Driving device and camera module

Abstract

The invention discloses a driving device and a camera module, the driving device comprises a chip driving assembly, the chip driving assembly further comprises a fixed frame body, an anti-shake carrier movably arranged on the fixed frame body, an anti-shake driving unit used for driving the anti-shake carrier to move and at least one suspension elastic piece, the suspension elastic piece comprises a first elastic piece connecting part, a second elastic piece connecting part and an elastic piece deformation part, the elastic piece deformation part extends in the height direction, and the first elastic piece connecting part and the second elastic piece connecting part extend in the horizontal direction after being bent from the bottom of the elastic piece deformation part. The first elastic piece connecting part is connected to the fixed frame body, the second elastic piece connecting part is connected to the anti-shake carrier, and the elastic piece deformation part is kept at the side part of the fixed frame body in a deformable manner.

Description

Drive device and camera module Technical Field

[0001] The present invention relates to the field of camera photography, and in particular to a driving device and a camera module. Background Art

[0002] Smartphones are equipped with cameras that allow users to capture images handheld. Hand tremors are an inevitable physiological phenomenon during smartphone capture. However, even the slightest hand tremor can be transmitted to the smartphone, causing it to vibrate. This tremor inevitably affects the camera's image clarity, resulting in blurred or unclear images. While meeting the trend toward thinner and lighter smartphones, the inventors of the present invention have sought to address the technical problem of compensating for this tremor to allow users to capture clear images handheld.

[0003] Summary of the Invention

[0004] One advantage of the present invention is that it provides a driving device and a camera module, wherein the chip driving component of the driving device suspends the anti-shake carrier at the bottom of the fixed frame through a three-dimensional suspension spring. Compared with the prior art suspension scheme using "ball + magnetic attraction", in the driving device of the present invention, since the first spring connection part and the second spring connection part of the suspension spring extending in the horizontal direction are respectively fixedly connected to the fixed frame and the anti-shake carrier, the driving device can avoid the problem of the suspension spring falling off, thereby ensuring the stability of the driving device.

[0005] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the driving device suspends the anti-shake carrier at the bottom of the fixed frame through the suspension spring. Compared with the suspension solution using "ball + magnetic attraction" in the prior art, in the driving device of the present invention, the suspension spring can provide better suspension and reset effects. At the same time, the size of the suspension spring is smaller, which is conducive to further reducing the length and width of the camera module.

[0006] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the spring deformation portion of the suspension spring extends upward after being bent from the first spring connection portion and the second spring deformation portion, and the spring deformation portion is deformably retained on the side of the fixed frame, so that the suspension spring does not need to occupy the space in the height direction of the chip driving component, and the suspension spring allows the anti-shake carrier to translate within a larger range to achieve a better anti-shake effect.

[0007] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the fixed frame can limit the translation range of the anti-shake carrier to avoid damage to the suspension spring due to excessive translation range of the anti-shake carrier.

[0008] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the support plate of the driving device is arranged on the fixed frame and extends to the bottom of the anti-shake carrier to avoid the anti-shake carrier from making a large displacement in the height direction relative to the fixed frame before the driving device and the photosensitive component are assembled, thereby protecting the suspension spring.

[0009] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the anti-shake carrier is an electrical carrier, a conductive insert is embedded in the interior of the anti-shake carrier, a portion of the conductive insert is exposed to the receiving cavity of the anti-shake carrier, and the anti-shake position sensing element received in the receiving cavity is connected to the conductive insert. In this way, the anti-shake position sensing element does not need to occupy the space in the height direction of the driving device, which is conducive to further reducing the height dimension of the camera module.

[0010] Another advantage of the present invention is that it provides a driving device and a camera module, wherein, from a top-down perspective, the damping arm of the anti-shake carrier is opposite to the damping cavity of the fixed frame, and the damping glue arranged in the damping cavity of the fixed frame is used to connect the fixed frame and the damping arm of the anti-shake carrier, so that the damping glue can provide a damping effect to prevent the driving device from losing control.

[0011] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the focus driving unit of the lens driving assembly of the driving device extends along the height direction, and the height position of the bottom surface of the anti-shake driving unit of the lens driving assembly is lower than the height position of the bottom surface of the anti-shake driving unit of the chip driving assembly. This is beneficial to reducing the height size of the camera module and increasing the stroke of the focus carrier, thereby improving the focusing function of the camera module.

[0012] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the focus driving unit and the anti-shake driving unit are arranged on opposite sides to rationally arrange the various structures of the driving device, thereby reducing the length and width of the camera module.

[0013] According to one aspect of the present invention, the present invention provides a driving device, which includes a chip driving component, wherein the chip driving component further includes:

[0014] Fixed frame;

[0015] an anti-shake carrier, wherein the anti-shake carrier is movably arranged on the fixed frame;

[0016] an anti-shake drive unit, wherein the anti-shake drive unit is configured to drive the anti-shake carrier to move relative to the fixed frame, wherein the anti-shake drive unit includes a plurality of pairs of anti-shake drive magnets and anti-shake drive coils arranged relative to each other in a height direction, wherein the anti-shake drive magnets are a first anti-shake drive magnet, a second anti-shake drive magnet, and a third anti-shake drive magnet, and the first anti-shake drive magnet and the third anti-shake drive magnet are respectively arranged on two adjacent sides of the second anti-shake drive magnet; and

[0017] A suspension component, wherein the suspension component includes at least one suspension spring, the suspension spring includes a spring connecting portion and a spring deformation portion, the spring deformation portion extends in the height direction, the spring connecting portion is bent from the bottom of the spring deformation portion and extends in the horizontal direction, the spring connecting portion is connected to the fixed frame and the anti-shake carrier, and the plane where the spring deformation portion of at least one of the suspension springs is located is perpendicular to the magnetic pole direction of the second anti-shake driving magnet.

[0018] According to one embodiment of the present invention, the K value of the elastic sheet deformation portion of the suspension elastic sheet in the extension direction is greater than the K value in the thickness direction.

[0019] According to one embodiment of the present invention, the extension direction of the spring deformation part of the suspension spring is the same as the length direction of the second anti-shake driving magnet, and the thickness direction of the spring deformation part of the suspension spring is the same as the length direction of the first anti-shake driving magnet and the length direction of the third anti-shake driving magnet.

[0020] According to one embodiment of the present invention, the chip driving component includes four suspension springs, two of the four suspension springs are arranged on one side of the fixed frame, and the other two suspension springs are arranged on the other side of the fixed frame opposite to the side.

[0021] According to one embodiment of the present invention, the planes where the spring deformation parts of the two suspension springs located on the same side of the fixed frame are located coincide with each other, and the planes where the spring deformation parts of the two suspension springs located on opposite sides of the fixed frame are located are parallel.

[0022] According to an embodiment of the present invention, the planes where the spring deformation portions of the four suspension springs are located are all perpendicular to the magnetic pole direction of the second anti-shake driving magnet.

[0023] According to one embodiment of the present invention, the chip driving component further includes at least one anti-shake position sensing element, which is arranged on the anti-shake carrier, and the anti-shake position sensing element corresponds to the anti-shake driving magnet in the height direction, and the anti-shake driving coil is located between the anti-shake driving magnet and the anti-shake position sensing element.

[0024] According to an embodiment of the present invention, a conductive insert is embedded in the anti-shake carrier, and the anti-shake position sensing element is connected to the conductive insert.

[0025] According to one embodiment of the present invention, the driving device further includes a lens driving assembly, wherein the lens driving assembly further includes a focus carrier and a focus driving unit, the focus carrier is movably arranged on the fixed frame, the focus driving unit is configured to drive the focus carrier to move relative to the fixed frame, and the focus driving unit and the anti-shake driving unit are arranged on opposite sides.

[0026] According to one embodiment of the present invention, the anti-shake drive magnet is arranged on the fixed frame, and the anti-shake drive coil is arranged on the anti-shake carrier, wherein the focus drive unit includes a focus drive magnet and the focus drive coil relative to each other in a horizontal direction, the focus drive magnet is arranged on the focus carrier, and the focus drive coil is arranged on the fixed frame, wherein the height position of the bottom surface of the focus drive magnet is lower than the height position of the bottom surface of the anti-shake drive magnet.

[0027] According to one embodiment of the present invention, the fixed frame has a damping cavity, and the anti-shake carrier has a damping arm. From a top view, the damping arm of the anti-shake carrier is opposite to the damping cavity of the fixed frame, wherein the damping glue is arranged in the damping cavity of the fixed frame, and the damping glue connects the fixed frame and the damping arm of the anti-shake carrier.

[0028] According to one embodiment of the present invention, the damping arm is arranged on the top surface of the anti-shake carrier, the second elastic piece connecting portion is connected to the bottom surface of the anti-shake carrier, and the damping arm and the second elastic piece connecting portion are staggered.

[0029] According to an embodiment of the present invention, the damping arm is integrally formed with the anti-shake carrier, and extends from the top surface of the anti-shake carrier in a height direction to extend into the damping cavity of the fixed frame.

[0030] According to one embodiment of the present invention, the damping arm is formed in the anti-shake carrier through an insert injection molding process, at least a portion of the damping arm is embedded in the anti-shake carrier, and at least a portion of the damping arm is exposed and extends along the height direction to extend into the damping cavity of the fixed frame.

[0031] According to one embodiment of the present invention, the chip driving component further includes a supporting plate, which is arranged on the frame connecting arm of the fixed frame, and at least a portion of the supporting plate overlaps with at least a portion of the suspension spring in the height direction.

[0032] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0033] Photosensitive components; and

[0034] An optical lens, wherein the optical lens is arranged in the light-sensing path of the light-sensing component; and

[0035] A driving device, comprising a chip driving component, wherein the chip driving component further comprises:

[0036] Fixed frame;

[0037] an anti-shake carrier, wherein the anti-shake carrier is movably arranged on the fixed frame;

[0038] an anti-shake drive unit, wherein the anti-shake drive unit is configured to drive the anti-shake carrier to move relative to the fixed frame, wherein the anti-shake drive unit includes a plurality of pairs of anti-shake drive magnets and anti-shake drive coils arranged relative to each other in a height direction, wherein the anti-shake drive magnets are a first anti-shake drive magnet, a second anti-shake drive magnet, and a third anti-shake drive magnet, and the first anti-shake drive magnet and the third anti-shake drive magnet are respectively arranged on two adjacent sides of the second anti-shake drive magnet; and

[0039] A suspension component, wherein the suspension component includes at least one suspension spring, the suspension spring includes a spring connecting portion and a spring deformation portion, the spring deformation portion extends in the height direction, the spring connecting portion is bent from the bottom of the spring deformation portion and extends in the horizontal direction, the spring connecting portion is connected to the fixed frame and the anti-shake carrier, wherein the plane where the spring deformation portion of at least one of the suspension springs is located is perpendicular to the magnetic pole direction of the second anti-shake driving magnet, wherein the photosensitive component is arranged on the anti-shake carrier of the chip driving component of the driving device, and the optical lens is arranged on the focusing carrier of the lens driving component of the driving device.

[0040] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the chip driving component of the driving device suspends the anti-shake carrier at the bottom of the fixed frame through a three-dimensional suspension spring. Compared with the suspension scheme using "ball + magnetic attraction" in the prior art, in the driving device of the present invention, since the first spring connection part and the second spring connection part of the suspension spring extending in the horizontal direction are respectively fixedly connected to the fixed frame and the anti-shake carrier, the driving device can avoid the problem of the suspension spring falling off, so as to ensure the stability of the driving device.

[0041] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the driving device suspends the anti-shake carrier at the bottom of the fixed frame through the suspension spring. Compared with the suspension solution using "ball + magnetic attraction" in the prior art, in the driving device of the present invention, the suspension spring can provide better suspension and reset effects. At the same time, the size of the suspension spring is smaller, which is conducive to further reducing the length and width of the camera module.

[0042] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the spring deformation portion of the suspension spring extends upward after being bent from the first spring connection portion and the second spring deformation portion, and the spring deformation portion is deformably retained on the side of the fixed frame, so that the suspension spring does not need to occupy the space in the height direction of the chip driving component, and the suspension spring allows the anti-shake carrier to translate within a larger range to achieve a better anti-shake effect.

[0043] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the fixed frame can limit the translation range of the anti-shake carrier to avoid damage to the suspension spring due to excessive translation range of the anti-shake carrier.

[0044] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the support plate of the driving device is arranged on the fixed frame and extends to the bottom of the anti-shake carrier to avoid the anti-shake carrier from making a large displacement in the height direction relative to the fixed frame before the driving device and the photosensitive component are assembled, thereby protecting the suspension spring.

[0045] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the anti-shake carrier is an electrical carrier, a conductive insert is embedded in the interior of the anti-shake carrier, a portion of the conductive insert is exposed to the receiving cavity of the anti-shake carrier, and the anti-shake position sensing element received in the receiving cavity is connected to the conductive insert. In this way, the anti-shake position sensing element does not need to occupy the space in the height direction of the driving device, which is conducive to further reducing the height dimension of the camera module.

[0046] Another advantage of the present invention is that it provides a driving device and a camera module, wherein, from a top-down perspective, the damping arm of the anti-shake carrier is opposite to the damping cavity of the fixed frame, and the damping glue arranged in the damping cavity of the fixed frame is used to connect the fixed frame and the damping arm of the anti-shake carrier, so that the damping glue can provide a damping effect to prevent the driving device from losing control.

[0047] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the focus driving unit of the lens driving assembly of the driving device extends along the height direction, and the height position of the bottom surface of the anti-shake driving unit of the lens driving assembly is lower than the height position of the bottom surface of the anti-shake driving unit of the chip driving assembly. This is beneficial to reducing the height size of the camera module and increasing the stroke of the focus carrier, thereby improving the focusing function of the camera module.

[0048] Another advantage of the present invention is that it provides a driving device and a camera module, wherein the focus driving unit and the anti-shake driving unit are arranged on opposite sides to rationally arrange the various structures of the driving device, thereby reducing the length and width of the camera module.

[0049] According to one aspect of the present invention, the present invention provides a driving device, which includes a chip driving component, wherein the chip driving component further includes:

[0050] A photosensitive component, wherein the photosensitive component is used to receive light;

[0051] An anti-shake carrier, the photosensitive component is arranged on the anti-shake carrier;

[0052] a fixed frame, wherein the anti-shake carrier is movably arranged on the fixed frame;

[0053] an anti-shake driving unit, the anti-shake driving unit being configured to drive the anti-shake carrier to move relative to the fixed frame;

[0054] a suspension assembly extending in a height direction on sides of the anti-shake carrier and the fixed frame, the suspension assembly connecting the anti-shake carrier and the fixed frame to movably mount the anti-shake carrier to the fixed frame;

[0055] A deflection circuit plate extends horizontally at the bottom of the photosensitive component, and the deflection circuit plate is connected to the photosensitive component. When the photosensitive component moves, at least a portion of the deflection circuit plate is deformed.

[0056] According to one embodiment of the present invention, the driving device further includes a bottom cover, which is directly or indirectly fixed to the fixed frame, and the flexible circuit plate mechanically connects the photosensitive component to the bottom cover.

[0057] According to one embodiment of the present invention, the flexible circuit plate includes a movable part fixed to the photosensitive component, a fixed part fixed to the bottom cover, and a deformable part, wherein the movable part is arranged on the inner side of the fixed part, and the movable part is connected to the fixed part through the deformable part.

[0058] According to an embodiment of the present invention, the deformable portion is bent multiple times between the movable portion and the fixed portion, and the deformable portion is deformed when the movable portion moves.

[0059] According to one embodiment of the present invention, the anti-shake drive unit includes an anti-shake drive magnet arranged on the fixed frame and an anti-shake drive coil arranged on the anti-shake carrier, and the anti-shake drive magnet and the anti-shake drive coil are arranged relative to each other in the height direction, wherein the anti-shake drive magnet includes a first anti-shake drive magnet, a second anti-shake drive magnet and a third anti-shake drive magnet, and the first anti-shake drive magnet, the second anti-shake drive magnet and the third anti-shake drive magnet are arranged on three adjacent sides; the anti-shake drive coil includes a first anti-shake drive coil, a second anti-shake drive coil and a third anti-shake drive coil, and the first anti-shake drive coil, the second anti-shake drive coil and the third anti-shake drive coil are arranged on three adjacent sides.

[0060] According to one embodiment of the present invention, the driving device further includes a lens driving assembly, wherein the lens driving assembly includes a focus carrier and a focus driving unit, the focus carrier is movably arranged on the fixed frame, the focus driving unit is configured to drive the focus carrier to move relative to the fixed frame, and the focus driving unit and the anti-shake driving unit are arranged on opposite sides.

[0061] According to one embodiment of the present invention, the focus drive unit includes a focus drive magnet and a focus drive coil that are opposite to each other in a horizontal direction, the focus drive magnet is arranged on the focus carrier, and the focus drive coil is arranged on the fixed frame, wherein the height position of the bottom surface of the focus drive magnet is lower than the height position of the bottom surface of the anti-shake drive magnet.

[0062] According to one embodiment of the present invention, the suspension assembly includes at least one suspension spring, wherein the suspension spring includes a first spring connection portion, a second spring connection portion and a spring deformation portion, the spring deformation portion extends in the height direction, the first spring connection portion and the second spring connection portion are respectively bent from the bottom of the spring deformation portion and extend in the horizontal direction, the first spring connection portion is connected to the fixed frame, the second spring connection portion is connected to the anti-shake carrier, and the spring deformation portion is deformably maintained on the side of the fixed frame.

[0063] According to one embodiment of the present invention, the spring deformation portion of the suspended spring includes m first extension segments extending in the height direction and n second extension segments extending in the horizontal direction, the opposite ends of each second extension segment are integrally connected to the ends of two adjacent first extension segments, and the parameter m and the parameter n satisfy the relationship: m>n≥1, so that the two outermost extension segments of the spring deformation portion are both the first extension segments, the bottom of one of the two outermost first extension segments of the spring deformation portion is integrally connected to the first spring connection portion, and the bottom of the other first extension segment is integrally connected to the second spring connection portion.

[0064] According to one embodiment of the present invention, the suspension assembly includes four suspension springs, two of which are arranged on one side of the fixed frame, and the other two are arranged on the other side of the fixed frame opposite to the side.

[0065] According to one embodiment of the present invention, the planes where the spring deformation parts of the two suspension springs located on the same side of the fixed frame are located coincide with each other, and the planes where the spring deformation parts of the two suspension springs located on opposite sides of the fixed frame are located are parallel.

[0066] According to an embodiment of the present invention, the plane where the elastic piece deformation portion of one of the suspending elastic pieces is located is perpendicular to the plane where the elastic piece deformation portion of at least one adjacent suspending elastic piece is located.

[0067] According to one embodiment of the present invention, the photosensitive component includes a photosensitive chip, a chip circuit board and a base. The photosensitive chip is arranged and electrically connected to the chip circuit board. The base is integrally formed on the chip circuit board and surrounds the outer peripheral side of the photosensitive chip.

[0068] According to one embodiment of the present invention, the top surface of the base is connected to the bottom surface of the anti-shake carrier, and the bottom surface of the chip circuit board is connected to the top surface of the movable part of the flexible circuit board, so that when the anti-shake carrier moves, the photosensitive component and the movable part of the flexible circuit board are driven to move.

[0069] According to one embodiment of the present invention, the photosensitive component further includes a filter element and a filter element bracket, the filter element bracket is installed above the base, and the filter element is placed on the filter element bracket, wherein the top surface of the filter element is lower than the bottom surface of the anti-shake drive coil.

[0070] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0071] An optical lens, wherein the optical lens is arranged on a light-sensing path of a light-sensing chip; and

[0072] A driving device, comprising a chip driving component, wherein the chip driving component further comprises:

[0073] A photosensitive component, wherein the photosensitive component is used to receive light;

[0074] An anti-shake carrier, the photosensitive component is arranged on the anti-shake carrier;

[0075] a fixed frame, wherein the anti-shake carrier is movably arranged on the fixed frame;

[0076] an anti-shake driving unit, the anti-shake driving unit being configured to drive the anti-shake carrier to move relative to the fixed frame;

[0077] a suspension assembly extending in a height direction on sides of the anti-shake carrier and the fixed frame, the suspension assembly connecting the anti-shake carrier and the fixed frame to movably mount the anti-shake carrier to the fixed frame;

[0078] A flexure circuit plate extends horizontally at the bottom of the photosensitive component, the flexure circuit plate is connected to the photosensitive component, and when the photosensitive component moves, at least a portion of the flexure circuit plate is deformed, wherein the optical lens is arranged on the focusing carrier of the chip anti-shake device.

[0079] According to one embodiment of the present invention, the top surface of the anti-shake driving magnet is higher than the bottom surface of the optical lens.

[0080] According to one embodiment of the present invention, the bottom surface of the anti-shake drive coil is higher than the bottom surface of the optical lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] FIG1 is a perspective schematic diagram of a camera module according to a preferred embodiment of the present invention.

[0082] FIG2 is an exploded schematic diagram of the camera module according to the above preferred embodiment of the present invention.

[0083] FIG3 is another exploded schematic diagram of the camera module according to the above preferred embodiment of the present invention.

[0084] FIG4 is a schematic cross-sectional view of the camera module according to the preferred embodiment of the present invention.

[0085] FIG5 is a perspective schematic diagram of a driving device of the camera module according to the above preferred embodiment of the present invention.

[0086] 6A and 6B are respectively exploded schematic diagrams of the driving device of the camera module according to the above preferred embodiment of the present invention from different perspectives.

[0087] FIG7 is a schematic three-dimensional cross-sectional view of the driving device of the camera module according to the above preferred embodiment of the present invention.

[0088] FIG8 is an enlarged view of a local position of FIG7.

[0089] 9A to 9C are schematic cross-sectional views of the driving device of the camera module at different positions according to the above preferred embodiment of the present invention.

[0090] FIG10A and FIG10B are three-dimensional schematic diagrams of a local structure of the driving device of the camera module according to the above preferred embodiment of the present invention from different perspectives.

[0091] FIG. 11 is an enlarged view of a local position of FIG. 10B .

[0092] FIG12 is a perspective schematic diagram of another partial structure of the driving device of the camera module according to the above preferred embodiment of the present invention.

[0093] FIG13 is an enlarged view of a local position of FIG12.

[0094] FIG14 is a schematic top view of another partial structure of the driving device of the camera module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0095] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components set forth in the following description or illustrated in the following figures. The present invention is capable of other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "including" or "having" and their variations herein is intended to cover the items and their equivalents set forth below and additional items. Unless otherwise specified or limited, the terms "mounted", "connected", "supported" and "coupled" and their variations are used broadly and cover direct mounting and indirect mounting, connection, support and coupling. In addition, "connected" and "coupled" are not limited to physical or mechanical connections or couplings.

[0096] Furthermore, on the first hand, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second hand, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0097] With reference to Figures 1 to 4 of the accompanying drawings of the present invention, a camera module according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the camera module includes a driving device 10, a photosensitive component 20 and an optical lens 30. The driving device 10 further includes a chip driving component 11. The photosensitive component 20 is arranged on the chip driving component 11. The optical lens 30 is arranged in the light sensing path of the photosensitive component 20. External light can reach the photosensitive component 20 after passing through the optical lens 30. The chip driving component 11 is used to drive the photosensitive component 20 to move in the horizontal direction (i.e., the X-axis and Y-axis directions in the coordinate system shown in Figure 1) to achieve anti-shake of the camera module.

[0098] Specifically, referring to Figures 5 to 14, and in combination with Figures 1 to 4, the chip driving component 11 includes a fixed frame 111, an anti-shake carrier 112, an anti-shake driving unit 113, a suspension component 1140 and a flexible circuit board 117, the suspension component 1140 extends in the height direction on the side of the fixed frame 111 and the anti-shake carrier 112, and the suspension component 1140 connects the fixed frame 111 and the anti-shake carrier 112 to movably set the anti-shake carrier 112 on the fixed frame 111, the sensor The optical assembly 20 is mounted on the anti-shake carrier 112. The deflection circuit plate 117 is connected to the bottom of the photosensitive assembly 20 and extends horizontally therefrom. The anti-shake drive unit 113 is configured to drive the anti-shake carrier 112 to move relative to the fixed frame 111, allowing the anti-shake carrier 112 to move the photosensitive assembly 20 to achieve anti-shake for the camera module. When the photosensitive assembly 20 moves, at least a portion of the deflection circuit plate 117 deforms. In other words, the photosensitive assembly 20 is supported by the deflection circuit plate 117, ensuring good flatness.

[0099] The suspension assembly 1140 further includes at least one suspension spring 114, which includes a spring connection portion 1141 and a spring deformation portion 1142. The spring deformation portion 1142 extends in the height direction, and the spring connection portion 1141 is bent from the bottom of the spring deformation portion 1142 and extends in the horizontal direction. The spring connection portion 1141 is connected to the fixed frame 111 and the anti-shake carrier 112, so that the suspension spring 114 can movably set the anti-shake carrier 112 on the fixed frame 111. When the anti-shake drive unit 113 drives the anti-shake carrier 112 to move relative to the fixed frame 111, the spring deformation portion 1142 of the suspension spring 114 is elastically deformed to accumulate elastic potential energy, thereby providing a reset function for the suspension spring 114.

[0100] In some embodiments of the present invention, the spring connection portion 1141 of the suspension spring 114 further includes a first spring connection portion 1141a and a second spring connection portion 1141b, each of which is bent from the bottom of the spring deformation portion 1142 and extends horizontally, wherein the first spring connection portion 1141a is connected to the fixed frame 111, and the second spring connection portion 1141b is connected to the anti-shake carrier 112. The spring deformation portion 1142 is located on the side of the fixed frame 11, so that the suspension spring 114 can movably set the anti-shake carrier 112 on the fixed frame 111. When the anti-shake drive unit 113 drives the anti-shake carrier 112 to move relative to the fixed frame 111, the spring deformation portion 1142 of the suspension spring 114 is elastically deformed to accumulate elastic potential energy, thereby providing a reset function for the suspension spring 114.

[0101] In some specific examples of the present invention, the first elastic piece connection portion 1141a of the suspension elastic piece 114 is connected to the bottom of the fixed frame 111, and the second elastic piece connection portion 1141b is connected to the bottom of the anti-shake carrier 112, so that the suspension elastic piece 114 can movably set the anti-shake carrier 112 at the bottom of the fixed frame 111. In a specific example, the plane where the first elastic piece connection portion 1141a of the elastic piece connection portion 1141 of the suspension elastic piece 114 lies coincides with the plane where the second elastic piece connection portion 1141b lies, so that the anti-shake carrier 112 is stably supported within the fixed frame 111.

[0102] In the camera module of the present invention, the chip driving component 11 suspends the anti-shake carrier 112 at the bottom of the fixed frame 111 through the three-dimensional suspension spring 114. Compared with the prior art suspension scheme using "ball + magnetic attraction", on the one hand, since the first spring connection part 1141a of the suspension spring 114 is fixedly connected to the fixed frame 111 and the second spring connection part 1141b is fixedly connected to the anti-shake carrier 112, the chip driving component 112 can avoid the problem of the suspension spring 114 falling, so as to ensure the stability of the chip driving component 11. On the other hand, the suspension spring 114 has good deformation recovery ability. When the anti-shake driving unit 113 stops driving the anti-shake carrier 112, the suspension spring 114 can quickly realize the reset function through the elastic force generated after deformation, and the working efficiency is higher. On the other hand, the suspension spring 114 itself is relatively thin, which can reduce the space occupied by the drive device 10, thereby further reducing the length and width of the camera module. On the other hand, the suspension spring 114 extends horizontally outward from the bottom of the fixed frame 111 and the anti-shake carrier 112 and then extends upward in the height direction after bending, so that the suspension spring 114 occupies less space in the height direction, thereby reducing the height dimension of the camera module.

[0103] Now turning to Figures 6A to 8 and Figures 10A to 14, the spring deformation portion 1142 of the suspended spring 114 includes m first extension segments 11421 extending in the height direction and n second extension segments 11422 extending in the horizontal direction. The opposite ends of each second extension segment 11422 are integrally connected to the ends of two adjacent first extension segments 11421, and the parameter m and the parameter n satisfy the relationship: m>n≥1. In this way, on the one hand, the first extension segment 11421 and the second extension segment 11422 form a plane parallel to the YOZ plane, and on the other hand, the two outermost extension segments of the spring deformation portion 1142 are both the first extension segments 11421. The bottom of one of the two outermost first extension sections 11421 of the elastic fragment deformation portion 1142 is integrally connected to the first elastic fragment connection portion 1141a, and the bottom of the other first extension section 11421 is integrally connected to the second elastic fragment connection portion 1141b, so that the suspension elastic fragment 114 is an integrated three-dimensional structure. In some specific examples of the present invention, the first elastic fragment connection portion 1141a and the second elastic fragment connection portion 1141b of the suspension elastic fragment 114 are at the same height so that the first elastic fragment connection portion 1141a and the second elastic fragment connection portion 1141b form a plane parallel to the XOY plane. In some specific examples of the present invention, the suspension elastic fragment 114 is formed by stamping and bending a metal sheet in sequence along a preset position, so that the suspension elastic fragment 114 is an integrated three-dimensional structure.

[0104] Turning now to Figures 6A, 6B, 10A, and 10B, in this specific example of the present invention, the fixed frame 111 and the anti-shake carrier 112 are both square frames, and the four corners of the fixed frame 111 correspond one-to-one with the four corners of the anti-shake carrier 112 to form the four corners of the chip driver assembly 11. The suspension assembly 1140 includes four suspension springs 114, each of which connects the fixed frame 111 and the anti-shake carrier 112 at each corner of the chip driver assembly 11 to prevent the anti-shake carrier 112 from tilting.

[0105] In other words, a suspension spring 114 is provided at each corner of the chip driving component 11, and the first spring connection part 1141a of the suspension spring 114 is connected to the bottom of the fixed frame 111 at the corner of the fixed frame 111, and the second spring connection part 1141b is connected to the bottom of the anti-shake carrier 112 at the corner of the anti-shake carrier 112. In this way, the four suspension springs 114 cooperate with each other to suspend the anti-shake carrier 112 flatly below the fixed frame 111 to prevent the anti-shake carrier 112 from tilting.

[0106] Based on the position difference, the four suspension springs 114 are respectively defined as a first suspension spring 114a, a second suspension spring 114b, a third suspension spring 114c and a fourth suspension spring 114d, wherein at the first corner of the chip driving component 11, the first spring connecting portion 1141a and the second spring connecting portion 1141b of the first suspension spring 114a are respectively connected to the fixed frame 111 and the anti-shake carrier 112, and at the second corner of the chip driving component 11, the first spring connecting portion 1141a and the second spring connecting portion 1141b of the first suspension spring 114a are respectively connected to the fixed frame 111 and the anti-shake carrier 112. The two spring-type connecting portions 1141b are connected to the fixed frame 111 and the anti-shake carrier 112, respectively. At the third corner of the chip driver assembly 11, the first spring-type connecting portion 1141a and the second spring-type connecting portion 1141b of the first suspending spring 114a are connected to the fixed frame 111 and the anti-shake carrier 112, respectively. At the fourth corner of the chip driver assembly 11, the first spring-type connecting portion 1141a and the second spring-type connecting portion 1141b of the first suspending spring 114a are connected to the fixed frame 111 and the anti-shake carrier 112, respectively. That is, the first suspending spring 114a, the second suspending spring 114b, the third suspending spring 114c, and the fourth suspending spring 114d cooperate with each other to smoothly suspend the anti-shake carrier 112 at the bottom of the fixed frame 111.

[0107] Furthermore, in this specific example of the present invention, the fixed frame 111 is in the shape of a square frame, which includes a first frame 1111, a second frame 1112, a third frame 1113 and a fourth frame 1114. The first frame 1111 and the third frame 1113 are face to face, the second frame 1112 and the fourth frame 1114 are face to face, the opposite ends of the first frame 1111 are respectively connected to one end of the second frame 1112 and one end of the fourth frame 1114, and the opposite ends of the third frame 1113 are respectively connected to the other end of the second frame 1112 and the other end of the fourth frame 1114. In other words, the first frame 1111, the second frame 1112, the third frame 1113 and the fourth frame 1114 of the fixed frame 111 are connected end to end, so that the fixed frame 111 is in the shape of a square frame.

[0108] Correspondingly, the anti-shake carrier 112 is in the shape of a square frame and includes a first carrier frame 1121, a second carrier frame 1122, a third carrier frame 1123, and a fourth carrier frame 1124. The first carrier frame 1121 and the third carrier frame 1123 face each other, while the second carrier frame 1122 and the fourth carrier frame 1124 face each other. Opposite ends of the first carrier frame 1121 are respectively connected to one end of the second carrier frame 1122 and one end of the fourth carrier frame 1124. Opposite ends of the third carrier frame 1123 are respectively connected to the other end of the second carrier frame 1122 and the other end of the fourth carrier frame 1124. In other words, the first carrier frame 1121, the second carrier frame 1122, the third carrier frame 1123, and the fourth carrier frame 1124 of the anti-shake carrier 112 are connected end to end, giving the anti-shake carrier 112 a square frame shape.

[0109] The position of the first border 1111 of the fixed frame 111 corresponds to the position of the first carrier frame 1121 of the anti-shake carrier 112, so as to define a first component side 1101 of the chip driver component 11, the position of the second border 1112 of the fixed frame 111 corresponds to the position of the second carrier frame 1122 of the anti-shake carrier 112, so as to define a second component side 1102 of the chip driver component 11, the position of the third border 1113 of the fixed frame 111 corresponds to the position of the third carrier frame 1123 of the anti-shake carrier 112, so as to define a third component side 1103 of the chip driver component 11, and the position of the fourth border 1114 of the fixed frame 111 corresponds to the position of the fourth carrier frame 1124 of the anti-shake carrier 112, so as to define a fourth component side 1104 of the chip driver component 11.

[0110] It is understood that in other examples of the present invention, the fixed frame 111 and the anti-shake carrier 112 may have other shapes, as long as their shapes match. For example, the fixed frame 111 and the anti-shake carrier 112 may be annular. Nevertheless, the following description will still use the fixed frame 111 and the anti-shake carrier 112 as an example to further disclose the content and features of the present invention.

[0111] In this specific example of the present invention, referring to FIG10B, the first suspension spring piece 114a and the fourth suspension spring piece 114d are symmetrically arranged on the first component side 1101 of the chip driving component 11, so that the first spring piece connecting portion 1141a and the second spring piece connecting portion 1141b of the first suspension spring piece 114a are respectively connected to the first frame 1111 of the fixed frame 111 and the first carrier frame 1121 of the anti-shake carrier 112, and the spring piece deformation portion 1142 of the first suspension spring piece 114a is located at the first component side 1101 of the chip driving component 11. The first spring connecting portion 1141a and the second spring connecting portion 1141b of the fourth suspension spring 114d are respectively connected to the first frame 1111 of the fixed frame 111 and the first carrier frame 1121 of the anti-shake carrier 112. The spring deformation portion 1142 of the fourth suspension spring 114d is located on the side of the first frame 1111 of the fixed frame 111 and has a gap with the first frame 1111. The second suspension spring piece 114b and the third suspension spring piece 114c are symmetrically arranged on the third component side 1103 of the chip drive component 11, so that the first spring piece connecting portion 1141a and the second spring piece connecting portion 1141b of the second suspension spring piece 114b are respectively connected to the third frame 1113 of the fixed frame 111 and the third carrier frame 1123 of the anti-shake carrier 112, and the spring piece deformation portion 1142 of the second suspension spring piece 114b is located at the third side of the fixed frame 111. The side of the third frame 1113 and there is a gap with the third frame 1113, the first spring connecting part 1141a and the second spring connecting part 1141b of the third suspension spring 114c are respectively connected to the third frame 1113 of the fixed frame 111 and the third carrier frame 1123 of the anti-shake carrier 112, and the spring deformation part 1142 of the third suspension spring 114c is located on the side of the third frame 1113 of the fixed frame 111 and there is a gap with the third frame 1113.

[0112] That is to say, in the present invention, two of the four suspension springs 114 are arranged on the same side of the fixed frame 111 (that is, the first suspension spring 114a and the fourth suspension spring 114d are arranged on the first border 1111 of the fixed frame 111), and the other two suspension springs 114 are arranged on the other side of the fixed frame 111 opposite to this side (that is, the second suspension spring 114b and the third suspension spring 114c are arranged on the third border 1113 of the fixed frame 111).

[0113] Furthermore, the planes where the elastic sheet deformation portions 1142 of the two suspension elastic sheets 114 located on the same side of the fixed frame 111 are located coincide with each other (i.e., the plane where the elastic sheet deformation portion 1142 of the first suspension elastic sheet 114a is located coincides with the plane where the elastic sheet deformation portion 1142 of the fourth suspension elastic sheet 114d is located coincides with each other), and the planes where the elastic sheet deformation portions 1142 of the two suspension elastic sheets 114 located on opposite sides of the fixed frame 111 are parallel to each other (i.e., the planes where the elastic sheet deformation portions 1142 of the first suspension elastic sheet 114a is located coincide with the plane where the elastic sheet deformation portion 1142 of the fourth suspension elastic sheet 114d is located coincide with each other). The plane where the elastic fragment deformation part 1142 of the first suspension elastic fragment 114a is located is parallel to the plane where the elastic fragment deformation part 1142 of the second suspension elastic fragment 114b is located, and the plane where the elastic fragment deformation part 1142 of the second suspension elastic fragment 114b is located is parallel to the plane where the elastic fragment deformation part 1142 of the third suspension elastic fragment 114c is located). In this way, the four suspension elastic fragments 114 cooperate with each other to suspend the anti-shake carrier 112 flatly at the bottom of the fixed frame 111.

[0114] Optionally, in other examples of the present invention, the first suspension spring 114a is disposed on the first component side 1101 of the chip driver component 11, the first spring connection portion 1141a and the second spring connection portion 1141b of the first suspension spring 114a are respectively connected to the first frame 1111 of the fixed frame 111 and the first carrier frame 1121 of the anti-shake carrier 112, and the spring deformation portion 1142 of the first suspension spring 114a is located on the side of the first frame 1111 of the fixed frame 111 and has a gap with the first frame 1111. The second suspension spring 114b is disposed on the second component side 1102 of the chip driver component 11, and the first spring connection portion 1141a and the second spring connection portion 1141b of the second suspension spring 114b are respectively connected to the second frame 1112 of the fixed frame 111 and the second carrier frame 1122 of the anti-shake carrier 112. The elastic fragment deformation portion 1142 of the second suspension elastic fragment 114b is located on the side of the second frame 1112 of the fixed frame 111, and has a gap with the second frame 1112. The third suspension elastic fragment 114c is provided on the third component side 1103 of the chip driver component 11. The first elastic fragment connection portion 1141a and the second elastic fragment connection portion 1141b of the third suspension elastic fragment 114c are respectively connected to the third frame 1113 of the fixed frame 111 and the third carrier frame 1123 of the anti-shake carrier 112. The elastic fragment deformation portion 1142 of the third suspension elastic fragment 114c is located on the side of the third frame 1113 of the fixed frame 111, and has a gap with the third frame 1113. The fourth suspension spring clip 114d is arranged on the fourth component side 1104 of the chip driving component 11, and the first spring clip connecting part 1141a and the second spring clip connecting part 1141b of the fourth suspension spring clip 114d are respectively connected to the fourth frame 1114 of the fixed frame 111 and the fourth carrier frame 1124 of the anti-shake carrier 112, and the spring clip deformation part 1142 of the fourth suspension spring clip 114d is located on the side of the fourth frame 1114 of the fixed frame 111, and has a gap with the fourth frame 1114.

[0115] That is, the plane where the elastic deformation portion 1142 of one suspending elastic piece 114 lies is perpendicular to the plane where the elastic deformation portion 1142 of at least one adjacent suspending elastic piece 114 lies. For example, the plane where the elastic deformation portion 1142 of the first suspending elastic piece 114a lies is perpendicular to the plane where the elastic deformation portion 1142 of the second suspending elastic piece 114b lies, and / or the plane where the elastic deformation portion 1142 of the first suspending elastic piece 114a lies is perpendicular to the plane where the elastic deformation portion 1142 of the fourth suspending elastic piece 114d lies. In this way, the four suspending elastic pieces 114 cooperate with each other to smoothly suspend the anti-shake carrier 112 at the bottom of the fixed frame 111.

[0116] Turning now to Figures 6A, 6B, and 10A to 14, in this specific example of the present invention, the first frame 1111 of the fixed frame 111 has a first frame connecting arm 11111 extending downward at opposite ends, and the third frame 1113 of the fixed frame 111 has a second frame connecting arm 11131 extending downward at opposite ends. The first carrier frame 1121 of the anti-shake carrier 112 has a first carrier connecting arm 11211 extending outward at opposite ends, and the third carrier frame 1123 of the anti-shake carrier 112 has a second carrier connecting arm 11231 extending outward at opposite ends.

[0117] The positions of the two first frame connecting arms 11111 of the first border 1111 of the fixed frame 111 and the positions of the two first carrier connecting arms 11211 of the first carrier frame 1121 of the anti-shake carrier 112 are respectively adjacent to each other, the first spring clip connecting part 1141a of the first suspension spring clip 114a and the first spring clip connecting part 1141a of the fourth suspension spring clip 114d are respectively connected to the two first frame connecting arms 11111 of the first border 1111 of the fixed frame 111, and the second spring clip connecting part 1141b of the first suspension spring clip 114a and the second spring clip connecting part 1141b of the fourth suspension spring clip 114d are respectively connected to the two first carrier connecting arms 11211 of the first carrier frame 1121 of the anti-shake carrier 112. The positions of the two second frame connecting arms 11131 of the third frame 1113 of the fixed frame 111 and the positions of the two second carrier connecting arms 11231 of the third carrier frame 1123 of the anti-shake carrier 112 are respectively adjacent to each other, the first elastic fragment connecting part 1141a of the second suspension elastic fragment 114b and the first elastic fragment connecting part 1141a of the third suspension elastic fragment 114c are respectively connected to the two second frame connecting arms 11131 of the third frame 1113 of the fixed frame 111, and the second elastic fragment connecting part 1141b of the second suspension elastic fragment 114b and the second elastic fragment connecting part 1141b of the third suspension elastic fragment 114c are respectively connected to the two second carrier connecting arms 11231 of the third carrier frame 1123 of the anti-shake carrier 112. Through the above structure, the first suspension spring piece 114 a , the second suspension spring piece 114 b , the third suspension spring piece 114 c and the fourth suspension spring piece 114 d cooperate with each other to smoothly suspend the anti-shake carrier 112 on the bottom of the fixed frame 111 .

[0118] It is worth mentioning that the manner in which the first elastic piece connecting portion 1141a of the suspension elastic piece 114 is connected to the fixed frame 111 is not limited in the present invention. For example, in this specific example of the present invention, referring to Figures 12 and 13, the bottom end of the first frame connecting arm 11111 of the first side frame 1111 of the fixed frame 111 has at least one first retaining column 111111, the first elastic piece connecting portion 1141a of the first suspension elastic piece 114a has at least one first retaining hole 11411, and the first retaining column 111111 of the first frame connecting arm 11111 extends to the first elastic piece connecting portion 1141. a, the end of the first holding column 111111 of the first frame connecting arm 11111 is expanded by heating and / or pressurizing it to prevent the first holding column 111111 of the first frame connecting arm 11111 from falling off from the first holding hole 11411 of the first elastic piece connecting part 1141a, thereby fixedly connecting the first elastic piece connecting part 1141a of the first suspension elastic piece 114a to the fixed frame 111.

[0119] Further, referring to FIG13 , the bottom end of the first frame connecting arm 11111 of the first frame 1111 of the fixed frame 111 has two first retaining columns 111111, and the first elastic sheet connecting portion 1141a of the first suspension elastic sheet 114a has two first retaining holes 11411, wherein the outer diameter of one of the first retaining columns 111111 of the first frame connecting arm 11111 and the inner diameter of one of the first retaining holes 11411 of the first elastic sheet connecting portion 1141a are equal to the outer diameter of the first retaining column 111111 of the first frame connecting arm 11111. The outer diameters of the other first retaining column 111111 are slightly smaller than the inner diameter of the other first retaining hole 11411 of the first elastic piece connecting part 1141a. In this way, after the two first retaining columns 1111111 of the first frame connecting arm 11111 of the first frame 1111 respectively extend to the two first retaining holes 11411 of the first elastic piece connecting part 1141a, the relative positions of the first elastic piece connecting part 1141a and the first frame 1111 can be adjusted.

[0120] It can be understood that, based on the same structure, the first spring clip connecting portion 1141a of the second suspension spring clip 114b is connected to one of the second frame connecting arms 11131 of the third frame 1113 of the fixed frame 111, the first spring clip connecting portion 1141a of the third suspension spring clip 114c is connected to another of the second frame connecting arms 11131 of the third frame 1113 of the fixed frame 111, and the first spring clip connecting portion 1141a of the fourth suspension spring clip 114d is connected to another of the first frame connecting arms 11111 of the first frame 1111 of the fixed frame 111.

[0121] It is worth mentioning that the manner in which the second elastic piece connecting portion 1141 b of the suspension elastic piece 114 is connected to the anti-shake carrier 112 is not limited in the present invention. For example, in this specific example of the present invention, referring to Figures 12 and 13, the bottom of the first carrier connecting arm 11211 of the first carrier frame 1121 of the anti-shake carrier 112 has at least one second retaining column 112111, and the second elastic piece connecting part 1141b of the first suspension spring 114a has at least one second retaining hole 11412. After the second retaining column 112111 of the first carrier connecting arm 11211 extends to the second retaining hole 11412 of the second elastic piece connecting part 1141b, the end of the second retaining column 112111 of the first carrier connecting arm 11211 is heated and / or pressurized to expand it to prevent the second retaining column 112111 of the first carrier connecting arm 11211 from falling off from the second retaining hole 11412 of the second elastic piece connecting part 1142, thereby fixedly connecting the second elastic piece connecting part 1141b of the first suspension spring 114a to the anti-shake carrier 112.

[0122] Further, with reference to FIG13 , the bottom of the first carrier connecting arm 11211 of the first carrier frame 1121 of the anti-shake carrier 112 has two second retaining columns 112111, and the second elastic sheet connecting portion 1141b of the first suspension elastic sheet 114a has two second retaining holes 11412, wherein the outer diameter of one second retaining column 112111 of the first carrier connecting arm 11211 and the inner diameter of one second retaining hole 11412 of the second elastic sheet connecting portion 1141b are equal to the outer diameter of the second retaining column 112111 of the first carrier connecting arm 11211. The outer diameter of the other second retaining column 112111 is slightly smaller than the inner diameter of the other second retaining hole 11412 of the second elastic piece connecting part 1141b. In this way, after the two second retaining columns 112111 of the first carrier connecting arm 11211 of the first carrier frame 1121 respectively extend to the two second retaining holes 11412 of the second elastic piece connecting part 1141b, the relative positions of the second elastic piece connecting part 1142 and the first carrier frame 1121 can be adjusted.

[0123] It can be understood that, based on the same structure, the second spring clip connecting portion 1141b of the second suspension spring clip 114b is connected to one of the second carrier connecting arms 11231 of the third carrier frame 1123 of the anti-shake carrier 112, the second spring clip connecting portion 1141b of the third suspension spring clip 114c is connected to another second carrier connecting arm 11231 of the third carrier frame 1123 of the anti-shake carrier 112, and the second spring clip connecting portion 1141b of the fourth suspension spring clip 114d is connected to another first carrier connecting arm 11211 of the first carrier frame 1121 of the anti-shake carrier 112.

[0124] Now turning to Figures 10A to 14, the two first carrier connecting arms 11211 of the first carrier frame 1121 of the anti-shake carrier 112 are respectively located on the inner sides of the two first frame connecting arms 11111 of the first border 1111 of the fixed frame 111, so that the translation range of the anti-shake carrier 112 is limited by the fixed frame 111, thereby avoiding damage to the suspension spring 114 due to excessive translation range of the anti-shake carrier 112.

[0125] Furthermore, the second carrier frame 1122 of the anti-shake carrier 112 is located on the inner side of one of the first frame connecting arms 11111 of the first frame 1111 of the fixed frame 111 and one of the second frame connecting arms 11131 of the third frame 1113, and the fourth carrier frame 1124 is located on the inner side of another of the first frame connecting arms 11111 of the first frame 1111 of the fixed frame 111 and another of the second frame connecting arms 11131 of the third frame 1113, so that the translation range of the anti-shake carrier 112 is limited by the fixed frame 111, thereby avoiding damage to the suspension spring 114 due to excessive translation range of the anti-shake carrier 112.

[0126] Turning now to Figures 6A to 8, 10B, and 11, the chip driver assembly 11 further includes at least one supporting plate 115, which is disposed at the bottom of the fixed frame 111, and one end of the supporting plate 115 extends below the anti-shake carrier 112, so that at least a portion of the supporting plate 115 overlaps with at least a portion of the suspension spring 114 in the height direction. Before the chip driver assembly 11 and the photosensitive assembly 20 are assembled, the supporting plate 115 is used to prevent the anti-shake carrier 112 from generating a large displacement in the height direction relative to the fixed frame 111, thereby protecting the suspension spring 114. Furthermore, the other end of the supporting plate 115 extends below the suspension spring 114.

[0127] In this specific example of the present invention, the number of the supporting plates 115 is four, which are respectively defined as a first supporting plate 115a, a second supporting plate 115b, a third supporting plate 115c, and a fourth supporting plate 115d. The middle portions of the first supporting plate 115a and the fourth supporting plate 115d are respectively arranged at the bottom ends of the two first frame connecting arms 11111 of the first side frame 1111 of the fixed frame 111, and one end of the first supporting plate 115a and one end of the fourth supporting plate 115d extend respectively to below one end of the second carrier frame 1122 and one end of the fourth carrier frame 1124 of the anti-shake carrier 112, the other end of the first supporting plate 115a extends to below the first suspension spring 114a, and the other end of the fourth supporting plate 115d extends to below the fourth suspension spring 114d. The middle parts of the second supporting plate 115b and the third supporting plate 115c are respectively arranged at the bottom ends of the two second frame connecting arms 11131 of the third frame 1113 of the fixed frame 111, and one end of the second supporting plate 115b and one end of the third supporting plate 115c extend to the bottom of the other end of the second carrier frame 1122 of the anti-shake carrier 112 and the bottom of the other end of the fourth carrier frame 1124, respectively. The other end of the second supporting plate 115b extends to the bottom of the second suspension spring 114b, and the other end of the third supporting plate 115c extends to the bottom of the third suspension spring 114c.

[0128] It is worth mentioning that the manner in which the supporting plate 115 is disposed at the bottom of the fixed frame 111 is not limited in the present invention. For example, in this specific example of the present invention, referring to Figures 10B and 11, the bottom end of the first frame connecting arm 11111 of the first side frame 1111 of the fixed frame 111 has at least one third retaining column 111112, and the first supporting plate 115a has at least one third retaining hole 1151. After the third retaining column 111112 of the first frame connecting arm 11111 extends to the third retaining hole 1151 of the first supporting plate 115a, the end of the third retaining column 111112 of the first frame connecting arm 11111 is expanded by heating and / or pressurizing the end to prevent the third retaining column 111112 of the first frame connecting arm 11111 from falling off from the third retaining hole 1151 of the first supporting plate 115a, thereby fixing the first supporting plate 115a at the bottom of the first frame connecting arm 11111 of the first side frame 1111 of the fixed frame 111.

[0129] It can be understood that, based on the same structure, the second supporting plate 115b is arranged at the bottom of one of the second frame connecting arms 11131 of the third frame 1113 of the fixed frame 111, the third supporting plate 115c is arranged at the bottom of the other second frame connecting arm 11131 of the third frame 1113 of the fixed frame 111, and the fourth supporting plate 115d is arranged at the bottom of the other first frame connecting arm 11111 of the first frame 1111 of the fixed frame 111.

[0130] Turning to Figures 6A, 6B, 9A, 9B, and 9C, the anti-shake drive unit 113 includes at least one anti-shake drive magnet 1131 and at least one anti-shake drive coil 1132. The anti-shake drive magnet 1131 is provided on at least one of the first frame 1111, the second frame 1112, the third frame 1113, and the fourth frame 1114 of the fixed frame 111. The anti-shake drive coil 1132 is provided on at least one of the first carrier frame 1121, the second carrier frame 1122, the third carrier frame 1123, and the fourth carrier frame 1124 of the anti-shake carrier 112. The position of the anti-shake drive magnet 1131 corresponds to the position of the anti-shake drive coil 1132. When the anti-shake drive coil 1132 is powered, the anti-shake drive coil 1132 and the anti-shake drive magnet 1131 work together to drive the anti-shake carrier 112 to move relative to the fixed frame 111.

[0131] In this specific example of the present invention, the anti-shake drive unit 113 includes three anti-shake drive magnets 1131 and three anti-shake drive coils 1132. For the convenience of description, the three anti-shake drive magnets 1131 of the anti-shake drive unit 113 are defined as a first anti-shake drive magnet 1131a, a second anti-shake drive magnet 1131b and a third anti-shake drive magnet 1131c, and correspondingly, the three anti-shake drive coils 1132 are defined as a first anti-shake drive coil 1132a, a second anti-shake drive coil 1131b and a third anti-shake drive coil 1131c, and the fixed frame 111 The second frame 1112, the third frame 1113 and the fourth frame 1114 are respectively provided with the first anti-shake drive magnet 1131a, the second anti-shake drive coil 1131b and the third anti-shake drive coil 1131c, and the second carrier frame 1122, the third carrier frame 1123 and the fourth carrier frame 1124 of the anti-shake carrier 112 are respectively provided with the first anti-shake drive coil 1132a, the second anti-shake drive coil 1132b and the third anti-shake drive coil 1132c. The first anti-shake driving magnet 1131a provided on the second frame 1112 of the fixed frame 111 and the first anti-shake driving coil 1132a provided on the second carrier frame 1122 of the anti-shake carrier 112 cooperate with each other, and the third anti-shake driving magnet 1131c provided on the fourth frame 1114 of the fixed frame 111 and the third anti-shake driving coil 1132c provided on the fourth carrier frame 1124 of the anti-shake carrier 112 cooperate with each other to drive the anti-shake carrier 112 to translate in the X-axis direction (the X-axis in the coordinate system of FIG. 1 ); the second anti-shake driving magnet 1131b provided on the third frame 1113 of the fixed frame 111 and the second anti-shake driving coil 1132b provided on the third carrier frame 1123 of the anti-shake carrier 112 cooperate with each other to drive the anti-shake carrier 112 to translate in the Y-axis direction (the Y-axis in the coordinate system of FIG. 1 ). It can be seen that the anti-shake drive unit 113 can provide a greater driving force in the X-axis direction than in the Y-axis direction.

[0132] Turning now to Figures 6A to 8 and 10A to 14, the K value of the elastic deformation portion 1142 of the suspension spring 114 in the X-axis direction and the K value in the Y-axis direction differ significantly. When viewed along the height direction, the direction in which the elastic deformation portion 1142 has a smaller width (the thickness direction) has a smaller K value, while the direction in which the elastic deformation portion 1142 has a larger width (the extension direction) has a larger K value. In some specific examples of the present invention, the thickness direction of the elastic deformation portion 1142 is the same as the length direction of the first anti-shake drive magnet 1131a and the third anti-shake drive magnet 1131c, and the extension direction of the elastic deformation portion 1142 is the same as the length direction of the second anti-shake drive magnet 1131b.

[0133] In some specific examples of the present invention, the width dimension of the spring deformation part 1142 of the suspension spring 114 along the Y-axis direction is small, so that the K value of the spring deformation part 1142 in the Y-axis direction is small, and the anti-shake drive unit 113 provides a small driving force in the Y-axis direction to drive the spring deformation part 1142 of the suspension spring 114 to deform. Therefore, the anti-shake drive unit 113 sets a second anti-shake drive magnet 1131b on the third frame 1113 of the fixed frame 111 along the X-axis direction and sets a second anti-shake drive coil 1132b on the third carrier frame 1123 of the anti-shake carrier 112. In other words, looking at the plane of the suspension spring piece 114 along the height direction, the direction in which the width of the spring deformation part 1142 of the suspension spring piece 114 is smaller is the same as the magnetic pole direction of the second anti-shake driving magnet 1131b of the anti-shake driving unit 113 arranged on the third frame 1113 of the fixed frame 111, and the direction of the driving force generated by the interaction between the second anti-shake driving magnet 1131b of the third frame 1113 of the fixed frame 111 and the second anti-shake driving coil 1132b of the third carrier frame 1123 of the anti-shake carrier 112 is the Y-axis direction, that is, the plane where the spring deformation part 1142 of the suspension spring piece 114 is located is perpendicular to the magnetic pole direction of the second anti-shake driving magnet 1131b of the third frame 1113 of the fixed frame 111. In particular, the planes where the spring deformation portions 1142 of the four suspension springs 114 of the suspension assembly 1140 are located are all perpendicular to the magnetic pole direction of the second anti-shake driving magnet 1131 b .

[0134] The magnetic pole direction of the second anti-shake drive magnet 1131b is consistent with the length direction of the first anti-shake drive magnet 1131a and the length direction of the third anti-shake drive magnet 1131c. For example, in some embodiments, the inner side of the second anti-shake drive magnet 1131b is the N pole and the outer side is the S pole, so that the magnetic pole direction of the second anti-shake drive magnet 1131b is consistent with the length direction of the first anti-shake drive magnet 1131a and the length direction of the third anti-shake drive magnet 1131c, or in other embodiments, the inner side of the second anti-shake drive magnet 1131b is the S pole and the outer side is the N pole, so that the magnetic pole direction of the second anti-shake drive magnet 1131b is consistent with the length direction of the first anti-shake drive magnet 1131a and the length direction of the third anti-shake drive magnet 1131c.

[0135] The width of the spring deformation part 1142 of the suspended spring 114 along the X-axis direction is large, so that the K value of the spring deformation part 1142 in the X-axis direction is large. The anti-shake drive unit 113 provides a large driving force in the X-axis direction to drive the spring deformation part 1142 of the suspended spring 114 to deform. Therefore, the anti-shake drive unit 113 is respectively arranged along the Y-axis direction on the second frame 1112 of the fixed frame 111 and the third anti-shake drive magnet 1131b on the fourth frame 1114, and respectively arranged on the second carrier frame 1122 of the anti-shake carrier 112 and the third anti-shake drive coil 1132a and the third anti-shake drive coil 1132c on the fourth carrier frame 1124. In other words, when viewing the plane of the suspension spring piece 114 along the height direction, the direction in which the width of the spring deformation portion 1142 of the suspension spring piece 114 is larger is the same as the magnetic pole direction of the first anti-shake driving magnet 1131a of the anti-shake driving unit 113 disposed on the second frame 1112 of the fixed frame 111 and the third anti-shake driving magnet 1131c disposed on the fourth frame 1114 of the fixed frame 111, and the second frame 1112 disposed on the fixed frame 111 is the same as the magnetic pole direction of the third anti-shake driving magnet 1131c of the fourth frame 1114 of the fixed frame 111. The direction of the driving force generated by the interaction between the first anti-shake driving magnet 1131a and the first anti-shake driving coil 1132a of the second carrier frame 1122 arranged on the anti-shake carrier 112 is the X-axis direction, and the direction of the driving force generated by the interaction between the third anti-shake driving magnet 1131c of the fourth frame 1114 arranged on the fixed frame 111 and the third anti-shake driving coil 1132c of the fourth carrier frame 1124 arranged on the anti-shake carrier 112 is the X-axis direction.

[0136] The magnetic pole direction of the first anti-shake driving magnet 1131a is aligned with the longitudinal direction of the second anti-shake driving magnet 1131b. For example, in some embodiments, the inner side of the first anti-shake driving magnet 1131a is an N pole and the outer side is an S pole, so that the magnetic pole direction of the first anti-shake driving magnet 1131a is aligned with the longitudinal direction of the second anti-shake driving magnet 1131b. Alternatively, in other embodiments, the inner side of the first anti-shake driving magnet 1131a is an S pole and the outer side is an N pole, so that the magnetic pole direction of the first anti-shake driving magnet 1131a is aligned with the longitudinal direction of the second anti-shake driving magnet 1131b. The magnetic pole direction of the third anti-shake driving magnet 1131c is the same as that of the first anti-shake driving magnet 1131a.

[0137] This arrangement of the anti-shake drive unit 113 and the suspension spring 114 can determine the anti-shake drive magnet 1131 configured in the direction according to the thickness of the spring deformation part 1142 of the suspension spring 114 along the X-axis direction and the Y-axis direction, so that the functions of each part of the suspension spring 114 can be fully utilized.

[0138] Turning now to Figures 9B and 9C , the second frame 1112, the third frame 1113, and the fourth frame 1114 of the fixed frame 111 are each provided with a first mounting groove 1115 for mounting the anti-shake drive magnet 1131. By mounting one anti-shake drive magnet 1131 on each of the second frame 1112, the third frame 1113, and the fourth frame 1114 of the fixed frame 111, on the one hand, the anti-shake drive magnet 1131 can be securely mounted on the fixed frame 111, and on the other hand, the height space occupied by the anti-shake drive magnet 1131 on the chip drive assembly 11 is reduced or avoided, thereby reducing the height dimension of the camera module.

[0139] Turning to Figure 6A, the second carrier frame 1122, the third carrier frame 1123 and the fourth carrier frame 1124 of the anti-shake carrier 112 are respectively provided with a retaining groove 1125 for setting the anti-shake drive coil 1132. In this way, the height space occupied by the anti-shake drive coil 1132 on the chip drive component 11 is reduced or avoided, thereby reducing the height dimension of the camera module.

[0140] Referring to Figures 6A, 6B, and 9A, in this specific example of the present invention, the anti-shake drive unit 113 further includes an anti-shake circuit board 1133. The anti-shake drive coil 1132 is formed on the anti-shake circuit board 1133, so that the two form an FPcoil structure. The anti-shake circuit board 1133 is positioned in the retaining groove 1125 of the anti-shake carrier 112, so that the anti-shake drive coil 1132 is positioned on the anti-shake carrier 112 by the anti-shake circuit board 1133. The FPcoil structure can reduce the height of the anti-shake drive coil 1132 while allowing it to have more wire layers, thereby enabling the anti-shake drive unit 113 to provide greater driving force. In other embodiments of the present invention, the anti-shake drive coil 1132 can be mounted on the anti-shake circuit board 1133.

[0141] Turning to Figures 9A, 9B and 9C, the anti-shake drive unit 113 further includes at least one anti-shake magnetic conductive element 1134. The anti-shake magnetic conductive element 1134 is arranged on the side of the anti-shake drive magnet 1131 away from the anti-shake drive coil 1132, so that the magnetic lines of force of the anti-shake drive magnet 1131 are concentrated in the direction of the anti-shake drive coil 1132. In this way, the magnetic field strength of the anti-shake drive unit 113 can be enhanced, so that the anti-shake drive unit 113 can provide greater driving force.

[0142] It is worth mentioning that the manner in which the anti-shake magnetic conductive element 1134 is disposed in the fixed frame 111 is not limited in the present invention. For example, in some embodiments, after the fixed frame 111 is injection molded, the anti-shake magnetic conductive element 1134 and the anti-shake driving magnet 1131 are sequentially embedded in the first embedding groove 1115 of the fixed frame 111. In this way, the anti-shake magnetic conductive element 1134 is disposed in the fixed frame 111 so that the anti-shake magnetic conductive element 1134 is located on a side of the anti-shake driving magnet 1131 away from the anti-shake driving coil 1132. In other embodiments, the anti-shake magnetic conductive element 1134 is integrally provided inside the fixed frame 111 through an insert injection molding process, and the position of the first embedding groove 1115 of the fixed frame 111 corresponds to the anti-shake magnetic conductive element 1134, so that after the anti-shake driving magnet 1131 is embedded in the first embedding groove 1115 of the fixed frame 111, the anti-shake magnetic conductive element 1134 is located on the side of the anti-shake driving magnet 1131 away from the anti-shake driving coil 1132.

[0143] 6A, 6B, 9A, and 9B, the anti-shake carrier 112 is an electrical carrier. The anti-shake carrier 112 further includes at least one conductive insert 1126 embedded in the first carrier frame 1121, the second carrier frame 1122, the third carrier frame 1123, and the fourth carrier frame 1124. The conductive insert 1126 forms a carrier soldering pad 11261 on the top surface of at least one of the first, second, third, and fourth carrier frames 1121, 1122, 1123, and 1124, and a carrier soldering foot 11262 on the bottom surface of at least one of the first, second, third, and fourth carrier frames 1121, 1122, 1123, and 1124. The anti-shake circuit board 1133 is soldered to the carrier soldering pad 11261 of the conductive insert 1126.

[0144] Turning now to Figures 6B, 10B, and 12, the anti-shake carrier 112 has at least one receiving cavity 1127 disposed in the second carrier frame 1122, the third carrier frame 1123, and / or the fourth carrier frame 1124. The receiving cavity 1127 of the anti-shake carrier 112 exposes the conductive insert 1126. The chip driver assembly 11 further includes at least one anti-shake position sensing element 116, which may be, but is not limited to, a Hall effect element or a TMR element. The anti-shake position sensing element 116 is disposed in the receiving cavity 1127 of the anti-shake carrier 112. Each anti-shake position sensing element 116 is connected to the conductive insert 1126, such that the anti-shake position sensing element 116 corresponds in height to the anti-shake driving magnet 1131 disposed therein. The anti-shake position sensing element 116 is configured to detect the magnetic field strength of the anti-shake driving magnet 1131 at different positions, thereby determining the position of the anti-shake carrier 112 relative to the fixed frame 111. In the present invention, by accommodating the anti-shake position sensing element 116 in the accommodating cavity 1127 of the anti-shake carrier 112, the anti-shake position sensing element 116 does not need to occupy the space in the height direction of the chip driving component 11, which is beneficial to reducing the height dimension of the camera module.

[0145] In some specific examples of the present invention, the anti-shake carrier 112 has two receiving cavities 1127, which are respectively provided in the second carrier frame 1122 and the third carrier frame 1123. Correspondingly, the chip driving component 11 includes two anti-shake position sensing elements 116, and each anti-shake position sensing element 116 is respectively received in each receiving cavity 1127 of the anti-shake carrier 112, so that one anti-shake position sensing element 116 corresponds to the first anti-shake driving magnet 1131a in the height direction, so as to detect the magnetic field strength of the first anti-shake driving magnet 1131a at different positions, and the other anti-shake position sensing element 116 corresponds to the second anti-shake driving magnet 1131b in the height direction, so as to detect the magnetic field strength of the second anti-shake driving magnet 1131b at different positions, so that the position of the anti-shake carrier 112 relative to the fixed frame 111 can be accurately determined.

[0146] Turning now to Figures 6A to 8, the fixed frame 111 further has at least one damping cavity 1116, and the anti-shake carrier 112 further has at least one damping arm 1128. Looking down from the height direction, the damping arm 1128 of the anti-shake carrier 112 faces the damping cavity 1116 of the fixed frame 111. Damping adhesive 40 is disposed in the damping cavity 1116 of the fixed frame 111 and connects the fixed frame 111 and the damping arm 1128 of the anti-shake carrier 112. The damping adhesive 40 provides a damping effect to prevent the chip driver assembly 11 from losing control. By disposing the damping adhesive 40 in the damping cavity 1116 of the fixed frame 111, the damping adhesive 40 and the suspension spring 114 avoid each other, preventing the damping adhesive 40 from affecting the performance of the suspension spring 114. In some specific examples, the damping arm 1128 of the anti-shake carrier 112 extends into the damping cavity 1116 of the fixed frame 111 .

[0147] In some specific examples of the present invention, the fixed frame 111 has four damping cavities 1116, two of which are respectively located at opposite ends of the second frame 1112 of the fixed frame 111, and the other two are respectively located at opposite ends of the fourth frame 1114. Correspondingly, the anti-shake carrier 112 has four damping arms 1128, two of which are respectively located at opposite ends of the second carrier frame 1122 of the anti-shake carrier 112, and the other two are respectively located at opposite ends of the fourth carrier frame 1124. In this way, the damping at the four corners of the chip driver assembly 11 is consistent, thereby ensuring the stability of the chip driver assembly 11.

[0148] It is worth mentioning that the formation method of the damping arm 1128 of the anti-shake carrier 112 is not limited in the present invention. For example, in some embodiments, when the anti-shake carrier 112 is injection molded, the damping arm 1128 is formed by injection molding, that is, the damping arm 1128 is integrally molded when the anti-shake carrier 112 is molded. In other embodiments, when the anti-shake carrier 112 is injection molded, the damping arm 1128 is molded in the anti-shake carrier 112 by an insert injection molding process. For example, in a specific example, the damping arm 1128 is formed by the conductive insert 1126, that is, a portion of the damping arm 1128 is integrally wrapped when the anti-shake carrier 112 is molded, and a portion of the damping arm 1128 is exposed, so that the exposed portion of the damping arm 1128 can extend into the damping cavity 1116 of the fixed frame 111. In other words, the damping arm 1128 can be implemented as an integral part of the anti-shake carrier 112 by injection molding material, or can be implemented as a metal material molded on the anti-shake carrier 112 by an insert injection molding process, which is selected according to design requirements.

[0149] Now turning back to Figures 1 to 4, the driving device 10 further includes a lens driving assembly 12, and the lens driving assembly 12 includes a focus carrier 121 and a focus driving unit 122. The focus carrier 121 is movably arranged on the fixed frame 111, and the optical lens 30 is arranged on the focus carrier 121. The focus driving unit 122 is configured to be able to drive the focus carrier 121 to move relative to the fixed frame 111, so as to allow the focus carrier 121 to drive the optical lens 30 to move and achieve the focus of the camera module. In other words, in this specific example of the present invention, the chip driving assembly 11 and the lens driving assembly 12 share the fixed frame 111. In this way, the volume of the driving device 10 can be reduced, which is conducive to the miniaturization of the camera module, so that the camera module can be applied to electronic devices that pursue lightness and thinness.

[0150] Now turning to Figures 6A, 6B, 9B and 9C, the focus drive unit 122 includes a pair of focus drive magnets 1221 and a pair of focus drive coils 1222, the focus drive magnet 1221 is arranged on the focus carrier 121, the focus drive coil 1222 is arranged on the fixed frame 111, and the position of the focus drive magnet 1221 corresponds to the position of the focus drive coil 1222, so that when the focus drive coil 1222 is powered, the focus drive magnet 1221 and the focus drive coil 1222 work together to drive the focus carrier 121 to move in the height direction relative to the fixed frame 111, so as to drive the optical lens 30 to move synchronously to achieve the focus of the camera module.

[0151] In some specific examples of the present invention, the focus drive magnet 1221 and the focus drive coil 1222 both extend in the height direction, so as to increase the stroke of the focus carrier 121 in the height direction and improve the focus function of the camera module.

[0152] It is worth mentioning that the extension direction of the focus drive coil 1222 is consistent with the magnetic pole direction of the focus drive magnet 1221, that is, the electromagnetic field generated by the focus drive coil 1222 and the magnetic field of the focus drive magnet 1221 interact with each other, so as to drive the focus carrier 121 to move relative to the fixed frame 111 in the magnetic pole direction of the focus drive magnet 1221 to achieve the focus of the camera module. In some embodiments, the upper part of the focus drive magnet 1221 is the S pole and the lower part is the N pole, so that the magnetic pole direction of the focus drive magnet 1221 is the height direction. In other embodiments, the upper part of the focus drive magnet 1221 is the N pole and the lower part is the S pole, so that the magnetic pole direction of the focus drive magnet 1221 is the height direction.

[0153] Thus, it can be seen that in some specific examples of the present invention, the anti-shake drive unit 113 of the chip drive assembly 11 and the focus drive unit 122 of the lens drive assembly 12 both adopt a "coil-magnet" drive scheme, and the anti-shake drive magnet 1131 and the anti-shake drive coil 1132 of the anti-shake drive unit 113 both extend in the horizontal direction, and the focus drive magnet 1221 and the focus drive coil 1222 of the focus drive unit 122 both extend in the height direction. This not only increases the stroke of the focus carrier 121 to improve the focus function of the camera module, but also reduces the height of the drive device 10, which is conducive to further reducing the height of the camera module. In addition, the height position of the bottom surface of the focus drive unit 122 is lower than the height position of the top surface of the anti-shake drive unit 113, which is conducive to reducing the height of the camera module and increasing the stroke of the focus carrier 121, thereby improving the focus function of the camera module.

[0154] In some specific examples of the present invention, the height position of the bottom surface of the focus drive unit 1221 is lower than the height position of the top surface of the anti-shake drive magnet 1131 of the anti-shake drive unit 113, which enables the overall height position of the focus drive unit 122 to be further lowered, which is beneficial to further increase the stroke of the focus carrier 121 on the basis of reducing the height size of the camera module.

[0155] It can be understood that the larger the size of the focus drive magnet 1221 and the size of the focus drive coil 1222 arranged along the height direction, the greater the driving force that the focus drive unit 122 can provide to drive the focus carrier 121. However, the increase in the size of the focus drive magnet 1221 and the size of the focus drive coil 1222 will cause the height dimension of the camera module to increase accordingly. Therefore, by lowering the overall height position of the focus drive magnet 1221, especially by making the height position of the bottom surface of the focus drive magnet 1221 lower than the height position of the bottom surface of the anti-shake drive magnet 1131, while ensuring that the focus drive magnet 1221 and the focus drive coil 1222 have larger sizes, the height dimension of the camera module can be avoided from increasing, and the height dimension of the camera module can even be reduced.

[0156] In this specific example of the present invention, the focus drive coil 1222 of the focus drive unit 122 is arranged on the first frame 1111 of the fixed frame 111. Since the three anti-shake drive magnets 1131 of the anti-shake drive unit 113 are respectively arranged on the second frame 1112, the third frame 1113 and the fourth frame 1113 of the fixed frame 111, the focus drive unit 122 and the anti-shake drive unit 113 are arranged on opposite sides. In this way, the drive device 10 has a reasonable structural layout to ensure the anti-shake and focusing functions of the camera module while achieving the miniaturization of the camera module. At the same time, the anti-shake drive magnet 1131 and the focus drive magnet 1221 are at a greater distance to reduce or even avoid the problem of magnetic interference between the anti-shake drive magnet 1131 and the focus drive magnet 1221.

[0157] Continuing to refer to Figures 6A, 6B, 9B and 9C, the focusing carrier 121 further includes a focusing frame 1211 and a carrier extension arm 1212 integrally extending downward from one side of the focusing frame 1211, and the focusing drive magnet 1221 is arranged on the carrier extension arm 1212. The first frame 1111 of the fixed frame 111 has an arm space 11112, and the length and width of the arm space 11112 of the first frame 1111 are slightly larger than the length and width of the carrier extension arm 1212 of the focusing carrier 121, so as to allow the carrier extension arm 1212 to move within the arm space 11112 of the first frame 1111. In this way, the first frame 1111 reserves space for the up and down movement of the carrier extension arm 1212 to avoid the problem of the carrier extension arm 1212 being stuck by the first frame 1111 due to slight tilt of the focusing carrier 121 caused by assembly error or unilateral driving of the focusing drive unit 122.

[0158] The focusing frame 1211 of the focusing carrier 121 is movably arranged above the fixed frame 111, and the carrier extension arm 1212 is movably arranged in the arm space 11112 of the first frame 1111, so that the carrier extension arm 1212 can extend from the upper part of the fixed frame 111 to the lower part. For example, the height position of the bottom surface of the carrier extension arm 1212 can be lower than the height position of the bottom surface of the fixed frame 111. Since the focus drive magnet 1221 of the focus drive unit 122 is arranged on the carrier extension arm 1212 of the focus carrier 121, and the three anti-shake drive magnets 1131 of the anti-shake drive unit 113 are respectively arranged on the second frame 1112, the third frame 1113 and the fourth frame 1114 of the fixed frame 111, the height position of the bottom surface of the focus drive magnet 1221 can be lower than the height position of the bottom surface of the anti-shake drive magnet 1131 by allowing the height position of the bottom surface of the carrier extension arm 1212 to be lower than the height position of the bottom surface of the fixed frame 111.

[0159] It is worth mentioning that the manner in which the focus drive magnet 1221 is disposed on the carrier extension arm 1212 of the focus carrier 121 is not limited in the present invention. For example, in this specific example of the present invention, referring to FIG9C , the carrier extension arm 1212 of the focus carrier 121 has a second embedding groove 12121, and the focus drive magnet 1221 is embedded in the second embedding groove 12121 of the carrier extension arm 1212. In this way, on the one hand, the focus drive magnet 1221 can be reliably disposed on the carrier extension arm 1212, and on the other hand, the surface of the focus drive magnet 1221 facing the focus drive coil 1222 can be flush with or slightly lower than the surface of the carrier extension arm 1212, so as to facilitate reducing the length and width of the drive device 10 and miniaturizing the camera module.

[0160] It is worth mentioning that the manner in which the focus drive coil 1222 is arranged on the first frame 1111 of the fixed frame 111 is not limited in the present invention. For example, in this specific example of the present invention, referring to Figures 6A and 9C, the first frame 1111 of the fixed frame 111 has a coil assembly hole 11113, which extends from the arm body space 11112 to the outside, that is, the coil assembly hole 11113 of the first frame 1111 connects the arm body space 11112 and the outside, wherein the focus drive coil 1222 is accommodated in the coil assembly hole 11113 of the first frame 1111. In this way, on the one hand, the arrangement of the focus drive coil 1222 does not need to occupy additional length and width space of the drive device 10, which is conducive to reducing the length and width dimensions of the drive device 10 and miniaturizing the camera module. On the other hand, the distance between the focus drive magnet 1221 and the focus drive coil 1222 can be reduced, which is conducive to improving the driving force of the focus drive unit 122.

[0161] Continuing with reference to Figures 6A, 6B, and 9C, the lens drive assembly 12 further includes a focus circuit board 123. The focus drive coil 1222 is mounted on the focus circuit board 123 so that the focus circuit board 123 can supply power to the focus drive coil 1222. The focus circuit board 123 is mounted on the outer wall of the first frame 1111 of the fixed frame 111 so that the focus circuit board 123 holds the focus drive coil 1222 in the coil assembly hole 11113 of the first frame 1111 of the fixed frame 111.

[0162] In some specific examples of the present invention, the first frame 1111 of the fixed frame 111 further has a plate groove 11114, which is connected to the coil assembly hole 11113, wherein the focusing circuit board 123 is retained in the plate groove 11114 of the first frame 1111 to reduce the height of the focusing circuit board 123 protruding from the outside of the first frame 1111, or to avoid the focusing circuit board 123 protruding from the outside of the first frame 1111.

[0163] Continuing to refer to Figures 6A, 6B, and 9C, the lens drive assembly 12 further includes a focus magnetic plate 124, which is mounted on a side of the focus circuit board 123 away from the focus drive coil 1222, and the position of the focus magnetic plate 124 corresponds to the position of the focus drive magnet 1221. In this way, on the one hand, the focus magnetic plate 124 can reinforce the focus circuit board 123 to improve the flatness of the focus circuit board 123. On the other hand, the focus magnetic plate 124 and the focus drive magnet 1221 interact to generate a magnetic force to movably set the focus carrier 121 on the fixed frame 111. In some embodiments, the focus magnetic plate 124 can be a non-magnetic metal part, or the focus magnetic plate 124 is a permanent magnet.

[0164] Continuing with reference to FIG9C , the lens drive assembly 12 further includes a focus magnetic conductive element 125. The focus magnetic conductive element 125 is disposed on a side of the focus drive magnet 1221 away from the focus drive coil 1222 to concentrate the magnetic lines of force of the focus drive magnet 1221 toward the focus drive coil 1222. In this manner, on the one hand, the magnetic field strength of the lens drive assembly 12 can be increased, and on the other hand, the magnetic force of the focus drive magnet 1221 can be prevented from overflowing and interfering with the magnetic field of the focus drive magnet 1221 and the magnetic field of the anti-shake drive magnet 1131. In some embodiments of the present invention, the focus magnetic conductive element 125 is disposed in the second mounting groove 12121 of the carrier extension arm 1212 of the focus carrier 121, and the focus magnetic conductive element 125 is located between the focus drive magnet 1221 and the carrier extension arm 1212.

[0165] It is worth mentioning that the manner in which the focusing magnetic conductive element 125 is disposed on the carrier extension arm 1212 of the focusing carrier 121 is not limited in the present invention. For example, in some embodiments, after the focusing carrier 121 is injection molded, the focusing magnetic conductive element 125 and the focus driving magnet 1221 are sequentially embedded in the second embedding groove 12121 of the carrier extension arm 1212 of the focusing carrier 121, so that the focusing magnetic conductive element 125 is disposed in the second embedding groove 12121 of the carrier extension arm 1212 of the focusing carrier 121, and the focusing magnetic conductive element 125 is located between the focus driving magnet 1221 and the carrier extension arm 1212. In other embodiments, the focusing magnetic conductive element 125 is integrally provided inside the focusing carrier 121 through an insert injection molding process, so that after the focusing drive magnet 1221 is embedded in the second embedding groove 12121 of the carrier extension arm 1212, the focusing magnetic conductive element 125 is located between the focusing drive magnet 1221 and the carrier extension arm 1212.

[0166] Continuing with reference to FIG6B and FIG9C , the lens drive assembly 12 further includes a focus drive component 126, which may be, but is not limited to, a driver IC. The focus drive component 126 is mounted on the focus circuit board 123 and surrounded by the racetrack-shaped focus drive coil 1222. This prevents the focus drive component 126 from occupying additional space, thereby facilitating a reduction in the length and width of the drive device 10. In other words, the focus drive coil 1222 has a hollow portion, and the focus drive component 126 extends from the focus circuit board 123 to and is retained within the hollow portion of the focus drive coil 1222.

[0167] Continuing with reference to FIG6B , the lens drive assembly 12 further includes a focus position sensing element 127, which may be but is not limited to a Hall element or a TMR element. The focus position sensing element 127 is mounted on the focus circuit board 123 and is retained in the hollow portion of the focus drive coil 1222 , and the position of the focus position sensing element 127 corresponds to the position of the focus drive magnet 1221 , so as to detect the magnetic field strength of the focus drive magnet 1221 at different positions, so as to determine the position of the focus carrier 121 relative to the fixed frame 111 .

[0168] Continuing to refer to Figures 6A, 9A, 9B and 9C, the top of the fixed frame 111 has a frame groove 1117, and the focus frame 1211 of the focus carrier 121 is movably suspended in the frame groove 1117 of the fixed frame 111. In this way, on the one hand, from a side perspective, the focus carrier 121 can be hidden inside the fixed frame 111, and on the other hand, the height of the camera module can be further reduced so that the camera module can be applied to electronic devices that pursue lightweight and thinness.

[0169] 6A, 6B and 9B, the lens drive assembly 12 further includes at least two focus balls 128, which are rollably arranged between the carrier extension arm 1212 of the focus carrier 121 and the first frame 1111 of the fixed frame 111. When the focus drive unit 122 provides driving force, the plurality of focus balls 128 allow the focus carrier 121 to be driven smoothly and steadily in the height direction by rolling.

[0170] Furthermore, the first frame 1111 of the fixed frame 111 has at least two first focus ball grooves 11115, and the carrier extension arm 1212 of the focus carrier 121 has at least two second focus ball grooves 12122. These first focus ball grooves 11115 of the first frame 1111 and these second focus ball grooves 12122 of the carrier extension arm 1212 correspond one to one, and the depth dimension of the first focus ball groove 11115 of the first frame 1111 and these second focus ball grooves 12122 of the carrier extension arm 1212 are the same as the depth dimension of the first focus ball groove 11115 of the first frame 1111. The sum of the depth dimensions is smaller than the diameter dimension of the focusing ball 128. In this way, the focusing ball 128 can be reliably and rollably arranged between the first frame 1111 and the carrier extension arm 1212. On the other hand, the focusing ball 128 creates a gap between the first frame 1111 and the carrier extension arm 1212 to avoid friction between the first frame 1111 and the carrier extension arm 1212 when the focusing carrier 121 is driven to move in the height direction, thereby allowing the focusing carrier 121 to be driven smoothly and steadily in the height direction.

[0171] In some embodiments of the present invention, the first frame 1111 of the fixed frame 111 has two first focusing ball grooves 11115, which are symmetrically arranged on opposite sides of the coil assembly hole 11113 and arranged along the height direction. The carrier extension arm 1212 of the focusing carrier 121 has four second focusing ball grooves 12122, and two second focusing ball grooves 12122 arranged along the height direction are respectively provided on opposite sides of the second embedding groove 12121 of the carrier extension arm 1212. In this way, the two second focusing ball grooves 12122 located on the same side of the carrier extension arm 1212 respectively correspond to different height positions of one of the first focusing ball grooves 11115 of the first frame 1111. The lens drive assembly 12 includes four focus balls 128. The two first focus ball grooves 11115 of the first frame 1111 and the four second focus ball grooves 12122 of the carrier extension arm 1212 are arranged so that two focus balls 128 arranged along the height direction are respectively provided at the opposite ends of the focus drive magnet 1221. In this way, when the electromagnetic field generated by the focus drive coil 1222 and the magnetic field of the focus drive magnet 1221 interact to drive the focus carrier 121 to move in the height direction, the four focus balls 128 cooperate with each other to improve the stability of the focus carrier 121 during movement.

[0172] During the focusing process, the relative positions of the four focusing balls 128 and the carrier extension arm 1212 of the focusing carrier 121 can remain unchanged. They only roll in the second focusing ball groove 12122 of the carrier extension arm 1212, so that the focusing balls 128 and the carrier extension arm 1212 form point friction contact, reducing the friction between the focusing balls 128 and the carrier extension arm 1212. At the same time, the four focusing balls 128 respectively move relative to the fixed frame 111 along the tracks formed by the two first focusing ball grooves 11115 of the first frame 1111 of the fixed frame 111, thereby preventing the focusing balls 128 from falling off between the first frame 1111 and the carrier extension arm 1212 during the focusing process, thereby ensuring the stability and reliability of the camera module.

[0173] It is worth mentioning that in other examples of the present invention, the focus ball 128 can be replaced by a slider, which moves relative to the fixed frame 111 in synchronization with the movement of the focus carrier 121 .

[0174] Continuing to refer to Figures 5 to 7 and Figures 9A to 9C, the driving device 10 further includes a cover 13, which is arranged on the outside of the chip driving component 11 and the lens driving component 12 to form the appearance of the driving device 10 and protect the fixed frame 111, the anti-shake carrier 112, the suspension spring 114 and the supporting plate 115 of the chip driving component 11 and the focusing carrier 121, the focusing circuit board 123 and the focusing magnetic plate 124 of the lens driving component 12.

[0175] Now turning back to Figures 1 to 4, and in combination with Figures 6A, 6B, and 9A to 9C, the anti-shake carrier 112 has a first through-hole 11201, the anti-shake circuit board 1133 has a second through-hole 113301, the fixed frame 111 has a third through-hole 11101, the focusing carrier 121 has a fourth through-hole 12101, and the cover 13 has a fifth through-hole 1301, wherein the first through-hole 11201 of the anti-shake carrier 112, the second through-hole 113301 of the anti-shake circuit board 1133, the third through-hole 11101 of the fixed frame 111, the fourth through-hole 12101 of the focusing carrier 121, and the fifth through-hole 1301 of the cover 13 correspond to each other. The photosensitive component 20 is mounted on the anti-shake carrier 112, the bottom of the optical lens 30 is set on the fourth perforation 12101 of the focusing carrier 121, and the top extends to the outside through the fifth perforation 1301 of the cover body 13, and the optical lens 30 is maintained in the photosensitive path of the photosensitive component 20. The first perforation 11201 of the anti-shake carrier 112, the second perforation 113301 of the anti-shake circuit board 1133 and the third perforation 11101 of the fixed frame 111 form a light incident path 50 to allow light incident from the optical lens 30 to reach the photosensitive component 20 through the light incident path 50 to form an image.

[0176] Turning to FIG. 4 , the photosensitive component 20 further includes a chip circuit board 21, a photosensitive chip 22, a base 23, and a filter element 24. The photosensitive chip 22 is mounted in the middle of the chip circuit board 21. The base 23 is disposed at the edge of the chip circuit board 21 and surrounds the photosensitive chip 22. The filter element 24 is retained in the light sensing path of the photosensitive chip 22. The top surface of the base 23 of the photosensitive component 20 is mounted on the bottom surface of the anti-shake carrier 112 of the chip driver component 11 to mount the photosensitive component 20 on the anti-shake carrier 112.

[0177] In this specific example of the camera module of the present invention shown in Figures 1 to 4, the base 23 is integrally combined with the edge of the chip circuit board 21. For example, the base 23 can be integrally combined with the edge of the chip circuit board 21 through a molding process. In other examples of the camera module of the present invention, the base 23 can be a prefabricated part, which is attached to the edge of the chip circuit board 21 and surrounds the photosensitive chip 22.

[0178] Continuing to refer to Figures 2 and 4, the photosensitive assembly 20 further includes at least one electronic component 25, which can be, but is not limited to, a resistor, a capacitor, or a driver, wherein the electronic component 25 is mounted on the chip circuit board 21 and embedded in the base 23. In other words, when the base 23 is integrally combined with the chip circuit board 21 through a molding process, the base 23 encloses the electronic component 25 inside, which not only helps to reduce the length, width, and height dimensions of the camera module, but also protects the electronic component 25.

[0179] Continuing to refer to Figures 2 and 4, the photosensitive component 20 further includes a filter element bracket 26, the filter element 24 is mounted on the filter element bracket 26, and the filter element bracket 26 is mounted on the top surface of the base 23, so that the base 23 and the bracket 26 cooperate with each other to maintain the filter element 24 in the photosensitive path of the photosensitive chip 22, so that the filter element 24 can have a smaller size, which not only reduces the cost of the camera module, but also reduces the risk of the filter element 24 being broken.

[0180] Turning to Figures 3 and 4 , the deflection circuit plate 117 extends horizontally at the bottom of the photosensitive assembly 20 and is connected to the photosensitive assembly 20. When the anti-shake carrier 112 of the chip driver assembly 11 drives the photosensitive assembly 20 to move horizontally, at least a portion of the deflection circuit plate 117 deforms. In other words, the deflection circuit plate 117 of the chip driver assembly 11 provides a horizontal mounting surface for the photosensitive assembly 20, allowing the photosensitive assembly 20 to be driven horizontally by the anti-shake carrier 112 to achieve anti-shake for the camera module.

[0181] Specifically, the flexure circuit plate 117 includes a movable portion 1171, a fixed portion 1172, and at least one deformable portion 1173. The fixed portion 1172 has a plate through-hole 11721. The movable portion 1171 and the deformable portion 1173 are both located in the plate through-hole 11721 of the fixed portion 1172. Opposite ends of the deformable portion 1173 extend to and are connected to the movable portion 1171 and the fixed portion 1172, respectively, allowing the deformable portion 1173 to suspend the movable portion 1171 from the plate through-hole 11721 of the fixed portion 1172. In other words, the movable portion 1171 is disposed inside the fixed portion 1172 and is connected to the fixed portion 1172 via the deformable portion 1173. In a specific example of the present invention, the deformation portion 1173 is bent multiple times between the movable portion 1171 and the fixed portion 1172 to allow the deformation portion 1173 to deform as the movable portion 1171 translates. When the photosensitive component 20 drives the movable portion 1171 to translate, the reaction force generated by the deformation portion 1173 is small to avoid affecting the anti-shake effect of the camera module.

[0182] In some examples of the present invention, the movable part 1171 of the flexible circuit plate 117 is a square plate, and the shape and size of the movable part 1171 match the shape and size of the photosensitive component 20, and the fixed part 1172 is a square frame, which is located outside the movable top 1171, wherein one end of the deformable part 1173 is connected to one side of the movable part 1171 and the other end of the deformable part 1173 is connected to the non-corresponding side of the fixed part 1172, so as to reduce the reaction force generated by the deformable part 1173 when the photosensitive component 20 drives the movable part 1171 to translate. That is, each side of the movable part 1171 faces the corresponding side of the fixed part 1172, and the deformation part 1173 is provided with at least three bending positions 1174, one of the bending positions 1174 is close to the end of the deformation part 1173 connected to the movable part 1171, another of the bending positions 1174 is close to the end of the deformation part 1173 connected to the fixed part 1172, and another of the bending positions 1174 spans the corner of the movable part 1171, so that one end of the deformation part 1171 is connected to one side of the movable part 1171 and the other end of the deformation part 1173 is connected to the non-corresponding side of the fixed part 1172.

[0183] The side of the photosensitive circuit board 21 of the photosensitive component 20 away from the photosensitive chip 22 is mounted on the movable portion 1171 of the flexible circuit board 117, so that the movable portion 1171 is fixed to the photosensitive circuit board 21 of the photosensitive component 20. The fixed portion 1172 of the flexible circuit board 117 is directly or indirectly fixed to the fixed frame 111. When the anti-shake carrier 112 is driven to move the photosensitive component 20 in the horizontal direction, the deformable portion 1173 of the flexible circuit board 117 is deformed to allow the photosensitive component 20 to drive the movable portion 1171 to move horizontally. During this process, the deformable portion 1173 always conducts electricity between the movable portion 1171 and the fixed portion 1172.

[0184] In some examples of the camera module of the present invention, referring to FIG2 and in combination with FIG5 , FIG6A , and FIG6B , the focus circuit board 1133 of the focus drive unit 113 of the chip driver assembly 11 is connected to the fixed portion 1172 of the flex circuit board 117, allowing the flex circuit board 117 to supply power to the focus drive coil 1132 via the focus circuit board 1133. The carrier solder pin 11262 of the conductive insert 1126 of the anti-shake carrier 112 of the chip driver assembly 11 is connected to the fixed portion 1172 of the flex circuit board 117, allowing the flex circuit board 117 to supply power to the anti-shake drive coil 1132 via the conductive insert 1126 of the anti-shake carrier 112 and the anti-shake circuit board 1133 of the anti-shake drive unit 113.

[0185] In order to facilitate the welding of the carrier pin 11262 of the conductive insert 1126 and the fixed portion 1172 of the flexible circuit board 117, the cover 13 of the driving device 10 is provided with at least one notch 131, and the notch 131 corresponds to the position of the carrier pin 11262 of the conductive insert 1126 to expose the carrier pin 11262 of the conductive insert 1126, so that solder can be applied to the connection position of the carrier pin 11262 of the conductive insert 1126 and the fixed portion 1172 of the flexible circuit board 117 through the notch 131 of the cover 13, thereby realizing the welding of the carrier pin 11262 of the conductive insert 1126 and the fixed portion 1172 of the flexible circuit board 117.

[0186] That is to say, the anti-shake circuit board 113 of the anti-shake drive unit 113 can be connected to the flexible circuit board 117 through the anti-shake carrier 112, and the chip circuit board 21 of the photosensitive component 20 can also be connected to the flexible circuit board 117. In this way, the camera module can be conductively connected to the external electronic device only through the flexible circuit board 117, so that the flexible circuit board 117 not only serves as a support platform to provide a flat installation surface for the photosensitive component 20, but can also be used to conduct the various structures.

[0187] Referring to Figures 2 and 3, the camera module further includes at least one cover plate 70, wherein the cover plate 70 is mounted on the cover shell 13 to cover the welding position of the carrier pin 11262 of the conductive insert 1126 and the fixing portion 62 of the flexible circuit board 60, thereby protecting the welding position of the carrier pin 11262 of the conductive insert 1126 and the fixing portion 62 of the flexible circuit board 60.

[0188] Now turning to Figures 2 to 4, the camera module further includes a bottom cover 80, the edge of the bottom cover 80 is attached to the fixed portion 62 of the flexible circuit board 60 so that the fixed portion 62 is fixed to the bottom cover 80, and there is a gap between the movable portion 61 of the circuit board 60 and the bottom cover 80 to prevent the movable portion 61 from touching the bottom cover 80 when the movable portion 61 is driven to move horizontally, that is, the flexible circuit board 60 mechanically connects the photosensitive component 20 to the bottom cover 80, wherein the bottom cover 80 is directly or indirectly fixed to the fixed frame 111.

[0189] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. Drive device, It is characterized in that The chip driving component includes: Fixed frame; An anti-shake carrier, wherein the anti-shake carrier is movably arranged on the fixed frame; an anti-shake driving unit, wherein the anti-shake driving unit is configured to drive the anti-shake carrier to move relative to the fixed frame, wherein the anti-shake driving unit comprises a plurality of pairs of anti-shake driving magnets and anti-shake driving coils arranged relatively in a height direction, wherein the anti-shake driving magnets are respectively a first anti-shake driving magnet, a second anti-shake driving magnet and a third anti-shake driving magnet, and the first anti-shake driving magnet and the third anti-shake driving magnet are respectively arranged on two adjacent sides of the second anti-shake driving magnet; and A suspension component, wherein the suspension component includes at least one suspension spring, the suspension spring includes a spring connecting portion and a spring deformation portion, the spring deformation portion extends in a height direction, the spring connecting portion is bent from the bottom of the spring deformation portion and extends in a horizontal direction, the spring connecting portion is connected to the fixed frame and the anti-shake carrier, wherein the plane where the spring deformation portion of at least one of the suspension springs is located is perpendicular to the magnetic pole direction of the second anti-shake driving magnet. 2 . The driving device according to claim 1 , wherein the K value of the spring sheet deformation portion of the suspension spring sheet in the extension direction is greater than the K value in the thickness direction.

3. The driving device according to claim 2, wherein the extension direction of the spring deformation part of the suspension spring is the same as the length direction of the second anti-shake driving magnet, and the thickness direction of the spring deformation part of the suspension spring is the same as the length direction of the first anti-shake driving magnet and the length direction of the third anti-shake driving magnet.

4. The driving device according to claim 3, wherein the chip driving component includes four suspension springs, two of the four suspension springs are arranged on one side of the fixed frame, and the other two suspension springs are arranged on the other side of the fixed frame opposite to the side.

5. The driving device according to claim 4, wherein the planes where the spring deformation parts of the two suspension springs located on the same side of the fixed frame are located coincide with each other, and the planes where the spring deformation parts of the two suspension springs located on the opposite sides of the fixed frame are located are parallel. 6 . The driving device according to claim 4 , wherein the planes where the spring deformation parts of the four suspension springs are located are all perpendicular to the magnetic pole direction of the second anti-shake driving magnet.

7. The driving device according to claim 1, wherein the chip driving component further includes at least one anti-shake position sensing element, the anti-shake position sensing element is arranged on the anti-shake carrier, and the anti-shake position sensing element corresponds to the anti-shake driving magnet in the height direction, and the anti-shake driving coil is located between the anti-shake driving magnet and the anti-shake position sensing element. 8 . The driving device according to claim 7 , wherein a conductive insert is embedded in the anti-shake carrier, and the anti-shake position sensing element is connected to the conductive insert.

9. The driving device according to claim 1 further comprises a lens driving assembly, wherein the lens driving assembly further comprises a focus carrier and a focus driving unit, the focus carrier is movably arranged on the fixed frame, the focus driving unit is configured to be able to drive the focus carrier to move relative to the fixed frame, and the focus driving unit and the anti-shake driving unit are arranged on opposite sides.

10. The driving device according to claim 9, wherein the anti-shake driving magnet is arranged on the fixed frame, and the anti-shake driving coil is arranged on the anti-shake carrier, wherein the focus driving unit includes a focus driving magnet and the focus driving coil which are opposite to each other in a horizontal direction, the focus driving magnet is arranged on the focus carrier, and the focus driving coil is arranged on the fixed frame, wherein the height position of the bottom surface of the focus driving magnet is lower than the height position of the bottom surface of the anti-shake driving magnet.

11. A driving device according to any one of claims 1 to 10, wherein the fixed frame has a damping cavity, the anti-shake carrier has a damping arm, and from a top view, the damping arm of the anti-shake carrier is opposite to the damping cavity of the fixed frame, wherein damping glue is arranged in the damping cavity of the fixed frame, and the damping glue connects the fixed frame and the damping arm of the anti-shake carrier.

12. The driving device according to claim 11, wherein the damping arm is arranged on the top surface of the anti-shake carrier, The second elastic sheet connecting portion is connected to the bottom surface of the anti-shake carrier, and the damping arm and the second elastic sheet connecting portion are staggered. 13 . The driving device according to claim 12 , wherein the damping arm is integrally formed on the anti-shake carrier, and extends from the top surface of the anti-shake carrier along the height direction to extend into the damping cavity of the fixed frame.

14. The driving device according to claim 12, wherein the damping arm is formed in the anti-shake carrier by an insert injection molding process, at least a portion of the damping arm is embedded in the anti-shake carrier, and at least a portion of the damping arm is exposed and extends in the height direction to extend into the damping cavity of the fixed frame.

15. The driving device according to claim 1, wherein the chip driving component further comprises a supporting plate, the supporting plate is arranged on the frame connecting arm of the fixed frame, and at least a portion of the supporting plate overlaps with at least a portion of the suspension spring in the height direction.

16. Camera module, It is characterized in that include: Photosensitive components; and An optical lens, wherein the optical lens is arranged in the light-sensing path of the light-sensing component; as well as According to any one of claims 1 to 15, the photosensitive component is arranged on the anti-shake carrier of the chip driving component of the driving device, and the optical lens is arranged on the focus carrier of the lens driving component of the driving device.

17. Driving device, Features The chip anti-shake component includes: A photosensitive component, wherein the photosensitive component is used to receive light; An anti-shake carrier, the photosensitive component is arranged on the anti-shake carrier; A fixed frame, wherein the anti-shake carrier is movably arranged on the fixed frame; an anti-shake driving unit, wherein the anti-shake driving unit is configured to drive the anti-shake carrier to move relative to the fixed frame; A suspension assembly, the suspension assembly extending along the height direction at the sides of the anti-shake carrier and the fixed frame, the suspension assembly connecting the anti-shake carrier and the fixed frame to movably mount the anti-shake carrier to the fixed frame; A flexure circuit plate extends horizontally at the bottom of the photosensitive component, the flexure circuit plate is connected to the photosensitive component, and when the photosensitive component moves, at least a portion of the flexure circuit plate is deformed.

18. The driving device according to claim 17, further comprising a bottom cover, the bottom cover being directly or indirectly fixed to the fixing frame, the flexure circuit plate mechanically connecting the photosensitive component to the bottom cover.

19. The driving device according to claim 18, wherein the flexure circuit plate comprises a movable portion fixed to the photosensitive component, a fixed portion fixed to the bottom cover, and a deformable portion, wherein the movable portion is arranged on the inner side of the fixed portion, and the movable portion is connected to the fixed portion through the deformable portion. 20 . The driving device according to claim 19 , wherein the deformable portion is bent multiple times between the movable portion and the fixed portion, and the deformable portion is deformed when the movable portion moves.

21. The driving device according to claim 17, wherein the anti-shake driving unit comprises an anti-shake driving magnet arranged on the fixed frame and an anti-shake driving coil arranged on the anti-shake carrier, the anti-shake driving magnet and the anti-shake driving coil are arranged relative to each other in the height direction, wherein the anti-shake driving magnet comprises a first anti-shake driving magnet, a second anti-shake driving magnet and a third anti-shake driving magnet, and the first anti-shake driving magnet, the second anti-shake driving magnet and the third anti-shake driving magnet are arranged on three adjacent sides; the anti-shake driving coil comprises a first anti-shake driving coil, a second anti-shake driving coil and a third anti-shake driving coil, and the first anti-shake driving coil, the second anti-shake driving coil and the third anti-shake driving coil are arranged on three adjacent sides.

22. The driving device according to claim 21 further comprises a lens driving assembly, wherein the lens driving assembly comprises a focus carrier and a focus driving unit, the focus carrier is movably arranged on the fixed frame, the focus driving unit is configured to be able to drive the focus carrier to move relative to the fixed frame, and the focus driving unit and the anti-shake driving unit are arranged on opposite sides.

23. The driving device according to claim 22, wherein the focus driving unit comprises a focus driving magnet and a focus driving coil which are opposite to each other in a horizontal direction, the focus driving magnet is arranged on the focus carrier, and the focus driving coil is arranged on the fixed frame, wherein the height position of the bottom surface of the focus driving magnet is lower than the height position of the bottom surface of the anti-shake driving magnet.

24. The driving device according to claim 17, wherein the suspension assembly comprises at least one suspension spring, wherein the suspension spring comprises a first spring connection portion, a second spring connection portion and a spring deformation portion, the spring deformation portion extends in a height direction, the first spring connection portion and the second spring connection portion are respectively bent from the bottom of the spring deformation portion and extend in a horizontal direction, the first spring connection portion is connected to the fixed frame, the second spring connection portion is connected to the anti-shake carrier, and the spring deformation portion is deformably retained on the side of the fixed frame.

25. The driving device according to claim 24, wherein the spring sheet deformation portion of the suspended spring sheet comprises m first extension segments extending in the height direction and n second extension segments extending in the horizontal direction, the opposite ends of each second extension segment are respectively integrally connected to the ends of two adjacent first extension segments, and the parameter m and the parameter n satisfy the relationship: m>n≥1, so that the two outermost extension segments of the spring sheet deformation portion are both the first extension segments, the bottom of one of the two outermost first extension segments of the spring sheet deformation portion is integrally connected to the first spring sheet connecting portion, and the bottom of the other first extension segment is integrally connected to the second spring sheet connecting portion.

26. The driving device according to claim 25, wherein the suspension assembly comprises four suspension springs, two of which are arranged on one side of the fixed frame, and the other two are arranged on the other side of the fixed frame opposite to the side.

27. The driving device according to claim 26, wherein the planes where the spring deformation parts of the two suspension springs located on the same side of the fixed frame are located coincide with each other, and the planes where the spring deformation parts of the two suspension springs located on the opposite sides of the fixed frame are located are parallel.

28. The driving device according to claim 26, wherein a plane where the spring sheet deformation portion of one of the suspension spring sheets is located is perpendicular to a plane where the spring sheet deformation portion of at least one adjacent suspension spring sheet is located.

29. A driving device according to any one of claims 17 to 28, wherein the photosensitive component comprises a photosensitive chip, a chip circuit board and a base, the photosensitive chip is arranged and electrically connected to the chip circuit board, and the base is integrally formed with the chip circuit board and surrounds the outer peripheral side of the photosensitive chip.

30. The driving device according to claim 29, wherein the top surface of the base is connected to the bottom surface of the anti-shake carrier, and the bottom surface of the chip circuit board is connected to the top surface of the movable part of the flexure circuit board, so that when the anti-shake carrier moves, the photosensitive component and the movable part of the flexure circuit board are driven to move.

31. The driving device according to claim 30, wherein the photosensitive component further comprises a filter element and a filter element holder, the filter element holder is installed above the base, the filter element is placed on the filter element holder, wherein the top surface of the filter element is lower than the bottom surface of the anti-shake driving coil.

32. Camera module, It is characterized in that include: An optical lens, wherein the optical lens is arranged on the light-sensing path of the light-sensing chip; as well as The driving device according to any one of claims 17 to 31, wherein the optical lens is arranged on the focus carrier of the chip anti-shake device.

33. The camera module according to claim 32, wherein the top surface of the anti-shake driving magnet is higher than the bottom surface of the optical lens.

34. A camera module according to claim 32, wherein the bottom surface of the anti-shake drive coil is higher than the bottom surface of the optical lens.

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