Butt-joint welded and packaged ceramic shell

Abstract

The invention provides a butt-joint welding packaged ceramic shell, which belongs to the technical field of ceramic packaging and comprises a ceramic lower base with a lower cavity, a ceramic upper base with an upper cavity, a first chip arranged in the lower cavity and a second chip arranged in the upper cavity, the ceramic upper base is welded on the ceramic lower base to form a double-layer stacked structure, the lower cavity and the upper cavity form a through sealing cavity, and the first chip and the second chip are sealed in the sealing cavity; and a signal transmission conductor is arranged between the ceramic upper base and the ceramic lower base. According to the butt-joint welded and packaged ceramic shell provided by the invention, the metal cover plate and the ceramic substrate are fused to form the ceramic upper base with the upper cavity and the internal wiring, meanwhile, the ceramic lower base with the lower cavity is prepared, and the ceramic upper base and the ceramic lower base are subjected to alignment welding to realize airtight packaging; while high reliability is ensured, miniaturization of the photoelectric coupler is effectively realized.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of ceramic packaging, and particularly relates to a ceramic shell of butt joint type welding packaging. BACKGROUND

[0002] The photoelectric coupler is generally provided with a light emitting diode as a signal input end and a photosensitive triode as a signal output end, and the light emitting diode and the photosensitive chip are physically isolated, so that the signal can only be transmitted from the input end to the output end and cannot be reversely transmitted. The device achieving electrical and physical isolation can achieve extremely high reliability in application, and the isolation voltage can be made very high, and the isolation voltage directly affects the feedback and interference between the input and output, which is of great significance to improve the reliability of the system. The isolation voltage of the ceramic packaged photoelectric coupler is generally guaranteed to be 1000-1500V.

[0003] As shown in Figure 6 The traditional photoelectric coupler packaging is composed of a metal cover plate, a ceramic substrate and a ceramic base, which guarantees the high isolation voltage between the input and output. However, the current photoelectric coupler packaging has large size and complex packaging process, which is not conducive to the miniaturization and cost reduction of the packaged device. SUMMARY

[0004] The embodiment of the application provides a ceramic shell of butt joint type welding packaging, aiming at realizing the miniaturization and cost reduction of the packaged device.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the application is to provide a ceramic shell of butt joint type welding packaging, comprising: a ceramic lower base with a lower cavity; a first chip arranged in the lower cavity; a ceramic upper base with an upper cavity, which is welded on the ceramic lower base to form a double-layer stacked structure, and the lower cavity and the upper cavity form a through sealed cavity; and a second chip arranged in the upper cavity, and a signal transmission conductor arranged between the ceramic upper base and the ceramic lower base.

[0006] In an implementable manner, a ceramic column is arranged between the ceramic upper base and the ceramic lower base, the ceramic column is provided with a central hole, and the signal transmission conductor is arranged in the central hole.

[0007] In an implementable manner, a lower groove is arranged on the welding surface of the ceramic lower base, the lower end of the signal transmission conductor is inserted into the lower groove, an upper groove is arranged on the inner top surface of the upper cavity of the ceramic upper base, and the upper end of the signal transmission conductor is inserted into the upper groove.

[0008] In an implementable mode, the lower groove and the upper groove are circular grooves or rectangular grooves.

[0009] In an implementable mode, the welding surface of the upper ceramic base is laminated on the welding surface of the lower ceramic base, and the inner side of the welding surface of the upper ceramic base does not exceed the inner side of the welding surface of the lower ceramic base, and the outer side of the welding surface of the upper ceramic base does not exceed the outer side of the welding surface of the lower ceramic base.

[0010] In an implementable mode, a middle ceramic base is further laminated between the upper ceramic base and the lower ceramic base, the middle ceramic base is provided with a middle cavity, the middle cavity is communicated with the lower cavity, and the upper cavity is sealed by the middle ceramic base.

[0011] In an implementable mode, when the upper ceramic base and the lower ceramic base are abutted to form a two-layer stacked structure, the first chip is a photosensitive chip, and the second chip is a diode.

[0012] In an implementable mode, when the upper ceramic base, the middle ceramic base and the lower ceramic base are abutted to form a three-layer stacked structure, the first chip is a photosensitive chip, the second chip is a photosensitive chip, the third chip provided on the inner top surface of the middle cavity is a diode, and the fourth chip provided on the outer top surface of the middle ceramic base is a diode.

[0013] In an implementable mode, a signal transmission conductor is arranged between the upper ceramic base and the middle ceramic base, and a signal transmission conductor is arranged between the middle ceramic base and the lower ceramic base.

[0014] In an implementable mode, a metal welding ring is arranged on the welding surface of the upper ceramic base, the middle ceramic base and the lower ceramic base, so as to be welded and sealed.

[0015] The abutment type welding packaged ceramic shell provided by the present application has the beneficial effects that, based on the high-temperature co-fired ceramic technology, the metal cover plate and the ceramic substrate are fused to form an upper ceramic base with an upper cavity and internal wiring, and a lower ceramic base with a lower cavity is prepared, the upper ceramic base and the lower ceramic base are abutted and welded to realize airtight packaging, the miniaturization of the optoelectronic coupler is effectively realized while the high reliability is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The structure of the abutment type welding packaged ceramic shell provided by the present application is shown in the following figure Figure 1 ; Figure 2Structure diagram of the butt joint welding packaged ceramic shell provided by the embodiment of the present application Figure 2 ; Figure 3 Structure diagram of the butt joint welding packaged ceramic shell provided by the embodiment of the present application Figure 3 ; Figure 4 Structure diagram of the butt joint welding packaged ceramic shell provided by the embodiment of the present application Figure 4 ; Figure 5 Structure diagram of the ceramic upper base provided by the embodiment of the present application; Figure 6 Structure diagram of the ceramic shell provided by the prior art; Explanation of reference numerals: 1, ceramic upper base; 2, ceramic lower base; 3, first chip; 4, lower cavity; 5, signal transmission conductor; 6, upper cavity; 7, second chip; 8, ceramic column; 9, ceramic middle base; 10, middle cavity; 11, third chip; 12, fourth chip; 13, metal welding ring; 14, interconnection pad; 15, metal cover plate; 16, ceramic substrate. DETAILED DESCRIPTION

[0017] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clearly understood, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0018] In the claims, specification and above drawings of the present application, unless otherwise explicitly defined, the terms such as "first", "second" or "third" are used only to distinguish different objects, and are not used to describe a specific order.

[0019] Please refer to Figures 1 to 5 The butt joint welding packaged ceramic shell provided by the present application will be described. The butt joint welding packaged ceramic shell comprises: a ceramic lower base 2 with a lower cavity 4, a ceramic upper base 1 with an upper cavity 6, a first chip 3 arranged in the lower cavity 4, and a second chip 7 arranged in the upper cavity 6; the ceramic upper base 1 is welded on the ceramic lower base 2 to form a double-layer stacked structure, and the lower cavity 4 and the upper cavity 6 form a through sealed cavity, and the first chip 3 and the second chip 7 are sealed in the sealed cavity; a signal transmission conductor 5 is arranged between the ceramic upper base 1 and the ceramic lower base 2.

[0020] Compared with the prior art, the butt joint type welding packaging ceramic shell has the beneficial effects that: based on the high-temperature co-fired ceramic technology, the metal cover plate 15 and the ceramic substrate 16 are fused to form a ceramic upper base 1 with an upper cavity 6 and internal wiring, and a ceramic lower base 2 with a lower cavity 4 is prepared, and the ceramic upper base 1 and the ceramic lower base 2 are butt joint welded to realize airtight packaging, so that the miniaturization of the optoelectronic coupler is effectively realized while the high reliability is ensured.

[0021] For example, referring to Figure 1 and Figure 5 , based on the high-temperature co-fired ceramic technology, signal lines are printed on each layer of ceramic sheet, a via hole is punched and filled with a metalized paste, each layer of ceramic sheet is stacked together and laminated, and then the cavity is cut by a high-power ultraviolet laser, so that the ceramic upper base 1 with the upper cavity 6 and the ceramic lower base 2 with the lower cavity 4 are prepared. The metal welding ring 13 and the interconnection pad 14 are printed on the surface of the ceramic upper base 1 and the surface of the ceramic lower base 2, and the alloy solder is pre-placed on the metal welding ring 13 and the interconnection pad 14 of the ceramic upper base 1. The second chip 7 is welded in the ceramic upper base 1, and the first chip 3 is installed in the ceramic lower base 2. In use, the ceramic upper base 1 and the ceramic lower base 2 are butt joint welded to realize airtight packaging, and the signals are transmitted between the two bases through the internal signal lines of the ceramic base and the interconnection pad 14.

[0022] In some embodiments, referring to Figure 2 and Figure 5 , the ceramic upper base 1 and the ceramic lower base 2 are provided with a ceramic column 8, the ceramic column 8 is provided with a center hole, and the signal transmission conductor 5 is arranged in the center hole. The above technical solution adopts the ceramic column 8 to replace the interconnection pad 14 in the ceramic upper base 1. The signal transmission conductor 5 is prepared in the ceramic column 8, and the ceramic column and the ceramic upper base 1 are integrally sintered and formed.

[0023] In some embodiments, referring to Figure 3 , the welding surface of the ceramic lower base 2 is provided with a lower groove, and the lower end of the signal transmission conductor 5 is inserted into the lower groove; the inner top surface of the upper cavity 6 of the ceramic upper base 1 is provided with an upper groove, and the upper end of the signal transmission conductor 5 is inserted into the upper groove. In the above technical solution, the signal transmission conductor 5 is directly used to replace the interconnection pad 14 in the ceramic upper base 1. The upper and lower ends of the signal transmission conductor 5 are respectively placed in the upper groove and the lower groove, so as to effectively improve the welding alignment accuracy and the conductivity.

[0024] Specifically, the lower groove closely fits the lower end of the signal transmission conductor 5, stably supporting the signal transmission conductor 5 and reducing its positional deviation during welding. The upper groove also perfectly fits the upper end of the signal transmission conductor 5, ensuring the precise positioning of the signal transmission conductor 5 in the vertical direction and greatly improving the accuracy of welding. Moreover, this way of directly inserting the signal transmission conductor 5 into the groove shortens the signal transmission path, reduces the resistance during signal transmission, and significantly improves the electrical conductivity, enabling faster and more stable signal transmission and reducing signal distortion and attenuation. In practical applications, this improved structure can effectively improve the performance and stability of related electronic devices, meeting the requirements of high-precision and high-conductivity scenarios such as high-speed signal transmission, and providing strong technical support for the further development of electronic devices.

[0025] In some embodiments, the lower groove and the upper groove are circular grooves or rectangular grooves.

[0026] In some embodiments, referring to Figures 1 to 3 , the welding surface of the upper ceramic base 1 is stacked on the welding surface of the lower ceramic base, and the inner side of the welding surface of the upper ceramic base 1 does not exceed the inner side of the welding surface of the lower ceramic base, and the outer side of the welding surface of the upper ceramic base 1 does not exceed the outer side of the welding surface of the lower ceramic base. This design ensures good fit and stability of the upper ceramic base 1 and the lower ceramic base during welding. When welding, the welding area can be accurately positioned and the welding deviation can be reduced due to the stacking of the welding surfaces and the non-exceeding of the edges. During welding, heat can be evenly transmitted to the entire welding surface, helping to form a firm and reliable welding connection. This precise size relationship also avoids welding defects such as virtual welding and missed welding that may occur due to inconsistent welding surface edges. Further, it helps to improve the mechanical properties of the entire ceramic structure, so that the welding part can better resist stress and maintain the integrity of the structure when subjected to various external forces, thereby meeting the requirements of stability and reliability of ceramic components in different application scenarios.

[0027] In some embodiments, referring to Figure 4 , a middle ceramic base 9 is also stacked between the upper ceramic base 1 and the lower ceramic base 2, and a middle cavity 10 is provided on the middle ceramic base 9, which is in communication with the lower cavity 4 and the upper cavity 6 is sealed by the middle ceramic base 9. After the upper ceramic base 1, the middle ceramic base 9 and the lower ceramic base 2 are connected, a three-layer stacked structure is formed, two packaging cavities are formed, one photoelectric coupler is expanded to two photoelectric couplers, and the integration is further improved to realize miniaturization.

[0028] In some embodiments, referring to Figures 1 to 3When the ceramic upper base 1 and the ceramic lower base 2 are butted to form a two-layer stacked structure, the first chip 3 is a photosensitive chip, and the second chip 7 is a diode. The above structure is a packaging cavity, forming an optical-electric coupling device.

[0029] In some embodiments, referring to Figure 4 When the ceramic upper base 1, the ceramic middle base 9, and the ceramic lower base 2 are butted to form a three-layer stacked structure, the first chip 3 is a photosensitive chip, the second chip 7 is a photosensitive chip, the third chip 11 on the inner top surface of the middle cavity 10 is a diode, and the fourth chip 12 on the outer top surface of the ceramic middle base 9 is a diode. The above structure is two packaging cavities, forming a two-way optical-electric coupling device.

[0030] The two-way optical-electric coupling device exhibits good performance in actual application. Due to the combination of photosensitive chips and diodes, efficient conversion and transmission of optical-electric signals can be achieved. When light shines on the photosensitive chip, it will trigger the photoelectric effect inside the chip, producing corresponding changes in the electrical signal. The diode plays a key role in rectification and amplitude limiting, ensuring that the signal can be transmitted stably and accurately. Under different light intensities, the two-way optical-electric coupling device can accurately respond and reliably convert optical signals into electrical signals, and transmit them to subsequent circuits through the lines in the packaging cavity, providing a stable and efficient optical-electric coupling solution for signal processing and control of various electronic devices, effectively improving the reliability and stability of the entire system.

[0031] In some embodiments, referring to Figure 4 A signal transmission conductor 5 is arranged between the ceramic upper base 1 and the ceramic middle base 9, and between the ceramic middle base 9 and the ceramic lower base 2. Signal interconnection is achieved through the signal transmission conductor 5.

[0032] During the transmission of signals of different frequencies, the signal transmission conductor 5 exhibits good conductivity and stability, accurately and efficiently transmitting the signals received by the ceramic upper base 1 to the ceramic middle base 9, and further to the ceramic lower base 2.

[0033] In some embodiments, referring to Figure 5 A metal solder ring 13 is arranged on the soldering surface of the mutual soldering of the ceramic upper base 1, the ceramic middle base 9, and the ceramic lower base 2 for soldering and sealing.

[0034] Metal solder rings 13 and interconnection pads 14 are printed on the surface of the ceramic upper base 1 and the surface of the ceramic lower base 2, and alloy solder is pre-placed on the metal solder rings 13 and interconnection pads 14 of the ceramic upper base 1. During use, the ceramic upper base 1 and the ceramic lower base 2 are aligned and soldered to achieve airtight packaging, ensuring high reliability while effectively realizing the miniaturization of the optical-electric coupling device.

[0035] In the above embodiments, the description of each embodiment is focused on, and the part not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0036] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A ceramic housing for a butt-welded package, characterized by, The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure.

2. The docked welded packaged ceramic housing of claim 1, wherein, The application relates to a ceramic double-layer stack structure.

3. The docked welded packaged ceramic housing of claim 1, wherein, The application relates to a ceramic double-layer stack structure.

4. The docked welded packaged ceramic housing of claim 3, wherein, The application relates to a ceramic double-layer stack structure.

5. The docked welded packaged ceramic housing of claim 1, wherein, The application relates to a ceramic double-layer stack structure.

6. The docked welded packaged ceramic housing of claim 1, wherein, The application relates to a ceramic double-layer stack structure.

7. The docked welded packaged ceramic housing of claim 6, wherein, The application relates to a ceramic double-layer stack structure.

8. The docked welded packaged ceramic housing of claim 6, wherein, The application relates to a ceramic double-layer stack structure.

9. The docked welded packaged ceramic housing of claim 6, wherein, The application relates to a ceramic double-layer stack structure.

10. The docked solder packaged ceramic housing of claim 6, wherein, The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. The application relates to a ceramic double-layer stack structure. 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