Cable assembly, computing system, and method for using a wired OCP connector

Abstract

An apparatus, system, and method. The apparatus includes an OCP connector including an OCP socket, a cable connector, a first attachment feature, and a second attachment feature. The OCP socket can be configured to receive an OCP edge connector of an OCP module. The cable connector can be configured to receive one end of a cable, where the other end of the cable can be coupled with a host system board. The first attachment feature can be configured to attach the OCP connector to a horizontal support. The second attachment feature can be configured to attach the OCP connector to a vertical support. Either support can be used to couple the OCP connector with a computer system without modification of the OCP connector.

Description

Technical Field

[0001] This disclosure generally relates to the field of connectors. Background Technology

[0002] Server computing systems can be configured to use pluggable modules, such as hot-swappable storage drives, network interface cards (NICs), etc. These pluggable modules can be designed to insert into bays that can be accessed from outside the server without opening the chassis. Some bays can be located on the front panel of the chassis for front access, while others can be located on the rear panel for rear access. Pluggable modules can have various form factors specified by various standards, including those specified by the Open Computing Project (OCP)—for example, network interface cards (NICs) are often deployed as OCP modules. Some pluggable modules, such as storage drives, are typically deployed in both front and rear accessible bays, but OCP modules are typically used in rear accessible bays. Summary of the Invention

[0003] A first aspect of this disclosure provides a cable assembly comprising: a cable; an Open Compute Project (OCP) connector connected to a first end of the cable and including a receptacle configured to mate with an edge connector of an OCP module, a first attachment feature coupled to the receptacle, and a second attachment feature coupled to the receptacle; a second connector connected to a second end of the cable and configured to mate with a connector mounted to a main system board of an information processing device; wherein the first attachment feature is configured to attach the OCP connector to a horizontal support of the information processing device, the horizontal support being parallel to a mating axis of the receptacle; and wherein the second attachment feature is configured to mount the OCP connector to a vertical support of the information processing device, the vertical support being perpendicular to the mating axis of the receptacle.

[0004] A second aspect of this disclosure provides a computing system comprising: a chassis configured to house a main system board; the main system board mechanically coupled to the chassis, the main system board including a connector; a front accessible bracket configured to receive a removable module via a front panel of the chassis; a vertical support positioned adjacent to the front accessible bracket, the vertical support coupled to the chassis or a portion thereof; a rear accessible bracket configured to receive a removable module via a rear panel of the chassis; a horizontal support supporting the main system board, the horizontal support coupled to the chassis or a portion thereof; and a wired OCP connector comprising: a cable; an Open Compute Project (OCP) connector connected to a first end of the cable and including a connector... A receptacle configured to mate with an edge connector of an OCP module, a first attachment feature coupled to the receptacle, and a second attachment feature coupled to the receptacle; and a second connector, connected to a second end of the cable and mates with a connector on the main system board; wherein the first attachment feature is configured to attach the OCP connector to the horizontal support such that the receptacle is positioned to receive an edge connector of an OCP module inserted into the rear accessible bracket, the mating axis of the receptacle being parallel to the horizontal support; and wherein the second attachment feature is configured to mount the OCP connector to the vertical support such that the receptacle is positioned to receive an edge connector of an OCP module inserted into the front accessible bracket, the mating axis of the receptacle being perpendicular to the vertical support.

[0005] A third aspect of this disclosure provides a method for using a wired OCP connector, comprising: mounting the wired OCP connector to a chassis by either: attaching a first attachment feature of the wired OCP connector to a horizontal support, wherein the horizontal support is parallel to an OCP edge socket and a cable socket; or attaching a second attachment feature to a vertical support, wherein the vertical support is perpendicular to the OCP edge socket and the cable socket; and connecting the cable to the cable socket and a corresponding connector on a main system board, wherein the OCP edge socket is configured to mate with an edge connector of an OCP module, and wherein the cable socket is configured to mate with a cable. Attached Figure Description

[0006] This disclosure may be understood solely from the following detailed description, or it may be understood in conjunction with the accompanying drawings. The drawings are included to provide a further understanding of this disclosure and are incorporated in and form part of this specification. The drawings illustrate one or more examples of the teachings and, together with the description, explain certain principles and operations. In the figures:

[0007] Figure 1 This is a block diagram illustrating an example of a computer system including a wired OCP connector.

[0008] Figure 2A This is a perspective view of a wired OCP connector.

[0009] Figure 2B yes Figure 2A Another perspective view of the wired OCP connector in the image.

[0010] Figure 2C yes Figure 2A Another perspective view of the wired OCP connector in the image.

[0011] Figure 3 It is a perspective view of two wired OCP connectors and a vertical support.

[0012] Figure 4 This is a view of a wired OCP connector mounted on a horizontal support, with the OCP module in the mounting position.

[0013] Figure 5 This is a schematic diagram of a wired OCP connector installed on a riser frame.

[0014] Figure 6 This is a perspective view of two wired OCP connectors and a vertical support, with the two OCP modules in their mounting positions.

[0015] Figure 7 This is a perspective view of two wired OCP connectors installed in a dual-purpose rack.

[0016] Figure 8 An example process flow using a wired OCP connector is shown.

[0017] The accompanying drawings are included to provide a further understanding of this disclosure, and are incorporated into and form part of this specification. The drawings illustrate one or more examples of the present teachings and, together with the description, explain certain principles and operations. In some cases, details that are not necessary for understanding examples of this disclosure or that may make other details difficult to perceive may be omitted. Detailed Implementation

[0018] As mentioned above, OCP modules are typically used in rear-accessible drive bays on the rear panel of a server chassis. Specifically, the OCP module is usually directly connected to the system board via an OCP connector, which is mounted across the rear edge of the system board to receive the OCP module inserted through the rear panel, where the OCP module is parallel and coplanar with the system board. In some cases, it may be desirable to locate the OCP module on the front panel of the information processing system (e.g., a server). This may be ideal, for example, because a rear-mounted OCP module may result in insufficient cooling, as the module in the rear bay may receive air preheated by other components of the server. Moving the OCP module to the front of the server may help improve cooling performance.

[0019] However, positioning the OCP module on the front panel of the server can be challenging. Specifically, providing a standard straddle-type OCP connector at the front edge of the system board to receive OCP modules inserted through the front panel may be impractical because the distance between the front panel and the front edge of the system board may be too large. Furthermore, there may be components such as fans between the front panel and the system board that could obstruct OCP modules inserted through the front panel and prevent them from reaching the connector.

[0020] In some cases, in addition to rear or front accessible brackets, it may be necessary to position the OCP module in other locations within the information processing equipment. However, standard OCP connectors mounted to the main system board are often located in positions and / or orientations that are inconvenient for direct mounting of the OCP module. For example, some connectors on the system board may require the OCP module to be oriented perpendicular to the system board, which is not feasible in many systems where the height of the system is insufficient. Other system board connectors may be positioned close to other components, leaving insufficient space for direct connection of the OCP module to the system board connector. Other system board connectors may also be positioned such that the OCP module connected to them will receive insufficient airflow, obstruct airflow to other components, and / or be inconvenient to access. Therefore, directly connecting the OCP module to a system board connector in an external location on the rear OCP bracket may not be feasible, or, if feasible, may be inconvenient.

[0021] To address these and other issues, this paper discloses a wired OCP connection system that allows the OCP module to be installed in any of a variety of locations within an information processing device, while being indirectly connected to the main system board via a cable. The wired OCP connection system may include a cable having an OCP connector at one end for connection to the OCP module and another connector at the other end for connection to the system board connector of the main system board. This allows the OCP module to be installed in various locations, such as the front bracket, rear bracket, or other locations within the chassis, because the position of the OCP connector is not limited by the position or orientation of the system board connector.

[0022] The OCP connector can be configured to attach to a support structure adjacent to the tray that receives the OCP module. Attaching the OCP connector to the support structure aligns and supports the OCP connector relative to the tray, enabling blind mating with the OCP module inserted into the tray. Blind mating means that the user applies force to insert the module into the tray without seeing or manually aligning the connector or handling it in any way, thus automatically mating the module's connector and the tray together. This contrasts with loosely connecting a connector at one end of a cable to the module, which may require manual alignment and control by the user, potentially necessitating opening the chassis and causing inconvenience.

[0023] Furthermore, the cable's OCP connector can be a multi-functional OCP connector, capable of attaching to various different support structures in different locations within the chassis. For example, the support structure in the rear OCP tray may differ from that in the front tray, but the OCP connector can likely connect to either of these support structures. This versatility makes it easier to deploy the OCP connector to various locations within the chassis, at least including front-accessible or rear-accessible configurations that use the same OCP connector in any location. In other words, because a single type of wired OCP connector can be used in any of a variety of installation locations, there is no need to design and manufacture multiple different types of cables with different OCP connectors (each cable specifically designed for one type of installation location). Using a single cable design, rather than many different cable designs for many different installation locations, reduces development, manufacturing, and logistical costs. Furthermore, the versatility of the connectors allows for easier reconfiguration of the system after it has been manufactured. For example, the OCP module can be moved from one mounting location (e.g., rear bracket) to another (e.g., front bracket) by simply disassembling, moving, and reconnecting the existing OCP connectors, while avoiding the hassle and cost of first obtaining new connectors designed for the new mounting location.

[0024] Example wired OCP connectors may have an OCP edge socket on one side, such as a 4C or 4C+ edge socket. These sockets can use edge sockets defined by standards such as SFF-TA-1002. The other side can be configured to receive conductors (wires) of a cable, which are permanently connected (e.g., soldered) to conductive contacts (pins) of the socket. The other end of the conductor is permanently connected to one or more connectors at the other end of the cable. These additional connectors are then connected to corresponding connectors on the main system board housed in the chassis, for example, for data or power connections. For example, a Mini Cool Edge IO (MCIO) connector socket can be used as a main system board connector, and a corresponding MCIO plug can be used as a connector at the second end of the cable.

[0025] Wired OCP connectors can have two sets of attachment features, allowing for at least two different methods of attachment to the server. The first attachment feature attaches the wired OCP connector to a horizontal support via a fastener extending from a mating axis perpendicular to the OCP edge socket. The second attachment feature attaches the wired OCP connector to a vertical support via a fastener extending from a mating axis parallel to the OCP edge socket. Either set of attachment features can be used without changing the wired OCP connector or its orientation within the chassis. Both attachment features may be available simultaneously. The ability of the OCP connector to attach to different types of supports (e.g., horizontal and vertical supports) facilitates mounting the OCP connector in different locations within the chassis where different types of related supports may exist—for example, the front bracket of the chassis may have vertical supports, to which the OCP connector can be attached (using the second attachment feature), while the rear bracket of the chassis may have horizontal supports, to which the same OCP connector can also be attached (using the first attachment feature).

[0026] The first attachment feature may include a horizontal wall configured to be parallel to and engage with a horizontal support. The horizontal wall may include one or more holes to allow fasteners (e.g., screws) to pass through and engage with the horizontal support. One or more protrusions may be present on the side of the horizontal wall engaging with the horizontal support, configured to engage complementary recesses on the horizontal support to aid in aligning the wired OCP connector by controlling the position of the wired OCP controller relative to the horizontal support when the wired OCP connector is attached to the horizontal support. The protrusions may be, for example, small cylindrical pillars with a domed top or elongated ridge. Any size, shape, or number of protrusions may be used. The horizontal support may be, for example, a motherboard tray or baseplate of a computing system chassis. In some examples, holes and recesses in the motherboard tray or baseplate facilitating OCP connector attachment may be positioned near a rear-accessible OCP tray, such that when the OCP connector is attached, it is positioned in the rear OCP tray to receive the connector of the OCP module inserted into the OCP tray.

[0027] The second attachment feature may include a vertical fin protruding from and extending along the top of the wired OCP connector. The vertical fin includes one or more holes for receiving fasteners, and the fin is configured such that the holes through the fin are parallel to the mating axis of the OCP edge socket. Fasteners (e.g., screws) may pass through the holes in the fin and engage with the vertical support. The fin is configured to contact the vertical support parallel to it when the OCP connector is attached, such that the engagement between the vertical fin and the vertical support constrains the OCP connector and provides additional support against connector rotation (tilting) when the OCP module mates with it. One or more protrusions may be present on the side of the fin facing the vertical support, configured to engage complementary recesses on the vertical support to aid in aligning the wired OCP connector by controlling the position of the wired OCP controller relative to the vertical support when the wired OCP connector is attached to it. The protrusions may be, for example, small cylindrical pillars with a domed top or elongated ridges. Protrusions of any size, shape, or number can be used. In some examples, the vertical support may be a metal frame attached at the front panel of the chassis to the rear of a drive rack, which includes one or more trays capable of receiving OCP modules (e.g., with adapters). The frame includes one or more mounting positions for OCP connectors, arranged such that the OCP connectors attached thereto are positioned in corresponding trays of the drive rack to receive connectors of OCP modules inserted into the trays. The frame and the OCP connectors(s) mounted thereto together form the backplate of the drive rack. Alternatively, the vertical support may be a metal frame configured to couple to a riser cage, which is configured to accommodate one or more expansion cards at the rear of the chassis. The riser cage may be configured to receive one or more wired OCP connectors connected to one or more expansion cards. Other rack configurations may be used. For example, a single rack may be configured as a dual-purpose rack, capable of accommodating one or more storage drives and one or more OCP modules within the same rack structure. Alternatively, the rack structure can be configured to accommodate one or more OCP modules in any configuration, either side-by-side or stacked.

[0028] The manufacturing process for wired OCP connectors is simplified by using a single-format wired OCP connector that can be deployed in multiple configurations. There is no need to use different versions of connectors depending on the deployment method and location. A single stock unit (SKU) can be used, thereby reducing manufacturing and logistics costs.

[0029] Figure 1An example computer system 100 is shown, which includes an OCP cable assembly 130, which includes a wired OCP connector 160. The computer system 100 may be a server, a networking device, or other computing device. The OCP cable assembly 130 is configured for use in the computer system, and therefore is described and illustrated herein in the context of the computer system 100 to aid understanding. Furthermore, in some cases, the OCP cable assembly 130 may be supplied (manufactured, sold, etc.) as part of such a computer system; therefore, some examples disclosed herein include computer systems with the cable assembly 130 installed. However, the OCP cable assembly 130 may optionally be supplied (manufactured, sold, etc.) separately from the system 100; therefore, some examples disclosed herein include the OCP cable assembly 130 itself.

[0030] Computer system 100 includes a chassis 110, within which is a main system board 120. The main system board 120 may be, for example, a host processor module (HPM) or a motherboard. The main system board 120 includes various components, such as one or more processors, memory, etc. (not shown), which will be familiar to those skilled in the art. Furthermore, the main system board includes one or more connectors 121 configured to receive corresponding one or more second connectors 135 of the OCP cable assembly 130. Connector 121 may be, for example, an MCIO connector. Although a single connector 121 is shown, multiple connectors 121 may be present.

[0031] The chassis 110 may contain one or more rear-accessible trays 140 and one or more front-accessible trays 150. Each tray 140 and 150 may be configured to receive an OCP module. One or more front trays 150 are positioned at the front panel of the chassis 110 and are configured to receive an OCP module inserted into the chassis 110 from a location outside the front side of the chassis 110. One or more rear trays 140 are positioned at the rear panel of the chassis 110 and are configured to receive an OCP module inserted into the chassis 110 from a location outside the rear side of the chassis 110. In some examples, the chassis 110 may also have trays (not shown) for receiving other modules; in some implementations, these trays may include front trays configured to receive storage drives, such as enterprise and data center standard form factor (EDSFF) storage drives. In some of these examples, at least one front bracket 150 for receiving an OCP module is formed from a subset of front brackets for receiving storage drives (e.g., two front storage drive brackets may be combined to form a front OCP module bracket 150). An adapter is attached to the OCP module to enable it to be mounted in a bracket configured to receive a storage drive, as described in U.S. Patent Application 18 / 628,888, filed April 8, 2024, entitled "Adapter for OCP Module," the entire contents of which are incorporated herein by reference. In other words, in some examples, the front bracket 150 may be configured to interchangeably receive an OCP module or one or more other modules, such as storage drives. In other examples, the front OCP bracket 150 may be configured to naturally receive an OCP module without the need for an adapter.

[0032] The front bracket 150 may be part of a pluggable module rack, which is a compartment within the chassis 110 for accommodating and defining the bracket 150. In some examples, such a pluggable module rack may be a drive rack defining storage drive bays, some or all of which may also form the front OCP bracket 150 using adapters as described above. Each bracket 140, 150 may include engagement features to engage OCP modules, guide them to a mounting position, and support the OCP modules after installation. For example, the rear bracket 140 may include two parallel rails attached to the base plate of the chassis 110 and configured to engage with the side edges of the OCP module's PCB when the OCP module is inserted into the rear bracket 140. As another example, the front bracket 150 may be part of a drive rack for a storage drive and may include protrusions (flanges) configured to engage with engagement features of a storage drive inserted therein or an OCP adapter attached to an OCP module, the OCP adapter allowing the OCP module to be inserted into the bracket 150.

[0033] OCP cable assembly 130 includes a wired OCP connector 160 at one end, one or more second connectors 135 at the opposite end, and a cable 170 including a plurality of conductors 131 extending therebetween. It is worth noting that in everyday use, "cable" may sometimes refer to the entire assembly including the electrical conductors and the connectors connected to its ends, while at other times it may refer more specifically to a bundle of electrical conductors. To avoid confusion, "cable" is used herein to refer to a bundle of electrical conductors, and "cable assembly" is used herein to refer to the combination of electrical conductors and the connectors attached thereto. The wired OCP connector 160 includes an OCP receptacle 161 configured to mate with (receive) a complementary OCP edge connector of the OCP module, and to be electrically connected thereto when mated. For example, the receptacle 161 of the wired OCP connector 160 may be configured as an OCP 4C or 4C+ receptacle. Each second connector 135 is configured to mate with (receive) a complementary connector 121 of the main system board 120. For example, connector 121 can be configured as an MCIO socket, and second connector 135 can be configured as an MCIO plug. One end of conductor 131 is electrically connected to a corresponding electrical contact (e.g., a pin) of wired OCP connector 160, and the other end is electrically connected to a corresponding electrical contact (e.g., a pin) of second connector(s) 135. Thus, when the OCP module mates with OCP connector 160, the OCP module is electrically connected to system board 120 via an electrical path including OCP connector 160, conductor 131, and (one or more) second connectors 135. Conductors 131 can be bundled together to form one or more cables 170. In some examples, conductor 131 is permanently electrically connected to the electrical contacts of OCP connector 160 and second connector 135, for example, by soldering, crimping, etc. (In this case, "permanent" means that the component is not designed for connection / disconnection during normal use; for example, disconnection of the component would require physical changes to one or more assembly parts or fasteners, such as melting, deformation, cutting, tearing, etc.).

[0034] By positioning the OCP connector 160 in a mounting location and attaching it to a corresponding support at that location, the OCP connector 60 can be installed in any of a variety of mounting locations within the computer system 100. These mounting locations include at least one or more front brackets 150 and one or more rear brackets 140. In some examples, mounting locations may also include those in a riser rack. In some examples, mounting locations may include additional mounting locations. The OCP cable assembly 130 allows the OCP connector 160 to be positioned in any mounting location, while the second connector 135 remains connected to the system board 120, and the cable 170 allows cabling around intermediate components such as fans. The OCP connector 160 is also configured to be mounted to the chassis 110 by attaching it to any of a variety of supports that are part of or coupled to the chassis 110, and this ability to attach to different types of supports facilitates the installation of the OCP connector 60 in a variety of mounting locations. The OCP connector 160 may include several different attachment features, which will be described in more detail below, enabling it to be attached to different types of supports in different mounting locations.

[0035] As described above, the mounting locations of the OCP connector 160 include mounting locations at the rear bracket 140 and the front bracket 150, and in some examples, mounting locations at riser racks or other locations. When the OCP connector 160 is mounted in one of the rear bracket 140 or the front bracket 150, the OCP connector 60 may be positioned near or within the respective bracket 140 or 150, such that the OCP module inserted into the bracket 140 or 150 is guided to blindly mate with the OCP socket 161 during insertion. When the OCP connector 160 is mounted in a riser rack, the OCP connector 60 may be arranged to mate with the edge connector of an OCP module mounted as an expansion card in the riser rack. When the OCP connector 160 is mounted in another mounting location within the chassis 110, the OCP connector 60 may be arranged to mate with the edge connector of an OCP module mounted to an adjacent mounting location on the chassis 100. In some examples of system 100, each bracket 140, 150 may house a wired OCP connector 160 of a corresponding OCP cable assembly 130 to receive an OCP module. For example, for each bracket 140 and 150, a first OCP cable assembly 130 may house its OCP connector 160 in a first rear bracket 140, a second OCP cable assembly 130 may house its OCP connector 160 in a first front bracket 150, and so on (note that brackets 140 and 150 do not necessarily include all brackets in system 100). In other examples, each bracket 140 and 150 may be able to house an OCP connector 160, but currently only some brackets 140, 150 may house wired OCP connectors. For example, the OCP connector 160 of the first OCP cable assembly may initially be installed in the rear bracket 140 but not in the front bracket 150, and the same OCP connector 160 may later be repositioned from the rear bracket 140 to the front bracket 150, and vice versa. As another example, the OCP connector 160 of the first OCP cable assembly 130 may initially be installed in the rear bracket 140, but the OCP connector may not be installed in the front bracket 150, and then a second OCP cable assembly 130 may be added, whose OCP connector 160 may be installed in the front bracket 150, and vice versa.

[0036] System 100 may also include one or more horizontal supports 180 and one or more vertical supports 190. These supports 180 and 190 are either part of chassis 110 or directly or indirectly mechanically coupled to chassis 110. Supports 180 and 190 are two types of supports that are examples of the aforementioned set of supports to which OCP connector 160 is configured to be attached and to mount OCP connector 160 to chassis 110. The horizontal supports 180 may include a generally flat horizontal surface that engages with the attachment features of the OCP connector in the mounted state of system 100 and when OCP connector 160 is attached to the horizontal supports 180, while the vertical supports 190 may include a generally flat vertical surface that engages with the attachment features of the OCP connector in the mounted state of system 100 and when OCP connector 160 is attached to the vertical supports 190. As used herein, horizontal means a direction or orientation parallel to the component bearing surface of the main system board 120, and vertical means a direction or orientation perpendicular to the horizontal; these directions as defined herein are relative to the system board 120 and do not imply any limitation on any direction relative to an external reference frame (e.g., the ground).

[0037] In some examples, the horizontal support 180 includes a portion of the motherboard tray or base plate of the chassis 110 adjacent to one of the rear brackets 140, such that mounting the OCP connector 160 at the rear bracket 140 includes attaching the OCP connector 160 to the horizontal support 180. For example, an OCP rail may be attached to the motherboard tray or base plate, adjacent to an opening in the rear panel and extending in a front-rear direction to define the rear bracket 140 therebetween, and the OCP connector 160 may be attached to the horizontal support 180 near the front end of the OCP rail to mate with an OCP module inserted into the bracket 140.

[0038] In some examples, the vertical support 190 includes a vertical panel attached to the chassis 110 at the front bracket 150, such that mounting the OCP connector 160 to the front bracket 150 includes attaching the OCP connector 160 to the vertical support 190. In some of these examples, the vertical panel forming the vertical support 190 may be configured to receive a plurality of OCP connectors 160 attached thereto, each OCP connector being positioned aligned with a corresponding one in the front bracket 150. In some examples, the front bracket 150 may be part of the drive rack and the vertical panel, and may form its backplate. In some examples, the vertical support 190 may include a support for a riser rack. For example, the riser rack may include a vertical rear plate, vertically coupled vertical side plates, and a horizontal top plate coupled to the rear and side plates. A vertical support 190 may be positioned on the front side of the riser rack opposite the rear plate and coupled to one or both of the top or side plates. An OCP connector 160 faces rearward into the internal space within the riser rack. In some examples, system 100 includes multiple vertical supports 190, including one vertical support 190 adjacent to the front carriage 150 (e.g., forming the back plate of the drive rack) and another vertical support that is part of the riser rack.

[0039] The wired OCP connector 160 includes a first attachment feature 162 and a second attachment feature 166, each attachment feature being connected to an OCP edge socket 161. The first attachment feature 162 is configured to engage with a horizontal support 180 to attach the wired OCP connector 160 thereto. The second attachment feature 166 is configured to engage with a vertical support 190 to attach the wired OCP connector 160 thereto. These features will be described in more detail below.

[0040] The first attachment feature 162 may include a horizontal wall 163. The horizontal wall 163 is configured to be parallel to and engage with the horizontal support 180 when the wired OCP connector 160 is attached to the horizontal support 180. The horizontal wall 163 may include one or more fastening elements 164 configured to engage directly or indirectly with corresponding fastening elements 184 of the horizontal support 180 to secure the OCP connector 160 to the horizontal support 180. In some examples, fastening elements 164 engage directly with fastening elements 184; for example, fastening element 164 may be configured as a latch, and fastening element 184 may be configured as an interlocking latch receiver (or vice versa). In other examples, fastening elements 164 engage indirectly with fastening elements 184 via individual fasteners (not shown), which engage with each other. The fasteners may be screws, rivets, or any other mechanical fasteners. For example, fastening element 164 may include a hole through horizontal wall 163, while fastening element 184 may include a fastener receiver (not shown) (e.g., nut, threaded sleeve, threaded hole, bore, etc.) attached to horizontal support 180 such that a fastener can extend through the hole of fastening element 164 and into the fastener receiver of fastening element 184, and vice versa.

[0041] In some examples, the horizontal wall 163 may also include a first protrusion. One or more first holes may be configured to receive fasteners for attaching the wired OCP connector 160 to the horizontal support 180. For example, screws or finger screws may be used. One or more first protrusions may be configured to align and engage with complementary first recesses on the horizontal support 180 to ensure that the wired OCP connector 160 is correctly positioned and held in place when attached to the horizontal support 180. More specifically, in some cases, the fasteners themselves may not be able to align the OCP connector 160 relative to the desired mounting position with the required level of precision (e.g., due to tolerances in the fasteners to allow for easier tightening). In such cases, the protrusions and first recesses can be more precisely positioned and sized to ensure that the positioning of the OCP connector 160 achieves the required precision upon engagement. For example, the horizontal support 180 may be the motherboard tray or base plate of the chassis 110, and the fastening element 184 may be located near the rear accessible bracket 140, such that the OCP edge socket 161 is positioned to mate with the edge connector of the OCP module mounted in the rear accessible bracket 140.

[0042] The second attachment feature 166 may include a vertical fin 167. The vertical fin 167 is configured to be parallel to and engage with the vertical support 190 when the wired OCP connector 160 is attached to the vertical support 190. The vertical fin 167 may include one or more fastening elements 168 configured to engage directly or indirectly with a corresponding fastening element 198 of the vertical support 190 to secure the OCP connector 160 to the vertical support 190. In some examples, the fastening element 168 engages directly with the fastening element 198; for example, fastening element 68 may be configured as a latch, and fastening element 198 may be configured as a latch receiver (or vice versa). In other examples, the fastening element 168 engages indirectly with the fastening element 198 via a fastener (not shown) that engages both. The fastener may be a screw, rivet, or any other mechanical fastener. For example, the fastening element 168 may include a second hole through the vertical fin 167. The vertical fin 167 may also include a second protrusion. One or more second fastening elements 168 may be configured to receive fasteners for attaching the wired OCP connector 160 to the vertical support 190. For example, screws or finger screws may be used. One or more second protrusions may be configured to align with complementary second recesses on the vertical support 190 to ensure that the wired OCP connector 160 is properly positioned and held in place when attached to the vertical support 190.

[0043] In some examples, the vertical support 190 may include a support opening through which a portion of the wired OCP connector 160 extends, such that the vertical fin 167 abuts against the vertical support 190 near the support opening. The vertical support 190 may be adjacent to the front accessible bracket 150, such that the OCP edge socket 161 is positioned to mate with the edge connector of the OCP module mounted in the front accessible bracket 150.

[0044] Now for reference Figure 2A-2C This section will describe an example OCP cable assembly 230, including an example wired OCP connector 260. The OCP cable assembly 230 is an example implementation of the OCP cable assembly 130 described above. Figure 2A The OCP cable assembly 230 and the wired OCP connector 260 are shown from the top rear view. Figure 2B The OCP cable assembly 230 and the wired OCP connector 260 are shown from the bottom front view. Figure 2C The OCP cable assembly 230 and the wired OCP connector 260 are shown from top, front, and side angles. (Reference) Figure 2A -C, The use of directional terms such as "top" and "bottom" is for ease of explanation only and should be understood relative to the directions shown in the diagram. They are not intended to outline the implementation of restrictions or to impose restrictions in any way.

[0045] OCP cable assembly 230 includes a plurality of electrical conductors 231 (e.g., wires) (only one is labeled) assembled into one or more cables 270, a wired OCP connector 260 connected to one end of the conductors 231, and a second connector (not shown) connected to the other end of the conductors 230. The second connector may follow an industry standard format and is therefore not shown here. Furthermore, for simplicity, only a portion of the electrical conductors 231 immediately adjacent to the OCP connector 260 is shown; however, it should be understood that the electrical conductors 231 can extend to any desired length and can be assembled in various groupings and sheathed in any desired manner, as understood by those skilled in the art or of ordinary skill.

[0046] The wired OCP connector 260 includes a connector housing 232, which has an OCP edge socket 261 on one side (see...). Figure 2B This side can be referred to as the front side. The connector housing 232 also has an opening 233 (only one is marked) on its other side, through which the conductor 231 enters the interior of the housing 232 (not shown) (see...). Figure 2A ).exist Figure 2A-2C In one example, the opening 233 is located on the rear side of the housing 232, opposite to the socket 261, such that the conductor 231 extends out of the housing 232 in a direction parallel to the mating axis X of the socket 261. However, in other examples, the opening 233 may be located on the other side of the housing 232, such that the conductor 231 extends out of the housing 232 in a direction perpendicular to the mating axis X.

[0047] The OCP edge socket 261 is configured to receive the edge connector of the OCP module. Specifically, the OCP edge socket 261 includes a plurality of recesses 271 (sockets) that extend along the lateral dimension of the housing 232 (parallel to the...). Figure 2B It extends along the axis y in the middle and along the depth dimension of the shell (parallel to the axis y). Figure 2B The mating axis X is recessed from the front surface of housing 232. Recess 271 is configured such that an edge connector of the OCP module aligned with recess 271 can be inserted into recess 271 via relative translation along the mating axis X between the edge connector and OCP socket 261. Recess 271 includes electrical contacts 272 (e.g., pins) configured to engage corresponding electrical contacts (e.g., PCB gold fingers) of the OCP edge connector of the OCP module. OCP edge socket 261 may have a form factor corresponding to the form factor specified in the OCP specification (e.g., OCP 4C or 4C+ socket connector) and the electrical pins. Each electrical contact 271 is electrically connected to a corresponding electrical conductor 231. The connection between the contact 271 and conductor 231 can be direct or indirect via an intermediate component such as a PCB within the housing.

[0048] The OCP connector 260 also includes a horizontal wall 263, which is an example implementation of horizontal wall 163. In this example, horizontal wall 263 is formed by the bottom surface of housing 232. At two rear corners of housing 232, portions 263a of horizontal wall 263 protrude from housing 232, and these portions 263a include first holes 264 extending vertically through them. These first holes 264 are an example implementation of the aforementioned first fastening element 164 and are configured to receive fasteners inserted therein. The head of the fastener may abut against the top surface of the protruding portion 263a. When the OCP connector 260 is mounted therein, the bottom surface of horizontal wall 263 may make flush contact with the top surface of motherboard tray or base plate 280, such that mating axis X is parallel to tray or base plate 280 (and therefore parallel to the system board mounted thereon), as follows. Figure 4 The OCP connector 260 also includes first protrusions 265 projecting vertically downward from the horizontal wall 263. These first protrusions 265 include a first type of protrusion 265a configured to engage (received therein) a corresponding recess in the tray or base plate 280 and a second protrusion 265b configured to engage with the edge of the motherboard tray or be received in a recess in the tray or base plate. The first protrusions are configured to align the OCP connector 260 relative to a predetermined mounting position by engaging with the tray / base plate, allowing the OCP connector 260 to blind-mate with an OCP module inserted into the brackets 240, 250. In the example shown, the first protrusion 265 includes two types of protrusions, wherein two protrusions 265a are shaped as cylinders with tapered (e.g., dome-shaped) tips, and one protrusion 265b is shaped as a ridge or fin; however, it should be understood that any number or shape of first protrusions 265 may be used in other examples.

[0049] The OCP connector 260 also includes vertical fins 267, such as Figure 2A and 2C As shown. This is an example implementation of the vertical fin 267. In this example, the vertical fin 267 is formed by a protrusion projecting vertically upward from the top surface of the housing 232. Furthermore, in this example, a second hole 268 extends horizontally through the vertical fin 267. The second hole 268 is an example implementation of the aforementioned second fastening element 168 and is configured to receive a fastener inserted therein. The head of the fastener can abut against the rear surface of the vertical fin 267. When the OCP connector 260 is mounted therein, the front surface 267a of the vertical fin 267 can abut against and be flush with the vertical surface of the vertical support, for example, the rear surface of the backplate 290 (see...). Figure 6 ) or the front surface of the riser frame bracket 390 (see Figure 5This ensures that the mating axis X is perpendicular to the vertical support (and therefore parallel to the system board). The contact between the front surface 267a and the vertical support helps control the connector's position along the forward / reverse axis, which helps ensure the correct positioning of connector 260. Furthermore, the contact between the front surface 267a and the vertical support provides additional support to connector 260, helping to resist tilting of connector 260 in response to torque applied during mating / decoupling of the OCP edge connector. Figure 2C As shown, the OCP connector 260 also includes a second protrusion 269 located on the vertical fin 267. The second protrusion 269 projects horizontally forward from the front surface of the vertical fin 267. The second protrusion 269 engages with a corresponding recess in the vertical support to align the connector 260 relative to the mounting position. Similar to the first protrusion 265, there are two cylindrical protrusions 269 with tapered tips. Again, it should be understood that any number or shape of second protrusions 269 may be used in other examples.

[0050] Figure 3 A vertical support 290 and two OCP cable assemblies 230, including an example wired OCP connector 260, are shown. The vertical support 290 is an example configuration of the vertical support 190 described above. In some examples, the vertical support 290 may be attached to a removable module rack that may include a dual-purpose drive rack configured to interchangeably receive storage drives and / or OCP modules. For example, in some embodiments, the vertical support 290 is attached to... Figure 7 The drive rack 297, which will be described in more detail below, is used. In some examples, the same drive rack can be switched between a configuration that accommodates storage drives, a configuration that accommodates OCP modules, and (in some cases) a configuration that accommodates both storage drives and OCP modules by changing the type of backplane provided to the drive rack. A storage backplane can be added to the drive rack to enable compatibility of storage drives in one or more bays aligned with the storage backplane, and a vertical support 290 (with an OCP connector 260 attached thereto) can be added to the drive rack to enable compatibility with OCP modules for one or more bays aligned with the OCP connector 260. In some examples, both the storage drive backplane and the vertical support 290 can be attached to the drive rack simultaneously, with some bays initially aligned with the storage drive backplane while the others are aligned with the vertical support 290. In other cases, one or the other of the storage backplane and the vertical support 290 is used.

[0051] The vertical support 290 includes a support opening 292 configured to receive the front end portion (including the end of the socket 261) of the body 232 of the connector 260 inserted therein. In this example, there are two support openings 292, therefore the vertical support 290 can accommodate a maximum of two wired OCP connectors 260, such as... Figure 3 , Figure 6 ,and Figure 7 The wired OCP connector 260. Figure 3 An exploded view is shown, while Figure 6 and Figure 7 A connector 260 is shown engaging via a support opening 292 in a vertical support 290. In other examples, the dimensions of the vertical support 290 may be increased, and additional support openings 292 may be added to increase the number of connectors 260 that can be mounted to the vertical support 290. The OCP connector 260 insertion opening 292 provides an overall alignment level of the connector 260 with the desired mounting location. Engagement of the protrusion 269 with a corresponding recess 294 in the vertical support 290 provides a finer alignment level. Once engaged, a fastener 295 may be used to attach the wired OCP connector 260 to the vertical support 290 by inserting it through a hole 268 in the fin 267 and then into a hole 298 in the vertical support 290. In the example shown, the fastener 295 is a screw, and the hole 298 may include threads to engage with the screw's threads, or a separate nut may be placed on the opposite face of the vertical support 290 above the hole 298 to engage the screw's threads. Hole 298 and / or nut (if present) are examples of the fastening element 198 described above.

[0052] Once connector 260 is attached to vertical support 290, fins 267 abut against the rear surface of vertical support 290. For example... Figure 3 As shown, the vertical support 290 includes an opening 201 and a latching engagement feature 202 located at the opening 201. Furthermore, the fin 267 includes a lowered portion 267b that aligns with the opening 201 when the connector 260 is attached to the vertical support 290. The opening 201 is for receiving a latch 203 from the OCP module, and the lowered portion 267b allows the latch to extend through the opening 201 without being obstructed by the fin 267. Figure 6 As shown. Figure 6 As shown, latch 203 engages with latch engagement feature 202.

[0053] When the vertical support 290 is attached to the drive rack, the opening 292 can be aligned with the drive rack's bracket, such that when the connector 260 is attached to the vertical support 290, the connector 260 is positioned for blind mating with the OCP module inserted into the bracket. For example, Figure 6Two OCP modules 296 are shown, inserted into two front brackets 250 and mating with two OCP connectors 260 attached to a vertical support 290. The front brackets 250 are defined by a drive rack, for example, Figure 7 The drive rack 297, but Figure 6 The drive rack is omitted to allow for visibility of other aspects. Each connector 260 is aligned with the bracket 250. As mentioned above, the drive rack may be able to receive storage drives or OCP modules. This can be achieved using adapters, for example... Figure 6 The OCP adapter 275 is shown. Adapter 275 is attached to OCP module 296 and provides engagement feature 276 whose size, shape, and position are capable of engaging with complementary engagement features in the drive rack. In this engagement, OCP module 295 can be guided to a suitable mounting position where its edge connector can blindly mate with OCP connector 260 attached to vertical support 290 and aligned with a bracket 250 into which OCP module 296 is inserted. The engagement features of the drive rack can be configured to naturally engage with a specific form factor of the storage drive, thus allowing the storage drive to be mounted in the drive rack without the adapter. In some examples, a given bracket 250 for the OCP module can be formed by multiple (e.g., two) brackets for the storage drive.

[0054] like Figure 7 As shown, in some examples, a vertical support 290 with a connector 260 attached thereto is attached to the rear side of a drive rack 297. This drive rack can be positioned at the front of the computing device's chassis. Figure 7In the example shown, drive rack 297 includes multiple storage drive bays 205, each sized to receive a storage drive of a given form factor (e.g., EDSFF). A vertical support 290 covers four of these storage drive bays 205, forming two front OCP bays 250, each comprising two adjacent storage drive bays 205. Each front OCP bay 250 is aligned with one of the OCP connectors 260 attached to the vertical support 290. A separate storage backplate 206 is also attached to drive rack 297 and covers four additional bays 205. This storage backplate 206 includes connectors aligned with the bays 205 for blind mating with inserted storage drives. Additional bays (not labeled), as shown, are also provided where drive stops are mounted, but any other type of device can be installed therein. As shown, drive rack 297 allows OCP modules 296 (via two OCP brackets 250) to be mounted therein, and allows storage drives (via other brackets 205) to be mounted therein. It should be understood that additional vertical supports 290 can be attached to the drive rack on the other brackets 205 to allow additional OCP modules to be mounted therein. Furthermore, one or more vertical supports 290 can be mounted on any desired set of four brackets 205, and are not limited to the positions shown. Additionally, an additional storage backplate 206 can be added to allow the insertion of additional storage drives. Furthermore, other backplates (not shown) can be added to facilitate the installation of other types of devices.

[0055] Drive rack 297 is one example of a drive rack that can be used with vertical support 290 and connector 260, but vertical support 290 is not limited to drive rack 297. For example, vertical support 290 and connector 260 can be used with drive racks having only four storage trays 205 or any number of storage trays 205 or more. Furthermore, vertical support 290 and connector 260 can be used in modular racks that are not designed to naturally receive storage drives, but rather to naturally receive OCP modules (no adapter required).

[0056] Figure 4An example wired OCP connector 260 is shown attached to an OCP cable assembly 230 of a horizontal support 280. In the example shown, the horizontal support 280 is part of a motherboard tray that is mounted on a chassis 210 of a computer system 200 and supports the motherboard board within the computer system 200. The horizontal support 280 is located at the front end of a rear OCP tray 240. The rear OCP tray 240 is defined by two OCP rails 241 and an opening 282 in the rear panel 211 of the chassis 210, which are also mounted on the motherboard tray. The OCP connector 260 is connected to the horizontal support 280 using two fasteners 293 that engage with corresponding fastener receivers (e.g., holes) (not visible) in the horizontal support 280 through a first hole 264. Furthermore, the horizontal wall 263 contacts the top surface of the tray flush, the first protrusion 265a engages with a corresponding hole (not visible) in the tray, and the protrusion 265b engages with the rearward-facing edge of the tray (not visible, if the tray has a cutout portion in the space corresponding to the bracket 240) or another hole (not visible). The first protrusion 265 aligns the connector 260 relative to the bracket 240, allowing the OCP module 296 mounted in the bracket to blind-mate with the connector 260. More specifically, an opening 282 is provided in the rear panel 211 of the chassis 210 to allow the OCP module 296 to be inserted and removed from the outside of the chassis 210 into the rear OCP bracket 240 via the opening 282. With OCP module 296 inserted into bracket 240, the side edge of the PCB of OCP module 295 engages with a groove extending along guide rail 241 to guide OCP module 296 into a mounting position where the OCP edge connector 255 of OCP module 296 blindly mates with connector 260 (i.e., is received in socket 261). Once OCP module 296 is in the mounting position, guide rail 241 supports OCP module 295 and secures it to chassis 210. Wired OCP connector 260 is shown for connection to example OCP module 296. In this mounting configuration, vertical fins 267 are present but not used. Cable 270 is also shown connecting to another connector (not shown) that connects to the system board, thereby connecting OCP module 296 communicatively and electrically to the main system board.

[0057] Figure 5An example wired OCP connector 260 is shown attached to a vertical support 390, which is attached to a riser rack 274. The vertical support 390 is another example of the vertical support 190 described above. In this example, the vertical support 390 is a riser rack bracket. The riser rack 274 is used to connect expansion cards to the main system board. The riser rack 274 includes multiple panels 273 coupled together, including: a vertical rear panel 273b, a vertical side panel 273a coupled perpendicular to the rear panel 273a, and a horizontal top panel 273c coupled to the rear panel 273b and the side panel 273a. The riser rack 274 also includes a driver housing 277 attached to some or all of the panels 273. The driver housing 277 is configured to receive an OCP module. The front surface of the driver housing 277 includes the vertical support 390. The OCP connector 260, attached to the vertical support 390, faces rearward and enters the internal space within the driver housing 277.

[0058] The vertical support 390 includes a support opening 392 into which the OCP connector 260 is inserted in the attached state. Fasteners (omitted from view to avoid obscuring other features) can be inserted through a second hole 268 in the vertical fin 267 into a corresponding fastener receiver (e.g., a hole, not visible) in the vertical support 390 to attach the wired OCP connector 260 to the vertical support 390. Furthermore, in the attached state, the fin 267 abuts against the front surface of the vertical support 390. Protrusion 269 ( Figure 5 The rear panel 273b engages with a corresponding recess (not visible) in the vertical support 390. The riser rack 274 can be deployed at the rear of the computer system chassis, which is common for riser racks, with the rear panel 273b coupled to the rear panel of the chassis (rear panel 237b can subsequently become part of the rear panel of the chassis). A cable 270 is also shown connecting to a second connector (not shown), which connects to the system board, enabling the OCP module mates with connector 260 to be communicatively and electrically connected to the main system board.

[0059] Figure 8 The diagram shows the use of wired OCP connectors (e.g., the previous Figures 2 to 3). Figure 7Example method 800 for the wired OCP connector 260 shown. Method 800 begins at step 810, in which the wired OCP connector is mounted to the chassis. This can be done via step 820 or step 830. In step 820, a first attachment feature of the wired OCP connector is attached to a horizontal support. In step 830, a second attachment feature of the wired OCP connector is attached to a vertical support. In step 840, a cable is attached to the cable receptacle of the wired OCP connector, and the other end of the cable is attached to a corresponding connector on the main system board. The wired OCP connector can be mounted in a manner that allows it to be used with either a front-accessible bracket or a rear-accessible bracket, and the OCP module can be inserted into either bracket and mate with the OCP edge receptacle of the wired OCP connector.

[0060] The above description describes various types of electronic circuits. As used herein, "electronic" is intended to be broadly understood to include all types of circuits that utilize electricity, including digital and analog circuits, direct current (DC) and alternating current (AC) circuits, as well as circuits that convert electricity into other forms of energy and use electricity to perform other functions. In other words, as used herein, there is no distinction between "electronic" circuits and "electrical" circuits.

[0061] It should be understood that both the general description and the detailed description provide essentially illustrative examples intended to provide an understanding of this disclosure, but not to limit its scope. Various mechanical, compositional, structural, electronic, and operational changes may be made without departing from the scope of this specification and the claims. In some cases, well-known circuits, structures, and techniques have not been shown or described in detail to avoid obscuring the examples. Identical numbers in two or more figures represent the same or similar elements.

[0062] Furthermore, unless the context otherwise requires, the singular forms “a,” “an,” and “the” also include the plural forms. Additionally, the terms “comprising,” “including,” “having,” etc., specify the presence of the stated feature, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or components. Unless otherwise specifically stated, components described as coupled may be directly electronically or mechanically coupled, or indirectly coupled through one or more intermediate components. Unless the context of the specification otherwise indicates, mathematical and geometric terms are not necessarily intended to be used according to their strict definitions, as those skilled in the art will understand that, for example, fundamentally similar elements that function in a fundamentally similar manner readily fall within the scope of descriptive terms, even if such terms have strict definitions.

[0063] And / or: The word “and / or” is occasionally used in conjunction with a list of items in this article. This phrase means that any combination of items in the list—from a single item to all items and any permutation in between—can be included. Thus, for example, “A, B, and / or C” means “one of {A}, {B}, {C}, {A, B}, {A, C}, {C, B}, and {A, C, B}.”

[0064] Elements and related aspects described in detail with reference to an example may be included in other examples that do not specifically show or describe them, whenever feasible. For example, if an element is described in detail with reference to an example but not with reference to a second example, the element may still be considered as included in the second example.

[0065] Unless otherwise stated herein or implied by the context, the use of approximate terms such as “substantially,” “approximately,” “about,” “around,” “roughly,” etc., should be understood as not requiring mathematical precision, but rather referring to a range of variation, including but not limited to, the values, properties, or relationships described herein. In particular, apart from any ranges expressly specified herein (if any), the range of variation implied by the use of such approximate terms includes at least any insignificant variations, as well as those typical of the type of article under discussion in the relevant field due to manufacturing or other tolerances. In any case, unless otherwise stated, the range of variation may include values ​​at least within ±1% of the stated values, properties, or relationships.

[0066] Given the disclosure herein, those skilled in the art will understand further modifications and alternative examples. For example, these apparatuses and methods may include additional components or steps that are clearly omitted from the figures and description for operation. Therefore, this description is to be interpreted only as illustrative and intended to teach those skilled in the art the general manner of performing this teaching. It should be understood that the various examples shown and described herein are to be considered exemplary. Elements and materials, and the arrangement of such elements and materials, may substitute for those shown and described herein, components and processes may be reversed, and certain features of this teaching may be used independently, all of which will be apparent to those skilled in the art upon benefiting from the description herein. Changes may be made to the elements described herein without departing from the scope of this teaching and the appended claims.

[0067] It should be understood that the specific examples described herein are non-limiting, and modifications may be made to the structure, dimensions, materials, and methods without departing from the scope of this teaching.

[0068] By considering the specification and practice of the invention disclosed herein, those skilled in the art will understand other examples based on this disclosure. It is intended that the specification and examples be considered exemplary only, and the following claims shall be entitled to their fullest extent, including equivalents, in accordance with applicable law.

Claims

1. A cable assembly, comprising: cable; An Open Computing Project (OCP) connector is connected to a first end of the cable and includes a receptacle configured to mate with an edge connector of the OCP module, a first attachment feature coupled to the receptacle, and a second attachment feature coupled to the receptacle. The second connector is connected to the second end of the cable and is configured to mate with a connector mounted on the main system board of the information processing equipment. Wherein, the first attachment feature is configured to attach the OCP connector to a horizontal support of the information processing device, the horizontal support being parallel to the mating axis of the socket; and The second attachment feature is configured to mount the OCP connector to a vertical support of the information processing device, the vertical support being perpendicular to the mating axis of the socket.

2. The cable assembly according to claim 1, wherein, The second attachment feature includes: A vertical fin protruding from the socket, the vertical fin including a mating surface configured to be parallel to and engage with the vertical support when the OCP connector is attached to the vertical support; and One or more second holes extend horizontally through the vertical fins and are configured to receive fasteners.

3. The cable assembly according to claim 2, wherein, The second attachment feature includes one or more protrusions projecting from the vertical fin, and the one or more protrusions are configured to engage with complementary recesses in the vertical support and control the position of the OCP connector relative to the vertical support.

4. The cable assembly according to claim 2, wherein, The vertical support includes an opening, and with the OCP connector attached to the vertical support, the socket extends through the opening through the vertical support, and the vertical fins abut against the vertical support near the opening.

5. The cable assembly according to claim 4, wherein, The vertical support is a vertical panel positioned adjacent to the front accessible bracket of the information processing device, the opening of which is aligned with the front accessible bracket such that, with the OCP connector attached to the vertical panel, the socket is positioned to mate with the edge connector of the OCP module mounted in the front accessible bracket.

6. The cable assembly according to claim 4, wherein, The vertical support is a vertical bracket for the riser frame of the information processing equipment, such that when the OCP connector is attached to the vertical support, the socket is positioned to mate with the edge connector of the OCP module installed in the riser frame.

7. The cable assembly according to claim 1, wherein, The first attachment feature includes: A horizontal wall is configured to be parallel to and engage with the horizontal support when the OCP connector is attached to the horizontal support; and One or more first holes extend vertically through the horizontal wall and are configured to receive fasteners.

8. The cable assembly according to claim 7, wherein, The horizontal wall forms the bottom wall of the socket.

9. The cable assembly according to claim 8, wherein, The horizontal support is the motherboard tray or base plate of the chassis of the information processing device, and the OCP connector is configured to attach to the horizontal support adjacent to the rear accessible bracket of the information processing device, such that the socket is positioned to mate with the edge connector of the OCP module mounted in the rear accessible bracket.

10. The cable assembly according to claim 1, wherein, The socket includes an OCP 4C connector or an OCP 4C+ connector.

11. A computing system, comprising: The chassis is configured to house the main system board; A main system board, mechanically coupled to the chassis, the main system board including connectors; A front-accessible bracket is configured to receive a removable module via the front panel of the chassis. A vertical support member, positioned adjacent to the front accessible bracket, the vertical support member being coupled to the chassis or a portion thereof; A rear-accessible bracket is configured to receive a removable module via the rear panel of the chassis; A horizontal support member that supports the main system board, the horizontal support member being coupled to the chassis or a part of the chassis; as well as Wired OCP connector, the wired OCP connector comprising: cable; An Open Computing Project (OCP) connector, connected to a first end of the cable, includes a receptacle configured to mate with an edge connector of the OCP module, a first attachment feature coupled to the receptacle, and a second attachment feature coupled to the receptacle; and The second connector connects to the second end of the cable and mates with the connector on the main system board; Wherein, the first attachment feature is configured to attach the OCP connector to the horizontal support, such that the receptacle is positioned to receive an edge connector of the OCP module inserted into the rear accessible bracket, the mating axis of the receptacle being parallel to the horizontal support; and The second attachment feature is configured to mount the OCP connector to the vertical support such that the receptacle is positioned to receive an edge connector of the OCP module inserted into the front accessible bracket, the mating axis of the receptacle being perpendicular to the vertical support.

12. The computing system according to claim 11, further comprising: A riser rack coupled to the chassis or a portion thereof, wherein the vertical support is coupled to the riser rack or a portion thereof.

13. The computing system according to claim 12, wherein, The vertical support is a metal frame coupled to the riser frame.

14. The computing system according to claim 11, wherein, The second attachment feature includes: A vertical fin protruding from the socket, the vertical fin including a mating surface configured to be parallel to and engage with the vertical support when the OCP connector is attached to the vertical support; and One or more second holes extend horizontally through the vertical fins and are configured to receive fasteners.

15. The computing system according to claim 14, wherein, The second attachment feature includes one or more protrusions projecting from the vertical fin, and the one or more protrusions are configured to engage with complementary recesses in the vertical support and control the position of the OCP connector relative to the vertical support.

16. The computing system according to claim 11, wherein, The first attachment feature includes: A horizontal wall is configured to be parallel to and engage with the horizontal support when the OCP connector is attached to the horizontal support; and One or more first holes extend vertically through the horizontal wall and are configured to receive fasteners.

17. The computing system according to claim 16, wherein, The horizontal support is the motherboard tray or base plate of the chassis.

18. A method for using a wired OCP connector, comprising: Install the wired OCP connector into the chassis using any of the following methods: The first attachment feature of the wired OCP connector is attached to a horizontal support, wherein the horizontal support is parallel to the OCP edge socket and the cable socket; or The second attachment feature is attached to the vertical support, wherein the vertical support is perpendicular to the OCP edge socket and the cable socket; and Connect the cable to the cable receptacle and the corresponding connector on the main system board. The OCP edge socket is configured to mate with the edge connector of the OCP module. The cable socket is configured to mate with a cable.

19. The method according to claim 18, wherein, The wired OCP connector is installed into the chassis, such that the OCP module is inserted into the front accessible bracket and mates with the OCP edge socket.

20. The method according to claim 19, wherein, The wired OCP connector is installed into the chassis such that the OCP module is inserted into the rear accessible bracket and mates with the OCP edge socket.

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