A molding process for a signal pin

Abstract

The application relates to the field of metal forming and surface treatment, in particular to a signal PIN forming process, which comprises the following steps: cold upsetting copper raw materials into a cuboid signal PIN blank, coating isolation liquid medicine containing a gradient solidification process on five non-electroplating surfaces of the blank and reserving target electroplating surfaces, implementing selective electroplating treatment on the target electroplating surfaces, and then completing packaging after removing the liquid medicine coating films on the corresponding surfaces through two laser stations respectively, and the application also relates to the following contents: parameter correlation of each step such as liquid medicine coating, electroplating treatment and laser removal, construction of a process parameter correlation matrix, setting of a closed-loop quality control system, cross-process parameter collaborative optimization, process knowledge base updating mechanism and the like. The application achieves the following technical effects: ensuring the cooperation of coating structure strength and plating deposition rate, guaranteeing the dynamic adaptation of surface activation effect and production line beat, being capable of tracing quality deviation to specific process nodes, and realizing process continuous optimization.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic product forming, in particular to a forming process of a signal PIN. BACKGROUND

[0002] With the rapid development of electronic technology, electronic products are increasingly moving towards miniaturization, high integration, and high performance. Connectors, as an indispensable part of electronic devices, directly affect the stability and reliability of the entire electronic system in terms of quality and performance. As the core conductive component in connectors, signal PINs not only need to have excellent conductivity, but also need to meet the mechanical connection requirements of high precision and high reliability. In particular in the field of high-frequency and high-speed data transmission, the performance of signal PINs is crucial. Therefore, the forming process of signal PINs is of great significance to improving the overall performance of electronic products and market competitiveness.

[0003] In the past, for the forming of signal PINs, the raw material is first formed into a blank body through cold heading process, and then electroplating treatment is performed. In electroplating, the traditional method may be to electroplate the entire blank body, or to use some complex shielding method to avoid the unneeded surface from being plated. However, for small volume signal PIN products, these traditional methods have certain difficulties in operation. For example, full electroplating may not meet the subsequent packaging requirements, and complex shielding methods may be difficult to implement accurately due to the small volume of the product. And when removing the shielding, it may also face difficulties, and it is difficult to ensure the uniformity and accuracy of the removal effect.

[0004] The defect of the prior art is that when the product only needs to be electroplated on one surface and the other surfaces remain bare copper, the traditional process cannot accurately electroplate only on the target surface, and cannot meet the subsequent packaging requirements. Moreover, for very small cuboid signal PIN products, it is difficult to ensure the accuracy and uniformity of the operation when removing the protective measures of the surface that does not need to be electroplated. SUMMARY

[0005] The purpose of the present application is to overcome the above technical problems, and provide a forming process of a signal PIN

[0006] A forming process of a signal PIN, comprising the following steps:

[0007] S1: copper raw material is cold headed to form a cuboid signal PIN blank;

[0008] S2: coating isolation medicine on the five non-electroplated surfaces of the blank, leaving the target electroplated surface;

[0009] S3: performing selective electroplating treatment on the target electroplated surface;

[0010] S4: horizontally conveying the electroplating blank to the first laser station, and synchronously removing the top surface and the left and right side surfaces by the three-axis linkage laser head;

[0011] S5: conveying to the second laser station, and removing the front and rear surfaces by the two-axis linkage laser head to complete the packaging.

[0012] By adopting the above technical scheme, the copper raw material can be cold upset into a rectangular cuboid signal PIN blank, the target electroplating surface is retained by coating the isolation chemical solution and selective electroplating treatment is performed, the electroplating of the specific surface is realized, the subsequent packaging requirement is met, the chemical solution coating film on each non-electroplating surface is removed by different laser heads at different stations, the molding and packaging of the signal PIN are completed, the quality and performance of the signal PIN are ensured, and the signal PIN is suitable for electronic equipment, and the stability and reliability of the electronic system are improved.

[0013] Preferably, the chemical solution coating in step S2 comprises a gradient curing process, specifically including:

[0014] S21: forming a porous base at an ambient temperature of 25-30℃;

[0015] S22: realizing molecular chain crosslinking of the second coating layer at 50-55℃;

[0016] S23: completing surface leveling of the third coating layer in a negative pressure environment.

[0017] By adopting the above technical scheme, after the copper raw material is cold upset into a rectangular cuboid signal PIN blank, the isolation chemical solution is coated on the five non-electroplating surfaces of the blank to form a porous base at an ambient temperature of 25-30℃, which is helpful for the adhesion of the subsequent coating layer; the molecular chain crosslinking of the second coating layer is realized at 50-55℃, so that the coating layer has better stability and structural strength; the surface leveling of the third coating layer is completed in a negative pressure environment, so that the surface of the coating layer is flat, which is beneficial to the subsequent electroplating process of retaining the target electroplating surface and also makes the subsequent selective electroplating treatment more accurate.

[0018] Preferably, the electroplating treatment in step S3 is coordinated with the structure of the coating layer, including:

[0019] S31: implementing pulse electroplating (on-off ratio 1:3) for the base layer;

[0020] S32: adopting constant current electroplating (3.2-3.5 A / dm²) for the layer;

[0021] S33: performing reverse current leveling treatment for the layer.

[0022] By adopting the technical scheme, the copper raw material is first cold upset into a cuboid signal PIN blank, then the isolation medicine containing the gradient curing process is coated on the five non-electroplating surfaces of the blank, then the electroplating treatment is coordinated with the coating layer structure, the substrate layer is implemented by pulse electroplating, the layer is implemented by constant current electroplating, and the layer is implemented by reverse current leveling treatment, which can make the electroplating treatment and the coating layer structure cooperate with each other, help to improve the electroplating effect and quality, then the non-electroplating surface medicine film is removed by the laser station to complete packaging, meet the subsequent packaging requirements and ensure that only the target electroplating surface is effectively electroplated, thereby improving the performance and quality of the signal PIN, and is suitable for high-frequency, high-speed data transmission and other fields, and improves the overall performance and market competitiveness of electronic products. The scheme of coordinating the electroplating treatment with the coating layer structure can improve the precision and uniformity of electroplating, and enhance the quality and stability of the plating layer by pulse electroplating, constant current electroplating and reverse current leveling treatment.

[0023] Preferably, the laser removal parameter is associated with the electroplating layer thickness in the step S4, including:

[0024] S41: Establish the mapping relationship between the plating layer thickness δ and the laser power P: P=0.8δ+12 (unit: W);

[0025] S42: Dynamically adjust the laser focal point diameter according to the real-time detected δ value;

[0026] S43: The surface roughness Ra after removal is ≤0.6μm.

[0027] By adopting the above technical scheme, the summary scheme includes that the copper raw material is cold upset into a cuboid signal PIN blank, the isolation medicine is coated on the five non-electroplating surfaces of the blank, the medicine coating contains a gradient curing process, the target electroplating surface is reserved, the target electroplating surface is implemented by selective electroplating treatment, the electroplating treatment is coordinated with the coating layer structure, the electroplating blank is horizontally conveyed to the first laser station, the three-axis linkage laser head synchronously removes the medicine film on the top surface and the left and right side surfaces, the laser removal parameter is associated with the electroplating layer thickness, it is conveyed to the second laser station, and the double-axis linkage laser head removes the medicine film on the front and rear surfaces to complete packaging. The effect of associating the laser removal parameter with the electroplating layer thickness in the step S4 is that: establishing the mapping relationship between the plating layer thickness and the laser power can accurately determine the appropriate laser power according to the actual thickness of the electroplating layer; dynamically adjusting the laser focal point diameter according to the real-time detected thickness value can make the laser removal operation more accurate and effective; the surface roughness Ra after removal is ≤0.6μm, which can ensure the flatness and quality of the surface after removal, improve the performance of the signal PIN and the subsequent use effect.

[0028] Preferably, the porosity of the coating layer is feedback to the laser removal efficiency, including:

[0029] A1: When the porosity is >35%, start the high-power rough removal mode;

[0030] A2: Enable hierarchical cleaning strategy when porosity is 20-35%;

[0031] A3: Trigger coating parameter optimization instruction when porosity is <20%.

[0032] By adopting the above technical solutions, when the coating layer porosity is > 35%, the high-power rough cleaning mode is started to quickly clean the drug film, improving the cleaning efficiency; when the porosity is 20-35%, the hierarchical cleaning strategy is enabled, which can accurately clean the drug film in stages according to different situations; when the porosity is < 20%, the coating parameter optimization instruction is triggered, which can adjust the coating process to ensure the effect and quality of subsequent laser cleaning and the entire forming process, realizing effective feedback and cooperation of coating layer porosity and laser cleaning efficiency, and further improving the accuracy and reliability of the signal PIN forming process.

[0033] Preferably, the electroplating solution composition forms a compatible system with the coating layer material, including:

[0034] B1: Negative correlation regulation of copper sulfate concentration and polytetrafluoroethylene content;

[0035] B2: Direct relationship between the amount of brightener added and the particle size of nanosilica;

[0036] B3: Dynamic adjustment of leveling agent concentration with epoxy resin viscosity.

[0037] By adopting the above technical solutions, the electroplating solution composition forms a compatible system with the coating layer material, in which the copper sulfate concentration and the polytetrafluoroethylene content are negatively correlated, which can make them cooperate with each other to achieve good electroplating and coating effect under different content conditions; the amount of brightener added is directly proportional to the particle size of nanosilica, which can accurately control the amount of brightener added according to the particle size of nanosilica to ensure the electroplating effect; the leveling agent concentration is dynamically adjusted with the epoxy resin viscosity, which can adapt to different viscosity conditions of the epoxy resin to achieve better leveling effect. Thus, the electroplating solution composition and the coating layer material work better together, improving the overall quality and performance of the signal PIN forming process.

[0038] Preferably, a process parameter correlation matrix is constructed, including:

[0039] Matching curve of coating temperature gradient and electroplating current density;

[0040] Laser power and electroplating layer thickness compensation algorithm;

[0041] Dynamic balance equation of transmission speed and surface activation time;

[0042] Wherein the coating temperature gradient (T1, T2, T3) and the plating current density (D) satisfy the linear matching D=0.35(T2-T1)+0.18(T3-T2), to ensure the synergy of coating structure strength and plating deposition rate; The transmission speed (v) and the surface activation time (t) form the inverse power law relationship v·t1.2=C (C is a material characteristic constant), to ensure the dynamic adaptation of surface activation effect and production line rhythm.

[0043] By adopting the above technical solutions, the matching curve of coating temperature gradient and plating current density, the compensation algorithm of laser power and plating layer thickness, and the dynamic balance equation of transmission speed and surface activation time are constructed, which can ensure the synergy of coating structure strength and plating deposition rate, and ensure the dynamic adaptation of surface activation effect and production line rhythm.

[0044] Preferably, a closed-loop quality control system is provided, comprising:

[0045] A coating layer porosity online detection module;

[0046] A plating layer thickness real-time monitoring unit;

[0047] A laser cleaning efficiency feedback controller;

[0048] An abnormal data tracing mechanism to trace to a specific process link;

[0049] The coating layer porosity online detection module collects three-stage gradient curing data in real time to generate a porosity distribution thermodynamic map; The plating layer thickness real-time monitoring unit synchronously obtains a dynamic parameter adjustment curve to establish a thickness-current density correlation model; The laser cleaning efficiency feedback controller dynamically generates a power compensation coefficient in combination with the plating layer thickness mapping relationship; and the abnormal data tracing mechanism traces quality deviation to a specific process node through process fingerprint spectrum comparison.

[0050] By adopting the above technical solutions, the coating layer porosity online detection module collects three-stage gradient curing data in real time and generates a porosity distribution thermodynamic map, which helps to understand the porosity of the coating layer; The plating layer thickness real-time monitoring unit synchronously obtains a dynamic parameter adjustment curve and establishes a thickness-current density correlation model, which can master the change of plating layer thickness; The laser cleaning efficiency feedback controller dynamically generates a power compensation coefficient in combination with the plating layer thickness mapping relationship, which can ensure the laser cleaning efficiency; The abnormal data tracing mechanism traces quality deviation to a specific process node through process fingerprint spectrum comparison, which is convenient for timely discovering and solving quality problems, and overall forms a closed-loop quality control to improve the quality and reliability of the signal PIN forming process.

[0051] Preferably, cross-process parameter collaborative optimization is implemented, comprising:

[0052] C1: associated constraint of cold heading forming tolerance band and coating temperature;

[0053] C2: Synchronization control of plating time window and transmission speed;

[0054] C3: Matching planning of laser cleaning path and surface activation area.

[0055] By adopting the above technical solutions, the cold upsetting and coating processes are coordinated by correlating and constraining the cold upsetting forming tolerance band and the coating temperature, the signal PIN size precision and coating quality are guaranteed, the plating uniformity and consistency are ensured by synchronously controlling the plating time window and the transmission speed, the laser cleaning effect and the surface activation effect are improved by matching planning the laser cleaning path and the surface activation area, and thus the efficiency and quality of the entire forming process are improved.

[0056] Preferably, an updating mechanism of the process knowledge base is established, including:

[0057] D1: Automatically generating a process fingerprint map for each batch of production data;

[0058] D2: Triggering self-learning when the key parameter deviation exceeds ±2σ;

[0059] D3: Matching the historical optimal process template when a new material is introduced;

[0060] D4: Generating a process capability migration feasibility evaluation report.

[0061] By adopting the above technical solutions, the process fingerprint map of each batch of production data is automatically generated, which can comprehensively record production information for analysis; self-learning is triggered when the key parameter deviation exceeds ±2σ, which can timely adjust and optimize the process; the historical optimal process template is matched when a new material is introduced, which can quickly determine the appropriate process; and the generation of the process capability migration feasibility evaluation report helps to evaluate the applicability and feasibility of the process under different production conditions, and comprehensively improves the stability, adaptability and sustainable improvement capability of the process.

[0062] In summary, the present application includes at least one of the following beneficial technical effects:

[0063] 1. Through the cold upsetting and selective plating process, the target surface is precisely plated, meeting the subsequent packaging requirements;

[0064] 2. The laser head is used to remove the non-plating surface coating, solving the problem of difficulty in ensuring precision and uniformity when removing protective measures for small cuboid signal PIN products;

[0065] 3. The process parameter correlation matrix is constructed, the closed-loop quality control system is set, and the cross-process parameter collaborative optimization is implemented, ensuring the cooperation of coating structure strength and plating deposition rate, guaranteeing the dynamic adaptation of surface activation effect and production line beat, and improving the stability and reliability of the forming process. BRIEF DESCRIPTION OF DRAWINGS

[0066] Figure 1 is a flow chart of a signal PIN forming process of an embodiment of the present application.

[0067] Figure 2 is a flow chart of steps S21-S23 in an embodiment of the present application.

[0068] Figure 3 is a flow chart of steps S31-S33 in an embodiment of the present application.

[0069] Figure 4 is a flow chart of steps S31-S33 in an embodiment of the present application.

[0070] Figure 5 is a schematic diagram of a cold upsetting step in an embodiment of the present application. DETAILED DESCRIPTION

[0071] The technical solutions in the embodiments of the present application will be described in further detail below with reference to the drawings. The described embodiments are merely possible technical implementations of the present application, but are not limited thereto. Those skilled in the art can make other embodiments of the present application without creative effort, which are also within the protection scope of the present application.

[0072] Embodiment 1:

[0073] With reference to Figure 1 , the signal PIN forming process provided in an embodiment of the present application includes the following steps:

[0074] S1: cold upsetting a copper raw material into a cuboid signal PIN blank;

[0075] S2: coating isolation medicine on five non-electroplated surfaces of the blank, and reserving a target electroplated surface;

[0076] S3: performing selective electroplating treatment on the target electroplated surface;

[0077] S4: horizontally conveying the electroplated blank to a first laser station, and synchronously removing the medicine coating film on the top surface and the left and right side surfaces by a three-axis linkage laser head;

[0078] S5: conveying to a second laser station, and completing packaging after removing the medicine coating film on the front and back surfaces by a two-axis linkage laser head.

[0079] Corresponding to the cold upsetting, coating isolation medicine, electroplating treatment, laser removal and packaging steps, through the synergistic cooperation of each step, efficient, accurate and reliable signal PIN forming is achieved, the quality and performance of the product are improved, and the requirements of the high-frequency and high-speed data transmission field on the signal PIN are met.

[0080] Specifically, the cold upsetting forming step is to process the copper raw material into a cuboid signal PIN blank body through the cold upsetting process. The copper raw material has good electrical conductivity and is suitable as the basic material of the signal PIN. The cold upsetting process is a processing method that applies pressure to the metal blank through a mold at room temperature to make it produce plastic deformation and obtain the required shape and size, which has the advantages of high production efficiency, high precision, and high material utilization rate. The copper raw material here can also be replaced by other metal materials with good electrical conductivity, such as aluminum, silver, etc.

[0081] Referring to Figure 2 , the coating isolation liquid step is to coat isolation liquid on the five non-electroplating surfaces of the blank body, leaving the target electroplating surface. The role of the isolation liquid is to prevent these surfaces from being plated with metal during the electroplating process, ensuring that only the target surface is electroplated. The liquid coating includes a gradient curing process, specifically:

[0082] S21: Forming a porous substrate at an ambient temperature of 25-30°C;

[0083] S22: Realizing molecular chain cross-linking of the second coating layer at 50-55°C;

[0084] S23: Completing surface leveling of the third coating layer in a negative pressure environment.

[0085] In PIN pin processing, the gradient curing process realizes coating structure optimization through temperature step control. For example, the first layer is coated at 25°C to form a 50-80μm porous substrate (porosity 35-40%) to provide an anchoring structure for subsequent electroplating; the second layer is heated to 55°C to cross-link the molecular chains of the epoxy resin, increasing the coating hardness to 3H; the third layer is under -0.08MPa negative pressure to eliminate bubbles, making the surface roughness Ra≤0.2μm. This process improves the adhesion of the PIN pin coating to 9.8N / cm² (ASTM D3359 standard). This gradient curing process can make the coating layer have good structure and performance. For example, in a certain batch of production, after using the above gradient curing process, the compactness of the coating layer is significantly improved, and the protection effect on the non-electroplating surface is better. During coating, spraying, dipping, etc. can be used, and coating equipment such as spray gun, dipping tank, etc. can be selected.

[0086] Referring to Figure 3 , the electroplating treatment step is to implement selective electroplating treatment on the target electroplating surface. The electroplating treatment cooperates with the coating layer structure to form, specifically including:

[0087] S31: Implementing pulse electroplating (on-off ratio 1:3) on the substrate layer;

[0088] S32: Using constant current electroplating (3.2-3.5A / dm²) on the layer;

[0089] S33: Performing reverse current leveling treatment.

[0090] For the special structure of the PIN pin, pulse plating produces intermittent deposition on the porous substrate, avoiding hole clogging (42% improvement in deposition efficiency); the cross-linking layer is plated at a constant current of 3.5 A / dm2, forming a dense plating layer (porosity <0.5%); reverse current leveling treatment makes the surface smoothness of the leveling layer reach the ▽10 level. For example, the plating layer thickness deviation of a 0.3mm diameter PIN pin is controlled within ±1.2μm. This synergy can improve the quality and performance of the plating layer, making it have better conductivity and corrosion resistance. For example, after testing, the resistance of the plating layer is reduced by 10% and the salt spray test time is extended by 20% after using the above-mentioned synergistic plating process. The composition of the plating solution used in the plating process forms a compatible system with the coating material, for example:

[0091] B1: negative correlation adjustment of copper sulfate concentration and polytetrafluoroethylene content;

[0092] B2: proportional relationship between the amount of brightener added and the particle size of nanosilica;

[0093] B3: leveling agent concentration dynamically adjusted with epoxy resin viscosity.

[0094] This can ensure good bonding and performance synergy between the plating layer and the coating layer. For example, when the epoxy resin viscosity of the coating material increases, appropriately increasing the leveling agent concentration can make the plating layer smoother.

[0095] Referring to Figure 4 , the laser cleaning step is to horizontally transport the electroplated blank to a first laser station, use a three-axis linkage laser head to simultaneously clean the top surface and left and right side surfaces of the drug water coating, then transport it to a second laser station, and use a two-axis linkage laser head to clean the front and back surfaces of the drug water coating. The laser cleaning parameters are related to the thickness of the plating layer, including:

[0096] S41: establish a mapping relationship between the plating layer thickness δ and the laser power P: P = 0.8δ + 12 (unit: W);

[0097] S42: dynamically adjust the laser focal point diameter according to the real-time detected δ value;

[0098] S43: the surface roughness Ra after cleaning is ≤0.6μm.

[0099] When the plating layer thickness of the PIN pin is detected to be δ = 15 μm, the laser power is automatically adjusted to P = 0.8 x 15 + 12 = 24 W, and the focal point diameter is reduced to 80 μm. Practical application shows that this algorithm improves the laser cleaning efficiency by 55%, and the heat-affected zone is controlled within 15 μm, meeting the requirements of the PIN pin surface integrity for high-frequency connectors. This ensures the accuracy and efficiency of laser cleaning, while ensuring the quality of the cleaned surface. For example, in a production, when the plating layer thickness is detected to increase, the laser power is increased according to the mapping relationship, and the focal point diameter is adjusted, and finally the surface roughness after cleaning meets the requirements, and the cleaning efficiency is improved by 15%. The porosity of the coating layer and the laser cleaning efficiency form a feedback, including:

[0100] A1: Start high-power rough cleaning mode when porosity > 35%;

[0101] A2: Enable hierarchical cleaning strategy when porosity is 20 - 35%;

[0102] A3: Trigger coating parameter optimization instructions when porosity < 20%.

[0103] When processing a PIN array with a 0.5 mm pitch, porosity detection can effectively guide the adjustment of the laser cleaning strategy. For example, when the coating layer porosity is detected to be 40%, the high-power rough cleaning mode is started, which can quickly remove most of the coating film, and then fine processing is performed, greatly improving the overall cleaning efficiency. Through this feedback mechanism, the laser cleaning strategy can be adjusted according to the actual situation of the coating layer to improve the cleaning efficiency and quality.

[0104] Finally, the packaging step is performed to complete the formation of the signal PIN.

[0105] The implementation principle of the embodiment is that the embodiment realizes efficient, accurate and reliable signal PIN formation through the coordinated cooperation of multiple steps. Cold heading forming ensures the shape and size accuracy of the blank; coating isolation chemicals and gradient curing process effectively protect the non-electroplated surface; the coordination of electroplating treatment and coating layer structure and the compatibility of electroplating liquid composition and coating layer material improve the quality and performance of the electroplated layer; the laser cleaning step is dynamically adjusted according to the electroplated layer thickness and the porosity of the coating layer to ensure the accuracy and efficiency of cleaning; and the packaging step finally completes the formation of the signal PIN. Compared with the prior art, the entire process can better meet the requirements of high-frequency and high-speed data transmission fields for signal PINs, and improve the overall performance and market competitiveness of electronic products.

[0106] Embodiment 2:

[0107] The difference between this embodiment and the above embodiments is that a different coating method is used when coating the isolation liquid. For example, a roll coating method can be used, and the roll coating device can be a roll coating machine. Roll coating can make the liquid more evenly coated on the surface of the blank, reducing the difference in coating thickness. In addition, in the laser cleaning step, the layout and working order of the laser heads can be adjusted. For example, the original order of using 3 laser heads first and then using 2 laser heads is changed to using 5 laser heads at the same time to clean the liquid film on 5 surfaces at once. This can shorten the cleaning time and improve the production efficiency. For example, after using the roll coating method to coat the liquid in a certain production batch, the standard deviation of the coating thickness is reduced by 30%; after using 5 laser heads at the same time to clean the liquid film, the cleaning time is shortened by 25%.

[0108] The implementation principle of this embodiment is that changing the coating method and the working order of the laser heads can optimize the process to a certain extent. The roll coating method can improve the uniformity of the coating, thereby improving the quality of the coating layer; adjusting the working order of the laser heads can improve the efficiency of laser cleaning, thereby shortening the cycle of the entire forming process and improving the production efficiency. At the same time, this local replacement scheme can still cooperate with other steps to ensure the forming quality and performance of the signal PIN.

[0109] Embodiment 3:

[0110] The signal PIN forming process provided by the embodiments of the present application includes the step of establishing a process parameter correlation matrix. This step correlates and optimizes multiple process parameters such as coating temperature gradient, plating current density, laser power, plating layer thickness, transmission speed, and surface activation time, realizes the cooperation and matching between process links, improves the stability and reliability of the signal PIN forming process, and ensures the consistency of product quality.

[0111] Specifically, a matching curve of the coating temperature gradient and the plating current density is established. The coating temperature gradient (T1, T2, T3) and the plating current density (D) satisfy the linear matching D = 0.35(T2 - T1) + 0.18(T3 - T2), which can ensure the cooperation of the coating structure strength and the plating deposition rate. By accurately controlling the relationship between the coating temperature gradient and the plating current density, the performance of the coating layer and the plating layer can be optimized, and the quality of the product can be improved. For example, in a certain batch production, the structure strength of the coating layer is increased by 15% by strictly controlling the process parameters according to this matching curve, the plating deposition rate is stabilized within a reasonable range, and the pass rate of the product is increased by 8%. The coating temperature can be controlled by heating equipment such as an oven, a heating plate, etc., and the plating current density can be realized by adjusting the parameters of the plating power supply.

[0112] A compensation algorithm between laser power and electroplated layer thickness is established. A mapping relationship between the electroplated layer thickness δ and the laser power P is established: P = 0.8δ + 12 (unit: W), and the laser focal point diameter is dynamically adjusted according to the real-time detected δ value to ensure the accuracy and efficiency of laser cleaning. In this way, the laser power and focal point diameter can be dynamically adjusted according to the actual thickness of the electroplated layer, avoiding the problem of inconsistent laser cleaning effect caused by the difference in electroplated layer thickness. For example, when the electroplated layer thickness is detected to increase, the laser power is increased in time and the focal point diameter is adjusted, which can ensure that the laser cleaning effect is not affected. The laser power can be adjusted by a laser generator, and the electroplated layer thickness can be detected in real time by a thickness gauge or other equipment.

[0113] A dynamic balance equation between the transmission speed and the surface activation time is established. The transmission speed (v) and the surface activation time (t) form an inverse power law relationship of v·t1.2 = C (C is a material characteristic constant), which ensures the dynamic adaptation of the surface activation effect and the production line beat. By reasonably adjusting the relationship between the transmission speed and the surface activation time, the surface activation process can be matched with the running speed of the production line, improving the production efficiency while ensuring the surface activation effect. For example, when the production line transmission speed increases, the surface activation time is correspondingly shortened, and the surface activation effect still meets the requirements, improving the production efficiency. The transmission speed can be adjusted by a driving device of a conveyor belt, and the surface activation time can be realized by controlling the action time of an activator or the working time of an activation device.

[0114] The implementation principle of the embodiment is that by establishing a process parameter correlation matrix, the relationship between various process parameters is quantized and optimized, so that the coating, electroplating, laser cleaning and other process links can work better in cooperation. The matching of the coating temperature gradient and the electroplating current density ensures the performance cooperation of the coating and the plated layer; the compensation algorithm between the laser power and the electroplated layer thickness ensures the accuracy and efficiency of laser cleaning; the dynamic balance equation between the transmission speed and the surface activation time realizes the adaptation of the surface activation effect and the production line beat. The establishment of the entire process parameter correlation matrix improves the stability and reliability of the signal PIN forming process, reduces the product quality difference caused by process parameter fluctuations, and improves the product qualification rate and consistency.

[0115] Embodiment 4

[0116] The signal PIN forming process provided by the embodiment of the application comprises the step of setting a closed-loop quality control system, which realizes real-time monitoring and feedback control of key parameters such as coating layer porosity, electroplated layer thickness and laser cleaning efficiency, and establishes an abnormal data tracing mechanism, thereby realizing quality monitoring and precise regulation and control of the entire forming process, and improving the stability and reliability of product quality.

[0117] Specifically, the coating porosity online detection module collects three-stage gradient curing data in real time to generate a porosity distribution thermal map. Through this module, the porosity of the coating layer can be understood in a timely manner, providing a basis for subsequent process adjustment. Coating porosity has an important influence on laser cleaning efficiency and product performance. When the porosity is too high or too low, it may affect the effect of laser cleaning and the protective performance of the coating layer. For example, when the porosity is too high, the laser cleaning efficiency is reduced, and the protective performance of the coating layer is poor; when the porosity is too low, the coating layer may be too dense, which is not conducive to subsequent processes. The coating porosity online detection equipment can be a detection instrument based on optical principles or electrical principles.

[0118] The electroplating layer thickness real-time monitoring unit synchronously acquires the dynamic parameter adjustment curve to establish a thickness-current density correlation model. This unit can monitor the thickness of the electroplating layer in real time and dynamically adjust electroplating parameters such as current density according to the thickness change. The thickness of the electroplating layer directly affects the conductivity and corrosion resistance of the signal PIN, and by establishing a correlation model, the quality of the electroplating layer can be better controlled. For example, when the thickness of the electroplating layer is monitored to increase, timely reduction of the current density can ensure the stable quality of the electroplating layer. The electroplating layer thickness real-time monitoring equipment can be an ultrasonic thickness gauge, an X-ray thickness gauge, etc.

[0119] The laser cleaning efficiency feedback controller dynamically generates a power compensation coefficient in combination with the plating layer thickness mapping relationship. According to the real-time detection of the electroplating layer thickness and the coating layer porosity, the laser power and focal point diameter are dynamically adjusted to ensure the efficiency and accuracy of laser cleaning. For example, when the electroplating layer thickness is detected to increase and the coating layer porosity changes, timely adjustment of the laser power and focal point diameter can ensure that the laser cleaning efficiency is not affected. The laser cleaning efficiency feedback controller can be a PLC (Programmable Logic Controller) based control system that receives data from other monitoring modules, calculates and adjusts the parameters of the laser equipment in real time.

[0120] The abnormal data tracing mechanism traces quality deviations to specific process nodes through process fingerprint comparison. When there is a product quality problem, this mechanism can quickly locate the process where the problem occurs, facilitating timely corrective and improvement measures. For example, when the conductivity of a batch of products is found to be out of specification, the process fingerprint comparison quickly determines that the electroplating process parameters have deviated, and timely adjustments are made to avoid the production of more unqualified products. The process fingerprint is a database that records the process parameters and product quality data of each production batch, and through comparison, the corresponding process and parameters of abnormal data can be found out.

[0121] The implementation principle of the embodiment is that the closed-loop quality control system realizes comprehensive monitoring and precise regulation and control of the forming process through the cooperative work of various monitoring modules and feedback controllers. The coating layer porosity online detection module, the electroplating layer thickness real-time monitoring unit, and the laser cleaning efficiency feedback controller respectively monitor and feedback different key parameters, ensuring the stability and accuracy of the process parameters. The abnormal data tracing mechanism provides strong support for problem investigation and solution. Compared with the prior art, the entire system can better ensure the forming quality of the signal PIN, reduce the defective rate, improve the production efficiency and market competitiveness of the product.

[0122] Embodiment 5

[0123] The embodiment of the present application provides a signal PIN forming process, which comprises the step of establishing a process knowledge base updating mechanism. The mechanism continuously updates and optimizes the process knowledge base through the ways of automatically generating process fingerprint atlas, triggering self-learning, matching historical optimal process template, and generating process capability migration feasibility evaluation report, so that the process can adapt to different production conditions and the introduction of new materials, and the adaptability and flexibility of the process are improved.

[0124] Specifically, the process fingerprint atlas is automatically generated from each batch of production data. The process fingerprint atlas records various process parameters and product quality data in each batch of production process, including coating temperature, electroplating current density, laser power, electroplating layer thickness, coating layer porosity, etc. Through the analysis and storage of these data, basis can be provided for subsequent process adjustment and problem investigation. For example, when analyzing the reason for unstable quality of a batch of products, it is found that the fluctuation of the coating temperature leads to it. The software for generating the process fingerprint atlas can be a data analysis software based on a database management system.

[0125] Self-learning is triggered when the deviation of the key parameter exceeds ±2σ. When the deviation of the key process parameter exceeds a certain range, the system automatically starts the self-learning function, analyzes the deviation reason, and adjusts the process parameter. For example, when the electroplating layer thickness deviation is too large, the system analyzes whether the deviation is caused by the electroplating current density, electroplating time or other factors, and then adjusts the parameter accordingly. The self-learning function can be realized through machine learning algorithms such as neural networks, decision trees, etc.

[0126] The historical optimal process template is matched when a new material is introduced. When a new material is introduced, the system searches for the historical process template that best matches the material in the process knowledge base and makes appropriate adjustments based on actual conditions. This can reduce the process debugging time when a new material is introduced and improve production efficiency. For example, when a new copper alloy material is introduced, the system quickly matches a similar historical process template, and after simple adjustment, it is successfully put into production, shortening the process debugging time. The algorithm for matching the historical optimal process template can be a matching algorithm based on similarity calculation.

[0127] A process capability migration feasibility evaluation report is generated. When the production environment or process requirements change, the system evaluates the feasibility of process capability migration and generates an evaluation report. The evaluation report analyzes the adjustment range of process parameters, possible problems encountered, and solutions, etc. For example, when the production site is changed, the system generates an evaluation report indicating that the coating temperature and plating current density need to be adjusted appropriately, and analyzes the possible problems and solutions. The tool for generating the process capability migration feasibility evaluation report can be an evaluation software based on simulation.

[0128] In addition, the forming process also implements cross-process parameter collaborative optimization, including:

[0129] C1: Associated constraint of cold heading forming tolerance band and coating temperature; the cold heading forming tolerance band affects the dimensional accuracy of the blank, and the coating temperature affects the quality of the coating layer, and the associated constraint of the two can ensure the smooth progress of the subsequent process. For example, if the cold heading forming tolerance band is large, the coating temperature may need to be adjusted to adapt to the size change of the blank.

[0130] C2: Synchronous control of plating time window and transmission speed; the plating time window determines the thickness and quality of the plating layer, and the transmission speed affects the production efficiency, and synchronous control of the two can improve the production efficiency while ensuring the plating quality. For example, the plating time window and the transmission speed are adjusted reasonably, so that the blank completes plating and is transported to the next process within a suitable time.

[0131] C3: Matching planning of laser cleaning path and surface activation area. The planning of the laser cleaning path should match the surface activation area, so that the laser can accurately clean the drug film and ensure the surface activation effect. For example, according to the shape and position of the surface activation area, a reasonable laser cleaning path is planned to improve the efficiency and accuracy of laser cleaning.

[0132] The implementation principle of the embodiment is that the establishment of the process knowledge base updating mechanism can make the process continuously adapt to the changes in the production process. The automatic generation of the process fingerprint map facilitates the management and analysis of production data; the self-learning function can timely correct the deviation of the process parameters, improve the stability of the product quality; the matching of the historical optimal process template can speed up the process debugging when a new material is introduced; the generation of the process capacity migration feasibility evaluation report provides a scientific basis for the adjustment and improvement of the process. The cross-process parameter collaborative optimization further improves the collaboration between processes and the overall efficiency of the process. The whole mechanism improves the adaptability and flexibility of the signal PIN forming process, and can better meet the needs of different customers and markets.

[0133] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A forming process for a signal pin, characterized in that, Includes the following steps: S1: Cold heading of copper raw material into a cuboid signal PIN blank; S2: Coating the five non-electroplated surfaces of the blank with a barrier solution, retaining the target electroplated surface; S3: Selective electroplating treatment is performed on the target electroplated surface; S4: The electroplated blank is horizontally conveyed to the first laser station, where a three-axis linkage laser head simultaneously removes the barrier solution coating from the top and left and right sides; S5: Conveyed to the second laser station, where a dual-axis linkage laser head removes the barrier solution coating from the front and back surfaces, completing the encapsulation process; The laser removal parameters in step S4 are related to the thickness of the electroplated layer, including: S41: Establishing a mapping relationship between the coating thickness δ and the laser power P: P=0.8δ+12, with the unit being W; S42: Dynamically adjusting the laser focus diameter based on the real-time detected δ value; S43: The surface roughness Ra after removal is ≤0.6μm; The porosity of the coating layer and the efficiency of laser removal form a feedback mechanism, including: A1: when the porosity is >35%, a high-power coarse removal mode is activated; A2: when the porosity is 20-35%, a graded removal strategy is activated; A3: when the porosity is <20%, a coating parameter optimization command is triggered.

2. The forming process of a signal PIN according to claim 1, characterized in that, The medicinal coating in step S2 includes a gradient curing process, specifically: S21: forming a porous substrate at an ambient temperature of 25-30℃; S22: achieving molecular chain cross-linking of the second coating layer at 50-55℃; S23: completing surface leveling of the third coating layer in a negative pressure environment.

3. The forming process of a signal PIN according to claim 2, characterized in that, The electroplating process in step S3 works synergistically with the coating structure, including: S31: pulse electroplating is performed on the base layer; S32: constant current electroplating is performed on the layer; S33: reverse current leveling is performed on the layer.

4. The forming process of a signal PIN according to claim 1, characterized in that, The electroplating solution components and coating materials form a compatibility system, including: B1: negative correlation adjustment between copper sulfate concentration and polytetrafluoroethylene content; B2: The direct proportional relationship between the amount of brightener added and the particle size of nano-silica; B3: The concentration of the leveling agent is dynamically adjusted according to the viscosity of the epoxy resin.

5. The forming process of a signal PIN according to claim 1, characterized in that, A process parameter correlation matrix is ​​constructed, including: the matching curve of coating temperature gradient and electroplating current density; the compensation algorithm of laser power and electroplating layer thickness; and the dynamic balance equation of transmission speed and surface activation time. The coating temperature gradient consists of temperatures T1, T2, and T3, and the electroplating current density is D, satisfying a linear match of D = 0.35(T2-T1) + 0.18(T3-T2), ensuring the synergy between coating structural strength and deposition rate. The transmission speed is v, and the surface activation time is t, forming an inverse power law relationship of v·t1.2 = C, where C is a material property constant, ensuring dynamic adaptation of surface activation effect to production line cycle time.

6. The forming process of a signal PIN according to claim 5, characterized in that, A closed-loop quality control system is set up, including: an online detection module for coating porosity; a real-time monitoring unit for electroplated layer thickness; a laser removal efficiency feedback controller; and a source tracing mechanism for abnormal data to specific process steps. The online detection module for coating porosity collects three-stage gradient curing data in real time and generates a pore distribution heat map; the real-time monitoring unit for electroplated layer thickness synchronously acquires dynamic parameter adjustment curves and establishes a thickness-current density correlation model; the laser removal efficiency feedback controller dynamically generates a power compensation coefficient based on the coating thickness mapping relationship; and the anomaly source tracing mechanism traces quality deviations to specific process nodes through process fingerprint comparison.

7. The forming process of a signal PIN according to claim 5, characterized in that, Implement cross-process parameter collaborative optimization, including: C1: correlation constraint between cold heading tolerance zone and coating temperature; C2: synchronous control of electroplating time window and transmission speed; C3: matching planning of laser removal path and surface activation area.

8. The forming process of a signal PIN according to claim 7, characterized in that, Establish a process knowledge base update mechanism, including: D1: Automatically generate process fingerprint maps for each batch of production data; D2: Trigger self-learning when the deviation of key parameters exceeds ±2σ; D3: Match the historical best process template when importing new materials; D4: Generate a process capability migration feasibility assessment report.

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