Connector for precursor delivery

Abstract

A connector for a substrate processing system includes a body including a first body portion including an inlet and an outlet and defining a first airflow channel extending from the inlet to the outlet in a first direction. The second body portion includes an inlet and defines a second airflow passage extending in a second direction different from the first direction. A 'T'-shaped conduit is disposed in the first airflow passage, the 'T'-shaped conduit including a first conduit portion defining a third airflow passage extending in the second direction and including an inlet connected to the second airflow passage. A second conduit portion is connected to a downstream side of the first body portion and defines a fourth airflow passage extending in the first direction and in fluid communication with the third airflow passage.

Description

Cross-reference to related applications

[0001] This application claims priority to U.S. Provisional Application No. 63 / 452,328, filed March 15, 2023. The entire disclosure of the aforementioned application is incorporated herein by reference. Technical Field

[0002] This disclosure relates to substrate processing systems, and more particularly to connectors for precursor delivery. Background Technology

[0003] The background description provided herein is for the purpose of presenting the general context of this disclosure. The work of the currently designated inventors within the scope described in this background section, as well as aspects of the specification that could not be identified as prior art at the time of filing, are neither express nor implied admissions of prior art to this disclosure.

[0004] Substrate processing systems can be used to process substrates such as semiconductor wafers. Substrate processing can include deposition, etching, cleaning, and / or other substrate treatments. The substrate is arranged on a substrate support such as an electrostatic chuck (ESC) within a processing chamber. During processing, a gas delivery system introduces gas mixtures and / or vapors into the processing chamber using nozzles, injectors, and / or other gas distribution devices.

[0005] During atomic layer deposition (ALD) or atomic layer etching (ALE), the substrate is cycled through a process that includes exposure to a first precursor, a first clean step, exposure to a second precursor, and a second clean step. Because ALD or ALE processes typically deposit or etch a single layer during each cycle, the repetition rate of ALD or ALE processes is quite high. Summary of the Invention

[0006] A connector for a substrate processing system includes a body comprising: a first body portion having an inlet and an outlet, and defining a first airflow passage extending from the inlet to the outlet along a first direction; a second body portion having an inlet and defining a second airflow passage extending along a second direction different from the first direction; a T-shaped conduit disposed in the first airflow passage, the T-shaped conduit comprising: a first conduit portion defining a third airflow passage extending along the second direction, and having an inlet connected to the second airflow passage; and a second conduit portion connected to a downstream side of the first body portion and defining a fourth airflow passage extending along the first direction and in fluid communication with the third airflow passage.

[0007] Among other features, the first body portion includes a first slot and a second slot located on the inner surface of the first airflow channel, wherein opposite sides of the first conduit portion are received in the first slot and the second slot. The second body portion includes an interlocking portion configured to engage the inlet of the first conduit portion. The interlocking portion of the second body portion includes a gas conduit, the gas conduit including a male protrusion received within the inlet of the first conduit portion. A plug is disposed in the third airflow channel and located downstream of the connection with the fourth airflow channel, and the plug includes an arched surface configured to redirect airflow in the third airflow channel to the fourth airflow channel.

[0008] Among other features, the inner diameter of the first airflow channel is larger than the outer diameters of the first and second conduit portions. The inner diameter of the first airflow channel is at least 1.5 times the outer diameters of the first and second conduit portions. The first direction is transverse to the second direction.

[0009] A connector for a substrate processing system includes a body comprising: a first body portion having an inlet and an outlet, and defining a first gas flow channel extending between the inlet and the outlet along a first direction; and a second body portion having an inlet and defining a second gas flow channel extending along a second direction different from the first direction. A gas conduit is disposed in the first gas flow channel and defines a third gas flow channel extending along the second direction. The gas conduit also includes an inlet connected to the second gas flow channel and includes a plurality of gas through-holes passing through the gas conduit on a downstream side of the gas conduit.

[0010] Among other features, the first body portion includes a first slot and a second slot located in the first airflow channel, and the first slot and the second slot are configured to receive opposite sides of the gas conduit. The second body portion includes an interlocking portion configured to engage the inlet of the gas conduit. The interlocking portion of the second body portion includes a gas conduit, the gas conduit including a male protrusion received within the inlet of the gas conduit. A plug is disposed in the gas conduit downstream of the plurality of gas through-holes.

[0011] Among other features, the inner diameter of the first airflow channel is larger than the outer diameter of the gas conduit. The inner diameter of the first airflow channel is at least 1.5 times the outer diameter of the gas conduit. The plurality of gas through-holes are configured to provide a tapered airflow pattern. The first direction is transverse to the second direction.

[0012] A connector for a substrate processing system includes a body comprising: a first body portion having an inlet and an outlet, and defining a first airflow channel extending from the inlet to the outlet along a first direction; and a second body portion having an inlet and an outlet and defining a second airflow channel extending along a second direction different from the first direction. A cantilever body portion extends from the second body portion into the first airflow channel and includes an inclined body portion extending from the second body portion into the first airflow channel. A third body portion extends from the inclined body portion in the first airflow channel. The second airflow channel extends through the second body portion, the inclined body portion, and the first body portion. Gas flowing through the first airflow channel mixes with gas flowing through the second airflow channel at the outlet of the third body portion.

[0013] Among other features, the connector is manufactured using additive manufacturing technology. The inner diameter of the first airflow channel is larger than the outer diameter of the inclined body portion and the third body portion of the cantilever body. The inner diameter of the first airflow channel is 1.5 times larger than the outer diameter of the inclined body portion and the third body portion of the cantilever body. The first direction is transverse to the second direction. A cavity is defined in the second body portion surrounding the second airflow channel. A heater is arranged in the cavity.

[0014] The further scope of the applicability of this disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0015] This disclosure will be more fully understood in light of the detailed description and accompanying drawings, in which:

[0016] Figure 1 The present disclosure provides a functional block diagram of a substrate processing system including a gas delivery system, wherein the gas delivery system includes a "T"-shaped connector.

[0017] Figure 2 This is a flowchart of a method for performing atomic layer deposition according to the present disclosure.

[0018] Figures 3A to 3C This is a functional block diagram illustrating the gas flow during ALD according to this disclosure.

[0019] Figure 4A This is a side cross-sectional view of a "T"-shaped connector according to this disclosure.

[0020] Figure 4B This is a partial top view of the "T"-shaped connector according to this disclosure.

[0021] Figure 5A and Figure 5B A perspective view of a "T"-shaped connector according to this disclosure.

[0022] Figure 6A This is a side cross-sectional view of another "T"-shaped connector according to this disclosure.

[0023] Figure 6B Showing a bottom view of the hole pattern according to this disclosure.

[0024] Figure 6C Showing the use of Figure 6B A perspective view of the gas jet pattern of the hole pattern.

[0025] Figure 7A This is a side cross-sectional view of another "T"-shaped connector according to this disclosure. as well as

[0026] Figure 7B for Figure 7A A top view of the "T" shaped connector.

[0027] In the accompanying drawings, reference numerals may be used repeatedly to identify similar and / or identical elements. Detailed Implementation

[0028] Although the “T” connector is described below in the context of atomic layer deposition (ALD) processes, the “T” connector according to this disclosure can be used in atomic layer etching (ALE), chemical vapor deposition (CVD), plasma-enhanced layer deposition or other types of substrate processing.

[0029] In some applications, different gas or vapor mixtures are supplied via different gas flow paths, and these mixtures are mixed at a connector, such as a "T" connector, before being delivered to the processing chamber. It should be understood that ineffective mixing of gases and / or vapors delivered to the processing chamber via the "T" connector during substrate processing can adversely affect substrate non-uniformity (NU). For example, ineffective mixing of carrier gas and precursors during the dosing step in atomic layer deposition (ALD) can lead to variations in film deposition thickness at different locations on the substrate.

[0030] To improve gas mixing after the "T" connector, a spiral mixer can be used. The spiral mixer is arranged inside the gas conduit and includes a spiral section extending into the gas flow channel to induce spiral mixing of the gas flowing through it. While the spiral mixer in the gas conduit increases the mixing of the gas supplied by the "T" connector, it can cause unacceptable pressure drops and / or backflow of the purge gas and / or second precursor during a burst purging step. The spiral mixer may also increase substrate defects by introducing unwanted particles and / or powder.

[0031] The "T" connector according to this disclosure improves mixing, reduces NU without causing high pressure drop and / or backflow, and reduces particle formation in the conduit. In some examples, the "T" connector described below reduces pressure drop by 50% or more during burst purge.

[0032] Now for reference Figure 1 The substrate processing system 200 includes a processing chamber 210, which contains a gas distribution device 211, such as a nozzle, injector, or other gas distribution device. A substrate support 212, such as an electrostatic chuck or base, is arranged in the processing chamber 210. The substrate 213 is transported to the processing chamber 210 by a robot, processed, and then removed from the processing chamber 210 by the robot.

[0033] Gas delivery system 204 includes a T-connector 250. A gas source is connected to the T-connector 250. Gas source 214 is selectively fluidly connected to a first inlet of the T-connector 250 via valve 216. Similarly, gas sources 218, 222, and 228 are selectively fluidly connected to the first inlet of the T-connector 250 via valves 220, 224, and 230. Gas source 244 is selectively fluidly connected to a second inlet of the T-connector 250 via valve 246. The outlet of the T-connector 250 is fluidly connected to a gas distribution device 211. The gas source can supply a single gas, a mixture of carrier gas and delivered vapor, a mixture of two or more gases, etc. In some examples, the gas flow channel and / or gas conduit has a circular profile, but other profiles may also be used.

[0034] In some examples, gas source 214 supplies an inert gas or carrier gas, such as argon (Ar). Gas source 218 supplies a purge gas, such as molecular nitrogen (N2). Gas source 244 supplies a first precursor. Gas source 222 supplies a second precursor, such as an oxidant.

[0035] Now for reference Figure 2The diagram illustrates a method 258 for performing atomic layer deposition. At 260, a substrate 213 is exposed to a first precursor (and a carrier gas from gas source 214) for a first predetermined time period. After exposure to the first precursor, a purge chamber 210 is purged at 264 using a purge gas from gas source 218 for a second predetermined time period. After the second predetermined time period, at 268, the substrate 213 is exposed to a second precursor (e.g., an oxidant) from gas source 222 for a third predetermined time period. After the third predetermined time period, the purge chamber 210 is purged at 270. This process can be repeated once or multiple times.

[0036] Now for reference Figures 3A to 3C This shows the airflow during the ALD process. Figure 3A The image shows the first precursor being dispensed during the supply of carrier gas from gas source 214 and a first precursor from gas source 244 to the "T" connector 250, gas distribution device 211, and processing chamber 210. Figure 3B The image shows the cleaning steps during the supply of cleaning gas from gas source 218 to the T-connector 250, gas distribution device 211, and processing chamber 210. (See reference...) Figure 3C The second precursor is dispensed during the process of supplying gas from gas source 222 to "T" connector 250, gas distribution equipment and processing chamber 210.

[0037] Now for reference Figure 4A and Figure 4B The "T"-shaped connector 300 includes a body 310, which includes a first body portion 312 extending in a first direction and a second body portion 313 extending in a second direction transverse to the first direction. The first body portion 312 defines a first airflow passage 314 extending in the first direction. The second body portion 313 defines a second airflow passage 318 extending in the second direction and intersecting with the first airflow passage 314.

[0038] A T-shaped conduit 320 is disposed in a first airflow passage 314 and includes a first conduit portion 321 extending in a second direction and defining a third airflow passage 324 in fluid communication with a second airflow passage 318. The T-shaped conduit 320 includes a second conduit portion 325 extending in a first direction and defining a fourth airflow passage 326. In some examples, a plug 327 defining an arched surface 329 is disposed in the third airflow passage 324 and downstream of the connection with the second conduit portion 325. The arched surface 329 of the plug 327 redirects the airflow in the second direction to flow towards the outlet in the first direction.

[0039] The T-shaped conduit 320 redirects gas flowing in the second direction in the third airflow channel 324 into the fourth airflow channel 326 extending in the first direction. Gas flowing in the first airflow channel 314 flows around the T-shaped conduit 320. Gas flowing in the second airflow channel 318 is redirected by the third airflow channel 324 of the T-shaped conduit 320 into the fourth airflow channel 326 extending in the first direction.

[0040] The gas exiting the fourth airflow channel 326 mixes with the gas flowing in the first airflow channel 314. In some examples, the gas flowing in the first airflow channel 314 flows slower than the gas flowing in the fourth airflow channel 326. This velocity difference between the gas flowing in the first airflow channel 314 and the gas flowing in the fourth airflow channel 326 causes mixing to occur.

[0041] exist Figure 4B In the T-shaped connector 300, the inner diameter of the first airflow channel 314 is larger than the outer diameter of the first conduit portion 321 and the second conduit portion 325. This configuration allows gas flowing in the first airflow channel 314 to flow around the T-shaped conduit 320 without significant back pressure. In some examples, the inner diameter of the first airflow channel is at least 1.5 times the outer diameter of the first conduit portion 321 and / or the second conduit portion 325. In some examples, the inner diameter of the first airflow channel is at least twice the outer diameter of the first conduit portion 321 and / or the second conduit portion 325.

[0042] The “T”-shaped conduit 320 serves as a flow guide to deliver the precursor into the carrier gas flow during the dosing step while preventing precursor stratification. Due to the Coanda effect, improved mixing occurs downstream of the outlet of the “T”-shaped conduit 320. Therefore, the “T”-shaped connector improves mixing and reduces substrate inhomogeneity without causing back pressure and / or backflow associated with other methods, such as spiral mixers.

[0043] Now for reference Figure 5A and Figure 5BExamples of a "T"-shaped conduit 320 and a "T"-shaped connector 300 are shown. In some examples, the inner diameter of a first airflow passage 314 defines a rectangular slot 360 to receive opposite ends of the first conduit portion of the "T"-shaped conduit 320. A second airflow passage 318 is defined by a gas conduit 362, which includes an interlock 364 to engage the "T"-shaped conduit 320. For example, the interlock 364 may include a male protrusion extending into a third airflow passage 324 of the "T"-shaped conduit 320. In some examples, the "T"-shaped conduit 320 is inserted into the slot 360 while the gas conduit 362 is positioned in a partially installed location. When the "T"-shaped conduit 320 is seated in the slot 360, the gas conduit 362 moves laterally to engage the interlock 364 with the inlet of the first conduit portion of the "T"-shaped conduit 320. Although the conduit 362 includes a male protrusion, a female protrusion may also be used.

[0044] In some examples, the gas conduit 362 and the "T"-shaped conduit 320 are made of aluminum. In some examples, the body 310 is made of ceramic (e.g., alumina, zirconium oxide, silicon nitride, silicon oxide, etc.).

[0045] Now for reference Figures 6A to 6C This shows a "T"-shaped connector 400. In some examples, a gas conduit 410 is used instead of the "T"-shaped conduit 320. The gas conduit 410 extends linearly and defines a third gas flow channel 412 that receives gas from the second gas flow channel 318. The third gas flow channel 412 includes a gas through-hole 414 to supply gas downward along a first direction from the third gas flow channel 412 into the first gas flow channel 314 where the mixing occurs.

[0046] exist Figure 6B In this configuration, gas via 414 may include multiple gas vias. For example, one or more central gas vias may be surrounded by multiple gas vias arranged symmetrically or asymmetrically. In some examples, the gas vias extend in a radial direction relative to the gas conduit 410. In other examples, the gas vias define a tapered pattern 420, such as... Figure 6C As shown. In other words, one or more central gas through-holes may be aligned with the radial direction, and other gas through-holes surrounding one or more central gas through-holes may be offset from the radial direction to define a conical airflow pattern.

[0047] Now for reference Figure 7AThe "T"-shaped connector 500 can be manufactured using additive manufacturing methods such as 3D printing. The "T"-shaped connector 500 includes a body 510, which includes a first body portion 511 extending in a first direction and a second body portion 512 extending in a second direction transverse to the first direction. The first body portion 511 defines a first airflow passage 514 extending along the first direction and including an inlet 513 and an outlet 515. The second body portion 512 defines a second airflow passage 518 extending along the second direction and including an inlet 517.

[0048] The cantilever body portion 519 extends from the second body portion 512 into the first airflow passage 514. The cantilever body portion 519 includes an inclined body portion 520 and a third body portion 522. The cantilever body portion 519 extends into the first airflow passage 514 in a second direction, turns at the inclined body portion 520, while the third body portion 522 extends in the first airflow passage 514 in a first direction. The third body portion 522 partially extends toward the outlet 515 of the first body portion 511. In some examples, the cantilever body portion 519 includes a triangular reinforcing member 538 extending between the first airflow passage 514 and the sidewall of the cantilever body portion 519.

[0049] like Figure 7B As shown, gas flowing into the inlet 513 of the first airflow channel 514 flows along a first direction around the cantilever body portion 519 to the outlet 515. Gas flowing into the second airflow channel 518 along a second direction flows through the inclined body portion 520 and enters the third body portion 522, then exits the cantilever body portion 519 and mixes with the gas in the first airflow channel. In some examples, the inclined body portion 520 is rotated or bent by 90°.

[0050] In some examples, the "T" connector 500 is made of ceramic. In some examples, the "T" connector 500 includes cavities 530 and 531 defined during additive manufacturing. In some examples, cavity 530 is defined around the second airflow passage 518 and cavity 531 is defined near outlet 515. In some examples, cavities 530 and / or 531 are annular. In some examples, heater 525 is arranged in cavity 530 to heat the gas flowing in the second airflow passage 518. In some examples, heater 525 comprises a resistance heater.

[0051] The foregoing description is merely illustrative in nature and is in no way intended to limit this disclosure, its application, or its use. The broad teachings of this disclosure can be implemented in various forms. Therefore, while this disclosure includes specific examples, its true scope should not be so limited, as other modifications will become apparent upon examination of the drawings, specification, and appended claims. It should be understood that one or more steps in the method may be performed in different orders (or simultaneously) without altering the principles of this disclosure. Furthermore, while each embodiment is described above as having certain features, any one or more of those features described relative to any embodiment of this disclosure may be implemented in and / or combined with features of any other embodiment, even if such combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitution of one or more embodiments for each other remains within the scope of this disclosure.

[0052] Various terms are used to describe spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including “connection,” “joint,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “set.” Unless the relationship between the first and second elements is explicitly described as “direct,” the relationship described in the above disclosure can be a direct relationship, where no other intermediate element exists between the first and second elements, but it can also be an indirect relationship, where one or more intermediate elements exist between the first and second elements (spatially or functionally). As used herein, the phrase “at least one of A, B, and C” should be interpreted as meaning the use of a non-exclusive logical OR (A or B or C) logic and should not be interpreted as meaning “at least one of A, at least one of B, and at least one of C.”

Claims

1. A connector for a substrate processing system, comprising: The main body, which includes: A first main body includes an inlet and an outlet, and defines a first airflow passage extending from the inlet to the outlet along a first direction; as well as The second main body includes an inlet and defines a second airflow passage extending in a second direction different from the first direction; and A "T"-shaped conduit is disposed in the first airflow channel, the "T"-shaped conduit comprising: A first duct portion defines a third airflow passage extending along the second direction and includes an inlet connected to the second airflow passage; as well as The second conduit portion is connected to the downstream side of the first main body portion and defines a fourth airflow channel that extends along the first direction and is in fluid communication with the third airflow channel.

2. The connector according to claim 1, wherein the first body portion includes a first slot and a second slot located on the inner surface of the first airflow channel, wherein opposite sides of the first conduit portion are accommodated in the first slot and the second slot.

3. The connector of claim 2, wherein the second body portion includes an interlock portion configured to engage the inlet of the first conduit portion.

4. The connector of claim 3, wherein the interlocking portion of the second body portion includes a gas conduit, the gas conduit including a male protrusion received within the inlet of the first conduit portion.

5. The connector of claim 1, further comprising a plug disposed in the third airflow channel and downstream of the connection with the fourth airflow channel, the plug comprising an arched surface configured to redirect airflow in the third airflow channel to the fourth airflow channel.

6. The connector according to claim 1, wherein the inner diameter of the first airflow channel is greater than the outer diameter of the first conduit portion and the second conduit portion.

7. The connector according to claim 1, wherein the inner diameter of the first airflow channel is at least 1.5 times the outer diameter of the first conduit portion and the second conduit portion.

8. The connector of claim 1, wherein the first direction is transverse to the second direction.

9. A connector for a substrate processing system, comprising: The main body, which includes: A first main body includes an inlet and an outlet, and defines a first airflow passage extending along a first direction between the inlet and the outlet; as well as The second main body includes an inlet and defines a second airflow passage extending in a second direction different from the first direction; as well as A gas conduit is disposed in the first airflow channel and defines a third airflow channel extending along the second direction. The gas conduit includes an inlet connected to the second airflow channel and includes a plurality of gas through holes passing through the gas conduit on its downstream side.

10. The connector of claim 9, wherein the first body portion includes a first slot and a second slot located in the first airflow channel, and the first slot and the second slot are configured to receive opposite sides of the gas conduit.

11. The connector of claim 10, wherein the second body portion includes an interlock portion configured to engage the inlet of the gas conduit.

12. The connector of claim 11, wherein the interlocking portion of the second body comprises a gas conduit, the gas conduit including a male protrusion received within the inlet of the gas conduit.

13. The connector of claim 9, further comprising a plug disposed in the gas conduit downstream of the plurality of gas through-holes.

14. The connector according to claim 9, wherein the inner diameter of the first airflow channel is larger than the outer diameter of the gas conduit.

15. The connector of claim 9, wherein the inner diameter of the first airflow channel is at least 1.5 times the outer diameter of the gas conduit.

16. The connector of claim 9, wherein the plurality of gas through-holes are configured to provide a tapered airflow pattern.

17. The connector of claim 9, wherein the first direction is transverse to the second direction.

18. A connector for a substrate processing system, comprising: The main body, which includes: A first main body includes an inlet and an outlet, and defines a first airflow passage extending from the inlet to the outlet along a first direction; as well as The second main body includes an inlet and an outlet and defines a second airflow channel extending in a second direction different from the first direction; as well as A cantilever body extending from the second body into the first airflow channel, and comprising: An inclined main body portion extending from the second main body portion into the first airflow passage; and A third main body portion extends from the inclined main body portion in the first airflow channel, wherein the second airflow channel extends through the second main body portion, the inclined main body portion, and the first main body portion, and The gas flowing through the first airflow channel and the gas flowing through the second airflow channel are mixed at the outlet of the third main body.

19. The connector of claim 18, wherein the connector is manufactured using additive manufacturing technology.

20. The connector according to claim 18, wherein the inner diameter of the first airflow channel is greater than the outer diameter of the inclined main body portion and the third main body portion of the cantilever main body portion.

21. The connector according to claim 18, wherein the inner diameter of the first airflow channel is greater than 1.5 times the outer diameter of the inclined main body portion and the third main body portion of the cantilever main body portion.

22. The connector of claim 18, wherein the first direction is transverse to the second direction.

23. The connector of claim 18, further comprising a cavity in the second body portion defined around the second airflow passage.

24. The connector of claim 23, further comprising a heater disposed in the cavity.

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