Laminate, method for manufacturing laminate, and method for manufacturing printed wiring board

Abstract

Provided is a laminate in which a protective layer is uniformly laminated on a separator and the peel strength of the separator after thermocompression bonding does not become too strong. This laminate is characterized by being provided with: a separator having a base material and a silicone resin film which is formed on the surface of the base material and serves as a mold release surface; and a protective layer laminated on the separator so as to be in contact with the mold release surface, in which the water contact angle of the mold release surface is 107.1 DEG or more, and the protective layer contains at least one resin selected from the group consisting of urethane resins, polyamideimide resins, and polyamide resins.

Description

Technical Field

[0001] This invention relates to laminates, methods for manufacturing laminates, and methods for manufacturing printed wiring boards. Background Technology

[0002] In recent years, with the increasing integration of high-performance circuits in electronic devices, printed circuit boards are progressing towards higher precision and higher density.

[0003] One method for forming circuits in a printed wiring board is to transfer circuits formed on a transfer film onto a substrate.

[0004] As an example of such a transfer film, there is a transfer film made by sequentially stacking a protective layer, a conductive paste that forms the circuit, and an adhesive resin on a separator.

[0005] When using such a transfer film to transfer circuits onto a substrate, the transfer film is first placed on the substrate in such a way that the adhesive resin of the transfer film contacts the substrate.

[0006] Next, the transfer film is pressed onto the substrate by thermoforming. At this point, the conductive paste solidifies to form a circuit.

[0007] Then, by peeling off the release film, it becomes possible to manufacture a printed wiring board on which adhesive resin, circuitry, and a protective layer are transferred onto the substrate.

[0008] For the separator of such transfer film, the following polyester film is disclosed in Patent Document 1.

[0009] That is, Patent Document 1 discloses a polyester film, which is a film formed by having a polyester A layer on at least one side of a polyester B layer. The polyester A layer forms the surface layer of at least one side of the polyester film and contains 5% to 30% by mass of polyester having butylene terephthalate as a repeating unit. The average surface roughness Ra of the centerline of the surface of the polyester A layer is 0.20 μm to 1.00 μm, and the water contact angle is 70° to 84°.

[0010] Existing technical documents

[0011] Patent documents

[0012] Patent Document 1: Japanese Patent Application Publication No. 2022-1431 Summary of the Invention

[0013] To improve the peelability of the separator, a method for forming an organosilicon resin film on the surface of the separator is known.

[0014] When a protective layer is to be laminated on the silicone resin film of a separator, there is a problem that the separator may repel the protective layer, resulting in an uneven formation of the protective layer.

[0015] In addition, when peeling off the release liner of the transfer film after heat pressing, there is a problem that the peel strength becomes too high, causing part of the protective layer to adhere to the release liner or the protective layer to break.

[0016] This invention was made to solve the above-mentioned problems. The purpose of this invention is to provide a laminate in which the protective layer is uniformly stacked on the separator and the peel strength of the separator does not become too strong after hot pressing.

[0017] That is, the laminate of the present invention is characterized by comprising: a separator having a substrate and an organosilicon resin film formed on the surface of the substrate as a release surface; and a protective layer laminated on the separator in a manner that contacts the release surface, wherein the water contact angle of the release surface is 107.1° or more, and the protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin and polyamide resin.

[0018] Organosilicon resin films have the property of repelling resins that are laminated onto them through printing or other processes.

[0019] In addition, under normal circumstances, if the water contact angle of the silicone resin film (i.e., the release surface) becomes larger, it will be more likely to repel the resin.

[0020] Surprisingly, it was found that if the resin is selected from at least one of polyurethane resin, polyamide-imide resin and polyamide resin, the resin is not easily repelled by the silicone resin film.

[0021] This invention is based on the above insights.

[0022] In the laminate of the present invention, the protective layer contains a resin selected from at least one of polyurethane resin, polyamide-imide resin and polyamide resin.

[0023] As mentioned above, these resins are not easily repelled by silicone resin films. Therefore, a protective layer can be formed uniformly.

[0024] It should be noted that in this specification, "uniform protective layer" means that when the laminate is observed from the protective layer side, there is no part of the protective layer formed on the release surface of the separator that is rejected, and the release surface of the separator cannot be visually observed.

[0025] In the laminate of the present invention, if the water contact angle of the demolding surface is 107.1° or higher, the peel strength of the separator after the laminate of the present invention is hot-pressed can be reduced.

[0026] In addition, if the water contact angle of the release surface is less than 107.1°, the resin is easily repelled by the silicone resin film, making it difficult to form a uniform protective layer.

[0027] The laminate of the present invention may further include a conductive material layer, which is laminated on the protective layer in such a manner that the insulating member is located on the opposite side of the protective layer.

[0028] By using the laminate of the present invention, it is possible to transfer a conductive material layer onto a substrate.

[0029] In the laminate of the present invention, the conductive material layer may be a conductive paste layer for circuit formation.

[0030] Compared to forming circuits directly on a substrate, forming a conductive paste layer for circuit formation in a laminate that becomes a transfer film, and then transferring this conductive paste layer for circuit formation onto a substrate to form a circuit, can result in a finer circuit.

[0031] The laminate of the present invention may further include an adhesive resin layer, which is laminated on the opposite side of the spacer and the protective layer, and in a manner that covers the conductive material layer.

[0032] If such an adhesive resin layer is present, the substrate can be transferred from the separator to the substrate.

[0033] The method for manufacturing the laminate of the present invention is characterized by comprising: a separator preparation step, wherein a silicone resin film serving as a release surface is formed on the surface of a substrate to form a separator; and a protective layer formation step, wherein a protective layer is laminated on the release surface, wherein the silicone resin film is formed in the separator preparation step such that the water contact angle of the release surface is 107.1° or more, and the protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin, and polyamide resin.

[0034] The laminate of the present invention described above can be manufactured using the manufacturing method of the laminate of the present invention.

[0035] The method for manufacturing a printed wiring board according to the present invention is characterized by comprising the following steps: a laminate preparation step, wherein a laminate comprising an isolator, a protective layer, a conductive material layer and an adhesive resin layer is prepared, wherein the isolator has a substrate and an organosilicon resin film forming on the surface of the substrate as a release surface, the protective layer is laminated on the isolator in contact with the release surface, the conductive material layer is laminated on the protective layer with the isolator on the opposite side of the protective layer, and the adhesive resin layer is laminated on the opposite side of the protective layer with the isolator on the opposite side of the protective layer and in a manner covering the conductive material layer; a laminate arrangement step, wherein the laminate is arranged such that the adhesive resin layer is bonded to a substrate; a thermoforming step, wherein the laminate is thermoformed and bonded to the substrate; and a peeling step, wherein the isolator is peeled off, wherein the water contact angle of the release surface is 107.1° or more, and the protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin and polyamide resin.

[0036] In the method for manufacturing the printed wiring board of the present invention, the water contact angle of the release surface (silicone resin film) of the separator is 107.1° or more, and the protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin and polyamide resin.

[0037] They are well compatible, so after the laminate is hot-pressed, the peel strength between the release surface of the separator and the protective layer will not become too high, and the separator can be properly peeled off during the peeling process.

[0038] According to the present invention, it is possible to provide a laminate in which a protective layer is uniformly stacked in the separator, and the peel strength of the separator after heat pressing does not become too strong. Attached Figure Description

[0039] Figure 1A This is a perspective view schematically illustrating an example of a laminate of the present invention.

[0040] Figure 1B yes Figure 1A A-A line cross-sectional view.

[0041] Figure 2A This is a schematic diagram of an example of the separator preparation step in the manufacturing method of the laminate of the present invention.

[0042] Figure 2B This is a schematic diagram of an example of the separator preparation step in the manufacturing method of the laminate of the present invention.

[0043] Figure 3 This is a schematic diagram of an example of the protective layer formation process in the manufacturing method of the laminate of the present invention.

[0044] Figure 4 This is a schematic diagram illustrating an example of the transfer object lamination process in the manufacturing method of the laminate of the present invention.

[0045] Figure 5A This is a schematic diagram illustrating an example of the lamination process in the manufacturing method of the printed wiring board of the present invention.

[0046] Figure 5B This is a schematic diagram of an example of the hot-pressing process in the manufacturing method of the printed wiring board of the present invention.

[0047] Figure 5C This is a schematic diagram of an example of the stripping process in the manufacturing method of the printed wiring board of the present invention.

[0048] Figure 6A The photo shows an example of an "O" rating that rejects evaluation.

[0049] Figure 6B The photo shows an example of a "△" rating that rejects evaluation.

[0050] Figure 6C The photo shows an example of an "X" rating that is rejected. Detailed Implementation

[0051] The laminate of the present invention, the method for manufacturing the laminate, and the method for manufacturing a printed wiring board using the laminate will be described in detail below. However, the present invention is not limited to the following embodiments, and appropriate modifications can be made without changing the spirit of the present invention.

[0052] Figure 1A This is a perspective view schematically illustrating an example of a laminate of the present invention.

[0053] Figure 1B yes Figure 1A A-A line cross-sectional view.

[0054] Figure 1A and Figure 1B The laminate 10 shown includes a separator 20 and a protective layer 30 laminated on the separator 20 in a manner that contacts the release surface 22a. The separator 20 has a substrate 21 and an organosilicon resin film 22 formed on the surface of the substrate 21, which serves as the release surface 22a.

[0055] Furthermore, the laminate 10 includes a conductive material layer 40 and an adhesive resin layer 50 sequentially laminated on the protective layer 30.

[0056] In other words, the conductive material layer 40 is stacked on the protective layer 30 on the opposite side of the insulating member 20.

[0057] In addition, the adhesive resin layer 50 is stacked on the opposite side of the protective layer 30 with the spacer 20 in between, and in a manner that covers the conductive material layer 40.

[0058] In the laminate 10, the protective layer 30 contains at least one resin selected from polyurethane resin, polyamide-imide resin and polyamide resin.

[0059] These resins have good compatibility with the silicone resin film 22 and are not easily rejected by the silicone resin film 22. Therefore, a protective layer 30 can be formed uniformly.

[0060] In the laminate 10, the water contact angle of the release surface 22a is 107.1° or higher.

[0061] The water contact angle of the demolding surface 22a is preferably 109 to 120°, more preferably 110 to 115°, and even more preferably 110 to 113.5°.

[0062] Details will be described later. The laminate 10 is thermo-pressed onto the substrate.

[0063] If the water contact angle of the release surface 22a is 107.1° or higher, the peel strength of the separator 20 after the laminate 10 is heat-pressed can be reduced. Therefore, the separator 20 is easier to peel off.

[0064] In addition, if the water contact angle of the release surface is less than 107.1°, the resin is easily repelled by the silicone resin film and it is not easy to form a protective layer evenly.

[0065] It should be noted that in this specification, "water contact angle of the demolding surface" refers to the contact angle of the demolding surface with pure water, measured using a contact angle meter (product name: portable contact angle meter PCA-11, manufacturer: Kyowa Interface Science Co., Ltd.).

[0066] The following is a detailed description of each component of the laminated body.

[0067] (Isolation component)

[0068] The substrate 21 constituting the separator 20 is not particularly limited, but examples include polyethylene naphthalate (PEN) and polyethylene terephthalate (PET).

[0069] The substrate 21 is preferably in sheet form, and its thickness is preferably 6 to 100 μm, more preferably 12 to 100 μm.

[0070] If the thickness of the substrate is less than 6μm, the substrate itself is easily damaged.

[0071] If the thickness of the substrate exceeds 100μm, it is difficult to conduct heat and poor pressing is likely to occur.

[0072] An organosilicon resin film 22 is formed on the surface of the substrate 21. In addition, the organosilicon resin film 22 forms the release surface 22a of the separator 20.

[0073] As for the silicone resin film 22, there are emulsion type formed by emulsifying silicone oil, solution type formed by diluting silicone resin with toluene and petroleum hydrocarbons, baking type formed by diluting silicone resin with petroleum hydrocarbons and evaporating the solvent and then baking at high temperature to form a film, spray type that can be used directly, etc., but the solution type is preferred in this invention.

[0074] As a release element 20 having a release surface formed by forming an organosilicon resin film 22, examples include NS-75-G manufactured by Nakamoto Packs, E7001 manufactured by Toyobo Co., Ltd., E7002 manufactured by Toyobo Co., Ltd., and E7006 manufactured by Toyobo Co., Ltd.

[0075] The dried weight of the silicone resin film 22 is particularly preferably 0.01 to 1 g / m³. 2 More preferably, it is 0.05–0.8 g / m 2 .

[0076] If the weight of the dried silicone resin film is less than 0.01 g / m 2 If the silicone resin film is formed, it will be difficult to obtain the effect of the peel strength.

[0077] If the dried weight of the silicone resin film exceeds 1 g / m 2 If the effect obtained by forming an organosilicon resin film is close to the upper limit, it is therefore uneconomical.

[0078] In addition to the aforementioned resin, the silicone resin film 22 may contain crosslinking agents, catalysts, reaction inhibitors, and adhesion enhancers.

[0079] The water contact angle of the release surface 22a of the separator 20 can be adjusted by selecting the coating amount and type of silicone resin film 22.

[0080] (Protective layer)

[0081] In the laminate 10, the protective layer 30 contains at least one resin selected from polyurethane resin, polyamide-imide resin and polyamide resin.

[0082] When the protective layer 30 contains polyurethane resin, the elasticity of the protective layer 30 is improved. Therefore, it is useful when elasticity is required for printed wiring boards manufactured using the laminate 10.

[0083] If the protective layer 30 contains polyamide-imide resin and / or polyamide resin, the heat resistance of the protective layer 30 is improved. Therefore, it is useful in cases where heat resistance is required for printed wiring boards manufactured using the laminate 10.

[0084] In addition, in the case where the protective layer 30 is required to be flexible in the printed wiring board manufactured using the laminate 10, the protective layer 30 may contain a polyurethane elastomer.

[0085] Polyurethane elastomers are composed of hard segments and soft segments. The soft segments include carbonates, esters, ethers, etc. As a physical property, the elongation at break is preferably 20 to 500%, more preferably 30 to 500%.

[0086] The thickness of the protective layer 30 is preferably 3 to 60 μm, more preferably 5 to 50 μm.

[0087] If the thickness of the protective layer is less than 3μm, the protective layer is easily damaged. Therefore, in printed circuit boards manufactured using laminates, it is difficult to adequately protect the circuits that are to be protected by the protective layer.

[0088] If the thickness of the protective layer exceeds 60 μm, its flexibility tends to decrease. Therefore, it is difficult to apply to components requiring bending resistance.

[0089] Depending on the requirements, the protective layer 30 may contain curing accelerators, adhesive agents, antioxidants, pigments, dyes, plasticizers, ultraviolet absorbers, defoamers, leveling agents, fillers, flame retardants, viscosity modifiers, anti-blocking agents, etc.

[0090] (Conductive material layer)

[0091] As the conductive material layer 40, there are no particular limitations when manufacturing a printed wiring board using the laminate 10, as long as a circuit can be formed.

[0092] For example, the conductive material layer 40 can be a conductive paste layer or a metal layer.

[0093] Examples of metal layers include vapor-deposited layers, plating layers, and metal layers formed through etching processes.

[0094] The conductive paste layer may contain conductive fillers and resins.

[0095] Examples of conductive fillers include copper powder, silver powder, silver-coated copper powder, silver-coated nickel powder, copper-coated nickel powder, graphite, and carbon nanotubes.

[0096] The shape of conductive fillers can be dendritic, rolled, blocky, spherical, sheet-like, needle-like, fibrous, etc. Dendritic refers to a shape in which rod-shaped main branches extend into rod-shaped branches in a two-dimensional or three-dimensional direction. In addition, dendritic also includes the shape in which the above-mentioned branches bend midway, and the shape in which rod-shaped branches further extend from the midway of the above-mentioned branches.

[0097] Particle size (average particle size D) of conductive fillers 50 The preferred size is 0.01–50 μm, more preferably 0.02–30 μm.

[0098] If the particle size of the conductive filler is greater than 0.01 μm, the conductive fillers can easily contact each other, and the conductive composition has good conductivity.

[0099] If the particle size of the conductive filler is less than 50 μm, the printability and smoothness of the conductive material layer can be guaranteed.

[0100] The content of conductive filler in the conductive paste layer is preferably 50-95% by weight.

[0101] Examples of resins include epoxy resin, phenolic resin, polyimide resin, and polyamide-imide resin.

[0102] In addition, in printed wiring boards manufactured using the laminate 10, where the circuit requires flexibility, the resin can be an elastomeric resin.

[0103] Examples of elastic resins include styrene-based elastomers, olefin-based elastomers, polyester-based elastomers, polyurethane-based elastomers, polyamide-based elastomers, and silicone-based elastomers.

[0104] Polyurethane elastomers are composed of hard segments and soft segments. The soft segments include carbonates, esters, ethers, etc. As physical properties, the elongation at break is preferably 20 to 500%, more preferably 30 to 500%.

[0105] There are no particular restrictions on the metals used to form vapor-deposited layers, coatings, or metal layers formed through etching processes, but copper is generally used.

[0106] The thickness of the conductive material layer 40 is preferably 3 to 60 μm, more preferably 5 to 50 μm.

[0107] (Adhesive resin layer)

[0108] The adhesive resin layer 50 preferably contains a resin with heat-melt adhesive properties.

[0109] Examples of thermoplastic resins that can be used for hot-melt bonding include polyester resins, polyurethane resins, polyamide resins, olefin resins, and ethylene vinyl acetate resins.

[0110] The thermoplastic resin preferably has a softening point below 170°C and an elongation at break of 300% or more, and more preferably a softening point below 150°C and an elongation at break of 500% or more.

[0111] More specifically, the thermoplastic resin can be a polyurethane-based thermoplastic resin such as "SHM101-PUR" manufactured by Sheedom Corporation.

[0112] Next, the method for manufacturing the laminate of the present invention will be described.

[0113] The manufacturing method of the laminate of the present invention includes a spacer preparation step and a protective layer formation step.

[0114] In addition, the manufacturing method of the laminate of the present invention may include a transfer object lamination process in which a transfer object is further laminated on a protective layer.

[0115] The following is a detailed description of each process.

[0116] (Preparation process for isolation components)

[0117] Figure 2A and Figure 2B This is a schematic diagram of an example of the separator preparation step in the manufacturing method of the laminate of the present invention.

[0118] In the preparation process of the isolation components, the first step is to prepare, such as Figure 2A The substrate 21 shown.

[0119] The substrate 21 can be formed by extruding material into the desired shape and size.

[0120] Next, as Figure 2B As shown, an organosilicon resin film 22 is formed on the surface of the substrate 21 to form a release surface 22a.

[0121] At this time, an organosilicon resin film 22 is formed with a water contact angle of 107.1° or higher on the release surface 22a.

[0122] It should be noted that the water contact angle of the demolding surface 22a is preferably formed to be 109 to 120°, more preferably 110 to 115°, and even more preferably 110 to 113.5°.

[0123] The silicone resin film 22 can be formed by coating a silicone resin film forming composition containing silicone resin and solvent and then heating and drying it.

[0124] Examples of solvents include toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, and dimethylformamide.

[0125] The concentration of the solid component in the composition for forming the silicone resin film is preferably determined appropriately based on the thickness of the silicone resin film 22, etc.

[0126] There are no particular limitations on the method for forming the composition for coating silicone resin film, and a known coating machine can be used.

[0127] For example, a silicone resin film 22 can be formed using a gravure roller coating machine, a reverse roller coating machine, a kiss roller coating machine, a lip coating machine, an impregnation roller coating machine, a bar coating machine, a doctor blade coating machine, a spray coating machine, a comma coating machine, a direct coating machine, a slot coating machine, and other coating machines.

[0128] It should be noted that the preferred materials for the substrate 21 and the silicone resin film 22 have already been described, so the description here is omitted.

[0129] (Protective layer formation process)

[0130] In the protective layer formation process, such as Figure 3 As shown, a protective layer 30 is stacked on the demolding surface 22a.

[0131] As a method for forming the protective layer 30, the protective layer forming composition containing a protective layer resin and a solvent can be prepared by coating and then heated to dry, or the protective layer forming composition can be prepared by printing.

[0132] It should be noted that the preferred protective layer resin contained in the protective layer forming composition is the same as the resin constituting the above-described protective layer, therefore the description here is omitted.

[0133] Examples of solvents contained in compositions for forming a protective layer include toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, N-methylpyrrolidone, γ-butyrolactone, butyl carbitol acetate, and butyl cellosolve.

[0134] If the concentration of the solid component in the protective layer forming composition is within the above range, the protective layer forming composition is not easily rejected by the silicone resin film 22 and can uniformly form the protective layer 30.

[0135] There are no particular limitations on the method of using the composition for forming the protective coating layer, and a known coating machine can be used.

[0136] For example, a protective layer 30 can be formed using a gravure roller coating machine, a reverse roller coating machine, a kiss roller coating machine, a lip coating machine, an impregnation roller coating machine, a bar coating machine, a doctor blade coating machine, a spray coating machine, a comma coating machine, a direct coating machine, a slot coating machine, and other coating machines.

[0137] Methods for forming a composition for a printing protective layer include gravure printing, flexographic printing, offset printing, screen printing, and rotary screen printing.

[0138] The heating and drying conditions for the composition for forming the protective layer are preferably at 100–250°C for 2–60 minutes.

[0139] Through the above processes, a laminate 11 containing the separator 20 and the protective layer 30 can be manufactured.

[0140] The laminate 11 thus manufactured is also the laminate of the present invention.

[0141] (Laying process of the transfer material)

[0142] Figure 4 This is a schematic diagram illustrating an example of the transfer object lamination process in the manufacturing method of the laminate of the present invention.

[0143] Next, as Figure 4 As shown, a conductive material layer 40 and an adhesive resin layer 50, which serve as the transfer material, are sequentially stacked on the protective layer 30.

[0144] The method of laminating the conductive material layer 40 and the adhesive resin layer 50 can be a conventionally known method.

[0145] Through the above processes, it is possible to manufacture such as Figure 1A The layered body 10 shown.

[0146] Next, a method for manufacturing a printed wiring board using the laminate of the present invention will be described.

[0147] The method for manufacturing the printed wiring board of the present invention includes a laminate preparation process, a laminate configuration process, a hot pressing process, and a peeling process.

[0148] The following is a description of each process.

[0149] (Preparation process for laminated bodies)

[0150] In the manufacturing method of the printed wiring board of the present invention, a laminate 10 is first prepared.

[0151] Since the structure of the laminate 10 has already been explained, the explanation here is omitted.

[0152] (Laminated body configuration process)

[0153] Figure 5A This is a schematic diagram illustrating an example of the lamination process in the manufacturing method of the printed wiring board of the present invention.

[0154] In the laminate configuration process, such as Figure 5AAs shown, the laminate 10 is configured such that the adhesive resin layer 50 is bonded to the substrate 60.

[0155] It should be explained that Figure 5A The stacked body 10 shown is based on the principle of... Figure 1A The stacked body 10 is shown in a flipped-up state.

[0156] The material of the substrate 60 is not particularly limited, but it is preferably made of engineering plastic. Examples of engineering plastics include polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyetherimide, polyphenylene sulfide (PPS) resin, fabric, elastic fabric, nonwoven fabric, elastic nonwoven fabric, etc.

[0157] (Hot pressing process)

[0158] Figure 5B This is a schematic diagram of an example of the hot-pressing process in the manufacturing method of the printed wiring board of the present invention.

[0159] Next, as Figure 5B As shown, the laminate 10 is hot-pressed onto the substrate 60. Figure 5B In the image, the arrow indicates the direction of pressure.

[0160] The conditions for hot pressing are preferably determined appropriately based on the composition of the adhesive resin layer 50 and the thickness of the spacer 20. For example, it is preferable to perform hot pressing at 60–300°C, 0.1–3.0 MPa, and 5–300 seconds.

[0161] By performing this process, the adhesive resin layer 50, the conductive material layer 40, and the protective layer 30 can be transferred onto the substrate 60.

[0162] It should be noted that when the conductive material layer 40 is composed of a conductive paste layer, the conductive paste layer is cured by heat pressing to form a circuit.

[0163] (Stripping process)

[0164] Figure 5C This is a schematic diagram of an example of the stripping process in the manufacturing method of the printed wiring board of the present invention.

[0165] Next, as Figure 5C As shown, the isolation element 20 is peeled off.

[0166] In the laminate 10, the water contact angle of the release surface 22a, which is composed of silicone resin film 22, is 107.1° or higher, and the protective layer 30 contains at least one resin selected from polyurethane resin, polyamide-imide resin and polyamide resin.

[0167] They are compatible, so the peel strength between the release surface 22a of the hot-pressed separator 20 and the protective layer 30 will not become too high, and the separator 20 can be properly peeled off during the peeling process.

[0168] The peel strength when peeling off the separator is preferably 0.01 to 2 N / 50 mm or more, and more preferably 0.05 to 1 N / 50 mm.

[0169] The peel strength refers to the value measured on the separator using a peel strength tester (PALMEK Co., Ltd., PFT50S) at room temperature, under tensile speed of 1000 mm / min and peel angle of 170°.

[0170] Through the above processes, a printed wiring board 70 can be manufactured in which an adhesive resin layer 50, a conductive material layer 40 for circuitry, and a protective layer 30 are sequentially stacked on a substrate 60.

[0171] (Other implementation methods)

[0172] The aforementioned laminate 10 is used for transferring the circuitry of the printed wiring board 70.

[0173] However, as long as the laminate of the present invention has an isolator and a protective layer, the transfer material laminated on the protective layer does not have to be a material used to form a circuit.

[0174] For example, the laminate of the present invention may be a laminate in which an isolator, a protective layer and a shielding layer are stacked sequentially.

[0175] Alternatively, the laminate of the present invention may also be a laminate in which an insulating member, a protective layer and a polarizing film are stacked sequentially.

[0176] Furthermore, in the laminate of the present invention, other layers such as an anchoring layer or other functional material layers may be laminated between the protective layer and the conductive material layer, or between the conductive material layer and the adhesive resin layer.

[0177] Example

[0178] The following are embodiments that illustrate the invention in more detail, but the invention is not limited to these embodiments.

[0179] (Example 1)

[0180] (Preparation process for isolation components)

[0181] Prepare a sheet-like substrate made of polyethylene terephthalate with a thickness of 75 μm.

[0182] Next, the silicone resin film forming composition (release surface forming composition) shown in Table 1 is coated on one side of the substrate, and heated to dry it to form a silicone resin film, thus creating a release surface.

[0183] Thus, the isolation component of Example 1 is prepared.

[0184] Using a contact angle meter (product name: portable contact angle meter PCA-11, manufacturer: Kyowa Interface Science Co., Ltd.), 2 μL of distilled water was added dropwise using the droplet method, and the contact angle of the demolded surface was measured after 1 second. The results are shown in Table 1.

[0185] (Protective layer formation process)

[0186] Next, the protective layer forming composition shown in Table 1 was printed onto the release surface of the separator in a length × width of 60 mm × 60 mm. The printing conditions were manual screen printing and drying at 150°C for 3 minutes to achieve a protective layer thickness of 10 μm.

[0187] The laminate of Example 1 is manufactured through the above processes.

[0188] Examples 2 through 6 and Comparative Examples 1 through 8

[0189] Except for the changes to the composition shown in Tables 1 and 2, the laminates of Examples 2 to 6 and Comparative Examples 1 to 8 were manufactured in the same manner as in Example 1.

[0190]

[0191]

[0192] It should be noted that the release components formed by the silicone resin composition in Tables 1 and 2 are as follows.

[0193] Organosilicon resin 1: NS-75-G manufactured by Nakamoto Packs Co., Ltd.

[0194] Organosilicon resin 2: Nakamoto Packs NS-75-G water contact angle adjuster 1

[0195] Organosilicon resin 3: Nakamoto Packs NS-75-G water contact angle adjuster 2

[0196] 4. Silicone resin: NS-75-G water contact angle adjuster manufactured by Nakamoto Packs Co., Ltd.

[0197] Organosilicon resin 5: E7001 manufactured by Toyobo Co., Ltd.

[0198] Organosilicon resin 6: E7002 manufactured by Toyobo Co., Ltd.

[0199] Organosilicon resin 7: E7006 manufactured by Toyobo Co., Ltd.

[0200] In addition, the following is a release liner made of a non-silicone resin composition.

[0201] Non-silicone resin 1: R02N2 manufactured by Nakamoto Packs Co., Ltd.

[0202] Non-silicone resin 2: F05N manufactured by Nakamoto Packs Co., Ltd.

[0203] In addition, the composition used to form the protective layer is as follows.

[0204] Acrylic urethane resin: TPTF-9001N manufactured by Koyo Chemical Industry Co., Ltd.

[0205] Polyurethane resin: Resamine CU-4104E manufactured by Daihisei Chemical Co., Ltd.

[0206] Polyamide-imide resin: Toyobo Co., Ltd. HR-16NN

[0207] Acrylic resin: PTF-60N manufactured by Koyo Chemical Industry Co., Ltd.

[0208] Polycarbonate resin: TPTF-9500 manufactured by Koyo Chemical Industry Co., Ltd.

[0209] Polyimide resin: PIAD200 manufactured by Arakawa Chemical Industry Co., Ltd.

[0210] <Appearance Evaluation>

[0211] The laminates of each embodiment and comparative example were observed from the protective layer side, and the presence or absence of the protective layer was visually assessed. The results are shown in Tables 1 and 2.

[0212] It should be noted that the evaluation criteria for appearance assessment are as follows: Figures 6A to 6C As shown.

[0213] Figure 6A The photo shows an example of a rejection rating of "0".

[0214] Figure 6B The photo shows an example of a "△" rating in the rejection evaluation.

[0215] Figure 6C The photo shows an example of an "×" rating in the rejection evaluation.

[0216] The evaluation of "0" is as follows: Figure 6AAs shown, this means that the protective layer is not rejected, the isolation membrane is not visible, and the protective layer is uniformly formed.

[0217] "△" evaluation is as follows Figure 6B As shown, this means that although there are parts where a protective layer is uniformly formed, there are also parts where the protective layer is repelled and the isolation membrane can be observed, indicating an unevenly formed state.

[0218] "×" evaluation is as follows Figure 6C As shown, this means that the protective layer is generally rejected, and the isolation membrane is observed to be in a state where the protective layer is not uniformly formed.

[0219] It should be noted that the "〇" rating has no problems in actual use, while the "△" and "×" ratings have problems in actual use.

[0220] <Evaluation of peel strength after heat pressing>

[0221] Using a wire rod, Sheedom SHM101-PUR, a type of adhesive resin, was applied to the protective layer of the laminates in each embodiment and each comparative example to achieve a thickness of 10 μm, thus forming an adhesive resin layer.

[0222] Next, the laminates of each embodiment and each comparative example were configured such that the adhesive resin layer was in contact with the substrate made of polyimide, and hot-pressed using a stamping machine under the conditions of temperature: 150°C, time: 5 seconds, and pressure: 0.5 MPa.

[0223] After the laminate returned to room temperature, the peel strength of the spacers was measured using a peel strength tester (PALMEK, PFT50S). The tests were conducted at room temperature, a tensile speed of 1000 mm / min, and a peel angle of 170°. Ten tests were performed, and the average value was calculated. The results are shown in Tables 1 and 2.

[0224] As shown in Table 1, the water contact angle of the release surface is above 107.1°. In the isolation parts of Examples 1 to 6, where the protective layer contains polyurethane resin and polyamide-imide resin, the appearance evaluation is good and the peel strength after hot pressing is also low.

[0225] It should be noted that, as shown in Comparative Examples 1 to 3 in Table 2, even if the water contact angle of the release surface is 107.1° or higher, and the protective layer does not contain any of the following: polyurethane resin, polyamide-imide resin, and polyamide resin, the appearance evaluation is still poor.

[0226] Furthermore, as shown in Comparative Examples 4 to 8 in Table 2, even if the protective layer contains polyurethane resin, if the water contact angle of the release surface is less than 107.1°, the appearance evaluation is also poor.

[0227] Symbol Explanation

[0228] 10 and 11 layered structures

[0229] 20 isolation components

[0230] 21 Substrate

[0231] 22. Organosilicon resin film

[0232] 22a Demolding surface

[0233] 30 protective layers

[0234] 40. Conductive material layer

[0235] 50 Adhesive resin layer

[0236] 60 substrates

[0237] 70 Printed Wiring Board

Claims

1. A laminated body, characterized in that, have: A release element having a substrate and an organosilicon film formed on the surface of the substrate as a release surface, and A protective layer is laminated onto the spacer in such a way that it contacts the release surface. The water contact angle of the release surface is 107.1° or higher. The protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin, and polyamide resin.

2. The laminated body according to claim 1, wherein, The protective layer is further provided with a conductive material layer, which is stacked on the protective layer on the opposite side of the insulating member.

3. The laminated body according to claim 2, wherein, The conductive material layer is a conductive paste layer used for circuit formation.

4. The laminate according to claim 2 or 3, wherein, It further comprises an adhesive resin layer, which is stacked on the opposite side of the spacer and the protective layer, and in a manner that covers the conductive material layer.

5. A method for manufacturing a laminated body, characterized in that, include: The process of preparing the separator involves forming an organosilicon resin film on the surface of the substrate to serve as the release surface, thereby producing the separator. as well as In the protective layer forming process, a protective layer is stacked on the demolding surface; In the preparation process of the separator, the silicone resin film is formed such that the water contact angle of the demolding surface is 107.1° or higher. The protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin, and polyamide resin.

6. A method for manufacturing a printed wiring board, characterized in that, The process includes the following steps: The laminate preparation process involves preparing a laminate containing an insulating component, a protective layer, a conductive material layer, and an adhesive resin layer. The separator has a substrate and an organosilicon resin film formed on the surface of the substrate, which serves as a release surface. The protective layer is stacked on the separator in a manner that it contacts the demolding surface. The conductive material layer is stacked on the protective layer on opposite sides of the insulating member, with the insulating member in between. The adhesive resin layer is stacked on the opposite side of the spacer, separated from the protective layer, and in a manner that covers the conductive material layer; The laminate configuration process involves configuring the laminate by bonding the adhesive resin layer to the substrate; The hot pressing process involves hot pressing the laminate onto the substrate; as well as In the stripping process, the separator is stripped off. The water contact angle of the release surface is 107.1° or higher. The protective layer contains at least one resin selected from polyurethane resin, polyamide-imide resin, and polyamide resin.

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