Apparatus for manufacturing display device

Abstract

An apparatus for manufacturing a display device that deposits a first deposition material and a second deposition material on a display substrate arranged in a virtual plane is provided. The apparatus may include a deposition source having a plurality of deposition portions including different deposition materials in different regions or portions of a virtual plane. The deposition source is moved relative to the display substrate such that the deposition material can be deposited onto the display substrate with at least one of the different regions of the virtual plane coinciding with the position of the display substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0058672, filed on May 2, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to apparatus for manufacturing display devices. Background Technology

[0004] Mobile electronic devices are widely used. Recently, in addition to small electronic devices such as mobile phones, tablet PCs have also become widely used as mobile electronic devices.

[0005] To support various functions, these mobile electronic devices include display devices to provide users with visual information such as images or videos. Recently, with the miniaturization of components used to drive display devices, the proportion of display devices in electronic devices has been gradually increasing, and display devices with structures that can be bent from a near-flat state to an angle are also under development. Summary of the Invention

[0006] One or more embodiments include apparatus for manufacturing a display device, wherein manufacturing time and cost of the display device can be reduced, and material buildup can be reduced.

[0007] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0008] According to one or more embodiments, an apparatus for manufacturing a display device may include: a chamber; a deposition source disposed in the chamber and including a first deposition section and a second deposition section, the first deposition section spraying a first deposition material toward a display substrate, and the second deposition section spraying a second deposition material toward the display substrate; and a moving section that moves the deposition source relative to the display substrate in a first direction and a second direction opposite to the first direction, wherein the display substrate may be disposed on a virtual plane, the virtual plane may include: a first region where the first deposition material reaches the first region and the second deposition material does not reach the first region; a second region where the first deposition material and the second deposition material each reach the second region; and a third region where the second deposition material reaches the third region and the first deposition material does not reach the third region, and the first region, the second region and the third region may be defined relative to the deposition source and move together with the deposition source to different positions on the virtual plane.

[0009] The display substrate can sequentially pass through the first region, the second region, the third region, the second region, and the first region as the deposition source moves in the first direction and the second direction in sequence with respect to the display substrate.

[0010] A first layer including the first deposition material can be deposited on the display substrate as the display substrate passes through the first region, a second layer including the first deposition material and the second deposition material can be deposited on the display substrate as the display substrate passes through the second region, a third layer including the second deposition material can be deposited on the display substrate as the display substrate passes through the third region, a fourth layer including the first deposition material and the second deposition material can be deposited on the display substrate as the display substrate passes through the second region again, and a fifth layer including the first deposition material can be deposited on the display substrate as the display substrate passes through the first region again.

[0011] In the second layer, the concentration of the second deposition material can gradually increase in a direction toward the third layer as compared with the first deposition material.

[0012] In the fourth layer, the concentration of the first deposition material can gradually increase in a direction toward the fifth layer as compared with the second deposition material.

[0013] Each of the first deposition material and the second deposition material can include a capping material.

[0014] The third layer can have a refractive index greater than a refractive index of each of the first layer and the fifth layer.

[0015] The fifth layer can have a thickness greater than a thickness of the first layer.

[0016] The first deposition portion can include a first-1 deposition portion and a first-2 deposition portion that eject the same material.

[0017] The first-1 deposition portion, the first-2 deposition portion, and the second deposition portion can be arranged in a linear manner in sequence.

[0018] According to one or more embodiments, an apparatus for manufacturing a display device can include a chamber, a deposition source disposed in the chamber and including a first deposition portion that ejects a first deposition material toward a display substrate and a second deposition portion that ejects a second deposition material toward the display substrate, and a moving portion that moves the deposition source in a first direction and a second direction opposite to the first direction in sequence with respect to the display substrate, wherein a first layer including the first deposition material, a second layer including the first deposition material and the second deposition material, a third layer including the second deposition material, a fourth layer including the first deposition material and the second deposition material, and a fifth layer including the first deposition material can be sequentially deposited on the display substrate, and wherein the display substrate can be disposed in a virtual plane defined with respect to the deposition source.

[0019] In the second layer, the concentration of the second deposition material can gradually increase in a direction toward the third layer, compared to the first deposition material.

[0020] In the fourth layer, the concentration of the first deposition material can gradually increase in a direction toward the fifth layer, compared to the second deposition material.

[0021] Each of the first deposition material and the second deposition material can include a capping material.

[0022] The third layer can have a refractive index greater than a refractive index of each of the first layer and the fifth layer.

[0023] The fifth layer can have a thickness greater than a thickness of the first layer.

[0024] The virtual plane can include a first region to which the first deposition material reaches and to which the second deposition material does not reach, a second region to which each of the first deposition material and the second deposition material reaches, and a third region to which the second deposition material reaches and to which the first deposition material does not reach.

[0025] The display substrate can sequentially pass through the first region, the second region, the third region, the second region, and the first region.

[0026] The first deposition part can include a first-1 deposition part and a first-2 deposition part that eject the same material.

[0027] The first-1 deposition part, the first-2 deposition part, and the second deposition part can be sequentially arranged in a linear manner.

[0028] Other aspects, features, and advantages will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, which are a described in detail in the detailed description. The detailed description includes claims, the description and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0029] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a schematic cross-sectional view of an apparatus for manufacturing a display apparatus according to an embodiment;

[0031] Figure 2 is a schematic plan view of a deposition source according to an embodiment;

[0032] Figure 3 is a schematic cross-sectional view of a deposition source according to an embodiment;

[0033] Figures 4 to 10 is a schematic cross-sectional view of a deposition source according to an embodiment;

[0034] Figure 11 is a schematic cross-sectional view of a display device according to an embodiment;

[0035] Figure 12 is a schematic plan view of a display device according to an embodiment;

[0036] Figure 13 is a schematic cross-sectional view of a display device according to an embodiment; and

[0037] Figure 14 is a schematic view of an equivalent circuit of a pixel in a display panel according to an embodiment.

[0038] DETAILED DESCRIPTION

[0039] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words that are non-limiting examples of the apparatus or methods disclosed herein. It will be apparent, however, that various embodiments can be practiced without these specific details or with one or more equivalent arrangements. Herein, various embodiments are not necessarily mutually exclusive, and can be combined in any manner. For example, specific shapes, configurations, and characteristics of an embodiment can be used or implemented in another embodiment.

[0040] Unless otherwise indicated, the illustrated embodiments are to be understood as providing features of the present disclosure. Accordingly, unless otherwise indicated, features, components, modules, layers, films, panels, regions, and / or aspects of various embodiments (hereinafter referred to as "elements") can be combined, separated, interchanged, and / or rearranged, unless otherwise indicated.

[0041] The use of cross-hatching and / or shading in the drawings is generally provided to illustrate the boundaries, of the elements of the drawings. As the use of such shading and cross-hatching is not intended to indicate or imply specific material, material properties, dimensions, ratios, etc., the presence or absence of such shading and cross-hatching should not be construed as indicating or implying any preference or requirement regarding specific material, material properties, dimensions, ratios, etc. Additionally, for clarity and the purpose of example, some of the drawings can show detailed views, detailed components, or detailed figures that can not be necessary to the understanding of the various embodiments. In addition, the various embodiments can be implemented in a number of different arrangements, sizes, configurations, materials, etc. without departing from the scope of the present disclosure. Also, while the terms "first," "second," "third," etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are generally only used herein as a label to tell apart different elements, components, regions, layers and / or sections from one another. Further, the use of the term "beneath" or "below" includes "on" or "at", unless otherwise indicated. For example, a first element or layer disposed beneath a second element or layer can be directly on surface of the second element or layer or can be indirectly on the surface of the second element or layer, such as through an intervening element or layer. As used herein, the term "directly on" or "directly connected" means that the first element or layer is in physical contact with the second element or layer without any intervening elements or layers.

[0042] When an element or layer is referred to as being “on”, “connected to”, or “coupled to” another element or layer, it can be directly on, connected, or coupled to the other element or layer, or one or more intervening elements or layers can be present. In contrast, when an element or layer is referred to as being “directly on”, “directly connected to”, or “directly coupled to” another element or layer, there are no intervening elements or layers present. To this end, the term “connected” can refer to physical, electrical, and / or fluid connection whether it is direct or it has intervening elements. Also, the x-axis, y-axis and z-axis do not limit the position to the three axes of a Cartesian coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis and z-axis can be perpendicular to one another, or can be different directions not perpendicular to one another.

[0043] For purposes of this disclosure, “at least one of A and B” can be interpreted to mean only A, only B, or any combination of A and B. Additionally, “at least one of X, Y, and Z” and “at least one of the group consisting of X, Y, and Z” can be interpreted to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0044] Although the terms “first”, “second”, etc. can be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure.

[0045] Spatially relative terms, such as “beneath”, “below”, “lower”, “under”, “above”, “upper”, “higher”, “side” (as in “sidewall”), and the like, can be used herein for ease of description to describe one element or feature’s relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the term “below” can encompass both an orientation of above and below. The device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Well-known functions or constructions can not be described in detail for brevity.

[0046] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "comprises," "comprising," "includes," and / or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. It should also be noted that as used herein, the terms "substantially," "approximately," and other like terms are used as synonyms for "about," and are employed to account for inherent variations in measuring, calculating, and / or providing values.

[0047] Various embodiments are described herein with reference to cross-sectional and / or exploded illustrations of schematic views of implementations and / or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Therefore, embodiments disclosed herein should not necessarily be construed as limited to the particular shapes of regions as illustrated and are to include deviations in shapes that result, for example, from manufacturing. In this manner, regions illustrated in the figures can be schematic in nature and the shapes of the regions as illustrated in the figures can not reflect actual shapes of regions of devices and, as such, are not intended to limit the scope of the embodiments to the particular shapes of regions illustrated. In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or

[0048] As is customary in the art, some embodiments are described and shown in the drawings with respect to functional blocks, sections and / or modules. Those skilled in the art will understand that these blocks, sections and / or modules are physically implemented by electrical circuits (or optical circuits), such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, wired connectors and others, which can be formed using semiconductor-based fabrication technologies or other fabrication technologies. Where the blocks, sections and / or modules are implemented by microprocessors or other similar hardware, they can be programmed by software (e.g., microcode) and controlled by firmware and / or software to perform the various functions discussed herein, and can be selectively driven by firmware and / or software. It is also contemplated that each block, section and / or module can be implemented by dedicated hardware, or as a combination of dedicated hardware to perform some functions, and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Additionally, each block, section and / or module of some embodiments can be physically separated into two or more interacting and discrete blocks, sections and / or modules, without departing from the scope of the concepts of the present disclosure. Furthermore, the blocks, sections and / or modules of some embodiments can be physically combined into more complex blocks, sections and / or modules, without departing from the scope of the concepts of the present disclosure.

[0049] Unless otherwise defined or implied, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0050] Figure 1 is a schematic sectional view of an apparatus 1 for manufacturing a display device according to an embodiment.

[0051] The apparatus 1 can include a chamber 10, a first support portion 20, a second support portion 30, a mask assembly 40, a deposition source 50, a magnetic force portion 60, a vision portion 70, a pressure adjustment portion 80, and a moving portion 90.

[0052] The chamber 10 can provide an internal space. The first support portion 20, the second support portion 30, the mask assembly 40, the deposition source 50, the magnetic force portion 60, the vision portion 70, the pressure adjustment portion 80, and the moving portion 90 can be disposed in the internal space of the chamber 10. Here, a portion of the chamber 10 can be opened, and a gate valve 11 can be provided at the opened portion of the chamber 10. The opened portion of the chamber 10 can be opened or closed according to the operation of the gate valve 11.

[0053] The display substrate DS can mean a display substrate DS during manufacturing of a display apparatus, in which at least one layer among an organic layer, an inorganic layer, and a metal layer can be deposited on the substrate 100 described below. For example, the display substrate DS can be a substrate 100 on which none of the organic layer, the inorganic layer, and the metal layer has been deposited.

[0054] The first support portion 20 can support the display substrate DS. Here, the first support portion 20 can be in the form of a plate fixed inside the chamber 10. According to an embodiment, the first support portion 20 can be in the form of a shuttle that can mount the display substrate DS and can linearly move inside the chamber 10. According to an embodiment, the first support portion 20 can include an electrostatic chuck or an adhesive chuck arranged in the chamber 10 so as to be fixed to the chamber 10 or movable inside the chamber 10.

[0055] The second support portion 30 can support the mask assembly 40. Here, the second support portion 30 can be arranged inside the chamber 10. The second support portion 30 can finely adjust the position of the mask assembly 40. Here, the second support portion 30 can include a separate driving portion or an alignment portion to move the mask assembly 40 in different directions.

[0056] According to an embodiment, the second support portion 30 can be in the form of a shuttle. The mask assembly 40 can be mounted on the second support portion 30, and the second support portion 30 can transfer the mask assembly 40. For example, after the mask assembly 40 is mounted, the second support portion 30 can move to the outside of the chamber 10, and then enter into the chamber 10 from the outside of the chamber 10.

[0057] The first support portion 20 and the second support portion 30 can be integrated with each other. The first support portion 20 and the second support portion 30 can include a movable shuttle. Here, the first support portion 20 and the second support portion 30 include a structure that fixes the mask assembly 40 and the display substrate DS when the display substrate DS is mounted on the mask assembly 40, and can linearly move the display substrate DS and the mask assembly 40 at the same time.

[0058] Hereinafter, for convenience of description, an embodiment in which the first support portion 20 and the second support portion 30 can be formed separately from each other and located at different positions, and an embodiment in which the first support portion 20 and the second support portion 30 can be arranged inside the chamber 10 will be described in detail.

[0059] The mask assembly 40 can be arranged inside the chamber 10 to face the display substrate DS. The deposition material M can be deposited on the display substrate DS by passing through the mask assembly 40.

[0060] The deposition source 50 can be disposed to face the mask assembly 40 and supply the deposition material M so that the deposition material M can be deposited on the display substrate DS by passing through a deposition area of the mask assembly 40. Here, the deposition source 50 can evaporate or sublimate the deposition material M by applying heat to the deposition material M.

[0061] The magnetic force part 60 can be disposed inside the chamber 10 to face the display substrate DS and / or the mask assembly 40. Here, the magnetic force part 60 can apply a magnetic force to the mask assembly 40 to press the mask assembly 40 toward the display substrate DS. In particular, the magnetic force part 60 can not only prevent sagging of the mask assembly 40 but also bring the mask assembly 40 close to the display substrate DS. In addition, the magnetic force part 60 can uniformly maintain a gap between the mask assembly 40 and the display substrate DS.

[0062] The vision part 70 can be disposed in the chamber 10 and can photograph positions of the display substrate DS and the mask assembly 40. Here, the vision part 70 can include a camera configured to photograph the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 can be determined based on images captured by the vision part 70, and a change in the mask assembly 40 can be identified. The position of the display substrate DS on the first support part 20 can be finely adjusted, or the position of the mask assembly 40 on the second support part 30 can be finely adjusted based on the images. Hereinafter, a case in which the position of the mask assembly 40 on the second support part 30 is finely adjusted to align the positions of the display substrate DS and the mask assembly 40 will be described in detail.

[0063] The pressure adjustment part 80 can extend (or be connected) to the chamber 10 and adjust a pressure inside the chamber 10. For example, the pressure adjustment part 80 can maintain the pressure inside the chamber 10 to be the same as or similar to an atmospheric pressure. In addition, the pressure adjustment part 80 can maintain the pressure inside the chamber 10 to be the same as or similar to a vacuum state.

[0064] The pressure adjustment part 80 can include a connection pipe 81 extending to the chamber 10 and a pump 82 disposed at the connection pipe 81. Here, according to an operation of the pump 82, external air can be introduced through the connection pipe 81 or gas inside the chamber 10 can be guided to the outside through the connection pipe 81.

[0065] The moving part 90 can move the deposition source 50 in a first direction (for example, a -x-axis direction) and a second direction (for example, a +x-axis direction) with respect to the display substrate DS. Here, the first direction (for example, the -x-axis direction) and the second direction (for example, the +x-axis direction) can be opposite directions.

[0066] For example, as Figure 1As illustrated in FIG. 1, one side (e.g., single side) of the moving section 90 can be fixed to the chamber 10, and the moving section 90 can move the deposition source 50 with respect to the chamber 10 in a first direction (e.g., -x-axis direction) and a second direction (e.g., +x-axis direction). However, this is merely an example, and the arrangement of the moving section 90 is not limited thereto.

[0067] For example, unlike as illustrated in FIG. 1, the deposition source 50 can be fixed to the chamber 10, and the moving section 90 can move the display substrate DS with respect to the chamber 10 in the first direction (e.g., -x-axis direction) and the second direction (e.g., +x-axis direction). For example, the moving section 90 can move the magnetic force section 60 and the mask assembly 40 with respect to the chamber 10 in the first direction (e.g., -x-axis direction) and the second direction (e.g., +x-axis direction). Figure 1

[0068] Referring to a method of manufacturing a display apparatus by using the apparatus 1, the display substrate DS can be prepared first.

[0069] The pressure adjusting section 80 can maintain the inside of the chamber 10 to be the same as or similar to the atmospheric pressure, and the opening portion of the chamber 10 can be opened in the case where the gate valve 11 is activated.

[0070] Then, the display substrate DS can enter the chamber 10 from the outside of the chamber 10. The display substrate DS can enter the chamber 10 in various ways. For example, the display substrate DS can enter the chamber 10 from the outside of the chamber 10 by a mechanical arm or the like arranged outside the chamber 10. According to an embodiment, in the case where the first support section 20 is in the form of a shuttle, the first support section 20 can be taken out from the inside of the chamber 10 to the outside of the chamber 10, the display substrate DS can be mounted on the first support section 20 by a separate mechanical arm or the like arranged outside the chamber 10, and then the first support section 20 can enter the chamber 10 from the outside of the chamber 10.

[0071] The mask assembly 40 can be arranged inside the chamber 10 as described above. According to an embodiment, the mask assembly 40 can enter the chamber 10 from the outside of the chamber 10 in the same or similar manner as the display substrate DS.

[0072] In the case where the display substrate DS enters the chamber 10, the display substrate DS can be mounted on the first support section 20. Here, the vision section 70 can photograph the positions of the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 can be determined based on images captured by the vision section 70. Here, the apparatus 1 can include a separate controller to determine the positions of the display substrate DS and the mask assembly 40.

[0073] ​Upon determining the positions of the display substrate DS and the mask assembly 40, the second support portion 30 can finely adjust the position of the mask assembly 40.

[0074] Then, the deposition source 50 can be activated to supply the deposition material M to the mask assembly 40, and the deposition material M that has passed through the plurality of pattern holes of the mask assembly 40 can be deposited on the display substrate DS. Here, the deposition source 50 can be moved in parallel to the display substrate DS and the mask assembly 40 by the moving portion 90, or the display substrate DS and the mask assembly 40 can be moved in parallel to the deposition source 50. In other words, the deposition source 50 can be moved with respect to the display substrate DS and the mask assembly 40 by the moving portion 90. Here, the pump 82 can absorb gas inside the chamber 10 and discharge the gas to the outside, thereby maintaining the pressure inside the chamber 10 to be the same as or similar to a vacuum.

[0075] As described above, the deposition material M supplied from the deposition source 50 can be deposited on the display substrate DS by passing through the mask assembly 40, and thus, a plurality of layers, for example, at least one of organic layers, inorganic layers, and metal layers described below, can be formed to be stacked on the display device.

[0076] Figure 2 is a schematic plan view of the deposition source 50 according to an embodiment, and Figure 3 is a schematic cross-sectional view of the deposition source 50 according to an embodiment.

[0077] In particular, Figure 3 may correspond to Figure 2 part I-I'.

[0078] Referring to Figures 1 to 3 , the deposition source 50 according to an embodiment can eject the deposition material M including the first deposition material M1 and the second deposition material M2.

[0079] The deposition source 50 can include a first deposition portion 51 configured to supply the first deposition material M1 and a second deposition portion 52 configured to supply the second deposition material M2.

[0080] In the internal space of the chamber 10, a virtual plane (or surface) on which the display substrate DS is disposed will be referred to as a virtual plane S1. Thus, when the apparatus 1 deposits the deposition material M on the display substrate DS, the lower surface of the display substrate DS and the virtual plane S1 can coincide with each other. In other words, the apparatus 1 can deposit the deposition material M on the display substrate DS disposed on (or coinciding with) the virtual plane S1.

[0081] The first deposition part 51 can spray the first deposition material M1 toward the display substrate DS. The first deposition part 51 can supply the first deposition material M1 so that the first deposition material M1 passes through the mask assembly 40 and can be deposited on the display substrate DS. The first deposition part 51 can include a first deposition frame 511, a first spray part 512, a first adhesion part 513, a first support part 514, a first heating part 515, a first reflector 516, and a first angle restriction part 517.

[0082] The first deposition frame 511 can form an outer appearance of the first deposition part 51 and provide a first inner space 511A. One side (e.g., a single side) of the first deposition frame 511 can be open so that the first deposition material M1 can be sprayed to the outside. The first deposition frame 511 can include a cooling device. In this structure, the first deposition frame 511 can cool heat generated in the first inner space 511A. Accordingly, the first deposition frame 511 can reduce a phenomenon in which heat generated in the first inner space 511A can be discharged to the outside, thereby affecting other components including a mask frame and a substrate. Figure 2 and Figure 3 In the first deposition frame 511 has a hexahedral shape with one side (e.g., a single side) open, but this is only an example, and the shape of the first deposition frame 511 is not limited thereto.

[0083] The first spray part 512 can be accommodated in the first inner space 511A of the first deposition frame 511 and can spray the first deposition material M1 stored therein. The first spray part 512 can include a first crucible part 5121 and a first nozzle part 5122.

[0084] The first crucible part 5121 can provide a first storage space 5121A that stores the first deposition material M1. The first deposition material M1 can be accommodated in the first storage space 5121A of the first crucible part 5121. The first nozzle part 5122 can be extended (or connected) to the first crucible part 5121 and can spray the first deposition material M1 stored in the first storage space 5121A of the first crucible part 5121. A first spray hole 5122H that sprays the first deposition material M1 can be disposed in the first nozzle part 5122. The first storage space 5121A of the first crucible part 5121 can be in communication with the first spray hole 5122H of the first nozzle part 5122.

[0085] The first adhering part 513 can be accommodated in the first inner space 511A of the first deposition frame 511 to adhere the first crucible part 5121 and the first nozzle part 5122 to each other. The first adhering part 513 can adhere the first crucible part 5121 and the first nozzle part 5122 to each other by applying pressure to at least one of the first crucible part 5121 and the first nozzle part 5122. Accordingly, when the first deposition material M1 is sprayed, the first deposition material M1 can be prevented from leaking between the first crucible part 5121 and the first nozzle part 5122.

[0086] The first supporting part 514 can support the first spraying part 512 from the first deposition frame 511. The first supporting part 514 can be accommodated in the first inner space 511A of the first deposition frame 511. One side (e.g., a single side) of the first supporting part 514 can be fixed to the first deposition frame 511 so that the first supporting part 514 can be supported by the first deposition frame 511. The first supporting part 514 can support the first adhering part 513 to support the first spraying part 512 fixed to the first adhering part 513. For example, when the first spraying part 512 and the first adhering part 513 can be accommodated in the first supporting part 514, one side (e.g., a single side) of the first adhering part 513 can be supported by being caught on the first step 514C arranged in the first supporting part 514. However, this is only an example, and the manner in which the first supporting part 514 supports the first spraying part 512 is not limited thereto.

[0087] The first heating part 515 can be accommodated in the first inner space 511A of the first deposition frame 511 to heat the first nozzle part 5122. The first heating part 515 can be arranged to surround the first spraying part 512, the first adhering part 513, and the first supporting part 514. The first heating part 515 can be disposed between the first supporting part 514 and the first deposition frame 511. For example, as shown in FIG. 5B, the first heating part 515 can include a first heating part 515A and a second heating part 515B. The first heating part 515A can be disposed between the first nozzle part 5122 and the first deposition frame 511, and the second heating part 515B can be disposed between the first nozzle part 5122 and the first supporting part 514. However, this is only an example, and the arrangement and shape of the first heating part 515 are not limited thereto. Figure 3

[0088] ​The first deposition material M1 accommodated in the first crucible portion 5121 can be heated by the first heating portion 515. The first heating portion 515 can heat the side surface (e.g., a surface facing the x-axis direction) and the lower surface (e.g., a surface facing the -z-axis direction) of the first ejection portion 512. In a case where the first heating portion 515 heats the first deposition material M1, the first deposition material M1 accommodated in the first crucible portion 5121 can be evaporated. Accordingly, the first deposition material M1 evaporated by the first heating portion 515 can be ejected by the first nozzle portion 5122.

[0089] For example, the first heating portion 515 can include a heating member configured to generate heat. The heating member can generate heat (e.g., directly generate heat). For example, a heating wire generating heat can be disposed on a surface of the first heating portion 515 facing the first nozzle portion 5122. However, this is merely an example, and a method by which the first heating portion 515 heats the first nozzle portion 5122 is not limited thereto.

[0090] The first reflector 516 can block heat generated in the first internal space 511A of the first deposition frame 511 from being transmitted to the mask assembly 40. The first reflector 516 can be disposed between the first heating portion 515 and the mask assembly 40. In this structure, the first reflector 516 can prevent the mask assembly 40 or the display substrate DS from being damaged by heat, which can be transmitted from the first heating portion 515 to the mask assembly 40. Further, by reducing external emission of heat generated in the first internal space 511A of the first deposition frame 511, heat efficiency of the first heating portion 515 can be improved.

[0091] The first reflector 516 can extend (or be connected) to the first deposition frame 511. In a case where the first deposition frame 511 includes a cooling device, the first deposition frame 511 can cool the first reflector 516. In this structure, the first reflector 516 can effectively block heat generated in the first internal space 511A of the first deposition frame 511 from being transmitted to the mask assembly 40.

[0092] The first angle limiting portion 517 can extend (or be connected) to the first deposition frame 511 and can limit a supply angle of the first deposition material M1 supplied to the mask assembly 40. A portion of the first deposition material M1 ejected by the first nozzle portion 5122 can be blocked by the first angle limiting portion 517 from being supplied to the display substrate DS. In other words, the first angle limiting portion 517 can limit the supply angle of the first deposition material M1 by allowing only the first deposition material M1 having a specified range of supply angles to pass through.

[0093] The second deposition part 52 can spray the second deposition material M2 toward the display substrate DS. The second deposition part 52 can supply the second deposition material M2 so that the second deposition material M2 passes through the mask assembly 40 and is deposited on the display substrate DS. The second deposition part 52 can include a second deposition frame 521, a second spray part 522, a second adhesion part 523, a second support part 524, a second heating part 525, a second reflector 526, and a second angle restriction part 527.

[0094] The second deposition frame 521 can form an outer appearance of the second deposition part 52 and provide a second inner space 521A. One side (e.g., a single side) of the second deposition frame 521 can be open so that the second deposition material M2 can be sprayed outward. The second deposition frame 521 can include a cooling device. In this structure, the second deposition frame 521 can cool heat generated in the second inner space 521A. Accordingly, the second deposition frame 521 can reduce a phenomenon in which heat generated in the second inner space 521A is discharged to the outside and thus affects other components including the mask frame and the substrate. Figure 2 and Figure 3 In the second deposition frame 521 has a hexahedral shape with one side (e.g., a single side) open, but this is only an example, and the shape of the second deposition frame 521 is not limited thereto.

[0095] The second spray part 522 can be accommodated in the second inner space 521A of the second deposition frame 521 and can spray the second deposition material M2 stored therein. The second spray part 522 can include a second crucible part 5221 and a second nozzle part 5222.

[0096] The second crucible part 5221 can provide a second storage space 5221A that stores the second deposition material M2. The second deposition material M2 can be accommodated in the second storage space 5221A of the second crucible part 5221. The second nozzle part 5222 can extend (or be connected to) the second crucible part 5221 and can spray the second deposition material M2 stored in the second storage space 5221A of the second crucible part 5221. A second spray hole 5222H that sprays the second deposition material M2 can be disposed in the second nozzle part 5222. The second storage space 5221A of the second crucible part 5221 can communicate with the second spray hole 5222H of the second nozzle part 5222.

[0097] The second adhering part 523 can be accommodated in the second inner space 521A of the second deposition frame 521 to adhere the second crucible part 5221 and the second nozzle part 5222 to each other. The second adhering part 523 can adhere the second crucible part 5221 and the second nozzle part 5222 to each other by applying pressure to at least one of the second crucible part 5221 and the second nozzle part 5222. Accordingly, when the second deposition material M2 is sprayed, leakage of the second deposition material M2 between the second crucible part 5221 and the second nozzle part 5222 can be prevented.

[0098] The second support part 524 can support the second spraying part 522 from the second deposition frame 521. The second support part 524 can be accommodated in the second inner space 521A of the second deposition frame 521. One side (e.g., a single side) of the second support part 524 can be fixed to the second deposition frame 521 so that the second support part 524 can be supported by the second deposition frame 521. The second support part 524 can support the second adhering part 523 to support the second spraying part 522 fixed to the second adhering part 523. For example, when the second spraying part 522 and the second adhering part 523 are accommodated in the second support part 524, one side (e.g., a single side) of the second adhering part 523 can be supported by being caught on the second step 524C arranged in the second support part 524. However, this is merely an example, and the manner in which the second support part 524 supports the second spraying part 522 is not limited thereto.

[0099] The second heating part 525 can be accommodated in the second inner space 521A of the second deposition frame 521 to heat the second nozzle part 5222. The second heating part 525 can be arranged to surround the second spraying part 522, the second adhering part 523, and the second support part 524. The second heating part 525 can be disposed between the second support part 524 and the second deposition frame 521. For example, as shown in FIG. 5B, the second heating part 525 can be arranged to surround the second spraying part 522, the second adhering part 523, and the second support part 524. Figure 3 The second heating part 525 can be accommodated in the second inner space 521A of the second deposition frame 521 to heat the second nozzle part 5222. The second heating part 525 can be arranged to surround the second spraying part 522, the second adhering part 523, and the second support part 524. The second heating part 525 can be disposed between the second support part 524 and the second deposition frame 521. For example, as shown in FIG. 5B, the second heating part 525 can be arranged to surround the second spraying part 522, the second adhering part 523, and the second support part 524.

[0100] The second deposition material M2 accommodated in the second crucible part 5221 can be heated by the second heating part 525. The second heating part 525 can heat the side surface (e.g., the surface facing the x-axis direction) and the lower surface (e.g., the surface facing the -z-axis direction) of the second spraying part 522. In the case where the second heating part 525 heats the second deposition material M2, the second deposition material M2 accommodated in the second crucible part 5221 can be evaporated. Accordingly, the second deposition material M2 evaporated by the second heating part 525 can be sprayed by the second nozzle part 5222.

[0101] For example, the second heating part 525 can include a heating member configured to generate heat. The heating member can generate heat (e.g., directly generate heat). For example, a heating wire that generates heat can be disposed on a surface of the second heating part 525 facing the second nozzle part 5222. However, this is merely an example, and a method of heating the second nozzle part 5222 by the second heating part 525 is not limited thereto.

[0102] The second reflector 526 can block heat generated in the second inner space 521A of the second deposition frame 521 from being transferred to the mask assembly 40. The second reflector 526 can be disposed between the second heating part 525 and the mask assembly 40. In this structure, the second reflector 526 can prevent the mask assembly 40 or the display substrate DS from being damaged by heat due to heat that can be transferred from the second heating part 525 to the mask assembly 40. In addition, by reducing external emission of heat generated in the second inner space 521A of the second deposition frame 521, heat efficiency of the second heating part 525 can be improved.

[0103] The second reflector 526 can be extended (or connected) to the second deposition frame 521. In the case where the second deposition frame 521 includes a cooling device, the second deposition frame 521 can cool the second reflector 526. In this structure, the second reflector 526 can effectively block heat generated in the second inner space 521A of the second deposition frame 521 from being transferred to the mask assembly 40.

[0104] The second angle limiting part 527 can be extended (or connected) to the second deposition frame 521 and can limit a supply angle of the second deposition material M2 supplied to the mask assembly 40. A portion of the second deposition material M2 sprayed by the second nozzle part 5222 can be blocked by the second angle limiting part 527 from being supplied to the display substrate DS. In other words, the second angle limiting part 527 can limit the supply angle of the second deposition material M2 by allowing only the second deposition material M2 having a specified range of supply angles to pass through.

[0105] The first deposition portion 51 and the second deposition portion 52 can be arranged parallel to each other. The first deposition portion 51 and the second deposition portion 52 can each jet the deposition material M in a third direction (e.g., a +z-axis direction) facing the virtual plane S1. Here, the third direction can be a direction that intersects the first direction (e.g., a -x-axis direction) and the second direction (e.g., a +x-axis direction). The first deposition material M1 jetted by the first deposition portion 51 can be different from the second deposition material M2 jetted by the second deposition portion 52. The virtual plane S1 can include a first region (or a first area) ARE1, a second region (or a second area) ARE2, and a third region (or a third area) ARE3. The first region ARE1, the second region ARE2, and the third region ARE3 are defined with respect to the position of the deposition source 50 and move across the virtual plane S1 that can include the display substrate DS together with the deposition source 50. In a case where at least one of the first region ARE1, the second region ARE2, and the third region ARE3 coincides with the display substrate DS, one or both of the first deposition material M1 and the second deposition material M2 can be deposited on the display substrate DS.

[0106] The first deposition material M1 can reach the first region ARE1, and the first region ARE1 can be adjacent to a region reached by the second deposition material M2. The second deposition material M2 can not reach the first region ARE1. In other words, only the first deposition material M1 can reach the first region ARE1.

[0107] The first deposition material M1 and the second deposition material M2 can each reach the second region ARE2. The first deposition material M1 and the second deposition material M2 can overlap each other in the second region ARE2. The first deposition material M1 and the second deposition material M2 can mix with each other in the second region ARE2.

[0108] The second deposition material M2 can reach the third region ARE3, and the third region ARE3 can be adjacent to a region reached by the first deposition material M1. The first deposition material M1 can not reach the third region ARE3. In other words, only the second deposition material M2 can reach the third region ARE3.

[0109] Multiple first deposition sections 51 may exist. For example, a first deposition section 51 may include a first-1 deposition section 51-1 and a first-2 deposition section 51-2. The first-1 deposition section 51-1 and the first-2 deposition section 51-2 may spray the same material. The first-1 deposition section 51-1 may spray a first-1 deposition material M1-1, and the first-2 deposition section 51-2 may spray a first-2 deposition material M1-2. The first-1 deposition material M1-1 and the first-2 deposition material M1-2 may be the same material. The first-1 deposition section 51-1, the first-2 deposition section 51-2, and the second deposition section 51-2 may be arranged in a linear manner.

[0110] Figures 4 to 10 This is a schematic cross-sectional view of the deposition source 50 according to an embodiment, and Figure 11 This is a schematic cross-sectional view of the display device 2 according to the embodiment.

[0111] exist Figures 4 to 11 In, with Figures 1 to 3 Similar reference numerals denote similar elements, and therefore their redundant descriptions can be omitted.

[0112] refer to Figures 4 to 11 The method of manufacturing display device 2 by apparatus 1 is described. When the deposition source 50 moves sequentially relative to the display substrate DS in a first direction (e.g., the -x-axis direction) and a second direction (e.g., the +x-axis direction), the display substrate DS can sequentially pass through the first region ARE1, the second region ARE2, the third region ARE3, the second region ARE2 and the first region ARE1 of the virtual plane S1.

[0113] In detail, such as Figure 4 and Figure 5 As shown, when the deposition source 50 moves relative to the display substrate DS in a first direction (e.g., the -x-axis direction), the display substrate DS can pass through the first region ARE1. Figure 4 , Figure 5 and Figure 11 As shown, when the display substrate DS passes through the first region ARE1, a first layer LY1 comprising a first deposition material M1 can be deposited on the display substrate DS.

[0114] like Figure 6 As shown, when the deposition source 50 moves relative to the display substrate DS in a first direction (e.g., the -x-axis direction), the display substrate DS can pass through the second region ARE2. Figure 6 and Figure 11As shown, when the display substrate DS passes through the second region ARE2, a second layer LY2 comprising a first deposition material M1 and a second deposition material M2 can be deposited on the display substrate DS. In the second layer LY2, the concentration of the second deposition material M2 can gradually increase in the direction toward the third layer LY3 compared to the first deposition material M1.

[0115] like Figure 7 As shown, when the deposition source 50 moves relative to the display substrate DS in a first direction (e.g., the -x-axis direction), the display substrate DS can pass through the third region ARE3. Figure 7 and Figure 11 As shown, when the display substrate DS passes through the third region ARE3, a third layer LY3 comprising the second deposition material M2 can be deposited on the display substrate DS.

[0116] like Figure 8 As shown, when the deposition source 50 moves relative to the display substrate DS in a second direction (e.g., the +x axis direction), the display substrate DS can again pass through the second region ARE2. Figure 8 and Figure 11 As shown, when the display substrate DS passes through the second region ARE2 again, a fourth layer LY4, comprising a first deposition material M1 and a second deposition material M2, can be deposited on the display substrate DS. In the fourth layer LY4, the concentration of the first deposition material M1 can gradually increase in the direction toward the fifth layer LY5 compared to the second deposition material M2.

[0117] like Figure 9 and Figure 10 As shown, when the deposition source 50 moves relative to the display substrate DS in a second direction (e.g., the +x axis direction), the display substrate DS can again pass through the first region ARE1. Figure 9 and Figure 11 As shown, when the display substrate DS passes through the first region ARE1 again, a fifth layer LY5 comprising the first deposition material M1 can be deposited on the display substrate DS.

[0118] Each of the first deposition material M1 and the second deposition material M2 can include a capping material. For example, each of the first deposition material M1 and the second deposition material M2 can include lithium fluoride (LiF), another inorganic material, and / or an organic material. In detail, each of the first deposition material M1 and the second deposition material M2 can include a carbocyclic compound, a heterocyclic compound, an amine-containing compound, a porphine derivative, a phthalocyanine derivative, a naphthalocyanine derivative, an alkali metal complex, an alkaline earth metal complex, or any combination thereof. The carbocyclic compound, the heterocyclic compound, and the amine-containing compound can be selectively substituted with a substituent including oxygen (O), nitrogen (N), sulfur (S), selenium (Se), silicon (Si), fluorine (F), chlorine (Cl), bromine (Br), iodine (I), or any combination thereof.

[0119] For example, the second deposition material M2 can have a larger refractive index than the first deposition material M1. Accordingly, the third layer LY3 can have a larger refractive index than each of the first layer LY1 and the fifth layer LY5. The second layer LY2 can have a gradually increasing refractive index in a direction toward the third layer LY3. The fourth layer LY4 can have a gradually decreasing refractive index in a direction toward the fifth layer LY5. For example, the refractive index of the first layer LY1 can be in a range of about 1.0 to about 1.8, the refractive index of the third layer LY3 can be in a range of about 1.8 to about 2.4, and the refractive index of the fifth layer LY5 can be in a range of about 1.0 to about 1.8.

[0120] Further, the thickness of the fifth layer LY5 can be greater than the thickness of the first layer LY1. For example, the thickness of the first layer LY1 can be in a range of about 5 nm to about 80 nm, the thickness of the third layer LY3 can be in a range of about 20 nm to about 100 nm, and the thickness of the fifth layer LY5 can be in a range of about 5 nm to about 80 nm.

[0121] In this structure, light loss caused by surface plasmon polaritons (SPPs) of the display device 2 can be reduced according to the arrangement of the first layer LY1 having a relatively low refractive index.

[0122] Further, light emitted from the display substrate DS can be resonated according to the arrangement of the third layer LY3 having a relatively high refractive index and the fifth layer LY5 having a relatively low refractive index. In other words, light efficiency can be improved by the principle of constructive interference of light passing through the third layer LY3 and the fifth layer LY5.

[0123] As an example, the second deposition material M2 can have a lower refractive index than the first deposition material M1. Accordingly, the third layer LY3 can have a lower refractive index than each of the first layer LY1 and the fifth layer LY5. The second layer LY2 can have a refractive index that gradually decreases in a direction toward the third layer LY3. The fourth layer LY4 can have a refractive index that gradually increases in a direction toward the fifth layer LY5. For example, the first layer LY1 can have a refractive index of 1.8 to 2.4, the third layer LY3 can have a refractive index of 1.0 to 1.8, and the fifth layer LY5 can have a refractive index of 1.8 to 2.4.

[0124] However, this is merely an example, and the refractive index and thickness of each of the first layer LY1, the second layer LY2, the third layer LY3, the fourth layer LY4, and the fifth layer LY5 are not limited thereto. The refractive index and thickness of each of the first layer LY1, the second layer LY2, the third layer LY3, the fourth layer LY4, and the fifth layer LY5 can be variously modified depending on the type and / or size of the display device 2.

[0125] According to the reference Figures 1 to 11 The described embodiments, the device 1 can not include a separate shutter, but can alternatively arrange the first deposition material M1 and the second deposition material M2 of different materials on the display substrate DS. Accordingly, the time and cost of manufacturing the display device 2 can be reduced.

[0126] Because there is the second region ARE2 reached by the first deposition material M1 and the second deposition material M2, the angle at which the first deposition material M1 and / or the second deposition material M2 is sprayed can be relatively increased compared to a case in which the first deposition material M1 and the second deposition material M2 do not overlap each other. In other words, the supply angle limited by the first angle limiting portion 517 and / or the second angle limiting portion 527 can be relatively increased. Accordingly, in a case in which the same flow of the deposition material M is supplied to the virtual plane S1, the flow rate of the deposition material M can be relatively reduced. Accordingly, a material accumulation phenomenon occurring in the first angle limiting portion 517 and / or the second angle limiting portion 527 can be reduced.

[0127] Figure 12 is a schematic plan view of a display device 2 according to an embodiment, and Figure 13 is a schematic cross-sectional view of a display device 2 according to an embodiment.

[0128] Reference Figure 12 and Figure 13 , Figure 12A plan view of the display device 2 that can include a non-display region NDA around a display region DA is shown. Pixels PX can be provided in the display region DA, and each pixel PX can be connected to a scan line SL to select the pixel PX for emission, and to a data line DLL to drive the pixel PX according to image data. The display device 2 can include a display substrate DS. Here, the display substrate DS can correspond to the display substrate 100 described with reference to Figures 1 to 11 the display substrate DS described. Figure 13 is Figure 12 a schematic cross-sectional view of the pixel PX. As shown in Figure 13 the display substrate DS can include a substrate 100 and a display layer DL.

[0129] The display layer DL, a cover layer CPL, and a thin film encapsulation layer TFE can be arranged on the substrate 100. The display layer DL can include a pixel circuit layer PCL and a display element layer DEL.

[0130] The substrate 100 can include glass or a polymeric resin such as polyether sulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, cellulose acetate propionate, or a combination thereof.

[0131] A barrier layer can be further positioned between the display layer DL and the substrate 100. The barrier layer can be a barrier layer configured to prevent penetration of external impurities, and can be a single layer or a plurality of layers of an inorganic material such as silicon nitride (SiNx x ) (where x > 0) or silicon oxide (SiO x ) (where x > 0).

[0132] The pixel circuit layer PCL can be provided on the substrate 100. The pixel circuit layer PCL can include a thin film transistor TFT and a buffer layer 111, a first insulating layer 13a, a second insulating layer 13b, a third insulating layer 15, and a planarization layer 17 provided below and / or above components of the thin film transistor TFT.

[0133] The buffer layer 111 can include an inorganic insulating material such as silicon nitride, silicon oxynitride, silicon oxide, or a combination thereof, and can be a single layer or a plurality of layers including the inorganic insulating material described above.

[0134] The thin film transistor TFT can include a semiconductor layer 12, and the semiconductor layer 12 can include polycrystalline silicon. As another example, the semiconductor layer 12 can include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer 12 can include a channel region 12c and a drain region 12a and a source region 12b arranged on both sides of the channel region 12c, respectively. A gate electrode 14 can overlap the channel region 12c.

[0135] The gate electrode 14 can include a low-resistance metallic material. The gate electrode 14 can include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or a combination thereof, and can be formed as a single layer or multiple layers including the conductive material.

[0136] The first insulating layer 13a between the semiconductor layer 12 and the gate electrode 14 can include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and / or zinc oxide (ZnO2).

[0137] The second insulating layer 13b can be disposed to cover the gate electrode 14. Similar to the first insulating layer 13a, the second insulating layer 13b can include an inorganic insulating material such as SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO2, or a combination thereof.

[0138] The upper electrode Cst2 of the storage capacitor Cst can be disposed on the second insulating layer 13b. The upper electrode Cst2 can overlap the gate electrode 14 under the upper electrode Cst2. Here, the gate electrode 14 and the upper electrode Cst2 overlapping each other with the second insulating layer 13b therebetween can form the storage capacitor Cst. In other words, the gate electrode 14 can operate as a lower electrode Cst1 of the storage capacitor Cst.

[0139] As such, the storage capacitor Cst and the thin film transistor TFT can overlap each other. According to some embodiments, the storage capacitor Cst can not overlap the thin film transistor TFT.

[0140] The upper electrode Cst2 can include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and can be a single layer or multiple layers including such materials.

[0141] The third insulating layer 15 can be disposed to cover the upper electrode Cst2. The third insulating layer 15 can include SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO2, or a combination thereof. The third insulating layer 15 can be a single layer or multiple layers including the above-described inorganic insulating material.

[0142] The drain electrode 16a and the source electrode 16b can each be located on the third insulating layer 15. The drain electrode 16a and the source electrode 16b can include a material having good electrical conductivity. The drain electrode 16a and the source electrode 16b can include a conductive material including Mo, Al, Cu, Ti, or a combination thereof, and can be formed as a single layer or a plurality of layers including the above-described material. According to an embodiment, the drain electrode 16a and the source electrode 16b can have a multi-layer structure of Ti / Al / Ti.

[0143] The planarization layer 17 can include an organic insulating layer. The planarization layer 17 can include an organic insulating material such as a general-purpose polymer (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenol-based group, an acrylic-based polymer, an imide-based polymer, a polyarylether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylylene-based polymer, a vinyl alcohol-based polymer, or a mixture thereof.

[0144] The display element layer DEL can be disposed on the pixel circuit layer PCL having the above-described structure. The display element layer DEL can include an organic light emitting diode OLED, wherein a pixel electrode 21 of the organic light emitting diode OLED can be electrically connected to the thin film transistor TFT through a contact hole defined in the planarization layer 17.

[0145] The pixel PX can include the organic light emitting diode OLED and the thin film transistor TFT. Each pixel PX can be configured to emit, for example, red light, green light, or blue light, or red light, green light, blue light, or white light through the organic light emitting diode OLED.

[0146] The pixel electrode 21 can include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), aluminum zinc oxide (AZO), or a combination thereof. According to an embodiment, the pixel electrode 21 can include a reflective layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), a compound thereof, or a combination thereof. According to an embodiment, the pixel electrode 21 can further include a layer formed of ITO, IZO, ZnO, or In2O3 above / below the reflective layer.

[0147] A pixel defining layer 19 having an opening 19OP exposing a central portion of the pixel electrode 21 can be disposed on the pixel electrode 21. The pixel defining layer 19 can include an organic insulating material and / or an inorganic insulating material. The opening 19OP can define an emission area EA of light emitted from the organic light emitting diode OLED. For example, a width of the opening 19OP can correspond to a width of the emission area EA.

[0148] The emission layer 22 can be disposed at the opening 19OP of the pixel-defining layer 19. The emission layer 22 can include a high molecular weight organic material or a low molecular weight organic material that emits light of a specific color. According to an embodiment, the emission layer 22 can include a quantum dot material. According to an embodiment, the emission layer 22 can be formed by dispensing a droplet onto a device for manufacturing a display apparatus.

[0149] Although not shown, a first functional layer and a second functional layer can be provided below and above the emission layer 22. For example, the first functional layer can include a hole transport layer (HTL) or can include an HTL and a hole injection layer (HIL). The second functional layer can be a component provided on the emission layer 22 and can be optional. The second functional layer can include an electron transport layer (ETL) and / or an electron injection layer (EIL). Similar to the common electrode 23 described below, the first functional layer and / or the second functional layer can be a common layer formed to completely cover the substrate 100.

[0150] The common electrode 23 can include a conductive material having a low work function. For example, the common electrode 23 can include a (semi-)transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca), an alloy thereof, or a combination thereof. For another example, the common electrode 23 can further include a layer including ITO, IZO, ZnO, In2O3, or a combination thereof on the (semi-)transparent layer including such a material.

[0151] A capping layer CPL can be disposed on the common electrode 23. The capping layer CPL can include a capping material. The capping layer CPL can include a carbon ring compound, a heterocyclic compound, an amine-containing compound, a porphine derivative, a phthalocyanine derivative, a naphthalocyanine derivative, an alkali metal complex, an alkaline earth metal complex, or any combination thereof, as described above. Figure 11 The first layer LY1, the second layer LY2, the third layer LY3, the fourth layer LY4, and the fifth layer LY5 are described.

[0152] For example, the capping layer CPL can include LiF, another inorganic material, and / or an organic material. In detail, the capping layer CPL can include a carbon ring compound, a heterocyclic compound, an amine-containing compound, a porphine derivative, a phthalocyanine derivative, a naphthalocyanine derivative, an alkali metal complex, an alkaline earth metal complex, or any combination thereof. The carbon ring compound, the heterocyclic compound, and the amine-containing compound can be selectively substituted by a substituent including oxygen (O), nitrogen (N), sulfur (S), selenium (Se), silicon (Si), fluorine (F), chlorine (Cl), bromine (Br), iodine (I), or any combination thereof.

[0153] A thin film encapsulation layer TFE can be disposed on the capping layer CPL. According to an embodiment, the thin film encapsulation layer TFE can include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and according to an embodiment, Figure 13It is shown that the thin film encapsulation layer TFE can include a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 stacked one after another with each other.

[0154] The first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 can include one or more inorganic materials from among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 32 can include a polymer-based material. An example of the polymer-based material can include an acrylic resin, an epoxy resin, a polyimide, a polyethylene, or a combination thereof. According to an embodiment, the organic encapsulation layer 32 can include an acrylate.

[0155] According to an embodiment, the thin film encapsulation layer TFE can have a structure in which the substrate 100 and an upper substrate of the transparent member can be bonded via a sealing member, thereby sealing an inner space between the substrate 100 and the upper substrate. Here, a moisture absorbent or a filler can be located in the inner space. The sealing member can be a sealant, and according to an embodiment, the sealing member can include a material hardened by a laser beam. For example, the sealing member can be a glass frit. In detail, the sealing member can include a urethane-based resin, an epoxy-based resin, or an acryl-based resin as an organic sealant or silicon as an inorganic sealant. For example, the urethane-based resin can use a urethane acrylate. For example, the acryl-based resin can use butyl acrylate or isooctyl acrylate. The sealing member can include a material hardened by heat.

[0156] Figure 14 is a schematic diagram of an equivalent circuit of a pixel PX in a display panel according to an embodiment.

[0157] Each pixel PX can include a pixel circuit PC and a display element. For example, the display element can include an organic light emitting diode OLED electrically connected to the pixel circuit PC. The pixel circuit PC can include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel PX can be configured to emit, for example, red light, green light, blue light, or white light through the organic light emitting diode OLED.

[0158] The second thin film transistor T2 can be a switching thin film transistor connected to a scan line SL and a data line DLL, and can be configured to transmit a data voltage input from the data line DLL to the first thin film transistor T1 based on a switching voltage input from the scan line SL. The storage capacitor Cst can be connected to the second thin film transistor T2 and a driving voltage line PL, and can store a voltage corresponding to a difference between a voltage received from the second thin film transistor T2 and a first power voltage ELVDD supplied to the driving voltage line PL.

[0159] The first thin-film transistor T1 can be a driving thin-film transistor connected to the driving voltage line PL and the storage capacitor Cst, and can control a driving current flowing through the organic light emitting diode OLED from the driving voltage line PL in response to a voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED can be configured to emit light of a certain brightness according to the driving current. The opposite electrode (e.g., cathode) of the organic light emitting diode OLED can receive the second power voltage ELVSS.

[0160] In Figure 14 , the pixel circuit PC can include a storage capacitor (e.g., a single storage capacitor) and two thin-film transistors, but the disclosure is not limited thereto. The number of thin-film transistors and the number of storage capacitors can vary depending on the design of the pixel circuit PC. For example, the pixel circuit PC can include four or more thin-film transistors in addition to the two thin-film transistors described above.

[0161] According to the embodiments, the structure of an apparatus for manufacturing a display device can be simplified, and process efficiency can be improved.

[0162] Effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood from the claims by those skilled in the art.

[0163] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims.

Claims

1. An apparatus for manufacturing a display device, the apparatus comprising: chamber; A deposition source is disposed in the chamber and includes a first deposition section and a second deposition section, wherein the first deposition section sprays a first deposition material toward the display substrate and the second deposition section sprays a second deposition material toward the display substrate; as well as The moving part moves the deposition source relative to the display substrate in a first direction and in a second direction opposite to the first direction. The display substrate is arranged on a virtual plane. The virtual plane includes: A first region, wherein the first deposited material reaches the first region, and the second deposited material does not reach the first region; A second region, wherein the first and second deposited materials each reach the second region; and In the third region, the second deposited material reaches the third region, and the first deposited material does not reach the third region. The first region, the second region, and the third region are defined relative to the deposition source and move together with the deposition source to different positions on the virtual plane.

2. The apparatus according to claim 1, wherein, When the deposition source moves relative to the display substrate in the first direction and the second direction in sequence, the display substrate passes through the first region, the second region, the third region, the second region and the first region in sequence.

3. The apparatus according to claim 1, wherein, When the display substrate passes through the first region, a first layer comprising the first deposition material is deposited on the display substrate. When the display substrate passes through the second region, a second layer comprising the first deposition material and the second deposition material is deposited on the display substrate. When the display substrate passes through the third region, a third layer comprising the second deposition material is deposited on the display substrate. When the display substrate passes through the second region again, a fourth layer comprising the first deposition material and the second deposition material is deposited on the display substrate, and If the display substrate passes through the first region again, a fifth layer comprising the first deposited material is deposited on the display substrate.

4. The apparatus according to claim 3, wherein, In the second layer, the concentration of the second deposited material gradually increases in the direction toward the third layer compared to the first deposited material.

5. The apparatus according to claim 3, wherein, In the fourth layer, the concentration of the first deposited material gradually increases in the direction toward the fifth layer compared to the second deposited material.

6. The apparatus according to claim 3, wherein, Each of the first and second deposition materials includes a capping material.

7. The apparatus according to claim 6, wherein, The refractive index of the third layer is greater than that of each of the first and fifth layers.

8. The apparatus according to claim 6, wherein, The thickness of the fifth layer is greater than the thickness of the first layer.

9. The apparatus according to claim 1, wherein, The first deposition section includes a first-1 deposition section and a first-2 deposition section that spray the same material.

10. The apparatus according to claim 9, wherein, The first-1 deposition section, the first-2 deposition section, and the second deposition section are arranged in a linear sequence.

11. An apparatus for manufacturing a display device, the apparatus comprising: chamber; A deposition source is disposed in the chamber and includes a first deposition section and a second deposition section, wherein the first deposition section sprays a first deposition material toward the display substrate and the second deposition section sprays a second deposition material toward the display substrate; as well as The moving part causes the deposition source to move relative to the display substrate sequentially in a first direction and in a second direction opposite to the first direction. Specifically, a first layer comprising the first deposited material, a second layer comprising the first deposited material and the second deposited material, a third layer comprising the second deposited material, a fourth layer comprising the first deposited material and the second deposited material, and a fifth layer comprising the first deposited material are sequentially deposited on the display substrate. The display substrate is disposed in a virtual plane defined relative to the deposition source.

12. The apparatus according to claim 11, wherein, In the second layer, the concentration of the second deposited material gradually increases in the direction toward the third layer compared to the first deposited material.

13. The apparatus according to claim 11, wherein, In the fourth layer, the concentration of the first deposited material gradually increases in the direction toward the fifth layer compared to the second deposited material.

14. The apparatus according to claim 11, wherein, Each of the first and second deposition materials includes a capping material.

15. The apparatus according to claim 14, wherein, The refractive index of the third layer is greater than that of each of the first and fifth layers.

16. The apparatus according to claim 15, wherein, The thickness of the fifth layer is greater than the thickness of the first layer.

17. The apparatus according to claim 11, wherein, The virtual plane includes: A first region, wherein the first deposited material reaches the first region, and the second deposited material does not reach the first region; A second region, wherein the first and second deposited materials each reach the second region; and The third region is where the second deposited material reaches the third region, while the first deposited material does not reach the third region.

18. The apparatus according to claim 17, wherein, The display substrate passes sequentially through the first region, the second region, the third region, the second region, and the first region.

19. The apparatus according to claim 11, wherein, The first deposition section includes a first-1 deposition section and a first-2 deposition section that spray the same material.

20. The apparatus according to claim 19, wherein, The first-1 deposition section, the first-2 deposition section, and the second deposition section are arranged in a linear sequence.

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