Novel hybrid polyamide material and preparation method thereof
By adding organic/inorganic hybrid monomers to polyamide materials and carrying out melt polymerization, a novel hybrid polyamide material with significantly improved high temperature resistance and wear resistance was prepared. This solved the problem of insufficient high temperature resistance and wear resistance of existing materials and met the high requirements of applications such as rail transportation and aerospace.
Patent Information
- Application Number
- CN202410590061.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-11-14
AI Technical Summary
Existing polyamide materials are insufficient in terms of high temperature resistance and wear resistance, making it difficult to meet the high requirements of fields such as rail transportation and aerospace.
Organic/inorganic hybrid polyamide materials are prepared by adding organic/inorganic hybrid monomers during the polymerization process. The specific steps include melt polymerization and the addition of antioxidants. By controlling the monomer ratio and reaction temperature, a new type of hybrid polyamide material with significantly improved high-temperature resistance and wear resistance is prepared.
This significantly improves the high-temperature resistance and wear resistance of polyamide materials, making them suitable for high-temperature applications and meeting the demanding requirements of rail transportation and aerospace.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of novel hybrid polymers, and particularly to a novel hybrid polyamide material and its preparation method, as well as the novel hybrid polyamide prepared by the method and its applications. Background Technology
[0002] Polyamide materials are demonstrating their irreplaceable importance in the domestic market, and their superiority has been fully reflected in many aspects.
[0003] First, polyamides possess excellent mechanical properties. They exhibit high strength, high modulus, and excellent toughness, enabling them to withstand significant external forces without easily breaking or deforming. This gives polyamide materials a significant advantage in manufacturing high-load, high-requirement components, such as automotive engine parts, gears, and bearings. Their robust mechanical properties ensure product stability and durability, improving overall performance.
[0004] Secondly, polyamide materials possess excellent wear resistance and corrosion resistance. They resist friction and abrasion, maintaining a long-lasting surface smoothness and reducing the frequency of maintenance and replacement. Simultaneously, polyamides exhibit good stability to chemicals and acidic / alkaline environments, showing little susceptibility to corrosion and erosion. This has led to the widespread application of polyamide materials in industries such as chemical, petroleum, and food processing, meeting the needs of various environmental conditions.
[0005] In addition, polyamide materials possess excellent heat resistance. They maintain stable physical and chemical properties at high temperatures, resisting deformation or melting. This gives polyamide materials outstanding reliability in high-temperature operating environments, such as the manufacture of high-temperature components like engine compartments and electrical equipment.
[0006] In addition, polyamide materials also possess excellent insulation properties. They can effectively isolate current, preventing electrical faults and fire risks. In the electronics and electrical fields, polyamide materials are widely used in wires and cables, insulation materials, and other applications, ensuring the normal operation of electrical equipment and the safety of personnel.
[0007] In addition to the advantages mentioned above, polyamide materials are also environmentally friendly and biodegradable. With increasing environmental awareness, more and more industries are focusing on material sustainability. As a recyclable and biodegradable material, polyamide plays a vital role in reducing environmental pollution and resource waste. It can be recycled and reused, reducing the demand for raw materials, energy consumption, and waste emissions. Furthermore, polyamide materials can naturally degrade under specific conditions, without causing long-term pollution to soil and water sources.
[0008] In conclusion, polyamide materials, with their excellent mechanical properties, wear resistance, corrosion resistance, heat resistance, insulation properties, and environmentally friendly biodegradability, are playing an increasingly irreplaceable role in the domestic market. They not only meet the needs of various industries for high-performance materials but also drive innovation and development in related industries. With continuous technological advancements and market expansion, the application prospects of polyamide materials will become even broader, and their position in the national economy will become even more secure.
[0009] In recent years, with the rapid development of rail transit and aerospace technologies, the requirements for the wear resistance and high temperature resistance of materials have become increasingly stringent. By adding hybrid monomers during the polymerization process to achieve organic / inorganic hybridization, organic / inorganic hybrid polyamide materials can be prepared, which significantly improves their high temperature resistance and wear resistance, making them applicable to high temperature fields. Summary of the Invention
[0010] The purpose of this invention is to provide a novel hybrid polyamide material that significantly improves its high-temperature resistance and wear resistance, making it applicable to high-temperature fields.
[0011] The main technical solution of this invention is a novel hybrid polyamide material characterized in that the molar amount of organic / inorganic hybrid monomers in the hybrid polyamide is 1%-50%, the molar amount of diamine monomers is 1%-50%, the molar amount of diacid monomers is 100%, the antioxidant is 1%-2%, and the molar ratio of diamine monomers to diacid monomers is 1:1. 。
[0012] Furthermore, the organic / inorganic hybrid monomer is at least one of bis(4-aminophenoxy)dimethylsilane and aminopropyl-terminated polydimethylsiloxane.
[0013] Furthermore, the diamine monomer is one or more of hexamethylenediamine, pentanediamine, decanediamine, and dodecyldiamine.
[0014] Furthermore, the diacid monomers are one or more of adipic acid, glutaric acid, sebacic acid, and dodecyl diacid.
[0015] Furthermore, the antioxidant is one or more of aromatic amine antioxidants and hindered phenolic antioxidants.
[0016] Another objective of this invention is to provide a method for preparing a novel hybrid polyamide material, which is prepared by melt polymerization, and the specific steps are as follows: The organic / inorganic hybrid monomer, diamine monomer, and diacid monomer are weighed and added to a reaction vessel. The mixture is purged with an inert gas, heated to 140-150℃, and reacted for 0.5-1 hour. Then the temperature is raised to 180-200℃ and reacted for 0.5-1 hour. Finally, the temperature is raised to 240-260℃ and reacted for 1-3 hours. Excess moisture is removed by purging with an inert gas, and an antioxidant is added to obtain the hybrid polyamide material.
[0017] Furthermore, the inert gas is either nitrogen or argon.
[0018] The novel hybrid polyamide material provided by this invention can be used in the field of high-temperature resistant polyamides.
[0019] The advantages of this invention are: by adding special monomers during the polymerization process to achieve organic / inorganic hybridization, organic / inorganic hybrid polyamide materials are prepared, which significantly improves their high temperature resistance and wear resistance. Detailed Implementation
[0020] The present invention will now be described in detail with reference to the embodiments. Example 1
[0021] 162g of aminopropyl-terminated polydimethylsiloxane monomer, 104g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then raised to 180℃ and reacted for 0.5h. Finally, the temperature was raised to 240℃ and reacted for 2h. Excess moisture was removed by purging with nitrogen. An antioxidant was added to obtain a hybrid polyamide material. Example 2
[0022] 324g of aminopropyl-terminated polydimethylsiloxane monomer, 93g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then raised to 180℃ and reacted for 0.5h. Finally, the temperature was raised to 240℃ and reacted for 2h. Excess moisture was removed by purging with nitrogen. An antioxidant was added to obtain a hybrid polyamide material. Example 3
[0023] 486g of aminopropyl-terminated polydimethylsiloxane monomer, 81g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then increased to 180℃ and reacted for 0.5h. Finally, the temperature was increased to 240℃ and reacted for 2h. Excess moisture was removed by purging with nitrogen. An antioxidant was added to obtain a hybrid polyamide material. Example 4
[0024] 811g of aminopropyl-terminated polydimethylsiloxane monomer, 58g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then increased to 180℃ and reacted for 0.5h. Finally, the temperature was increased to 240℃ and reacted for 2h. Excess moisture was removed by purging with nitrogen gas, and an antioxidant was added to obtain a hybrid polyamide material. Example 5
[0025] 27.4g of bis(4-aminophenoxy)dimethylsilane monomer, 104g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then raised to 180℃ and reacted for 0.5h. Finally, the temperature was raised to 240℃ and reacted for 2h. Excess moisture was removed by purging with nitrogen. An antioxidant was added to obtain a hybrid polyamide material. Example 6
[0026] 54g of bis(4-aminophenoxy)dimethylsilane monomer, 93g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then raised to 180℃ and reacted for 0.5h. Finally, the temperature was raised to 240℃ and reacted for 2h. Excess moisture was removed by purging with nitrogen gas, and an antioxidant was added to obtain a hybrid polyamide material. Example 7
[0027] 82g of bis(4-aminophenoxy)dimethylsilane monomer, 81g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. Then the temperature was raised to 180℃ and reacted for 0.5h. Finally, the temperature was raised to 240℃ and reacted for 2h. Excess moisture was removed by argon purging, and an antioxidant was added to obtain a hybrid polyamide material. Example 8
[0028] 137g of bis(4-aminophenoxy)dimethylsilane monomer, 58g of hexamethylenediamine monomer, and 146g of adipic acid monomer were weighed and added to a reaction vessel. The mixture was purged with an inert gas, heated to 140℃, and reacted for 0.5h. The temperature was then raised to 180℃ and reacted for 0.5h. Finally, the temperature was raised to 240℃ and reacted for 2h. Excess moisture was removed by argon purging, and an antioxidant was added to obtain a hybrid polyamide material. Comparative Example 1
[0029] 116g of hexamethylenediamine monomer and 146g of adipic acid monomer were weighed and added to the reactor. The reactor was purged with an inert gas and heated to 140°C for 0.5h. The temperature was then increased to 180°C and reacted for 0.5h. Finally, the temperature was increased to 240°C and reacted for 2h. Excess moisture was removed by purging with nitrogen. An antioxidant was added to obtain the polyamide material. Comparative Example 2
[0030] 224g of pentanediamine monomer and 202g of sebacic acid monomer were weighed and added to the reactor. The reactor was purged with an inert gas, heated to 150°C, and reacted for 0.5h. Then the temperature was raised to 200°C and reacted for 0.5h. Finally, the temperature was raised to 240°C and reacted for 2h. Excess moisture was removed by purging with nitrogen gas. An antioxidant was added to obtain the hybrid polyamide material. Comparative Example 3
[0031] 185g of pentanediamine monomer and 230g of sebacic acid monomer were weighed and added to the reactor. The reactor was purged with an inert gas and heated to 150°C for 0.5h. The temperature was then increased to 200°C and reacted for 0.5h. Finally, the temperature was increased to 240°C and reacted for 2h. Excess moisture was removed by purging with nitrogen. An antioxidant was added to obtain the hybrid polyamide material.
[0032]
[0033] The test results above show that the addition of organic / inorganic hybrid monomers significantly improves the heat resistance of the material.
Claims
1. A novel hybrid polyamide material, characterized in that, The hybrid polyamide contains 1%-50% organic / inorganic hybrid monomers, 1%-50% diamine monomers, 100% diacid monomers, 1%-2% antioxidants, and the molar ratio of diamine monomers to diacid monomers is 1:
1.
2. The novel hybrid polyamide material according to claim 1, characterized in that, The organic / inorganic hybrid monomer is at least one of bis(4-aminophenoxy)dimethylsilane and aminopropyl-terminated polydimethylsiloxane.
3. The novel hybrid polyamide material according to claim 1, characterized in that... The diamine monomer is one or more of hexamethylenediamine, pentanediamine, decanediamine, and dodecyldiamine.
4. The novel hybrid polyamide material according to claim 1, characterized in that... The diacid monomers are one or more of adipic acid, glutaric acid, sebacic acid, and dodecyl diacid.
5. The novel hybrid polyamide material according to claim 1, characterized in that... The antioxidant is one or more of aromatic amine antioxidants and hindered phenolic antioxidants.
6. The method for preparing the novel hybrid polyamide material according to claim 1, characterized in that... Includes the following steps: The organic / inorganic hybrid monomer, diamine monomer, and diacid monomer are weighed and added to a reaction vessel. The mixture is purged with an inert gas, heated to 140-150℃, and reacted for 0.5-1 hour. Then the temperature is raised to 180-200℃ and reacted for 0.5-1 hour. Finally, the temperature is raised to 240-260℃ and reacted for 1-3 hours. Excess moisture is removed by purging with an inert gas, and an antioxidant is added to obtain the hybrid polyamide material.
7. The preparation method according to claim 6, characterized in that, The inert gas is either nitrogen or argon.
8. A novel hybrid polyamide material according to any one of claims 1-5, characterized in that... Used in the field of high-temperature resistant polyamides.
Citation Information
Patent Citations
Dimethyl silicone polymer-polyamide multi-block elastomer and production method thereof
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Organic silicon modified polyamide as well as preparation method and application thereof
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Polyimide hybrid material
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