Transmission electron microscope in-situ biaxial plane stress mechanical experiment platform

Abstract

The application relates to the technical field of mechanical research equipment, in particular to a transmission electron microscope in-situ biaxial plane stress mechanical experiment platform which comprises a support structure, a vertical driver and a horizontal driver. The vertical driver comprises a substrate outer frame, a first piezoelectric ceramic and a first connecting beam. The substrate outer frame is arranged on the support structure; the first end of the first piezoelectric ceramic is connected with the support structure; the first connecting beam is movably arranged on the substrate outer frame and is connected between the first piezoelectric ceramic and a sample. The movable end of the horizontal driver is connected with the two ends of the sample in the horizontal direction. The transmission electron microscope in-situ biaxial plane stress mechanical experiment platform provided by the application forms a cross sample loading area in the center of the vertical driver and the horizontal driver, realizes independent transmission of biaxial displacement, and the movement of the vertical driver and the horizontal driver is independent of each other, so that sample drift is obviously reduced, the drift amount is controlled in an extremely low range, and the continuity of high-resolution imaging is ensured.

Description

Technical Field

[0001] This invention relates to the field of mechanical research equipment technology, and in particular to an in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy. Background Technology

[0002] The mechanical properties of materials (such as impact resistance, fatigue performance, and plastic machinability) are key factors determining the engineering application value of structural materials. Developing novel high-performance materials requires in-depth understanding of the deformation mechanisms at the nanoscale, atomic, and even sub-angstrom scales. Transmission electron microscopy (TEM), with its high spatial resolution (up to 0.1 nm), has become a core tool for characterizing microstructures. However, traditional non-in-situ research methods require independent observation of samples at different deformation stages, which inevitably leads to the following problems: observation area shift, inconsistent partitioning due to multiple sampling, and inability to track the dynamic evolution of the same micro-region; distortion of the deformation mechanism, as microstructural relaxation after material unloading may mask the true deformation mechanism, leading to biased mechanism inferences. To overcome these limitations, researchers have developed an in-situ mechanical experimental platform for TEM. By integrating mechanical loading devices, with mainstream driving methods including electrostatic drive, shape memory alloy drive, piezoelectric drive, fluid drive, electromagnetic drive, and thermal drive, in-situ mechanical experiments and real-time observation of the same sample region can be achieved.

[0003] Current mainstream TEM in-situ mechanical platforms generally employ a uniaxial loading design: uniaxial tension / compression is achieved through a cantilever beam structure of a Micro-Electro-Mechanical Systems (MEMS) chip, or nanoindentation is performed using a first piezoelectric ceramic-driven probe. While such systems can provide sub-nanometer displacement resolution, they are limited by the confined space and mechanical degrees of freedom of the TEM sample cavity, making it impossible to simultaneously apply controllable loads in orthogonal directions, leading to the following key drawbacks:

[0004] 1. Unable to simulate real multiaxial stress environment: Materials often bear biaxial plane stress in actual working conditions (such as thermal expansion mismatch of semiconductor devices, biaxial strain in the plane of two-dimensional materials), while uniaxial loading can only induce deformation in a single direction, which is difficult to reflect the microscopic mechanism under complex stress conditions.

[0005] 2. Loading direction cannot be switched: The loading direction of existing MEMS chips is fixed by the prefabricated structure, and the axis of force application cannot be dynamically adjusted during the experiment. Summary of the Invention

[0006] This invention provides an in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy, which solves the defect of traditional uniaxial loading systems in the prior art that cannot simulate real multiaxial stress environments.

[0007] This invention provides an in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy, comprising:

[0008] Support structure;

[0009] Vertical actuator, including:

[0010] The substrate outer frame is disposed on the support structure;

[0011] The first piezoelectric ceramic has its first end connected to the supporting structure;

[0012] A first connecting beam is movably disposed on the outer frame of the substrate, and a first end of the first connecting beam is connected to a second end of the first piezoelectric ceramic, and the second end of the first connecting beam is connected to a first end in the vertical direction of the sample.

[0013] A horizontal actuator, the fixed end of which is connected to the outer frame of the substrate, and the movable end of which is connected to both ends of the sample in the horizontal direction.

[0014] According to the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in this application, the vertical actuator further includes:

[0015] The second connecting beam has its first end fixed to the outer frame of the substrate and its second end connected to the second end of the sample in the vertical direction.

[0016] According to the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in this application, the vertical actuator further includes:

[0017] The first support beam is disposed on both sides of the first connecting beam and connects the first connecting beam and the outer frame of the substrate.

[0018] The second support beam is located on both sides of the second connecting beam and connects the second connecting beam to the outer frame of the substrate.

[0019] According to the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in this application, the first connecting beam and the second connecting beam each have an "L"-shaped beam at the end near the sample, and the first connecting beam is connected to the end of the sample near the second connecting beam through the "L"-shaped beam, and the second connecting beam is connected to the end of the sample near the first connecting beam through the "L"-shaped beam.

[0020] According to the in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy provided in this application, the horizontal actuator includes:

[0021] A driving substrate is fixedly connected to the outer frame of the substrate.

[0022] Two drive rods are located at the two ends of the sample in the horizontal direction, and the two drive rods are respectively connected to the ends of the sample in the horizontal direction.

[0023] Multiple thermally driven beams are obliquely connected to both sides of the drive rod and connected to the drive base. The thermally driven beams are provided with electrical interfaces for connecting to a power source and drive the drive rod to move horizontally based on the principle of thermal expansion.

[0024] According to the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in this application, the multiple thermally driven beams located on both sides of the drive rod form a "V" shaped beam structure.

[0025] According to the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in this application, the driving rod is located at the top or bottom of the first connecting beam, and the driving rod has a first connecting block extending in a vertical direction at one end near the sample, and the driving rod is connected to the sample through the first connecting block.

[0026] According to the in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy provided in this application, the horizontal actuator includes:

[0027] A second piezoelectric ceramic is disposed on the outer frame of the substrate;

[0028] The third connecting beam has its first end connected to the second piezoelectric ceramic and its second end connected to the first end of the sample in the horizontal direction.

[0029] The fourth connecting beam has its first end fixed to the outer frame of the substrate and its second end connected to the second end of the sample in the horizontal direction.

[0030] According to the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in this application, the third connecting beam and the fourth connecting beam are located at the top or bottom of the first connecting beam, and the third connecting beam and the fourth connecting beam have a second connecting block extending in a vertical direction at one end near the sample. The third connecting beam and the fourth connecting beam are respectively connected to the sample through the second connecting block.

[0031] According to the in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy provided in this application, the horizontal actuator further includes:

[0032] The third support beam is located on both sides of the third connecting beam and connects the third connecting beam to the outer frame of the substrate.

[0033] This invention provides an in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy, comprising: a support structure, a vertical actuator, and a horizontal actuator. The vertical actuator includes: a substrate frame, a first piezoelectric ceramic, and a first connecting beam. The substrate frame is disposed on the support structure; a first end of the first piezoelectric ceramic is connected to the support structure; the first connecting beam is movably disposed on the substrate frame, and a first end of the first connecting beam is connected to a second end of the first piezoelectric ceramic, the second end of the first connecting beam being connected to a first end of the sample in the vertical direction. The fixed end of the horizontal actuator is connected to the substrate frame, and the movable end of the horizontal actuator is connected to both ends of the sample in the horizontal direction. This in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy provides a cross-shaped sample mounting area formed centrally by the vertical and horizontal actuators. The sample is connected to both the vertical and horizontal actuators, achieving independent transmission of biaxial displacement. Furthermore, the movements of the vertical and horizontal actuators are independent of each other. Through the physical isolation design of the mechanical path, sample drift is significantly reduced, and the drift amount is controlled within an extremely low range, ensuring the continuity of high-resolution imaging. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of the in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy provided in one embodiment of the present invention.

[0036] Figure 2 This is a schematic diagram of the structure of the vertical driver and the horizontal driver provided in one embodiment of the present invention.

[0037] Figure 3 This is a partial structural schematic diagram of the "L"-shaped beam and the first connecting block provided in one embodiment of the present invention.

[0038] Figure 4 This is a schematic diagram of the structure of the vertical driver and the horizontal driver provided in one embodiment of the present invention.

[0039] Figure label:

[0040] 100: Support structure; 200: Vertical actuator; 201: Substrate frame; 202: First piezoelectric ceramic; 203: First connecting beam; 204: Second connecting beam; 205: First support beam; 206: Second support beam; 207: "L" shaped beam; 300: Horizontal actuator; 301: Drive substrate; 302: Drive rod; 303: Thermal drive beam; 304: First connecting block; 311: Second piezoelectric ceramic; 312: Third connecting beam; 313: Fourth connecting beam; 314: Second connecting block; 315: Third support beam; 400: Sample. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0042] In the description of this embodiment, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this embodiment and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this embodiment.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this embodiment, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this embodiment, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," "link," and "fix" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0045] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] Analysis of existing technologies reveals the following pressing technical problems with current transmission electron microscopy (TEM) in-situ mechanical experimental platforms:

[0047] 1. Lack of multiaxial stress simulation capability: Traditional uniaxial loading designs (such as MEMS cantilever beams or piezoelectric probes) cannot apply controllable loads in orthogonal directions simultaneously, which makes it impossible to observe the micro-deformation behavior of materials under biaxial plane stress (such as crack propagation path selection and dislocation slip system activation) in situ, which seriously restricts the mechanistic analysis of the material's real service performance (such as impact resistance and fatigue life).

[0048] 2. Rigid fixation of loading direction: Existing systems rely on prefabricated structures to fix the loading direction, and the axial direction of the force cannot be dynamically adjusted during the experiment, making it difficult to meet the research needs of multi-directional stress paths under complex working conditions.

[0049] Dual-axis loading implementation has the following bottlenecks:

[0050] 1. Spatial conflict: The internal space of the TEM sample holder is insufficient, and the existing mechanical design is difficult to accommodate orthogonally arranged independent drive mechanisms (such as horizontal and vertical actuators).

[0051] 2. Load crosstalk and the lack of physical decoupling mechanism in the multi-directional force transmission path lead to inaccurate positioning of stress measurement errors in each axis.

[0052] 3. Biaxial loading causes sample drift, which disrupts the stability of electron beam focusing and renders atomic-scale dynamic observations ineffective.

[0053] The aforementioned shortcomings collectively render traditional platforms unable to meet the needs of studying the microscopic mechanisms of advanced structural materials (such as high-entropy alloys and nanolayered composite materials) under synergistic multiaxial stress. Therefore, developing an in-situ mechanical experimental platform capable of simultaneously applying independent and controllable biaxial plane stresses while being compatible with the spatial constraints of TEM chambers has become an urgent need for technological upgrading in this field.

[0054] The following is combined Figures 1-4 This invention describes an in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy. The platform includes a support structure 100, a vertical actuator 200, and a horizontal actuator 300.

[0055] The vertical actuator 200 includes a substrate frame 201, a first piezoelectric ceramic 202, and a first connecting beam 203. The substrate frame 201 is disposed on the support structure 100; the first end of the first piezoelectric ceramic 202 is connected to the support structure 100; the first connecting beam 203 is movably disposed on the substrate frame 201, and the first end of the first connecting beam 203 is connected to the second end of the first piezoelectric ceramic 202, with the second end of the first connecting beam 203 connected to the first end of the sample 400 in the vertical direction. The fixed end of the horizontal actuator 300 is connected to the substrate frame 201, and the movable end of the horizontal actuator 300 is connected to both ends of the sample 400 in the horizontal direction.

[0056] Specifically, the vertical actuator 200 and the horizontal actuator 300 form a cross-shaped sample 400 mounting area in the center. This area is used to mount the sample 400, and the vertical actuator 200 applies a vertical force to the sample 400, while the horizontal actuator 300 applies a horizontal force to the sample 400, thereby realizing a biaxial plane stress experiment.

[0057] The experimental platform of this invention adopts a compact cross-shaped layout, including: a support structure 100, a vertical actuator 200, a horizontal actuator 300, and a biaxial cross-shaped sample 400 mounting area. The overall thickness is controlled at the sub-millimeter level to accommodate the confined space of the transmission electron microscope sample 400 cavity. In terms of static relationship, the support structure 100 serves as the main load-bearing frame, with the vertical actuator 200 and horizontal actuator 300 embedded within it through a symmetrical design, achieving physical isolation of the mechanical path and reducing mechanical interference.

[0058] The support structure 100 adopts a modular design, consisting of a base plate and a sensor stage. The base plate is connected to the main body of the experimental platform (i.e., the vertical actuator 200 and the horizontal actuator 300) via a stop fit and screws, serving as the main load-bearing component. The sensor stage is fixed to the front end of the sample 400 head via two support shafts, allowing it to tilt independently of the drive components and avoid collisions. The rear of the sensor stage has a through hole to accommodate dual-axis tilting operation. Grooves are formed on the surface of the sensor stage for embedding into the main body of the experimental platform, ensuring stable connection with the subsequent actuators.

[0059] The substrate frame 201 serves as the mounting frame for the vertical actuator 200, and the first piezoelectric ceramic 202 serves as the power source for the first connecting beam 203. The deformation of the first piezoelectric ceramic 202 is transmitted to the sample 400 through the first connecting beam 203, thereby enabling the sample 400 to be subjected to force in the vertical direction.

[0060] Specifically, the substrate frame 201 serves as the structural foundation, providing rigidity and stability. Piezoelectric ceramic elements are integrated onto it and fixed via bonding or embedding. Utilizing the inverse piezoelectric effect, when an external circuit applies voltage, the piezoelectric ceramic undergoes expansion and contraction. This minute deformation is amplified by the first connecting beam 203 and used to push the sample 400 upwards or downwards, thus transmitting its vertical motion to the sample 400. The displacement accuracy using this structure reaches the nanometer level, with drift controlled within an extremely low range (less than 0.1 nm / s), ensuring high-resolution imaging continuity.

[0061] The fixed end of the horizontal actuator 300 is fixedly connected to the substrate outer frame 201. It has a horizontal movement function, thereby driving the two ends of the sample 400 to move horizontally. The specific structure of the horizontal actuator 300 is described below through two specific embodiments.

[0062] In addition, regarding the control logic, the platform supports independent programming of both axes, allowing users to adjust voltage parameters in real time via external circuits to simulate complex stress paths, such as biaxial tension.

[0063] This invention provides an in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy, comprising: a support structure 100, a vertical actuator 200, and a horizontal actuator 300. The vertical actuator 200 includes: a substrate frame 201, a first piezoelectric ceramic 202, and a first connecting beam 203. The substrate frame 201 is disposed on the support structure 100; the first end of the first piezoelectric ceramic 202 is connected to the support structure 100; the first connecting beam 203 is movably disposed on the substrate frame 201, and the first end of the first connecting beam 203 is connected to the second end of the first piezoelectric ceramic 202, with the second end of the first connecting beam 203 connected to the first end of the sample 400 in the vertical direction. The fixed end of the horizontal actuator 300 is connected to the substrate frame 201, and the movable end of the horizontal actuator 300 is connected to both ends of the sample 400 in the horizontal direction. This invention provides an in-situ biaxial planar stress mechanics experimental platform for transmission electron microscopy. A vertical actuator 200 and a horizontal actuator 300 form a cross-shaped sample 400 mounting area in the center. The sample 400 is connected to the vertical actuator 200 and the horizontal actuator 300 respectively, realizing independent transmission of biaxial displacement. In addition, the movements of the vertical actuator 200 and the horizontal actuator 300 are independent of each other. Through the physical isolation design of the mechanical path, the drift of the sample 400 is significantly reduced, and the drift amount is controlled within an extremely low range, ensuring the continuity of high-resolution imaging.

[0064] In one embodiment of the present invention, the vertical actuator 200 further includes a second connecting beam 204, the first end of which is fixed to the substrate outer frame 201, and the second end of which is connected to the second vertical end of the sample 400. Specifically, the second connecting beam 204 is fixed to the substrate outer frame 201 and connected to the second vertical end of the sample 400, thereby fixing the second end of the sample 400. Figures 2 to 4 In the structure shown, the lower end of the sample 400 is constrained by the second connecting beam 204, and a vertical force is applied to the upper end of the sample 400 by the first connecting beam 203 under the action of the first piezoelectric ceramic 202. The vertical force on the sample 400 can be achieved simply by energizing the first piezoelectric ceramic 202.

[0065] In one embodiment of the present invention, the vertical actuator 200 further includes: a first support beam 205 and a second support beam 206. The first support beam 205 is disposed on both sides of the first connecting beam 203 and connects the first connecting beam 203 and the substrate outer frame 201; the second support beam 206 is disposed on both sides of the second connecting beam 204 and connects the second connecting beam 204 and the substrate outer frame 201. Specifically, the first support beam 205 and the second support beam 206 are symmetrically arranged on the left and right sides of the first connecting beam 203 and the second connecting beam 204, respectively. The lateral constraint of the first supporting beam 205 on the first connecting beam 203 and the lateral constraint of the second supporting beam 206 on the second connecting beam 204 mainly prevents lateral displacement of the first connecting beam 203 and the second connecting beam 204, ensuring the accurate connection and support of the first connecting beam 203 and the second connecting beam 204 for the sample 400. It is understandable that the first support beam 205 can be made of a material with a certain deformation function to meet the need for the first connecting beam 203 to move in the vertical direction. In order to ensure that the lateral constraints on the first connecting beam 203 and the second connecting beam 204 are equal, the lengths of the first support beam 205 and the second support beam 206 on the left and right sides are equal, generating the same constraint force on the left and right sides.

[0066] In one embodiment of the present invention, the first connecting beam 203 and the second connecting beam 204 each have an "L"-shaped beam 207 at one end near the sample 400. The first connecting beam 203 is connected to the end of the sample 400 near the second connecting beam 204 via the "L"-shaped beam 207, and the second connecting beam 204 is connected to the end of the sample 400 near the first connecting beam 203 via the "L"-shaped beam 207. In this embodiment, the "L"-shaped beams 207 on the first connecting beam 203 and the second connecting beam 204 can pass around the left and right sides of the sample 400 and connect to the other end of the sample 400, thereby changing the application of pressure by the vertical actuator 200 to the application of tension on the sample 400. That is, the downward displacement of the first connecting beam 203 provides tension to the sample 400, making the force application more precise and less prone to deviation.

[0067] In one embodiment of the present invention, the horizontal actuator 300 includes: a driving base 301, two driving rods 302, and a plurality of thermally driven beams 303. The driving base 301 is fixedly connected to the substrate frame 201; the two driving rods 302 are located at opposite ends of the sample 400 in the horizontal direction and are connected to the ends of the sample 400 in the horizontal direction; the plurality of thermally driven beams 303 are obliquely connected to both sides of the driving rods 302 and connected to the driving base 301. Each thermally driven beam 303 has an electrical interface for connecting to a power source and drives the driving rods 302 to move horizontally based on the principle of thermal expansion. Specifically, the driving base 301 of the horizontal actuator 300 is fixed to the substrate frame 201 of the vertical actuator 200. The driving base 301 serves as the support structure 100 for the thermally driven beams 303. When the thermally driven beams 303 are energized, their length increases based on the principle of thermal expansion, thereby driving the driving rods 302 to move horizontally. Multiple thermally driven beams 303 are connected to both sides of the drive rod 302 to ensure accurate horizontal movement of the drive rod 302 and prevent vertical deviation.

[0068] In one embodiment of the invention, a plurality of thermally driven beams 303 located on both sides of the drive rod 302 form a "V"-shaped beam structure. Figure 2 In the structure shown, multiple thermally driven beams 303 on both sides of the drive rod 302 form a "V"-shaped beam structure. When the "V"-shaped beam structure expands due to heat, it drives the left drive rod 302 of the sample 400 to move to the left and the right drive rod 302 of the sample 400 to move to the right, thus applying a horizontal tensile force to the sample 400. It is understood that the aforementioned thermally driven beams 303 can be made of thermally expandable materials with a constant coefficient of thermal expansion, and an electrical source can be provided to allow the thermally driven beams 303 to elongate.

[0069] In one embodiment of the invention, the drive rod 302 is located at the top or bottom of the first connecting beam 203, and a first connecting block 304 extending vertically is formed at one end of the drive rod 302 near the sample 400. The drive rod 302 is connected to the sample 400 through the first connecting block 304. Figure 2 In the structure shown, the drive rod 302 is located below the first connecting beam 203, and its end near the sample 400 has an upwardly extending first connecting block 304. The first connecting block 304 can bypass the "L"-shaped beam 207 from below to connect with the sample 400, thereby avoiding interference between the vertical drive 200 and the horizontal drive 300, ensuring that the vertical drive and the horizontal drive move independently of each other, and saving the arrangement space of the two drives.

[0070] In one embodiment of the present invention, such as Figure 4As shown, the horizontal actuator 300 includes a second piezoelectric ceramic 311, a third connecting beam 312, and a fourth connecting beam 313. The second piezoelectric ceramic 311 is disposed on the substrate outer frame 201; the first end of the third connecting beam 312 is connected to the second piezoelectric ceramic 311, and the second end is connected to the first end of the sample 400 in the horizontal direction; the first end of the fourth connecting beam 313 is fixed to the substrate outer frame 201, and the second end is connected to the second end of the sample 400 in the horizontal direction. In this embodiment, the horizontal actuator 300 adopts a driving method similar to that of the vertical actuator 200, that is, it uses piezoelectric ceramic as a power source, applies a horizontal driving force to the sample 400 through the third connecting beam 312, and the fourth connecting beam 313 serves as the fixed end of the sample 400 and is connected to the substrate outer frame 201. It is understood that in this embodiment, the third connecting beam 312 and the fourth connecting beam 313 are arranged horizontally to provide horizontal force; the first connecting beam 203 and the second connecting beam 204 are arranged vertically to provide vertical force, thereby applying biaxial plane stress to the sample 400.

[0071] In one embodiment of the present invention, the third connecting beam 312 and the fourth connecting beam 313 are located at the top or bottom of the first connecting beam 203, and the third connecting beam 312 and the fourth connecting beam 313 have a second connecting block 314 extending vertically at the end near the sample 400. The third connecting beam 312 and the fourth connecting beam 313 are respectively connected to the sample 400 through the second connecting block 314. In this embodiment, the third connecting beam 312 and the fourth connecting beam 313 are located at the top of the first connecting beam 203, and have a downwardly extending second connecting block 314 at the end near the sample 400, so that they can bypass the "L"-shaped beam 207 from below and connect to the sample 400, avoiding interference between the vertical actuator 200 and the horizontal actuator 300, ensuring that the vertical drive and the horizontal drive move independently of each other, and saving the arrangement space of the two actuators.

[0072] In one embodiment of the present invention, the horizontal actuator 300 further includes a third support beam 315. The third support beam 315 is disposed on both sides of the third connecting beam 312 and connects the third connecting beam 312 and the substrate outer frame 201. The function of the third support beam 315 in this embodiment is similar to that of the first support beam 205 and the second support beam 206, except that the vertical constraint of the third connecting beam 312 by the third support beam 315 prevents the third connecting beam 312 from shifting vertically, thus ensuring the accuracy of the connection and support of the third connecting beam 312 for the sample 400.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A transmission electron microscope in-situ biaxial plane stress mechanics experimental platform, characterized in that, include: Support structure (100); Vertical drive (200), including: The substrate outer frame (201) is disposed on the support structure (100); The first piezoelectric ceramic (202) has its first end connected to the support structure (100); The first connecting beam (203) is movably disposed on the outer frame (201) of the substrate, and the first end of the first connecting beam (203) is connected to the second end of the first piezoelectric ceramic (202), and the second end of the first connecting beam (203) is connected to the first end of the sample (400) in the vertical direction; A horizontal actuator (300) is provided, with its fixed end connected to the substrate frame (201) and its movable end connected to both ends of the sample (400) in the horizontal direction. The vertical actuator (200) also includes: The second connecting beam (204) has its first end fixed to the outer frame (201) of the substrate and its second end connected to the second end of the sample (400) in the vertical direction. The vertical actuator (200) also includes: The first support beam (205) is disposed on both sides of the first connecting beam (203) and is connected between the first connecting beam (203) and the substrate outer frame (201); The second support beam (206) is disposed on both sides of the second connecting beam (204) and is connected between the second connecting beam (204) and the substrate outer frame (201); The first connecting beam (203) and the second connecting beam (204) each have an "L"-shaped beam (207) at one end near the sample (400), and the first connecting beam (203) is connected to the end of the sample (400) near the second connecting beam (204) through the "L"-shaped beam (207), and the second connecting beam (204) is connected to the end of the sample (400) near the first connecting beam (203) through the "L"-shaped beam (207).

2. The in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy according to claim 1, characterized in that, The horizontal driver (300) includes: The driving substrate (301) is fixedly connected to the outer frame of the substrate (201); Two drive rods (302) are located at the two ends of the sample (400) in the horizontal direction, and the two drive rods (302) are connected to the ends of the sample (400) in the horizontal direction respectively; Multiple thermal drive beams (303) are obliquely connected to both sides of the drive rod (302) and connected to the drive base (301). The thermal drive beams (303) are provided with electrical interfaces for connecting to a power source and drive the drive rod (302) to move horizontally based on the principle of thermal expansion.

3. The in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy according to claim 2, characterized in that, The multiple thermal drive beams (303) located on both sides of the drive rod (302) form a "V" shaped beam structure.

4. The in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy according to claim 2, characterized in that, The drive rod (302) is located at the top or bottom of the first connecting beam (203), and the drive rod (302) has a first connecting block (304) extending in a vertical direction at one end near the sample (400), and the drive rod (302) is connected to the sample (400) through the first connecting block (304).

5. The in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy according to claim 1, characterized in that, The horizontal driver (300) includes: A second piezoelectric ceramic (311) is disposed on the outer frame (201) of the substrate; The third connecting beam (312) has its first end connected to the second piezoelectric ceramic (311) and its second end connected to the first end of the sample (400) in the horizontal direction; The fourth connecting beam (313) has its first end fixed to the outer frame (201) of the substrate and its second end connected to the second end of the sample (400) in the horizontal direction.

6. The in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy according to claim 5, characterized in that, The third connecting beam (312) and the fourth connecting beam (313) are located at the top or bottom of the first connecting beam (203), and the third connecting beam (312) and the fourth connecting beam (313) have a second connecting block (314) extending in a vertical direction at one end near the sample (400). The third connecting beam (312) and the fourth connecting beam (313) are respectively connected to the sample (400) through the second connecting block (314).

7. The in-situ biaxial plane stress mechanics experimental platform for transmission electron microscopy according to claim 5, characterized in that, The horizontal actuator (300) also includes: The third support beam (315) is located on both sides of the third connecting beam (312) and connects the third connecting beam (312) and the substrate frame (201).

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