Substrate positioning method and ink-jet printer

Abstract

The invention discloses a substrate positioning method, and the method comprises the steps: moving a camera according to a preset camera path, and obtaining a first mark point coordinate and a second mark point coordinate of a substrate; wherein the initial position of the camera is the original point of the plane-coordinate system, and the initial position is the initial position of the substrate in the positioning operation; obtaining an offset parameter of the substrate according to the first mark point coordinate and the second mark point coordinate; the offset parameter is the offset parameter of the current position of the substrate relative to the target position; moving the substrate to a target position according to the offset parameter; third mark point coordinates of the substrate are obtained through a camera, and the target position is rechecked; and when the recheck of the target position is passed, confirming that the substrate completes the positioning operation. According to the invention, the substrate is positioned through a single camera, and the debugging is simple; substrates with different sizes and positioning marks with different sizes can be compatible; the occupied space is small, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the technical field of substrate positioning, specifically a substrate positioning method and an inkjet printer. Background Technology

[0002] Currently, precise positioning of the substrate is required during the printing of display panels. This is especially true for inkjet printing, which is micron-level printing, where precise substrate positioning is crucial for printing accuracy.

[0003] Currently, multiple cameras are often used in substrate positioning, such as two cameras. Each camera aligns its lens crosshair with the positioning crosshair on the substrate to complete substrate positioning. Multiple cameras bring the following problems: 1. High debugging workload: The coordinates of each camera need to be calibrated with the substrate's coordinates to ensure each camera is in the same coordinate system as the substrate; 2. Poor compatibility: Camera positions are often fixed, typically positioning fixed-size markings on fixed-size substrates, making them incompatible with various sizes of markings or substrates; 3. Accumulated guide rail errors: Cameras are fixed on supports. After the substrate is positioned by the camera in the transport direction, it is sent to the inkjet printer printhead via guide rails. Although the camera completes the positioning, the guide rails themselves have errors, which can still cause printing deviations; 4. Large space occupation: Inkjet printers have complex structures, including air-bearing transport and visual inspection components, making space reduction crucial; 5. High cost: High-definition cameras are expensive, and the cost of the cameras, their supports, and guide rails is also significant.

[0004] Therefore, it is particularly important to position the substrate during inkjet printing by reducing the number of cameras. Summary of the Invention

[0005] This application provides a substrate positioning method that enables substrate positioning via a single camera during inkjet printing. The method is simple to debug, requiring only one camera to be adjusted. The camera and printhead are set together, and the printhead can print directly after the camera completes positioning, reducing the accumulation of guide rail errors when using multiple cameras. Furthermore, it is compatible with substrates of different sizes and positioning marks of different sizes. It also occupies less space and reduces costs.

[0006] The first aspect of this application discloses a method for positioning a substrate. The method includes: moving a camera according to a preset camera path and acquiring the coordinates of a first marker point and a second marker point on the substrate; wherein the initial position of the camera is the origin of a planar coordinate system, and the initial position is the starting position of the substrate in the positioning operation; obtaining an offset parameter of the substrate according to the first marker point coordinates and the second marker point coordinates; the offset parameter is the offset parameter of the current position of the substrate relative to a target position; moving the substrate to the target position according to the offset parameter; acquiring the coordinates of a third marker point on the substrate through the camera and rechecking the target position; and confirming that the substrate has completed the positioning operation when the recheck of the target position passes.

[0007] In the above solution, only one camera is used, which is moved by a motion module to capture the coordinates of three marker points. A single camera saves costs compared to multiple cameras. Furthermore, during substrate positioning, the camera serves as the origin of the planar coordinate system; it can move to the position of the second marker point to obtain its coordinates, then move to the position of the first marker point to obtain its coordinates, return to the second marker point, and then move to the position of the third marker point to obtain its coordinates. Two of the three marker points are located on the diagonal of the substrate, allowing for the determination of substrate deformation and more accurate substrate positioning. Substrate deformation and offset can both affect the printing quality of the inkjet printer. Moreover, by obtaining the substrate offset parameters through two marker points and verifying them through the third marker point, substrate positioning is achieved. Using three marker points ensures precise substrate positioning; if only one or two marker points are used, substrate positioning errors still exist, especially during inkjet printing (micron-level printing), where small errors accumulate and lead to inkjet printing deviations, thus reducing the yield rate of inkjet printing.

[0008] In one possible implementation, before moving the camera according to a preset camera path and obtaining the coordinates of the first and second marker points on the substrate, the method includes: obtaining the serial number of the substrate through the camera; obtaining the preset camera path corresponding to the serial number from a preset database; the preset database includes the correspondence between the serial number and the preset camera path.

[0009] The above scheme aims to illustrate the relationship between the preset camera path and the substrate serial number. The substrate serial number serves as a carrier of substrate information. The camera can first capture the serial number on the substrate and then retrieve the preset camera path corresponding to that serial number from the preset database. The position of the serial number on the substrate is preferentially set at the second marker point, which is often also set as the coordinates of the first marker point acquired by the camera.

[0010] In one possible implementation, the serial number includes a substrate serial number and a substrate size type number; wherein, the substrate size type number is a number corresponding to the length and width of the substrate, and one substrate size type number corresponds to one size of the substrate.

[0011] The above scheme aims to disclose the serial number settings. The serial number includes a serial number, which is either the production date of the substrate or a unique identifier for the substrate; the substrate size type number is used to indicate the length and width of the substrate. When the camera obtains the substrate serial number, it can parse the substrate size type number and then obtain the substrate size; the substrate size corresponds to a preset camera path.

[0012] In one possible implementation, before obtaining the preset camera path corresponding to the serial number in the preset database, the method includes: constructing a correspondence between the serial number and the preset camera path; wherein, one serial number corresponds to one preset camera path, and the preset camera path includes a first distance moved by the camera in the Y-axis direction and a second distance moved in the X-axis direction of the planar coordinate system; the first distance is the distance between the coordinates of the first marker point and the coordinates of the second marker point, and the second distance is the distance between the coordinates of the second marker point and the third marker point; and storing the correspondence in the preset database.

[0013] The above solution aims to pre-define the database construction method. The substrate size information is mapped or stored in the serial number; the pre-defined camera path needs to correspond to the substrate size. The pre-defined camera path is the path the camera takes to find marker points on the Y-axis or X-axis. Configuring this path requires knowing the distance between two marker points; and the distance between two marker points is closely related to the substrate size. Therefore, the relationship between the pre-defined camera path and the serial number is pre-built and stored in the pre-defined database. In other words, the solution in this application supports automatic positioning of substrates of different sizes.

[0014] In one possible implementation, the coordinates of the first marker point, the second marker point, and the third marker point are located at any three vertices of the substrate; wherein the coordinates of the first marker point and the second marker point are located in the Y-axis direction of the planar coordinate system, and the coordinates of the second marker point and the third marker point are located in the X-axis direction of the planar coordinate system.

[0015] The above scheme discloses the positions of three marker points. Any three of the four vertices of the substrate can be used as marker points; these markers are often configured as a positioning "cross," placed near the vertices and at a distance from both the length and width of the substrate. For ease of explanation, the markers along the Y-axis are designated as the first and second marker points, and those along the X-axis as the second and third marker points; the second marker point is the first marker point captured by the camera. The third marker point is located far from the first and second marker points to facilitate the identification of minute substrate offsets; the distance between the first and second marker points should be greater than the distance between the second and third marker points. A larger distance makes it easier to identify minute offsets and allows for more precise substrate positioning. In particular, substrate deformation in the middle (bending or twisting along the X or Y axis) or diagonal deformation (bending or twisting around the diagonal) can be identified through the positioning of these three markers.

[0016] In one possible implementation, the offset parameter includes one or more of an offset angle, a third distance offset along the X-axis of the planar coordinate system, and a fourth distance offset along the Y-axis of the planar coordinate system; wherein the offset angle is the angle between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the planar coordinate system, the third distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate along the X-axis of the planar coordinate system, and the fourth distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate along the Y-axis of the planar coordinate system.

[0017] The offset parameters are disclosed in the above scheme. The offset of the substrate may be one or more types of offset.

[0018] In one possible implementation, when the re-inspection of the target position passes, it is confirmed that the substrate has completed the positioning; specifically, this includes: moving the camera and acquiring the coordinates of the third marker point, the coordinates of the third marker point being the actual coordinates of the current position of the third marker point; when the coordinates of the third marker point are the same as the coordinates of the third marker point when the substrate is in the target position, it is confirmed that the re-inspection of the target position passes; when the re-inspection of the target position passes, it is confirmed that the substrate has completed the positioning operation.

[0019] The above scheme discloses a re-inspection method using the third marker point as the re-inspection marker point. That is, the actual coordinates of the third marker point at the current position of the substrate after correction are obtained; and the coordinates of the third marker point at the target position (also known as the theoretical position of the third marker point) are compared. If the two are the same, the re-inspection of the target position is confirmed to have passed.

[0020] In one possible implementation, the method further includes: when the re-inspection of the target position fails, re-acquiring the current position coordinates of the first marker point and the second marker point; obtaining a new offset parameter based on the re-acquiring the current position coordinates of the first marker point and the second marker point; moving the substrate to the target position based on the new offset parameter; and re-performing the re-inspection operation until the re-inspection operation is successful.

[0021] The above solution discloses that when a re-inspection fails, the coordinates of the first and second marker points need to be re-acquired, new offset parameters calculated for correction (i.e., position compensation), and then a re-inspection is performed again. This method ensures more accurate positioning of the substrate, and if multiple re-inspections (the specific number can be set) fail, an alarm or prompt message can be issued to allow for manual intervention.

[0022] In one possible implementation, after the target position is re-inspected and confirmed that the substrate has completed the positioning operation, the method further includes: obtaining the initial distance between the substrate edge and the stage edge; wherein the substrate is located on the stage; after the stage moves, the real-time distance between the substrate edge and the stage edge is monitored in real time; when the difference between the real-time distance and the initial distance is greater than or equal to a preset distance threshold, a substrate offset prompt is issued.

[0023] In the above scheme, the substrate may shift as it moves with the stage after positioning. If a shift occurs, the stage moves the substrate back to its initial positioning position, and the positioning operation is repeated. The initial distance includes a first distance between the width edge of the substrate and the width edge of the stage, and a second distance between the length edge of the substrate and the length edge of the stage. The real-time distance corresponds to and is the same as the initial distance, but the real-time distance is after the stage has moved, while the initial distance is before the stage has moved and after the substrate has been positioned. The difference between the real-time distance and the initial distance is the difference between the first distance in the initial distance and the first distance in the real-time distance, and the difference between the second distance in the initial distance and the second distance in the real-time distance. Any difference greater than or equal to a preset distance threshold will trigger a substrate shift warning.

[0024] In one possible implementation, the offset parameter of the substrate is obtained based on the coordinates of the first marker point and the coordinates of the second marker point; specifically including:

[0025] The offset angle is obtained in the following way:

[0026]

[0027] L = b - 2 * h²;

[0028] Where θ is the offset angle, the coordinates of the first marker point are (x1, y1), the coordinates of the second marker point are (x2, y2), L is the distance between the first and second marker points, b is the width of the substrate, and h2 is the perpendicular distance between the first and second marker points and the long side of the substrate.

[0029] In one possible implementation, the offset parameter of the substrate is obtained based on the coordinates of the first marker point and the coordinates of the second marker point; specifically including:

[0030] Obtained through the following methods:

[0031]

[0032] Wherein, the coordinates of the second marker point are (x2, y2), h2 is the vertical distance between the first and second marker points and the long side of the substrate, h1 is the vertical distance between the first and second marker points and the short side of the substrate, b is the width of the substrate, a is the length of the substrate, Lx is the distance on the X-axis between the current position of the substrate after offset and the second marker point, and α is the angle on the X-axis between the current position of the substrate after offset and the second marker point.

[0033] In one possible implementation, the offset parameter of the substrate is obtained based on the coordinates of the first marker point and the coordinates of the second marker point; specifically including:

[0034] Obtained through the following methods:

[0035]

[0036] Wherein, the coordinates of the second marker point are (x2, y2), h2 is the vertical distance between the first and second marker points and the long side of the substrate, h1 is the vertical distance between the first and second marker points and the short side of the substrate, b is the width of the substrate, a is the length of the substrate, Ly is the distance on the Y-axis between the current position of the substrate after offset and the second marker point, and α is the angle on the X-axis between the current position of the substrate after offset and the second marker point.

[0037] A second aspect of this application discloses an inkjet printer, including a processor, a memory, a user interface, and a network interface. The memory is used to store instructions, and both the user interface and the network interface are used to communicate with other devices. The processor is used to execute the instructions stored in the memory to cause the electronic device to perform the following instructions:

[0038] According to the preset camera path, the camera is moved and the coordinates of the first and second marker points on the substrate are obtained; wherein, the initial position of the camera is the origin of the plane coordinate system, and the initial position is the starting position of the substrate in the positioning operation;

[0039] The offset parameter of the substrate is obtained based on the coordinates of the first and second marker points; the offset parameter is the offset parameter of the current position of the substrate relative to the target position.

[0040] Based on the offset parameter, move the substrate to the target position;

[0041] The target position is re-inspected by acquiring the coordinates of the third marker point on the substrate using a camera.

[0042] When the re-inspection of the target position passes, it is confirmed that the substrate has completed the positioning operation.

[0043] A third aspect of this application provides a computer-readable storage medium storing instructions that, when executed, perform the method described in any of the preceding descriptions.

[0044] The beneficial effects of this application include:

[0045] The substrate positioning is completed by a single camera, which is simple to debug and only requires debugging of one camera. The camera and printhead are set together. After the camera completes the positioning, the printhead can print directly, which reduces the accumulation of guide rail errors when using multiple cameras. It is also compatible with substrates of different sizes and positioning marks of different sizes. It occupies less space and reduces costs.

[0046] Using only a single camera, moved by a motion module, it captures the coordinates of three marker points. This single-camera approach saves costs compared to multiple cameras. Furthermore, during substrate positioning, the camera serves as the origin of the planar coordinate system. It can move to the second marker point to obtain its coordinates, then to the first marker point to obtain its coordinates, and so on. The camera returns to the second marker point and then moves to the third marker point to obtain its coordinates. Two of the three marker points are located diagonally across the substrate, allowing for accurate substrate positioning and determination of substrate deformation. Substrate deformation and offset can both affect the print quality of inkjet printers.

[0047] In addition, the substrate offset parameters are obtained through two marker points, and the substrate positioning is achieved by re-inspecting through a third marker point. Three marker points are used to accurately position the substrate. If only one or two marker points are used, the substrate positioning will still have errors. In particular, during the inkjet printing (micron-level printing) process of the substrate, small errors accumulate and cause inkjet printing deviations, thereby reducing the yield of inkjet printing of the substrate.

[0048] The relationship between the preset camera path and the substrate serial number. The substrate serial number serves as a carrier of substrate information. The camera can first capture the serial number on the substrate, and then retrieve the preset camera path corresponding to that serial number from the preset database. The position of the serial number on the substrate is preferentially set at the second marker point, which is often also set as the coordinates of the first marker point acquired by the camera.

[0049] The serial number is set publicly. The serial number includes a serial number, which is either the production date of the substrate or a unique identifier for the substrate; the substrate size type number is used to indicate the length and width of the substrate. When the camera obtains the substrate serial number, it can parse the substrate size type number and then obtain the substrate size; the substrate size corresponds to the preset camera path.

[0050] The method for constructing the preset database is disclosed. The substrate size information is mapped or stored in the serial number; the preset camera path needs to correspond to the substrate size. The preset camera path is the path the camera takes to find marker points on the Y-axis or X-axis. Configuring this path requires knowing the distance between two marker points; and the distance between two marker points is closely related to the substrate size. Therefore, the relationship between the preset camera path and the serial number is pre-constructed and stored in the preset database. In other words, the solution in this application supports automatic positioning of substrates of different sizes.

[0051] The system monitors for potential substrate misalignment as the substrate moves with the stage after positioning. If misalignment occurs, the stage repositions the substrate back to its initial positioning position, and the positioning operation is repeated. The initial distance includes a first distance between the substrate's width edge and the stage's width edge, and a second distance between the substrate's length edge and the stage's length edge. The real-time distance corresponds to and is the same as the initial distance, but it is after the stage has moved, while the initial distance is before the stage has moved and after the substrate has been positioned. The difference between the real-time distance and the initial distance is the difference between the first distance in the initial distance and the first distance in the real-time distance, and the difference between the second distance in the initial distance and the second distance in the real-time distance. Any difference greater than or equal to a preset distance threshold will trigger a substrate misalignment warning. Attached Figure Description

[0052] Figure 1 This is a schematic flowchart of a substrate positioning method disclosed in this application specification;

[0053] Figure 2 This is a schematic flowchart of another substrate positioning method disclosed in this application specification;

[0054] Figure 3 This is a schematic diagram illustrating an application scenario of the substrate positioning method disclosed in this application.

[0055] Figure 4 This is a schematic diagram of the substrate offset disclosed in this application specification;

[0056] Figure 5 This is a schematic diagram of another substrate offset disclosed in this application specification;

[0057] Figure 6 This is a schematic diagram of the structure of an electronic device disclosed in this application.

[0058] In the diagram: inkjet printing area 100, adsorption and transfer unit 101, plasma cleaning unit 102, automatic optical inspection unit 103, visual correction unit 104, inkjet printing unit 105, ultraviolet curing lamp unit 106, first gantry frame 107, second gantry frame 108, zero reference point of rectangular coordinate system 109, glass substrate 110; first marking point 201, second marking point 202, third marking point 203. Detailed Implementation

[0059] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0060] In the description of the embodiments of this application, the words "for example" or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design that is described as "for example" or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Rather, the use of the words "for example" or "for instance" is intended to present the relevant concepts in a specific manner.

[0061] In the description of the embodiments of this application, the term "multiple" means two or more. For example, multiple systems means two or more systems, and multiple screen terminals means two or more screen terminals. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0062] Figure 3 A schematic diagram illustrating an application scenario for substrate positioning. (Example) Figure 3As shown, the glass substrate 110 is placed on the adsorption and transfer unit 101, wherein the two adjacent edges of the glass substrate are aligned with the positioning blocks on the two sides of the adsorption platform of the adsorption and transfer unit 101. After vacuum adsorption and fixation through the adsorption holes, the adsorption and transfer unit 101 moves along the X direction to below the plasma cleaning unit 102. Subsequently, the plasma cleaning unit 102 moves along the Y direction to the cleaning starting point of the glass substrate, wherein the plasma cleaning unit moves and cleans along the Y direction. When the plasma cleaning unit 102 moves to the edge of the glass substrate in the Y+ direction, the stage transfer unit ( Figure 3 (Not shown) The plasma cleaning unit moves along the X+ direction with a set step distance, connecting with the previously cleaned area in the X direction. Then, the plasma cleaning unit moves along the Y- direction until the plasma cleaning unit 102 moves the glass substrate 110 to the edge in the Y- direction. At this point, the adsorption and transfer unit moves along the X+ direction again with a set step distance, connecting with the previously cleaned area in the X direction. This cycle repeats until the entire glass substrate is cleaned and covered. After cleaning, the adsorption and transfer unit 101 carries the glass substrate a fixed distance to the visual correction unit 104 for correction. Precise positioning of the substrate is required at this stage.

[0063] like Figure 3 As shown, after cleaning, the adsorption and transfer unit 101 will carry the glass substrate a fixed distance to the visual correction unit 104 for correction. The zero reference point at the lower left corner of the adsorption platform 109 is set as the origin of the coordinate system. This position is also the starting position of the camera under the substrate positioning operation.

[0064] After the glass substrate passes through the first gantry-type fixing frame 107, the inkjet printing unit 105 determines the start and end points of inkjet printing and performs inkjet printing on the entire surface or a designated area of ​​the glass substrate; mainly printing in the inkjet printing area 100 of the glass substrate. The printing process can be as follows: The inkjet printing unit 105 first moves to point A (pre-set point) on the glass substrate and begins inkjet printing, moving towards point B at a set speed, and stopping inkjet printing upon reaching point B. After the stage transfer unit (adsorption transfer unit) 101 moves a set step distance in the X+ direction, the inkjet printing unit 105 starts inkjet printing again, moving towards the Y+ direction at a set speed until it reaches the upper edge of the glass substrate and stops inkjet printing. After the stage transfer unit 101 moves a set step distance in the X+ direction, the inkjet printing unit 105 starts inkjet printing again, moving towards the Y- direction at a set speed until it reaches the lower edge of the glass substrate and stops, and this cycle continues until the entire glass substrate is printed. After the glass substrate 110 is printed by the inkjet printing unit 105, the inkjet printing unit 105 and the visual correction unit 104 move to their original positions to await the next substrate. The stage transfer unit 101 carries the printed glass substrate to below the Automated Optical Inspection (AOI) unit 103. The AOI unit 103 moves over multiple different areas of the glass substrate to take pictures, and uses a pre-set image defect detection system to inspect the printing quality of the glass substrate. The inspection results are transmitted to the processor (e.g., a PLC processor) via Ethernet; the processor performs NG logic calibration on the current printing quality of the glass substrate. The AOI process is then complete.

[0065] After the glass substrate passes through the second gantry-type fixing frame 108, the stage transfer unit 101 moves the glass substrate to the ultraviolet (UV) curing lamp unit 106 for ink curing. The UV curing lamp converts electrical energy into light energy, exciting the phosphor to generate ultraviolet radiation, thus curing the liquid material. The UV curing lamp unit 106 scans the ink on the entire surface of the glass substrate using a line scan method. The UV curing lamp unit 106 first moves to the lower edge of the glass substrate, then turns on the curing lamp. At the set moving speed, the UV curing lamp unit 106 moves uniformly along the Y+ direction, stopping and turning off the curing lamp when it reaches the upper edge of the glass substrate, thus completing the UV curing process.

[0066] The stage transfer unit 101 moves the glass substrate to the unloading area to prepare for unloading. At this point, the entire automatic alignment and inkjet printing process is complete.

[0067] In this specification, the target position of the substrate is the position of the substrate when the inkjet printer prints on the substrate, which is also the standard position that the substrate is set in advance; substrate offset refers to the substrate deviating from the target position of the substrate, which may be an X-axis, Y-axis or angular offset.

[0068] The positioning operation of the substrate will be explained in detail below.

[0069] This specification discloses a method for positioning a substrate, such as... Figure 1 As shown. The method includes steps S101-S105. The subject of this instruction manual is an inkjet printer.

[0070] Step S101: Move the camera according to the preset camera path and obtain the coordinates of the first and second marker points on the substrate; wherein, the initial position of the camera is the origin of the plane coordinate system and the initial position is the starting position of the substrate in the positioning operation.

[0071] The camera serves as the starting point for the positioning operation. When the camera captures the first marker point, it automatically aligns the "positioning crosshair" on the camera lens with the "crosshair" of the first marker point and obtains the coordinates of the first marker point. Similarly, the coordinates of the second marker point are obtained.

[0072] At this point, the offset parameters of the substrate are obtained through two marker points, and the substrate is re-inspected through a third marker point to achieve substrate positioning. Three marker points are used to accurately position the substrate. If only one or two marker points are used, the substrate positioning will still have errors. Especially in the process of inkjet printing (micron-level printing) of the substrate, small errors accumulate and will lead to inkjet printing deviation, thereby reducing the yield of inkjet printing of the substrate.

[0073] Furthermore, the above method uses only one camera, which is moved by a motion module to capture images of three marker points and obtain their coordinates. A single camera saves costs compared to multiple cameras. Moreover, during the substrate positioning operation, the camera serves as the origin of the planar coordinate system; it can move to the position of the second marker point to obtain its coordinates; then move to the position of the first marker point to obtain its coordinates; the camera returns to the second marker point, and then moves to the position of the third marker point to obtain its coordinates.

[0074] Using multiple cameras, such as two vision cameras, increases equipment investment costs and the computational burden on the computer. In vision-based correction or positioning systems, for glass substrates with two specific marker points, two fixed cameras are often configured to photograph the two marker points on the glass substrate respectively. This not only limits the size of the glass substrate printed by inkjet printing but also increases the manufacturing and maintenance costs of the equipment, as well as the computational burden on the CPU (the CPU needs to process data from two cameras), affecting the efficiency of the equipment. Furthermore, the connection positions of the vision cameras are fixed, which is often inconvenient for photographing glass substrates of different sizes: in existing vision-based correction systems, the fixed position of the camera remains unchanged throughout the entire automatic operation process. Before each correction, the glass substrate needs to be moved by the motion module to a pre-set fixed position to photograph the marker points on the glass substrate. If a different sized glass substrate is used, the photographing points need to be re-taught and recorded separately, and the re-teaching of the photographing points requires professional skills from the operator and has a relatively high error rate.

[0075] Furthermore, the substrate positioning is completed by a single camera, which is simple to debug and only requires debugging of one camera. The camera and printhead are set together, and after the camera completes the positioning, the printhead can print directly, reducing the accumulation of guide rail errors when using multiple cameras. It is also compatible with substrates of different sizes and positioning marks of different sizes. It occupies less space and reduces costs.

[0076] If multiple cameras are used, and their positions are fixed, the following situations cannot be addressed: The distances between multiple positioning marks differ on substrates of different sizes (and the distance a single camera needs to move also differs); even on substrates of the same size, the distances between multiple positioning marks may differ between the two substrates. Furthermore, if two cameras are used, one on the printhead and the other on the support (which cannot move), the problem of guide rail error accumulation can be solved, but the printhead will collide with the other camera, which is not on the printhead, during printing; the other camera not on the printhead not only occupies space but also increases camera cost.

[0077] In one example, before moving the camera according to a preset camera path and obtaining the coordinates of the first and second marker points on the substrate, the method includes: obtaining the serial number of the substrate through the camera; obtaining the preset camera path corresponding to the serial number in a preset database; the preset database includes the correspondence between the serial number and the preset camera path.

[0078] At this point, the substrate serial number serves as the carrier of substrate information. The camera can first capture the serial number on the substrate and then retrieve the preset camera path corresponding to that serial number from the preset database. The position of the serial number on the substrate is preferentially set at the second marker point, which is often also set as the coordinates of the first marker point acquired by the camera.

[0079] In one example, the serial number includes the substrate serial number and the substrate size type number; wherein, the substrate size type number is the number corresponding to the length and width of the substrate, and one substrate size type number corresponds to one substrate size.

[0080] In the example above, the serial number includes a serial number, which is either the production date of the substrate or a unique identifier for the substrate; the substrate size type number is used to indicate the length and width of the substrate. When the camera obtains the substrate serial number, it can parse the substrate size type number and then obtain the substrate size; the substrate size corresponds to the preset camera path. At this point, the serial number can be set in the form of a QR code. It can directly use L230W120 to represent a glass substrate that is 23cm long and 12cm wide, or it can use A01 to represent a glass substrate that is 23cm long and 12cm wide.

[0081] In one example, before retrieving the preset camera path corresponding to the serial number in the preset database, the method includes: constructing a correspondence between serial numbers and preset camera paths; wherein, one serial number corresponds to one preset camera path, and the preset camera path includes a first distance moved by the camera in the Y-axis direction of the planar coordinate system and a second distance moved in the X-axis direction; the first distance is the distance between the coordinates of the first marker point and the coordinates of the second marker point, and the second distance is the distance between the coordinates of the second marker point and the third marker point; and storing the correspondence in the preset database.

[0082] At this point, the substrate's size information is mapped or stored in the serial number; the preset camera path needs to correspond to the substrate size. The preset camera path is the path the camera takes to find marker points on the Y-axis or X-axis, and configuring this path requires knowing the distance between two marker points; the distance between two marker points is closely related to the substrate size. Therefore, the relationship between the preset camera path and the serial number is pre-established and stored in a preset database. In other words, the solution in this application supports automatic positioning of substrates of different sizes. Figure 4 As shown, the first distance is the distance between the first marker point 201 and the second marker point 202, which is L1 = b - 2h2; the second distance is the distance between the second marker point 202 and the third marker point 203, which is L2 = a - 2h1; the width of the substrate is b, and the length is a.

[0083] Furthermore, if the substrate size for a particular inkjet print is not in the preset database, it is necessary to first establish a mapping between serial numbers and preset camera paths, and then add the established mapping to the preset database. Generally, the substrate size type is relatively fixed, and the preset database can be used to establish a mapping between these substrate size types and configured serial numbers before storing them.

[0084] In one example, the coordinates of the first, second, and third marker points are located at any three vertices of the substrate; wherein the coordinates of the first and second marker points are located in the Y-axis direction of the planar coordinate system, and the coordinates of the second and third marker points are located in the X-axis direction of the planar coordinate system.

[0085] The positions of the markings on the substrate in this specification are not limited and are all based on... Figure 4 Let's take an example to describe it. For example... Figure 4 As shown, there are three marker points: 201 (first marker), 202 (second marker), and 203 (third marker). Marker points can be set at any three of the four vertices of the substrate. These markers are often configured as a "crosshair" shape, positioned close to the vertices and a certain distance from both the length and width of the substrate. For ease of explanation, the markers along the Y-axis are designated as the first and second marker points, and those along the X-axis as the second and third marker points. The second marker point is the first marker point captured by the camera.

[0086] At this point, the third marker is further away from the first and second markers, making it easier to identify minute substrate offsets. The distance between the first and second markers is greater than the distance between the second and third markers; the greater the distance, the easier it is to identify minute offsets (relatively small offsets are more easily displayed at a distance, while relatively small offsets may not be displayed at two closer markers; and these minute offsets still have a significant impact on the print quality of the inkjet printer described in this manual), allowing for more precise substrate positioning. In particular, substrate deformation in the middle (bending or twisting in the X-axis or Y-axis direction) or diagonal deformation (bending or twisting around the diagonal) can be identified through the positioning of the three markers.

[0087] It should be noted that four or more marker points can also be set. Three marker points can be understood as the minimum number of marker points required for precise positioning.

[0088] Furthermore, it should be noted that current substrate positioning often requires setting markers on the substrate, typically one or two. During the display panel manufacturing process, the substrate is transferred multiple times from one process to the next; and as the substrate size increases, it may deform (e.g., bend or twist); this is especially true for flexible substrates or thinner substrates. Using only one or two markers may not reveal whether the substrate has deformed during positioning, making precise substrate positioning impossible. In this situation, setting three markers, especially three markers at diagonal positions, becomes particularly important.

[0089] Step S102: Obtain the offset parameter of the substrate based on the coordinates of the first and second marker points; the offset parameter is the offset parameter of the current position of the substrate relative to the target position.

[0090] In one example, the offset parameters include one or more of the following: offset angle, a third distance offset on the X-axis of the planar coordinate system, and a fourth distance offset on the Y-axis of the planar coordinate system; wherein, the offset angle is the angle between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the planar coordinate system, the third distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the X-axis of the planar coordinate system, and the fourth distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the Y-axis of the planar coordinate system.

[0091] like Figure 5 As shown, the geometric center of the current position of the substrate is M, and the geometric center of the target position of the substrate is N; the distance between M and N on the X-axis is the third distance Δx; the distance between M and N on the Y-axis is the fourth distance Δy. Figure 4 As shown, the substrate offset angle is θ.

[0092] Step S103: Move the substrate to the target position according to the offset parameters.

[0093] The substrate is moved to the target position by a moving module, which will not be described in detail.

[0094] Step S104: Obtain the coordinates of the third marker point on the substrate using a camera, and re-inspect the target position.

[0095] At this point, the camera still moves according to the preset camera path and then obtains the coordinates of the third marker point.

[0096] In one example, when the re-inspection of the target location passes, the substrate is confirmed to be properly positioned; specifically including, for example... Figure 2 The steps S201-S203 are shown.

[0097] Step S201: Move the camera and obtain the coordinates of the third marker point. The coordinates of the third marker point are the actual coordinates of the current position of the third marker point.

[0098] Step S202: When the coordinates of the third marker point are the same as the coordinates of the third marker point when the substrate is in the target position, confirm that the target position re-inspection has passed.

[0099] Step S203: When the re-inspection of the target position passes, confirm that the substrate has completed the positioning operation.

[0100] At this point, the corrected substrate is obtained. The actual coordinates of the third marker point at the current position of the substrate are compared with the coordinates of the third marker point at the target position (also known as the theoretical position of the third marker point). If the two are the same, the target position re-inspection is confirmed to have passed.

[0101] In one example, the method further includes: when the re-inspection of the target position fails, re-acquiring the current position coordinates of the first and second marker points; obtaining new offset parameters based on the re-acquiring current position coordinates of the first and second marker points; moving the substrate to the target position based on the new offset parameters; and re-performing the re-inspection operation until the re-inspection operation succeeds.

[0102] The above solution discloses that when a re-inspection fails, the coordinates of the first and second marker points need to be re-acquired, new offset parameters calculated for correction (i.e., position compensation), and then a re-inspection is performed again. This method ensures more accurate positioning of the substrate, and if multiple re-inspections (the specific number can be set) fail, an alarm or prompt message can be issued to allow for manual intervention.

[0103] Step S105: When the re-inspection of the target position passes, confirm that the substrate has completed the positioning operation.

[0104] After this step, the substrate moves with the stage transfer unit 101; this is to prevent substrate offset during the process of moving with the stage transfer unit 101 after precise positioning.

[0105] In one example, after the target position is re-inspected and confirmed that the substrate has completed the positioning operation, the method further includes: obtaining the initial distance between the substrate edge and the stage edge; wherein the substrate is located on the stage; after the stage moves, the real-time distance between the substrate edge and the stage edge is monitored in real time; when the difference between the real-time distance and the initial distance is greater than or equal to a preset distance threshold, a substrate offset prompt is issued.

[0106] At this point, the initial distance includes a first distance between the width edge of the substrate and the width edge of the stage, and a second distance between the length edge of the substrate and the length edge of the stage. The real-time distance corresponds to the initial distance (i.e., on the corresponding side) and is the same as the initial distance (i.e., on the same side), but the real-time distance is after the stage has moved, while the initial distance is before the stage has moved and after the substrate has been positioned. The difference between the real-time distance and the initial distance is the difference between the first distance in the initial distance and the first distance in the real-time distance, and the difference between the second distance in the initial distance and the second distance in the real-time distance. Any difference greater than or equal to a preset distance threshold will trigger a substrate offset warning. A positive difference indicates that the substrate offset is within the allowable range when the difference is less than the preset distance threshold.

[0107] In addition, sensors are installed on one or both sides of the X-axis direction of the stage transfer unit 101 to monitor the distance between the substrate edge and the stage edge (both sides in the X-axis direction, i.e., the two edges in the stage length direction); sensors are also installed on one or both sides of the Y-axis direction to monitor the distance between the substrate edge and the stage edge (both sides in the Y-axis direction, i.e., the two edges in the stage width direction). When sensors are installed on one side (any edge around the stage) in either the Y-axis or X-axis direction, the number can be one or more. That is, at least one sensor is installed on one side in the Y-axis direction, and one sensor is installed on one side in the Y-axis direction.

[0108] When any sensor emits an offset signal or alarm signal, the substrate needs to be moved to its initial positioning position; the substrate positioning operation described above must then be repeated. The sensor's function is to issue an alarm when the offset between the detected distance (the distance between the monitored edge of the substrate and the corresponding monitoring stage edge after stage movement) and the distance after positioning (the initial distance between the monitored edge of the substrate and the corresponding monitoring stage edge before stage movement) exceeds a distance threshold in the Y-axis or X-axis direction. The distance threshold can be set according to actual needs.

[0109] This manual does not limit the type of sensor used; for example, a laser displacement sensor can be used. Laser displacement sensors are characterized by their small spot size, compact size, and easy installation. A laser beam is projected onto the surface of the object being measured through a lens. The reflected laser beam is received by an internal CCD linear camera. The distance between the sensor and the object is calculated based on the angle and the known distance between the laser beam and the camera. Laser displacement sensors can achieve linearity up to 1 μm and resolution up to 0.1 μm. When detecting the distance from the edge of a glass substrate to a reference object (the edge of the stage), they provide accurate data due to their high precision and non-contact measurement advantages.

[0110] In one example, the offset parameters of the substrate are obtained based on the coordinates of the first and second marker points; specifically, this includes:

[0111] The offset angle is obtained in the following way:

[0112]

[0113] L = b - 2 * h²;

[0114] Where θ is the offset angle, the coordinates of the first marker point are (x1, y1), the coordinates of the second marker point are (x2, y2), L is the distance between the first and second marker points, b is the width of the substrate, and h2 is the perpendicular distance between the first and second marker points and the long side of the substrate.

[0115] In one example, the offset parameters of the substrate are obtained based on the coordinates of the first and second marker points; specifically, this includes:

[0116] Obtained through the following methods:

[0117]

[0118] Wherein, the offset distance in the X direction is Δy, the coordinates of the second marker point are (x2, y2), h2 is the perpendicular distance between the first and second marker points and the long side of the substrate, h1 is the perpendicular distance between the first and second marker points and the short side of the substrate, b is the width of the substrate, a is the length of the substrate, Lx is the distance between the current position of the substrate after offset and the second marker point on the X-axis, and α is the angle between the current position of the substrate after offset and the second marker point on the X-axis.

[0119] In one example, the offset parameters of the substrate are obtained based on the coordinates of the first and second marker points; specifically, this includes:

[0120] Obtained through the following methods:

[0121]

[0122] Wherein, the offset distance in the Y direction is Δy, the coordinates of the second marker point are (x2, y2), h2 is the perpendicular distance between the first and second marker points and the long side of the substrate, h1 is the perpendicular distance between the first and second marker points and the short side of the substrate, b is the width of the substrate, a is the length of the substrate, Ly is the distance on the Y-axis between the current position of the substrate after offset and the second marker point, and α is the angle on the X-axis between the current position of the substrate after offset and the second marker point.

[0123] The following section provides further explanation of how to obtain the substrate offset.

[0124] like Figure 3It is known that the center points of the first marking point 201 and the second marking point 202 on the substrate are perpendicularly distanced from the adjacent long side and short side by h2 and h1, respectively.

[0125] First, the visual correction unit moves along the Y-direction to move the visual camera to a specific position (the origin of the coordinate system, which is also the origin of the substrate positioning operation) above the second marker point 202 on the glass substrate and takes a picture. This position in the XY Cartesian coordinate system is denoted as (x2, y2). Then, the visual correction unit moves along the Y+ direction towards the first marker point 201. After moving a fixed distance (the first distance in the preset camera path), the camera takes a picture and reads the serial number from the QR code. The length and width of the substrate are then obtained as a and b, respectively. The distance between the first marker point 201 and the second marker point 202 is L = b - 2 * h². Given the width of the glass substrate, the distance the visual camera needs to move from the first marker point to the second marker point is L = b - 2 * h².

[0126] After the movement is complete, the first marker point 201 will be in the camera's field of view. Restart the photo taking, and record its position in the plane XY rectangular coordinate system as (x1, y1).

[0127] The substrate offset angle can be obtained using the inverse cosine function of a right triangle. Substituting the value of L, we can obtain the final angle of offset of the glass substrate in the XY rectangular coordinate system.

[0128] The included angle can be obtained using the arctangent function of a right triangle. α is the angle on the X-axis between the current position of the substrate after offset and the second mark point.

[0129] The length of a line segment can be determined using the sine function of a triangle. line segment length

[0130] The position of the center point M of the uncompensated glass substrate in the plane coordinate system is (L x +x2,L y +y2).

[0131] Based on the calculated offset angle of the glass substrate, a deflection angle command is sent to rotate the adsorption platform on the carrier by an angle Δθ; where Δθ = θ, resulting in a glass substrate that is completely parallel to the coordinate system in the planar coordinate system; as shown Figure 5 As shown.

[0132] Figure 5The position of the glass substrate in the system's planar coordinate system after rotational correction is shown. Point N is the center point of the substrate after complete system correction. Comparing the substrate center point M (after rotation by an angle Δθ) with the target glass substrate center point N, offsets in the X and Y directions are still required.

[0133] Based on the known length and width of the glass substrate, the coordinates of the center point N of the target glass substrate can be calculated. Based on the positions of points M and N in the system coordinate system, the offset distance in the X direction can be calculated as follows: The offset distance in the Y direction is

[0134] The above provides the offset angles and distances of the glass substrate in three directions. The angular offsets are in degrees... The distance moved in the X direction is The distance moved in the Y direction is

[0135] The glass substrate is rotated by Δθ by the adsorption platform on the stage transfer unit 101. The stage transfer unit moves the adsorption platform by Δy distance in the Y direction and Δx distance in the X direction. After that, points M and N will coincide, completing the glass substrate correction process.

[0136] To confirm the accuracy of the glass substrate's position after correction, the camera needs to take a picture of the third marker point 203 for verification. After correction in the X and θ directions, the theoretical coordinates of the third marker point (a-h1, h2) can be calculated. Knowing the theoretical position of the third marker point 203, the camera is positioned above the third marker point and taken a picture, recording the coordinates as (x'3, y'3). If x'3 = a-h1 and y'3 = h2, the substrate correction is successful. Otherwise, it is considered a correction error. After another correction attempt, if a correction error still appears after a preset number of attempts, manual inspection is required.

[0137] It should be noted that, Figure 4 and Figure 5 The origin of the coordinate system is the starting position for the camera's positioning operation. At this time, the two adjacent edges of the glass substrate should be aligned with the positioning blocks on the two sides of the adsorption platform of the adsorption and transfer unit 101. In the actual inkjet printing process, the target position may be such that the glass substrate is aligned with the positioning block on the Y-axis of the adsorption platform, and there is a distance Δy between the long side of the glass substrate and the X-axis. In this case, the theoretical coordinates of the third marker point are (a-h1, Δy+h2); it can be assumed that there is no offset in the Y-axis direction; during the re-inspection, the theoretical coordinates (a-h1, Δy+h2) of the third marker point are compared with the actual coordinates (x'3, y'3) of the target position.

[0138] The introduction of a third marker point for re-inspection in the correction system can effectively avoid waste of subsequent inkjet printing materials and improve the success rate of inkjet printing on glass substrates.

[0139] This specification discloses an inkjet printer, including a processor, a memory, a user interface, and a network interface. The memory is used to store instructions, the user interface and the network interface are both used to communicate with other devices, and the processor is used to execute the instructions stored in the memory to cause the electronic device to perform the following instructions:

[0140] According to the preset camera path, the camera is moved and the coordinates of the first and second marker points on the substrate are obtained; wherein, the initial position of the camera is the origin of the planar coordinate system, and the initial position is the starting position of the substrate in the positioning operation.

[0141] The offset parameter of the substrate is obtained based on the coordinates of the first and second marker points; the offset parameter is the offset parameter of the current position of the substrate relative to the target position.

[0142] Based on the offset parameters, move the substrate to the target position;

[0143] The coordinates of the third marker point on the substrate are obtained by a camera, and the target position is re-inspected.

[0144] When the re-inspection of the target position passes, the substrate is confirmed to have completed the positioning operation.

[0145] In one example, before moving the camera according to a preset camera path and obtaining the coordinates of the first and second marker points on the substrate, the method includes: obtaining the serial number of the substrate through the camera; obtaining the preset camera path corresponding to the serial number in a preset database; the preset database includes the correspondence between the serial number and the preset camera path.

[0146] In one example, the serial number includes the substrate serial number and the substrate size type number; wherein, the substrate size type number is the number corresponding to the length and width of the substrate, and one substrate size type number corresponds to one substrate size.

[0147] In one example, before retrieving the preset camera path corresponding to the serial number in the preset database, the method includes: constructing a correspondence between serial numbers and preset camera paths; wherein, one serial number corresponds to one preset camera path, and the preset camera path includes a first distance moved by the camera in the Y-axis direction of the planar coordinate system and a second distance moved in the X-axis direction; the first distance is the distance between the coordinates of the first marker point and the coordinates of the second marker point, and the second distance is the distance between the coordinates of the second marker point and the third marker point; and storing the correspondence in the preset database.

[0148] In one example, the coordinates of the first, second, and third marker points are located at any three vertices of the substrate; wherein the coordinates of the first and second marker points are located in the Y-axis direction of the planar coordinate system, and the coordinates of the second and third marker points are located in the X-axis direction of the planar coordinate system.

[0149] In one example, the offset parameters include one or more of the following: offset angle, a third distance offset on the X-axis of the planar coordinate system, and a fourth distance offset on the Y-axis of the planar coordinate system; wherein, the offset angle is the angle between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the planar coordinate system, the third distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the X-axis of the planar coordinate system, and the fourth distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the Y-axis of the planar coordinate system.

[0150] In one example, when the re-inspection of the target position passes, the substrate is confirmed to have completed the positioning process. Specifically, this includes: moving the camera and acquiring the coordinates of the third marker point, where the coordinates of the third marker point are the actual coordinates of the current position of the third marker point; when the coordinates of the third marker point are the same as the coordinates of the third marker point when the substrate is in the target position, the target position re-inspection is confirmed to have passed; when the re-inspection of the target position passes, the substrate is confirmed to have completed the positioning operation.

[0151] In one example, the method further includes: when the re-inspection of the target position fails, re-acquiring the current position coordinates of the first and second marker points; obtaining new offset parameters based on the re-acquiring current position coordinates of the first and second marker points; moving the substrate to the target position based on the new offset parameters; and re-performing the re-inspection operation until the re-inspection operation succeeds.

[0152] In one example, after the target position is re-inspected and confirmed that the substrate has completed the positioning operation, the method further includes: obtaining the initial distance between the substrate edge and the stage edge; wherein the substrate is located on the stage; after the stage moves, the real-time distance between the substrate edge and the stage edge is monitored in real time; when the difference between the real-time distance and the initial distance is greater than or equal to a preset distance threshold, a substrate offset prompt is issued.

[0153] In one example, the offset parameters of the substrate are obtained based on the coordinates of the first and second marker points; specifically, this includes:

[0154] The offset angle is obtained in the following way:

[0155]

[0156] L = b - 2 * h²;

[0157] Where θ is the offset angle, the coordinates of the first marker point are (x1, y1), the coordinates of the second marker point are (x2, y2), L is the distance between the first and second marker points, b is the width of the substrate, and h2 is the perpendicular distance between the first and second marker points and the long side of the substrate.

[0158] In one example, the offset parameters of the substrate are obtained based on the coordinates of the first and second marker points; specifically, this includes:

[0159] Obtained through the following methods:

[0160]

[0161] Wherein, the coordinates of the second marker point are (x2, y2), h2 is the vertical distance between the first and second marker points and the long side of the substrate, h1 is the vertical distance between the first and second marker points and the short side of the substrate, b is the width of the substrate, a is the length of the substrate, Lx is the distance on the X-axis between the current position of the substrate after offset and the second marker point, and α is the angle on the X-axis between the current position of the substrate after offset and the second marker point.

[0162] In one example, the offset parameters of the substrate are obtained based on the coordinates of the first and second marker points; specifically, this includes:

[0163] Obtained through the following methods:

[0164]

[0165] Wherein, the coordinates of the second marker point are (x2, y2), h2 is the vertical distance between the first and second marker points and the long side of the substrate, h1 is the vertical distance between the first and second marker points and the short side of the substrate, b is the width of the substrate, a is the length of the substrate, Ly is the distance on the Y-axis between the current position of the substrate after offset and the second marker point, and α is the angle on the X-axis between the current position of the substrate after offset and the second marker point.

[0166] It should be noted that the above embodiments of the apparatus are only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the apparatus and method embodiments provided in the above embodiments belong to the same concept, and the specific implementation process can be found in the method embodiments, which will not be repeated here.

[0167] The specification also discloses a computer-readable storage medium storing instructions that, when executed, perform the method described above.

[0168] This embodiment also discloses an electronic device, which may be an inkjet printer, to perform the above-described method. (Refer to...) Figure 6 The electronic device may include: at least one processor 601, at least one communication bus 602, display 603, network interface 604, and at least one memory 605.

[0169] The communication bus 602 is used to enable communication between these components.

[0170] The display 603 may include a display screen and a camera.

[0171] The network interface 604 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface).

[0172] The processor 601 may include one or more processing cores. The processor 601 connects to various parts of the server using various interfaces and lines, and performs various server functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 605, and by calling data stored in the memory 605. Optionally, the processor 601 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 601 may integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content required for display; and the modem handles wireless communication. It is understood that the modem may also be implemented as a separate chip without being integrated into the processor 601.

[0173] The memory 605 may include random access memory (RAM) or read-only memory. Optionally, the memory 605 may include a non-transitory computer-readable storage medium. The memory 605 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 605 may include a program storage area and a data storage area. The program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch functionality, sound playback functionality, image playback functionality, etc.), instructions for implementing the various method embodiments described above, etc.; the data storage area may store data involved in the various method embodiments described above, etc. Optionally, the memory 605 may also be at least one storage device located remotely from the aforementioned processor 601. As shown in the figure, the memory 605, as a computer storage medium, may include an operating system, a network communication module, and application programs for a display module.

[0174] exist Figure 6 In the electronic device shown, the display 603 is mainly used to provide an input interface for the user and to obtain the user input data; while the processor 601 can be used to call the application program stored in the memory 605. When executed by one or more processors 601, the electronic device performs one or more methods as described in the above embodiments.

[0175] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0176] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0177] In the several embodiments provided in this application, it should be understood that the disclosed apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the shown or discussed mutual couplings or direct couplings or communication connections may be through some service interfaces; indirect couplings or communication connections between apparatuses or units may be electrical or other forms.

[0178] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0179] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0180] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage device 605. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage device 605 and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage device 605 includes various media capable of storing program code, such as a USB flash drive, external hard drive, magnetic disk, or optical disk.

[0181] The foregoing description is merely an exemplary embodiment of this disclosure and should not be construed as limiting the scope of this disclosure. Any equivalent changes and modifications made in accordance with the teachings of this disclosure shall still fall within the scope of this disclosure. Those skilled in the art will readily conceive of other embodiments of this disclosure upon considering the specification and the disclosure of practical truth. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not described in this disclosure. The specification and embodiments are considered exemplary only, and the scope and spirit of this disclosure are defined by the claims.

Claims

1. A method for positioning a substrate, characterized in that, The method includes: According to the preset camera path, the camera is moved and the coordinates of the first and second marker points on the substrate are obtained; wherein, the initial position of the camera is the origin of the plane coordinate system, and the initial position is the starting position of the substrate in the positioning operation; The offset parameter of the substrate is obtained based on the coordinates of the first and second marker points; the offset parameter is the offset parameter of the current position of the substrate relative to the target position. Based on the offset parameter, move the substrate to the target position; The coordinates of the third marker point on the substrate are obtained through the camera, and the target position is re-inspected. When the re-inspection of the target position passes, it is confirmed that the substrate has completed the positioning operation.

2. The positioning method according to claim 1, characterized in that, Before moving the camera according to a preset camera path and acquiring the coordinates of the first and second marker points on the substrate; the method includes: The serial number of the substrate is obtained through the camera; In a preset database, the preset camera path corresponding to the serial number is obtained; the preset database includes the correspondence between the serial number and the preset camera path.

3. The positioning method according to claim 2, characterized in that, The serial number includes a substrate serial number and a substrate size type number; wherein, the substrate size type number is a number corresponding to the length and width of the substrate, and one substrate size type number corresponds to one size of the substrate.

4. The positioning method according to claim 2, characterized in that, Before retrieving the preset camera path corresponding to the serial number from the preset database, the method includes: Establish a correspondence between the serial number and the preset camera path; wherein, one serial number corresponds to one preset camera path, and the preset camera path includes a first distance the camera moves along the Y-axis and a second distance it moves along the X-axis in the planar coordinate system; the first distance is the distance between the coordinates of the first marker point and the coordinates of the second marker point, and the second distance is the distance between the coordinates of the second marker point and the third marker point; The correspondence is stored in the preset database.

5. The positioning method according to claim 1, characterized in that, The coordinates of the first marker point, the second marker point, and the third marker point are located at any three vertices of the substrate; wherein, The coordinates of the first and second marker points are located in the Y-axis direction of the planar coordinate system, and the coordinates of the second and third marker points are located in the X-axis direction of the planar coordinate system.

6. The positioning method according to claim 1 or 5, characterized in that, The offset parameters include one or more of the following: offset angle, a third offset distance on the X-axis of the planar coordinate system, and a fourth offset distance on the Y-axis of the planar coordinate system; wherein, The offset angle is the angle between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the plane coordinate system. The third distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the plane coordinate system along the X-axis. The fourth distance is the distance between the geometric center of the current position of the substrate and the geometric center of the target position of the substrate in the plane coordinate system along the Y-axis.

7. The positioning method according to claim 4, characterized in that, When the re-inspection of the target position passes, the substrate is confirmed to be properly positioned; specifically including: Move the camera and acquire the coordinates of the third marker point, where the coordinates of the third marker point are the actual coordinates of the current position of the third marker point; When the coordinates of the third marker point are the same as the coordinates of the third marker point when the substrate is at the target position, the target position re-inspection is confirmed to be passed; When the re-inspection of the target position passes, it is confirmed that the substrate has completed the positioning operation.

8. The positioning method according to claim 1, 4, or 7, characterized in that, The method further includes: If the re-inspection of the target location fails, the current position coordinates of the first and second marker points are reacquired. Based on the current position coordinates of the first and second marker points, a new offset parameter is obtained; Based on the new offset parameters, move the substrate to the target position; Repeat the re-inspection process until it is successful.

9. The positioning method according to claim 1, characterized in that, When the re-inspection of the target position passes, confirming that the substrate has completed the positioning operation; the method further includes: Obtain the initial distance between the edge of the substrate and the edge of the stage; wherein the substrate is located on the stage; After the stage moves, the real-time distance between the edge of the substrate and the edge of the stage is monitored. When the difference between the real-time distance and the initial distance is greater than or equal to a preset distance threshold, a substrate offset prompt is issued.

10. An inkjet printer, characterized in that, The device includes a processor, a memory, a user interface, and a network interface. The memory stores instructions. Both the user interface and the network interface are used to communicate with other devices. The processor executes the instructions stored in the memory to cause the electronic device to perform the following instructions: According to the preset camera path, the camera is moved and the coordinates of the first and second marker points on the substrate are obtained; wherein, the initial position of the camera is the origin of the plane coordinate system, and the initial position is the starting position of the substrate in the positioning operation; The offset parameter of the substrate is obtained based on the coordinates of the first and second marker points; the offset parameter is the offset parameter of the current position of the substrate relative to the target position. Based on the offset parameter, move the substrate to the target position; The coordinates of the third marker point on the substrate are obtained through the camera, and the target position is re-inspected. When the re-inspection of the target position passes, it is confirmed that the substrate has completed the positioning operation.

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