Multi-physics field coupled intelligent air duct self-adjusting type low-voltage switch cabinet heat dissipation system

Abstract

The invention relates to the technical field of low-voltage switch cabinet heat dissipation, in particular to a multi-physics-field coupled intelligent air duct self-adjusting type low-voltage switch cabinet heat dissipation system which comprises a low-voltage switch cabinet and universal wheels. A monitoring mechanism used for monitoring temperature and humidity, current and air pressure data in the electrical box is arranged in the electrical box, a heat dissipation mechanism is fixedly connected to the back face of the electrical box, and an air inlet mechanism is fixedly connected to the side face of the low-voltage switch cabinet. According to the multi-physics-field coupled intelligent air duct self-adjusting type low-voltage switch cabinet heat dissipation system, through monitoring mechanisms such as a temperature and humidity sensor, an air pressure sensor and a current sensor, multi-physics-field parameters such as the temperature, the humidity, the air pressure and the working current of electrical elements in the cabinet are comprehensively collected, and the parameters are subjected to coupling analysis by the electric control box; and in combination with a field coupling simulation model, the heat dissipation requirement is accurately judged, and then the rotating speed of the fan and the opening and closing angle of the shutter are adjusted.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for low-voltage switchgear, specifically to a multi-physical field coupled intelligent air duct self-adjusting low-voltage switchgear heat dissipation system. Background Technology

[0002] Low-voltage switchgear is widely used in power systems. It contains a large number of electrical components, which generate a lot of heat during operation. If the heat cannot be dissipated in time, the temperature inside the switchgear will rise, which will not only affect the service life and performance of the electrical components, but may also cause safety accidents such as short circuits and fires in severe cases.

[0003] Currently, the commonly used heat dissipation methods for low-voltage switchgear mainly include natural heat dissipation, forced air cooling, and liquid cooling. Natural heat dissipation relies on natural air convection for heat dissipation, which has relatively low heat dissipation efficiency and is suitable for applications with low heat generation. Forced air cooling uses fans and other equipment to force airflow for heat dissipation. Although the heat dissipation efficiency is improved, the air duct is fixed and cannot be adjusted according to changes in heat distribution inside the cabinet, which can easily lead to localized insufficient heat dissipation. Liquid cooling has high heat dissipation efficiency, but its structure is complex, its cost is high, and its maintenance is difficult.

[0004] Furthermore, most existing heat dissipation systems only consider temperature as a single physical field parameter, neglecting the influence of other physical field parameters such as humidity, air pressure, and the operating status of electrical components on heat dissipation. In actual operation, these physical field parameters are coupled with each other, jointly affecting the heat dissipation performance of the switchgear. Therefore, developing a low-voltage switchgear heat dissipation system that can comprehensively consider the coupling effects of multiple physical fields and achieve intelligent self-adjustment of the air duct is of significant practical importance. Summary of the Invention

[0005] The purpose of this invention is to provide a multi-physics field coupled intelligent air duct self-adjusting low-voltage switchgear heat dissipation system to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a multi-physics field coupled intelligent air duct self-adjusting low-voltage switchgear heat dissipation system, comprising a low-voltage switchgear and casters fixedly installed at the bottom of the low-voltage switchgear, a mounting frame fixedly connected to the inner wall of the low-voltage switchgear, a load-bearing frame fixedly connected to the side of the mounting frame, an electrical box fixedly installed on the top of the load-bearing frame, and an electrical control box fixedly installed on the right side of the low-voltage switchgear;

[0007] The electrical box is equipped with a monitoring mechanism for monitoring the temperature, humidity, current and air pressure inside the electrical box. A heat dissipation mechanism is fixedly connected to the back of the electrical box, and an air intake mechanism is fixedly connected to the side of the low-voltage switch cabinet.

[0008] Preferably, the monitoring mechanism includes an electrical cabinet, a temperature and humidity sensor, a barometric pressure sensor, and a current sensor. The electrical cabinet is fixedly installed inside an electrical box, the temperature and humidity sensor and the barometric pressure sensor are both fixedly installed on the front of the electrical cabinet, and the current sensor is fixedly installed at the electrical connection point on the back of the electrical cabinet.

[0009] Preferably, the electrical box is also equipped with a ventilation fan, a back cover is fixedly installed on the back of the electrical box, a handle is fixedly connected to the front of the electrical box, and the ventilation fan is electrically connected to the electrical control box through a PLC program.

[0010] Preferably, the air intake mechanism includes an air duct, a fan, a hemispherical bulb, a compression spring, a piezoelectric ceramic plate, and an electromagnetic plate. The air duct is fixedly installed on the side of the low-voltage switchgear, the fan is fixedly installed at one end of the air duct, the air duct is connected to the air duct through a ventilation opening on the side of the low-voltage switchgear, the hemispherical bulb is fixedly installed inside the air duct, the compression spring is fixedly connected to one side of the inner wall of the hemispherical bulb, the piezoelectric ceramic plate is fixedly connected to the other side of the inner wall of the hemispherical bulb, and the electromagnetic plate is fixedly installed on the side of the low-voltage switchgear near the hemispherical bulb.

[0011] Preferably, the heat dissipation mechanism includes a heat-conducting plate, a control box, and a heat dissipation box. The heat-conducting plate is fixedly installed on the back of the rear cover. The control box and the heat dissipation box are both fixedly installed on the back of the heat-conducting plate. An electromagnet is slidably connected inside the control box, and a first telescopic spring is fixedly connected to one side of the electromagnet. A magnetic slider is slidably connected inside the heat dissipation box, and a second telescopic spring is fixedly connected to one side of the magnetic slider. The heat dissipation box is filled with coolant. A pressure relief pipe is fixedly connected to the side of the heat dissipation box, and a semiconductor heat sink is fixedly connected to the back of the heat dissipation box.

[0012] Preferably, the low-voltage switchgear has heat dissipation holes on its side, a rotating shaft is fixedly connected to the inner wall of the heat dissipation holes, a louver is fixedly connected to the outer surface of the rotating shaft, a through hole is opened on the surface of the louver, a sliding groove is opened on the side of the louver, a baffle is slidably connected inside the sliding groove, and a micro motor is fixedly installed on the side of the low-voltage switchgear.

[0013] Preferably, the electrical control box is electrically connected to the monitoring mechanism, micro motor, and air duct via a PLC program, and the electromagnet is coupled to the piezoelectric ceramic sheet via an inverter.

[0014] Preferably, the top of the low-voltage switchgear is fixedly installed with a top cover, and the front and back of the low-voltage switchgear are hinged with cabinet doors and a rear cabinet door. The upper surface of the top cover is provided with a dust cover and a ventilation slot, the side of the top cover is provided with a side ventilation hole, the inner wall of the top cover is fixedly installed with a cooling fan, and the bottom of the cooling fan is fixedly installed with a dustproof net.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics coupling comprehensively collects multi-physics parameters such as temperature, humidity, air pressure, and operating current of electrical components inside the cabinet through monitoring mechanisms such as temperature and humidity sensors, air pressure sensors, and current sensors. The control box performs coupled analysis on these parameters and, combined with the field coupling simulation model, accurately determines the heat dissipation requirements, and then intelligently adjusts the fan speed, louver opening angle, etc., so that the heat dissipation system can adapt to different operating conditions and improve the targeting and efficiency of heat dissipation.

[0017] 2. This multi-physics field coupled intelligent air duct self-adjusting low-voltage switchgear heat dissipation system features a heat-conducting plate that transfers heat from the electrical box to the heat dissipation box. The heat is absorbed by the circulating coolant, while the semiconductor heat sink further reduces the coolant temperature, significantly enhancing the heat dissipation effect. The coordinated adjustment of the air intake mechanism and the heat dissipation holes ensures smooth airflow, allowing heat to be expelled from the cabinet in a timely manner. This effectively prevents damage to electrical components caused by excessively high temperatures inside the cabinet, ensuring the safe and stable operation of the low-voltage switchgear.

[0018] 3. This multi-physics coupled intelligent duct self-regulating low-voltage switchgear cooling system utilizes airflow within the duct to deform a hemispherical capsule, generating current through the collision of a compression spring and a piezoelectric ceramic plate. This current powers the electromagnetic plate, semiconductor heat sink, and other components, achieving energy recovery and reducing external energy consumption. Simultaneously, the system automatically adjusts the operating status of each component according to cooling requirements, avoiding unnecessary energy waste and achieving energy conservation and emission reduction. Attached Figure Description

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a schematic diagram of the front structure of the low-voltage switchgear of the present invention;

[0021] Figure 2 This is a schematic diagram of the side structure of the low-voltage switchgear of the present invention;

[0022] Figure 3 This is a schematic diagram of the internal structure of the low-voltage switchgear of the present invention;

[0023] Figure 4 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle;

[0024] Figure 5 This is a schematic diagram of the electrical box structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the rear structure of the electrical box of the present invention;

[0026] Figure 7 This is a schematic diagram of the top cover structure of the present invention;

[0027] Figure 8 This is an enlarged schematic diagram of the heat dissipation hole structure of the present invention;

[0028] Figure 9 This is a cross-sectional view of the heat sink of the present invention;

[0029] Figure 10 This is a schematic diagram of the internal structure of the hemispherical sac of the present invention.

[0030] In the diagram: 1. Low-voltage switchgear; 2. Casters; 3. Top cover; 301. Side ventilation hole; 302. Dust cover; 303. Cooling fan; 304. Dust screen; 305. Ventilation slot; 4. Cabinet door; 5. Rear cabinet door; 6. Air duct; 601. Fan; 602. Hemispherical bag; 603. Compression spring; 604. Piezoelectric ceramic plate; 605. Electromagnetic plate; 7. Electrical control box; 8. Ventilation hole; 801. Micro motor; 802. Shaft; 803. Louver; 804. Through hole; 805. Slide rail; 80 6. Baffle; 9. Electrical box; 901. Handle; 902. Ventilation fan; 903. Electrical cabinet; 904. Temperature and humidity sensor; 905. Barometric pressure sensor; 906. Current sensor; 907. Rear cover; 908. Heat-conducting plate; 909. Control box; 9091. Electromagnet; 9092. Telescopic spring one; 910. Heat sink; 9101. Magnetic slider; 9102. Telescopic spring two; 9103. Semiconductor cooling chip; 9104. Pressure relief pipe; 10. Mounting bracket; 11. Load-bearing frame. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] Please see Figures 1-10 This invention provides a technical solution: a multi-physics field coupling intelligent air duct self-adjusting low-voltage switchgear heat dissipation system, including a low-voltage switchgear 1 and casters 2 fixedly installed at the bottom of the low-voltage switchgear 1. A mounting frame 10 is fixedly connected to the inner wall of the low-voltage switchgear 1, a load-bearing frame 11 is fixedly connected to the side of the mounting frame 10, an electrical box 9 is fixedly installed on the top of the load-bearing frame 11, and an electrical control box 7 is fixedly installed on the right side of the low-voltage switchgear 1. A communication module is installed inside the electrical control box 7. The communication module is used to realize communication between the intelligent control module and a remote monitoring center, uploading the multi-physics field parameters inside the cabinet and the system's operating status to the remote monitoring center in real time. When transmitting data, the communication module synchronously transmits the multi-physics field coupling analysis results and key parameters of the field coupling simulation model.

[0034] The top of the low-voltage switchgear 1 is fixedly installed with a top cover 3. The front and back of the low-voltage switchgear 1 are hinged with cabinet doors 4 and rear cabinet doors 5. The upper surface of the top cover 3 is provided with a dust cover 302 and a ventilation slot 305. The side of the top cover 3 is provided with a side ventilation hole 301. The inner wall of the top cover 3 is fixedly installed with a cooling fan 303. The bottom of the cooling fan 303 is fixedly installed with a dustproof net 304.

[0035] The electrical box 9 is equipped with a monitoring mechanism for monitoring the internal temperature, humidity, current and air pressure data. A heat dissipation mechanism is fixedly connected to the back of the electrical box 9, and an air intake mechanism is fixedly connected to the side of the low-voltage switch cabinet 1.

[0036] The monitoring mechanism includes an electrical cabinet 903, a temperature and humidity sensor 904, a barometric pressure sensor 905, and a current sensor 906. The electrical cabinet 903 is fixedly installed inside the electrical box 9. The temperature and humidity sensor 904 and the barometric pressure sensor 905 are both fixedly installed on the front of the electrical cabinet 903 to collect real-time temperature, humidity, and barometric pressure data inside the cabinet. The current sensor 906 is fixedly installed at the electrical connection point on the back of the electrical cabinet 903 to collect the operating current data of the electrical components. A ventilation fan 902 is also installed inside the electrical box 9. A back cover 907 is fixedly installed on the back of the electrical box 9, and a handle 901 is fixedly connected to the front of the electrical box 9. The ventilation fan 902 is electrically connected to the electrical control box 7 via a PLC program.

[0037] The temperature sensor uses a thermocouple temperature sensor with a measurement range of -50℃ to 150℃ and an accuracy of ±0.5℃; the humidity sensor uses a capacitive humidity sensor with a measurement range of 0 to 100%RH and an accuracy of ±2%RH; the air pressure sensor uses a piezoresistive air pressure sensor with a measurement range of 80kPa to 110kPa and an accuracy of ±0.5kPa.

[0038] The collected data, including temperature, humidity, air pressure, and current, are preprocessed, including data filtering and outlier removal, and then analyzed to obtain the heat distribution and heating status of electrical components inside the cabinet. The chip in the electrical control box 7 performs coupled analysis on the processed data, establishes a correlation model for each parameter, clarifies the degree of influence of the interaction on heat dissipation, and constructs a system based on the cabinet structure and component layout. It dynamically simulates the heat transfer path and airflow distribution based on real-time data, calculates the optimal opening and closing angle of the louvers 803 and the optimal speed of the fan 601, and generates corresponding control commands.

[0039] The air intake mechanism includes an air duct 6, a fan 601, a hemispherical bulb 602, a compression spring 603, a piezoelectric ceramic plate 604, and an electromagnetic plate 605. The air duct 6 is fixedly installed on the side of the low-voltage switchgear 1, and the fan 601 is fixedly installed at one end of the air duct 6. The air duct 6 is connected to the air duct 6 through a ventilation opening on the side of the low-voltage switchgear 1. The hemispherical bulb 602 is fixedly installed inside the air duct 6. The compression spring 603 is fixedly connected to one side of the inner wall of the hemispherical bulb 602, and the piezoelectric ceramic plate 604 is fixedly connected to the other side of the inner wall of the hemispherical bulb 602. The electromagnetic plate 605 is fixedly installed on the side of the low-voltage switchgear 1 near the hemispherical bulb 602. The fan 601 is a DC brushless fan with adjustable speed, ranging from 500 r / min to 3000 r / min.

[0040] The heat dissipation mechanism includes a heat-conducting plate 908, a control box 909, and a heat sink 910. The heat-conducting plate 908 is fixedly installed on the back of the rear cover 907. The control box 909 and the heat sink 910 are both fixedly installed on the back of the heat-conducting plate 908. An electromagnet 9091 is slidably connected inside the control box 909. A first telescopic spring 9092 is fixedly connected to one side of the electromagnet 9091. A magnetic slider 9101 is slidably connected inside the heat sink 910. A second telescopic spring 9102 is fixedly connected to one side of the magnetic slider 9101. The heat sink 910 is filled with coolant. A pressure relief pipe 9104 is fixedly connected to the side of the heat sink 910. A semiconductor heat sink 9103 is fixedly connected to the back of the heat sink 910.

[0041] The electrical control box 7 is electrically connected to the monitoring mechanism and the air duct 6 through the PLC program. The electromagnet 9091 is coupled to the piezoelectric ceramic sheet 604 through the inverter. The piezoelectric ceramic sheet 604 is coupled to the semiconductor cooling chip 9103.

[0042] Electromagnetic plate 605 is coupled to piezoelectric ceramic plate 604 via inverter. When air flows inside duct 6, according to Bernoulli's principle, at the same height, the greater the flow velocity, the lower the pressure. This results in a faster flow velocity on one side of hemispherical bladder 602, leading to lower pressure on that side. Consequently, the pressure on one side of hemispherical bladder 602 is less than the pressure on the other side, causing hemispherical bladder 602 to bulge under pressure. This, in turn, causes compression spring 603 to separate from piezoelectric ceramic plate 604. Furthermore, due to the air gap in the container during transportation... The varying airflow velocities cause the hemispherical bladder 602 to continuously bulge and contract under pressure and its own elasticity. This causes the compression spring 603 to continuously collide with the piezoelectric ceramic plate 604, resulting in a continuous current generation in the piezoelectric ceramic plate 604. The piezoelectric ceramic plate 604 is coupled to the semiconductor cooling chip 9103. Since the direction of the magnetic field of the electromagnetic plate 605 is related to the direction of the current, the piezoelectric ceramic plate 604 converts the generated current into alternating current through an inverter. This causes the direction of the current flowing through the electromagnetic plate 605 to change periodically. The electromagnetic plate 605 periodically attracts and repels the electromagnet 9091, causing the electromagnet 9091 to slide back and forth on the inner wall of the control box 909 under the periodic attraction and repulsion of the electromagnetic plate 605. This, in turn, attracts the magnetic slider 9101, causing the magnetic slider 9101 to slide continuously within the heat sink 910. This circulates the coolant within the heat sink 910, accelerating the absorption of heat from the electrical box 9, thereby reducing energy consumption during heat dissipation. The semiconductor cooling chip 9103, when energized, will... One end of the thermoelectric cooler absorbs heat, while the other end releases heat. Therefore, the heat-absorbing end of the thermoelectric cooler 9103 is placed inside the heat sink 910, and the heat-releasing end of the thermoelectric cooler 9103 is placed outside the low-voltage switchgear 1. When the current generated on the piezoelectric ceramic plate 604 supplies power to the thermoelectric cooler 9103, the heat-absorbing end of the thermoelectric cooler 9103 absorbs heat, and the heat-releasing end releases heat. In this way, the heat-absorbing end of the thermoelectric cooler 9103 absorbs the heat of the coolant in the heat sink 910, so that the coolant temperature is kept low and the cooling of the low-voltage switchgear 1 is accelerated.

[0043] During actual operation, after the temperature and humidity sensor 904, air pressure sensor 905, and current sensor 906 in the monitoring mechanism collect the temperature, humidity, air pressure, and current data inside the electrical box 9, they transmit these data to the electrical control box 7. The chip in the electrical control box 7 preprocesses and performs coupling analysis on the data, and combines it with the field coupling simulation model to determine the current heat dissipation requirements inside the cabinet.

[0044] If the analysis results indicate that the temperature inside the cabinet is high and heat dissipation needs to be strengthened, the electrical control box 7 will control the fan 601 to increase its speed and increase the air intake through the PLC program. At the same time, it will control the micro motor 801 to rotate, which will drive the shaft 802 to rotate, thereby increasing the opening angle of the louvers 803. It will also control the baffle 806 to slide in the slide groove 805, adjusting the opening size of the through hole 804 to increase the air output of the heat dissipation hole 8.

[0045] During air intake, the airflow within the duct 6 causes the hemispherical bladder 602 to continuously bulge and contract. The compression spring 603 repeatedly collides with the piezoelectric ceramic plate 604, generating an electric current. This current, after being processed by the inverter, causes the electromagnetic plate 605 to generate a periodically changing magnetic field, attracting and repelling the electromagnet 9091, causing it to slide back and forth within the control box 909. This, in turn, drives the magnetic slider 9101 to slide within the heat sink 910, promoting coolant circulation and accelerating the absorption of heat transferred from the electrical box 9 through the heat-conducting plate 908. Simultaneously, the current powers the semiconductor heat sink 9103, causing its heat-absorbing end to absorb heat from the coolant, further reducing the coolant temperature and enhancing the heat dissipation effect.

[0046] Example 2: Based on Example 1, the low-voltage switchgear 1 has a heat dissipation hole 8 on its side. A rotating shaft 802 is fixedly connected to the inner wall of the heat dissipation hole 8. A louver 803 is fixedly connected to the outer surface of the rotating shaft 802. A through hole 804 is opened on the surface of the louver 803. A sliding groove 805 is opened on the side of the louver 803. A baffle 806 is slidably connected inside the sliding groove 805. A micro motor 801 is fixedly installed on the side of the low-voltage switchgear 1. The electrical control box 7 is electrically connected to the micro motor 801 through a PLC program.

[0047] When the temperature inside the cabinet drops to a suitable range, the electrical control box 7 will control the fan 601 to reduce its speed, the micro motor 801 will drive the louvers 803 to reduce their opening angle, and the baffle 806 will adjust the opening size of the through hole 804 to reduce the air intake and exhaust volume in order to achieve energy saving.

[0048] In addition, the ventilation fan 902 works in coordination with the electrical control box 7 to enhance air circulation inside the electrical box 9 and improve heat dissipation efficiency. The cooling fan 303 on the top cover 3 will also turn on or adjust its speed in a timely manner according to the overall temperature inside the cabinet to assist in heat dissipation. The communication module uploads multiphysics parameters, system operating status, and multiphysics coupling analysis results from inside the cabinet to the remote monitoring center in real time. Staff can monitor the system operation in real time through the remote monitoring center and intervene remotely when necessary.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0050] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-physics field coupled intelligent air duct self-adjusting low-voltage switchgear heat dissipation system, comprising a low-voltage switchgear (1) and casters (2) fixedly installed at the bottom of the low-voltage switchgear (1), characterized in that: The low-voltage switchgear (1) is fixedly connected to the inner wall of the cabinet with a mounting bracket (10), and a load-bearing frame (11) is fixedly connected to the side of the mounting bracket (10). An electrical box (9) is fixedly installed on the top of the load-bearing frame (11), and an electrical control box (7) is fixedly installed on the right side of the low-voltage switchgear (1). The electrical box (9) is equipped with a monitoring mechanism for monitoring the temperature, humidity, current and air pressure data inside the electrical box (9). A heat dissipation mechanism is fixedly connected to the back of the electrical box (9), and an air intake mechanism is fixedly connected to the side of the low-voltage switch cabinet (1).

2. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The monitoring mechanism includes an electrical cabinet (903), a temperature and humidity sensor (904), a barometric pressure sensor (905), and a current sensor (906). The electrical cabinet (903) is fixedly installed inside the electrical box (9). The temperature and humidity sensor (904) and the barometric pressure sensor (905) are both fixedly installed on the front of the electrical cabinet (903). The current sensor (906) is fixedly installed at the electrical connection point on the back of the electrical cabinet (903).

3. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The electrical box (9) is also equipped with a ventilation fan (902), a back cover (907) is fixedly installed on the back of the electrical box (9), a handle (901) is fixedly connected to the front of the electrical box (9), and the ventilation fan (902) is electrically connected to the electrical control box (7) through a PLC program.

4. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The air intake mechanism includes an air duct (6), a fan (601), a hemispherical bag (602), a compression spring (603), a piezoelectric ceramic plate (604), and an electromagnetic plate (605). The air duct (6) is fixedly installed on the side of the low-voltage switchgear (1). The fan (601) is fixedly installed at one end of the air duct (6). The air duct (6) is connected to the air duct (6) through a ventilation opening on the side of the low-voltage switchgear (1). The hemispherical bag (602) is fixedly installed inside the air duct (6). The compression spring (603) is fixedly connected to one side of the inner wall of the hemispherical bag (602). The piezoelectric ceramic plate (604) is fixedly connected to the other side of the inner wall of the hemispherical bag (602). The electromagnetic plate (605) is fixedly installed on the side of the low-voltage switchgear (1) near the hemispherical bag (602).

5. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The heat dissipation mechanism includes a heat-conducting plate (908), a control box (909), and a heat dissipation box (910). The heat-conducting plate (908) is fixedly installed on the back of the rear cover (907). The control box (909) and the heat dissipation box (910) are both fixedly installed on the back of the heat-conducting plate (908). An electromagnet (9091) is slidably connected inside the control box (909). A first telescopic spring (9092) is fixedly connected to one side of the electromagnet (9091). A magnetic slider (9101) is slidably connected inside the heat dissipation box (9101). A second telescopic spring (9102) is fixedly connected to one side of the magnetic slider (9101). The heat dissipation box (910) is filled with coolant. A pressure relief pipe (9104) is fixedly connected to the side of the heat dissipation box (910). A semiconductor heat sink (9103) is fixedly connected to the back of the heat dissipation box (910).

6. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The low-voltage switchgear (1) has heat dissipation holes (8) on its side. A rotating shaft (802) is fixedly connected to the inner wall of the heat dissipation holes (8). A louver (803) is fixedly connected to the outer surface of the rotating shaft (802). A through hole (804) is opened on the surface of the louver (803). A sliding groove (805) is opened on the side of the louver (803). A baffle (806) is slidably connected inside the sliding groove (805). A micro motor (801) is fixedly installed on the side of the low-voltage switchgear (1).

7. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The electrical control box (7) is electrically connected to the monitoring mechanism, micro motor (801), and air duct (6) through a PLC program, and the electromagnet (9091) is coupled to the piezoelectric ceramic sheet (604) through an inverter.

8. The intelligent air duct self-adjusting low-voltage switchgear heat dissipation system with multi-physics field coupling according to claim 1, characterized in that: The top of the low-voltage switchgear (1) is fixedly installed with a top cover (3). The front and back of the low-voltage switchgear (1) are hinged with cabinet doors (4) and rear cabinet doors (5). The upper surface of the top cover (3) is provided with a dust cover (302) and a ventilation slot (305). The side of the top cover (3) is provided with a side ventilation hole (301). The inner wall of the top cover (3) is fixedly installed with a cooling fan (303). The bottom of the cooling fan (303) is fixedly installed with a dustproof net (304).

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