Apparatus and method for measuring component and lithographic system

Abstract

The invention relates to an apparatus (1) for measuring a component (2), in particular an optical component (2) of a lithographic system, having at least one vibration isolator device (3), a measuring system (4) mounted on the at least one vibration isolator device (3), and a supply device (5) for supplying the measuring system (4) via at least the following connections:-a data connection (6), the invention relates to a device (1) for transmitting data between a supply device (5) and a measuring system (4), and / or a galvanic connection (7) for transmitting electrical energy between the supply device (5) and the measuring system (4), and / or a gas connection (8) for transmitting at least one gas between the supply device (5) and the measuring system (4), and / or a liquid connection (9) for transmitting electrical energy between the supply device (5) and the measuring system (4). -a supply device (5) for transferring at least one liquid between the supply device (5) and the measuring system (4), and / or-a vacuum connection (10) for transferring a vacuum between the supply device (5) and the measuring system (4). According to the invention, a decoupling device (11) is provided which is designed to mechanically at least partially decouple the measuring system (4) from the supply device (5) at least during the measurement of the component (2).

Description

[0001] This application claims priority to German Patent Application No. 10 2023 202 241.9, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present invention relates to an apparatus for measuring components, particularly optical components of a lithography system, the apparatus having at least one vibration isolator device, a measuring system mounted on the at least one vibration isolator device, and a supply device for supplying to the measuring system via at least the following connection.

[0003] - A data connection for transmitting data between the supply unit and the measurement system, and / or

[0004] - A current connection for transferring electrical energy between the supply device and the measuring system, and / or

[0005] - A gas connection for transferring at least one gas between a supply device and a measuring system, and / or

[0006] - A liquid connection for transferring at least one liquid between a supply device and a measuring system, and / or

[0007] - A vacuum connection for transferring vacuum between the supply unit and the measurement system.

[0008] The present invention also relates to a method for measuring components, particularly optical components, using a vibration-damping measuring system, wherein a supply device supplies the measuring system via at least the following connection:

[0009] - A data connection for transmitting data between the supply unit and the measurement system, and / or

[0010] - A current connection for transferring electrical energy between the supply device and the measuring system, and / or

[0011] - A gas connection for transferring at least one gas between a supply device and a measuring system, and / or

[0012] - A liquid connection for transferring at least one liquid between a supply device and a measuring system, and / or

[0013] - A vacuum connection for transferring vacuum between the supply unit and the measurement system.

[0014] Furthermore, the present invention relates to a lithography system, particularly a projection exposure apparatus for semiconductor lithography, having an illumination system and an optical unit, the illumination system having a radiation source and the optical unit having at least one optical component. Background Technology

[0015] To measure components, particularly optical components of a lithography system, measurement systems are used according to existing technology. Measurement systems known from the prior art require, for their operation, elements such as electrical energy (current), data and information, and gases and / or liquids, such as water.

[0016] It is known from the prior art that cables, hoses, and screw connectors are used to transmit media, especially for supplying current and transmitting data, gases, and liquids, between machine parts of a supply device on the ambient side and vibration-isolated measurement systems.

[0017] Cables and hoses used in the present technology typically have inherent stiffness to ensure static requirements, dielectric load and installation safety, especially regarding buckling and compression.

[0018] The cross-sectional area and material dimensions of cables and hoses known in the prior art are so large that they exceed the tuning frequency of the vibration isolator device supporting the measurement system.

[0019] Therefore, in the case of a measurement system known from the prior art (which is also called a measuring machine), a disadvantage is that destructive vibrations and forces are transmitted to the measurement system through the supply device and may then adversely affect the measurement process of the measurement system. Summary of the Invention

[0020] The purpose of this invention is to provide a device for measuring components that avoids the disadvantages of the prior art and, in particular, allows for reliable measurement of components.

[0021] According to the invention, this objective is achieved by a device having the features specified in claim 1.

[0022] The present invention also aims to provide a method for measuring components that avoids the disadvantages of the prior art and, in particular, allows for reliable measurement of components.

[0023] According to the invention, this objective is achieved by a method having the features specified in claim 12.

[0024] The present invention also aims to provide a lithography system that avoids the disadvantages of the prior art and, in particular, has components for reliable measurement.

[0025] According to the invention, this objective is achieved by a photolithography system having the features specified in claim 20.

[0026] The apparatus for measuring components (particularly optical components of a lithography system) according to the invention comprises at least one vibration isolator device, a measuring system mounted on the at least one vibration isolator device, and a supply device for supplying the measuring system via the following connection:

[0027] - A data connection for transmitting data between the supply unit and the measurement system, and / or

[0028] - A current connection for transferring electrical energy between the supply device and the measuring system, and / or

[0029] - A gas connection for transferring at least one gas between a supply device and a measuring system, and / or

[0030] - A liquid connection for transferring at least one liquid between a supply device and a measuring system, and / or

[0031] - A vacuum connection for transferring vacuum between the supply unit and the measurement system.

[0032] According to the invention, a decoupling device is provided, which is configured to mechanically decouple the measurement system from the supply device at least partially, at least during the measurement of the component.

[0033] The device according to the invention allows for the transfer of media between a measuring system and a supply device or between machine components with minimal contact, particularly in the case of highly sensitive measuring systems.

[0034] In the context of this invention, the term "medium" or "medium flow" should be understood to mean one, two, more or all of the media mentioned below, namely data, electrical energy, gas or more different gases, liquid or more different liquids, or vacuum.

[0035] In the context of this invention, the term "connection" between the measurement system and the supply device should be understood to mean any of the following connections: a data connection, an electrical connection, a gas connection, a liquid connection, or a vacuum connection, unless otherwise specified in the context of this invention. Therefore, the term "connection" should be understood to mean one, two, more, or all of the aforementioned connections.

[0036] The apparatus according to the invention is suitable for measuring components, particularly optical components. The apparatus according to the invention is especially suitable for measuring optical components of lithography systems, particularly optical components of projection exposure equipment used in semiconductor manufacturing.

[0037] In the case of the device according to the invention, cable, hose, and screw connections are preferably largely or completely omitted. This prevents destructive vibrations from being transmitted to the measurement system or the measurement system side of the device.

[0038] In the case of the device according to the invention, a structural solution can be provided so that the medium or medium flow is transferred to the sensitive measurement system without contact or with minimal contact. In the case of the device according to the invention, the structural solution is designed to reduce or avoid direct mechanical connection between the isolated and non-isolated sides of the device used for conveying the medium, preferably at least during the measurement of the component.

[0039] In the context of this invention, it may be specified that one, more, or all of the media are transferred without a direct mechanical connection from the supply device to the measurement system, or that the decoupling device is configured such that, at least during the measurement of the component, one, more, or all of the connections between the supply device and the measurement system are decoupled.

[0040] In the context of this invention, it may be specifically stipulated that two or more connections between the measuring system and the supply device are mechanically decoupled during the measurement of the component by a decoupling device.

[0041] Furthermore, in the context of this invention, it may be specified that two or more media are transferred non-contactly or without contact during the measurement of a component, and / or that the transfer between the measurement system and the supply device is omitted during the measurement of a component, and / or that the media is supplied to the measurement system through the internal storage unit of the measurement system.

[0042] In the context of this invention, two or more structural solutions may be provided, thereby allowing for the mechanical decoupling of a corresponding number of connections during component measurement.

[0043] The decoupling device can be configured, in particular, to decouple the direct mechanical connection between the measurement system and the supply device, at least during the measurement of the component (i.e., during the operation of the measurement system).

[0044] The decoupling device can be configured to mechanically decouple one, several, or all connections at least partially, preferably completely, by active means, at least during component measurement. However, in the context of this invention, the decoupling device can also be configured such that one, several, or all connections between the measurement system and the supply device are mechanically decoupled at least partially, preferably completely, continuously, or permanently. The decoupling device can also be configured such that when the supply of the measurement system is necessary and no component measurement is being performed at that point in time, the decoupling device mechanically couples only one, several, or all connections between the measurement system and the supply device, for example, the measurement system may have one, several, or all storage units for a medium. The decoupling device can also be configured such that it actively and mechanically decouples at least one connection at least partially and / or permanently or continuously without contact affects at least one connection and / or at least one connection is only temporarily mechanically coupled without affecting component measurement, for example, for supplying storage units.

[0045] The decoupling device is preferably constructed such that the connection is completely decoupled mechanically. However, for example, for the transport of liquids, gases or vacuums, it may have been advantageous, in connection with the prior art, that the mechanical connection be at least partially decoupled, as these measures also reduce the transmission of vibrations.

[0046] In the context of this invention, the gas may in particular be air or a rare gas.

[0047] In the context of this invention, the transport of liquids may specifically involve water.

[0048] In the context of this invention, "transmission of vacuum between the supply device and the measurement system" should be understood in particular as the supply device generating or maintaining a vacuum in the measurement system.

[0049] The following illustrates particularly advantageous configurations for individual connections or configurations for transmitting individual media. These can be used in any combination.

[0050] Due to at least partial mechanical decoupling, the device according to the invention also makes it easier to replace machine parts of the measuring system or supply device, preferably without requiring the disassembly of cables, hoses and screw connections.

[0051] The device according to the invention specifically allows for the omission of cables and hoses, which must have the appropriate inherent stiffness to meet static requirements and installation safety (buckling, compression, etc.).

[0052] Decoupling devices can be, in particular, switchable designs to disconnect and reconnect connections and / or have contactless connections and / or have or create low-contact connections. Decoupling devices can be configured, in particular, to disconnect and reconnect plug connections such that the connection between the measurement system and the supply device for transmission of one of the media is disconnected or decoupled at least during the measurement of the component.

[0053] In the case of known measuring machines, the cross-section and material of cables and hoses are typically determined in such a way that the cables and hoses exceed the tuning frequency of the vibration isolator device supporting the measuring system. The tuning frequency here specifically describes the first natural frequency. However, cable bundles and / or conduits typically also have higher natural frequencies, which can then precisely introduce vibrations into the measuring system within these frequency ranges.

[0054] Therefore, it is advantageous if, in the case of the device according to the invention, the tuning frequency or the first natural frequency and / or a higher natural frequency and / or an additional vibration mode is used as a decoupling design criterion.

[0055] In an advantageous improvement to the device according to the invention, the decoupling device may be configured to form at least a partial wireless structure for data connection.

[0056] Wireless or cable-free data connections or data transfers can be achieved, in particular, by means of WLAN, Bluetooth, and / or optical transmission methods.

[0057] The aforementioned data connection is suitable for efficiently transmitting signals between supply devices in a measurement system.

[0058] Here, in particular, data used to control the measurement system can be transmitted from the supply device to the measurement system, and preferably, measurement data about the components already collected by the measurement system is transmitted to the supply device for storage and further processing.

[0059] In an advantageous improvement to the device according to the invention, it may be specified that the decoupling device has an induction device that can be used to inductively transfer electrical energy without contact at at least one point of the current connection.

[0060] Especially in situations where the power of the measurement system is reduced, current can be permanently and preferably transmitted or supplied without contact, particularly inductively. Inductive current transmission has the advantage that current can be supplied without contact, thereby advantageously avoiding the transmission of vibrations.

[0061] In an advantageous improvement to the device according to the invention, the decoupling device may be specified to have a gap seal and / or a labyrinth seal arranged at at least one point of the gas connection and / or liquid connection and / or vacuum connection.

[0062] With the help of labyrinth seals and / or gap seals, contactless media feed can be achieved between the supply device and the measurement system.

[0063] The sealing effect of labyrinth seals and / or gap seals is preferably based on the extension of the flow path of gas and / or liquid and / or vacuum through the gap to be sealed, resulting in a significant increase in flow resistance. This path extension is preferably achieved through the interlocking or engagement of the forming elements.

[0064] Preferably, labyrinth seals and / or gap seals are designed to prevent flow separation in the medium, which could lead to undesirable vibrations.

[0065] It has proven advantageous that gas and / or liquid connections are achieved by means of a sealing system that operates with minimal, preferably no, contact, thereby minimizing vibrations compared to direct mechanical connections. Labyrinth seals and gap seals are particularly suitable for this purpose.

[0066] In the context of this invention, a vacuum connection can be understood in particular as a connection through which residual gas is conveyed from the measuring system toward the supply device, thereby creating a vacuum environment in the region of the measuring system. The resulting gas flow is then directed from the measuring system to the supply device. In contrast, in the case of the gas connection described above, the gas flow is preferably directed from the supply device to the measuring system.

[0067] In an advantageous improvement to the device according to the invention, the gap seal and / or labyrinth seal may be provided with a sealing air device for increasing the sealing effect.

[0068] By using sealing air assistance, the sealing effect of labyrinth seals or gap seals can be further improved. The use of sealing air provides the possibility of sealing cavities formed by gas connections and / or vacuum connections through air overpressure and / or gas overpressure and / or sealing air suction and / or gas suction and removal, and improves the contactless sealing effect. The flow characteristics of the sealing air can be specified in such a way that vibrations generated by the sealing air in the area of ​​the labyrinth seal and / or gap seal are avoided.

[0069] In an advantageous improvement to the device according to the invention, it can be specified that the decoupling device is arranged in the interface area between the supply device and the measurement system.

[0070] Arranging the decoupling device in a separate interface area, i.e., spatially concentrating the individual connections in the interface area, has the advantage that it can be preferably installed and / or isolated in a particularly reliable manner.

[0071] In an advantageous improvement to the device according to the invention, the decoupling device may be specified to have an actuating motion mechanism.

[0072] If the connection between the measuring system and the supply device is established and / or disconnected by means of an actuated motion mechanism, this can be advantageously achieved quickly. In the case of the measuring system, rapid production and / or rapid disconnection has the advantage of keeping the process time or handling time of the measuring process advantageously short.

[0073] In an advantageous improvement to the device according to the invention, the decoupling device may be configured to disconnect and / or connect data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections.

[0074] Temporary connections and / or temporary supplies of media for the duration of sensitive measurement processes have the advantage that complex contactless connection or transmission methods can be omitted.

[0075] Specifically, it can be specified that the decoupling device disconnects the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection during or before the measurement operation of the measurement system. After the measurement process is completed, the decoupling device reconnects the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection to the supply device, so that the measurement system can be supplied.

[0076] Decoupling devices can be configured, in particular, to disconnect and / or connect the mechanical connection between the supply device and the measurement system.

[0077] In an advantageous improvement to the device according to the invention, the decoupling device may be specified to have at least one data carrier and / or at least one charge storage unit and / or at least one gas storage unit and / or at least one liquid container and / or at least one vacuum accumulator device.

[0078] Energy storage devices and / or storage units, such as capacitors, may be provided as part of the measurement system and / or on the measurement system side. In particular, it may be specified that the energy storage device or storage unit on the measurement system side be charged with the required amount of electrical energy before the measurement process.

[0079] Therefore, the device according to the present invention can be in two operating modes, and these two operating modes can also be implemented simultaneously in the same device.

[0080] The first operating mode is the permanent mode, in which the medium, electrical energy or current, and data are continuously but non-contactly transmitted.

[0081] The second operating mode is a temporary mode, in which the storage system (or only one storage system) in the device is charged before the measurement process begins, allowing the measurement system to operate autonomously during the measurement process.

[0082] Two operating modes can be provided for different measurement tasks: temporary operating mode and permanent operating mode. In particular, the operating mode can be selected selectively based on the medium to be supplied and the reduction in the measurement system's demand for the medium or electrical energy to be supplied.

[0083] The above-described embodiments of the device enable the realization of a measuring apparatus for measuring components (preferably optical components) of a lithography apparatus. In the case of this apparatus, a medium such as electrical energy or data (e.g., electromagnetic signals) is preferably transferred to the measuring system without contact (i.e., without mechanical contact connection). The apparatus according to the invention and its advantageous modifications particularly allow for minimizing vibration on the measuring system during operation, preferably during the measurement of optical components. In the case of this apparatus, it can be specified that liquids and / or gases are not completely contactless, but at least in a vibration-minimizing manner, transferred from a supply device to the measuring system via special seals, and / or at least one storage unit integrated into the measuring system, or the storage system is filled, which supplies the measuring system during the measurement of optical components.

[0084] In an advantageous improvement of the device according to the invention, it can be specified that the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection have such low stiffness that the transmission of vibration from the supply device to the measuring system is at least largely suppressed.

[0085] Instead of a completely contactless transmission medium, connections, such as connecting wires, can be provided, with stiffness chosen so low that vibrations are not transmitted or are transmitted only to a negligible degree.

[0086] For example, in order to transmit electrical energy, instead of insulated cables, only fine strands with an insulating coating can be provided.

[0087] In an advantageous improvement to the device according to the invention, the data connection and / or current connection and / or gas connection and / or liquid connection and / or vacuum connection may be specified to have a stiffness of 0.1 N / mm to 100 N / mm, preferably 0.1 N / mm to 50 N / mm, more preferably 0.2 N / mm to 10 N / mm, and particularly 0.2 N / mm to 2 N / mm.

[0088] The above stiffness values ​​should preferably be considered in conjunction with mass, isolation structure, or measurement system.

[0089] The isolation mass used for the isolation structure or measurement system can be, for example, 10 kg. A stiffness of c = 0.1 N / mm results in a first natural frequency or tuning frequency of 0.5 Hz.

[0090] The isolation mass used for the isolation structure or measurement system can be, for example, 10,000 kg. A stiffness of c = 100 N / mm also results in a first natural frequency or tuning frequency of 0.5 Hz.

[0091] Accordingly, larger or smaller machines can have greater or less stiffness and mass. Preferably, the first natural frequency ω can be determined via the formula... Let c be the stiffness and m be the isolation mass.

[0092] The inventors have determined that, at stiffness values ​​as described above, vibrations during the damage measurement process are not transmitted through data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections.

[0093] It can also be specified that the measurement system be housed in an isolation box. Specifically, the isolation box can be a soundproof and / or vibration-damping design. This allows for the reduction and / or minimization of airborne noise propagation to the measurement system. Here, the isolation box can be considered part of a decoupling device.

[0094] It can be specified that the decoupling device takes the form of a plug-in module and / or a connection module.

[0095] The present invention also relates to a method having the features specified in claim 12.

[0096] In the method according to the invention for measuring components, particularly optical components, using a vibration-damped measuring system, the supply device supplies to the measuring system via at least the following connection:

[0097] - A data connection for transmitting data between the supply unit and the measurement system, and / or

[0098] - A current connection for transferring electrical energy between the supply device and the measuring system, and / or

[0099] - A gas connection for transferring at least one gas between a supply device and a measuring system, and / or

[0100] - A liquid connection for transferring at least one liquid between a supply device and a measuring system, and / or

[0101] - A vacuum connection for transferring vacuum between the supply unit and the measurement system.

[0102] According to the invention, the measurement system is at least partially mechanically decoupled from the supply device, at least during the measurement of the component.

[0103] It can be stipulated that the direct mechanical connection between the measurement system and the supply device is decoupled at least during the measurement of the component.

[0104] It can be specified that at least part of the mechanical decoupling is achieved through the complete mechanical decoupling or disconnection of one or all connections, namely data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections.

[0105] As an alternative or supplement, it may be stipulated that at least partial mechanical decoupling is achieved by reducing the capability of one or all connections, namely data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections, in order to transmit mechanical excitations, particularly vibrations.

[0106] The method according to the invention has the advantage that it enables particularly reliable measurement of components by means of a measuring system, since the measuring system is protected from vibrations that could impair measurement accuracy, at least during the measurement process.

[0107] In an advantageous improvement to the method according to the invention, data can be transmitted wirelessly via a data connection.

[0108] Wireless data transmission can be achieved in a particularly reliable and simple manner using established systems such as WLAN and / or Bluetooth.

[0109] In an advantageous improvement to the method according to the invention, it can be specified that electrical energy is transmitted at least partially inductively via a current connection.

[0110] The inductive transfer of electrical energy can be achieved without contact and is particularly suitable for measurement processes that require only a small reduction in the power of the measurement system.

[0111] In an advantageous improvement to the method according to the invention, it may be specified that at least one gas and / or at least one liquid and / or at least one vacuum is transmitted at at least one point of gas connection and / or liquid connection and / or vacuum connection via gap seals and / or labyrinth seals.

[0112] The advantage of using gap seals and / or labyrinth seals in the transmission of gases, liquids and / or vacuums is that contactless sealing can be achieved by means of labyrinth seals and / or gap seals.

[0113] In particular, the use of gap seals and / or labyrinth seals is appropriate if the operating pressure of the gas and / or liquid, or the negative pressure acting under vacuum conditions, is limited. Specific values ​​for the operating pressure of the gas and / or liquid, or the negative pressure acting under vacuum conditions, can be determined such that the occurrence of turbulence is avoided, or at least largely avoided.

[0114] In an advantageous improvement to the method according to the invention, it may be specified that data connections and / or current connections and / or gas connections and / or liquid connections and / or vacuum connections are disconnected before the measurement of the component and / or reconnected after the measurement of the component.

[0115] The method can be performed in a temporary operating mode (also referred to as the second operating mode in the context of this invention) and / or a permanent operating mode (also referred to as the first operating mode in the context of this invention).

[0116] In permanent operation mode, data, electrical energy, gas, liquid and / or vacuum are permanently transferred between the measurement system and the supply device even during the measurement process.

[0117] In temporary operating mode, it can be specified that the measuring system is temporarily connected to the supply device, and in particular, the connection between the measuring system and the supply device can be disconnected or sealed during the measurement of a component.

[0118] In an advantageous improvement to the method according to the invention, it can be specified that the measuring system operates partially or completely autonomously during the measurement of the component.

[0119] If the measurement system operates partially or completely autonomously, the corresponding direct connection between the measurement system and the supply device can therefore be partially or completely disconnected during the measurement of the component.

[0120] For example, it can be specified that from the start of the measurement, the measuring system is evacuated, and after complete evacuation, the measuring system is disconnected from the vacuum pump of the supply device and shut off in a vacuum-sealed manner. The quality of the applied vacuum may be maintained within a tolerable range during the measurement time.

[0121] Similarly, it can be stipulated that from the start of the measurement, the measuring system is filled with gas, particularly an inert gas, and the gas concentration is maintained within a sufficient and tolerable range during the measurement time.

[0122] In an advantageous improvement to the method according to the invention, it may be specified that, prior to the measurement of the component, at least one data carrier and / or at least one charge storage unit and / or at least one gas storage unit and / or at least one liquid container and / or at least one vacuum accumulator device are loaded via a data connection and / or a current connection and / or a gas connection and / or a liquid connection and / or a vacuum connection.

[0123] A storage device (also referred to as a storage cell / storage system in the context of this invention) is particularly advantageous for performing the method in temporary operating modes. For example, the charge storage cell can be configured to be loaded with high power outside of the measurement period by means of a cable connection. The measurement system then benefits from the stored energy during the measurement.

[0124] In an advantageous improvement to the method according to the invention, it may be specified that during the measurement of the component, the measurement system is at least partially supplied by a data carrier and / or a charge storage unit and / or a gas storage unit and / or a liquid container and / or a vacuum accumulator device.

[0125] It can be specified that the aforementioned storage device, during the operation of the measurement system or during the measurement of a component, assists the execution of methods in the permanent operation mode through a temporary operation mode. For example, it can be specified that, in order to supplement the transfer of electrical energy through induction, especially when power peaks exist, electrical energy from the charge storage unit is also used.

[0126] Therefore, a combination or simultaneous use of the two operating modes can be provided, or it may be used only for a single medium.

[0127] In the case of measurement operations, it can be specified that no gas or air is required for relatively rigid gas connections at the decoupling device, interface surface, or interface area to be disconnected. Simultaneously, it can be specified that cable connections with relatively low stiffness are permanently maintained. The interface area is preferably located between the supply device and the measurement system, or the interface surface is preferably constructed between the supply device and the measurement system.

[0128] The present invention also relates to a photolithography system having the features specified in claim 20.

[0129] The photolithography system according to the invention, particularly a projection exposure apparatus for semiconductor photolithography, comprises an illumination system with a radiation source and an optical unit having at least one optical component. According to the invention, at least one of the optical components is measured at least partially by means of the apparatus described above and / or by means of the method described above.

[0130] The lithography system according to the invention has the advantage of measuring its components, particularly its optical components, also referred to as optical elements, in a particularly reliable manner. Preferably, the optical components are mirrors, lens elements, or light collectors. In this way, the lithography system according to the invention can be used to produce semiconductor products, which are formed in a particularly reliable manner.

[0131] The device according to the invention is particularly suitable for use as a measuring machine for measuring the projection optical unit of a lithography system.

[0132] The features described in conjunction with one of the subjects of the invention, particularly those given by the apparatus, method, or lithography system according to the invention, can also be advantageously implemented for other subjects of the invention. Similarly, the advantages specified in conjunction with one of the subjects of the invention can also be understood with respect to other subjects of the invention.

[0133] Additionally, it should be noted that terms such as “comprising,” “having,” or “with” do not exclude other features or steps. Furthermore, terms such as “one” or “the” that indicate a single step or feature do not exclude multiple features or steps, and vice versa.

[0134] However, in a purely embodiment of the invention, it may also be provided to use the terms "comprising," "having," or "with" the features introduced in the invention as an exhaustive enumeration. Thus, one or more enumerations of features can be considered exhaustive within the scope of the invention, for example, considered individually with respect to each claim. For example, the invention may consist only of the features specified in claim 1.

[0135] It should be noted that names such as "first" or "second" are primarily used to distinguish the corresponding features of the equipment or method, and are not necessarily intended to indicate that the features are required or related to each other.

[0136] The vibration isolator device, supply device, and decoupling device provided according to the present invention can also be configured and arranged for use in the lithography system itself. This means that the device according to the present invention can be used in the lithography system itself. This constitutes a separate (second) invention, for which reference may also be made directly or similarly to the foregoing and subsequent configurations of the device and method according to the present invention.

[0137] The second invention may have the following features:

[0138] An apparatus for a photolithography system includes at least one vibration isolator, a photolithography system (or a component of the photolithography system, particularly a projection system, an illumination optics unit, an exposure system, or an illumination system) mounted on the at least one vibration isolator, and a supply device for supplying to the photolithography system (or a component of the photolithography system, particularly a projection system or an exposure system) via the following connection:

[0139] - A data connection for transmitting data between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system), and / or

[0140] - A current connection for transferring electrical energy between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system), and / or

[0141] - A gas connection for transferring at least one gas between a supply device and a lithography system (or a component of the lithography system, particularly a projection system or an exposure system), and / or

[0142] - A liquid connection for transferring at least one liquid between a supply device and a lithography system (or a component of the lithography system, particularly a projection system or an exposure system), and / or

[0143] - A vacuum connection for transferring vacuum between the supply device and the lithography system (or components of the lithography system, particularly the projection or exposure system).

[0144] Its features are,

[0145] The decoupling device is provided and configured to mechanically decouple the lithography system (or components of the lithography system, particularly the projection system or exposure system) from the supply device at least partially, preferably completely, during at least a predefined period of operation (e.g., during maintenance, operation, or adjustment).

[0146] The corresponding method according to the invention for use in the second invention can be characterized as follows:

[0147] A method for a photolithography system, the photolithography system having at least one vibration isolator device, the photolithography system (or a component of the photolithography system, particularly a projection system or an exposure system) being mounted on the at least one vibration isolator device, wherein a supply device supplies to the photolithography system (or a component of the photolithography system, particularly a projection system or an exposure system) via at least the following connection:

[0148] - A data connection for transmitting data between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system), and / or

[0149] - A current connection for transferring electrical energy between the supply device and the lithography system (or components of the lithography system, particularly the projection system or exposure system), and / or

[0150] - A gas connection for transferring at least one gas between a supply device and a lithography system (or a component of the lithography system, particularly a projection system or an exposure system), and / or

[0151] - A liquid connection for transferring at least one liquid between a supply device and a lithography system (or a component of the lithography system, particularly a projection system or an exposure system), and / or

[0152] - A vacuum connection for transferring vacuum between the supply device and the lithography system (or components of the lithography system, particularly the projection or exposure system).

[0153] Its features are,

[0154] The lithography system (or components of the lithography system, particularly the projection system or exposure system) is mechanically at least partially, preferably completely, decoupled from the supply device at least during a predefined period of operation (e.g., during maintenance, operation, or adjustment).

[0155] The use of equipment and methods for the lithography system itself allows for the transfer of media between the lithography system (or components of the lithography system, particularly the projection or exposure system) and the supply device in a manner that is as non-contact as possible, at least during predefined operations, thus avoiding destructive vibrations and forces that could negatively impact operations.

[0156] The independent claims, namely, the apparatus for measuring a component (having at least one vibration isolator device, a measuring system mounted on at least one vibration isolator device, and a supply device for supplying the measuring system), and correspondingly the method for measuring the component using the vibration-damping measuring system (wherein the supply line supplies the measuring system), can also be understood in certain embodiments as follows: the measuring system is a lithography system (or a component of a lithography system, particularly a projection system or illumination optics unit or exposure system or illumination system), which is configured and provided for the production of semiconductors and operates accordingly for this purpose. Attached Figure Description

[0157] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings.

[0158] The accompanying drawings each illustrate preferred exemplary embodiments, wherein various features of the invention are shown in combination with each other. Features of exemplary embodiments may also be implemented independently of other features of the same exemplary embodiment, and may be readily combined by those skilled in the art to form further feasible combinations and sub-combinations with features of other exemplary embodiments.

[0159] In the accompanying drawings, elements with the same function are given the same reference numerals.

[0160] In the attached diagram:

[0161] Figure 1 The meridional section of the EUV projection exposure equipment is shown;

[0162] Figure 2 This shows a DUV projection exposure device;

[0163] Figure 3 A schematic diagram illustrating a possible embodiment of the device or method according to the present invention is shown;

[0164] Figure 4 A schematic diagram of a possible embodiment of the transmission device is shown;

[0165] Figure 5 A schematic diagram of another possible embodiment of the device or method according to the invention is shown; and

[0166] Figure 6 A block diagram illustrating a possible embodiment of the method according to the present invention is shown. Detailed Implementation

[0167] refer to Figure 1 The basic components of the micro-lithography EUV projection exposure apparatus 100, which is an example of a lithography system, are described below by way of example. The description of the basic structure of the EUV projection exposure apparatus 100 and its components should not be interpreted restrictively here.

[0168] The illumination system 101 of the EUV projection exposure apparatus 100, in addition to the radiation source 102, includes an illumination optics unit 103 for illuminating the object field 104 in the object plane 105. The object being exposed is a mask master 106 arranged in the object field 104. The mask master 106 is held by a mask master holder 107. The mask master holder 107 can be displaced in the scanning direction, specifically by a mask master displacement driver 108.

[0169] Figure 1 A Cartesian xyz coordinate system is depicted for illustrative purposes. The x-direction extends vertically into the plane shown in the figure. The y-direction extends horizontally, and the z-direction extends vertically. Figure 1 In the image, the scanning direction extends in the y-direction. The z-direction extends perpendicularly to the object plane at a distance of 105 degrees.

[0170] The EUV projection exposure apparatus 100 includes a projection optics unit 109. The projection optics unit 109 is used to image an object field 104 onto an image field 110 in an image plane 111. The image plane 111 extends parallel to the object plane 105. Alternatively, an angle other than 0° between the object plane 105 and the image plane 111 is also possible.

[0171] The structure on the mask master 106 is imaged onto the photosensitive layer of the wafer 112, which is located in the image field 110 region of the image plane 111. The wafer 112 is held by a wafer holder 113. The wafer holder 113 can be displaced, specifically in the y-direction, by a wafer displacement driver 114. The displacement of the mask master 106 by the mask displacement driver 108 and the displacement of the wafer 112 by the wafer displacement driver 114 can be synchronized with each other.

[0172] Radiation source 102 is an EUV radiation source. Radiation source 102 specifically emits EUV radiation 115, which is also referred to hereinafter as the radiation used or illumination radiation. Specifically, the radiation used 115 has a wavelength in the range of 5 nm to 30 nm. Radiation source 102 can be a plasma source, such as an LPP source (“laser-generated plasma”) or a GDPP source (“gas discharge-generated plasma”). It can also be a synchrotron-based radiation source. Radiation source 102 can be a free-electron laser (FEL).

[0173] Illumination radiation 115 emitted from radiation source 102 is focused by a concentrator 116. The concentrator 116 may be a concentrator having one or more elliptical and / or hyperboloidal reflective surfaces. At least one reflective surface of the concentrator 116 may be illuminated by illumination radiation 115 having grazing incidence (GI) (i.e., an angle of incidence greater than 45°) or normal incidence (NI) (i.e., an angle of incidence less than 45°). The concentrator 116 may be structured and / or coated, primarily to optimize its reflectivity to the radiation 115 used, and secondarily to suppress intrusive light.

[0174] Downstream of the light collector 116, illumination radiation 115 propagates through the intermediate focal point in the intermediate focal plane 117. The intermediate focal plane 117 can constitute a separation between the radiation source module and the illumination optical unit 103, the radiation source module including the radiation source 102 and the light collector 116.

[0175] The illumination optics unit 103 includes a deflecting mirror 118 and a first faceted mirror 119 disposed downstream of the deflecting mirror 118 in the beam path. The deflecting mirror 118 may be a planar deflecting mirror, or alternatively a mirror having a beam-affecting effect beyond a pure deflection effect. Alternatively or additionally, the deflecting mirror 118 may be in the form of a spectral filter that separates the wavelength of light used in the illumination radiation 115 from intrusive light having wavelengths deviating from it. The first faceted mirror 119 is also referred to as a field faceted mirror if it is arranged in a plane of the illumination optics unit 103 that is optically conjugate to the object plane 105 and serves as the field plane. The first faceted mirror 119 includes a plurality of individual first facets 120, which are also referred to hereinafter as field facets. By way of example, in Figure 1 Only a few of these facets 120 are shown in the image.

[0176] The first facet 120 can be in the form of a macroscopic facet, particularly a rectangular facet or a facet with an arc-shaped edge profile or a partially circular edge profile. The first facet 120 can be in the form of a planar facet, or alternatively, in the form of a convex or concave curved facet.

[0177] As is known, for example, from DE 10 2008 009 600 A1, the first facet 120 itself can also be composed of multiple individual mirrors, particularly multiple micromirrors. In particular, the first facet mirror 119 can be in the form of a microelectromechanical system (MEMS system). For details, refer to DE 10 2008 009 600 A1.

[0178] The illumination radiation 115 travels horizontally (i.e., in the y direction) between the light collector 116 and the deflector 118.

[0179] In the beam path of the illumination optical unit 103, the second faceted mirror 121 is disposed downstream of the first faceted mirror 119. If the second faceted mirror 121 is arranged in the pupil plane of the illumination optical unit 103, it is also called a pupil faceted mirror. The second faceted mirror 121 can also be arranged at a certain distance from the pupil plane of the illumination optical unit 103. In this case, the combination of the first faceted mirror 119 and the second faceted mirror 121 is also called a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US 6,573,978.

[0180] The second faceted reflector 121 includes a plurality of second facets 122. In the case of a pupil faceted reflector, the second facets 122 are also referred to as pupil facets.

[0181] The second facet 122 can also be a macroscopic facet, which may, for example, have circular, rectangular, or hexagonal boundaries, or alternatively, a facet composed of micromirrors. In this regard, see also DE 10 2008 009 600 A1.

[0182] The second facet 122 may have a planar reflective surface, or alternatively, a convex or concave curved reflective surface.

[0183] The illumination optics unit 103 thus forms a biplane system. This basic principle is also known as a fly-eye integrator.

[0184] It may be advantageous to arrange the second faceted mirror 121 imprecisely in a plane that is optically conjugate to the pupil plane of the projection optics unit 109.

[0185] The second faceted mirror 121 is used to image each of the first facets 120 into the object field 104. The second faceted mirror 121 is the final beam-shaping mirror or, in effect, the final mirror reflecting the illumination radiation 115 in the beam path upstream of the object field 104.

[0186] In another embodiment (not shown) of the illumination optics unit 103, a transmission optics unit, particularly helpful in imaging the first facet 120 into the object field 104, may be arranged in the beam path between the second facet mirror 121 and the object field 104. The transmission optics unit may have exactly one mirror or, alternatively, two or more mirrors arranged front and back in the beam path of the illumination optics unit 103. In particular, the transmission optics unit may comprise one or two normal incident mirrors (NI mirrors) and / or one or two grazing incident mirrors (GI mirrors).

[0187] exist Figure 1 In the embodiment shown, the illumination optics unit 103 has exactly three mirrors downstream of the light collector 116, specifically a deflector 118, a field plane mirror 119, and a pupil plane mirror 121.

[0188] In another embodiment of the illumination optics unit 103, the deflecting mirror 118 may be omitted, and thus the illumination optics unit 103 may be followed by exactly two mirrors downstream of the light collector 116, specifically a first faceted mirror 119 and a second faceted mirror 121.

[0189] Imaging the first plane 120 onto the object plane 105 via the second plane 122 or using the second plane 122 and the transmission optical unit is typically only an approximate imaging.

[0190] The projection optics unit 109 includes a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the EUV projection exposure apparatus 100.

[0191] exist Figure 1 In the example shown, the projection optics unit 109 includes six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or different numbers of mirrors M1 are also possible. The penultimate mirror M5 and the last mirror M6 each have a channel opening for illumination radiation 115. The projection optics unit 109 is a double-shielded optics unit. The projection optics unit 109 has an image-side numerical aperture greater than 0.5 and may also be greater than 0.6 and may be, for example, 0.7 or 0.75.

[0192] The reflective surface of mirror Mi can be a free-form surface without an axis of rotational symmetry. Alternatively, the reflective surface of mirror Mi can be designed as an aspherical surface having exactly one axis of rotational symmetry in its shape. Like the mirror of illumination optics unit 103, mirror Mi can have a highly reflective coating for illumination radiation 115. These coatings can be designed as multilayer coatings, particularly with alternating layers of molybdenum and silicon.

[0193] The projection optics unit 109 has a large object-image offset in the y-direction between the y-coordinate of the center of the object field 104 and the y-coordinate of the center of the image field 110. In the y-direction, this object-image offset can have approximately the same magnitude as the z-distance between the object plane 105 and the image plane 111.

[0194] Specifically, the projection optics unit 109 may have a deformable design. Specifically, it has different imaging ratios βx and βy in the x and y directions. The two imaging ratios βx and βy of the projection optics unit 109 are preferably (βx, βy) = (+ / -0.25, + / -0.125). A positive imaging ratio β means imaging without image inversion. A negative imaging ratio β means imaging with image inversion.

[0195] The projection optical unit 109 thus causes its size to decrease in the x-direction (i.e., in the direction perpendicular to the scanning direction) at a ratio of 4:1.

[0196] The projection optical unit 109 results in a size reduction of 8:1 in the y-direction (i.e., in the scanning direction).

[0197] Other imaging scales are also possible. Imaging scales with the same sign and the same absolute value in both the x and y directions (e.g., absolute values ​​of 0.125 or 0.25) are also possible.

[0198] The number of intermediate image planes in the x and y directions of the beam path between object field 104 and image field 110 may be the same or different, depending on the embodiment of projection optics 109. Examples of projection optics with different numbers of such intermediate images in the x and y directions are known from US 2018 / 0074303 A1.

[0199] In each case, one of the pupil planes 122 is assigned to exactly one of the field planes 120 for the purpose of forming a corresponding illumination channel for illuminating the object field 104. This can in particular lead to illumination according to Köhler's principle. The far field is decomposed into multiple object fields 104 by means of the field planes 120. The field planes 120 produce multiple images with intermediate focal points on their respective pupil planes 122.

[0200] Each freely allocated pupil plane 122 of the field plane 120 is imaged onto the mask master 106 in an overlapping manner to illuminate the object field 104. The illumination of the object field 104 particularly has maximum uniformity. It preferably has a uniformity error of less than 2%. Field uniformity can be obtained by superimposing different illumination channels.

[0201] The illumination of the entrance pupil of the projection optical unit 109 can be geometrically defined by the arrangement of the pupil facets. The intensity distribution in the entrance pupil of the projection optical unit 109 can be set by selecting the illumination channel (specifically, a subset of the pupil facets guiding the light). This intensity distribution is also referred to as the illumination setting.

[0202] The equally preferred pupil uniformity in the region of the illumination pupil of the illumination optical unit 103 illuminated in a defined manner can be obtained by redistributing the illumination channels.

[0203] Other aspects and details of the illumination of the object field 104 are described below, particularly the other aspects and details of the illumination of the entrance pupil of the projection optical unit 109.

[0204] The projection optics unit 109 may have a concentric entrance pupil. The latter may be accessible or inaccessible.

[0205] The entrance pupil of the projection optics unit 109 is generally not precisely illuminated by the pupil facet mirror 121. In the case of imaging by the projection optics unit 109, which images the center of the pupil facet mirror 121 onto the wafer 112 at a telecentric angle, the aperture rays typically do not intersect at a single point. However, it is possible to find a region where the spacing between pairs of defined aperture rays becomes minimal. This region represents the entrance pupil or the region conjugate to it in real space. In particular, this region exhibits a finite curvature.

[0206] The projection optics unit 109 may have different positions for the entrance pupils for the tangential beam path and the sagittal beam path. In this case, an imaging element, particularly an optical structural element of the transmission optics unit, should be provided between the second faceted mirror 121 and the mask master 106. This optical structural element allows for consideration of the different positions of the tangential and sagittal entrance pupils.

[0207] exist Figure 1 In the arrangement of components of the illumination optical unit 103 shown, the pupil faceted mirror 121 is arranged in a region conjugate with the incident pupil of the projection optical unit 109. The first field faceted mirror 119 is inclined relative to the object plane 105. The first field faceted mirror 119 has an inclination relative to the arrangement plane defined by the deflecting mirror 118.

[0208] The first faceted mirror 119 has an inclination relative to the arrangement plane defined by the second faceted mirror 121.

[0209] Figure 2An exemplary DUV projection exposure apparatus 200 is shown. The DUV projection exposure apparatus 200 includes an illumination system 201, means for receiving and precisely positioning a mask master 203 (through which subsequent structures on a wafer 204 are determined), a wafer holder 205 for holding, moving, and precisely positioning the wafer 204, and an imaging means, specifically a projection optics unit 206 having a plurality of optical components, specifically lens elements 207, which are held in a lens housing 209 of the projection optics unit 206 by means of a mounting 208.

[0210] As an alternative to or supplement to the lens element 207 shown, various refractive, diffractive, and / or reflective optical elements can be provided, especially mirrors, prisms, end plates, etc.

[0211] The basic functional principle of the DUV projection exposure device 200 enables the imaging of the structure in the mask master 203 onto the wafer 204.

[0212] The illumination system 201 provides a projected beam 210 in the form of electromagnetic radiation, which is required to image the mask master 203 onto the wafer 204. The source for this radiation can be a laser, a plasma source, or the like. The radiation is shaped in the illumination system 201 by means of optical elements such that when the projected beam 210 is incident on the mask master 203, the projected beam 210 has desired characteristics regarding diameter, polarization, wavefront shape, etc.

[0213] With the aid of the projection beam 210, an image of the mask master 203 is created and transferred from the projection optics unit 206 to the wafer 204 in a appropriately reduced form. In this case, the mask master 203 and the wafer 204 can move synchronously, such that the area of ​​the mask master 203 is actually continuously imaged onto the corresponding area of ​​the wafer 204 during the so-called scanning operation.

[0214] The air gap between the last lens element 207 and the wafer 204 can optionally be replaced by a liquid medium having a refractive index greater than 1.0. The liquid medium can be, for example, high-purity water. This configuration is also known as immersion lithography and has increased lithographic resolution.

[0215] The use of this invention is not limited to use in projection exposure apparatuses 100 and 200, and in particular, not in those having the described structure. This invention is applicable to any desired lithography system or microlithography system, but is particularly applicable to projection exposure apparatuses having the described structure. This invention is also applicable to EUV projection exposure apparatuses, which have a more specific combination... Figure 1The invention describes a smaller image-side numerical aperture without obscuring mirrors M5 and / or M6. In particular, the invention is also applicable to EUV projection exposure apparatus having an image-side numerical aperture of 0.25 to 0.5, preferably 0.3 to 0.4, and particularly preferably 0.33. The invention and the following exemplary embodiments should not be construed as limiting to a particular design.

[0216] The following figures illustrate the invention by way of example only and in a highly schematic manner.

[0217] Figure 3 A schematic diagram of a possible embodiment of an apparatus 1 for measuring component 2 (particularly the optical component 2 of a lithography system) is shown. The optical component 2 may be, in particular, one of a light collector 116 or a mirror, or one of facets 118, 119, 120, 121, 122, Mi, or one of lens elements 207. The apparatus 1 includes at least one vibration isolator 3, a measuring system 4 mounted on at least one vibration isolator 3, and a supply device 5 for supplying the measuring system 4. In the case of apparatus 1, the measuring system 4 is supplied via at least one data connection 6 for transmitting data between the supply device 5 and the measuring system 4 and / or a current connection 7 for transmitting electrical energy between the supply device 5 and the measuring system 4 and / or a gas connection 8 for transmitting at least one gas between the supply device 5 and the measuring system 4 and / or a liquid connection 9 for transmitting at least one liquid between the supply device 5 and the measuring system 4 and / or a vacuum connection 10 for transmitting vacuum between the supply device 5 and the measuring system 4.

[0218] In the case of device 1, a decoupling device 11 is provided and the decoupling device 11 is configured to mechanically decouple the measurement system 4 from the supply device 5 at least partially during the measurement of component 2.

[0219] exist Figure 3 In the exemplary embodiment shown, the decoupling device 11 is preferably configured to form a data connection 6 in a configuration that is at least partially, and preferably entirely, wireless. Figure 3 In this context, the wireless data connection 6 is symbolized by the antenna on the supply device 5 and / or the measurement system 4.

[0220] exist Figure 3 In the exemplary embodiment shown, the decoupling device 11 preferably has a sensing device 12, which can be used to inductively transfer electrical energy without contact at at least one point of the current connection 7.

[0221] according to Figure 3 In the exemplary embodiment shown, the decoupling device 11 is preferably arranged in the interface region 13 between the supply device 5 and the measurement system 4. According to... Figure 3In the schematic diagram, the interface area 13 is symbolized by a rectangle depicted in dashed lines.

[0222] exist Figure 3 In the exemplary embodiment shown, the measurement system 4 is further preferably arranged in an isolation box 14, which protects the measurement system 4 from airborne noise. Figure 3 In the middle, the isolation box 14 is symbolized by a rectangle depicted in dashed lines.

[0223] exist Figure 3 In the embodiment shown, the decoupling device 11 has contactless transmission devices 15 for gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0224] In particular, the transmission device 15 may be a non-contact seal as explained below, especially a gap seal 16a and / or a labyrinth seal 16b.

[0225] Figure 4 A schematic diagram of a possible embodiment of a transmission device 15 for a gas connection 8 and / or a liquid connection 9 and / or a vacuum connection 10 is shown.

[0226] exist Figure 4 In the exemplary embodiment shown, the transmission device 15 is in the form of a gap seal 16a or a labyrinth seal 16b. The labyrinth seal 16b has an engaging arrangement 17 to prevent the outflow of the medium flowing in connections 8, 9, and 10, wherein the medium... Figure 4 The middle is represented by the flowing arrow 18.

[0227] Preferably, the flow of the medium indicated by flow arrow 18 is shut off or interrupted during the measurement operation of device 1. This prevents destructive flow noise, vibration, and structurally transmitted sound during the measurement.

[0228] exist Figure 4 In the exemplary embodiment shown, the decoupling device 11 accordingly has a gap seal 16a and / or a labyrinth seal 16b, which are arranged at at least one point of the gas connection 8 and / or the liquid connection 9 and / or the vacuum connection 10.

[0229] exist Figure 4 In the exemplary embodiment shown, the gap seal 16a and / or the labyrinth seal 16b also have a sealing air device 19 for increasing the sealing effect. Figure 4 In the exemplary embodiment shown, the sealing air device 19 has at least one nozzle element to seal air at a suitable angle and with a suitable flow profile relative to the gap and / or labyrinth of the gap seal 16a and / or labyrinth seal 16b, respectively.

[0230] exist Figure 4 In the exemplary embodiment shown, the sealing air device 19 is preferably configured for sealing air suction removal.

[0231] Figure 5 A schematic diagram of another possible embodiment of device 1 is shown.

[0232] exist Figure 5 In the exemplary embodiment shown, the decoupling device 11 preferably has an actuated moving mechanism 20.

[0233] according to Figure 5 In an exemplary embodiment of the device 1 shown, the decoupling device 11 is configured to disconnect and / or connect data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0234] exist Figure 5 In a specific exemplary embodiment of the device 1 shown, the moving mechanism 20 is configured to preferably quickly disconnect and / or connect data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0235] In addition, according to Figure 5 An exemplary embodiment of the device 1 shown indicates that the decoupling device 11 has at least one data carrier 21 and / or at least one charge storage unit 22 and / or at least one gas storage unit 23 and / or at least one liquid container 24 and / or at least one vacuum accumulator device 25. Figure 5 In the specific exemplary embodiment shown, the vacuum accumulator device 25 is implemented by the vacuum-sealed housing of the measurement system 4, which is sufficiently tight to maintain a vacuum environment at least for the duration of the measurement.

[0236] exist Figure 5 In the exemplary embodiment of device 1 shown, the data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10 preferably have such low stiffness that vibrations transmitted from the supply device 5 to the measuring system 4 are suppressed. This is particularly advantageous if no disconnection is provided during measurement.

[0237] Preferably, in Figure 5 In an exemplary embodiment of the device 1 shown, the data connection 6 and / or the current connection 7 and / or the gas connection 8 and / or the liquid connection 9 and / or the vacuum connection 10 have a stiffness of 0.1 N / mm to 100 N / mm, preferably 0.1 N / mm to 50 N / mm, more preferably 0.2 N / mm to 10 N / mm, and particularly 0.2 N / mm to 2 N / mm.

[0238] exist Figure 3 and Figure 5 Mechanical oscillations or vibrations that can be emitted from or transmitted by the supply device 5, the ground, and / or the air are shown as stylized waves.

[0239] Figure 6 A similar block diagram illustrating a possible embodiment of a method for measuring component 2 is shown.

[0240] exist Figure 6 In the method shown, to measure component 2, particularly the optical component 2 of the lithography system, a measurement system 4 mounted in a vibration-damping manner is used in the measurement block 30 to measure component 2. In the supply block 31, the supply device 5 supplies the measurement system 4 via at least one data connection 6 for transmitting data between the supply device 5 and the measurement system 4 and / or at least one current connection 7 for transmitting electrical energy between the supply device 5 and the measurement system 4 and / or via at least one gas connection 8 for transmitting at least one gas between the supply device 5 and the measurement system 4 and / or at least one liquid connection 9 for transmitting at least one liquid between the supply device 5 and the measurement system 4 and / or at least one vacuum connection 10 for transmitting vacuum between the supply device 5 and the measurement system 4. In the decoupling block 32, the measurement system 4 is at least partially mechanically decoupled from the supply device 5, at least during the measurement of component 2.

[0241] exist Figure 6 In the exemplary embodiment shown, in the context of supply block 31 and / or decoupling block 32, data is preferably transmitted wirelessly via data connection 6.

[0242] Furthermore, in the context of decoupling block 32 and / or measuring block 30, electrical energy is preferably transmitted at least partially contactlessly, particularly inductively, via current connection 7.

[0243] In the context of supply block 31 and / or decoupling block 32, Figure 6 In the exemplary embodiment shown, at least one gas and / or at least one liquid and / or vacuum are preferably transmitted at least substantially without contact, preferably without contact, at at least one point of the gas connection 8 and / or liquid connection 9 and / or vacuum connection 10 via gap seal 16a and / or labyrinth seal 16b.

[0244] exist Figure 6 In the context of the decoupling block 32 of the exemplary embodiment of the method shown, it may be specified that data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10 are disconnected before the measurement of component 2 and / or re-closed after the measurement of component 2.

[0245] exist Figure 6In the exemplary embodiment shown, in the context of the measuring block 30, the measuring system 4 can preferably operate partially or completely autonomously during the measurement of the component 2.

[0246] exist Figure 6 In the exemplary embodiment shown, in the context of supply block 31 and / or decoupling block 32, prior to measurement of component 2, preferably at least data carrier 21 and / or at least charge storage unit 22 and / or at least gas storage unit 23 and / or at least liquid container 24 and / or at least vacuum accumulator device 25 can be loaded via data connection 6 and / or current connection 7 and / or gas connection 8 and / or liquid connection 9 and / or vacuum connection 10.

[0247] exist Figure 6 In the exemplary embodiment shown, with the supply block 31 in mind, during the measurement of component 2, the measurement system 4 is preferably supplied at least in part by the data carrier 21 and / or the charge storage unit 22 and / or the gas storage unit 23 and / or the liquid container 24 and / or the vacuum accumulator device 25.

[0248] Figure 1 and Figure 2 The diagram shows a photolithography system, particularly a projection exposure apparatus 100, 200 for semiconductor photolithography, which has an illumination system 101, 201 and a radiation source 102 and optical units 103, 109, 206, the optical units 103, 109, 206 having at least one optical component 116, 118, 119, 120, 121, 122, Mi, 207.

[0249] exist Figure 1 and Figure 2 In the case of the projection exposure apparatus 100 and 200 shown, at least one of the optical components 116, 118, 119, 120, 121, 122, Mi, and 207 uses a combination at least partially. Figures 3 to 5 The device 1 described above is used to measure and / or at least partially utilize a combination of Figure 6 The methods outlined are for measurement.

[0250] Therefore, in Figure 1 and Figure 2 In the case of the projection exposure devices 100 and 200 shown, by means of device 1 and / or combined Figure 6 The component 2 measured by the method is preferably one of optical components 116, 118, 119, 120, 121, 122, Mi, and 207.

[0251] The device 1 according to the invention and the method according to the invention are particularly suitable for reflectors Mi.

[0252] The following is for reference. Figure 3The second invention is described in principle. In the second invention, an apparatus 1 or a corresponding method for the lithography system itself is provided. In the second invention, the lithography system is configured as follows... Figure 3 The method shown constitutes measurement system 4. For the purpose of describing the second invention only, the following references... Figure 3 Reference numeral 4 is used for the lithography system. The following statements apply accordingly to the method for carrying out the second invention. According to the second invention, device 1 is specified for use in a lithography system 4 having at least one vibration isolator device 3, or the lithography system is part of device 1. The lithography system 4 is specified to be mounted on at least one vibration isolator device 3. Furthermore, a supply device 5 is provided for supplying the lithography system 4. This supply is achieved via at least one data connection 6 for transmitting data between the supply device 5 and the lithography system 4 and / or a current connection 7 for transmitting electrical energy between the supply device 5 and the lithography system 4 and / or a gas connection 8 for transmitting at least one gas between the supply device 5 and the lithography system 4 and / or a liquid connection 9 for transmitting at least one liquid between the supply device 5 and the lithography system 4 and / or a vacuum connection 10 for transmitting vacuum between the supply device 5 and the lithography system 4. A decoupling device 11 is provided and configured to mechanically decouple the lithography system 4 from the supply device 5, at least partially, at least during a predefined period of operation, such as during maintenance, operation, or adjustment. The lithography system 4 may also involve only components of the lithography system 4, particularly the projection system or illumination optics unit 103 or the exposure system or illumination system 101. The second invention is based on the concept that the apparatus for measuring components according to the invention and the method for measuring components according to the invention can also be used for the lithography system itself, and not only for measuring components subsequently inserted into the lithography system.

[0253] List of reference numerals

[0254] 1 device

[0255] 2 components

[0256] 3 Vibration Isolator Device

[0257] 4 Measurement System

[0258] 5. Supply devices

[0259] 6 Data Connection

[0260] 7 Current Connection

[0261] 8 Gas Connection

[0262] 9 Liquid Connection

[0263] 10 Vacuum Connection

[0264] 11 Decoupling device

[0265] 12. Sensing device

[0266] 13 Interface Area

[0267] 14 Isolation Box

[0268] 15. Transmission device

[0269] 16a gap seal

[0270] 16b labyrinth seal

[0271] 17 Meshing Arrangement

[0272] 18 Flowing arrows

[0273] 19. Sealed air device

[0274] 20 Sports Organizations

[0275] 21 Data carriers

[0276] 22 charge storage units

[0277] 23 Gas storage unit

[0278] 24 Liquid containers

[0279] 25 Vacuum accumulator device

[0280] 30 measuring blocks

[0281] 31 Supply Block

[0282] 32 Decoupling Block

[0283] 100EUV projection exposure equipment

[0284] 101 Lighting System

[0285] 102 radiation source

[0286] 103 Illumination Optical Unit

[0287] 104 Sites

[0288] 105 object plane

[0289] 106 mask master

[0290] 107 Mask Master Retainer

[0291] 108 Mask Master Displacement Driver

[0292] 109 projection optical units

[0293] 110 image field

[0294] 111 Image Plane

[0295] 112 chip

[0296] 113 chip holder

[0297] 114-chip displacement driver

[0298] 115 EUV / used / lighting radiation

[0299] 116 light collector

[0300] 117 intermediate focal plane

[0301] 118 deflecting mirror

[0302] 119 First-faceted reflector / Field-faceted reflector

[0303] 120 First Division / Field Division

[0304] 121 Second facet mirror / Pupil facet mirror

[0305] 122 Second facet / Pupil facet

[0306] 200DUV projection exposure equipment

[0307] 201 Lighting System

[0308] 202 Mask Master Platform

[0309] 203 Mask Master

[0310] 204 chip

[0311] 205 chip holder

[0312] 206 projection optical units

[0313] 207 lens element

[0314] 208 installation parts

[0315] 209 Lens Housing

[0316] 210 projected beam

[0317] Mi reflector

Claims

1. An apparatus (1) for measuring a component (2), particularly an optical component (2) of a lithography system, the apparatus (1) having at least one vibration isolator device (3), a measuring system (4) mounted on the at least one vibration isolator device (3), and a supply device (5) for supplying to the measuring system (4) via at least the following connection: - A data connection (6) for transmitting data between the supply device (5) and the measuring system (4), and / or - A current connection (7) for transferring electrical energy between the supply device (5) and the measuring system (4), and / or - A gas connection (8) for transferring at least one gas between the supply device (5) and the measuring system (4), and / or - A liquid connection (9) for transferring at least one liquid between the supply device (5) and the measuring system (4), and / or - A vacuum connection (10) for transferring vacuum between the supply device (5) and the measuring system (5), Its features are, A decoupling device (11) is provided, which is configured to mechanically decouple the measurement system (4) from the supply device (5) at least partially during the measurement of the component (2).

2. The device (1) according to claim 1. Its features are, The decoupling device (11) is configured to form at least a partial wireless structure of the data connection (6).

3. The device (1) according to claim 1 or 2. Its features are, The decoupling device (11) has a sensing device (12) which is capable of inductively transmitting the electrical energy at at least one point of the current connection (7) without contact.

4. The device (1) according to any one of claims 1 to 3. Its features are, The decoupling device (11) has a gap seal (16a) and / or a labyrinth seal (16b) arranged at at least one point of the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

5. The device (1) according to claim 4. Its features are, The gap seal (16a) and / or the labyrinth seal (16b) have a sealing air device (19) for increasing the sealing effect.

6. The device (1) according to any one of claims 1 to 5. Its features are, The decoupling device (11) is arranged in the interface area (13) between the supply device (5) and the measurement system (4).

7. The device (1) according to any one of claims 1 to 6. Its features are, The decoupling device (11) has an actuated motion mechanism (20).

8. The device (1) according to any one of claims 1 to 7. Its features are, The decoupling device (11) is configured to disconnect and / or connect the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

9. The device (1) according to any one of claims 1 to 8. Its features are, The decoupling device (11) has at least one data carrier (21) and / or at least one charge storage unit (22) and / or at least one gas storage unit (23) and / or at least one liquid container (24) and / or at least one vacuum accumulator device (25).

10. The device (1) according to any one of claims 1 to 9. Its features are, The data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) have such low stiffness that the transmission of vibration from the supply device (5) to the measuring system (4) is at least largely suppressed.

11. The device (1) according to any one of claims 1 to 10. Its features are, The data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) have a stiffness of 0.1 N / mm to 100 N / mm, preferably 0.1 N / mm to 50 N / mm, more preferably 0.2 N / mm to 10 N / mm, and particularly 0.2 N / mm to 2 N / mm.

12. A method for using a measuring component (2) of a measurement system (4) mounted in a vibration-damping manner, particularly an optical component (2) of a lithography system, wherein, The supply device (5) supplies the measuring system (4) at least via the following connection: - A data connection (6) for transmitting data between the supply device (5) and the measuring system (4), and / or - A current connection (7) for transferring electrical energy between the supply device (5) and the measuring system (4), and / or - A gas connection (8) for transferring at least one gas between the supply device (5) and the measuring system (4), and / or - A liquid connection (9) for transferring at least one liquid between the supply device (5) and the measuring system (4), and / or - A vacuum connection (10) for transferring vacuum between the supply device (5) and the measuring system (4), Its features are, The measurement system (4) is mechanically decoupled at least partially from the supply device (5) at least during the measurement of the component (2).

13. The method according to claim 12, Its features are, The data is wirelessly transmitted via the data connection (6).

14. The method according to claim 12 or 13, Its features are, The electrical energy is at least partially inductively transmitted via the current connection (7).

15. The method according to any one of claims 12 to 14, Its features are, The at least one gas and / or the at least one liquid and / or the at least one vacuum are transmitted at at least one point of the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) via a gap seal (16a) and / or a labyrinth seal (16b).

16. The method according to any one of claims 12 to 15, Its features are, The data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10) are disconnected before the measurement of the component (2) and / or reconnected after the measurement of the component (2).

17. The method according to any one of claims 12 to 16, Its features are, The measurement system (4) operates partially or completely autonomously during the measurement of the component (2).

18. The method according to any one of claims 12 to 17, Its features are, Before measuring the component (2), at least one data carrier (21) and / or at least one charge storage unit (22) and / or at least one gas storage unit (23) and / or at least one liquid container (24) and / or at least one vacuum energy storage device (25) are loaded via the data connection (6) and / or the current connection (7) and / or the gas connection (8) and / or the liquid connection (9) and / or the vacuum connection (10).

19. The method according to claim 18, Its features are, During the measurement of the component (2), the measurement system (4) is supplied at least in part by the data carrier (21) and / or the charge storage unit (22) and / or the gas storage unit (23) and / or the liquid container (24) and / or the vacuum energy storage device (25).

20. A photolithography system, particularly a projection exposure apparatus (100, 200) for semiconductor photolithography, comprising an illumination system (101, 201) and optical units (103, 109, 206), the illumination system (101, 201) having a radiation source (102), and the optical units (103, 109, 206) having at least one optical component (116, 118, 119, 120, 121, 122, Mi, 207). Its features are, At least one of the optical components (116, 118, 119, 120, 121, 122, Mi, 207) is at least partially measured by means of the following: -The device (1) as claimed in any one of claims 1 to 11 and / or - The method as described in any one of claims 12 to 19.

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