A processing method for improving the processing efficiency of a printed circuit board groove

Abstract

The present application relates to the technical field of circuit board, specifically to a processing method for improving the processing efficiency of printed circuit board grooves. The present application realizes intelligent adaptation of processing methods through processing mode sorting mechanism. Based on the design parameters of the grooves to be processed, the present application combines the processing influence coefficient to obtain a comprehensive influence coefficient, and then compares it with the dynamically adjusted comprehensive division threshold value to accurately determine whether to use laser finishing or mechanical-laser compound processing. This avoids the problems of time extension and energy consumption surge caused by multiple scanning of single laser processing in deep groove processing, and solves the defects of insufficient precision of single mechanical processing. It enables grooves of different depths and materials to match the optimal processing path, greatly improving the overall processing efficiency. In addition, through regional processing of compound processing, combined with mechanical processing monitoring and quality evaluation early warning, the present application reduces processing abnormalities, discovers process problems in time, reduces the rate of defective products, and at the same time ensures the stability of processing quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board, in particular to a processing method for improving the processing efficiency of a printed circuit board cavity. BACKGROUND

[0002] Today, with the continuous miniaturization of electronic products, the space on the circuit board becomes more and more valuable; the appearance of the printed circuit board cavity (Cavity) can effectively reduce the assembly height for large components, thereby optimizing the space utilization of the circuit board and making the entire product more compact; Cavity design can effectively reduce electromagnetic interference; some high-frequency or high-power components may generate a strong electromagnetic field when working, which may cause electromagnetic interference to the surrounding circuits; placing these components in the Cavity and taking appropriate shielding measures can effectively reduce electromagnetic interference and increase signal transmission distance and improve signal transmission speed.

[0003] In traditional printed circuit board cavity processing, laser processing has obvious limitations: as the processing depth increases, multiple repeated scanning is required, resulting in prolonged processing time, low efficiency, and significantly increased energy consumption; increasing laser energy to speed up can easily cause copper breakdown at the bottom of the hole, uneven bottom plane, and carbonization of the sidewall, among other problems; in addition, a single processing method cannot adapt to the processing needs of cavities of different depths and materials, and cannot balance efficiency and quality. SUMMARY

[0004] The present application provides a processing method for improving the processing efficiency of a printed circuit board cavity to solve the above technical problems.

[0005] The present application provides a processing method for improving the processing efficiency of a printed circuit board cavity, comprising the following steps:

[0006] Step 1: Collecting the design parameters of the cavity to be processed through data acquisition technology; the design parameters include the target depth of the cavity, the opening size of the cavity, and the material parameters of the board material; the material parameters of the board material include the material types corresponding to the dielectric layer and the conductive layer, respectively.

[0007] Step 2: Obtaining the design parameters of the current cavity to be processed and inputting the design parameters into a preset processing mode sorting mechanism; the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, the initial processing mode signal includes a laser finishing signal and a mechanical and laser composite processing signal; and the initial processing mode signal is identified by a signal recognition unit; when the initial processing mode signal corresponds to the mechanical and laser composite processing signal, step 3 is performed on the cavity to be processed; when the initial processing mode signal corresponds to the laser finishing signal, step 4 is performed on the cavity to be processed.

[0008] As a further improvement of the present application, the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, which is specifically:

[0009] The processing mode sorting mechanism includes a processing mode threshold setting unit and a processing mode matching unit, and identifies the design parameters of each to-be-processed groove to obtain a groove target depth and a plate material parameter;

[0010] The processing impact analysis unit specifically analyzes the processing impact coefficient of the plate material parameter of each to-be-processed groove to obtain the corresponding processing impact coefficient;

[0011] The processing mode matching unit specifically matches and analyzes the groove target depth of the to-be-processed groove with the processing impact coefficient to obtain the corresponding initial processing mode signal.

[0012] Further, the processing impact coefficient of the plate material parameter of each to-be-processed groove is analyzed to obtain the corresponding processing impact coefficient, which is specifically:

[0013] According to the plate material parameter, the medium layer parameter and the conductive layer parameter corresponding to the to-be-processed area corresponding to the to-be-processed groove are obtained; according to the medium layer parameter, the material hardness and the medium heat resistance corresponding to the medium layer are obtained, the material hardness value is obtained by converting the material hardness of the medium layer through the Shore hardness conversion method; the material hardness value corresponding to each commonly used medium in the database is obtained, and the material hardness span interval is obtained by collecting the material hardness value corresponding to each commonly used medium, and the value of the lowest medium hardness corresponding to the medium hardness span interval is marked as the hardness reference point; the hardness reference point and the material hardness value corresponding to each to-be-processed groove are substituted into the preset arctangent function to calculate the material hardness factor to obtain the medium hardness coefficient, that is, the hardness impact coefficient is calculated by the formula ; wherein YD corresponds to the material hardness value corresponding to the medium layer parameter; YD jz represents the hardness reference point, YD mg represents a preset hardness interval compression constant, which is 20.

[0014] The glass transition temperature interval of each type of material is obtained by identifying the medium heat resistance, and the medium layer glass transition temperature interval is obtained by collecting the glass transition temperature interval of each type of material, and the middle value of the medium layer glass transition temperature interval is marked as the heat resistance reference point; the glass transition temperature value of the medium layer corresponding to the to-be-processed groove and the heat resistance reference point are input into the preset heat resistance impact index decay function model to calculate the heat resistance impact coefficient ; wherein respectively represent the heat resistance reference point and the glass transition temperature value; 0.01 is a preset heat resistance sensitivity constant. ​

[0015] obtaining the thickness of the conductive layer and the surface state of the conductive layer based on the conductive layer parameters; obtaining a thickness upper limit extreme value of the conductive layer by summing the thickness standard maximum value of the copper foil of the conductive layer in the PCB industry in the database and a preset upper limit constant; inputting the value of the thickness of the conductive layer of the current groove to be processed and the thickness upper limit extreme value of the conductive layer into a preset thickness influence logarithmic function calculation model calculating the thickness influence coefficient ; wherein HD represents the thickness of the conductive layer, represents the thickness upper limit extreme value of the conductive layer. represents the preset thickness weight coefficient, and the value is 0.2.

[0016] obtaining the laser reflectivity of the surface of the conductive layer according to the surface state of the conductive layer, obtaining a corresponding preset light reflection threshold value based on the laser of the laser processing in the database, obtaining a low light reflection area and a high light reflection area according to the light reflection threshold value, and respectively marking as [0, F th ], (F th , 1]; calculating the reflection influence coefficient based on the preset power law function and the hyperbolic tangent function coupling model ; wherein F BM represents the laser reflectivity. respectively represent the preset maximum laser gain coefficient and the maximum laser inhibition coefficient. represents the preset power index, and the value is a constant greater than zero; represents the preset reflection sensitivity factor, and the value is 10.

[0017] The hardness influence coefficient, the heat resistance influence coefficient, the thickness influence coefficient and the reflection influence coefficient are collected to obtain the processing influence coefficient corresponding to each groove to be processed.

[0018] Further, the groove target depth of the groove to be processed is matched and analyzed with the processing influence coefficient to obtain the corresponding initial processing mode signal, which is specifically:

[0019] The hardness influence coefficient, the heat resistance influence coefficient, the thickness influence coefficient and the reflection influence coefficient are obtained by identifying the processing influence coefficient, and each processing influence coefficient is normalized and its value is taken, and the normalized processing influence coefficient is substituted into the preset processing coefficient coupling formula to calculate the comprehensive influence coefficient ; wherein represents the weight coefficient corresponding to each processing influence coefficient, and the value is 0.33, 0.17, 0.34 and 0.16.

[0020] Obtain the initial processing division threshold preset for the groove to be processed, and substitute both the comprehensive influence coefficient and the initial processing division threshold into the preset hyperbolic tangent comprehensive model. Calculate the overall partitioning threshold ;in, These represent the initial processing threshold and the preset maximum threshold adjustment range, respectively.

[0021] Obtain the target design parameters corresponding to the target depth of the groove to be processed. Based on the hyperbolic tangent comprehensive model, obtain the comprehensive division threshold of the target design parameters and record it as the target division threshold. Compare the groove target depth with the target division threshold. When the groove target depth is less than or equal to the target division threshold, generate the initial processing mode signal as a laser finishing signal. When the groove target depth exceeds the target division threshold, generate the initial processing mode signal as a mechanical and laser composite processing signal.

[0022] Step 3: When the mechanical and laser combined processing signal is received, perform combined processing on the groove to be processed;

[0023] As a further improvement of the present invention, the groove to be processed is subjected to composite processing, and the specific processing steps are as follows:

[0024] Step 3.1: Based on the target division threshold of the groove to be processed, the processing area is divided to obtain the mechanical processing depth and the laser processing depth. Specifically, the target division threshold of the groove to be processed corresponding to the mechanical and laser composite processing signals is obtained. Based on the target division threshold, the target depth of the groove is divided into two working target depths. The working target depth that is closer to the cutting surface of the groove to be processed is marked as the mechanical processing depth, and the other working target depth is marked as the laser processing depth.

[0025] Step 3.2: Obtain the machining depth and laser processing depth of the groove to be processed; and obtain the groove opening size corresponding to the machining depth, and set the machining target area based on the machining depth and the groove opening size; similarly, obtain the laser processing target area corresponding to the laser processing depth, and generate a laser reprocessing signal, and execute step 4 on the laser processing target area.

[0026] Step 3.3: Perform machining on the target area;

[0027] Step 3.4, Machining Monitoring: Obtain the machining parameters and perform machining monitoring and analysis on the machining parameters to obtain machining status information. When the machining status information corresponds to a machining abnormality, mark the corresponding groove to be processed as a machining abnormal groove, execute step 3.1 on the machining abnormal groove, and count the number of machining operations for the machining abnormal groove. When the number of machining operations exceeds the preset machining operation threshold, generate a machining process abnormality warning.

[0028] Further, the machining monitoring analysis is performed on the machining parameters to obtain machining state information, which specifically includes:

[0029] The cutting data and tool wear parameters are obtained according to the machining parameters; the cutting force and cutting vibration parameters are obtained according to the cutting data, the cutting force difference is calculated by differentiating the cutting force from the preset cutting standard force, and the force abnormal signal is generated when the cutting force difference exceeds the preset force difference threshold; the vibration acceleration peak and vibration frequency are obtained based on the cutting vibration parameters, the peak abnormal information is generated when the vibration acceleration peak exceeds the preset upper limit of the acceleration peak, and the frequency abnormal information is generated when the vibration frequency exceeds the preset vibration frequency interval, and the vibration abnormal signal is generated when any one of the peak abnormal information and the frequency abnormal information is detected;

[0030] The tool wear amount and tool use duration are obtained according to the tool wear parameters; the tool wear allowance and the longest service life corresponding to the tool wear amount and the tool use duration are obtained based on the database; the tool wear amount, the tool use duration, the tool wear allowance and the longest service life are all normalized and substituted into the preset nonlinear coupling formula to calculate the tool wear comprehensive value ms; wherein, respectively represent the tool wear amount and the tool wear allowance; respectively represent the tool use duration and the longest service life; the wear abnormal signal is generated when the tool wear comprehensive value exceeds the preset wear comprehensive threshold;

[0031] The signal monitoring unit is used to identify the force abnormal signal, the vibration abnormal signal and the wear abnormal signal, and no machining state information is generated when no signal or any one of the force abnormal signal and the vibration abnormal signal is monitored; the signal state one is recorded when the force abnormal signal and the vibration abnormal signal are simultaneously monitored, the signal state two is recorded when the wear abnormal signal is monitored, and the signal state three is recorded when the signal state one and the signal state two are simultaneously monitored; the machining state information is machining abnormality when the signal monitoring unit monitors any one of the signal state one, the signal state two and the signal state three.

[0032] Step 4: When the laser finishing signal and the laser reprocessing signal are received, laser finishing is performed on the corresponding to-be-machined groove and laser machining target area, and the corresponding groove is marked as a machined groove;

[0033] Step 5: The processing quality state and process warning are obtained by quality evaluation of the processed groove through the pre-deployed image monitoring comparison technology, which is specifically: the processed groove is compared with the preset design parameters through the pre-deployed image monitoring comparison technology to obtain the processing quality state, and the number of processed grooves corresponding to quality abnormalities is obtained when the processing quality state of the preset unit monitoring is abnormal; when the number of processed grooves exceeds the preset processed abnormal threshold, a process warning is generated.

[0034] The technical solution provided by the present application has the following advantages compared with the prior art:

[0035] 1. The present application realizes intelligent adaptation of processing methods through processing mode sorting mechanism, significantly improves processing efficiency, and based on the design parameters of the to-be-processed groove, combines processing influence coefficient for comprehensive analysis, obtains comprehensive influence coefficient through normalization processing and coupling calculation, and compares with the dynamically adjusted comprehensive division threshold, accurately determines whether to use laser finishing or mechanical-laser composite processing, avoids the problem of time extension and energy surge caused by multiple scanning of single laser processing in deep groove processing, solves the defect of insufficient precision of single mechanical processing, and enables grooves of different depths and materials to match the optimal processing path, thereby greatly improving the overall processing efficiency.

[0036] 2. The present application processes by composite processing in different regions, and in composite processing, the groove depth is divided into mechanical processing and laser processing regions according to the target division threshold, the surface is efficiently processed by machinery, and the deep layer is precisely processed by laser, taking into account efficiency and accuracy, and the mechanical processing monitoring and quality evaluation warning are matched to reduce processing abnormalities, timely discover process problems, reduce the rate of defective products, and at the same time, ensure the stability of processing quality. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description, and the following drawings are not deliberately drawn according to the actual size, and the focus is on showing the main idea of the present application.

[0038] Figure 1 The method flowchart of the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0040] For the convenience of understanding, the specific process of the embodiments of the present application will be described below. Please refer toFigure 1 In an embodiment of the present application, one embodiment of a processing method for improving the processing efficiency of a printed circuit board groove includes:

[0041] Step 1, processing requirement identification and parameter collection: collect the design parameters of the to-be-processed groove through data acquisition technology; the design parameters include groove target depth, groove opening size, and board material parameters; the board material parameters include the material types corresponding to the dielectric layer and the conductive layer, respectively.

[0042] Step 2, processing mode selection analysis: obtain the design parameters of the current to-be-processed groove and input the design parameters into a preset processing mode sorting mechanism; the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters; the initial processing mode signal includes a laser finishing signal and a mechanical and laser composite processing signal; and the initial processing mode signal is identified by a signal recognition unit; when the initial processing mode signal corresponds to the mechanical and laser composite processing signal, step 3 is performed on the to-be-processed groove; when the initial processing mode signal corresponds to the laser finishing signal, step 4 is performed on the to-be-processed groove.

[0043] The processing mode sorting mechanism has the following specific analysis content:

[0044] The processing mode sorting mechanism includes a processing mode threshold setting unit and a processing mode matching unit, and identifies the design parameters of each to-be-processed groove to obtain the groove target depth and the board material parameters.

[0045] The processing influence analysis unit is used to analyze the processing influence coefficient of the board material parameters of each to-be-processed groove to obtain the corresponding processing influence coefficient.

[0046] The processing mode matching unit matches and analyzes the groove target depth of the to-be-processed groove with the processing influence coefficient to obtain the corresponding initial processing mode signal.

[0047] The processing influence coefficient analysis of the board material parameters of each to-be-processed groove has the following specific analysis content:

[0048] According to the material parameters of the plate, the medium layer parameters and the conductive layer parameters corresponding to the to-be-processed area corresponding to the to-be-processed groove are obtained; according to the medium layer parameters, the material hardness and the medium heat resistance corresponding to the medium layer are obtained, the material hardness is a material hardness value obtained by converting the material of the medium layer into hardness through a Shore hardness conversion method; the material hardness values corresponding to the commonly used media in the database of the PCB plate are obtained, and the material hardness values corresponding to the commonly used media are collected to obtain a medium hardness span interval, and the value of the lowest medium hardness corresponding to the medium hardness span interval is marked as a hardness reference point; for example, in the commonly used medium layer of the PCB, the PP glue is the softest medium, and the lower limit of the Shore hardness is 60D, that is, the hardness reference point is 60, and the corresponding medium hardness span interval is 60D-100D; the hardness reference point and the material hardness value corresponding to each to-be-processed groove are substituted into a preset arctangent function to calculate the material hardness factor to obtain a medium hardness coefficient, that is, the hardness influence coefficient is calculated through the formula ; wherein YD corresponds to the material hardness value corresponding to the medium layer parameters; YD jz represents the hardness reference point, YD mg represents a preset hardness interval compression constant, which is 20, and is used to compress the input value to the interval [0, 2] to match the nonlinear sensitive area of the arctan function.

[0049] The glass transition temperature interval of each type of material is obtained by identifying the medium heat resistance, and the medium layer glass transition temperature interval is obtained by collecting the glass transition temperature interval of each type of material, and the middle value of the medium layer glass transition temperature interval is marked as a heat resistance reference point; the glass transition temperature value of the medium layer corresponding to the to-be-processed groove and the heat resistance reference point are input into a preset heat resistance influence exponential decay function model to calculate the heat resistance influence coefficient ; wherein respectively represent the heat resistance reference point and the glass transition temperature value; 0.01 is a preset heat resistance sensitive constant, which is set based on the temperature range of the medium layer glass transition temperature interval, and is used to make the value range of be (-0.7, 0.1), and ensure that ∈[0.5, 1].

[0050] The thickness and surface state of the conductive layer are obtained based on the conductive layer parameters; the thickness standard maximum value of the copper foil of the conductive layer in the PCB industry is obtained based on the database, and the thickness standard maximum value is summed with a preset upper limit constant, and the obtained value is marked as the upper limit extreme value of the conductive layer thickness, for example, the maximum thickness standard of the industry standard is 70 μm, and the upper limit constant is 10 μm, that is, the upper limit extreme value of the conductive layer thickness corresponds to 80; the value of the conductive layer thickness of the current to-be-processed groove and the upper limit extreme value of the conductive layer thickness are input into a preset thickness influence logarithmic function calculation model ​The thickness influence coefficient is calculated ; wherein HD represents the conductive layer thickness, represents the upper limit of the conductive thickness, which is used to make the logarithmic function avoid taking a negative value; represents a preset thickness weight coefficient, and the value is 0.2.

[0051] The laser reflectivity of the conductive layer surface is obtained according to the surface state of the conductive layer, a corresponding preset light reflection threshold is obtained based on the laser in the database of laser processing, the low light reflection area and the high light reflection area are obtained according to the light reflection threshold, and are respectively denoted as [0, F th ], (F th , 1]; the preset power law function and the hyperbolic tangent function coupling model The reflection influence coefficient is calculated ; wherein F BM represents the laser reflectivity; respectively represent the preset maximum laser gain coefficient and the maximum laser inhibition coefficient, the maximum laser gain coefficient represents the threshold value maximum that can be brought by the laser processing efficiency advantage in the ideal low reflectivity condition (i.e. F BM = 0), the value is 0.15; on the contrary, the maximum laser inhibition coefficient represents the threshold value maximum that is caused by the laser processing in the case of extremely high reflectivity (i.e. F BM = 1); represents a preset power index, and the value is a constant greater than zero, which is used to control the shape of the function curve, when , the function is a convex curve; when , the function is a concave curve, which represents the relationship between the laser energy absorption and the processing efficiency; represents a preset reflection sensitivity factor, and the value is 10, which is used to control the change rate of the hyperbolic tangent function in the high light reflection area.

[0052] The hardness influence coefficient, the heat resistance influence coefficient, the thickness influence coefficient and the reflection influence coefficient are collected to obtain the processing influence coefficient corresponding to each to-be-processed groove.

[0053] The groove target depth of the to-be-processed groove is matched and analyzed with the processing influence coefficient, and the specific analysis content is as follows:

[0054] The hardness influence coefficient, the heat resistance influence coefficient, the thickness influence coefficient and the reflection influence coefficient are identified from the processing influence coefficient, the values of each processing influence coefficient are normalized, and the normalized processing influence coefficients are all substituted into the preset processing coefficient coupling formula The comprehensive influence coefficient is calculated ; wherein, The weight coefficients corresponding to each processing influence coefficient are represented, n = 1, 2, 3, 4; 、 、 、 The values of the weight coefficients are 0.33, 0.17, 0.34, and 0.16, respectively.

[0055] An initial processing division threshold value preset for the to-be-processed groove is obtained, and the comprehensive influence coefficient and the initial processing division threshold value are substituted into the preset hyperbolic tangent comprehensive model The output comprehensive division threshold value is calculated ; wherein, The initial processing division threshold value and the preset maximum threshold value adjustment range are represented, respectively, and the maximum threshold value adjustment range is used to limit the value of the comprehensive division threshold value, i.e., the maximum absolute value that the threshold value can change based on all influence coefficients;

[0056] The target design parameter corresponding to the groove target depth of the current to-be-processed groove is obtained, the comprehensive division threshold value of the target design parameter is obtained based on the hyperbolic tangent comprehensive model, and is recorded as a target division threshold value. The groove target depth is compared with the target division threshold value, and when the groove target depth is less than or equal to the target division threshold value, an initial processing mode signal is generated as a laser fine processing signal; when the groove target depth exceeds the target division threshold value, an initial processing mode signal is generated as a mechanical and laser composite processing signal.

[0057] Step 3, composite processing: when receiving the mechanical and laser composite processing signal, the to-be-processed groove is subjected to composite processing, which is specifically:

[0058] Step 3.1, processing area division: obtaining the target division threshold value of the to-be-processed groove corresponding to the mechanical and laser composite processing signal, dividing the groove target depth into two working target depths based on the target division threshold value, marking the working target depth close to the cutting surface of the to-be-processed groove as the mechanical processing depth, and vice versa, marking the other working target depth as the laser processing depth;

[0059] Step 3.2, processing parameter setting: obtaining the mechanical processing depth and the laser processing depth of the to-be-processed groove; and obtaining the groove opening size corresponding to the mechanical processing depth, setting the mechanical processing target area based on the mechanical processing depth and the groove opening size. Similarly, the laser processing target area corresponding to the laser processing depth is obtained, and a laser reprocessing signal is generated, and step 4 is executed on the laser processing target area;

[0060] Step 3.3, mechanical processing execution: mechanical processing is performed on the mechanical processing target area;

[0061] Step 3.4, machining monitoring: obtain the machining parameters of the machining, and perform machining monitoring analysis on the machining parameters to obtain machining state information, when the machining state information corresponds to machining abnormality, mark the corresponding to-be-machined groove as a mechanical abnormal groove, execute step 3.1 on the mechanical abnormal groove, and count the machining times of the mechanical abnormal groove, when the machining times exceed a preset machining times threshold, generate a machining process abnormality warning.

[0062] The machining parameters are subjected to machining monitoring analysis, and the specific analysis content is as follows:

[0063] According to the machining parameters, cutting data and tool wear parameters are obtained; according to the cutting data, cutting force and cutting vibration parameters are obtained, the cutting force is subjected to difference calculation with a preset cutting standard force to obtain a cutting force difference, when the cutting force difference exceeds a preset force difference threshold, a force abnormality signal is generated; based on the cutting vibration parameters, vibration acceleration peak value and vibration frequency are obtained, when the vibration acceleration peak value exceeds a preset upper limit of the acceleration peak value, a peak value abnormality information is generated, similarly, when the vibration frequency exceeds a preset vibration frequency interval, a frequency abnormality information is generated, when any one of the peak value abnormality information and the frequency abnormality information is detected, a vibration abnormality signal is generated;

[0064] According to the tool wear parameters, tool wear amount and tool use time length are obtained; based on the database, tool wear allowance and longest service life corresponding to the tool wear amount and tool use time length are obtained; the tool wear amount, tool use time length, tool wear allowance and longest service life are all subjected to normalization processing and substituted into a preset nonlinear coupling formula to calculate a tool wear comprehensive value ms; wherein, respectively represent the tool wear amount and the tool wear allowance; respectively represent the tool use time length and the longest service life; when the tool wear comprehensive value exceeds a preset wear comprehensive threshold, a wear abnormality signal is generated;

[0065] The force abnormality signal, the vibration abnormality signal and the wear abnormality signal are identified by a preset signal monitoring unit, when no signal or any one of the force abnormality signal and the vibration abnormality signal is monitored, no machining state information is generated; when the force abnormality signal and the vibration abnormality signal are simultaneously monitored, it is recorded as signal state one, when the wear abnormality signal is monitored, it is recorded as signal state two, when signal state one and signal state two are simultaneously monitored, it is recorded as signal state three; when the signal monitoring unit monitors any one of signal state one, signal state two and signal state three, the machining state information is generated as machining abnormality.

[0066] Step 4, laser finishing processing: when receiving the laser finishing signal and the laser reprocessing signal, obtaining the to-be-processed groove corresponding to the laser finishing signal, and obtaining the laser processing target area corresponding to the laser reprocessing signal, performing laser finishing on the corresponding to-be-processed groove and laser processing target area, and marking the corresponding groove as a processed groove.

[0067] Step 5, processing quality feedback: through the pre-deployed image monitoring comparison technology, the quality of the processed groove is evaluated with the preset design parameters to obtain the processing quality state, and the number of processed grooves corresponding to quality abnormalities is obtained when the processing quality state is monitored per unit. When the number of processed grooves exceeds the preset processed abnormal threshold, a process warning is generated.

[0068] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A processing method for improving the efficiency of groove processing on printed circuit boards, characterized in that, Includes the following steps: Step 1: Collect the design parameters of the groove to be processed using data acquisition technology; Step 2: Obtain the design parameters of the groove to be processed and input the design parameters into a preset processing method selection mechanism. The processing method selection mechanism outputs an initial processing method signal based on the design parameters. The initial processing method signal includes a laser finishing signal and a mechanical and laser composite processing signal. The initial processing method signal is identified by a signal recognition unit. When the initial processing method signal corresponds to a mechanical and laser composite processing signal, proceed to step 3 for the groove to be processed; when the initial processing method signal corresponds to a laser finishing signal, proceed to step 4 for the groove to be processed. Step 3: When the mechanical and laser combined processing signal is received, perform combined processing on the groove to be processed; Step 4: When the laser finishing signal and the laser reprocessing signal are received, perform laser finishing on the corresponding groove to be processed and the laser processing target area, and mark the corresponding groove as the processed groove; Step 5: Use pre-deployed image monitoring and comparison technology to assess the quality of the processed grooves and obtain processing quality status and process warnings.

2. The processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 1, characterized in that, The processing method sorting mechanism outputs an initial processing method signal based on design parameters, specifically as follows: The processing method sorting mechanism includes a processing mode threshold setting unit and a processing mode matching unit, and identifies the design parameters of each groove to be processed to obtain the groove target depth and plate material parameters; The processing influence analysis unit is specifically used to analyze the processing influence coefficients of the plate material parameters of each groove to be processed, and obtain the corresponding processing influence coefficients. The processing mode matching unit specifically performs matching analysis between the target depth of the groove to be processed and the processing influence coefficient to obtain the corresponding initial processing mode signal.

3. The processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 2, characterized in that, The processing influence coefficients were obtained by analyzing the material parameters of the plate material for each groove to be processed. Specifically: Based on the material parameters of the board, the dielectric layer parameters and conductive layer parameters corresponding to the area to be processed in the groove to be processed are obtained; based on the dielectric layer parameters, the material hardness and heat resistance of the dielectric layer are obtained. The material hardness is the material hardness value obtained by converting the material of the dielectric layer through the Shore hardness conversion method; the material hardness values ​​corresponding to the commonly used dielectrics of PCB boards in the database are obtained, and the material hardness values ​​corresponding to each commonly used dielectric are collected to obtain the dielectric hardness span range. The lowest dielectric hardness value corresponding to the dielectric hardness span range is marked as the hardness benchmark point. The medium hardness coefficient is obtained by substituting the hardness reference point and the material hardness value corresponding to each groove to be processed into the preset arctangent function to calculate the material hardness factor. The glass transition temperature range of various materials is obtained by identifying the heat resistance of the medium. The glass transition temperature ranges of various materials are combined to obtain the glass transition temperature range of the medium layer. The median value of the glass transition temperature range of the medium layer is marked as the heat resistance reference point. The glass transition temperature value of the medium layer corresponding to the groove to be processed and the heat resistance reference point are input into the preset heat resistance influence index decay function model to calculate the heat resistance influence coefficient. The thickness and surface condition of the conductive layer are obtained based on the conductive layer parameters. Based on the maximum standard thickness of the conductive layer copper foil in the PCB industry database, the maximum standard thickness is summed with a preset upper limit constant, and the resulting value is marked as the upper limit extreme value of the conductive layer thickness. The value of the conductive layer thickness of the current groove to be processed and the upper limit extreme value of the conductive layer thickness are both input into the preset thickness influence logarithmic function calculation model to calculate the thickness influence coefficient. The laser reflectivity of the conductive layer surface is obtained based on the surface state of the conductive layer. The corresponding preset reflection threshold is obtained based on the laser processed by the laser in the database. The low reflection area and high reflection area are obtained based on the reflection threshold. The reflection influence coefficient is calculated based on the preset power law function and hyperbolic tangent function coupling model. The processing influence coefficients for each groove to be processed are obtained by combining the hardness influence coefficient, heat resistance influence coefficient, thickness influence coefficient, and reflection influence coefficient.

4. The processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 3, characterized in that, The initial processing method signal is obtained by matching and analyzing the target depth of the groove to be processed with the processing influence coefficient. Specifically: The processing influence coefficients are identified to obtain the hardness influence coefficient, heat resistance influence coefficient, thickness influence coefficient, and reflection influence coefficient. Each processing influence coefficient is normalized and its value is taken. The normalized processing influence coefficients are then substituted into a preset processing coefficient coupling formula to calculate the comprehensive influence coefficient. An initial processing division threshold is obtained for the groove to be processed. Both the comprehensive influence coefficient and the initial processing division threshold are substituted into a preset hyperbolic tangent comprehensive model to calculate and output the comprehensive division threshold. The target design parameters corresponding to the current groove target depth are obtained. Based on the hyperbolic tangent comprehensive model, the comprehensive division threshold of the target design parameters is obtained and recorded as the target division threshold. The groove target depth is compared with the target division threshold. When the groove target depth is less than or equal to the target division threshold, an initial processing mode signal of laser finishing is generated; when the groove target depth exceeds the target division threshold, an initial processing mode signal of mechanical and laser composite processing is generated.

5. The processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 1, characterized in that, The groove to be processed undergoes a composite processing treatment, the specific processing steps of which are as follows: Step 3.1: Divide the processing area based on the target division threshold of the groove to be processed to obtain the mechanical processing depth and the laser processing depth; Step 3.2: Based on the machining depth and laser machining depth, obtain the machining target area and the laser machining target area respectively. Perform step 3.3 on the machining target area and step 4 on the laser machining target area. Step 3.3: Perform machining on the target area; Step 3.4, Machining Monitoring: Obtain the machining parameters and perform machining monitoring and analysis on the machining parameters to obtain machining status information. When the machining status information corresponds to a machining abnormality, mark the corresponding groove to be processed as a machining abnormal groove, execute step 3.1 on the machining abnormal groove, and count the number of machining operations for the machining abnormal groove. When the number of machining operations exceeds the preset machining operation threshold, generate a machining process abnormality warning.

6. The processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 5, characterized in that, Step 3.1 specifically involves: obtaining the target division threshold corresponding to the groove to be processed by the mechanical and laser composite processing signals; dividing the target depth of the groove into two working target depths based on the target division threshold; marking the working target depth closer to the cutting surface of the groove to be processed as the mechanical processing depth, and conversely, marking the other working target depth as the laser processing depth.

7. A processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 6, characterized in that, Step 3.2 specifically involves: obtaining the machining depth and laser processing depth of the groove to be processed; obtaining the groove opening size corresponding to the machining depth, and setting the machining target area based on the machining depth and the groove opening size; similarly, obtaining the laser processing target area corresponding to the laser processing depth, generating a laser reprocessing signal, and performing step 4 on the laser processing target area.

8. A processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 7, characterized in that, The machining parameters are monitored and analyzed to obtain machining status information, specifically as follows: Cutting data and tool wear parameters are obtained based on machining parameters; cutting force and cutting vibration parameters are obtained based on cutting data; the difference between the cutting force and the preset standard cutting force is calculated to obtain the cutting force difference value; when the cutting force difference value exceeds the preset force difference threshold, a force abnormality signal is generated; the peak vibration acceleration and vibration frequency are obtained based on the cutting vibration parameters; when the peak vibration acceleration exceeds the preset upper limit of the peak acceleration, peak value abnormality information is generated; similarly, when the vibration frequency exceeds the preset vibration frequency range, frequency abnormality information is generated; when either peak value abnormality information or frequency abnormality information is detected, a vibration abnormality signal is generated. The tool wear amount and tool usage time are obtained based on the tool wear parameters; the allowable tool wear amount and the maximum service life corresponding to the tool wear amount and tool usage time are obtained from the database; the tool wear amount, tool usage time, allowable tool wear amount and maximum service life are normalized and substituted into the preset nonlinear coupling formula to calculate the comprehensive tool wear value; When the overall tool wear value exceeds the preset overall wear threshold, a wear anomaly signal is generated; The preset signal monitoring unit identifies abnormal force signals, abnormal vibration signals, and abnormal wear signals. When no signal is detected, or when either the abnormal force signal or the abnormal vibration signal is detected, no machining status information is generated. When both the abnormal force signal and the abnormal vibration signal are detected, it is recorded as signal status one. When the abnormal wear signal is detected, it is recorded as signal status two. When both signal status one and signal status two are detected, it is recorded as signal status three. When the signal monitoring unit detects any one of signal status one, signal status two, and signal status three, machining status information is generated as machining abnormality.

9. A processing method for improving the processing efficiency of grooves on printed circuit boards according to claim 1, characterized in that, The quality assessment of the processed grooves and the process warning are obtained by pre-deployed image monitoring and comparison technology. Specifically, the processed grooves are compared with the preset design parameters to obtain the processing quality status. The number of processed grooves with quality abnormalities corresponding to the processing quality status at the preset unit monitoring time is obtained. When the number of processed grooves exceeds the preset processing abnormality threshold, a process warning is generated.

Images