Good product screening method and system for heating elements of electronic atomization device

By analyzing thermal imaging images of the heating elements in electronic atomizing devices, calculating the average temperature and variance of sub-regions, and using infrared thermometry to screen out high-quality heating elements, the inefficiency of existing screening methods is solved, and the screening accuracy and product quality are improved.

CN120900965APending Publication Date: 2025-11-07GUANGDONG QISITECH CO LTD
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Patent Information

Application Number
CN202510933034.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-07
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Existing methods for screening heating elements in electronic atomizing devices are inefficient at identifying good products, resulting in low output power, slow heating, and an inability to accurately determine whether the heating elements are qualified.

Method used

By acquiring thermal imaging images of the heating element, dividing it into multiple sub-regions, calculating the average temperature and temperature variance of each sub-region, and using infrared thermometry technology to screen out good heating elements.

Benefits of technology

This technology enables efficient screening of heating elements, ensuring temperature uniformity and stability, improving the pass rate of heating elements, extending their service life, and reducing the risk of substandard products entering the market.

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Abstract

The invention relates to the technical field of electronic atomization, in particular to a good product screening method and system for heating elements of an electronic atomization device. The method comprises the following steps: acquiring a thermal imaging image of a heating element and thermal imaging images of a plurality of sub-regions of the heating element, and then acquiring the average temperature of the thermal imaging image of each sub-region; afterwards, the temperature of each temperature monitoring point in each sub-region thermal imaging image is obtained, then the temperature variance of the corresponding sub-region thermal imaging image is calculated according to the temperatures of the multiple temperature monitoring points in each sub-region thermal imaging image, and finally, the temperature variance of the corresponding sub-region thermal imaging image is calculated. And screening good heating elements according to the average temperature of the thermal imaging image of each sub-region and the temperature variance of the thermal imaging image of each sub-region. According to the method, the infrared temperature measurement mode is adopted, the average temperature and the temperature variance of the heating elements are tested, the average temperature and the temperature variance of each heating element are judged, efficient screening of the heating elements is finally achieved, and the problem that good heating elements cannot be efficiently screened out through an existing screening mode is effectively solved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic atomization, and in particular to a good product screening method and system for a heating element of an electronic atomization device. BACKGROUND

[0002] In the production process of existing atomization devices, the heating elements thereof need to be screened to ensure that the electronic atomization device has good use performance when it is in the hands of a user. At present, the detection of the heating element is performed by calibrating the power thereof, specifically, each heating body is heated by the same power, and the heating time is generally about 150 seconds. This long-time power calibration method not only has low output power and slow temperature rise, but also, after the temperature of the heating element is stable, the TCR values of the heating bodies with concentrated heating in some areas and normal heating bodies have little difference, so that it is difficult to accurately determine whether the heating element is qualified. SUMMARY

[0003] The present application provides a good product screening method and system for a heating element of an electronic atomization device, which effectively solves the problem that the existing screening method cannot efficiently screen out good heating elements.

[0004] According to a first aspect, in an embodiment, a good product screening method for a heating element of an electronic atomization device is provided, comprising:

[0005] obtaining a thermal imaging image of the heating element, the thermal imaging image comprising a plurality of sub-region thermal imaging images;

[0006] obtaining an average temperature of each of the sub-region thermal imaging images;

[0007] setting a plurality of temperature monitoring points in each of the sub-region thermal imaging images;

[0008] obtaining a temperature of each of the temperature monitoring points;

[0009] calculating a temperature variance of the corresponding sub-region thermal imaging image according to the temperatures of the plurality of temperature monitoring points in each of the sub-region thermal imaging images;

[0010] screening a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images.

[0011] In an implementable embodiment, the obtaining of the thermal imaging image of the heating element, the thermal imaging image comprising a plurality of sub-region thermal imaging images, comprises:

[0012] dividing the heating element into a plurality of sub-regions by a division line, and placing the heating element at a predetermined position;

[0013] An infrared thermal imager is used to obtain a thermal imaging image of the heating element at the preset position, and the thermal imaging image includes a plurality of sub-region thermal imaging images.

[0014] In an implementable embodiment, the heating element includes an upper heating body and a lower heating body, and the heating element is divided into a plurality of sub-regions by a division line, including:

[0015] The upper heating body is divided into a plurality of sub-regions by a division line.

[0016] The lower heating body is divided into a plurality of sub-regions by a division line.

[0017] In an implementable embodiment, the temperature variance of the corresponding sub-region thermal imaging image is calculated according to the temperatures of a plurality of temperature monitoring points in each sub-region thermal imaging image, including:

[0018] The average temperature of the temperature monitoring points in each sub-region thermal imaging image is calculated according to the temperatures of a plurality of temperature monitoring points in each sub-region thermal imaging image.

[0019] The temperature variance of the corresponding sub-region thermal imaging image is calculated according to the average temperature of the temperature monitoring points in each sub-region and the temperatures of a plurality of temperature monitoring points in the corresponding sub-region.

[0020] In an implementable embodiment, the calculation formula for calculating the temperature variance of the sub-region thermal imaging image is as follows:

[0021]

[0022] In the formula, S 2 represents the temperature variance, M represents the average temperature, T n represents the temperature of the nth temperature monitoring point in the sub-region, where n≥8.

[0023] In an implementable embodiment, the good heating element is screened according to the average temperature and the temperature variance of each sub-region thermal imaging image, including:

[0024] It is determined whether the average temperature of each sub-region thermal imaging image is within a preset range, and it is determined whether the temperature variance of each sub-region thermal imaging image is less than a preset value; if yes, the current heating element is determined to be a good product, otherwise, the current heating element is determined to be a defective product.

[0025] According to a second aspect, in an embodiment, a good product screening system for a heating element of an electronic atomization device is provided, including:

[0026] an image acquisition module, configured to acquire a thermal imaging image of the heating element, the thermal imaging image comprising a plurality of sub-region thermal imaging images;

[0027] a first temperature acquisition module, configured to acquire an average temperature of each of the sub-region thermal imaging images;

[0028] a monitoring point setting module, configured to set a plurality of temperature monitoring points in each of the sub-region thermal imaging images;

[0029] a second temperature acquisition module, configured to acquire a temperature of each of the temperature monitoring points;

[0030] a calculation module, configured to calculate a temperature variance of each of the sub-region thermal imaging images according to the temperatures of the plurality of temperature monitoring points in the corresponding sub-region thermal imaging image;

[0031] a screening module, configured to screen a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images.

[0032] In an implementation, the screening module screens a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images, comprising:

[0033] judging whether the average temperature of each of the sub-region thermal imaging images is within a preset range and whether the temperature variance of each of the sub-region thermal imaging images is less than a preset value; if yes, determining that the current heating element is a good product, otherwise, determining that the current heating element is a defective product.

[0034] According to a third aspect, in an embodiment, a computer readable storage medium is provided, and the medium stores a computer program, which can be executed by a processor to implement the method described above.

[0035] According to a fourth aspect, in an embodiment, a computer program product is provided, comprising a computer program and / or instructions, which are executed by a processor to implement the method described above.

[0036] According to the good product screening method / system of the heating element of the electronic atomization device in the above embodiment, the thermal imaging image of the heating element is obtained, wherein the thermal imaging image of each heating element includes a plurality of sub-region thermal imaging images, and then the average temperature of each sub-region thermal imaging image is obtained; then a plurality of temperature monitoring points are set in each sub-region thermal imaging image, and the temperature of each temperature monitoring point is obtained, and then the temperature variance of the corresponding sub-region thermal imaging image is calculated according to the temperature of the plurality of temperature monitoring points in each sub-region thermal imaging image; finally, the good heating element is screened according to the average temperature and the temperature variance of each sub-region thermal imaging image. By adopting the above scheme of the present application, the average temperature and the temperature variance of the heating element are tested by using the infrared temperature measurement method, and the average temperature and the temperature variance of each heating element are judged, so as to realize efficient screening of the heating element, and effectively solve the problem that the existing screening method cannot efficiently screen the good heating element. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 A flowchart of a good product screening method of a heating element of an electronic atomization device is provided for the present embodiment;

[0038] Figure 2 A flowchart of obtaining a thermal imaging image of a heating element is provided for the present embodiment;

[0039] Figure 3 A flowchart of calculating the temperature variance of a sub-region thermal imaging image is provided for the present embodiment;

[0040] Figure 4 A development plan view of a heating element is provided for the present embodiment;

[0041] Figure 5 A thermal imaging image corresponding to the heating element shown in the above embodiment; Figure 4

[0042] Figure 6 A structure block diagram of a good product screening system of a heating element of an electronic atomization device is provided for the present embodiment.

[0043] Reference signs: 10, heating element; 11, upper heating body; 12, lower heating body; 20, division line; 100, image acquisition module; 200, first temperature acquisition module; 300, monitoring point setting module; 400, second temperature acquisition module; 500, calculation module; 600, screening module. DETAILED DESCRIPTION

[0044] ​The application will be described in further detail below with specific reference to the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without these specific details. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure the application. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without these specific details. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure the application.

[0045] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various embodiments. At the same time, the steps or actions in the method description can also be sequentially changed or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and drawings are only for the purpose of clearly describing a certain embodiment, and do not mean that the sequence is necessary, unless otherwise stated that a certain sequence must be followed.

[0046] The serial numbers of the components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "coupling" in this application include direct and indirect connection (coupling) unless otherwise specified.

[0047] In actual production, the heating element of the application is printed on a round stainless steel tube by silver-palladium alloy thick film, and then formed after sintering. However, for such a heating element, the printing thickness has a great influence on the mobility of silver-palladium alloy during sintering. Too thin will cause a large change in resistance, exceeding the use range; too thick will increase the thermal resistance of the heat conduction path, causing uneven distribution of the surface temperature of the heating element, thereby easily causing resistance fluctuation and reducing overall heating efficiency. Since the printing thickness of the heating element cannot be accurately controlled during processing, the screening accuracy and efficiency of the good product rate of the heating element are required to be higher. Therefore, the application proposes a good product screening method and system for the heating element of the electronic atomization device to accurately and efficiently screen the good heating element.

[0048] Reference Figure 1 The good product screening method for the heating element of the electronic atomization device provided in this embodiment includes the following steps:

[0049] Step 100: Obtain a thermal imaging image of the heating element 10 through an image acquisition module. The thermal imaging image includes a plurality of sub-region thermal imaging images.

[0050] In the actual application process, the heating element 10 to be tested is preheated, and the image acquisition module can use a high-precision infrared thermal imager to acquire a thermal imaging image of the heating element 10 according to the distribution of the surface temperature of the heating element 10. Specifically, referring to Figure 2 , the following steps are implemented:

[0051] Step 110: The heating element 10 is divided into a plurality of sub-regions by the division line 20, and the heating element 10 is placed at a predetermined position.

[0052] Step 120: Acquire a thermal imaging image of the heating element 10 at the predetermined position by the infrared thermal imager, and the thermal imaging image includes a plurality of sub-region thermal imaging images.

[0053] Specifically, the heating element 10 is divided into a plurality of sub-regions (not less than 7) by the division line 20 according to actual needs, and referring to Figure 4 , for ease of understanding, the embodiment gives an expanded plan view of the heating element 10 divided into a plurality of sub-regions by the division line 20, Figure 4 wherein a, b, c, d, e, f, and g respectively represent the sub-regions formed after the division by the division line 20. The heating element 10 after division is placed at a predetermined position, so that the infrared thermal imager can acquire a complete thermal imaging image of the heating element 10, and also can ensure that the acquired thermal imaging image includes the thermal imaging images of all the sub-regions formed after the division by the division line 20. As shown in Figure 5 , it is a thermal imaging image of the heating element 10 formed after the division by the division line 20, Figure 5 wherein a, b, c, d, e, f, and g are respectively thermal imaging images of the a, b, c, d, e, f, and g sub-regions in Figure 4 .

[0054] In actual application, the heating element 10 includes the upper heating body 11 and the lower heating body 12, the upper heating body 11 is divided into a plurality of sub-regions by the division line 20, and the lower heating body 12 is divided into a plurality of sub-regions by the division line 20. As an embodiment, when the upper heating body 11 and the lower heating body 12 are divided, specifically, the upper heating body 11 can be divided into three sub-regions by the division line 20, and the lower heating body 12 can be divided into four sub-regions by the division line 20; or the upper heating body 11 can be divided into four sub-regions by the division line 20, and the lower heating body 12 can be divided into three sub-regions by the division line 20. Or the upper heating body 11 and the lower heating body 12 can be divided into more sub-regions according to actual needs. After the heating element 10 is divided into a plurality of sub-regions, a thermal imaging image is obtained, on the one hand, the temperature of a plurality of different regions can be detected and judged, so as to master the heating condition (i.e. heating consistency) of different positions of the heating element 10; on the other hand, the average temperature of the heating element 10 can also be obtained.

[0055] Step 200: acquiring the average temperature of each sub-region thermal imaging image by the first temperature acquisition module. Specifically, as a temperature acquisition method, the thermal imaging image can be imported into professional analysis software, and the average temperature of each sub-region thermal imaging image can be measured by the analysis tools of the software, such as point temperature measurement, line temperature measurement, and region temperature measurement.

[0056] Step 300: setting a plurality of temperature monitoring points in each sub-region thermal imaging image by the monitoring point setting module.

[0057] Step 400: acquiring the temperature of each temperature monitoring point by the second temperature acquisition module. Similarly, the temperature of each temperature monitoring point can be measured by using professional analysis software.

[0058] Step 500: calculating the temperature variance of the corresponding sub-region thermal imaging image according to the temperature of a plurality of temperature monitoring points in each sub-region thermal imaging image by the calculation module.

[0059] In the use process of the electronic atomization device, the stability of the temperature of the heating element 10 has a crucial influence on the taste. Therefore, the inventors of the present application propose to calculate the temperature variance by the calculation module to judge the consistency of the heating element 10. Specifically, as shown in FIG. 5, specifically including the following steps: Figure 3

[0060] ​Step 510: calculating the average temperature of the temperature monitoring points in the corresponding sub-region according to the temperatures of the temperature monitoring points in the thermal imaging image of each sub-region. In actual applications, the number of temperature monitoring points set in each sub-region thermal imaging image is not less than 8. After obtaining the temperature of each temperature monitoring point, the average temperature of the temperature monitoring points in the sub-region thermal imaging image is calculated.

[0061] Step 520: calculating the temperature variance of the thermal imaging image of the corresponding sub-region according to the average temperature of the temperature monitoring points in each sub-region and the temperatures of the temperature monitoring points in the corresponding sub-region.

[0062] Taking sub-region a as an example, after obtaining the temperature of each temperature monitoring point in the sub-region thermal imaging image of sub-region a and the average temperature of the temperature monitoring points in sub-region a, the temperature variance of the thermal imaging image of sub-region a is calculated by the following formula:

[0063]

[0064] In the formula, S 2 represents the temperature variance of the thermal imaging image of sub-region a, M represents the average temperature of the temperature monitoring points in sub-region a, and T n represents the temperature of the nth temperature monitoring point in sub-region a, where n≥8.

[0065] Similarly, the calculation of the temperature variance of the thermal imaging images of sub-regions b, c, d, e, f, and g is the same as the calculation principle of sub-region a described above. Therefore, the detailed description is not repeated here.

[0066] Step 600: the screening module screens the good heating element 10 according to the average temperature and the temperature variance of each sub-region thermal imaging image.

[0067] Specifically, the screening module screens the good heating element 10 according to the average temperature and the temperature variance of each sub-region thermal imaging image, which specifically includes: judging whether the average temperature of each sub-region thermal imaging image is in the preset range, and judging whether the temperature variance of each sub-region thermal imaging image is less than the preset value; if yes, it is determined that the current heating element 10 is good, otherwise, it is determined that the current heating element 10 is defective.

[0068] Generally in application, for the upper heating element 11, when it is judged that the average temperature of each sub-region thermal imaging image is in 320℃-380℃, and the temperature variance of each sub-region thermal imaging image is less than 4, it is determined that the upper heating element 11 meets the requirements; for the lower heating element 12, when it is judged that the average temperature of each sub-region thermal imaging image is in 380℃-420℃, and the temperature variance of each sub-region thermal imaging image is less than 4, it is determined that the lower heating element 12 meets the requirements, only when the upper heating element 11 and the lower heating element 12 meet the requirements at the same time, it is determined that the current heating element 10 is qualified, otherwise, it is unqualified.

[0069] In actual application, if the temperature variance is small, it means that the heating element 10 can maintain a relatively stable temperature during the puffing process. In this way, the atomized substrate is uniformly heated, and the evaporation rate is stable, thereby generating smoke with consistent taste. Users can obtain similar experience every time they puff, and there will be no taste difference caused by temperature fluctuation, such as taste being strong or weak, smoke volume being large or small, etc. Moreover, a smaller temperature variance also helps to reduce the thermal stress of the heating element 10 caused by temperature fluctuations. Thermal stress can cause the material of the heating element 10 to fatigue and damage, shortening its service life. Stable temperature can reduce such thermal stress, prolong the service life of the heating element and the entire electronic atomization device, and reduce maintenance and replacement costs.

[0070] For unqualified heating elements 10, light signals, sound signals or electrical signals can be sent to prompt the staff that the current heating element 10 is detected as unqualified, so as to facilitate the staff to isolate the unqualified products from the qualified products in time, preventing them from flowing into the market.

[0071] By adopting the good product screening method of the heating element 10 of the electronic atomization device of the present application, the infrared temperature measurement method is adopted, the average temperature and the temperature variance of the heating element 10 are tested, and the average temperature and the temperature variance of each heating element 10 are judged, so as to realize efficient screening of the heating element 10, effectively solving the problem that the existing screening method cannot efficiently screen out good heating elements 10.

[0072] As Figure 6As shown, the good product screening system of the heating element 10 of the electronic atomization device provided in this embodiment comprises an image acquisition module 100, a first temperature acquisition module 200, a monitoring point setting module 300, a second temperature acquisition module 400, a calculation module 500, and a screening module 600. Among them, the image acquisition module 100 is used to acquire the thermal imaging image of the heating element 10, and the thermal imaging image comprises a plurality of sub-region thermal imaging images; the first temperature acquisition module 200 is used to acquire the average temperature of each sub-region thermal imaging image; the monitoring point setting module 300 is used to set a plurality of temperature monitoring points in each sub-region thermal imaging image; the second temperature acquisition module 400 is used to acquire the temperature of each temperature monitoring point; the calculation module 500 is used to calculate the temperature variance of the corresponding sub-region thermal imaging image according to the temperature of the plurality of temperature monitoring points in each sub-region thermal imaging image; and the screening module 600 is used to screen the good heating element 10 according to the average temperature and the temperature variance of each sub-region thermal imaging image.

[0073] The good product screening system of the heating element 10 of the electronic atomization device provided in this embodiment acquires the thermal imaging image of the heating element 10 through the image acquisition module 100, wherein each thermal imaging image of the heating element 10 respectively comprises a plurality of sub-region thermal imaging images, then acquires the average temperature of each sub-region thermal imaging image through the first temperature acquisition module 200; then sets a plurality of temperature monitoring points in each sub-region thermal imaging image through the monitoring point setting module 300, and acquires the temperature of each temperature monitoring point through the second temperature acquisition module 400; then calculates the temperature variance of the corresponding sub-region thermal imaging image according to the temperature of the plurality of temperature monitoring points in each sub-region thermal imaging image through the calculation module 500; and finally screens the good heating element 10 according to the average temperature and the temperature variance of each sub-region thermal imaging image through the screening module 600. By adopting the system of the present application, the average temperature and the temperature variance of the heating element 10 are tested in the infrared temperature measurement mode, and the average temperature and the temperature variance of each heating element 10 are judged, so as to realize efficient screening of the heating element 10, and effectively solve the problem that the existing screening mode cannot efficiently screen the good heating element 10. Since the modules have been described in detail in the above embodiment of the good product screening method of the heating element 10 of the electronic atomization device, this embodiment will not be described in detail here.

[0074] Furthermore, in the screening module 600, the good heating element 10 is screened according to the average temperature and the temperature variance of each sub-region thermal imaging image, specifically including: judging whether the average temperature of each sub-region thermal imaging image is in the preset range, and judging whether the temperature variance of each sub-region thermal imaging image is less than the preset value; if yes, the current heating element 10 is determined to be a good product, otherwise, the current heating element 10 is determined to be a defective product.

[0075] In general, in the application, for the upper heating element 11, when it is determined that the average temperature of each sub-region thermal imaging image is between 320℃ and 380℃, and the temperature variance of each sub-region thermal imaging image is less than 4, it is determined that the upper heating element 11 meets the requirements; for the lower heating element 12, when it is determined that the average temperature of each sub-region thermal imaging image is between 380℃ and 420℃, and the temperature variance of each sub-region thermal imaging image is less than 4, it is determined that the lower heating element 12 meets the requirements. Only when the upper heating element 11 and the lower heating element 12 meet the requirements at the same time, it is determined that the current heating element 10 is qualified, otherwise, it is unqualified.

[0076] In actual application, if the temperature variance is small, it means that the heating element 10 can maintain a relatively stable temperature during the puffing process. In this way, the atomized substrate is uniformly heated, and the evaporation rate is stable, thereby generating smoke with consistent taste. Users can obtain similar experience every time they puff, and there will be no taste difference caused by temperature fluctuation, such as taste being strong or weak, smoke volume being large or small, and the like. Moreover, the smaller temperature variance also helps to reduce the thermal stress of the heating element 10 caused by the drastic change of temperature. Thermal stress can cause the material of the heating element 10 to fatigue and damage, thereby shortening the service life thereof. Stable temperature can reduce such thermal stress, prolong the service life of the heating element and the entire electronic atomization device, and reduce maintenance and replacement costs.

[0077] For unqualified heating element 10, a light signal, a sound signal, or an electrical signal can be emitted to prompt the staff that the current heating element 10 is unqualified, so as to facilitate the staff to isolate the unqualified product from the qualified products in time, and prevent it from flowing into the market.

[0078] The computer readable storage medium provided in the embodiment has a computer program stored thereon, and the computer program can be executed by a processor to implement the method described above. Since the above embodiment has described in detail the good product screening method of the heating element 10 of the electronic atomization device, the embodiment will not be described in detail here.

[0079] The computer program product provided in the embodiment includes a computer program and / or instructions, and the computer program and / or instructions are executed by a processor to implement the method described above. Since the above embodiment has described in detail the good product screening method of the heating element 10 of the electronic atomization device, the embodiment will not be described in detail here.

[0080] Those skilled in the art can understand that all or part of the functions of various methods in the above embodiments can be realized by hardware or by a computer program. When all or part of the functions in the above embodiments are realized by a computer program, the program can be stored in a computer readable storage medium, which can include a read-only memory, a random access memory, a magnetic disk, an optical disk, a hard disk, and the like. The above functions are realized by executing the program by a computer. For example, the program is stored in a memory of a device, and the above functions are realized by executing the program in the memory by a processor. In addition, when all or part of the functions in the above embodiments are realized by a computer program, the program can also be stored in a storage medium such as a server, another computer, a disk, an optical disk, a flash disk, or a mobile hard disk, and is saved in a memory of a local device by downloading or copying, or the system of the local device is updated, and the above functions are realized by executing the program in the memory by a processor.

[0081] The above application of specific examples to the present application is described, which is only used to help understand the present application and does not limit the present application. For those skilled in the art, according to the idea of the present application, a number of simple deductions, deformations or substitutions can be made.

Claims

1. A good product screening method of a heating element of an electronic atomization device, characterized by, The method comprises the following steps: acquiring a thermal imaging image of the heating element, the thermal imaging image comprising a plurality of sub-region thermal imaging images; acquiring an average temperature of each of the sub-region thermal imaging images; setting a plurality of temperature monitoring points in each of the sub-region thermal imaging images; acquiring a temperature of each of the temperature monitoring points; calculating a temperature variance of the corresponding sub-region thermal imaging image according to the temperatures of the plurality of temperature monitoring points in each of the sub-region thermal imaging images; screening a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images.

2. The good product screening method according to claim 1, wherein The step of acquiring the thermal imaging image of the heating element, the thermal imaging image comprising a plurality of sub-region thermal imaging images, comprises the following steps: dividing the heating element into a plurality of sub-regions by a dividing line, and placing the heating element at a preset position; acquiring a thermal imaging image of the heating element at the preset position by an infrared thermal imager, the thermal imaging image comprising a plurality of sub-region thermal imaging images.

3. The good product screening method according to claim 2, wherein The heating element comprises an upper heating body and a lower heating body, and the step of dividing the heating element into a plurality of sub-regions by a dividing line comprises the following steps: dividing the upper heating body into a plurality of sub-regions by a dividing line; dividing the lower heating body into a plurality of sub-regions by a dividing line.

4. The good product screening method according to Claim 1, wherein The step of calculating a temperature variance of the corresponding sub-region thermal imaging image according to the temperatures of the plurality of temperature monitoring points in each of the sub-region thermal imaging images comprises the following steps: calculating an average temperature of the temperature monitoring points in the corresponding sub-region according to the temperatures of the plurality of temperature monitoring points in each of the sub-region thermal imaging images; calculating a temperature variance of the corresponding sub-region thermal imaging image according to the average temperature of the temperature monitoring points in the corresponding sub-region and the temperatures of the plurality of temperature monitoring points in the corresponding sub-region.

5. The good product screening method according to Claim 4, wherein The calculation formula of the temperature variance of the sub-region thermal imaging image is as follows: In the formula, S 2 represents the temperature variance, M represents the average temperature, T n represents the temperature of the nth temperature monitoring point in the sub-region, where n≥8.

6. The good product screening method according to Claim 1, wherein The step of screening a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images comprises the following steps: determining whether the average temperature of each of the sub-region thermal imaging images is within a preset range, and determining whether the temperature variance of each of the sub-region thermal imaging images is less than a preset value; if yes, determining that the current heating element is a good product, otherwise, determining that the current heating element is a defective product.

7. A good product screening system of a heating element of an electronic atomizing device, characterized in that, The method comprises the following steps: an image acquisition module, configured to acquire a thermal imaging image of the heating element, the thermal imaging image comprising a plurality of sub-region thermal imaging images; a first temperature acquisition module, configured to acquire an average temperature of each of the sub-region thermal imaging images; a monitoring point setting module, configured to set a plurality of temperature monitoring points in each of the sub-region thermal imaging images; a second temperature acquisition module, configured to acquire a temperature of each of the temperature monitoring points; a calculation module, configured to calculate a temperature variance of the corresponding sub-region thermal imaging image according to the temperatures of the plurality of temperature monitoring points in each of the sub-region thermal imaging images; a screening module, configured to screen a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images.

8. The good screening system according to claim 7, wherein In the screening module, the step of screening a good heating element according to the average temperature and the temperature variance of each of the sub-region thermal imaging images comprises the following steps: determining whether the average temperature of each of the sub-region thermal imaging images is within a preset range, and determining whether the temperature variance of each of the sub-region thermal imaging images is less than a preset value; if yes, determining that the current heating element is a good product, otherwise, determining that the current heating element is a defective product.

9. A computer-readable storage medium, characterized in that, The medium has stored thereon a computer program, which can be executed by a processor to implement the method of any one of claims 1-6.

10. A computer program product comprising computer programs and / or instructions, characterized in that, The computer program and / or instructions, when executed by a processor, implement the method of any one of claims 1-6.