High-integration-level 18-40GHz up-down frequency conversion device

Abstract

The invention provides a high-integration 18-40GHz up-down conversion device. The device comprises a first radio frequency link branch and a second radio frequency link branch, wherein the first radio frequency link branch is arranged on the lower substrate; the second radio frequency link branch is arranged on the upper substrate; the circuit adopted by the device realizes two modes of up and down conversion through a transceiving time-sharing control mode. According to the invention, through the SIP lamination packaging technology, three-dimensional integration is carried out on a traditional up-down frequency conversion device realized by a separate device, and intermediate frequency circuit device multiplexing is carried out according to the technical characteristic that intermediate frequency working frequencies cover each other. The size of a traditional millimeter wave frequency conversion assembly is greatly reduced, and the problem of assembly inconsistency introduced in the assembling process is reduced.

Description

Technical Field

[0001] This application relates to the fields of microwave measurement and electronic countermeasures, and in particular to a highly integrated 18-40GHz up-conversion device. Background Technology

[0002] Domestic and international communication transceiver systems are gradually developing towards miniaturization, lightweighting, broadband, solid-state technology, and high integration. With the rapid iteration of radio technology, microwave and millimeter-wave technologies are being used more and more widely. The millimeter-wave band still possesses a large amount of spectrum resources, and to alleviate the shortage of electromagnetic spectrum resources, more applications of millimeter-wave technology are constantly being developed. Compared to the microwave band, millimeter waves have attracted widespread attention due to their advantages such as narrow beamwidth, wide bandwidth, strong security and anti-interference capabilities, and large capacity, especially given the urgent needs of military systems.

[0003] System-in-package (SIP) technology based on ceramic housings refers to the use of high-temperature sintered ceramic plates and frames to form a closed structure. The package housing can be used for three-dimensional circuit layout using multi-layer circuit boards. This technology transforms millimeter-wave components designed with traditional discrete devices into multifunctional chip units through high-density device-level packaging, reducing component size and improving chip integration. The back side can be assembled onto traditional printed circuit boards using BGA (Ball Grid Array) assembly. It has advantages such as high system reliability, small size, light weight, low development cost, and short development time.

[0004] Traditional millimeter-wave frequency converter circuit design involves cascading traditional millimeter-wave band devices, including amplifiers, attenuators, mixers, RF switches, and filters, through RF microstrip lines to achieve the function of the frequency converter circuit. Furthermore, traditional frequency converter circuits often use cavity filtering to remove stray signals, which makes it impossible to achieve high integration while ensuring filtering performance. Summary of the Invention

[0005] This invention proposes a highly integrated 18-40GHz up / down converter. The technical solution for achieving this invention is as follows: This application provides a highly integrated 18-40GHz up / down converter. Through SIP stacked packaging technology, the traditional discrete component-based up / down converter is three-dimensionally integrated. Simultaneously, based on the technical characteristics of overlapping intermediate frequency operating frequencies, intermediate frequency circuit components are reused. Furthermore, in the circuit design, chips in the link are directly interconnected via gold wire bonding, reducing the circuit area occupied by microstrip lines. Compared to traditional millimeter-wave frequency converters, this significantly reduces component size and minimizes component inconsistencies introduced during assembly.

[0006] This application provides a highly integrated 18-40GHz up / down conversion device, the device including a first radio frequency link branch and a second radio frequency link branch;

[0007] The first RF link branch is located on the lower substrate, and the second RF link branch is located on the upper substrate. In the receiving mode, when the input signal is 18-40GHz, the up-conversion device can down-convert it to an intermediate frequency (IF) signal by switching the external input local oscillator signal. The IF frequency is divided into two segments: when a 34GHz local oscillator is used, the IF frequency is 2-16GHz; when a 30GHz local oscillator signal is used, the IF frequency is 2-10GHz. In the transmitting mode, the 2-16GHz IF input signal can be up-converted to 18-32GHz using a 34GHz local oscillator signal, using the LO-IF method (where IF represents the IF signal and LO represents the local oscillator signal, and the same applies below). When the IF input signal is 2-10GHz, the IF signal can be up-converted to 32-40GHz using a 30GHz local oscillator signal, using the IF+LO method, thus achieving up-conversion functionality covering 18-40GHz.

[0008] The device's circuitry includes radio frequency components such as amplifiers, transceiver switches, mixers, filters, and digitally controlled attenuators. A brief description of the device is provided below with reference to the block diagram:

[0009] When the device is used as a downconverter, that is, when the component enters the receiving state, the 18-40GHz input signal passes through the first transceiver switch, then through the first digitally controlled attenuator and the first amplifier, and then through the second transceiver switch before entering the first frequency selection switch.

[0010] After passing through the first frequency selector switch, the radio frequency signal is split into two paths. One path passes through the first filter, the second filter, and the first attenuator before entering the third filter, and then enters the second frequency selector switch. The first filter is a 18GHz high-pass filter, the second and third filters are 18 to 32GHz ceramic bandpass filters, and the first attenuator is 3dB, forming a 18-32GHz split signal. The 3dB attenuator can be used to adjust the gain between links and improve the inter-stage standing wave degradation between links.

[0011] The other signal after the first frequency selector switch passes through a tenth and eleventh filter, then through a twelfth attenuator, and finally enters the thirteenth filter before entering the second frequency selector switch. The tenth filter is a 10GHz high-pass filter, while the eleventh and thirteenth filters are 32-40GHz bandpass filters. The twelfth attenuator is also 3dB. This path forms a 32-40GHz split signal. The 3dB attenuator can be used to adjust the gain between links and also to improve the inter-stage standing wave degradation between links.

[0012] After passing through the second frequency selection switch, the radio frequency signal is selected from two radio frequency signals and then enters the first mixer 1.

[0013] The local oscillator circuit includes two paths: one path is where the 34GHz signal passes through the first local oscillator switching switch 1, then through the third amplifier and the eighth filter, and then enters the second local oscillator switching switch before entering the mixer. The third amplifier is used to amplify the signal power to ensure that the mixer can work properly, and the eighth filter is used to filter out the 34GHz harmonics.

[0014] Another 30GHz local oscillator signal from the local oscillator circuit passes through the fourth amplifier and the seventh filter, and then through the second local oscillator switching switch to enter the first mixer. The fourth amplifier is used to amplify the power to ensure the operation of the mixer, and the seventh filter is used to filter out the 30GHz harmonics.

[0015] After passing through the second frequency selection switch, the radio frequency signal and the local oscillator signal are mixed. The 18-32GHz radio frequency signal and the 34GHz local oscillator signal are linked, and the 32-40GHz radio frequency signal and the 30GHz local oscillator signal are linked. That is, the first frequency selection switch and the local oscillator switching switch are controlled in the same way. When the 18-32GHz radio frequency signal is selected, the local oscillator is selected as 34GHz; when the 32-40GHz radio frequency signal is selected, the local oscillator is selected as 30GHz.

[0016] The 18-32GHz radio frequency signal and the 34GHz local oscillator signal are mixed to obtain the 2-16GHz intermediate frequency signal; the 32-40GHz radio frequency signal and the 30GHz local oscillator signal are mixed to obtain the 2-10GHz intermediate frequency signal. This part of the signal is then filtered and amplified by the intermediate frequency circuit.

[0017] The intermediate frequency circuit includes: a fourth filter, an amplifying pass-through device, a fifth filter, a sixth attenuator, a sixth filter and an eighth attenuator, and finally outputs through a bidirectional amplifying multifunctional device. At this time, the bidirectional amplifier operates in the mode of providing receiving gain.

[0018] When the frequency converter is used as an upconverter, that is, when the component enters the transmitting state, the intermediate frequency signal is provided by the intermediate frequency input / output port. Its link path is exactly the opposite of that of the downconverter. The link is explained in conjunction with the principle block diagram. The provided intermediate frequency signal includes two paths, which will be explained separately.

[0019] When the intermediate frequency signal is 2-16GHz, it first passes through a bidirectional amplification multifunctional device, then enters the eighth attenuator, the sixth filter, the sixth attenuator and the fifth filter. After passing through the through end of an amplification pass-through device, it enters the mixer after the fourth filter and is mixed with the corresponding 34GHz local oscillator signal to obtain the 18-32GHz radio frequency signal. Then, after passing through the second frequency selection switch, it enters the third filter, the first attenuator, the second filter and the first filter, then enters the first frequency selection switch. After passing through the second transceiver switch, it enters the sixth amplifier, the first and thirteenth attenuators and the fifth amplifier, then enters the first transceiver switch.

[0020] When the intermediate frequency signal is 2-10GHz, it first passes through a bidirectional amplification multifunctional device, enters the eighth attenuator, then passes through the sixth filter, the sixth attenuator and the fifth filter, then through the pass-through terminal of an amplification pass-through functional device and the fourth filter, and enters the mixer, where it is mixed with the corresponding 30GHz local oscillator signal to obtain a 32-40GHz radio frequency signal. After entering the second frequency selection switch, it passes through the thirteenth filter, the twelfth attenuator, the eleventh filter and the tenth filter, and then enters the first frequency selection switch. Similarly, it passes through the second transceiver switch to enter the sixth amplifier, the thirteenth attenuator and the fifth amplifier, and then enters the first transceiver switch.

[0021] After the two-channel converted signals enter the first transceiver switch, they are combined into one output. The total output frequency range includes 18-32GHz and 32-40GHz, which covers the 18-40GHz radio frequency signal output.

[0022] Compared with the prior art, the significant advantages of this invention are:

[0023] (1) The module integrates two modes of upconversion and downconversion. In downconversion mode, the frequency selection switch mixes the 18-32GHz and 32-40GHz radio frequency signals with the 34GHz and 30GHz signals respectively to obtain 2-16GHz and 2-10GHz intermediate frequency signals. In upconversion mode, the input 2-16GHz intermediate frequency signal and 2-10GHz intermediate frequency signal are mixed with the 34GHz and 30GHz local oscillator signals respectively to obtain 18-32GHz and 32-40GHz signals. The entire radio frequency working bandwidth can cover 18-40GHz.

[0024] (2) The signals 2-16GHz and 2-10GHz in the intermediate frequency circuit are respectively formed by two high-pass filter chips and one low-pass filter chip to complete the harmonic filtering of the intermediate frequency signal. Since the bandwidth of the 2-16GHz intermediate frequency signal covers 2-10GHz, the filter of the intermediate frequency circuit is reused, which effectively ensures the filtering of the local oscillator signal while further reducing the circuit size.

[0025] (3) A ceramic plate filter is used to replace the cavity filter in the traditional component. The four ceramic filters for two paths are arranged on the upper and lower printed circuit boards respectively, reducing the circuit area occupied by the filters and achieving better filtering performance. Finally, by adding attenuators between the cascaded filters, the standing wave degradation caused by the cascading of filters is improved, thus realizing the filter function. Specifically, a single-pole double-throw switch is used to split the 18-40GHz RF signal into two paths. One path is connected to the 18-32GHz ceramic plate bandpass filter, and the other path is connected to the 32-40GHz ceramic plate bandpass filter. This part of the circuit is arranged on the lower substrate, and then... Each BGA solder ball transmits the RF signal to the upper substrate, and then a corresponding ceramic chip bandpass filter is connected in series. Finally, the signal is combined into a single signal by a single-pole double-throw switch and then mixed. This part of the circuit is laid out on the upper substrate, resulting in a total of four ceramic chip filters. Two cascaded ceramic filters are laid out on the upper and lower printed circuit boards respectively, making full use of the advantages of the double-layer circuit layout to obtain better filtering performance. Finally, attenuators are added between the cascaded filter stages to improve the standing wave degradation problem caused by the cascading of filters and obtain a signal with high suppression performance. This part of the circuit is reciprocal and can easily provide spurious filtering function for up and down conversion.

[0026] (4) To address the different signal power requirements of upconversion and downconversion, a bidirectional functional device is used for the link; a multi-functional chip with one bidirectional function is an amplifier and the other is a RF pass-through is used to provide the intermediate frequency gain required during downconversion and adjust the power entering the mixer during upconversion, thereby obtaining excellent upconversion and downconversion performance; one of the amplifier and the other of the RF pass-through multi-functional device is an amplifier and the other is a RF pass-through multi-functional chip, which provides the intermediate frequency gain required during downconversion. The amplifier gain is 18dB, and the bidirectional amplifier gain is -3dB during upconversion, which can adjust the power entering the mixer and make it work in a low spurious state, thereby obtaining better upconversion and downconversion performance;

[0027] (5) A dual-power modulation chip is used to output two voltages, one positive and one negative, to power the transmitting amplifier, receiving amplifier and bidirectional amplifier in a time-division manner. In receiving mode, the transmitting amplifier is powered off; in transmitting mode, the receiving amplifier is powered off, thereby effectively reducing the power consumption of the circuit and reducing the possibility of the RF link forming a gain loop, thus improving the stability of RF transmission performance.

[0028] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0029] Figure 1 A simplified principle block diagram of the present invention;

[0030] Figure 2 A schematic diagram showing the distribution of solder joints at the bottom of the BGA casing in this invention;

[0031] Figure 3 The underlying circuit block diagram for implementing this invention;

[0032] Figure 4 To implement the top-level circuit schematic of this invention;

[0033] Figure 5 A schematic diagram of the control circuit for the bidirectional amplifier and receiver / transmitter amplifier of this invention. Detailed Implementation

[0034] This solution uses small-sized ceramic filters to replace traditional large-sized cavity filters. By cascading multiple ceramic filters on the double-layer BGA internal substrate, the performance of cavity filters is achieved while improving the integration of the module.

[0035] This invention employs SIP (System-in-Package) three-dimensional circuit layout technology based on ceramic housings. It arranges RF switches, low-noise amplifiers, digitally controlled attenuators, mixers, filters, and attenuators on upper and lower printed circuit boards (PCBs). This primarily addresses the technical challenges of large ceramic filter size and demanding assembly requirements. It fully leverages the advantage of the slotted thickness of the lower PCB to embed filters between PCB layers, cascading two ceramic filters via BGA solder joints. Simultaneously, attenuators are used between the upper and lower RF boards to improve interstage matching. The final design realizes a compact 18-40GHz frequency conversion component with up and down conversion capabilities.

[0036] Combination Figure 1This invention discloses a highly integrated 18-40GHz up / down converter. The overall design of the scheme has been described in detail in the invention description and will not be repeated here. The final 18-40GHz up / down converter has a measured gain of approximately 0dB. In the transmission state, the input power of the intermediate frequency signal is -10dBm, and the final RF output power reaches approximately 5dBm, which meets the application requirements.

[0037] Combination Figure 2 The external interface diagram of the device of this invention shows that the operating frequency of this housing covers DC to 18-40GHz. The main difference between this housing and traditional ceramic housings is that the entire area around the RF input port is covered by isolation vias, as shown in the diagram (A04B04, A10B04, A16B04, etc.). A04B04 is used as... Figure 1 The input port of the local oscillator signal switching switch 1, A10B04, serves as the RF input port during down-conversion and the RF output port during up-conversion of the invention device. Figure 1 The interface of the first transceiver switch 1, A10B22, serves as the intermediate frequency output port during downconversion and the intermediate frequency input port during upconversion in the invention device. Figure 1 The intermediate frequency input and output ports are as follows: A04B08 and A16B08 serve as the +5V power input ports of the invention device; A04B09 and A16B09 serve as the -5V power input ports of the invention device; A04B10, A04B11, and A04B12 serve as the control input interfaces for the transmit / receive switching switch, respectively; there are also frequency band selection switching control input interfaces and local oscillator switching control input interfaces; a control input interface for a digitally controlled attenuator; and all remaining BGA solder points with coordinates are set as grounding holes.

[0038] Figure 3 and Figure 4 The layout of the radio frequency link chips on the lower and upper substrates are shown respectively. The device of the present invention will be described with reference to the figures. Figure 3 This indicates the layout of the RF link chip on the lower substrate. Figure 4 This indicates the layout of the RF link chip on the upper substrate.

[0039] Figure 3When the device operates in downconversion mode, the input RF signal, after passing through the corresponding internal pads of A10B04, first passes through a first transceiver switch, a first digitally controlled attenuator, and a first amplifier for gain compensation of the RF signal link. Then, it passes through a second transceiver switch and a first frequency selection switch to segment the RF signal. The first frequency selection switch divides the RF signal into two paths: 18-32GHz and 32-40GHz. The 18-32GHz path enters a first filter and a second filter; the first filter is a high-pass filter, and the second is a ceramic filter. Similarly, the 32-40GHz path... The branch passes through the tenth filter and the eleventh filter; the tenth filter is a high-pass filter and the eleventh filter is a ceramic chip filter; then the RF signal is transmitted to the upper substrate through BGA ball 3 and BGA ball 4 respectively. At the same time, the local oscillator signal on the upper substrate is transmitted directly to the upper substrate through the transmission line via the internal pad corresponding to A04B04. There is also a BGA ball 2 that transmits the signal that has been frequency converted on the upper substrate to the lower substrate. After passing through a bidirectional amplification multifunctional device, it is transmitted to the internal pad position of A10B22 as an interface for external transmission.

[0040] Figure 4The RF signal transmitted via BGA ball 3 passes through the first attenuator to improve VSWR adaptation during link transmission, then through the third filter to match the ceramic filter on the underlying substrate, before entering the second frequency selector switch. Similarly, the signal from BGA ball 4 passes through the twelfth attenuator and thirteenth filter before also entering the second frequency selector switch. After being selected by the second frequency selector switch, it finally enters the RF port of the mixer for mixing. The circuit between the first and second frequency selectors uses two-port reciprocal circuits, allowing for circuit multiplexing and achieving RF signal filtering performance during up-conversion and down-conversion, effectively reducing circuit area. Furthermore, the use of two cascaded ceramic filter stages provides performance essentially equivalent to traditional cavity filters, while ceramic filters are inherently smaller than cavity filters. Further improvements were made to reduce the circuit footprint while enhancing performance. The local oscillator signal of the mixer is transmitted through BGA ball 1. Since the local oscillator signal has two fixed frequencies, it is split into two paths by the first local oscillator switching switch. One path passes through the third amplifier and the eighth filter, while the other path passes through the fourth amplifier and the seventh filter. Both signals enter the second local oscillator switching switch for signal selection and then enter the local oscillator signal port of the mixer. After mixing, the intermediate frequency signal is generated by the mixer. Then, it passes through the fourth filter, an amplifying pass-through multifunctional device, and a bidirectional amplifier with 18dB gain in downconversion mode. It then passes through a fifth filter, a sixth attenuator, a sixth filter, an eighth attenuator, and finally through BGA ball 2, transmitting this part of the intermediate frequency signal to the corresponding position of BGA ball 2 on the lower substrate.

[0041] Combination Figure 5 This document briefly describes the control of the bidirectional amplifier and the receiving / transmitting amplifier in the device of this invention. A dual-channel power modulation chip is used, with a single-channel drive current reaching 0.5A. The enable signals are ENA and ENB; in this example, the enable terminal only needs to provide +5V. The amplifiers selected in this device are all powered by +5V; therefore, the power supply VCC is connected to +5V. Connecting the transmit / receive switching control signal to the two control signal input terminals yields an output power supply voltage of +5V for OUTA and OUTB. When OUTA is +5V, OUTB is 0V, and vice versa. This allows for time-division control of the voltage for the receiving, transmitting, and bidirectional amplifiers. In this example, OUTA controls the bidirectional amplifier to supply power from input port 1 to input port 2 and the receiving amplifier. OUTB controls the bidirectional amplifier to supply power from input port 2 to input port 1 and the first transmitting amplifier 1 to input port 2, and the second transmitting amplifier 2 to input port 2. This ultimately achieves time-division operation of the amplifiers, reducing circuit power consumption.

[0042] The embodiments described above do not constitute a limitation on the scope of protection of this application. The embodiments are described in more detail below.

Claims

1. A highly integrated 18-40GHz up / down converter, characterized in that, The device includes a first radio frequency link branch and a second radio frequency link branch; The first radio frequency link branch is located on the lower substrate; the second radio frequency link branch is located on the upper substrate. The circuit used in the device achieves two modes of upconversion and downconversion through time-division multiplexing control. In downconversion mode, the input 18-40GHz signal is split into 18-32GHz and 32-40GHz radio frequency signals, which are then mixed with 34GHz and 30GHz respectively to obtain 2-16GHz and 2-10GHz intermediate frequency signals. When operating in upconversion mode, the input 2-16GHz and 2-10GHz intermediate frequency signals are mixed with the 34GHz and 30GHz local oscillator signals respectively to obtain 18-32GHz and 32-40GHz, and then combined and output through a switch. The entire device covers a radio frequency operating bandwidth of 18-40GHz.

2. The apparatus according to claim 1, characterized in that, When the device is in downconversion mode, the operation of each component in the lower substrate is as follows: The input radio frequency signal passes through a first transceiver switch, a first digitally controlled attenuator, and a first amplifier to perform gain compensation for the radio frequency signal link, and then passes through a second transceiver switch and a first frequency-selective switch to segment the radio frequency signal; The first frequency selection switch splits the radio frequency signal into two paths, 18-32GHz and 32-40GHz, respectively. The 18-32GHz path enters the first filter and the second filter. The 32-40GHz band enters the high-pass filter of the tenth filter and the eleventh filter; The two paths then transmit the RF signal to the upper substrate via BGA ball 3 and BGA ball 4 respectively. At the same time, the local oscillator signal is transmitted directly to the upper substrate via BGA ball 1 after passing through the transmission line. BGA ball 2 transmits the signal that has been frequency-converted by the upper substrate to the lower substrate, and then passes through a bidirectional amplification multifunctional device as an interface for external transmission.

3. The apparatus according to claim 2, characterized in that, The operating methods of each component in the lower substrate are as follows: The radio frequency signal transmitted through BGA ball 3 passes through the first attenuator and the third filter before entering the second frequency selection switch. The signal passing through BGA ball 4 passes through the twelfth attenuator and the thirteenth filter before entering the second frequency selection switch. After being selected by the second frequency selection switch, it finally enters the RF port of the mixer for mixing. The signal from the local oscillator side is transmitted through BGA ball 1. Since the local oscillator signal has two fixed frequencies, the 34GHz signal in the local oscillator signal is split into two paths by the first local oscillator switching switch. One path passes through the third amplifier and the eighth filter, while the other 30GHz signal passes through the fourth amplifier and the seventh filter. Both signals enter the second local oscillator switching switch, where they are selected from two signals and then enter the local oscillator signal port of the mixer. The mixer generates an intermediate frequency signal, which then passes through the fourth filter, which is an amplification pass-through multifunctional device. The signal then passes through the fifth filter, the sixth attenuator, the sixth filter, the eighth attenuator, and finally through BGA ball 2, transmitting the intermediate frequency signal to the corresponding position of BGA ball 2 on the lower substrate.

4. The apparatus according to claim 3, characterized in that, During the mixing process, the 18-32GHz radio frequency signal and the 34GHz local oscillator signal are linked, and the 32-40GHz radio frequency signal and the 30GHz local oscillator signal are linked. That is, the first frequency selection switch and the local oscillator switching switch are controlled in the same way. When the 18-32GHz radio frequency signal is selected, the local oscillator is selected as 34GHz; when the 32-40GHz radio frequency signal is selected, the local oscillator is selected as 30GHz. The 18-32GHz radio frequency signal and the 34GHz local oscillator signal are mixed to obtain the 2-16GHz intermediate frequency signal; the 32-40GHz radio frequency signal and the 30GHz local oscillator signal are mixed to obtain the 2-10GHz intermediate frequency signal. This part of the signal is then filtered and amplified by the intermediate frequency circuit.

5. The apparatus according to claim 4, characterized in that, When the device up-converts and enters the transmission state, the intermediate frequency (IF) signal is provided by the IF input and output ports. The link path is opposite to that of the down-conversion, and the two paths of the IF signal are as follows: When the intermediate frequency signal is 2-16GHz, it first passes through a bidirectional amplification multifunctional device, then enters the eighth attenuator, the sixth filter, the sixth attenuator and the fifth filter. After passing through the pass-through terminal of the amplification pass-through device, it enters the mixer after the fourth filter and is mixed with the corresponding 34GHz local oscillator signal to obtain the 18-32GHz radio frequency signal. After passing through the second frequency selection switch, it enters the third filter, the first attenuator, the second filter and the first filter, then enters the first frequency selection switch. After passing through the second transceiver switch, it enters the sixth amplifier, the first and thirteenth attenuators and the fifth amplifier, then enters the first transceiver switch. When the intermediate frequency signal is 2-10GHz, it first passes through a bidirectional amplification multifunctional device, enters the eighth attenuator, then passes through the sixth filter, the sixth attenuator and the fifth filter, then through the pass-through terminal of an amplification pass-through functional device and the fourth filter, and then enters the mixer, where it is mixed with the corresponding 30GHz local oscillator signal to obtain a 32-40GHz radio frequency signal. After entering the second frequency selection switch 2, it passes through the thirteenth filter, the twelfth attenuator, the eleventh filter and the tenth filter, and then enters the first frequency selection switch. Similarly, it passes through the second transceiver switch to enter the sixth amplifier, the thirteenth attenuator and the fifth amplifier, and then enters the first transceiver switch. After the two-channel converted signals enter the first transceiver switch, they are combined into one output. The total output frequency range includes 18-32GHz and 32-40GHz, which covers the 18-40GHz radio frequency signal output.

6. The apparatus according to claim 3, characterized in that, The circuit between the first and second frequency selective switches consists of two-port reciprocal circuits.

7. The apparatus according to claim 3, characterized in that, in, The first filter is a high-pass filter; the second filter is a ceramic plate filter. The tenth filter is a high-pass filter, and the eleventh filter is a ceramic plate filter; The third and thirteenth filters are ceramic sheet filters.

8. The apparatus according to claim 3, characterized in that, The bidirectional amplification multifunctional device is a bidirectional amplifier with a gain of 13.5dB in both transmission directions; One path of the amplifying pass-through multi-functional device is an amplifier, and the other path is a multi-functional chip for RF pass-through. It provides the intermediate frequency gain required during downconversion, with an amplifier gain of 18dB. During upconversion, the bidirectional amplifier gain is reduced by 3dB to adjust the power entering the mixer.

9. The apparatus according to claim 3, characterized in that, The device uses a dual-power modulation chip to output two voltages, one positive and one negative, to provide time-division power to the transmitting amplifier, receiving amplifier, and bidirectional amplifier. In receiving mode, the transmitting amplifier is powered off; in transmitting mode, the receiving amplifier is powered off.

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