Photoelectric detector

Abstract

The invention relates to the field of photoelectric detectors, and particularly discloses a photoelectric detector. The circuit board, the photosensitive board and other electronic components are arranged in the mounting shell, the first sealing plate and the second sealing plate are used for performing dual sealing on the mounting shell, a stable sealing working environment is formed in the mounting shell, impurities can be effectively prevented from entering the mounting shell after long-time use, and the service life of the mounting shell is prolonged. Therefore, the working environment stability of the photosensitive plate is effectively maintained, and the long-term stable effect of the photoelectric detector is ensured.

Description

Technical Field

[0001] This invention belongs to the field of photodetector technology, and specifically relates to a photodetector. Background Technology

[0002] A photodetector is a semiconductor device that converts light signals into electrical signals and is widely used in optical communication, imaging, and sensing. Its core principle is the photovoltaic effect or photoconductive effect, which generates electron-hole pairs by absorbing photons, forming a measurable electrical signal. Common photodetectors include PIN photodiodes, avalanche photodiodes (APDs), and photoconductive detectors.

[0003] Traditional photodetectors suffer from low sensitivity, poor signal-to-noise ratio under low light conditions, high dark current, and a narrow spectral response range, covering only a portion of the wavelengths. They also exhibit slow response speeds and are susceptible to performance degradation due to environmental temperature and humidity changes over extended periods, particularly in low-light environments. Furthermore, the seal of photodetectors deteriorates over time, allowing dust, moisture, and other contaminants to enter the internal environment. These substances affect the accuracy of the photosensitive area, leading to further performance degradation. Therefore, existing photodetectors cannot operate stably and reliably in low-light conditions for extended periods, necessitating structural improvements. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a photodetector to solve the problem that existing photodetectors cannot function effectively and stably for a long time in low light environments.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A photodetector, comprising:

[0007] The mounting housing includes an outer shell, the top of which has an opening, and the top of the outer shell is connected from the inside to the outside to seal the opening with a first sealing plate and a second sealing plate. An external power connector, an external output head, and a lens are connected to the outer shell.

[0008] A circuit board is connected to the housing, and a temperature detection board is connected to the circuit board. A photosensitive board is connected to the temperature detection board. The photosensitive board is arranged opposite to the lens. An internal output port and an internal power connector are connected to the circuit board. The internal output port and the internal power connector are respectively connected to the external output head and the external power connector.

[0009] Preferably, the photosensitive plate includes, from bottom to top, a silicon substrate, a silicon oxide layer, a hole transport layer, an active deposition layer one, and an active deposition layer two. Electrodes one and two are connected to the active deposition layer two in an interdigitated manner. The active deposition layer one is a MoS2 layer, and the active deposition layer two is a CsPbBr3 layer. Electrodes one and two are a gold grating electrode and a titanium grating electrode, respectively. An Al2O3 protective layer is encapsulated on the electrodes.

[0010] Preferably, the outer casing has a stepped layer inside, and the stepped layer has screw holes. The second sealing plate is connected to the outer casing by connecting screws inserted into the screw holes.

[0011] Preferably, a first sealing groove is formed on the stepped layer, a protruding plate is connected to the inner sidewall of the outer shell, a second sealing plate is fastened to the protruding plate, and the upper surface of the first sealing plate is flush with the top of the stepped layer. The second sealing plate is fastened to the first sealing plate, an annular groove is formed on the first sealing plate, and an outer sealing ring that is engaged in the first sealing groove and an inner sealing ring that is engaged in the annular groove are fixedly connected to the second sealing plate.

[0012] Preferably, the first sealing plate has an annular groove on its side wall, and a first sealing strip is engaged inside the annular groove. An expansion strip is fixedly connected to the side of the first sealing strip near the annular groove, and the expansion strip is not connected to the lower side of the first sealing strip. The inner wall of the outer shell has a second sealing groove opposite to the first sealing strip. The second sealing groove is inverted triangular in shape, and the inner wall of the second sealing groove is inclined. The cross-section of the first sealing strip is triangular.

[0013] Preferably, the first sealing plate has an air hole, and an outer cylinder communicating with the air hole is connected to the first sealing plate. The outer cylinder has a truncated cone-shaped chamber inside, and a sealing block and a first spring are provided inside the chamber. The sealing block is truncated cone-shaped, and one end of the first spring is connected to the sealing block, and the other end is connected to the bottom of the outer cylinder. The bottom of the outer cylinder has multiple holes communicating with the inside of the outer shell.

[0014] Preferably, the inner wall of the outer casing is provided with a plurality of side insertion holes, and the first sealing plate is connected with a plurality of positioning components that cooperate with the side insertion holes. The positioning components include a first side plate fixedly installed on the first sealing plate, a slide rod slidably connected to the first side plate, and a second side plate fixedly installed at the end of the slide rod. A rubber sleeve is connected between the first side plate and the second side plate, and a second spring is connected to the inner wall of the rubber sleeve. The end of the slide rod away from the second side plate is inserted into the side insertion hole.

[0015] Preferably, the rubber sleeve is sealed under normal pressure, and the outer shell is filled with inert gas and sealed under high pressure.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] This invention places electronic components such as circuit boards and photosensitive plates inside a mounting housing, and then uses a first sealing plate and a second sealing plate to double-seal the mounting housing, forming a stable sealed working environment inside the mounting housing. This effectively prevents impurities from entering the mounting housing after long-term use, thereby effectively maintaining the stable working environment of the photosensitive plate and ensuring the long-term stable function of the photodetector. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ;

[0020] Figure 3 This is a partial cross-sectional view of the second sealing plate of the present invention;

[0021] Figure 4 This is a schematic diagram of the second sealing plate structure of the present invention;

[0022] Figure 5 This is a schematic diagram of the internal structure of the mounting shell of the present invention;

[0023] Figure 6 This is a schematic diagram of the first sealing plate structure of the present invention;

[0024] Figure 7 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0025] Figure 8 For the present invention Figure 7 Enlarged view of part A in the middle;

[0026] Figure 9 This is a schematic diagram of the cross-sectional structure of the outer cylinder of the present invention;

[0027] Figure 10 This is a schematic diagram of the cross-sectional structure of the rubber sleeve of the present invention;

[0028] Figure 11 This is a schematic diagram of the photosensitive plate structure of the present invention;

[0029] In the diagram: 1. Outer shell; 2. External power connector; 3. External output head; 4. Lens; 5. Circuit board; 6. Temperature detection board; 7. Photosensitive plate; 71. Silicon substrate; 72. Silicon oxide layer; 73. Hole transport layer; 74. Active deposition layer one; 75. Active deposition layer two; 76. Electrode one; 77. Electrode two; 8. Internal output port; 9. Internal power connector; 10. First sealing groove; 11. Protruding plate; 12. Second sealing groove; 13. Side insertion hole; 14. Screw hole; 15. First sealing plate; 151. Annular groove; 16. First sealing strip; 161. Expansion strip; 17. Outer cylinder; 18. Sealing block; 19. First spring; 20. First side plate; 21. Slide rod; 22. Second side plate; 23. Rubber sleeve; 24. Second spring; 25. Second sealing plate; 26. Outer sealing ring; 27. Inner sealing ring; 28. Connecting screw. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1:

[0032] Please see Figure 1 - Figure 11 As shown, a photodetector includes:

[0033] The mounting housing includes an outer shell 1, with an opening at the top of the outer shell 1. A first sealing plate 15 and a second sealing plate 25 that seal the opening are connected from the inside to the outside of the top of the outer shell 1. An external power connector 2, an external output head 3, and a lens 4 are connected to the outer shell 1.

[0034] Circuit board 5 is connected to the outer casing 1, and temperature detection board 6 is connected to circuit board 5. Photosensitive board 7 is connected to temperature detection board 6. Photosensitive board 7 is arranged opposite to lens 4. Internal output port 8 and internal power connector 9 are connected to circuit board 5. Internal output port 8 and internal power connector 9 are respectively connected to external output head 3 and external power connector 2.

[0035] As can be seen from the above, by placing electronic components such as circuit board 5 and photosensitive board 7 inside the mounting shell, and then using the first sealing plate 15 and the second sealing plate 25 to double seal the mounting shell, a stable sealed working environment is formed inside the mounting shell. This effectively prevents impurities from entering the mounting shell after long-term use, thereby effectively maintaining the stable working environment of photosensitive board 7 and ensuring the long-term stable function of the photodetector. Users can transmit light to photosensitive board 7 through lens 4. Photosensitive board 7 converts the light signal into an electrical signal, and after being processed by conventional means such as the amplification circuit of the circuit board, it is output to the outside from the internal output port 8 and the external output head 3. At the same time, users can also supply power to circuit board 5 through external power connector 2 and internal power connector 9.

[0036] Please see Figure 11 As shown, the photosensitive plate 7 includes a silicon substrate 71, a silicon oxide layer 72, a hole transport layer 73, an active deposition layer 74, and an active deposition layer 75 arranged sequentially from bottom to top. Electrodes 76 and 77, arranged in an interdigitated manner, are connected to the active deposition layer 75. The active deposition layer 74 is a MoS2 layer, and the active deposition layer 75 is a CsPbBr3 layer. Electrodes 76 and 77 are a gold grating electrode and a titanium grating electrode, respectively, and an Al2O3 protective layer is encapsulated on the electrodes.

[0037] The vertically integrated active deposition layer 74 and active deposition layer 75 work together to form a PN heterojunction, reducing carrier recombination. That is, the MoS2 layer and the CsPbBr3 layer can form type-II band alignment to enhance carrier separation efficiency. At the same time, gold nanoparticles can be added to the active layer 75 to enhance light absorption through local surface plasmon resonance, thereby enhancing weak light detection performance. The gold grating electrode and the titanium grating electrode are arranged in an interdigitated pattern to increase the photosensitive area and improve the response speed. Finally, the Al2O3 protective layer is encapsulated to isolate water and oxygen, effectively extending the device life.

[0038] When fabricating the photosensitive layer 7, a PEDOT:PSS hole transport layer 73 can be spin-coated onto the silicon oxide layer 72 of the silicon substrate 71. Then, a monolayer MoS2 layer is grown by chemical vapor deposition as the active deposition layer 74. Next, a CsPbBr3 film is coated by solution method and Au NPs are embedded to form the active deposition layer 75. Then, Au and Ti grating electrodes are prepared by electron beam evaporation to form electrode 76 and electrode 77. Finally, a 50nm Al2O3 protective layer is deposited by ALD.

[0039] Please see Figure 3As shown, the outer shell 1 has a stepped layer inside, and screw holes 14 are provided on the stepped layer. The second sealing plate 25 is connected to the outer shell 1 by connecting screws 28 inserted into the screw holes 14. The second sealing plate 25 can be stably installed on the outer shell 1 by connecting screws 28 and screw holes 14, thereby sealing the internal cavity of the outer shell 1.

[0040] Please see Figure 3 - Figure 5 As shown, to enhance the sealing of the internal cavity of the outer shell 1, a first sealing groove 10 is provided on the stepped layer, a protruding plate 11 is connected to the inner sidewall of the outer shell 1, a second sealing plate 25 is fastened to the protruding plate 11, and the upper surface of the first sealing plate 15 is flush with the top of the stepped layer. The second sealing plate 25 is fastened to the first sealing plate 15, an annular groove 151 is provided on the first sealing plate 15, and an outer sealing ring 26 that is snapped into the first sealing groove 10 and an inner sealing ring 27 that is snapped into the annular groove 151 are fixedly connected to the second sealing plate 25.

[0041] As can be seen from the above, before installing the second sealing plate 25, the first sealing plate 15 can be placed on top of the convex plate 11 so that the upper surface of the first sealing plate 15 is flush with the top of the stepped layer. Then, the second sealing plate 25 is placed on top of the first sealing plate 15 and the stepped layer. At this time, the outer sealing ring 26 is engaged in the first sealing groove 10, and the inner sealing ring 27 is engaged in the annular groove 151. The outer sealing ring 26, the second sealing plate 25 and the inner sealing ring 27 block the joint gap between the first sealing plate 15 and the outer shell 1, thereby improving the sealing performance of the first sealing plate 15. Then, the second sealing plate 25 is installed on the outer shell 1 by connecting screws 28.

[0042] Please see Figure 7 - Figure 8 As shown, the first sealing plate 15 has an annular groove on its side wall, and a first sealing strip 16 is engaged inside the annular groove. An expansion strip 161 is fixedly connected to the side of the first sealing strip 16 near the annular groove. The expansion strip 161 expands when heated, and the expansion strip 161 is not connected to the lower side of the first sealing strip 16. The inner wall of the outer shell 1 has a second sealing groove 12 opposite to the first sealing strip 16. The second sealing groove 12 is arranged in an inverted triangle shape, and the inner wall of the second sealing groove 12 is inclined. The cross-section of the first sealing strip 16 is triangular.

[0043] After the user has installed the first sealing plate 15, the periphery of the first sealing plate 15 can be heated, causing the expansion strip 161 to expand due to the heat. The expanded and widened expansion strip 161 pushes the first sealing strip 16 outward, forcing the lower side of the first sealing strip 16 to move outward into the second sealing groove 12, blocking the connection gap between the first sealing plate 15 and the outer shell 1.

[0044] Please see Figure 6 and Figure 9 As shown, the first sealing plate 15 has an air hole, and an outer cylinder 17 connected to the first sealing plate 15 and communicating with the air hole is connected to the first sealing plate 15. The outer cylinder 17 has a frustum-shaped chamber inside, and a sealing block 18 and a first spring 19 are provided inside the chamber. The sealing block 18 is frustum-shaped, and one end of the first spring 19 is connected to the sealing block 18, and the other end is connected to the bottom of the outer cylinder 17. The bottom of the outer cylinder 17 has multiple holes communicating with the inside of the outer shell 1.

[0045] Please see Figure 6 and Figure 10 As shown above, in order to further improve the sealing performance of the inner shell 1, the user can insert the pipe of the vacuum pump into the air hole and push the sealing block 18 downward to compress the first spring 19. At this time, a gap appears between the sealing block 18 and the outer cylinder 17, thereby drawing away the gas inside the outer shell 1. Then, inert gas is filled into the inner shell 1 to create a high-pressure environment inside the outer shell 1. The gas under the high-pressure environment will press on the inclined first sealing strip 16, so that the first sealing strip 16 fits tightly in the second sealing groove 12, enhancing the function of the first sealing strip 16.

[0046] Example 2:

[0047] Please see Figure 1 - Figure 11 As shown, a photodetector includes:

[0048] The mounting housing includes an outer shell 1, with an opening at the top of the outer shell 1. A first sealing plate 15 and a second sealing plate 25 that seal the opening are connected from the inside to the outside of the top of the outer shell 1. An external power connector 2, an external output head 3, and a lens 4 are connected to the outer shell 1.

[0049] Circuit board 5 is connected to the outer casing 1, and temperature detection board 6 is connected to circuit board 5. Photosensitive board 7 is connected to temperature detection board 6. Photosensitive board 7 is arranged opposite to lens 4. Internal output port 8 and internal power connector 9 are connected to circuit board 5. Internal output port 8 and internal power connector 9 are respectively connected to external output head 3 and external power connector 2.

[0050] As can be seen from the above, by placing electronic components such as circuit board 5 and photosensitive board 7 inside the mounting shell, and then using the first sealing plate 15 and the second sealing plate 25 to double seal the mounting shell, a stable sealed working environment is formed inside the mounting shell. This effectively prevents impurities from entering the mounting shell after long-term use, thereby effectively maintaining the stable working environment of photosensitive board 7 and ensuring the long-term stable function of the photodetector. Users can transmit light to photosensitive board 7 through lens 4. Photosensitive board 7 converts the light signal into an electrical signal, and after being processed by conventional means such as the amplification circuit of the circuit board, it is output to the outside from the internal output port 8 and the external output head 3. At the same time, users can also supply power to circuit board 5 through external power connector 2 and internal power connector 9.

[0051] Please see Figure 11 As shown, the photosensitive plate 7 includes a silicon substrate 71, a silicon oxide layer 72, a hole transport layer 73, an active deposition layer 74, and an active deposition layer 75 arranged sequentially from bottom to top. Electrodes 76 and 77, arranged in an interdigitated manner, are connected to the active deposition layer 75. The active deposition layer 74 is a MoS2 layer, and the active deposition layer 75 is a CsPbBr3 layer. Electrodes 76 and 77 are a gold grating electrode and a titanium grating electrode, respectively, and an Al2O3 protective layer is encapsulated on the electrodes.

[0052] The vertically integrated active deposition layer 74 and active deposition layer 75 work together to form a PN heterojunction, reducing carrier recombination. That is, the MoS2 layer and the CsPbBr3 layer can form type-II band alignment to enhance carrier separation efficiency. At the same time, gold nanoparticles can be added to the active layer 75 to enhance light absorption through local surface plasmon resonance, thereby enhancing weak light detection performance. The gold grating electrode and the titanium grating electrode are arranged in an interdigitated pattern to increase the photosensitive area and improve the response speed. Finally, the Al2O3 protective layer is encapsulated to isolate water and oxygen, effectively extending the device life.

[0053] When fabricating the photosensitive layer 7, a PEDOT:PSS hole transport layer 73 can be spin-coated onto the silicon oxide layer 72 of the silicon substrate 71. Then, a monolayer MoS2 layer is grown by chemical vapor deposition as the active deposition layer 74. Next, a CsPbBr3 film is coated by solution method and Au NPs are embedded to form the active deposition layer 75. Then, Au and Ti grating electrodes are prepared by electron beam evaporation to form electrode 76 and electrode 77. Finally, a 50nm Al2O3 protective layer is deposited by ALD.

[0054] Please see Figure 3As shown, the outer shell 1 has a stepped layer inside, and screw holes 14 are provided on the stepped layer. The second sealing plate 25 is connected to the outer shell 1 by connecting screws 28 inserted into the screw holes 14. The second sealing plate 25 can be stably installed on the outer shell 1 by connecting screws 28 and screw holes 14, thereby sealing the internal cavity of the outer shell 1.

[0055] Please see Figure 3 - Figure 5 As shown, to enhance the sealing of the internal cavity of the outer shell 1, a first sealing groove 10 is provided on the stepped layer, a protruding plate 11 is connected to the inner sidewall of the outer shell 1, a second sealing plate 25 is fastened to the protruding plate 11, and the upper surface of the first sealing plate 15 is flush with the top of the stepped layer. The second sealing plate 25 is fastened to the first sealing plate 15, an annular groove 151 is provided on the first sealing plate 15, and an outer sealing ring 26 that is snapped into the first sealing groove 10 and an inner sealing ring 27 that is snapped into the annular groove 151 are fixedly connected to the second sealing plate 25.

[0056] As can be seen from the above, before installing the second sealing plate 25, the first sealing plate 15 can be placed on top of the convex plate 11 so that the upper surface of the first sealing plate 15 is flush with the top of the stepped layer. Then, the second sealing plate 25 is placed on top of the first sealing plate 15 and the stepped layer. At this time, the outer sealing ring 26 is engaged in the first sealing groove 10, and the inner sealing ring 27 is engaged in the annular groove 151. The outer sealing ring 26, the second sealing plate 25 and the inner sealing ring 27 block the joint gap between the first sealing plate 15 and the outer shell 1, thereby improving the sealing performance of the first sealing plate 15. Then, the second sealing plate 25 is installed on the outer shell 1 by connecting screws 28.

[0057] Please see Figure 7 - Figure 8 As shown, the first sealing plate 15 has an annular groove on its side wall, and a first sealing strip 16 is engaged inside the annular groove. An expansion strip 161 is fixedly connected to the side of the first sealing strip 16 near the annular groove. The expansion strip 161 expands when heated, and the expansion strip 161 is not connected to the lower side of the first sealing strip 16. The inner wall of the outer shell 1 has a second sealing groove 12 opposite to the first sealing strip 16. The second sealing groove 12 is arranged in an inverted triangle shape, and the inner wall of the second sealing groove 12 is inclined. The cross-section of the first sealing strip 16 is triangular.

[0058] After the user has installed the first sealing plate 15, the periphery of the first sealing plate 15 can be heated, causing the expansion strip 161 to expand due to the heat. The expanded and widened expansion strip 161 pushes the first sealing strip 16 outward, forcing the lower side of the first sealing strip 16 to move outward into the second sealing groove 12, blocking the connection gap between the first sealing plate 15 and the outer shell 1.

[0059] Please see Figure 6 and Figure 9 As shown, the first sealing plate 15 has an air hole, and an outer cylinder 17 connected to the first sealing plate 15 and communicating with the air hole is connected to the first sealing plate 15. The outer cylinder 17 has a frustum-shaped chamber inside, and a sealing block 18 and a first spring 19 are provided inside the chamber. The sealing block 18 is frustum-shaped, and one end of the first spring 19 is connected to the sealing block 18, and the other end is connected to the bottom of the outer cylinder 17. The bottom of the outer cylinder 17 has multiple holes communicating with the inside of the outer shell 1.

[0060] Please see Figure 6 and Figure 10 As shown above, in order to further improve the sealing performance of the inner shell 1, the user can insert the pipe of the vacuum pump into the air hole and push the sealing block 18 downward to compress the first spring 19. At this time, a gap appears between the sealing block 18 and the outer cylinder 17, thereby drawing away the gas inside the outer shell 1. Then, inert gas is filled into the inner shell 1 to create a high-pressure environment inside the outer shell 1. The gas under the high-pressure environment will press on the inclined first sealing strip 16, so that the first sealing strip 16 fits tightly in the second sealing groove 12, enhancing the function of the first sealing strip 16.

[0061] The inner wall of the outer casing 1 is provided with a plurality of side insertion holes 13. The first sealing plate 15 is connected with a plurality of positioning components that cooperate with the side insertion holes 13. The positioning components include a first side plate 20 fixedly installed on the first sealing plate 15, a slide rod 21 slidably connected to the first side plate 20, and a second side plate 22 fixedly installed at the end of the slide rod 21. A rubber sleeve 23 is connected between the first side plate 20 and the second side plate 22. The rubber sleeve 23 is sealed under normal pressure. A second spring 24 is connected to the inner wall of the rubber sleeve 23. The end of the slide rod 21 away from the second side plate 22 is inserted into the side insertion hole 13.

[0062] As can be seen from the above, when the internal air pressure of the outer shell 1 increases, the strong pressure causes the rubber sleeve 23 under normal pressure to deform and shrink. At this time, the rubber sleeve 23 shrinks and compresses the second spring 24. The rubber sleeve 23 and the second spring 24 drive the second side plate 22 and the slide rod 21 to move. The slide rod 21 slides out of the first side plate 20 and is inserted into the side insertion hole 13. At this time, the first sealing plate 15 and the outer shell 1 are connected, so as to avoid the high pressure environment inside the outer shell 1 causing the connection of the first sealing plate 15 to be unstable and the sealing performance to be damaged.

[0063] All standard parts used in this invention can be purchased commercially, and irregularly shaped parts can be customized according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are mature technologies in the prior art. The machinery, parts, and equipment all use conventional models in the prior art, and the circuit connections also use conventional connection methods in the prior art, which will not be detailed here. Any content not described in detail in this specification belongs to the prior art known to those skilled in the art.

[0064] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0065] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0066] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0067] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0068] The accompanying drawings of the embodiments disclosed in this invention only involve structures relevant to the embodiments disclosed in this invention. Other structures can be referred to with common designs. Unless otherwise specified, the same embodiment and different embodiments of this invention can be combined with each other.

Claims

1. A photodetector, characterized in that, include: The mounting housing includes an outer shell (1), the top of which is provided with an opening, and the top of the outer shell (1) is connected from the inside to the outside with a first sealing plate (15) and a second sealing plate (25) to seal the opening. An external power connector (2), an external output head (3) and a lens (4) are connected to the outer shell (1). A circuit board (5) is connected to the outer casing (1), and a temperature detection board (6) is connected to the circuit board (5). A photosensitive board (7) is connected to the temperature detection board (6). The photosensitive board (7) is arranged opposite to the lens (4). An internal output port (8) and an internal power connector (9) are connected to the circuit board (5). The internal output port (8) and the internal power connector (9) are respectively connected to the external output head (3) and the external power connector (2).

2. A photodetector according to claim 1, characterized in that: The photosensitive plate (7) includes a silicon substrate (71), a silicon oxide layer (72), a hole transport layer (73), an active deposition layer one (74), and an active deposition layer two (75) arranged sequentially from bottom to top. Electrode one (76) and electrode two (77) arranged in an interdigitated manner are connected to the active deposition layer two (75). The active deposition layer one (74) is a MoS2 layer, and the active deposition layer two (75) is a CsPbBr3 layer. Electrode one (76) and electrode two (77) are a gold grating electrode and a titanium grating electrode, respectively. An Al2O3 protective layer is encapsulated on the electrodes.

3. A photodetector according to claim 1, characterized in that: The outer shell (1) has a stepped layer inside, and screw holes (14) are provided on the stepped layer. The second sealing plate (25) is connected to the outer shell (1) by a connecting screw (28) inserted into the screw hole (14).

4. A photodetector according to claim 3, characterized in that: A first sealing groove (10) is provided on the stepped layer, a protruding plate (11) is connected to the inner side wall of the outer shell (1), a second sealing plate (25) is fastened to the protruding plate (11), and the upper surface of the first sealing plate (25) is flush with the top of the stepped layer. The second sealing plate (25) is fastened to the first sealing plate (15), an annular groove (151) is provided on the first sealing plate (15), and an outer sealing ring (26) that is snapped into the first sealing groove (10) and an inner sealing ring (27) that is snapped into the annular groove (151) are fixedly connected to the second sealing plate (25).

5. A photodetector according to claim 4, characterized in that: The first sealing plate (15) has an annular groove on its side wall, and a first sealing strip (16) is engaged inside the annular groove. An expansion strip (161) is fixedly connected to the side of the first sealing strip (16) near the annular groove, and the expansion strip (161) is not connected to the lower side of the first sealing strip (16). The inner wall of the outer shell (1) has a second sealing groove (12) opposite to the first sealing strip (16). The second sealing groove (12) is inverted triangular in shape, and the inner wall of the second sealing groove (12) is inclined. The cross-section of the first sealing strip (16) is triangular.

6. A photodetector according to claim 5, characterized in that: The first sealing plate (15) has an air hole, and an outer cylinder (17) connected to the first sealing plate (15) and communicating with the air hole is connected to the first sealing plate (15). The outer cylinder (17) has a chamber with a frustum shape inside. A sealing block (18) and a first spring (19) are provided inside the chamber. The sealing block (18) is frustum shaped, and one end of the first spring (19) is connected to the sealing block (18), and the other end is connected to the bottom of the outer cylinder (17). The bottom of the outer cylinder (17) has multiple holes communicating with the inside of the outer shell (1).

7. A photodetector according to claim 6, characterized in that: The inner wall of the outer shell (1) is provided with a plurality of side insertion holes (13). The first sealing plate (15) is connected with a plurality of positioning components that cooperate with the side insertion holes (13). The positioning components include a first side plate (20) fixedly installed on the first sealing plate (15), a slide rod (21) slidably connected to the first side plate (20), and a second side plate (22) fixedly installed at the end of the slide rod (21). A rubber sleeve (23) is connected between the first side plate (20) and the second side plate (22). A second spring (24) is connected to the inner wall of the rubber sleeve (23). The end of the slide rod (21) away from the second side plate (22) is inserted into the side insertion hole (13).

8. A photodetector according to claim 7, characterized in that: The rubber sleeve (23) is sealed under normal pressure, and the outer shell (1) is filled with inert gas and sealed under high pressure.

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