A UV-curable solvent-free hot press adhesive and its preparation method

By using UV-cured solvent-free hot press adhesive, the problems of low production efficiency, significant safety hazards, and severe VOC emissions associated with solvent-based hot press adhesives in the manufacturing of lithium-ion batteries and consumer electronics have been solved. This approach achieves rapid curing, solvent-free emissions, shorter production cycles, and improved safety, meeting the demands of high-efficiency production.

CN120865832BActive Publication Date: 2026-05-26滁州都铂新材料科技有限公司 +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
滁州都铂新材料科技有限公司
Filing Date
2025-09-28
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing solvent-based thermosetting adhesives suffer from low production efficiency, significant safety hazards, long production cycles, and severe VOC emissions in the manufacturing of lithium-ion batteries and consumer electronics. Furthermore, solvent-free thermosetting adhesives have slow curing speeds that cannot meet the requirements for efficient and continuous production.

Method used

The UV-curable solvent-free hot-press adhesive consists of liquid polybutadiene, polyurethane acrylate oligomer, ester-soluble thermoplastic polyurethane, polyfunctional acrylate monomers, monofunctional acrylate monomers, hydroxyl acrylate monomers, phosphate ester adhesion promoters, photoinitiators, and end-capped isocyanates. It achieves rapid curing triggered by UV light, combined with hot-press final curing, thus realizing solvent-free full-process curing.

Benefits of technology

It achieves solvent-free emissions, improved production efficiency, shortened production cycle, enhanced safety, reduced energy consumption, improved raw material utilization, and adhesive layer performance that meets the structural bonding requirements of lithium-ion batteries and consumer electronics.

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Abstract

This invention discloses a UV-curable solvent-free hot-press adhesive and its preparation method, belonging to the field of polymer materials. The UV-curable solvent-free hot-press adhesive contains 9 components by weight, including 5-10 parts of liquid polybutadiene and 10-20 parts of polyurethane acrylate oligomer. In the preparation process, some raw materials are first mixed, ester-soluble TPU is added for dissolution, a photoinitiator is added in the dark, and end-capping isocyanate is added after cooling. The application requires three steps: coating, UV curing (wavelength 365-405nm, light intensity 150mJ / cm²), and hot-pressing (120-140℃). Compared with traditional hot-press adhesives, it has no VOC emissions, high production efficiency, low energy consumption, and excellent adhesion performance (peel force 17.3-33.5N / 25mm).
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Description

Technical Field

[0001] This invention relates to the field of polymer materials technology, specifically to a UV-curable solvent-free hot press adhesive and its preparation method. Background Technology

[0002] In the manufacturing process of lithium-ion battery packs and consumer electronics, hot-melt adhesives are widely used for bonding and fixing battery end plates or end films, as well as for the insulation, protection, and fixing of flexible flat cables (FFCs). Currently, solvent-based hot-melt adhesive tapes or their films are the mainstream materials used in this field.

[0003] The typical production process is as follows: the synthesized solid adhesive block is dissolved in organic solvents such as toluene, acetone, and ethyl acetate to form a high-solids-content adhesive solution. This solution is then coated onto a release film or substrate using a coating machine to form an adhesive film. This adhesive film must pass through a long heated drying tunnel (usually tens of meters long) to force the evaporation and removal of the organic solvents, completing the initial drying and curing (pre-curing). Finally, it is wound up to obtain the finished tape. After winding, the tape usually needs to be "aged" in a temperature-controlled warehouse for 3 days to allow residual solvents to further escape and stabilize the adhesive layer properties.

[0004] In use, the operator cuts the tape to the desired shape, peels off the release film, and applies it to the object to be bonded (such as a battery side panel or FFC). Then, a hot press is used to apply pressure at a temperature of 120°C to 140°C for hot pressing bonding. During this process, the adhesive layer melts and wets the surface of the object to be bonded, while a second stage of curing occurs at high temperature. After cooling, the bond is achieved.

[0005] However, this existing technology has the following significant drawbacks:

[0006] The long heating and drying tunnel is the core of the production line's energy consumption. In order to ensure that the solvent evaporates completely, the coating line speed is strictly limited, which seriously restricts production efficiency and increases manufacturing costs.

[0007] The production cycle is long: the "maturation" time of several days occupies a lot of inventory space and capital turnover time, which cannot meet the demand of modern manufacturing for rapid response and prolongs the delivery cycle.

[0008] There are potential safety and performance risks during use: If solvent residue is not completely removed, it may continue to evaporate during subsequent high-temperature hot pressing or use of the end product, leading to defects such as bubbles, edge lifting, and delamination. It may even cause corrosion and other safety hazards to the sensitive lithium battery cells.

[0009] Therefore, developing a new type of adhesive that can completely replace existing solvent-based hot-press tapes, fundamentally solve VOC emissions, shorten production cycles, and improve production efficiency and safety has become an urgent technological need in the field of lithium battery and consumer electronics packaging materials. Although solvent-free thermosetting hot-press adhesives exist, their curing speed is slow and they still require a long post-curing period, which cannot meet the requirements of efficient continuous production. Summary of the Invention

[0010] The purpose of this section is to outline some aspects of the embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0011] Therefore, the purpose of this invention is to provide a UV-curable solvent-free hot-press adhesive and its preparation method. This hot-press adhesive contains no organic solvents, eliminating VOC emissions at the source; it cures rapidly via UV light triggering, reaching its strength immediately after curing, eliminating the need for a lengthy post-curing process and greatly improving production efficiency.

[0012] To address the aforementioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0013] A UV-curable solvent-free hot press adhesive, by weight, comprises the following raw material components: 5-10 parts liquid polybutadiene, 10-20 parts polyurethane acrylate oligomer, 5-15 parts ester-soluble thermoplastic polyurethane, 10-25 parts polyfunctional acrylate monomer, 35-45 parts monofunctional acrylate monomer, 1-5 parts hydroxy acrylate monomer, 1-5 parts phosphate ester adhesion promoter, 1-5 parts photoinitiator, and 5-10 parts end-capped isocyanate.

[0014] As a preferred embodiment of the UV-curable solvent-free hot press adhesive described in this invention, the liquid polybutadiene is one or more of conventional low molecular weight liquid polybutadiene, hydroxyl-terminated liquid polybutadiene, and acrylate-modified polybutadiene.

[0015] As a preferred embodiment of the UV-curable solvent-free hot press adhesive described in this invention, the polyurethane acrylate oligomer is one or more of CR92060, U-CURE9579, U-CURE9583, and CR93667.

[0016] As a preferred embodiment of the UV-curable solvent-free hot press adhesive described in this invention, the ester-soluble thermoplastic polyurethane is one or more of FRR-302, FRR-301, and 8160.

[0017] As a preferred embodiment of the UV-curable solvent-free hot press adhesive of the present invention, the polyfunctional acrylate monomer is one or more of 1,6-hexanediol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane triethoxytriacrylate, and trimethylolpropane nonethoxytriacrylate.

[0018] As a preferred embodiment of the UV-curable solvent-free hot press adhesive described in this invention, the monofunctional acrylate monomer is one or more of isobornyl acrylate, tetrahydrofuran acrylate, phenoxyethyl acrylate, cyclotrimethylolpropane methyl acetal acrylate, 2-ethylhexyl acrylate, and butyl acrylate.

[0019] As a preferred embodiment of the UV-curable solvent-free hot press adhesive described in this invention, the hydroxy acrylate monomer is one or more of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, and hydroxypropyl methacrylate.

[0020] As a preferred embodiment of the UV-curable solvent-free hot press adhesive of the present invention, the phosphate ester adhesion promoter is one or more of PM-2, 6051A, M221, and HC5110, and the photoinitiator is one or more of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1-hydroxycyclohexylphenyl ketone, and benzophenone.

[0021] As a preferred embodiment of the UV-curable solvent-free hot press adhesive described in this invention, the end-capped isocyanate is one or more of PT-1085, PT-1105, E-1070, and EN-1075.

[0022] A method for preparing a UV-curable solvent-free hot-press adhesive includes the following steps:

[0023] S1. Heat 5-10 parts of liquid polybutadiene, 10-20 parts of polyurethane acrylate oligomer, 10-25 parts of polyfunctional acrylate monomer, 35-45 parts of monofunctional acrylate monomer, 1-5 parts of hydroxy acrylate monomer, and 1-5 parts of phosphate ester adhesion promoter to 40°C and stir until completely dissolved and mixed evenly.

[0024] S2. Then add 5-10 parts of ester-soluble thermoplastic polyurethane while stirring, raise the temperature to 50°C, and dissolve for 2-3 hours to fully dissolve it into a homogeneous liquid.

[0025] S3. Then, add 1-5 parts of photoinitiator in a light-protected environment, dissolve it completely, and finally add 5-10 parts of end-capped isocyanate after cooling. Pack the resulting material to obtain UV-curable solvent-free hot press adhesive.

[0026] The present invention also provides a method for applying the UV-curable solvent-free hot-press adhesive, comprising the following steps:

[0027] Coating: Applying hot-press adhesive to the surface of substrates such as PET by means of roller coating or blade coating.

[0028] UV curing: The coated surface is irradiated with ultraviolet light (wavelength 365~405nm, light intensity 150 mJ / cm²) to initiate a free radical polymerization reaction of the adhesive layer, achieving the first stage of curing and immediately reaching the winding strength.

[0029] Bonding: Press the adhesive surface to the substrate, with the surface temperature of the pressing board at 120~140℃. During this process, the adhesive surface develops initial tack due to the temperature rise, fully adhering to the substrate. The end-capped isocyanates in the adhesive layer are unsealed, and further cured and cross-linked with the hydroxyl groups on the substrate surface and in the adhesive layer, achieving a high structural bonding strength.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] 1. Liquid polybutadiene provides excellent flexibility, hydrolysis resistance, low-temperature resistance, and initial tack in the system of this invention; polyurethane acrylate provides high curing reactivity and final cohesive strength and flexibility; ester-soluble thermoplastic polyurethane (TPU) is used in the formulation to toughen and increase initial tack, and it has good compatibility with the acrylate system. It can also act as a low-shrinkage agent to reduce volume shrinkage during free radical curing, thus improving the mechanical properties of the adhesive film; polyfunctional acrylate monomers have low viscosity, high reactivity, and low skin irritation, and are used to adjust the system viscosity and increase the curing speed; monofunctional acrylate monomers are used to further adjust the viscosity, curing rate, and the flexibility and adhesion of the cured adhesive layer; hydroxyl acrylate monomers are used to introduce hydroxyl groups into the system to facilitate further crosslinking and curing with the end-capped isocyanate during the later hot-pressing process; phosphate ester adhesion promoters are used to significantly improve the adhesion of the adhesive to substrates such as PET and metals; photoinitiators are used for the first stage of film formation and curing; and end-capped isocyanates are used for hot-pressing curing during final application.

[0032] 2. No organic solvents are used throughout the process, eliminating VOC emissions at the source. There is no need to build an exhaust gas treatment system, which reduces the company's environmental protection costs and protects the health of operators. UV curing only takes 5-10 seconds to reach the winding strength, completely eliminating the 3-day curing process. At the same time, there is no need for long drying tunnel heating, and the coating line speed can be increased by 2-3 times (from the existing solvent-based 5-10m / min to 15-25m / min), which significantly shortens the production cycle and reduces inventory and capital occupation.

[0033] 3. Eliminating the energy consumption of heating and constant temperature curing in the drying tunnel reduces production energy consumption by more than 40%. Simultaneously, there is no solvent evaporation loss, increasing raw material utilization to over 99% (compared to 85-90% for existing solvent-based raw materials), further reducing raw material costs. The absence of solvent residue avoids problems such as bubbles, curling, and delamination. Through a two-step process of "UV pre-curing + hot-pressing final curing," the peel strength of the adhesive layer can reach 17.3-33.5 N / 25 mm, and the shear strength can reach 6.2-8.2 MPa, meeting the structural bonding requirements of lithium-ion batteries and consumer electronics. Furthermore, the absence of solvent corrosion risk enhances the safety of end products. Detailed Implementation

[0034] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below.

[0035] Example 1

[0036] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMPTA, 25 parts IBOA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, the mixture is cooled and 7 parts PT-1085 are added to obtain the UV-curable hot-press adhesive.

[0037] Example 2

[0038] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP3EOTA, 25 parts IBOA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, the mixture is cooled and 7 parts PT-1085 are added to obtain the UV-curable hot-press adhesive.

[0039] Example 3

[0040] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP9EOTA, 25 parts IBOA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, the mixture is cooled and 7 parts PT-1085 are added to obtain the UV-curable hot-press adhesive.

[0041] Example 4

[0042] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP3EOTA, 20 parts IBOA, 5 parts CTFA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, 7 parts PT-1085 are added after cooling to obtain the UV-curable hot-press adhesive.

[0043] Example 5

[0044] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP3EOTA, 20 parts IBOA, 5 parts CTFA, 10 parts THFA, 5 parts EHA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, the mixture is cooled and 7 parts PT-1085 are added to obtain the UV-curable hot-press adhesive.

[0045] Example 6

[0046] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP3EOTA, 20 parts IBOA, 5 parts CTFA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-302 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, 7 parts PT-1085 are added after cooling to obtain the UV-curable hot-press adhesive.

[0047] Example 7

[0048] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP3EOTA, 20 parts IBOA, 5 parts CTFA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts PM-2 are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, the mixture is cooled and 7 parts PT-1085 are added to obtain the UV-curable hot-press adhesive.

[0049] Example 8

[0050] A UV-curable hot-press adhesive is prepared by the following steps: 7 parts liquid polybutadiene EP-MAT, 15 parts polyurethane acrylate oligomer CR92060, 6 parts TPGDA, 9 parts TMP3EOTA, 20 parts IBOA, 5 parts CTFA, 10 parts THFA, 5 parts BA, 4 parts HEA, and 2 parts 6051A are heated to 40°C and stirred until completely dissolved and uniformly mixed. Then, 6 parts FRR-301 are added while stirring, and the temperature is increased to 50°C. The mixture is dissolved for 2-3 hours to form a homogeneous liquid. Subsequently, 3 parts TPO and 1 part 184 are added under a light-protected environment and dissolved completely. Finally, 7 parts EN-1075 are added after cooling to obtain the UV-curable hot-press adhesive.

[0051] Example 9

[0052] A UV-curable hot-melt adhesive, and its preparation method comprises the following steps: Heat 7 parts of liquid polybutadiene EP-MAT, 15 parts of polyurethane acrylate oligomer CR92060, 6 parts of TPGDA, 9 parts of TMP3EOTA, 20 parts of IBOA, 5 parts of CTFA, 10 parts of THFA, 5 parts of BA, 4 parts of HEA, and 2 parts of 6051A to 40 °C, and stir until completely dissolved and mixed evenly. Then add 6 parts of FRR-301 while stirring, raise the temperature to 50 °C, and dissolve for 2 - 3 hours until it is fully dissolved into a homogeneous liquid. Subsequently, add 3 parts of TPO and 1 part of BP in a light-shielded environment and dissolve them fully. Finally, cool down and add 7 parts of PT-1085 to obtain the UV-curable hot-melt adhesive.

[0053] Example 10

[0054] A UV-curable hot-melt adhesive, and its preparation method comprises the following steps: Heat 7 parts of liquid polybutadiene EP-MAT, 15 parts of polyurethane acrylate oligomer CR92060, 6 parts of TPGDA, 9 parts of TMP3EOTA, 20 parts of IBOA, 5 parts of CTFA, 10 parts of THFA, 5 parts of BA, 4 parts of HEMA, 2 parts of 6051A to 40 °C, and stir until completely dissolved and mixed evenly. Then add 6 parts of FRR-301 while stirring, raise the temperature to 50 °C, and dissolve for 2 - 3 hours until it is fully dissolved into a homogeneous liquid. Subsequently, add 3 parts of TPO and 1 part of 184 in a light-shielded environment and dissolve them fully. Finally, cool down and add 7 parts of PT-1085 to obtain the UV-curable hot-melt adhesive.

[0055] The performance test results of the UV-curable solvent-free hot-melt adhesives prepared in Examples 1 - 10 are shown in Table 1;

[0056] Table 1 Performance test results of the UV-curable solvent-free hot-melt adhesives prepared in Examples 1 - 10

[0057]

[0058] As shown in the test results of Table 1:

[0059] Influence of multi-functional acrylate monomers: Comparing Example 1 (TMPTA), Example 2 (TMP3EOTA), and Example 3 (TMP9EOTA), as the length of the ethoxy chain in the multi-functional monomer increases (TMPTA < TMP3EOTA < TMP9EOTA), the dissolution rate gradually slows down (+++ → ++ → +), but the peel strength significantly increases (17.3 → 25.1 → 31.6 N / 25 mm). The reason is that the ethoxy chain can improve the compatibility between the monomer and TPU and increase the flexibility of the adhesive layer; however, the shear strength slightly decreases (8.2 → 7.9 → 7.1 MPa) because the long-chain structure may reduce the crosslinking density.

[0060] Effect of monofunctional acrylate monomers: In Example 4, CTFA (replacing part of IBOA) was added based on Example 2, and the peel strength was further improved to 32.1 N / 25 mm with low odor residue; In Example 5, EHA was used to replace BA. Although the peel strength was the highest (33.5 N / 25 mm), the odor residue was slightly higher and the shear strength was reduced to 6.2 MPa, indicating that BA is more suitable for the balance of odor and strength of the system.

[0061] Effect of ester-soluble TPU: In Example 6, FRR-302 was used instead of FRR-301. The dissolution rate was slower (+), but the peel strength (32.4 N / 25 mm) and shear strength (7.9 MPa) remained excellent, indicating that FRR-301 had better dissolution efficiency.

[0062] Effect of phosphate ester accelerator: In Example 7, when PM-2 was used instead of 6051A, the peel force decreased to 28.6 N / 25 mm and the shear strength decreased to 6.8 MPa, proving that 6051A had a more significant effect on improving adhesion.

[0063] Effects of capped isocyanates and photoinitiators: In Example 8, EN-1075 was used instead of PT-1085, and in Example 9, BP was used instead of 184. The performance of both was slightly reduced, but still met the requirements. In Example 10, HEMA was used instead of HEA, and the performance was stable, indicating that the choice of hydroxy acrylate monomer has little impact on the system.

[0064] In summary, Example 4 is the optimal solution: it has a fast dissolution rate (++), low odor residue, and high peel strength (32.1 N / 25 mm) and shear strength (7.7 MPa). It has the best overall performance and fully meets the requirements for bonding lithium-ion battery side plates and FFC.

[0065] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, as long as there is no structural conflict, the features in the disclosed embodiments can be combined with each other in any manner. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A UV-curable solvent-free hot-press adhesive, characterized in that, The product comprises, by weight, the following raw material components: 5-10 parts liquid polybutadiene, 10-20 parts polyurethane acrylate oligomer, 5-15 parts ester-soluble thermoplastic polyurethane, 10-25 parts polyfunctional acrylate monomer, 35-45 parts monofunctional acrylate monomer, 1-5 parts hydroxy acrylate monomer, 1-5 parts phosphate ester adhesion promoter, 1-5 parts photoinitiator, and 5-10 parts end-capped isocyanate, wherein the end-capped isocyanate is one or more of PT-1085, PT-1105, E-1070, and EN-1075. The preparation method of UV-curable solvent-free hot-press adhesive includes the following steps: S1. Heat 5-10 parts of liquid polybutadiene, 10-20 parts of polyurethane acrylate oligomer, 10-25 parts of polyfunctional acrylate monomer, 35-45 parts of monofunctional acrylate monomer, 1-5 parts of hydroxy acrylate monomer, and 1-5 parts of phosphate ester adhesion promoter to 40°C and stir until completely dissolved and mixed evenly. S2. Then add 5-10 parts of ester-soluble thermoplastic polyurethane while stirring, raise the temperature to 50°C, and dissolve for 2-3 hours to fully dissolve it into a homogeneous liquid. S3. Then, add 1-5 parts of photoinitiator in a light-protected environment, dissolve it completely, and finally add 5-10 parts of end-capped isocyanate after cooling. Pack the resulting material to obtain UV-curable solvent-free hot press adhesive.

2. The UV-curable solvent-free hot-press adhesive according to claim 1, characterized in that, The liquid polybutadiene is one or more of the following: conventional low molecular weight liquid polybutadiene, hydroxyl-terminated liquid polybutadiene, and acrylate-modified polybutadiene.

3. The UV-curable solvent-free hot-press adhesive according to claim 1, characterized in that, The polyurethane acrylate oligomer is one or more of CR92060, U-CURE9579, U-CURE9583, and CR93667.

4. The UV-curable solvent-free hot-press adhesive according to claim 1, characterized in that, The ester-soluble thermoplastic polyurethane is one or more of FRR-302, FRR-301, and 8160.

5. The UV-curable solvent-free hot press adhesive according to claim 1, characterized in that, The polyfunctional acrylate monomer is one or more of 1,6-hexanediol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane triethoxytriacrylate, and trimethylolpropane nonethoxytriacrylate.

6. The UV-curable solvent-free hot-press adhesive according to claim 1, characterized in that, The monofunctional acrylate monomer is one or more of isobornyl acrylate, tetrahydrofuran acrylate, phenoxyethyl acrylate, cyclotrimethylolpropane methyl acetal acrylate, 2-ethylhexyl acrylate, and butyl acrylate.

7. The UV-curable solvent-free hot-press adhesive according to claim 1, characterized in that, The hydroxyacrylate monomer is one or more of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, and hydroxypropyl methacrylate.

8. The UV-curable solvent-free hot-press adhesive according to claim 1, characterized in that, The phosphate ester adhesion promoter is one or more of PM-2, 6051A, M221, and HC5110, and the photoinitiator is one or more of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1-hydroxycyclohexylphenyl ketone, and benzophenone.