Mini-led or micro-led package dicing lane alignment method

Abstract

This invention provides a method for aligning dicing channels in Mini-LED or Micro-LED packages, relating to the field of Mini-LED or Micro-LED packaging processing. The method includes: identifying the dicing channels to be detected in the X-channel and Y-channel of the Mini-LED or Micro-LED package; transporting the Mini-LED or Micro-LED package to a worktable for holding; when the image acquisition unit identifies the coordinates of each first point to be identified in the dicing channels of adjacent X-channels, the worktable moves in opposite directions along the X-axis; controlling the worktable to rotate 90°; when the image acquisition unit identifies the coordinates of each second point to be identified in the dicing channels of adjacent Y-channels, the worktable moves in opposite directions along the X-axis. Using this method, the worktable does not need to move additionally to achieve the detection of the crossover between two adjacent dicing channels in the X-channel or Y-channel, reducing the travel distance of the worktable during the entire Mini-LED or Micro-LED package dicing alignment process and improving the dicing channel alignment efficiency before Mini-LED or Micro-LED package cutting.

Description

Technical Field

[0001] This invention relates to the field of Mini-LED or Micro-LED packaging and processing, and more specifically, to a method for aligning the cutting channels of a Mini-LED or Micro-LED package. Background Technology

[0002] Mini-LED and Micro-LED are considered next-generation display technologies. Mini-LED, also known as "submillimeter light-emitting diode," uses LED crystals in the 100-200 micrometer range and is an improved version of traditional LED backlighting. Mini-LED technology is considered a transitional technology between traditional LED and Micro-LED. Using Mini-LED, displays with pixel particles of 0.5-1.2 millimeters can be produced, resulting in significantly better display effects than traditional LED screens. Micro-LED is a technology for miniaturizing and machining LEDs. Simply put, it involves thinning, miniaturizing, and arraying LED backlights, allowing LED units to be smaller than 100 micrometers. Like OLED, it enables each pixel to be individually addressed and driven to emit light (self-emissive). Mini-LED is mainly used in displays, automotive displays, mobile phones, and wearable devices. As a next-generation display product, Micro-LED applications include smartwatches, smartphones, tablets, automotive dashboards and center consoles, and televisions (including large-screen and ultra-large-screen TVs). The mass production of Mini-LED and Micro-LED utilizes chip-level packaging technology. Specifically, the process involves massively transferring Mini-LED or Micro-LED chips from an epitaxial wafer to a carrier substrate, followed by direct packaging, dicing, and then inspection and light mixing. This process directly eliminates defective LEDs, eliminating the need for rework. The next step is to place the Mini-LED or Micro-LED chips onto a tape and deliver them to a display manufacturer for assembly into modules. Among the various processes involved in the dicing of Mini-LED or Micro-LED packages, the alignment efficiency and accuracy before dicing have always been a significant concern.

[0003] Currently, the alignment methods for Mini-LED or Micro-LED packages before cutting include T_ADJ (single-point alignment mode) and T_ADJ2 (multi-point alignment mode). However, when aligning the cutting tracks of the Mini-LED or Micro-LED packages to be cut, the movement of the stage in the two adjacent cutting tracks is in the same direction. That is, the detection start point and detection end point of each cutting track are on the same side. After the detection of one cutting track is completed, when detecting the next adjacent cutting track, after the camera moves from the detection end point of the previous cutting track to the detection end point of the next cutting track, the stage needs to move the detection start point of the next cutting track to the camera position before the alignment detection of that cutting track can begin. This results in an increased movement of the stage from the detection end point of the next cutting track to the detection start point during the line-changing detection, significantly increasing the total travel distance of the stage during the entire Mini-LED or Micro-LED package cutting track alignment detection process, thus reducing the efficiency of cutting track alignment before Mini-LED or Micro-LED package cutting. Summary of the Invention

[0004] The purpose of this invention is to provide a method for aligning the dicing channels of Mini-LED or Micro-LED packages, which can avoid the problem of low alignment efficiency of dicing channels before Mini-LED or Micro-LED package cutting and at the same time ensure the accuracy of alignment.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0006] This application provides a method for aligning the dicing channels of a Mini-LED or Micro-LED package. The method includes:

[0007] The test cut channels in the X channel and Y channel of the Mini-LED or Micro-LED package are identified. The test cut channels in the X channel and the test cut channels in the Y channel are perpendicular to each other. The test cut channels in the X channel are equally spaced at a second preset distance, and each test cut channel in the X channel has a first preset number of first identification points equally spaced at a first preset distance. The test cut channels in the Y channel are equally spaced at a fourth preset distance, and each test cut channel in the Y channel has a second preset number of second identification points equally spaced at a third preset distance.

[0008] The Mini-LED or Micro-LED package is transported to a worktable for holding, wherein the holding method includes: vacuum adsorption or magnetic attraction;

[0009] The worktable is controlled to reciprocate along the X-axis in steps of a first preset distance, and the image acquisition unit is controlled to move along the Y-axis in steps of a second preset distance. The image acquisition unit is used to identify the coordinates of each first identification point in the cutting path to be detected in each X-channel, thereby completing the alignment of the cutting path to be cut in the X-channel. When the image acquisition unit identifies the coordinates of each first identification point in the cutting path to be detected in two adjacent X-channels, the worktable moves in opposite directions along the X-axis.

[0010] Control the worktable to rotate 90°;

[0011] The worktable is controlled to reciprocate along the X-axis in steps of a third preset distance, and the image acquisition unit is controlled to move along the Y-axis in steps of a fourth preset distance. The image acquisition unit is used to identify the coordinates of each second identification point in the cutting path to be detected in each Y-channel, thereby completing the alignment of the cutting path to be cut in the Y-channel. When the image acquisition unit identifies the coordinates of each second identification point in the cutting path to be detected in two adjacent Y-channels, the worktable moves in opposite directions along the X-axis.

[0012] In an optional implementation, the number of cut tracks to be detected in the X channel is less than or equal to the number of cut tracks to be cut in the X channel; the number of cut tracks to be detected in the Y channel is less than or equal to the number of cut tracks to be cut in the Y channel.

[0013] In an optional implementation, the step of transferring the Mini-LED or Micro-LED package to the workbench for holding includes:

[0014] Create a first preset data comparison table and a second preset data comparison table;

[0015] The first preset data lookup table includes:

[0016] The coordinates of a preset first target recognition point in the X channel, the coordinates of a preset first alignment start point in the X channel, the moving distance of the worktable in the X channel, the moving distance of the image acquisition unit in the X channel, and the coordinates of the first point to be recognized; wherein, the coordinates of the preset first target recognition point correspond to the coordinates of the preset first alignment start point, and the moving distance of the worktable in the X channel and the moving distance of the image acquisition unit in the X channel correspond one-to-one with the coordinates of the first point to be recognized;

[0017] The second preset data lookup table includes:

[0018] The coordinates of the preset second target recognition point in the Y channel, the coordinates of the preset second alignment starting point in the Y channel, the moving distance of the worktable in the Y channel, the moving distance of the image acquisition unit in the Y channel, and the coordinates of the second point to be recognized; wherein, the coordinates of the preset second target recognition point correspond to the coordinates of the preset second alignment starting point, and the moving distance of the worktable in the Y channel and the moving distance of the image acquisition unit in the Y channel correspond one-to-one with the coordinates of the second point to be recognized.

[0019] In an optional implementation, the control of the worktable to reciprocate along the X-axis in steps of the first preset distance, the control of the image acquisition unit to move along the Y-axis in steps of the second preset distance, and the use of the image acquisition unit to identify the coordinates of each of the first identification points in each X-channel to be detected cutting path, thereby completing the alignment of the cutting path to be cut in the X-channel, prior to which the following is included:

[0020] The image acquisition unit is controlled to move to the target position above the workbench, and a target image containing the first target recognition point is acquired. The coordinates of the preset first target recognition point are extracted from the first preset data lookup table and stored in the first target data lookup table for recording.

[0021] The coordinates of the preset first alignment starting point are determined based on the preset first target identification point coordinates and the first preset data lookup table;

[0022] The image acquisition unit and the worktable are moved simultaneously according to the preset first alignment starting point coordinates, so that the image acquisition unit is located at the preset first alignment starting point coordinates on the worktable, and the preset first alignment starting point coordinates are extracted from the first preset data lookup table and stored in the first target data lookup table for recording.

[0023] In an optional implementation, the step of controlling the worktable to reciprocate along the X-axis in steps of the first preset distance, controlling the image acquisition unit to move along the Y-axis in steps of the second preset distance, and using the image acquisition unit to identify the coordinates of each of the first points to be identified in the cutting path to be detected in each X-channel, thereby completing the alignment of the cutting path to be cut in the X-channel, includes:

[0024] When the workbench moves along the positive or negative X-axis by the first preset distance while the position of the image acquisition unit remains unchanged, the image acquisition unit acquires a first image of the point to be identified and compares the first image of the point to be identified with the preset feature image of the point to be identified.

[0025] When the similarity is within the similarity threshold, the image of the first point to be identified is confirmed to be correct, and the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit are confirmed at this time. Based on the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit, the coordinates of the first point to be identified that correspond one-to-one with the workbench moving distance in the X channel and the image acquisition unit moving distance in the X channel that correspond one-to-one with the cumulative moving distance of the image acquisition unit are extracted from the first preset data lookup table. The coordinates of the first point to be identified are stored in the first target data lookup table for recording.

[0026] When the worktable moves an accumulated distance along the positive or negative X-axis in a single cutting path to be detected within the X-channel, equal to the fifth preset distance, the detection of the single cutting path to be detected within the X-channel is completed.

[0027] In any two cut paths to be detected within the X channel, the first identification point at the end of the detection of the first cut path to be detected and the first identification point at the start of the detection of the next cut path to be detected are on the same straight line along the Y-axis and are separated by a second preset distance; after the detection of the first cut path to be detected is completed, the image acquisition unit moves from the position of the first identification point at the end of the detection of the first cut path to be detected to the position of the first identification point at the start of the detection of the next cut path to be detected;

[0028] When the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the sixth preset distance, the alignment of the cutting path to be cut in the X channel is completed.

[0029] In an optional implementation, the step of controlling the worktable to reciprocate along the X-axis in steps of the first preset distance, controlling the image acquisition unit to move along the Y-axis in steps of the second preset distance, and using the image acquisition unit to identify the coordinates of each of the first identification points in each X-channel to be detected cutting path, thereby completing the alignment of the cutting path to be cut in the X-channel, further includes:

[0030] When the similarity is not within the similarity threshold, an identification anomaly is confirmed, and the alignment process is interrupted.

[0031] The manual alignment command is executed to move the image acquisition unit to the detection cut path in the X channel where anomalies are identified, and the coordinates corresponding to the detection cut path in the X channel are identified and stored in the first target data lookup table for recording.

[0032] Execute the continue alignment command, confirm the coordinates of the position of the image acquisition unit, and calculate the coordinates of the first point to be identified at both ends of the next detection cut track in the X channel that is adjacent to the detection cut track with abnormal identification in the X channel, based on the coordinates of the first point to be identified at the detection endpoint of the previous detection cut track completed in the X channel, the coordinates of the first point to be identified at the detection start point, and the second preset distance.

[0033] The coordinates of the location of the image acquisition unit are compared with the coordinates of the first identification point at both ends of the next detection cut path in the X channel adjacent to the detection cut path with an abnormality in the X channel, and the coordinates of the nearest first identification point are confirmed.

[0034] The image acquisition unit is controlled to move to the coordinate position of the nearest first point to be identified.

[0035] In an optional implementation, the control of the worktable to reciprocate along the X-axis in steps of the third preset distance, the control of the image acquisition unit to move along the Y-axis in steps of the fourth preset distance, and the use of the image acquisition unit to identify the coordinates of each of the second identification points in each of the Y-channels to be detected cutting paths, thereby completing the alignment of the cutting paths to be cut in the Y-channels, before which the following is included:

[0036] The image acquisition unit is controlled to move to the target position above the workbench and acquire a target image containing the second target recognition point. The coordinates of the preset second target recognition point are extracted from the second preset data lookup table and stored in the second target data lookup table for recording.

[0037] The coordinates of the preset second alignment starting point are determined based on the preset second target identification point coordinates and the second preset data lookup table;

[0038] The image acquisition unit and the worktable are moved simultaneously according to the preset second alignment starting point coordinates, so that the image acquisition unit is located at the preset second alignment starting point coordinates on the worktable, and the preset second alignment starting point coordinates are extracted from the second preset data lookup table and stored in the second target data lookup table for recording.

[0039] In an optional implementation, controlling the worktable to reciprocate along the X-axis in steps of the third preset distance, controlling the image acquisition unit to move along the Y-axis in steps of the fourth preset distance, and using the image acquisition unit to identify the coordinates of each of the second identification points in each of the Y-channels to be detected cutting paths, thereby completing the alignment of the cutting paths to be cut in the Y-channels, includes:

[0040] When the workbench moves along the positive or negative X-axis by the third preset distance while the position of the image acquisition unit remains unchanged, the image acquisition unit acquires a second image of the point to be identified and compares the second image of the point to be identified with the preset feature image of the point to be identified.

[0041] When the similarity is within the similarity threshold, the image of the second point to be identified is confirmed to be correct. The cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit are also confirmed. Based on the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit, the coordinates of the second point to be identified that correspond one-to-one with the workbench moving distance in the Y channel and the image acquisition unit moving distance in the Y channel that correspond one-to-one with the cumulative moving distance of the image acquisition unit are extracted from the second preset data lookup table. The coordinates of the second point to be identified are then stored in the second target data lookup table for recording.

[0042] When the worktable moves an accumulated distance along the positive or negative X-axis in a single cutting path to be detected within the Y-channel, equal to the seventh preset distance, the detection of the single cutting path to be detected within the Y-channel is completed.

[0043] In any two cut paths to be detected within the Y channel, the second identification point at the end of the detection of the first detected cut path and the second identification point at the start of the detection of the next detected cut path are on the same straight line along the Y-axis and are separated by a fourth preset distance; after the detection of the first detected cut path is completed, the image acquisition unit moves from the position of the second identification point at the end of the detection of the first detected cut path to the position of the second identification point at the start of the detection of the next detected cut path;

[0044] When the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the eighth preset distance, the alignment of the cutting path to be cut in the Y channel is completed.

[0045] In an optional implementation, the step of controlling the worktable to reciprocate along the X-axis in steps of the third preset distance, controlling the image acquisition unit to move along the Y-axis in steps of the fourth preset distance, and using the image acquisition unit to identify the coordinates of each of the second identification points in each of the Y-channels to be detected cutting paths, thereby completing the alignment of the cutting paths to be cut in the Y-channels, further includes:

[0046] When the similarity is not within the similarity threshold, an identification anomaly is confirmed, and the alignment process is interrupted.

[0047] The manual alignment command is executed to move the image acquisition unit to the detection cut path in the Y channel where anomalies are identified. The coordinates of the detection cut path in the Y channel where anomalies are identified are identified and stored in the second target data lookup table for recording.

[0048] Execute the continue alignment command, confirm the coordinates of the position of the image acquisition unit, and calculate the coordinates of the second point to be identified at both ends of the next detection cut track in the Y channel adjacent to the detection cut track with abnormal identification in the Y channel based on the coordinates of the second point to be identified at the detection endpoint of the previous detection cut track completed in the Y channel, the coordinates of the second point to be identified at the detection start point, and the fourth preset distance.

[0049] The coordinates of the location of the image acquisition unit are compared with the coordinates of the second identification point at both ends of the next detection cut slit in the Y channel adjacent to the detection cut slit in the Y channel that is abnormally identified, and the coordinates of the nearest second identification point are confirmed.

[0050] The image acquisition unit is controlled to move to the coordinate position of the nearest second point to be identified.

[0051] In an optional implementation, both the first preset quantity and the second preset quantity are greater than or equal to 2;

[0052] Prior to transferring the Mini-LED or Micro-LED package to the workbench for holding, the following steps are included:

[0053] When the first preset quantity and / or the second preset quantity are equal to 2, a two-point alignment mode is selected to align the Mini-LED or Micro-LED package cutting channel.

[0054] When the first preset quantity and / or the second preset quantity are greater than 2, a multi-point alignment mode is selected to align the Mini-LED or Micro-LED package cutting channels.

[0055] This application has the following beneficial effects:

[0056] The Mini-LED or Micro-LED package dicing alignment method of this application includes: confirming the dicing tracks to be detected in the X channel and the Y channel of the Mini-LED or Micro-LED package, wherein the dicing tracks to be detected in the X channel and the dicing tracks to be detected in the Y channel are perpendicular to each other; the dicing tracks to be detected in the X channel are equally spaced at a second preset distance, and each dicing track in the X channel has a first preset number of first identification points equally spaced at a first preset distance; the dicing tracks to be detected in the Y channel are equally spaced at a fourth preset distance, and each dicing track in the Y channel has a second preset number of second identification points equally spaced at a third preset distance; transporting the Mini-LED or Micro-LED package to a worktable for holding; controlling the worktable to reciprocate along the X-axis in steps of a first preset distance, and controlling the image... The acquisition unit moves along the Y-axis in steps of a second preset distance, and uses the image acquisition unit to identify the coordinates of each first identification point in the cutting path to be detected in each X-channel, thus completing the alignment of the cutting path to be cut in the X-channel; wherein, when the image acquisition unit identifies the coordinates of each first identification point in the cutting path to be detected in two adjacent X-channels, the worktable moves in opposite directions along the X-axis; the worktable is controlled to rotate 90°; the worktable is controlled to reciprocate along the X-axis in steps of a third preset distance, and the image acquisition unit is controlled to move along the Y-axis in steps of a fourth preset distance, and uses the image acquisition unit to identify the coordinates of each second identification point in the cutting path to be detected in each Y-channel, thus completing the alignment of the cutting path to be cut in the Y-channel; wherein, when the image acquisition unit identifies the coordinates of each second identification point in the cutting path to be detected in two adjacent Y-channels, the worktable moves in opposite directions along the X-axis. With the Mini-LED or Micro-LED package dicing alignment method of this application, the stage does not need to be moved to realize the crossover detection of two adjacent dicing tracks to be detected in the X channel or Y channel. This reduces the movement of the stage during the entire Mini-LED or Micro-LED package dicing alignment process, improves the dicing alignment efficiency before Mini-LED or Micro-LED package cutting, and ensures the accuracy of alignment. Attached Figure Description

[0057] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 This is a top view of a partial schematic diagram of a grinding wheel dicing machine;

[0059] Figure 2 One of the schematic diagrams for Mini-LED or Micro-LED packaging;

[0060] Figure 3 The second schematic diagram is for Mini-LED or Micro-LED packaging;

[0061] Figure 4 The third schematic diagram of a Mini-LED or Micro-LED package;

[0062] Figure 5 This is one of the flowcharts illustrating the steps of the Mini-LED or Micro-LED package cleavage alignment method provided in the embodiments of this application;

[0063] Figure 6 The second flowchart illustrates the steps of the Mini-LED or Micro-LED packaging cleavage alignment method provided in the embodiments of this application.

[0064] Figure 7 The third step of the Mini-LED or Micro-LED packaging cleavage alignment method provided in the embodiments of this application;

[0065] Figure 8 The fourth step of the flowchart of the Mini-LED or Micro-LED package dicing alignment method provided in the embodiments of this application. Detailed Implementation

[0066] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0067] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0068] like Figure 1 As shown, Figure 1This is a top view of a partial schematic diagram of a grinding wheel dicing machine. In one feasible embodiment, the Mini-LED or Micro-LED package cutting track alignment method of this application is applied to the grinding wheel dicing machine. The grinding wheel dicing machine specifically includes a cutting unit c, a worktable a, and an image acquisition unit d. The worktable a is used to hold the Mini-LED or Micro-LED package b, the image acquisition unit d is used for aligning the Mini-LED or Micro-LED package b, and the cutting unit c is used to divide the aligned Mini-LED or Micro-LED package b held on the worktable a into particle units. There can be one or two cutting units c. When there are two cutting units c, the two cutting units c are coaxially opposite each other. The image acquisition unit d is mounted on one of the cutting units c. The cutting unit c and the image acquisition unit d are located above the worktable a and can reciprocate along a straight line. The direction of movement of the cutting unit c and the image acquisition unit d is defined as the Y-axis direction. The worktable a can reciprocate along a straight line and can rotate along the central axis T of the worktable a. The direction of movement of the worktable a is defined as the X-axis direction. The X-axis is perpendicular to the Y-axis. The direction perpendicular to the plane containing the X-axis and the Y-axis is defined as the Z-axis. The cutting unit c and the image acquisition unit d can reciprocate up and down along the Z-axis. The direction in which the worktable a moves away from the cutting unit c and the image acquisition unit d is defined as the positive direction of the X-axis. The direction in which the cutting unit c and the image acquisition unit d move away from the worktable a is defined as the positive direction of the Y-axis.

[0069] The aforementioned Mini-LED or Micro-LED package b is rectangular, and the Mini-LED or Micro-LED package b has multiple particle units arranged at equal intervals along the X-axis and Y-axis directions on its top. Cutting channels are provided at equal intervals and parallelly along the X-axis and Y-axis directions between each particle unit and at the edge of the Mini-LED or Micro-LED package b. The area where the cutting channel along the X-axis is located is the X channel of the Mini-LED or Micro-LED package b, and the area where the cutting channel along the Y-axis is located is the Y channel of the Mini-LED or Micro-LED package b.

[0070] like Figure 5 The diagram shown is one of the steps in a method for aligning the dicing channels of a Mini-LED or Micro-LED package provided in this application embodiment. The method includes:

[0071] Step 101: Confirm the cut channels to be detected in the X channel and the Y channel of the Mini-LED or Micro-LED package. The cut channels to be detected in the X channel and the cut channels to be detected in the Y channel are perpendicular to each other. The cut channels to be detected in the X channel are equally spaced at a second preset distance, and each cut channel to be detected in the X channel has a first preset number of first identification points equally spaced at a first preset distance. The cut channels to be detected in the Y channel are equally spaced at a fourth preset distance, and each cut channel to be detected in the Y channel has a second preset number of second identification points equally spaced at a third preset distance.

[0072] Specifically, the number of dicing channels to be cut in the X channel of the Mini-LED or Micro-LED package b is E, the number of dicing channels to be cut in the Y channel is F, the number of dicing channels to be detected in the X channel is M, and the number of dicing channels to be detected in the Y channel is N. When aligning the Mini-LED or Micro-LED package b, the selected dicing channels to be detected in the X channel can be all the dicing channels to be cut in the X channel, or a portion of the dicing channels to be cut in the X channel arranged at equal intervals, i.e., M≤E, and the spacing between the dicing channels to be detected in the X channel is a second preset distance. When aligning the Mini-LED or Micro-LED package b, the selected dicing channels to be detected in the Y channel can be all the dicing channels to be cut in the Y channel, or a portion of the dicing channels to be cut in the Y channel arranged at equal intervals, i.e., N≤F, and the spacing between the dicing channels to be detected in the Y channel is a fourth preset distance.

[0073] Furthermore, within each X channel, multiple marker points are evenly spaced within the cutting path to be cut. For example, the marker points can be mark points, and the number of marker points is defined as G. When aligning the Mini-LED or Micro-LED package b, the first preset number i of the first identification points selected at equal intervals with a first preset distance within the cutting path to be detected in each X channel is less than or equal to G. Within each Y channel, multiple marker points are evenly spaced within the cutting path to be cut, and the number of marker points is defined as H. When aligning the Mini-LED or Micro-LED package b, the second preset number j of the second identification points selected at equal intervals with a third preset distance within the cutting path to be detected in each Y channel is less than or equal to H.

[0074] In one feasible implementation, such as Figure 2 As shown, Figure 2 This is one of the schematic diagrams for a Mini-LED or Micro-LED package. The Mini-LED or Micro-LED package b is an 8*4 sized workpiece, and the cutting path to be cut within its X channel includes: S X1 S X2 SX3 S X4 S X5 S X6 S X7 S X8 S X9 The quantity E=9; the cutting paths to be cut within its Y channel include: S Y1 S Y2 S Y3 S Y4 S Y5 The quantity F=5; the distance between the cutting tracks to be cut within the X channel is L. X1 The distance between the cutting paths to be cut within the Y channel is L. Y1 The "+" markings on the Mini-LED or Micro-LED package b are all the same mark point. The mark points in each dicing channel within the X channel are evenly spaced. In this embodiment, five mark points are evenly spaced, and the distance between two adjacent mark points is L. X2 The mark points in each cutting path within the Y channel are evenly spaced. In this embodiment, nine mark points are evenly spaced, and the distance between two adjacent mark points is L. Y2 .

[0075] Furthermore, such as Figure 3 As shown, Figure 3 The second schematic diagram is for Mini-LED or Micro-LED packaging. Figure 3 The image only shows the cutting ridges to be detected and the mark points to be identified during the alignment of the cutting ridges within the X-channel; confirm that the cutting ridges to be detected within the X-channel of the Mini-LED or Micro-LED package b are S. X1 S X3 S X5 S X7 S X9 The quantity M=5, and the cutting path to be detected in the X channel is at a second preset distance L. X3 The X-channel is set at equal intervals and the cutting path to be detected is selected within each X-channel at a first preset distance L. X4 A first preset number i of mark points, set at equal intervals, are used as the first points to be identified, where i=3; for example... Figure 4 As shown, Figure 4 The third schematic diagram for Mini-LED or Micro-LED packaging. Figure 4 The image only shows the cutting ridges to be detected and the mark points to be identified during the alignment of the cutting ridges within the Y channel; confirm that the cutting ridges to be detected within the Y channel of the Mini-LED or Micro-LED package b are S. Y1 SY3 S Y5 The quantity N=3, and the cutting path to be detected in the Y channel is at a fourth preset distance L. Y4 The cutting path to be detected is set at equal intervals and selected within each Y channel at a third preset distance L. Y3 The second preset number j of mark points set at equal intervals are used as the second points to be identified, where j=5.

[0076] It should be noted that within the X channel, the second preset distance L X3 It can be a directly known value, or it can be indirectly obtained by multiplying the number of steps in the Y-axis direction and the step distance in the Y-axis direction between two adjacent cutting paths to be detected in the X channel. The first preset distance L X4 The value can be directly known, or it can be indirectly obtained by multiplying the number of steps in the X-axis direction between adjacent first identification points within each cut track to be detected in the X channel by the step distance in the X-axis direction. The number of steps in the Y-axis direction is obtained based on the cut tracks to be cut in the X channel and the selected cut tracks to be detected within the X channel. The step distance in the Y-axis direction is the distance L between the cut tracks to be cut in the X channel. X1 The X-axis step number is obtained based on the number of mark points in each cut track to be detected in the X channel and the number of the first identification point in each cut track to be detected in the X channel. The X-axis step distance is the distance L between two adjacent mark points in each cut track to be detected. X2 The third preset distance L within the Y channel Y3 and the fourth preset distance L Y4 The method of obtaining and the first preset distance L within the X channel X4 and the second preset distance L X3 The method of obtaining them is the same, so it will not be repeated here.

[0077] Step 102: Transfer the Mini-LED or Micro-LED package to the worktable for holding;

[0078] In the embodiments of this application, such as Figure 1 As shown, the transport unit (not shown in the figure) transports the Mini-LED or Micro-LED package b to the worktable a for holding. The holding method can be vacuum adsorption or magnetic attraction. Other holding methods are also possible and are not limited here.

[0079] Step 103: Control the worktable to reciprocate along the X-axis at a first preset distance, control the image acquisition unit to move along the Y-axis at a second preset distance, and use the image acquisition unit to identify the coordinates of each first identification point in the cutting path to be detected in each X-channel, thereby completing the alignment of the cutting path to be cut in the X-channel; wherein, when the image acquisition unit identifies the coordinates of each first identification point in the cutting path to be detected in two adjacent X-channels, the worktable moves in opposite directions along the X-axis;

[0080] In the embodiments of this application, such as Figure 1 and Figure 3 As shown, the cutting path S to be detected in the X channel X1 S X3 S X5 S X7 S X9 During sequential inspection, the worktable a is moved in the X-axis direction and the image acquisition unit d is moved in the Y-axis direction, so that the image acquisition unit d is positioned above the worktable a on the cut path S to be inspected. X1 The first identification point Q is located in the upper left corner of the Mini-LED or Micro-LED package b. X11 The position is used as the cut path S to be detected. X1 The identification starting point is located at the cut surface S to be detected. X1 At this time, the image acquisition unit d remains stationary in the Y-axis direction, while the worktable a moves a first preset distance L along the negative X-axis direction. X4 At this time, the image acquisition unit d identifies the cutting path S to be detected. X1 The second first point to be identified within Q X12 The coordinates are used to repeat the above process, moving the worktable a along the negative X-axis a first preset distance L. X4 The image acquisition unit d identifies the cut surface S to be detected. X1 The steps involve determining the coordinates of the first point to be identified within the corresponding location, up to the cut path S to be detected. X1 After the coordinates of all i=3 first points to be identified are identified, the first cutting path S to be detected in the X channel is completed. X1 During detection, the image acquisition unit d is located at the cut path S to be detected. X1 The first point to be identified within the recognition endpoint Q X13 The position; in the next adjacent cutting path to be inspected S X3 During the detection, the worktable a remains stationary in the X-axis direction, while the image acquisition unit d moves a second preset distance L along the positive Y-axis direction. X3 At this time, the image acquisition unit d is located at the cut path S to be detected. X3 The first point to be identified, Q, is the starting point for identification within the range. X21 The location and identification of the first point to be identified, Q.X21 The coordinates are such that the worktable a moves a first preset distance L along the positive X-axis. X4 The image acquisition unit d identifies the next adjacent first point to be identified, Q. X22 The coordinates are used to repeatedly move the worktable a along the positive X-axis a first preset distance L. X4 The image acquisition unit d identifies the coordinates of the next adjacent first point to be identified, until the cut surface S to be detected. X3 After the coordinates of all i=3 first points to be identified are identified, the cutting path S to be detected in the X channel is completed. X3 During detection, the image acquisition unit d is located at the cut path S to be detected. X3 The first point to be identified within the recognition endpoint Q X23 Position; repeat the above steps until the remaining cut channels S to be detected in the X channel are completed. X5 S X7 S X9 The detection, that is, the alignment of the cutting path to be cut within the X channel.

[0081] It is understandable that when aligning two adjacent cutting tracks to be detected, the movement direction of the worktable a along the X-axis is opposite. In other words, the first point to be identified at the end point of the previous cutting track and the first point to be identified at the start point of the next cutting track are closest to each other, and the distance is the second preset distance L. X3 .

[0082] Step 104: Control the worktable to rotate 90°;

[0083] In the embodiments of this application, such as Figure 1 As shown, after the control table rotates 90°, the Y channel is located in the X-axis direction, enabling the image acquisition unit d to detect the cutting path to be detected in the Y channel.

[0084] Step 105: Control the worktable to reciprocate along the X-axis at a third preset distance, control the image acquisition unit to move along the Y-axis at a fourth preset distance, and use the image acquisition unit to identify the coordinates of each second identification point in the cutting path to be detected in each Y channel, thereby completing the alignment of the cutting path to be cut in the Y channel; wherein, when the image acquisition unit identifies the coordinates of each second identification point in the cutting path to be detected in two adjacent Y channels, the worktable moves in opposite directions along the X-axis.

[0085] In the embodiments of this application, such as Figure 1 and Figure 4 As shown, the cutting path S to be detected in the Y channel Y1 S Y3 S Y5During sequential inspection, the worktable a is moved in the X-axis direction and the image acquisition unit d is moved in the Y-axis direction, so that the image acquisition unit d is positioned above the worktable a on the cut path S to be inspected. Y1 The second identification point Q is located in the upper left corner of the Mini-LED or Micro-LED package b. Y11 The position is used as the cut path S to be detected. Y1 The identification starting point is located at the cut surface S to be detected. Y1 At that time, the image acquisition unit d remains stationary in the Y-axis direction, while the worktable a moves a third preset distance L along the negative X-axis direction. Y3 At this time, the image acquisition unit d identifies the cutting path S to be detected. Y1 The second point to be identified within Q Y12 The coordinates are repeated, and the worktable a moves a third preset distance L along the negative X-axis. Y3 The image acquisition unit d identifies the cut surface S to be detected. Y1 The steps involve determining the coordinates of the second point to be identified within the corresponding location, until the cut path S to be detected is reached. Y1 After the coordinates of all j=5 second points to be identified are identified, the first cutting path S to be detected in the X channel is completed. Y1 During detection, the image acquisition unit d is located at the cut path S to be detected. Y1 The second point to be identified within the recognition endpoint Q Y15 The position; in the next adjacent cutting path to be inspected S Y3 During the detection, the worktable a remains stationary in the X-axis direction, while the image acquisition unit d moves a fourth preset distance L along the positive Y-axis direction. Y4 At this time, the image acquisition unit d is located at the cut path S to be detected. Y3 The second point to be identified, Q, is located within the identification starting point. Y21 The location and identification of the second point to be identified, Q. Y21 The coordinates are such that the worktable a moves a third preset distance L along the positive X-axis. Y3 The image acquisition unit d identifies the next adjacent second point to be identified, Q. Y22 The coordinates are used to repeatedly move the worktable a along the positive X-axis by a third preset distance L. Y3 The image acquisition unit d identifies the coordinates of the next adjacent second point to be identified, until the cut surface S to be detected. Y3 After the coordinates of all j=5 second points to be identified are identified, the cutting path S to be detected in the Y channel is completed. Y3 During detection, the image acquisition unit d is located at the cut path S to be detected. Y3 The second point to be identified, Q, is the endpoint of the identification process. Y25 Position; repeat the above steps until the remaining cut channels S to be detected in the Y channel are completed. Y5The detection is to complete the alignment of the cutting path to be cut within the Y channel.

[0086] It is understandable that when aligning two adjacent cutting tracks to be detected, the movement direction of the stage a along the X-axis is opposite. In other words, the second point to be identified at the end point of the previous cutting track and the second point to be identified at the start point of the next cutting track are closest to each other, and the distance is the fourth preset distance L. Y4 .

[0087] In this embodiment, the Mini-LED or Micro-LED package dicing alignment method includes: confirming the dicing tracks to be detected in the X channel and the Y channel of the Mini-LED or Micro-LED package, wherein the dicing tracks to be detected in the X channel and the dicing tracks to be detected in the Y channel are perpendicular to each other; the dicing tracks to be detected in the X channel are equally spaced at a second preset distance, and each dicing track in the X channel has a first preset number of first identification points equally spaced at a first preset distance; the dicing tracks to be detected in the Y channel are equally spaced at a fourth preset distance, and each dicing track in the Y channel has a second preset number of second identification points equally spaced at a third preset distance; transporting the Mini-LED or Micro-LED package to a worktable for holding; controlling the worktable to reciprocate along the X-axis in steps of a first preset distance, and controlling... The image acquisition unit moves along the Y-axis in steps of a second preset distance, and uses the image acquisition unit to identify the coordinates of each first identification point in the cut path to be detected in each X-channel, thus completing the alignment of the cut path to be cut in the X-channel; wherein, when the image acquisition unit identifies the coordinates of each first identification point in the cut path to be detected in two adjacent X-channels, the worktable moves in opposite directions along the X-axis; the worktable is controlled to rotate 90°; the worktable is controlled to reciprocate along the X-axis in steps of a third preset distance, and the image acquisition unit is controlled to move along the Y-axis in steps of a fourth preset distance, and uses the image acquisition unit to identify the coordinates of each second identification point in the cut path to be detected in each Y-channel, thus completing the alignment of the cut path to be cut in the Y-channel; wherein, when the image acquisition unit identifies the coordinates of each second identification point in the cut path to be detected in two adjacent Y-channels, the worktable moves in opposite directions along the X-axis. With the Mini-LED or Micro-LED package dicing alignment method of this application, the stage does not need to be moved to realize the crossover detection of two adjacent dicing tracks to be detected in the X channel or Y channel. This reduces the movement of the stage during the entire Mini-LED or Micro-LED package dicing alignment process, improves the dicing alignment efficiency before Mini-LED or Micro-LED package cutting, and ensures the accuracy of alignment.

[0088] like Figure 6The diagram shown is a second step in the alignment method for the cutting channels of a Mini-LED or Micro-LED package provided in this application embodiment. The method includes:

[0089] Step 201: Confirm the cut channels to be detected in the X channel and the Y channel of the Mini-LED or Micro-LED package. The cut channels to be detected in the X channel and the cut channels to be detected in the Y channel are perpendicular to each other. The cut channels to be detected in the X channel are equally spaced at a second preset distance, and each cut channel to be detected in the X channel has a first preset number of first identification points equally spaced at a first preset distance. The cut channels to be detected in the Y channel are equally spaced at a fourth preset distance, and each cut channel to be detected in the Y channel has a second preset number of second identification points equally spaced at a third preset distance.

[0090] Step 202: Create the first preset data comparison table and the second preset data comparison table.

[0091] In this embodiment of the application, the first preset data lookup table includes:

[0092] The coordinates of the preset first target recognition point in the X channel, the coordinates of the preset first alignment start point in the X channel, the moving distance of the worktable in the X channel, the moving distance of the image acquisition unit in the X channel, and the coordinates of the first point to be recognized; wherein, the coordinates of the preset first target recognition point correspond to the coordinates of the preset first alignment start point, and the moving distance of the worktable in the X channel and the moving distance of the image acquisition unit in the X channel correspond one-to-one with the coordinates of the first point to be recognized.

[0093] Specifically, such as Figure 3 As shown, the first preset data lookup table includes: the preset coordinates Q of the first target recognition point in the X channel. X00 (X) X00 Y X00 T X00 and the preset first alignment start point coordinates Q in the X channel X11 (X) X11 Y X11 T X11 ); Q X00 (X) X00 Y X00 T X00 ) and Q X11 (X) X11 Y X11 T X11 The X channel has 5 channels with a second preset distance L. X3 The cut tracks S to be detected are set at equal intervals. X1 S X3 S X5 S X7 SX9 Within each cutting channel to be inspected, at a first preset distance L X4 Three first identification points are set at equal intervals. Each first identification point corresponds one-to-one with the worktable movement distance in the corresponding X channel and the image acquisition unit movement distance in the corresponding X channel. X1 The internal correspondence is: [L X4 ,0,Q X12 (X) X12 Y X12 T X12 )]、[2L X4 ,0,Q X13 (X) X13 Y X13 T X13 )];S X3 The internal correspondence is: [2L X4 L X3 Q X21 (X) X21 Y X21 T X21 )]、[3L X4 L X3 Q X22 (X) X22 Y X22 T X22 )]、[4L X4 L X3 Q X23 (X) X23 Y X23 T X23 )];S X5 The internal correspondence is: [4L X4 2L X3 Q X31 (X) X31 Y X31 T X31 )]、[5L X4 2L X3 Q X32 (X) X32 Y X32 T X32 )]、[6L X4 2L X3 Q X33 (X) X33 Y X33 T X33 )];S X7 The internal correspondence is: [6L X4 3L X3 Q X41 (X) X41 Y X41 TX41 )]、[7L X4 3L X3 Q X42 (X) X42 Y X42 T X42 )]、[8L X4 3L X3 Q X43 (X) X43 Y X43 T X43 )];S X9 The internal correspondence is: [8L X4 4L X3 Q X51 (X) X51 Y X51 T X51 )]、[9L X4 4L X3 Q X52 (X) X52 Y X52 T X52 )]、[10L X4 4L X3 Q X53 (X) X53 Y X53 T X53 )].

[0094] The second preset data comparison table includes:

[0095] The coordinates of the preset second target recognition point in the Y channel, the coordinates of the preset second alignment start point in the Y channel, the moving distance of the worktable in the Y channel, the moving distance of the image acquisition unit in the Y channel, and the coordinates of the second point to be recognized; wherein, the coordinates of the preset second target recognition point correspond to the coordinates of the preset second alignment start point, and the moving distance of the worktable in the Y channel and the moving distance of the image acquisition unit in the Y channel correspond one-to-one with the coordinates of the second point to be recognized.

[0096] Specifically, such as Figure 4 As shown, the second preset data lookup table includes: the preset second target recognition point coordinates Q in the Y channel. Y00 (X) Y00 Y Y00 T Y00 and the preset second alignment start point coordinates Q in the Y channel Y11 (X) Y11 Y Y11 T Y11 ); Q Y00 (X) Y00 Y Y00 T Y00 ) and QY11 (X) Y11 Y Y11 T Y11 The Y channel has 3 channels with a fourth preset distance L. Y4 The cut tracks S to be detected are set at equal intervals. Y1 S Y3 S Y5 Within each cutting channel to be inspected, at a third preset distance L Y3 Five second identification points are set at equal intervals. Each second identification point corresponds one-to-one with the worktable movement distance in the corresponding Y channel and the image acquisition unit movement distance in the corresponding Y channel. Y1 The internal correspondence is: [L Y3 ,0,Q Y12 (X) Y12 Y Y12 T Y12 )]、[2L Y3 ,0,Q Y13 (X) Y13 Y Y13 T Y13 )]、[3L Y3 ,0,Q Y14 (X) Y14 Y Y14 T Y14 )]、[4L Y3 ,0,Q Y15 (X) Y15 Y Y15 T Y15 )];S Y3 The internal correspondence is: [4L Y3 L Y4 Q Y21 (X) Y21 Y Y21 T Y21 )]、[5L Y3 L Y4 Q Y22 (X) Y22 Y Y22 T Y22 )]、[6L Y3 L Y4 Q Y23 (X) Y23 Y Y23 T Y23 )]、[7L Y3 L Y4 Q Y24 (X) Y24 Y Y24 T Y24 )]、[8L Y3 LY4 Q Y25 (X) Y25 Y Y25 T Y25 )];S Y5 The internal correspondence is: [8L Y3 2L Y4 Q Y31 (X) Y31 Y Y31 T Y31 )]、[9L Y3 2L Y4 Q Y32 (X) Y32 Y Y32 T Y32 )]、[10L Y3 2L Y4 Q Y33 (X) Y33 Y Y33 T Y33 )]、[11L Y3 2L Y4 Q Y34 (X) Y34 Y Y34 T Y34 )]、[12L Y3 2L Y4 Q Y35 (X) Y35 Y Y35 T Y35 )].

[0097] Step 203: Transfer the Mini-LED or Micro-LED package to the worktable for holding.

[0098] Step 204: Control the image acquisition unit to move to the target position above the workbench, acquire the target image containing the first target recognition point, extract the preset first target recognition point coordinates from the first preset data lookup table and store them in the first target data lookup table for recording.

[0099] Specifically, such as Figure 3 As shown, the image acquisition unit d is controlled to move to the target position above the worktable a, which is the first target recognition point Q. X00 Location, obtain the first target identification point Q X00 The target image is obtained, and the coordinates Q of the preset first target recognition point are extracted from the first preset data lookup table. X00 (X) X00 Y X00 T X00 And store it in the first target data reference table for recording.

[0100] Step 205: Determine the coordinates of the first alignment starting point based on the preset coordinates of the first target identification point and the first preset data comparison table.

[0101] Specifically, based on the preset coordinates Q of the first target identification point X00 (X) X00 Y X00 T X00 ) and Q in the first preset data comparison table X00 With Q X11 The correspondence is used to determine the preset first alignment starting point coordinates Q. X11 (X) X11 Y X11 T X11 ).

[0102] Step 206: Move the image acquisition unit and the worktable simultaneously according to the preset first alignment starting point coordinates, so that the image acquisition unit is located at the preset first alignment starting point coordinate position on the worktable, and extract the preset first alignment starting point coordinates from the first preset data lookup table and store them in the first target data lookup table for recording.

[0103] Specifically, based on the preset first alignment starting point coordinates Q X11 (X) X11 Y X11 T X11 Simultaneously move the image acquisition unit d and the worktable a, so that the image acquisition unit d is located on the worktable a at the preset first alignment starting point coordinates Q. X11 (X) X11 Y X11 T X11 At the location, the preset first alignment starting point coordinates Q are extracted from the first preset data lookup table. X11 (X) X11 Y X11 T X11 And store it in the first target data reference table for recording.

[0104] Step 207: Control the worktable to reciprocate along the X-axis at a first preset distance, control the image acquisition unit to move along the Y-axis at a second preset distance, and use the image acquisition unit to identify the coordinates of each first identification point in the cutting path to be detected in each X-channel, thereby completing the alignment of the cutting path to be cut in the X-channel; wherein, when the image acquisition unit identifies the coordinates of each first identification point in the cutting path to be detected in two adjacent X-channels, the worktable moves in opposite directions along the X-axis.

[0105] Specifically, in one feasible implementation, such as Figure 7 As shown, Figure 7The third step of the flowchart for the Mini-LED or Micro-LED package dicing alignment method provided in the embodiments of this application includes:

[0106] Step 301: When the control worktable moves a first preset distance along the positive or negative X-axis while the position of the image acquisition unit remains unchanged, the image acquisition unit acquires a first image of the point to be identified and compares the similarity between the first image of the point to be identified and the preset feature image of the point to be identified.

[0107] Step 302: When the similarity is within the similarity threshold, confirm that the image of the first point to be identified is correct, and confirm the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit at this time. Based on the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit, extract the coordinates of the first point to be identified from the first preset data lookup table. The coordinates of the first point to be identified are the workbench moving distance in the X channel that is equal to the cumulative moving distance of the workbench and the image acquisition unit moving distance in the X channel that is equal to the cumulative moving distance of the image acquisition unit. Store the coordinates of the first point to be identified in the first target data lookup table for recording.

[0108] Step 303: When the similarity is not within the similarity threshold, the recognition is confirmed to be abnormal and the alignment process is interrupted.

[0109] Step 304: Execute the manual alignment command to move the image acquisition unit to the detection cut path in the X channel where anomalies are identified, identify the coordinates of the detection cut path in the X channel where anomalies are identified, and store them in the first target data lookup table for recording.

[0110] Step 305: Execute the continue alignment command, confirm the coordinates of the image acquisition unit, and calculate the coordinates of the first identification point at both ends of the next X channel adjacent to the abnormal identification cutting path in the X channel based on the coordinates of the first identification point at the detection endpoint of the previously identified cutting path, the coordinates of the first identification point at the detection start point, and the second preset distance.

[0111] Step 306: Compare the coordinates of the image acquisition unit with the coordinates of the first points to be identified at both ends of the next X channel in the X channel adjacent to the detected cut path that is abnormal in the X channel, and confirm the coordinates of the nearest first point to be identified.

[0112] Step 307: Control the image acquisition unit to move to the coordinate position of the nearest first point to be identified.

[0113] Step 308: Determine whether the cumulative distance the worktable moves along the positive or negative X-axis in a single cutting path to be detected within the X-channel is equal to the fifth preset distance.

[0114] Step 309: When the cumulative distance the worktable moves along the positive or negative X-axis in a single cutting path to be tested within the X-channel is equal to the fifth preset distance, the detection of the single cutting path to be tested within the X-channel is completed.

[0115] Step 310: In any two cut paths to be detected within the X channel, the first identification point at the end of the first detected cut path and the first identification point at the starting point of the next detected cut path are on the same straight line along the Y-axis and are separated by a second preset distance; after the first detected cut path is detected, the image acquisition unit moves from the position of the first identification point at the end of the first detected cut path to the position of the first identification point at the starting point of the next detected cut path.

[0116] Step 311: Determine whether the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the sixth preset distance.

[0117] Step 312: When the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the sixth preset distance, the alignment of the cutting path to be cut in the X channel is completed.

[0118] It is understood that in the embodiments of this application, steps 303 to 307 are not necessarily executed. They may only be executed when the manufacturing error of the Mini-LED or Micro-LED package b is too large, the manufacturing process of the Mini-LED or Micro-LED package b is contaminated and dirty, or the equipment alarms due to infrastructure problems.

[0119] Steps 301 to 312 above are methods for aligning the cutting path to be detected within the X channel. Specifically, as follows: Figure 1 , Figure 3 and Figure 7 As shown, the image acquisition unit d is currently located at the first alignment starting point coordinate Q. X11 (X) X11 Y X11 T X11 At point S, the cutting path to be inspected begins. X1 Alignment is performed, the position of image acquisition unit d remains unchanged, and the worktable a moves a first preset distance L along the negative X-axis. X4 At this point, the first point to be identified, Q X12 Move below the image acquisition unit d, and the image acquisition unit d acquires the image containing the first point to be identified, Q. X12 The image will contain the first point to be identified, Q. X12 The image is compared with the preset feature image of the point to be identified: when the similarity is within the similarity threshold, it is confirmed that the first point to be identified, Q, is included. X12The image is correct, and it is confirmed that the cumulative movement distance of workbench a is L at this time. X4 The cumulative moving distance of the image acquisition unit d is L. X3 L X3 =0, find the match with L from the first preset data lookup table. X4 The coordinates Q of the first point to be identified, corresponding to 0. X12 (X) X12 Y X12 T X12 Extract the coordinates Q of the first point to be identified. X12 (X) X12 Y X12 T X12 ), and Q X12 (X) X12 Y X12 T X12 The data is stored in the first target data lookup table for recording.

[0120] At the same time, the cumulative movement distance of workbench a within a single cutting path to be inspected will also be compared with the fifth preset distance L. X5 The cumulative movement distance of the image acquisition unit d is compared with the sixth preset distance L. X6 By comparison, it is understandable that L X5 = (i-1)*L X4 L X6 = (M-1)*L X3 When the cumulative distance traveled by workbench a within a single cutting path to be inspected is greater than the fifth preset distance L... X5 If they are equal, it is confirmed that the next cutting path to be detected needs to be detected; otherwise, the detection of the current cutting path continues. When the cumulative moving distance of the image acquisition unit d is equal to the sixth preset distance L... X6 If they are equal, confirm that the image acquisition unit d is located at the detection starting point of the last cut path to be detected; otherwise, continue to detect the next cut path to be detected after the cut path where the image acquisition unit d is located has been detected.

[0121] Repeat the above steps for the coordinates Q of the first point to be identified. X12 The identification steps complete the detection of the cut surface S. X1 S X3 S X5 S X7 S X9 The remaining first point to be identified, Q X13 Q X21 Q X22 Q X23 Q X31 Q X32 Q X33 Q X41 Q X42Q X43 Q X51 Q X52 Q X53 The identification of the X channel is to complete the alignment of all the cutting paths to be cut within the X channel.

[0122] It should be noted that when the first point to be identified, Q, is completed... X13 Q X23 Q X33 Q X43 Q X53 After identification, that is, when workbench a is in each of the cutting paths S to be detected X1 S X3 S X5 S X7 S X9 Cumulative travel distance and fifth preset distance L X5 When the positions are equal, the position of worktable a remains unchanged, and the image acquisition unit d moves a second preset distance L along the positive Y-axis. X3 Then, the next section to be tested is cut and tested.

[0123] It is understandable that, in any two adjacent cutting paths to be detected, the first identification point at the end of the first detected cutting path and the first identification point at the start of the next detected cutting path are on the same straight line along the Y-axis and are separated by a second preset distance L. X3 That is, the recognition trajectory of the image acquisition unit d is "S" shaped.

[0124] Furthermore, in S X1 and S X3 After all the first points to be identified within the image have been identified, the image acquisition unit d retrieves data from the first point to be identified, Q. X23 Move the second preset distance L X3 Get S X5 The first point to be identified within Q X31 The image will have the first point Q to be identified. X31 The image is compared with the feature image of the preset point to be identified. If the similarity is not within the similarity threshold, the recognition is confirmed to be abnormal, the alignment process is interrupted, indicating that the first point to be identified, Q, is at this time. X31 The first identification point Q is dirty or due to manufacturing errors in Mini-LED or Micro-LED packaging. X31 With the first point to be identified Q X23 It's not about the distance from L X3 In this case, a manual alignment command needs to be executed, that is, the image acquisition unit d is manually moved into the X channel to identify the abnormal cut path S to be detected. X5 Inside, identify S X5The corresponding coordinates are recorded in the first target data lookup table. It should be noted that during manual alignment, abnormal cut lines S to be detected are identified within the X channel. X5 The alignment results are only used when executing the cutting command after the Mini-LED or Micro-LED package alignment is completed. They are not needed in subsequent alignment processes. Therefore, for identifying abnormalities in the X-channel, the cut path S to be detected... X5 When manually identifying the coordinates, only S needs to be identified. X5 The Y-axis and T-axis coordinates of the entire cutting path to be inspected are stored in the first target data reference table for recording.

[0125] Furthermore, execute the continue alignment command to continue aligning with the cut path S to be detected. X5 The next adjacent cutting track to be inspected, S X7 Perform detection to confirm the coordinates Q of the image acquisition unit d. Xd1 (X) Xd1 Y Xd1 T Xd1 ), and based on the previously identified cutting path S in the X channel. X3 The coordinates of the first point to be identified within the detection endpoint are Q. X23 (X) X23 Y X23 T X23 The coordinates of the first point to be identified at the detection starting point are Q. X21 (X) X21 Y X21 T X21 ), second preset distance L X3 Calculate and identify the abnormal cut path S within the X channel X5 The cut path S to be detected in the adjacent next X channel X7 The coordinates of the first point to be identified at both ends of the inner boundary, specifically, S X7 The coordinates of the first points to be identified at both ends of the inner boundary are Q. X41 and Q X43 Q X41 The coordinates of Q X21 (X) X21 Y X21 T X21 ) and the second preset distance L X3 The calculation yields Q. X41 The coordinates are Q X41 (X) X21 Y X21 +L X3 T X21 ), Q X43 The coordinates of Q X23 (X) X23 YX23 T X23 ) and the second preset distance L X3 The calculation yields Q. X43 The coordinates are Q X43 (X) X23 Y X23 +L X3 T X23 ).

[0126] The coordinates Q of the location of the image acquisition unit d are obtained. Xd1 (X) Xd1 Y Xd1 T Xd1 ) and Q X41 (X) X21 Y X21 +L X3 T X21 ) and Q X43 (X) X23 Y X23 +L X3 T X23 The coordinates of the nearest first point to be identified are compared. If the coordinates of the nearest first point to be identified are Q, then... X43 (X) X23 Y X23 +L X3 T X23 If so, the image acquisition unit d is moved to Q. X43 (X) X23 Y X23 +L X3 T X23 The location is marked with Q. X43 Repeat steps 301 to 312 to complete the alignment of the cutting path to be cut within the X channel, starting from the detection point.

[0127] In this embodiment, by manually identifying the cut lines that cannot be correctly detected, and by calculating and comparing the coordinates of the first identification points at both ends of the previously correctly detected cut line to obtain the detection starting point coordinates of the cut line to be detected to continue detection, not only is the problem of how to continue alignment after alignment is stopped, but the alignment accuracy of Mini-LED or Micro-LED packages is also improved.

[0128] It should be noted that the similarity comparison methods mentioned above can be known methods for calculating the similarity between two images, such as average hashing, perceptual hashing, or histogram calculation, and are not limited here.

[0129] Step 208: Control the worktable to rotate 90°.

[0130] It is understandable that by controlling the stage a to rotate 90°, the cutting path to be detected in the Y channel is parallel to the X-axis direction, so that the image acquisition unit d can detect the cutting path to be detected in the Y channel.

[0131] Step 209: Control the image acquisition unit to move to the target position above the workbench, acquire the target image containing the second target recognition point, extract the preset second target recognition point coordinates from the second preset data lookup table and store them in the second target data lookup table for recording.

[0132] Step 210: Determine the coordinates of the preset second alignment starting point based on the preset second target identification point coordinates and the second preset data comparison table.

[0133] Step 211: Move the image acquisition unit and the worktable simultaneously according to the preset second alignment starting point coordinates, so that the image acquisition unit is located at the preset second alignment starting point coordinate position on the worktable, and extract the preset second alignment starting point coordinates from the second preset data lookup table and store them in the second target data lookup table for recording.

[0134] Step 212: Control the worktable to reciprocate along the X-axis at a third preset distance, and control the image acquisition unit to move along the Y-axis at a fourth preset distance. Use the image acquisition unit to identify the coordinates of each second identification point in the cutting path to be detected in each Y channel, and complete the alignment of the cutting path to be cut in the Y channel. When the image acquisition unit identifies the coordinates of each second identification point in the cutting path to be detected in two adjacent Y channels, the worktable moves in opposite directions along the X-axis.

[0135] Specifically, in one feasible implementation, such as Figure 8 As shown, Figure 8 The fourth step of the flowchart for the Mini-LED or Micro-LED package dicing alignment method provided in the embodiments of this application includes:

[0136] Step 401: When the control worktable moves along the positive or negative X-axis by a third preset distance and the position of the image acquisition unit remains unchanged, the image acquisition unit acquires a second image of the point to be identified and compares the similarity between the second image of the point to be identified and the preset feature image of the point to be identified.

[0137] Step 402: When the similarity is within the similarity threshold, confirm that the image of the second point to be identified is correct, and confirm the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit at this time. Based on the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit, extract the coordinates of the second point to be identified from the second preset data lookup table. The coordinates of the second point to be identified are the workbench moving distance in the Y channel that is equal to the cumulative moving distance of the workbench and the image acquisition unit moving distance in the Y channel that is equal to the cumulative moving distance of the image acquisition unit. Store the coordinates of the second point to be identified in the second target data lookup table for recording.

[0138] Step 403: When the similarity is not within the similarity threshold, the recognition is confirmed to be abnormal and the alignment process is interrupted.

[0139] Step 404: Execute the manual alignment command to move the image acquisition unit to the detection cut path in the Y channel where anomalies are identified, identify the coordinates of the detection cut path in the Y channel where anomalies are identified, and store them in the second target data comparison table for recording.

[0140] Step 405: Execute the continue alignment command, confirm the coordinates of the image acquisition unit, and calculate the coordinates of the second identification point at both ends of the next detection cutting path adjacent to the detection abnormal cutting path in the next Y channel based on the coordinates of the second identification point at the detection endpoint of the previous detection completed cutting path in the Y channel, the coordinates of the second identification point at the detection start point, and the fourth preset distance.

[0141] Step 406: Compare the coordinates of the image acquisition unit with the coordinates of the second points to be identified at both ends of the next Y channel in the next Y channel adjacent to the detected cut path that is abnormal in the Y channel, and confirm the coordinates of the closest second point to be identified.

[0142] Step 407: Control the image acquisition unit to move to the coordinate position of the nearest second point to be identified.

[0143] Step 408: Determine whether the cumulative distance the worktable moves along the positive or negative X-axis in a single cutting path to be detected within the Y-channel is equal to the seventh preset distance.

[0144] Step 409: When the cumulative distance the worktable moves along the positive or negative X-axis in a single cutting path to be tested within the Y-channel is equal to the seventh preset distance, the detection of the single cutting path to be tested within the Y-channel is completed.

[0145] Step 410: In any two cut paths to be detected within the Y channel, the second identification point at the end of the first detected cut path and the second identification point at the starting point of the next detected cut path are on the same straight line along the Y-axis and are separated by a fourth preset distance; after the first detected cut path is detected, the image acquisition unit moves from the second identification point at the end of the first detected cut path to the second identification point at the starting point of the next detected cut path.

[0146] Step 411: Determine whether the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the eighth preset distance.

[0147] Step 412: When the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the eighth preset distance, the alignment of the cutting path to be cut in the Y channel is completed.

[0148] Steps 401 to 412 above are methods for aligning the cutting path to be cut within the Y channel, such as... Figure 1 , Figure 4 and Figure 8 As shown, the specific implementation method is the same as the method for aligning the cutting path in the X channel described above, and will not be repeated here.

[0149] like Figures 1 to 4 As shown, in another feasible implementation, before the Mini-LED or Micro-LED package b is transferred to the worktable a for holding, an alignment mode is selected. Specifically, when the first preset quantity i and / or the second preset quantity j equals 2, a two-point alignment mode is selected for aligning the dicing channels of the Mini-LED or Micro-LED package b; when the first preset quantity i and / or the second preset quantity j is greater than 2, a multi-point alignment mode is selected for aligning the dicing channels of the Mini-LED or Micro-LED package. Specifically, when the two first identification points in the selected X-channel dicing channel to be detected are the first and last mark points, and when the two second identification points in the selected Y-channel dicing channel to be detected are the first and last mark points, the two-point alignment mode is used; when multiple equally spaced mark points in the selected X-channel dicing channel to be detected are selected as first identification points, and when multiple equally spaced mark points in the selected Y-channel dicing channel to be detected are selected as second identification points, the multi-point alignment mode is used. The choice between the two alignment modes mentioned above can improve alignment accuracy and efficiency when applicable to various types of Mini-LED or Micro-LED packages.

[0150] The above descriptions are merely various embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for aligning the dicing channels of a Mini-LED or Micro-LED package, characterized in that, The method includes: The test cut channels in the X channel and Y channel of the Mini-LED or Micro-LED package are identified. The test cut channels in the X channel and the test cut channels in the Y channel are perpendicular to each other. The test cut channels in the X channel are equally spaced at a second preset distance, and each test cut channel in the X channel has a first preset number of first identification points equally spaced at a first preset distance. The test cut channels in the Y channel are equally spaced at a fourth preset distance, and each test cut channel in the Y channel has a second preset number of second identification points equally spaced at a third preset distance. The Mini-LED or Micro-LED package is transported to a worktable for holding, wherein the holding method includes: vacuum adsorption or magnetic attraction; The worktable is controlled to reciprocate along the X-axis at a first preset distance, and the image acquisition unit is controlled to move along the Y-axis at a second preset distance. The image acquisition unit is used to identify the coordinates of each first identification point in the cutting path to be detected in each X-channel, thereby completing the alignment of the cutting path to be cut in the X-channel. When the image acquisition unit identifies the coordinates of each first identification point in the cutting path to be detected in two adjacent X-channels, the worktable moves in opposite directions along the X-axis. Control the worktable to rotate 90°; The worktable is controlled to reciprocate along the X-axis at a third preset distance, and the image acquisition unit is controlled to move along the Y-axis at a fourth preset distance. The image acquisition unit is used to identify the coordinates of each second identification point in the cutting path to be detected in each Y-channel, thereby completing the alignment of the cutting path to be cut in the Y-channel. When the image acquisition unit identifies the coordinates of each second identification point in the cutting path to be detected in two adjacent Y-channels, the worktable moves in opposite directions along the X-axis.

2. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 1, characterized in that, The number of cut tracks to be detected in the X channel is less than or equal to the number of cut tracks to be cut in the X channel; the number of cut tracks to be detected in the Y channel is less than or equal to the number of cut tracks to be cut in the Y channel.

3. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 1, characterized in that, Prior to transferring the Mini-LED or Micro-LED package to the workbench for holding, the following steps are included: Create a first preset data comparison table and a second preset data comparison table; The first preset data lookup table includes: The coordinates of a preset first target recognition point in the X channel, the coordinates of a preset first alignment start point in the X channel, the moving distance of the worktable in the X channel, the moving distance of the image acquisition unit in the X channel, and the coordinates of the first point to be recognized; wherein, the coordinates of the preset first target recognition point correspond to the coordinates of the preset first alignment start point, and the moving distance of the worktable in the X channel and the moving distance of the image acquisition unit in the X channel correspond one-to-one with the coordinates of the first point to be recognized; The second preset data lookup table includes: The coordinates of the preset second target recognition point in the Y channel, the coordinates of the preset second alignment starting point in the Y channel, the moving distance of the worktable in the Y channel, the moving distance of the image acquisition unit in the Y channel, and the coordinates of the second point to be recognized; wherein, the coordinates of the preset second target recognition point correspond to the coordinates of the preset second alignment starting point, and the moving distance of the worktable in the Y channel and the moving distance of the image acquisition unit in the Y channel correspond one-to-one with the coordinates of the second point to be recognized.

4. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 3, characterized in that, The control of the worktable to reciprocate along the X-axis in steps of the first preset distance, and the control of the image acquisition unit to move along the Y-axis in steps of the second preset distance, and the use of the image acquisition unit to identify the coordinates of each of the first identification points in each X-channel to be detected cutting path, to complete the alignment of the cutting path to be cut in the X-channel, includes the following: The image acquisition unit is controlled to move to the target position above the workbench, and a target image containing the first target recognition point is acquired. The coordinates of the preset first target recognition point are extracted from the first preset data lookup table and stored in the first target data lookup table for recording. The coordinates of the preset first alignment starting point are determined based on the preset first target identification point coordinates and the first preset data lookup table; The image acquisition unit and the worktable are moved simultaneously according to the preset first alignment starting point coordinates, so that the image acquisition unit is located at the preset first alignment starting point coordinates on the worktable, and the preset first alignment starting point coordinates are extracted from the first preset data lookup table and stored in the first target data lookup table for recording.

5. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 4, characterized in that, The control of the worktable to reciprocate along the X-axis in steps of the first preset distance, the control of the image acquisition unit to reciprocate along the Y-axis in steps of the second preset distance, and the use of the image acquisition unit to identify the coordinates of each of the first identification points in each X-channel to be detected cutting path, thereby completing the alignment of the cutting path to be cut in the X-channel, includes: When the workbench moves along the positive or negative X-axis by the first preset distance while the position of the image acquisition unit remains unchanged, the image acquisition unit acquires a first image of the point to be identified and compares the first image of the point to be identified with the preset feature image of the point to be identified. When the similarity is within the similarity threshold, the image of the first point to be identified is confirmed to be correct, and the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit are confirmed at this time. Based on the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit, the coordinates of the first point to be identified that correspond one-to-one with the workbench moving distance in the X channel and the image acquisition unit moving distance in the X channel that correspond one-to-one with the cumulative moving distance of the image acquisition unit are extracted from the first preset data lookup table. The coordinates of the first point to be identified are stored in the first target data lookup table for recording. When the worktable moves an accumulated distance along the positive or negative X-axis in a single cutting path to be detected within the X-channel, equal to the fifth preset distance, the detection of the single cutting path to be detected within the X-channel is completed. In any two cut paths to be detected within the X channel, the first identification point at the end of the detection of the first cut path to be detected and the first identification point at the start of the detection of the next cut path to be detected are on the same straight line along the Y-axis and are separated by a second preset distance; after the detection of the first cut path to be detected is completed, the image acquisition unit moves from the position of the first identification point at the end of the detection of the first cut path to be detected to the position of the first identification point at the start of the detection of the next cut path to be detected; When the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the sixth preset distance, the alignment of the cutting path to be cut in the X channel is completed.

6. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 5, characterized in that, The method of controlling the worktable to reciprocate along the X-axis in steps of the first preset distance, controlling the image acquisition unit to move along the Y-axis in steps of the second preset distance, and using the image acquisition unit to identify the coordinates of each of the first identification points in the cutting path to be detected in each X-channel, thereby completing the alignment of the cutting path to be cut in the X-channel, further includes: When the similarity is not within the similarity threshold, an identification anomaly is confirmed, and the alignment process is interrupted. The manual alignment command is executed to move the image acquisition unit to the detection cut path in the X channel where anomalies are identified, and the coordinates corresponding to the detection cut path in the X channel are identified and stored in the first target data lookup table for recording. Execute the continue alignment command, confirm the coordinates of the position of the image acquisition unit, and calculate the coordinates of the first point to be identified at both ends of the next detection cut track in the X channel that is adjacent to the detection cut track with abnormal identification in the X channel, based on the coordinates of the first point to be identified at the detection endpoint of the previous detection cut track completed in the X channel, the coordinates of the first point to be identified at the detection start point, and the second preset distance. The coordinates of the location of the image acquisition unit are compared with the coordinates of the first identification point at both ends of the next detection cut path in the X channel adjacent to the detection cut path with an abnormality in the X channel, and the coordinates of the nearest first identification point are confirmed. The image acquisition unit is controlled to move to the coordinate position of the nearest first point to be identified.

7. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 3, characterized in that, The control of the worktable to reciprocate along the X-axis in steps of the third preset distance, and the control of the image acquisition unit to reciprocate along the Y-axis in steps of the fourth preset distance, and the use of the image acquisition unit to identify the coordinates of each of the second identification points in each of the Y-channels to be detected cutting paths, to complete the alignment of the cutting paths to be cut in the Y-channel, includes the following prior steps: The image acquisition unit is controlled to move to the target position above the workbench and acquire a target image containing the second target recognition point. The coordinates of the preset second target recognition point are extracted from the second preset data lookup table and stored in the second target data lookup table for recording. The coordinates of the preset second alignment starting point are determined based on the preset second target identification point coordinates and the second preset data lookup table; The image acquisition unit and the worktable are moved simultaneously according to the preset second alignment starting point coordinates, so that the image acquisition unit is located at the preset second alignment starting point coordinates on the worktable, and the preset second alignment starting point coordinates are extracted from the second preset data lookup table and stored in the second target data lookup table for recording.

8. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 7, characterized in that, The control of the worktable to reciprocate along the X-axis in steps of the third preset distance, and the control of the image acquisition unit to reciprocate along the Y-axis in steps of the fourth preset distance, and the use of the image acquisition unit to identify the coordinates of each of the second identification points in each of the Y-channels to be detected cutting paths, to complete the alignment of the cutting paths to be cut in the Y-channel, includes: When the workbench moves along the positive or negative X-axis by the third preset distance while the position of the image acquisition unit remains unchanged, the image acquisition unit acquires a second image of the point to be identified and compares the second image of the point to be identified with the preset feature image of the point to be identified. When the similarity is within the similarity threshold, the image of the second point to be identified is confirmed to be correct. The cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit are also confirmed. Based on the cumulative moving distance of the workbench and the cumulative moving distance of the image acquisition unit, the coordinates of the second point to be identified that correspond one-to-one with the workbench moving distance in the Y channel and the image acquisition unit moving distance in the Y channel that correspond one-to-one with the cumulative moving distance of the image acquisition unit are extracted from the second preset data lookup table. The coordinates of the second point to be identified are then stored in the second target data lookup table for recording. When the worktable moves an accumulated distance along the positive or negative X-axis in a single cutting path to be detected within the Y-channel, equal to the seventh preset distance, the detection of the single cutting path to be detected within the Y-channel is completed. In any two cut paths to be detected within the Y channel, the second identification point at the end of the detection of the first detected cut path and the second identification point at the start of the detection of the next detected cut path are on the same straight line along the Y-axis and are separated by a fourth preset distance; after the detection of the first detected cut path is completed, the image acquisition unit moves from the position of the second identification point at the end of the detection of the first detected cut path to the position of the second identification point at the start of the detection of the next detected cut path; When the cumulative movement distance of the image acquisition unit in the Y-axis direction is equal to the eighth preset distance, the alignment of the cutting path to be cut in the Y channel is completed.

9. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 8, characterized in that, The method of controlling the worktable to reciprocate along the X-axis in steps of the third preset distance, controlling the image acquisition unit to move along the Y-axis in steps of the fourth preset distance, and using the image acquisition unit to identify the coordinates of each second identification point in the cutting path to be detected in each Y-channel, thereby completing the alignment of the cutting path to be cut in the Y-channel, further includes: When the similarity is not within the similarity threshold, an identification anomaly is confirmed, and the alignment process is interrupted. The manual alignment command is executed to move the image acquisition unit to the detection cut path in the Y channel where anomalies are identified. The coordinates of the detection cut path in the Y channel where anomalies are identified are identified and stored in the second target data lookup table for recording. Execute the continue alignment command, confirm the coordinates of the position of the image acquisition unit, and calculate the coordinates of the second point to be identified at both ends of the next detection cut track in the Y channel adjacent to the detection cut track with abnormal identification in the Y channel based on the coordinates of the second point to be identified at the detection endpoint of the previous detection cut track completed in the Y channel, the coordinates of the second point to be identified at the detection start point, and the fourth preset distance. The coordinates of the location of the image acquisition unit are compared with the coordinates of the second identification point at both ends of the next detection cut slit in the Y channel adjacent to the detection cut slit in the Y channel that is abnormally identified, and the coordinates of the nearest second identification point are confirmed. The image acquisition unit is controlled to move to the coordinate position of the nearest second point to be identified.

10. The method for aligning the dicing channels of a Mini-LED or Micro-LED package according to claim 1, characterized in that, Both the first preset quantity and the second preset quantity are greater than or equal to 2; Prior to transferring the Mini-LED or Micro-LED package to the workbench for holding, the following steps are included: When the first preset quantity and / or the second preset quantity are equal to 2, a two-point alignment mode is selected to align the Mini-LED or Micro-LED package cutting channel. When the first preset quantity and / or the second preset quantity are greater than 2, a multi-point alignment mode is selected to align the Mini-LED or Micro-LED package cutting channels.

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