A multi-band imaging device based on an objective lens turntable

Abstract

The application discloses a kind of multi-band imaging devices based on objective turntable, including infrared camera, screen, objective turntable, first lens, second lens, visible light camera, visible light optical path component;Infrared camera is connected with objective turntable by support, screen is fixed in the front of infrared camera;Visible light camera and visible light optical path component are fixed in the side of infrared camera by screw, two pieces of reflector are provided in visible light optical path component;First lens and second lens are all arranged on objective turntable, objective turntable can rotate around its axis to switch first lens and second lens to the middle position in front, and the application relates to chip failure analysis detection technical field.The application solves the problems of complex structure, cumbersome use process and inconvenient chip probe contact operation caused by the separation of visible light imaging part and infrared detection part in traditional chip failure analysis detection equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip failure analysis detection, in particular to a multi-band imaging device based on an objective lens turntable. BACKGROUND

[0002] In the whole life cycle of chip research and development, production and use, various failure problems are prone to occur due to factors such as design defects, manufacturing process deviations, and use environment influences. In order to clarify the chip failure mode, failure mechanism and root cause, detection work needs to be carried out through chip failure analysis detection equipment, and then design optimization and process improvement suggestions are put forward to avoid repeated failure and improve the reliability of components. In the chip failure analysis detection process, probe chip point contact test and infrared detection are two core key steps, which directly affect the accuracy and efficiency of failure analysis.

[0003] At present, the mainstream chip failure analysis detection equipment adopts a "visible light observation + infrared detection" separate module design, and its working process and structure are as follows:

[0004] Visible light observation stage: microscopically observe the chip through a visible light microscope to confirm the physical damage on the chip surface, and complete the probe chip point contact test operation based on the observation results;

[0005] Infrared detection stage: after completing the probe chip point contact test, the visible light module needs to be moved to the side of the equipment, and then the infrared detection module is lowered along the Z-axis to the working position. The infrared camera detects the chip after the probe chip point contact test to locate the defect position.

[0006] However, the above prior art has the following significant defects:

[0007] High structural complexity and large equipment size: the visible light module and the infrared module are independent structures, and a module moving mechanism needs to be designed additionally, which leads to a complex overall structure of the equipment, a significant increase in size and weight;

[0008] High Z-axis height requirement and safety hazards: in the process of visible light observation and probe chip point contact test, in order to avoid the infrared module blocking the working space of the visible light microscope, the infrared module needs to be raised to a higher position along the Z-axis, which not only significantly increases the overall height of the equipment, but also may cause collision between the visible light module and the lens below the infrared camera due to operation errors when manually switching the visible light module;

[0009] Complicated detection process and low efficiency: each time the "visible light probe chip point contact test and infrared detection" switching is completed, the visible light module needs to be manually moved and the Z-axis height of the infrared module needs to be adjusted, which is repeated and time-consuming, increases the complexity of the detection process, and reduces the efficiency of failure analysis. SUMMARY

[0010] In order to solve the problems of complex structure, cumbersome use process and inconvenient chip probe contact operation caused by the separated modules of visible light imaging part and infrared detection part in the traditional chip failure analysis detection equipment, the purpose of the present application is to provide a multi-band imaging device based on an objective lens turntable.

[0011] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme: a multi-band imaging device based on an objective lens turntable, comprising an infrared camera, a screen, an objective lens turntable, a first lens, a second lens, a visible light camera and a visible light optical path assembly; the infrared camera is connected with the objective lens turntable through a support, and the screen is fixed in front of the infrared camera; the visible light camera and the visible light optical path assembly are fixed on the left or right side of the infrared camera through screws, and two reflecting mirrors are arranged in the visible light optical path assembly; the first lens and the second lens are arranged on the objective lens turntable, and the objective lens turntable can rotate around its own axis to switch the first lens and the second lens to the middle position in front; when switched to the visible light mode, the objective lens turntable rotates the first lens to the middle position in front, at this time, the pipe diameter of the light path of the first lens corresponds to the pipe diameter of the visible light optical path assembly, the visible light reflected by the chip enters the visible light optical path assembly through the first lens, and is conducted to the visible light camera through the two reflecting mirrors; when switched to the infrared mode, the objective lens turntable rotates the second lens to the middle position in front, at this time, the infrared camera is directly above the second lens to conduct infrared detection on the chip after being pricked.

[0012] Preferably, the first lens is a lens suitable for visible light imaging, the second lens is a lens suitable for infrared imaging, and other lenses different from the first lens and the second lens can be additionally arranged on the objective lens turntable to expand the multi-band imaging range.

[0013] Preferably, the two reflecting mirrors in the visible light optical path assembly are arranged at a preset included angle, and the preset included angle is set according to the conduction path requirement of the visible light to ensure that the visible light reflected by the chip can be accurately and losslessly conducted to the photosensitive area of the visible light camera.

[0014] Preferably, the visible light camera and the visible light optical path assembly are fixed on the left or right side of the infrared camera through screws, and the fixed position can be fine-tuned by adjusting the tightness of the screws to adapt to the detection requirements of chips of different sizes.

[0015] Preferably, the objective lens turntable can be replaced by a linear module or a gear and rack structure; when the linear module is adopted, the first lens and the second lens are fixed on the slider of the linear module, and the lens switching is realized by the linear motion of the slider; when the gear and rack structure is adopted, the first lens and the second lens are fixed on the rack, and the lens switching is realized by driving the rack to move through the gear.

[0016] Preferably, the screen is electrically connected with the visible light camera, for displaying the chip imaging picture output by the visible light camera in real time, the display resolution of the screen is adapted to the imaging resolution of the visible light camera, so that the microstructure of the chip is clearly presented, and the operator can complete the chip observation and the probe chip point contact test operation.

[0017] Preferably, the support is a height-adjustable structure, and the distance between the infrared camera and the objective lens turntable can be finely adjusted by adjusting the height of the support, so as to adapt to the first lens and the second lens with different focal lengths and ensure the imaging clarity.

[0018] Compared with the prior art, the present application has the following beneficial effects:

[0019] 1. The infrared camera, the visible light camera and the objective lens turntable are integrated by the support and the screw, so that the Z-axis lifting mechanism and the module push-pull mechanism of the existing equipment are omitted, and the Z-axis structure height and the overall volume and mass of the equipment are greatly reduced.

[0020] 2. The infrared module does not need to be frequently lifted or the visible light module does not need to be frequently moved, so that the collision risk in the module switching process is avoided, and the operator can more conveniently complete the probe chip point contact test operation under the visible light mode.

[0021] 3. The present application only needs to rotate the objective lens turntable to realize the switching between the visible light mode and the infrared mode, so that the repeated steps of moving the module and adjusting the height in the existing equipment are omitted, the detection process is significantly simplified, and the chip failure analysis efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] The present application will be further described in detail below in combination with the drawings and specific embodiments:

[0023] Figure 1 The figure is a schematic view of the overall structure of the present application.

[0024] In the figure: 1, infrared camera; 2, screen; 3, objective lens turntable; 4, first lens; 5, second lens; 6, visible light camera; 7, visible light light path assembly. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be described below by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in the present specification.

[0026] Please refer to Figure 1It is to be understood that the structures, proportions, sizes, etc. shown in the drawings accompanying the present specification are merely intended to facilitate the understanding of the content disclosed in the present specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which the present application can be implemented, and therefore do not have technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that can be achieved by the present application, should still fall within the scope of the technology disclosed by the present application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are merely for the purpose of clear understanding of the description, and are not intended to limit the scope of the present application, and the change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the scope of the present application.

[0027] The present application provides a technical solution: a multi-band imaging device based on an objective lens turntable, comprising an infrared camera 1, a screen 2, an objective lens turntable 3, a first lens 4, a second lens 5, a visible light camera 6, a visible light optical path assembly 7, a bracket and a screw; wherein:

[0028] The infrared camera 1 is fixedly connected with the objective lens turntable 3 through the bracket, so as to fix the relative position of the infrared camera 1 and the objective lens turntable 3;

[0029] The screen 2 is fixed in front of the infrared camera 1, and is used for displaying the imaging picture in real time;

[0030] The visible light camera 6 and the visible light optical path assembly 7 are fixed on the side of the infrared camera 1 through the screw, and can be on the left side or the right side, which is adjusted according to the equipment layout requirement;

[0031] The visible light optical path assembly 7 is internally provided with two reflecting mirrors, which are used for changing the visible light transmission path;

[0032] The first lens 4 and the second lens 5 are both installed on the objective lens turntable 3, and the objective lens turntable 3 can rotate around its own axis to realize the switching of the first lens 4 and the second lens 5 to the "front middle working position"; wherein the first lens 4 is a lens suitable for visible light imaging, and the second lens 5 is a lens suitable for infrared imaging.

[0033] When micro-observation and probe chip point contact test operation of the chip are needed, the objective lens turntable 3 is controlled to rotate around its own axis to switch the first lens 4 to the front middle position; at this time, the light path diameter of the first lens 4 accurately corresponds to the diameter of the visible light optical path assembly 7, the visible light reflected from the surface of the chip enters the visible light optical path assembly 7 through the first lens 4 in sequence, and is accurately transmitted to the visible light camera 6 after changing the transmission direction through the two reflecting mirrors inside the assembly; the visible light camera 6 transmits the imaging signal to the screen 2, and the operator observes the microstructure of the chip in real time through the screen 2 to complete the probe chip point contact test operation.

[0034] After the probe chip point contact test is completed, without moving any module, only control the objective lens turntable 3 to rotate around its own axis, switch the second lens 5 to the front middle position; at this time, the upper side of the second lens 5 is aligned with the photosensitive area of the infrared camera 1, the infrared camera 1 receives the infrared signal of the chip radiation through the second lens 5, realizes the infrared detection of the chip after the probe chip point contact test, and locates the defect position.

[0035] When a linear module is used instead of the objective lens turntable 3, the first lens 4 and the second lens 5 are fixed on the two sliders of the linear module respectively, and the target lens first lens 4 or second lens 5 is moved to the front middle working position by controlling the slider to move along the guide rail through PLC; when a gear and rack structure is used instead of the objective lens turntable 3, the first lens 4 and the second lens 5 are fixed on the rack, and the lens switching is realized by driving the gear to rotate through the servo motor, which drives the rack to move, the working principle is consistent with the switching mode of the objective lens turntable, only the movement form is different.

[0036] Infrared camera 1: select an industrial grade infrared camera with a resolution of not less than 1280x1024, to ensure the accuracy of defect detection;

[0037] Screen 2: select a high-definition liquid crystal screen with imaging resolution compatible with visible light camera 6, which can be 1920x1080 resolution, and is electrically connected with visible light camera 6 through data line to realize real-time imaging display;

[0038] Objective lens turntable 3: adopt a rotary turntable driven by a stepping motor, the diameter of the turntable is designed according to the size of the first lens 4 and the second lens 5, to ensure that the two lenses can be stably installed and there is no jam when rotating and switching;

[0039] First lens 4 and second lens 5: the first lens 4 selects a visible light special objective lens with a focal length of 20mm, which is suitable for 400-760nm waveband, and the second lens 5 selects an infrared special objective lens with a focal length of 25mm, which is suitable for 8-14μm waveband;

[0040] Visible light camera 6: select an industrial grade visible light camera with not less than 5 million pixels, to ensure clear imaging of chip microstructure;

[0041] Visible light optical path assembly 7: adopt a metal shell, the two pieces of reflecting mirror inside are selected to be optical reflecting mirror coated with anti-reflection film, the two pieces of reflecting mirror are arranged at a 90° angle, and the setting is according to the requirement of visible light transmission path, to ensure that the visible light is transmitted to the photosensitive area of the visible light camera 6 without loss;

[0042] Support: adjustable height support of aluminum alloy material, the height adjustment range of the support is 50-100mm, the height is locked by bolt, the distance between the infrared camera 1 and the objective turret 3 can be fine adjusted according to the focal length of the first lens 4 and the second lens 5, and the imaging clarity is ensured.

[0043] The above embodiments only illustrate the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical idea disclosed by the present application should be covered by the claims of the present application.

Claims

1. A multi-band imaging device based on an objective lens turret, characterized in that, The system includes an infrared camera (1), a screen (2), an objective lens turntable (3), a first lens (4), a second lens (5), a visible light camera (6), and a visible light optical path assembly (7). The infrared camera (1) is connected to the objective lens turntable (3) via a bracket, and the screen (2) is fixed in front of the infrared camera (1). The visible light camera (6) and the visible light optical path assembly (7) are fixed to the side of the infrared camera (1) by screws, and the visible light optical path assembly (7) contains two reflectors. The first lens (4) and the second lens (5) are both mounted on the objective lens turntable (3), which can rotate around its own axis to cut... Replace the first lens (4) and the second lens (5) with the front center position; when switching to visible light mode, the objective lens turret (3) rotates the first lens (4) to the front center position. At this time, the diameter of the optical path tube of the first lens (4) corresponds to the diameter of the visible light optical path assembly (7). The visible light reflected by the chip enters the visible light optical path assembly (7) through the first lens (4) and is transmitted to the visible light camera (6) through two mirrors; when switching to infrared mode, the objective lens turret (3) rotates the second lens (5) to the front center position. At this time, the infrared camera (1) is directly above the second lens (5) to perform infrared detection on the chip after it has been touched by the probe; The first lens (4) is a lens adapted for visible light imaging, the second lens (5) is a lens adapted for infrared imaging, and other lenses with different functions from the first lens (4) and the second lens (5) can be added to the objective lens turntable (3) to expand the multi-band imaging range. The two reflectors in the visible light optical path assembly (7) are arranged at a preset angle. The preset angle is set according to the requirements of the visible light transmission path to ensure that the visible light reflected by the chip can be transmitted to the photosensitive area of ​​the visible light camera (6) without loss and with precision. The visible light camera (6) and the visible light optical path assembly (7) are fixed to the left or right side of the infrared camera (1) by screws, and the fixed position can be finely adjusted by adjusting the tightness of the screws to adapt to the detection requirements of chips of different sizes.

2. The multi-band imaging device based on an objective lens turret according to claim 1, characterized in that, The objective lens turntable (3) can be replaced by a linear module or a gear rack structure. When a linear module is used, the first lens (4) and the second lens (5) are fixed on the slider of the linear module, and the lens switching is achieved by the linear movement of the slider. When a gear rack structure is used, the first lens (4) and the second lens (5) are fixed on the rack, and the lens switching is achieved by the gear driving the rack to move.

3. The multi-band imaging device based on an objective lens turret according to claim 1, characterized in that, The screen (2) is electrically connected to the visible light camera (6) and is used to display the chip imaging image output by the visible light camera (6) in real time. The display resolution of the screen (2) is adapted to the imaging resolution of the visible light camera (6) to clearly present the microstructure of the chip and assist the operator in completing chip observation and probe chip point contact test operations.

4. The multi-band imaging device based on an objective lens turret according to claim 1, characterized in that, The bracket is a height-adjustable structure. By adjusting the height of the bracket, the distance between the infrared camera (1) and the objective lens turntable (3) can be finely adjusted to accommodate the first lens (4) and the second lens (5) with different focal lengths, thus ensuring image clarity.

Images