Aluminum skin sandwich structure with embedded special-shaped fluid loop and manufacturing method

Abstract

The invention provides an aluminum skin sandwich structure with an embedded special-shaped fluid loop and a manufacturing method. The aluminum skin sandwich structure comprises a panel, a solid adhesive film adhesive, a honeycomb core, a foaming material and the fluid loop. Two sides of the honeycomb core are bonded with panels through a solid adhesive film adhesive, a fluid loop is arranged in the honeycomb core, and a foaming material is filled between the fluid loop and the honeycomb core. The embedded special-shaped fluid loop is integrally formed, the continuity of the embedded honeycomb core is guaranteed, and the problems that when the honeycomb core needs to be spliced at multiple positions due to the special shape, the position needs to be reinforced and filled with polystyrene foam, the weight is increased, and a new interface is reduced are solved.

Description

Technical Field

[0001] This invention relates to the field of composite material molding technology, specifically to an aluminum skin sandwich structure with an embedded irregular fluid circuit and its manufacturing method. Background Technology

[0002] Honeycomb sandwich structures are widely used in satellites due to their high strength-to-weight ratio, high stiffness-to-weight ratio, and good fatigue resistance. A common structure in satellite design, it typically consists of two panels with an internal honeycomb core, bonded together with adhesive. Embedded metal components provide installation interfaces. The lightweight and high-rigidity characteristics of honeycomb panels are increasingly being utilized in satellite structural design.

[0003] Heat pipes are widely used in satellite thermal design. They are usually embedded in the honeycomb core. However, with the development towards "functionality" and "lightweighting", the requirements for satellite weight reduction are getting higher and higher. The heat consumption of spacecraft is constantly increasing, and the resources of effective heat dissipation surface are becoming increasingly scarce. Traditional passive thermal control methods can no longer meet mission requirements. Fluid loop systems are a highly efficient and active temperature control measure. By collecting, transferring, storing and dissipating heat through active fluid loop systems, they can be used to solve the temperature control requirements of high heat-consuming devices.

[0004] Currently, the method for manufacturing embedded irregular fluid circuits in aluminum skin sandwich structures involves cutting the upper and lower panels of the aluminum skin separately, placing the lower panel in a mold, and then placing the fluid circuit. The honeycomb layer at the fluid circuit location must be low, and the honeycomb cells need to be spliced ​​separately, with the seams filled with adhesive film or expanding foam. This method causes discontinuity in the honeycomb core, increases weight, hinders lightweighting, increases adhesive usage, requires high precision in matching the honeycomb core height, and results in significant adhesive overflow and accumulated errors at the splicing points, leading to poor flatness in the subsequent overall panel molding. Currently, no effective solution has been proposed to address these numerous technical problems associated with the existing manufacturing methods for embedded irregular fluid circuits in aluminum skin sandwich structures. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide an aluminum skin sandwich structure with an embedded irregular fluid circuit and a manufacturing method thereof.

[0006] An aluminum skin sandwich structure with an embedded irregular fluid circuit according to the present invention includes: a panel, a solid adhesive film, a honeycomb core, a foaming material, and a fluid circuit;

[0007] The panels are bonded to both sides of the honeycomb core with a solid adhesive film. A fluid circuit is provided in the honeycomb core, and foam material is filled between the fluid circuit and the honeycomb core.

[0008] Preferably, the fluid circuit is composed of a fluid circuit Ω segment, a fluid circuit circular pipe segment, and a fluid circuit extending out of the aluminum skin interlayer structure segment, the fluid circuit extending out of the aluminum skin interlayer structure segment extending beyond the outer side of the panel.

[0009] Preferably, a limiting embedded part is placed inside the honeycomb core to limit the fluid circuit.

[0010] Preferably, a solid adhesive film is laid between the fluid circuit and the panel.

[0011] Preferably, a method for manufacturing an aluminum skin sandwich structure with an embedded irregular fluid circuit includes the following steps:

[0012] Step S1: Cut the stack height of the honeycomb core according to the requirements and pull the honeycomb core apart;

[0013] Step S2: Cut the shape of the honeycomb core according to the shape of the fluid circuit;

[0014] Step S3: Lay foam material around the fluid loop and between it and the honeycomb core contact surface;

[0015] Step S4: Pressurization and curing yields a rectangular fluid loop of equal height;

[0016] Step S5: Trim the interference area between the solidified rectangular fluid loop and the surrounding metal embedded parts;

[0017] Step S6: Apply solid adhesive film between the fluid circuit and the panel;

[0018] Step S7: Place metal parts around the fluid loop;

[0019] Step S8: Place a limiting insert between the fluid loop and the honeycomb core;

[0020] Step S9: After the aluminum skin sandwich structure is assembled, it is vacuum-packed, heated, and pressurized to cure and solidify.

[0021] Preferably, in step S1, the honeycomb core is cut to match the height of the honeycomb stack according to different internal boundary differences.

[0022] Preferably, in step S3, the fluid circuit is bonded into a rectangle of equal height using foam material.

[0023] Preferably, in step S4, the embedded fluid circuit is heated to 88℃-90℃ along with the mold and then evacuated to a vacuum degree of ≤-0.095Mpa. While evacuating the vacuum, the honeycomb core is shaped to ensure the fit between the fluid circuit and the honeycomb core and the mold.

[0024] Preferably, the forming mold of the fluid circuit and the bonding assembly mold of the sandwich structure share the same mold.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. This application uses an embedded irregular fluid circuit for integral molding to ensure the continuity of the embedded honeycomb core. This solves the problem that when multiple honeycomb cores need to be spliced ​​due to irregular shapes, the positions need to be reinforced and filled with foam, which increases the weight and reduces the number of new interfaces.

[0027] 2. Compared with aluminum panel sandwich structures, fluid loop connections are less dependent on panel materials, enabling the assembly of materials with different coefficients of thermal expansion and offering greater design flexibility.

[0028] 3. Compared with aluminum panel sandwich structures, if composite material panels are used, the weight of the entire sandwich structure is significantly reduced.

[0029] 4. The molded irregular fluid circuit extends from both ends of the upper and lower panels, which solves the problems of heat dissipation by utilizing the internal fluid circuit and reducing the need for external heat sinks to reduce weight.

[0030] 5. The method provided in this application can form products with high precision, excellent performance, good quality consistency, and lightweight and high-strength structure. Attached Figure Description

[0031] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0032] Figure 1 A cross-sectional view of an aluminum skin sandwich structure with an embedded irregular fluid circuit;

[0033] Figure 2 A three-dimensional view of the aluminum skin sandwich structure with an embedded irregular fluid circuit;

[0034] Figure 3 A front view of an aluminum skin sandwich structure with an embedded irregular fluid circuit;

[0035] Figure 4 This is a schematic diagram of the fluid loop structure;

[0036] As shown in the figure:

[0037] Detailed Implementation

[0038] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0039] Example 1

[0040] The sandwich structure in this embodiment consists of upper and lower panels 1, with a honeycomb core 3 in between. The honeycomb core 3 and the fluid circuit are located between the upper and lower panels 1, with the fluid circuit extending out of both ends of the upper and lower panels 1. After assembly, it is cured by heating and pressurizing in a vacuum bag. The sandwich structure includes the fluid circuit, as well as the solid adhesive film 2 and foaming material 4 used to connect the panels 1 and the honeycomb core 3, and various specifications of aluminum alloy or magnesium alloy embedded parts.

[0041] Specifically, such as Figure 1-3 As shown, this embodiment includes: panel 1, solid adhesive film 2, honeycomb core 3, foam material 4, and fluid circuit; panel 1 is bonded to both sides of honeycomb core 3 by solid adhesive film 2, fluid circuit is provided in honeycomb core 3, and foam material 4 is filled between fluid circuit and honeycomb core 3.

[0042] Combination Figure 4 As shown, the fluid circuit is composed of fluid circuit Ω segment 5, fluid circuit circular pipe segment 6 and fluid circuit extending aluminum skin sandwich structure segment 7 connected together. The fluid circuit extending aluminum skin sandwich structure segment 7 extends out of the outside of panel 1.

[0043] In a preferred embodiment, a limiting embedded part is placed inside the honeycomb core 3 to limit the fluid circuit, and a solid adhesive film 2 is laid between the fluid circuit and the panel 1.

[0044] This embodiment also provides a method for manufacturing an aluminum skin sandwich structure with an embedded irregular fluid circuit, including the following steps:

[0045] Step S1: Cut the stack height of the honeycomb core 3 according to the requirements and pull the honeycomb core 3 apart; In step S1, the honeycomb core 3 is cut with matching honeycomb stack height according to different internal boundary differences;

[0046] Step S2: Cut the shape of the honeycomb core 3 according to the shape of the fluid circuit;

[0047] Step S3: Foam material 4 is laid between the fluid circuit and the contact surface of the honeycomb core 3; in step S3, the fluid circuit is bonded into a rectangle of equal height using foam material 4.

[0048] Step S4: Pressurize and solidify to obtain a rectangular fluid circuit of equal height; In step S4, the embedded fluid circuit is heated to 88℃-90℃ along with the mold and vacuumed, with a vacuum degree ≤-0.095Mpa. While vacuuming, the honeycomb core 3 is shaped to ensure the fluid circuit and honeycomb core 3 fit with the mold.

[0049] Step S5: Trim the interference area between the solidified rectangular fluid loop and the surrounding metal embedded parts;

[0050] Step S6: Apply solid adhesive film 2 between the fluid circuit and panel 1;

[0051] Step S7: Place metal parts around the fluid loop;

[0052] Step S8: Place a limiting embedded part between the fluid circuit and the honeycomb core 3;

[0053] Step S9: After the aluminum skin sandwich structure is assembled, it is vacuum-packed, heated, and pressurized to cure and solidify.

[0054] In a preferred embodiment, the forming mold for the fluid circuit and the bonding assembly mold for the sandwich structure share the same mold.

[0055] The manufacturing method of this embodiment has the following main features: First, the fluid circuit is an irregular shape formed by welding the Ω segment 5 and the circular pipe segment 6 of the fluid circuit. The fluid circuit and the foaming material 4 are first formed into rectangles of equal height to ensure the continuity of the embedded honeycomb core 3. This solves the problem of poor flatness caused by the cumulative error when splicing the honeycomb core 3 in multiple places due to the irregular shape during the molding of the irregular fluid circuit. Second, the molding mold of the fluid circuit of the sandwich structure is shared with the bonding assembly mold of the sandwich structure (the same curing platform is used), which can reduce the number of molds and the problem of poor surface matching caused by different molds, and ensure that the molding surface of the fluid circuit and the mold are in close contact under high temperature curing. Third, by extending the upper and lower panels 1 at both ends of the molded irregular fluid circuit, the problem of heat dissipation by using the internal fluid circuit and reducing the need for external heat sinks to reduce weight is solved.

[0056] This embodiment breaks away from the conventional manufacturing method of embedded fluid circuits and upper and lower panels 1 and honeycomb core 3. It can fundamentally solve the problem of abnormal flatness caused by height mismatch between the irregular embedded fluid circuits extending from the upper and lower panels 1, ensuring the strength of the structure. At the same time, it reduces the use of adhesives and foaming materials 4, and can obtain a lightweight and efficient sandwich structure.

[0057] Example 2

[0058] Example 2 is a preferred example of Example 1.

[0059] like Figure 1-4 As shown, the sandwich structure of this embodiment includes: upper and lower panels 1, a honeycomb core 3, a fluid circuit, metal embedded parts, and a solid adhesive film 2 and a foaming material 4 used to connect the panel 1 and the honeycomb core 3. This embodiment uses a thin-walled structure such as aluminum alloy or carbon fiber composite material as the panel 1, an aluminum honeycomb core as the honeycomb core 3, J-78B medium-temperature curing adhesive as the solid adhesive film 2 for bonding the panel 1 and the honeycomb core 3, and a limiting embedded part as a local limiter for the fluid circuit at a specific location within the honeycomb core 3.

[0060] The manufacturing method of the sandwich structure in this embodiment includes the following steps:

[0061] Step S1: Cut the height of the honeycomb core 3 stack according to the requirements, and pull the honeycomb core 3 apart to make the honeycomb core grid hexagonal;

[0062] Step S2: Cut the shape of the honeycomb core 3 according to the shape of the fluid circuit;

[0063] Step S3: Apply high-temperature foaming material 4 around the fluid loop and onto the contact surface with the honeycomb core 3.

[0064] Step S4: Pressurize and solidify to obtain a rectangular fluid circuit of equal height;

[0065] Step S5: Trim the interference area between the solidified rectangular fluid loop and the surrounding metal embedded parts;

[0066] Step S6: Apply solid adhesive film 2 between the fluid circuit and panel 1;

[0067] Step S7: Place metal parts around the fluid loop;

[0068] Step S8: Place limiting embedded parts at specific locations in the fluid circuit and the honeycomb core 3;

[0069] Step S9: The assembled honeycomb panel is vacuum-packed, heated, and pressurized to cure and solidify.

[0070] In a preferred embodiment:

[0071] In step S1, the honeycomb core 3 is cut to match the height of the honeycomb core 3 stack according to different internal boundary differences, thereby forming honeycomb core cells of different heights. That is, in order to meet the design requirements, the honeycomb core 3 needs to be divided into different heights during cutting, thus forming honeycomb core cells of different heights.

[0072] In step S2, the connection shape of the irregularly shaped fluid circuit Ω segment 5 and fluid circuit circular pipe segment 6 is adapted to the honeycomb core cells placed at different heights.

[0073] In step S3, the fluid circuit is bonded into a rectangle of equal height using foam material 4.

[0074] In step S4, the embedded fluid circuit is heated to 88℃-90℃ along with the mold in the furnace, and a vacuum is drawn with a vacuum degree of ≤-0.095Mpa. While drawing the vacuum, the honeycomb is shaped to ensure that the fluid circuit and honeycomb fit the mold.

[0075] In step S4, the pressure curing molding process includes, but is not limited to, oven curing molding process, autoclave curing molding process, and vacuum bag pressure curing molding process.

[0076] The molding mold for the fluid circuit and the bonding assembly mold for the sandwich structure share the same mold, ensuring good fit between the inner skin and the mold during the curing of the sandwich structure and guaranteeing the matching accuracy of the surface.

[0077] Panel 1 can be made of thin-walled materials such as aluminum alloy or glass fiber composite materials, allowing for greater design freedom.

[0078] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0079] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An aluminum skin sandwich structure with an embedded irregularly shaped fluid circuit, characterized in that, include: Panel (1), solid adhesive film (2), honeycomb core (3), foaming material (4), and fluid circuit; The two sides of the honeycomb core (3) are bonded to the panel (1) by solid adhesive film (2). A fluid circuit is provided in the honeycomb core (3), and foam material (4) is filled between the fluid circuit and the honeycomb core (3).

2. The aluminum skin sandwich structure with an embedded irregular fluid circuit according to claim 1, characterized in that: The fluid circuit is composed of a fluid circuit Ω segment (5), a fluid circuit circular pipe segment (6), and a fluid circuit extending out of the aluminum skin sandwich structure segment (7). The fluid circuit extending out of the aluminum skin sandwich structure segment (7) extends out of the outside of the panel (1).

3. The aluminum skin sandwich structure with an embedded irregular fluid circuit according to claim 1, characterized in that: The honeycomb core (3) contains a limiting embedded part to limit the fluid circuit.

4. The aluminum skin sandwich structure with an embedded irregular fluid circuit according to claim 1, characterized in that: A solid adhesive film (2) is laid between the fluid circuit and the panel (1).

5. A method for manufacturing an aluminum skin sandwich structure with an embedded irregular fluid circuit, characterized in that, Includes the following steps: Step S1: Cut the stack height of the honeycomb core (3) according to the requirements and pull the honeycomb core (3) apart; Step S2: Cut the shape of the honeycomb core (3) according to the shape of the fluid circuit; Step S3: Lay foam material (4) around the fluid loop and between the contact surface of the fluid loop and the honeycomb core (3); Step S4: Pressurization and curing yields a rectangular fluid loop of equal height; Step S5: Trim the interference area between the solidified rectangular fluid loop and the surrounding metal embedded parts; Step S6: Apply solid adhesive film (2) between the fluid circuit and the panel (1); Step S7: Place metal parts around the fluid loop; Step S8: Place a limiting insert between the fluid circuit and the honeycomb core (3); Step S9: After the aluminum skin sandwich structure is assembled, it is vacuum-packed, heated, and pressurized to cure and solidify.

6. The manufacturing method of the aluminum skin sandwich structure with embedded irregular fluid circuit according to claim 5, characterized in that: In step S1, the honeycomb core (3) is cut to match the height of the honeycomb stack according to the different internal boundary differences.

7. The manufacturing method of the aluminum skin sandwich structure with embedded irregular fluid circuit according to claim 5, characterized in that: In step S3, the fluid circuit is bonded into a rectangle of equal height using foam material (4).

8. The manufacturing method of the aluminum skin sandwich structure with embedded irregular fluid circuit according to claim 5, characterized in that: In step S4, the embedded fluid circuit is heated to 88℃-90℃ along with the mold and a vacuum is drawn, with a vacuum degree ≤-0.095Mpa. While drawing the vacuum, the honeycomb core (3) is shaped to ensure that the fluid circuit and the honeycomb core (3) fit the mold.

9. The manufacturing method of the aluminum skin sandwich structure with embedded irregular fluid circuit according to claim 5, characterized in that: The forming mold for the fluid circuit and the bonding assembly mold for the sandwich structure share the same mold.

10. An aluminum skin sandwich structure with an embedded irregular fluid circuit, characterized in that: It is prepared by the manufacturing method of the aluminum skin sandwich structure with embedded irregular fluid circuit according to any one of claims 5-9.

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