Lens assembly and electronic device including the same

Abstract

According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include: a lens assembly; and an image sensor including an image forming surface on which an image is formed. The lens assembly may include at least four lenses continuously arranged in a direction from an object side toward an image side along an optical axis, the at least four lenses including a first lens, a second lens having an image-side surface thereof having a shape recessed on the image side, a third lens, and a fourth lens. Various other embodiments are also possible.

Description

TECHNICAL FIELD

[0001] Embodiments of the disclosure relate to a lens assembly and an electronic device including the same. BACKGROUND

[0002] Optical devices, such as cameras capable of capturing images or videos, have been widely used. Although film-based optical devices were dominant in the past, in recent years, digital cameras or video cameras equipped with a solid-state image sensor, such as a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS), have become increasingly widespread. Because optical devices employing a solid-state image sensor (CCD or CMOS) provide advantages in storing, copying, and transferring images more easily than film-based optical devices, optical devices employing a solid-state image sensor (CCD or CMOS) have gradually replaced film-based optical devices.

[0003] To obtain high-quality images and / or videos, an optical device can include an optical system consisting of a lens assembly having a plurality of lenses and an image sensor having a high pixel count. The lens assembly can have, for example, a low F number (Fno) and small aberrations, so that high-quality (high-resolution) images and / or videos can be obtained. To achieve a low F number (Fno) and small aberrations, in other words, to obtain bright and high-resolution images, a plurality of lenses needs to be combined. When an image sensor includes more pixels, the pixel count of the image sensor increases, which results in high-resolution (high spatial resolution) images and / or videos. To implement a high-pixel count image sensor within a limited installation space in an electronic device, a plurality of extremely small pixels (e.g., micrometer-sized pixels) can be arranged. Recently, image sensors including hundreds of millions to billions of micrometer-sized pixels have even been installed in portable electronic devices such as smartphones and tablet computers. Such high-performance optical devices can be used to attract users to purchase electronic devices.

[0004] The above-described information can be provided as related art to help understand the disclosure. It is not suggested or determined whether anything in the above description can be applied as prior art related to the disclosure. SUMMARY

[0005] TECHNICAL SOLUTION

[0006] According to embodiments of the disclosure, an electronic device can be provided. The electronic device can include a lens assembly and an image sensor, wherein the image sensor includes an imaging surface on which an image is formed. The lens assembly can include at least four lenses sequentially arranged from an object side toward an image side along an optical axis, and can include a first lens, a second lens having an image side surface with a shape concaved toward the image side, a third lens, and a fourth lens. The electronic device (or an entire optical system including the lens assembly and the image sensor) can satisfy the following

Equation 1

【Equation 4]:

[0007]

Equation 1

[0008] IH ≥ 2.9mm

[0009]

Equation 2

[0010] f / EPD ≤ 2.3

[0011]

Equation 3

[0012] TTL / (IH×2) < 0.74

[0013]

Equation 4

[0014] N2 ≥ 1.66

[0015] wherein, in

Equation 1

Equation 3

Equation 2

Equation 3

Equation 4

[0016] According to embodiments of the disclosure, an optical system can be provided. The optical system can include a lens assembly and an image sensor, wherein the image sensor includes an imaging surface on which an image is formed. The lens assembly can include at least four lenses sequentially arranged from an object side toward an image side along an optical axis, and can include a first lens, a second lens having an image side surface with a shape concaved toward the image side, a third lens, a fourth lens, and a stop disposed between an object and the first lens. The optical system can have a field of view equal to or less than 90 degrees, and can satisfy the following

Equation 1

Equation 4

Equation 1

Equation 2

Equation 3

[0017] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the disclosure; Figure 2 is a block diagram illustrating a camera module according to an embodiment of the disclosure; Figure 3 is a front perspective view of an electronic device according to an embodiment of the disclosure; Figure 4 is a rear perspective view of an electronic device according to an embodiment of the disclosure; Figure 5 is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 6a is a graph illustrating a spherical aberration of the lens assembly of Figure 5 according to an embodiment of the disclosure; Figure 6b is a graph illustrating a coma of the lens assembly of Figure 5 according to an embodiment of the disclosure; Figure 6c is a graph illustrating a distortion aberration of the lens assembly of Figure 5 according to an embodiment of the disclosure; Figure 7 is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 8a is a graph illustrating a spherical aberration of the lens assembly of Figure 7 according to an embodiment of the disclosure; Figure 8b is a graph illustrating a coma of the lens assembly of Figure 7 according to an embodiment of the disclosure; Figure 8c is a graph illustrating a distortion aberration of the lens assembly of Figure 7 according to an embodiment of the disclosure; Figure 9is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 10a is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 9 is a graph illustrating a spherical aberration of the lens assembly of Figure 10b is a graph illustrating a spherical aberration of the lens assembly of Figure 9 Figure 10c is a graph illustrating a spherical aberration of the lens assembly of Figure 9 Figure 11 is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 12a is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 11 is a graph illustrating a spherical aberration of the lens assembly of Figure 12b is a graph illustrating a spherical aberration of the lens assembly of Figure 11 Figure 12c is a graph illustrating a spherical aberration of the lens assembly of Figure 11 Figure 13 is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 14a is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the disclosure; Figure 13 is a graph illustrating a spherical aberration of the lens assembly of Figure 14b is a graph illustrating a spherical aberration of the lens assembly of Figure 13 Figure 14c is a graph illustrating a spherical aberration of the lens assembly of Figure 13

[0018] In all the drawings, like reference numerals can be assigned to like parts, components and / or structures. DETAILED DESCRIPTION

[0019] Figure 1 is a block diagram of an electronic device in a network environment 100 according to an embodiment of the disclosure. Referring to Figure 1 ​​​​​​The electronic device 101 in the network environment 100 can communicate with an external electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an external electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the external electronic device 104 via the server 108. According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one (e.g., the connection terminal 178) of the above components can be omitted from the electronic device 101, or one or more other components can be added in the electronic device 101. In an embodiment, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) can be integrated into a single component (e.g., the display module 160).

[0020] The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 and can perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 can store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store processed results in the non-volatile memory 134. According to an embodiment, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 can be configured to be less powerful than the main processor 121, or to be specialized for a specific function. The auxiliary processor 123 can be implemented as separate from, or as part of, the main processor 121.

[0021] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via an electronic device 101 that performs artificial intelligence or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0022] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0023] Program 140 may be stored as software in memory 130, and program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0024] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0025] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record. The receiver can be used to receive an incoming call. According to an embodiment, the receiver can be implemented as separate from the speaker, or can be implemented as part of the speaker.

[0026] The display module 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 can include, for example, a display, a hologram device, or a projector and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 can include a touch sensor configured to detect a touch, or a second sensor configured to measure a strength of force generated by the touch.

[0027] The audio module 170 can convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can obtain sound through the input module 150, or output sound through the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.

[0028] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface 177 can support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the external electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0030] The connection terminal 178 can include a connector through which the electronic device 101 can be physically connected with the external electronic device (e.g., the external electronic device 102). According to an embodiment, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module 179 can convert electrical signal into a mechanical stimulus (e.g., a vibration or movement) or electrical stimulus that can be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0032] The camera module 180 can capture still images or moving images. According to an embodiment, the camera module 180 can include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0034] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0035] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the external electronic device 102, the external electronic device 104, or a server 108) and performing communication between the electronic devices 101 and the external electronic device 104 via the established communication channel. The communication module 190 can include one or more communication processors that are operable independently from the processor 120 (e.g., an application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can perform communication by using at least one of the first network 198 (e.g., a short-range wireless communication network, such as Bluetooth, wireless-fidelity (Wi-Fi), Wi-Fi direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range wireless communication network, such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))).

[0036] The wireless communication module 192 can support 5G networks and next-generation communication technologies (e.g., new radio (NR) access technology) after 4G networks. The NR access technology can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support a high frequency band (e.g., a millimeter wave band) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for securing performance on a high frequency band, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beamforming, or large scale antenna. The wireless communication module 192 can support various requirements designated in the electronic device 101, an external electronic device (e.g., the external electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, a loss coverage (e.g., 164 dB or less) for implementing mMTC, or a U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less of round trip) for implementing URLLC.

[0037] The antenna module 197 can transmit or receive a signal or power to or from an external (e.g., an external electronic device). According to an embodiment, the antenna module 197 can include one antenna including a radiator formed of a conductor or a conductive pattern formed on a base (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 can include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme suitable for use in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190. Then, a signal or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, other than the radiator, another part (e.g., a radio frequency integrated circuit (RFIC)) can further be formed as part of the antenna module 197.

[0038] According to an embodiment, the antenna module 197 can form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module can include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., a millimeter wave band), and the plurality of antennas is disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving a signal of the designated high frequency band.

[0039] At least some of the above-described components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicate information (e.g., commands or data) between them.

[0040] According to an embodiment, instructions or data can be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the external electronic devices 102 or 104 can be a device of a same type as or a different type as compared with the electronic device 101. According to an embodiment, some or all of the operations to be performed by the electronic device 101 can be performed by one or more of the external electronic devices 102, 104, or server 108. For example, if the electronic device 101 is to automatically perform a function or a service or is to perform a function or a service in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request can perform the requested at least part of the function or the service, or perform another function or another service related to the request, and transfer a result of the performance to the electronic device 101. The electronic device 101 can provide the result, with or without further processing of the result, as a reply to at least part of the request. To that end, a cloud computing technique, a distributed computing technique, a mobile edge computing (MEC) technique, or a client-server computing technique can be used, for example. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide an ultra-low latency service. In an embodiment, the external electronic device 104 can include an Internet of Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 104 or the server 108 can be included in the second network 199. The electronic device 101 can be applied to a smart service (e.g., a smart home, a smart city, a smart car, or a health care) based on a 5G communication technology or an IoT-related technology.

[0041] Figure 2 is a block diagram 200 illustrating a camera module 280 (e.g., Figure 1 of the electronic device 101 according to an embodiment of the disclosure. Referring to Figure 2The camera module 280 can include a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., a buffer memory), or an image signal processor 260. In an embodiment, the lens assembly 210 can include the image sensor 230. The lens assembly 210 can collect light emitted from a subject. The lens assembly 210 can include one or more lenses. According to an embodiment, the camera module 280 can include a plurality of lens assemblies 210. In this case, the camera module 280 can form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 can have the same lens characteristics (e.g., angle of view, focal length, auto focus, f number, or optical zoom), or at least one of the lens assemblies can have one or more lens characteristics different from the lens characteristics of the other lens assemblies. The lens assembly 210 can include, for example, a wide-angle lens or a telephoto lens.

[0042] The flash 220 can emit light for enhancing light emitted or reflected from a subject. According to an embodiment, the flash 220 can include one or more light emitting diodes (LEDs) (e.g., a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED) or a xenon lamp. The image sensor 230 can obtain an image corresponding to a subject by converting light emitted or reflected from the subject and transmitted via the lens assembly 210 into an electrical signal. According to an embodiment, the image sensor 230 can include one image sensor (such as an RGB sensor, a black-and-white (BW) sensor, an infrared (IR) sensor, or an ultraviolet (UV) sensor) selected from among a plurality of image sensors having different characteristics, a plurality of image sensors having the same characteristics, or a plurality of image sensors having different characteristics. Each of the image sensors included in the image sensor 230 can be implemented using, for example, a charge-coupled device (CCD) sensor or a complementary metal-oxide semiconductor (CMOS) sensor.

[0043] The image stabilizer 240 can move the image sensor 230 or at least one lens included in the lens assembly 210 in a certain direction or control an operable characteristic (e.g., adjust a readout timing) of the image sensor 230 in response to movement of the camera module 280 or the electronic device 201 including the camera module 280. This can compensate for at least a portion of a negative effect caused by such movement of the photographed image. According to an embodiment, the image stabilizer 240 can detect movement of the camera module 280 or the electronic device (e.g., the electronic device 201) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 280. Figure 1such movement of the electronic device 101. According to an embodiment, the image stabilizer 240 can be implemented as, for example, an optical image stabilizer. The memory 250 can temporarily store at least a portion of an image acquired via the image sensor 230 for subsequent image processing. For example, if an image acquisition is delayed due to a shutter lag, or if a plurality of images are rapidly captured, the acquired raw image (e.g., a Bayer pattern image, a high-resolution image) can be stored in the memory 250, and at least a portion of the raw image stored in the memory 250 can be acquired and processed via the image signal processor 260 when a designated condition (e.g., a user input or a system command) is satisfied. Figure 1 a corresponding copy image (e.g., a low-resolution image) via the display module 160. Then, when a designated condition (e.g., a user input or a system command) is satisfied, at least a portion of the raw image stored in the memory 250 can be acquired and processed by, for example, the image signal processor 260. According to an embodiment, the memory 250 can be configured as a portion of the memory 130 of the electronic device 101, or the memory 250 can be configured as a separate memory that operates independently. Figure 1 a corresponding copy image (e.g., a low-resolution image) via the display module 160. Then, when a designated condition (e.g., a user input or a system command) is satisfied, at least a portion of the raw image stored in the memory 250 can be acquired and processed by, for example, the image signal processor 260. According to an embodiment, the memory 250 can be configured as a portion of the memory 130 of the electronic device 101, or the memory 250 can be configured as a separate memory that operates independently.

[0044] The image signal processor 260 can perform one or more image processing operations on an image acquired via the image sensor 230 or an image stored in the memory 250. The one or more image processing operations can include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 260 can control at least one component (e.g., the image sensor 230) included in the camera module 280 (such as by controlling an exposure time or controlling a readout timing). An image processed by the image signal processor 260 can be stored again in the memory 250 for further processing, or the image can be provided to an external component (e.g., the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108) of the camera module 280. According to an embodiment, the image signal processor 260 can be implemented as a portion of the processor 120 of the electronic device 101, or the image signal processor 260 can be implemented as a separate processor that operates independently of the processor 120. In the case where the image signal processor 260 is implemented as a processor separate from the processor 120, at least one image processed by the image signal processor 260 can be displayed via the display module 160 directly or after additional image processing by the processor 120. Figure 1 The image signal processor 260 can perform one or more image processing operations on an image acquired via the image sensor 230 or an image stored in the memory 250. The one or more image processing operations can include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 260 can control at least one component (e.g., the image sensor 230) included in the camera module 280 (such as by controlling an exposure time or controlling a readout timing). An image processed by the image signal processor 260 can be stored again in the memory 250 for further processing, or the image can be provided to an external component (e.g., the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108) of the camera module 280. According to an embodiment, the image signal processor 260 can be implemented as a portion of the processor 120 of the electronic device 101, or the image signal processor 260 can be implemented as a separate processor that operates independently of the processor 120. In the case where the image signal processor 260 is implemented as a processor separate from the processor 120, at least one image processed by the image signal processor 260 can be displayed via the display module 160 directly or after additional image processing by the processor 120.

[0045] According to an embodiment, the electronic device (e.g., the electronic device 102 or the electronic device 104) can include at least one of the image sensor 230, the image stabilizer 240, the memory 250, the image signal processor 260, or the camera module 280. Figure 1The electronic device 101 may include a plurality of camera modules 280, each having different attributes or functions. In this case, for example, at least one of the plurality of camera modules 280 may be a wide-angle camera, and at least another of the plurality of camera modules 280 may be a telephoto camera. Similarly, at least one of the plurality of camera modules 280 may be a front-facing camera, and at least another of the plurality of camera modules 280 may be a rear-facing camera.

[0046] Figure 3 This is a front perspective view of an electronic device according to an embodiment of the present disclosure. Figure 4 This is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0047] Figure 3 and Figure 4 The configuration of the electronic device 101 shown can be with Figure 1 The electronic devices 101 shown are configured in whole or in part the same way.

[0048] Reference Figure 3 and Figure 4 An electronic device 101 according to an embodiment of the present disclosure may include a housing 310, the housing 310 including a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a side surface 310C surrounding the space between the first surface 310A and the second surface 310B. In an embodiment (not shown), housing 310 may refer to a device forming... Figure 3 First surface 310A, Figure 4 The second surface 310B and the side surface 310C are partially structured. According to an embodiment, the first surface 310A may be formed at least partially of a substantially transparent front panel 302 (e.g., a glass or polymer panel including various coatings). The second surface 310B may be formed of a substantially opaque back panel 311. The back panel 311 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side surface 310C may be bonded to the front panel 302 and the back panel 311, and may be formed of a side structure (or “side frame structure”) 318 including metal and / or polymer. In an embodiment, the back panel 311 and the side structure 318 may be integrally formed and may include the same material (e.g., ceramic or glass or a metallic material such as aluminum).

[0049] According to an embodiment (not shown), the front panel 302 may include one or more seamless extension regions that bend toward the rear panel 311 at at least a portion of its edge. In an embodiment, only one of the bent extension regions of the front panel 302 (or rear panel 311) toward the rear panel 311 (or front panel 302) may be included at one edge of the first surface 310A. According to an embodiment, the front panel 302 or the rear panel 311 may have a substantially flat shape, in which case the bent extension regions may not be included. When bent extension regions are included, the thickness of the electronic device 101 in the bent extension regions may be less than its thickness in other regions.

[0050] According to an embodiment, the electronic device 101 may include a display 301, an audio module (not shown) including at least one sound hole 303, 207 or 214 (e.g., Figure 1 The audio module 170), sensor module 304 (e.g., Figure 1 Sensor module 176), camera module 305, 212 or 213 (e.g., Figure 1 Camera module 280 and / or Figure 2 The camera module 280), and the key input device 317 (e.g., Figure 1 Input module 150), light-emitting element 306, connector hole 308 or 209 (e.g., Figure 1 At least one of the following: the connector end 178) and the non-conductive cover 361. According to an embodiment, the electronic device 101 may omit at least one of the components (e.g., connector hole 309) or additionally include other components.

[0051] According to an embodiment, the display 301 can be visually exposed through a major portion of the front panel 302. According to an embodiment, at least a portion of the display 301 can be visually exposed through the front panel 302 forming the first surface 310A or through a portion of the side surface 310C. According to an embodiment, the corners of the display 301 can be formed to substantially match the adjacent external shape of the front panel 302. In an embodiment (not shown), to extend the visually exposed area of ​​the display 301, the gap between the outer edge of the display 301 and the outer edge of the front panel 302 can be formed to be substantially uniform. According to an embodiment, the surface of the housing 310 (or the front panel 302) can include a screen display area formed when the display 301 is visually exposed, and as an example, the screen display area can include the front surface 310A.

[0052] In an embodiment (not shown), a recess or an opening can be formed in a portion (e.g., the front surface 310A) of the screen display area of the display 301, and can include at least one of the sound hole 314, the sensor module 304, the camera module 305, and the light emitting element 306 aligned with the recess or the opening. In an embodiment (not shown), at least one of the sound hole 314, the sensor module 304, the camera module 305, a fingerprint sensor (not shown), and a light emitting element (not shown) can be disposed on the rear side of the screen display area of the display 301. In an embodiment (not shown), the display 301 can be coupled with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a stylus based on a magnetic field. According to an embodiment, at least a portion of the sensor module 304 and / or at least a portion of the key input device 317 can be disposed on the side surface 310C.

[0053] According to an embodiment, the audio module (not shown) can include the microphone hole 303 as well as the sound holes 307 and 214. A microphone can be disposed inside the microphone hole 303 to acquire external sounds, and in an embodiment, a plurality of microphones can be arranged to detect the direction of sound. According to an embodiment, the sound holes 307 and 214 can include an external sound hole 307 for a voice call and a receiver hole 314. In an embodiment, the sound holes 307 and 214 and the microphone hole 303 can be implemented as a single hole, or a speaker can be included in an audio module without the sound holes 307 and 214 (e.g., a piezoelectric speaker).

[0054] According to an embodiment, the sensor module (not shown) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) can include, for example, a first sensor module (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the front surface 310A of the housing 310, and / or a third sensor module (e.g., a heart rate monitoring (HRM) sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the rear surface 310B of the housing 310. In an embodiment (not shown), the fingerprint sensor can be disposed not only on the front surface 310A (e.g., the display 301) of the housing 310 but also on the rear surface 310B. The electronic device 101 can further include at least one additional sensor module (not shown), such as a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an ambient light sensor. The sensor module is not limited to the configurations described above, and can be variously modified according to the structure of the electronic device 101, for example, by including only some of the sensor modules or by adding a new sensor module.

[0055] According to an embodiment, the camera module 305, 212, or 213 can include a first camera device 305 disposed on the first surface 310A of the electronic device 101, a second camera device 312 disposed on the second surface 310B, and / or a flash 313. The camera devices 305 and 212 can include one or more lenses, image sensors, and / or image signal processors. The flash 313 can include, for example, a light-emitting diode or a xenon lamp. In an embodiment, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a long-focus lens) and image sensors can be disposed on one surface of the electronic device 101. In an embodiment, the flash 313 can emit infrared light. For example, infrared light emitted from the flash 313 and reflected by an object can be received by a sensor module (not shown) disposed on the second surface 310B of the housing 310. The electronic device 101 or the processor of the electronic device 101 can detect depth information of the object based on a point in time at which the infrared light is received by the sensor module. The camera module 305, 312, or 313 is not limited to the above-described configurations, and can be variously modified according to the structure of the electronic device 101, for example, by including only some of the camera modules or by adding a new camera module.

[0056] According to an embodiment, the electronic device 101 can include a plurality of camera modules (e.g., dual cameras or triple cameras) each having different characteristics (e.g., fields of view) or functions. For example, a plurality of camera modules 305 and 312 including lenses having different fields of view can be provided, and the electronic device 101 can control the fields of view of the camera modules 305 and 312 operating on the electronic device 101 to change based on a selection of a user. For example, at least one of the plurality of camera modules 305 and 312 can be a wide-angle camera, and at least another one can be a telephoto camera. Similarly, at least one of the plurality of camera modules 305 and 312 can be a front camera, and at least another one can be a rear camera. Furthermore, the plurality of camera modules 305 and 312 can include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera). According to an embodiment, the IR camera can operate as at least part of a sensor module. For example, the TOF camera can operate as at least part of a sensor module (not shown) for detecting a distance from an object.

[0057] According to an embodiment, the key input device 317 can be disposed on the side surface 310C of the housing 310. In an embodiment, the electronic device 101 can include only some of the above-described key input devices 317 or not include the key input device 317, and the key input device 317 not included can be implemented in another form such as a soft key on the display 301. In an embodiment, the key input device can include a sensor module (not shown) disposed on the second surface 310B of the housing 310.

[0058] According to an embodiment, the light emitting element 306 can be disposed on, for example, the first surface 310A of the housing 310. The light emitting element 306 can provide state information of the electronic device 101 in the form of light. In an embodiment, the light emitting element 306 can provide a light source that cooperates with the operation of the first camera module 305 disposed on the first surface 310A. The light emitting element 306 can include, for example, an LED, an IR LED, and a xenon lamp.

[0059] According to an embodiment, the connector holes 308 and 209 can include a first connector hole 308 configured for a connector (e.g., a USB connector) for transmitting and / or receiving power and / or data with an external electronic device and / or a second connector hole 309 configured to receive a connector (e.g., a headphone jack) for transmitting and receiving an audio signal with an external electronic device.

[0060] According to embodiments, some of camera modules 305 and 312 (such as camera module 305) and / or some of sensor modules (not shown) may be configured to be exposed to the outside through at least a portion of display 301. For example, camera module 305 may include a punch-hole camera disposed in a hole or recess formed on the rear side of display 301. According to embodiments, camera module 312 may be disposed inside housing 310 such that the lens is exposed through the rear surface 310B of electronics 101. For example, camera module 312 may be disposed on a printed circuit board (not shown).

[0061] According to an embodiment, the camera module 305 and / or sensor module may be disposed within the internal space of the electronic device 101, such that they are in contact with the external environment through a transparent area of ​​the display 301 extending to the front panel 302. Additionally, some sensor modules 304 may be disposed within the internal space of the electronic device to perform their functions without being visually exposed through the front panel 302.

[0062] Figure 5 This is a configuration diagram illustrating an optical system including a lens assembly and an image sensor according to an embodiment of the present disclosure. Figure 6a This illustrates an embodiment according to the present disclosure. Figure 5 A curve showing the spherical aberration of the lens assembly. Figure 6b This illustrates an embodiment according to the present disclosure. Figure 5 The astigmatism curve of the lens assembly. Figure 6c This illustrates an embodiment according to the present disclosure. Figure 5 A graph showing the distortion and aberration of the lens components.

[0063] Figure 6a This is a graph illustrating the spherical aberration of a lens assembly 400 according to an embodiment of the present disclosure, where the horizontal axis represents the coefficient of longitudinal spherical aberration, the vertical axis represents the normalized distance from the optical axis O, and the variation of longitudinal spherical aberration with respect to the wavelength of light is shown. The longitudinal spherical aberration is shown for light having wavelengths of, for example, 656.3000 nm, 587.6000 nm, 546.1000 nm, 486.1000 nm, and 435.8000 nm. Figure 6b This is a graph showing the astigmatism curve of the lens assembly 400 according to an embodiment of the present disclosure for light having a wavelength of 546.1000 nm. In the graph, "S" represents the sagittal plane and "T" represents the sectional plane (or meridional plane). Figure 6c This is a graph showing the distortion of a lens assembly 400 according to an embodiment of the present disclosure for light having a wavelength of 546.1000 nm.

[0064] Reference Figures 5 to 6c In embodiments of this disclosure, electronic devices (e.g., Figure 1 、 Figure 3 and Figure 4 The electronic device 101) can include an optical system including a lens assembly 400 (e.g., the lens assembly 210 of Figure 2 and an image sensor I (e.g., the image sensor 230 of Figure 2 ). The optical system including a lens assembly according to an embodiment of the disclosure (e.g., the lens assembly 400 of Figure 5 , Figure 7 the lens assembly 500 of Figure 9 the lens assembly 600 of Figure 11 the lens assembly 700 of Figure 13 and / or the lens assembly 800 of Figure 1 may constitute at least a portion of a camera module (e.g., the camera module 180 of Figure 2 , Figure 3 the camera module 305 of Figure 4 and / or the camera module 312 of According to an embodiment, the lens assembly 400, 500, 600, 700, and 800 can include a plurality (e.g., at least four) of lenses L1, L2, L3, and L4 and a stop sto. According to an embodiment, the lenses L1, L2, L3, and L4, the stop sto, and / or the image sensor I can be aligned substantially along an optical axis O. In the disclosure, the expression "aligned along the optical axis O" can be understood to mean that an area through which light passes from the stop sto and / or the lenses L1, L2, L3, and L4 to an imaging surface img of the image sensor I or the imaging surface img of the image sensor I itself is aligned with the optical axis O.

[0065] According to an embodiment, the lenses L1, L2, L3, and L4 can include a first lens L1, a second lens L2, a third lens L3, and a fourth lens L4 sequentially arranged along the optical axis O in a direction from the object obj toward the image sensor I. According to an embodiment, the lenses L1, L2, L3, and L4 can each include an object-side surface facing the object obj and an image-side surface facing the image sensor I. For example, the first lens L1 can include an object-side surface S3 and an image-side surface S4. The second lens L2 can include an object-side surface S5 and an image-side surface S6. The third lens L3 can include an object-side surface S7 and an image-side surface S8. The fourth lens L4 can include an object-side surface S9 and an image-side surface S10. According to an embodiment, at least one of the lenses L1, L2, L3, and L4 can be configured to reciprocate along the optical axis O, and the electronic device (e.g., the electronic device 101 of Figure 1 and / or Figure 3 and Figure 4 The electronic device 101) or a processor (e.g., the processor 120 of Figure 1The processor 120 can perform focusing or focal length adjustment by reciprocating at least one of lenses L1, L2, L3, and L4. According to an embodiment, the lens assembly (e.g., Figure 5 Lens assembly 400, Figure 7 Lens assembly 500, Figure 9 Lens assembly 600, Figure 11 Lens assembly 700 and / or Figure 13 The lens assembly 800 can be set in Figure 3 Camera module 305 and / or Figure 4 At least one of the camera modules 312. For example, S1 shown in the figures (e.g., Figure 5 , Figure 7 , Figure 9 , Figure 11 and Figure 13 S1 can represent a point located between the first lens L1 and the object obj. The "S1" shown in the attached figure (e.g., Figure 5 , Figure 7 , Figure 9 , Figure 11 and Figure 13 S1) can represent a position considered in the design of lens assemblies 400, 500, 600, 700 and 800, rather than the actual lens surface, and can indicate, for example, the reference position of a structure in which a protective window is set, or the position of a structure (or lens barrel or lens housing) used to fix one of lenses L1, L2, L3 and L4 (e.g., the first lens L1).

[0066] According to an embodiment, the aperture stop sto can be disposed between the object obj and the first lens L1, and can be implemented, for example, on the surface of the first lens L1 (e.g., the object-side surface S3). For example, the arrangement of the aperture stop sto in front of the object-side surface S3 of the first lens L1 can help reduce the field of view of the optical system and minimize the aperture of the optical system.

[0067] According to an embodiment, the aperture stop sto can be positioned on the object obj side relative to lenses L1, L2, L3, and L4, and can limit the light entering therein to substantially incident on the lens assembly (e.g., Figure 5 Lens assembly 400, Figure 7 Lens assembly 500, Figure 9 Lens assembly 600, Figure 11 Lens assembly 700, and / or Figure 13According to embodiments, the stop sto can be disposed between the object obj and the first lens L1 and can be implemented, for example, on a surface (e.g., an object-side surface S3) of the first lens L1. For example, the lenses L1, L2, L3, and L4 can be substantially disposed between the stop sto and the image sensor I and can focus light incident through the stop sto onto the image sensor I. For example, the arrangement of the stop sto in front of the object-side surface S3 of the first lens L1 can be advantageous to reduce the field of view angle of the optical system and to minimize the aperture of the optical system. For example, by disposing the stop sto in front of the object-side surface S3 of the first lens L1, the aperture of the lens assembly 400, 500, 600, 700, and 800 can be reduced while still providing good wide-angle performance. According to embodiments, the image sensor I can comprise an imaging face img that receives at least a portion of the light focused through the stop sto and / or the lenses L1, L2, L3, and L4. According to embodiments, the image sensor I can be understood as a component separate from the lens assembly 400, 500, 600, 700, and 800.

[0068] According to embodiments, the lens assembly (e.g., Figure 5 the lens assembly 400 of FIG. 4, Figure 7 the lens assembly 500 of FIG. 5, Figure 9 the lens assembly 600 of FIG. 6, Figure 11 the lens assembly 700 of FIG. 7, and / or Figure 13 the lens assembly 800 of FIG. 8) can further comprise an infrared cut filter F. According to embodiments, the infrared cut filter F can comprise an object-side surface S11 facing the object obj and an image-side surface S12 facing the image sensor I, respectively. For example, the infrared cut filter F can block light (e.g., infrared light) of a wavelength band that is not visible to the human eye but can be detected by film or the image sensor I. In embodiments, depending on the application of the lens assembly 400, 500, 600, 700, and 800 or the electronic device (e.g., Figure 1 and / or Figure 3 and Figure 4 the electronic device 101 of FIG. 1), the infrared cut filter F can be replaced with a bandpass filter that transmits infrared light and blocks visible light. For example, in the lens assembly (e.g., 400, 500, 600, 700, or 800) or in the electronic device 101 for detecting infrared light, the infrared cut filter F can be replaced with a bandpass filter that transmits infrared light.

[0069] According to embodiments, the infrared cut filter F and / or the image sensor I can be described as being separate from the lens assembly (e.g., Figure 5 the lens assembly 400 of FIG. 4, Figure 7 the lens assembly 500 of FIG. 5, Figure 9 the lens assembly 600 of FIG. 6, Figure 11 lens assembly 700 of FIG. 7 and / or Figure 13 lens assembly 800 of FIG. 8) separated configuration. For example, the infrared cut filter F and / or the image sensor I can be mounted in an electronic device (e.g., the electronic device 101 of FIG. 1) or an optical device (e.g., the camera module 180 of FIG. 2, Figure 1 lens assembly 500 of FIG. 5 and / or Figure 3 lens assembly 600 of FIG. 6, and Figure 4 lens assembly 700 of FIG. 7 and / or Figure 1 lens assembly 800 of FIG. 8) separated configuration. For example, the infrared cut filter F and / or the image sensor I can be mounted in an electronic device (e.g., the electronic device 101 of FIG. 1) or an optical device (e.g., the camera module 180 of FIG. 2, Figure 2 lens assembly 280 of FIG. 3 and / or Figure 3 lens assembly 305 and 312 of FIG. 4) and the plurality of lenses L1, L2, L3, and L4 constituting the lens assemblies 400, 500, 600, 700, and 800 can be mounted to the electronic device or the optical device in a state of being aligned with the infrared cut filter F and / or the image sensor I along the optical axis O. Figure 4 According to an embodiment, an electronic device (e.g., the electronic device 101 of FIG. 1) can include a front camera (e.g., the first camera device 305 of FIG. 3 and / or

[0070] lens assembly 280 of FIG. 3 and / or Figure 1 lens assembly 305 and 312 of FIG. 4) and the plurality of lenses L1, L2, L3, and L4 constituting the lens assemblies 400, 500, 600, 700, and 800 can be mounted to the electronic device or the optical device in a state of being aligned with the infrared cut filter F and / or the image sensor I along the optical axis O. Figure 3 lens assembly 280 of FIG. 3 and / or Figure 4 lens assembly 305 and 312 of FIG. 4) and the plurality of lenses L1, L2, L3, and L4 constituting the lens assemblies 400, 500, 600, 700, and 800 can be mounted to the electronic device or the optical device in a state of being aligned with the infrared cut filter F and / or the image sensor I along the optical axis O. Figure 2 lens assembly 280 of FIG. 3 and / or Figure 3 lens assembly 305 and 312 of FIG. 4) and the plurality of lenses L1, L2, L3, and L4 constituting the lens assemblies 400, 500, 600, 700, and 800 can be mounted to the electronic device or the optical device in a state of being aligned with the infrared cut filter F and / or the image sensor I along the optical axis O. Figure 1 lens assembly 280 of FIG. 3 and / or Figure 3 lens assembly 305 and 312 of FIG. 4) and the plurality of lenses L1, L2, L3, and L4 constituting the lens assemblies 400, 500, 600, 700, and 800 can be mounted to the electronic device or the optical device in a state of being aligned with the infrared cut filter F and / or the image sensor I along the optical axis O. Figure 1 lens assembly 280 of FIG. 3 and / or Figure 3 lens assembly 305 and 312 of FIG. 4) and the plurality of lenses L1, L2, L3, and L4 constituting the lens assemblies 400, 500, 600, 700, and 800 can be mounted to the electronic device or the optical device in a state of being aligned with the infrared cut filter F and / or the image sensor I along the optical axis O.

[0071] In the following detailed description, terms such as “recessed” or “convex” may be used to describe the shape of the object-side surface (which is the surface of lenses L1, L2, L3, and L4 facing the object obj) and / or the image-side surface (which is the surface of lenses L1, L2, L3, and L4 facing the image sensor I or the imaging plane img). This description of the shape of the lens surfaces may refer to the shape at the point of intersection with the optical axis O or in the paraxial region intersecting with the optical axis O. The statement “the object-side surface is recessed” may refer to a shape in which the center of curvature of the object-side surface is located on the object obj side. The statement “the object-side surface is convex” may refer to a shape in which the center of curvature of the object-side surface is located on the image sensor I side. Therefore, even when one surface of the lens (the portion along the optical axis) is described as having a convex shape, the edge portions of the lens (the portions spaced a predetermined distance from the optical axis) may be recessed. Similarly, even when one surface of the lens (the portion along the optical axis) is described as having a concave shape, the edge portion of the lens (the portion spaced a predetermined distance from the optical axis) may be convex. In the following detailed description and claims, the term "curvature point" may refer to the point in the portion that does not intersect the optical axis O where the radius of curvature changes.

[0072] In the following detailed description, unless otherwise stated, the radii, effective focal length f, total trajectory length (TTL), surface distance (SD), thickness, or image height (IH) of lenses L1, L2, L3, and L4 may be expressed in millimeters (mm). Furthermore, the radii, effective focal length, TTL, SD, thickness, or image height IH of lenses L1, L2, L3, and L4 may be distances measured relative to the optical axis O.

[0073] According to an embodiment, the lens assembly (e.g., Figure 5 Lens assembly 400, Figure 7 Lens assembly 500, Figure 9 Lens assembly 600, Figure 11 Lens assembly 700 and / or Figure 13 The lens assembly 800 can be a wide-angle lens that provides a field of view (FOV) of about 90 degrees or less and can achieve, for example, a field of view of about 80 degrees. According to an embodiment, lenses L1, L2, L3 and L4 can be formed comprising a polymer material.

[0074] According to an embodiment, the first lens L1 can be a lens closest to the object obj, and can have a positive refractive power. According to an embodiment, the stop sto can be disposed between the first lens L1 and the object obj, and the first lens L1 can be a first lens disposed behind the stop sto. According to an embodiment, an object-side surface S3 of the first lens L1 can have a convex shape toward the object obj. For example, the convex shape of the object-side surface S3 toward the object obj can suppress an increase in spherical aberration caused by a large aperture of the optical system (e.g., the lenses L1, L2, L3, and L4). According to an embodiment, a refractive index of the first lens L1 can be relatively lower than a refractive index of the second lens L2, and can be, for example, about 1.6 or less.

[0075] According to an embodiment, the second lens L2 can be a second lens disposed behind the stop sto, and can have a negative refractive power. According to an embodiment, an image-side surface S6 of the second lens L2 can have a concave shape toward the image side. For example, the concave shape of the image-side surface S6 toward the image side can be advantageous to improve aberration of the optical system and reduce the total length. According to an embodiment, a refractive index of the second lens L2 can be relatively greater than a refractive index of the first lens L1, the third lens L3, and / or the fourth lens L4, and can be, for example, about 1.66 or more.

[0076] According to an embodiment, the third lens L3 can be a third lens disposed behind the stop sto, and can have a positive refractive power. According to an embodiment, the third lens L3 can have a meniscus shape convex toward the image side. In this case, both an object-side surface S7 and an image-side surface S8 of the third lens L3 can have a convex shape toward the image side. For example, the meniscus shape convex toward the image side of the third lens L3 can be advantageous to improve or correct aberration in a peripheral region of the third lens L3. According to an embodiment, a refractive index of the third lens L3 can be relatively lower than a refractive index of the second lens L2, and can be, for example, about 1.6 or less.

[0077] According to an embodiment, the fourth lens L4 can be a fourth lens disposed behind the stop sto, and can have a negative refractive power. The fourth lens L4 can be a lens disposed closest to the image sensor I. At least one of the object side surface S9 or the image side surface S10 of the fourth lens L4 can be formed as an aspherical surface. According to an embodiment, both the object side surface S9 and the image side surface S10 of the fourth lens L4 can be formed as aspherical surfaces. In an embodiment, a paraxial region of the fourth lens L4 close to the optical axis O can have a meniscus shape convex toward the object obj. According to an embodiment, a peripheral region adjacent to the paraxial region of the fourth lens L4 can include at least one inflection point, and can have a shape inclined toward the object obj. Such a shape can be advantageous in reducing the effective diameter of the fourth lens L4 and shortening the total length of the entire optical system. According to an embodiment, the refractive index of the fourth lens L4 can be lower than the refractive index of the second lens L2, and can be, for example, about 1.6 or less.

[0078] According to an embodiment, at least one surface (e.g., an object side surface and / or an image side surface) of at least some of the plurality of lenses L1, L2, L3, and L4 can be formed as an aspherical surface. By forming at least one surface of at least some of the plurality of lenses L1, L2, L3, and L4 as an aspherical surface, it is possible to suppress spherical aberration that can occur in the lenses. According to an embodiment, by forming the lens surfaces as aspherical surfaces, it is possible to prevent the occurrence of coma in the peripheral portion of the image sensor I, facilitate the control of astigmatism, and reduce the phenomenon of field curvature from the center to the peripheral portion of the imaging surface img of the image sensor I.

[0079] According to an embodiment, the optical system (or electronic device) including the lens assembly 400 can satisfy the following

Equation 1

Equation 1

Equation 1

[0080] According to an embodiment, the value calculated in

Equation 1

Equation 1

Equations 2 to 11

[0081] According to an embodiment, the optical system including the lens assembly 400 can satisfy the following

Equation 2

[0082] According to an embodiment, [Equation 2] can define a condition for a value of an F number (Fno) indicating brightness of the optical system. According to an embodiment, when a calculated value of [Equation 2] is greater than about 2.3, a deflection limit can be reduced, which can result in an overall degradation of optical performance and a relatively darker brightness of the lens assembly 400.

[0083] According to an embodiment, the optical system including the lens assembly 400 can satisfy the following [Equation 3]: [Equation 3] TTL / (IH × 2) < 0.74 In [Equation 3], “TTL” (total track length) can denote a distance measured along the optical axis O from the object side surface S3 of the first lens L1 to the imaging surface img (hereinafter, referred to as “lens total length”). In [Equation 3], “IH” can denote half of a diagonal length of the image sensor I, and can be a maximum value among heights or distances measured from the optical axis O to edges of the imaging surface img.

[0084] According to an embodiment, [Equation 3] can define a condition for a degree of slimness (or slimming factor) of the optical system. According to an embodiment, when a calculated value of [Equation 3] is about 0.74 or more, a total length of the lens can increase and a total size of the optical system can become larger, which can violate a miniaturization demand of the optical system.

[0085] According to an embodiment, the optical system including the lens assembly 400 can satisfy the following [Equation 4]: [Equation 4] N2 ≥ 1.66 In [Equation 4], “N2” can denote a refractive index of the second lens L2 at a wavelength of about 587.6 nm.

[0086] According to an embodiment, by satisfying the refractive index condition defined in [Equation 4], a compact optical system having improved chromatic aberration can be implemented. According to an embodiment, when a calculated value of [Equation 4] is less than about 1.66, a field angle of the optical system can be reduced; however, controlling aberration of the lenses L1, L2, L3, and L4 and optimizing lens performance (e.g., modulation transfer function, MTF) can become difficult, and a lens total length can increase, which can violate a miniaturization demand of the optical system.

[0087] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following

Equation 5

Equation 5

Equation 5

[0088] According to an embodiment, by satisfying the Abbe number condition defined in

Equation 5

Equation 5

[0089] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following

Equation 6

Equation 6

Equation 6

Equation 6

Equation 6

[0090] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following

Equation 7

Equation 7

Equation 7

[0091] According to an embodiment, by satisfying the refractive index condition defined in

Equation 7

Equation 7

[0092] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following [Equation 8]: [Equation 8] N1 ≤ 1.6 In [Equation 8], "N1" can denote the refractive index of the first lens L1 at a wavelength of about 587.6 nm.

[0093] According to an embodiment, by satisfying the refractive index condition defined in [Equation 8], an optical system having improved aberration characteristics can be implemented. For example, when the calculated value of [Equation 8] exceeds about 1.6, the aberration control performance of the optical system can deteriorate.

[0094] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following [Equation 9]: [Equation 9] N4 < 1.6 In [Equation 9], "N4" can denote the refractive index of the fourth lens L4 at a wavelength of about 587.6 nm.

[0095] According to an embodiment, by satisfying the refractive index condition defined in [Equation 9], an optical system having improved aberration characteristics can be implemented. For example, when the calculated value of [Equation 9] exceeds about 1.6, the aberration control performance of the optical system can deteriorate.

[0096] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following [Equation 10]: [Equation 10] CT2 ≥ 0.15 mm In [Equation 10], "CT2" can denote the center thickness of the second lens L2. For example, the center thickness of the second lens L2 can be measured with respect to the optical axis O.

[0097] According to an embodiment, [Equation 10] can define a slimming condition of the optical system. For example, when the calculated value of [Equation 10] is less than about 0.15 mm, it can be difficult to implement desired slimming characteristics of the optical system.

[0098] According to an embodiment, an optical system including the lens assembly 400 can satisfy the following [Equation 11]: [Equation 11] IH / N2 ≥ 1.7 In [Equation 11], "IH" can denote half of the diagonal length of the image sensor, and "N2" can denote the refractive index of the second lens at a wavelength of 587.6 nm.

[0099] According to an embodiment, Equation 11 can define a slimness condition of the optical system. For example, when a calculated value of Equation 11 is less than about 1.7, it can be difficult to achieve a slimness characteristic of the optical system or to ensure improved aberration performance.

[0100] The following Table 1 shows calculated values of Equations 1 to 11 of the lens assemblies 400, 500, 600, 700, and 800 according to Embodiment 1 and / or Embodiments 2 to 5 described below. Referring to Table 1, it can be seen that the lens assemblies 400, 500, 600, 700, and 800 according to Embodiments 1 to 5 satisfy the conditions of Equations 1 to 11.

[0101] Table 1

[0102] As described above, the optical system including the lens assemblies 400, 500, 600, 700, and 800 according to the embodiments of the disclosure can apply an image sensor I having a diagonal length equal to or greater than a certain size (e.g., about 2.9 mm or more of IH), and can be implemented as a compact or slim optical system that is bright (e.g., has an Fno of about 2.3 or less) and has a shortened total length (e.g., a slim factor of 0.73 or less). According to an embodiment, the optical system including such a lens assembly 400, 500, 600, 700, and 800 can satisfy at least one of Equations 1 to 6 and Equations 7 to 11 described above, and can be implemented by setting a stop sto in front of the first lens L1 and optimizing the shapes of the third lens L3 and the fourth lens L4.

[0103] Embodiment 1

[0104] In an embodiment, the optical system including the lens assembly 400 can be manufactured to conform to the shapes of the lenses L1, L2, L3, and L4 (e.g., lens surfaces) described above and to the conditions presented by Equations 1 to 11 described above, and to have specifications shown in the following Table 2. In Table 2, the surface 1 (e.g., S1 in Equation 1) can represent a gap between the first lens L1 and the object obj, and the thickness value of the surface can correspond to the distance of the gap or air gap. According to an embodiment, the optical system including the lens assembly 400 can have a combined effective focal length f of about 3.38 mm, an Fno value of about 2.25, and a field of view angle of about 80 degrees. Figure 5 Table 2

[0105]

[0106] ​Tables 3 and 4 below show aspherical coefficients of the lenses L1, L2, L3, and L4, and the aspherical coefficients can be calculated using the following Mathematical Expression 1: [Mathematical Expression 1] Here, "x" can denote a distance from a vertex of the lenses L1, L2, L3, and L4 in a direction of an optical axis O, "y" can denote a distance in a direction perpendicular to the optical axis O, "R" can denote a radius of curvature at the vertex of the lens, "K" can denote a conic constant, and "A4" to "A10" can denote aspherical coefficients. A i E+01 can indicate 10 1 , and E-02 can indicate 10 -2 . The radius of curvature R can denote, for example, a value indicating a degree of curvature at each point on a curved surface or a curve.

[0107] [Table 3]

[0108] [Table 4]

[0109] [Example 2]

[0110] Figure 7 is a configuration diagram illustrating an optical system including a lens assembly 500 and an image sensor I according to an embodiment of the disclosure. Figure 8a is a graph illustrating a spherical aberration of the lens assembly 500 according to an embodiment of the disclosure. Figure 7 is a graph illustrating a spherical aberration of the lens assembly 500 according to an embodiment of the disclosure. Figure 8b is a graph illustrating a coma of the lens assembly 500 according to an embodiment of the disclosure. Figure 7 is a graph illustrating a coma of the lens assembly 500 according to an embodiment of the disclosure. Figure 8c is a graph illustrating a distortion of the lens assembly 500 according to an embodiment of the disclosure. Figure 7 is a graph illustrating a distortion of the lens assembly 500 according to an embodiment of the disclosure.

[0111] Figure 8a is a graph illustrating a spherical aberration of the lens assembly 500 according to an embodiment of the disclosure, in which a horizontal axis denotes a coefficient of a longitudinal spherical aberration, a vertical axis denotes a normalized distance from the optical axis O, and a change in the longitudinal spherical aberration according to a wavelength of light is shown. For example, the longitudinal spherical aberration is shown for light having wavelengths of 656.2725 nm, 587.5618 nm, 546.0740 nm, 486.1327 nm, and 435.8343 nm. Figure 8b is a graph illustrating a coma of the lens assembly 500 according to an embodiment of the disclosure based on light having a wavelength of 546.0740 nm. "S" denotes a sagittal plane, and "T" denotes a tangential plane. Figure 8c is a graph illustrating distortion of the lens assembly 500 based on light having a wavelength of 546.0740 nm according to an embodiment of the disclosure.

[0112] In an embodiment, the lens assembly 500 can satisfy at least some of the conditions presented by the shapes (e.g., lens surfaces) of the lenses described above with reference to Figure 5

Equation 1

Equation 11

Table 5

Table 6

Table 7

Table 5

[0113]

Table 5

[0114]

Table 6

[0115]

Table 7

[0116]

Embodiment 3

[0117] Figure 9 is a configuration diagram of an optical system including a lens assembly 600 and an image sensor I according to an embodiment of the disclosure. Figure 10a is a graph illustrating distortion of the lens assembly 600 according to an embodiment of the disclosure. Figure 9 Figure 10b is a graph illustrating astigmatism of the lens assembly 600 according to an embodiment of the disclosure. Figure 9 Figure 10c is a graph illustrating distortion of the lens assembly 600 according to an embodiment of the disclosure. Figure 9

[0118] In an embodiment, the lens assembly 600 can satisfy at least some of the conditions presented by the shapes (e.g., lens surfaces) of the lenses described above with reference to Figure 5 ​​​The described lens shape (e.g., lens surface) presents conditions and at least some of the conditions defined by Equations 1 through 11. Lens assembly 600 can be manufactured according to the specifications shown in Table 8 and can have the aspherical coefficients shown in Tables 9 and 10. In Table 8, lens surface 1 can represent the gap between the first lens L1 and the object obj, and a measurement of its thickness can correspond to the distance of the gap or air gap. According to an embodiment, the optical system including lens assembly 600 can have a compound effective focal length f of approximately 3.38 mm, an Fno value of approximately 2.26, and a field of view of approximately 80 degrees.

[0119] Table 8

[0120] Table 9

[0121] Table 10

[0122]

Example 4

[0123] Figure 11 This is a configuration diagram illustrating an optical system including a lens assembly 700 and an image sensor I according to an embodiment of the present disclosure. Figure 12a This illustrates an embodiment according to the present disclosure. Figure 11 A graph showing the spherical aberration of the 700 lens assembly. Figure 12b This illustrates an embodiment according to the present disclosure. Figure 11 The astigmatism curve of the 700 lens assembly. Figure 12c This illustrates an embodiment according to the present disclosure. Figure 11 The distortion curve of the lens assembly 700.

[0124] In the embodiment, the lens assembly 700 can meet the requirements described above. Figure 5 The described lens shape (e.g., lens surface) presents conditions and at least some of the conditions defined by Equations 1 through 11. Lens assembly 700 can be manufactured according to the specifications shown in Table 11 and can have the aspherical coefficients shown in Tables 12 and 13. In Table 11, lens surface 1 can represent the gap between the first lens L1 and the object obj, and a measurement of its thickness can correspond to the distance of the gap or air gap. According to an embodiment, the optical system including lens assembly 700 can have a compound effective focal length f of approximately 3.38 mm, an Fno value of approximately 2.25, and a field of view of approximately 80 degrees.

[0125] Table 11

[0126] Table 12

[0127] Table 13

[0128] Example 5

[0129] Figure 13 FIG. 8 is a configuration diagram illustrating an optical system including a lens assembly 800 and an image sensor I according to an embodiment of the disclosure. Figure 14a FIG. 9 is a configuration diagram illustrating a lens assembly 900 according to an embodiment of the disclosure. Figure 13 FIG. 10 is a graph illustrating a spherical aberration of the lens assembly 900 of FIG. 9 according to an embodiment of the disclosure. Figure 14b FIG. 11 is a graph illustrating a coma of the lens assembly 900 of FIG. 9 according to an embodiment of the disclosure. Figure 13 FIG. 12 is a graph illustrating a distortion of the lens assembly 900 of FIG. 9 according to an embodiment of the disclosure. Figure 14c FIG. 13 is a graph illustrating a lateral chromatic aberration of the lens assembly 900 of FIG. 9 according to an embodiment of the disclosure. Figure 13 FIG. 14 is a graph illustrating an axial chromatic aberration of the lens assembly 900 of FIG. 9 according to an embodiment of the disclosure.

[0130] In an embodiment, the lens assembly 800 can satisfy at least some of the conditions presented by the shapes (e.g., lens surfaces) of the lenses described above with reference to FIGS. 1 to 7 and the conditions defined by [Equation 1] to [Equation 11]. The lens assembly 800 can be manufactured according to the specifications shown in Table 14, and can have aspherical coefficients shown in Tables 15 and 16. In Table 14, the lens surface 1 can denote a gap between the first lens L1 and the object obj, and a measured value of a thickness thereof can correspond to a distance of the gap or an air gap. According to an embodiment, an optical system including the lens assembly 800 can have a composite effective focal length f of about 3.39 mm, an Fno value of about 2.25, and a field of view of about 80 degrees. Figure 5

[0131] Table 14

[0132] Table 15

[0133] Table 16

[0134] ​As described above, the optical systems including the lens assemblies 400, 500, 600, 700, and 800 according to embodiments of the disclosure can apply a high-pixel image sensor I having a diagonal length equal to or greater than a certain size (e.g., about 2.9 mm or more of IH), and can be implemented as a compact or slim optical system that is bright (e.g., has an Fno of about 2.3 or less) and has a reduced total length (e.g., a slim factor of 0.73 or less). According to embodiments, the optical system including such a lens assembly can satisfy at least one of the above-described

Equation 1

Equation 6

Equation 7

Equation 11

[0135] An optical system including a plurality of lenses can be applied to a camera module of various electronic devices such as a smart phone, a tablet PC, a smart watch, and a drone. In general, aberrations caused by the shapes of lenses occur in an optical system, and it is necessary to minimize such aberrations to provide good optical performance. In general, in order to reduce aberrations in an optical system, methods such as using a relatively small sensor, applying a dark lens in conjunction with a large sensor, or increasing the total length of a lens system can be applied.

[0136] Embodiments disclosed herein aim to at least solve the above-mentioned problems and / or disadvantages, and provide at least the advantages described below. The embodiments can provide an optical system including a lens assembly optimized for a high-resolution image sensor in which the total length is reduced and the optical performance (aberration control and brightness) is improved, and an electronic device including the optical system.

[0137] According to various embodiments disclosed herein, an optical system can be appropriately installed in a miniaturized and / or light-weighted electronic device such as a smart phone, and can contribute to the expansion of the optical function or the enhancement of the optical performance of the electronic device.

[0138] The technical objects to be achieved by the disclosure are not limited to those described above, and other technical objects not mentioned explicitly will become apparent to those skilled in the art from the disclosure herein provided.

[0139] Effects obtainable from the present disclosure are not limited to those described above and additional effects not expressly mentioned will be clearly understood by persons of ordinary skill in the art based on the description of the present disclosure.

[0140] According to embodiments of the present disclosure, an electronic device can be provided. The electronic device can include a lens assembly 400, 500, 600, 700, or 800 and an image sensor I including an imaging surface img on which an image is formed. The lens assembly can include at least four lenses sequentially arranged from an object obj side toward the imaging surface img along an optical axis O, and can include a first lens L1, a second lens L2 having an image-side surface S6 curved toward the image side, a third lens L3, and a fourth lens L4. The electronic device (or the entire optical system including the lens assembly and the image sensor) can satisfy the following

Equation 1

Equation 4

Equation 1

Equation 2

Equation 3

Equation 4

Equation 1

Equation 3

Equation 2

Equation 3

Equation 4

[0141] According to embodiments, the second lens can satisfy the following

Equation 5

Equation 5

[0142] According to embodiments, the object-side surface S3 of the first lens can have a shape convex toward the object side.

[0143] According to embodiments, the third lens can have a meniscus shape curved toward the image side.

[0144] According to embodiments, the electronic device (or the entire optical system including the lens assembly and the image sensor) can satisfy the following

Equation 6

Equation 6

[0145] According to an embodiment, the third lens can satisfy the following

Equation 7

Equation 7

[0146] According to an embodiment, the first lens can satisfy the following

Equation 8

Equation 8

[0147] According to an embodiment, the fourth lens can satisfy the following

Equation 9

Equation 9

[0148] According to an embodiment, the second lens can have a negative refractive power and satisfy the following

Equation 10

Equation 10

[0149] According to an embodiment, the third lens can have a positive refractive power, and the image-side surface S8 of the third lens can have a shape convex toward the image side.

[0150] According to an embodiment, at least one of the object-side surface S9 or the image-side surface S10 of the fourth lens can be formed as an aspheric surface.

[0151] According to an embodiment, at least one of the aspheric surfaces among the object-side surface or the image-side surface of the fourth lens can include at least one inflection point.

[0152] According to an embodiment, the electronic device (or the entire optical system including the lens assembly and the image sensor) can satisfy the following

Equation 11

Equation 11

[0153] According to an embodiment, the lens assembly can further include a stop sto disposed between the object and the first lens.

[0154] According to an embodiment, the lens assembly can constitute a camera module of an electronic device having a field of view equal to or less than 90 degrees.

[0155] According to an embodiment of the disclosure, an optical system can be provided. The optical system can include a lens assembly 400, 500, 600, 700, or 800 and an image sensor I including an imaging surface img on which an image is formed. The lens assembly can include at least four lenses sequentially arranged from an object obj side toward an image side along an optical axis O, and can include a first lens L1, a second lens L2 having an image-side surface S6 concave toward the image side, a third lens L3, a fourth lens L4, and a stop sto disposed between the object and the first lens. The optical system can have a field of view equal to or less than 90 degrees, and can satisfy the following

Equation 1

Equation 4

Equation 1

Equation 2

Equation 3

Equation 4

Equation 1

Equation 3

Equation 2

Equation 3

Equation 4

[0156] According to an embodiment, the second lens can satisfy the following

Equation 5

Equation 5

[0157] According to an embodiment, the optical system can satisfy the following

Equation 6

Equation 6

[0158] According to an embodiment, the third lens and the fourth lens can satisfy the following

Equation 7

Equation 8

Equation 7

Equation 8

Equation 7

Equation 8

[0159] According to an embodiment, the fourth lens can satisfy the following

Equation 9

Equation 10

Equation 9

Equation 10

Equation 9

Equation 10

[0160] The embodiments disclosed in the disclosure should not be construed as limiting the present invention, but should be understood as examples. It will be apparent to those skilled in the art that various changes in form and details can be made without departing from the spirit and scope of the disclosure including the following appended claims and their equivalents.

[0161] An electronic device according to various embodiments of the disclosure can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic devices according to an embodiment are not limited to those described above.

[0162] It should be understood that an embodiment of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. For the description of the drawings, like reference numerals can be used to refer to like or similar elements. It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include all possible combinations of the items listed in the corresponding one of the phrases. As used herein, the terms such as "1st" and "2nd," or "first" and "second" can be used to simply distinguish a corresponding component from another, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled with" or "connected with" or "joined with" or "connected to" another element (e.g., a second element) without qualification, it should be understood that the element can be directly coupled with or connected with or joined with or connected to the other element or be coupled with or connected with or joined with or connected to the other element via a third element.

[0163] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms, e.g., "logic," "logic block," "part," or "circuitry." A module can be a single integral component, or a minimum unit or part thereof, configured to perform one or more functions. For example, a module according to an embodiment can be implemented in a form of an application-specific integrated circuit (ASIC).

[0164] Embodiments of the disclosure can be implemented as software (e.g., program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that are readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated as a special purpose machine to perform at least one function. The one or more instructions can include a code generated by a compiler or a code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[0165] According to an embodiment, a method according to various embodiments of the disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed online via an application store (e.g., PlayStoreTM). If distributed online, at least part of the computer program product can be temporarily stored in a storage medium such as a memory of a manufacturer's server, an application store's server, or a relay server.

[0166] According to various embodiments, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities, and some of the multiple entities can be separately positioned in different components. According to various embodiments, one or more of the above-described components can be omitted, or one or more other components can be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) can be integrated into a single component. In such a case, according to various embodiments, the integrated component can still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations can be executed in a different order or omitted, or one or more other operations can be added.

Claims

1.An electronic device comprising: a lens assembly (400; 500; 600; 700; 800) including at least four lenses arranged in order from an object side (obj) toward an image side along an optical axis (O), the lens assembly including a first lens (L1), a second lens (L2) having an image side surface (S6) of a shape concave toward the image side, a third lens (L3), and a fourth lens (L4); and an image sensor (I) including an imaging surface (img) on which an image is formed, wherein the electronic device satisfies the following 【Equation 1】 to 【Equation 4】: 【Equation 1】 IH ≥ 2.9 mm 【Equation 2】 f / EPD ≤ 2.3 【Equation 3】 TTL / (IH × 2) < 0.74 【Equation 4】 wherein, in 【Equation 1】 and 【Equation 3】, "IH" is half of a diagonal length of the image sensor; in 【Equation 2】, "f" is an effective focal length of an entire optical system including the lens assembly and the image sensor, and "EPD" is an entrance pupil diameter; in 【Equation 3】, "TTL" is a distance from an object side surface (S3) of the first lens to the imaging surface; and in 【Equation 4】, "N2" is a refractive index of the second lens at a wavelength of 587.6 nm. N2 ≥ 1.66 2.The electronic device according to claim 1, the second lens satisfies the following 【Equation 5】: wherein 【Equation 5】 wherein, "V2" is an Abbe number of the second lens at a wavelength of 587.6 nm. V2 < 25 the object side surface of the first lens has a shape convex toward the object side. 3.The electronic device of claim 1 or 2, wherein, the third lens has a meniscus shape curved toward the image side. 4.The electronic device of any one of claims 1 to 3, wherein, satisfies the following 【Equation 6】: 5.The electronic device of any one of claims 1 to 4, wherein, 【Equation 6】 S2 / TTL ≤ 0.9 wherein, "SD" is a distance from the object side surface of the first lens to an image side surface (S9) of the fourth lens, and "TTL" is a distance from the object side surface of the first lens to the imaging surface. the third lens satisfies the following 【Equation 7】: 6.The electronic device of any one of claims 1 to 5, wherein, 【Equation 7】 wherein, "N3" is a refractive index of the third lens at a wavelength of 587.6 nm. N3 ≤ 1.6 the first lens satisfies the following 【Equation 8】: 7.The electronic device of any one of claims 1 to 6, wherein, 【Equation 8】 wherein, "N1" is a refractive index of the first lens at a wavelength of 587.6 nm. N1 ≤ 1.6 the fourth lens satisfies the following 【Equation 9】: 8.The electronic device of any one of claims 1 to 7, wherein, 【Equation 9】 wherein, "N4" is a refractive index of the fourth lens at a wavelength of 587.6 nm. N4 < 1.6 the second lens has a negative refractive power and satisfies the following 【Equation 10】: 9.The electronic device of any one of claims 1 to 8, wherein, 【Equation 10】 CT2 ≥ 0.15 mm wherein, "CT2" is a center thickness of the second lens. the third lens has a positive refractive power, and an image side surface (S8) of the third lens has a shape convex toward the image side. 10.The electronic device of any one of claims 1 to 9, wherein, at least one of an object side surface or an image side surface (S10) of the fourth lens is formed as an aspherical surface. 11.The electronic device of any one of claims 1 to 10, wherein, ​ 12.The electronic device of claim 11, wherein, At least one of the aspherical surfaces among the object side surface or the image side surface of the fourth lens includes at least one inflection point. 13.The electronic device of any one of claims 1-12, wherein, The following 【Equation 11】 is satisfied: 【Equation 11】 IH / N2 ≥ 1.7 where "IH" is half of the diagonal length of the image sensor, and "N2" is the refractive index of the second lens at a wavelength of 587.6 nm. 14.The electronic device of any one of claims 1-13, wherein, The lens assembly further includes a stop (sto) disposed between an object and the first lens. 15.The electronic device of any one of claims 1 to 14, wherein, The lens assembly has a field of view equal to or less than 90 degrees.

Images