Ultrasonic level meter

Abstract

The invention discloses an ultrasonic level meter which comprises an ultrasonic detection assembly, an ultrasonic control assembly and a control assembly. The ultrasonic detection assembly comprises an ultrasonic intelligent sensor, an outer shell connected with the ultrasonic intelligent sensor and a connecting part arranged on the outer shell. The control assembly comprises a single-chip microcomputer part, a network communication unit, a mobile communication unit and a positioning unit which are electrically connected with the ultrasonic intelligent sensor, the network communication unit and the mobile communication unit are externally connected with the Internet, the control assembly is arranged in the outer shell, and a heat dissipation part is arranged on the single-chip microcomputer part; an adjusting piece is arranged on the heat dissipation component, in the blowing process, an operator can control rotation of the heat dissipation plate by rotating the guide circular plate according to needs, so that the heat dissipation opening is opened or closed, heat dissipation is conducted, controllability of temperature heat dissipation can be achieved through the heat dissipation structure, and the heat dissipation efficiency is improved. And heat preservation can be conducted in the environment needing heat preservation, two different effects are achieved through one set of structure, and the structure is simple and integrally controllable.

Description

Technical Field

[0001] This invention relates to the technical field of ultrasonic intelligent sensors, and more particularly to an ultrasonic level gauge. Background Technology

[0002] An ultrasonic level gauge measures the level by transmitting ultrasonic signals emitted by an ultrasonic intelligent sensor, which are reflected back from the surface of the liquid or solid material and received by a probe. The gauge measures the entire duration of the ultrasonic wave to measure the level. It features comprehensive material / liquid level measurement and control, data transmission, and human-machine interaction functions.

[0003] Currently, ultrasonic level gauges require manual, direct data acquisition from the gauges themselves; remote acquisition is not possible. This necessitates significant manpower and time investment when acquiring data from multiple gauges. Furthermore, in safety monitoring applications, if one or more gauges show abnormal readings, it's difficult for personnel to quickly pinpoint the location of the anomaly, thus delaying the optimal application of safety measures.

[0004] In addition, existing ultrasonic level gauges do not have heat dissipation capabilities, which will cause heat accumulation after long-term use and affect their service life. Summary of the Invention

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0006] In view of the problems existing in the current ultrasonic level gauges, the present invention is proposed.

[0007] Therefore, the object of this invention is to provide an ultrasonic level gauge.

[0008] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an ultrasonic level gauge, comprising an ultrasonic detection component, including an ultrasonic intelligent sensor, an outer housing connected to the ultrasonic intelligent sensor, and a connecting component disposed on the outer housing; and a control component, including a microcontroller component, a network communication unit, a mobile communication unit, and a positioning unit electrically connected to the ultrasonic intelligent sensor, wherein the network communication unit and the mobile communication unit are connected to the Internet, the control component is disposed inside the outer housing, and the microcontroller component is provided with a heat dissipation component; the heat dissipation component is provided with an adjustment component.

[0009] In a preferred embodiment of the ultrasonic level gauge of the present invention, the outer casing includes a connecting housing connected to the ultrasonic intelligent sensor, a connecting frame disposed on the connecting housing, and a mounting cavity disposed within the connecting housing. The control component is disposed within the mounting cavity, and a heat dissipation opening is provided on the side wall of the mounting cavity for heat dissipation. The heat dissipation component is disposed near the heat dissipation opening, and the heat dissipation component connects the heat dissipation opening to the microcontroller component.

[0010] In a preferred embodiment of the ultrasonic level gauge of the present invention, the heat dissipation component includes a heat dissipation frame disposed at the heat dissipation opening, a sliding strip slidably connected to one side of the heat dissipation frame, a plurality of rotating rings rotatably connected to the sliding strip, and a heat dissipation strip disposed on the rotating ring. A heat dissipation plate is disposed on the heat dissipation strip, and a plurality of heat dissipation channels are disposed on the heat dissipation plate. After the plurality of heat dissipation plates rotate, they block the heat dissipation opening.

[0011] In a preferred embodiment of the ultrasonic level gauge of the present invention, the adjusting component includes a rotating connecting rod rotatably connected to the heat dissipation frame, a guide circular plate rotatably connected to the rotating connecting rod, a guide rod eccentrically hinged to the guide circular plate, a telescopic component rotatably connected to the inner wall of the first connecting box, and a connecting block disposed at the end of the telescopic component. The connecting block is connected to the sliding strip, and the guide rod is connected to the end of the telescopic component.

[0012] In a preferred embodiment of the ultrasonic level gauge of the present invention, the telescopic component includes a locking block disposed on the heat dissipation frame, a bolt rod disposed on the locking block, an extension locking rod threadedly connected to the bolt rod, an extension rod slidably connected to the extension locking rod, a stop plate disposed at the end of the extension rod and connected to the connecting block, and a spring disposed between the stop plate and the extension locking rod. The outer wall of the extension rod is provided with external threads, and the extension rod is connected to an adjusting ring through the external threads. The other end of the spring is connected to the adjusting ring.

[0013] In a preferred embodiment of the ultrasonic level gauge of the present invention: the heat dissipation channels of the plurality of heat dissipation plates are interconnected after rotation, a guide plate is provided in each heat dissipation channel, a copper heat dissipation radiator is provided at the rear end of the heat dissipation frame, a heat dissipation fan is provided on the copper heat dissipation radiator, the copper heat dissipation radiator is connected to the microcontroller component, and a rotating groove is provided on the heat dissipation plates at the uppermost and lowermost ends, the rotating groove being connected to the heat dissipation channel after rotation.

[0014] In a preferred embodiment of the ultrasonic level gauge of the present invention, a first rotating wheel is provided on the rotating groove, a second rotating wheel is provided on the heat dissipation frame, and a plurality of locking rods are provided on both the first and second rotating wheels. After the uppermost heat dissipation plate rotates, the locking rods on the first rotating wheel cooperate with the locking rods on the second rotating wheel. A plurality of circulating grooves are provided in the mounting cavity, and the rotating grooves cooperate with the circulating grooves after rotation.

[0015] In a preferred embodiment of the ultrasonic level gauge of the present invention, a mounting groove for mounting a second rotating wheel is provided on the side wall of the mounting cavity.

[0016] In a preferred embodiment of the ultrasonic level gauge of the present invention, the second rotating wheel is provided with a drive motor, and the other end of the rotating connecting rod is provided with a drive motor.

[0017] In a preferred embodiment of the ultrasonic level gauge of the present invention, a guide strip is provided on the guide plate.

[0018] The beneficial effects of this invention are as follows: When performing ultrasonic level measurement, the heat generated during ultrasonic measurement is generated on the microcontroller component, and the internal heat is transferred to the copper heat sink and blown out by the cooling fan.

[0019] During the blowing process, the operator can rotate the guide plate as needed. The rotation of the guide plate will drive the guide rod to move back and forth. The front end of the guide rod is connected to the sliding strip through the connecting block, which in turn drives the sliding strip to slide. The sliding strip drives the rotation of several rotating rings, which in turn drives the rotation of the heat sink plate, thereby opening or closing the heat sink opening to dissipate heat.

[0020] In certain environments, it is necessary to keep the internal temperature warm. The operator can rotate the guide plate to close the heat dissipation opening after rotating several heat dissipation plates. At this time, the second rotating wheel cooperates with the lever on the first rotating wheel. Then, the drive motor drives the second rotating wheel and the first rotating wheel to rotate, thereby driving the rotating groove to rotate. This makes the rotating groove connected with the circulation groove. At this time, the heat will flow and diffuse to the entire outer shell through the circulation groove, thus achieving heat preservation.

[0021] This heat dissipation structure allows for controllable temperature dissipation and can also be used for heat preservation in environments where insulation is required. One structure achieves two different effects, and the structure is simple and controllable overall. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the ultrasonic level gauge of the present invention.

[0023] Figure 2 This is a schematic diagram of the overall structure of the ultrasonic level gauge of the present invention.

[0024] Figure 3 This is a schematic diagram of the heat dissipation component of the ultrasonic level gauge of the present invention.

[0025] Figure 4 This is a schematic diagram of the control components of the ultrasonic level gauge of the present invention.

[0026] Figure 5 This is a schematic diagram of the heat sink of the ultrasonic level meter of the present invention in the open state.

[0027] Figure 6 This is a schematic diagram of the heat dissipation component of the ultrasonic level gauge of the present invention. Figure 7 This is an enlarged schematic diagram of the adjustment component of the ultrasonic level gauge of the present invention.

[0028] Figure 8 This is a schematic diagram of the heat sink of the ultrasonic level meter of the present invention in the closed state.

[0029] Figure 9 The ultrasonic level gauge of the present invention Figure 8 Enlarged diagram of part A in the middle. Detailed Implementation

[0030] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0032] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0033] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example 1

[0034] Reference Figure 1-9 The first embodiment of the present invention provides an ultrasonic level gauge, including an ultrasonic detection component 100. In this embodiment, the ultrasonic detection component 100 includes an ultrasonic smart sensor 101, an outer housing 102 connected to the ultrasonic smart sensor 101, and a connecting component 103 disposed on the outer housing 102. The outer housing 102 is disposed on the upper end of the ultrasonic smart sensor 101, and the connecting component 103 connects the outer housing 102 to the ultrasonic smart sensor 101.

[0035] In this embodiment, the connecting component 103 includes an opening provided on the housing 102, a flange provided on the opening, and a flange also provided on the ultrasonic smart sensor 101, and the two are connected by bolts.

[0036] Furthermore, the present invention also includes a control component 200. In this embodiment, the control component 200 includes a microcontroller component 201 electrically connected to the ultrasonic smart sensor 101, a network communication unit 202, a mobile communication unit 203, and a positioning unit 204. The network communication unit 202 and the mobile communication unit 203 are connected to the Internet. The control component is located inside the housing 102. The control component 200 is mainly a circuit control system. The network communication unit 202 is used to access a wired or wireless local area network. The mobile communication unit 203 accesses a mobile communication network via a remote SIM card. The microcontroller calculates the position of the object based on the ultrasonic signal received by the ultrasonic smart sensor and obtains the remote SIM card information allocated by the server from the wireless local area network accessed by the network communication unit 202 to enable the mobile communication unit 203 to access the mobile communication network. The positioning unit 204 is used to determine the position of the ultrasonic level gauge.

[0037] Furthermore, a heat dissipation component 205 is provided on the microcontroller component 201, and an adjustment component 300 is provided on the heat dissipation component 205.

[0038] Furthermore, in this embodiment, the outer shell 102 includes a connecting shell 102a connected to the ultrasonic smart sensor 101, a connecting frame 102b disposed on the connecting shell 102a, and a mounting cavity 102c disposed inside the connecting shell 102a. The connecting shell 102a is sleeved on the outside of the connecting frame 102b, thereby forming a double-layer shell shape, which in turn achieves the effect of heat insulation.

[0039] Furthermore, the control component 200 is disposed inside the mounting cavity 102c, and a heat dissipation opening 102d for heat dissipation is provided on the side wall of the mounting cavity 102c. The heat dissipation component 205 is disposed near the heat dissipation opening 102d. The heat dissipation component 205 connects the heat dissipation opening 102d to the microcontroller component 201, thereby ensuring that the heat generated inside is dissipated in a timely manner.

[0040] In this embodiment, the heat dissipation component 205 includes a heat dissipation frame 205a disposed at the heat dissipation opening 102d, a sliding strip 205b slidably connected to one side of the heat dissipation frame 205a, a plurality of rotating rings 205c rotatably connected to the sliding strip 205b, and heat dissipation strips 205d disposed on the rotating rings 205c. The heat dissipation frame 205a is bolted to the heat dissipation opening 102d, and the sliding strip 205b is disposed on one of the vertical sides of the heat dissipation frame 205a. A groove is provided on the side wall of the heat dissipation frame 205a, and the rotating rings 205c are rotatably connected in the groove. A plurality of slots are provided at the upper end of the sliding strip 205b, and side strips extend from the rotating rings 205c. The side strips are rotatably connected in the slots. Thus, when the sliding strip 205b moves, it will drive the rotating rings 205c to rotate.

[0041] Furthermore, a heat dissipation plate 206 is provided on the heat dissipation strip 205d. The heat dissipation plate 206 is arranged along the length direction of the heat dissipation frame 205a. Several heat dissipation channels 207 are provided on the heat dissipation plate 206. Several heat dissipation plates 206 are spliced ​​into a louver shape. After several heat dissipation plates 206 are rotated, the heat dissipation opening 102d is blocked. The heat dissipation plates 206 are equidistant from each other and gaps are left between them. An adjustment component 300 is provided on the heat dissipation frame 205a.

[0042] In this embodiment, the adjusting member 300 includes a rotating connecting rod 301 rotatably connected to the heat dissipation frame 205a, a guide circular plate 302 rotatably connected to the rotating connecting rod 301, a guide rod 303 eccentrically hinged to the guide circular plate 302, a telescopic member 304 rotatably connected to the heat dissipation frame 205a, and a connecting block 305 disposed at the end of the telescopic member 304. The connecting block 305 is connected to the sliding strip 205b, and the guide rod 303 is connected to the end of the telescopic member 304.

[0043] Preferably, when the guide plate 302 rotates, it will drive the guide rod 303 to move back and forth. The front end of the guide rod 303 is connected to the sliding bar 205b through the connecting block 305, which will drive the sliding bar 205b to slide. The sliding bar 205b drives the rotation of several rotating rings 205c, thereby driving the rotation of the heat sink 206, which will open or close the heat sink opening 102d.

[0044] In this embodiment, the telescopic component 304 includes a locking block 304a disposed on the heat dissipation frame 205a, a bolt rod 304b disposed on the locking block 304a, an extension locking rod 304c threadedly connected to the bolt rod 304b, an extension rod 304d slidably connected to the extension locking rod 304c, a stop plate 304e disposed at the end of the extension rod 304d and connected to the connecting block 305, and a spring 304f disposed between the stop plate 304e and the extension locking rod 304c. An external thread is provided on the outer wall of the extension locking rod 304c, and an adjusting ring 306 is connected to the extension locking rod 304c through the external thread. The other end of the spring 304f is connected to the adjusting ring 306.

[0045] Using the above structure, the opening degree of the heat sink 206 can be controlled, and the operator can rotate the adjusting ring 306 to adjust the length of the spring 304f, thereby controlling the moving distance and moving resistance of the guide rod 303, and thus controlling the rotation angle of the heat sink 206.

[0046] Furthermore, after several heat sinks 206 rotate and close the heat dissipation openings 102d, the heat dissipation channels 207 are interconnected. A guide plate 400 is provided in each heat dissipation channel 207. A copper heat sink 401 is provided at the rear end of the heat dissipation frame. A heat dissipation fan 402 is provided on the copper heat sink 401. The heat dissipation fan 402 sends the heat on the copper heat sink 401 outward. The copper heat sink 401 is connected to the microcontroller component 201. A rotating groove 403 is provided on the heat sinks 206 at the top and bottom. The rotating groove 403 is an arc-shaped groove with a semi-circular cross-section and a length of one-quarter of the arc length. After the rotating groove 403 rotates, it connects with the heat dissipation channel 207.

[0047] Furthermore, a first rotating wheel 404 is provided on the rotating groove 403, and a second rotating wheel 405 is provided on the heat dissipation frame 205a. Several locking rods 406 are provided on both the first rotating wheel 404 and the second rotating wheel 405. After the uppermost heat dissipation plate 206 rotates, the locking rods 406 on the first rotating wheel 404 cooperate with the locking rods 406 on the second rotating wheel 405. Several circulating grooves 407 are provided in the mounting cavity 102c, which cooperate with the circulating grooves 407 after the rotating groove 403 rotates.

[0048] Preferably, an installation groove 408 for mounting the second rotating wheel 405 is provided on the side wall of the mounting cavity 102c.

[0049] A drive motor is provided on the second rotating wheel 405, a drive motor is provided at the other end of the rotating connecting rod 301, and a guide strip is provided on the guide plate 400.

[0050] Operation process: When performing ultrasonic level measurement, the heat generated during ultrasonic measurement is generated on the microcontroller component 201. The internal heat is transferred to the copper heat sink 401 and blown out by the cooling fan 402.

[0051] During the blowing process, the operator can rotate the guide plate 302 as needed. The rotation of the guide plate 302 will drive the guide rod 303 to move back and forth. The front end of the guide rod 303 is connected to the sliding bar 205b through the connecting block 305, which will drive the sliding bar 205b to slide. The sliding bar 205b drives the rotation of several rotating rings 205c, which in turn drives the rotation of the heat sink 206, thereby opening or closing the heat sink opening 102d to dissipate heat.

[0052] In certain environments, it is necessary to maintain the internal temperature. The operator can rotate the guide plate 302 to close the heat dissipation opening 102d after rotating several heat dissipation plates 206. At this time, the second rotating wheel 405 cooperates with the latch 406 on the first rotating wheel 404. The drive motor drives the second rotating wheel 405 and the first rotating wheel 404 to rotate, thereby driving the rotating groove 403 to rotate. This makes the rotating groove 403 connected to the circulation groove 407. At this time, the heat will flow and diffuse to the entire outer shell 102 through the circulation groove 407, thus achieving heat preservation.

[0053] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0054] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0055] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0056] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An ultrasonic level gauge, characterized in that: include, The ultrasonic detection assembly (100) includes an ultrasonic smart sensor (101), an outer housing (102) connected to the ultrasonic smart sensor (101), and a connecting component (103) disposed on the outer housing (102); and, The control component (200) includes a microcontroller component (201) electrically connected to the ultrasonic smart sensor (101), a network communication unit (202), a mobile communication unit (203), and a positioning unit (204). The network communication unit (202) and the mobile communication unit (203) are connected to the Internet. The control component (200) is located inside the housing (102). The microcontroller component (201) is provided with a heat dissipation component (205). An adjustment component (300) is provided on the heat dissipation component (205).

2. The ultrasonic level gauge as described in claim 1, characterized in that: The outer casing (102) includes a connecting housing (102a) connected to the ultrasonic smart sensor (101), a connecting frame (102b) disposed on the connecting housing (102a), and a mounting cavity (102c) disposed within the connecting housing (102a). The control component (200) is disposed within the mounting cavity (102c), and a heat dissipation opening (102d) is provided on the side wall of the mounting cavity (102c). The heat dissipation component (205) is disposed near the heat dissipation opening (102d), and the heat dissipation component (205) connects the heat dissipation opening (102d) to the microcontroller component (201).

3. The ultrasonic level gauge as described in claim 2, characterized in that: The heat dissipation component (205) includes a heat dissipation frame (205a) disposed at the heat dissipation opening (102d), a sliding strip (205b) slidably connected to one side of the heat dissipation frame (205a), a plurality of rotating rings (205c) rotatably connected to the sliding strip (205b), and heat dissipation strips (205d) disposed on the rotating rings (205c). A heat dissipation plate (206) is disposed on the heat dissipation strip (205d), and a plurality of heat dissipation channels (207) are disposed on the heat dissipation plate (206). After the plurality of heat dissipation plates (206) rotate, they block the heat dissipation opening (102d).

4. The ultrasonic level gauge as described in claim 3, characterized in that: The adjusting component (300) includes a rotating connecting rod (301) rotatably connected to the heat dissipation frame (205a), a guide circular plate (302) rotatably connected to the rotating connecting rod (301), a guide rod (303) eccentrically hinged to the guide circular plate (302), a telescopic component (304) rotatably connected to the inner wall of the first connecting box (103a), and a connecting block (305) disposed at the end of the telescopic component (304). The connecting block (305) is connected to the sliding strip (205b), and the guide rod (303) is connected to the end of the telescopic component (304).

5. The ultrasonic level gauge as described in claim 4, characterized in that: The telescopic component (304) includes a locking block (304a) disposed on the heat dissipation frame (205a), a bolt rod (304b) disposed on the locking block (304a), an extension locking rod (304c) threadedly connected to the bolt rod (304b), an extension rod (304d) slidably connected to the extension locking rod (304c), a stop plate (304e) disposed at the end of the extension rod (304d) and connected to the connecting block (305), and a spring (304f) disposed between the stop plate (304e) and the extension locking rod (304c). The outer wall of the extension rod (304c) is provided with external threads, and the extension rod (304c) is connected to the adjusting ring (306) through the external threads. The other end of the spring (304f) is connected to the adjusting ring (306).

6. The ultrasonic level gauge as described in claim 3, characterized in that: After the heat sinks (206) rotate, the heat dissipation channels (207) are interconnected. Each heat dissipation channel (207) is provided with a guide plate (400). A copper heat sink (401) is provided at the rear end of the heat dissipation frame. A heat dissipation fan (402) is provided on the copper heat sink (401). The copper heat sink (401) is connected to the microcontroller component (201). A rotating groove (403) is provided on the heat sinks (206) at the top and bottom. After the rotating groove (403) rotates, it is connected to the heat dissipation channel (207).

7. The ultrasonic level gauge as described in claim 6, characterized in that: The rotating groove (403) is provided with a first rotating wheel (404), and the heat dissipation frame (205a) is provided with a second rotating wheel (405). Both the first rotating wheel (404) and the second rotating wheel (405) are provided with a plurality of locking rods (406). After the uppermost heat dissipation plate (206) rotates, the locking rods (406) on the first rotating wheel (404) cooperate with the locking rods (406) on the second rotating wheel (405). The mounting cavity (102c) is provided with a plurality of circulating grooves (407). After the rotating groove (403) rotates, it cooperates with the circulating grooves (407).

8. The ultrasonic level gauge as described in claim 7, characterized in that: The mounting cavity (102c) has a mounting groove (408) on its side wall for mounting the second rotating wheel (405).

9. The ultrasonic level gauge as described in claim 7, characterized in that: The second rotating wheel (405) is equipped with a drive motor, and the other end of the rotating connecting rod (301) is equipped with a drive motor.

10. The ultrasonic level gauge as described in claim 4, characterized in that: The guide plate (400) is provided with guide strips.

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