CIS wafer test probe card

Abstract

The invention discloses a CIS wafer test probe card which comprises a PCB, a main frame used for fixing the PCB, an installation plate fixedly installed on the back face of the PCB, a lens module substrate fixed to the installation plate, an adapter plate installed on the front face of the PCB and a ceramic substrate fixedly installed on the front face of the adapter plate. A plurality of lens modules are fixedly mounted on the lens module substrate, the mounting plate, the PCB, the adapter plate and the ceramic substrate are all provided with lens mounting holes allowing lens bodies to penetrate through, and a plurality of spring needles electrically connected with the ceramic substrate and the PCB are arranged in the adapter plate. And a plurality of cantilever probes are arranged on the front surface of the ceramic substrate.

Description

TECHNICAL FIELD

[0001] The application relates to the chip testing technical field, in particular to a CIS wafer test probe card. BACKGROUND

[0002] CIS refers to CMOS Image Sensor, and with the development of the automobile, mobile phone, robot and monitoring security industries, the demand for cameras is increasing day by day, and the market demand for CIS is also rapidly increasing. Like other chips, after the CIS wafer manufacturing is completed, wafer testing also needs to be carried out, and accordingly, a CIS probe card needs to be used to test the CIS wafer. The CIS probe card needs to integrate a lens module on the traditional probe card structure to provide a test light source.

[0003] At present, the traditional CIS probe card is a cantilever type probe card, and with the iteration of the CIS technology, the cantilever type probe card exposes problems such as low test frequency, small number of simultaneous tests, long assembly delivery cycle, large needle tip position deviation and unstable needle position high temperature. SUMMARY

[0004] The application aims to solve the problems of long assembly cycle and small number of simultaneous tests in the prior art, and provides a CIS wafer test probe card with high test frequency, large number of simultaneous tests and stable needle tip position.

[0005] To achieve the above-mentioned purpose, the application adopts the following technical scheme: The application provides a CIS wafer test probe card, which comprises a PCB board, a main frame for fixing the PCB board, a mounting plate fixedly installed on the back of the PCB board, a lens module substrate fixedly installed on the mounting plate, an adapter plate fixedly installed on the front of the PCB board and a ceramic substrate fixedly installed on the front of the adapter plate, a plurality of lens modules are fixedly installed on the lens module substrate, lens mounting holes through which lens bodies pass are formed in the mounting plate, the PCB board, the adapter plate and the ceramic substrate, a plurality of spring needles electrically connecting the ceramic substrate and the PCB board are arranged in the adapter plate, and a plurality of cantilever probes are arranged on the front of the ceramic substrate.

[0006] In a feasible scheme, the front of the PCB board is further fixedly provided with an MLC support ring, the MLC support ring is located outside the adapter plate, the front of the MLC support ring is provided with a plurality of support piers, and the plurality of support piers are supported on the back of the ceramic substrate.

[0007] In an embodiment, the MLC support ring is further provided with a plurality of first positioning pin holes and a plurality of second positioning pin holes, the MLC support ring and the ceramic substrate are connected by the first positioning pin holes, and the MLC support ring and the PCB are connected by the second positioning pin holes.

[0008] In an embodiment, the MLC support ring and the PCB are provided with an insulating gasket, and the MLC support ring, the PCB and the mounting plate are connected by screws.

[0009] In an embodiment, the CIS wafer test probe card further comprises an MLC fixing frame fixed to the periphery of the ceramic substrate, the MLC fixing frame is fixed to the MLC support ring by screws, the MLC fixing frame is provided with a plurality of elastic pressing pieces shielding the outer edge of the ceramic substrate, and the elastic pressing pieces are located on the front surface of the MLC fixing frame.

[0010] In an embodiment, the mounting plate is further provided with a plurality of height adjustment bolts, the height adjustment bolts are threadedly connected to an adjusting block through the PCB and the adapter plate, and the adjusting block is fixed to the back surface of the ceramic substrate.

[0011] In an embodiment, the height adjustment bolt comprises a bolt sleeve and a locking screw, the screw rod of the bolt sleeve is provided with external threads, the bolt sleeve is connected to the mounting plate by the external threads, the bolt sleeve is further provided with a threaded hole penetrating the screw rod, the locking screw is threadedly connected to the threaded hole, and the end of the locking screw is threadedly fixed to the adjusting block.

[0012] In an embodiment, a plurality of through holes are formed in the lens module substrate, the PCB and the adapter plate, the height adjustment bolt passes through the through holes in the lens module substrate and the PCB, and the adjusting block is located in the through hole in the adapter plate.

[0013] In an embodiment, the height adjustment bolt and the mounting plate are further provided with a locking ring, the locking ring is threadedly connected to the bolt sleeve, and the locking ring is provided with a plurality of notches for inserting a rotating tool.

[0014] In an embodiment, the lens module has a hollow cylindrical lens body and a pair of ears extending in a direction perpendicular to the axis at one end surface of the lens body, the ears are fixed to the lens module substrate by screws, and a plurality of leveling gaskets are arranged between the lens module substrate and the mounting plate.

[0015] The application is a CIS wafer test probe card based on a MEMS probe, which is installed on a lens module substrate through a plurality of lens modules, can realize multiple CIS tests, and has the advantages of short production cycle, high number of same sides, and small needle tip position deviation through the positioning and fixing of the mounting plate, adapter plate, PCB plate, and ceramic plate to realize rapid assembly. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A perspective structural schematic view of a CIS wafer test probe card provided by an embodiment of the application.

[0017] Figure 2 A bottom view schematic view of a CIS wafer test probe card provided by an embodiment of the application.

[0018] Figure 3 A top view schematic view of a CIS wafer test probe card provided by an embodiment of the application.

[0019] Figure 4 A perspective structural schematic view of a CIS wafer test probe card provided by an embodiment of the application. Figure 3 A sectional view along A-A.

[0020] Figure 5 A sectional view along A-A. Figure 4 An enlarged view of a part C.

[0021] Figure 6 A sectional view along B-B. Figure 3 An enlarged view of a part C.

[0022] Figure 7 A sectional view along B-B. Figure 6 An enlarged view of a part D.

[0023] Figure 8 A front view of an MLC fixing frame provided by an embodiment of the application.

[0024] Figure 9 A perspective structural schematic view of an MLC fixing frame provided by an embodiment of the application.

[0025] Figure 10 A front view of an MLC support ring provided by an embodiment of the application.

[0026] Figure 11 A perspective structural schematic view of an MLC support ring provided by an embodiment of the application.

[0027] Figure 12 A front view of a ceramic substrate provided by an embodiment of the application.

[0028] Figure 13 A front view of an adapter plate provided by an embodiment of the application.

[0029] Figure 14 A perspective view of the adapter plate provided for the embodiment of the present application.

[0030] Figure 15 A front view of the PCB provided for the embodiment of the present application.

[0031] Figure 16 A front view of the mounting plate provided for the embodiment of the present application.

[0032] Figure 17 A perspective view of the mounting plate provided for the embodiment of the present application.

[0033] Figure 18 A front view of the lens module substrate provided for the embodiment of the present application.

[0034] Figure 19 A perspective view of the height adjustment bolt provided for the embodiment of the present application.

[0035] wherein 10, main frame; 20, ceramic substrate; 21, probe; 22, first positioning pin hole; 23, lens mounting hole; 30, adapter plate; 31, spring needle; 32, through hole; 33, lens mounting hole; 34, screw hole; 35, positioning hole; 37, fixing screw; 40, PCB; 41, screw hole; 42, through hole; 43, lens mounting hole; 44, positioning hole; 45, second positioning pin hole; 50, mounting plate; 51, screw hole; 52, screw hole; 53, lens mounting hole; 54, second positioning pin hole; 55, nut; 56, height adjustment screw hole; 57, positioning hole; 60, lens module substrate; 61, gasket; 62, through hole; 63, lens mounting hole; 64, lens module; 641, lens body; 642, ear; 643, fastening bolt; 70, height adjustment bolt; 71, bolt sleeve; 711, screw part; 712, nut; 72, locking screw; 73, locking ring; 730, notch; 74, adjustment block; 80, MLC fixing frame; 81, elastic pressing sheet; 82, screw hole; 90, MLC support ring; 91, support column; 92, first positioning pin hole; 93, screw hole; 94, screw hole; 95, second positioning pin hole. DETAILED DESCRIPTION

[0036] To describe the technical solutions, technical features, achieved purposes and effects of the application in detail, the technical solutions in the embodiments of the application will be described below in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, rather than all the embodiments. In the following description, for the purpose of explanation, a large number of specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or implementations of the application. However, various exemplary embodiments can also be implemented without these specific details or in one or more equivalent arrangements. In addition, various exemplary embodiments can be different, but not necessarily exclusive. For example, the specific shape, structure and characteristics of an exemplary embodiment can be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0037] Hereinafter, the terms "first", "second", and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0038] The present application Figure 2 is the "front side" of the CIS wafer test probe card, Figure 3 is the back side of the CIS wafer test probe card, and the "upper" and "lower" positional relationships in the description correspond to the upper and lower positional relationships shown in Figure 4 respectively.

[0039] In addition, in the present application, spatial relative terms such as "under", "below", "lower", "down", "above", "upper", "on", "higher", "side" (for example, as in "side wall") are used to describe the relationship between one element and another (other) element as shown in the drawings. The spatial relative terms are intended to include different orientations of the device in use, operation and / or manufacture in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, the element described as "below" or "under" the other element or feature will then be positioned "above" the other element or feature. Therefore, the exemplary term "below" can include both upward and downward orientations. In addition, the device can be positioned otherwise (for example, rotated 90 degrees or at other orientations), and accordingly the spatial relative descriptions used herein are interpreted accordingly.

[0040] Please refer to Figures 1-7, a structure schematic diagram of a CIS wafer test probe card provided by an embodiment of the present application is shown. The CIS wafer test probe card comprises a PCB board 40, a main frame 10 for fixing the PCB board 40, a mounting plate 50 fixedly installed on the back of the PCB board 40, a lens module substrate 60 fixed on the mounting plate 50, a conversion plate 30 installed on the front of the PCB board 40, and a ceramic substrate 20 fixedly installed on the front of the conversion plate 30. Referring to Figure 4 、 5 , the lens module substrate 60, the mounting plate 50, the PCB board 40, the conversion plate 30 and the ceramic substrate 20 are arranged in sequence from top to bottom, wherein a plurality of lens modules 64 are fixedly installed on the lens module substrate 60, mounting holes for lens bodies 641 to pass through are formed on the mounting plate 50, the PCB board 40, the conversion plate 30 and the ceramic substrate 20, a plurality of spring needles 31 for electrically connecting the ceramic substrate 20 and the PCB board 40 are arranged in the conversion plate 30, and a plurality of cantilever probes 21 are arranged on the front of the ceramic substrate 20, with the needle tips of the probes 21 located directly below the mounting holes and opposite the lens bodies. When wafer testing is performed, light passes through the lens bodies to irradiate the image sensor below.

[0041] In one embodiment, the probes 21 can be probes made using a MEMS process, and can also be cantilever structures with a certain length. The needle tails of the probes 21 are fixed on corresponding metal pads (solder pads) of the ceramic substrate 20 by welding or bonding, and the needle tips are suspended below the lens bodies through the cantilever structure, so that the electrical signals passing through the wafer pads can be tested when the lens is irradiated. It should be noted that the probes given in the present embodiment are only for illustration, and the size, number, performance and other parameters of the probes in the actual product are determined by the information of the wafer to be tested.

[0042] Referring to Figure 12 , the ceramic substrate 20 is a multi-layer co-fired ceramic circuit board MLC, which is widely used in probe cards for DRAM, FLASH and other memory chips. Unlike the MLC used in the memory probe card, the ceramic substrate 20 used in the CIS probe card of the present application has a plurality of lens mounting holes 23 formed thereon for mounting the lens modules 64. The ceramic substrate 20 also has a plurality of first positioning pin holes 22, the first positioning pin holes 22 are inserted with positioning pins, and are positioned and connected with first positioning pin holes 92 on the MLC support ring 90 through the first positioning pin holes 22.

[0043] Referring to Figure 13 、 14As shown, the adapter plate 30 is an intermediate layer structure for fixing the pogo pins 31, which can be made of FR4 grade board. The adapter plate 30 has a plurality of small holes for inserting the pogo pins 31, which are used to maintain the position of the pogo pins 31 in the vertical and horizontal directions. The front surface of the adapter plate 30 protrudes from the surface of the board after the pogo pins are installed, while the back surface of the adapter plate 30 is in contact with the PCB 40, and the pogo pins 31 are electrically connected to a plurality of pads on the PCB 40. A plurality of lens mounting holes 33 are also formed in the adapter plate 30, and four through holes 32 are also formed in the adapter plate 30 for mounting the adjusting blocks 74. Screw holes 34 and positioning holes 35 are also formed in the adapter plate 30, which is positioned and connected to the PCB 40 through the positioning holes 35, and is locked and fixed through the screw holes 34.

[0044] To ensure positioning and installation accuracy, in this application, the adapter plate 30 and the ceramic substrate 20 are positioned and installed by the MLC support ring 90, and are locked and pressed by the MLC fixed frame 80. Please refer to Figure 10 、 11 The MLC support ring 90 is a square frame, and the adapter plate 30 is located in the center of the MLC support ring 90. The inner side of each frame of the MLC support ring 90 is processed with a shallow groove, and a plurality of raised support pillars 91 are formed in the shallow groove along the periphery of the MLC support ring 90. The height of the support pillars 91 is slightly higher than the front surface of the MLC support ring 90, so that when the ceramic substrate 20 is stacked on the adapter plate 30, the plurality of support pillars 91 on the MLC support ring 90 are supported below the edges of the ceramic substrate 20. When assembling the ceramic substrate 20, first measure the height of the current support pillar 91, calculate the difference between the actual height and the theoretical value of each support pillar 91, and then modify the height of the support pillar in the mechanical processing center (CNC), to ensure the accuracy of the level and height around the ceramic substrate 20, and also to ensure the structural rigidity of the edge position of the ceramic substrate 20.

[0045] Continuing to refer to Figure 10 、 11 , 12, the MLC support ring 90 is positioned and installed on the PCB 40. The MLC support ring 90 has four first positioning pin holes 92, which are used in cooperation with the four first positioning pin holes 22 on the ceramic substrate 20 to ensure the position accuracy of the ceramic substrate 20. The MLC support ring 90 is positioned and fixed on the PCB 40 through the second positioning pin holes 95 on the MLC support ring 90 and the second positioning pin holes 45 on the PCB 40 and the second positioning pin holes 54 on the mounting plate 50 at corresponding positions, to ensure the position accuracy. After the MLC support ring 90 is positioned with the PCB 40 and the mounting plate 50, it is locked and pressed on the PCB by screws, and the surface of the MLC support ring 90 and the PCB 40 is insulated by a pad, so that the circuit structure is not in contact, and the probe card is stably connected.

[0046] Referring to Figure 8 ,9 The area of the ceramic substrate 20 is larger than that of the adapter plate 30. The edge of the ceramic substrate 20 is supported on the plurality of support piers 91. The MLC fixing frame 80 is located outside the ceramic substrate 20, and is fixed on the MLC support ring 90 by screw locking. To prevent the ceramic substrate 20 from falling off accidentally, the MLC fixing frame 80 has a plurality of elastic pressing pieces 81 shielding the outer edge of the ceramic substrate 20. The elastic pressing pieces 81 are located in the inner circle of the MLC fixing frame 80, and can press the ceramic substrate 20 tightly on the MLC support ring 90.

[0047] Reference Figure 4 、 5 , 14, between the ceramic substrate 20 and the PCB plate 40, a plurality of spring pins 31 are used for conduction and connection. On the back of the ceramic substrate 20 and the front of the PCB plate, BGA for contact is used. The spring pins 31 pass through the adapter plate 30, and the two ends are in contact with the BGA points on the ceramic substrate 20 and the PCB plate 40 respectively, realizing the circuit conduction of the two.

[0048] Reference Figure 16 、 17 As shown in the figure, a plurality of positioning pin holes are processed on the mounting plate 50. The second positioning pin hole 54 is used for positioning and fixing the PCB plate 40 and the MLC support ring 90, to ensure the relative position of the mounting plate 50, the PCB plate 40 and the MLC support ring 90. The mounting plate 50 is also provided with a positioning hole 57, which is used for positioning the PCB plate 40 and the adapter plate 30. The back of the mounting plate 50 is also provided with a positioning hole (not shown in the figure), and the mounting plate 50 and the lens module substrate 60 are connected by the positioning hole. The positioning accuracy between the PCB plate, the adapter plate and the lens module substrate, which have position requirements, meets the requirements through these positioning pin holes.

[0049] Reference Figure 18 As shown in the figure, the lens module 64 is a light transmission structure, which is used to transmit the light on the light source of the tester to the surface of the wafer under test. A plurality of lens modules 64 are fixed on the lens module substrate 60 by screws. The lens module substrate 60 has a plurality of precisely processed lens mounting holes 63 on the surface, which are used to ensure the X and Y positions of each lens module 64. The horizontal position between each lens module 64 is adjusted by the gasket 61. After the lens module 64 and the lens module substrate 60 are assembled, they are installed on the mounting plate 50 by the positioning pin, and the level of the entire lens module substrate can be adjusted by the gasket 61 at the four corners.

[0050] The lens module 64 has a hollow cylindrical lens body 641 and a pair of ears 642 extending from one end face of the lens body 641 in a direction perpendicular to the axis, and the pair of ears 642 are fixed on the lens module substrate 60 by screws, and a gasket is arranged between the pair of ears 642 and the lens module substrate 60.

[0051] As shown in Figure 6 , As shown in 7 , a plurality of height adjustment bolts 70 are arranged on the mounting plate 50, the ends of the height adjustment bolts 70 are threaded with an adjusting block 74 through the PCB board 40 and the adapter plate 30, and the adjusting block 74 is bonded to the back of the ceramic substrate 20. A plurality of through holes are formed on the lens module substrate 60, the PCB board 40 and the adapter plate 30, the height adjustment bolts 70 pass through the through holes on the lens module substrate 60 and the PCB board 40, and the adjusting block 74 is located in the through hole on the adapter plate 30.

[0052] As shown in Figure 19 , the height adjustment bolt 70 includes a bolt sleeve 71 and a locking screw 72. A locking ring 73 is further arranged between the height adjustment bolt 70 and the mounting plate 50, the locking ring 73 is threaded on the bolt sleeve 71, and a plurality of notches are arranged on the locking ring 73 for inserting a rotating tool. The threaded portion 711 of the bolt sleeve 71 is provided with external threads, the bolt sleeve 71 is connected to the mounting plate 50 through the external threads, the bolt sleeve 71 is further provided with a threaded hole penetrating the threaded portion 711, the locking screw 72 is threaded in the threaded hole, and the end of the locking screw 72 is threaded with the adjusting block 74. The surface of the bolt sleeve 71 is processed with external threads, which can realize the function of moving up and down by engaging with the corresponding internal threads on the mounting plate 50. The adjusting block 74 is fixed to the back of the ceramic substrate 20 by adhesive, and the ceramic substrate 20 can be fixed at a specific height position by adjusting the locking screw 72. After the initial assembly of the ceramic substrate 20, the height adjustment bolt 70 can be adjusted to a standard range using a special tool, and then the locking ring 73 is tightened to lock the height adjustment bolt 70. Subsequently, only the height of the different height adjustment bolts 70 needs to be adjusted slightly to control the overall level of the ceramic substrate 20.

[0053] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and the scope of protection of the present application is defined by the appended claims, the specification and their equivalents.

Claims

1. A CIS wafer test probe card, characterized by, The application relates to a PCB board (40), a main frame (10) for fixing the PCB board (40), a mounting plate (50) fixedly installed on the back of the PCB board (40), a lens module base plate (60) fixed on the mounting plate (50), an adapter plate (30) fixedly installed on the front of the PCB board (40) and a ceramic substrate (20) fixedly installed on the front of the adapter plate (30), wherein the lens module base plate (60) is fixedly installed with a plurality of lens modules (64), the mounting plate (50), the PCB board (40), the adapter plate (30) and the ceramic substrate (20) are all provided with lens mounting holes through which lens bodies (641) pass, the adapter plate (30) is provided with a plurality of spring pins (31) electrically connected with the ceramic substrate (20) and the PCB board (40), and the front of the ceramic substrate (20) is provided with a plurality of cantilever probes (21). The front of the PCB board (40) is also fixedly installed with an MLC supporting ring (90), the MLC supporting ring (90) is located outside the adapter plate (30), the front of the MLC supporting ring (90) is provided with a plurality of supporting piers (91), and the plurality of supporting piers (91) are supported on the back of the ceramic substrate (20).

2. The CIS wafer test probe card of claim 1, wherein, The MLC supporting ring (90) is also provided with a plurality of first positioning pin holes (92) and a plurality of second positioning pin holes (95), the MLC supporting ring (90) and the ceramic substrate (20) are connected through the plurality of first positioning pin holes (92), and the MLC supporting ring (90) and the PCB board (40) are connected through the plurality of second positioning pin holes (95).

3. The CIS wafer test probe card of claim 2, wherein, The MLC supporting ring (90) and the PCB board (40) are provided with insulating gaskets, and the MLC supporting ring (90), the PCB board (40) and the mounting plate (50) are fastened and connected through screws.

4. The CIS wafer test probe card of claim 2, wherein, The application also relates to an MLC fixing frame (80) fixed on the periphery of the ceramic substrate (20), the MLC fixing frame (80) is fixed on the MLC supporting ring (90) through screw locking, the MLC fixing frame (80) is provided with a plurality of elastic pressing pieces (81) shielding the outer edges of the ceramic substrate (20), and the plurality of elastic pressing pieces (81) are located on the front of the MLC fixing frame (80).

5. The CIS wafer test probe card of claim 2, wherein, The mounting plate (50) is also provided with a plurality of height adjusting bolts (70), the tail ends of the height adjusting bolts (70) pass through the PCB board (40) and the adapter plate (30) and are threadedly connected with an adjusting block (74), and the adjusting block (74) is fixedly connected on the back of the ceramic substrate (20).

6. The CIS wafer test probe card of claim 1, wherein, ​ 7. The CIS wafer test probe card of claim 6, wherein, The height adjusting bolt (70) comprises a bolt sleeve (71) and a locking screw (72), the screw rod part of the bolt sleeve (71) is provided with external threads, the bolt sleeve (71) is connected to the mounting plate (50) through the external threads, the bolt sleeve (71) is further provided with a threaded hole penetrating through the screw rod part, and the locking screw (72) is threadedly connected in the threaded hole, and the end of the locking screw (72) is threadedly fixed with the adjusting block (74).

8. The CIS wafer test probe card of claim 7, wherein, The lens module substrate (60), the PCB (40) and the adapter plate (30) are all provided with a plurality of through holes, the height adjusting bolt (70) penetrates through the through holes on the lens module substrate (60) and the PCB (40), and the adjusting block (74) is located in the through hole on the adapter plate (30).

9. The CIS wafer test probe card of claim 6, wherein, The height adjusting bolt (70) and the mounting plate (50) are further provided with a locking ring (73), the locking ring (73) is threadedly connected to the bolt sleeve (71), and the locking ring (73) is provided with a plurality of notches (730) for the insertion of a rotating tool.

10. The CIS wafer test probe card of claim 1, wherein, The lens module (64) has a hollow cylindrical lens body (641) and a pair of ears (642) extending along a direction perpendicular to the axis of the lens body (641) at one end surface of the lens body (641), the pair of ears (642) are respectively fixed on the lens module substrate (60) through screws, and a plurality of leveling shims (61) are arranged between the lens module substrate (60) and the mounting plate (50).

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