Buffer layer manufacturing apparatus and method, and optical fiber coil bonding method

Abstract

The application belongs to the technical field of fiber-optic gyroscope, and discloses a buffer layer manufacturing device and method, and a fiber ring bonding method. The buffer layer manufacturing device comprises a cover plate, a vacuum assembly and a rotating mechanism. The cover plate is installed at the opening end of a mounting box, a first air pipe joint is sealed and penetrated on the cover plate, and a heat-resistant structural adhesive is filled in the mounting box. The vacuum assembly comprises a vacuum pump and a connecting pipeline. One end of the connecting pipeline is in communication with the vacuum pump, and the other end of the connecting pipeline is in communication with the first air pipe joint. The rotating mechanism comprises a rotating body and a heating piece. The mounting box, the vacuum assembly and the heating piece can be installed on the rotating body. The heating piece is used for heating the mounting box. The buffer layer formed by the solidified heat-resistant structural adhesive has high flatness. The heat-resistant structural adhesive is subjected to defoaming treatment. The buffer layer formed by solidification does not contain bubbles, avoids the stress concentration of the buffer layer, improves the mechanical strength, and reduces the risk of buffer layer failure.

Description

Technical Field

[0001] This invention relates to the field of fiber optic gyroscope technology, and in particular to a buffer layer fabrication apparatus and method, as well as a fiber optic loop bonding method. Background Technology

[0002] Hollow-core optical fiber establishes a novel light guiding mechanism using a specific cladding structure, which efficiently confines light waves within the air core for propagation. By using air as the transmission medium, the light waves are no longer sensitive to the effects of heat, magnetism, and radiation in the environment, achieving ideal high-stability optical transmission. This can fundamentally solve the problem of improving the environmental adaptability of fiber optic gyroscopes.

[0003] Hollow-core optical fibers used in fiber optic gyroscopes require precise winding into a loop. When constructing a fiber optic gyroscope after ideal fiber loop fabrication, thermosetting structural adhesive is typically used to fix the loop to a metal structure via bottom-side bonding. This structure, called a mounting box (loop mounting box), serves to support and protect the loop. However, the bottom surface of the fiber loop is tightly bonded to the metal surface of the mounting box, with only a very thin adhesive layer between the loop and the box. When the ambient temperature changes, the difference in thermal expansion and contraction rates between the mounting box and the loop is significant, creating stress disturbances on the bottom surface of the loop. Since hollow-core optical fibers contain numerous micro- and nano-sized microstructures with poor mechanical strength, repeated stress disturbances can easily lead to microcracks in these microstructures, which then grow rapidly, posing a risk of fiber loop failure.

[0004] In existing technologies, introducing a buffer layer between the fiber loop and the mounting box can alleviate the stress caused by repeated impacts on the hollow fiber. The buffer layer material must have sufficient rigidity and be easily processed to achieve a smooth surface. In existing technologies, without introducing new materials, the buffer layer is usually made by coating the fiber with adhesive, which results in insufficient structural rigidity. Thermosetting structural adhesives are also used to make the buffer layer, but these adhesives have high viscosity, causing bulging during static curing, poor flatness after curing, and the presence of air bubbles. This leads to stress concentration in the buffer layer, resulting in poor mechanical strength and a risk of failure.

[0005] Therefore, there is an urgent need for a buffer layer fabrication device and method, as well as an optical fiber loop bonding method. Summary of the Invention

[0006] The first objective of this invention is to provide a buffer layer manufacturing apparatus to solve the problem in the prior art where the thermosetting structural adhesive has poor flatness after curing and contains air bubbles, resulting in stress concentration in the formed buffer layer, thereby improving mechanical strength and reducing the risk of failure.

[0007] The second objective of this invention is to provide a method for manufacturing a buffer layer, so as to avoid the situation where the thermosetting structural adhesive has poor flatness and contains air bubbles after curing, thereby improving its mechanical strength and reducing the risk of buffer layer failure.

[0008] The third objective of this invention is to provide a fiber optic loop bonding method that effectively reduces the stress impact of thermal expansion and contraction of the mounting box on the hollow fiber microstructure loop, reduces damage to the hollow fiber, and improves the stability and reliability of the fiber optic loop.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] A buffer layer fabrication apparatus, wherein the buffer layer is used to buffer the fiber optic loop bottom surface of the fiber optic gyroscope between the mounting box and the gyroscope, the buffer layer fabrication apparatus comprising:

[0011] A cover plate is installed at the open end of the placement box to seal the placement box. A first air pipe connector is provided on the cover plate for sealing. The thermosetting structural adhesive is filled inside the placement box.

[0012] A vacuum assembly includes a vacuum pump and a connecting pipe, one end of which is connected to the vacuum pump and the other end of which is connected to the first gas pipe connector.

[0013] The rotating mechanism includes a rotating body and a heating element. The heating element and the vacuum assembly are disposed on the rotating body. The placement box can be installed on the rotating body. The heating element is used to heat the placement box.

[0014] Furthermore, the buffer layer manufacturing device also includes an adapter plate, which is mounted on the rotating body, and multiple placement boxes can be mounted on the adapter plate.

[0015] Furthermore, the vacuum assembly includes a plurality of connecting pipes, each of which is corresponding to a plurality of first air pipe connectors. One end of each of the plurality of connecting pipes is connected to the vacuum pump, and the other end of one end of each of the plurality of connecting pipes is connected to the corresponding first air pipe connector.

[0016] Furthermore, multiple adapter plates and multiple vacuum components are provided, with each adapter plate corresponding to one of the multiple vacuum components.

[0017] Furthermore, the rotating body is annular in shape, and the inner wall of the rotating body is provided with a plurality of mounting slots spaced apart. The plurality of mounting slots are provided in correspondence with a plurality of adapter plates, and the adapter plates are installed in the corresponding mounting slots.

[0018] Furthermore, the buffer layer manufacturing device also includes a driving component and a transmission component. The driving component is connected to the transmission component, and the transmission component is connected to the rotating body to drive the rotating body to rotate.

[0019] Furthermore, the transmission component is a transmission gear, the rotating body is annular, and the outer periphery of the rotating body is provided with an annular rack that meshes with the transmission gear.

[0020] Furthermore, the annular rack is sleeved in the middle of the rotating body, and the heating element is provided on the outer peripheral surface of the rotating body on both sides of the annular rack.

[0021] A method for fabricating a buffer layer, using the aforementioned buffer layer fabrication apparatus, includes the following steps:

[0022] Fill the mounting box with thermosetting structural adhesive;

[0023] Install the cover plate on the open end of the placement box, connect the connecting pipe to the first air pipe connector, and then turn on the vacuum pump to evacuate the placement box.

[0024] After the vacuum pump is turned on for a first preset time, the vacuum pump is turned off, the mounting box and the vacuum assembly are mounted on the rotating body, and the rotating body is driven to rotate. After the rotating body rotates for a second preset time, the vacuum pump is turned on again.

[0025] After the vacuum pump is turned on for a third preset time, the heating element is started to heat the placement box. After a fourth preset heating time, the heating element, the vacuum pump, and the rotating body all stop running, and then the placement box is taken out.

[0026] A fiber optic loop bonding method, including the method for fabricating the buffer layer, further includes the following steps:

[0027] After removing the mounting box, open the cover, apply thermosetting structural adhesive to the bottom surface of the fiber optic loop, and then attach the fiber optic loop to the upper part of the buffer layer inside the mounting box.

[0028] The beneficial effects of this invention are:

[0029] This invention provides a buffer layer fabrication apparatus. The buffer layer is used to buffer the fiber optic loop bottom surface of a fiber optic gyroscope between the fiber optic gyroscope and the mounting box. The buffer layer fabrication apparatus includes a cover plate, a vacuum assembly, and a rotation mechanism. The cover plate is installed at the open end of the mounting box to seal the mounting box. A first gas pipe connector is sealed through the cover plate, and thermosetting structural adhesive is filled inside the mounting box. The vacuum assembly includes a vacuum pump and a connecting pipe. One end of the connecting pipe is connected to the vacuum pump, and the other end of the connecting pipe is connected to the first gas pipe connector. The rotation mechanism includes a rotating body and a heating element. The heating element and the vacuum assembly are disposed on the rotating body, and the mounting box can be mounted on the rotating body. The heating element is used to heat the mounting box. During the buffer layer fabrication process, after the thermosetting structural adhesive is filled into the placement box, a cover plate is installed at the open end of the placement box to seal it. Turning on the vacuum pump evacuates the placement box, degassing the thermosetting structural adhesive and expelling the gas inside. Rotating the main body drives the placement box and vacuum components to rotate. The centrifugal force of rotation ensures that the thermosetting structural adhesive is evenly distributed at the bottom of the placement box. Combined with the vacuum pump's degassing and the heating element's heating of the placement box, the thermosetting structural adhesive inside cures. The buffer layer formed by the cured thermosetting structural adhesive has high flatness, and because the thermosetting structural adhesive has undergone degassing treatment, the cured buffer layer is free of air bubbles, avoiding stress concentration in the buffer layer, improving mechanical strength, and reducing the risk of buffer layer failure.

[0030] This invention also provides a method for manufacturing a buffer layer. Using the aforementioned buffer layer manufacturing apparatus, thermosetting structural adhesive is filled into the placement box; then, a cover plate is installed at the open end of the placement box, and the connecting pipe is connected to the first air pipe connector. Then, a vacuum pump is turned on to evacuate the placement box; after the vacuum pump has been turned on for a first preset time, it is turned off, and then the placement box and vacuum assembly are mounted on the rotating body, driving the rotating body to rotate. After the rotating body has rotated for a second preset time, the vacuum pump is turned on again; after the vacuum pump has been turned on for a third preset time, the heating element is activated to heat the placement box. After a fourth preset time of heating, the heating element, vacuum pump, and rotating body all stop operating, and then the placement box is removed. The rotating body drives the placement box and vacuum components to rotate. The centrifugal force of the rotation allows the thermosetting structural adhesive inside the placement box to be evenly distributed at the bottom of the placement box, and the heating element can heat the placement box, causing the thermosetting structural adhesive inside the placement box to cure. The cured thermosetting structural adhesive forms a buffer layer with high flatness. In addition, the thermosetting structural adhesive is treated by vacuum pump to form a buffer layer without air bubbles, avoiding stress concentration in the buffer layer, improving mechanical strength, and reducing the risk of buffer layer failure.

[0031] The present invention also provides a method for bonding optical fiber loops, including the above-mentioned method for fabricating a buffer layer. The method further includes coating the bottom surface of the optical fiber loop with thermosetting structural adhesive and bonding it to the upper part of the buffer layer inside the mounting box. This effectively reduces the stress impact of thermal expansion and contraction of the mounting box on the hollow fiber microstructure loop, reduces damage to the hollow fiber, and improves the stability and reliability of the optical fiber loop. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the hollow optical fiber and optical fiber loop provided in an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the cover plate and the mounting box provided in an embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the structure of mounting multiple mounting boxes on the adapter plate provided in an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the structure provided in an embodiment of the present invention, showing how a transmission component drives a rotating body to rotate.

[0036] Figure 5 This is a schematic diagram of the structure provided in an embodiment of the present invention, which shows the bonding of an optical fiber loop to a buffer layer.

[0037] In the picture:

[0038] 1. Cover plate; 11. First air pipe connector; 12. Air valve; 2. Vacuum pump; 21. Second air pipe connector; 3. Connecting pipe; 4. Rotating body; 5. Heating element; 6. Adapter plate; 7. Transmission element; 8. Ring rack; 10. Hollow optical fiber; 100. Optical fiber ring; 200. Buffer layer; 300. Installation box. Detailed Implementation

[0039] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0040] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0043] This embodiment provides a buffer layer manufacturing apparatus. The buffer layer formed by the cured thermosetting structural adhesive has high flatness and does not contain air bubbles, thus avoiding stress concentration in the buffer layer, thereby improving mechanical strength and reducing the risk of failure.

[0044] like Figure 1 This is a schematic diagram of the structure of hollow-core optical fiber 10 and optical fiber loop 100. A certain length of hollow-core optical fiber 10 is wound into an optical fiber loop 100 using a symmetrical winding method (such as quadrupole winding, octupole winding, etc.). The structural material of the hollow-core optical fiber 10 can be silicon dioxide, consisting of several micrometer-scale microstructural units (…). Figure 1 The diagram shows six single-circular tube microstructure units evenly distributed inside the empty circular structure. The function of these micrometer-scale microstructure units is to completely confine light within the air fiber core for transmission.

[0045] In this embodiment, as Figures 2-5As shown, the fiber optic loop 100 is located inside the mounting box 300, and the buffer layer 200 is used to buffer the bottom surface of the fiber optic loop 100 of the fiber optic gyroscope between the mounting box 300 and the fiber optic loop 100. The buffer layer fabrication device includes a cover plate 1, a vacuum assembly, and a rotation mechanism. The cover plate 1 is installed at the open end of the mounting box 300 to seal the mounting box 300. A first air pipe connector 11 is sealed through the cover plate 1, and thermosetting structural adhesive is filled inside the mounting box 300. The vacuum assembly includes a vacuum pump 2 and a connecting pipe 3. One end of the connecting pipe 3 is connected to the vacuum pump 2, and the other end of the connecting pipe 3 is connected to the first air pipe connector 11. The rotation mechanism includes a rotating body 4 and a heating element 5. The heating element 5 and the vacuum assembly are disposed on the rotating body 4, and the mounting box 300 can be mounted on the rotating body 4. The heating element 5 is used to heat the mounting box 300.

[0046] Understandably, during the fabrication of the buffer layer 200, after the thermosetting structural adhesive is filled into the mounting box 300, the cover plate 1 is installed at the open end of the mounting box 300 to seal it. Turning on the vacuum pump 2 creates a vacuum inside the mounting box 300, degassing the thermosetting structural adhesive and expelling the gas from it—this is the initial degassing treatment of the thermosetting structural adhesive. The rotating body 4 drives the mounting box 300 and the vacuum assembly to rotate, and the centrifugal force of the rotation ensures that the thermosetting structural adhesive is evenly distributed on the flat surface at the bottom of the mounting box 300. On the surface, in conjunction with vacuum pump 2, the thermosetting structural adhesive in the mounting box 300 is degassed, that is, the thermosetting structural adhesive is degassed again to further remove the gas in the thermosetting structural adhesive. The heating element 5 can heat the mounting box 300 to cure the thermosetting structural adhesive in the mounting box 300. The cured thermosetting structural adhesive forms a buffer layer 200 with high flatness. Moreover, the thermosetting structural adhesive has been degassed and the cured buffer layer 200 does not contain air bubbles, avoiding stress concentration in the buffer layer 200, improving mechanical strength and reducing the risk of failure of the buffer layer 200.

[0047] Furthermore, in this embodiment, the placement box 300 is vacuumed twice, that is, the thermosetting structural adhesive is degassed twice, so that the gas in the thermosetting structural adhesive is thoroughly discharged, ensuring that the formed buffer layer 200 is free of air bubbles.

[0048] For remote control of the vacuum pump 2, a control module can be installed on the vacuum pump 2. The control module is communicatively connected to the controller, and the controller can use the control module to control the state of the vacuum pump 2, thereby controlling whether the vacuum pump 2 evacuates the housing 300. The types and control principles of the controller and control module are existing technologies, and will not be elaborated upon in this embodiment; they only need to meet the actual usage requirements.

[0049] It should be noted that, given the fixed dimensions of the mounting box 300, the thickness of the buffer layer 200 depends on the amount of thermosetting structural adhesive. The buffer layer 200 should not be too thin, otherwise it will not provide a stress-buffering effect; conversely, it should not be too thick, as this will affect the overall rigidity after the ring is bonded, potentially leading to instability in the fiber optic gyroscope's misalignment angle, i.e., axial instability in the sensing rotational angular rate. By strictly controlling the amount of thermosetting structural adhesive during the fabrication of the buffer layer 200, its thickness can be controlled, preventing it from becoming too thin or too thick.

[0050] In this embodiment, as Figure 2 As shown, an air valve 12 is provided on the first air pipe connector 11. The air valve 12 can control whether the connecting pipe 3 is connected to the inside of the placement box 300. This facilitates the control of whether the vacuum pump 2 evacuates the inside of the placement box 300. The air valve 12 is an existing structure and will not be described in detail in this embodiment.

[0051] Furthermore, the cover plate 1 is made of rubber material, and an interference fit can be formed between the cover plate 1 and the mounting box 300. The interference fit between the cover plate 1 and the mounting box 300 can improve the sealing effectiveness of the cover plate 1 on the mounting box 300. The cover plate 1 is made of rubber material, which facilitates the sealing of the first air pipe connector 11 on the cover plate 1.

[0052] Furthermore, such as Figures 3-4 As shown, the buffer layer fabrication device also includes an adapter plate 6, which is mounted on the rotating body 4, and multiple mounting boxes 300 can be mounted on the adapter plate 6. It is understood that by setting the adapter plate 6 and mounting it on the rotating body 4, it is convenient to set a fixing structure on the adapter plate 6, thereby stably mounting the mounting boxes 300 on the rotating body 4. Furthermore, the adapter plate 6 can mount multiple mounting boxes 300, eliminating the need for sequentially mounting multiple mounting boxes 300 on the rotating body 4. During installation, only the adapter plate 6 needs to be mounted on the rotating body 4, saving time and effort.

[0053] The number of mounting boxes 300 that can be installed on the adapter plate 6 can be 2, 3, 4, 5, 6, etc. In this embodiment, for example... Figure 3 As shown, four mounting boxes 300 are installed on the adapter plate 6, and the four mounting boxes 300 are arranged in an array. Of course, in other embodiments, the number and distribution of mounting boxes 300 installed on the adapter plate 6 can be determined according to actual usage requirements. The number of mounting boxes 300 that the adapter plate 6 can install depends on the relative size and arrangement of the adapter plate 6 and the mounting boxes 300, as long as it meets the actual usage requirements.

[0054] Furthermore, the vacuum assembly includes multiple connecting pipes 3, each corresponding to a plurality of first air pipe connectors 11. One end of each connecting pipe 3 is connected to the vacuum pump 2, and the other end is connected to the corresponding first air pipe connector 11. It is understood that the adapter plate 6 can mount multiple mounting boxes 300, each connected to the vacuum pump 2 via its corresponding first air pipe connector 11. This one-to-one correspondence between the multiple connecting pipes 3 and the multiple first air pipe connectors 11 allows the vacuum pump 2 to simultaneously connect to multiple mounting boxes 300, eliminating the need for multiple vacuum pumps 2 for multiple mounting boxes 300 on a single adapter plate 6, thus reducing space requirements and investment costs.

[0055] In this embodiment, as Figure 3 As shown, to facilitate the connection of multiple connecting pipes 3 to the vacuum pump 2, a second air pipe connector 21 is also installed on the vacuum pump 2, and one end of each of the multiple connecting pipes 3 is connected to the second air pipe connector 21. The specific types of the first air pipe connector 11 and the second air pipe connector 21 can be determined according to actual usage requirements, and this embodiment does not impose specific limitations.

[0056] Furthermore, multiple adapter plates 6 and multiple vacuum components are provided, with each adapter plate 6 corresponding to one vacuum component. It is understood that by providing multiple adapter plates 6 and corresponding vacuum components, more placement boxes 300 can be installed, further improving the manufacturing efficiency of the buffer layer 200. In this embodiment, four adapter plates 6 and four vacuum components are provided. Of course, in other embodiments, the specific number of adapter plates 6 and vacuum components can be determined according to actual usage requirements.

[0057] Furthermore, such as Figure 4 As shown, the rotating body 4 is annular in shape. Multiple mounting slots are spaced apart on the inner wall of the rotating body 4, and each mounting slot corresponds to a different adapter plate 6. The adapter plate 6 is installed in its corresponding mounting slot. It is understood that by providing multiple mounting slots on the inner wall of the rotating body 4, it is easier to install multiple adapter plates 6, thus improving the ease of installation. In this embodiment, the bottom surface of the mounting box 300 is parallel to the plane containing the adapter plate 6, and the end of the adapter plate 6 furthest from the mounting box 300 is flush with the bottom wall of the mounting slot.

[0058] Regarding the specific installation method of the adapter plate 6, in this embodiment, corresponding threaded holes can be opened on the adapter plate 6 and the corresponding mounting slot, and then connected by bolts. Of course, in other embodiments, a slot can also be opened on the side wall of the mounting slot, and the adapter plate 6 can be snapped into the slot to realize the installation of the adapter plate 6.

[0059] To facilitate the rotation of the rotating body 4, in this embodiment, as follows: Figure 4 As shown, the buffer layer fabrication device also includes a driving component (not shown) and a transmission component 7. The driving component and the transmission component 7 are connected in a transmission connection, and the transmission component 7 is connected in a transmission connection to the rotating body 4 to drive the rotating body 4 to rotate. In this embodiment, the driving component can be a motor, and its specific type can be determined according to actual usage requirements.

[0060] For example, the transmission component 7 is a transmission gear, and the rotating body 4 is annular in shape. The outer periphery of the rotating body 4 is provided with an annular rack 8 that meshes with the transmission gear. Specifically, the transmission gear is sleeved on the output shaft of the drive component, that is, the drive component drives the transmission gear to rotate, which in turn meshes with the annular rack 8 on the outer periphery of the rotating body 4 to achieve relative movement between the two, thereby driving the rotating body 4 to rotate.

[0061] Of course, in other embodiments, the transmission component 7 can also be a gear set, that is, it includes multiple gears that can be selectively meshed. By selecting different gears to cooperate with each other, the rotational speed transmitted by the transmission component 7 to the ring rack 8 can be adjusted to meet the different speed requirements of the rotating body 4.

[0062] Furthermore, the annular rack 8 is fitted into the middle of the rotating body 4, and heating elements 5 are provided on both outer peripheral surfaces of the rotating body 4 located on the annular rack 8. It can be understood that by fitting the annular rack 8 into the middle of the rotating body 4, i.e., the force-bearing point of the rotating body 4 is located in the middle of the rotating body 4, the stability of the transmission from the transmission component 7 to the rotating body 4, i.e., the stability of the rotation of the rotating body 4, is improved. Moreover, the heating elements 5 are provided on both outer peripheral surfaces of the rotating body 4 located on the annular rack 8, i.e., the heating elements 5 act on the rotating body 4. By providing two sets of heating elements 5, the mounting box 300 is heated indirectly, ensuring the heating effect.

[0063] In this embodiment, the heating element 5 can be a far-infrared rope heater. This heater uses high-strength ceramic elements, maintaining structural integrity and thermal stability even when bent. It allows the heater to be wound around the surface of irregularly shaped workpieces at any angle without affecting heat conduction efficiency. It can be paired with a remotely controllable temperature controller to achieve remote heating control. Alternatively, the heating element 5 can be multiple electric heating wires wound around the outer circumference of the rotating body 4. For the power supply to the heating wires, a power supply module can be fixed inside the rotating body 4. The power supply module can communicate with the controller, which can control the power supply module's activation and deactivation to control whether the heating wires are heated. The specific type of heating element 5 can be determined according to actual usage requirements; this embodiment does not impose specific limitations.

[0064] In this embodiment, as Figure 5As shown, after the buffer layer 200 inside the mounting box 300 is fabricated and cured, the buffer layer 200 is located at the bottom of the mounting box 300. The bottom surface of the fiber optic loop 100 can be coated with thermosetting structural adhesive to bond the fiber optic loop 100 to the upper part of the buffer layer 200 inside the mounting box 300, thus completing the bonding operation of the fiber optic loop 100. It is understood that, without introducing other materials, this embodiment, using existing thermosetting structural adhesive to prepare the buffer layer 200, can eliminate the stress impact of thermal expansion and contraction of the metal structure on the fiber optic loop 100, facilitating operation and reducing the risk of buffer layer 200 failure. It also eliminates the stress impact of thermal expansion and contraction of the mounting box 300 on the fiber optic loop 100, contributing to improved reliability in engineering applications of the fiber optic loop 100.

[0065] In this embodiment, the rotating body 4 can be supported using a support structure from the prior art. For example, a support frame and multiple bearings, with the bearings rotatably mounted on the support frame. The rotating body 4 is located within the support frame, and all bearings are in rotatable contact with the outer surface of the rotating body 4, thus achieving rotatable support for the rotating body 4. Of course, other support methods can also be used in other embodiments; these are existing technologies and will not be elaborated upon in this embodiment. The method should be determined based on actual usage requirements.

[0066] This embodiment also provides a method for manufacturing a buffer layer, which enables the buffer layer 200 formed by the cured thermosetting structural adhesive to have high flatness. The cured buffer layer 200 is free of air bubbles, which avoids stress concentration in the buffer layer 200, improves mechanical strength, and reduces the risk of failure of the buffer layer 200.

[0067] In this embodiment, the buffer layer fabrication method uses the above-described buffer layer fabrication apparatus, and the buffer layer fabrication method includes the following steps:

[0068] The thermosetting structural adhesive is filled into the mounting box 300;

[0069] Install the cover plate 1 at the open end of the placement box 300, connect the connecting pipe 3 to the first air pipe connector 11, then turn on the vacuum pump 2 to evacuate the placement box 300. After sealing the placement box 300 with the cover plate 1, turn on the vacuum pump 2 to evacuate the placement box 300 to degas the thermosetting structural adhesive inside the placement box 300.

[0070] After the vacuum pump 2 is turned on for the first preset time, it is turned off. The placement box 300 and the vacuum assembly are installed on the rotating body 4, and the rotating body 4 is driven to rotate. After the rotating body 4 rotates for the second preset time, the vacuum pump 2 is turned on again to evacuate the placement box 300. It can be understood that after the rotating body 4 rotates for the second preset time, due to the centrifugal force, the thermosetting structural adhesive is evenly distributed at the bottom of the placement box 300. At this time, the vacuum pump 2 is turned on again to evacuate the placement box 300 to degas the thermosetting structural adhesive in the placement box 300 again, which improves the degassing effect of the thermosetting structural adhesive and avoids the presence of air bubbles in the thermosetting structural adhesive.

[0071] After the vacuum pump 2 is turned on for the third preset time, the heating element 5 is started to heat the mounting box 300. After the fourth preset heating time, the heating element 5, the vacuum pump 2 and the rotating body 4 all stop running. Then the mounting box 300 is taken out and heated by the heating element 5, which in turn heats the thermosetting structural adhesive, so that the thermosetting structural adhesive in the mounting box 300 is cured.

[0072] refer to Figures 2-5 It is understood that, through the above steps, this embodiment can rotate the mounting box 300 and the vacuum component by rotating the main body 4. The centrifugal force of rotation can make the thermosetting structural adhesive in the mounting box 300 evenly distributed at the bottom of the mounting box 300. In conjunction with the vacuum pump 2, the mounting box 300 is evacuated twice, which improves the degassing effect of the thermosetting structural adhesive. The heating element 5 can heat the mounting box 300, so that the thermosetting structural adhesive in the mounting box 300 is cured. The cured thermosetting structural adhesive has high flatness. Moreover, the buffer layer 200 formed by the curing of the thermosetting structural adhesive after being evacuated by the vacuum pump 2 does not contain air bubbles, which avoids stress concentration in the buffer layer 200, improves mechanical strength, and reduces the risk of failure of the buffer layer 200.

[0073] Furthermore, it can be inferred that even if the thermosetting structural adhesive has a high viscosity and the centrifugal force it experiences is much greater than the surface tension of the thermosetting structural adhesive, the area of ​​the thermosetting structural adhesive in contact with the mounting box 300 will not produce a protrusion, and the buffer layer 200 formed by the cured thermosetting structural adhesive has high flatness.

[0074] Furthermore, in the above steps, after the vacuum pump 2 is turned on again, the rotating body 4 remains rotating. At this time, the vacuum pump 2 begins to pump air. After pumping, the air pressure inside the mounting box 300 is generally lower than 200 Pa. During this process, due to centrifugal force, the thermosetting structural adhesive will not splash onto the structural wall of the mounting box 300. This avoids the situation where, if this centrifugal force is not present, the thermosetting structural adhesive would splash onto the side wall of the mounting box 300 during degassing. Since thermosetting structural adhesive is usually highly viscous and difficult to clean, a certain amount of thermosetting structural adhesive would be randomly lost on the side wall of the mounting box 300, thus affecting the thickness of the buffer layer 200.

[0075] It should be noted that the specific values ​​of the first preset time, the second preset time, the third preset time, and the fourth preset time can be determined according to actual usage requirements, and this embodiment does not impose specific limitations.

[0076] Furthermore, after removing the placement box 300, the following steps may also be included:

[0077] Disconnect the connecting pipe 3 from the first air pipe connector 11 and open the air valve 12. This step allows the interior of the placement box 300 to be connected to the outside, making it easier to open the cover 1 when using the buffer layer 200 later, thus saving effort.

[0078] refer to Figure 5 As can be seen, this embodiment also provides a fiber optic loop bonding method, which avoids stress concentration in the buffer layer 200, improves mechanical strength, reduces the risk of buffer layer 200 failure, effectively reduces the stress impact of thermal expansion and contraction of the mounting box 300 on the hollow fiber microstructure loop, reduces damage to the hollow fiber, and improves the stability and reliability of the fiber optic loop 100.

[0079] In this embodiment, the fiber optic loop bonding method includes the buffer layer fabrication method described above, and the fiber optic loop bonding method further includes the following steps:

[0080] After removing the mounting box 300, open the cover plate 1, apply thermosetting structural adhesive to the bottom surface of the fiber optic ring 100, and then attach the fiber optic ring 100 to the upper part of the buffer layer 200 inside the mounting box 300.

[0081] It is understood that the optical fiber loop 100 is bonded to the buffer layer 200 formed in this embodiment using thermosetting structural adhesive. The buffer layer 200 can reduce the stress impact of thermal expansion and contraction of the metal structure on the hollow optical fiber microstructure loop, and can avoid local stress abrupt changes in the buffer layer 200 under temperature changes that could damage the optical fiber loop 100. This improves the stability and reliability of the optical fiber loop 100 and helps to enhance the reliability of the optical fiber loop 100 in engineering applications.

[0082] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A buffer layer fabrication apparatus, wherein a buffer layer (200) is used to buffer the fiber optic loop (100) of a fiber optic gyroscope between the bottom surface of the loop (100) and the mounting box (300), characterized in that, The buffer layer fabrication apparatus includes: A cover plate (1) is installed at the open end of the placement box (300) to seal the placement box (300). A first air pipe connector (11) is sealed through the cover plate (1), and thermosetting structural adhesive is filled inside the placement box (300). The vacuum assembly includes a vacuum pump (2) and a connecting pipe (3), one end of which is connected to the vacuum pump (2) and the other end of which is connected to the first gas pipe connector (11). The rotating mechanism includes a rotating body (4) and a heating element (5). The heating element (5) and the vacuum assembly are disposed on the rotating body (4). The placement box (300) can be installed on the rotating body (4). The heating element (5) is used to heat the placement box (300).

2. The buffer layer manufacturing apparatus according to claim 1, characterized in that, The buffer layer manufacturing device also includes an adapter plate (6), which is mounted on the rotating body (4) and can mount multiple of the mounting boxes (300).

3. The buffer layer manufacturing apparatus according to claim 2, characterized in that, The vacuum assembly includes a plurality of connecting pipes (3), each of which is corresponding to a plurality of first air pipe connectors (11). One end of each of the plurality of connecting pipes (3) is connected to the vacuum pump (2), and the other end of each of the plurality of connecting pipes (3) is connected to the corresponding first air pipe connector (11).

4. The buffer layer manufacturing apparatus according to claim 3, characterized in that, Multiple adapter plates (6) are provided, and multiple vacuum components are provided, with each adapter plate (6) corresponding to one of the multiple vacuum components.

5. The buffer layer manufacturing apparatus according to claim 4, characterized in that, The rotating body (4) is in the shape of a ring. Multiple mounting slots are provided on the inner wall of the rotating body (4) at intervals. The multiple mounting slots are provided in correspondence with the multiple adapter plates (6). The adapter plates (6) are installed in the corresponding mounting slots.

6. The buffer layer manufacturing apparatus according to claim 1, characterized in that, The buffer layer manufacturing device further includes a driving component and a transmission component (7). The driving component is connected to the transmission component (7), and the transmission component (7) is connected to the rotating body (4) to drive the rotating body (4) to rotate.

7. The buffer layer manufacturing apparatus according to claim 6, characterized in that, The transmission component (7) is a transmission gear, the rotating body (4) is in the shape of a ring, and the outer periphery of the rotating body (4) is provided with an annular rack (8) that meshes with the transmission gear.

8. The buffer layer manufacturing apparatus according to claim 7, characterized in that, The annular rack (8) is sleeved in the middle of the rotating body (4), and the heating element (5) is provided on the outer peripheral surface of the rotating body (4) on both sides of the annular rack (8).

9. A method for manufacturing a buffer layer, using the buffer layer manufacturing apparatus according to any one of claims 1-8, characterized in that, The method for manufacturing the buffer layer includes the following steps: Thermosetting structural adhesive is filled into the mounting box (300); Install the cover plate (1) at the open end of the placement box (300), connect the connecting pipe (3) to the first air pipe connector (11), and then turn on the vacuum pump (2) to evacuate the placement box (300); After the vacuum pump (2) is turned on for a first preset time, the vacuum pump (2) is turned off, the mounting box (300) and the vacuum component are mounted on the rotating body (4), the rotating body (4) is driven to rotate, and after the rotating body (4) rotates for a second preset time, the vacuum pump (2) is turned on again. After the vacuum pump (2) is turned on for a third preset time, the heating element (5) is started to heat the placement box (300). After the heating is turned on for a fourth preset time, the heating element (5), the vacuum pump (2) and the rotating body (4) all stop running, and then the placement box (300) is taken out.

10. A fiber optic loop bonding method, characterized in that, Including the buffer layer fabrication method as described in claim 9, the optical fiber loop bonding method further includes the following steps: After removing the mounting box (300), open the cover plate (1), apply thermosetting structural adhesive to the bottom surface of the fiber optic ring (100), and attach the fiber optic ring (100) to the upper part of the buffer layer (200) inside the mounting box (300).

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