Mounting device, tape stripping device, substrate transfer device, tape stripping method, and substrate transfer method

Abstract

A substrate transfer apparatus (100) includes a tape peeling mechanism (RM) for peeling a first adhesive tape (T1) adhered to a wafer (W). The tape peeling mechanism (RM) is configured so that the peeling angle (alpha) at the beginning of peeling and at the end of peeling can be different. Specifically, the tape peeling mechanism (RM) has a heat sealer (RM5) for pressing and heating a peeling tape (PT) in contact with a first adhesive tape (T1) on the first adhesive tape (T1), and a peeling tape recovery roller (RM2) for recovering the peeling tape (PT). The peeling tape (PT) is welded to the first adhesive tape (T1) by heating of the heat sealer (RM5), and the first adhesive tape (T1) is pulled by the peeling tape (PT) recovered by the peeling tape recovery roller (RM2) and peeled from the wafer (W).

Description

Technical Field

[0001] This invention relates to an installation device, a tape peeling device, a substrate transfer device, a tape peeling method, and a substrate transfer method. Background Technology

[0002] Devices having a mechanism for peeling adhesive tape from semiconductor wafers are known (see Patent Document 1).

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] Patent Document 1: Japanese Patent No. 6695173 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] The mechanism is configured such that, with the adhesive tape being adhered to the non-adhesive surface of the adhesive tape bonded to the semiconductor wafer, and with the lower surface (horizontal plane) of the blade-shaped peeling member facing the non-adhesive surface of the adhesive tape, the peeling force, which acts as a force for peeling the adhesive tape from the semiconductor wafer, can be activated by winding the peeling tape along the top surface (sloping plane) of the peeling member.

[0008] However, since the mechanism can only exert peeling force in the direction along the top surface (sloping surface) of the peeling component, when peeling the adhesive tape off the semiconductor wafer, there may be unintended force waves that affect the semiconductor wafer and cause damage to the semiconductor wafer.

[0009] Therefore, it is desirable to provide a device that can suppress substrate damage when peeling adhesive tape from a substrate such as a semiconductor wafer.

[0010] [Technical means to solve the problem]

[0011] The mounting device of the present invention is used to attach adhesive tape to an annular frame and a substrate, or to separate the annular frame and the substrate from the adhesive tape. It has a tape peeling mechanism to peel off the adhesive tape attached to the substrate, and the tape peeling mechanism is configured to make the peeling angle different at the beginning of peeling and at the end of peeling.

[0012] [The effects of the invention]

[0013] This mounting device can suppress substrate damage when peeling off adhesive tape from the substrate. Attached Figure Description

[0014] Figure 1 This is a diagram showing an example of the structure of a substrate transfer apparatus.

[0015] Figure 2 This is a diagram showing an example of an installation frame structure.

[0016] Figure 3 This is a front view of the wafer separation mechanism.

[0017] Figure 4 This is a front view of a part of the tape application mechanism.

[0018] Figure 5 This is a right-side view of another part of the tape-applying mechanism.

[0019] Figure 6 This is the right-side view of the third robot.

[0020] Figure 7 This is a flowchart illustrating an example of a substrate transfer method.

[0021] Figure 8 This is a schematic diagram showing the state of the mounting frame in each step of the substrate transfer method.

[0022] Figure 9 This is a schematic diagram of a portion of a substrate transfer apparatus operating in the first step of a substrate transfer method.

[0023] Figure 10 This is a schematic diagram of a portion of a substrate transfer apparatus operating in the second step of a substrate transfer method.

[0024] Figure 11 This is a schematic diagram of a portion of the substrate transfer apparatus operating in the third step of the substrate transfer method.

[0025] Figure 12 This is a schematic diagram of a portion of the substrate transfer apparatus operating in the fourth step of the substrate transfer method.

[0026] Figure 13 This is a schematic diagram of a portion of the substrate transfer apparatus operating in the fifth step of the substrate transfer method.

[0027] Figure 14 This is a schematic diagram of a portion of the substrate transfer apparatus operating in the sixth step of the substrate transfer method.

[0028] Figure 15 This is a schematic diagram of a portion of the substrate transfer apparatus operating in the 8th step of the substrate transfer method.

[0029] Figure 16 This diagram illustrates the operation of the tape peeling mechanism in step 8.

[0030] Figure 17 This diagram illustrates the operation of the tape peeling mechanism in step 8.

[0031] Figure 18 This diagram illustrates the operation of the tape peeling mechanism in step 8.

[0032] Figure 19 This is a diagram showing an example of the structure of the mounting device.

[0033] Figure 20 This is a diagram showing another structural example of the mounting device. Detailed Implementation

[0034] Hereinafter, the substrate transfer apparatus 100 according to an embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a diagram illustrating an example of the structure of the substrate transfer apparatus 100. More specifically, Figure 1 The image above is a top view (plan view) of the substrate transfer apparatus 100. Figure 1 The image below is a front view of the substrate transfer apparatus 100.

[0035] exist Figure 1 In this system, X1 represents one direction of the X-axis constituting the three-dimensional Cartesian coordinate system, and X2 represents the other direction of the X-axis. Similarly, Y1 represents one direction of the Y-axis constituting the three-dimensional Cartesian coordinate system, and Y2 represents the other direction of the Y-axis. Likewise, Z1 represents one direction of the Z-axis constituting the three-dimensional Cartesian coordinate system, and Z2 represents the other direction of the Z-axis. Figure 1 In the figures, the X1 side of the substrate transfer apparatus 100 corresponds to the front side (front face side) of the substrate transfer apparatus 100, and the X2 side of the substrate transfer apparatus 100 corresponds to the rear side (back face side) of the substrate transfer apparatus 100. Additionally, the Y1 side of the substrate transfer apparatus 100 corresponds to the left side of the substrate transfer apparatus 100, and the Y2 side of the substrate transfer apparatus 100 corresponds to the right side of the substrate transfer apparatus 100. Furthermore, the Z1 side of the substrate transfer apparatus 100 corresponds to the upper side of the substrate transfer apparatus 100, and the Z2 side of the substrate transfer apparatus 100 corresponds to the lower side of the substrate transfer apparatus 100. Other components in the other figures are similarly represented. Additionally, in... Figure 1 In the above figure, for clarity, the top cover plate covering the upper surface of the substrate transfer device 100 is omitted.

[0036] The substrate transfer apparatus 100 is configured to transfer a substrate from one mounting frame MF to another mounting frame MF. The mounting frame MF is a component used in various apparatuses when processing substrates such as semiconductor wafers, and it includes the substrate. Specifically, such as... Figure 2 As shown, the mounting frame MF comprises an annular frame F, adhesive tape T, and a wafer W, which serves as a semiconductor wafer. Figure 2 This is a diagram illustrating an example of the configuration of the mounting frame MF. The wafer W is a circular plate-shaped semiconductor wafer with a central axis WX, which is attached to the central portion of an adhesive tape T attached to one side of the annular frame F, and is supported on the inside of the annular frame F by the adhesive tape T.

[0037] The mounting frame MF processed by the substrate transfer apparatus 100 includes a first mounting frame MF1 and a second mounting frame MF2. Specifically, the substrate transfer apparatus 100 is configured to transfer the wafer W from the first mounting frame MF1 to the second mounting frame MF2. Therefore, the wafer W in the second mounting frame MF2 is the same wafer W in the first mounting frame MF1. In other words, the first mounting frame MF1 is the input (material) to the substrate transfer apparatus 100, and the second mounting frame MF2 is the output (product) from the substrate transfer apparatus 100.

[0038] Figure 2 The image above is a perspective view of the first mounting frame, MF1. Figure 2 In the image above, for clarity, a rough dot pattern is added to the adhesive tape T (the first adhesive tape T1). Figure 2 The middle image is a cross-sectional view of the first mounting frame MF1. Specifically, Figure 2 The middle diagram shows the view from the X1 side and includes Figure 2 The cross-section of the annular frame F (first annular frame F1), adhesive tape T (first adhesive tape T1), and wafer W in the virtual plane perpendicular to the XY plane, including the cut line CL1 in the figure above. Figure 2 The image below is a cross-sectional view of the second mounting frame MF2, corresponding to... Figure 2 The Chinese image. Figure 2 In the middle and lower figures, for clarity, the cross-sections of the wafer W and the ring frames F (first ring frame F1 and second ring frame F2) are shown without fill (white). Additionally, in Figure 2 In the diagram, for clarity, the cross-section of the first adhesive tape T1 is represented by a diagonal line. Figure 2 In the figure below, for clarity, the cross-section of the adhesive tape T (second adhesive tape T2) is represented by a dotted pattern. The same applies when showing the side surfaces of the wafer W, the first adhesive tape T1, the second adhesive tape T2, and the annular frame F. That is, in Figure 8 , Figures 10-14 , Figure 16 and Figure 17 In the diagram, the sides of the wafer W, the first adhesive tape T1, the second adhesive tape T2, and the annular frame F are represented as unfilled (white), diagonal line pattern, dot pattern, and unfilled (white), respectively.

[0039] Specifically, the first mounting frame MF1, such as Figure 2 As shown in the upper and middle figures, the device includes a first annular frame F1, a first adhesive tape T1, and a wafer W. In the first mounting frame MF1, the wafer W is adhered to the first adhesive tape T1 attached to the lower surface of the first annular frame F1, and is supported inside the first annular frame F1 by the first adhesive tape T1. The second mounting frame MF2 is as follows... Figure 2 As shown in the figure below, it includes a second annular frame F2, a second adhesive tape T2, and a wafer W. In the second mounting frame MF2, the wafer W is adhered to the second adhesive tape T2, which is attached to the upper surface of the second annular frame F2, and is supported inside the second annular frame F2 by the second adhesive tape T2. In the example shown, the first adhesive tape T1 is adhered to the main surface of the wafer W, while the second adhesive tape T2 is adhered to the back surface of the wafer W. Furthermore, the main surface of the wafer W is the side on which circuit patterns are formed, and is also called the "holding surface" as it holds the circuit patterns, while the back surface of the wafer W is the side opposite to the main surface and is also called the "non-holding surface."

[0040] Furthermore, in the example shown, the second adhesive tape T2 is a different adhesive tape from the first adhesive tape T1, and the second annular frame F2 is a different annular frame from the first annular frame F1. However, the second annular frame F2 can also be the first annular frame F1. That is, the first annular frame F1 can be separated from the first adhesive tape T1 and reused, then pasted onto the second adhesive tape T2.

[0041] In addition, in the example shown, to make the wafer W rigid, the first adhesive tape T1 and the second adhesive tape T2 are formed using PET (polyethylene terephthalate) as the main raw material. Other known materials besides PET can also be used. The first annular frame F1 and the second annular frame F2 are formed of stainless steel. Other metals can also be used, or materials other than metals such as synthetic resins can be used.

[0042] Refer again Figure 1 Substrate transfer device 100 Figure 1 As shown in the figure above, it includes a first loader 1, a second loader 2, a wafer separation mechanism 3, an ultraviolet irradiation mechanism 4, a ring frame recovery unit 5, a ring frame supply unit 6, a robot RB, a tape pasting mechanism MT, and a tape peeling mechanism RM.

[0043] The first loader 1 is a device for loading the mounting frame MF into the substrate transfer apparatus 100. The second loader 2 is a device for loading the wafer W (monomeric component) instead of the mounting frame MF into the substrate transfer apparatus 100. That is, the second loader 2 is configured to load the wafer W into the substrate transfer apparatus 100 in a state where it is not supported by the adhesive tape T attached to the annular frame. The substrate transfer apparatus 100 includes the second loader 2, thereby enabling the fabrication of the first mounting frame MF1. Alternatively, either the first loader 1 or the second loader 2 may be omitted.

[0044] The wafer separation mechanism 3 is configured to separate the mounting frame MF into a wafer W and an annular frame F.

[0045] Here, refer to Figure 3 Details of wafer separation mechanism 3 are explained. Figure 3 This is a front view of the wafer separation mechanism 3. In the example shown, the wafer separation mechanism 3 includes a first worktable TBL1, a frame 31, a cleaver lifting drive unit 32, a lifting frame 33, a cleaver rotation drive unit 34, a rotating frame 35, a cleaver unit 36, and a cleaver blade 37. The cleaver lifting drive unit 32 is configured to lift the lifting frame 33 relative to the frame 31. The cleaver rotation drive unit 34 is configured to rotate the rotating frame 35 around a rotation axis 3X. The cleaver unit 36 ​​is configured to be connected to the rotating frame 35 in a manner that allows it to rotate together with the rotating frame 35 around the rotation axis 3X, and has a lifting function that allows the cleaver blade 37 to lift relative to the rotating frame 35. In the example shown, the wafer separation mechanism 3 includes two cleaver units 36 to accommodate wafers W of two different sizes. Alternatively, it may include only one cleaver unit 36, or three or more cleaver units 36. By having multiple cleaver units 36, the wafer separation mechanism 3 can accommodate multiple wafers W of different sizes.

[0046] In addition, the cleaver unit 36 ​​may also be capable of sensing when the cleaver blade 37 comes into contact with an object other than the adhesive tape T, such as the wafer W or foreign objects. This is to prevent damage to the wafer W and the cleaver blade 37.

[0047] Furthermore, the cutting unit 36 ​​may also include a heater for heating the cutting blade 37. The purpose is to extend the life of the cutting blade 37 by making it easier to cut the adhesive tape T using a heated cutting blade 37.

[0048] The ultraviolet irradiation mechanism 4 is configured to easily peel the adhesive tape T from the substrate. In the example shown, the ultraviolet irradiation mechanism 4 hardens the adhesive tape T by irradiating it with ultraviolet light onto the wafer W, thereby making the adhesive tape T easy to peel from the substrate. Specifically, the ultraviolet irradiation mechanism 4 hardens the first adhesive tape T1, which is adhered to the main surface of the wafer W, by irradiating it with ultraviolet light, thereby making the first adhesive tape T1 easy to peel from the wafer W. Additionally, the ultraviolet irradiation mechanism 4 may also include an alignment mechanism for positioning the wafer W when irradiating it with ultraviolet light.

[0049] The annular frame recovery unit 5 is configured to recover the annular frame F separated from the mounting frame MF. In the example shown, the annular frame recovery unit 5 is configured to recover the annular frame F separated from the mounting frame MF by the wafer separation mechanism 3. Specifically, the annular frame recovery unit 5 recovers the first annular frame F1 constituting the first mounting frame MF1 from the wafer separation mechanism 3 (first worktable TBL1) and stacks it in the center of the annular frame recovery unit 5. In addition, the first annular frames F1 stacked by the annular frame recovery unit 5 are typically manually removed from the substrate transfer apparatus 100 when their number reaches a certain level.

[0050] The annular frame providing unit 6 is configured to provide annular frames F one by one. In the example shown, the annular frame providing unit 6 is configured to provide another annular frame F (second annular frame F2) to replace the annular frame F (first annular frame F1) separated from the mounting frame MF by the wafer separation mechanism 3. Specifically, the annular frame providing unit 6 is configured to provide the second annular frames F2 stacked in its central portion one by one to the tape application mechanism MT (second workbench TBL2). In addition, the second annular frames F2 stacked in the central portion of the annular frame providing unit 6 are typically replenished by manual operation.

[0051] The tape application mechanism MT is configured to apply adhesive tape T to the wafer W and the annular frame F. Furthermore, the tape application mechanism MT is configured to cut the adhesive tape T applied to the wafer W and the annular frame F along the annular frame F.

[0052] Here, refer to Figure 4 and Figure 5 Explain the details of the tape application mechanism MT. Figure 4 This is a front view of a part of the tape application mechanism MT. Figure 5 This is a right-side view of another part of the tape application mechanism MT. Specifically, Figure 4 The image above shows the state when the adhesive roller MT5 and the peeling roller MT6 are located at the left end. Figure 4 The diagram below shows the state when the adhesive roller MT5 and the peeling roller MT6 are located at the right end. Additionally, for clarity, Figure 4 The middle part is omitted Figure 5 The diagram shows the second mechanism (cutter lifting drive unit MT11, lifting frame MT12, cutter rotation drive unit MT13, rotation frame unit MT14, and cutter unit MT15) located above the second worktable TBL2. Relatively speaking, Figure 5 The middle part is omitted Figure 4The diagram shows the first mechanism (adhesive roller MT5, peeling roller MT6, tape supply roller MT7, tape take-up roller MT8, protective tape take-up roller MT9, and tape holding unit MT10) located above the second worktable TBL2. However, in reality, the second mechanism partially overlaps with the first mechanism and is positioned slightly higher than the first mechanism.

[0053] In the example shown, the tape application mechanism MT includes a wafer holding part MT1, an annular frame holding part MT2, a positioning unit MT3, a lifting drive part MT4, an application roller MT5, a peeling roller MT6, a tape supply roller MT7, a tape recycling roller MT8, a protective tape recycling roller MT9, a tape holding unit MT10, a cutter lifting drive part MT11, a lifting frame MT12, a cutter rotation drive part MT13, a rotating frame part MT14, and a cutter unit MT15.

[0054] The wafer holding section MT1, the annular frame holding section MT2, the positioning unit MT3, and the lifting drive section MT4 constitute the second worktable TBL2. The adhesive roller MT5, the peeling roller MT6, the tape supply roller MT7, the tape recovery roller MT8, the protective tape recovery roller MT9, and the tape holding unit MT10 constitute the first mechanism. The cutter lifting drive section MT11, the lifting frame MT12, the cutter rotation drive section MT13, the rotation frame section MT14, and the cutter unit MT15 constitute the second mechanism. The first mechanism is configured to adhere the second adhesive tape T2 to the wafer W and the second annular frame F2, and peel off the remaining portion of the second adhesive tape T2. The second mechanism is configured to cut the second adhesive tape T2 adhered to the wafer W and the second annular frame F2, and separate the circular portion and the remaining portion.

[0055] The heights of the wafer holding section MT1 and the annular frame holding section MT2 are configured to be adjustable separately via numerical control. Based on this configuration, the tape application mechanism MT can accommodate cases where the thickness of the wafer W differs from the thickness of the second annular frame F2, and can also accommodate various wafers W with different thicknesses.

[0056] like Figure 5As shown, the cutter lifting drive unit MT11 is configured to lift the lifting frame MT12. The cutter rotation drive unit MT13 is configured to rotate the rotating frame MT14 around the rotation axis MTX. The cutter unit MT15 is connected to the rotating frame MT14 in a manner that allows it to rotate together with the rotating frame MT14 around the rotation axis MTX, and is configured to have a lifting function that allows the cutter blade MT16 to lift relative to the rotating frame MT14. In the example shown, the tape application mechanism MT has two cutter units MT15 to accommodate two different sizes of wafers W. Alternatively, it can be configured to have only one cutter unit MT15, or three or more cutter units MT15. By having multiple cutter units MT15, the tape application mechanism MT can accommodate multiple wafers W of different sizes.

[0057] Robot RB is an example of a transfer device used to move items from one location to another within a substrate transfer apparatus 100. Items may be, for example, wafers W, mounting frames MF, or ring frames F. In the example shown, robot RB is a multi-axis robot for transfer, such as... Figure 1 As shown, it includes a first robot RB1, a second robot RB2, and a third robot RB3. The first robot RB1 is configured to transfer items between the second loader 2, the wafer separation mechanism 3, the ultraviolet irradiation mechanism 4, and the tape application mechanism MT. The second robot RB2 is configured to transfer items between the first loader 1, the wafer separation mechanism 3, and the tape peeling mechanism RM. The third robot RB3 is configured to transfer items between the wafer separation mechanism 3, the annular frame recovery unit 5, the annular frame supply unit 6, the tape application mechanism MT, and the tape peeling mechanism RM.

[0058] Here, refer to Figure 6 Explain the reversing mechanism RV of robot RB. Figure 6 This is the right-side view of the third robot, RB3. Specifically, Figure 6 The image above (shown by double-dotted lines) is the right side view of the third robot, RB3, before it is reversed. Figure 6 The image below (shown as solid lines) is the right side view of the third robot, RB3, after it has been reversed vertically. More specifically, Figure 6 The figure above shows the second mounting frame MF2 held in a state where the first adhesive tape T1 is located on the underside of the wafer W by the adsorption pad SC of the robotic arm RH mounted at the front end of the third robot RB3. Figure 6 The figure below shows the second mounting frame MF2, which is placed on the third worktable TBL3, which is part of the tape peeling mechanism RM, after the adsorption pad SC of the release robot RH is removed and the first adhesive tape T1 is located on the upper side of the wafer W.

[0059] In the example shown, the reversing mechanism RV of the third robot RB3 is configured to allow the manipulator RH to rotate around the rotation axis RX. Furthermore, the manipulator RH can be interchangeable depending on the application. Additionally, the first robot RB1 and the second robot RB2 can have the same reversing mechanism as the third robot RB3. Furthermore, the manipulator RH of the third robot RB3 has an adsorption pad SC for adsorbing the annular frame F, and the manipulator RH of the first robot RB1 can also have an adsorption pad for adsorbing the wafer W. Moreover, the adsorption pad for adsorbing the wafer W can be a known adsorption mechanism such as the vacuum chuck described in US Patent 8,858,756.

[0060] By utilizing the robot RB, the substrate transfer apparatus 100 can achieve complex transfer (including reverse transfer) of items from one position to another in the forward direction, compared to the case of using a conveyor belt or transporter. Furthermore, the substrate transfer apparatus 100 can achieve transfer of items from one position to another in the reverse direction. However, the substrate transfer apparatus 100 can also be configured to utilize a conveyor belt or transporter.

[0061] The tape peeling mechanism RM is configured to peel off the adhesive tape T adhered to the substrate. In the example shown, the tape peeling mechanism RM is configured to peel off the first adhesive tape T1 adhered to the main surface of the wafer W using the peeling tape.

[0062] Next, refer to Figure 7 and Figure 8 This describes a method by which the substrate transfer apparatus 100 transfers wafer W from the first mounting frame MF1 to the second mounting frame MF2 (hereinafter referred to as the "substrate transfer method"). Figure 7 This is a flowchart illustrating an example of a substrate transfer method. Figure 8 This is a schematic diagram showing the state of the mounting frame MF in each step of the substrate transfer method.

[0063] First, the substrate transfer apparatus 100 provides (prepares) the first mounting frame MF1 (first step ST1). Figure 8 The top left figure shows the state of the first mounting frame MF1, which is placed on the first worktable TBL1 of the wafer separation mechanism 3 in the first process ST1.

[0064] Here, refer to Figure 9 The operation details of the substrate transfer device 100 in the first process ST1 are explained. Figure 9 This is a schematic diagram of a portion of the substrate transfer apparatus 100 operating in the first process ST1. Specifically, Figure 9 The left image is a front view of the first loader 1 equipped with the material box MG. Figure 9The right figure is a front view of the first worktable TBL1, which holds a first mounting frame MF1 removed from the material box MG. The material box MG is a container capable of housing multiple first mounting frames MF1 in a stacked state. The first mounting frame MF1, as shown... Figure 2 As shown in the middle image, the first adhesive tape T1 is housed in the cassette MG with its position below the wafer W. Additionally, in Figure 9 For clarity, the first mounting frame MF1 is simplified in the diagram.

[0065] In the first process ST1, the second robot RB2, as... Figure 9 As shown in the left figure, a robotic arm RH is inserted between the topmost first mounting frame MF1 and the second first mounting frame MF1 from the top, which are housed within the material box MG. Then, the second robot RB2 removes one first mounting frame MF1 from the material box MG by lifting the robotic arm RH. Subsequently, the second robot RB2... Figure 9 As shown in the right figure, the removed first mounting frame MF1 is moved onto the first stage TBL1 of the wafer separation mechanism 3. Then, the wafer separation mechanism 3 raises the positioning unit 3U of the first stage TBL1 to receive the first mounting frame MF1. Typically, the positioning unit 3U has four support portions capable of supporting the outer periphery of the first mounting frame MF1, each support portion configured to move radially along the first mounting frame MF1. Upon receiving the first mounting frame MF1, the positioning unit 3U lowers while positioning the first mounting frame MF1 relative to the first stage TBL1, so that the first mounting frame MF1 contacts the support surface of the first stage TBL1. The first stage TBL1 holds the first mounting frame MF1 by adsorbing it with an adsorption pad (not shown).

[0066] Next, the substrate transfer apparatus 100 cuts the first adhesive tape T1 (second step ST2). Figure 8 From the top of the left Figure 2 The image shows the state in which the first mounting frame MF1, the first adhesive tape T1, is cut by the cleaver blade 37 of the wafer separation mechanism 3 in the second process ST2.

[0067] Here, refer to Figure 10 This section describes the operation details of the substrate transfer device 100 in the second process ST2. Figure 10 This is a schematic diagram of a portion of the substrate transfer apparatus 100 operating in the second process ST2. Specifically, Figure 10 The image above is a front view of a portion of the wafer separation mechanism 3 when the first adhesive tape T1 is cut. Figure 10 The image below is a front view of a portion of the wafer separation mechanism 3 after the first adhesive tape T1 has been cut.

[0068] In the second process ST2, the wafer separation mechanism 3 is configured to separate the first mounting frame MF1, which is transferred to the first stage TBL1, into a wafer W and a first annular frame F1. After the first mounting frame MF1 is placed on the first stage TBL1, the wafer separation mechanism 3 proceeds as follows: Figure 10 As shown in the figure above, the first worktable TBL1 is raised by the lifting drive unit 38, and the cutting blade lifting drive unit 32 (see reference) Figure 3 The cutting unit 36 ​​lowers the cutting blade 37 so that it contacts the first adhesive tape T1. In the example shown, in order to suppress or prevent damage to the wafer W, the wafer separation mechanism 3 contacts the first adhesive tape T1 at a position in the radial direction of the wafer W that is a distance from the outer edge of the wafer W greater than the thickness of the wafer W.

[0069] Then, the wafer separation mechanism 3 is driven by the cutter rotation drive unit 34 (see reference). Figure 3 Rotate the frame portion 35 (refer to) Figure 3 The wafer separation mechanism 3 rotates around the rotation axis 3X to cut the first adhesive tape T1 in a circular cutting line manner. After cutting the first adhesive tape T1, the wafer separation mechanism 3 lowers the first worktable TBL1 via the lifting drive unit 38. Figure 10 The figure below shows the state of the first worktable TBL1 after it is lowered.

[0070] Next, the substrate transfer device 100 recovers the first annular frame F1 (third process ST3). Figure 8 From the top of the left Figure 3 The state of the wafer W and the first adhesive tape T1 is shown after the first annular frame F1 is recovered in the third process ST3.

[0071] Here, refer to Figure 11 This section describes the operation details of the substrate transfer device 100 in the third process ST3. Figure 11 This is a schematic diagram of a portion of the substrate transfer apparatus 100 operating in the third process ST3. Specifically, Figure 11 The left image is a front view of a portion of the third robot RB3 transferring the first annular frame F1 to the annular frame recovery unit 5. Figure 11 The right image is a front view of a portion of the first robot RB1 that transfers wafer W onto the second worktable TBL2 of the tape-attaching mechanism MT.

[0072] In step ST3, the third robot RB3 adsorbs the first annular frame F1 using the adsorption pad SC of the robotic arm RH mounted at its front end, and lifts the first annular frame F1 by raising the robotic arm RH. Then, the third robot RB3 transfers the adsorbed first annular frame F1 to the annular frame recycling section 5. An annular outer remaining portion T1C, which is part of the first adhesive tape T1, is attached to the first annular frame F1. The outer remaining portion T1C is the portion of the first adhesive tape T1 that was cut by the cleaver blade 37 of the wafer separation mechanism 3 and recycled (discarded) in step ST3, and has a shape that surrounds the inner circular portion T1M, which is the remaining portion not recycled (discarded) in this stage.

[0073] Then, the first robot RB1 uses the adsorption mechanism of the robotic arm RH mounted at the front end of the first robot RB1 to adsorb the wafer W that has been placed on the first worktable TBL1, and lifts the wafer W by raising the robotic arm RH. Then, the first robot RB1 transfers the adsorbed wafer W to the second worktable TBL2 of the tape application mechanism MT. And, the inner circular portion T1M, which is part of the first adhesive tape T1, is adsorbed on the wafer W.

[0074] Figure 11 The area with double-dotted lines in the right figure represents the state of the first robot RB1, the wafer W, and the first adhesive tape T1 (inner circular part T1M) before the wafer W is placed on the second workbench TBL2.

[0075] Subsequently, the first robot RB1 lowers its robotic arm RH, enabling it to place the wafer W held by the robotic arm RH and the first adhesive tape T1 (inner circular portion T1M) onto the second worktable TBL2. The second worktable TBL2 holds the wafer W and the first adhesive tape T1 (inner circular portion T1M) by adsorbing and attaching them to the inner circular portion T1M of the main surface of the wafer W using an adsorption pad (not shown).

[0076] Then, the substrate transfer apparatus 100 provides (prepares) the second annular frame F2 (the fourth step ST4). Figure 8 The bottom left diagram shows the state of the wafer W and the first adhesive tape T1 (inner circular portion T1M) after the second annular frame F2 is provided in process ST4.

[0077] Here, refer to Figure 12 The operation details of the substrate transfer device 100 in step ST4 are explained. Figure 12 This is a schematic diagram of a portion of the substrate transfer apparatus 100 operating in the fourth process, ST4. Specifically, Figure 12This is a front view of a portion of the third robot RB3 used to transfer the second annular frame F2 from the annular frame supply unit 6 to the tape application mechanism MT on the second workbench TBL2.

[0078] In step ST4, after the third robot RB3 transfers the first annular frame F1 to the annular frame recovery unit 5 via the robotic arm RH, it adsorbs the second annular frame F2 located in the annular frame supply unit 6 via the adsorption pad SC. Then, the third robot RB3 lifts the adsorbed second annular frame F2 and transfers it to the second workbench TBL2.

[0079] The second worktable TBL2 receives the second annular frame F2 via the positioning unit MT3. Upon receiving the second annular frame F2, the positioning unit MT3 positions the second annular frame F2 relative to the annular frame holding part MT2 of the second worktable TBL2, while simultaneously bringing the second annular frame F2 into contact with the support surface of the annular frame holding part MT2. The annular frame holding part MT2 holds the second annular frame F2 by adsorbing it with an adsorption pad (not shown). Furthermore, in the wafer holding part MT1 of the second worktable TBL2, a wafer W is already placed with its inner circular portion T1M covered by the first adhesive tape T1.

[0080] Next, the substrate transfer apparatus 100 applies the second adhesive tape T2 (step 5 ST5). Figure 8 The top right diagram shows the state of the wafer W and the first adhesive tape T1 (inner circular portion T1M) after the second adhesive tape T2 is applied in step ST5.

[0081] Here, refer to Figure 13 This section describes the operation details of the substrate transfer device 100 in step ST5. Figure 13 This is a schematic diagram of a portion of the substrate transfer apparatus 100 operating in process ST5. Specifically, Figure 13 The left image is a front view of a portion of the tape application mechanism MT when the adhesive roller MT5 applies the second adhesive tape T2 to the wafer W and the second annular frame F2. Figure 13 The right image is a front view of a portion of the tape application mechanism MT after the adhesive roller MT5 applies the second adhesive tape T2 to the wafer W and the second annular frame F2.

[0082] In step ST5, the second adhesive tape T2 is as follows: Figure 4 As shown in the figure above, the second worktable TBL2 is in a horizontally stretched state above it. The tape application mechanism MT raises the second worktable TBL2 via the lifting drive MT4, so that the height of the upper surface of the second annular frame F2 and the wafer W is approximately the same as the height of the lower surface of the second adhesive tape T2.

[0083] Then, the tape application mechanism MT, such as Figure 13 The left figure roughly illustrates how the adhesive roller MT5 is guided along the guide GD (see reference). Figure 4 (As shown in the image above) The adhesive roller MT5 moves from left to right while bringing the second adhesive tape T2 against the second annular frame F2 and the wafer W respectively. Thus, the second adhesive tape T2 is adhered to the upper surfaces of both the second annular frame F2 and the wafer W.

[0084] Next, the substrate transfer device 100 cuts the second adhesive tape T2 (step 6 ST6). Figure 8 From the top of the right side Figure 2 The diagram shows the state of the wafer W, the first adhesive tape T1 (inner circular portion T1M), and the second adhesive tape T2 when the cutting blade MT16 for cutting the second adhesive tape T2 is pressed onto the second adhesive tape T2 in step ST6.

[0085] Here, refer to Figure 14 The operation details of the substrate transfer device 100 in step ST6 are explained. Figure 14 This is a schematic diagram of a portion of the substrate transfer apparatus 100 operating in process ST6. Specifically, Figure 14 This is a front view of a part of the tape-adhesive mechanism MT when the cutter blade MT16 cuts the second adhesive tape T2.

[0086] In step ST6, after the tape-applying mechanism MT moves the applicator roller MT5 from left to right, the cutter unit MT15 lowers the cutter blade MT16 so that the tip of the cutter blade MT16 pierces into the second adhesive tape T2, and then presses the tip of the cutter blade MT16 against the second annular frame F2. Then, the tape-applying mechanism MT rotates the rotating frame MT14 360 degrees around the rotating axis MTX via the cutter rotation drive unit MT13. Since the cutter unit MT15 and the cutter blade MT16 are mounted at the front end of the rotating frame MT14, the tape-applying mechanism MT can cut the second adhesive tape T2 along the second annular frame F2, separating the second adhesive tape T2 into an inner circular portion T2M and an outer remaining portion T2C.

[0087] The outer remaining portion T2C is the part of the second adhesive tape T2 that is cut by the cutter blade MT16 and is peeled off (discarded) in the sixth process ST6 stage. It has a shape that surrounds the inner circular portion T2M, which is the remaining portion that is not peeled off (discarded) in this stage.

[0088] After the second adhesive tape T2 is separated into the inner circular portion T2M and the remaining outer portion T2C, the tape application mechanism MT is as follows: Figure 4As shown, the peeling roller MT6 moves from right to left along the guide GD, peeling off the remaining outer portion T2C. The peeled remaining outer portion T2C is then rolled up and recycled by the protective tape recovery roller MT9.

[0089] Subsequently, the substrate transfer device 100 reverses the second mounting frame MF2 (step 7 ST7). Figure 8 From the top of the right side Figure 3 The state of the second mounting frame MF2, which is lifted from the second workbench TBL2 by the third robot RB3 in the seventh step ST7, is shown. The second mounting frame MF2 consists of a wafer W, a second annular frame F2, and a second adhesive tape T2 (inner circular portion T2M). At this stage, the first adhesive tape T1 (inner circular portion T1M) is attached to the main surface of the wafer W.

[0090] In the 7th operation ST7, the 3rd robot RB3, as... Figure 6 As shown in the figure below, the robot arm RH is rotated around the rotation axis RX by the reversing mechanism RV, so that the second mounting frame MF2 is reversed up and down and becomes the inner circular part T1M of the first adhesive tape T1 facing upward. Then, the second mounting frame MF2 is placed on the third worktable TBL3 of the tape peeling mechanism RM.

[0091] Next, the substrate transfer apparatus 100 peels off the first adhesive tape T1 (step 8 ST8). Figure 8 The bottom right diagram shows the state of the second mounting frame MF2 when the inner circular portion T1M of the first adhesive tape T1 is peeled off in step ST8. Figure 8 The second mounting frame MF2, after the inner circular portion T1M in the bottom right diagram is peeled off, is equivalent to the output (product) of the substrate transfer device 100. Figure 2 The structure of the second mounting frame MF2 after it has been reversed in the image below.

[0092] Here, refer to Figures 15-18 This section describes the operation details of the substrate transfer device 100 in step ST8, section 8. Figure 15 This is a front view of the tape peeling mechanism RM. Figure 16 and Figure 17 This is a front view of the removal head RM1, which is part of the tape peeling mechanism RM. Specifically, Figure 16 The five diagrams illustrate the series of operations of the removal head RM1 up to the start of peeling off the first adhesive tape T1, with the series of operations of the removal head RM1 proceeding from the top diagram to the bottom diagram. Additionally, Figure 17The four diagrams are used to illustrate a series of operations of the removal head RM1 after the peeling of the first adhesive tape T1 begins, with the series of operations of the removal head RM1 proceeding from the top diagram to the bottom diagram. Figure 18 It is a slanted view with the head RM1 removed. Specifically, Figure 18 The image above shows the state of the removal head RM1 before the peeling of the first adhesive tape T1 begins. Figure 18 The image below shows the state of the removal head RM1 during the peeling of the first adhesive tape T1.

[0093] The tape peeling mechanism RM is configured to peel off the first adhesive tape T1 adhered to the main surface of the wafer W using a peeling tape PT. In the example shown, the tape peeling mechanism RM is as follows: Figure 15 As shown, it includes a third worktable TBL3, a removal head RM1, a peeling tape recovery roller RM2, a peeling tape supply roller RM3, a slider RM4, a heat sealer RM5, a removal wedge RM6, and driven rollers DR. Driven rollers DR include first driven rollers DR1 to eleventh driven rollers DR11. The third worktable TBL3 includes a positioning unit RM7.

[0094] In step ST8, the third workbench TBL3 positions the second mounting frame MF2 relative to the third workbench TBL3 using the positioning unit RM7. An adsorption pad (not shown) is used to hold the second mounting frame MF2 in place. Additionally, the second mounting frame MF2... Figure 16 As shown, the inner circular portion T1M of the first adhesive tape T1 is adhered to the main surface of the wafer W.

[0095] Subsequently, the tape peeling mechanism RM, as Figure 16 As shown in the top figure, to position the end of the wafer W (the inner circular portion T1M of the first adhesive tape T1) directly below the heating element HT of the heat sealer RM5, the third worktable TBL3 is moved using the slider RM4. At this time, the tape peeling mechanism RM can guide the removal head RM1 along the guide GD (see reference). Figure 15 The movement can also move the removal head RM1 and the third workbench TBL3 simultaneously.

[0096] Then, the tape peeling mechanism RM, as Figure 16 The top Figure 2 As shown, the heat sealer RM5 is lowered, and the heating element HT is used to bring a portion of the peeling tape PT against the end of the inner circular portion T1M. At the same time, the portion of the peeling tape PT is heated so that it is fused to the end of the inner circular portion T1M. Figure 18 The image above shows the state of the removal head RM1 (heat sealer RM5) at this time.

[0097] Next, the tape peeling mechanism RM, as shown... Figure 16 The top Figure 3 As shown, the heat sealer RM5 is raised. Even as the heat sealer RM5 rises, the welded portion WP of the peeling tape PT will not rise with the heat sealer RM5 during this stage because it is welded to the end of the inner circular portion T1M.

[0098] Then, the tape peeling mechanism RM, as Figure 16 The top Figure 4 As shown, to position the welded portion WP directly below the front end of the removal wedge RM6, which serves as an example of a peeling component, the third worktable TBL3 is moved to the left using the slider RM4. At this time, the tape peeling mechanism RM can move along the guide GD (see reference). Figure 15 This allows the removal head RM1 to move, and it can also move the removal head RM1 and the third worktable TBL3 simultaneously.

[0099] Then, the tape peeling mechanism RM, as Figure 16 As shown in the bottom diagram, lower the removal wedge RM6 to press the front end of the removal wedge RM6 against the welded portion WP.

[0100] Then, the tape peeling mechanism RM, as Figure 17 As shown in the top image, the tape recovery roller RM2 is driven to peel off the tape (see reference). Figure 15 ) and peeling tape supply roller RM3 (see reference) Figure 15 This generates a peeling force PF. Additionally, the tape peeling mechanism RM uses slider RM4 to move the third worktable TBL3 to the left.

[0101] At this point, the angle between the line of action of the peeling force PF and the upper surface (horizontal plane) of the wafer W, i.e., the peeling angle α, is α1, and the first adhesive tape T1 (the inner circular portion T1M) begins to peel off from the upper surface of the wafer W. Furthermore, the peeling angle α is a different angle from the wedge angle, which is the angle at the tip of the removal wedge RM6; typically, it is greater than the wedge angle. Figure 18 The diagram below shows the same state as when head RM1 (wedge RM6) was removed. Strictly speaking, Figure 18 The figure below shows the state as the process of peeling the first adhesive tape T1 (inner circular portion T1M) from the upper surface of wafer W progresses.

[0102] As described above, the tape peeling mechanism RM is able to lift the welded portion WP approximately directly upward with an appropriate peeling force PF while pressing the first adhesive tape T1 (inner circular portion T1M) with the removal wedge RM6. Therefore, the tape peeling mechanism RM can begin to peel the first adhesive tape T1 (inner circular portion T1M) from the upper surface of the wafer W without causing cracks or the like in the wafer W.

[0103] Then, the tape peeling mechanism RM, as Figure 17 The top Figure 2 As shown, this causes the removal wedge RM6 to rise. Additionally, the tape peeling mechanism RM, as... Figure 17 As shown in the second, third, and fourth figures from the top (bottom), while moving the third worktable TBL3 to the left with peeling angles α becoming values ​​α2, α3, and α4 smaller than the initial peeling value α1, the peeling tape recovery roller RM2 (see figure) continues to be used. Figure 15 The reclaimed peeling tape PT and the first adhesive tape T1 (inner circular portion T1M) are then removed. At this time, the tape peeling mechanism RM can move along the guide GD (refer to...). Figure 15 This allows the removal head RM1 to move, and it can also move the removal head RM1 and the third worktable TBL3 simultaneously.

[0104] In the example diagram, the peel angle α is controlled so that it is maximum at the start of peeling (value α1), decreases sequentially according to values ​​α2 and α3, and minimum at the end of peeling (value α4). That is, the peel angle α is controlled to gradually decrease from the start of peeling to the end of peeling. However, the peel angle α can also be controlled, for example, to gradually decrease from value α1 to value α3, and then maintain at value α3. That is, the peel angle α can also be controlled to be approximately constant for a portion of the period between the start of peeling and the end of peeling. Alternatively, the peel angle α can also be controlled to increase for a portion of the period between the start of peeling and the end of peeling. For example, the tape peeling mechanism RM can also be controlled to maintain or increase the peel angle α during the period when the peel width increases, and decrease the peel angle α during the period when the peel width decreases. Furthermore, the peel width is the length of the inner circular portion T1M being peeled in the X-axis direction, which varies with the peel line LS (refer to...). Figure 18 (See the diagram below) The peel line LS increases as it approaches the center of the circular wafer W, reaches its maximum when it passes through the center of the circular wafer W, and decreases as it moves away from the center of the circular wafer W. The peel line LS corresponds to the boundary line between the peeled and unpeeled portions of the inner circular portion T1M.

[0105] By controlling the peeling angle α as described above, the tape peeling mechanism RM can prevent the wafer W from being stretched in an undesirable direction with an undesirable force due to the peeling tape PT passing through the first adhesive tape T1 (inner circular portion T1M), thereby suppressing damage caused by cracking of the wafer W.

[0106] Furthermore, in the above embodiments, the release tape PT is a heat-sealed tape formed by heating with a heat sealer RM5 and fusing it to the first adhesive tape T1 (inner circular portion T1M). Alternatively, it can be an adhesive tape formed by adhering to the first adhesive tape T1 (inner circular portion T1M). In this case, the adhesion of the release tape PT to the first adhesive tape T1 (inner circular portion T1M) can be achieved by the seventh driven roller DR7 (see reference). Figure 15 This is achieved by pressing. Alternatively, the heat sealer RM5 can be omitted.

[0107] Alternatively, the tape peeling mechanism RM can be configured to control the peeling force by adjusting the driving force of the tape recovery roller RM2. For example, the tape peeling mechanism RM can be configured to maintain a constant peeling force during peeling, or it can be configured to have different peeling forces at the beginning and end of peeling. Specifically, the peeling force can also be controlled to gradually decrease from the beginning of peeling to the end of peeling.

[0108] Furthermore, in the above embodiment, after the process of peeling the first adhesive tape T1 (inner circular portion T1M) from the wafer W begins, the tape peeling mechanism RM raises the removal wedge RM6. However, the tape peeling mechanism RM can also keep the removal wedge RM6 in contact with the upper surface of the first adhesive tape T1 (inner circular portion T1M) without raising it. According to this structure, the removal wedge RM6 can achieve the following effect: when the wafer W has been sliced, it prevents the sliced ​​chips, etc., from adhering to the first adhesive tape T1 to be peeled and lifting off the substrate (wafer W). In addition, in the example shown in the figure, the removal wedge RM6 is as follows... Figure 18 As shown in the figure below, the width in the X-axis direction is configured to be slightly larger than the width of the stripping tape PT. However, in cases where it has the function of suppressing the lifting of chips that have been sliced, it can also be configured to be larger than the width of the wafer W.

[0109] As described above, the substrate transfer apparatus 100 according to an embodiment of the present invention, such as Figure 2 As shown, the substrate transfer apparatus 100 is configured to transfer a substrate (wafer W) with a first adhesive tape (first adhesive tape T1) attached to its holding surface side to a second adhesive tape (second adhesive tape T2). Specifically, the substrate transfer apparatus 100 includes, as shown... Figure 13 The tape application mechanism MT shown is used to apply a second adhesive tape (second adhesive tape T2) to the non-retaining side of the annular frame F (second annular frame F2) and the substrate (wafer W). Figure 14 The tape cutting portion (cutter blade MT16) shown is used to cut the second adhesive tape (second adhesive tape T2) along the outline of the annular frame F (second annular frame F2), as... Figure 6The shown inverting mechanism RV is used to invert a substrate (wafer W) held within an annular frame F (second annular frame F2) by a second adhesive tape (second adhesive tape T2). Figure 15 The tape peeling mechanism RM shown is for peeling the first adhesive tape (first adhesive tape T1) from the substrate (wafer W). Furthermore, the tape peeling mechanism RM is as follows... Figure 17 As shown, it is configured to allow the peeling angle α to change between the start and end of peeling.

[0110] According to the above structure, the substrate transfer apparatus 100 can have the following effect: suppressing damage to the substrate (wafer W) when peeling off the adhesive tape T (first adhesive tape T1) from the substrate (wafer W).

[0111] Furthermore, the tape peeling mechanism RM can also be included in the mounting apparatus MD. The mounting apparatus MD is a device for attaching adhesive tape T to the annular frame F and the substrate (wafer W), or for separating the annular frame F and the substrate (wafer W) from the adhesive tape T. For example, it can be a device for assembling the mounting frame MF, or a device for separating the mounting frame MF. Specifically, the mounting apparatus MD can be a normal mounting apparatus NMD for fabricating the mounting frame MF by attaching adhesive tape T to the substrate (wafer W) and the annular frame F positioned on a worktable. Alternatively, the mounting apparatus MD can be a reverse mounting apparatus RMD for separating the mounting frame MF placed on the worktable into the substrate (wafer W) and the annular frame F. Furthermore, the mounting apparatus MD can also have a tape peeling mechanism RM for peeling the adhesive tape T from the substrate (wafer W). Additionally, the tape peeling mechanism RM can be configured to allow the peeling angle α to vary between the start and end of peeling.

[0112] More specifically, a typical mounting device such as a NMD, which is an example of a mounting device MD, is... Figure 19 As shown, it can also be configured including a second loader 2, a ring frame providing part 6, a tape pasting mechanism MT, a robot RB, and a tape peeling mechanism RM. Additionally, another example of a mounting device MD is a reverse mounting device RMD. Figure 20 As shown, it can also be configured to include a first loader 1, a wafer separation mechanism 3, a ring frame recovery unit 5, a robot RB, and a tape peeling mechanism RM. Additionally, the mounting device MD can also be configured as a combination of a standard mounting device NMD and a reverse mounting device RMD.

[0113] Based on the above structure, the mounting device has the following effect: it can suppress damage to the substrate (wafer W) when peeling off the adhesive tape T from the substrate (wafer W).

[0114] Additionally, the tape peeling mechanism RM, such as Figure 15 As shown, the device may include a heating device (heat sealer RM5) for heating the release tape PT in contact with the adhesive tape T (first adhesive tape T1), and a recycling mechanism (release tape recycling roller RM2) for recycling the release tape PT. In this case, the release tape PT is as follows: Figure 16 As shown, the adhesive tape T (first adhesive tape T1) is fused to the tape T (first adhesive tape T1) by heating with a heating device (heat sealer RM5). Figure 17 As shown, the stripping tape PT, recovered by the recycling mechanism (stripping tape recycling roller RM2), is stripped from the substrate (wafer W).

[0115] Based on the above structure, the tape peeling mechanism RM can utilize a heat-fused adhesive tape as the peeling tape PT. Therefore, compared to using an adhesive tape as the peeling tape PT, the bonding strength between the peeled adhesive tape T (first adhesive tape T1) and the peeling tape PT can be improved. As a result, the tape peeling mechanism RM can suppress deviations in the peeling force, which is the force used to peel the adhesive tape T (first adhesive tape T1) from the substrate (wafer W), thereby further suppressing damage to the substrate (wafer W) when peeling the tape T (first adhesive tape T1) from the substrate (wafer W).

[0116] Alternatively, the tape peeling mechanism RM can be configured as a separate tape peeling device independent of the substrate transfer device 100 or the mounting device. In this case, the tape peeling device may be, for example, a device for peeling off the adhesive tape T (second adhesive tape T2) attached to the substrate (wafer W), and may also be configured to change the peeling angle α between the start and end of peeling.

[0117] Based on the above structure, the tape peeling device achieves the effect of suppressing damage to the substrate (wafer W) when peeling the adhesive tape T from the substrate (wafer W).

[0118] Furthermore, the substrate transfer apparatus 100 according to the embodiments of the present invention is configured to perform... Figure 7 and Figure 8The substrate transfer method shown is a method of transferring a substrate (wafer W) with a first adhesive tape (first adhesive tape T1) attached to the holding side onto a second adhesive tape (second adhesive tape T2). Specifically, the substrate transfer method includes a pasting step (step ST5) of pasting a second adhesive tape (second adhesive tape T2) to the non-holding side of the annular frame F (second annular frame F2) and the substrate (wafer W), a second tape cutting step (step ST6) of cutting the second adhesive tape (second adhesive tape T2) along the outline of the annular frame F (second annular frame F2), a reversal step (step ST7) of reversing the substrate (wafer W) held in the annular frame F (second annular frame F2) by the second adhesive tape (second adhesive tape T2), and a tape peeling step (step ST8) of peeling the first adhesive tape (inner circular portion T1M of the first adhesive tape T1) from the substrate (wafer W). In the tape peeling step (step 8 ST8), the first adhesive tape (the inner circular portion T1M of the first adhesive tape T1) is peeled off from the substrate (wafer W) in a manner with different peeling angles α at the start and end of peeling.

[0119] By means of this substrate transfer method, the substrate transfer apparatus 100 achieves the effect of suppressing damage to the substrate (wafer W) when the adhesive tape T (first adhesive tape T1) is peeled off from the substrate (wafer W).

[0120] Furthermore, the substrate transfer apparatus 100, mounting apparatus, or tape peeling apparatus can be configured to perform a tape peeling method. The tape peeling method is a method of peeling off an adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) adhered to a substrate (wafer W). Specifically, the tape peeling method includes an attachment process of attaching a peeling tape PT to the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) (see reference). Figure 16 The top Figure 2 The tape peeling process involves peeling the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) attached to the release tape PT from the substrate (wafer W) by recycling (winding up) the release tape PT (see reference). Figure 17 Furthermore, in the tape peeling process, the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1) is peeled off from the substrate (wafer W) in a manner where the peeling angle α is different at the beginning of peeling (value α1) and at the end of peeling (value α4).

[0121] According to this tape peeling method, the substrate transfer apparatus 100, the mounting apparatus, or the tape peeling apparatus can achieve the effect of suppressing damage to the substrate (wafer W) when peeling the adhesive tape T (first adhesive tape T1) from the substrate (wafer W).

[0122] Additionally, in the attachment process, the peeling tape PT is used. Figure 16 The top Figure 2 As shown, it can be configured to be heated while being pressed onto the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1), thereby fusing it onto the adhesive tape T (the inner circular portion T1M of the first adhesive tape T1).

[0123] According to this attachment process, the substrate transfer apparatus 100, the mounting apparatus, or the tape peeling apparatus can use a hot-melt adhesive tape as the peeling tape PT. Therefore, compared with the case where an adhesive tape is used as the peeling tape PT, the bonding strength between the peeled adhesive tape T (first adhesive tape T1) and the peeling tape PT can be improved. As a result, the tape peeling mechanism RM can suppress the deviation of the peeling force, which is the force used to peel the adhesive tape T (first adhesive tape T1) from the substrate (wafer W), thereby achieving the effect of further suppressing damage to the substrate (wafer W) when peeling the adhesive tape T (first adhesive tape T1) from the substrate (wafer W).

[0124] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Various modifications and substitutions can be applied to the above embodiments without departing from the scope of the present invention. Furthermore, the features described in the above embodiments can be appropriately combined as long as no technical contradictions arise.

[0125] This application claims priority to Japanese Patent Application No. 2023-064943, filed on April 12, 2023, and the entire contents of that Japanese Patent Application are incorporated herein by reference.

[0126] [Symbol Explanation]

[0127] 1: First Loader

[0128] 2: Second Loader

[0129] 3: Wafer Separation Mechanism

[0130] 3U: Positioning Unit

[0131] 3X: Rotation axis

[0132] 4: Ultraviolet Irradiation Mechanism

[0133] 5: Circular Frame Recycling Section

[0134] 6: Ring frame supply unit

[0135] 31: Framework

[0136] 32: Cutter Lifting Drive Unit

[0137] 33: Lifting Frame

[0138] 34: Cutter Rotation Drive Unit

[0139] 35: Rotating frame section

[0140] 36: Cutting Unit

[0141] 37: Cutter blade

[0142] 38: Lifting drive unit

[0143] 100: Substrate transfer device

[0144] DR: Driven roller

[0145] DR1: First driven roller

[0146] DR2: Second driven roller

[0147] DR3: Third driven roller

[0148] DR4: Fourth driven roller

[0149] DR5: 5th driven roller

[0150] DR6: 6th driven roller

[0151] DR7: 7th driven roller

[0152] DR8: 8th driven roller

[0153] DR9: 9th driven roller

[0154] DR10: 10th driven roller

[0155] DR11: 11th driven roller

[0156] F: Ring frame

[0157] F1: First Ring Frame

[0158] F2: Second Ring Frame

[0159] GD: Guide Rail

[0160] HT: Heating Unit

[0161] LS: Stripping line

[0162] MD: Mounting device

[0163] MF: Mounting Frame

[0164] MF1: ​​First mounting frame

[0165] MF2: Second mounting frame

[0166] MG: Material Box

[0167] MT: Tape application mechanism

[0168] MT1: Wafer Holding Section

[0169] MT2: Circular frame retaining part

[0170] MT3: Positioning Unit

[0171] MT4: Lifting Drive Unit

[0172] MT5: Adhesive Roller

[0173] MT6: Peeling Roller

[0174] MT7: Belt supply roller

[0175] MT8: Belt Recycling Roller

[0176] MT9: Protective tape recycling roller

[0177] MT10: Tape Holding Unit

[0178] MT11: Cutter Lifting Drive Unit

[0179] MT12: Lifting Frame

[0180] MT13: Cutting blade rotation drive unit

[0181] MT14: Rotating Frame

[0182] MT15: Cutting Unit

[0183] MT16: Cutting Blade

[0184] MTX: Rotary Axis

[0185] NMD: Standard Installation Device

[0186] PF: Peel strength

[0187] PT: Peeling tape

[0188] RB: Robot

[0189] RB1: The First Robot

[0190] RB2: The Second Robot

[0191] RB3: The Third Robot

[0192] RH: Robotic Arm

[0193] RM: Tape peeling mechanism

[0194] RM1: Remove head

[0195] RM2: Stripping tape recycling roller

[0196] RM3: Peeling tape provided to rollers

[0197] RM4: Slider

[0198] RM5: Heat sealer

[0199] RM6: Remove wedge

[0200] RM7: Positioning Unit

[0201] RMD: Reverse Installation Device

[0202] RV: Reversing Mechanism

[0203] RX: Rotation axis

[0204] SC: Adsorption pad

[0205] T: Adhesive tape

[0206] T1: First adhesive tape

[0207] T1C: Remaining outer portion

[0208] T1M: Inner circular part

[0209] T2: Second adhesive tape

[0210] T2C: Remaining outer portion

[0211] T2M: Inner circular part

[0212] TBL1: Workbench 1

[0213] TBL2: Second Workbench

[0214] TBL3: Third Workbench

[0215] W: Wafer

[0216] WP: Welding section

[0217] WX: Central axis

[0218] α: Peeling angle

Claims

1. An installation device for attaching adhesive tape to an annular frame and a substrate, or for separating the annular frame attached to the adhesive tape from the substrate, characterized in that, It has an adhesive tape peeling mechanism for peeling off the adhesive tape adhered to the substrate. The tape peeling mechanism is configured to allow the peeling angle to be different at the beginning and end of peeling.

2. The installation device according to claim 1, wherein, The tape peeling mechanism includes a heating device and a recycling device. The heating device is used to press the peeling tape, which is in contact with the adhesive tape, onto the adhesive tape for heating. The recycling device is used to recycle the peeling tape. The peeling tape is heated and fused to the adhesive tape by the heating device. The adhesive tape is peeled off from the substrate by being pulled by the peeling tape recovered by the recycling mechanism.

3. A tape peeling device for peeling adhesive tape adhered to a substrate, characterized in that, It is configured in a way that allows the peeling angle to be different at the beginning and end of peeling.

4. A substrate transfer apparatus for transferring a substrate with a first adhesive tape adhered to its holding surface onto a second adhesive tape, characterized in that, include: A tape application mechanism for applying the second adhesive tape to the non-retaining side of the annular frame and the substrate; A tape cutting section for cutting the second adhesive tape along the outline of the annular frame; A reversing mechanism for reversing the substrate, which is held in place within the annular frame by the second adhesive tape; and A tape peeling mechanism for peeling the first adhesive tape from the substrate. The tape peeling mechanism is configured to allow the peeling angle to be different at the beginning and end of peeling.

5. A tape peeling method for peeling adhesive tape adhered to a substrate, characterized in that, include: The attachment process involves attaching the release tape to the adhesive tape. as well as The tape peeling process involves recycling the peeling tape and peeling the adhesive tape, to which the peeling tape is attached, off the substrate. In the tape peeling process, the adhesive tape is peeled off from the substrate in a manner that allows the peeling angle to be different at the beginning and end of peeling.

6. The tape peeling method according to claim 5, wherein, In the attachment process, the peeling tape is heated and fused to the adhesive tape while being pressed onto the adhesive tape.

7. A substrate transfer method, used to transfer a substrate with a first adhesive tape adhered to its holding surface side onto a second adhesive tape, characterized in that, include: In the pasting process, the second adhesive tape is pasted onto the non-retaining side of the annular frame and the substrate. The tape cutting process involves cutting the second adhesive tape along the outline of the annular frame; The reversal process reverses the substrate that is held in place within the annular frame by the second adhesive tape; and In the tape peeling process, the first adhesive tape is peeled off. In the tape peeling process, the first adhesive tape is peeled off from the substrate in a manner that allows the peeling angle to be different at the beginning and end of peeling.

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