Improvement of base

Abstract

A susceptor for processing a substrate is provided. The susceptor includes a base and a coating formed over the base. The base comprises an outer edge, and the outer edge is provided with an inner edge, an outer edge and a top connecting the inner edge to the outer edge; and an inner disc disposed inside and coupled to the outer rim, the inner disc recessed from the top of the outer rim, the inner disc having a front side and an opposite back side. The coating has an outer surface including a first portion formed over the front side of the inner disc. The first portion of the outer surface of the coating includes a first region having a first average roughness level and a second region having a second average roughness level.

Description

Background Technology

[0001] field

[0002] Embodiments of this disclosure generally relate to a base for processing a substrate (e.g., a semiconductor substrate), and more specifically, to a base having features that improve thermal uniformity on the substrate during processing.

[0003] Related technical descriptions

[0004] In epitaxial processes, substrates are frequently used to support a substrate and to heat it to a highly uniform temperature. Substrates often have a shallow, disc-shaped or disc-shaped upper surface that supports the substrate from below around its edges, while leaving a small gap between the remaining lower surface of the substrate and the upper surface of the substrate. Precise control of the heat source (such as multiple heating lamps positioned beneath the substrate) allows the substrate to be heated within very tight tolerances. The heated substrate can then transfer heat to the substrate primarily through radiation emitted by the substrate.

[0005] Despite precise control of the heating substrate in epitaxy, temperature non-uniformity persists on the upper surface of the substrate, often degrading the quality of processes performed on the substrate (e.g., deposition). Therefore, an improved substrate is needed to support and heat the substrate during processes such as semiconductor processing. Summary of the Invention

[0006] Embodiments of this disclosure generally relate to a substrate for processing a substrate (e.g., a semiconductor substrate), and more specifically to a substrate in which regions of one or more surfaces of the substrate have different roughness levels to improve thermal uniformity on the substrate during processing.

[0007] In one embodiment, a base for processing a substrate is provided, the base including a base and a coating formed on the base. The base includes an outer edge having an inner edge, an outer edge, and a top connecting the inner edge to the outer edge; and an inner disc disposed inside and coupled to the outer edge, the inner disc being recessed from the top of the outer edge, the inner disc having a front side and an opposing back side. The coating has an outer surface including a first portion formed on the front side of the inner disc, wherein the first portion of the outer surface of the coating includes a first region and a second region, the first region having a first average roughness level, the second region having a second average roughness level, and the first average roughness level being at least 50% greater or 33% less than the second average roughness level.

[0008] In another embodiment, a base for processing a substrate, a substrate, and a coating formed on the substrate are provided. The base includes an outer edge having an inner edge, an outer edge, and a top connecting the inner edge to the outer edge; and an inner disc disposed inside and coupled to the outer edge, the inner disc being recessed from the top of the outer edge, the inner disc having a front side and an opposing back side. The coating has an outer surface including a first portion formed on the back side of the inner disc, wherein the first portion of the outer surface of the coating includes a first region and a second region, the first region having a first average roughness level, the second region having a second average roughness level, and the first average roughness level being at least 50% greater or 33% less than the second average roughness level.

[0009] In another embodiment, a base for processing a substrate is provided, the base including a base having an outer edge, an inner edge, an outer edge, and a top connecting the inner edge to the outer edge; and an inner disc disposed inside and coupled to the outer edge, the inner disc being recessed from the top of the outer edge, the inner disc having a front side and an opposing back side. The outer surface of the base includes a first portion on the front side or the back side of the base, the first portion including a first region and a second region, the first region having a first average roughness level, the second region having a second average roughness level, and the first average roughness level being at least 50% greater or 33% less than the second average roughness level. Attached Figure Description

[0010] To gain a more detailed understanding of the features described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be obtained with reference to the embodiments illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate exemplary embodiments only and should therefore not be considered as limiting the scope of this disclosure, and other equally effective embodiments are appreciated.

[0011] Figure 1 This is a cross-sectional view of a processing chamber according to one embodiment.

[0012] Figure 2A According to one embodiment, from Figure 1 A side cross-sectional view of the base.

[0013] Figure 2B According to one embodiment, from Figure 1 A side cross-sectional view of the base together with the substrate on the base.

[0014] Figure 2C According to one embodiment, from Figure 1 A top view of the first part of the outer surface of the coating on the base.

[0015] Figure 3 This is a side cross-sectional view of the base according to another embodiment.

[0016] Figure 4 This is a side cross-sectional view of the base according to another embodiment.

[0017] Figure 5 This is a side cross-sectional view of the base according to another embodiment.

[0018] Figure 6 This is a top view of the first part of the base according to another embodiment.

[0019] For ease of understanding, common elements in the figures have been designated using the same element symbols where possible. It is envisioned that elements and features of one embodiment may be beneficially incorporated into other embodiments without further description. Detailed Implementation

[0020] Embodiments of this disclosure generally relate to a substrate for processing a substrate (e.g., a semiconductor substrate), and more specifically to a substrate in which regions of one or more surfaces of the substrate have different roughness levels to improve thermal uniformity on the substrate during processing. The substrate surfaces with different roughness levels may be inner or outer surfaces. The roughness level of a surface region affects the heat transferred from that surface region to the substrate. Therefore, varying the roughness levels on different regions of one or more surfaces of the substrate can be used to address temperature non-uniformity on different regions of the substrate during processing, which can improve the uniformity of processes performed on the substrate, such as improved deposition thickness uniformity.

[0021] Figure 1 This is a cross-sectional view of a processing chamber 100 according to one embodiment. The processing chamber 100 can be configured to perform an epitaxial (Epi) deposition process. A substrate 200 is positioned within the processing chamber 100. A substrate 50 is positioned on the substrate 200. Figure 1 A simplified illustration of the base 200 is shown. Figures 2A to 2C Additional details of the base 200 are shown. The processing chamber 100 is configured to allow the exchange of substrate 50 via an opening 160, which can be opened by a slit valve 165 of the processing chamber 100.

[0022] The processing chamber 100 includes a housing structure 102 made of a processing-resistant material, such as aluminum or stainless steel, for example, 316L stainless steel. The housing structure 102 encloses various functional elements of the processing chamber 100, such as a quartz chamber 104, which includes an upper quartz chamber 106 and a lower quartz chamber 108. The quartz chamber 104 encloses the processing space 110 (also referred to as the internal space). One or more liners 136, 137 may separate the quartz chamber 104 from the housing structure 102 at their edges.

[0023] Processing chamber 100 includes a substrate support assembly 116. The substrate support assembly 116 may include a support member 117 and a shaft 118. A base 200 may be positioned on the support member 117. The substrate support assembly 116 may further include an actuator 119 to rotate the shaft 118 and the base 200. During the process, rotation of the base 200 generally improves the uniformity of the process, but unfortunately, non-uniformities still exist, such as temperature non-uniformity on the substrate 50 during the process. The base 200 and other bases described in this disclosure include features (such as surfaces with different average roughness levels) to address these non-uniformities.

[0024] In some embodiments, actuator 119 may also raise and lower support 117, which may be useful when transferring substrate 50 or for use at different processing positions. In some embodiments, substrate support assembly 116 may include a lifting rod (not shown) that can be raised and lowered to facilitate the exchange of substrate 50. Base 200 may include lifting rods that can extend through lifting rod holes therethrough.

[0025] Reactive substances can be supplied to the processing space 110 by a gas distribution assembly (not shown), and processing byproducts can be removed from the processing space 110 through an outlet port (not shown), which is typically connected to a vacuum source (not shown). In some embodiments, gas is supplied to the outside of the processing space 110, for example, via one or more openings in the linings 136, 137. In these embodiments, gas can flow from the outside to an area above the base 200 and substrate 50, and then flow out through the outlet port.

[0026] Purifying gas (not shown) may also be positioned below the base 200 to prevent reactive substances from entering the area below the base 200 within the processing space 110. A preheating ring 170 may be positioned around the base 200. The preheating ring 170 can be used to preheat reactive substances as the gas moves from the outer portion of the processing space 110 to the inner portion (e.g., above the base 200). The preheating ring 170 can also be used to control the flow of purifying gas around the base 200.

[0027] Heating of the substrate 50 and / or processing space 110 can be provided by a radiation source, such as an upper lamp module 124A and a lower lamp module 124B. In one embodiment, the upper lamp module 124A and the lower lamp module 124B are infrared (IR) lamps.

[0028] Figure 2A According to one embodiment, from Figure 1 A side cross-sectional view of the base 200. According to one embodiment, Figure 2B This is a side cross-sectional view of the base 200 together with the substrate 50 on the substrate 200.

[0029] The base 200 includes a base 201 and a coating 240 formed on the base 201. The coating 240 includes an outer surface 241. In embodiments including a coating formed on the base, the outer surface of the base may also be referred to as an inner surface. In some embodiments, as described in further detail below, the coating 240 may be omitted. The base 201 may be formed of a ceramic material (e.g., alumina) or a graphite material. The coating 240 may be a silicon material, such as silicon carbide, or other processable materials. In some embodiments, the coating 240 may have a substantially uniform thickness over the entire base 201.

[0030] The base 201 includes an outer edge 210 and an inner disc 202 coupled to the outer edge 210. The outer edge 210 includes an inner edge 211, an outer edge 212, and a top 213 connecting the inner edge 211 to the outer edge 212. The outer edge 210 further includes a bottom 214 connected to the outer edge 212.

[0031] The inner disc-shaped object 202 includes an outer portion 204 disposed around a central portion 203. The central portion 203 may be flat (i.e., in...). Figure 2A and Figure 2B The outer portion 204 may be inclined. The outer portion 204 extends from the central portion 203 to the inner edge 211 of the outer edge 210. The inner disc 202 is recessed from the top 213 of the outer edge 210. The central portion 203 of the inner disc 202 is also recessed from the inner edge 211 of the outer edge 210. Although the outer portion 204 is shown as having a straight slope, in some embodiments, the outer portion 204 may be curved. Furthermore, although the central portion 203 is shown as straight, in some embodiments, the central portion 203 may be curved (e.g., recessed). Furthermore, in some embodiments, the outer portion 204 may be omitted. In some of these embodiments, another feature (such as an annular ridge supporting the substrate) may be used to create a gap between the bottom of the substrate 50 and the top of the central portion 203 of the inner disc 202.

[0032] The inner disc-shaped member 202 further includes a front side 208 and an opposing back side 209. When the substrate 50 is positioned on the base 200, the front side 208 is the side facing the substrate 50. Figure 2B As shown, the substrate 50 is separated from a portion of the outer surface 241 of the coating 240 covering the central portion 203 of the inner disc 202. The gap between the bottom of the substrate and the front side 208 of the inner disc 202 allows more of the substrate to be heated by radiation, which improves the temperature uniformity of the substrate compared to conductive heating between contact surfaces.

[0033] Figure 2C This is a top view of the first portion 2411 of the outer surface 241 of the coating 240 on the base 200 according to one embodiment. See also... Figure 2A and Figure 2B describe Figure 2C . Figure 2C The first portion 2411 of the outer surface 241 shown covers the central portion 203 and the outer portion 204 of the inner disc 202. The first portion 2411 of the outer surface 241 of the coating 240 includes a first set of regions 250 and a second set of regions 260 with substantially different average roughness levels Ra to improve the temperature uniformity of the substrate 50 during processing.

[0034] As used herein, the Ra value of a surface (also referred to as the average roughness level) represents the average value of the profile height deviating from the average line of the surface. Ra values ​​may have units of length (e.g., micrometers (μm) or millimeters (mm)). Also as used herein, substantially different average roughness levels of two or more regions represent a region where at least one of the two or more regions has an average roughness level Ra that is at least 50% larger or 33% smaller than the average roughness level Ra of at least one of the other regions. In some embodiments, the average roughness level between two regions may be smaller (e.g., one region has an average roughness level that is 10% larger than the average roughness level of the other region) or larger (e.g., one region has an average roughness level that is twice as large as the average roughness level of the other region).

[0035] As used herein, if the average roughness level of the first region is within 5% plus or minus the average roughness level of the second region, the average roughness levels of the two regions are considered substantially the same. Although this disclosure generally describes different roughness levels as different average roughness levels Ra, other roughness parameters, such as the root mean square mean or quadratic mean of the profile height of the surface, can be used, and the benefits of this disclosure can be obtained by using these other roughness parameters.

[0036] The first group of regions 250 includes the first region 251, the second region 252, and the third region 253. The second group of regions 260 includes the first region 261, the second region 262, and the third region 263.

[0037] Regions 261 to 263 Figure 2A , Figure 2B The middle is shown as a rectangle, so as to be in Figure 2A , Figure 2B The cross-sectional view indicates the location of these regions on the outer surface 241. The use of these rectangles does not imply any information about the depth of regions 261 to 263 in the Z direction. The statements in this paragraph regarding the use of rectangles and the depth of these rectangles also apply. Figures 3 to 5 Use of rectangles of similar size 361 to 363, 461 to 463, and 561 to 563.

[0038] refer to Figure 2A and Figure 2C The first region 251 may be the central region. The first region 251 may be circular in the top view. The second region 252 and the third region 253 may be ring-shaped in the top view. Similarly, the first region 261, the second region 262, and the third region 263 may be ring-shaped in the top view. The first region 261 is located between the first region 251 and the second region 252. The second region 252 is located between the first region 261 and the second region 262. The second region 262 is located between the second region 252 and the third region 253. The third region 253 is located between the second region 262 and the third region 263. The third region 263 is located between the third region 253 and the inner edge 211 of the outer edge 210. Figure 2C The outer boundary of the third region 263 is the position where the third region 263 contacts the inner edge 211 of the outer edge 210.

[0039] The first set of regions 250 are each individually spaced apart from each other by regions in the second set of regions 260. Similarly, the second set of regions 260 are each individually spaced apart from each other by regions in the first set of regions 250. Although there are three regions 250 and three regions 260, in other embodiments, there may be more or fewer of each of the regions 250 and 260. In one embodiment, there are only three total regions, such as an embodiment that includes only the first region 251, the second region 252, and the first region 261, wherein the first region 261 is located between the first region 251 and the second region 252. Another embodiment may include only two regions with different roughnesses, for example, when regions with different roughnesses are used to address temperature non-uniformity that exists only at the center or edge of the substrate.

[0040] Each of the individual regions 251 to 253, 261 to 263 may cover a significant portion of the first portion 2411 of the outer surface 241 of the coating 240. For example, in some embodiments, each individual region 251 to 253 may cover at least 2.5%, at least 5%, at least 10%, at least 15%, or at least 25% of the area enclosed by the outer edge 210 and corresponding to the front side 208 of the inner disc 202.

[0041] In some embodiments, the first set of regions 250 may have an average roughness level that is at least 50%, at least twice, at least five times, or at least ten times greater than the average roughness level of the second set of regions 260. Conversely, in other embodiments, the second set of regions 260 may have an average roughness level that is at least 50%, at least twice, at least five times, or at least ten times greater than the average roughness level of the first set of regions 250.

[0042] Determining whether to form a first set of regions 250 with a rougher surface than the second set of regions 260 can be based on (1) where the temperature non-uniformity on base 50 is located during a process performed on other similar bases without any roughness modification, and (2) the temperature difference between base 200 and base 50 during the process being performed. A surface with a higher roughness level is more pronounced in a two-dimensional plane (e.g., compared to other similar surfaces with lower roughness levels). Figure 2C Each unit area on the XY plane can have a larger surface area. Therefore, when compared to a similarly sized area with an outer surface 241 having a lower average roughness level, a region of the outer surface 241 of the substrate 200 with a higher average roughness level and a larger surface area can have a higher viewing factor and radiate more heat to or absorb more heat from the substrate 50 depending on the temperature difference between the substrate 200 and the substrate 50 during a given process. Therefore, it can be concluded that the average roughness level of the outer surface 241 of the coating 240 of the substrate 200 can be adjusted in different regions of the outer surface 241 (e.g., regions 250, 260) to counteract the temperature non-uniformity on the substrate that exists when the substrate is processed on other similar substrates with an unmodified roughness level (e.g., a relatively constant level).

[0043] Because the substrate (e.g., substrate 200) is frequently rotated during processing, temperature inhomogeneities on the substrate during processing and inhomogeneities in the processing results (e.g., thickness deposition inhomogeneities) often exist in annular patterns on the surface of substrate 50. Therefore, using a substrate 200 with a coating 240 having an outer surface 241 comprising regions 250, 260 having substantially different average roughness levels, and all regions except the central region 251 having an annular shape, is an example of a solution to address temperature inhomogeneities in annular patterns on the substrate. For processes in which the substrate does not rotate, in addition to the annular pattern (see, for example...), Figure 6 In addition, patterns used to change the roughness of the substrate may be more suitable for addressing non-uniformities on the substrate, such as temperature non-uniformity.

[0044] In some embodiments, the difference in average roughness level between regions 250, 260 can be obtained by (1) roughening one set of regions 250, 260 without modifying the other set, (2) smoothing one set of regions 250, 260 without modifying the other set, or (3) modifying each of regions 250, 260 with roughening or smoothing. In some embodiments, smoothing can be accomplished by polishing. Polishing a region of the surface reduces the roughness of that region relative to an unpolished region. Roughening a region increases the roughness of that region relative to an unroughened region. Roughening can be accomplished by using machining, sandblasting, milling, and other techniques to create grooves, scratches, turf-like patterns, or other surface features. In some embodiments, laser energy can also be used to modify the surface roughness.

[0045] Although the base 200 is described as having a first set of regions 250 having a first average roughness level and a second set of regions 260 having a second average roughness level, it is not required to have only two roughness levels. For example, some embodiments of the base may include three or more regions of a given surface, each region having a different average roughness level. In one embodiment of the base 200, each of the six different regions 251 to 253, 261 to 263 individually has an average roughness level substantially different from each of the other five regions. Each base described in this disclosure (see, for example) Figures 2A to 6The substrate may have a surface (e.g., the surface of coating 240 or base 201) that may include three or more regions, each having an average roughness level that is substantially different from the average roughness level of two or more other regions on that surface. Furthermore, although the substrates disclosed herein are described only as having a base and a single coating, other substrates may include three or more components (e.g., layers), each having a surface for which the roughness may be modified to improve the temperature uniformity of the process to be performed on the substrate.

[0046] Figure 3 This is a side cross-sectional view of a base 300 according to another embodiment. The base 300 is identical to the base 200 described above, except that different portions of the outer surface 241 of the coating 240 include areas with different average roughness levels. On the base 300, the lower portion 2412 of the outer surface 241 of the coating 240, which lies beneath the inner disc 202, includes areas with different average roughness levels, rather than the first portion 2411 of the outer surface 241 of the inner disc 202 covering the base 200.

[0047] The lower portion 2412 (first portion) of the outer surface 241 includes a first group of regions 350 and a second group of regions 360. The first group of regions 350 includes a first region 351, a second region 352, and a third region 353. The second group of regions 360 includes a first region 361, a second region 362, and a third region 363. The roughness level of the first group of regions 350 is substantially different from the roughness level of the second group of regions 360. For example, the average roughness level Ra of the first group of regions 350 may be at least 50% greater than the average roughness level Ra of the second group of regions 360.

[0048] Although not shown, the bottom view of the lower portion 2412 of the base 300 can appear similar to... Figure 2C The top view of the first portion 2411 of the base 200 shown is identical. For example, the first region 351 may have a circular shape in the XY plane. The second region 352 and the third region 353 may have a ring shape in the XY plane. Similarly, the first region 361, the second region 362, and the third region 363 may each have a ring shape in the XY plane. The first region 361 is located between the first region 351 and the second region 352. The second region 352 is located between the first region 361 and the second region 362. The second region 362 is located between the second region 352 and the third region 353. The third region 353 is located between the second region 362 and the third region 363. The third region 363 is located between the third region 353 and the bottom 214 of the outer edge 210.

[0049] The roughness of regions 350 and 360 can be modified for the same reasons described above regarding regions 250 and 260 on the base 200. For example, roughening a region can increase the roughness of that region in a two-dimensional area (e.g., in...). Figure 3 The surface area (on the region in the XY plane). Compared to an unroughened region of the same size, an increased surface area increases the radiative heat transfer in that region. On the other hand, a smoothed (e.g., polished) region can reduce the surface area of ​​that region in the two-dimensional region (e.g., in the XY plane). Figure 3 The surface area of ​​the region in the XY plane can reduce the radiative heat transfer and effective emissivity of that region relative to an unsmoothed region of the same size.

[0050] In some embodiments, modifications are made as follows: Figure 3 The surface roughness of the bottom surface of the base 300 shown may be greater than that of the modified base. Figure 2A The roughening of the top surface of the base 200 shown is easier because the bottom of the base is often a flat surface, while the top surface of the base, which lies beneath the substrate during processing, often has a slope or curve, which can make certain roughening or polishing techniques more challenging. Furthermore, the inner disc 202 recessed within the outer edge 210 can also make modifying the roughness of the top surface of the base more challenging than modifying the roughness of the bottom surface.

[0051] Figure 4 This is a side cross-sectional view of a base 400 according to another embodiment. The base 400 is identical to the base 200 described above, except that the front side 208 of the inner disc 202 of the base 201 includes a region with different roughness levels rather than the outer surface 241 of the coating 240 with different roughness levels (see [link to documentation]). Figures 2A to 2C The front side 208 of the inner disc 202 is the surface of the base 201 facing the substrate during processing. The roughness of the front side 208 of the inner disc 202 can be modified (e.g., roughened or smoothed) before the coating 240 is formed on the base 201.

[0052] The front side 208 of the inner disc 202 includes a first set of regions 450 and a second set of regions 460. The first set of regions 450 includes a first region 451, a second region 452, and a third region 453. The second set of regions 460 includes a first region 461, a second region 462, and a third region 463. The average roughness level of the first set of regions 450 is substantially different from the average roughness level of the second set of regions 460; for example, the average roughness level Ra of the first set of regions 450 is at least 50% greater than the average roughness level Ra of the second set of regions 460.

[0053] The front side 208 of the inner disc 202 has a similar shape to the front side 208 in the XY plane. Figure 2CThe first portion 2411 of the outer surface 241 of the coating 240 shown in the XY plane is the same size as that of the coating 240. Although not shown, a top view of the front side 208 of the inner disc 202 of the base 400 can appear to be the same as that of the coating 240. Figure 2C The top view of the first portion 2411 of the base 200 shown is identical. For example, the first region 451 may have a circular shape in the XY plane. The second region 452 and the third region 453 may have a ring shape in the XY plane. Similarly, the first region 461, the second region 462, and the third region 463 may each have a ring shape in the XY plane. The first region 461 is located between the first region 451 and the second region 452. The second region 452 is located between the first region 461 and the second region 462. The second region 462 is located between the second region 452 and the third region 453. The third region 453 is located between the second region 462 and the third region 463. The third region 463 is located between the third region 453 and the inner edge 211 of the outer edge 210.

[0054] The roughness of one or more of regions 450 and 460 may be modified (e.g., smoothed or roughened) for the same reasons described above regarding the modification of the roughness of one or more of regions 250 and 260 on the base 200. For example, roughening a region may increase the roughness of that region in a two-dimensional area (e.g., in...). Figure 4 The surface area of ​​a region (on the XY plane). Compared to an unroughened region of the same size, an increased surface area increases the heat transfer in that region. Similarly, as mentioned above, a smoothed region can reduce the surface area and heat transfer of that region.

[0055] Figure 5 This is a side cross-sectional view of a base 500 according to another embodiment. The base 500 is identical to the base 200 described above, except that the back side 209 of the inner disc 202 includes a region with different roughness levels rather than a first portion 2411 of the outer surface 241 of the coating 240 with different roughness levels. (See also...) Figures 2A to 2C The roughness of the back side 209 of the inner disc 202 can be modified (e.g., roughened or smoothed) before the coating 240 is formed on the base 201.

[0056] The back side 209 of the inner disc 202 includes a first set of regions 550 and a second set of regions 560. The first set of regions 550 includes a first region 551, a second region 552, and a third region 553. The second set of regions 560 includes a first region 561, a second region 562, and a third region 563. The roughness level of the first set of regions 550 is substantially different from the roughness level of the second set of regions 560; for example, the average roughness level Ra of the first set of regions 550 is at least 50% greater than the average roughness level Ra of the second set of regions 560.

[0057] The back side 209 of the inner disc 202 has a shape in the XY plane that is similar to... Figure 2C The first portion 2411 of the outer surface 241 of the coating 240 shown in the XY plane is the same size as that of the coating 240. Although not shown, the bottom view of the back side 209 of the inner disc 202 of the base 500 can appear to be the same as that of the coating 240. Figure 2C The top view of the first portion 2411 of the base 200 shown is identical. For example, the first region 551 may have a circular shape in the XY plane. The second region 552 and the third region 553 may have a ring shape in the XY plane. Similarly, the first region 561, the second region 562, and the third region 563 may each have a ring shape in the XY plane. The first region 561 is located between the first region 551 and the second region 552. The second region 552 is located between the first region 561 and the second region 562. The second region 562 is located between the second region 552 and the third region 553. The third region 553 is located between the second region 562 and the third region 563. The third region 563 is located between the third region 553 and the bottom 214 of the outer edge 210.

[0058] The roughness of regions 550 and 560 can be modified for the same reasons described above regarding regions 250 and 260 on the base 200. For example, roughening a region can increase the roughness of that region in a two-dimensional area (e.g., in...). Figure 5 The surface area of ​​a region (on the XY plane). Compared to an unroughened region of the same size, an increased surface area increases the heat transfer in that region. Similarly, as mentioned above, smoothing (e.g., polishing) a region can reduce the surface area and heat transfer of that region.

[0059] For bases 400 and 500 (see...) Figure 4 and Figure 5 Instead of modifying the surface roughness of the coating as described above regarding bases 200 and 300, the surface roughness of the base 201 is modified (see...). Figures 2A to 2C and Figure 3 In some embodiments, instead of modifying the coating surface, it may be preferable to modify the surface roughness of the base 201, for example, when modifying the roughness of the base surface is easier (e.g., easier to process) or can be done more precisely than modifying the roughness of the coating surface formed on the base. Modifying the roughness of the base may also be used when the base is formed of a single material (e.g., a base formed by silicon carbide monomerization).

[0060] Figure 6This is a top view of the first portion 6411 of the base 600 according to another embodiment. Except for the first portion 6411 of the base 600, which includes the outer surface 241 of the coating 240, the base 600 is similar to the base 200 described above (see [link to previous embodiment]). Figures 2A to 2C Same as, when with Figure 2C Compared to the first portion 2411 of the base 200 shown, this first portion 6411 has different partition patterns with different average roughness levels. The first portion 6411 of the base 600 is the same size as the first portion 2411 of the base 200 and is located in the same position on the base 201. (See reference) Figure 2A As shown in the figures, the first part 6411 of the outer surface 241 of the base 600 covers the central part 203 and the outer part 204 of the inner disc 202.

[0061] The first portion 6411 includes a first region 650. The first portion 6411 includes a set of regions 661 to 664. These regions 661 to 664 are separated by the first region 650. The first region 650 may surround each of the regions 661 to 664. Each individual region 650 and each of 661 to 664 may cover a significant portion of the first portion 6411 of the outer surface 241 of the coating 240. For example, in some embodiments, each individual region 650 and 661 to 664 may cover at least 5%, at least 10%, at least 15%, or at least 25% of the region corresponding to the front side 208 of the inner disc 202.

[0062] A substrate (such as substrate 600) including a coating having multiple non-annular regions (which have at least two substantially different average roughness levels) can be used in a process in which the substrate does not rotate during the process. Although regions 661 to 664 are shown as rectangular, regions 661 to 664 can have any shape including irregular shapes.

[0063] For each of the aforementioned bases 200 to 600, the shape and location of regions with different average roughness levels can be based on: (1) the components in the process chamber in which the base is used; (2) each different configuration for a given process chamber (e.g., different base locations); and (3) each different process performed in a given process chamber. Some examples of components in a given process chamber that the base described herein can be used to address that may lead to temperature non-uniformity include (1) the lamp layout in the process chamber; (2) the relative uniformity of radiation reflected by reflectors in the process chamber; and (3) the airflow in the process chamber, including the airflow of precursor gases and cooling gases.

[0064] In some embodiments, the base may include a non-annular region (e.g., regions 661 to 664) and one or more annular regions (e.g., from...). Figure 2C (The third region 263). For example, this can be useful when the base is not rotated, but there is still non-uniformity near the edge of the substrate during processing.

[0065] although Figures 2A to 6 Each substrate disclosed herein provides an example of a substrate having one surface (which is modified to have a different average roughness level), but the benefits of this disclosure can be used to modify two or more surfaces of a given substrate to improve the uniformity of the process on the substrate. For example, in one embodiment, the outer surface 241 of the coating 240 is modified to have regions with different average roughness levels on the front side 208 of the inner disc 202 (see, for example...). Figure 2A ), and regions on the back side 209 of the inner disc 202 with different average roughness levels (see, for example) Figure 3 In another embodiment, the front side 208 of the base 201 (see example) Figure 4 ) and dorsal 209 (see example) Figure 5 The outer surfaces of each are modified to have regions with different average roughness levels. In yet another embodiment, each of the front and back sides of the coating 240 and the base 201 is modified to have regions with different average roughness levels, such that there are four different surfaces on the base with regions having different average roughness levels.

[0066] In another embodiment, one or more regions have an average roughness level that gradually varies throughout the region. For example, in one embodiment, the intermediate region (e.g., Figure 2C A first region 261 is located between a first region (e.g., first region 251) and a second region (e.g., second region 252), and the average roughness level in the intermediate region gradually decreases from a first average roughness level (e.g., 40 μm) at the boundary between the intermediate region and the first region to a second average roughness level (e.g., 80 μm) at the boundary between the intermediate region and the second region. In another embodiment, the average roughness level in the region may increase from the boundary of the region to a maximum value at an intermediate location (e.g., the center) between the boundaries. In another embodiment, the average roughness level in the region may decrease from the boundary of the region to a minimum value at an intermediate location (e.g., the center) between the boundaries. Other profiles that change the roughness within the region may also be provided without departing from the scope of this disclosure.

[0067] Although most of this disclosure describes a substrate including a base and a coating, the aforementioned benefits can also be applied to substrates formed from a single material (e.g., a silicon carbide substrate formed by monomerization). For substrates formed from a single material, the roughness of the outer surface can be modified in a manner similar to that described with respect to the substrates disclosed above. Furthermore, although the benefits of roughness modification in this disclosure are described as applicable to substrates for deposition including outer edges and recessed inner disks, these benefits of roughness modification can be applied to any component used to support a substrate during the process, including (1) substrates with different shapes (e.g., substantially flat disk-shaped substrates), (2) substrates for different processes (e.g., substrates for pre-cleaning processes), (3) devices that can support more than one substrate (e.g., wafer boats), or (4) any other substrate support including substrate supports permanently fixed in the corresponding process chamber.

[0068] While the foregoing describes embodiments of this disclosure, other and further embodiments of this disclosure may be conceived without departing from the basic scope of this disclosure.

Claims

1. A base for processing a substrate, the base comprising: The base includes: An outer edge, the outer edge having an inner edge, an outer edge, and a top connecting the inner edge to the outer edge; and An inner disc-shaped object, disposed inside and coupled to the outer edge, the inner disc-shaped object being recessed from the top of the outer edge, the inner disc-shaped object having a front side and an opposing back side; and A coating is formed on the base, the coating having an outer surface, the outer surface including a first portion formed on the front side of the inner disc, wherein... The first portion of the outer surface of the coating includes a first region and a second region. The first region has a first average roughness level. The second region has a second average roughness level, and The first average roughness level is at least 50% greater or 33% less than the second average roughness level.

2. The base as claimed in claim 1, wherein the first region and the second region are each annular regions.

3. The base of claim 1, wherein the first portion of the outer surface further includes a third region, the third region being spaced apart from the first region by the second region.

4. The base as claimed in claim 3, wherein the first region, the second region and the third region are each annular regions.

5. The base as claimed in claim 3, wherein the second region surrounds the first region and the third region.

6. The base as claimed in claim 3, wherein the third region has a third average roughness level that is substantially different from the first average roughness level and the second average roughness level.

7. The base as claimed in claim 3, wherein the third region has an average roughness level substantially the same as the first average roughness level.

8. The base as claimed in claim 1, wherein the first average roughness level is at least ten times greater or ten times less than the second average roughness level.

9. A base for processing a substrate, the base comprising: The base includes: An outer edge, the outer edge having an inner edge, an outer edge, and a top connecting the inner edge to the outer edge; and An inner disc-shaped object, disposed inside and coupled to the outer edge, the inner disc-shaped object being recessed from the top of the outer edge, the inner disc-shaped object having a front side and an opposing back side; and A coating is formed on the base, the coating having an outer surface, the outer surface including a first portion formed on the back side of the inner disc, wherein... The first portion of the outer surface of the coating includes a first region and a second region. The first region has a first average roughness level. The second region has a second average roughness level, and The first average roughness level is at least 50% greater or 33% less than the second average roughness level.

10. The base as claimed in claim 9, wherein the first region and the second region are each annular regions.

11. The base of claim 9, wherein the first portion of the outer surface further includes a third region, the third region being spaced apart from the first region by the second region.

12. The base as claimed in claim 11, wherein the first region, the second region, and the third region are each annular regions.

13. The base of claim 11, wherein the second region surrounds the first region and the third region.

14. The base of claim 11, wherein the third region has a third average roughness level that is substantially different from the first average roughness level and the second average roughness level.

15. The base of claim 11, wherein the third region has an average roughness level substantially the same as the first average roughness level.

16. The base of claim 9, wherein the first average roughness level is at least ten times greater or ten times less than the second average roughness level.

17. A base for processing a substrate, the base comprising: The base includes: An outer edge, the outer edge having an inner edge, an outer edge, and a top connecting the inner edge to the outer edge; and An inner disc-shaped object is disposed inside and coupled to the outer edge, the inner disc-shaped object being recessed from the top of the outer edge, the inner disc-shaped object having a front side and an opposing back side, wherein... The outer surface of the base includes a first portion on the front side or the back side of the base. The first part includes a first region and a second region. The first region has a first average roughness level. The second region has a second average roughness level, and The first average roughness level is at least 50% greater or 33% less than the second average roughness level.

18. The base of claim 17, wherein the first portion of the outer surface of the base is on the front side of the base.

19. The base of claim 17, wherein the first portion of the outer surface of the base is on the back side of the base.

20. The base as claimed in claim 17, wherein The first portion of the outer surface further includes a third region, the third region being separated from the first region by the second region, and The third region has a third average roughness level that is substantially different from the second average roughness level.

Images