Vibration reduction method, system, semiconductor vibration reduction apparatus, and storage medium
By performing grouped logical axis fitting and refitting on the support legs of the vibration reduction platform, combined with modal decoupling and historical data screening, the problem of low accuracy in existing vibration reduction technologies is solved, and a more efficient vibration reduction effect is achieved.
Patent Information
- Application Number
- CN202511476567.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-15
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2045-10-15
AI Technical Summary
Existing vibration reduction technologies lack precision, leading to resource waste and inefficiency, especially in semiconductor manufacturing where vibration control of precision components is not accurate enough.
By grouping the support legs of the vibration reduction platform, performing logical axis fitting and refitting, the overall logical axis data is obtained. Vibration reduction processing is then performed based on the overall logical axis data until the data does not exceed a preset threshold. Combined with modal decoupling and historical data filtering rules, the vibration reduction effect is optimized.
This improved vibration reduction accuracy, avoided the problem of local optima leading to overall imbalance, ensured the stability and precision of the vibration reduction effect, and reduced resource waste.
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Figure CN120949846B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of vibration reduction management, and in particular to a vibration reduction method, system, semiconductor vibration reduction device and storage medium. BACKGROUND
[0002] Currently, during the operation of industrial equipment, vibration not only affects the stability of the equipment, but also can seriously affect product quality, especially in the field of semiconductor manufacturing, even a small vibration can cause damage or performance degradation of precision devices. Therefore, how to effectively detect and control the vibration of the equipment has become a key link to improve production efficiency and product quality.
[0003] In the prior art, in the process of vibration reduction, the number of support legs often needs to be increased, but the more the number of support legs, the more the complexity of the vibration reduction system and the amount of data calculation, and the vibration reduction system generally only vibrates in part of the area or only needs to pay attention to the vibration situation in part of the area, resulting in waste of resources and low efficiency.
[0004] Therefore, in the prior art, in the process of vibration reduction, the vibration reduction precision is not high. SUMMARY
[0005] The embodiments of the present application provide a vibration reduction method, system, semiconductor vibration reduction device and storage medium, which aims to solve the problem of low vibration reduction precision in the prior art.
[0006] To solve the above technical problems, the embodiments of the present application provide the following technical solutions:
[0007] A vibration reduction method, comprising:
[0008] obtaining sensor data of support legs of a vibration reduction platform;
[0009] grouping the support legs, and performing logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs;
[0010] performing re-fitting on all the logical axis data to obtain overall logical axis data of the vibration reduction platform, and performing vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold.
[0011] Optionally, the performing re-fitting on all the logical axis data to obtain overall logical axis data of the vibration reduction platform, and performing vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold, further comprises:
[0012] Performing vibration reduction processing on each group of support legs according to the logical axis data until the logical axis data of all groups are not greater than the preset vibration reduction threshold.
[0013] Optionally, the grouping of the support legs and the logical axis fitting of the sensor data of each group of support legs to obtain the logical axis data of the group of support legs comprises:
[0014] Dividing the support legs into multiple groups according to a preset grouping rule to obtain multiple groups of support legs;
[0015] Performing modal matrix transformation on the sensor data of each group of support legs to obtain the logical axis data of the group of support legs;
[0016] The preset grouping rule comprises at least one of a fixed occupied area rule, a fixed support leg number rule, and a specified grouping rule entered by a user.
[0017] Optionally, before obtaining the sensor data of the support legs of the vibration reduction platform, the method further comprises:
[0018] Performing vibration reduction region screening on the vibration reduction platform according to a preset screening rule to determine a region to be reduced in vibration;
[0019] The preset screening rule comprises at least one of a load-bearing region screening rule, an environmental vibration sensitivity screening rule, a historical vibration reduction data screening rule, and a specified region screening rule entered by a user.
[0020] Optionally, the vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold comprises:
[0021] When the overall logical axis data is greater than the preset vibration reduction threshold, performing modal decoupling on the logical axis data, and determining a vibration reduction adjustment result of each support leg according to the decoupling result;
[0022] Performing vibration reduction processing on the support legs according to the vibration reduction adjustment result until the overall logical axis data is not greater than the preset vibration reduction threshold.
[0023] Optionally, the obtaining of the sensor data of the support legs of the vibration reduction platform comprises:
[0024] Determining a vibration reduction detection interval period according to the natural vibration period of the vibration reduction platform;
[0025] Performing periodic speed displacement detection on the support legs according to the vibration reduction detection interval period to obtain the sensor data of the support legs.
[0026] Optionally, the step of determining the preset vibration reduction threshold comprises:
[0027] obtaining historical sensor data of the damping platform in a steady state;
[0028] determining a mean value of the historical sensor data as the preset damping threshold.
[0029] A damping system, comprising:
[0030] a sensor data obtaining module, configured to obtain sensor data of support legs of a damping platform;
[0031] a logical axis data obtaining module, configured to group the support legs, and perform logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs;
[0032] a damping processing module, configured to perform re-fitting on all the logical axis data to obtain overall logical axis data of the damping platform, and perform damping processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset damping threshold.
[0033] A semiconductor damping device, comprising a memory and a processor, the memory stores a computer program, and the computer program is executed by the processor to make the processor perform the following steps:
[0034] obtaining sensor data of support legs of a damping platform;
[0035] grouping the support legs, and performing logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs;
[0036] performing re-fitting on all the logical axis data to obtain overall logical axis data of the damping platform, and performing damping processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset damping threshold.
[0037] A computer readable storage medium, which stores a computer program, and the computer program is loaded by a processor to execute the steps in the damping method described above.
[0038] In the embodiment of the present application, by grouping the support legs and logically fitting the sensor data of each group of support legs, the redundant interference of local sensor data can be eliminated, and the core vibration dimension of each group of support legs can be accurately extracted; by re-fitting all the logical axis data to obtain the overall logical axis data of the vibration reduction platform, and performing vibration reduction processing on the support legs according to the overall logical axis data, the problem of local optimization and overall imbalance caused by isolated analysis of single sensor data can be avoided; taking the overall logical axis data being not greater than a preset vibration reduction threshold as a vibration reduction closed-loop control condition, the vibration reduction result can be continuously fed back and optimized to ensure the stability of the vibration reduction effect. BRIEF DESCRIPTION OF DRAWINGS
[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0040] Figure 1 is a scene schematic diagram of an embodiment of the vibration reduction system provided by the embodiment of the present application.
[0041] Figure 2 is a scene schematic diagram of another embodiment of the vibration reduction system provided by the embodiment of the present application.
[0042] Figure 3 is a flowchart of an embodiment of the vibration reduction method provided by the embodiment of the present application.
[0043] Figure 4 is a three-dimensional structure schematic diagram of an embodiment of the vibration reduction platform provided by the embodiment of the present application.
[0044] Figure 5 is a front view structure schematic diagram of an embodiment of the vibration reduction platform provided by the embodiment of the present application.
[0045] Figure 6 is a result schematic diagram of an embodiment of the grouping result of the support legs provided by the embodiment of the present application.
[0046] Figure 7 is a result schematic diagram of an embodiment of the re-fitting of the logical axis data provided by the embodiment of the present application.
[0047] Figure 8 is a structure schematic diagram of an embodiment of the vibration reduction system provided by the embodiment of the present application.
[0048] Figure 9 is a structure schematic diagram of an embodiment of the semiconductor vibration reduction device provided by the embodiment of the present application. DETAILED DESCRIPTION
[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0050] In the following description, specific embodiments of the present application will be described with reference to steps and symbolic representations of operations that are performed by one or more computers. Unless specifically stated otherwise, as is apparent from the following discussions, it is appreciated that throughout the specification, discussions utilizing terms such as "processing," "computing," "calculating," "determining," "displaying," and / or "generating" involve the actions and / or processes of a computer system, or similar electronic computing device.
[0051] The term "module" or "unit" used herein can be regarded as a software object executed on the operating system. Different components, modules, engines and services described herein can be regarded as implementation objects on the operating system. The apparatus and method described herein are preferably implemented in software, but can also be implemented in hardware, both of which are within the scope of the present application.
[0052] The embodiments of the present application provide a vibration reduction method, system, semiconductor vibration reduction device and storage medium.
[0053] Please refer to Figure 1 , Figure 1 The scene schematic diagram of an embodiment of the vibration reduction system provided by the embodiments of the present application can include a client 100 and a server 200, the client 100 and the server 200 are connected through a network, the server 200 is integrated with a vibration reduction device, the server 200 can be a work platform server (i.e. a server loaded with a work platform), such as Figure 1The server 200 can be accessed by the client 100. The server 200 in the embodiment of the application is mainly used to acquire sensor data of the support legs of the vibration reduction platform, group the support legs, perform logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs, perform re-fitting on all the logical axis data to obtain overall logical axis data of the vibration reduction platform, and perform vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold.
[0054] In the embodiment of the application, the server 200 can be a stand-alone server, a server network or a server cluster composed of servers. For example, the server 200 described in the embodiment of the application includes but is not limited to a computer, a network host, a single network server, a plurality of network server sets or a cloud server composed of a plurality of servers. The cloud server is composed of a large number of computers or network servers based on cloud computing. In the embodiment of the application, the server and the client can communicate through any communication mode, including but not limited to mobile communication based on the 3rd Generation Partnership Project (3GPP), Long Term Evolution (LTE), Worldwide Interoperability for Microwave Access (WiMAX), computer network communication based on the TCP / IP Protocol Suite (TCP / IP) and User Datagram Protocol (UDP) protocol, etc.
[0055] It can be understood that the client 100 used in the embodiment of the application can be understood as a client device, which includes a device with receiving and transmitting hardware, i.e., a device with receiving and transmitting hardware capable of performing bidirectional communication on a bidirectional communication link. Such a client device can include a cellular or other communication device with a single-line display or a multi-line display or a cellular or other communication device without a multi-line display. The client 100 can be a desktop terminal or a mobile terminal, and can be one of a mobile phone, a tablet computer, a notebook computer, etc.
[0056] Those skilled in the art can understand that, Figure 1 The application environment shown in the embodiment of the application is only one application scenario of the scheme of the application, and does not constitute a limitation on the application scenario of the scheme of the application. Other application environments can also include more than Figure 1more or less servers, or server network connection relationships, for example Figure 1 In the figure, only 1 server and 2 clients are shown, and it can be understood that the vibration reduction system can also include one or more other servers, or / and one or more clients connected with the server network, which is not limited here.
[0057] In some embodiments of the present application, the work platform can be an enterprise office platform, for example, WeChat for enterprise, and taking the server 200 as an example, it can further include an enterprise office platform contact server, an enterprise office platform configuration management server and a Web management server. Enterprise users or developers can access the Web management server through a Web browsing terminal to configure the field configuration information on the enterprise office platform configuration management server, and set and store the enterprise user information of the enterprise employees of the enterprise office platform on the enterprise office platform contact server.
[0058] In addition, as shown in Figure 2 , Figure 2 The scene diagram of another embodiment of the vibration reduction system provided by the embodiment of the present application, the vibration reduction system can also include a storage end 300 for storing data, such as an object database, the object database stores object data, which can include speed data, displacement data, temperature data and other sensor data.
[0059] It should be noted that Figures 1-2 The scene diagram of the vibration reduction system shown in the figure is only an example, and the vibration reduction system and the scene described in the embodiment of the present application are used to more clearly illustrate the technical solution of the embodiment of the present application, and do not constitute a limitation on the technical solution provided by the embodiment of the present application. It can be known by those skilled in the art that with the evolution of the vibration reduction system and the appearance of new business scenarios, the technical solution provided by the embodiment of the present application is also applicable to similar technical problems.
[0060] The specific embodiments will be described in detail below.
[0061] In this embodiment, it will be described from the perspective of the vibration reduction device, which can be integrated in the server 200.
[0062] The present application provides a vibration reduction method, please refer to Figure 3 , Figure 3 The flowchart of one embodiment of the vibration reduction method provided by the embodiment of the present application, comprising:
[0063] S301: acquiring sensor data of the support leg of the vibration reduction platform;
[0064] It should be noted that the vibration reduction platform includes a plurality of vibration reduction areas, and at least one support leg is provided in each vibration reduction area.
[0065] In one specific embodiment, please refer to Figures 4 to 5 , Figure 4 This is a three-dimensional structural schematic diagram of an embodiment of the vibration reduction platform provided in this application. Figure 5 This is a front view structural schematic diagram of an embodiment of the vibration reduction platform provided in this application. Figures 4 to 5 As shown, the vibration damping platform includes a base plate 10 and a top plate 20 arranged at relative intervals, and a vibration damping support assembly 30 disposed between the base plate 10 and the top plate 20; the vibration damping support assembly 30 includes multiple support legs 310 and a data processor (not shown).
[0066] The vibration damping area can be the area where the top plate 20 is located, or it can be extended on the basis of the top plate 20, and the area obtained by setting the support leg 310 in the extended area is much larger than the area of the top plate 20. There is no limitation here.
[0067] The support leg 310 can be a component with telescopic properties such as a hydraulic cylinder, a pneumatic cylinder, or an elastic support column. Each support leg 310 is fixedly connected to the top plate 20, and its specific form is not limited to the structure shown in the figure.
[0068] The area to be damped refers to the area that needs to be damped, specifically all or part of the area to be damped. It should be noted that the area to be damped must include at least one support leg 310.
[0069] Sensor data refers to the velocity and / or displacement measurements of the support legs on the vibration damping platform collected by sensors, representing the real-time state of vibration energy transmission in the area where the support legs are located.
[0070] S302: Group the support legs and perform logical axis fitting on the sensor data of each group of support legs to obtain the logical axis data of that group of support legs;
[0071] Logical axis fitting refers to fusing sensor data from multiple support legs using a specific algorithm to fit a virtual logical axis, which represents the overall vibration state of that group of support legs. The logical axis data of each support leg group will serve as the basis for subsequent higher-level logical axis fitting, and will be aggregated level by level upwards to ultimately form a unified control input.
[0072] Specifically, the logical axis fitting method involves fitting two degrees of freedom of sensor data into six degrees of freedom, thereby obtaining the state data of each support leg in six degrees of freedom.
[0073] S303: Refit all logical axis data to obtain the overall logical axis data of the vibration reduction platform, and perform vibration reduction treatment on the support legs according to the overall logical axis data until the overall logical axis data is not greater than the preset vibration reduction threshold.
[0074] It should be noted that only two logical axis fittings are performed on the sensor data in the embodiment, and when the area range of the damping platform is large or higher precision processing of the sensor data of the support legs of the damping platform is required, multiple logical axis fittings can be performed on the sensor data, and the number of fittings is not limited, which will not be described here.
[0075] In a specific embodiment, the preset damping threshold is a reference value set according to the actual working condition of the damping platform. Generally, the preset damping threshold is set to zero.
[0076] The overall logical axis data is a global unified vibration state representation obtained by re-fitting all the grouped logical axis data, which reflects the vibration energy distribution of the damping platform as a whole in six degrees of freedom.
[0077] The damping processing specifically refers to offsetting the vibration energy of the damping platform by adjusting the extension length of the support legs, thereby reducing the vibration amplitude of the damping platform. That is, by applying a control signal to the support legs and the output of the external motor to offset the vibration, the hydraulic or pneumatic pressure inside the support legs changes, thereby changing the extension state of the support legs to effectively suppress the vibration of the damping platform.
[0078] In summary, by grouping the support legs and fitting the sensor data of each group of support legs, the embodiment can eliminate the redundant interference of local sensor data and accurately extract the core vibration dimension of each group of support legs. By re-fitting all the logical axis data to obtain the overall logical axis data of the damping platform, and performing damping processing on the support legs according to the overall logical axis data, the problem of local optimization and overall imbalance caused by isolated analysis of a single sensor data can be avoided. Taking the overall logical axis data being not greater than the preset damping threshold as the damping closed-loop control condition, the damping result can be continuously fed back and optimized to ensure the stability of the damping effect.
[0079] In a specific embodiment, in S301, in order to improve the pertinence of damping, before obtaining the sensor data of the support legs of the damping platform, the damping region of the damping platform is screened to determine the to-be-damped region of the damping platform, specifically including: screening the damping region of the damping platform based on a preset screening rule to determine the to-be-damped region; wherein the preset screening rule includes at least one of a load area screening rule, an environmental vibration sensitivity screening rule, a historical damping data screening rule, and a specified region screening rule entered by a user.
[0080] It should be noted that the load area screening rule specifically refers to preferentially identifying and screening out the region with large load or concentrated load as the to-be-damped region based on the static load distribution characteristics of the damping platform, i.e., the load distribution and weight concentration degree on the damping platform.
[0081] The environmental vibration sensitivity screening rule refers to prioritizing the screening of highly sensitive areas that require focused vibration reduction based on the sensitivity of specific areas on the vibration reduction platform (such as areas containing precision instruments, high-precision equipment, or critical components with extremely low vibration tolerance).
[0082] The historical vibration reduction data screening rule refers to analyzing the execution records of historical vibration reduction measures and identifying areas that repeatedly trigger vibration reduction requirements or whose vibration reduction effects fail to meet standards as areas to be affected by vibration reduction.
[0083] The input-defined area filtering rules refer to allowing users to manually specify specific areas of interest through the input interface. In other words, the system can filter specific areas according to the user's actual needs, thereby improving the system's flexibility and applicability.
[0084] Furthermore, this application can also use multiple rules for cross-filtering (such as prioritizing the identification of critical load-bearing areas, vibration-sensitive areas, and user-specified areas) to accurately pinpoint the core areas that truly require vibration reduction, thus avoiding ineffective processing of non-critical areas, which will not be elaborated here.
[0085] In summary, this embodiment achieves accurate identification of the area to be vibration-damped by combining multi-dimensional preset rules such as load-bearing area, environmental vibration sensitivity, historical vibration reduction data, and input of a specified area.
[0086] In one specific embodiment, since the vibration damping platform does not need to perform vibration damping adjustments in real time, in order to reduce data redundancy, the acquisition of sensor data of the support leg specifically includes: determining the vibration damping detection interval period based on the inherent vibration period of the vibration damping platform; performing periodic velocity displacement detection on the support leg based on the vibration damping detection interval period to obtain the sensor data of the support leg.
[0087] It should be noted that the inherent vibration period of the vibration reduction platform refers to the vibration characteristics of the system itself under the condition of no external interference. It reflects the core vibration characteristics of the vibration reduction platform. By making reasonable use of this periodicity, it can be ensured that periodic detection can completely capture key dynamic information in the vibration process (such as vibration peak value, periodic characteristics, etc.), and avoid data loss due to excessively long detection intervals or redundancy due to excessively short detection intervals.
[0088] Periodic vibration velocity testing of the support legs can avoid the energy consumption and computational resource waste caused by high-frequency testing, and prevent the loss of key data caused by low-frequency testing. It can achieve dynamic adaptation between the testing frequency and the vibration characteristics of the system, and improve the testing economy while ensuring data quality.
[0089] In a specific embodiment, in S302, in order to group the support legs and logically axis fit the sensor data of each group of support legs to obtain the logical axis data of the group of support legs, specifically includes: dividing the support legs into multiple groups based on the preset grouping rule to obtain multiple groups of support legs; modal matrix transformation is performed on the sensor data of each group of support legs to obtain the logical axis data of the group of support legs; wherein the preset grouping rule includes at least one of the fixed occupied area rule, the fixed support leg number rule, and the specified grouping rule entered by the user.
[0090] It should be noted that the fixed occupied area rule specifically refers to dividing the support legs into regions according to a preset area threshold, ensuring that the physical area covered by each group of support legs is substantially consistent.
[0091] The fixed support leg number rule means that the support legs are evenly grouped according to the set number, ensuring that the number of support legs in each group is equal or close, so as to realize balanced distribution of the load.
[0092] The specified grouping rule entered by the user can include user-defined grouping preferences, such as targeted grouping according to the physical location, functional area, or historical failure rate of the structure where the support legs are located. Specifically, a certain group of support legs can also be distributed in non-adjacent physical areas, and the grouping strategy can also be flexibly adjusted according to actual needs, thereby improving the accuracy of logical axis fitting and the level of fine-tuning of vibration control.
[0093] Modal matrix transformation means mapping the sensor data of each support leg from physical space to modal space through mathematical modeling technology. Specifically, the six-degree-of-freedom motion information of the sensor data is decoupled into independent modal coordinates, thereby extracting the dominant vibration modal characteristics of the support leg group, and realizing coordinated analysis and control of the vibration behavior of multiple groups of support legs.
[0094] Specifically, in the modal matrix transformation process, a filtering algorithm is used to filter the sensor data, remove noise interference in the data, and retain the main vibration feature vector, thereby improving the accuracy and stability of the logical axis data, enhancing the recognition ability of the vibration reduction system to complex vibration patterns, and optimizing the execution effect of the vibration reduction control strategy.
[0095] In a specific embodiment, in order to intuitively display the grouping results of the support legs, please refer to Figure 6 , Figure 6 The result schematic diagram of the grouping results of the support legs provided by the embodiment of the present application, wherein there are a total of 16 support legs on the vibration reduction platform, which are evenly divided into 4 groups, each group including 4 support legs. By logically axis fitting the sensor data of each group of support legs, the data of 4 logical axes can be obtained.
[0096] In summary, by reasonably setting the grouping rules, the adaptability of the system to complex vibration modes can be improved, and the logical axis fitting is more accurate.
[0097] In a specific embodiment, in S303, after obtaining the logical axis data of each group of support legs, in order to perform vibration reduction, all the logical axis data is refitted to obtain the overall logical axis data of the vibration reduction platform, and the support legs are processed for vibration reduction according to the overall logical axis data, until the overall logical axis data is not greater than the preset vibration reduction threshold. It can also be replaced by:
[0098] Based on the logical axis data, each group of support legs corresponding to the logical axis data is processed for vibration reduction until the logical axis data is not greater than the preset vibration reduction threshold.
[0099] That is, in the embodiment, the logical axis data of each group of support legs is used as the basis for vibration reduction processing of each group of support legs, so that the vibration characteristics of each group meet the vibration reduction target, wherein the condition for determining that each group of support legs is vibration-reduced is that the logical axis data corresponding to the group of support legs is not greater than the preset vibration reduction threshold. That is, in the embodiment, each group of support legs is treated as an independent vibration reduction control unit.
[0100] In a specific embodiment, all the logical axis data is refitted to obtain the overall logical axis data of the vibration reduction platform, which means that the logical axis fitting is performed on all the logical axis data to obtain the overall logical axis data of the vibration reduction platform. Similar to the process of fitting the logical axis of the sensor data of each group of support legs in the foregoing, only the sensor data of each group of support legs is replaced by the logical axis data corresponding to each group of support legs for data conversion processing.
[0101] In a specific embodiment, in order to intuitively show the result of refitting the logical axis data, please refer to Figure 7 , Figure 7 The result diagram of one embodiment of the logical axis data refitting provided by the embodiment of the application corresponds to Figure 6 , wherein the secondary logical axis cabinet 1-4 controls the data of the logical axis 1-4, and the primary logical axis cabinet controls the overall logical axis data.
[0102] Obviously, a three-level logical axis cabinet, a four-level logical axis cabinet, etc. can also be set according to needs to realize multi-level fitting and management of the sensor data, which will not be repeated here.
[0103] Further, after obtaining the overall logical axis data, in order to perform vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold, specifically comprising: when the overall logical axis data is greater than the preset vibration reduction threshold, performing modal decoupling on the logical axis data, and determining vibration reduction adjustment results of the support legs respectively according to the decoupling results; performing vibration reduction processing on the support legs based on the vibration reduction adjustment results until the overall logical axis data is not greater than the preset vibration reduction threshold.
[0104] It should be noted that modal decoupling refers to decomposing coupled vibration modes into multiple independent subsystems through mathematical transformation, so as to independently perform vibration reduction control on the vibration characteristics of each subsystem. Specifically, by performing eigenvalue analysis on the overall logical axis data, the main vibration modes are identified, and the vibration reduction priority is allocated in combination with the contribution degree of each mode. Further, the vibration reduction adjustment results are dynamically adjusted according to the vibration energy distribution of each subsystem, ensuring that high-energy modes are preferentially suppressed, thereby effectively reducing the overall vibration level.
[0105] In order to standardize the determination of the preset vibration speed threshold, the step of determining the preset vibration speed threshold includes: obtaining historical sensor data of the vibration reduction platform in a steady state; and determining the mean value of the historical sensor data as the preset vibration speed threshold.
[0106] In this embodiment, the historical sensor data of the vibration reduction platform in a steady state is used as the basis for determining the preset vibration speed threshold, so that the determined preset vibration speed threshold is more targeted and adaptive, and can accurately reflect the vibration benchmark level of the vibration reduction platform during normal operation. Further, by taking the mean value of the historical sensor data as the preset vibration speed threshold, the interference of accidental fluctuations on the threshold can be effectively smoothed, and the stability and reliability of the threshold can be improved. Based on the preset vibration speed threshold, it can accurately distinguish between the normal steady state of the platform and the abnormal vibration state requiring vibration reduction, avoid false positives (such as premature start of vibration reduction wasting resources) or false negatives (such as vibration exceeding the threshold without timely vibration reduction), thereby improving the accuracy and effectiveness of vibration reduction control, and ensuring that the vibration reduction platform can timely and accurately respond to the vibration state requiring vibration reduction while ensuring normal operation, thereby improving the overall vibration reduction effect and work stability.
[0107] In order to better implement the vibration reduction method provided by the embodiments of the present application, the embodiments of the present application also provide a system based on the above vibration reduction method. The meanings of the terms are the same as in the above vibration reduction method, and the specific implementation details can be referred to the description in the method embodiment.
[0108] Please refer to Figure 8 , Figure 8 The structure schematic diagram of an embodiment of the vibration reduction system provided by the embodiments of the present application, wherein the vibration reduction system 800 can include:
[0109] The sensor data acquisition module 801 is configured to acquire sensor data of the support legs of the vibration reduction platform.
[0110] The logical axis data acquisition module 802 is configured to group the support legs, and perform logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs.
[0111] The vibration reduction processing module 803 is configured to perform re-fitting on all the logical axis data to obtain overall logical axis data of the vibration reduction platform, and perform vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold.
[0112] The embodiment of the present application further provides a semiconductor vibration reduction device, as shown in the accompanying drawings. Figure 9 Figure 9 is a structural schematic diagram of an embodiment of the semiconductor vibration reduction device provided by the embodiment of the present application, and specifically:
[0113] The semiconductor vibration reduction device can include a processor 901 with one or more processing cores, a memory 902 with one or more computer readable storage media, a power supply 903, an input unit 904, and the like. Those skilled in the art can understand that the semiconductor vibration reduction device structure shown in the accompanying drawings does not constitute a limitation on the semiconductor vibration reduction device, and can include more or fewer components than shown, or combine certain components, or different component arrangements. Among them: Figure 9
[0114] The processor 901 is the control center of the semiconductor vibration reduction device, and connects various parts of the semiconductor vibration reduction device through various interfaces and lines. By running or executing software programs and / or modules stored in the memory 902 and calling data stored in the memory 902, the processor 901 performs various functions of the semiconductor vibration reduction device and processes data, thereby performing overall detection of the semiconductor vibration reduction device. Optionally, the processor 901 can include one or more processing cores; preferably, the processor 901 can integrate an application processor and a modem processor, wherein the application processor mainly processes operation storage media, user interfaces, and application programs, etc., and the modem processor mainly processes wireless communication. It can be understood that the above-mentioned modem processor can also not be integrated into the processor 901.
[0115] The memory 902 can be used to store software programs and modules, and the processor 901 executes various function applications and data processing by running the software programs and modules stored in the memory 902. The memory 902 can mainly include a program storage area and a data storage area, wherein the program storage area can store application programs required for operating the storage medium, at least one function (such as a sound playing function, an image playing function, etc.), and the like; and the data storage area can store data created according to the use of the semiconductor damping device, etc. In addition, the memory 902 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state memory device. Accordingly, the memory 902 can also include a memory controller to provide the processor 901 with access to the memory 902.
[0116] The semiconductor damping device further includes a power supply 903 for supplying power to each component. Preferably, the power supply 903 can be logically connected to the processor 901 through a power management storage medium, so as to realize functions of managing charging, discharging, and power consumption management, etc. through the power management storage medium. The power supply 903 can also include one or more than one direct current or alternating current power supply, a rechargeable storage medium, a power failure detection circuit, a power converter or inverter, a power state indicator, and any other components.
[0117] The semiconductor damping device can further include an input unit 904, which can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function controls.
[0118] Although not shown, the semiconductor damping device can also include a display unit, etc., which will not be described here. Specifically, in the present embodiment, the processor 901 in the semiconductor damping device loads executable files corresponding to the processes of one or more than one application program into the memory 902 according to the following instructions, and runs the application programs stored in the memory 902 by the processor 901, so as to realize various functions, as follows:
[0119] Obtaining sensor data of support legs of a damping platform; grouping the support legs, and performing logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs; performing re-fitting on all the logical axis data to obtain overall logical axis data of the damping platform, and performing damping processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset damping threshold.
[0120] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructions or by controlling relevant hardware by the instructions, which can be stored in a computer readable storage medium and loaded and executed by a processor.
[0121] To this end, an embodiment of the present application provides a computer readable storage medium, which stores a computer program, and the computer program is loaded by a processor to execute steps in any vibration reduction method provided by an embodiment of the present application. For example, the computer program loaded by the processor can execute the following steps:
[0122] Obtaining sensor data of support legs of a vibration reduction platform; grouping the support legs, and performing logical axis fitting on the sensor data of each group of support legs to obtain logical axis data of the group of support legs; re-fitting all the logical axis data to obtain overall logical axis data of the vibration reduction platform, and performing vibration reduction processing on the support legs according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold.
[0123] The specific implementation of each operation can refer to the foregoing embodiments, which will not be described here again.
[0124] The computer readable storage medium can include a read only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.
[0125] Since the computer program stored in the computer readable storage medium can execute steps in any vibration reduction method provided by an embodiment of the present application, the beneficial effects that can be achieved by any vibration reduction method provided by an embodiment of the present application can be achieved, which will be described in detail in the foregoing embodiments, and will not be described here again.
[0126] The above describes in detail a vibration reduction method, system, semiconductor vibration reduction device and storage medium provided by an embodiment of the present application. The principle and implementation manner of the present application are described by applying specific examples in this paper, and the above embodiment is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range will be changed, and the above description should not be understood as a limitation of the present application.
Claims
1. A vibration reduction method, characterized in that, include: Acquire sensor data from the support legs of the vibration damping platform; The support legs are grouped, and the sensor data of each group of support legs are fitted with logical axes to obtain the logical axis data of that group of support legs. All logical axis data are refitted to obtain the overall logical axis data of the vibration reduction platform, and the support leg is subjected to vibration reduction treatment based on the overall logical axis data until the overall logical axis data is not greater than the preset vibration reduction threshold. The step of grouping the support legs and performing logical axis fitting on the sensor data of each group of support legs to obtain the logical axis data of that group of support legs includes: The support legs are divided into multiple groups based on preset grouping rules, resulting in multiple groups of support legs; Modal matrix transformation is performed on the sensor data of each support leg to obtain the logical axis data of that support leg.
2. The vibration reduction method according to claim 1, characterized in that, The step of refitting all logical axis data to obtain the overall logical axis data of the vibration reduction platform, and performing vibration reduction processing on the support leg based on the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold, further includes: Based on the logical axis data, vibration reduction processing is performed on each corresponding support leg until the logical axis data is no greater than the preset vibration reduction threshold.
3. The vibration reduction method according to claim 1, characterized in that, The preset grouping rules include at least one of the following: fixed area occupation rules, fixed number of support legs rules, and input specified grouping rules.
4. The vibration reduction method according to claim 1, characterized in that, Before acquiring sensor data from the support legs of the vibration damping platform, the following steps are also included: The vibration reduction area of the vibration reduction platform is screened based on preset screening rules to determine the area to be vibration reduced; The initial support leg within the area to be damped is determined as the support leg; The preset filtering rules include at least one of the following: load-bearing area filtering rules, environmental vibration sensitivity filtering rules, historical vibration reduction data filtering rules, and input specified area filtering rules.
5. The vibration reduction method according to claim 1, characterized in that, The step of performing vibration reduction processing on the support leg based on the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold includes: When the overall logical axis data is greater than the preset vibration reduction threshold, the logical axis data is modally decoupled, and the vibration reduction adjustment result of the support leg is determined according to the decoupling result. Based on the vibration reduction adjustment results, the support leg is subjected to vibration reduction treatment until the overall logical axis data is not greater than the preset vibration reduction threshold.
6. The vibration reduction method according to claim 1, characterized in that, The acquisition of sensor data from the support legs of the vibration damping platform includes: The vibration reduction detection interval is determined based on the natural vibration period of the vibration reduction platform; Based on the vibration reduction detection interval, the support leg is periodically velocity-displacement detected to obtain sensor data of the support leg.
7. The vibration reduction method according to claim 1, characterized in that, The steps for determining the preset vibration reduction threshold include: Acquire historical sensor data of the vibration reduction platform under stable conditions; The mean value of the historical sensor data is determined to be the preset vibration reduction threshold.
8. A vibration reduction system, characterized in that, include: The sensor data acquisition module is used to acquire sensor data from the support legs of the vibration damping platform. The logical axis data acquisition module is used to group the support legs and perform logical axis fitting on the sensor data of each group of support legs to obtain the logical axis data of that group of support legs. The vibration reduction module is used to refit all logical axis data to obtain the overall logical axis data of the vibration reduction platform, and to perform vibration reduction processing on the support leg according to the overall logical axis data until the overall logical axis data is not greater than a preset vibration reduction threshold. The step of grouping the support legs and performing logical axis fitting on the sensor data of each group of support legs to obtain the logical axis data of that group of support legs includes: The support legs are divided into multiple groups based on preset grouping rules, resulting in multiple groups of support legs; Modal matrix transformation is performed on the sensor data of each support leg to obtain the logical axis data of that support leg.
9. A semiconductor vibration damping device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor causes the processor to perform the following steps: Acquire sensor data from the support legs of the vibration damping platform; The support legs are grouped, and the sensor data of each group of support legs are fitted with logical axes to obtain the logical axis data of that group of support legs. All logical axis data are refitted to obtain the overall logical axis data of the vibration reduction platform, and the support leg is subjected to vibration reduction treatment based on the overall logical axis data until the overall logical axis data is not greater than the preset vibration reduction threshold. The step of grouping the support legs and performing logical axis fitting on the sensor data of each group of support legs to obtain the logical axis data of that group of support legs includes: The support legs are divided into multiple groups based on preset grouping rules, resulting in multiple groups of support legs; Modal matrix transformation is performed on the sensor data of each support leg to obtain the logical axis data of that support leg.
10. A computer-readable storage medium, characterized in that, It stores a computer program, which is loaded by a processor to perform the steps of the vibration reduction method according to any one of claims 1-7.
Citation Information
Patent Citations
Grouping control method of active / semi-active vibration isolation / vibration reduction platform
CN108843723A
Control method and device of six-degree-of-freedom active vibration isolation control system and electronic equipment
CN116166065A