Thin plate test piece mechanical property data conversion method and device and electronic equipment

By establishing and correcting the relationship between the measurement factors and geometric parameters of thin plate specimens, the problem of obtaining mechanical property data of miniaturized thin plate specimens was solved, and efficient and low-cost mechanical property data conversion was achieved.

CN120911178APending Publication Date: 2025-11-07DONGFANG TURBINE CO LTD +1
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Patent Information

Application Number
CN202510975246.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-15
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Existing technologies make it difficult to effectively obtain mechanical property data of miniaturized thin plate specimens, resulting in high difficulty and cost in conducting general mechanical tests on them.

Method used

By establishing the relationship between the measurement factors and geometric parameters of thin plate specimens, and using simulated values ​​to correct the relationship, a second relationship between the measurement factors and geometric parameters of thin plate specimens is obtained, thereby realizing the conversion of mechanical property data of miniaturized thin plate specimens.

Benefits of technology

This method enables the conversion of mechanical properties from miniaturized thin plate specimens to standard-sized specimens, reducing the difficulty and cost of data acquisition while improving the accuracy of data conversion.

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Abstract

The invention provides a mechanical property data conversion method and device of a thin plate test piece and electronic equipment. Relates to the technical field of data processing. The method comprises the following steps: determining a simulation value of a measurement factor corresponding to a thin plate test piece according to simulation mechanical property data of the thin plate test piece; according to each mechanical property corresponding theory, determining a first relational expression between the measurement factor and the geometric parameter of the thin plate test piece; correcting the first relational expression based on the simulation value to obtain a second relational expression between the measurement factor and the geometric parameter of the thin plate test piece; determining a measurement factor value of the target test piece by using a second relational expression, and converting the first mechanical property data of the target test piece based on the measurement factor value to obtain second mechanical property data; the target test piece is a thin-plate test piece and is smaller than the standard-size test piece in size, and the second mechanical property data is used for indicating the mechanical property data of the standard-size test piece corresponding to the first mechanical property data. According to the invention, the problems of large difficulty and high cost of common mechanical tests of the existing thin plate test piece are solved.
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Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of data processing, in particular to a mechanical property data conversion method and device for thin plate specimen, and an electronic device. BACKGROUND

[0002] Miniaturized thin-plate specimen (MTPS) test is suitable for mechanical property test of thin, narrow or hollow structure materials in one direction, such as mechanical property test of coating materials. However, due to the very small thickness of such thin plate materials, the size requirements of general mechanical tests (such as uniaxial creep test) cannot be met, making it difficult and costly to obtain the mechanical property data of standard size specimens of such materials.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The purpose of the embodiments of the present disclosure is to provide a mechanical property data conversion method and device for thin plate specimen, and an electronic device, thereby to a certain extent solve the problem of high cost and difficulty of general mechanical test of existing thin plate specimen.

[0005] According to a first aspect of the present disclosure, a mechanical property data conversion method for thin plate specimen is provided, comprising:

[0006] According to the simulated mechanical property data of the thin plate specimen, a simulated value of a measurement factor corresponding to the thin plate specimen is determined; the simulated mechanical property data is obtained by performing a mechanical property simulation test on the thin plate specimen;

[0007] According to each mechanical property corresponding theory, a first relationship between the measurement factor and the geometric parameter of the thin plate specimen is determined;

[0008] Based on the simulated value, the first relationship is corrected to obtain a second relationship between the measurement factor and the geometric parameter of the thin plate specimen;

[0009] The measurement factor value of the target specimen is determined by using the second relationship, and the first mechanical property data of the target specimen is converted based on the measurement factor value to obtain second mechanical property data; the target specimen is a thin plate specimen and its size is smaller than that of a standard size specimen, and the second mechanical property data is used to indicate the mechanical property data of the standard size specimen corresponding to the first mechanical property data.

[0010] In an example embodiment of the present disclosure, based on the foregoing scheme, the thin plate test piece comprises a uniform section, the simulated mechanical property data comprises a steady-state creep rate value and an average strain rate value, and the simulated value of the measurement factor corresponding to the thin plate test piece is determined according to the simulated mechanical property data of the thin plate test piece, comprising:

[0011] An equivalent standard length of the thin plate test piece is determined based on the measurement factor;

[0012] A relationship between the average strain and the total deformation rate of the uniform section is constructed based on the equivalent standard length;

[0013] A relationship between the average strain rate and the steady-state creep rate of the thin plate test piece under steady-state creep is derived according to the relationship between the average strain and the total deformation rate;

[0014] The simulated value of the measurement factor corresponding to the thin plate test piece is determined according to the relationship between the average strain rate and the steady-state creep rate under steady-state creep, the steady-state creep rate value and the average strain rate value.

[0015] In an example embodiment of the present disclosure, based on the foregoing scheme, the thin plate test piece comprises a uniform section and a fillet section, and a first relationship between the measurement factor and the geometric parameter is determined according to the respective mechanical property corresponding theory, comprising:

[0016] A corresponding expression of the creep elongation rate of the uniform section and a corresponding expression of the creep elongation rate of the fillet section are determined according to the Norton law of steady-state creep;

[0017] A total elongation rate expression of the thin plate test piece is determined according to the corresponding expression of the creep elongation rate of the uniform section and the corresponding expression of the creep elongation rate of the fillet section;

[0018] An average strain expression of the uniform section is determined;

[0019] The first relationship is determined according to the relationship between the average strain and the total elongation rate, and the average strain expression and the total elongation rate expression.

[0020] In an example embodiment of the present disclosure, based on the foregoing scheme, the thin plate test piece comprises a uniform section and a fillet section, and a first relationship between the measurement factor and the geometric parameter is determined according to the respective mechanical property corresponding theory, comprising:

[0021] A corresponding expression of the elastic elongation rate of the uniform section and a corresponding expression of the elastic elongation rate of the fillet section are determined according to the Hooke's law of elastic strain;

[0022] A corresponding expression of the creep elongation rate of the uniform section and a corresponding expression of the creep elongation rate of the fillet section are determined according to the Norton law of steady-state creep;

[0023] determining a total elongation expression of the thin plate event according to the creep elongation corresponding expression of the uniform section, the creep elongation corresponding expression of the fillet section, the elastic elongation corresponding expression of the uniform section and the elastic elongation corresponding expression of the fillet section;

[0024] determining an average strain expression of the uniform section;

[0025] determining the first relationship according to the average strain expression, the total elongation expression and the relationship between the average strain and the total elongation of the uniform section.

[0026] In an example embodiment of the present disclosure, based on the foregoing scheme, the correcting the first relationship according to the simulation value comprises:

[0027] determining an error correlation term in the first relationship;

[0028] constructing a correction factor function with the error correlation term as the independent variable;

[0029] correcting the first relationship by using the correction factor function to determine the second relationship.

[0030] In an example embodiment of the present disclosure, based on the foregoing scheme, the correcting the first relationship by using the correction factor function comprises:

[0031] taking the difference between the correction solution of the measurement factor determined based on the second relationship and the simulation value of the corresponding measurement factor as an objective function;

[0032] solving the correction parameter in the correction factor function by using the least square method to obtain a correction parameter solution value by minimizing the objective function;

[0033] determining the second relationship according to the correction parameter solution value.

[0034] In an example embodiment of the present disclosure, based on the foregoing scheme, the method further comprises:

[0035] performing mechanical tests of thin plate test pieces under different combinations of geometric parameters by using finite element analysis to obtain simulation mechanical property data corresponding to each combination of geometric parameters.

[0036] In an example embodiment of the present disclosure, based on the foregoing scheme, before the correcting the first relationship according to the simulation value, the method further comprises:

[0037] determining analytical values of measurement factors corresponding to each combination of geometric parameters by using the first relationship;

[0038] Based on the error value between the simulation value and the analytical value of the measurement factor corresponding to each combination of geometric parameters, a geometric parameter range corresponding to a target error value meeting a preset error requirement is screened out, so as to perform the mechanical property data conversion in the geometric parameter range.

[0039] According to a second aspect of the present disclosure, a mechanical property data conversion device for a thin plate specimen is provided, comprising:

[0040] A simulation value determination module is configured to determine a simulation value of a measurement factor corresponding to the thin plate specimen according to simulation mechanical property data of the thin plate specimen, wherein the simulation mechanical property data is obtained by performing a mechanical property simulation test on the thin plate specimen.

[0041] A relationship determination module is configured to determine a first relationship between the measurement factor and the geometric parameter of the thin plate specimen according to a corresponding theory of each mechanical property.

[0042] A correction module is configured to correct the first relationship based on the simulation value, so as to obtain a second relationship between the measurement factor and the geometric parameter of the thin plate specimen.

[0043] A conversion module is configured to determine a measurement factor value of a target specimen by using the second relationship, and convert first mechanical property data of the target specimen based on the measurement factor value, so as to obtain second mechanical property data, wherein the target specimen is a thin plate specimen and has a size smaller than a standard size specimen, and the second mechanical property data is used to indicate mechanical property data of a standard size specimen corresponding to the first mechanical property data.

[0044] According to a third aspect of the present disclosure, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to implement the mechanical property data conversion method for a thin plate specimen according to any one of the above aspects.

[0045] According to a fourth aspect of the present disclosure, an electronic device is provided, comprising a processor and a memory for storing executable instructions of the processor, wherein the processor is configured to execute the mechanical property data conversion method for a thin plate specimen according to any one of the above aspects by executing the executable instructions.

[0046] The exemplary embodiments of the present disclosure can have the following partial or all beneficial effects:

[0047] In the mechanical property data conversion method of the thin plate test piece provided in the disclosed example embodiment, on one hand, the first mechanical property data of the miniaturized thin plate test piece (target test piece) is converted by using a conversion relationship (second relationship), to obtain the second mechanical property data corresponding to the standard size, so as to realize the mechanical property conversion of the miniaturized thin plate test piece to the standard size test piece, avoid the large-size mechanical test process of the thin plate material, reduce the difficulty of obtaining the standard size corresponding mechanical property data of the thin plate material, and reduce the data measurement cost. On the other hand, the first relationship between the theoretical derivation measurement factor and the geometric parameter can be corrected by using the simulation value of the thin plate test piece corresponding measurement factor, to improve the accuracy of data conversion.

[0048] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and are not limiting to the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0049] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate one embodiment consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0050] Figure 1 The flow chart of the mechanical property data conversion method of the thin plate test piece according to one embodiment of the present disclosure is schematically shown;

[0051] Figure 2 The mechanical tensile test schematic diagram of the miniaturized thin plate test piece in one embodiment of the present disclosure is schematically shown;

[0052] Figure 3 The geometric structure schematic diagram of the mechanical tensile test of the miniaturized thin plate test piece in one embodiment of the present disclosure is schematically shown;

[0053] Figure 4 The flow chart of correcting the first relationship based on the simulation value in one embodiment of the present disclosure is schematically shown;

[0054] Figure 5 (a) The contour plot of the error between the finite element simulation value and the formula analytical value with l0 / d and R / d as the horizontal and vertical coordinates in one embodiment of the present disclosure is schematically shown;

[0055] Figure 5 (b) The contour plot of the error between the finite element simulation value and the formula analytical value with n and R / d as the horizontal and vertical coordinates in one embodiment of the present disclosure is schematically shown;

[0056] Figure 6 (a) shows a comparison chart of the corrected analytical value and the simulated value of the measurement factor with respect to the change of l0 / d according to one embodiment of the present disclosure;

[0057] Figure 6 (b) shows a comparison chart of the corrected analytical value and the simulated value of the measurement factor with respect to the change of R / d according to one embodiment of the present disclosure;

[0058] Figure 6 (c) shows a contour chart of the corrected analytical value and the simulated value of the measurement factor with respect to the change of R / d according to one embodiment of the present disclosure

[0059] Figure 6 (d) shows a contour chart of the corrected analytical value and the simulated value of the measurement factor with respect to the change of n according to one embodiment of the present disclosure;

[0060] Figure 7 Fig. 6 shows a structural block diagram of a mechanical property data conversion device for a thin plate specimen according to one embodiment of the present disclosure;

[0061] Figure 8 Fig. 7 shows a structural diagram of a computer system of an electronic device suitable for implementing the embodiments of the present disclosure. DETAILED DESCRIPTION

[0062] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations can be implemented in any

[0063] Moreover, the attached drawings are merely illustrative of the present disclosure and are not necessarily drawn to scale. Identical reference numerals in the figures represent the same or similar elements and therefore repeated description thereof will be omitted. Some of the block diagrams shown in the drawings are functional entities that do not necessarily have to correspond to physically or logically independent entities. These functional entities can be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0064] Miniaturized thin-plate specimen (MTPS) test is particularly suitable for thin, narrow or hollow structures with small size in one direction. This test method can be applied to coating-substrate composite materials, which can extend the service life of key components of aircraft under high temperature conditions, and therefore the study of the mechanical properties of such materials is of great significance. However, the thickness of such thin plate materials is very small, and it is basically impossible to extract a standard size specimen for conventional mechanical property testing (such as uniaxial creep test), which brings difficulties to the study of such thin plate materials. In order to solve the problem of being unable to obtain the results of conventional mechanical property tests of thin plate materials, the present disclosure aims to establish a data correlation between the mechanical property data of micro specimens and standard specimens, so as to reproduce the mechanical property data of standard size specimens based on micro thin plate specimens. Based on this, the present disclosure provides a mechanical property data conversion method for thin plate specimens.

[0065] The technical solutions of the steps of the embodiments of the present disclosure are described in detail as follows:

[0066] Reference Figure 1 As shown in the drawings, the mechanical property data conversion method for thin plate specimens of an example embodiment provided by the present disclosure can include the following steps:

[0067] Step S110, determining the simulation value of the measurement factor of the thin plate specimen according to the simulation mechanical property data of the thin plate specimen; the simulation mechanical property data is obtained by performing a mechanical property simulation test on the thin plate specimen;

[0068] Step S120, determining the first relationship between the measurement factor and the geometric parameter of the thin plate specimen according to the corresponding theory of each mechanical property;

[0069] Step S130, correcting the first relationship based on the simulation value to obtain the second relationship between the measurement factor and the geometric parameter of the thin plate specimen;

[0070] In step S140, the measuring factor value of the target test piece is determined by using the second relationship, and the first mechanical property data of the target test piece is converted based on the measuring factor value to obtain second mechanical property data; the target test piece is a thin plate test piece and the size is smaller than that of the standard size test piece, and the second mechanical property data is used to indicate the mechanical property data of the standard size test piece corresponding to the first mechanical property data.

[0071] The mechanical property data conversion method of the thin plate test piece provided by the present disclosure, on the one hand, converts the first mechanical property data of the miniaturized thin plate test piece (target test piece) by using the conversion relationship (second relationship) to obtain the corresponding second mechanical property data of the standard size, realizes the mechanical property conversion of the miniaturized thin plate test piece to the standard size test piece, avoids the large size mechanical test process of the thin plate material, reduces the difficulty of obtaining the corresponding mechanical property data of the standard size of the thin plate material, and reduces the data measurement cost. On the other hand, the analog value of the measuring factor corresponding to the thin plate test piece can be used to correct the first relationship between the theoretically derived measuring factor and the geometric parameter, thereby improving the accuracy of data conversion.

[0072] In another embodiment, the above steps are described in more detail as follows.

[0073] In step S110, the analog value of the measuring factor corresponding to the thin plate test piece is determined according to the analog mechanical property data of the thin plate test piece.

[0074] In the example embodiment, the thin plate test piece is a test piece for MTPS test, i.e. a miniaturized thin plate test piece, and the gauge length (GL) of the test piece is usually less than 10 mm, so in the tensile test, the elongation of the thin plate test piece can be directly measured by the movement of the end of the thin plate test piece. The tensile test schematic diagram of the miniaturized thin plate test piece is shown in FIG. 1. Figure 2 The analog mechanical property data is obtained by performing a mechanical property simulation test on the thin plate test piece, and the mechanical property simulation test can include at least one of a high temperature / room temperature tensile simulation test, a creep simulation test, and various fatigue simulation tests. Correspondingly, the analog mechanical property data can include at least one of stress-strain corresponding analog data, creep corresponding analog data, and analog fatigue curve (relationship curve between maximum stress or stress amplitude and its corresponding fracture cycle number).

[0075] In the example embodiment, the geometric profile structure of the miniaturized thin plate test piece is shown in FIG. 1. Figure 3 In the figure, the miniaturized thin plate test piece includes a uniform section in the middle and a round corner section on both sides, d and lo are the width and length of the uniform section, b is the thickness of the test piece, R is the round corner radius, and l f is the length of the round corner section, and when lf / R = 1 corresponds to a quarter circle, and / is the distance between the two clamping end edges, i.e. the gauge length. Exemplarily, the mechanical test of the thin plate specimen under different combinations of geometric parameters can be carried out by using finite element analysis to obtain the simulated mechanical property data corresponding to each combination of geometric parameters. By observing Figure 3 It can be seen that the size of the miniaturized thin plate specimen can be controlled by the following four geometric ratios l o / d, R / d, b / d and l f / R(l f / R≤1) can be controlled, so that the simulated value of the measurement factor can be determined based on Figure 2 A finite element model is constructed, and then finite element analysis is performed on the given specimen geometry (l o / d, R / d, b / d and l f / R) to obtain corresponding simulated mechanical property data, which can include the first steady-state strain rate value of the gauge section and the second steady-state strain rate value of the uniform section.

[0076] Exemplarily, the simulated value of the measurement factor can be determined by the following steps:

[0077] First, determine the equivalent standard length of the thin plate specimen based on the measurement factor;

[0078] Second, based on the equivalent standard length, construct the relationship between the average strain of the uniform section and the total deformation rate;

[0079] Third, according to the relationship between the average strain and the total deformation rate, derive the relationship between the average strain rate and the steady-state creep rate of the thin plate specimen under steady-state creep;

[0080] Fourth, according to the relationship between the average strain rate and the steady-state creep rate under steady-state creep, use the steady-state creep rate value and the average strain rate value to determine the simulated value of the measurement factor of the thin plate specimen.

[0081] In the present example embodiment, as Figure 3 shown, the equivalent standard length βl o of the thin plate specimen can be determined based on the uniform section length l o of the specimen and the measurement factor β; before constructing the relationship, it is assumed Figure 3 that the specimen end only experiences rigid motion, and the total deformation of the specimen is Δ T , which can be measured by a high temperature extensometer, and the average strain of the uniform section l o is By defining a standard coefficient (measurement factor) β of a miniaturized thin plate specimen to determine the equivalent standard length βl o of the miniaturized thin plate specimen (β>1), then:

[0082]

[0083] For a given specimen size, since l o and Δ T is the measured value of the load path at a certain position β, the average strain of the uniform section can be calculated.

[0084] To calculate the specification factor under steady-state creep, equation (1) can be rewritten as:

[0085]

[0086] From the steady-state creep rate of the uniform section, we have:

[0087]

[0088] where, represents the average strain rate, represents the steady-state creep rate of the gauge section l, represents the steady-state creep rate of the uniform section lo.

[0089] In practice, for a given specimen geometry, finite element analysis can be performed to obtain the value of the steady-state creep rate of the gauge section l and the value of the steady-state creep rate of the uniform section lo Combined with equations (2) and (3), the value of β can be calculated.

[0090] Through the above method, finite element analysis can be performed on specimens with different combinations of geometric parameters to obtain the simulated value of the measurement factor (β value) corresponding to the size, and the results obtained by direct finite element method can be used as accurate results for subsequent correction.

[0091] In step S120, a first relationship between the measurement factor and the geometric parameters of the thin plate specimen is determined according to the corresponding theory of each mechanical property.

[0092] In the example embodiment, the mechanical properties can include at least one of elastic deformation, plastic deformation, creep, etc. The corresponding theory of each mechanical property can include Hooke's law for elasticity and Norton's law for steady-state creep, etc., and can also include other mechanical related theories, which are not limited in the example. The geometric parameters can include each parameter of the specimen in Figure 3 or the ratio between the parameters, and can also include other parameter forms determined by size parameters, which are not limited in the example.

[0093] In other embodiments, the mechanical test is taken as a creep tensile test as an example, the total deformation can include the elastic deformation rate and the creep deformation rate, and the first relationship between the measurement factor and the geometric parameters can be determined by the following steps:

[0094] Firstly, according to the Hooke's law of elastic strain, the elastic elongation rate corresponding expression of the uniform section and the elastic elongation rate corresponding expression of the rounded section are determined;

[0095] Secondly, according to the Norton law of steady-state creep, the creep elongation rate corresponding expression of the uniform section and the creep elongation rate corresponding expression of the rounded section are determined;

[0096] Thirdly, according to the creep elongation rate corresponding expression of the uniform section, the creep elongation rate corresponding expression of the rounded section, the elastic elongation rate corresponding expression of the uniform section and the elastic elongation rate corresponding expression of the rounded section, the total elongation rate expression of the thin plate event is determined;

[0097] Fourthly, the average strain expression of the uniform section is determined;

[0098] Fifthly, according to the relationship between the average strain and the total elongation rate of the uniform section and the average strain expression and the total elongation rate expression, the first relationship expression is determined.

[0099] In the example embodiment, the derivation of the relationship expression can be based on the specimen mechanical tensile test structure and device as shown in Figure 2 and Figure 3 The derivation of the relationship expression can also be based on other mechanical test structures and devices, which are not limited in the example.

[0100] Exemplarily, the derivation process of the first relationship expression is explained by taking the tensile test of the specimen creep performance as an example. Specifically, the flexibility of the test bench can be ignored, and the deformation rate of the overall load direction of the specimen is as shown in Figure 3

[0101]

[0102] Wherein, Δ o is the elongation rate of lo, Δ f is the elongation rate of l f , and the superscripts e and c represent elasticity and creep respectively.

[0103] The uniaxial form of the Hooke's law of elasticity and the Norton law of steady-state creep are respectively:

[0104] ε e = σ / E

[0105] ε c = Bσ n t (5)

[0106] In the formula, σ is stress, E is elastic modulus, ε c is creep strain, t is creep time, B and n are creep resistance coefficients and stress index, and then the total strain ε​t For:

[0107] ε t = ε e + ε c (6)

[0108] For the elastic elongation of the rounded section The process of determining the expression is as follows:

[0109] The rounded section of the sheet tensile specimen is shown in Figure 3 Fig. 1, where, when l f = R, d g = d + 2R, d g represents the width of the specimen at the clamping end; the elastic strain at the x position is:

[0110]

[0111] Assuming that the stress distribution in the rounded corner is mainly uniaxial, then

[0112]

[0113] where F and b are the applied force and specimen thickness, respectively. If d f (x) is the specimen width on the rounded section at the x position, assuming the condition l f ≤ R, the definition domain of x is 0 to l f , and there is:

[0114]

[0115] The elongation of the rounded section is:

[0116]

[0117] If l f = R. Substituting formulas (8) and (9) into formula (10) gives:

[0118]

[0119] For the expression of the creep elongation of the rounded corner The process of determining the expression is as follows:

[0120] The creep strain at the rounded section at x is:

[0121]

[0122] The elongation of the rounded section is:

[0123]

[0124] If lf = R, substituting equations (9), (11) into equation (13) gives

[0125]

[0126] Total elongation Δ T The determination process is as follows:

[0127] The elastic strain of the uniform section is:

[0128]

[0129] The elastic elongation of the uniform section is:

[0130]

[0131] The creep strain of the uniform section is:

[0132]

[0133] The creep elongation of the uniform section is:

[0134]

[0135] From equations (11), (14), (16), (18), we can obtain:

[0136]

[0137] The derivation process of the expression of the measurement factor β is as follows:

[0138] Based on equations (15), (17), the average strain of the uniform section is:

[0139]

[0140] For the conventional elastic-creep problem, from equations (1), (19), (20), the first relationship between the corresponding measurement factor β and the geometric parameters is:

[0141]

[0142] Based on the above equation (21), the measurement factor of the thin plate specimen with different geometric parameter combinations can be obtained.

[0143] In some embodiments, since the elastic component is usually one order of magnitude smaller than the creep component of the ductile material, the elastic deformation is ignored and only the creep deformation is considered. The thin plate specimen includes a uniform section and a fillet section, and the first relationship between the measurement factor and the geometric parameters can be determined by the following steps:

[0144] In a first step, a corresponding expression of the creep elongation of the uniform section and a corresponding expression of the creep elongation of the rounded section are determined according to the Norton law of steady-state creep.

[0145] In a second step, a total elongation expression of the thin sheet specimen is determined according to the corresponding expression of the creep elongation of the uniform section and the corresponding expression of the creep elongation of the rounded section.

[0146] In a third step, an average strain expression of the uniform section is determined.

[0147] In a fourth step, a first relationship is determined according to the relationship between the average strain of the uniform section and the total elongation, and the average strain expression and the total elongation expression.

[0148] In the example embodiment, the elastic component part can be ignored in the derivation of the total elongation expression, i.e. the elastic elongation of the rounded section and the elastic elongation of the uniform section are omitted, and the first relationship obtained by omitting the elastic component part in the formula (21) is as follows:

[0149]

[0150] It should be noted that, in general, the value of β is mainly affected by the initial geometric shape (l o / d, R / d and l f / d) and the stress index (n), i.e. the influence of the change of the specimen geometry due to creep is ignored. The stress index, i.e. the strain hardening index, is a performance index reflecting the ability of a metal material to resist uniform plastic deformation, and is a performance index characterizing the strain hardening behavior of a metal material.

[0151] It should be further noted that the analytical value of the measurement factor calculated by the above formula is based on the small deformation and the plane stress assumption, i.e. the specimen thickness is not considered and the constant volume condition is not enforced. The measurement factor in the formula (22) is a function of lo, d, R and n, and is only applicable to the case of l f =R, l f <R, the formula (9) is used to calculate d f (x).

[0152] In step S130, the first relationship is corrected based on the simulation value to obtain a second relationship between the measurement factor and the geometric parameters of the thin sheet specimen.

[0153] In the example embodiment, the simulation value of the measurement factor can be used as the accurate value to correct the first relationship, i.e. the error between the measurement factor calculated by the first relationship and the corresponding simulation value is used to correct the first relationship.

[0154] It should be noted that the above correction is to correct the deviation between the test data and the theoretical calculation value caused by the defects of the test piece, high temperature oxidation and other phenomena in the actual experiment, and aims to correct the deviation between the theoretical derivation formula and the actual situation.

[0155] Exemplarily, referring to Figure 4 , the correction of the first relationship based on the simulation value can include the following steps:

[0156] S410, determining an error correlation term in the first relationship;

[0157] In the present example embodiment, the influencing factors of the β value can be determined by observing the first relationship, for example, it can be set that l f =R, after simplifying formula (22), the β value can be determined as a function of the initial size (l o , R) and the stress index (n), therefore, a series of parameter combinations can be selected for finite element simulation and theoretical formula calculation respectively to determine the parameters that have greater influence on the error (i.e. the difference between the analytical value of the measurement factor determined by the first relationship and the simulation value), for example, a geometric parameter and a stress index can be selected as the error correlation term, or only the geometric parameter combination can be selected as the error correlation term when the stress index has less influence, the number of parameters of the error correlation term can be one or more, which is not limited in the present example.

[0158] Exemplarily, through a series of finite element calculation examples of different parameter combinations, the influence of different parameters is studied to finally determine the error correlation term, for example, the correction process can be divided into two categories: one category is to study the influence of the geometric ratio, and the stress index is constant (such as Table 1, Group I); the other category is to study the influence of the stress index, and the geometric ratio is constant (such as Table 1, Group II), and the influence of various factors on the β value is studied. The specific parameter combination is shown in Table 1.

[0159] Table 1. Finite element modeling geometric parameter combination table

[0160]

[0161] The error between the analytical value and the finite element simulation result corresponding to the different parameter combinations in Table 1 above is calculated, and the results are shown in Figure 5 (a), (b), from Figure 5 (a), (b) can be seen that there is a certain error between the analytical value and the simulation value, and the error value changes with R / d, l0 / d and n, therefore, according to this result, R / d and n can be selected as the error correlation term. From Figure 5 (a), (b) can also be seen that the relationship between the error value and the independent variable R / d is non-monotonic and nonlinear, and the correction factor function can be constructed based on this relationship.

[0162] In some embodiments, the analytical value of the measurement factor corresponding to each combination of geometric parameters can be determined by using the first relationship; and based on the error value between the simulation value and the analytical value of the measurement factor corresponding to each combination of geometric parameters, a range of geometric parameters corresponding to a target error value meeting a preset error requirement is screened out, so that the mechanical property data conversion is performed within the range of geometric parameters.

[0163] In the example embodiment, the error between the analytical value and the simulation value corresponding to different combinations of geometric parameters can be used to screen out a parameter range meeting a preset error requirement. For example, the preset error requirement is not greater than 5%, and then the points with error values not greater than 5% are screened out from (a) and (b), and then the corresponding range of geometric parameters is determined based on the screened points, such as 0.5≤R / d≤1.5, lo / d≥3 determined from (a) and (b). Figure 5 Figure 5 The range of geometric parameters determined from (a) and (b) is 0.5≤R / d≤1.5, lo / d≥3.

[0164] It should be noted that in the finite element simulation process of the above embodiments, the model adopts full model modeling, and the mesh division adopts three-dimensional eight-node brick element (C3D8R) with reduced integration. C3D8R is the element type, C represents a solid element, “3D” represents “three-dimensional”, “8” is the number of nodes that this element has, and “R” means that this element is a “reduced integration element”. Since the finite element prediction can depend on the mesh refinement method, a mesh sensitivity study has been previously performed to determine the best mesh strategy for the single material model.

[0165] S420, a correction factor function is constructed with the error correlation item as the independent variable.

[0166] In the example embodiment, a correction factor function can be defined by using Fourier polynomial transformation with the error correlation item as the independent variable. For example, the correction factor function ψ(R / d, n) defined with R / d and n as the independent variables is:

[0167]

[0168] In the formula, a . ,a2,a + ,…,a W are constant parameter items of Fourier polynomials, the above formula is expanded according to the Fourier series polynomial, and the expansion term is 9 terms.

[0169] It should be noted that the number of expansion terms will affect the accuracy of the correction. In practice, the specific number of expansion terms can be determined according to experience combined with the number of independent variables.

[0170] S430, the first relationship is corrected by using the correction factor function, and the second relationship is determined.

[0171] ​In the example embodiment, the measurement factor in the first relationship can be corrected by a correction factor function, and the specific formula is:

[0172]

[0173] wherein β YnZ,oH[ represents the corrected measurement factor, β YnZ represents the measurement factor determined by the first relationship, i.e., the measurement factor before correction, represents the correction factor function.

[0174] Exemplarily, the difference between the correction solution of the measurement factor determined based on the second relationship and the simulation value of the corresponding measurement factor can be taken as the objective function; by minimizing the objective function, the correction parameter in the correction factor function is solved by using the least square method to obtain the correction parameter solution; and the second relationship is determined according to the correction parameter solution.

[0175] In the example embodiment, the screening of the correction parameter combination can be performed by using Matlab programming to make the optimized correction solution infinitely close to the finite element simulation result.

[0176] Specifically, the difference between the corrected analytical solution and the finite element simulation value can be defined as the objective function, and the parameter array m=[a . ,a2,a + ,…,a W ] is continuously optimized by using the least square method, and the initial parameter array m0=[1,0,0,0,0,0,0,0,0] is set in the correction function, and the least square error value of the corresponding objective function is 0.26959 at this time, and by continuously optimizing the parameter combination, the error is reduced to 0.0013876 compared to before correction, and the parameter values in the finally optimized parameter combination are shown in Table 2.

[0177] Table 2 Parameter values in the correction factor function

[0178] Parameter a . ]]> [a2] a + ]]> a R ]]> a S ]]> Value 1.02690 -0.00455 -0.01176 0.00182 -0.00045 Parameter a T ]]> a U ]]> a V ]]> a W ]]> — Value 0.00059 -0.00041 0.00030 -0.00006 —

[0179] The determined parameter values are substituted into formula (23) and formula (24) to obtain the corrected second relationship. Figure 6 (a)-(d) are respectively the β value curves and error contour maps obtained based on the second relationship and the finite element simulation value under different conditions, from Figure 6 As can be seen from (a)-(d), the measurement factor value determined based on the corrected second relationship has a smaller error (less than or equal to 5%) with the simulation value within a certain range of geometric parameters, compared to Figure 5, the error is obviously reduced, which indicates the effectiveness of the correction of the first relationship by the present scheme. Within the given range of “0.5≤R / d≤1.5, lo / d≥3”, the error is less than or equal to 5%.

[0180] In step S140, the measurement factor value of the target test piece is determined by using the second relationship, and the first mechanical property data of the target test piece is converted based on the measurement factor value to obtain the second mechanical property data.

[0181] In the present example embodiment, the target test piece is a thin plate test piece and the size is smaller than the standard size test piece, i.e., the target test piece is a small size test piece. The first mechanical property data is the mechanical property data obtained after actual mechanical test of the target test piece, such as the stress-strain curve, strain-time curve, etc. obtained after tensile test for creep performance of the small size test piece. The second mechanical property data is used to indicate the mechanical property data of the standard size test piece corresponding to the first mechanical property data. The measurement factor value of the target test piece can be determined based on the second relationship, and the first mechanical property data is converted by using the measurement factor, and the mechanical property result of the standard size test piece corresponding to the target test piece is obtained after conversion.

[0182] It should be noted that the process of formula derivation of the present disclosure is based on the assumption of plane stress state, i.e., the plate is subjected to external force parallel to the direction of the plate. At this time, it can be assumed that there is no stress in the direction perpendicular to the plate, i.e., the stress in the direction perpendicular to the plate is 0. It can also be considered that other stresses are small enough to be ignored compared to the principal stress. Therefore, the applicable scenario of the method of the present disclosure should be for sufficiently thin test pieces, i.e., test pieces that meet the assumption of plane stress state.

[0183] The present disclosure realizes the detection of the creep performance of the conventional standard size test piece based on the creep test of the small test piece by designing the simplified analytical method of the creep strain in the miniaturized thin plate creep test, and reduces the cost and difficulty of the creep test. In the experimental operation, the non-contact measurement technology such as laser speckle and digital speckle can be avoided, which reduces the experimental cost while retaining the high accuracy of the material performance test result. The determined second relationship can be applied to different materials, which is convenient for popularization and application in engineering practice.

[0184] Further, in the present example embodiment, a mechanical property data conversion device 700 for a thin plate test piece is also provided. The mechanical property data conversion device 700 for the thin plate test piece can be applied to an electronic device. As shown in Figure 7 The mechanical property data conversion device 700 for the thin plate test piece can include:

[0185] The simulation value determination module 710 is configured to determine a simulation value of the measurement factor of the thin plate specimen according to simulation mechanical property data of the thin plate specimen; the simulation mechanical property data is obtained by performing a mechanical property simulation test on the thin plate specimen;

[0186] The relationship determination module 720 is configured to determine a first relationship between the measurement factor and the geometric parameter of the thin plate specimen according to a corresponding theory of each mechanical property;

[0187] The correction module 730 is configured to correct the first relationship based on the simulation value to obtain a second relationship between the measurement factor and the geometric parameter of the thin plate specimen;

[0188] The conversion module 740 is configured to determine a measurement factor value of a target specimen by using the second relationship, and convert first mechanical property data of the target specimen based on the measurement factor value to obtain second mechanical property data; the target specimen is the thin plate specimen and has a size smaller than that of a standard size specimen, and the second mechanical property data is used to indicate mechanical property data of the standard size specimen corresponding to the first mechanical property data.

[0189] In an example embodiment of the present disclosure, the thin plate specimen includes a uniform section, the simulation mechanical property data includes a steady creep rate value and an average strain rate value, and the simulation value determination module 710 is further configured to:

[0190] determine an equivalent standard length of the thin plate specimen based on the measurement factor;

[0191] construct a relationship between the average strain and the total deformation rate of the uniform section based on the equivalent standard length;

[0192] deduce a relationship between the average strain rate and the steady creep rate of the thin plate specimen under steady creep according to the relationship between the average strain and the total deformation rate;

[0193] determine the simulation value of the measurement factor of the thin plate specimen by using the steady creep rate value and the average strain rate value according to the relationship between the average strain rate and the steady creep rate under steady creep.

[0194] In an example embodiment of the present disclosure, the thin plate specimen includes a uniform section and a round corner section, and the relationship determination module 720 is further configured to:

[0195] determine a creep elongation rate corresponding expression of the uniform section and a creep elongation rate corresponding expression of the round corner section according to a Norton law of steady creep;

[0196] determine a total elongation rate expression of the thin plate specimen according to the creep elongation rate corresponding expression of the uniform section and the creep elongation rate corresponding expression of the round corner section;

[0197] determine an average strain expression of the uniform section;

[0198] The first relationship is determined according to a relationship between the average strain and the total elongation, the average strain expression, and the total elongation expression.

[0199] In an example embodiment of the present disclosure, the sheet specimen includes a uniform section and a fillet section, and the relationship determining module 720 is further configured to:

[0200] According to Hooke's law of elastic strain, the elastic elongation corresponding expression of the uniform section and the elastic elongation corresponding expression of the fillet section are determined;

[0201] According to Norton's law of steady-state creep, the creep elongation corresponding expression of the uniform section and the creep elongation corresponding expression of the fillet section are determined;

[0202] According to the creep elongation corresponding expression of the uniform section, the creep elongation corresponding expression of the fillet section, the elastic elongation corresponding expression of the uniform section, and the elastic elongation corresponding expression of the fillet section, the total elongation expression of the sheet specimen is determined;

[0203] The average strain expression of the uniform section is determined;

[0204] The first relationship is determined according to a relationship between the average strain and the total elongation, the average strain expression, and the total elongation expression.

[0205] In an example embodiment of the present disclosure, the correction module 730 is further configured to:

[0206] The error correlation term in the first relationship is determined;

[0207] The correction factor function is constructed with the error correlation term as the independent variable;

[0208] The first relationship is corrected by using the correction factor function, and the second relationship is determined.

[0209] In an example embodiment of the present disclosure, the correction module 730 corrects the first relationship by using the correction factor function by the following steps:

[0210] The difference between the corrected solution of the measurement factor determined based on the second relationship and the simulation value of the corresponding measurement factor is taken as the objective function;

[0211] By minimizing the objective function, the correction parameter in the correction factor function is solved by using the least square method to obtain a correction parameter solution value;

[0212] The second relationship is determined according to the correction parameter solution value.

[0213] In an example embodiment of the present disclosure, the apparatus 700 further includes:

[0214] The simulation module is configured to perform mechanical tests on the thin plate specimen under different combinations of geometric parameters by using finite element analysis, and obtain simulation mechanical property data corresponding to each combination of geometric parameters.

[0215] In an exemplary embodiment of the present disclosure, the device 700 further comprises a range determination module configured to determine an analytical value of the measurement factor corresponding to each combination of geometric parameters by using the first relationship before the first relationship is modified based on the simulation value; and screen out a geometric parameter range corresponding to a target error value meeting a preset error requirement based on an error value between the simulation value and the analytical value of the measurement factor corresponding to each combination of geometric parameters, so as to perform mechanical property data conversion within the geometric parameter range.

[0216] The specific details of each module or unit in the mechanical property data conversion device of the thin plate specimen have been described in detail in the mechanical property data conversion method of the corresponding thin plate specimen, and thus will not be described here again.

[0217] As another aspect, the present disclosure further provides a computer readable medium, which can be included in the electronic device described in the above embodiments, or can exist separately without being assembled into the electronic device. The computer readable medium carries one or more programs, which, when executed by the electronic device, cause the electronic device to implement the methods in the above embodiments. For example, the electronic device can implement each step shown in the above embodiments and the like. Figure 1 , Figure 4

[0218] ​It should be noted that the computer-readable medium shown in the present disclosure can be a computer-readable signal medium or a computer-readable storage medium or any combination of the two. The computer-readable storage medium may, for example, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present disclosure, the computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or apparatus. In the present disclosure, the computer-readable signal medium can include a data signal carried in a baseband or as a part of a carrier wave, which carries computer-readable program code. Such a propagated data signal can take various forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. The computer-readable signal medium can also be any computer-readable medium other than the computer-readable storage medium, which can send, propagate or transmit a program for use by or in conjunction with an instruction execution system, device or apparatus. The program code contained on the computer-readable medium can be transmitted by any suitable medium, including but not limited to wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0219] Figure 8 A structural schematic diagram of a computer system of an electronic device suitable for implementing embodiments of the present disclosure is shown.

[0220] It should be noted that Figure 8 The computer system 800 of the electronic device shown is only an example and should not impose any limitation on the functions and use range of embodiments of the present disclosure.

[0221] As Figure 8 shown, the computer system 800 includes a central processing unit (CPU) 801, which can perform various appropriate actions and processes according to programs stored in a read-only memory (ROM) 802 or programs loaded from a storage portion 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for system operation are also stored. The CPU 801, the ROM 802, and the RAM 803 are connected to each other through a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0222] The following components are connected to the I / O interface 805: an input part 806 including a keyboard, a mouse, etc.; an output part 807 including a display such as a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage part 808 including a hard disk, etc.; and a communication part 809 including a network interface card such as a LAN card, a modem, etc. The communication part 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the I / O interface 805 as necessary. A removable medium 811 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is attached to the drive 810 as necessary, so that a computer program read out therefrom is installed in the storage part 808 as necessary.

[0223] In particular, according to embodiments of the present disclosure, the processes described below with reference to the flowcharts can be implemented as a computer software program. For example, embodiments of the present disclosure include a computer program product comprising a computer program carried on a computer readable medium, the computer program containing program code for executing the methods illustrated by the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network by the communication part 809, and / or installed from the removable medium 811. When the computer program is executed by the central processing unit (CPU) 801, various functions defined in the methods and apparatus of the present application are performed.

[0224] The flowcharts and block diagrams in the drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowcharts or block diagrams can represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks can sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowcharts, and combinations thereof, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or combinations of special purpose hardware and computer instructions.

[0225] It should be noted that, although the various steps of the methods of the present disclosure are described in a particular order in the drawings, this does not require or imply that the steps must be performed in that particular order, or that all of the steps must be performed to achieve the desired result. Additional or alternative steps can be omitted, multiple steps can be combined into a single step, a single step can be divided into multiple steps, etc., all of which are considered to be part of the present disclosure.

[0226] It is to be understood that the disclosure disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text or drawings. All of these different combinations constitute various alternative aspects of the disclosure. The embodiments of the specification illustrate the best ways known to the inventor of carrying out the disclosure and the application thereof.

Claims

1. A method of converting mechanical property data of a sheet specimen, characterized by, The method comprises the following steps: According to the simulation mechanical property data of the thin plate test piece, the simulation value of the measurement factor corresponding to the thin plate test piece is determined; The simulation mechanical property data is obtained by performing a mechanical property simulation test on the thin plate test piece; According to the corresponding theory of each mechanical property, a first relationship between the measurement factor and the geometric parameter of the thin plate test piece is determined; The first relationship is corrected based on the simulation value to obtain a second relationship between the measurement factor and the geometric parameter of the thin plate test piece; The measurement factor value of the target test piece is determined by using the second relationship, and the first mechanical property data of the target test piece is converted based on the measurement factor value to obtain second mechanical property data; the target test piece is a thin plate test piece and has a size smaller than that of a standard size test piece, and the second mechanical property data is used to indicate the mechanical property data of the standard size test piece corresponding to the first mechanical property data.

2. The method of claim 1, wherein, The thin plate test piece comprises a uniform section, and the simulation mechanical property data comprises a steady-state creep rate value and an average strain rate value. According to the simulation mechanical property data of the thin plate test piece, the simulation value of the measurement factor corresponding to the thin plate test piece is determined, which comprises the following steps: An equivalent standard length of the thin plate test piece is determined based on the measurement factor; A relationship between the average strain and the total deformation rate of the uniform section is constructed based on the equivalent standard length; A relationship between the average strain rate under steady-state creep and the steady-state creep rate of the thin plate test piece is derived according to the relationship between the average strain and the total deformation rate; The simulation value of the measurement factor corresponding to the thin plate test piece is determined by using the steady-state creep rate value and the average strain rate value according to the relationship between the average strain rate under steady-state creep and the steady-state creep rate.

3. The method of claim 1, wherein, The thin plate test piece comprises a uniform section and a round corner section. According to the corresponding theory of each mechanical property, the first relationship between the measurement factor and the geometric parameter is determined, which comprises the following steps: According to the Norton law of steady-state creep, a corresponding expression of the creep elongation rate of the uniform section and a corresponding expression of the creep elongation rate of the round corner section are determined; A total elongation rate expression of the thin plate test piece is determined according to the corresponding expression of the creep elongation rate of the uniform section and the corresponding expression of the creep elongation rate of the round corner section; An average strain expression of the uniform section is determined; The first relationship is determined according to the relationship between the average strain and the total elongation rate, and the average strain expression and the total elongation rate expression.

4. The method of claim 1, wherein, The thin plate test piece comprises a uniform section and a round corner section. According to the corresponding theory of each mechanical property, the first relationship between the measurement factor and the geometric parameter is determined, which comprises the following steps: According to the Hooke law of elastic strain, a corresponding expression of the elastic elongation rate of the uniform section and a corresponding expression of the elastic elongation rate of the round corner section are determined; According to the Norton law of steady-state creep, a corresponding expression of the creep elongation rate of the uniform section and a corresponding expression of the creep elongation rate of the round corner section are determined; A total elongation rate expression of the thin plate test piece is determined according to the corresponding expression of the creep elongation rate of the uniform section, the corresponding expression of the creep elongation rate of the round corner section, the corresponding expression of the elastic elongation rate of the uniform section, and the corresponding expression of the elastic elongation rate of the round corner section. determining an average strain expression of the uniform section; determining the first relationship according to a relationship between the average strain of the uniform section and the total elongation and the average strain expression and the total elongation expression.

5. The method of claim 1, wherein, The correcting the first relationship based on the simulation value comprises: determining an error correlation term in the first relationship; constructing a correction factor function with the error correlation term as an independent variable; correcting the first relationship by using the correction factor function to determine the second relationship.

6. The method of claim 5, wherein, The correcting the first relationship by using the correction factor function comprises: taking a difference between a correction solution of a measurement factor determined based on the second relationship and a simulation value of the corresponding measurement factor as an objective function; solving a correction parameter in the correction factor function by using a least square method to obtain a correction parameter solution value by minimizing the objective function; determining the second relationship according to the correction parameter solution value.

7. The method of claim 1, wherein, The method further comprises: performing a mechanical test of the thin plate specimen under different combinations of geometric parameters by using finite element analysis to obtain simulation mechanical property data corresponding to each combination of geometric parameters.

8. The method of claim 7, wherein, Before the correcting the first relationship based on the simulation value, the method further comprises: determining an analytical value of the measurement factor corresponding to each combination of geometric parameters by using the first relationship; filtering out a geometric parameter range corresponding to a target error value meeting a preset error requirement based on an error value between a simulation value and a corresponding analytical value of the measurement factor corresponding to each combination of geometric parameters to perform the mechanical property data conversion within the geometric parameter range.

9. A device for converting mechanical property data of thin plate specimens, characterized in that, comprise: a simulation value determination module configured to determine a simulation value of a measurement factor corresponding to a thin plate specimen according to simulation mechanical property data of the thin plate specimen; the simulation mechanical property data is obtained by performing a mechanical property simulation test on the thin plate specimen; a relationship determination module configured to determine a first relationship between the measurement factor and geometric parameters of the thin plate specimen according to a corresponding theory of each mechanical property; a correction module configured to correct the first relationship based on the simulation value to obtain a second relationship between the measurement factor and the geometric parameters of the thin plate specimen; a conversion module configured to determine a measurement factor value of a target specimen by using the second relationship and convert first mechanical property data of the target specimen based on the measurement factor value to obtain second mechanical property data; the target specimen is a thin plate specimen and has a size smaller than a standard size specimen, and the second mechanical property data is used to indicate mechanical property data of the standard size specimen corresponding to the first mechanical property data.

10. An electronic device, comprising: comprise: one or more processors; a storage device configured to store one or more programs, which, when executed by the one or more processors, cause the one or more processors to implement the method according to any one of claims 1-7.