Method and device for monitoring etching precision of printed circuit board

Abstract

The invention discloses a method and a device for monitoring the etching precision of a printed circuit board. The method comprises the following steps of: etching a product pattern and a reference module on the printed circuit board; wherein the product pattern is used for presenting a product circuit structure, and the etching line width level of the reference module is consistent with the product pattern; the etching line width of a reference module is obtained, and the etching line width of the reference module is consistent with the etching line width of the product pattern; the design line width of the printed circuit board is obtained, the etching line width of the reference module is compared with the design line width, and if the difference does not exceed a threshold value, the precision monitoring of the printed circuit board is passed; and if the difference exceeds a threshold value, the precision monitoring of the printed circuit board is not passed. Through the mode, the problems that the troubleshooting process is complex and the troubleshooting difficulty is high when the etching precision of the printed circuit board is different at present are solved.

Description

Technical Field

[0001] This application relates to a method and apparatus for monitoring the etching accuracy of printed circuit boards, belonging to the field of printed circuit board technology. Background Technology

[0002] With the continuous development and technological updates in the field of electronic technology, printed circuit boards (PCBs) often require more precise processing during the design and etching stages. Due to the high density and complex design of PCBs, etching differences within the working panel are prone to occur during PCB production. Therefore, to ensure the precision of PCBs, the etching accuracy needs to be monitored before shipment. Because PCBs often have complex structures and involve multiple layers, the monitoring process can be lengthy and complex.

[0003] PCB etching is a key step in the printed circuit board manufacturing process. It is mainly used to remove unwanted copper layers to form circuit patterns. With the upgrading of products and the improvement of the performance requirements of electronic products, the requirements of the PCB industry for etched patterns are also increasing.

[0004] Typically, before printed circuit boards (PCBs) leave the factory, randomly selected PCBs are measured using optical inspection equipment to confirm the actual linewidth etching level. The measurement results are then compared with etching standards to confirm the accuracy of the etched pattern. However, this method is overly complex, not only affecting the factory's production rhythm but also introducing errors in determining the accuracy of all PCBs based on random sampling results. Summary of the Invention

[0005] The technical problem to be solved by this invention is that it is difficult and slow to investigate the etching differences in printed circuit boards.

[0006] To address the aforementioned technical problems, this application provides a method for monitoring the etching accuracy of a printed circuit board, comprising: etching a product pattern and a reference module on the printed circuit board; wherein the product pattern is used to represent the product circuit structure, and the etching linewidth level of the reference module is consistent with that of the product pattern; obtaining the etching linewidth of the reference module, wherein the etching linewidth of the reference module is consistent with the etching linewidth of the product pattern; obtaining the design linewidth of the printed circuit board, comparing the etching linewidth of the reference module with the design linewidth, and if the difference does not exceed a threshold, the printed circuit board accuracy monitoring passes; if the difference exceeds the threshold, the printed circuit board accuracy monitoring fails.

[0007] In this way, the uniformity of the etched linewidths of the reference module and the product pattern is guaranteed at the design level. Therefore, by comparing the difference between the etched linewidth of the final reference module and the design linewidth, it is possible to clearly determine whether the design pattern meets the customer's specifications. At the same time, the addition of the reference module optimizes the original monitoring method. It is no longer necessary to monitor the entire printed circuit board, but only the reference module is processed, which improves the monitoring efficiency.

[0008] The aforementioned method for monitoring the etching accuracy of printed circuit boards uses a reference module whose minimum linewidth spacing level and residual copper rate are consistent with the product pattern.

[0009] In this way, not only can the horizontal accuracy of the printed circuit board be guaranteed, but the reference module can also be guaranteed to meet the linewidth accuracy requirements of the printed circuit board.

[0010] The aforementioned method for monitoring the etching accuracy of a printed circuit board (PCB) is used when the PCB has a multilayer structure.

[0011] This approach not only meets the application needs of various scenarios, but also makes the design of printed circuit boards more flexible and suitable for high-precision applications.

[0012] The aforementioned method for monitoring the etching accuracy of printed circuit boards includes a reference module in each layer of a multilayer printed circuit board structure.

[0013] This approach provides a more convenient way to monitor each layer of a multilayer printed circuit board, improving the overall monitoring efficiency of the printed circuit board. It not only speeds up the production rate of printed circuit boards but also improves the accuracy of multilayer printed circuit boards.

[0014] The aforementioned method for monitoring the etching accuracy of a printed circuit board includes a reference module comprising a measurement endpoint and an end line; wherein the measurement endpoint is located on one side of the end line, and at least two parallel comb lines with equal spacing are connected to the end line.

[0015] The aforementioned method for monitoring the etching accuracy of printed circuit boards allows the reference module to confirm performance parameters such as design resistance and circuit connection status using tools like multimeters during the finished product stage of the printed circuit board, thereby enabling the monitoring function of the printed circuit board.

[0016] In one alternative approach, if the printed circuit board (PCB) accuracy monitoring fails, the PCB etching parameters are readjusted based on the PCB's design linewidth.

[0017] In this way, this application achieves faster confirmation of etched linewidth levels on printed circuit boards, reduces linewidth etching differences in shipped boards, and improves product quality.

[0018] In one alternative approach, the etching parameters include at least one of the following: etching liquid, nozzle spray pressure, etching line speed, and etching placement method.

[0019] In this way, this application adjusts the parameters that can be changed in the pattern etching process to improve the pattern differences on the work board during specific etching operations, and provides a multi-dimensional solution from different perspectives for different problems of etched linewidths on printed circuit boards.

[0020] In one alternative approach, the reference module is positioned in a blank area of ​​the printed circuit board.

[0021] This approach not only ensures that the reference module does not affect product performance, but also allows for quick and effective confirmation of differences in printed circuit board linewidth etching.

[0022] This application also provides an etching accuracy monitoring device for printed circuit boards, including: an etching module, an acquisition module, and a judgment module.

[0023] The system includes an etching module for etching product patterns and a reference module onto the printed circuit board (PCB). The product pattern represents the product's circuit structure, and the etched linewidth of the reference module matches that of the product pattern. An acquisition module acquires the etched linewidth of the reference module, ensuring it matches the etched linewidth of the product pattern. A judgment module acquires the design linewidth of the PCB, compares the etched linewidth of the reference module with the design linewidth, and if the difference does not exceed a threshold, the PCB accuracy monitoring passes; if the difference exceeds the threshold, the PCB accuracy monitoring fails.

[0024] The aforementioned etching accuracy monitoring device for printed circuit boards further includes a judgment module that, if the printed circuit board fails the accuracy monitoring, readjusts the etching parameters of the printed circuit board according to the design linewidth of the printed circuit board.

[0025] This invention achieves several beneficial effects: Based on the differences in design layout, residual copper ratio, etching direction, and other factors among different printed circuit boards (PCBs), a reference module is set on the PCB to confirm the etching standards of the shipped board. To ensure that the reference module meets monitoring requirements, the etching linewidth of the reference module and the product pattern are consistent at the design level. In this way, parameters such as the etching linewidth of the reference module can be monitored to achieve the purpose of quickly monitoring the etching accuracy of the PCB. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a flowchart of a method for monitoring the etching accuracy of a printed circuit board provided in Embodiment 1 of the present application; Figure 2 It is a schematic diagram of a reference module in Embodiment 1 of the present application; Figure 3 It is a schematic diagram of the product pattern and the position of the reference module in Embodiment 1 of the present application; Figure 4 It is a schematic diagram of the design process of a printed circuit board in Embodiment 1 of the present application; Figure 5 It is a schematic diagram of a device for monitoring the etching accuracy of a printed circuit board in Embodiment 1 of the present application. Detailed implementation manners

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention.

[0029] In the following embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Here, A and B can be singular or plural. The character " / " generally represents that the associated objects before and after are in an "or" relationship. "At least one (item) below" or similar expressions refer to any combination of these items, including any combination of single item (item) or plural items (items). For example, at least one (item) of a, b, or c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c can be single or multiple. The singular expression forms "one", "a kind of", "the", "the above", "this", and "this one" are also intended to include expressions such as "one or more" unless there is a clear opposite indication in the context. Also, unless there is a contrary statement, the ordinal numbers such as "first" and "second" mentioned in the embodiments of the present application are used to distinguish multiple objects and are not used to limit the order, time sequence, priority, or importance of multiple objects.

[0030] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0031] Example 1

[0032] like Figure 1 As shown, this embodiment provides a method for monitoring the etching accuracy of a printed circuit board, including: Step 101: Etch a product pattern and a reference module on the printed circuit board. The product pattern is used to represent the product circuit structure, and the etched linewidth of the reference module is consistent with the etched linewidth of the product pattern.

[0033] The typical process for manufacturing printed circuit boards (PCBs) involves "pattern plating," which first pre-plats a lead-tin resist layer onto the copper foil portion of the PCB that needs to be retained, i.e., the product pattern area. Then, the remaining copper foil is chemically etched away; this process is called etching. Simultaneously with etching the product pattern, this application etches a reference module on the PCB with a linewidth level consistent with the product pattern. The reference module is used to monitor whether the etching accuracy of the PCB meets the standard.

[0034] In this embodiment, the minimum linewidth spacing level and residual copper ratio of the reference module are consistent with the product pattern.

[0035] Since the reference module is used to provide a quick way to determine whether the etching accuracy of the printed circuit board meets the standard, the minimum line width spacing level and residual copper ratio of the reference module are consistent with the product pattern to ensure that the data of the reference module meets the standard of the printed circuit board.

[0036] Example 2

[0037] The printed circuit board has a multilayer printed circuit board structure.

[0038] Due to the continuous development and technological updates in the field of electronic technology, multilayer printed circuit board (PCB) structures are often more suitable for operational requirements. However, due to differences in design layout, residual copper content, and etching direction on each side of the product, the etching accuracy monitoring process for multilayer PCB structures is typically more complex. For example, if the residual copper content of the first PCB layer of a multilayer PCB is 50%, while that of the second PCB layer is 70%, then etching accuracy monitoring usually requires placing each layer separately into a layer scanner for monitoring.

[0039] In each layer of a multilayer printed circuit board (PCB), a reference module is set. When monitoring etching accuracy, since the minimum line width spacing and residual copper ratio of the reference module in each PCB layer are consistent with the product pattern of that layer, it is only necessary to test the reference module of each PCB layer to determine whether the product pattern of that layer meets the etching line width level.

[0040] By comparing the actual etched linewidth with the designed linewidth in this way, it is possible to quickly and clearly determine whether the product pattern meets customer specifications and to identify linewidth distribution differences among multiple PCBs in multilayer printed circuit boards. This allows for rapid adjustment of pattern compensation and etching parameters, shortening the confirmation time for etched linewidth levels in traditional methods, reducing linewidth etching differences in shipped boards, and thus improving product quality.

[0041] Step 102: Obtain the etching linewidth of the reference module. The etching linewidth of the reference module is consistent with the etching linewidth of the product pattern.

[0042] Since the etching linewidth directly affects the circuit signal integrity, current carrying capacity, and impedance control of the printed circuit board, ensuring that the etching linewidth of the product pattern and the reference module are consistent can achieve the purpose of judging whether the etching linewidth of the product pattern conforms to the standard by using the reference module.

[0043] In one possible implementation, the etched linewidth of the reference module is calculated by measuring the electrical or photochemical properties of the reference module. For example, the corresponding etched linewidth can be calculated based on parameters such as the measured resistance, copper wire resistivity, wire length, and copper thickness of the reference module. It should be noted that the above method of obtaining the etched linewidth is only one example, and the etched linewidth can also be obtained in other ways, such as automatically identifying the actual linewidth on the reference module using a camera or microscope, etc. This application does not limit this to any particular method.

[0044] like Figure 2As shown. The reference module includes two parallel terminal lines, each with a measurement endpoint 20. The two measurement endpoints 20 are diagonally positioned. Each terminal line is connected to multiple parallel, equally spaced comb-shaped lines, which are arranged in a crisscross pattern, facing each other. The measurement endpoints 20 are used to measure the electrical performance of the reference module. For example, a multimeter can be used to confirm the design resistance and circuit connection status of the reference module. If the line width of the reference module is too thick or too thin during testing, the etching parameters are adjusted in time to ensure the accuracy requirements of the PCB board. The spacing between adjacent comb-shaped lines 21 is the minimum line width of the current printed circuit board product pattern. The line width is designed and selected based on the minimum actual line width spacing of the corresponding PCB board, and the comb-shaped line length is adjusted according to the actual selected blank area. In this way, the line width specifications of the reference module can be guaranteed to meet the design requirements of the PCB board.

[0045] The design structure of the above-mentioned reference module is only an example. The reference module may also include other design structures. For example, the reference module may also include multiple parallel lines with equal spacing and opposite directions, each with a measurement endpoint at one end, arranged in an intersecting pattern. Since each line has a measurement endpoint, the individual electrical performance of each test point can be obtained by measuring different measurement endpoints. This application does not limit this.

[0046] In this way, the selected location can be ensured to be reasonable and controllable. Since most products have broken edges added during PCB board production, and these broken edges are removed after assembly and soldering to avoid delamination damage caused by machine stress, the reference module of this invention is designed with the broken edge area as much as possible. This ensures product reliability and the realism and effectiveness of the monitoring module's simulation of the product's internal circuitry.

[0047] The reference module is located in a blank area of ​​the printed circuit board.

[0048] like Figure 3 The diagram shows the product graphic and reference module positions on the printed circuit board in this embodiment. 30 represents the product graphic, and 31 represents the reference module. Due to differences in design layout, residual copper ratio, and etching direction on each side of the product in multilayer printed circuit boards, the reference module is placed in a blank area of ​​the printed circuit board to ensure relative stability and prevent it from interfering with the board's operation. Furthermore, since multiple shipping boards are connected to one working board in actual production, the reference module is positioned at the edge of the shipping board.

[0049] The selection of the reference module setting area must not only ensure that it does not affect the product performance of the printed circuit board, but also ensure that the line width etching differences of the printed circuit board can be quickly and effectively identified.

[0050] Step 103: Obtain the design linewidth of the printed circuit board. Compare the etched linewidth of the reference module with the design linewidth. If the difference between the two does not exceed the threshold, proceed to step 104; if the difference between the two exceeds the threshold, proceed to step 105.

[0051] Specifically, the threshold difference between the etched linewidth and the design linewidth of the reference module depends on the characteristics of the printed circuit board. The allowable difference threshold can be set. For example, the allowable difference threshold is usually 20% of the design line width, while in the design of some printed circuit boards with high precision requirements, the allowable difference threshold may be 8% to 10% of the line specification. This application does not limit this.

[0052] The linewidth of a printed circuit board (PCB) is obtained during the PCB design process; such as... Figure 4 As shown, the design process for a printed circuit board includes the following steps: Step 401: Analyze the printed circuit board data and confirm the line width.

[0053] The design requirements for a printed circuit board (PCB) are obtained from a PCB requirements table. This table includes the design requirements for the PCB to meet practical applications, such as basic information, electrical parameters, mechanical parameters, material requirements, and wiring design constraints. Basic information includes the number of PCB layers, dimensions, and total pin count. Alternatively, it may include other PCB design information based on actual needs, such as the product type, required date, and whether simulation, component procurement, or mounting is required. This application does not limit this information. The PCB requirements table is obtained based on product requirements.

[0054] The design line width of the corresponding printed circuit board is determined based on the wiring design constraints and other information in the requirements table. For example, if the wiring design constraints in the requirements table indicate that the line width of the printed circuit board is 0.3mm, then the design line width of the printed circuit board is determined to be 0.3mm.

[0055] Step 402: Based on the line width confirmed in step 401, adjust the design parameters of the printed circuit board, including adjusting parameters such as minimum line width, line spacing, and via type, and adjusting the etching parameters to ensure that the etching parameters of all layers of the multilayer printed circuit board are consistent on the entire working board and meet the line width accuracy requirements.

[0056] Step 403: After the printed circuit board design is completed, the final conductive pattern is formed through an etching process. At the same time, the product pattern and reference module are etched on the corresponding positions of the printed circuit board to ensure that the function of the printed circuit board can be realized.

[0057] Once the printed circuit board (PCB) design is complete, a small batch of PCBs is etched according to the design specifications as a trial production run. After etching, at least one of optical inspection equipment, contact measuring equipment, or non-contact measuring equipment is used to measure and compare the internal circuitry, line width, and spacing of the etched PCBs. The product's accuracy is then verified against inspection standards to confirm compliance with regulations before mass production. If the product accuracy is compliant, mass production proceeds; otherwise, the process returns to step 402 to adjust the PCB design until the product accuracy meets requirements.

[0058] Step 404: Obtain the etched linewidth of the reference module and product pattern according to the method in step 102.

[0059] In this way, this application realizes the design process of printed circuit boards in a clearer and faster manner. It not only considers the working conditions of printed circuit boards in the design stage, but also analyzes and improves the actual etched printed circuit boards, further ensuring the actual working accuracy of printed circuit boards.

[0060] Step 104: When the difference between the etched linewidth and the design linewidth of the reference module does not exceed a threshold, the printed circuit board (PCB) accuracy monitoring passes, and the current PCB design is qualified. For example, if the etched linewidth of the reference module on the PCB is 0.17 mm, and its corresponding design linewidth is 0.2 mm, and the threshold is set to 20%, then the difference between the etched linewidth and the design linewidth on the PCB does not exceed the threshold, and the PCB accuracy monitoring passes. It should be noted that the above values ​​are merely examples, and this application does not limit them.

[0061] Once the accuracy monitoring of the printed circuit board is passed, the printed circuit board can undergo subsequent operations such as electrical testing.

[0062] Step 105: When the difference between the etched linewidth and the designed linewidth of the reference module exceeds a threshold, the printed circuit board (PCB) accuracy monitoring fails, and the current PCB design is unqualified. For example, if the etched linewidth of the reference module on the PCB is 0.15mm, while its corresponding designed linewidth is 0.2mm, and the threshold is set to 20%, then the difference between the etched linewidth and the designed linewidth on the PCB exceeds the threshold, and the PCB accuracy monitoring fails. It should be noted that the above values ​​are merely examples, and this application does not limit them.

[0063] If the printed circuit board fails the accuracy monitoring, the etching parameters of the printed circuit board should be readjusted according to the design linewidth of the printed circuit board.

[0064] Etching parameters include at least one of the following: etching liquid, nozzle spray pressure, etching line speed, and etching board placement method. Adjusting etching parameters is multifaceted and multi-dimensional. Depending on the specific type of etching production line, parameters such as etching liquid, nozzle spray pressure, etching line speed, and etching board placement method can be adjusted in the pattern etching process to improve the pattern variation on the work board during specific etching operations.

[0065] In this way, this application can clearly and quickly determine whether the printed circuit board design meets customer specifications and confirm the differences in linewidth distribution among multiple printed circuit boards. Simultaneously, when accuracy monitoring fails, design and etching parameters can be quickly adjusted, shortening the confirmation time for etched pattern linewidth levels, reducing linewidth etching differences, and thus improving product quality.

[0066] Based on the same technological concept, such as Figure 5 As shown, this embodiment provides an etching accuracy monitoring device for printed circuit boards, which can execute the etching accuracy monitoring method for printed circuit boards. It includes: an etching module 501, an acquisition module 502, and a judgment module 503.

[0067] The etching module 501 is used to etch a product pattern and a reference module on the printed circuit board; wherein the product pattern is used to present the product circuit structure, and the etching linewidth level of the reference module is consistent with that of the product pattern; the acquisition module 502 is used to acquire the etching linewidth of the reference module, wherein the etching linewidth of the reference module is consistent with the etching linewidth of the product pattern; the judgment module 503 is used to acquire the design linewidth of the printed circuit board, compare the etching linewidth of the reference module with the design linewidth, and if the difference does not exceed a threshold, the printed circuit board accuracy monitoring passes; if the difference exceeds the threshold, the printed circuit board accuracy monitoring fails.

[0068] The minimum line width spacing level and residual copper ratio of the reference module are consistent with the product graphics.

[0069] The printed circuit board has a multilayer printed circuit board structure.

[0070] Each layer of the multilayer printed circuit board structure contains a reference module.

[0071] The reference module is a comb-shaped line design with measurement endpoints arranged in pairs.

[0072] The judgment module 503 is also used to readjust the etching parameters of the printed circuit board according to the design line width of the printed circuit board if the accuracy monitoring of the printed circuit board fails.

[0073] Etching parameters include at least one of the following: etching liquid, nozzle spray pressure, etching line speed, and etching board placement method.

[0074] The reference module is set in a blank area of ​​the printed circuit board.

[0075] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0076] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A method for monitoring the etching accuracy of a printed circuit board, characterized in that, include: Etching product graphics and reference modules onto printed circuit boards; The product graphic is used to represent the product circuit structure, and the etch line width of the reference module is consistent with the etch line width of the product graphic. Obtain the etch linewidth of the reference module; The design linewidth of the printed circuit board is obtained, and the etched linewidth of the reference module is compared with the design linewidth. If the difference does not exceed the threshold, the accuracy monitoring of the printed circuit board is passed. If the difference exceeds the threshold, the printed circuit board accuracy monitoring fails.

2. The method for monitoring the etching accuracy of a printed circuit board according to claim 1, characterized in that, The method further includes: the minimum line width spacing level and residual copper ratio of the reference module are consistent with the product pattern.

3. The method for monitoring the etching accuracy of printed circuit boards according to claim 1, characterized in that, The method further includes: the printed circuit board is a multilayer printed circuit board structure.

4. The method for monitoring the etching accuracy of a printed circuit board according to claim 3, characterized in that, The method further includes: each layer of the multilayer printed circuit board structure contains a reference module.

5. The method for monitoring the etching accuracy of a printed circuit board according to claim 1, characterized in that, The reference module includes: Measurement endpoints and end lines; wherein the measurement endpoints are located on one side of the end lines, and at least two parallel and equally spaced comb lines are connected to the end lines.

6. The method according to claim 1, characterized in that, The method further includes: if the accuracy monitoring of the printed circuit board fails, readjusting the etching parameters of the printed circuit board according to the design linewidth of the printed circuit board.

7. The method for monitoring the etching accuracy of a printed circuit board according to claim 6, characterized in that, The etching parameters include at least one of the following: Etching liquid, nozzle spray pressure, etching line speed, etching board placement method.

8. The method for monitoring the etching accuracy of a printed circuit board according to claim 1, characterized in that, The method further includes: the reference module is disposed in a blank area of ​​the printed circuit board.

9. A device for monitoring the etching accuracy of a printed circuit board, characterized in that, include: An etching module is used to etch product patterns and reference modules on a printed circuit board; wherein the product patterns are used to represent the product circuit structure, and the etching linewidth level of the reference modules is consistent with that of the product patterns; An acquisition module is used to acquire the etching linewidth of the reference module, wherein the etching linewidth of the reference module is consistent with the etching linewidth of the product pattern; The judgment module is used to obtain the design linewidth of the printed circuit board, compare the etched linewidth of the reference module with the design linewidth, and if the difference does not exceed the threshold, the accuracy monitoring of the printed circuit board passes; if the difference exceeds the threshold, the accuracy monitoring of the printed circuit board fails.

10. The etching accuracy monitoring device for printed circuit boards according to claim 9, characterized in that, The judgment module is also used to readjust the etching parameters of the printed circuit board according to the design linewidth of the printed circuit board if the accuracy monitoring of the printed circuit board fails.

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