Colorable PID-resistant carbon fiber photovoltaic module frame

Abstract

The present application relates to the technical field of photovoltaic modules, and discloses a colorable PID-resistant carbon fiber photovoltaic module frame, which comprises a frame body, a honeycomb layer plate embedded in the frame body, and a plurality of regular hexagonal honeycomb cells arrayed in the honeycomb layer plate, wherein the honeycomb cells are filled with microcapsules containing oxidizable curing repair materials, and water-absorbing resin is arranged in the honeycomb cells and located at the front end of the microcapsules; the honeycomb cells have a tapered structure with a narrow front and a wide rear, and are used for guiding the directional flow of the repair materials to the crack area. The colorable PID-resistant carbon fiber photovoltaic module frame is characterized in that the water-absorbing resin expands when wet, triggers the rupture of the microcapsules, and the released repair materials flow directionally along the tapered honeycomb cells to the crack area, form a high-insulation sealing layer after oxidation and curing, and completely block the moisture penetration path; the detachable shell cooperates with the heat-softening sealant structure, supports the convenient replacement of the honeycomb layer plate, and greatly prolongs the service life.

Description

Technical Field

[0001] This invention relates to the technical field of photovoltaic modules, and more particularly to a colorable, anti-PID carbon fiber photovoltaic module frame. Background Technology

[0002] In recent years, the performance of the photovoltaic module frame, as a key structural component for protecting the internal cells, directly affects the module's resistance to potential-induced degradation. Although traditional aluminum alloy frames have good mechanical strength, they suffer from high density and weight gain, electrochemical corrosion risks, and limitations in colorability, making it difficult to meet the needs of building-integrated photovoltaics. More seriously, the conductivity of aluminum alloys can exacerbate the PID effect in high humidity environments, leading to module power degradation.

[0003] Microcracks trigger a PID chain reaction, which is caused by outdoor thermal stress cycles leading to microcrack propagation, and moisture seeping in along the cracks to form electrolyte channels, causing leakage current between the cell and the frame. The leakage current triggers ion migration, leading to the failure of the cell passivation layer and a sharp drop in module power.

[0004] Therefore, considering self-healing technology and combining existing technologies, three methods were experimentally proposed. The first method uses microbial mineralization microcapsules, which has a long repair cycle and the mineralization products contain conductive calcium ions, which in turn form leakage channels. The second method uses dicyclopentadiene microcapsules, which rely on catalysts and cannot polymerize without a catalytic environment. The third method uses epoxy resin microcapsules, which cure slowly at room temperature and are limited at high temperatures, delaying repair and causing continuous moisture intrusion, thus resulting in excessive wet leakage current.

[0005] Existing technologies cannot simultaneously meet the triple requirements of rapid self-healing, high insulation, and resistance to moisture penetration, resulting in poor performance in addressing the PID effect. Summary of the Invention

[0006] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0007] In view of the problems existing in the current colorable anti-PID carbon fiber photovoltaic module frames, the present invention is proposed.

[0008] Therefore, the purpose of this invention is to provide a colorable anti-PID carbon fiber photovoltaic module frame that simultaneously meets the triple requirements of rapid self-healing, high insulation, and resistance to moisture penetration.

[0009] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a colorable anti-PID carbon fiber photovoltaic module frame, comprising a frame body having a hollow structure inside;

[0010] A honeycomb layer is embedded in the hollow structure of the frame body, and the honeycomb layer is composed of multiple regular hexagonal honeycomb grids;

[0011] Microcapsules are filled inside the honeycomb grid, and the inside of the microcapsules encapsulates a repair material that can be oxidized and cured;

[0012] Water-absorbing resin is disposed within the honeycomb grid and located at the front end of the microcapsule;

[0013] The honeycomb grid has a cone-shaped structure that is narrow at the front and wide at the back, which is used to guide the repair material to flow in a directional manner to the crack area.

[0014] The above technical solution involves setting a honeycomb layer inside the frame, with each cell filled with microcapsules and absorbent resin. The microcapsules encapsulate an oxidizable and curable repair material. The honeycomb cells adopt a tapered design, narrower at the front and wider at the back. When the front end is close to the crack area on the inner wall of the frame, it guides the repair material to flow directionally to the damaged area. When a crack occurs, allowing moisture to seep in, the absorbent resin expands upon contact with moisture to form a hydrogel, physically compressing the microcapsules to rupture and release the repair material. The repair material flows along the tapered channel to the crack, where it oxidizes and cures upon contact with air, forming a dense sealing layer. This structure achieves triple protection: actively repairing cracks, blocking moisture penetration paths, and forming a high-insulation barrier, eliminating the physical basis for potential-induced attenuation at its source.

[0015] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, the frame body is a detachable structure, including an upper shell and a lower shell that are symmetrical to each other;

[0016] The upper and lower housings are sealed together by a sealant silicone adhesive.

[0017] Using the above technical solution, the frame consists of a symmetrical upper shell and a lower shell, which are bonded together with low-temperature curing silicone sealant. The silicone sealant fills the assembly gaps and forms an elastic sealing layer. After curing, it has a low expansion rate, effectively preventing external moisture intrusion. The split design allows for the removal of the outer shell to replace the internal honeycomb layer. When the repair function is exhausted, only partial replacement is needed instead of complete scrapping. During disassembly, the silicone sealant is softened by heating, peeled off, and then a new honeycomb layer is inserted and re-inserted for curing. This design significantly extends the service life of the frame and adapts to the customized maintenance needs of different corrosive environments such as deserts and coastal areas.

[0018] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, wherein: a positioning block and a limiting block are respectively provided on the outer side of the upper shell and the lower shell;

[0019] Limiting grooves are respectively provided inside the positioning block and the limiting block.

[0020] Using the above technical solution, the positioning block is fixed to the edge of the upper shell, and the limiting block is correspondingly set in the lower shell. Both blocks have the same thickness as the shells, forming a continuous plane. Limiting grooves are formed inside the positioning and limiting blocks, with the grooves having a gradually varying depth. During assembly, a vertical alignment reference is established through the limiting grooves, ensuring that the upper and lower shells are completely overlapped without misalignment. This mechanical positioning method eliminates manual alignment errors, prevents the sealing silicone from cracking due to shell misalignment, and maintains long-term sealing integrity.

[0021] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, the limiting groove is a conical structure that is narrow at the top and wide at the bottom;

[0022] The locking element is movably inserted into the limiting groove to lock the vertical position of the positioning block and the limiting block.

[0023] The above technical solution employs a conical structure with a narrower top and wider bottom, where the inner wall's inclination angle matches the outer contour of the locking component. The locking component can be inserted into the limiting groove; when the bottom end of the locking component contacts the conical surface of the groove bottom, its outer wall forms a surface contact with the groove wall. The conical structure converts the axial pressure of the locking component into a radial expansion force, ensuring a tight fit between the locking component and the groove wall. This design offers three advantages: automatic guidance and correction of positional deviations during insertion; increased contact surface for enhanced shear strength; and a self-locking effect from the conical surface to prevent loosening. This plug-in locking system significantly simplifies the assembly process while providing mechanical stability against vibration and impact.

[0024] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, the locking member includes:

[0025] A threaded handle is located at the top of the locking element;

[0026] A cast iron disc is located inside the cavity of the locking component and is movably connected to the threaded rod of the threaded handle;

[0027] The conical block is located below the cast iron disk;

[0028] A compression spring is placed between the cast iron disc and the conical block;

[0029] The steel ball is located in a spherical groove on the surface of the locking element and is partially exposed due to the pressure of the conical block.

[0030] The above technical solution involves a top threaded handle connected to a middle cast iron disc, with a conical block positioned below the disc, connected by a compression spring. Tightening the threaded handle pushes the cast iron disc downwards, compressing the spring and causing the conical block to move vertically. A steel ball is positioned between the outer wall of the conical block and the inner cavity of the locking element, partially embedded in a spherical groove. As the conical block moves downwards, its conical surface compresses the steel ball, causing it to protrude radially outwards from the locking element. This design converts the axial rotational force of manual tightening into a radial mechanical expansion force, achieving physical locking through the protrusion of the steel ball.

[0031] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, wherein: the inclined end of the outer surface of the conical block and the inclined end of the bottom of the limiting groove form a right-angle enclosing structure;

[0032] When the conical block is pressed down, the steel ball forms a lever force with the bottom of the limiting groove to lock it in place.

[0033] Using the above technical solution, the steel ball partially protrudes from the surface of the locking component when the conical block is pressed down, forming a point-to-surface contact with the inclined conical surface at the bottom of the limiting groove. When an external force attempts to separate the positioning block and the limiting block, the steel ball experiences a compressive reaction force from the inclined surface of the limiting groove. This force is transmitted along the center of the steel ball to the inclined contact surface of the conical block. Because the two inclined surfaces form a right-angled envelope, the reaction force is decomposed into a component perpendicular to the direction of movement of the conical block, causing the conical block to press the steel ball more tightly. This leverage effect increases the locking force with the increase of the external force, achieving complete mechanical self-locking and completely avoiding the risk of accidental unlocking under vibration conditions.

[0034] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, the frame body is an integrally molded structure, and the shape of its internal hollow part is completely fitted with the honeycomb layer.

[0035] Using the above technical solution, the internal hollow structure of the frame body perfectly matches the shape of the honeycomb layer. After the honeycomb layer is embedded, it forms a seamless fit with the inner wall of the frame, eliminating assembly gaps in the split structure. The overall structure can resist high-pressure water penetration in a water immersion environment and prevent particulate matter intrusion and friction damage under high dust conditions. Although replaceability is sacrificed, the repair life is compensated by increasing the microcapsule filling rate, making it particularly suitable for extreme scenarios where maintenance is difficult, such as offshore power plants and desert power plants.

[0036] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, the water-absorbing resin is granular, expands upon contact with water vapor to form a hydrogel, and releases the repair material by squeezing the microcapsules.

[0037] Using the above technical solution, water-absorbing resin is pre-placed in granular form at the front end of the microcapsule. When moisture seeps into the honeycomb cell due to cracks, the resin particles absorb water and expand hundreds of times in volume. The expanded resin forms a hydrogel with a three-dimensional network structure. This gel does not release water under pressure but continues to fill the honeycomb cell space. The continuous expansion of the hydrogel generates uniform lateral pressure, gradually squeezing the microcapsule until its wall material ruptures. This physical triggering mechanism requires no electricity or heat source; it relies solely on ambient humidity to automatically activate the repair function, achieving a truly passive intelligent response.

[0038] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, the wall material of the microcapsule is polyurethane, and the core material includes an oxidative curing repair monomer and an initiator.

[0039] Using the above technical solution, the microcapsules employ polyurethane as the wall material, whose molecular chains contain urethane groups, maintaining chemical inertness in the alkaline environment of concrete and preventing premature degradation of the repair material. The core material contains an oxidatively curable monomer and a peroxide initiator. Upon contact with air, the monomer initiates a free radical chain reaction, transforming from a liquid to a solid polymer. The cured product forms a cross-linked network structure, both sealing cracks and providing a light-insulating layer with a volume resistivity exceeding the standard, thus doubly blocking electron migration and ion permeation channels.

[0040] As a preferred embodiment of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention, wherein: the conical front end of the honeycomb grid faces the inner wall surface of the frame body, and the rear end faces the central axis of the honeycomb layer.

[0041] Using the above technical solution, the honeycomb grid conical structure has a narrow front opening facing the inner wall of the frame, and a wide rear opening facing the central axis of the honeycomb layer. When the repair material is released from the ruptured microcapsules, it flows along the conical space under the pressure of the hydrogel. The narrow-front, wide-rear geometry generates a Venturi effect, accelerating the convergence of the repair material towards the crack area on the inner wall of the frame. Simultaneously, the conical channel blocks reverse flow, ensuring that the repair material preferentially fills the cracks rather than flowing back into the honeycomb grid. This design improves repair efficiency and significantly enhances crack coverage integrity with the same amount of material.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] The water-absorbing resin expands upon contact with moisture, triggering the rupture of microcapsules. The released repair material flows directionally along the conical honeycomb grid to the crack area. After oxidation and curing, it forms a highly insulating sealing layer, completely blocking the moisture penetration path and eliminating the risk of potential-induced decay. The detachable shell, combined with the heat-softening sealant structure, supports convenient replacement of the honeycomb layer, significantly extending its service life. The integrated structure improves the sealing reliability in harsh environments and adapts to diverse application scenarios. The locking mechanism, through the lever self-locking mechanism of steel balls and conical blocks, maintains a stable locking force in vibration environments, ensuring the long-term sealing integrity of the frame. The synergistic effect of crack repair, moisture barrier, and high insulation barrier solves the industry problem of existing technologies being unable to simultaneously achieve rapid self-repair, high insulation, and resistance to moisture penetration. Attached Figure Description

[0044] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0045] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention.

[0046] Figure 2 This is a schematic diagram of the internal cross-sectional structure of the frame body in Embodiment 2 of the present invention, which is a colorable anti-PID carbon fiber photovoltaic module frame.

[0047] Figure 3 This is a schematic diagram of the internal cross-sectional structure of the positioning block and limiting block of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention.

[0048] Figure 4 This is a schematic diagram of the internal cross-sectional structure of the locking component of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention.

[0049] Figure 5 This is a schematic diagram of the disassembly and assembly structure of the positioning block, limiting block, and locking component of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention.

[0050] Figure 6 This is a schematic diagram showing the movement of the microcapsules and water-absorbing resin in the frame of the colorable anti-PID carbon fiber photovoltaic module of the present invention.

[0051] Figure 7 This is a schematic diagram showing the sealing silicone junction filling state of the colorable anti-PID carbon fiber photovoltaic module frame according to the present invention.

[0052] Figure 8This is a schematic diagram of the process structure for replacing the honeycomb layer of the frame of the colorable anti-PID carbon fiber photovoltaic module according to the present invention.

[0053] Figure 9 This is a schematic diagram of the process structure of the microcapsules and water-absorbing resin filling state of the colorable anti-PID carbon fiber photovoltaic module frame of the present invention.

[0054] Figure 10 This is a schematic diagram of the crack repair structure of the microcapsule prepared in Comparative Example 1 of the present invention.

[0055] Figure 11 This is a schematic diagram of the crack repair structure of the microcapsule prepared in Comparative Example 2 of the present invention.

[0056] Figure 12 This is a schematic diagram of the crack repair structure of the microcapsule used in Example 1 of the present invention.

[0057] In the diagram: 1. Frame body; 2. Upper shell; 3. Lower shell; 4. Honeycomb layer; 5. Honeycomb grid; 6. Microcapsule; 7. Water-absorbing resin; 8. Positioning block; 9. Limiting block; 10. Limiting groove; 11. Locking element; 12. Threaded handle; 13. Spherical groove; 14. Steel ball; 15. Cast iron disc; 16. Conical block; 17. Compression spring; 18. Sealing silicone. Detailed Implementation

[0058] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0059] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0060] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0061] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example 1

[0062] Reference Figures 1-7 The first embodiment of the present invention provides a colorable, PID-resistant carbon fiber photovoltaic module frame, the device comprising:

[0063] The frame body 1 is either detachable or integrally molded. In this embodiment, it is detachable. The frame body 1 is composed of an upper shell 2 and a lower shell 3. The upper shell 2 and the lower shell 3 are symmetrical, and the interior between them is a hollow structure. The shape of the hollow part fits the shape of the honeycomb layer 4.

[0064] The size of the honeycomb layer 4 is the sum of the internal volumes of the upper shell 2 and the lower shell 3. The outer surface of the honeycomb layer 4 is composed of several regular hexagonal honeycomb arrays. Each independent honeycomb cell 5 has the same volume structure inside. The honeycomb cell 5 contains microcapsules 6 and water-absorbing resin 7. The microcapsules 6 occupy 60% of the volume space of the honeycomb cell 5 and have a diameter of 80±10μm, forming a nested structure of microcapsules 6. The microcapsules 6 are filled with triethylene glycol dimethacrylate. This material is liquid and fills the cracks. After oxidation, it gradually solidifies and finally forms a repair structure.

[0065] The honeycomb cell 5 contains microcapsules 6 containing a chelating agent. The ratio of microcapsules 6 to triethylene glycol dimethacrylate is 1:50. The amount of chelating agent is relatively small, and the honeycomb cell 5 has a conical structure, narrow at the front and wide at the back. Figure 1 As shown in the enlarged view, the solvent can be guided to flow.

[0066] The honeycomb cell 5 is also equipped with a water-absorbing resin 7, which has a granular structure. The water-absorbing resin 7 is pre-positioned at the front end of the microcapsule 6. When cracks are generated on the surface of the frame body 1, external water vapor penetrates into the space between the honeycomb cell 5 and the frame body 1. The water-absorbing resin 7 absorbs the water vapor and expands, expanding to hundreds of times its original volume. After the water-absorbing resin 7 expands, it forms a hydrogel. Even if the hydrogel is pressed against itself, its material properties cannot separate the water. Therefore, the expanded hydrogel fills the inside of the honeycomb cell 5. Since the honeycomb cell 5 is filled, it will compress the microcapsule 6. After the microcapsule 6 is compressed, it will rupture. The triethylene glycol dimethacrylate inside the microcapsule 6 flows from the gap of the hydrogel to the gap of the frame body 1 and becomes solid after oxidation. Therefore, the expansion of the water-absorbing resin generates uniform lateral pressure, which pushes the microcapsule to move towards the crack and rupture.

[0067] Temperature conditions:

[0068] system Temperature range time Pure TEGDMA + BPO 60-80℃ 30-60 minutes TEGDMA+BPO+DMT 0.5% Ambient temperature -40℃ 5-15 minutes

[0069] Curing time:

[0070] Light intensity Curing time 1mm thickness 500mW / cm² 20-40 seconds 1000mW / cm² 10-20 seconds

[0071] Formula ingredient ratio:

[0072] Element Proportion effect TEGDMA 30-50% Reduce viscosity and increase conversion rate Bis-GMA 50-70% Enhance mechanical strength Photoinitiator (TPO) 0.5-1.5% Trigger aggregation silicon dioxide 50-70wt% Enhanced wear resistance

[0073] Preparation method of triethylene glycol dimethacrylate (TEGDMA) microcapsules:

[0074] The raw materials are the capsule core, TEGDMA-90g and benzoyl peroxide 0.9g, the wall material is diphenylmethane diisocyanate 15g and ethylenediamine 10g, and the solvent is cyclohexane 200ml;

[0075] The steps are as follows:

[0076] S1. TEGDMA and benzoyl peroxide were mixed and dissolved in an oil phase, and then 15g of diphenylmethane diisocyanate was added and stirred for 30 minutes under nitrogen protection.

[0077] S2. Dissolve 10g of ethylenediamine in 300mL of 0.5% PVA solution at 45°C using an aqueous phase preparation method.

[0078] S3. Using interfacial polymerization again, the oil phase is injected into the water phase and stirred at 1200 rpm. Then, the stirring environment is heated to 60 degrees Celsius and reacted for 2 hours, finally forming the polyurethane wall material in situ.

[0079] S4. Finally, the mixture is filtered, washed three times with cyclohexane, and vacuum dried at 35 degrees Celsius for no less than 12 hours. It is then sieved through a 75-105μm mesh sieve to obtain transparent spherical microcapsules.

[0080] The repair mechanism involves triethylene glycol dimethacrylate rapidly curing at 40-80 degrees Celsius under the action of an oxidant, with a curing time of 30-60 minutes. After the lipid expands and squeezes the microcapsules to rupture, the liquid monomers come into contact with air and oxidize and solidify, forming a dense polymer that fills the cracks.

[0081] The honeycomb layer 4 is composed of honeycomb cells 5. Therefore, each honeycomb cell 5 has a repairable crack-repairing honeycomb cell 5 on the surface of the frame body 1, thus fully covering the entire frame body 1.

[0082] The connection between the upper shell 2 and the lower shell 3 is filled with sealing silicone 18. Before installation, liquid sealing silicone 18 is filled between the upper shell 2 and the lower shell 3. This sealing silicone 18 is cured at low temperature to fill the assembly gap. After curing, the expansion rate is 5%, so its own volume change is not significant, preventing water vapor from seeping in from the assembly gap. The detachable structure of the upper shell 2 and the lower shell 3 can adapt to various application scenarios and facilitate the disassembly and assembly of the internal honeycomb layer 4. When it is necessary to replace the honeycomb layer 4, the sealing silicone 18 needs to be softened by high temperature. The temperature should be above 120 degrees Celsius and the heating time should be between 15 and 20 minutes. After softening, it can be directly peeled off. Then the honeycomb layer 4 is embedded between the upper shell 2 and the lower shell 3. Then, an appropriate amount of sealing silicone 18 material is added again as needed and cured.

[0083] After the sealing process, the upper shell 2 and the lower shell 3 still need to be vertically limited. The vertical limiting structure includes a positioning block 8 and a limiting block 9. The positioning block 8 and the limiting block 9 are respectively set on the outside of the upper shell 2 and the lower shell 3 of the frame body 1, and the positioning block 8 and the limiting block 9 have matching shapes and the same thickness as the corresponding upper shell 2 and lower shell 3.

[0084] The upper housing 2 and the lower housing 3 are respectively provided with limiting grooves 10. The limiting grooves 10 are narrow at the top and wide at the bottom. The bottom of the limiting grooves 10 is a conical structure. The conical structure is also narrow at the top and wide at the bottom. The inclined surface of the limiting grooves 10 corresponds to the position of the spherical grooves 13 of the locking member 11. The spherical grooves 13 are distributed in a ring inside the locking member 11, and the locking member 11 is movably inserted into the limiting grooves 10.

[0085] When the bottom of the limiting groove 10 is in contact with one end of the locking member 11, it indicates that the locking member 11 is successfully positioned. The locking member 11 includes a threaded handle 12, a spherical groove 13, a steel ball 14, a cast iron disc 15, a conical block 16, and a compression spring 17. The threaded handle 12 is located at the top of the locking member 11, and the bottom of the threaded handle 12 is a threaded rod that is threadedly connected to the locking member 11. The cast iron disc 15 is circular and is preset in the internal cavity of the locking member 11. The outer edge curvature of the cast iron disc 15 is the same as the inner edge curvature of the locking member 11. The center end of the cast iron disc 15 is movably connected to the threaded rod at one end of the threaded handle 12. The conical block 17... 6 is located in the cavity of the locking member 11, at the bottom of the cast iron disc 15. The outer edge curvature of the top of the conical block 16 is the same as that of the outer edge of the cast iron disc 15. A compression spring 17 is provided between the conical block 16 and the cast iron disc 15. The compression spring 17 is movable between the cast iron disc 15 and the conical block 16. The steel ball 14 is preset inside the spherical groove 13. The surface of the locking member 11 is provided with an annular array of spherical grooves 13. The central axis of the spherical groove 13 is biased towards one side of the conical block 16. Therefore, under the compression of the conical block 16, the space for the steel ball 14 to extend outward from the surface of the locking member 11 is limited and does not exceed one-third of its own volume.

[0086] The top of the threaded handle 12 is provided with an annular anti-slip protrusion. The threaded handle 12 can be rotated to generate threaded transmission with the locking member 11. The threaded rod of the threaded handle 12 controls the cast iron disc 15 to move up and down under the threaded transmission. The cast iron disc 15 slides in cooperation with the inner wall of the locking member 11. During the sliding process, the cast iron disc 15 affects the state of the compression spring 17. When the compression spring 17 is in the compressed state, it can move vertically in sync with the cone block 16.

[0087] The inclined end of the outer surface of the conical block 16 forms a right-angle encircling structure with the inclined end of the bottom of the limiting groove 10. The steel ball 14 rolls along the outer surface of the conical block 16. As the conical block 16, which is wider at the top and narrower at the bottom, moves downwards, it continuously compresses the steel ball 14, causing it to extend outwards inside the spherical groove 13 until it is pressed against the outermost inner wall of the spherical groove 13. At this point, the steel ball 14 is in contact with the inclined surface at the bottom of the limiting groove 10. Therefore, the steel ball 14 is stuck between the limiting groove 10 and the conical block 16. The angle difference between the contact surfaces of block 16 and the steel ball 14, due to the outward extension of one-third of itself, forms a lever force with the limiting groove 10 and the conical block 16. The limiting groove 10 requires a greater squeezing force to affect the movement of the steel ball 14. The steel ball 14 is blocked by the outer wall of the conical block 16. The position and height of the conical block 16 are controlled by the compression spring 17 in a compressed state. The compression spring 17 provides the reset elastic force of the conical block 16. The locking force is generated entirely by the lever effect between the steel ball 14 and the inclined plane. Example 2

[0088] Reference Figure 2 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the frame body 1 is integrally formed and the inside of the frame body 1 is a hollow structure. The shape of the hollow part fits the shape of the honeycomb layer plate 4.

[0089] The size of the honeycomb layer 4 is the total volume of the frame body 1. The outer surface of the honeycomb layer 4 is composed of several regular hexagonal honeycomb arrays. Each independent honeycomb cell 5 has the same volume structure inside. The honeycomb cell 5 contains microcapsules 6 and water-absorbing resin 7. The microcapsules 6 occupy 60% of the volume space of the honeycomb cell 5 and have a diameter of 80±10μm to form a nested structure of microcapsules 6. The initial volume of the water-absorbing resin is ≤5%. After expansion, it fills the remaining 40% of the space and squeezes the microcapsules. The microcapsules 6 are filled with triethylene glycol dimethacrylate. This material is liquid and fills the cracks. After oxidation, it gradually solidifies and finally forms a repair structure.

[0090] The honeycomb cell 5 is also equipped with a water-absorbing resin 7, which has a granular structure. The water-absorbing resin 7 is pre-positioned at the front end of the microcapsule 6. When cracks are generated on the surface of the frame body 1, external water vapor penetrates into the space between the honeycomb cell 5 and the frame body 1. The water-absorbing resin 7 absorbs the water vapor and expands, expanding to hundreds of times its original volume. After the water-absorbing resin 7 expands, it forms a hydrogel. Even if the hydrogel is pressed against each other, its material properties cannot separate the water. Therefore, the expanded hydrogel fills the inside of the honeycomb cell 5. Since the honeycomb cell 5 is filled, it will compress the microcapsule 6. After the microcapsule 6 is compressed, it will rupture. The triethylene glycol dimethacrylate inside the microcapsule 6 flows from the gap of the hydrogel to the gap of the frame body 1 and becomes solid after oxidation.

[0091] The honeycomb layer 4 is composed of honeycomb cells 5. Therefore, each honeycomb cell 5 has a repairable crack-repairing honeycomb cell 5 on the surface of the frame body 1, thus fully covering the entire frame body 1.

[0092] Compared to Embodiment 1, the frame body 1 is integrally molded, which differs from the application scenario of Embodiment 1. The frame body 1 in this embodiment cannot replace the internal honeycomb layer 4, lacking a certain degree of flexibility. However, the sealing performance is significantly improved compared to Embodiment 1. The frame body 1 is suitable for harsher environments, such as installation immersed in water and high dust environments. When the lifespan of the frame body 1 is nearing its end after cracks are formed and repaired, the entire frame body 1 needs to be replaced. Frame bodies 1 with corresponding molding methods can be selected for different environments. This embodiment extends the service life by increasing the microcapsule filling density to 80%.

[0093] The remaining structure is the same as that in Example 1.

[0094] Comparative Example 1

[0095] Reference Figure 10 This embodiment describes the preparation method of the dicyclopentadiene material of the present invention. This embodiment differs from the first embodiment in that it includes the following steps:

[0096] The raw material core is made of dicyclopentadiene, the capsule wall is made of 10g urea, 25ml formaldehyde solution and 0.5g ammonium chloride, and the emulsifier is 1g sodium dodecyl sulfate;

[0097] S1. Add 100g of dicyclopentadiene and 1g of sodium dodecyl sulfate to 500mL of deionized water, and emulsify at 8000rpm at 40℃ for 15 minutes to form an O / W emulsion (particle size 50-100μm).

[0098] S2, 10g of urea, 25mL of formaldehyde, pH adjusted to 8.0, and reacted at 70℃ for 1 hour to obtain a transparent urea-formaldehyde resin prepolymer;

[0099] S3. Add the prepolymer to the emulsion, stir at 300 rpm, and add 10% ammonium chloride solution dropwise. Then adjust the pH to 2.5 and react at 55°C for 3 hours to obtain microcapsule formation.

[0100] S4. First, filter the product and wash it three times with deionized water. After drying it under vacuum at 40°C for 24 hours, sieve it (75-105μm) to obtain white powdery microcapsules.

[0101] Dicyclopentadiene requires ring-opening polymerization (ROMP) under the action of a catalyst, but the lack of an effective catalyst in the cracked environment of the photovoltaic frame prevents the polymerization reaction from being triggered, and the repair material remains in a liquid state and cannot be solidified.

[0102] Comparative Example 2

[0103] Reference Figure 11 This embodiment describes the preparation method of the epoxy resin material of the present invention. This embodiment differs from the first embodiment in that it includes the following steps:

[0104] The core material is made of 80g of epoxy resin and 20g of m-phenylenediamine, the wall material is made of 15g of gelatin and 15g of gum arabic, and the curing agent is 5ml of glutaraldehyde.

[0105] S1. Dissolve 15g of gelatin and 15g of gum arabic in 500mL of deionized water, then dissolve at 50℃ and adjust the pH to 4.5.

[0106] S2. A mixture of epoxy resin and curing agent is added dropwise and emulsified at 4000 rpm for 20 minutes to form a W / O / W double emulsion (particle size ~80μm).

[0107] S3. After the emulsion is cooled to 10°C, it is slowly stirred at 300 rpm for 1 hour, followed by the addition of 5 mL of glutaraldehyde for cross-linking and curing for 2 hours.

[0108] S4. After centrifugation, washing with cold water, freeze-drying for 48 hours, and sieving (75-105μm), pale yellow microcapsules were obtained.

[0109] Epoxy resins require amine curing agents to trigger the crosslinking reaction at temperatures above 60°C. The reaction rate at room temperature is extremely low (>2 hours), resulting in delayed crack filling.

[0110] The following comparative table, along with the accompanying drawings, illustrates the implementation steps of Comparative Example 1, Comparative Example 2, and Example 1, and includes the following comparative table:

[0111] Repair effect comparison:

[0112] Test metrics Comparative Example 1 (DCPD) Comparative Example 2 (EPOX) Example 1 (TEGDMA) Crack filling rate ≤18% 42% 95% The decrease in water absorption rate 8% 22% 92% Insulation resistance recovery rate ＜30% 65% ＞98%

[0113] Comparison of key process control points:

[0114] parameter Comparative Example 1 (DCPD) Comparative Example 2 (Epoxy Resin) Example 1 (TEGDMA) reaction type In-situ polymerization Reconstitution Interface aggregation Temperature control 55±2℃ 10℃ low temperature gel 60±1℃ pH adjustment 2.5 (Acid Curing) 4.5 (Isoelectric point) No adjustment required Drying method 40℃ hot air drying freeze-drying Vacuum drying at 35℃ Particle size control methods Emulsification shear rate Initial particle size of compound emulsion Stirring speed adjustment

[0115] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A colorable, PID-resistant carbon fiber photovoltaic module frame, characterized in that: include, The frame body (1) has a hollow structure inside; The honeycomb layer (4) is embedded in the hollow structure of the frame body (1), and the honeycomb layer (4) is composed of an array of multiple regular hexagonal honeycomb grids (5); Microcapsules (6) are filled inside the honeycomb grid (5) and encapsulate an oxidatively curable repair material inside; Water-absorbing resin (7) is disposed within the honeycomb grid (5) and located at the front end of the microcapsule (6); The honeycomb grid (5) has a cone-shaped structure that is narrow at the front and wide at the back, which is used to guide the repair material to flow in a directional manner to the crack area; The water-absorbing resin (7) is granular and expands to form a hydrogel when exposed to water vapor. When the microcapsule (6) is squeezed, it ruptures and releases the repair material. The wall material of the microcapsule (6) is polyurethane, and the core material contains an oxidative curing repair monomer and an initiator. The tapered front end of the honeycomb cell (5) faces the inner wall of the frame body (1), and the rear end faces the central axis of the honeycomb layer plate (4).

2. The colorable anti-PID carbon fiber photovoltaic module frame according to claim 1, characterized in that: The frame body (1) is a detachable structure and an integrally molded structure. The detachable structure of the frame body (1) includes an upper shell (2) and a lower shell (3) that are symmetrical to each other. The upper housing (2) and the lower housing (3) are bonded and sealed by sealing silicone (18).

3. The colorable anti-PID carbon fiber photovoltaic module frame according to claim 2, characterized in that: The upper shell (2) and the lower shell (3) are respectively provided with a positioning block (8) and a limiting block (9) on their outer sides. The positioning block (8) and the limiting block (9) are respectively provided with limiting grooves (10).

4. The colorable anti-PID carbon fiber photovoltaic module frame according to claim 3, characterized in that: The limiting groove (10) is a conical structure that is narrow at the top and wide at the bottom; The locking element (11) is movably inserted into the limiting groove (10) to lock the vertical position of the positioning block (8) and the limiting block (9).

5. The colorable anti-PID carbon fiber photovoltaic module frame according to any one of claims 4, characterized in that: The locking element (11) includes: A threaded handle (12) is located at the top of the locking element (11); A cast iron disc (15) is located in the cavity inside the locking member (11) and is movably connected to the threaded rod of the threaded handle (12); A conical block (16) is located below a cast iron disk (15); A compression spring (17) is provided between the cast iron disc (15) and the conical block (16); The steel ball (14) is located in the spherical groove (13) on the surface of the locking member (11) and is partially exposed by the pressure of the conical block (16).

6. The colorable anti-PID carbon fiber photovoltaic module frame according to claim 5, characterized in that: The inclined end of the outer surface of the conical block (16) and the inclined end of the bottom of the limiting groove (10) form a right-angle enclosing structure; When the conical block (16) is pressed down, the steel ball (14) forms a lever lock with the bottom of the limiting groove (10).

7. The colorable anti-PID carbon fiber photovoltaic module frame according to claim 2, characterized in that: The frame body (1) is an integrally molded structure, and the shape of its internal hollow part is completely fitted with the honeycomb layer (4).

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