Precision optimization method and system for optical fiber coupling laser engraving

Abstract

The invention is suitable for the technical field of laser processing, and provides an optical fiber coupling laser engraving precision optimization method and system.The method comprises the steps that the laser focus position in the laser engraving process and the material surface roughness and the temperature fluctuation value corresponding to the laser focus position are obtained; determining laser focus offset parameters according to the material surface roughness and the temperature fluctuation value, wherein the laser focus offset parameters comprise an offset direction and an offset value; generating a corresponding laser focus correction parameter based on the laser focus offset parameter by using a preset adjustment strategy; correcting the laser focus position according to the laser focus correction parameter to obtain a target laser focus position; and corresponding target laser machining parameters are determined according to the target laser focus position, the target laser machining parameters comprise the laser power and the machining speed, the target laser machining parameters are used for indicating laser engraving equipment to conduct laser engraving on the target workpiece, and therefore the laser machining precision is improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a method and system for optimizing the precision of fiber-coupled laser engraving. Background Technology

[0002] With the development of laser technology, it is mainly used for cutting and welding in the field of materials processing. At the same time, due to its high energy density, lasers can also be used for localized heating of materials, enabling material removal and processing.

[0003] During laser engraving, the laser focus position can easily shift due to slight changes in material surface properties or environmental conditions. If the focus position cannot be detected and adjusted in real time, it can lead to decreased processing accuracy and even processing defects. Laser processing results are affected by multiple parameters. In practical applications, due to the lack of efficient data processing and feedback mechanisms, parameter adjustments are often delayed or inaccurate, resulting in inconsistent processing effects and a high scrap rate.

[0004] Traditional feedback control systems are slow to adjust the focal position and parameters, making it difficult to meet the high-speed, high-precision requirements of laser processing. During processing, the focal position may change, but the feedback control system cannot adjust in time, leading to a decline in processing quality. Therefore, improving the precision of laser processing has become an urgent technical problem to be solved. Summary of the Invention

[0005] This application provides a method and system for optimizing the precision of fiber-coupled laser engraving, which can solve the technical problem of how to improve the precision of laser processing.

[0006] In a first aspect, embodiments of this application provide a method for optimizing the precision of fiber-coupled laser engraving, including: Obtain the laser focal point position during the laser engraving process, as well as the corresponding material surface roughness and temperature fluctuation values; The laser focus offset parameters are determined based on the material surface roughness and temperature fluctuation values. The laser focus offset parameters include the offset direction and offset value. The corresponding laser focus correction parameters are generated based on the laser focus offset parameters using a preset adjustment strategy. The laser focus position is corrected according to the laser focus correction parameters to obtain the target laser focus position; The target laser processing parameters are determined based on the target laser focus position. These parameters include laser power and processing speed. They are used to instruct the laser engraving equipment to perform laser engraving on the target workpiece.

[0007] In one embodiment, determining the laser focus offset parameters based on material surface roughness and temperature fluctuation values ​​includes: Determine whether the surface roughness of the material exceeds a preset roughness threshold; If the surface roughness of the material exceeds the preset roughness threshold, the initial laser focus offset parameter is obtained by looking up the temperature fluctuation value in the preset lookup table. The preset lookup table is used to show the correspondence between the temperature fluctuation value and the initial laser focus offset parameter. The initial laser focus offset parameters are corrected using a preset correction model to obtain the laser focus offset parameters.

[0008] In one embodiment, the preset correction model is represented as: ; Wherein, ΔF0 represents the initial offset value; ΔR represents the change in material surface roughness; ΔT represents the temperature fluctuation value; E represents other environmental data vectors; H represents historical processing data; and ΔF represents the offset value. Indicates the direction of offset; Indicates the initial offset direction; k is the sensitivity gain.

[0009] In one embodiment, a preset adjustment strategy is used to generate corresponding laser focus correction parameters based on the laser focus offset parameters, including: Obtain vibration interference data during the laser engraving process; the vibration interference data is related to the vibration frequency. Based on the vibration interference data and the laser focus offset parameters, the initial laser focus correction parameters are determined. The initial laser focus correction parameters include the initial correction value and the initial correction direction. Determine whether the initial laser focus correction parameters meet the preset correction conditions. If the initial laser focus correction parameters do not meet the preset correction conditions, fine-tune the initial laser focus correction parameters until they meet the preset correction conditions to obtain the laser focus correction parameters.

[0010] In one embodiment, determining the corresponding target laser processing parameters based on the target laser focal point position includes: The initial laser processing parameter range is selected from the preset parameter matching table based on the target laser focus position; Simulated laser engraving was performed based on the initial laser processing parameter range to obtain simulation results; The simulation results are compared with the standard results to obtain the laser engraving matching degree; The initial laser processing parameters whose laser engraving matching degree exceeds the preset matching degree threshold are determined as the target laser processing parameters.

[0011] In one embodiment, the above method further includes: Determine whether the temperature fluctuation data and vibration disturbance data meet the corresponding preset adjustment thresholds; If the temperature fluctuation data and vibration interference data meet the corresponding preset adjustment thresholds, the initial laser processing parameters are adjusted according to the temperature fluctuation data and vibration interference data to obtain the target laser processing parameters.

[0012] In one embodiment, the laser power satisfies the following formula: ; in, P 0 represents the initial laser power. Here, ΔT is the temperature sensitivity coefficient, and ΔT is the temperature fluctuation value. Let Δf be the vibration coupling coefficient, and Δf be the change in vibration frequency. Here, A is the frequency reference constant, and A is the vibration acceleration amplitude.

[0013] In one embodiment, the processing speed satisfies the following formula: ; in, The initial processing speed, Let ΔT represent the sensitivity of thermal deformation to temperature fluctuations, where ΔT is the temperature fluctuation value. Let Δf be the intensity of the vibration's effect on the stability of the focal point, Δf be the change in vibration frequency, and A be the amplitude of vibration acceleration.

[0014] In one embodiment, the above method further includes: The laser focus offset level is determined based on the material surface roughness and temperature fluctuation value. The laser focus offset levels include: low, medium and high. The corresponding offset correction factor is determined based on the laser offset level, where different levels correspond to different offset correction factors. The laser power or processing speed is adjusted sequentially based on the offset correction coefficient to obtain optimized laser processing parameters.

[0015] Secondly, embodiments of this application provide a precision optimization system for fiber-coupled laser engraving, which has the function of implementing the method in the first aspect or any possible implementation thereof. Specifically, the system includes units for implementing the method in the first aspect or any possible implementation thereof.

[0016] In one embodiment, the system includes: The acquisition unit is used to acquire the laser focus position during the laser engraving process, as well as the corresponding material surface roughness and temperature fluctuation values. The determination unit is used to determine the laser focus offset parameters based on the material surface roughness and temperature fluctuation value. The laser focus offset parameters include the offset direction and offset value. The generation unit is used to generate corresponding laser focus correction parameters based on the laser focus offset parameters using a preset adjustment strategy. The correction unit is used to correct the laser focus position according to the laser focus correction parameters to obtain the target laser focus position; The processing unit is used to determine the corresponding target laser processing parameters based on the target laser focus position. The target laser processing parameters include laser power and processing speed. The target laser processing parameters are used to instruct the laser engraving equipment to perform laser engraving on the target workpiece.

[0017] Thirdly, embodiments of this application provide a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it causes the computer device to implement any of the implementation methods of the first aspect described above.

[0018] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a computer device, causes the computer device to implement any of the implementation methods of the first aspect described above.

[0019] Fifthly, embodiments of this application provide a computer program product that, when run on a computer device, causes the computer device to execute any of the implementation methods of the first aspect described above.

[0020] The beneficial effects of this application embodiment compared to the prior art are as follows: Real-time monitoring enables timely detection of changes in the focal position and fluctuations in material surface and environmental conditions, providing data support for precise adjustment. Compared to traditional methods, this real-time monitoring can respond more quickly to changes during processing, reducing processing errors caused by delayed monitoring. By analyzing the aforementioned monitored data, the specific situation of the focal offset is determined, providing accurate parameters for subsequent correction. Precisely determining the direction and magnitude of the focal offset allows for more targeted correction. Based on the focal offset parameters, specific correction parameters are generated using a preset adjustment strategy to guide the adjustment of the focal position. The preset adjustment strategy can quickly generate correction parameters, reducing manual intervention and improving adjustment speed and consistency. Based on the generated correction parameters, the laser focal position is actually adjusted to ensure the accuracy of the focal position. Through correction, the accuracy of the focal position can be ensured, improving processing precision. Compared to traditional methods, this dynamic correction can better adapt to changes during processing, reducing error accumulation. Based on the corrected focal position, the optimal laser processing parameters are determined, optimizing the processing process, improving processing efficiency and precision, and reducing the scrap rate. Attached Figure Description

[0021] Figure 1 This is a flowchart illustrating a method for optimizing the precision of fiber-coupled laser engraving according to an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a fiber-coupled laser engraving precision optimization system provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the computer device provided in the embodiments of this application. Detailed Implementation

[0022] To further illustrate the technical solution of this application, specific embodiments are described below.

[0023] Figure 1 This is a flowchart illustrating a method for optimizing the precision of fiber-coupled laser engraving provided in an embodiment of this application.

[0024] like Figure 1 As shown, the above method includes the following steps S101 to S105.

[0025] S101. Obtain the laser focus position during the laser engraving process, as well as the corresponding material surface roughness and temperature fluctuation values.

[0026] The laser focal point is the point where the laser beam is focused during processing. It's understood that only at the focal point is the laser's energy density high enough to precisely carve, cut, or perform other processing operations on the material. Changes in the focal point directly affect the quality and precision of the processing.

[0027] As an example, and not a limitation, high-frequency sampling technology is used to monitor changes in the focal point position in real time by installing high-precision position sensors, such as focusing lens position sensors or reflective position sensors, on the optical path of the laser processing equipment. These sensors can acquire focal point position data at extremely high frequencies (e.g., thousands of times per second or even higher), thereby accurately tracking minute shifts in the focal point.

[0028] Surface roughness refers to the degree of microscopic unevenness on a material surface, usually quantified by roughness values. In laser processing, surface roughness reflects the smoothness of the material surface at the microscopic scale. Higher surface roughness may mean that there are more microscopic protrusions and depressions on the material surface, which can affect the interaction between the laser and the material, and thus affect the processing results.

[0029] As an example, and not a limitation, optical sensors, such as confocal microscopes and laser scanning probes, are used to perform non-contact measurements on material surfaces. These sensors emit laser beams and receive light signals reflected from the material surface. By analyzing information such as the intensity and phase of the reflected light, the surface roughness value of the material can be calculated. During laser engraving, surface roughness data of the processed area is acquired in real time to promptly understand changes in the material surface condition.

[0030] Temperature fluctuation refers to the deviation of the material surface temperature or the ambient temperature during processing. In laser processing, laser energy causes localized increases in material temperature, while changes in ambient temperature also affect the processing. Temperature fluctuations can impact the physical properties of the material, the propagation characteristics of the laser, and the performance of the processing equipment.

[0031] As an example, and not a limitation, thermal sensors, such as thermocouples and resistance temperature detectors (RTDs), are placed around the processing area and near the material surface to monitor temperature changes in real time. These sensors convert temperature signals into electrical signals, which are then transmitted to a data acquisition system for processing and analysis. By comprehensively analyzing data from multiple temperature monitoring points, temperature fluctuations during the processing can be accurately assessed.

[0032] Through high-precision sensors and advanced measurement technology, minute changes in the focal position, subtle differences in material surface roughness, and minute temperature fluctuations can be accurately measured. This precise data provides a reliable basis for accurately judging the processing status and enabling precise control, thus helping to improve processing accuracy and quality stability.

[0033] S102. Determine the laser focus offset parameters based on the material surface roughness and temperature fluctuation values.

[0034] Laser focus offset parameters are parameters used to describe the direction and offset value of the laser focus position deviating from the ideal position. They include offset direction and offset value. The offset direction indicates whether the focus is offset upward, downward, leftward, rightward, or in other directions, while the offset value quantitatively describes the distance of focus offset.

[0035] As an example rather than a limitation, the laser focus offset parameters corresponding to the material surface roughness and temperature fluctuation values ​​can be obtained by querying historical data, or the corresponding laser focus offset parameters can be calculated using a preset calculation formula.

[0036] In one implementation, the laser focus offset parameter is determined based on the material surface roughness and temperature fluctuation value, including: determining whether the material surface roughness exceeds a preset roughness threshold; if the material surface roughness exceeds the preset roughness threshold, then looking up the temperature fluctuation value in a preset lookup table to obtain the initial laser focus offset parameter, the preset lookup table being used to represent the correspondence between the temperature fluctuation value and the initial laser focus offset parameter; and correcting the initial laser focus offset parameter using a preset correction model to obtain the laser focus offset parameter.

[0037] A preset lookup table is a data table pre-built based on historical laser engraving data, used to represent the correspondence between temperature fluctuation values ​​and initial laser focus offset parameters. By querying the preset lookup table, the initial laser focus offset parameters can be quickly obtained based on the actual measured temperature fluctuation values.

[0038] For example, the preset calibration model is represented as: ; Wherein, ΔF represents the offset value; ΔF0 represents the initial offset value; ΔR represents the change in material surface roughness; ΔT represents the temperature fluctuation value; E represents other environmental data vectors; and H represents historical processing data. Indicates the direction of offset; The initial offset direction is indicated by k; the sensitivity gain is k, and time is t.

[0039] Among them, α is a confidence coefficient (range 0.6~0.8) summarized from historical data, which reflects the reliability of ΔF0 and can be set according to the actual situation.

[0040] , w R The roughness weighting coefficient, w T R0 is the reference roughness, where is the temperature weighting factor. β As an environmentally sensitive factor, The coefficient of thermal expansion of the material. The baseline scale factor (e.g., 1 μm) can be set according to the specific circumstances.

[0041] g ( H )=avg(Δ F hist )⋅ e - λ ⋅∣Δ R −Δ R hist | (Exponentially decaying weighted average of historical offset values) γ The historical data credibility weight represents the historical processed data.g ( H The strength of the influence on the final offset value, for example, γ=0.3 means that historical data contributes 30% weight, which can be set according to the actual situation.

[0042] h ( E )=∑ i ( E i ⋅ c i (Environment Vector) E With coefficient matrix c (dot product) δ The environmental disturbance compensation weight represents the environmental disturbance. h ( E Compensation intensity (such as vibration, etc.).

[0043] Suppose that during the processing of a metal sheet, the surface roughness measured by an optical sensor is 2.5 micrometers, exceeding the preset threshold range of 1.0 to 2.0 micrometers. In this case, combined with temperature fluctuation values ​​(e.g., a fluctuation offset of 5 degrees Celsius, exceeding the normal range of 2 degrees Celsius), it can be preliminarily determined that the initial deviation of the focus offset is likely due to thermal expansion, with the offset direction being upward and the offset value approximately 1.83 μm. This multi-parameter analysis approach can more accurately pinpoint the root cause of the problem and improve processing stability.

[0044] The corrected direction and value of the laser focus offset can more accurately reflect the actual offset of the laser focus, providing a more precise basis for subsequent focus position adjustment.

[0045] By determining whether the material surface roughness exceeds a preset roughness threshold, it is possible to quickly identify any abnormalities in the material surface condition, allowing for timely problem detection and appropriate measures. Using a preset lookup table, the initial laser focus offset parameters can be quickly retrieved based on temperature fluctuations, improving the efficiency of parameter determination and saving time. Correcting the initial laser focus offset parameters using a preset calibration model comprehensively considers the influence of multiple factors, resulting in more accurate laser focus offset parameters. This provides a more accurate basis for subsequent focus position adjustments, thereby improving the precision and quality of laser processing. This step dynamically adjusts and corrects the laser focus offset parameters based on real-time changes in material surface roughness and temperature fluctuations, enabling the laser processing process to better adapt to different processing conditions and environmental changes, ensuring processing stability and reliability.

[0046] S103. Generate corresponding laser focus correction parameters based on laser focus offset parameters using a preset adjustment strategy.

[0047] The preset adjustment strategy defines how to convert the direction and value of the offset into specific correction measures to adjust the laser focus position.

[0048] Laser focus correction parameters are specific parameters used to guide laser equipment in adjusting the focus position. These parameters include information such as the adjustment direction and offset value, and can be directly used to control the focus adjustment mechanism of the laser equipment to correct focus offset problems.

[0049] As an example, and not a limitation, it is assumed that there is a fixed proportional relationship between the offset value and the correction parameter, for example, correction parameter = offset value × scaling factor. The scaling factor can be preset based on experiments and experience. If the scaling factor is 1.2 and the focus offset value is 0.3 mm, then the correction parameter is 0.3 × 1.2 = 0.36 mm.

[0050] As an example, and not a limitation, a calibration lookup table is pre-established, listing the calibration parameters corresponding to different offset values. During actual adjustments, the corresponding calibration parameter is found in the lookup table based on the current focus offset value. For example, the lookup table specifies that when the offset value is 0.3 mm, the calibration parameter is 0.35 mm.

[0051] For example, in the field of laser processing, when correcting initial deviation data for focus offset, a pre-established correction comparison table can be used for preliminary comparison. Taking the processing of an aluminum alloy sheet as an example, suppose the initial deviation data indicates that the focus offset direction may be upward, with an offset value of 0.3 mm. By referring to the table, it can be found that this offset may be related to the thermal expansion of the material surface, and the direction value is initially determined to be upward.

[0052] In one possible implementation, assuming the surface roughness increases from 1.5 micrometers to 2.2 micrometers during processing, while the ambient temperature fluctuates by 3 degrees Celsius, analysis using a reference table suggests that the temperature fluctuation may cause slight material deformation, thus affecting the focal point position. Therefore, the initial orientation value remains upward. This analytical approach helps to more accurately pinpoint the root cause of the offset.

[0053] For example, when acquiring historical data related to material surface properties, the database can be used to retrieve records of surface roughness and focal point offset from past processing of similar aluminum alloy sheets. Assuming the offset value corresponding to a similar roughness change in historical data is 0.25 mm, while the current real-time data shows 0.3 mm, a reference offset value of 0.28 mm can be obtained through comparison. This method of comparing historical and real-time data provides a reliable basis for subsequent corrections.

[0054] S104. Correct the laser focus position according to the laser focus correction parameters to obtain the target laser focus position.

[0055] The target laser focus position refers to the ideal position that the laser focus should reach after calibration, which can ensure the accuracy and quality of laser processing.

[0056] As an example, and not a limitation, when laser cutting thin steel plates, if the focal spot is misaligned, it may result in uneven cut edges. The laser focal spot correction parameter obtained in S103 is adjusted downwards by 0.2 mm. In S104, the drive unit adjusts the lens position according to this parameter, moving the focal spot downwards by 0.2 mm. After adjustment, the sensor measures the focal spot position, confirming that it has reached the target position, thus ensuring cutting quality.

[0057] As an example, and not a limitation, when laser engraving plastic parts, focus misalignment can cause inconsistent engraving depth. Assuming a correction parameter of 0.1 mm upwards, the focus adjustment mechanism adjusts accordingly, and a high-precision position sensor measures to ensure the focus accurately reaches the target position, resulting in a uniform engraving depth.

[0058] The laser focus position is dynamically adjusted according to the laser focus correction parameters to adapt to different processing conditions and material properties, enhancing the flexibility and adaptability of the equipment, achieving precise control of the laser focus position, ensuring the accuracy of laser processing, and thus improving product quality.

[0059] S105. Determine the corresponding target laser processing parameters based on the target laser focus position.

[0060] The target laser processing parameters include laser power and processing speed. These parameters are used to instruct the laser engraving equipment to perform laser engraving on the target workpiece.

[0061] Laser power refers to the output power of a laser beam, usually measured in watts (W). The magnitude of laser power directly affects the intensity of the interaction between the laser and the material, thus affecting the processing results, such as cutting speed and engraving depth.

[0062] Processing speed refers to the speed at which the laser beam moves relative to the workpiece during laser processing, usually measured in meters per minute (m / min). The processing speed affects both processing quality and efficiency, and needs to be adjusted according to the specific processing task and material properties.

[0063] As an example, and not a limitation, the laser power and processing speed range corresponding to the target laser focus position are searched in the parameter matching database. Based on real-time monitored environmental factors (such as temperature and vibration frequency), the found laser power and processing speed are dynamically adjusted to adapt to the current processing environment. Combined with real-time feedback on the processing status, the target laser processing parameters are finally determined and sent to the laser engraving equipment for laser engraving of the target workpiece.

[0064] By determining the laser power and processing speed that are precisely matched to the target focal position, processing quality and efficiency can be significantly improved, and processing defects caused by parameter mismatch can be reduced.

[0065] In one embodiment, generating corresponding laser focus correction parameters based on laser focus offset parameters using a preset adjustment strategy includes: acquiring vibration interference data during the laser engraving process, the vibration interference data being related to the vibration frequency; determining initial laser focus correction parameters based on the vibration interference data and laser focus offset parameters, the initial laser focus correction parameters including an initial correction value and an initial correction direction; determining whether the initial laser focus correction parameters meet preset correction conditions; if the initial laser focus correction parameters do not meet the preset correction conditions, then fine-tuning the initial laser focus correction parameters until they meet the preset correction conditions to obtain the laser focus correction parameters.

[0066] Vibration interference data refers to data changes caused by vibrations generated by the external environment or the equipment itself during laser engraving. These vibrations may affect the stability of the laser focus position, thereby affecting the processing quality.

[0067] As an example and not a limitation, the vibration during the laser engraving process is monitored in real time using a high-precision vibration sensor to obtain vibration interference data (related to the vibration frequency).

[0068] The initial laser focus correction parameters are parameters used to correct the laser focus position, which are initially determined based on vibration interference data. They include the initial correction value and the initial correction direction.

[0069] Preset calibration conditions are pre-defined standards or requirements used to determine whether the initial laser focus calibration parameters are reasonable. These conditions may include requirements for the stability of the calibrated focus position, machining accuracy, and other aspects.

[0070] As an example, and not a limitation, it is assumed that there is a linear relationship between vibration interference data and laser focus offset parameters. By collecting a large amount of sample data (including vibration interference data and corresponding focus offset parameters), a linear equation is fitted using a linear regression algorithm. Based on this linear equation, combined with new vibration interference data and focus offset parameters, the initial laser focus correction parameters can be calculated.

[0071] As an example rather than a limitation, vibration interference data and laser focus offset parameters are used as input variables, and initial laser focus correction parameters are used as output variables. Fuzzy logic rules are used to describe the relationship between them. By establishing a fuzzy rule base (such as "if the vibration frequency is high and the focus offset value is large, then the initial correction value is large, and the direction is opposite to the focus offset direction"), fuzzy reasoning is performed on the input data to obtain the initial laser focus correction parameters.

[0072] Fuzzy logic rules are a logical reasoning method used to handle uncertain and fuzzy information. It fuzzifies the input variables, using linguistic variables (such as "high", "large", "small", etc.) to describe the range of values ​​of the input variables, and then performs reasoning based on predefined fuzzy rules to finally obtain the result of the output variable.

[0073] Fuzzy logic rules typically consist of a series of "if-then" statements describing the relationship between input and output variables. Each rule includes a premise (if part) and a conclusion (then part). The premise provides a fuzzy description of the input variables, while the conclusion provides a fuzzy description of the output variables. For example, a possible fuzzy logic rule would be: "If the vibration frequency is high and the focus offset value is large, then the initial correction value is large, and the initial correction direction is opposite to the focus offset direction." For example, the specific numerical values ​​of the input variables (vibration frequency and focus offset value) are converted into fuzzy sets (e.g., low, medium, high). Based on the fuzzified input variables, all matching fuzzy rules are identified. Reasoning calculations are performed on the matching rules to obtain the fuzzy results of the output variables. The fuzzy results are then converted into specific numerical values ​​(e.g., initial correction direction and correction value).

[0074] Assume the current vibration frequency is 55Hz (high), the focus offset value is 0.2 mm (large), and the focus offset direction is upward. According to the above fuzzy rule base, the matched rule is: "If the vibration frequency is high and the focus offset value is large, then the initial correction value is large, and the direction is opposite to the focus offset direction." Therefore, the initial correction direction is downward, and the initial correction value is large (the specific value can be set according to the actual situation, such as 0.3 mm).

[0075] The initial calibration parameters are precisely determined based on vibration interference data and further optimized through fine-tuning to ensure the accuracy of the laser focus position, thereby improving processing quality. Simultaneously, it can respond in real-time to different vibration interference conditions, dynamically adjusting the calibration parameters to ensure the laser engraving equipment maintains excellent processing performance under various environmental conditions.

[0076] For example, in the field of laser processing, a preliminary comparison between the direction value and the offset value of the focus deviation can be achieved using a pre-established lookup table. Suppose that when processing a thin stainless steel sheet, the initial detection shows that the focus deviation is downwards, with an offset value of 0.2 mm. The lookup table records similar deviations that may be related to localized thermal deformation in the processing area, and the initial correction parameter can be set to adjust upwards by 0.2 mm. This method provides a basic reference for subsequent corrections.

[0077] For example, real-time acquisition of dynamic change data in the processing area can be achieved through high-precision sensors to obtain information on surface morphology changes and environmental interference.

[0078] In one possible implementation, during processing, the surface flatness was found to decrease from 2.0 micrometers to 1.8 micrometers, while a slight increase in the environmental vibration frequency was detected. By extracting vibration-related wave characteristics, it was initially determined that the offset might be affected by external interference, and the correction parameters needed to be adjusted in direction. The offset value was tentatively set at 0.1 millimeters. This real-time acquisition provided a dynamic basis for correction.

[0079] For example, when performing data fusion based on the characteristics of the laser equipment's adjustment mechanism, multi-dimensional processing tools can be used to analyze the characteristics of environmental interference fluctuations. Assuming that vibration interference and temperature changes work together, and the processed data exceeds a preset threshold range of 0.15 mm, the correction parameters need to be adjusted a second time, ultimately determined to be adjusted upwards by 0.25 mm. This multi-dimensional processing ensures the comprehensiveness of the correction parameters.

[0080] In one embodiment, determining the corresponding target laser processing parameters based on the target laser focus position includes: selecting an initial laser processing parameter range from a preset parameter matching table based on the target laser focus position; performing simulated laser engraving based on the initial laser processing parameter range to obtain simulation results; comparing the simulation results with standard results to obtain a laser engraving matching degree; and determining the initial laser processing parameters whose laser engraving matching degree exceeds a preset matching degree threshold as target laser processing parameters.

[0081] The preset parameter matching table is a pre-established table that contains the possible range of laser processing parameters corresponding to different target laser focus positions. These parameters mainly include laser power and processing speed. It is based on a large amount of experimental data and experience, and can provide a reference for parameter selection under different processing conditions.

[0082] Selecting the initial laser processing parameter range refers to finding the approximate range of laser power and processing speed corresponding to the currently determined target laser focus position in a preset parameter matching table. For example, if the target focus position is 3mm away from the workpiece surface, the corresponding laser power range may be 800-1000W, and the processing speed range may be 4-6m / min.

[0083] Using computer simulation software, the laser engraving process is simulated according to different parameter combinations within the initial laser processing parameter range. The simulation software can simulate the interaction between the laser and the material, the material removal process, and the final engraving effect. After the simulation is completed, the software will output the corresponding simulation results, including indicators such as engraving depth, width, surface roughness, and processing efficiency. These results can intuitively reflect the laser engraving effect under different parameter combinations.

[0084] The standard result is a predefined ideal laser engraving effect, including expected engraving depth, width, surface roughness, and other indicators, representing the optimal processing quality requirements. The simulated results are compared one by one with the standard result to calculate the laser engraving matching degree (for example, converting the simulated and standard results into image form and using image similarity algorithms to calculate the matching degree, i.e., extracting image feature points, such as SIFT, SURF, etc., and measuring image similarity by the degree of feature point matching). This matching degree measures how close the simulated result is to the standard result, usually expressed as a percentage; for example, a 90% matching degree indicates that the simulated result is relatively close to the standard result.

[0085] For example, when machining a stainless steel part, a laser power range of 800-1000W and a processing speed range of 4-6m / min are selected from a preset parameter matching table based on the target focal position. Then, multiple parameter combinations within these ranges are selected for simulated laser engraving. The simulation results show that when the laser power is 900W and the processing speed is 5m / min, the engraving depth is 0.5mm and the surface roughness is 1.2μm; while the standard result requires an engraving depth of 0.5mm and a surface roughness of 1.0μm. Calculations show that the laser engraving matching degree of this simulation result is 85%. If the preset matching degree threshold is 80%, then the matching degree of this parameter combination exceeds the threshold; therefore, a laser power of 900W and a processing speed of 5m / min can be determined as the target laser processing parameters.

[0086] In one embodiment, the method further includes: determining whether the temperature fluctuation data and vibration interference data meet the corresponding preset adjustment threshold; if the temperature fluctuation data and vibration interference data meet the corresponding preset adjustment threshold, adjusting the initial laser processing parameters according to the temperature fluctuation data and vibration interference data to obtain the target laser processing parameters.

[0087] The preset adjustment threshold is a pre-defined standard value used to determine whether temperature fluctuation data and vibration interference data need adjustment. When the actual detected data exceeds this threshold, the current processing conditions are considered unstable, and the laser processing parameters need to be adjusted to ensure processing quality.

[0088] Real-time monitoring of temperature fluctuations and vibration interference during laser processing is performed using temperature and vibration sensors to acquire accurate data. The monitored temperature fluctuations and vibration interference data are compared to corresponding preset adjustment thresholds to determine if they exceed the thresholds. If both the temperature fluctuations and vibration interference data meet the corresponding preset adjustment thresholds (i.e., exceed the thresholds), then the initial laser processing parameters are considered to require adjustment; otherwise, the initial laser processing parameters remain unchanged.

[0089] Based on temperature fluctuation data and vibration interference data exceeding thresholds, the initial laser processing parameters are adjusted according to certain adjustment rules or algorithms. For example, if the temperature fluctuation is large, the laser power is appropriately reduced to avoid material overheating; if the vibration interference is strong, the processing speed is appropriately reduced to improve processing stability. The adjusted laser processing parameters are the target laser processing parameters, which are applied to the laser engraving equipment for subsequent laser processing.

[0090] In one embodiment, the laser power satisfies the following formula: ; in, P 0 represents the initial laser power. Here, ΔT is the temperature sensitivity coefficient, and ΔT is the temperature fluctuation value. Let Δf be the vibration coupling coefficient, and Δf be the change in vibration frequency. A is the frequency reference constant, and A is the vibration acceleration amplitude (measured by a triaxial accelerometer, in gravitational acceleration g).

[0091] I understand. This indicates the effect of temperature on energy absorption efficiency, used to compensate for laser power loss caused by material thermal effects. It can be determined by measuring the minimum effective power under fixed vibration conditions at different ΔT values. Different materials will yield different results. The expressions are different. Take stainless steel as an example: =2.3 × thickness − 0.7 (thickness unit: mm); 1mm stainless steel sheet: =2.3×1−0.7≈5.0W / ℃.

[0092] I understand. To compensate for the interference of vibration on energy transfer and to compensate for the energy loss caused by the focus shift due to vibration, it is possible to determine the power loss under different Δf conditions by fixing the vibration conditions. Different materials can be fitted with the appropriate values. The expressions are different. Take stainless steel as an example: =15 + 0.5 × yield strength (strength unit: MPa); 304 stainless steel (yield strength 205MPa): =15+0.5×205≈25.0W.

[0093] In one embodiment, the processing speed satisfies the following formula: ; in, The initial processing speed, Let ΔT represent the sensitivity of thermal deformation to temperature fluctuations, where ΔT is the temperature fluctuation value. Δf represents the intensity of the vibration's influence on the stability of the focal point, Δf represents the change in vibration frequency, and A represents the amplitude of vibration acceleration (measured by a triaxial accelerometer, in gravitational acceleration g).

[0094] I understand. This indicates the temperature requirement for suppressing thermal deformation, used to reduce speed to control heat accumulation deformation, and is calibrated by the material's thermal conductivity, for example, 304 stainless steel (16 W / (m·K)): =0.005×16=0.08m / (min·℃²).

[0095] I understand. This indicates the need to suppress vibration for motion stability. It is used to reduce velocity to suppress the risk of vibration instability. It can be measured at different Δf values ​​by fixing the temperature. For example, the vibration transfer function is: KV = 0.1 / system damping ratio m / (min·Hz).

[0096] By monitoring temperature and vibration changes in real time during processing and adjusting laser processing parameters promptly according to actual conditions, the equipment can quickly adapt to different processing environments and conditions, ensuring the stability and quality of the processing process. This effectively reduces processing errors, improves processing accuracy and surface quality, lowers scrap rates, and increases production efficiency.

[0097] In one embodiment, the method further includes: determining the laser focus offset level based on the material surface roughness and temperature fluctuation value, wherein the laser focus offset level includes: low, medium and high; determining the corresponding offset correction coefficient based on the laser offset level, wherein the offset correction coefficients are different for different levels; and adjusting the laser power or processing speed sequentially based on the offset correction coefficients to obtain optimized laser processing parameters.

[0098] Set the ranges for material surface roughness and temperature fluctuation values ​​to classify different levels. For example, divide the roughness range into three levels: low (e.g., 0-1μm), medium (1-2μm), and high (2-3μm), and divide the temperature fluctuation range into three levels: low (e.g., 0-2℃), medium (2-4℃), and high (4-6℃).

[0099] The laser focus offset level is determined by comprehensively considering the range of material surface roughness and temperature fluctuation. For example, if the material surface roughness is 1.5 μm (medium) and the temperature fluctuation is 3℃ (medium), then the laser focus offset level is determined to be medium.

[0100] A pre-defined offset correction factor table is used to specify the offset correction factor corresponding to different levels. For example: Low-level offset: The offset correction factor is 1.0 (indicating no correction or minimal correction).

[0101] Intermediate offset: The offset correction factor is 1.2 (indicating that a certain degree of correction is required).

[0102] Advanced offset: The offset correction factor is 1.5 (indicating that a larger degree of correction is required).

[0103] Based on actual processing needs and experience, determine the order in which to adjust the laser power or processing speed. Generally, it's advisable to adjust one parameter first, observe the effect, and then adjust the other parameter.

[0104] The initial laser power or processing speed can be adjusted using an offset correction factor. For example, if the initial laser power is 1000W, and the offset correction factor is 1.2, the adjusted laser power will be 1200W; if the initial processing speed is 5m / min, and the offset correction factor is 1.2, the adjusted processing speed will be 6m / min.

[0105] The adjusted laser power and processing speed are applied to actual processing to observe the processing effect and verify whether the adjusted parameters meet the processing quality requirements. If necessary, the parameters can be further fine-tuned until the optimal processing effect is achieved.

[0106] Determining the laser focus offset level based on material surface roughness and temperature fluctuations allows for targeted adjustments to laser power or processing speed, improving the accuracy and effectiveness of these adjustments. The adjusted laser processing parameters better adapt to actual processing conditions, reducing processing errors and improving processing quality.

[0107] Assuming that during the machining of a metal part, the surface roughness is detected to be 1.8 μm (medium) and the temperature fluctuation is 3.5℃ (medium), the laser focus offset level is determined to be medium. According to the preset offset correction coefficient table, the offset correction coefficient corresponding to medium offset is 1.2. The initial laser power is 800W, and the initial processing speed is 4 m / min. Following the adjustment sequence, the laser power is first adjusted: 800W × 1.2 = 960W; then the processing speed is adjusted: 4 m / min × 1.2 = 4.8 m / min. The adjusted laser power of 960W and processing speed of 4.8 m / min are applied to actual machining, and the processing effect is observed. If the processing quality is good and meets the requirements, these parameters are determined to be the optimized laser processing parameters. If further improvement is found, the parameters can be fine-tuned until the optimal effect is achieved.

[0108] In one embodiment, based on optimized laser processing parameters, configuration information related to laser power and processing speed is extracted from a preset parameter matching database. Adapted update scheme data is obtained by monitoring the current state of the configuration, and the adjusted configuration state information is determined. Based on the adjusted configuration state information, real-time operating status data is acquired and dynamically compared according to changes in the environment. If the changes exceed a preset threshold range, the parameter adjustment scheme is fine-tuned to obtain an adapted combination of operating parameters. Using the adapted combination of operating parameters, data feedback tools are used to record state changes during processing, continuously tracking the degree of matching between changes and laser power and processing speed to obtain final operating status confirmation data.

[0109] The parameter matching database stores a large amount of historical configuration information related to laser power and processing speed, which can provide a reference for the current equipment status. Assuming the processing of a thin stainless steel sheet, the optimized parameter combination is a processing speed of 2.8 m / min and a laser power of 950 watts. The corresponding configuration information extracted from the database shows that the current load range for similar parameters is 20 to 25 amps, while the current equipment status shows a load of 23 amps, which is within the normal range. Through comparison, it is initially determined that no major adjustments are needed, but load fluctuations should be monitored.

[0110] In one possible implementation, assuming the updated data indicates a fine-tuning of the laser power to 960 watts while maintaining a processing speed of 2.8 meters per minute, the embedded control tool generates a corresponding digital signal and sends it to the device control unit, ensuring synchronized updates. After real-time adjustment, the configuration status information shows a device response time of less than 0.5 seconds, indicating smooth command transmission and execution. This method ensures the accuracy of parameter adjustments.

[0111] For example, when acquiring and dynamically comparing operational status data from real-time monitoring tools, the impact of environmental changes on processing can be monitored. Suppose that during processing, the monitoring tool detects a 3-degree Celsius increase in ambient temperature, causing localized heat accumulation in the processing area, exceeding a preset threshold of 2 degrees Celsius. In this case, a fine-tuning mechanism is triggered, initially determining that the processing speed needs to be reduced to 2.7 meters per minute to decrease heat accumulation. After dynamic comparison, the new parameter combination is confirmed as the optimal solution. This real-time feedback and adjustment mechanism can effectively cope with sudden environmental disturbances.

[0112] For example, when using data feedback tools to record changes in the processing state and continuously track the degree of matching, analysis can begin with the stability of the processed surface. Suppose that when processing thin stainless steel sheets, the feedback tool records surface roughness changes within 0.02 mm, and the matching degree with the current laser power of 960 watts and processing speed of 2.7 m / min reaches over 90%, indicating that the parameter combination highly matches the processing requirements. Through continuous tracking, the final operational status confirmation data shows that the equipment is operating smoothly. This recording and tracking method provides a reliable basis for subsequent parameter optimization.

[0113] In one possible implementation, assuming a slight increase in the current environmental vibration frequency, historical data reveals that reducing the processing speed by 0.1 m / min under similar conditions can effectively reduce the impact of vibration. Therefore, the speed is automatically fine-tuned to 2.6 m / min while maintaining constant power. If the thickness of the processed material changes slightly, the corresponding parameter range in the database can be used as a reference to help determine whether a synchronous power adjustment is necessary. This multi-dimensional analysis ensures the comprehensiveness and adaptability of parameter adjustments, providing strong support for the stability of the processing.

[0114] In one embodiment, based on stability coefficients and relevant data on process defects, corresponding constraints are retrieved from a pre-set risk threshold database. For focus control requirements during laser processing, a data comparison tool is used to perform a preliminary analysis of the deviation between the current focus position and the parameter combination, obtaining an initial assessment result of focus offset. Using this initial assessment result and considering dynamic calibration requirements, a parameter adjustment tool is used to fine-tune the focus position. If the deviation exceeds the pre-set risk threshold range, iterative optimization logic is triggered, and a general calculation tool is used to repeatedly correct the parameter combination to determine suitable focus control data. Based on the suitable focus control data, and targeting the business objectives of processing control, a real-time monitoring tool continuously tracks the parameter matching status during laser processing. If a mismatch is detected between the parameter combination and process defect-related indicators, correction rules are retrieved from a pre-established calibration rule library to determine the final parameter adjustment range. Using the parameter adjustment range and the objectives determined by the scheme, a data integration tool is used to comprehensively compare the adjusted focus position and parameter combination. For the stability requirements of laser processing, the final processing control scheme is retrieved from the database to determine a complete configuration suitable for the current scenario.

[0115] For example, in the field of laser processing, the stability management of focus control requirements can be explored from multiple perspectives. Deviations in the focus position directly affect processing accuracy, thus requiring preliminary analysis using data comparison tools. Suppose that when processing a 2.5 mm thick aluminum plate, the current focus position deviates from the ideal position by 0.1 mm, while the preset risk threshold is 0.05 mm. In this case, an initial assessment result will be generated, determining that adjustment is needed.

[0116] Based on the initial evaluation results of the focus offset, and in accordance with the requirements of dynamic calibration, fine-tuning can be performed using parameter adjustment tools. Assuming the initial evaluation shows an offset of 0.1 mm, the focus position will be adjusted upwards by 0.05 mm according to preset rules as the first calibration, and the quality changes of the processed surface will be observed in real time. This fine-tuning method can gradually approach the ideal state, avoiding the instability risks caused by excessive adjustments at once.

[0117] When the deviation exceeds the risk threshold, iterative optimization logic is triggered. Assuming that after the first fine-tuning the focus offset is still 0.07 mm, exceeding the threshold range, multiple iterations of correction will be performed using general-purpose calculation tools. One possible implementation is to analyze historical processing data to find parameter combinations similar to the current scene, gradually adjusting the focus position until the offset is less than 0.05 mm, ultimately determining the appropriate focus control data. This iterative approach ensures the accuracy of the adjustments.

[0118] Suppose that during processing, a mismatch is detected between the focal position and the required processing depth, manifested as a processing depth deviation of 0.2 mm, exceeding the expected range. In this case, a correction rule is retrieved from the calibration rule base, determining that the focal position needs further fine-tuning by 0.03 mm, and simultaneously adjusting the laser power range. This continuous tracking mechanism can promptly detect potential problems.

[0119] Assuming the adjusted focus position offset is reduced to 0.02 mm and the machining depth meets requirements, the adjusted parameter combination will be compared with historical solutions in the database to confirm whether the current configuration is suitable for long-term machining needs. This comparison method ensures the comprehensiveness of parameter adjustments.

[0120] To ensure processing stability, the final processing control scheme can be determined by incorporating multi-dimensional data analysis. For example, if a slight increase in ambient temperature during aluminum plate processing might affect focal stability, relevant constraints can be extracted from the database, and the focal position can be fine-tuned to its optimal state while keeping other parameters constant. This comprehensive approach enhances the adaptability of the processing and ensures stability.

[0121] In one implementation, focus control parameters are acquired, which are generated in real time by the laser processing equipment during processing. Focus offset data and processing accuracy data are collected based on the focus control parameters. The focus offset data includes the offset direction and offset value. The focus offset data and processing accuracy data are stored in a pre-established historical database, which contains structured processing operation records indexed by time. It is determined whether the amount of data in the historical database has reached a preset threshold. If the preset threshold is reached, historical offset features and accuracy impact correlation data are extracted from the historical database. Based on the historical offset features and accuracy impact correlation data, the offset trend of the focus position and the corresponding parameter configuration in future processing tasks are determined.

[0122] Focus control parameters typically include focus position, offset value, and dynamic changes during the machining process. Using appropriate data acquisition tools, the direction and specific value of focus offset can be recorded in real time, while simultaneously acquiring relevant machining accuracy indicators, such as the flatness of the machined surface or the deviation of the cut width.

[0123] Assuming that when machining a 2.0 mm thick steel plate, focus offset data is recorded once per minute, including the offset direction being downward and the offset value being 0.08 mm. Simultaneously, machining accuracy data, such as the cut width deviation of 0.03 mm, is also recorded. This data is stored chronologically to form a structured operation log.

[0124] As an example, not a limitation, when determining whether the amount of historical database data has reached a preset threshold, a specific standard can be set, such as accumulating 1000 sets of processing data as a trigger condition. Assuming the current database has stored 1200 sets of data, it will automatically be determined that the threshold has been reached, thus initiating the data extraction process. From this, historical offset characteristics will be filtered out, such as offset values ​​concentrated in the 0.05 to 0.10 mm range, and data related to the impact of accuracy, such as a significant increase in cut width deviation when the offset value is large. This judgment mechanism ensures the sufficiency and reliability of data analysis.

[0125] The extracted data suggests that the focus offset characteristics differ when processing different materials; for example, the offset is mostly upward when processing aluminum plates, while it is mostly downward when processing steel plates. Meanwhile, the correlation data regarding accuracy effects indicates that for every 0.02 mm increase in offset value, the processing accuracy deviation increases by 0.01 mm.

[0126] As an example, not a limitation, if historical data analysis reveals that the focus offset value tends to increase gradually after 5 hours of continuous processing, based on this pattern (assuming that a corresponding linear function can be fitted based on historical data), the potential offset range of the focus position in future processing tasks will be predicted, and corresponding parameter configurations will be recommended, such as adjusting the focus position by 0.04 mm in advance.

[0127] In one embodiment, based on pre-established processing operation records, fluctuation information related to processing stability is extracted from historical data. For the frequency portion of the fluctuation information exceeding a preset threshold, the corresponding focus control deviation value is obtained, and the correlation between the deviation value and processing stability is determined. If the correlation between the deviation value and processing stability is higher than the preset threshold, a new dynamic parameter configuration scheme is generated by adjusting the response logic in the feedback mechanism to obtain a parameter matching result suitable for the current processing environment. Using the parameter matching result, the focus control-related records in the calibration database are updated, and the updated parameter matching data is obtained to determine whether it meets the requirements of long-term operation. By comparing the updated parameter matching data with historical data, the response logic configuration in the calibration database is adjusted for the dynamic parameter portions that do not meet the requirements to obtain optimized dynamic control parameters.

[0128] Fluctuations in processing stability typically reflect abnormal changes in equipment during operation. These fluctuations may originate from minor deviations in focus control or changes in environmental conditions. For example, when processing thin steel sheets, hourly stability fluctuation data is extracted from historical data. It is found that the fluctuation frequency reaches 3 times per minute at certain times, exceeding the preset threshold of 2 times per minute. In this case, the corresponding focus control deviation value is further obtained and recorded as 0.05 mm. Analysis reveals that this deviation value is correlated with processing stability by 80%, exceeding the preset threshold of 60%, indicating that focus deviation is one of the main factors affecting stability.

[0129] In one implementation, a new dynamic parameter configuration is generated based on a deviation of 0.05 mm, adjusting the response speed of the focus control and the correction offset value. Assume the adjusted parameter configuration increases the focus correction frequency from once per minute to twice per minute, while setting the correction offset value to 0.03 mm. This configuration can respond to deviations more promptly, ensuring stability during the machining process.

[0130] Assuming the updated parameter matching data shows that the focus deviation has decreased from 0.05 mm to 0.02 mm, further assessment will be conducted to determine if it meets the requirements for long-term operation. By comparing with historical data, it was found that the updated data reduced the frequency of stability fluctuations by 30%, meeting the standards for long-term operation. This update mechanism can provide a more reliable reference for subsequent processing tasks.

[0131] If, under certain processing conditions, the response time of dynamic parameters is too long, causing focus deviations to fail to be corrected in a timely manner, the logic configuration will be optimized to shorten the response time from 5 seconds to 3 seconds. This adjustment improves the adaptability of the parameters and ensures real-time performance during the processing.

[0132] The methods of embodiments of this application have been described above with reference to the accompanying drawings. It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially, these steps are not necessarily executed in the order shown in the figures. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least a portion of the steps or stages of other steps. A system according to an embodiment of this application will be described below with reference to the accompanying drawings. For brevity, appropriate omissions will be made when describing the system below; relevant content can be referred to in the relevant descriptions of the methods above, and will not be repeated.

[0133] Figure 2 This is a schematic diagram of the structure of a fiber-coupled laser engraving precision optimization system provided in an embodiment of this application.

[0134] like Figure 2 As shown, the system 1000 includes the following units.

[0135] The acquisition unit 1001 is used to acquire the laser focus position during the laser engraving process, as well as the material surface roughness and temperature fluctuation value corresponding to the laser focus position; The determining unit 1002 is used to determine the laser focus offset parameters based on the material surface roughness and temperature fluctuation value. The laser focus offset parameters include the offset direction and the offset value. The generation unit 1003 is used to generate corresponding laser focus correction parameters based on the laser focus offset parameters using a preset adjustment strategy. The correction unit 1004 is used to correct the laser focus position according to the laser focus correction parameters to obtain the target laser focus position; The processing unit 1005 is used to determine the corresponding target laser processing parameters based on the target laser focus position. The target laser processing parameters include laser power and processing speed. The target laser processing parameters are used to instruct the laser engraving equipment to perform laser engraving on the target workpiece.

[0136] It should be noted that the information interaction and execution process between the above-mentioned units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, which will not be repeated here.

[0137] Figure 3 This is a schematic diagram of the structure of the computer device provided in an embodiment of this application. Figure 3 As shown, the computer device 3000 of this embodiment includes: at least one processor 3100 ( Figure 3 (Only one is shown) a processor, a memory 3200, and a computer program 3210 stored in the memory 3200 and executable on at least one processor 3100, wherein when the processor 3100 executes the computer program 3210, the computer device performs the steps described in the above embodiments.

[0138] The processor 3100 can be a Central Processing Unit (CPU), or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0139] In some embodiments, memory 3200 may be an internal storage unit of computer device 3000, such as a hard disk or RAM of computer device 3000. In other embodiments, memory 3200 may be an external storage device of computer device 3000, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., provided on computer device 3000. Furthermore, memory 3200 may include both internal and external storage units of computer device 3000. Memory 3200 is used to store operating system, application programs, boot loader data, and other programs, such as program code for computer programs. Memory 3200 may also be used to temporarily store data that has been output or will be output.

[0140] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units is merely an example. In practical applications, the above functions can be assigned to different functional units or modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0141] This application also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a computer device, it enables the computer device to perform the steps described in the above-described method embodiments.

[0142] This application provides a computer program product that, when run on a computer device, enables the computer device to implement the methods described above.

[0143] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it enables a computer device to implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a photographing device / terminal device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0144] It should be understood that the sequence numbers of the steps in the above embodiments do not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. In the description, specific details such as particular system structures and technologies are set forth for illustrative purposes rather than for limiting purposes, so as to provide a thorough understanding of the embodiments of this application. However, those skilled in the art should understand that this application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of this application with unnecessary details.

[0145] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0146] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0147] Furthermore, in the description of this application and the appended claims, the terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0148] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0149] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0150] In the embodiments provided in this application, it should be understood that the disclosed apparatus, computer equipment, and methods can be implemented in other ways. For example, the apparatus and computer equipment embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0151] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for optimizing the precision of fiber-coupled laser engraving, characterized in that, include: The laser focus position during the laser engraving process, as well as the corresponding material surface roughness and temperature fluctuation values, are obtained. The laser focus offset parameters are determined based on the material surface roughness and temperature fluctuation values, and the laser focus offset parameters include the offset direction and offset value. Based on the laser focus offset parameters, a preset adjustment strategy is used to generate corresponding laser focus correction parameters; The laser focus position is corrected according to the laser focus correction parameters to obtain the target laser focus position; The target laser processing parameters are determined based on the target laser focus position. The target laser processing parameters include laser power and processing speed. The target laser processing parameters are used to instruct the laser engraving equipment to perform laser engraving on the target workpiece.

2. The method according to claim 1, characterized in that, The step of determining the laser focus offset parameters based on the material surface roughness and temperature fluctuation values ​​includes: Determine whether the surface roughness of the material exceeds a preset roughness threshold; If the surface roughness of the material exceeds the preset roughness threshold, the initial laser focus offset parameter is obtained by looking up the temperature fluctuation value in a preset lookup table. The preset lookup table is used to represent the correspondence between the temperature fluctuation value and the initial laser focus offset parameter. The initial laser focus offset parameters are corrected using a preset correction model to obtain the laser focus offset parameters.

3. The method according to claim 2, characterized in that, The preset correction model is represented as follows: ； Wherein, ΔF0 represents the initial offset value; ΔR represents the change in material surface roughness; ΔT represents the temperature fluctuation value; E represents other environmental data vectors; H represents historical processing data; and ΔF represents the offset value. Indicates the direction of offset; Indicates the initial offset direction; k is the sensitivity gain.

4. The method according to claim 1, characterized in that, The step of generating corresponding laser focus correction parameters based on the laser focus offset parameters using a preset adjustment strategy includes: Vibration interference data during the laser engraving process is obtained, and the vibration interference data is related to the vibration frequency; Based on the vibration interference data and the laser focus offset parameters, initial laser focus correction parameters are determined, including initial correction values ​​and initial correction directions. Determine whether the initial laser focus correction parameters meet the preset correction conditions. If the initial laser focus correction parameters do not meet the preset correction conditions, then fine-tune the initial laser focus correction parameters until they meet the preset correction conditions to obtain the laser focus correction parameters.

5. The method according to claim 4, characterized in that, The step of determining the corresponding target laser processing parameters based on the target laser focal point position includes: The initial laser processing parameter range is selected from the preset parameter matching table based on the target laser focus position; Simulated laser engraving was performed based on the initial laser processing parameter range to obtain simulation results; The simulation results are compared with the standard results to obtain the laser engraving matching degree; The initial laser processing parameters whose laser engraving matching degree exceeds the preset matching degree threshold are determined as the target laser processing parameters.

6. The method according to claim 5, characterized in that, The method further comprises: Determine whether the temperature fluctuation data and the vibration interference data meet the corresponding preset adjustment thresholds; If the temperature fluctuation data and the vibration interference data meet the corresponding preset adjustment threshold, the initial laser processing parameters are adjusted according to the temperature fluctuation data and the vibration interference data to obtain the target laser processing parameters.

7. The method according to claim 6, characterized in that, The laser power satisfies the following formula: ； in, P 0 represents the initial laser power. Here, ΔT is the temperature sensitivity coefficient, and ΔT is the temperature fluctuation value. Let Δf be the vibration coupling coefficient, and Δf be the change in vibration frequency. Here, A is the frequency reference constant, and A is the vibration acceleration amplitude.

8. The method according to claim 6, characterized in that, The processing speed satisfies the following formula: ； in, The initial processing speed, Let ΔT represent the sensitivity of thermal deformation to temperature fluctuations, where ΔT is the temperature fluctuation value. Let Δf be the intensity of the vibration's effect on the stability of the focal point, Δf be the change in vibration frequency, and A be the amplitude of vibration acceleration.

9. The method according to claim 1, characterized in that, The method further comprises: The laser focus offset level is determined based on the material surface roughness and temperature fluctuation value, and the laser focus offset level includes: low, medium and high. The corresponding offset correction coefficient is determined based on the laser offset level, where different levels correspond to different offset correction coefficients; The laser power or processing speed is adjusted sequentially according to the offset correction coefficient to obtain optimized laser processing parameters.

10. A precision optimization system for fiber-coupled laser engraving, characterized in that, include: The acquisition unit is used to acquire the laser focus position during the laser engraving process, as well as the material surface roughness and temperature fluctuation values ​​corresponding to the laser focus position; A determining unit is used to determine laser focus offset parameters based on the surface roughness and temperature fluctuation value of the material, wherein the laser focus offset parameters include offset direction and offset value; The generation unit is used to generate corresponding laser focus correction parameters based on the laser focus offset parameters using a preset adjustment strategy; The correction unit is used to correct the laser focus position according to the laser focus correction parameters to obtain the target laser focus position; The processing unit is used to determine the corresponding target laser processing parameters based on the target laser focal point position. The target laser processing parameters include laser power and processing speed. The target laser processing parameters are used to instruct the laser engraving equipment to perform laser engraving on the target workpiece.

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