Liquid-cooled power supply case, liquid-cooled power supply cabinet and data center cooling system

Abstract

The invention discloses a liquid-cooled power supply case which comprises a case body, at least one power supply and at least one partition plate. The case is provided with a cooling liquid input end and a cooling liquid output end. The power supply is arranged in the case. The partition plate is arranged in the machine box, and the partition plate divides the cooling liquid input end and the cooling liquid output end.

Description

TECHNICAL FIELD

[0001] The present application relates to a liquid cooling architecture, and in particular, to a liquid-cooled power supply chassis, a liquid-cooled power supply cabinet and a data center cooling system. BACKGROUND

[0002] Conventional liquid cooling architecture needs to add active cooling panels or heat-conductive copper sheets in the cabinet to transfer heat to the cooling liquid through the cooling panels or heat-conductive copper sheets, and then the cooling liquid carries away the heat. However, installing cooling panels or heat-conductive copper sheets in the space of the cabinet will occupy the original space of the cabinet, reducing the space utilization of the cabinet. In addition, the conventional liquid cooling architecture uses water as the cooling liquid, and water is a conductive medium, which may cause a short circuit hazard due to leakage, and further improvement is needed. SUMMARY

[0003] The present application relates to a liquid-cooled power supply chassis, a liquid-cooled power supply cabinet and a data center cooling system, which can dissipate heat through liquid cooling and solve the shortcomings of conventional liquid cooling architecture.

[0004] According to one aspect of the present application, a liquid-cooled power supply chassis is provided, which includes a chassis, at least one power supply, and at least one partition. The chassis has a cooling liquid input end and a cooling liquid output end. The power supply is disposed in the chassis. The partition is disposed in the chassis, and the partition separates the cooling liquid input end and the cooling liquid output end.

[0005] According to one aspect of the present application, a liquid-cooled power supply cabinet is provided, which includes a rack, a cooling liquid input manifold, a cooling liquid output manifold, at least one liquid-cooled power supply chassis, at least one first conduit, and at least one second conduit. The rack has a receiving slot, a first port, and a second port. The cooling liquid input manifold has at least one inlet end connected to the first port. The cooling liquid output manifold has at least one outlet end connected to the second port. The liquid-cooled power supply chassis is disposed in the receiving slot of the rack. The first conduit is connected between the first port and the cooling liquid input end. The second conduit is connected between the second port and the cooling liquid output end.

[0006] According to one aspect of the present application, a data center cooling system is provided, which comprises at least one liquid-cooled power supply cabinet and at least one server cabinet. The liquid-cooled power supply cabinet has a plurality of liquid-cooled power supply enclosures, a first cooling liquid input manifold, a first cooling liquid output manifold, and a first cooling liquid distribution unit. The server cabinet has a plurality of server enclosures, a second cooling liquid input manifold, a second cooling liquid output manifold, and a second cooling liquid distribution unit. By the configuration of the first cooling liquid distribution unit, cooling liquid is input into the plurality of liquid-cooled power supply enclosures via the first cooling liquid input manifold, and cooling liquid is output from the plurality of liquid-cooled power supply enclosures via the first cooling liquid output manifold. By the configuration of the second cooling liquid distribution unit, cooling liquid is input into the plurality of server enclosures via the second cooling liquid input manifold, and cooling liquid is output from the plurality of server enclosures via the second cooling liquid output manifold.

[0007] For a better understanding of the above objects and other objects of the present application, the following embodiments will be described in detail with reference to the attached drawings: BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 A top view of a liquid-cooled power supply enclosure according to one embodiment of the present application;

[0009] Figures 2A-2B Schematic diagrams of partition plates according to two embodiments of the present application, respectively;

[0010] Figures 3A-3C Schematic diagrams of partition plate configurations according to three embodiments of the present application, respectively;

[0011] Figures 4-10 Schematic diagrams of partition plate configurations according to seven embodiments of the present application, respectively;

[0012] Figure 11A and Figure 11B Schematic diagrams of a liquid-cooled power supply cabinet and a partial enlarged view according to one embodiment of the present application, respectively;

[0013] Figure 12 and Figure 13 Schematic diagrams of a liquid-cooled power supply cabinet with a built-in cooling liquid distribution unit according to one embodiment of the present application, respectively;

[0014] Figure 14 and Figure 15 Schematic diagrams of a liquid-cooled power supply cabinet (or server cabinet) with an external cooling liquid distribution unit and a data center cooling system according to one embodiment of the present application, respectively;

[0015] Figure 16 A schematic diagram of an AC input power supply and a DC output power supply.

[0016] In the drawings:

[0017] 100: liquid-cooled power supply chassis;

[0018] 101: server chassis;

[0019] 102: chassis;

[0020] 102a: coolant input;

[0021] 102b: coolant output;

[0022] 103: long side;

[0023] 104: power supply;

[0024] 105: short side;

[0025] 106: baffle (flow splitter);

[0026] 106a, 106b: baffle units;

[0027] 106p: overlap region;

[0028] 106q: non-overlap region;

[0029] 107, 108: straight-through flow field;

[0030] 109: bypass flow field;

[0031] 110: aperture;

[0032] 110': aperture-free region;

[0033] 111: bevel;

[0034] 112: folded edge plate;

[0035] 118: hybrid cabinet;

[0036] 120: liquid-cooled power supply cabinet;

[0037] 121: shelf;

[0038] 121a: first port;

[0039] 121b: second port;

[0040] 121c: receptacle slot;

[0041] 122: server cabinet;

[0042] 123: coolant input manifold;

[0043] 124: inlet end;

[0044] 125: coolant output manifold;

[0045] 126: outlet end;

[0046] 127: first conduit;

[0047] 128: second conduit;

[0048] 130: conduit mounting rack;

[0049] 131a: quick coupling;

[0050] 131b: quick coupling;

[0051] 132: coolant distribution unit;

[0052] 133: coolant distribution pipe;

[0053] 134: liquid pump unit;

[0054] 140: data center cooling system;

[0055] 150a, 150b: power cord;

[0056] 151: electromagnetic interference filter;

[0057] 152: active surge current limiter and repeater;

[0058] 153: power factor correction circuit;

[0059] 154: DC voltage reduction circuit;

[0060] L, Lp, Lq: length;

[0061] Lg: spacing;

[0062] Lp: length;

[0063] Lh: horizontal distance;

[0064] Lq: length;

[0065] H, H1, H2: height;

[0066] H3: lowered height. DETAILED DESCRIPTION

[0067] Please refer to Figure 1 and Figure 2A , Figure 2B wherein Figure 1 is a top view of a liquid-cooled power supply chassis 100 according to an embodiment of the present application, Figure 2A and Figure 2B are schematic views of a partition 106 according to two embodiments of the present application, respectively.

[0068] The liquid-cooled power supply chassis 100 is a heat dissipation method using liquid as a heat conduction medium. In other words, the liquid-cooled power supply chassis 100 uses an immersion cooling method to directly immerse the heat-generating components in a non-conductive coolant. The heat generated by the heat-generating components can be directly conducted to the coolant, and there is no need for other active cooling plates or heat-conducting copper sheets to transfer heat to the coolant. The coolant can flow out of the liquid-cooled power supply chassis 100 through a pipeline and be recirculated into the liquid-cooled power supply chassis 100 to continue to absorb the heat generated by the heat-generating components, thereby improving the heat dissipation efficiency. The liquid-cooled power supply chassis 100 of the present embodiment can be applied in a liquid-cooled power supply cabinet 120, a server cabinet 122, and / or a data center cooling system 140 including the liquid-cooled power supply cabinet 120 and the server cabinet 122 (see FIGS. 12-15).

[0069] In an embodiment, the coolant is a dielectric liquid, commonly used as a synthetic oil (hydrocarbon) or a fluorine compound (fluorochemicals). The coolant is a non-conductive medium, and there is no risk of short circuit caused by leakage.

[0070] Please refer to Figure 1 The liquid-cooled power supply chassis 100 includes a chassis 102, at least one power supply 104, and at least one partition 106. The chassis 102 includes a closed housing that can store components, circuit boards, and heat-generating components, etc. The power supply 104 includes a power converter and / or a transformer to provide the operating voltage and power required by the electrical components. The partition 106 is, for example, a flow guide plate and / or a shunt plate to divide the internal space of the chassis 102 into multiple areas to facilitate the flow of the coolant in the chassis 102. In addition, the circuit board of the electronic components in the chassis 102 can also be used as part of the partition 106. The coolant at least partially covers the electronic components such as the circuit board, the power converter, or the transformer, for example, at least 50-100% of the chassis 102 needs to be filled, but it does not need to be completely filled. The power supply 104 inputs alternating current AC, which passes through an electromagnetic interference filter (EMI filter) 151, an active inrush limiting and relay 152, a power factor correction circuit (PFC stage) 153, and a direct current step-down circuit (D2D stage) 154, and finally outputs direct current DC, as shown in Figure 16 .

[0071] Please refer to Figure 1The case 102 is, for example, a rectangular case. The case 102 has two long sides 103 and two short sides 105. In addition, the case 102 has a coolant input end 102a and a coolant output end 102b, which are located on the same short side 105 of the case 102. The coolant input end 102a is used for inputting coolant into the case 102. The coolant output end 102b is used for outputting coolant out of the case 102. However, in other embodiments, the coolant input end 102a can be located on one of the short sides 105 of the case 102, and the coolant output end 102b can be located on the other short side 105 of the case 102. Thus, the case 102 of the present embodiment is not limited to having the coolant input end 102a and the coolant output end 102b located on the same short side 105.

[0072] Please refer to Figure 1 The partition 106 is disposed in the case 102, and the partition 106 separates the coolant input end 102a and the coolant output end 102b. That is, the partition 106 extends along the long side 103 of the case 102 and is disposed between the coolant input end 102a and the coolant output end 102b, so as to divide the internal space of the case 102 into at least two straight flow fields 107, 108.

[0073] As shown in Figure 1 , the coolant input end 102a is located on one of the straight flow fields 107 on one side of the partition 106, and the coolant output end 102b is located on the other straight flow field 108 on the other side of the partition 106. In an embodiment, the coolant flows in the internal space of the case 102 through the two straight flow fields 107, 108 connected in a U shape, so that the heat generated by the heat-generating elements in the internal space of the case 102 can be directly conducted to the coolant, and the heat is conducted out of the case 102 through the coolant. However, in other embodiments, the coolant flows in the internal space of the case 102 through other types of flow fields (such as S-shaped, V-shaped, W-shaped, or other shapes).

[0074] Since the cooling liquid first flows through the straight flow field 107 and then through the straight flow field 108, and the cooling liquid has absorbed the heat of the electronic components in the straight flow field 107, the temperature of the cooling liquid in the straight flow field 108 is higher than that in the straight flow field 107. If the electronic components that are easy to generate heat are arranged in the straight flow field 107, the temperature of the cooling liquid in the straight flow field 107 will be greatly increased. When the cooling liquid flows to the straight flow field 108, the heat exchange efficiency between the cooling liquid and the electronic components will be reduced because the temperature difference between the cooling liquid and the electronic components in the straight flow field 107 is not large. In a more serious case, the temperature of the cooling liquid flowing through the straight flow field 108 can be higher than that of the electronic components in the straight flow field 108, which not only has no heat dissipation efficiency, but also causes the cooling liquid to heat the electronic components. To solve the above problems, the electronic components such as power converters or transformers in the case 102 can be arranged according to the flow direction of the cooling liquid. For example, the electronic components that are easy to generate heat are arranged in the straight flow field 108 close to the cooling liquid output end 102b according to the flow direction of the cooling liquid, i.e., the electronic components that are easy to generate heat are arranged in the straight flow field 108 close to the cooling liquid output end 102b, such as transformers or MOSFETs arranged in the cooling liquid output end 102b.

[0075] To further improve the cooling efficiency and avoid the problem of too high temperature of the cooling liquid in the straight flow field 108, at least one bypass flow field 109 (indicated by a dashed line) is added in another embodiment (as shown in Figure 1 FIG. 3) in addition to the straight flow fields 107 and 108 arranged in the case 102. The bypass flow field 109 is arranged near the electronic components that are easy to generate heat in the straight flow field 108 to allow part of the cooling liquid with a lower temperature to directly enter the straight flow field 108. The cooling liquid passing through the bypass flow field 109 mixes with the cooling liquid in the straight flow field 108, thereby reducing the temperature of the cooling liquid in the straight flow field 108 and improving the heat exchange efficiency between the cooling liquid and the electronic components in the straight flow field 108. Therefore, the partition plate 106 in the present embodiment does not limit the type of flow of the cooling liquid in the case 102.

[0076] Please refer to Figure 1 and Figure 2A . The partition plate 106 is, for example, a solid elongated plate that separates the two straight flow fields 107 and 108. The partition plate 106 has a length L and a height H, and the length L is much larger than the height H. The length L and the height H of the partition plate 106 can be matched with the length and the height of the case 102, for example, the length L of the partition plate 106 is about one-half or two-thirds of the length of the case 102, or the height H of the partition plate 106 is about the height of the case 102 or one-half or two-thirds of the height of the case 102, or the height H of the partition plate 106 varies.

[0077] Referring to Figure 1 and Figure 2B , the partition plates, for example, include partition plate units 106a, 106b composed of two solid long plates, which are arranged along the long side 103 of the case 102 and are separated between the two straight flow fields 107, 108. The length of each partition plate unit 106a, 106b is about one-half or less of the length of the case 102, and the height of each partition plate unit 106a, 106b is about the height of the case 102 or one-half or two-thirds of the height of the case 102. Meanwhile, the total length of the partition plates 106a, 106b in the direction of the long side 103 of the case 102 is about one-half or two-thirds of the length of the case 102.

[0078] Referring to Figures 3A-3C , which are schematic diagrams of the partition plate configurations of the three embodiments of the present application. In Figure 3A , two partition plate units 106a, 106b are arranged in alignment along the long side 103 of the case 102 (see Figure 1 ). The two partition plate units 106a, 106b can be closely connected or separated by a distance Lg. The distance Lg is about 0% to 25% of the length of the case 102. In Figure 3B and Figure 3C , two partition plate units 106a, 106b are arranged in parallel along the long side 103 of the case 102 (see Figure 1 ), and the two partition plate units 106a, 106b can partially overlap or not overlap in the direction of the horizontal projection of the long side 103. As shown in Figure 3B , the length Lp of the partially overlapping region 106p of the two partition plate units 106a, 106b can be one-half, one-fourth or less of the length of the case 102. In addition, the horizontal distance Lh between the two partition plate units 106a, 106b is about one-fourth or less of the width of the case 102. As shown in Figure 3C , when the two partition plate units 106a, 106b are parallel but not overlapping, the length Lq of the non-overlapping region 106q of the two partition plate units 106a, 106b can be one-fourth or less of the length of the case 102. In addition, the horizontal distance Lh between the two partition plate units 106a, 106b is about one-fourth or less of the width of the case 102. Meanwhile, the total length of the partition plates 106a, 106b in the direction of the long side 103 of the case 102 is about one-half or two-thirds of the length of the case 102. The above-mentioned partition plates 106, partition plate units 106a, 106b can also be referred to as flow dividing devices or flow dividing elements, and the region between the two partition plate units 106a, 106b can be defined as the region of the bypass flow field 109.

[0079] Referring to Figures 4-10Fig. 1 is a schematic diagram of a computer system 100 according to an embodiment of the present application. The computer system 100 includes a cabinet 102, a power supply 104, a motherboard 106, a hard disk drive 108, a memory 110, a CPU 112, a display 114, a keyboard 116, a mouse 118, and a cooling system 120. The cabinet 102 has an input end 102a and an output end 102b. The power supply 104 is disposed in the cabinet 102 and is connected to the motherboard 106. The motherboard 106 is disposed in the cabinet 102 and is connected to the hard disk drive 108, the memory 110, the CPU 112, the display 114, the keyboard 116, and the mouse 118. The cooling system 120 is disposed in the cabinet 102 and is connected to the motherboard 106. The cooling system 120 includes a bypass flow field device 122 disposed on the motherboard 106. The bypass flow field device 122 is configured to generate a bypass flow field 124 between two straight flow fields 126, 128 of the cooling system 120, so that the cooling liquid can flow from the straight flow field 126 to the straight flow field 128 through the bypass flow field device 122, thereby reducing the temperature of the cooling liquid in the straight flow field 128.

[0080] In Figure 4 , the bypass flow field device 122 of the motherboard 106 includes an opening 130, a plurality of openings 130 arranged in a horizontal direction, or a plurality of openings 130 arranged in a vertical direction. In Figure 4 , the number of the openings 130 is not limited, and the shape of the opening 130 can be circular or other shapes. Each opening 130 forms a bypass flow field 124 between the two straight flow fields 126, 128 (see Figure 1 ) to allow part of the cooling liquid to flow or generate a disturbance effect inside the cabinet 102 through each opening 130. In an embodiment, the percentage of the area of the opening 130 region to the area of the non-opening region 130' is between about 5% and 50%. The region of the motherboard 106 other than the opening 130 is referred to as the non-opening region 130'. In an embodiment, the opening 130 can be located at an end away from the input end 102a and the output end 102b of the cabinet 102, but the present application is not limited thereto.

[0081] In Figure 5 , the bypass flow field device 122 of the motherboard 106 includes an opening 130 or a plurality of openings 130. The opening 130 is located substantially on the top surface of the motherboard 106, so that the height H1 of the motherboard 106 at the opening 130 is lower than the height H2 of the non-opening region 130' to form a notch above the motherboard 106. In Figure 5 , the height H3 of the motherboard 106 lowered at the opening 130 is between about 5% and 50% of the height H2 of the motherboard 106 at the non-opening region 130', and the top surface of the motherboard 106 can have a concave-convex shape. In an embodiment, the opening 130 can be located at an end away from the input end 102a and the output end 102b of the cabinet 102, but the present application is not limited thereto.

[0082] In Figure 6 , the bypass flow field device 122 of the motherboard 106 includes an opening 130. The opening 130 is located substantially on the top surface of the motherboard 106, so that the height H1 of the motherboard 106 at the opening 130 is lower than the height H2 of the non-opening region 130'. In Figure 6In the embodiment, the top surface of the baffle 106 is, for example, a slope 111 extending downward from the upper portion of the baffle 106 to the side portion of the baffle 106 to form an inclined surface on the upper portion of the baffle 106. Thus, the height of the baffle 106 gradually decreases from the non-hole area 110' to the hole 110, and the height H3 of the baffle 106 at the hole 110 is between 20% and 50% of the height H2 of the baffle 106 at the non-hole area 110'. The hole 110 can be located at an end away from the coolant input end 102a and the coolant output end 102b, but the present application is not limited thereto.

[0083] In the embodiment, Figure 7 and Figure 8 , the bypass flow field device of the baffle 106 includes at least one hole 110, and the baffle 106 has a folded edge plate 112 at the hole 110. The folded edge plate 112 protrudes from one side of the baffle 106 to the other side of the baffle 106. That is, the folded edge plate 112 can protrude from one of the straight flow fields 107 or 108 (see Figure 1 ) to the other of the straight flow fields 108 or 107 (see Figure 1 ) so that the folded edge plate 112 is not coplanar with other areas (non-hole area 110') of the baffle 106. In the embodiment, Figure 7 and Figure 8 , the folded edge plate 112 is bent along the horizontal direction of the baffle 106, and the area of the folded edge plate 112 protruding from one side of the baffle 106 to the other side of the baffle 106 is between 20% and 80% of the area of the baffle 106. In an embodiment, the hole 110 can be located at an end away from the coolant input end 102a and the coolant output end 102b, but the present application is not limited thereto.

[0084] In the embodiment, Figure 9 and Figure 10 , the bypass flow field device of the baffle 106 includes at least one hole 110, and the baffle 106 has a folded edge plate 112 at the hole 110. The folded edge plate 112 protrudes from one side of the baffle 106 to the other side of the baffle 106. That is, the folded edge plate 112 can protrude from one of the straight flow fields 107 or 108 (see Figure 1 ) to the other of the straight flow fields 108 or 107 (see Figure 1 ) so that the folded edge plate 112 is not coplanar with other areas (non-hole area 110') of the baffle 106. In the embodiment, Figure 9 and Figure 10 , the folded edge plate 112 is bent along the vertical direction of the baffle 106, and the area of the folded edge plate 112 protruding from one side of the baffle 106 to the other side of the baffle 106 is between 20% and 80% of the area of the baffle 106. In an embodiment, the hole 110 can be located at an end away from the coolant input end 102a and the coolant output end 102b, but the present application is not limited thereto.

[0085] Referring to Figure 11A and Figure 11B which are a schematic view and a partial enlarged view of a liquid-cooled power cabinet 120 according to an embodiment of the present application. The liquid-cooled power cabinet 120 comprises a shelf 121, a cooling liquid input manifold 123, a cooling liquid output manifold 125, at least one liquid-cooled power cabinet 100, at least one first conduit 127, and at least one second conduit 128. Any number of shelves 121, for example, 10 to 30, can be placed on each cooling liquid input manifold 123 and cooling liquid output manifold 125; and any number of liquid-cooled power cabinets 100, for example, 5 to 10, can be placed on each shelf 121 according to the requirement. The detailed structure of the liquid-cooled power cabinet 100 is described in detail in Figures 1-10 , which will not be repeated here.

[0086] With respect to each liquid-cooled power cabinet 100, the shelf 121 has a receiving slot 121c, a first port 121a, and a second port 121b. In addition, with respect to each liquid-cooled power cabinet 100, the first conduit 127 is connected between the first port 121a and the cooling liquid input end 102a, and the second conduit 128 is connected between the second port 121b and the cooling liquid output end 102b.

[0087] In addition, with respect to each shelf 121, the cooling liquid input manifold 123 has an inlet end 124 connected to the first port 121a. With respect to each shelf 121, the cooling liquid output manifold 125 has an outlet end 126 connected to the second port 121b. That is, the flow of the cooling liquid is roughly as follows: the cooling liquid flows through the inlet end 124 of the cooling liquid input manifold 123 to the first port 121a, and then flows through the first port 121a and the first conduits 127 to the cooling liquid input ends 102a of the respective liquid-cooled power cabinets 100, so that the cooling liquid flows in the respective liquid-cooled power cabinets 100, absorbs the heat of the electronic components in the liquid-cooled power cabinets 100, and carries away the heat energy by the flow of the cooling liquid. Then, the cooling liquid flows through the cooling liquid output ends 102b of the respective liquid-cooled power cabinets 100 to the second conduits 128 and the second port 121b, and then flows through the second port 121b to the outlet end 126 of the cooling liquid output manifold 125. The cooling liquid carries away the heat energy to a heat exchanger (not shown in the figure) outside the liquid-cooled power cabinet 120, and is recirculated into the liquid-cooled power cabinet 100 to continue to absorb the heat energy of the electronic components.

[0088] Referring to Figure 11A and Figure 11BIn one embodiment, the liquid-cooled power supply cabinet 120 may further include a conduit mounting bracket 130 disposed on the shelf 121. The conduit mounting bracket 130 allows installers to quickly install the liquid-cooled power supply cabinet 100 onto the shelf 121 for easy subsequent maintenance and replacement.

[0089] Please refer to Figure 11A and Figure 11B For each liquid-cooled power supply chassis 100, the conduit mounting bracket 130 includes a quick connector 131a connecting the first conduit 127 to the coolant inlet 102a. Additionally, the conduit mounting bracket 130 includes a quick connector 131b connecting the second conduit 128 to the coolant outlet 102b. The quick connectors 131a and 131b are liquid-cooled quick connectors, preferably liquid-cooled blind-plug quick connectors, such as UQDB-02 or UQDB-04 standard connectors, which can be used in tool-free liquid-cooling systems.

[0090] Please refer to Figure 12 and Figure 13 These are schematic diagrams of a liquid-cooled power supply cabinet 120 (or server cabinet 122) with a built-in coolant distribution unit 132 according to an embodiment of the present invention. In one embodiment, two or more liquid-cooled power supply cabinets 120 (or server cabinets 122) can be connected to each other through the built-in coolant distribution unit 132, as described below.

[0091] Please refer to Figure 12 The coolant distribution unit 132 includes at least one coolant distribution pipe 133 and at least one liquid pump unit 134. The coolant distribution pipe 133 is connected between two or more liquid-cooled power supply cabinets 120 (or server cabinets 122) to input and / or output coolant to the liquid-cooled power supply cabinets 120 (or server cabinets 122). Furthermore, the liquid pump unit 134 is connected to the coolant input manifold 123 and coolant output manifold 125 of each liquid-cooled power supply cabinet 120 (or server cabinet 122) (see [link]). Figure 11A This allows for the input and / or output of coolant to each liquid-cooled power supply chassis 100 (or server chassis 101). In one embodiment, a liquid pump unit 134 may be located at the bottom of each liquid-cooled power supply rack 120 (or server rack 122), and the liquid pump unit 134 may be connected to each coolant input manifold 123 and each coolant output manifold 125 via a coolant distribution pipe 133 (see...). Figure 11A This forms a cooling circulation loop, wherein the power for the liquid pump unit 134 can be provided by the liquid-cooled power supply cabinet 120.

[0092] Please refer to Figure 13The liquid-cooled power supply chassis 100 and the server chassis 101 can be placed in the same rack to form a hybrid rack 118. The liquid pump unit 134 can be located at the bottom of the hybrid rack 118, and the liquid pump unit 134 can be directly connected to each coolant inlet manifold 123 and each coolant outlet manifold 125 (see...). Figure 11A This forms a cooling circulation loop. The power for the liquid pump unit 134 is supplied by the liquid-cooled power supply chassis 100.

[0093] Please refer to Figure 14 and 15 These are schematic diagrams of data center cooling systems 140 with independent or hybrid racks having external coolant distribution units 132, respectively, according to two embodiments of the present invention. Referring to Figure 14, the coolant distribution unit 132 is independently disposed outside two or more hybrid racks 118 (including liquid-cooled power supply chassis 100 and server chassis 101). The coolant distribution unit 132 includes at least one coolant distribution pipe 133 and at least one liquid pump unit 134. The difference is that the liquid pump unit 134 is disposed outside the two or more hybrid racks 118 to reduce the space occupied. The liquid pump unit 134 can be connected to the coolant inlet manifold 123 and the coolant outlet manifold 125 of each hybrid rack 118 via the coolant distribution pipe 133 (see Figure 14). Figure 11A This forms a cooling circulation loop. The coolant distribution unit 132 may further include a liquid-to-liquid heat exchanger (not shown) or a liquid-to-gas heat exchanger (not shown) to transfer heat from the coolant distribution pipe 133 to the external environment. The two or more hybrid racks 118 described above may each include any number of liquid-cooled power supply chassis 100 and any number of server chassis 101, for example, 10 to 30. When the liquid-cooled power supply chassis 100 and server chassis 101 are placed in the same rack, such as... Figure 14 As shown, the power supply for server chassis 101 can be provided by power supply chassis 100 within the same rack. Furthermore, in Figure 15 In this configuration, the liquid-cooled power supply chassis 100 and the server chassis 101 can also be independently configured in different racks to form separate power supply racks 120 and server racks 122. The liquid-cooled power supply rack 120 receives power from the server rack 122 via power cables 150a and 150b.

[0094] Please refer to Figure 11A and Figure 14 , 15The liquid-cooled power supply chassis 100 and server chassis 101 each have a coolant inlet 102a (hereinafter referred to as the first coolant inlet and the second coolant inlet) and a coolant outlet 102b (hereinafter referred to as the first coolant outlet and the second coolant outlet). Furthermore, the coolant inlet manifold 123 has at least two inlet ends 124, which are respectively connected to the first coolant inlet and the second coolant inlet. Additionally, the coolant outlet manifold 125 has at least two outlet ends 126, which are connected to the first coolant outlet and the second coolant outlet. The configuration of the coolant inlet 102a, coolant outlet 102b, coolant inlet manifold 123, and coolant outlet manifold 125 of the liquid-cooled power supply chassis 100 and server chassis 101 is similar to... Figure 11A and Figure 11B You can refer to these examples as well, so I won't go into detail here.

[0095] In addition, the coolant distribution unit 132 can input and / or output coolant to the liquid-cooled power supply chassis 100 and the server chassis 101 through the coolant inlet manifold 123 and the coolant outlet manifold 125.

[0096] Additionally, please refer to Figure 11A and Figure 15 In the case of independent racks, the liquid-cooled power supply rack 120 and the server rack 122 may each have separate coolant distribution units 132 (hereinafter referred to as the first coolant distribution unit and the second coolant distribution unit). The liquid-cooled power supply rack 120, through the configuration of the first coolant distribution unit, can supply coolant to multiple liquid-cooled power supply chassis 100 via the first coolant inlet manifold 123, and then discharge coolant to the multiple liquid-cooled power supply chassis 100 via the first coolant outlet manifold 125. Furthermore, the server rack 122, through the configuration of the second coolant distribution unit, can supply coolant to multiple server chassis 101 via the second coolant inlet manifold 123, and then discharge coolant to the multiple server chassis 101 via the second coolant outlet manifold 125.

[0097] On the other hand, Figure 15 In addition, the liquid-cooled power supply cabinet 120 can also directly supply coolant to the liquid-cooled power supply cabinet 120 via the configuration of the coolant distribution unit 132, through the first coolant input manifold 123, and then supply coolant to the liquid-cooled power supply cabinet 120 via the first coolant output manifold 125.

[0098] In addition, Figure 15In this configuration, the server rack 122 can also directly receive coolant via the second coolant inlet manifold 123 through the coolant distribution unit 132, and then receive coolant via the second coolant outlet manifold 125. The configuration of the coolant distribution unit 132 is similar to... Figure 14 You can refer to these examples as well, so I won't go into detail here.

[0099] In summary, although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A liquid-cooled power supply chassis, characterized in that, include: A chassis having a coolant inlet and a coolant outlet; At least one power supply is disposed in the chassis; as well as At least one partition is disposed in the chassis, the partition separating the coolant inlet and the coolant outlet.

2. The liquid-cooled power supply chassis as described in claim 1, characterized in that, The chassis has a long side and a short side, and the partition extends along the long side and is disposed between the coolant inlet and the coolant outlet to divide the internal space of the chassis into at least two straight flow fields.

3. The liquid-cooled power supply chassis as described in claim 2, characterized in that, The partition comprises two partition units aligned along the long side.

4. The liquid-cooled power supply chassis as described in claim 2, characterized in that, The partition includes two partition units arranged parallel to each other along the long side, and the two partition units may partially overlap or not overlap in the horizontal projection direction of the long side.

5. The liquid-cooled power supply chassis as described in claim 2, characterized in that, The coolant inlet and the coolant outlet are located on the short side. The coolant inlet corresponds to a straight flow field on one side of the partition, and the coolant outlet corresponds to another straight flow field on the other side of the partition.

6. The liquid-cooled power supply chassis as described in claim 5, characterized in that, The baffle includes at least one bypass flow field device for forming a bypass flow field between the direct flow fields.

7. The liquid-cooled power supply chassis as described in claim 6, characterized in that, The bypass flow field device includes an opening, and the height of the baffle at the opening is lower than the height at the location without the opening.

8. The liquid-cooled power supply chassis as described in claim 7, characterized in that, The height of the partition gradually decreases from the part without the opening towards the part with the opening.

9. The liquid-cooled power supply chassis as described in claim 6, characterized in that, The bypass flow field device includes a folded plate disposed on the partition, the folded plate protruding from one of the straight flow fields to the other straight flow field.

10. The liquid-cooled power supply chassis as described in claim 9, characterized in that, The folded edge plate is bent into shape along the horizontal or vertical direction of the partition.

11. A liquid-cooled power supply cabinet, characterized in that, include: A single-layer shelf has a receiving slot, a first port, and a second port; A coolant inlet manifold has at least one inlet end connected to the first port; A coolant outlet manifold has at least one outlet end connected to the second port; At least one liquid-cooled power supply chassis as described in any one of claims 1 to 10 is disposed in the receiving slot of the shelf; At least one first conduit is connected between the first port and the coolant inlet; as well as At least one second conduit is connected between the second port and the coolant output port.

12. The liquid-cooled power supply cabinet as described in claim 11, characterized in that, It also includes a conduit mounting bracket disposed on the shelf, the conduit mounting bracket including a quick connector connecting the first conduit and the coolant inlet.

13. The liquid-cooled power supply cabinet as described in claim 11, characterized in that, It also includes a conduit mounting bracket disposed on the shelf, the conduit mounting bracket including a quick connector connecting the second conduit and the coolant outlet.

14. The liquid-cooled power supply cabinet as described in claim 11, characterized in that, It also includes a coolant distribution unit, which uses a coolant distribution pipe to input / output coolant into / out of the liquid-cooled power supply chassis.

15. The liquid-cooled power supply cabinet as described in claim 14, characterized in that, The coolant distribution unit further includes a liquid pump unit connected to the coolant inlet manifold and the coolant outlet manifold.

16. A liquid-cooled power supply cabinet, characterized in that, include: At least one liquid-cooled power supply chassis has a first coolant input terminal and a first coolant output terminal; At least one server chassis has a second coolant inlet and a second coolant outlet; A coolant inlet manifold has at least two inlet ends, the inlet ends being respectively connected to a first coolant inlet end and a second coolant inlet end; A coolant outlet manifold has at least two outlet ends, the outlet ends being respectively connected to a first coolant outlet end and a second coolant outlet end; as well as A coolant distribution unit, wherein the coolant distribution unit inputs / outputs coolant to / from the liquid-cooled power supply chassis and the server chassis via the coolant inlet manifold and the coolant outlet manifold.

17. A data center cooling system, characterized in that, include: At least one liquid-cooled power supply cabinet, having multiple liquid-cooled power supply chassis, a first coolant inlet manifold, a first coolant outlet manifold, and a first coolant distribution unit; as well as At least one server rack, having multiple server chassis, a second coolant inlet manifold, a second coolant outlet manifold, and a second coolant distribution unit; Specifically, through the configuration of the first coolant distribution unit, coolant is input to the plurality of liquid-cooled power supply chassis via the first coolant input manifold, and coolant is output to the plurality of liquid-cooled power supply chassis via the first coolant output manifold. Through the configuration of the second coolant distribution unit, coolant is input to the plurality of server chassis via the second coolant inlet manifold, and coolant is output to the plurality of server chassis via the second coolant outlet manifold.

18. A data center cooling system, characterized in that, include: At least one liquid-cooled power supply cabinet, having multiple liquid-cooled power supply chassis, a first coolant inlet manifold and a first coolant outlet manifold; At least one server rack having multiple server chassis, a second coolant inlet manifold and a second coolant outlet manifold; as well as A coolant distribution unit is connected to the first coolant inlet manifold, the first coolant outlet manifold, the second coolant inlet manifold, and the second coolant outlet manifold. The coolant distribution unit is configured to supply coolant to the liquid-cooled power cabinet via the first coolant inlet manifold and to the liquid-cooled power cabinet via the first coolant outlet manifold. Through the configuration of the coolant distribution unit, coolant is input into the server rack via the first coolant inlet manifold and output from the server rack via the first coolant outlet manifold.

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