Laser processing device, laser processing apparatus, and laser processing control method

Abstract

The invention discloses a laser processing device, laser processing equipment and a laser processing control method.The laser processing device comprises a first laser device, a second laser device, a processing head, a first reflection assembly, a second reflection assembly and a third reflection assembly, the first reflection assembly is arranged on an emergent light path of the first laser, the second reflection assembly is arranged on an emergent light path of the second laser, and the third reflection assembly is arranged on reflection light paths of the first reflection assembly and the second reflection assembly. And light reflected by the first reflection assembly and the second reflection assembly can be reflected to the machining head through the third reflection assembly. According to the method, the plate can be processed based on the laser emitted by the first laser or the laser emitted by the second laser or simultaneously processed based on the laser emitted by the first laser and the laser emitted by the second laser according to needs, so that various processing methods are realized, and the method is suitable for various application scenes and high in practicability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser processing device, a laser processing equipment and a laser processing control method. BACKGROUND

[0002] Laser processing technology is a processing technology that uses the characteristics of laser beam and material interaction to cut, weld, surface treat, punch and micro-process materials. At present, laser processing has been widely applied in the processing field of PCB materials.

[0003] However, the laser forming equipment on the market can only be applied singly. The picosecond laser cannot cut the copper foil, and the nanosecond laser cannot cut the cover film, so it cannot realize one machine for multiple scene applications. SUMMARY

[0004] In order to overcome the problems existing in the prior art, the main purpose of the present application is to provide a laser processing device and a laser processing control method which can be applied in multiple scenes.

[0005] In order to achieve the above purpose, the following technical solutions are adopted in the present application:

[0006] The present application provides a laser processing device, which comprises a processing head, a first laser, a second laser, a first reflection assembly, a second reflection assembly and a third reflection assembly.

[0007] The first laser is used to emit first laser, and the second laser is used to emit second laser.

[0008] The first reflection assembly is arranged on the exit light path of the first laser and constitutes a first light path with the first laser, and the first light path is used to reflect the first laser to the third reflection assembly.

[0009] The second reflection assembly is arranged on the exit light path of the second laser and constitutes a second light path with the second laser, and the second light path is used to reflect the second laser to the third reflection assembly.

[0010] The third reflection assembly is arranged on the reflection light path of the first reflection assembly and the second reflection assembly, and is used to reflect the laser reflected by the first light path or the laser reflected by the second light path to the processing head, or is used to reflect the laser reflected by the first light path and the laser reflected by the second light path to the processing head after being combined.

[0011] In some embodiments, the first laser emits first laser light with a pulse width different from a pulse width of second laser light emitted by the second laser, so that the first laser light and the second laser light can cut different materials of a workpiece to be processed, wherein the workpiece to be processed includes a first material and a second material covering and adhering to the first material, the first material includes a copper foil, and the second material includes a cover film.

[0012] In some embodiments, the third reflection assembly has an arc-shaped reflection surface for reflecting the first light path reflected laser light or the second light path reflected laser light to the processing head, or for reflecting the first light path reflected laser light and the second light path reflected laser light after being combined to the processing head.

[0013] In some embodiments, the first reflection assembly includes a first mirror and a second mirror, and the second reflection assembly includes a third mirror and a fourth mirror.

[0014] The first laser emits laser light at an incident angle α on the first mirror, 30°≤α≤60°, the first mirror reflects laser light at an incident angle β on the second mirror, 0≤β≤45°, the second laser emits laser light at an incident angle δ on the third mirror, 30°≤δ≤60°, and the third mirror reflects laser light at an incident angle γ on the fourth mirror, 0≤γ≤45°.

[0015] In some embodiments, the processing head is provided in plurality, and the laser processing device further includes a light splitting assembly arranged on a reflection light path of the third reflection assembly, for splitting the third reflection assembly reflected laser light into multiple beams of laser light, so that each beam of the laser light is respectively incident into each of the processing heads.

[0016] In some embodiments, the processing head includes a first processing head and a second processing head, the light splitting assembly includes a 1 / 2 wave plate, a light splitting lens, and a fifth mirror, the 1 / 2 wave plate and the light splitting lens are arranged in sequence on the reflection light path of the third reflection assembly, the fifth mirror is arranged on a lens light path of the light splitting lens, the first processing head is arranged on a reflection light path of the light splitting lens, and the second processing head is arranged on a reflection light path of the fifth mirror.

[0017] In some embodiments, the processing head and the third reflection assembly are respectively provided in plurality, and the laser processing device further includes a first light splitting assembly and a second light splitting assembly, the first light splitting assembly is arranged on an exit light path of the first laser, for splitting the first laser emitted laser light into multiple beams of first laser light, so that multiple beams of the first laser light are reflected to each of the processing heads in sequence through the first reflection assembly and each of the third reflection assemblies.

[0018] The second light splitting assembly is arranged on the light path of the second laser, and is used for splitting the laser emitted by the second laser into a plurality of second laser beams, so that the plurality of second laser beams are reflected to the machining heads in turn via the second reflecting assembly and each third reflecting assembly.

[0019] In some embodiments, the first light splitting assembly comprises a first 1 / 2 wave plate and a first light splitting lens, and the first 1 / 2 wave plate and the first light splitting lens are arranged on the light path of the first laser in turn.

[0020] The second light splitting assembly comprises a second 1 / 2 wave plate and a second light splitting lens, and the second 1 / 2 wave plate and the second light splitting lens are arranged on the light path of the second laser in turn.

[0021] In some embodiments, the third reflecting assembly comprises a rotating mechanism and a sixth reflecting mirror, the sixth reflecting mirror is arranged on the rotating mechanism and located on the light path of the first reflecting assembly and the second reflecting assembly, and the rotating mechanism is used for driving the sixth reflecting mirror to rotate between a first state and a second state.

[0022] When the sixth reflecting mirror is in the first state, the laser emitted by the first laser can be reflected to the machining head in turn via the first reflecting assembly and the sixth reflecting mirror; and when the sixth reflecting mirror is in the second state, the laser emitted by the second laser can be reflected to the machining head in turn via the second reflecting assembly and the sixth reflecting mirror.

[0023] In some embodiments, the first laser is a picosecond laser, and the second laser is a nanosecond laser.

[0024] Correspondingly, the application also provides a laser processing device, which comprises a workbench and a laser processing apparatus as described in any one of the above embodiments.

[0025] Correspondingly, the application also provides a laser processing control method, which is applied to a laser processing apparatus, and the laser processing apparatus comprises a first laser, a second laser, a rotating mechanism, a sixth reflecting mirror, a machining head and a control card. The laser processing control method comprises the following steps.

[0026] When the first laser is used for processing, the control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to a first state.

[0027] When the sixth reflecting mirror rotates to the first state, the control card controls the first laser to emit laser, so that the laser is reflected to the machining head via the sixth reflecting mirror.

[0028] In the processing with the second laser, the control card controls the rotating mechanism to rotate, so as to drive the sixth mirror to rotate to a second state;

[0029] When the sixth mirror rotates to the second state, the control card controls the second laser to emit laser, and the laser is reflected to the processing head through the sixth mirror.

[0030] In some embodiments, the control card controls the rotating mechanism to rotate, so as to drive the sixth mirror to rotate to a first state, specifically:

[0031] The control card controls the rotating mechanism to rotate by a preset angle around a first direction, so as to drive the sixth mirror to rotate to the first state, wherein the first direction is perpendicular to the direction of the laser emitted to the sixth mirror.

[0032] The control card controls the rotating mechanism to rotate, so as to drive the sixth mirror to rotate to a second state, specifically:

[0033] The control card controls the rotating mechanism to rotate by a preset angle around the first direction, so as to drive the sixth mirror to rotate to the second state.

[0034] In some embodiments, the control card controls the rotating mechanism to rotate, so as to drive the sixth mirror to rotate to a first state, specifically:

[0035] The control card controls the rotating mechanism to rotate by a preset angle around a second direction, so as to drive the sixth mirror to rotate to the first state, wherein the second direction is parallel to the direction of the laser emitted to the sixth mirror.

[0036] The control card controls the rotating mechanism to rotate, so as to drive the sixth mirror to rotate to a second state, specifically:

[0037] The control card controls the rotating mechanism to rotate by a preset angle around the second direction, so as to drive the sixth mirror to rotate to the second state.

[0038] Compared with the prior art, the laser processing device of the application comprises a first laser, a second laser, a processing head, a first reflection assembly, a second reflection assembly and a third reflection assembly, the first laser is used to emit a first laser, the second laser is used to emit a second laser, the first reflection assembly is arranged on the exit light path of the first laser and constitutes a first light path with the first laser, the second reflection assembly is arranged on the exit light path of the second laser and constitutes a second light path with the second laser, the third reflection assembly is arranged on the reflected light paths of the first reflection assembly and the second reflection assembly, the first light path is used to reflect the first laser to the third reflection assembly, the second light path is used to reflect the second laser to the third reflection assembly, and the third reflection assembly is used to reflect the laser reflected by the first light path or the laser reflected by the second light path to the processing head, or is used to reflect the laser reflected by the first light path and the laser reflected by the second light path to the processing head after the laser reflected by the first light path and the laser reflected by the second light path are combined, so that the processing head can process the plate according to the laser emitted by the first laser, or process the plate according to the laser emitted by the second laser, or process the plate according to the lasers emitted by the first laser and the second laser. The application combines the lasers of multiple different light sources together to achieve the purpose of sharing the processing head and applying multiple application scenarios with one machine. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0040] Figure 1 The structural schematic diagram of the laser processing device provided by the embodiment of the application.

[0041] Figure 2 The structural schematic diagram of the laser processing device provided by another embodiment of the application.

[0042] Figure 3 The structural schematic diagram of the laser processing device provided by another embodiment of the application.

[0043] Figure 4 The structural schematic diagram of the laser processing device provided by another embodiment of the application.

[0044] Figure 5 The structural schematic diagram of the laser processing device provided by another embodiment of the application. Figure 4 The structural schematic diagram of another working state of the laser processing device.

[0045] Figure 6 The structural schematic diagram of another working state of the laser processing device. Figure 4 The structural schematic diagram of the rotating mechanism of the laser processing device.

[0046] Figure 7 Figure 1 is a schematic diagram of a laser processing device according to an embodiment of the present application. Figure 4 Figure 2 is a schematic diagram of a rotating mechanism of the laser processing device according to an embodiment of the present application.

[0047] Figure 8 Figure 3 is a schematic diagram of a rotating mechanism equipped with a sixth mirror according to an embodiment of the present application. Figure 4 Figure 4 is a schematic diagram of a rotating mechanism equipped with a sixth mirror according to an embodiment of the present application.

[0048] Figure 9 Figure 5 is a flow chart of a laser processing control method according to an embodiment of the present application. Figure 4 Figure 6 is a flow chart of a laser processing control method according to an embodiment of the present application.

[0049] Figure 10 Figure 7 is a flow chart of a laser processing control method according to an embodiment of the present application.

[0050] Reference signs:

[0051] 1, first laser; 2, second laser; 3, processing head; 31, first processing head; 32, second processing head; 4, first reflecting assembly; 41, first mirror; 42, second mirror; 5, second reflecting assembly; 51, third mirror; 52, fourth mirror; 6, third reflecting assembly; 61, convex mirror; 62, first convex mirror; 63, second convex mirror; 64, rotating mechanism; 641, mounting seat; 642, rotating table; 642a, mounting surface; 642b, first scale line; 643, knob; 643a, second scale line; 65, sixth mirror; 651, first reflecting surface; 652, second reflecting surface; 7, light splitting assembly; 71, 1 / 2 wave plate; 72, light splitting lens; 73, fifth mirror; 8, first light splitting assembly; 81, first 1 / 2 wave plate; 82, first light splitting lens; 83, seventh mirror; 9, second light splitting assembly; 91, second 1 / 2 wave plate; 92, second light splitting lens; 93, eighth mirror; 10, ninth mirror; 11, tenth mirror; 100, control card. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0053] In the description of the present application, unless otherwise explicitly specified and limited, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated, the term "multiple" means two or more, and the term "multiple" means two or more; the terms "connection", "fixation" and the like should be interpreted broadly, for example, "connection" can be fixed connection, or detachable connection, or integral connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] In the description of the present application, it should be understood that the "up", "down" and other orientation words described in the embodiments of the present application are described from the angle shown in the drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when referring to one element connected to another element "on" or "below", it can be directly connected to another element "on" or "below", or indirectly connected to another element "on" or "below" through an intermediate element.

[0055] Referring to Figure 1 As shown in the drawings, the embodiments of the present application disclose a laser processing device, which comprises a first laser 1, a second laser 2, a processing head 3, a first reflection assembly 4, a second reflection assembly 5, a third reflection assembly 6 and a controller (not shown in the figure). The first laser 1 is used to emit first laser, and the second laser 2 is used to emit second laser. The first laser and the second laser can be laser with same wavelength and different pulse width, so that different materials can be cut by the first laser and the second laser. The first reflection assembly 4 is arranged on the exit light path of the first laser 1, and forms a first light path with the first laser 1, which is used to reflect the first laser emitted by the first laser 1 to the third reflection assembly 6. The second reflection assembly 5 is arranged on the exit light path of the second laser 2, and forms a second light path with the second laser 2, which is used to reflect the second laser emitted by the second laser 2 to the third reflection assembly 6. The third reflection assembly 6 is arranged on the reflection light path of the first reflection assembly 4 and the second reflection assembly 5, and the processing head 3 is arranged on the reflection light path of the third reflection assembly 6. The third reflection assembly 6 is used to reflect the first laser reflected by the first reflection assembly 4 and the second laser reflected by the second reflection assembly 5 to the processing head 3, so that the processing head 3 can process the PCB based on the first laser and / or the second laser. The controller is electrically connected with the first laser 1, the second laser 2 and the processing head 3 respectively, and is used to control the work of the first laser 1, the second laser 2 and the processing head 3. In the figure, the dashed line represents the laser beam.

[0056] In the embodiment, the first laser 1 can be a picosecond laser, which is used to cut thin materials such as plastic, glass, etc. The second laser 2 can be a nanosecond laser, which is used to cut thick materials such as metal plates, ceramics, etc. The embodiment is provided with two different lasers to adapt to different processing materials. It can be understood that in other embodiments, the first laser 1 and the second laser 2 can also be other types of lasers. For example, the laser processing device can be used to cut different materials of the workpiece to be processed. The workpiece to be processed can be a flexible printed circuit (FPC for short), or the workpiece to be processed can include a first material and a second material covering and adhering to the first material. The first material includes copper foil, etc., and the second material includes a cover film, etc. Specifically, one workpiece to be processed can contain different materials, or different workpieces to be processed have different materials.

[0057] When processing the PCB, if the first laser 1 is used for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on, so that the first laser 1 emits the first laser. The first laser is reflected to the processing head 3 in sequence through the first reflecting assembly 4 and the third reflecting assembly 6, so that the processing head 3 can process the PCB based on the first laser. If the second laser 2 is used for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on, so that the second laser 2 emits the second laser. The second laser is reflected to the processing head 3 in sequence through the second reflecting assembly 5 and the third reflecting assembly 6, so that the processing head 3 can process the PCB based on the second laser. If the first laser 1 and the second laser 2 are used for simultaneous processing, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits the first laser and the second laser 2 emits the second laser. At this time, the first laser is reflected to the third reflecting assembly 6 in sequence through the first reflecting assembly 4, and the second laser is reflected to the third reflecting assembly 6 in sequence through the second reflecting assembly 5. The third reflecting assembly 6 reflects the first laser and the second laser after being combined into a beam to the processing head 3, thereby achieving the purpose of simultaneously processing the PCB by using the first laser and the second laser.

[0058] Continuing to refer to Figure 1As shown, the first reflecting assembly 4 includes a first mirror 41 and a second mirror 42, the second reflecting assembly 5 includes a third mirror 51 and a fourth mirror 52, and the third reflecting assembly 6 includes a convex mirror 61 provided with an arc-shaped reflecting surface. In installation, the first mirror 41 is arranged on the light path of the first laser 1, and the second mirror 42 is arranged on the light path of the first mirror 41. The third mirror 51 is arranged on the light path of the second laser 2, and the fourth mirror 52 is arranged on the light path of the third mirror 51. The convex mirror 61 is arranged on the light path of the second mirror 42 and the fourth mirror 52. When the first laser 1 emits the first laser, the first laser can be reflected by the first mirror 41 and the second mirror 42 to the convex mirror 61, and then reflected by the arc-shaped reflecting surface of the convex mirror 61 to the machining head 3. When the second laser 2 emits the second laser, the second laser can be reflected by the third mirror 51 and the fourth mirror 52 to the convex mirror 61, and then reflected by the arc-shaped reflecting surface of the convex mirror 61 to the machining head 3.

[0059] In the embodiment, the third reflecting assembly 6 includes the convex mirror 61 provided with the outward convex arc-shaped reflecting surface. In other embodiments, the third reflecting assembly 6 can also include a concave mirror provided with an inward concave arc-shaped reflecting surface.

[0060] Specifically, the incident angle of the laser emitted by the first laser 1 on the first mirror 41 is α, and 30°≤α≤60°. The incident angle of the laser reflected by the first mirror 41 on the second mirror 42 is β, and 0≤β≤45°. The incident angle of the laser emitted by the second laser 2 on the third mirror 51 is δ, and 30°≤δ≤60°. The incident angle of the laser reflected by the third mirror 51 on the fourth mirror 52 is γ, and 0≤γ≤45°. In actual application, the deflection angles of the first mirror 41, the second mirror 42, the third mirror 51 and the fourth mirror 52 can be adjusted to make the point and the reflection angle of the laser reflected by the second mirror 42 to the convex mirror 61 the same as the point and the reflection angle of the laser reflected by the fourth mirror 52 to the convex mirror 61. At the same time, whether the incident light of the machining head 3 is centered can be observed, and the laser paths emitted by the first laser 1 and the second laser 2 can be adjusted to be consistent by fine-tuning the deflection angles of the first mirror 41, the second mirror 42, the third mirror 51 and the fourth mirror 52.

[0061] In the embodiment, the laser paths between the first laser 1 and the first mirror 41, between the second laser 2 and the third mirror 51, and between the convex mirror 61 and the machining head 3 are arranged in parallel. The curvature radius of the convex mirror 61 can be infinitely large or infinitely small according to the distance from the second mirror 42 and the fourth mirror 52.

[0062] The embodiment can realize various processing modes. For example, if only one laser is used for processing, only the corresponding laser needs to be controlled to emit laser for processing; if two lasers are used for alternate processing, the two lasers are used for alternate processing on the same workpiece to be processed; if two lasers are used for combined processing, the two lasers are controlled to emit laser for processing at the same time, so that the laser processing device can be applied to various application scenarios and has high practicability.

[0063] Based on the above embodiment, another specific embodiment is disclosed, as shown in Figure 2 The difference between the embodiment and the above embodiment is that the processing head is provided in the embodiment, and the laser processing device further comprises a light splitting assembly 7. The light splitting assembly 7 is arranged on the reflection light path of the convex mirror 61, and is used to split the laser reflected by the convex mirror 61 into multiple beams of laser and make each beam of laser enter each processing head, so as to process the PCB board by the multiple processing heads at the same time.

[0064] Continuing to refer to Figure 2 The processing head comprises a first processing head 31 and a second processing head 32, and the light splitting assembly 7 comprises a 1 / 2 wave plate 71, a light splitting lens 72 and a fifth mirror 73. The 1 / 2 wave plate 71 is arranged on the reflection light path of the convex mirror 61, the light splitting lens 72 is arranged on the transmission light path of the 1 / 2 wave plate 71, and the fifth mirror 73 is arranged on the transmission light path of the light splitting lens 72. The first processing head 31 is arranged on the reflection light path of the light splitting lens 72, and the second processing head 32 is arranged on the reflection light path of the fifth mirror 73. The 1 / 2 wave plate is used to change the polarization direction of the laser beam, and the light splitting lens is used to split the incident light into two different beams at a specified ratio.

[0065] In actual application, the deflection angles of the first mirror 41, the second mirror 42, the third mirror 51 and the fourth mirror 52 can be adjusted, so that the point and reflection angle of the second mirror 42 reflected to the convex mirror 61 are the same as the point and reflection angle of the fourth mirror 52 reflected to the convex mirror 61. Then, the laser is split into two beams of light with different polarization directions by the 1 / 2 wave plate, and then the light is split into one beam of transmission light and one beam of reflection light by the light splitting lens 72. Each beam of light after splitting by the light splitting lens 72 enters each processing head.

[0066] When processing, if the first laser 1 is used for processing, the corresponding parameters of the first laser 1 are set, and the first laser 1 is controlled to be turned on, so that the first laser 1 emits first laser, which is reflected to the convex mirror 61 through the first mirror 41 and the second mirror 42, and is reflected to the 1 / 2 wave plate 71 through the convex mirror 61, and then is emitted into the beam splitter 72 after changing the polarization direction of the laser through the 1 / 2 wave plate 71, so as to split the light through the beam splitter 72, wherein part of the laser is reflected by the beam splitter 72 and then is emitted into the first processing head 31, and another part of the laser is transmitted through the beam splitter 72 and then is emitted into the fifth mirror 73, and then is reflected into the second processing head 32 through the fifth mirror 73, so that the first processing head 31 and the second processing head 32 can process the PCB based on the laser emitted by the first laser 1 at the same time. If the second laser 2 is used for processing, the corresponding parameters of the second laser 2 are set, and the second laser 2 is controlled to be turned on, so that the second laser 2 emits second laser, which is reflected to the convex mirror 61 through the third mirror 51 and the fourth mirror 52, and is reflected to the 1 / 2 wave plate 71 through the convex mirror 61, and then is emitted into the beam splitter 72 after changing the polarization direction of the laser through the 1 / 2 wave plate 71, so as to split the light through the beam splitter 72, wherein part of the laser is reflected by the beam splitter 72 and then is emitted into the first processing head 31, and another part of the laser is transmitted through the beam splitter 72 and then is emitted into the fifth mirror 73, and then is reflected into the second processing head 32 through the fifth mirror 73, so that the first processing head 31 and the second processing head 32 can process the PCB based on the laser emitted by the second laser 2 at the same time. If the first laser 1 and the second laser 2 are used for processing at the same time, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits first laser and the second laser 2 emits second laser, at this time, the first laser is reflected to the convex mirror 61 through the first mirror 41 and the second mirror 42, and the second laser is reflected to the convex mirror 61 through the third mirror 51 and the fourth mirror 52, and then the first laser and the second laser are combined through the convex mirror 61 and then are reflected to the 1 / 2 wave plate 71, and then are emitted into the beam splitter 72 after changing the polarization direction of the laser through the 1 / 2 wave plate 71, so as to split the light through the beam splitter 72, wherein part of the laser is reflected by the beam splitter 72 and then is emitted into the first processing head 31, and another part of the laser is transmitted through the beam splitter 72 and then is emitted into the fifth mirror 73, and then is reflected into the second processing head 32 through the fifth mirror 73, so that the first processing head 31 and the second processing head 32 can process the PCB based on the laser emitted by the first laser 1 and the second laser 2 at the same time.

[0067] The embodiment can realize various processing modes. For example, if only one of the lasers is used for processing, only the corresponding laser needs to be controlled to emit laser for processing; if two lasers are used for alternate processing, the two lasers are used for alternate processing on the same workpiece to be processed; if two lasers are used for combined processing, the two lasers are controlled to emit laser for processing at the same time, so that the laser processing device can be applied to various application scenarios and has high practicability.

[0068] Based on the above embodiment, the application further discloses another specific implementation mode, as shown in Figure 3 The difference between the embodiment and the above embodiment is that in the embodiment, the processing head and the convex mirror are respectively provided with multiple ones, and the laser processing device further comprises a first light splitting assembly 8 and a second light splitting assembly 9. The first light splitting assembly 8 is arranged on an exit light path of the first laser 1 and is used for splitting the laser emitted by the first laser 1 into multiple first laser beams, so that the multiple first laser beams are reflected to the multiple processing heads in sequence through the first reflecting assembly 4 and the multiple convex mirrors. The second light splitting assembly 9 is arranged on an exit light path of the second laser 2 and is used for splitting the laser emitted by the second laser 2 into multiple second laser beams, so that the multiple second laser beams are reflected to the multiple processing heads in sequence through the second reflecting assembly 5 and the multiple convex mirrors.

[0069] Continuing to refer to Figure 3As shown, the machining head includes a first machining head 31 and a second machining head 32, the third reflection assembly 6 includes a first convex mirror 62 and a second convex mirror 63, the first reflection assembly 4 includes a first mirror 41 and a second mirror 42, the second reflection assembly 5 includes a third mirror 51 and a fourth mirror 52, the first light splitting assembly 8 includes a first 1 / 2 wave plate 81, a first light splitting lens 82 and a seventh mirror 83, the second light splitting assembly 9 includes a second 1 / 2 wave plate 91, a second light splitting lens 92 and an eighth mirror 93, and the laser machining device further includes a ninth mirror 10 and a tenth mirror 11. When installed, the first 1 / 2 wave plate 81 is arranged on the outgoing light path of the first laser 1, the first light splitting lens 82 is arranged on the transmission light path of the first 1 / 2 wave plate 81, the first mirror 41 is arranged on the reflection light path of the first light splitting lens 82, the seventh mirror 83 is arranged on the transmission light path of the first light splitting lens 82, and the second mirror 42 is arranged on the reflection light path of the seventh mirror 83. The second 1 / 2 wave plate 91 is arranged on the outgoing light path of the second laser 2, the second light splitting lens 92 is arranged on the transmission light path of the second 1 / 2 wave plate 91, the third mirror 51 is arranged on the reflection light path of the second light splitting lens 92, the eighth mirror 93 is arranged on the transmission light path of the second light splitting lens 92, and the fourth mirror 52 is arranged on the reflection light path of the eighth mirror 93. The first convex mirror 62 is arranged on the reflection light paths of the first mirror 41 and the third mirror 51, and the second convex mirror 63 is arranged on the reflection light paths of the second mirror 42 and the fourth mirror 52. The ninth mirror 10 is arranged on the reflection light path of the first convex mirror 62, and the tenth mirror 11 is arranged on the reflection light path of the second convex mirror 63. The first machining head 31 is arranged on the reflection light path of the ninth mirror 10, and the second machining head 32 is arranged on the reflection light path of the tenth mirror 11.

[0070] In this embodiment, the laser emitted by the first laser 1 can first pass through the first 1 / 2 wave plate 81 and the first light splitting lens 82 to divide the light beam into two beams, and the two beams are reflected by the first mirror 41, the second mirror 42, the first convex mirror 62 and the second convex mirror 63 to the first machining head 31 and the second machining head 32, respectively. The laser emitted by the second laser 2 can first pass through the second 1 / 2 wave plate 91 and the second light splitting lens 92 to divide the light beam into two beams, and the two beams are reflected by the third mirror 51, the fourth mirror 52, the first convex mirror 62 and the second convex mirror 63 to the first machining head 31 and the second machining head 32, respectively.

[0071] In processing, if the first laser 1 is used for processing, the corresponding parameters of the first laser 1 are set, the first laser 1 is controlled to be turned on, the first laser is emitted by the first laser 1, the polarization direction of the first laser is changed after the first 1 / 2 wave plate 81, and the first laser is transmitted into the first beam splitter 82, so that part of the first laser is reflected to the first mirror 41 through the first beam splitter 82, and then reflected to the first convex mirror 62 through the first mirror 41, the first convex mirror 62 reflects the first laser to the ninth mirror 10 and reflects to the first processing head 31 through the ninth mirror 10, and the other part of the first laser is transmitted to the seventh mirror through the first beam splitter 82, and then reflected to the second convex mirror 63 through the seventh mirror 83 and the second mirror 42, the second convex mirror 63 reflects the first laser to the tenth mirror 11 and reflects to the second processing head 32 through the tenth mirror 11, so that the first processing head 31 and the second processing head 32 can process the plate based on the laser emitted by the first laser 1. If the second laser 2 is used for processing, the corresponding parameters of the second laser 2 are set, the second laser 2 is controlled to be turned on, the second laser is emitted by the second laser 2, the polarization direction of the second laser is changed after the second 1 / 2 wave plate 91, and the second laser is transmitted into the second beam splitter 92, so that part of the second laser is reflected to the third mirror 51 through the second beam splitter 92, and then reflected to the first convex mirror 62 through the third mirror 51, the first convex mirror 62 reflects the second laser to the ninth mirror 10 and reflects to the first processing head 31 through the ninth mirror 10, and the other part of the second laser is transmitted to the eighth mirror 93 through the second beam splitter 92, and then reflected to the second convex mirror 63 through the eighth mirror 93 and the fourth mirror 52, the second convex mirror 63 reflects the second laser to the tenth mirror 11 and reflects to the second processing head 32 through the tenth mirror 11, so that the first processing head 31 and the second processing head 32 can process the plate based on the laser emitted by the second laser 2.If the first laser 1 and the second laser 2 are used for simultaneous processing, the corresponding parameters of the first laser 1 and the second laser 2 are set, and the first laser 1 and the second laser 2 are controlled to be turned on, so that the first laser 1 emits the first laser and the second laser 2 emits the second laser. The first laser is transmitted into the first beam splitter 82 after the polarization direction is changed by the first 1 / 2 wave plate 81, so that part of the first laser is reflected to the first mirror 41 through the first beam splitter 82, reflected to the first convex mirror 62 through the first mirror 41, and another part of the first laser is transmitted to the seventh mirror 83 through the first beam splitter 82, and then reflected to the second convex mirror 63 through the seventh mirror 83 and the second mirror 42 in sequence. At the same time, the second laser is transmitted into the second beam splitter 92 after the polarization direction is changed by the second 1 / 2 wave plate 91, so that part of the second laser is reflected to the third mirror 51 through the second beam splitter 92, and then reflected to the first convex mirror 62 through the third mirror 51, and another part of the second laser is transmitted to the eighth mirror 93 through the second beam splitter 92, and then reflected to the second convex mirror 63 through the eighth mirror 93 and the fourth mirror 52 in sequence. Then the first laser and the second laser are combined and reflected to the ninth mirror 10 through the first convex mirror 62, and then reflected to the first processing head 31 through the ninth mirror 10, and the first laser and the second laser are combined and reflected to the tenth mirror 11 through the second convex mirror 63, and then reflected to the second processing head 32 through the tenth mirror 11.

[0072] The embodiment can realize various processing modes. For example, if only one laser is used for processing, the corresponding laser is controlled to emit laser for processing. If double lasers are used for alternate processing, double lasers are used for alternate processing on the same workpiece to be processed. If double lasers are used for combined processing, the two lasers are controlled to emit laser for processing products, so that the laser processing device can be applied to various application scenarios and has high practicability.

[0073] Based on the above embodiment, another specific implementation manner is disclosed in the embodiment of the application, which is described with reference to Figure 4 and Figure 5The difference between the embodiment and the above embodiment is that, in the embodiment, the third reflecting assembly 6 comprises a rotating mechanism and a sixth reflecting mirror 65, the sixth reflecting mirror 65 is arranged on the rotating mechanism and located on the reflecting light path of the first reflecting assembly 4 and the second reflecting assembly 5, and the rotating mechanism is used to drive the sixth reflecting mirror 65 to rotate between the first state and the second state. When the sixth reflecting mirror 65 is in the first state, the laser emitted by the first laser 1 can be reflected to the machining head 3 in sequence through the first reflecting assembly 4 and the sixth reflecting mirror 65, so that the machining head 3 can process the plate based on the laser emitted by the first laser 1. When the sixth reflecting mirror 65 is in the second state, the laser emitted by the second laser 2 can be reflected to the machining head 3 in sequence through the second reflecting assembly 5 and the sixth reflecting mirror 65, so that the machining head 3 can process the plate based on the laser emitted by the second laser 2.

[0074] Specifically, the laser processing device further comprises a control card 100, the first reflecting assembly 4 comprises a first reflecting mirror 41, and the second reflecting assembly 5 comprises a third reflecting mirror 51. The first reflecting mirror 41 is arranged on the light path of the first laser 1, the second reflecting mirror 42 is arranged on the light path of the second laser 2, and the sixth reflecting mirror 65 is arranged on the reflecting light path of the first reflecting mirror 41 and the third reflecting mirror 51. The control card 100 is connected with the first laser 1, the second laser 2, the rotating mechanism and the machining head 3, and is used to control the working of the first laser 1, the second laser 2, the rotating mechanism and the machining head 3.

[0075] In the processing, if the first laser 1 is needed to be used for processing, the rotating mechanism is controlled to rotate by the control card 100, so as to drive the sixth reflecting mirror 65 to rotate to the first state, the corresponding parameters of the first laser 1 are set, the first laser 1 is controlled to be turned on by the control card 100, the first laser 1 emits the first laser, the first laser is reflected to the machining head 3 in sequence through the first reflecting mirror 41 and the sixth reflecting mirror 65, so that the machining head 3 can process the PCB based on the laser emitted by the first laser 1. If the second laser 2 is needed to be used for processing, the rotating mechanism is controlled to rotate by the control card 100, so as to drive the sixth reflecting mirror 65 to rotate to the second state, the corresponding parameters of the second laser 2 are set, the second laser 2 is controlled to be turned on by the control card, the second laser 2 emits the second laser, the second laser is reflected to the machining head 3 in sequence through the third reflecting mirror 51 and the sixth reflecting mirror 65, so that the machining head 3 can process the PCB based on the laser emitted by the second laser 2. The embodiment can realize two laser processing modes, without the need to purchase two laser forming devices, so as to reduce the occupied space of the laser processing device and reduce the cost.

[0076] Reference Figure 6 and Figure 7As shown, the rotating mechanism 64 includes a mounting base 641, a driving component (not shown), a rotating platform 642, and a mounting bracket (not shown). The rotating platform 642 is rotatably connected to the mounting base 641 and has a mounting surface 642a and a first scale line 642b. The first scale line 642b is distributed along the circumference of the rotating platform 642 and is used to detect the rotation angle of the rotating platform 642. The mounting surface 642a has a mounting hole, and the mounting bracket is disposed in the mounting hole for mounting the sixth reflector 65. The driving component is mounted on the mounting base 641 and connected to the rotating platform 642, and is used to drive the rotating platform 642 to rotate, thereby causing the sixth reflector 65 to rotate between a first state and a second state.

[0077] In this embodiment, the rotating mechanism 64 further includes a transmission assembly. The driving component can be a motor, which is connected to the rotary table 642 via the transmission assembly to drive the rotary table 642 to rotate. The transmission assembly can be a worm gear transmission assembly or a gear transmission assembly. In this embodiment, the rotary table 642 is driven to rotate by a motor, which can accurately control the speed and position of the rotary table 642, thereby improving the accuracy of the rotation angle of the rotary table 642. It is understood that in other embodiments, the driving component can also be a rotary cylinder.

[0078] To more precisely control the rotation angle of the rotary table 642, the rotating mechanism 64 also includes a knob 643. The knob 643 is mounted on the mounting base 641 and connected to the rotary table 642. Rotating the knob 643 causes the rotary table 642 to rotate, allowing for fine-tuning of its rotation angle. Simultaneously, a second scale line 643a is provided along the outer surface of the knob 643. This second scale line 643a is distributed circumferentially around the knob 643 and is used to detect the rotation angle of the knob 643, thereby detecting the rotation angle of the rotary table 642 and ensuring the accuracy of the rotation angle of the sixth reflecting mirror 65.

[0079] Reference Figure 8 As shown, in some embodiments, the sixth reflector 65 has a first reflecting surface 651 and a second reflecting surface 652 on its opposite sides, and the rotating mechanism 64 is arranged in a horizontal state. At this time, the mounting surface 642a of the rotating platform 642 is aligned with the first direction ( Figure 4 The rotating stage 642 is arranged parallel to the X direction in the second direction, and can rotate around the second direction ( Figure 4When the rotating table 642 rotates around the second direction by a preset angle to drive the sixth mirror 65 to rotate to the first state, the laser emitted by the first laser 1 can be reflected to the machining head 3 in sequence through the first mirror 41 and the first reflecting surface 651 of the sixth mirror 65. When the rotating table 642 rotates around the second direction by a preset angle to drive the sixth mirror 65 to rotate to the second state, the laser emitted by the second laser 2 can be reflected to the machining head 3 in sequence through the third mirror 51 and the second reflecting surface 652 of the sixth mirror 65.

[0080] Referring to Figure 9 In other embodiments, as shown in FIG. 6B, the sixth mirror 65 has the first reflecting surface 651, and the rotating mechanism 64 is arranged in a vertical state, that is, the mounting surface 642a of the rotating table 642 is arranged in parallel with the second direction, and the rotating table 642 can rotate around the first direction. When the rotating table 642 rotates around the first direction by a preset angle to drive the sixth mirror 65 to rotate to the first state, the laser emitted by the first laser 1 can be reflected to the machining head 3 in sequence through the first mirror 41 and the first reflecting surface 651 of the sixth mirror 65. When the rotating table 642 rotates around the first direction by a preset angle to drive the sixth mirror 65 to rotate to the second state, the laser emitted by the second laser 2 can be reflected to the machining head 3 in sequence through the third mirror 51 and the first reflecting surface 651 of the sixth mirror 65.

[0081] In the embodiment, the lasers emitted by the first laser 1 and the second laser 2 are parallel to the first direction, the first mirror 41 is arranged in parallel with the sixth mirror 65 when the sixth mirror 65 is in the first state, and the third mirror 51 is arranged in parallel with the sixth mirror 65 when the sixth mirror 65 is in the second state. Exemplarily, in the first direction, the included angle between the first mirror 41 and the first direction and the included angle between the third mirror 51 and the first direction can each be 45°, 30°, 60°, etc. In other embodiments, the specific positions of the first mirror 41, the third mirror 51, the first laser 1 and the second laser 2 can also be arranged as required.

[0082] In a specific application scenario, when the first laser 1 needs to be used for machining, the driving member is controlled to operate by the control card 100 to drive the rotating table 642 to rotate, thereby driving the sixth mirror 65 to rotate to the first state, and then the first laser 1 is controlled to be turned on by the control card 100. At this time, the laser beam emitted by the first laser 1 can be reflected to the sixth mirror 65 through the first mirror 41, and then reflected to the machining head 3 through the sixth mirror 65, so as to perform machining on the workpiece to be machined by the first laser 1, which is described with reference to FIG. 6A. Figure 4shown. When the second laser 2 needs to be used for processing, the driving member is controlled to rotate by the control card 100 to drive the rotating table 642 to rotate, so that the sixth mirror 65 rotates to the second state, and then the second laser 2 is controlled to be turned on by the control card 100. At this time, the laser beam emitted by the second laser 2 is reflected to the sixth mirror 65 through the third mirror 51, and then reflected to the processing head 3 through the sixth mirror 65, so as to process the workpiece to be processed by the second laser 2. Referring to Figure 5 shown, so as to realize two laser processing modes.

[0083] Correspondingly, the embodiment of the application also discloses a laser processing equipment, which comprises a workbench and a laser processing device.

[0084] Referring to Figure 10 shown. Correspondingly, the application also discloses a laser processing control method, which can be applied to the laser processing device comprising the rotating mechanism. The laser processing control method comprises the following steps:

[0085] S11. When the first laser is used for processing, the control card controls the rotating mechanism to rotate, so that the sixth mirror rotates to the first state.

[0086] Specifically, the rotating mechanism 64 is controlled to rotate around the first direction by a preset angle, so that the sixth mirror 65 rotates to the first state. The first direction is perpendicular to the direction of the laser beam emitted to the sixth mirror 65.

[0087] In another embodiment, the rotating mechanism 64 is controlled to rotate around the second direction by a preset angle, so that the sixth mirror 65 rotates to the first state. The second direction is parallel to the direction of the laser beam emitted to the sixth mirror 65.

[0088] S12. When the sixth mirror rotates to the first state, the control card controls the first laser to emit a laser beam, so that the laser beam is reflected to the processing head through the sixth mirror.

[0089] S13. When the second laser is used for processing, the control card controls the rotating mechanism to rotate, so that the sixth mirror rotates to the second state.

[0090] Specifically, the rotating mechanism 64 is controlled to rotate around the first direction by a preset angle, so that the sixth mirror 65 rotates to the second state.

[0091] In another embodiment, the rotating mechanism 64 is controlled to rotate around the second direction by a preset angle, so that the sixth mirror 65 rotates to the second state.

[0092] S14. When the sixth mirror rotates to the second state, the second laser emits a laser beam, so that the laser beam is reflected to the processing head through the sixth mirror.

[0093] The embodiment can realize two laser processing modes without the need to purchase two laser forming devices, reduces the occupied space of the laser processing device, and reduces the cost.

[0094] The above merely provides the preferred embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or replacements within the technical scope disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A laser processing apparatus characterized by comprising: The processing head, the first laser, the second laser, the first reflection assembly, the second reflection assembly and the third reflection assembly are included. The first laser is used for emitting first laser, and the second laser is used for emitting second laser. The first reflection assembly is arranged on the light path of the first laser, and forms a first light path with the first laser. The second reflection assembly is arranged on the light path of the second laser, and forms a second light path with the second laser. The third reflection assembly is arranged on the reflection light path of the first reflection assembly and the second reflection assembly, and is used for reflecting the laser reflected by the first light path or the laser reflected by the second light path to the processing head, or is used for reflecting the laser reflected by the first light path and the laser reflected by the second light path to the processing head after the laser reflected by the first light path and the laser reflected by the second light path are combined.

2. The laser processing apparatus according to claim 1, characterized by The pulse width of the first laser is different from the pulse width of the second laser, so that the first laser and the second laser can cut different materials of the workpiece to be processed.

3. The laser processing apparatus according to claim 1, characterized by The third reflection assembly is provided with an arc-shaped reflection surface, which is used for reflecting the laser reflected by the first light path or the laser reflected by the second light path to the processing head, or is used for reflecting the laser reflected by the first light path and the laser reflected by the second light path to the processing head after the laser reflected by the first light path and the laser reflected by the second light path are combined.

4. The laser processing apparatus according to claim 3, characterized by The first reflection assembly includes a first mirror and a second mirror, and the second reflection assembly includes a third mirror and a fourth mirror. The incident angle of the laser emitted by the first laser on the first mirror is α, 30°≤α≤60°, the incident angle of the laser reflected by the first mirror on the second mirror is β, 0≤β≤45°, the incident angle of the laser emitted by the second laser on the third mirror is δ, 30°≤δ≤60°, and the incident angle of the laser reflected by the third mirror on the fourth mirror is γ, 0≤γ≤45°.

5. The laser processing apparatus according to any one of claims 1 to 4, characterized by The processing head is provided with a plurality of processing heads, and the laser processing device further includes a light splitting assembly arranged on the reflection light path of the third reflection assembly, which is used for splitting the laser reflected by the third reflection assembly into a plurality of lasers, so that each laser is respectively injected into each processing head.

6. The laser processing apparatus according to claim 5, characterized by The processing head includes a first processing head and a second processing head, the light splitting assembly includes a 1 / 2 wave plate, a light splitting lens and a fifth mirror, the 1 / 2 wave plate and the light splitting lens are arranged on the reflection light path of the third reflection assembly in sequence, the fifth mirror is arranged on the lens light path of the light splitting lens, the first processing head is arranged on the reflection light path of the light splitting lens, and the second processing head is arranged on the reflection light path of the fifth mirror.

7. The laser processing apparatus according to claim 1, wherein The machining head and the third reflection assembly are respectively provided with a plurality of, the laser machining device further comprises a first light splitting assembly and a second light splitting assembly, the first light splitting assembly is arranged on the light path of the first laser, and is used for splitting the laser emitted by the first laser into a plurality of first laser beams, so that the plurality of first laser beams are reflected to the machining head through the first reflection assembly and each third reflection assembly in turn; The second light splitting assembly is arranged on the light path of the second laser, and is used for splitting the laser emitted by the second laser into a plurality of second laser beams, so that the plurality of second laser beams are reflected to the machining head through the second reflection assembly and each third reflection assembly in turn.

8. The laser processing apparatus according to claim 7, characterized by The first light splitting assembly comprises a first 1 / 2 wave plate and a first light splitting lens, and the first 1 / 2 wave plate and the first light splitting lens are arranged on the light path of the first laser in turn; The second light splitting assembly comprises a second 1 / 2 wave plate and a second light splitting lens, and the second 1 / 2 wave plate and the second light splitting lens are arranged on the light path of the second laser in turn.

9. The laser processing apparatus according to claim 1, characterized by The third reflection assembly comprises a rotating mechanism and a sixth reflecting mirror, the sixth reflecting mirror is arranged on the rotating mechanism and located on the reflection light path of the first reflection assembly and the second reflection assembly, and the rotating mechanism is used for driving the sixth reflecting mirror to rotate between a first state and a second state; When the sixth reflecting mirror is in the first state, the laser emitted by the first laser can be reflected to the machining head through the first reflection assembly and the sixth reflecting mirror in turn; when the sixth reflecting mirror is in the second state, the laser emitted by the second laser can be reflected to the machining head through the second reflection assembly and the sixth reflecting mirror in turn.

10. The laser processing apparatus according to any one of claims 1 to 9, characterized by The first laser is a picosecond laser, and the second laser is a nanosecond laser.

11. A laser processing apparatus characterized by comprising: The laser machining device comprises a workbench and the laser machining device as claimed in any one of claims 1-9.

12. A laser processing control method applied to a laser processing apparatus including a first laser, a second laser, a rotating mechanism, a sixth mirror, a processing head, and a control sheet, characterized by, The laser machining control method comprises: When the first laser is used for machining, the control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to the first state; When the sixth reflecting mirror rotates to the first state, the control card controls the first laser to emit laser, so that the laser is reflected to the machining head through the sixth reflecting mirror; When the second laser is used for machining, the control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to the second state; When the sixth reflecting mirror rotates to the second state, the control card controls the second laser to emit laser, so that the laser is reflected to the machining head through the sixth reflecting mirror.

13. The laser processing control method according to claim 12, characterized by, The control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to the first state, specifically: The control card controls the rotating mechanism to rotate by a preset angle around a first direction, so as to drive the sixth reflecting mirror to rotate to the first state, wherein the first direction is perpendicular to the direction of the laser emitted to the sixth reflecting mirror; The control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to the second state, specifically: The control card controls the rotating mechanism to rotate around a first direction by a preset angle, so as to drive the sixth reflecting mirror to rotate to a second state.

14. The laser processing control method according to claim 12, characterized by, The control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to a first state, specifically: The control card controls the rotating mechanism to rotate around a second direction by a preset angle, so as to drive the sixth reflecting mirror to rotate to a first state, wherein the second direction is parallel to the direction of the laser beam irradiated to the sixth reflecting mirror. The control card controls the rotating mechanism to rotate, so as to drive the sixth reflecting mirror to rotate to a second state, specifically: The control card controls the rotating mechanism to rotate around a second direction by a preset angle, so as to drive the sixth reflecting mirror to rotate to a second state.

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