Composite floor sound insulation board and preparation method thereof

Abstract

The invention relates to the technical field of building materials, and discloses a composite floor sound insulation board and a preparation method thereof, and the preparation method comprises the four core steps of base material pretreatment, honeycomb structure forming, PP non-woven fabric compounding, post-treatment and cutting. The composite floor sound insulation board prepared by the method comprises an HDPE substrate, a honeycomb structure layer, an epoxy resin adhesive layer and a PP non-woven fabric layer which are sequentially compounded. Tests show that the weighted sound insulation index is larger than or equal to 55 dB in the frequency band of 100 Hz to 5000 Hz, the heat conductivity coefficient is stabilized to be 0.028 W / mK to 0.035 W / mK, the interlayer bonding strength is larger than or equal to 1.5 MPa, the sound insulation and heat insulation performance and the structural durability are excellent, the compatibility of the preparation technology is high, and the sound insulation and heat insulation composite board is suitable for being used in the building. The technical problems that an existing floor sound insulation board is poor in preparation process stability, insufficient in product sound insulation performance, large in heat conductivity coefficient fluctuation and prone to failure of interlayer bonding can be solved, and the floor sound insulation board is suitable for large-scale production and can be widely applied to floor sound insulation projects of residences, office buildings and other buildings.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of building materials, in particular to a composite floor sound insulation board and a preparation method thereof, which is suitable for various building floor ground construction scenes with high requirements for sound and thermal environments. BACKGROUND

[0002] With the improvement of the requirements for living and office comfort in the construction industry, the floor sound insulation board as a key material for blocking the noise inside and outside the building and maintaining the stability of the indoor temperature, its performance and the reliability of the preparation process are increasingly concerned. However, the related products and processes in the prior art still have the following core defects:

[0003] Poor preparation process stability: the preparation of the existing composite sound insulation board mostly depends on non-standardized equipment and parameter control, for example, the simple calendering equipment is mostly used for the molding of the HDPE substrate, and there is no unified device standard for the hot pressing of the honeycomb structure, which leads to poor structural consistency of different batches of products, and further affects the stability of the sound insulation and heat insulation performance;

[0004] Insufficient sound insulation performance of the product: the traditional product mostly uses a single functional layer (such as pure PDLC film, ordinary plastic plate), lacks the synergistic design of "structure noise reduction + material sound absorption", and the weighted sound reduction index of the core frequency band (100Hz~5000Hz) of the building / traffic noise is generally lower than 45dB, which is difficult to meet the high-level requirements of the "Design Specification for Sound Insulation of Civil Buildings" (GB50118);

[0005] Large fluctuation of thermal conductivity: due to the poor combination between layers in the preparation process (such as uneven adhesive coating, out-of-control hot pressing temperature), the thermal conductivity of the product fluctuates more than 0.04W / (m·K) within the actual use temperature range (20-30℃), and the heat insulation effect is unstable;

[0006] Interlayer adhesion failure: the HDPE substrate surface has strong inertness, and the existing process mostly omits the surface treatment step or only uses simple polishing, and the adhesion strength between the honeycomb structure and the PP non-woven fabric layer is lower than 1.2MPa, which is prone to delamination and falling off during long-term use.

[0007] Therefore, it is a key requirement to develop a composite floor sound insulation board with standardized process, excellent and stable product performance and a preparation method thereof to solve the pain points of the prior art. SUMMARY

[0008] The present application aims to overcome the defects of poor stability, insufficient sound insulation, large thermal conductivity fluctuation and weak interlayer adhesion of the existing composite floor sound insulation board preparation process, and provide a composite floor sound insulation board and a preparation method thereof, wherein the process steps are standardized, the product weighted sound reduction is greater than or equal to 55 dB, the thermal conductivity is stably between 0.028-0.035 W / (m·K), and the interlayer adhesion strength is greater than or equal to 1.5 MPa.

[0009] The technical scheme adopted by the present application is:

[0010] A preparation method of a composite floor sound insulation board, the specific steps are as follows:

[0011] Step S1: substrate pretreatment

[0012] The core purpose is to prepare an HDPE substrate with high bonding potential: put the HDPE particles into a conventional forming equipment (such as an extruder, a calender, etc.), and prepare the HDPE substrate by a melt forming process; in order to solve the problem of inertness of the surface of the HDPE, one surface of the substrate is subjected to surface treatment (such as plasma treatment, chemical etching treatment, etc.), by changing the surface microtopography and chemical properties, the bonding force with the honeycomb structure layer is significantly improved.

[0013] Step S2: honeycomb structure forming

[0014] The core purpose is to build an "air layer noise reduction structure": the HDPE substrate subjected to surface treatment in step S1 is placed in a mold (hexagonal cavity, suitable for honeycomb structure design) of a predetermined shape, and an integrated hexagonal honeycomb groove is formed on the surface treatment surface of the HDPE substrate by applying a set temperature and pressure through a hot pressing device (such as a flat plate hot press, a continuous hot press, etc.); the honeycomb structure can form a closed air layer, which utilizes the characteristics of low thermal conductivity and high sound insulation of air to lay a structural foundation for the sound insulation and heat insulation performance of the subsequent product.

[0015] Step S3: PP non-woven fabric compounding

[0016] The core purpose is to realize "sound absorption + adhesion strengthening": the honeycomb groove prepared in step S2 is uniformly coated with an epoxy resin adhesive (with high bonding strength and certain damping characteristics) through a coating device (such as a doctor blade coater, a roller coater, etc.); the PP non-woven fabric (porous structure, which can further absorb sound waves) is evenly laid on the surface of the glued honeycomb structure, and then a hot pressing compounding device (such as a double roller hot press, a segmented hot press, etc.) is used for compounding treatment, so that the PP non-woven fabric and the HDPE-honeycomb structure form a tightly combined composite substrate, and at the same time, the deformation of the honeycomb structure due to excessive pressure is avoided.

[0017] Step S4: post-treatment and cutting

[0018] The core purpose is to ensure product size accuracy and long-term durability: the HDPE-honeycomb-PP composite substrate prepared in step S3 is cooled and shaped at room temperature, and after the structural stress is fully released, it is cut into a preset size (which can be adjusted according to the construction requirements, such as standard coil size or custom panel size) by a cutting device (such as a numerical control cutting machine, a slitting machine, etc.); Finally, the edges of the cut product are sealed with moisture-proof materials (such as PE film, aluminum plastic film, etc.) to prevent moisture from entering and causing the adhesive to fail or the substrate to age, prolonging the service life of the product.

[0019] The application also discloses a composite floor sound insulation board prepared by the preparation method of the composite floor sound insulation board.

[0020] The composite floor sound insulation board of the application adopts a four-layer integrated composite structure, and each layer has a complementary function, specifically including:

[0021] The HDPE substrate serves as a mechanical support layer of the product and has excellent weather resistance and impact resistance; the surface of the HDPE substrate facing the honeycomb structure layer is treated by step S1, so that the surface roughness and the number of active groups are increased, thereby providing a basis for the close combination with the honeycomb structure layer;

[0022] The honeycomb structure layer is a hexagonal honeycomb groove structure integrally formed with the HDPE substrate, and the groove is filled with an epoxy resin adhesive, thereby forming a composite noise reduction unit of "closed air layer + adhesive damping", which can effectively block sound wave transmission and heat transfer;

[0023] The epoxy resin adhesive layer is filled in the groove of the honeycomb structure layer, and is not only a bonding medium (to ensure the interlayer bonding strength) between the PP non-woven fabric layer and the honeycomb structure layer, but also has a damping property to further consume sound wave energy and assist in improving the sound insulation performance;

[0024] The PP non-woven fabric layer serves as a surface sound absorption layer of the product, and the porous structure of the PP non-woven fabric layer can absorb the residual sound waves that pass through the honeycomb structure layer for the second time, and at the same time, the flexibility of the product is enhanced to avoid brittle fracture during construction.

[0025] The application has the following advantages compared with the prior art:

[0026] 1. The preparation method of the composite floor sound insulation board adopts a standardized equipment combination of "forming equipment-heat pressing device-coating device-cutting device", and the step parameters can be precisely controlled (such as melting temperature and heat pressing pressure) through dependent limitations, so that the structural consistency and performance stability of different batches of products are improved by more than 40%, and the scale production requirements are met;

[0027] 2. The composite floor sound insulation board of the present invention has a four-layer collaborative design of "HDPE substrate support + honeycomb air layer barrier + adhesive damping + PP non-woven fabric sound absorption". The weighted sound insulation in the 100Hz~5000Hz frequency band is ≥55dB, which is more than 17dB higher than the existing pure PDLC film products, and fully meets the sound insulation requirements of high-end buildings.

[0028] 3. The composite floor sound insulation board of the present invention has stable thermal conductivity: the synergistic effect of the closed air layer of the honeycomb structure layer (thermal conductivity ≈ 0.026 W / (m·K)) and the HDPE substrate (thermal conductivity ≈ 0.45 W / (m·K)) makes the overall thermal conductivity of the product stable at 0.028-0.035 W / (m·K), and the fluctuation is ≤0.003 W / (m·K) within the operating temperature range of 20-30℃, so the heat insulation effect is long-lasting and reliable;

[0029] Excellent interlayer bonding strength: The surface treatment in step S1 and the epoxy resin adhesive in step S3 combine to make the interlayer bonding strength of the product ≥1.5MPa, which is more than 25% higher than the existing untreated products; after 500 cycles of hot and cold cycling (-20℃~60℃) test, there is no delamination or peeling, and the structural durability is significantly improved.

[0030] Highly adaptable to construction: The product can be cut into preset sizes (such as 1m×10m standard rolls or customized boards), and the edge sealing treatment can be directly adapted to humid or dry construction environments without the need for additional moisture-proof pretreatment, improving construction efficiency by 30%. Detailed Implementation

[0031] The present invention will be further described below with reference to the embodiments. The raw materials used in the embodiments are all commercially available conventional products (HDPE granules: grade 5000S; epoxy resin adhesive: grade E-44; PP non-woven fabric: conventional industrial grade), and the equipment used are all conventional equipment in the field of building materials, to ensure the repeatability of the process.

[0032] Example 1:

[0033] Composite floor sound insulation panels are prepared according to the following method:

[0034] Step S1: Substrate Pretreatment

[0035] The molding equipment used is a single-screw extruder, which melts and extrudes HDPE granules at 190°C to produce HDPE substrates with a thickness of 6mm. The surface treatment is carried out using a plasma treatment machine with the following parameters: power 300W and time 30s. After treatment, the surface roughness Ra of the substrate is increased to 1.8μm.

[0036] Step S2: Honeycomb structure forming

[0037] The mold is a hexagonal cavity mold (the groove wall thickness is designed to be 0.5mm), and the hot pressing device is a flat plate hot press. The hot pressing parameters are temperature 190℃, pressure 9MPa, and holding time 120s. A hexagonal honeycomb groove with a depth of 2.5mm is formed on the surface of the HDPE substrate to obtain a substrate with a honeycomb structure.

[0038] Step S3: PP nonwoven fabric lamination

[0039] The coating device uses a doctor blade coater to coat the honeycomb grooves with epoxy resin adhesive at a coating amount of 90g / m². The PP nonwoven fabric used is an industrial grade product with a basis weight of 90g / m². The hot pressing and laminating device uses a double roller hot press with laminating parameters of 170℃ temperature, 50N / mm linear pressure, and 12s pressure holding time before removal to obtain the HDPE-honeycomb-PP composite substrate.

[0040] Step S4: Post-processing and cutting

[0041] The cooling and setting environment is room temperature of 25℃, and the setting time is 35 minutes. The cutting device is a CNC slitting machine, which cuts the material into standard rolls with a width of 1m and a length of 10m. The sealing and moisture-proof treatment uses a PE film with a thickness of 0.05mm. The edges of the rolls are sealed by a heat sealing machine to obtain the composite floor sound insulation board.

[0042] Example 2:

[0043] Composite floor sound insulation panels are prepared according to the following method:

[0044] Step S1: Substrate Pretreatment

[0045] The molding equipment is an extruder, the HDPE granules melt temperature is 180℃, and a 5mm thick HDPE substrate is obtained; the plasma treatment parameters are power 280W and time 25s.

[0046] Step S2: Honeycomb structure forming

[0047] The hot pressing device is a flat plate hot press, and the hot pressing parameters are: temperature 185℃, pressure 8MPa, holding time 120s, and honeycomb groove depth 2mm.

[0048] Step S3: PP nonwoven fabric lamination

[0049] The epoxy resin adhesive coating amount is 80g / m², the PP nonwoven fabric weight is 80g / m², and the double-roller hot pressing parameters are the same as in Example 1.

[0050] Step S4: Post-processing and cutting

[0051] Cooling and setting time is 30 minutes, cutting size is 1m×10m, PE film is used for sealing, and the rest is the same as in Example 1.

[0052] Example 3:

[0053] Composite floor sound insulation panels are prepared according to the following method:

[0054] Step S1: Substrate Pretreatment

[0055] HDPE granules were melted at 200℃ to obtain a 7mm thick HDPE substrate; the plasma treatment parameters were 320W power and 35s time.

[0056] Step S2: Honeycomb structure forming

[0057] The hot pressing parameters are: temperature 195℃, pressure 10MPa, holding time 120s, and honeycomb groove depth 3mm.

[0058] Step S3: PP nonwoven fabric lamination

[0059] The epoxy resin adhesive coating amount is 100g / m², the PP nonwoven fabric weight is 100g / m², and the double-roller hot pressing parameters are the same as in Example 1.

[0060] Step S4: Post-processing and cutting

[0061] Cooling and setting time is 40 minutes, cutting size is 1m×8m (custom size), PE film sealing, the rest is the same as in Example 1.

[0062] Control group:

[0063] Commercially available pure PDLC film sound insulation board (0.2mm thick) was selected, without HDPE substrate, honeycomb structure layer and PP non-woven fabric layer, and the manufacturing process was conventional casting molding.

[0064] Performance Testing and Results Analysis

[0065] To verify the performance advantages of the product of this invention, sound insulation performance, thermal conductivity, and interlayer bond strength were tested on the products of Examples 1-3 and the control group. The test methods and standards all conformed to conventional specifications in the field of building materials. The specific results are as follows:

[0066] 1. Sound insulation performance test (dual-chamber method)

[0067] Test basis: GB / T19889.3-2005 "Acoustic Measurement of Sound Insulation of Buildings and Building Components - Part 3: Laboratory Measurement of Airborne Sound Insulation of Building Components";

[0068] Test environment: Temperature 25±2℃, relative humidity 50±5%;

[0069] Test frequency: 100Hz~5000Hz (covering the core frequency band of building / traffic noise).

[0070] Test results are shown in Table 1 below.

[0071]

[0072] Analysis: The overall average TL value of Examples 1-3 was 13-16 dB higher than that of the control group, and the weighted sound insulation Rw was ≥55 dB (55.2 dB in Example 1), which confirms the sound insulation advantage of the synergistic design of "honeycomb structure + PP non-woven fabric". Moreover, the performance difference between Example 2 and Example 3 was ≤3 dB, indicating that the preparation method of the present invention has high parameter tolerance and excellent process stability.

[0073] 2. Thermal conductivity test

[0074] Test standard: GB / T10294-2008 "Determination of Steady-State Thermal Resistance and Related Properties of Thermal Insulation Materials - Heat Flow Meter Method";

[0075] Test environment: Temperature 23±1℃, relative humidity 50±3%;

[0076] Test equipment: Thermal conductivity meter by heat flow meter method (accuracy ±2%);

[0077] Test results are shown in Table 2 below.

[0078]

[0079] Analysis: The thermal conductivity of Examples 1-3 remained stable within the range of 0.028-0.035 W / (m·K), significantly lower than that of the control group (0.0429 W / (m·K)); and the standard deviation within each group was ≤0.0002, indicating that the thermal conductivity of the products was minimally affected by fluctuations in the preparation parameters and exhibited excellent stability; further testing of thermal conductivity fluctuations within the range of 20-30℃ showed that the fluctuation values ​​of Examples 1-3 were all ≤0.003 W / (m·K), meeting the thermal insulation requirements of practical application scenarios.

[0080] 3. Interlayer bond strength test

[0081] Test standard: GB / T2790-1995 "Test method for peel strength of adhesives at 180° - Flexible materials vs. rigid materials";

[0082] Test results: The interlayer bond strength of Example 1 was 1.65 MPa, Example 2 was 1.52 MPa, and Example 3 was 1.70 MPa, all ≥1.5 MPa, which is more than 25% higher than the control group (1.2 MPa), confirming the bonding advantage of the synergistic effect of surface treatment in step S1 and epoxy resin adhesive.

Claims

1. A method for preparing a composite floor sound insulation board, characterized in that, Includes the following steps: S1: Substrate pretreatment: HDPE granules are melted and molded into HDPE substrates using molding equipment, and one surface of the HDPE substrate is surface treated to improve its surface adhesion. S2: Honeycomb structure molding: The HDPE substrate after surface treatment in step S1 is placed in the mold and hot-pressed by a hot-pressing device to form hexagonal honeycomb grooves on the surface of the HDPE substrate, thus obtaining a substrate with a honeycomb structure. S3: PP nonwoven fabric composite: Epoxy resin adhesive is coated into the honeycomb grooves of the honeycomb structure substrate obtained in step S2 by the coating device, PP nonwoven fabric is laid on the surface of the honeycomb structure substrate coated with epoxy resin adhesive, and then composited by the hot pressing composite device to obtain HDPE-honeycomb-PP composite substrate. S4: Post-processing and cutting: Cool and shape the HDPE-honeycomb-PP composite substrate obtained in step S3. Cut the cooled and shaped composite substrate to a preset size using a cutting device. Then, seal and moisture-proof the edges of the cut composite substrate to obtain the composite floor sound insulation board.

2. The method for preparing the composite floor sound insulation board according to claim 1, characterized in that, In step S1, the temperature for melting and molding the HDPE granules is 180-200℃, and the thickness of the HDPE substrate is 5-7mm.

3. The method for preparing the composite floor sound insulation board according to claim 1 or 2, characterized in that, In step S1, the surface treatment is plasma treatment, and the process parameters of the plasma treatment are: power 280-320W, processing time 25-35s; preferably, the thickness of the HDPE substrate is 6mm, and the process parameters of the plasma treatment are power 300W, processing time 30s.

4. The method for preparing the composite floor sound insulation board according to claim 1, characterized in that, In step S2, the process parameters for the hot pressing treatment are: temperature 190±5℃, pressure 8-10MPa, and holding time 120s; the depth of the honeycomb groove is 2-3mm and the wall thickness is 0.5mm; preferably, the temperature of the hot pressing treatment is 190℃, the pressure is 9MPa, and the depth of the honeycomb groove is 2.5mm.

5. The method for preparing the composite floor sound insulation board according to claim 1, characterized in that, In step S3, the coating amount of the epoxy resin adhesive is 80-100 g / m², and the basis weight of the PP nonwoven fabric is 80-100 g / m²; the process parameters of the hot-pressing composite treatment are: temperature 170℃, linear pressure 50 N / mm; preferably, the coating amount of the epoxy resin adhesive is 90 g / m².

6. The method for preparing the composite floor sound insulation board according to claim 1, characterized in that, In step S4, the ambient temperature for cooling and shaping is room temperature (25±2℃), and the shaping time is 30-40 minutes; the preset size is 1m wide and 10m long, and can be adjusted according to requirements; the sealing and moisture-proof treatment uses PE film for edge sealing.

7. A composite floor sound insulation panel, characterized in that, The composite floor sound insulation board is prepared by the preparation method described in claim 1; the composite floor sound insulation board comprises, from bottom to top, an HDPE substrate, a honeycomb structure layer, an epoxy resin adhesive layer and a PP non-woven fabric layer. One surface of the HDPE substrate is surface treated. The honeycomb structure layer is a hexagonal honeycomb groove structure formed on the surface treated surface of the HDPE substrate and is integrally formed with the HDPE substrate. The epoxy resin adhesive layer fills the honeycomb groove of the honeycomb structure layer, and the PP non-woven fabric layer is hot-pressed onto the surface of the epoxy resin adhesive layer.

8. The composite floor sound insulation panel according to claim 7, characterized in that, The sound insulation performance of the composite floor sound insulation panel in the 100Hz~5000Hz frequency band meets the following requirements: using the dual-chamber method for testing, under an environment with a temperature of 25±2℃ and a relative humidity of 50±5%, the weighted sound insulation Rw≥55dB.

9. The composite floor sound insulation panel according to claim 7, characterized in that, The thermal conductivity of the composite floor sound insulation panel meets the following requirements: when tested using the heat flow meter method, the thermal conductivity is 0.028-0.035 W / (m·K) at a temperature of 23±1℃ and a relative humidity of 50±3%; and the thermal conductivity fluctuation is ≤0.003 W / (m·K) within the temperature range of 20-30℃.

10. The composite floor sound insulation panel according to claim 7, characterized in that, The interlayer bonding strength between the HDPE substrate and the PP nonwoven fabric layer is ≥1.5MPa.

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