A cold forging die for a copper IGBT heat sink substrate

Abstract

This invention belongs to the field of cold forging die technology for copper, and specifically discloses a cold forging die for a copper IGBT heat dissipation substrate, including a lower die plate and an upper die plate. The upper die plate is located above the lower die plate. An upper die assembly is provided at the bottom of the upper die plate, and a lower die assembly is provided at the top of the lower die plate. A floating structure is provided at the top of the lower die assembly. In this invention, the copper substrate is placed inside the groove formed between the top of the lower die pressure block and the top of the ejector block and the top of the lower die inner plate. During the process of the upper die assembly pressing down and the lower die assembly closing, the floating structure will be driven to descend as a whole, and the disc spring will be compressed. During the descent of the floating structure as a whole, the lower die pressure block and the ejector block located in the middle of the floating structure remain stationary, thereby forming a compression cavity inside the groove formed between the top of the lower die pressure block and the top of the ejector block and the top of the lower die inner plate during the descent of the floating structure, which compresses the copper substrate.

Description

Technical Field

[0001] This invention relates to the field of cold forging die technology for copper, and in particular to a cold forging die for a copper IGBT heat dissipation substrate. Background Technology

[0002] IGBT is short for Insulated Gate Bipolar Transistor. IGBT combines the advantages of power transistors and electric field-effect transistors, has excellent characteristics, and is widely used. Furthermore, IGBT is a three-terminal device: gate, collector, and emitter. During use, it needs to be cooled by a heat dissipation substrate made of cold-forged copper.

[0003] Traditional cold forging dies for copper heat dissipation substrates suffer from problems such as uneven material flow, coating damage during material removal, and insufficient material retention accuracy. This invention solves the stress concentration and deformation defects of coated copper during the extrusion process by using a floating pressure transmission structure and gap material retention design. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, the present invention provides a cold forging die for a copper IGBT heat dissipation substrate.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a cold forging die for a copper IGBT heat dissipation substrate, comprising a lower die plate and an upper die plate, the upper die plate being located above the lower die plate, an upper die assembly being provided at the bottom of the upper die plate, a lower die assembly being provided at the top of the lower die plate, a floating structure being provided at the top of the lower die assembly, and a feedback device being provided inside the lower die assembly.

[0006] The lower mold assembly includes a lower mold sleeve, which is fixed to the top of the lower mold plate. A lower mold positioning sleeve is provided between the inner walls of the lower mold sleeve near the bottom edge. A first pressure block is provided between the inner walls of the lower mold positioning sleeve. The bottom of the first pressure block and the bottom of the lower mold positioning sleeve are both in contact with the top of the lower mold plate.

[0007] Preferably, a clamping ring is provided at the top of the lower mold sleeve, and a floating structure is located inside the clamping ring. A positioning ring is provided at the top of the lower mold positioning sleeve near the outer surface edge. A bridging plate is provided at the top of the first pressure block. A second pressure block is fitted on the outer surface of the bridging plate. The outer surface of the second pressure block is in contact with the inner wall of the positioning ring. The bottom of the second pressure block is in contact with the top of the first pressure block near the inner edge.

[0008] Preferably, the floating structure includes an outer ring with an inclined outer surface wall. The outer ring is positioned inside the clamping ring, and the inclined surface of the outer ring is in contact with the inner wall of the clamping ring. A lower die middle ring is provided between the inner walls of the outer ring, and a lower die inner plate is provided between the inner walls of the lower die middle ring. A lower die pressure block is slidably provided between the inner walls of the lower die inner plate, and a material ejection block is slidably provided inside the lower die pressure block. A gap is left between the bottom of the outer ring, the bottom of the lower die middle ring, and the bottom of the lower die inner plate and the top of the bridging plate. The bottom of the lower die pressure block and the bottom of the material ejection block are in contact with the top of the bridging plate.

[0009] Preferably, the top of the ejector block is flush with the top of the lower die pressure block, the top of the ejector block is located below the top of the lower die inner plate, and a groove is formed between the top of the lower die pressure block and the top of the lower die inner plate. A butterfly spring is slidably provided on the outer surface of the lower die middle ring near the bottom edge. The outer surface edge of the butterfly spring extends obliquely to the bottom edge of the outer ring. The inner bottom of the butterfly spring is attached to the top of the second pressure block. A through hole extending to the bottom is provided on the top of the lower die inner plate near the front and rear side edges. A positioning rod is provided inside the two through holes, and the bottom of the two positioning rods extends to the top of the second pressure block.

[0010] Preferably, the feedback device includes a filler block, a movable cavity is provided inside the first pressure block, the filler block slides between the inner walls of the movable cavity, a connecting rod is fixed to the top of the filler block, the top of the connecting rod slides through to the top of the bridge plate and is fixed to the bottom of the ejector block, a threaded groove is provided at the bottom of the lower template, an ejector pin is rotatably provided at the bottom of the filler block, the bottom of the ejector pin slides through into the threaded groove, a threaded ring is fixed to the outer surface of the ejector pin near the bottom edge, the outer surface of the threaded ring is threadedly connected to the inner wall of the threaded groove, and a return spring is fixed between the top of the threaded ring and the inner top surface of the threaded groove.

[0011] Preferably, the lower mold positioning sleeve has adjustment cavities near both sides of its interior, and the inner walls of both sides of the movable cavity have side openings that extend into the interior of the adjustment cavity. The outer surfaces of both sides of the filling block have snap-fit ​​openings. The bottom of the lower mold inner plate is fixed with push plates near both sides of its bottom. The bottom of both push plates slides to the bottom of the second pressure block and slides into the interior of the adjustment cavity.

[0012] Preferably, an adjusting block is slidably disposed between the inner walls on both sides of the two adjusting cavities, the bottom of the two push plates is fixed to the top of the adjusting block, an inner cavity is opened inside the two adjusting blocks, a sliding plate is slidably disposed between the inner walls of the two inner cavities, a constraint spring is fixed to one side of the two sliding plates, and one end of the two constraint springs is fixed to the inner wall of the inner cavity.

[0013] Preferably, each of the two slide plates has a deflector fixed on the other side. One end of each deflector slides through into the side opening, and one end of each deflector can extend into the slot on the outer surface of the filler block. Each deflector has a wedge-shaped opening extending to the bottom. An adjustment plate is fixed on the top surface inside each side opening. The bottom of one side of each adjustment plate is inclined and opposite to the inclined surface of the wedge-shaped opening.

[0014] Preferably, the upper mold assembly includes an upper mold sleeve, which is installed at the bottom of the upper template. An upper mold positioning sleeve is provided between the inner walls of the upper mold sleeve, and an upper mold pressure block is provided between the inner walls of the upper mold positioning sleeve. The top of the upper mold positioning sleeve and the top of the upper mold pressure block are both in contact with the bottom of the upper template.

[0015] Preferably, the bottom of the upper mold pressure block is provided with an upper mold pressure plate, the outer surface of the upper mold pressure plate is provided with an upper mold middle ring, the outer surface of the upper mold middle ring extends to the inner wall of the upper mold sleeve near the top edge, the outer surface of the upper mold sleeve is threaded with a large nut near the bottom, the inner wall of the large nut extends to the outer surface of the upper mold middle ring near the bottom edge, and presses against the outer surface of the upper mold middle ring near the top edge, the bottom of the upper mold pressure plate is provided with multiple mold holes at equal intervals in the middle, and the bottom of the upper mold pressure plate is provided with positioning holes near the front and rear sides, and the two positioning holes are located directly above the two positioning rods.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. In this invention, during the process of the upper mold assembly pressing down and the lower mold assembly closing, the floating structure as a whole will be driven to descend, and the butterfly spring will be compressed at the same time. During the process of the floating structure descending as a whole, the lower mold pressure block and the ejector block located in the middle part of the floating structure remain stationary, thereby forming an extrusion cavity inside the groove generated between the top of the lower mold pressure block and the top of the ejector block and the top of the lower mold inner plate during the descent of the floating structure, which extrudes the copper substrate.

[0018] 2. In this invention, when the upper mold assembly and the lower mold assembly are working, the upper mold assembly presses down to complete the mold closing action with the lower mold assembly. During the mold closing process, the floating structure and feedback device are triggered to work, thereby cold forging and unloading the copper substrate. When the upper mold assembly and the lower mold assembly are closing, the positioning rod and positioning hole guide the upper mold assembly and the lower mold assembly, thereby ensuring the accuracy of the mold closing.

[0019] 3. In the floating structure of this invention, pressure is transmitted in stages through a butterfly spring, which reduces the coating damage rate on the outer surface during the subsequent unloading of the copper substrate. At the same time, during the synchronous pressing of the outer ring, the middle ring of the lower mold, and the inner plate of the lower mold, the lower mold pressure block and the unloading block located in the middle remain stationary. Thus, an extrusion chamber is formed inside the groove generated between the top of the lower mold pressure block and the top of the unloading block and the top of the inner plate of the lower mold to extrude the copper substrate, ensuring unidirectional material flow.

[0020] 4. When the feedback device is working in this invention, when the inner plate of the lower mold slides upward, it will also drive the adjusting block to slide upward, which in turn will drive the dial plate to slide upward. Since one end of the dial plate is inserted into the slot at this time, it will drive the filling block and the connecting rod to slide upward. The upward sliding of the connecting rod will push the ejection block upward, thereby ejecting the cold-forged copper substrate to complete the ejection. Attached Figure Description

[0021] Figure 1 This invention provides a front-view three-dimensional structural schematic diagram of a cold forging die for a copper IGBT heat dissipation substrate;

[0022] Figure 2 This invention provides a side-section perspective view of a cold forging die for a copper IGBT heat dissipation substrate.

[0023] Figure 3 This invention provides a three-dimensional cross-sectional view of another side of a cold forging die for a copper IGBT heat dissipation substrate.

[0024] Figure 4 This invention provides a cross-sectional three-dimensional structural diagram of the upper die assembly in a cold forging die for a copper IGBT heat dissipation substrate.

[0025] Figure 5 This invention provides a cross-sectional three-dimensional structural diagram of the lower die assembly in a cold forging die for a copper IGBT heat dissipation substrate.

[0026] Figure 6 This invention provides a cross-sectional three-dimensional structural diagram of a floating structure in a cold forging die for a copper IGBT heat dissipation substrate.

[0027] Figure 7 For the present invention Figure 3 A magnified view of a portion of point A in the middle.

[0028] In the diagram: 1. Lower mold plate; 2. Upper mold plate; 3. Lower mold sleeve; 4. Pressure ring; 5. Large nut; 6. Upper mold sleeve; 7. Upper mold positioning sleeve; 8. Upper mold pressure block; 9. Upper mold middle ring; 10. Upper mold pressure plate; 11. Outer ring; 12. Lower mold middle ring; 13. Lower mold inner plate; 14. Butterfly spring; 15. Lower mold pressure block; 16. Unloading block; 17. Positioning ring; 18. Lower mold positioning sleeve; 19. First pressure block; 20. Bridging plate; 21. Mold 21. Hole; 22. Second pressure block; 23. Movable cavity; 24. Threaded groove; 25. Return spring; 26. Threaded ring; 27. Positioning hole; 28. Through hole; 29. ​​Positioning rod; 30. Push plate; 31. Connecting rod; 32. Filler block; 33. Unloading pin; 34. Adjusting cavity; 35. Side opening; 36. Adjusting block; 37. Inner cavity; 38. Constraint spring; 39. Slide plate; 40. Paddle plate; 41. Adjusting plate; 42. Wedge-shaped opening; 43. Bayonet. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1-7 The present invention provides a technical solution: a cold forging die for a copper IGBT heat dissipation substrate, including a lower die plate 1 and an upper die plate 2. The upper die plate 2 is located above the lower die plate 1. An upper die assembly is provided at the bottom of the upper die plate 2, and a lower die assembly is provided at the top of the lower die plate 1. A floating structure is provided at the top of the lower die assembly, and a feedback device is provided inside the lower die assembly.

[0031] The lower mold assembly includes a lower mold sleeve 3, which is fixed to the top of the lower mold plate 1. A lower mold positioning sleeve 18 is provided between the inner walls of the lower mold sleeve 3 near the bottom edge. A first pressure block 19 is provided between the inner walls of the lower mold positioning sleeve 18. The bottom of the first pressure block 19 and the bottom of the lower mold positioning sleeve 18 are respectively in contact with the top of the lower mold plate 1. A clamping ring 4 is provided on the top of the lower mold sleeve 3. A floating structure is located inside the clamping ring 4. A positioning ring 17 is provided on the top of the lower mold positioning sleeve 18 near the outer surface edge. A bridging plate 20 is provided on the top of the first pressure block 19. A second pressure block 22 is fitted on the outer surface of the bridging plate 20. The outer surface of the second pressure block 22 is in contact with the inner wall of the positioning ring 17. The bottom of the second pressure block 22 is in contact with the top of the first pressure block 19 near the inner edge.

[0032] The effect achieved is that the copper substrate is placed inside the groove formed between the top of the lower mold pressure block 15 and the top of the ejector block 16 and the top of the lower mold inner plate 13. During the process of the upper mold assembly pressing down and the lower mold assembly closing, the floating structure will be driven to descend as a whole, and the butterfly spring 14 will be compressed. During the descent of the floating structure as a whole, the lower mold pressure block 15 and the ejector block 16 located in the middle of the floating structure remain stationary. This results in the formation of a compression cavity inside the groove formed between the top of the lower mold pressure block 15 and the top of the ejector block 16 and the top of the lower mold inner plate 13 during the descent of the floating structure, which then compresses the copper substrate.

[0033] like Figure 2 , Figure 3 and Figure 6 As shown, the floating structure includes an outer ring 11 with an inclined outer surface wall. The outer ring 11 is positioned inside the clamping ring 4, and the inclined surface of the outer ring 11 is in contact with the inner wall of the clamping ring 4. A lower mold middle ring 12 is positioned between the inner walls of the outer ring 11, and a lower mold inner plate 13 is positioned between the inner walls of the lower mold middle ring 12. A lower mold pressure block 15 is slidably positioned between the inner walls of the lower mold inner plate 13, and a material ejection block 16 is slidably positioned inside the lower mold pressure block 15. Gaps are left between the bottom of the outer ring 11, the bottom of the lower mold middle ring 12, and the bottom of the lower mold inner plate 13 and the top of the bridging plate 20. The bottoms of the lower mold pressure block 15 and the material ejection block 16 are respectively in contact with the top of the bridging plate 20. The top of block 16 is flush with the top of the lower mold pressure block 15. The top of ejector block 16 is located below the top of the lower mold inner plate 13, and a groove is formed between the top of the lower mold pressure block 15 and the top of the lower mold inner plate 13. A butterfly spring 14 is slidably provided on the outer surface of the lower mold middle ring 12 near the bottom edge. The outer surface edge of the butterfly spring 14 extends obliquely to the bottom edge of the outer ring 11. The inner bottom of the butterfly spring 14 is attached to the top of the second pressure block 22. A through hole 28 extending to the bottom is provided on the top of the lower mold inner plate 13 near the front and rear edges. A positioning rod 29 is provided inside the two through holes 28, and the bottom of the two positioning rods 29 extends to the top of the second pressure block 22.

[0034] The effect achieved is that when the upper mold assembly is pressed down to the top of the lower mold assembly, the bottom of the upper mold pressure plate 10 near the outer edge will fit together with the top of the outer ring 11, the top of the lower mold middle ring 12, and the top of the lower mold inner plate 13, thereby pressing down the outer ring 11, the lower mold middle ring 12, and the lower mold inner plate 13 simultaneously. During the pressing down, the butterfly spring 14 will be compressed, and the pressure will be transmitted in stages through the butterfly spring 14, reducing the coating damage rate on the outer surface during the subsequent copper substrate stripping process. At the same time, during the simultaneous pressing down of the outer ring 11, the lower mold middle ring 12, and the lower mold inner plate 13, the lower mold pressure block 15 and the stripping block 16 located in the middle remain stationary. Thus, an extrusion cavity is formed inside the groove generated between the top of the lower mold pressure block 15 and the top of the stripping block 16 and the top of the lower mold inner plate 13 to extrude the copper substrate, ensuring unidirectional material flow. At the same time, the lower mold inner plate 13 will also drive the feedback device to work when it is pressed down.

[0035] like Figure 2 , Figure 3 , Figure 5 and Figure 7As shown, the feedback device includes a filler block 32. A movable cavity 23 is formed inside the first pressure block 19. The filler block 32 slides between the inner walls of the movable cavity 23. A connecting rod 31 is fixed to the top of the filler block 32. The top of the connecting rod 31 slides through to the top of the bridging plate 20 and is fixed to the bottom of the ejector block 16. A threaded groove 24 is formed at the bottom of the lower template 1. An ejector pin 33 is rotatably provided at the bottom of the filler block 32. The bottom of the ejector pin 33 slides through into the threaded groove 24. The outer surface of the ejector pin 33 is near the bottom edge. A threaded ring 26 is fixed at the edge, and the outer surface of the threaded ring 26 is threadedly connected to the inner wall of the threaded groove 24. A return spring 25 is fixed between the top of the threaded ring 26 and the inner top surface of the threaded groove 24. Adjustment cavities 34 are provided inside the lower mold positioning sleeve 18 near both sides. Side openings 35 are provided on both sides of the inner wall of the movable cavity 23, and both side openings 35 extend into the interior of the adjustment cavity 34. The outer surfaces of both sides of the filling block 32 are provided with retaining slots 43. The bottom of the lower mold inner plate 13 is near both sides. Push plates 30 are fixed at both ends. The bottoms of both push plates 30 slide to below the second pressure block 22 and slide through into the adjustment cavity 34. Adjustment blocks 36 are slidably arranged between the inner walls of both sides of the two adjustment cavities 34. The bottoms of both push plates 30 are fixed to the tops of the adjustment blocks 36. The interior of both adjustment blocks 36 is provided with an inner cavity 37. A sliding plate 39 is slidably arranged between the inner walls of both inner cavities 37. A constraint spring 38 is fixed to one side of both sliding plates 39. One end of each of the two slide plates 39 is fixed to the inner wall of the inner cavity 37. The other side of each slide plate 39 is fixed with a lever 40. One end of each lever 40 slides through into the side opening 35. One end of each lever 40 can extend into the slot 43 on the outer surface of the filler block 32. The top of each lever 40 is provided with a wedge-shaped opening 42 that extends to the bottom. The inner top surface of each side opening 35 is fixed with an adjustment plate 41. The bottom of one side of each adjustment plate 41 is inclined and opposite to the inclined surface of the wedge-shaped opening 42.

[0036] The effect achieved is as follows: when the inner mold plate 13 is not pressed down, the adjusting block 36 is located above the inside of the adjusting cavity 34. At this time, the adjusting plate 41 slides into the inside of the wedge-shaped opening 42, and under the mutual constraint of the inclined surface of the adjusting plate 41 and the inner inclined surface of the wedge-shaped opening 42, the push plate 40 is pushed into the adjusting cavity 34. At this time, the constraint spring 38 is in a compressed state, and the latch 43 is located below one end of the push plate 40. When the inner mold plate 13 is pressed down, the adjusting block 36 will slide down into the adjusting cavity 34. During the sliding, it will drive the push plate 40 to slide down. When the adjusting plate 41 slides out from the inside of the wedge-shaped opening 42, it will release the constraint on the push plate 40. At this time, the constraint spring 38 resets and drives one end of the push plate 40 to slide on the outer surface of the filling block 32 until one end of the push plate 40 slides into the inside of the latch 43. At this time, the upper mold assembly and the lower mold assembly are closed, and the extrusion of the copper substrate is completed. During the subsequent reset, the upper mold assembly slides upward to release the clamping force on the lower mold inner plate 13. The elastic force generated by the resetting of the butterfly spring 14 will reset the floating structure, thereby causing the lower die inner plate 13 to slide upward. When the floating structure resets, the lower die inner plate 13 slides upward, so it will release the adhesive force generated by the extrusion pressure between the inner wall of the lower die inner plate 13 and the outer surface of the cold-forged copper substrate in stages. When the lower die inner plate 13 slides upward, it will also drive the adjusting block 36 to slide upward, thereby driving the push plate 40 to slide upward. Since one end of the push plate 40 is inserted into the bayonet 43 at this time, it will drive the filling block 32 and the connecting rod 31 to slide upward. The upward sliding of the connecting rod 31 will lift the ejection block 16 upward, thereby ejecting the cold-forged copper substrate to complete the ejection. At this time, the adjusting plate 41 slides into the wedge-shaped opening 42. Through the mutual constraint of the inclined surfaces, the push plate 40 slides to the side of the adjusting block 36, thereby releasing the constraint on the filling block 32. Under the action of the elastic force of the reset spring 25, the filling block 32 can be reset. This cycle repeats, which makes it easy for people to eject the material.

[0037] like Figure 1 , Figure 2 and Figure 4As shown, the upper mold assembly includes an upper mold sleeve 6, which is installed at the bottom of the upper template 2. An upper mold positioning sleeve 7 is provided between the inner walls of the upper mold sleeve 6, and an upper mold pressure block 8 is provided between the inner walls of the upper mold positioning sleeve 7. The top of the upper mold positioning sleeve 7 and the top of the upper mold pressure block 8 are both in contact with the bottom of the upper template 2. An upper mold pressure plate 10 is provided at the bottom of the upper mold pressure block 8. An upper mold middle ring 9 is provided on the outer surface of the upper mold pressure plate 10. The outer surface of the upper mold middle ring 9 extends to the inner wall of the upper mold sleeve 6 near the top edge. A large nut 5 is threadedly connected to the outer surface of the upper mold sleeve 6 near the bottom. The inner wall of the large nut 5 extends to the outer surface of the upper mold middle ring 9 near the bottom edge and presses against the outer surface of the upper mold middle ring 9 near the top edge. Multiple mold holes 21 are equidistantly opened at the middle of the bottom of the upper mold pressure plate 10. Positioning holes 27 are opened at the bottom of the upper mold pressure plate 10 near both the front and rear sides. The two positioning holes 27 are located directly above the two positioning rods 29.

[0038] The effect achieved is that the upper mold assembly is pressed down to complete the mold closing action with the lower mold assembly. During the mold closing process, the floating structure and feedback device are triggered to work, thereby cold forging and unloading the copper substrate. When the upper mold assembly and the lower mold assembly are closed, the positioning rod 29 and the positioning hole 27 guide the upper mold assembly and the lower mold assembly, thereby ensuring the accuracy of the mold closing.

[0039] Working principle: When using this device, the copper substrate is placed inside the groove formed between the top of the lower mold pressure block 15, the top of the ejector block 16, and the top of the lower mold inner plate 13. During the pressing down of the upper mold assembly and the closing of the lower mold assembly, the bottom of the upper mold pressure plate 10 near the outer edge will fit against the top of the outer ring 11, the top of the lower mold middle ring 12, and the top of the lower mold inner plate 13, thereby pressing down the outer ring 11, the lower mold middle ring 12, and the lower mold inner plate 13 simultaneously. During the pressing down, the disc spring 14 will be compressed, and the pressure will be graded and transmitted through the disc spring 14, reducing the coating damage rate on the outer surface during the subsequent ejection of the copper substrate. At the same time, during the simultaneous pressing down of the outer ring 11, the lower mold middle ring 12, and the lower mold inner plate 13, the middle part... The lower die pressure block 15 and the ejector block 16 remain stationary, thereby forming an extrusion chamber inside the groove between the top of the lower die pressure block 15 and the top of the ejector block 16 and the top of the lower die inner plate 13 to extrude the copper substrate, ensuring unidirectional material flow. When the lower die inner plate 13 is not pressed down, the adjusting block 36 is located above the inside of the adjusting cavity 34. At this time, the adjusting plate 41 slides into the inside of the wedge-shaped opening 42, and under the mutual constraint of the inclined surface of the adjusting plate 41 and the inner inclined surface of the wedge-shaped opening 42, the push plate 40 is pushed into the adjusting cavity 34. At this time, the constraint spring 38 is in a compressed state, and the latch 43 is located below one end of the push plate 40. When the lower die inner plate 13 is pressed down, the adjusting block 36 will move downwards into the adjusting cavity 34. During the sliding motion, the lever plate 40 slides downwards. When the adjusting plate 41 slides out from inside the wedge-shaped opening 42, the constraint on the lever plate 40 is released. At this time, the constraint spring 38 resets, causing one end of the lever plate 40 to slide on the outer surface of the filler block 32 until one end of the lever plate 40 slides into the slot 43. At this point, the upper mold assembly and the lower mold assembly are closed, and the extrusion of the copper substrate is completed. During the subsequent reset, the upper mold assembly slides upwards, releasing the clamping force on the lower mold inner plate 13. At this time, the elastic force generated by the resetting of the butterfly spring 14 will reset the floating structure, thereby causing the lower mold inner plate 13 to slide upwards. During the reset of the floating structure, because the lower mold inner plate 13 slides upwards, the release of the inner wall of the lower mold inner plate 13 from the cold forging process is transmitted in stages. The adhesive force generated by the extrusion between the outer surfaces of the copper substrate will also cause the adjusting block 36 to slide upward when the inner plate 13 of the lower mold slides upward, which in turn will cause the push plate 40 to slide upward. Since one end of the push plate 40 is inserted into the slot 43 at this time, it will cause the filling block 32 and the connecting rod 31 to slide upward. The upward sliding of the connecting rod 31 will push the ejection block 16 upward, thereby ejecting the cold-forged copper substrate to complete the ejection. At this time, the adjusting plate 41 slides into the wedge-shaped opening 42. Through the mutual constraint of the inclined surfaces, the push plate 40 slides to the side of the adjusting block 36, thereby releasing the constraint on the filling block 32. Under the elastic force of the return spring 25, the filling block 32 can be reset. This cycle is repeated to facilitate the ejection of materials.

[0040] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A red copper IGBT heat dissipation substrate cold forging die, characterized by, Including lower die plate (1) and upper die plate (2), the upper die plate (2) is located above the lower die plate (1), the bottom of the upper die plate (2) is provided with upper die assembly, the top of the lower die plate (1) is provided with lower die assembly, the top of the lower die assembly is provided with floating structure, the inside of the lower die assembly is provided with feedback device; The lower die assembly includes lower die sleeve (3), the lower die sleeve (3) is fixed on the top of the lower die plate (1), the inner wall between the lower die sleeve (3) is provided with lower die positioning sleeve (18) near the bottom edge, the inner wall between the lower die positioning sleeve (18) is provided with first pressure block (19), the bottom of the first pressure block (19) and the bottom of the lower die positioning sleeve (18) are correspondingly attached to the top of the lower die plate (1), the top of the lower die sleeve (3) is provided with compression ring (4), the floating structure is located on the inner side of the compression ring (4), the top of the lower die positioning sleeve (18) is provided with positioning ring (17) near the outer surface edge, the top of the first pressure block (19) is provided with bridge plate (20), the outer surface of the bridge plate (20) is sleeved with second pressure block (22), the outer surface of the second pressure block (22) is attached to the inner wall of the positioning ring (17), the bottom of the second pressure block (22) is attached to the top of the first pressure block (19) near the inner side edge, the floating structure includes outer ring (11), the outer surface wall of the outer ring (11) is inclined, the outer ring (11) is arranged on the inner side of the compression ring (4), and the inclined surface of the outer surface of the outer ring (11) is attached to the inner side wall of the compression ring (4), the inner wall between the outer ring (11) is provided with lower die middle ring (12), the inner wall between the lower die middle ring (12) is provided with lower die inner plate (13), the lower die inner plate (13) is provided with lower die pressure block (15) slidingly, the inside of the lower die pressure block (15) is provided with material return block (16), the bottom of the outer ring (11), the bottom of the lower die middle ring (12) and the bottom of the lower die inner plate (13) are all provided with gap between the top of the bridge plate (20), the bottom of the lower die pressure block (15) and the bottom of the material return block (16) are all attached to the top of the bridge plate (20) The feedback device comprises a filling block (32), the first pressure block (19) is internally provided with a movable cavity (23), the filling block (32) slides between the inner walls of the movable cavity (23), the top of the filling block (32) is fixedly provided with a connecting rod (31), the top of the connecting rod (31) slides through the top of the bridging plate (20) and is fixedly arranged at the bottom of the material returning block (16), the inside of the lower mold positioning sleeve (18) is provided with an adjusting cavity (34) near the two side edges, the two side inner walls of the movable cavity (23) are provided with side openings (35), the two side openings (35) are correspondingly arranged to penetrate into the inside of the adjusting cavity (34), the two side outer surfaces of the filling block (32) are provided with clamping openings (43), the bottom of the lower mold inner plate (13) is fixedly provided with a push plate (30) near the two side edges, the bottom of the two push plates (30) slides below the second pressure block (22) and is arranged to penetrate into the inside of the adjusting cavity (34), the two side inner walls of the two adjusting cavities (34) are slidably provided with adjusting blocks (36), the bottom of the two push plates (30) is correspondingly fixed to the top of the adjusting block (36), the inside of the two adjusting blocks (36) is provided with an inner cavity (37), the two inner cavities (37) are slidably provided with sliding plates (39) between the inner walls, one side of the two sliding plates (39) is fixedly provided with a constraint spring (38), one end of the two constraint springs (38) is correspondingly fixed to the inner wall of the inner cavity (37), the other side of the two sliding plates (39) is fixedly provided with a pushing plate (40), one end of the two pushing plates (40) slides to penetrate into the inside of the side opening (35) and the other end of the two pushing plates (40) can extend into the clamping opening (43) on the outer surface of the filling block (32).

2. The red copper IGBT heat dissipation substrate cold forging die according to claim 1, characterized in that: The bottom of the lower mold plate (1) is provided with a threaded groove (24), the bottom of the filling block (32) is rotatably provided with a material returning pin (33), the bottom of the material returning pin (33) slides to penetrate into the inside of the threaded groove (24), the outer surface of the material returning pin (33) is fixedly provided with a threaded ring (26) near the bottom edge, the outer surface of the threaded ring (26) is threadedly connected between the inner wall of the threaded groove (24), and the top of the threaded ring (26) is fixedly provided with a reset spring (25) between the inner top surface of the threaded groove (24).

3. The red copper IGBT heat dissipation substrate cold forging die according to claim 1, characterized in that: The top of the two pushing plates (40) is provided with a wedge-shaped opening (42) penetrating into the bottom, the inside of the two side openings (35) is fixedly provided with an adjusting plate (41), one side of the bottom of the two adjusting plates (41) is inclined, and the inclined surface of the wedge-shaped opening (42) is opposite.

4. The red copper IGBT heat dissipation substrate cold forging die according to claim 1, characterized in that: The top of the material returning block (16) is flush with the top of the lower mold pressure block (15), the top of the material returning block (16) is below the top of the lower mold inner plate (13), and a groove is formed between the top of the lower mold pressure block (15) and the top of the lower mold inner plate (13), the outer surface of the lower mold middle ring (12) is slidably provided with a butterfly spring (14) near the bottom edge, the outer surface edge of the butterfly spring (14) extends obliquely to the bottom edge of the outer ring (11), the inner side bottom of the butterfly spring (14) is attached to the top of the second pressure block (22), the top of the lower mold inner plate (13) is provided with a through hole (28) penetrating to the bottom near the edges of the front and rear sides, the inside of the two through holes (28) is provided with a positioning rod (29), and the bottom of the two positioning rods (29) extends to the top of the second pressure block (22).

5. The red copper IGBT heat dissipation substrate cold forging die according to claim 4, characterized in that: The upper mold assembly comprises an upper mold sleeve (6) mounted on the bottom of the upper mold plate (2), an upper mold positioning sleeve (7) is arranged between the inner walls of the upper mold sleeve (6), and an upper mold pressure block (8) is arranged between the inner walls of the upper mold positioning sleeve (7). The top of the upper mold positioning sleeve (7) and the top of the upper mold pressure block (8) are attached to the bottom of the upper mold plate (2).

6. The red copper IGBT heat dissipation substrate cold forging die according to claim 5, characterized in that: The bottom of the upper mold pressure block (8) is provided with an upper mold pressing plate (10), the outer surface of the upper mold pressing plate (10) is provided with an upper mold middle ring (9), the outer surface of the upper mold middle ring (9) extends to the inner wall of the upper mold sleeve (6) near the top edge, the outer surface of the upper mold sleeve (6) is threadedly connected with a large nut (5) near the bottom, the inner wall of the large nut (5) extends to the outer surface of the upper mold middle ring (9) near the bottom edge, and is pressed with the outer surface of the upper mold middle ring (9) near the top edge. The bottom of the upper mold pressing plate (10) is equally provided with a plurality of mold holes (21) at the middle, and the bottom of the upper mold pressing plate (10) is provided with positioning holes (27) near the front and rear sides, and the two positioning holes (27) are located above the two positioning rods (29).

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