Manufacturing method of micro-fluidic chip

Abstract

The invention provides a manufacturing method of a micro-fluidic chip, which comprises the following steps: preparing a substrate with micro-channels, the substrate has a first surface and a second surface which are opposite to each other, and the micro-channels comprise a first micro-channel positioned on the first surface; pressing a cover sheet on the first surface of the substrate, and enabling a first printing material layer to be arranged between the cover sheet and the substrate; and exposing the first printing material layer and keeping away from an area corresponding to the first micro-channel at the same time, so that the substrate and the cover plate are bonded. According to the manufacturing method and device of the micro-fluidic chip, bonding of the electrode glass and the runner part of the micro-fluidic chip is facilitated, the flatness of the bonding surface is improved, and the smoothness of the preparation process is improved.

Description

[0001] This invention is a divisional application of the invention with application number 202310610834.3, application date May 26, 2023, and invention title "Method for fabricating microfluidic chips and 3D printing equipment". Technical Field

[0002] This application mainly relates to the field of micro-nano 3D printing technology, and in particular to a method for fabricating a microfluidic chip. Background Technology

[0003] With the advancement of technology, the precision of chip fabrication techniques is constantly increasing. Microfluidic chips require high-precision flow channels, some of which are quite complex. Therefore, micro / nano 3D printing technology is a superior method for chip fabrication. This technology utilizes continuous or pulsed laser light or LED light as an energy source, employing a layered scanning and stacking process to decompose a 3D model layer by layer into a 2D model. Furthermore, it integrates with a microscopic imaging optical system to beam-concentrate or focus the light, controlling the photopolymerization reaction process at the micro / nano scale to achieve the printing and manufacturing of micro / nano 3D structures.

[0004] Traditional microfluidic chip printing methods often encounter numerous obstacles when bonding the substrate / electrode glass and the contact surface containing the microchannels. These obstacles include the need for adhesives that are potentially harmful to the microfluidic chip itself, and in some cases, the bonding step can lead to inconsistencies in the overall microfluidic chip manufacturing process. Therefore, there is an urgent need in the field for a fabrication scheme that optimizes the bonding process between the electrode glass and the channelized portion of the microfluidic chip. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a method for fabricating microfluidic chips, which facilitates the bonding of the electrode glass and the flow channel of the microfluidic chip, improves the flatness of the bonding surface, and enhances the smoothness of the preparation process.

[0006] To address the aforementioned technical problems, this application provides a method for fabricating a microfluidic chip, comprising the following steps: preparing a substrate having microchannels, the substrate having opposing first and second surfaces, the microchannels including a first microchannel located on the first surface; pressing a cover sheet onto the first surface of the substrate, and forming a first printing material layer between the cover sheet and the substrate; and exposing the first printing material layer while simultaneously avoiding the area corresponding to the first microchannel, thereby bonding the substrate and the cover sheet.

[0007] Optionally, the step of preparing a substrate with microchannels includes forming the microchannels on the substrate by photolithography, micro / nano imprinting, or mechanical imprinting.

[0008] Optionally, the step of preparing a substrate with microchannels includes: printing the substrate in layers in a 3D printing device in order from the second surface to the first surface until the top layer corresponding to the first surface is printed; wherein, the step of pressing a cover sheet onto the first surface of the substrate includes: pressing the cover sheet onto the top layer.

[0009] Optionally, the step of printing the substrate in layers includes: reducing the distance between the first cover plate of the 3D printing equipment and the forming platform to a predetermined distance, so that there is a second printing material layer between the first cover plate and the substrate to be formed on the forming platform; exposing the second printing material layer using the light source of the 3D printing equipment; and after printing the substrate, removing the first cover plate and adjusting the focal length used to expose the first printing material layer, or readjusting the distance between the first cover plate and the substrate, so that the distance meets the focal length requirement of the light source for exposing the first printing material layer.

[0010] Optionally, the method for fabricating a microfluidic chip further includes the step of placing a cover sheet in the cover sheet preparation area of ​​a 3D printing device and pressing the cover sheet onto the first surface of the substrate, comprising: transferring the cover sheet from the cover sheet preparation area to the printing area and pressing it onto the first surface of the substrate by a transfer mechanism of the 3D printing device.

[0011] Optionally, the method of fabricating a microfluidic chip further includes assembling electrodes onto the cover sheet before pressing the cover sheet onto the first surface of the substrate.

[0012] Compared with the prior art, the microfluidic chip fabrication method of this application can easily and conveniently complete the bonding operation between the electrode glass of the microfluidic chip and the part with the flow channel, with good bonding effect, which can improve the flatness of the bonding surface. In some preferred embodiments, the same 3D printing equipment can be used to complete the printing of the flow channel part and the bonding surface in the microfluidic chip, and the manufacturing process is continuous and direct, avoiding process contamination. Attached Figure Description

[0013] The accompanying drawings are included to provide a further understanding of this application; they are incorporated into and constitute a part of this application. The drawings illustrate embodiments of this application and, together with this specification, serve to explain the principles of this application. In the drawings:

[0014] Figure 1 This is a schematic flowchart illustrating a method for fabricating a microfluidic chip according to an embodiment of this application.

[0015] Figure 2 This is a three-dimensional schematic diagram of a three-dimensional printing device according to an embodiment of this application;

[0016] Figure 3 Is it like this? Figure 2A three-dimensional schematic diagram of a 3D printing device in a working state according to the embodiment shown;

[0017] Figure 4 , Figure 5 , Figure 6 and Figure 7 These are, respectively, the application as Figure 2 The illustrated embodiment presents a schematic diagram of the printing of the exposure area of ​​a 3D printing device under different printing states; and

[0018] Figure 8 and Figure 9 These are, respectively, the application as Figure 2 The illustrated embodiment presents a three-dimensional schematic diagram of a 3D printing device under different working conditions. Detailed Implementation

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0020] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0021] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0022] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0023] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0024] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In addition, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application's specification may have been chosen by the applicant according to his or her judgment, and their detailed meanings are explained in the relevant sections of this description. Moreover, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0025] This application refers to Figure 1 A fabrication method 10 for microfluidic chips (hereinafter referred to as "fabrication method 10") is proposed, which facilitates the bonding of the electrode glass and the flow channel of the microfluidic chip, improves the flatness of the bonding surface, and enhances the smoothness of the preparation process.

[0026] Flowcharts are used in this application to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, various steps can be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more steps may be removed from these processes.

[0027] according to Figure 1 The production method 10 includes steps 11 to 13, which are explained below.

[0028] Reference Figure 1 Step 11 involves preparing a substrate with microchannels. The substrate has opposing first and second surfaces, and the microchannels include first microchannels located on the first surface. These features will be further described below with reference to other accompanying drawings.

[0029] Step 12 involves pressing a cover sheet onto the first surface of the substrate, creating a first layer of printed material between the cover sheet and the substrate. It is understood that in step 11, the substrate is the portion of the microfluidic chip with flow channels, while the cover sheet in some embodiments can be understood as glass over the flow channels or glass with electrodes.

[0030] Step 13 involves exposing the first printed material layer while simultaneously avoiding the area corresponding to the first microchannel, thereby bonding the substrate and the cover plate.

[0031] For example, such as Figure 1 The step 11 shown, preparing a substrate with microchannels, includes forming microchannels on the substrate through photolithography, micro / nano imprinting, or mechanical etching. This application does not limit the method of obtaining a substrate with microchannels. This means that substrates with microchannels prepared using some common methods in the prior art can be directly used as follows: Figure 1 The fabrication method 10 shown enables the bonding operation between the substrate and the cover plate (e.g., electrode glass).

[0032] To better illustrate production method 10, please refer to... Figure 2 This application introduces a 3D printing apparatus 20 for microfluidic chips (hereinafter referred to as "printing apparatus 20"), suitable for fabricating microfluidic chips. In some embodiments of this application, the printing apparatus 20 can employ... Figure 1 The printing operation is performed using the manufacturing method 10 shown, or some preferred variations of the manufacturing method 10. Based on this, Figure 3 , Figure 8 and Figure 9 They are as follows Figure 2 The diagram shows the printing device 20 in several different operating states. Figure 4 , Figure 5 , Figure 6 and Figure 7 These are, respectively, the application as Figure 2 The accompanying drawings are schematic diagrams of the printing area of ​​the printing device 20 under different printing states. These drawings show different structural components of the printing device 20 from different angles, which will be further explained below.

[0033] Reference Figures 2-9 The printing device 20 mainly includes a material cylinder 201, a light source 202, a forming platform 203, a first cover plate 204, and a clamping mechanism 205 (see details). Figure 6 ), controller (not shown in the figure).

[0034] Specifically, refer to Figure 1 The material cylinder 201 is suitable for loading printing materials. The light source 202 is located above the material cylinder 201. The forming platform 203 is vertically and adjustablely positioned within the material cylinder 201. (For a clearer view...) Figure 5 As shown, the molding platform 203 is suitable for supporting a substrate 101 with microchannels for a microfluidic chip. The substrate 101 has opposing first surfaces 102 and second surfaces 103; further combined with... Figure 2 As shown in the relative positional relationship, the first surface 102 faces the light source 202, and there is an exposure space for exposure between the light source 202 and the forming platform 203.

[0035] Furthermore, the first cover plate 204 is movably disposed at the exposure position within the exposure space or in a rest area outside the exposure position. Specifically, during the operation of the printing device 20, the first cover plate 204 is adapted to enter the exposure space and remain at the exposure position, or to leave the exposure position and reach the rest area. It should be explained that, in conjunction with Figure 1 In step 13 of the manufacturing method 10 shown, the first cover plate 204 is in the rest area when printing the first printable material layer. This rest area may be completely located in the exposure area or partially overlap with the exposure area, or as shown in the diagram. Figure 6-8 The area shown is completely outside the exposure area. Only when the above reference... Figure 5 When the substrate 101 is also printed by the printing device 20, it can be assumed that the first cover plate 204 is located at the exposure position in the aforementioned exposure space during the printing process of the substrate 101 using the printing device 20. At this time, the light-transmitting area of ​​the first cover plate 204 is aligned with the light source 202. For example, Figures 3-5 This shows the state of the first cover plate 204 in the exposure position during the printing of substrate 101.

[0036] For example, the first cover plate 204 can be made of a light-transmitting material such as glass. Specific implementations can refer to the structure of a glass cover plate located between the light source and the forming platform in existing photopolymerization 3D printing equipment. In these solutions, the glass cover plate is in a specific position and cannot be moved during the entire process of the 3D printing equipment. Focus adjustment is achieved by adjusting the light source parameters or controlling the movement of the forming platform, thereby enabling printing. Unlike existing technologies, the first cover plate 204 in this application, which is analogous to a glass cover plate in the prior art, can rotate and move vertically or horizontally within the printing equipment 204, thereby satisfying the printing bonding operation between the microchannel substrate and the cover plate (electrode glass) in a microfluidic chip.

[0037] For example, in this embodiment, the printing device 20 further includes a first cover plate movement mechanism, specifically including a rotating part and a lifting part. The rotating part is adapted to control the first cover plate to rotate in the horizontal direction, and the lifting part is adapted to control the first cover plate to move in the vertical direction. Figure 2 An exemplary implementation of the rotating and lifting sections is shown. Specifically, in this embodiment, the rotating section includes a rotary motor 2042 and a rotating platform 2043, and the lifting section includes a lifting motor 2044 and a platform support 2041. During the printing process, when the first cover plate 204 needs to change position between the exposure position and the rest area, it can be controlled jointly by the aforementioned rotating and lifting sections.

[0038] Further reference Figure 6 The printing apparatus 20 also includes a clamping mechanism 205 for clamping the cover plate 105 of the microfluidic chip. The printing apparatus 20 also includes a controller configured to, after controlling the first cover plate 204 to leave the exposure position and reach the rest area, control the clamping mechanism 205 to move and press the cover plate 105 onto the first surface 102 of the substrate 101, creating a first printing material layer between the cover plate 105 and the substrate 101, and control the light source 202 to expose the first printing material layer, thus bonding the substrate 101 and the cover plate 105. It should be noted that, to distinguish different printing processes, the above text distinguishes between the first printing material layer and the second printing material layer. Specifically, the second printing material layer refers to each layer of printing material used when printing the substrate 101 with this printing apparatus 20; however, only when the final step (e.g., as shown in the image) is the second printing material layer considered. Figure 1 As shown in step 13), when the substrate 101 and the cover plate 105 are bonded, the printing material layer between them will be understood as the first printing material layer. Therefore, the first printing material layer and the second printing material layer may essentially belong to the same printing material.

[0039] In some preferred embodiments of this application, for example, as follows Figure 6In the substrate 101 shown, the microchannels include a first microchannel 104 located on the first surface 102. In this case, the controller is also adapted to avoid the area corresponding to the first microchannel 104 when controlling the light source 202 to expose the first printing material layer.

[0040] As described above, in some embodiments of this application, the above references Figure 5 The substrate 101 can also be printed using the printing device 20, and then the printed substrate 101 and cover plate 105 are bonded together. In such an embodiment, the controller is also configured to control the first cover plate 204 to enter the exposure space and remain in the exposure position before the cover plate 105 is pressed onto the first surface 102 of the substrate 101, and further control the light source 202 and the forming platform 203 to print the substrate 101 layer by layer in the order from the second surface 103 to the first surface 102, until the top layer corresponding to the first surface 102 is printed; then the cover plate 105 is pressed onto the top layer.

[0041] For example, the controller can be specifically configured to print the substrate 101 in layers as follows: reducing the distance between the first cover plate 204 and the forming platform 203 to a predetermined distance, so that the substrate 1010 to be formed on the first cover plate 204 and the forming platform 203 (e.g., Figure 4 A second printing material layer is provided between the substrate 101 and the light source 202; the light source 202 is controlled to expose the second printing material layer; and after printing the substrate 101, the controller is also configured to control the first cover plate 204 to leave the exposure position and reach the rest area, and to readjust the relative positional relationship (i.e., the spacing between each other) between the components, thereby meeting the focal length requirement of the light source 202 for exposing the first printing material layer. It is understood that, in this embodiment, referring to... Figures 6-8 This illustrates a scenario where the resting area of ​​the first cover plate 204 does not coincide with the exposure space. Therefore, after printing the substrate 101, it is equivalent to completely removing the first cover plate 204 from the exposure space. At this point, it is necessary to adjust the distance between the light source 202 and the substrate 101 and the cover plate 105 as a whole, so that this distance meets the focal length requirements for exposing the first printed material layer. In some other embodiments of this application, when the resting area of ​​the first cover plate 204 is still located in the exposure space (i.e., the first cover plate 204 moves upward in the exposure space to the resting area so that there is space between the first cover plate 204 and the substrate 101 to accommodate the cover plate 105), in such embodiments, readjusting the exposure focal length of the light source 202 requires considering the refraction effect of the cover plate 105 and the first cover plate 204 on the light, so that it meets the focal length requirements for printing the first printed material layer between the cover plate 105 and the substrate 101.

[0042] Specifically, during the printing process of substrate 101 using printing equipment 20, before printing to the top layer corresponding to the first surface 102, the substrate 1010 to be formed that has not yet been finally printed is carried on the forming platform at any printing stage; in addition, before printing to the top layer, each printing layer of substrate 101 can be understood as the second printing material layer mentioned above, that is, during the printing process of substrate 101, there is a second printing material layer between the first cover plate 204 and the substrate 1010 to be formed.

[0043] More preferably, refer to Figure 2 The printing device 20 also includes a cover plate preparation area 206 for holding one or more cover plates, such as... Figure 6 and Figure 7 The cover plate 105 is shown. In this embodiment, the clamping mechanism 205 of the cover plate 105 is located in the cover plate preparation area 206 and is used to fix and control the movement of the cover plate 105. Therefore, the printing device 20 also includes a cover plate transfer mechanism 207 connected to the cover plate preparation area 206. The cover plate transfer mechanism 207 includes a cover plate transfer lifting motor 2071, a cover plate transfer rotating motor 2072, and a cover plate transfer rotating platform 2073. Similar to the rotating and lifting parts for the first cover plate 204 described above, each component in the cover plate transfer mechanism 207 can receive control commands from the controller to transport the cover plate 105 to the corresponding printing position in a timely manner. In this embodiment, the controller is further configured to control the cover plate transfer mechanism 207 to transfer the cover plate 105 from the cover plate preparation area 206 to the exposure position after the substrate 101 is located in the exposure space, with the effect after transfer as shown... Figure 8 As shown. After the transfer, the cover plate 105 and the substrate 101 are bonded by curing the first printed material layer. After printing is completed, the cover plate transfer mechanism 207 can also retract the cover plate preparation area 206 to the initial position until the next printing, at which point the state is as shown. Figure 9 As shown.

[0044] The preceding text described references Figures 2-9 Some structural features of the printing device 20 shown above, as described above, allow the printing device 20 to be adapted to, for example... Figure 1 The manufacturing method shown is 10, or some variations thereof. The following describes... Figure 1 Based on the fabrication method 10 shown, and combined with the printing device 20, this application presents other preferred embodiments of microfluidic chip fabrication methods.

[0045] As mentioned earlier, such as Figure 1 The substrate in the fabrication method 10 shown can be prepared using existing techniques such as photolithography, but it can also be prepared using the 3D printing equipment proposed in this application. In such an embodiment, as... Figure 1The step 11 shown, which involves preparing the substrate with microchannels, specifically includes: printing the substrate 101 in layers in the printing apparatus 20 in the order from the second surface 103 to the first surface 102, until the top layer corresponding to the first surface 102 is printed. In such an embodiment, referring to... Figure 6 The step of pressing a cover sheet 105 onto the first surface 102 of the substrate 101 includes pressing a cover sheet 105 onto the top layer.

[0046] For example, refer to Figure 4 The step of printing the substrate 101 in layers includes reducing the distance between the first cover plate 204 of the printing device 20 and the forming platform 203 to a predetermined distance, so that there is a second printing material layer between the first cover plate 204 and the substrate 1010 to be formed on the forming platform 203; exposing the second printing material layer using the light source 202 of the printing device 20; and after printing the substrate 101, removing the first cover plate 204 and adjusting the focal length used to expose the first printing material layer, or readjusting the distance between the first cover plate 204 and the substrate 101 so that the distance meets the focal length requirement of the light source 202 for exposing the first printing material layer.

[0047] For example, refer to Figure 6 The method for fabricating a microfluidic chip proposed in this application further includes placing a cover plate 105 in the cover plate preparation area 206 of the printing device 20. In such an embodiment, the above-mentioned... Figure 1 The step of pressing the cover sheet 105 onto the first surface 102 of the substrate 101 in step 12 further includes: transferring the cover sheet 105 from the cover sheet preparation area 206 to the printing area and pressing it onto the first surface 102 of the substrate 101 by the cover sheet transfer mechanism 207 of the printing device 20.

[0048] Preferably, before pressing the cover sheet 105 onto the first surface 102 of the substrate 101, the electrode is further assembled onto the cover sheet 105. Using this method, a microfluidic chip can be obtained after bonding the substrate 101 and the cover sheet 105 without additional electrode fabrication steps, further optimizing the fabrication process.

[0049] To better understand the fabrication method of the microfluidic chip and the 3D printing equipment proposed in this application, the following is based on... Figures 2-9 The fabrication method of the microfluidic chip involved in this embodiment will be fully described.

[0050] First refer to Figure 2 and Figure 3 ,exist Figure 2In the initial state shown, in response to the controller's control command, the first cover plate 204 is moved to the exposure position in the exposure space by controlling the rotating and lifting parts of the first cover plate 204. This exposure position is also the position where the first cover plate 204 faces the light source 202 when the printing device 20 is normally printing any 3D model. Next, the substrate 101 is printed by the printing device 20, and before printing is completed, it presents the following appearance: Figure 4 The image shows the pattern of the substrate 1010 to be molded. (Continue to refer to...) Figure 5 Finally, the substrate 101 is printed onto the top layer of the first surface 102 in the printing device 20. Figure 5 This illustrates the unevenness of the first surface 102 caused by the printing or release process when printing the top layer of paper. Figure 5 The first surface 102 in the middle shows an uneven pattern; at the same time, in this embodiment, during the printing of the substrate 101, according to the actual needs of the microfluidic chip to be prepared, a first microchannel 104 is left on the first surface 102.

[0051] It should be noted that in this embodiment, the substrate 101 is pre-processed in a printing device used for bonding printing. Of course, this application is not limited to this. In some other embodiments, the substrate of the microfluidic chip can be prepared based on photolithography or other means. In such embodiments, this step can be skipped. Figures 3-5 The stage, directly from Figure 6 The fabrication process is carried out in the state shown. In this embodiment, since the substrate 101 has already been printed, the first cover plate 204 can be moved from the exposure displacement to the rest region. As described above, this rest region can partially or completely overlap with the exposure region (i.e., be completely within the exposure space or completely away from the exposure position), or it can completely leave the exposure region and return to the state shown. Figure 2 The initial position is shown. It should be noted that in some production scenarios, if the rest area and exposure area are set to completely overlap, it means that when bonding the substrate 101 and the cover plate 105, the first cover plate 204 is still in the path of the light source illuminating the forming platform 203. However, because the cover plate 105 also contains light-transmitting materials such as glass, the exposure focal length of the light source 202 needs to be adjusted based on the thickness of the first cover plate 204 and the thickness of the glass in the cover plate 105. See below for reference. Figures 6-9 Continuing with the example, the first cover plate 204 completely leaves the exposure area after the substrate 101 is printed.

[0052] according to Figure 6The cover plate 105 is held on top of the substrate 101 by the cover plate clamping mechanism 205. Then, through the combined action of the forming platform 203, the cover plate clamping mechanism 205, and the cover plate transfer mechanism 207, the bonding surface between the substrate 101 and the cover plate 105 is immersed in the chemical bath 201, thereby giving this bonding surface a first printing material layer. Furthermore, considering that the glass thickness and material of the cover plate 105 may differ from the dimensional parameters of the first cover plate 204, the exposure focal length of the light source 202 can be reconfirmed or adjusted at this time. (See next...) Figure 7 The first printed material layer is exposed while simultaneously avoiding the area corresponding to the first microchannel 104, allowing the substrate 101 and the cover plate 105 to bond. From Figure 7 What is clearly visible in the comparison is Figure 5 The unevenness of the top layer of substrate 101 was improved to a smooth state due to the immersion and exposure of the printing material. The equipment status for printing the bonding surface can also be referenced above. Figure 8 As shown. Finally, refer to Figure 9 The printed microfluidic chip remains on the molding platform 203, while the cover plate preparation area 206 can return to its initial state.

[0053] The microfluidic chip fabrication method and 3D printing equipment proposed in this application are improvements upon traditional 3D printing equipment, optimizing the final step of the microfluidic chip fabrication process: bonding. This application cleverly utilizes the light-transmitting property of the electrode glass in the microfluidic chip, placing the bonding step directly within the 3D printing equipment, greatly optimizing the microfluidic chip fabrication method. In some preferred embodiments, especially when substrate and bonding surface preparation are completed within the same 3D printing equipment, the first cover plate in the 3D printing equipment is designed to move freely in space and simultaneously prepare a cover plate preparation area. This allows for convenient curing of the bonding surface directly after substrate printing, resulting in a smooth processing flow and avoiding issues such as uneven bonding surfaces. It has high applicability and outstanding fabrication results.

[0054] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0055] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0056] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0057] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0058] Although this application has been described with reference to specific embodiments, those skilled in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, any changes or modifications to the above embodiments within the essential spirit of this application will fall within the scope of the claims of this application.

Claims

1. A method for fabricating a microfluidic chip, comprising the following steps: Prepare a substrate with microchannels, the substrate having opposing first and second surfaces, the microchannels including a first microchannel located on the first surface; A cover sheet is pressed onto the first surface of the substrate, and a first layer of printing material is formed between the cover sheet and the substrate; as well as The first printed material layer is exposed while avoiding the area corresponding to the first microchannel, so that the substrate and the cover plate are bonded.

2. The method as described in claim 1, characterized in that, The steps of preparing a substrate with microchannels include forming the microchannels on the substrate by photolithography, micro / nano imprinting, or mechanical imprinting.

3. The method as described in claim 1, characterized in that, The steps for preparing a substrate with microchannels include: printing the substrate in layers in a 3D printing device in the order from the second surface to the first surface, until the top layer corresponding to the first surface is printed; The step of pressing a cover sheet onto the first surface of the substrate includes pressing the cover sheet onto the top layer.

4. The method as described in claim 3, characterized in that, The steps of layer printing the substrate include: The distance between the first cover plate of the 3D printing equipment and the forming platform is reduced to a predetermined distance, so that there is a second printing material layer between the first cover plate and the substrate to be formed on the forming platform; The second printing material layer is exposed using the light source of the 3D printing equipment; and After printing the substrate, the first cover plate is removed and the focal length for exposing the first printed material layer is adjusted, or the distance between the first cover plate and the substrate is readjusted so that the distance meets the focal length requirement for the light source to expose the first printed material layer.

5. The method as described in claim 1, characterized in that, The method also includes the step of placing a cover sheet in the cover sheet preparation area of ​​the 3D printing device and pressing the cover sheet onto the first surface of the substrate, which includes: transferring the cover sheet from the cover sheet preparation area to the printing area and pressing it onto the first surface of the substrate by means of the transfer mechanism of the 3D printing device.

6. The method as described in claim 1 or 5, characterized in that, The process includes attaching electrodes to the cover sheet before pressing the cover sheet onto the first surface of the substrate.

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