Display panel, manufacturing method thereof and display device

Abstract

The invention relates to the technical field of mechanical equipment, and provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a first substrate, a first electrode layer, an electrophoresis layer, an insulating layer, a conductive adhesive layer, a second electrode layer and a second substrate which are sequentially stacked. The display device includes a display panel. According to the invention, the insulating layer is arranged between the electrophoresis layer and the conductive adhesive layer, so that the first electrode layer and the second electrode layer can be isolated through the insulating layer, direct conduction between the first electrode layer and the second electrode layer can be avoided, and an electric field generated between the first electrode layer and the second electrode layer is ensured to be relatively uniform; the possibility of black spots is greatly reduced, and the display effect of the electronic paper is ensured.

Description

Technical Field

[0001] This application relates to the field of mechanical equipment technology, and more specifically, to a display panel and its manufacturing method and display device. Background Technology

[0002] Electronic paper (E-paper) is a display technology that mimics the traditional paper reading experience, offering low power consumption, high contrast, and paper-like visual effects. It operates on the principle of electrophoretic display (EPD), utilizing the movement of charged electrophoretic particles under the influence of an electric field to form images or text. Electronic paper typically consists of an electrophoretic layer, a substrate layer, and a conductive adhesive layer. However, black spots are prone to occur during the electronic paper display process, affecting the display quality.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this application is to provide a display panel and its manufacturing method and display device, which aims to solve the technical problem that black spots are easily generated in the electronic paper display process in the prior art, affecting the display effect.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] This application provides a display panel, including a first substrate, a first electrode layer, an electrophoretic layer, an insulating adhesive layer, a conductive adhesive layer, a second electrode layer, and a second substrate, which are stacked sequentially.

[0007] In some implementations, the insulating adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer stacked together, wherein the first sub-adhesive layer fills the voids in the electrophoretic layer, and the dynamic viscosity of the first sub-adhesive layer is lower than that of the second sub-adhesive layer.

[0008] In some implementations, the thickness of the second sub-adhesive layer is less than or equal to 5 μm; the resistivity of the first sub-adhesive layer is greater than 10. 10 Ω·cm, the resistivity of the second sub-adhesive layer is greater than 10 Ω·cm 12 Ω·cm.

[0009] In some implementations, the electrophoretic layer includes a plurality of electrophoretic capsules and a dielectric binder, wherein the plurality of electrophoretic capsules are embedded in the dielectric binder;

[0010] The insulating adhesive layer can fill the gap between two adjacent electrophoretic capsules; the side of the insulating adhesive layer facing away from the electrophoretic layer can form a plane.

[0011] In some implementations, the resistivity of the insulating adhesive layer is the same as the resistivity of the dielectric adhesive.

[0012] In some implementations, the insulating adhesive layer is made of the same material as the dielectric adhesive.

[0013] This application provides a display device, including a display panel as described in any of the above implementations.

[0014] This application provides a method for manufacturing a display panel, used to manufacture a display panel as described in any of the above implementations, the manufacturing method comprising:

[0015] A first electrode layer is fabricated on a first substrate;

[0016] An electrophoretic layer is prepared on the first electrode layer;

[0017] An insulating adhesive layer is prepared on the electrophoretic layer;

[0018] A conductive adhesive layer is prepared on the insulating adhesive layer;

[0019] A second electrode layer is fabricated on the second substrate;

[0020] The second electrode layer is bonded to the conductive adhesive layer.

[0021] In some implementations, the preparation of an insulating adhesive layer on the electrophoretic layer includes:

[0022] The insulating adhesive layer includes a first sub-adhesive layer;

[0023] An insulating adhesive of a predetermined thickness is applied to the side of the electrophoretic layer facing away from the first electrode layer and cured to form a first sub-adhesive layer, which is used to fill the gap between two adjacent electrophoretic capsules.

[0024] In some implementations, the preparation of an insulating adhesive layer on the electrophoretic layer includes:

[0025] The insulating adhesive layer also includes a second sub-adhesive layer;

[0026] An insulating adhesive is applied to the first sub-adhesive layer and cured to form a second sub-adhesive layer. The dynamic viscosity of the insulating adhesive used in the first sub-adhesive layer is lower than that of the insulating adhesive used in the second sub-adhesive layer, and the side of the second sub-adhesive layer facing away from the first sub-adhesive layer is a flat surface.

[0027] The main advantages of the display panel, its manufacturing method, and the display device provided in this application are as follows:

[0028] In the display panel of this application, an insulating adhesive layer is provided between the electrophoretic layer and the conductive adhesive layer. This allows the first electrode layer and the second electrode layer to be isolated by the insulating adhesive layer. Since the insulating adhesive layer is not conductive, it can prevent the first electrode layer and the second electrode layer from conducting, thereby ensuring that the electric field generated between the first electrode layer and the second electrode layer is more uniform. This avoids the phenomenon of local electric field distortion, making it easier to control the movement of electrophoretic particles in the microcapsules, and greatly reducing the possibility of black spots, thus ensuring the display effect of electronic paper. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a display panel in related technologies;

[0031] Figure 2 This is a schematic diagram of the structure of the first type of display panel provided in the embodiments of this application;

[0032] Figure 3 This is a schematic diagram of the structure of a second type of display panel provided in the embodiments of this application;

[0033] Figure 4 This is a schematic diagram of part of the manufacturing process of the display panel of the second type in the embodiments of this application;

[0034] Figure 5 This is a schematic diagram of another part of the manufacturing process of the second type of display panel in the embodiments of this application.

[0035] Explanation of key figure labels:

[0036] 10. Protective substrate; 11. Capsule structure layer; 12. Conductive adhesive; 13. Base substrate; 14. Electrode layer;

[0037] 101. First substrate; 102. First electrode layer; 103. Electrophoretic layer; 104. Insulating adhesive layer; 105. Conductive adhesive layer; 106. Second electrode layer; 107. Second substrate; 108. Electrophoretic capsule; 109. First sub-adhesive layer; 110. Second sub-adhesive layer; 111. Release film layer. Detailed Implementation

[0038] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0039] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0040] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0042] See Figure 1 As shown, in related technologies, electronic paper includes, from top to bottom, a protective substrate 10, a capsule structure layer 11, conductive adhesive 12, and a base substrate 13. The protective substrate 10 is located on the user side. Electrode layers 14 are respectively present on the protective substrate 10 and the base substrate 13, with the electrode layers 14 facing the capsule structure layer 11. The capsule structure layer 11 and the electrode layers 14 of the base substrate 13 are directly bonded together by the conductive adhesive 12. Due to the varying sizes of the capsules in the capsule structure layer 11, the surface of the conductive adhesive 12 layer is uneven, resulting in unevenness when the capsule structure layer 11 and the electrode layers 14 are bonded. This causes an uneven electric field between the two electrode layers 14, leading to excessively high local voltages and unstable electrophoretic particle movement within the capsule structure. Furthermore, gaps may exist in the capsule structure layer 11, through which the conductive adhesive 12 used to form the conductive adhesive layer 12 passes, directly connecting the two electrode layers 14 and affecting the movement of electrophoretic particles. The uneven electric field causes unstable movement of the electrophoretic particles, resulting in restricted particle movement or abnormal aggregation in some areas, forming black spots.

[0043] Therefore, this application provides a display panel, a method for manufacturing the display panel, and a display device to solve the problems in the related art.

[0044] Combination Figure 2 and Figure 3 As shown, in one or more embodiments, the display panel provided in this application includes a first substrate 101, a first electrode layer 102, an electrophoretic layer 103, an insulating adhesive layer 104, a conductive adhesive layer 105, a second electrode layer 106, and a second substrate 107, which are sequentially stacked.

[0045] In the display panel provided in this embodiment, an insulating adhesive layer 104 is provided between the electrophoretic layer 103 and the conductive adhesive layer 105. This achieves the isolation between the first electrode layer 102 and the second electrode layer 106 through the insulating adhesive layer 104. Since the insulating adhesive layer 104 is non-conductive, direct conduction between the first electrode layer 102 and the second electrode layer 106 can be avoided. This ensures that the electric field generated between the first electrode layer 102 and the second electrode layer 106 is more uniform, thus avoiding the phenomenon of local electric field distortion. This makes it easier to control the movement of electrophoretic particles in the electrophoretic layer 103, greatly reducing the possibility of black spots and ensuring the display effect of electronic paper.

[0046] Combination Figure 2 and Figure 3 As shown, in some embodiments, the first substrate 101 is a transparent substrate, located on the light-emitting side of the display panel, for transmitting image light from the display panel. In use, the image light of the display panel is emitted from the light-emitting side, that is, the image light can be emitted from the side of the first substrate 101 facing the user, thereby allowing the user to see the image content displayed on the display panel.

[0047] The first substrate 101, the first electrode layer 102, the electrophoretic layer 103, the insulating adhesive layer 104, the conductive adhesive layer 105, the second electrode layer 106, and the second substrate 107 are arranged sequentially from top to bottom; the first substrate 101 serves as a protective layer to protect the electrophoretic layer 103; in use, the first substrate 101 faces directly towards the user, while the second substrate 107 serves as the bottom support structure.

[0048] Combination Figure 2 and Figure 3As shown, in some embodiments, the first substrate 101 is a transparent substrate, and the first electrode layer 102 is a transparent electrode layer. The transparent substrate allows the user to directly view the image from the front of the first substrate 101. Exemplarily, the transparent substrate can be made of glass or plastic; the plastic can be a flexible plastic to allow the display panel to be bent or rolled, thus enabling applications such as electronic tags, wearable devices, or mobile phone cases. The plastic can be polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide (PI). The transparent electrode layer can be an ITO (indium tin oxide) electrode layer. The first electrode layer 102 covers the entire surface of the first substrate 101 facing the electrophoretic layer 103. It should be noted that in some other possible embodiments, when the display panel is a color display panel, the display panel may further include a color filter located between the first substrate 101 and the first electrode layer 102.

[0049] Combination Figure 2 and Figure 3 As shown, in some embodiments, the electrophoretic layer 103 includes a plurality of electrophoretic capsules 108 and a dielectric adhesive (not shown). The plurality of electrophoretic capsules 108 are embedded in the dielectric adhesive. In this way, the plurality of electrophoretic capsules 108 are fixed together by the dielectric adhesive, which not only enhances the structural stability and display uniformity of the electrophoretic layer 103, but also helps to improve the display quality and reliability of the display panel. For example, the electrophoretic capsules 108 are spherical, and the dielectric adhesive is formed by insulating glue. During the manufacturing of the display panel, the plurality of electrophoretic capsules 108 and the insulating glue are premixed. This can achieve uniform mixing of the electrophoretic capsules 108 and the insulating glue. The mixture formed by mixing the electrophoretic capsules 108 and the insulating glue is uniformly coated on the surface of the first electrode layer 102 facing away from the first substrate 101. After curing to form the electrophoretic layer, the electrophoretic capsules 108 are fixed to the surface of the first electrode layer 102 facing away from the first substrate 101, and the electrophoretic capsules 108 are embedded in the dielectric adhesive. The dielectric adhesive uses an insulating adhesive with a resistivity greater than 10. 14 Ω·cm. It should be noted that the electrophoretic layer 103 contains millions of electrophoretic capsules 108, which are deposited on the surface of the first electrode layer 102 facing away from the first substrate 101, and the thickness of the layer is approximately the diameter of one electrophoretic capsule 108.

[0050] In some embodiments, the dielectric adhesive accounts for 5%-10% of the mass of the electrophoretic layer 103; the electrophoretic capsule 108 includes an electrophoretic solution and a first electrophoretic particle and a second electrophoretic particle located in the electrophoretic solution. The first electrophoretic particle has a different color than the second electrophoretic particle, and at least one of the first and second electrophoretic particles has an electric charge. By using at least two different colored electrophoretic particles, the display panel can display at least two colors; and by controlling the mass ratio of the dielectric adhesive to 5%-10%, the stability of the electrophoretic capsule 108 is ensured without affecting the display performance, reducing the possibility of display black spots. For example, the mass ratio of the dielectric adhesive in the electrophoretic layer 103 can be 5%, 6%, 7%, 8%, or 10%, so that the adhesive layer does not occupy the main volume, which is sufficient to achieve the positional stability and uniform distribution of the electrophoretic capsule 108 and effectively reduce the possibility of display black spots.

[0051] In some embodiments, the number of first electrophoretic particles in the electrophoretic capsule 108 is multiple, and the number of second electrophoretic particles is multiple. For example, the first electrophoretic particles are white particles, and the second electrophoretic particles are black particles.

[0052] In some embodiments, both the first and second electrophoretic particles have an electric charge; for example, white particles may carry a negative charge and black particles may carry a positive charge. It should be noted that in some other possible embodiments, white particles may also carry a positive charge, while black particles may carry a negative charge.

[0053] In other embodiments, one of the first and second electrophoretic particles has a charge, while the other is uncharged, i.e., the other is a neutral particle. For example, white particles may have a negative charge, and black particles may be neutral. It should be noted that in some other possible embodiments, white particles may have a positive charge, and black particles may be neutral; or, white particles may be neutral, and black particles may have either a positive or negative charge.

[0054] In some embodiments, the insulating adhesive layer 104 includes a sub-adhesive layer; or, the insulating adhesive layer 104 includes multiple sub-adhesive layers, which are stacked on top of each other. This uses the insulating adhesive layer 104 to separate the electrophoretic layer 103 from the second electrode layer 106, thus isolating the first electrode layer 102 from the second electrode layer 106. This avoids direct conductivity between the first electrode layer 102 and the second electrode layer 106 during the fabrication of the conductive adhesive layer 105, ensuring a more uniform electric field between the first electrode layer 102 and the second electrode layer 106, greatly reducing the possibility of black spots, and guaranteeing the display effect of the electronic paper. For example, the sub-adhesive layer is formed by curing insulating adhesive, and the material of the sub-adhesive layer can be the same as that of the dielectric adhesive. When the insulating adhesive layer 104 is made, when there is a gap between two adjacent electrophoretic capsules 108, the insulating adhesive used to make the insulating adhesive layer 104 can fill the gap between the two adjacent electrophoretic capsules 108, that is, fill the voids in the electrophoretic layer 103. In other words, a part of the structure of the insulating adhesive layer 104 fills the voids in the electrophoretic layer 103, and the remaining part of the structure of the insulating adhesive layer 104 protrudes from the surface of the electrophoretic layer 103. In this way, due to the insulating property of the insulating adhesive, direct conduction between the first electrode layer 102 and the second electrode layer 106 can be avoided.

[0055] In some embodiments, the resistivity of the insulating adhesive layer 104 is the same as the resistivity of the dielectric adhesive; this avoids direct conductivity between the first electrode layer 102 and the second electrode layer 106. It is understood that the resistivity of the insulating adhesive layer 104 and the resistivity of the dielectric adhesive can be identical, or there can be a certain error between the resistivity of the insulating adhesive layer 104 and the resistivity of the dielectric adhesive. For example, the resistivity error between the two can be -5% to 0, or 0 to 5%; for example, the resistivity error between the two can be -5%, -4%, -3%, -2%, -1%, 1%, 2%, 3%, 4%, or 5%.

[0056] In some embodiments, the resistivity of the sub-adhesive layer is greater than 10. 10 Ω·cm.

[0057] See Figure 2As shown, in some embodiments, the insulating adhesive layer 104 includes a sub-adhesive layer. Since a portion of the sub-adhesive layer's structure fills the voids in the electrophoretic layer 103, the thickness of the insulating adhesive layer can refer to the average thickness of the remaining structure of the sub-adhesive layer protruding from the surface of the electrophoretic layer 103. This average thickness can be less than or equal to 5 μm, where μm represents micrometers. Including a sub-adhesive layer is suitable for scenarios with high limitations on process costs. For example, the thickness of the insulating adhesive layer 104 can be 5 μm, 4.5 μm, 4 μm, 3.5 μm, 3 μm, 2.5 μm, 2 μm, 1.5 μm, 1 μm, or 0.5 μm.

[0058] See Figure 3 As shown, in some embodiments, the insulating adhesive layer 104 includes multiple sub-adhesive layers, which are stacked on top of each other. The materials of the multiple sub-adhesive layers can be the same or different, depending on the actual needs. For example, the number of sub-adhesive layers in the insulating adhesive layer 104 can be 2, 3 or 4. In this embodiment, taking two sub-adhesive layers in the insulating adhesive layer 104 as an example, the two sub-adhesive layers are a first sub-adhesive layer 109 and a second sub-adhesive layer 110. After the insulating adhesive is applied to the electrophoretic layer 103 and cured, the first sub-adhesive layer 109 is formed. The thickness of the first adhesive layer is small and it is mainly used to fill the gaps between different electrophoretic capsules 108. Then, another layer of insulating adhesive is applied, and after it is cured, the second sub-adhesive layer 110 is formed. In this way, the first sub-adhesive layer 109 is located between the second adhesive layer and the electrophoretic layer 103. This allows the surface of the second sub-adhesive layer 110 facing the conductive adhesive layer 105 to become relatively flat, thereby ensuring that the electric field strength generated between the two first electrode layers 102 and the second electrode layer 106 is uniform. In addition, by controlling the different materials and thicknesses of the multiple sub-adhesive layers, better dielectric constant matching and avoidance of breakdown can be achieved. The thickness of the second sub-adhesive layer 110 is less than or equal to 5 μm. The thickness of the second sub-adhesive layer 110 can be 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm. A smaller thickness of the second sub-adhesive layer 110 ensures that the electric field strength between the two electrode layers meets the design requirements. After the second sub-adhesive layer 110 dries, a conductive adhesive layer 105 is prepared on the side of the second sub-adhesive layer 110 facing the second electrode layer 106. Since the side of the second sub-adhesive layer 110 facing the second electrode layer 106 is flat, the conductive adhesive layer 105 can easily cover the second sub-adhesive layer 110, and the side of the conductive adhesive layer 105 facing the second electrode layer 106 is also easily flat. The resistivity of the first sub-adhesive layer is greater than 10⁻⁶. 10 Ω·cm; the resistivity of the second sub-adhesive layer is greater than 10 Ω·cm 12 Ω·cm.

[0059] In some embodiments, the conductive adhesive layer 105 is a conductive adhesive layer, and the resistivity of the conductive adhesive layer is 10. 6 Ω·cm-10 9 The resistivity of the conductive adhesive layer 105 is Ω·cm, which gives it weak conductivity and helps improve the uniformity of the electric field. The second electrode layer 106 is a pixel electrode layer, which can control the electric field state of each electrophoretic capsule 108, helping to achieve the clarity and resolution of the image display. For example, the conductive adhesive layer is formed by curing conductive adhesive, and the resistivity of the conductive adhesive layer is 10 Ω·cm. 6 Ω·cm, 10 7 Ω·cm, 10 8 Ω·cm or 10 9 Ω·cm.

[0060] Combination Figures 2 to 5 As shown, in one or more embodiments, this application also provides a method for manufacturing a display panel, used to manufacture the display panel in any of the above embodiments, the manufacturing method comprising the following steps:

[0061] S201, Prepare a first electrode layer 102 on the first substrate 101, such as Figure 4 As shown in (a) in the middle;

[0062] S202, Prepare an electrophoretic layer 103 on the first electrode layer 102, such as Figure 4 As shown in (b);

[0063] S203. Prepare an insulating adhesive layer 104 on the electrophoretic layer 103, such as Figure 4 As shown in (c);

[0064] S204. Prepare a conductive adhesive layer 105 on the insulating adhesive layer 104, such as... Figure 5 As shown in (d) and (e);

[0065] S205, Prepare a second electrode layer 106 on the second substrate 107;

[0066] S206, the second electrode layer 106 on the second substrate 107 is bonded to the conductive adhesive layer 105, such as... Figure 5 As shown in (f) in the figure.

[0067] In this embodiment, the display panel manufactured using the above-described manufacturing method utilizes an insulating adhesive layer 104 between the electrophoretic layer 103 and the conductive adhesive layer 105. This achieves isolation between the first electrode layer 102 and the second electrode layer 106 through the insulating adhesive layer 104, preventing direct conduction between the first electrode layer 102 and the second electrode layer 106. This ensures a more uniform electric field between the first electrode layer 102 and the second electrode layer 106, greatly reducing the possibility of black spots and guaranteeing the display effect of the electronic paper.

[0068] It should be noted that steps S205 and S201 can be performed simultaneously, which can save production time.

[0069] In step S202, during preparation, the side of the first substrate 101 with the first electrode layer 102 faces upwards, which facilitates subsequent manufacturing. Then, multiple electrophoretic adhesive capsules 108 are mixed with insulating adhesive, and the mixture is uniformly coated on the surface of the first electrode layer 102 facing away from the first substrate 101. After the insulating adhesive is fixed, the cured insulating adhesive forms a dielectric adhesive, and the dielectric adhesive and multiple electrophoretic capsules 108 form an electrophoretic layer 103.

[0070] In step S203, after the electrophoretic layer 103 is prepared, the number of sub-adhesive layers in the insulating adhesive layer 104 is determined as needed. When the number of sub-adhesive layers is one, an insulating adhesive of a set thickness is applied to the side of the electrophoretic layer 103 facing away from the first electrode layer 102 and cured to form the first sub-adhesive layer 109. The first sub-adhesive layer 109 is used to fill the gap between two adjacent electrophoretic capsules 108. Since the number of sub-adhesive layers is one, the first sub-adhesive layer 109 is also the insulating adhesive layer 104.

[0071] Combination Figure 4 and Figure 5As shown, when there are multiple sub-adhesive layers, taking two sub-adhesive layers as an example: An insulating adhesive of a predetermined thickness is applied to the side of the electrophoretic layer 103 facing away from the first electrode layer 102, and then cured to form the first sub-adhesive layer 109; then another layer of insulating adhesive is applied, and after curing, a second sub-adhesive layer 110 is formed, thereby realizing the preparation of the insulating adhesive layer 104. For example, the insulating adhesive used to form the first sub-adhesive layer and the insulating adhesive used to form the second sub-adhesive layer can be different types of insulating adhesives. The dynamic viscosity of the insulating adhesive used for the first sub-adhesive layer 109 is lower than that of the insulating adhesive used for the second sub-adhesive layer 110. This allows the insulating adhesive used for the first sub-adhesive layer 109 to fill the gap between two adjacent electrophoretic capsules 108. Due to the insulating properties of the adhesive, direct conductivity between the first electrode layer 102 and the second electrode layer 106 can be avoided. In addition, the side of the second sub-adhesive layer 110 facing away from the first sub-adhesive layer 109 is a flat surface, that is, the side of the insulating adhesive layer 104 facing away from the electrophoretic layer is a flat surface.

[0072] In step S204, conductive adhesive 12 is applied to the side of the second sub-adhesive layer 110 facing away from the first electrode layer 102. After curing, a conductive adhesive layer 105 is formed. It should be noted that, to ensure the cleanliness of the conductive adhesive layer 105, a release film layer 111 can be provided on the conductive adhesive layer 105 before the second electrode layer 106 is bonded to it. Figure 5 As shown in (e); when it is necessary to bond the second electrode layer 106 to the conductive adhesive layer 105, the release film layer 111 can be removed.

[0073] In step S206, when the second electrode layer 106 has been formed on the second substrate 107, the second electrode layer 106 and the second substrate 107 are bonded together to the conductive adhesive layer 105, thus forming a display panel.

[0074] Once the display panel is manufactured, the entire display panel can be flipped so that the first substrate 101 is at the top.

[0075] In one or more embodiments, this application also provides a display device, which includes the display panel of any of the above embodiments or the display panel manufactured by the manufacturing method of any of the above embodiments. Thus, in the display device, when an insulating adhesive layer 104 is provided between the electrophoretic layer 103 and the conductive adhesive layer 105, the first electrode layer 102 and the second electrode layer 106 are isolated by the insulating adhesive layer 104, avoiding direct conduction between the first electrode layer 102 and the second electrode layer 106. This ensures a more uniform electric field between the first electrode layer 102 and the second electrode layer 106, greatly reducing the possibility of black spots and ensuring the display effect of the electronic paper. For example, the display device can be a wearable device, such as a wristband or watch, an e-reader, or an electronic tag. The display device can also have a magnetic component, which can be a magnet; the magnet is fixedly connected to the display panel, so that the display panel can be attached to different objects, such as the back of a mobile phone, a car, or a refrigerator.

[0076] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, It includes a first substrate, a first electrode layer, an electrophoretic layer, an insulating adhesive layer, a conductive adhesive layer, a second electrode layer, and a second substrate, which are stacked in sequence.

2. The display panel as described in claim 1, characterized in that, The insulating adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer stacked together. The first sub-adhesive layer fills the voids in the electrophoretic layer, and the dynamic viscosity of the first sub-adhesive layer is lower than that of the second sub-adhesive layer.

3. The display panel as described in claim 2, characterized in that, The thickness of the second sub-adhesive layer is less than or equal to 5 μm; the resistivity of the first sub-adhesive layer is greater than 10. 10 Ω·cm, the resistivity of the second sub-adhesive layer is greater than 10 Ω·cm 12 Ω·cm.

4. The display panel as described in claim 2 or 3, characterized in that, The electrophoretic layer includes a plurality of electrophoretic capsules and a dielectric binder, wherein the plurality of electrophoretic capsules are embedded in the dielectric binder; The insulating adhesive layer can fill the gap between two adjacent electrophoretic capsules; the side of the insulating adhesive layer facing away from the electrophoretic layer can form a plane.

5. The display panel as described in claim 4, characterized in that, The resistivity of the insulating adhesive layer is the same as that of the dielectric adhesive.

6. The display panel as described in claim 4, characterized in that, The insulating adhesive layer is made of the same material as the dielectric adhesive.

7. A display device, characterized in that, include: The display panel as described in any one of claims 1-6.

8. A method for manufacturing a display panel, used to manufacture a display panel as described in any one of claims 1-6, characterized in that, The manufacturing method includes: A first electrode layer is fabricated on a first substrate; An electrophoretic layer is prepared on the first electrode layer; An insulating adhesive layer is prepared on the electrophoretic layer; A conductive adhesive layer is prepared on the insulating adhesive layer; A second electrode layer is fabricated on the second substrate; The second electrode layer is bonded to the conductive adhesive layer.

9. The method for manufacturing a display panel as described in claim 8, characterized in that, The preparation of the insulating adhesive layer on the electrophoretic layer includes: The insulating adhesive layer includes a first sub-adhesive layer; An insulating adhesive of a predetermined thickness is applied to the side of the electrophoretic layer facing away from the first electrode layer and cured to form a first sub-adhesive layer, which is used to fill the gap between two adjacent electrophoretic capsules.

10. The method for manufacturing a display panel as described in claim 9, characterized in that, The preparation of the insulating adhesive layer on the electrophoretic layer includes: The insulating adhesive layer also includes a second sub-adhesive layer; An insulating adhesive is applied to the first sub-adhesive layer and cured to form a second sub-adhesive layer. The dynamic viscosity of the insulating adhesive used in the first sub-adhesive layer is lower than that of the insulating adhesive used in the second sub-adhesive layer, and the side of the second sub-adhesive layer facing away from the first sub-adhesive layer is a flat surface.

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