A photovoltaic module and a method of manufacturing a photovoltaic module

Abstract

The application relates to the technical field of photovoltaic modules, in particular to a photovoltaic module and a preparation method thereof. The photovoltaic module comprises a laminated component, the laminated component comprises, from top to bottom, a front glass, a front encapsulation adhesive film, a cell group, a back encapsulation adhesive film and a back glass in sequence, the cell group is formed by a plurality of cell pieces connected in series and is connected in parallel through a bus bar; in the orthographic projection area of the bus bar on the laminated component plane, the thickness of the front encapsulation adhesive film and / or the back encapsulation adhesive film is less than the thickness of the corresponding front encapsulation adhesive film or back encapsulation adhesive film in other areas of the laminated component, so as to form a structure for accommodating the bus bar. The structure can effectively reduce the thickness difference caused by the bus bar during the laminating process, reduce the bending deformation and internal stress concentration of the glass, and thus improve the structural reliability and production yield of the module.

Description

Technical Field

[0001] This application relates to the field of photovoltaic module technology, and in particular to a photovoltaic module and a method for preparing the photovoltaic module. Background Technology

[0002] With the rapid development of solar photovoltaic technology, the requirements for the output power and long-term reliability of photovoltaic modules are increasing, making the optimized design of the internal structure one of the key technical challenges. Double-glass modules, with their high reliability and long lifespan, are widely used in the market. These modules typically employ a symmetrical laminated structure of "glass-encapsulant-cell-encapsulant-glass," with the cells electrically connected via busbars.

[0003] During the component lamination process, the various layers of material are melted and pressed together under high temperature and pressure. However, because the busbar itself has a certain thickness, its overall structural thickness within the planar projection area of ​​the laminated component is significantly greater than the thickness of the area without the busbar. This thickness difference will cause uneven deformation of the front and back glass during lamination, resulting in stress concentration within the glass in the area corresponding to the busbar.

[0004] Therefore, how to achieve effective thickness matching between the busbar area and the surrounding area at the component structure level, thereby suppressing stress concentration in the glass during lamination, has become a pressing technical problem in the current photovoltaic module field. Summary of the Invention

[0005] Therefore, it is necessary to provide a photovoltaic module that can fundamentally balance the thickness difference in structure and reduce the risk of glass breakage, addressing the glass bending and stress concentration problems caused by the difference in interlayer thickness between the busbar area and the short edge area during the lamination process of photovoltaic modules.

[0006] A photovoltaic module includes a laminated component, which, from top to bottom, includes a front glass, a front encapsulating film, a battery pack, a back encapsulating film, and a back glass. The battery pack is composed of multiple battery cells connected in series and connected by a busbar. The front glass and / or the back glass are provided with protruding structures.

[0007] Within the orthographic projection area of ​​the busbar onto the plane of the laminated component, the sum of the thicknesses of the front encapsulating film and the back encapsulating film is less than the sum of the thicknesses of the front encapsulating film and the back encapsulating film in other areas of the laminated component.

[0008] In one embodiment, the busbar has a cross-sectional area of ​​S, a width of W, and a thickness of T, where S = W × T, and 4 mm ≤ W ≤ 10 mm, 0.1 mm ≤ T ≤ 0.3 mm, and 1 mm... 2 ≤S≤3mm2 .

[0009] In one embodiment, within the orthographic projection area of ​​the busbar onto the plane of the laminated component, the sum of the thicknesses of the front encapsulating film and the back encapsulating film is D, where 0 < D ≤ 0.8 mm.

[0010] In one embodiment, the thickness of the protrusion structure is G, where 0 < G < 0.4 mm.

[0011] In one embodiment, the protruding structure is integrally formed with the front glass or the back glass.

[0012] In one embodiment, a buffer member is provided on the short edge region of the laminated component.

[0013] In one embodiment, the buffer component is spaced apart from the busbar.

[0014] In one embodiment, the thickness of the buffer component is equal to the thickness of the busbar.

[0015] In one embodiment, the buffer component is an additional busbar, EVA pad, POE pad, or PVB pad.

[0016] A method for manufacturing a photovoltaic module, the method comprising the following steps:

[0017] S01. A laminated component for a photovoltaic module is provided, wherein the laminated component comprises, from top to bottom, a front glass, a front encapsulating film, a battery pack, a back encapsulating film, and a back glass, wherein the battery pack is composed of multiple battery cells connected in series and connected by a busbar;

[0018] S02. Within the projected area of ​​the busbar, the front sealing film and / or the back sealing film are thinned.

[0019] And / or, a buffer component is provided in the short edge region of the photovoltaic module.

[0020] The aforementioned photovoltaic module, by reducing the thickness of the encapsulating film on the front and / or back sides within the busbar projection area, creates a structure in this area to accommodate the busbar. This effectively reduces the local bulge height caused by the busbar before lamination and significantly reduces the thickness difference between the busbar area and the short edge area during lamination. This structural improvement helps to balance lamination pressure, reduce bending deformation and internal stress concentration of the front and back glass, and ultimately reduce the risk of module glass cracking during lamination and use, improving the structural reliability and production yield of the module. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a photovoltaic module before lamination in the prior art.

[0022] Figure 2 This is a schematic diagram of the structure of a laminated photovoltaic module in the prior art.

[0023] Figure 3 This is a magnified view of a local structure of a laminated photovoltaic module in the prior art.

[0024] Figure 4 This is a magnified view of a local structure of a photovoltaic module before lamination in the prior art.

[0025] Figure 5 This is a partial structural diagram of the photovoltaic module before lamination, as provided in the first embodiment of this application.

[0026] Figure 6 This is a partial structural diagram of the photovoltaic module before lamination, provided in the second embodiment of this application.

[0027] Figure 7 This is a partial structural diagram of the photovoltaic module before lamination, provided in the third embodiment of this application.

[0028] Figure 8 This is a partial structural diagram of the photovoltaic module before lamination, provided in the fourth embodiment of this application.

[0029] Figure 9 This is a schematic diagram of the structure of the front or back glass in a laminated component in the prior art.

[0030] Figure 10 This is a partial structural diagram of the photovoltaic module before lamination, provided in the fifth embodiment of this application.

[0031] Figure 11 This is a structural schematic diagram of the front or back glass in the laminated component in the fifth embodiment of this application.

[0032] Figure 12 This is a flowchart illustrating a method for preparing a photovoltaic module according to an embodiment of this application.

[0033] The reference numerals in the detailed embodiments are as follows:

[0034] 100. Laminated components;

[0035] 10. Front glass; 20. Front sealing film; 30. Battery pack; 40. Rear sealing film; 50. Rear glass; 60. Busbar; 70. Short edge area;

[0036] 81. Additional busbar; 82. EVA pad; 83. Raised structure. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] See Figure 1 and Figure 4 , Figure 1 and Figure 4 This is a schematic diagram of the structure of a photovoltaic module before lamination in the prior art. The photovoltaic module in the prior art, from top to bottom, includes a front glass 10, a front encapsulating film 20, a cell pack 30, a back encapsulating film 40, and a back glass 50. The cell pack 30 is composed of multiple cells connected in series and connected by a busbar 60. Because the short edge region 70 does not have a busbar 60, there is a gap between the front encapsulating film 20 and the back encapsulating film 40 in this region.

[0044] Continue reading Figure 2 and Figure 3 , Figure 2 and Figure 3 This is a schematic diagram of the structure of a laminated photovoltaic module in the prior art. In the conventional lamination process, the materials of each layer of the photovoltaic module are melted and pressed together under high temperature and high pressure. Since the busbar 60 itself has a certain thickness, the overall structural thickness in its orthographic projection area on the plane is significantly greater than the thickness in the area without the busbar 60. Specifically, the total thickness in this area is formed by the superposition of the front encapsulating film 20, the busbar 60, and the back encapsulating film 40; while in the short edge area 70, since there is no busbar 60, the overall thickness is only composed of the front encapsulating film 20 and the back encapsulating film 40, and is therefore relatively thin. This thickness difference will lead to uneven pressure distribution during the lamination process, thereby causing the glass to bend and deform at the corresponding position of the busbar 60.

[0045] To address the problems existing in the prior art, this application provides a photovoltaic module, combining... Figure 5 The photovoltaic module includes a laminated component 100, which, from top to bottom, comprises a front glass 10, a front encapsulating film 20, a cell pack 30, a back encapsulating film 40, and a back glass 50. The cell pack 30 is composed of multiple cells connected in series and connected by a busbar 60. Within the orthographic projection area of ​​the busbar 60 onto the plane of the laminated component 100, the sum of the thicknesses of the front encapsulating film 20 and the back encapsulating film 40 is less than the sum of the thicknesses of the front encapsulating film 20 and the back encapsulating film 40 in other areas of the laminated component 100.

[0046] To compensate for the localized protrusions introduced by the busbar 60, this application thins the front and back encapsulating films 40 within its orthographic projection area, making the sum of the film thicknesses in this area less than in other areas, thereby effectively balancing the thickness differences before lamination. This thinning process significantly reduces the bending deformation of the glass at the busbar 60 after lamination and the resulting internal stress concentration, improving both the lamination quality of the module and its mechanical reliability and durability during transportation, installation, and long-term use, thus optimizing the structural performance and production yield of the photovoltaic module.

[0047] According to some embodiments of this application, the cross-sectional area of ​​the busbar 60 is S, the width is W, and the thickness is T, where S = W × T, and 4mm ≤ W ≤ 10mm, 0.1mm ≤ T ≤ 0.3mm, and 1mm... 2 ≤S≤3mm 2 While conventional busbar 60 designs (e.g., 4mm width and 0.3mm thickness) can meet basic conductivity requirements, their relatively thick dimensions can cause significant glass bending stress during lamination. To address this structural contradiction, this application can also synergistically optimize the dimensions of the busbar 60, thereby suppressing glass bending deformation during lamination.

[0048] Specifically, see Figure 6 In this embodiment, the busbar 60 has a width of 6 mm and a thickness of 0.2 mm. This dimensional evolution from 4×0.3 mm to 6×0.2 mm is key to achieving synergistic optimization. First, increasing the width from 4 mm to 6 mm significantly increases the welding contact area between the busbar 60 and the main grid lines of the solar cells. This increase directly reduces the series resistance of the cell string and reduces ohmic losses during current transmission, thereby effectively improving the current collection capability and final output power of the module. Second, reducing the thickness from 0.3 mm to 0.2 mm is a structural improvement directly addressing lamination stress. The reduction in the thickness of the busbar 60 directly reduces the local bulge height it causes in the laminated component 100. Although the dimensions of the busbar 60 have been optimized, the cross-sectional area S remains at 1.2 mm².2 This design ensures that despite the reduced thickness, the current-carrying capacity remains fully guaranteed, avoiding the overheating risk that might arise from size optimization. Therefore, this "widened and thinned" busbar design meets the requirements for high structural reliability and is one of the effective means to achieve high-performance, long-life photovoltaic modules.

[0049] It should be noted that the busbar 60 with a width of 6mm and a thickness of 0.2mm is only a preferred embodiment within the aforementioned parameter range, and not the only option. The aforementioned size range (4mm≤W≤10mm, 0.1mm≤T≤0.3mm) itself provides flexible design space to achieve optimization goals with different focuses. For example, in scenarios pursuing higher flexibility to adapt to flexible components or specific form factor designs, a busbar 60 with a narrower width (e.g., 7mm) and thinner thickness (e.g., 0.15mm) can be used to further reduce its rigidity and impact on structural stress while ensuring a sufficient cross-sectional area (S=1.05mm²). Conversely, if the component design prioritizes internal resistance loss, a busbar 60 with a larger width (e.g., 8mm) and appropriate thickness (e.g., 0.25mm) can be selected to obtain a larger contact area and current carrying capacity (S=2.0mm²). Therefore, this application, by defining a broad parameter range, allows the busbar 60 size to be flexibly adapted according to specific component power, structural requirements, and manufacturing processes.

[0050] In one embodiment, within the orthographic projection area of ​​the busbar 60 on the plane of the laminate 100, the sum of the thicknesses of the front encapsulating film 20 and the back encapsulating film 40 is D, where 0 < D ≤ 0.8 mm. Controlling the total film thickness D within this range ensures that the busbar 60 can be fully and securely encapsulated, while minimizing the additional height caused by excessive film thickness in this area, thereby precisely reducing the total thickness difference between it and the short edge region 70. From an encapsulation reliability perspective, a thickness D greater than zero ensures that sufficient adhesive material can completely encapsulate the busbar 60 after melting, forming reliable electrical insulation and a good adhesive interface, avoiding the risk of encapsulation failure or corrosion of the busbar 60 due to excessively thin film. Setting the upper limit to 0.8 mm ensures that even with the thickness of the busbar 60 itself (e.g., 0.2 mm), the total protrusion height in this area is limited to a low level, allowing pressure to be effectively transmitted to adjacent areas during lamination, significantly suppressing glass bending deformation.

[0051] Furthermore, within the orthographic projection area of ​​the busbar 60 on the plane of the laminated component 100, the widths of the front encapsulating film 20 and the back encapsulating film 40 can be equal to the width of the busbar 60. Precisely controlling the width of the film within the orthographic projection area of ​​the busbar 60 to match the width of the busbar 60 avoids adverse effects caused by the film being too large or too small in this area. If the film width is significantly greater than the width of the busbar 60, the excess film may flow excessively to both sides after lamination and melting, causing film accumulation or creating unnecessary thickness gradients, thus introducing new non-uniformity. If the film width is less than the width of the busbar 60, it may result in partial exposure or incomplete encapsulation of the busbar 60, affecting insulation reliability and long-term weather resistance.

[0052] Therefore, setting the width of the adhesive film to be equal to the width of the busbar 60 ensures that the adhesive film material precisely covers and wraps the busbar 60, achieving optimal matching between the melt flow of the adhesive film and the embedding depth of the busbar 60 during lamination. This precise width correspondence helps to form a uniform encapsulation interface, improves the degree of lamination integration, and also facilitates a smoother thickness transition in the busbar 60 area, further enhancing the overall structural stability and stress resistance of the module.

[0053] See Figure 9 , Figure 9 This is a schematic diagram of the structure of the front glass 10 or the back glass 50 in the laminated component 100 of the prior art. The prior art uses glass of uniform thickness. While this uniform thickness design is relatively simple in glass manufacturing, it leads to significant structural matching problems during the lamination process of photovoltaic modules. Because the area containing the busbar 60 is locally thickened due to the inclusion of the busbar 60, while the short edge region 70 is only the thickness of the two layers of glass and two layers of encapsulant film, a significant height difference is formed between the two. This abrupt thickness change will lead to severely uneven lamination pressure distribution under the high temperature and high pressure environment of lamination.

[0054] Specifically, during the lamination process, pressure preferentially acts on the raised busbar area 60, while the shorter edge area 70, being relatively lower, cannot be fully compacted. This uneven pressure distribution not only easily generates bending stress within the glass corresponding to the busbar 60, leading to microcracks, but also causes insufficient encapsulation of the short edge area 70, resulting in defects such as bubbles or delamination. This stress concentration caused by thickness differences significantly reduces the structural reliability of the module. More seriously, the initial stress introduced by the lamination process remains in the finished module, becoming a potential source of failure during subsequent transportation, installation, and outdoor operation. When encountering external stresses such as wind pressure or thermal expansion and contraction, these initially defective areas are highly susceptible to crack propagation, ultimately leading to glass breakage or performance degradation, directly affecting the lifespan and power generation efficiency of the photovoltaic module. Therefore, this simple equal-thickness glass design in existing technologies has become one of the technical bottlenecks restricting the improvement of the reliability and yield of double-glass modules.

[0055] According to some embodiments of this application, a buffer member is provided in the short edge region 70 of the laminating component 100. This buffer member is designed to fill the gap between the upper and lower adhesive films in the short edge region 70 where the busbar 60 is absent, thereby making the thickness transition between the short edge region 70 and the area where the busbar 60 is located smoother during lamination. By providing the buffer member, the pressure applied during lamination can be evenly distributed over a larger area, avoiding excessive pressure concentration at the location corresponding to the busbar 60, thereby further suppressing the bending deformation of the glass.

[0056] See Figure 10 In one embodiment, a raised structure 83 is provided on the front glass 10 and / or the back glass 50. Preferably, see [reference needed]. Figure 11 The protruding structure 83 is integrally formed with the front glass 10 or the back glass 50. The protruding structure 83 is integrally formed with the glass substrate through processes such as molding or cold working, thereby creating a permanently thickened area with precise height and contour in the short edge region 70 of the glass. This integrated design avoids interface compatibility problems that may arise from introducing additional materials. From a mechanical perspective, the protruding structure 83 acts as a rigid support during the lamination process, effectively increasing the compressive strength of the short edge region 70, allowing the lamination pressure to be transmitted more evenly from the busbar 60 region to the short edge region 70.

[0057] Specifically, the height of the raised structure 83 is precisely designed to match the thickness of the busbar 60, ensuring that the thickness difference of the component in different areas is controlled within an optimal range before lamination. When the component enters the lamination process, this design ensures that the encapsulating film can achieve more uniform flow and filling behavior after being heated and melted, avoiding local accumulation or loss of the encapsulating film due to abrupt thickness changes. At the same time, the raised structure 83 provides additional support area for the glass, reducing the bending moment generated by the glass in the thickness transition zone during lamination, thereby effectively suppressing the generation of microcracks.

[0058] Furthermore, this protruding structure 83, integrally molded with the glass, exhibits excellent environmental stability, and its mechanical properties do not degrade due to environmental factors such as UV aging and damp heat cycling. This not only improves the molding quality of the module during the lamination process, but more importantly, it provides durable mechanical protection for the module during subsequent transportation, installation, and decades of outdoor use, fundamentally enhancing the photovoltaic module's ability to resist external stress. It is an innovative and effective structural solution for achieving highly reliable double-glass modules.

[0059] According to some embodiments of this application, the thickness of the protrusion structure 83 is G, where 0 < G < 0.4 mm. Preferably, the thickness G of the protrusion structure 83 satisfies 0.1 mm ≤ G ≤ 0.3 mm. By controlling the thickness G of the protrusion structure 83 within this preferred range, a more precise match can be achieved with the thickness of the busbar 60. This provides just the right amount of support in the short edge region 70 during lamination, effectively balancing the thickness difference between the protrusion and the busbar 60 region, and promoting uniform pressure distribution. On the other hand, this thickness range also takes into account the process feasibility of integral glass molding, which is conducive to stable production and avoids insufficient support due to excessively thin protrusions or the introduction of new stress concentration risks due to excessively thick protrusions.

[0060] According to some embodiments of this application, the buffer component and the busbar 60 are spaced apart. By reasonably controlling the distance between them, a smooth thickness transition zone can be constructed between the busbar 60 area and the component edge, thereby effectively promoting the uniform distribution of external pressure during lamination and avoiding stress concentration in local areas. At the same time, the buffer component disposed in the short edge area 70 and the busbar 60 area form a mechanically cooperative support system, jointly bearing the lamination pressure and ensuring a more balanced overall stress on the lamination interface.

[0061] In one embodiment, the thickness of the buffer component is equal to the thickness of the busbar 60. By precisely matching the thickness of the buffer component to the thickness of the busbar 60, a support plane can be constructed in the short-side edge region 70 of the component that is exactly the same height as the busbar 60 region. This ensures that the total thickness of the laminated component 100 remains highly consistent throughout the entire region from the busbar 60 to the edge of the component before lamination, thereby fundamentally eliminating the problem of uneven pressure distribution caused by initial height differences.

[0062] See Figure 7 In one embodiment, the buffer component is an additional busbar 81. This additional busbar 81 is made of the same material as the busbar 60 used for current feeding, which not only simplifies material management but, more importantly, ensures that its coefficient of thermal expansion is highly compatible with the main component structure. During lamination, the additional busbar 81 provides stable and reliable mechanical support, and its good thermal conductivity also helps to evenly distribute heat in the short-side edge region 70, avoiding excessive local temperature differences that could generate thermal stress.

[0063] See Figure 8 In one embodiment, the cushioning component is an EVA pad 82. As a polymer of the same material as the encapsulation body, the EVA pad 82 melts and diffuses with the adjacent encapsulation film simultaneously at the high lamination temperature, ultimately forming a seamless, highly cohesive whole. This material homogeneity completely eliminates the compatibility risks that may exist at the interfaces of different materials, achieving an optimal combination of the cushioning structure and the encapsulation system, thereby obtaining an extremely stable lamination interface and long-term aging resistance.

[0064] Alternatively, the cushioning component can also be a POE pad or a PVB pad. POE material is renowned for its excellent PID resistance and superior hydrolysis resistance. Using POE pads provides mechanical cushioning and is particularly suitable for high-end modules with stringent weather resistance requirements, offering additional environmental protection for module edges. PVB pads, on the other hand, contribute stronger structural support and impact resistance due to their high bond strength and excellent mechanical properties, which is significant for applications facing potentially greater mechanical loads. This versatility in material selection allows this application to flexibly adapt to different module design goals, reliability levels, and cost control requirements.

[0065] See Figure 12 This application also provides a method for preparing a photovoltaic module, the method comprising the following steps:

[0066] S01. A laminated component 100 for photovoltaic modules is provided. The laminated component 100 includes, from top to bottom, a front glass 10, a front encapsulating film 20, a battery pack 30, a back encapsulating film 40, and a back glass 50. The battery pack 30 is composed of multiple battery cells connected in series and is connected by a busbar 60.

[0067] S02. Within the projected area of ​​the busbar 60, the front encapsulation film 20 and / or the back encapsulation film 40 are thinned.

[0068] And / or, a buffer component is provided in the short edge region 70 of the photovoltaic module.

[0069] The core of the above preparation method lies in optimizing the thickness configuration of the laminated component 100 before lamination through process control. In step S02, the film in the projected area of ​​the busbar 60 is thinned, which can be achieved through precision cutting, pre-embossing, or using a special film with a specific thickness distribution. This key process operation directly reduces the initial thickness of this area before lamination, effectively narrowing the thickness gradient between it and the short-edge region 70 without the busbar 60. Simultaneously, a buffer component can be selectively placed in the short-edge region 70. This component can be an EVA, POE, or PVB pad with good compatibility with the encapsulating film, or an additional busbar 81 with the same thickness as the busbar 60. The introduction of the buffer component is not a simple physical filling; its core function is to construct a smooth thickness transition zone from the busbar 60 area to the component edge. This design allows pressure to be transmitted more evenly to the short-edge region 70 of the component during lamination, avoiding stress concentration points at the thickness abrupt interface, thereby effectively suppressing the generation and propagation of glass microcracks.

[0070] This fabrication method achieves active control over the thickness distribution of the lamination interface through a synergistic process design of "local thinning" and "edge reinforcement." This control not only improves the uniformity of pressure distribution during lamination and reduces the amount of glass bending deformation, but more importantly, it optimizes the stress field distribution inside the module, significantly improving the structural integrity and long-term reliability of the module under harsh environments. This provides a practical and feasible process path for the fabrication of high-performance, long-life photovoltaic modules.

[0071] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photovoltaic module, characterized by, The photovoltaic module comprises a laminated component, which comprises, from top to bottom, a front glass, a front encapsulating adhesive film, a cell group, a back encapsulating adhesive film and a back glass, the cell group is formed by connecting a plurality of cell pieces in series and is connected by a bus bar, and the front glass and / or the back glass is provided with a convex structure; In the area of the bus bar projected on the plane of the laminated component, the sum of the thicknesses of the front encapsulating adhesive film and the back encapsulating adhesive film is less than the sum of the thicknesses of the front encapsulating adhesive film and the back encapsulating adhesive film in other areas of the laminated component.

2. The photovoltaic module of claim 1, wherein, The cross-sectional area of the bus bar is S, the width is W, the thickness is T, S = W x T, and 4 mm ≤ W ≤ 10 mm, 0.1 mm ≤ T ≤ 0.3 mm, 1 mm 2 ≤ S ≤ 3 mm 2 .

3. The photovoltaic module of claim 1, wherein, In the area of the bus bar projected on the plane of the laminated component, the sum of the thicknesses of the front encapsulating adhesive film and the back encapsulating adhesive film is D, and 0 4. The photovoltaic module of claim 1, wherein, The thickness of the convex structure is G, and 0 5. The photovoltaic module of claim 1, wherein, The convex structure is integrally formed with the front glass or the back glass.

6. The photovoltaic module of claim 1, wherein, The laminated component is provided with a buffer component at the short edge area.

7. The photovoltaic module of claim 6, wherein, The buffer component is arranged in a spaced manner with the bus bar.

8. The photovoltaic module of claim 7, wherein, The thickness of the buffer component is equal to the thickness of the bus bar.

9. The photovoltaic module of claim 8, wherein, The buffer component is an additional bus bar, an EVA pad strip, a POE pad strip or a PVB pad strip.

10. A method of making a photovoltaic module, characterized by, The method comprises the following steps: S01, providing a laminated component of a photovoltaic module, which comprises, from top to bottom, a front glass, a front encapsulating adhesive film, a cell group, a back encapsulating adhesive film and a back glass, the cell group is formed by connecting a plurality of cell pieces in series and is connected by a bus bar; S02, performing thinning treatment on the front encapsulating adhesive film and / or the back encapsulating adhesive film in the area of the bus bar projected on the plane of the laminated component; And / or, a buffer component is arranged at the short edge area of the photovoltaic module.

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