Sensor shift actuator and camera module including the same
By moving the image sensor in three axes using a sensor shift actuator, combined with magnet and coil drive, the focus adjustment and shake correction problems of the camera module at high zoom ratios are solved, and power consumption is reduced.
Patent Information
- Application Number
- CN202510438548.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-08
- Filing Date
- 2025-04-09
- Publication Date
- 2025-11-11
AI Technical Summary
Existing camera modules struggle to effectively combine high zoom ratio and focus adjustment functions, and they also consume a lot of power.
A sensor shift actuator is used to achieve focus adjustment and jitter correction in three-axis directions by moving the image sensor. The movement of the image sensor is supported by a voice coil motor driven by magnets and coils, and by a bridge section and ball component made of flexible and rigid materials.
It achieves precise focus adjustment and shake correction for the camera module at high zoom ratios, while reducing power consumption.
Smart Images

Figure CN120935445A_ABST
Abstract
Description
[0001] Cross-references to related applications
[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0060678, filed on May 8, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field
[0003] This disclosure relates to a sensor shift actuator and a camera module including the sensor shift actuator. Background Technology
[0004] Recently, camera modules used in mobile devices are being manufactured to offer performance comparable to that of traditional cameras. For example, camera modules may come standard with focus adjustment and image stabilization features.
[0005] At the same time, as the frequency of video recording using mobile devices increases, the demand for camera modules that can provide high zoom ratios is also increasing.
[0006] Therefore, a high zoom ratio is achieved by having reflectors such as prisms in the camera module, allowing the incident light to have a relatively long total track length.
[0007] In addition, in the camera module including the reflector, focus adjustment and shake correction functions are implemented through the moving lens module and the reflector module, respectively.
[0008] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention
[0009] The summary portion of this invention is intended to provide a brief overview of the chosen concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.
[0010] In one general aspect, the sensor displacement actuator includes: a housing having an internal space; an image sensor housed in the housing and having an imaging surface; a first moving frame housed in the housing and configured to move together with the image sensor in a direction parallel to the imaging surface; a second moving frame housed in the housing and configured to move together with the image sensor and the first moving frame in a direction perpendicular to the imaging surface; a bridge portion configured to at least partially bend and support movement of the image sensor in the direction parallel to the imaging surface; and a plurality of ball members disposed between the second moving frame and the housing and configured to support another movement of the image sensor in the direction perpendicular to the imaging surface.
[0011] A sensor substrate disposed on one side of an image sensor may include: a first movable portion connected to a first movable frame; a second movable portion connected to a second movable frame and spaced apart from the first movable portion; and a bridge portion disposed between the first movable portion and the second movable portion.
[0012] The first and second moving parts can be formed of rigid materials, and the bridge part can be formed of flexible materials.
[0013] The sensor shift actuator may further include a connecting substrate configured to support the image sensor, the first moving frame, and the second moving frame. One side of the connecting substrate may be connected to the sensor substrate, and the other side of the connecting substrate may be disposed within the housing.
[0014] The sensor substrate may further include: a first connecting portion extending from the first moving portion and connecting the first moving portion and the bridge portion; and a second connecting portion extending from the second moving portion and connecting the second moving portion and the bridge portion. One side of the connecting substrate may be connected to the first connecting portion.
[0015] The sensor displacement actuator may also include a main substrate disposed within the housing. A connecting substrate may be coupled to the main substrate on the other side, and the connecting substrate may be configured to surround a portion of the main substrate while maintaining a gap between the connecting substrate and the main substrate.
[0016] The connecting substrate may include: a first portion configured to have a gap with a main substrate in a first direction parallel to the imaging surface; a second portion configured to have a gap with the main substrate in a second direction parallel to the imaging surface and perpendicular to the first direction; and a third portion configured to have a gap with the main substrate in a third direction perpendicular to the imaging surface. The first portion may be connected to a housing, and the third portion may be connected to a sensor substrate.
[0017] The surface of the main substrate may include a clearance groove extending upward through the third portion of the surface in a portion overlapping with the third portion. A portion of the third portion may be disposed in the clearance groove.
[0018] The sensor shift actuator may further include: a first jitter correction magnet and a second jitter correction magnet, disposed on the first moving frame; and a first jitter correction coil and a second jitter correction coil, disposed in the housing to face the first jitter correction magnet and the second jitter correction magnet, respectively.
[0019] The sensor shift actuator may further include: a focus adjustment magnet disposed on the second moving frame; and a focus adjustment coil disposed in the housing to face the focus adjustment magnet.
[0020] The sensor shift actuator may also include a yoke disposed in the housing to face the focal adjustment magnet.
[0021] In another general aspect, the camera module includes: a lens module including at least one lens disposed along an optical axis; an image sensor having an imaging surface; a reflective member configured to reflect light toward the image sensor; and a sensor shift actuator configured to move the image sensor relative to the reflective member in a direction parallel to and perpendicular to the imaging surface. The sensor shift actuator includes: a bridge portion configured to at least partially bend and to support movement of the image sensor in a direction parallel to the imaging surface; and a plurality of ball members configured to support movement of the image sensor in a direction perpendicular to the imaging surface while rolling in the same direction.
[0022] The sensor shift actuator may further include: a first moving frame configured to move together with the image sensor in a direction parallel to the imaging surface; and a second moving frame configured to move together with the image sensor and the first moving frame in a direction perpendicular to the imaging surface.
[0023] The sensor shift actuator may further include a sensor substrate disposed on one side of the image sensor. The sensor substrate may include: a first moving portion connected to a first moving frame; a second moving portion connected to a second moving frame and spaced apart from the first moving portion; and a bridge portion disposed between the first moving portion and the second moving portion.
[0024] The sensor shift actuator may further include: a main substrate disposed within a housing accommodating an image sensor; and a connecting substrate, one side of which is connected to the sensor substrate and the other side of which is connected to the main substrate. The connecting substrate may be configured to have a gap with the main substrate in at least one of a direction parallel to the imaging surface and a direction perpendicular to the imaging surface. The connecting substrate may be configured such that at least a portion of the connecting substrate bends when the image sensor moves.
[0025] The reflecting component can be a parallelogram-shaped prism.
[0026] Other features and aspects will become apparent from the accompanying drawings and the detailed description below. Attached Figure Description
[0027] Figure 1 This is a conceptual diagram of a camera module according to an embodiment of the present disclosure.
[0028] Figure 2 This is an illustrative diagram showing the movement of an image sensor according to an embodiment of the present disclosure.
[0029] Figure 3 This is a perspective view of a sensor shift actuator according to an embodiment of the present disclosure.
[0030] Figure 4 This is an exploded perspective view of a sensor shift actuator according to an embodiment of the present disclosure.
[0031] Figure 5 This is a 3D view of the sensor displacement actuator with the shield removed.
[0032] Figure 6A It is along Figure 3 A sectional view taken by line I-I'.
[0033] Figure 6B yes Figure 6A A magnified view of part A.
[0034] Figure 7 This is a plan view of a sensor substrate according to an embodiment of the present disclosure.
[0035] Figure 8 It is along Figure 3 The sectional view taken from line II-II'.
[0036] Figure 9 This is a diagram illustrating the ball-guided portion according to an embodiment of the present disclosure.
[0037] Figure 10 and Figure 11 This is a diagram showing a connection substrate according to an embodiment of the present disclosure.
[0038] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation
[0039] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.
[0040] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.
[0041] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatuses, and / or systems described herein will become apparent upon understanding this disclosure.
[0042] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.
[0043] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.
[0044] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.
[0045] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.
[0046] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.
[0047] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.
[0048] It should be noted that in this document, the term "may" is used relative to examples, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.
[0049] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.
[0050] Figure 1 This is a conceptual diagram of a camera module according to an embodiment of the present disclosure.
[0051] Reference Figure 1 The camera module 1 may include a housing 10, multiple reflection modules 20 and 40, a lens module 30, and an image sensor module 50.
[0052] The housing 10 may have an internal space. Multiple reflection modules 20 and 40 and a lens module 30 may be disposed within the internal space of the housing 10.
[0053] The lens module 30 may include multiple lenses aligned in the optical axis direction.
[0054] The multiple reflection modules 20 and 40 may include reflective members that alter the path of light incident on the camera module 1. For example, the reflective member may be a prism.
[0055] The multiple reflection modules 20 and 40 may include a first reflection module 20 and a second reflection module 40, wherein the first reflection module 20 is disposed in front of the lens module 30 based on the light propagation path, and the second reflection module 40 is disposed behind the lens module 30 based on the light propagation path.
[0056] In this embodiment, the first reflection module 20 can reflect or refract light incident on the camera module 1 toward the lens module 30. Additionally, the second reflection module 40 can reflect or refract light passing through the lens module 30 toward the image sensor module 50.
[0057] According to embodiments of this disclosure, the camera module 1 can achieve a relatively long total track length by changing the propagation path of light incident on the camera module 1 at least twice.
[0058] Meanwhile, the light incident on camera module 1 can eventually reach image sensor module 50.
[0059] The image sensor module 50 may include an image sensor S that converts light arriving at the image sensor module 50 into electrical signals.
[0060] The camera module 1 according to the embodiments of this disclosure may not be limited to... Figure 1 The structure shown can be modified or some parts of the configuration can be omitted. For example, the shape and size of the multiple reflection modules 20 and 40 and the lens module 30 can be changed.
[0061] According to embodiments of this disclosure, camera module 1 can realize focus adjustment and shake correction functions by moving image sensor S.
[0062] Figure 2 This is an illustrative diagram showing the movement of an image sensor according to an embodiment of the present disclosure.
[0063] Reference Figure 2 The image sensor S can move along three mutually perpendicular axes. Figure 2 In this context, AF refers to autofocus, OIS X refers to X-axis image stabilization, and OIS Y refers to Y-axis image stabilization.
[0064] In embodiments of this disclosure, the image sensor S can be moved about the reflective member P, which will be described later, in three mutually perpendicular axial directions.
[0065] When adjusting the focus, the image sensor S can move in a first axis direction (Z-axis direction, i.e. AF direction) perpendicular to the imaging surface, and when correcting jitter, the image sensor S can move in two directions parallel to the imaging surface (e.g., a second axis direction (X-axis direction, i.e. OIS X direction) parallel to the major axis direction of the image sensor S and a third axis direction (Y-axis direction, i.e. OIS Y direction) parallel to the minor axis direction of the image sensor S).
[0066] According to embodiments of this disclosure, the camera module 1 moves the relatively lightweight image sensor S, thereby enabling precise focus adjustment and shake correction. Furthermore, power consumption can be reduced during focus adjustment and shake correction.
[0067] According to embodiments of the present disclosure, the camera module 1 may include a sensor shift actuator 500 for moving the image sensor S.
[0068] Figure 3 This is a perspective view of a sensor shift actuator according to an embodiment of the present disclosure.
[0069] The sensor shift actuator 500 can be applied to Figure 1 The image sensor module 50. For example, the sensor shift actuator 500 can accommodate the image sensor module 50.
[0070] The sensor shift actuator 500 may include a drive section that generates a driving force to move the image sensor S in three axial directions. For example, the drive section may be a voice coil motor that includes a magnet and a coil.
[0071] In the following text, refer to Figure 4 The detailed configuration of the sensor shift actuator 500 is described in detail.
[0072] Figure 4 This is an exploded perspective view of a sensor shift actuator according to an embodiment of the present disclosure. Figure 5 This is a 3D view of the sensor displacement actuator with the shield removed. Figure 6A It is along Figure 3 A sectional view taken from line I-I'. Figure 6B yes Figure 6A A magnified view of part A. Figure 8 It is along Figure 3 The sectional view taken from line II-II'.
[0073] Reference Figure 4 The sensor shift actuator 500 may include a housing 510, a shield 520, a sensor substrate 530, a first moving frame 540, a second moving frame 550, and a drive section.
[0074] The housing 510 may have an internal space that accommodates the sensor substrate 530 and the like.
[0075] The housing 510 may have an internal space and may be open in the first axial direction (Z-axis direction).
[0076] In one embodiment, the internal space of the housing 510 can sequentially accommodate the second movable frame 550, the first movable frame 540, and the sensor substrate 530 in the first axial direction (Z-axis direction).
[0077] Additionally, the reflective member P can be disposed on the upper side of the second movable frame 550. For example, the reflective member P can be a prism with a parallelogram shape.
[0078] The reflecting component P can be Figure 1 It is part of the second reflective module 40. The reflective member P can be disposed in the opening portion of the housing 510.
[0079] The shield 520 can be attached to the housing 510 to cover the internal space. For example, the shield 520 can be attached to the housing 510 on the opposite side of the reflective member P (i.e., the sensor substrate 530 side).
[0080] The housing 510 and the shield 520 can be fixed components. Therefore, the movement of the image sensor S, etc., can be relative to the housing 510.
[0081] The image sensor S can be mounted on the sensor substrate 530.
[0082] For details, refer to Figure 6A and Figure 6B The image sensor S can be mounted on the sensor substrate 530 via a sub-housing SH. In other words, the sub-housing SH on which the image sensor S is mounted can be connected to the sensor substrate 530.
[0083] In addition to the image sensor S, an optical filter F can also be disposed in the sub-housing SH. For example, the optical filter F can be disposed between the reflective member P and the image sensor S, and can block light of a specific wavelength region passing through the reflective member P from entering the image sensor S.
[0084] Figure 7 This is a plan view of a sensor substrate according to an embodiment of the present disclosure.
[0085] The sensor substrate 530 may include a first movable portion 531 connected to the sub-housing SH, a second movable portion 533 spaced apart from the first movable portion 531, and a bridge portion 532 supporting the movement of the image sensor S.
[0086] In an embodiment, the sensor substrate 530 may be a rigid printed circuit board, the first moving portion 531 and the second moving portion 533 may be formed of a rigid material, and the bridge portion 532 may be formed of a flexible material.
[0087] The first movable part 531 can be connected to the sub-housing SH in which the image sensor S is disposed, and can move together with the image sensor S in three mutually perpendicular axial directions.
[0088] Reference Figure 6A The sub-shell SH can be connected to the first movable frame 540, which moves in the second axial direction (X-axis direction) and the third axial direction (Y-axis direction) parallel to the imaging surface, and can move together with the first movable frame 540 in the second axial direction (X-axis direction) and the third axial direction (Y-axis direction) in the same direction.
[0089] Furthermore, since the sub-housing SH is also connected to the first moving part 531, the first moving part 531 can move together with the sub-housing SH and the first moving frame 540 in the second axis direction (X-axis direction) and the third axis direction (Y-axis direction).
[0090] The second moving portion 533 may include two portions spaced apart in the second axial direction (X-axis direction), and the first moving portion 531 is inserted between the two portions.
[0091] Reference Figure 6B The second moving part 533 can be connected to the second moving frame 550, which moves in the first axial direction (Z-axis direction). Therefore, the second moving part 533 can move together with the second moving frame 550 in the first axial direction (Z-axis direction).
[0092] In this case, although not shown in the accompanying drawings, leaf springs may be additionally provided to supplement the connection stiffness of the second moving part 533 and the second moving frame 550.
[0093] In one embodiment, the leaf spring can be structurally connected by having one side disposed on the second moving part 533 and the other side disposed on the second moving frame 550.
[0094] The leaf spring may extend at least partially in the first axial direction (Z-axis direction) to connect the second moving part 533 and the second moving frame 550 in the first axial direction (Z-axis direction).
[0095] Reference Figure 6B The second moving part 533 may be spaced apart from the first moving frame 540 in the first axial direction (Z-axis direction).
[0096] In other words, the second moving part 533 can be a fixed member that does not move during movement in the second axis direction (X-axis direction) and the third axis direction (Y-axis direction). In other words, the second moving part 533 can remain stationary during jitter correction, and the second moving part 533 can be spaced apart from the first moving frame 540 so as not to interfere with the movement of the first moving frame 540 in the second axis direction (X-axis direction) and the third axis direction (Y-axis direction).
[0097] Meanwhile, the first moving part 531 can also move in the first axis direction (Z-axis direction) via the bridge part 532.
[0098] At least a portion of the bridge portion 532 is bendable. The bridge portion 532 may be formed of a flexible material and may be the part that supports the movement of the image sensor S.
[0099] The bridge portion 532 can be disposed between the first movable portion 531 and the second movable portion 533.
[0100] Bridge portion 532 may include multiple bridge elements. The multiple bridge elements may be spaced apart by multiple slits and may extend along the periphery of the first moving portion 531.
[0101] The bridge portion 532 can be connected to the first moving portion 531 and the second moving portion 533 via the connecting portions 534a and 534b.
[0102] In an embodiment, the connecting portions 534a and 534b may be formed of a rigid material.
[0103] In one embodiment, the connecting portion may include a first connecting portion 534a, which may be spaced apart in the third axial direction (Y-axis direction) and connect the bridge portion 532 and the first moving portion 531. For example, the first connecting portion 534a may partially extend from the first moving portion 531 in the third axial direction (Y-axis direction). The first connecting portion 534a may be connected to the first moving portion 531 and spaced apart from the second moving portion 533.
[0104] Furthermore, the connecting portion may include a second connecting portion 534b, which is spaced apart in the second axial direction (X-axis direction) and connects the bridge portion 532 and the second moving portion 533. For example, the second connecting portion 534b may partially extend from the second moving portion 533 in the second axial direction (X-axis direction). The second connecting portion 534b may be connected to the second moving portion 533 and spaced apart from the first moving portion 531.
[0105] In this embodiment, when the image sensor S moves in the second axial direction (X-axis direction), the plurality of bridge elements connected to the second moving portion 533 can be bent. Furthermore, when the image sensor S moves in the third axial direction (Y-axis direction), the plurality of bridge elements connected to the first moving portion 531 can be bent.
[0106] At the same time, refer to Figure 5 The sensor substrate 530 can be coupled to the connection substrate 570. Details about the connection substrate 570 will be described later.
[0107] The first movable frame 540 may have a shape with one side open.
[0108] In an implementation, the first movable frame 540 can be formed as follows: The shape can be configured such that an open side is adjacent to the connecting substrate 570.
[0109] The first moving frame 540 can move in a direction parallel to the imaging surface of the image sensor S (i.e., in the second axis direction (X-axis direction) and the third axis direction (Y-axis direction).
[0110] The first movable frame 540 can be connected to the sub-housing SH on which the image sensor S is disposed, and can also be connected to the first movable portion 531 of the sensor substrate 530 through the sub-housing SH. The first movable frame 540, the sub-housing SH, and the first movable portion 531 of the sensor substrate 530 can move together in the second axis direction (X-axis direction) and the third axis direction (Y-axis direction).
[0111] The first jitter correction drive section 563 can generate a driving force to move the first moving frame 540, etc., in the second axial direction (X-axis direction).
[0112] The first jitter correction drive section 563 may include Figure 4 The first jitter correction magnet 5631 and the first jitter correction coil 5633 are shown in the figure.
[0113] In this embodiment, the first jitter correction magnet 5631 may be disposed on the first moving frame 540, and the first jitter correction coil 5633 may be mounted on the main substrate 580 and disposed in the housing 510.
[0114] The first jitter correction magnet 5631 and the first jitter correction coil 5633 can face each other in the second axial direction (X-axis direction).
[0115] When power is applied to the first jitter correction coil 5633, the first moving frame 540 and the like can move in the second axial direction (X-axis direction) by the electromagnetic force between the first jitter correction magnet 5631 and the first jitter correction coil 5633.
[0116] In an embodiment, the first jitter correction magnet 5631 may be a movable component disposed in the first movable frame 540 and moving together with the first movable frame 540, and the first jitter correction coil 5633 may be a fixed component disposed in the housing 510.
[0117] The first jitter correction drive section 563 may include a position sensor (or a second position sensor) 5635 for detecting the position of the first moving frame 540. For example, the position sensor 5635 may be a Hall sensor.
[0118] The position sensor 5635 can be configured to face the first jitter correction magnet 5631. For example, the position sensor 5635 can be mounted on the main substrate 580 together with the first jitter correction coil 5633.
[0119] The second jitter correction drive section 565 can generate a driving force to move the first moving frame 540, etc., in the third axis direction (Y-axis direction).
[0120] The second jitter correction drive section 565 may include a second jitter correction magnet 5651 and a second jitter correction coil 5653.
[0121] In this embodiment, the second jitter correction magnet 5651 may be disposed on the first moving frame 540, and the second jitter correction coil 5653 may be mounted on the main substrate 580 and disposed in the housing 510.
[0122] The second jitter correction magnet 5651 and the second jitter correction coil 5653 can face each other in the third axis direction (Y-axis direction).
[0123] When power is applied to the second jitter correction coil 5653, the first moving frame 540 and the like can move in the third axis direction (Y-axis direction) by the electromagnetic force between the second jitter correction magnet 5651 and the second jitter correction coil 5653.
[0124] In an embodiment, the second jitter correction magnet 5651 may be a movable component disposed on the first movable frame 540 and moving together with the first movable frame 540, and the second jitter correction coil 5653 may be a fixed component disposed in the housing 510.
[0125] The second jitter correction drive section 565 may include a position sensor (or a third position sensor) 5655 for detecting the position of the first moving frame 540. For example, the position sensor 5655 may be a Hall sensor.
[0126] The position sensor 5655 can be configured to face the second jitter correction magnet 5651. For example, the position sensor 5655 can be mounted on the main substrate 580 together with the second jitter correction coil 5653.
[0127] The second moving frame 550 may have an internal space and may be open in the first axial direction (Z-axis direction).
[0128] In one embodiment, the internal space of the second movable frame 550 can sequentially accommodate the first movable frame 540 and the sensor substrate 530 in the first axial direction (Z-axis direction).
[0129] Furthermore, the stop 590 can be connected to the second movable frame 550 to cover one side of the first movable frame 540. For example, the stop 590 can be configured to cover the side of the first movable frame 540 facing the sensor substrate 530.
[0130] The stop 590 can prevent the first moving frame 540, which is housed in the second moving frame 550, from separating from the second moving frame 550 due to impact or the like.
[0131] The second moving frame 550 can move in a direction perpendicular to the imaging surface of the image sensor S (i.e., in the first axis direction (Z-axis direction)).
[0132] The second movable frame 550 can be connected to the second movable portion 533 of the sensor substrate 530. The second movable portion 533 can move together with the second movable frame 550 in the first axial direction (Z-axis direction).
[0133] When the second moving part 533 moves in the first axis direction (Z-axis direction), the first moving part 531 can also move in the first axis direction (Z-axis direction) via the bridge part 532, and therefore, the image sensor S can also move in the first axis direction (Z-axis direction).
[0134] In other words, when the second moving frame 550 moves in the first axial direction (Z-axis direction), the configuration housed in the second moving frame 550 can also move in the first axial direction (Z-axis direction).
[0135] Additionally, according to embodiments of this disclosure, a leaf spring may be included to supplement the connection structure between the second moving frame 550 and the second moving portion 533 of the sensor substrate 530.
[0136] The focus adjustment drive unit 561 can generate a driving force to move the second moving frame 550, etc., in the first axial direction (Z-axis direction).
[0137] The focus adjustment drive section 561 may include a focus adjustment magnet 5611 and a focus adjustment coil 5613.
[0138] In one embodiment, the focus adjustment magnet 5611 may be disposed in the second moving frame 550, and the focus adjustment coil 5613 may be mounted on the main substrate 580 and disposed in the housing 510.
[0139] The focus adjustment magnet 5611 and the focus adjustment coil 5613 can face each other in the second axial direction (X-axis direction).
[0140] When power is applied to the focus adjustment coil 5613, the second moving frame 550 and the like can move in the first axial direction (Z-axis direction) by the electromagnetic force between the focus adjustment magnet 5611 and the focus adjustment coil 5613.
[0141] In one embodiment, the focus adjustment magnet 5611 may be a movable component disposed on the second movable frame 550 and moving together with the second movable frame 550, and the focus adjustment coil 5613 may be a fixed component disposed in the housing 510.
[0142] The focus adjustment drive section 561 may include a position sensor (or a first position sensor) 5615 for detecting the position of the second moving frame 550. For example, the position sensor 5615 may be a Hall sensor.
[0143] The position sensor 5615 can be configured to face the focus adjustment magnet 5611. For example, the position sensor 5615 can be mounted on the main substrate 580 together with the focus adjustment coil 5613.
[0144] The second movable frame 550 can move about the housing 510 in the first axial direction (Z-axis direction).
[0145] Multiple ball components B can be disposed between the second moving frame 550 and the housing 510 to reduce friction when the second moving frame 550 moves.
[0146] Multiple spherical components B can be spaced apart by focal adjustment magnets 5611.
[0147] Multiple ball components B may include multiple balls (spheres) arranged in the first axial direction (Z-axis direction). When the second moving frame 550 moves in the first axial direction (Z-axis direction), the multiple ball components B may roll in the first axial direction (Z-axis direction).
[0148] Figure 9 This is a diagram illustrating the ball-guided portion according to an embodiment of the present disclosure.
[0149] Reference Figure 9 Multiple ball components B can be accommodated in guide slots respectively provided in the second movable frame 550 and the housing 510.
[0150] In the implementation, the second movable frame 550 may be provided with a first guide groove G1 and a second guide groove G2, and the housing 510 may be provided with a third guide groove G3 and a fourth guide groove G4.
[0151] The first guide groove G1 can face the third guide groove G3, the second guide groove G2 can face the fourth guide groove G4, and multiple ball components B can be disposed between them.
[0152] The first guide groove G1 to the fourth guide groove G4 can extend in the first axial direction (Z-axis direction). In addition, a portion of the first guide groove G1 to the fourth guide groove G4 can have different cross-sectional shapes.
[0153] Meanwhile, the yoke 5617 can be disposed in the housing 510. In detail, the yoke 5617 can be disposed to cover the opposite surface of the main substrate 580 to the surface on which the focus adjustment coil 5613 is mounted (i.e., the other surface of the main substrate 580).
[0154] The yoke 5617 can be configured to face the focus adjustment magnet 5611, and the focus adjustment coil 5613 is located between the yoke 5617 and the focus adjustment magnet 5611.
[0155] The yoke 5617 can generate a force with the focus adjustment magnet 5611. For example, an attractive force can be applied between the yoke 5617 and the focus adjustment magnet 5611 in the direction in which they face each other (in the second axial direction (X-axis direction) based on the figures).
[0156] By means of the attraction generated between the yoke 5617 and the focus adjustment magnet 5611, a plurality of ball components B can be accommodated in a guide groove while maintaining contact with the guide groove, which is disposed in the second moving frame 550 and the housing 510.
[0157] According to embodiments of this disclosure, in addition to the bridge portion 532 and the plurality of ball members B of the sensor substrate 530 described above, the movement of the image sensor S and the like during jitter correction and focus adjustment can also be supported by the connecting substrate 570.
[0158] Figure 10 and Figure 11 This is a diagram showing a connection substrate according to an embodiment of the present disclosure.
[0159] The connecting substrate 570 can be formed of a flexible material to support the movement of the image sensor S, etc.
[0160] Reference Figure 10 The connecting substrate 570 may be configured to surround at least a portion of the main substrate 580 from the outside of the main substrate 580.
[0161] The connecting substrate 570 can be connected to the sensor substrate 530 and the main substrate 580.
[0162] The connecting substrate 570 can be disposed in the housing 510 by being connected to the main substrate 580.
[0163] In detail, the connecting substrate 570 can be connected to the first connecting portion 534a of the sensor substrate 530 and the main substrate 580. Both the first connecting portion 534a and the main substrate 580 can be formed of a rigid material. The connecting substrate 570 can support the movement of the image sensor S, etc., while being connected to it.
[0164] The connecting substrate 570 may be configured to have a gap g with the main substrate 580 in at least one of the first axial direction (Z-axis direction), the second axial direction (X-axis direction), and the third axial direction (Y-axis direction).
[0165] Therefore, when the image sensor S, etc., moves, the connecting substrate 570 can support the movement of the image sensor S, etc., by moving about the main substrate 580 within the range of the gap g formed between the connecting substrate 570 and the main substrate 580. In this case, the amount of movement of the image sensor S, etc., can be increased by the amount of movement of the connecting substrate 570.
[0166] In other words, according to embodiments of this disclosure, the driving distance of the image sensor S can be improved during focus adjustment and jitter correction.
[0167] The connecting substrate 570 may include a first portion 571 connected to the main substrate 580, a second portion 572 extending between the first portions 571, and a third portion 573 connected to the first connecting portion 534a of the sensor substrate 530 and connected to the second portion 572.
[0168] The first portion 571 may include two portions spaced apart in the second axial direction (X-axis direction). Each of the two portions may be coupled to the main substrate 580. In addition, either of the two portions may include a connecting portion, and the connecting portion may be coupled to the main substrate 580.
[0169] The first part 571 can be configured to have a gap g with the portion of the main substrate 580 disposed on the inner side of the first part 571 in a generally second axial direction (X-axis direction).
[0170] In the embodiment, when the image sensor S, etc., moves in the second axial direction (X-axis direction), the first part 571 can support the movement of the image sensor S, etc., by moving within the range of the gap g formed between the first part 571 and the main substrate 580 in the second axial direction (X-axis direction).
[0171] The second portion 572 may extend between the two portions of the first portion 571 that are spaced apart in the second axial direction (X-axis direction). Therefore, the second portion 572 may be in the form of extending in the second axial direction (X-axis direction).
[0172] The second part 572 can be configured to have a gap g between it and the portion of the main substrate 580 disposed on the inner side of the second part 572 in the third axis direction (Y-axis direction).
[0173] In the embodiment, when the image sensor S, etc., moves in the third axis direction (Y-axis direction), the second part 572 can support the movement of the image sensor S, etc., by moving within the range of the gap g formed between the second part 572 and the main substrate 580 in the third axis direction (Y-axis direction).
[0174] One side of the third part 573 can be connected to the first connection part 534a of the sensor substrate 530, and the other side can be connected to the second part 572.
[0175] The third part 573 may extend between the first connecting part 534a and the second part 572 in the third axial direction (Y-axis direction), and the other side of the third part 573 that is connected to the second part 572 may be formed to be at least partially bent at about 90 degrees.
[0176] At the same time, at the part where the third part 573 is bent to connect with the second part 572, the third part 573 may interfere with the part of the main substrate 580 that is disposed on the inside of the second part 572.
[0177] To prevent this, the main substrate 580 may include a clearance groove 581 in the first axial direction (Z-axis direction) in the portion that overlaps with the third portion 573.
[0178] The clearance g can be formed in the first axial direction (Z-axis direction) between the third part 573 and the clearance groove 581.
[0179] In the embodiment, when the image sensor S moves in the first axial direction (Z-axis direction), the third part 573 can support the movement of the image sensor S by moving within the range of the gap g formed between the third part 573 and the clearance groove 581 of the main substrate 580 in the first axial direction (Z-axis direction).
[0180] The sensor shift actuator according to embodiments of the present disclosure and the camera module including the sensor shift actuator can precisely adjust the focus and correct shake with relatively small driving force.
[0181] One aspect of this disclosure provides a sensor shift actuator capable of precisely performing focus adjustment and shake correction, and a camera module including the sensor shift actuator.
[0182] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.
Claims
1. A sensor displacement actuator, comprising: The shell has an internal space; An image sensor is housed within the housing and has an imaging surface; A first movable frame is housed within the housing and configured to move together with the image sensor in a direction parallel to the imaging surface; A second movable frame is housed within the housing and houses the first movable frame, and is configured to move together with the image sensor and the first movable frame in a direction perpendicular to the imaging surface; The bridge portion is configured such that at least a portion of it is bent and supports the movement of the image sensor in a direction parallel to the imaging surface; as well as Multiple spherical components are disposed between the second movable frame and the housing, and configured to support further movement of the image sensor in a direction perpendicular to the imaging surface.
2. The sensor shifting actuator according to claim 1, wherein, The sensor substrate disposed on one side of the image sensor includes: The first movable part is connected to the first movable frame; The second movable portion is connected to the second movable frame and spaced apart from the first movable portion; and The bridge portion is disposed between the first movable portion and the second movable portion.
3. The sensor shifting actuator according to claim 2, wherein, The first moving portion and the second moving portion are formed of rigid material, and the bridge portion is formed of flexible material.
4. The sensor shift actuator of claim 2, further comprising a connecting substrate configured to support the movement of the image sensor and the first moving frame, and the other movement of the image sensor, the first moving frame, and the second moving frame, and in, One side of the connecting substrate is connected to the sensor substrate, and the other side of the connecting substrate is disposed in the housing.
5. The sensor shifting actuator according to claim 4, wherein, The sensor substrate further includes: A first connecting portion extends from the first movable portion and connects the first movable portion and the bridge portion; and... The second connecting portion extends from the second moving portion and connects the second moving portion and the bridge portion, and One side of the connecting substrate is connected to the first connecting portion.
6. The sensor shifting actuator according to claim 4 further includes a main substrate disposed in the housing. in, The other side of the connecting substrate is connected to the main substrate, and The connecting substrate is configured to surround a portion of the main substrate, while maintaining a gap between the connecting substrate and the main substrate.
7. The sensor shifting actuator according to claim 6, wherein, The connecting substrate includes: The first part is configured to have a gap between itself and the main substrate in a first direction parallel to the imaging surface; The second part is configured to have a gap between itself and the main substrate in a second direction parallel to the imaging surface and perpendicular to the first direction; and The third part is configured to have a gap between itself and the main substrate in a third direction perpendicular to the imaging surface, and The first part is connected to the housing, and the third part is connected to the sensor substrate.
8. The sensor shifting actuator according to claim 7, wherein, The surface of the main substrate includes a clearance groove extending upward through the surface of the third portion in the portion overlapping with the third portion, and A portion of the third part is disposed in the clearance groove.
9. The sensor shifting actuator according to claim 1, further comprising: A first jitter correction magnet and a second jitter correction magnet are disposed on the first movable frame; and A first jitter correction coil and a second jitter correction coil are disposed in the housing so as to face the first jitter correction magnet and the second jitter correction magnet, respectively.
10. The sensor shifting actuator according to claim 1, further comprising: A focus adjustment magnet is disposed on the second movable frame; and A focus adjustment coil is disposed in the housing so as to face the focus adjustment magnet.
11. The sensor shift actuator of claim 10, further comprising a yoke disposed in the housing to face the focal adjustment magnet.
12. Camera module, including: A lens module, comprising at least one lens disposed along the optical axis; Image sensor, having an imaging surface; A reflective component is configured to reflect light toward the image sensor; A sensor shift actuator is configured to move the image sensor relative to the reflective member in a direction parallel to the imaging surface and in a direction perpendicular to the imaging surface. as well as The housing is configured to accommodate the lens module, the image sensor, the reflective member, and the sensor shift actuator. The sensor shift actuator includes: The bridge portion is configured to be at least partially curved and to support movement of the image sensor in a direction parallel to the imaging surface; and Multiple spherical components are configured to support the movement of the image sensor in a direction perpendicular to the imaging surface, while simultaneously rolling in the same direction.
13. The camera module according to claim 12, wherein, The sensor shift actuator also includes: A first movable frame is configured to move together with the image sensor in a direction parallel to the imaging surface; and The second moving frame is configured to move together with the image sensor and the first moving frame in a direction perpendicular to the imaging surface.
14. The camera module according to claim 13, wherein, The sensor shift actuator also includes a sensor substrate disposed on one side of the image sensor, and The sensor substrate includes: The first movable part is connected to the first movable frame; The second movable portion is connected to the second movable frame and spaced apart from the first movable portion; and The bridge portion is disposed between the first movable portion and the second movable portion.
15. The camera module according to claim 14, wherein, The sensor shift actuator also includes: The main substrate is disposed in the housing; and A connecting substrate, one side of which is connected to the sensor substrate and the other side of which is connected to the main substrate. The connecting substrate is configured to have a gap with the main substrate in at least one of two directions: a direction parallel to the imaging surface and a direction perpendicular to the imaging surface. The connecting substrate is configured such that at least a portion of the connecting substrate bends when the image sensor moves.
16. The camera module according to claim 12, wherein, The reflecting component is a parallelogram-shaped prism.
Citation Information
Patent Citations
Spectrally orthogonal audio component processing
KR1020240060678A