An integrated circuit package cure time control method and system

Abstract

The application discloses a kind of integrated circuit package solidification time control method and system, it is related to integrated circuit package solidification time control field, for improving the reliability of integrated circuit solidification process, including: in the process of using solidification furnace to package solidification integrated circuit, the real-time energy output of solidification furnace is obtained;Energy output reference of solidification furnace is maintained in the preset temperature under the condition of no product solidification;Based on the cumulative result of the difference between real-time energy output and energy output reference, the total energy of solidification reaction is calculated in the current release, and in the case where total energy is greater than or equal to preset total heat release threshold, the solidification energy end point is determined;Obtain the solidification rate end point based on the change of solidification rate;When solidification energy end point and solidification rate end point exist preset difference, and the time corresponding to solidification rate end point and preset minimum solidification time exist preset association, trigger abnormal alarm, to control the solidification time of package solidification process.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit packaging curing time control, and more particularly to an integrated circuit packaging curing time control method and system. Background Technology

[0002] In the integrated circuit packaging curing process, when the curing rate decreases to a preset value, the system determines that the chemical reaction is basically complete; at the same time, in order to ensure that the material is fully cured, the total heating time of all packages in the curing oven must also meet a preset minimum time requirement.

[0003] However, the additional heating required to meet the minimum time requirement may lead to over-curing of the material, which in turn generates byproducts that contaminate the rate sensor, ultimately causing sensor data distortion and incorrectly delaying the calculated rate endpoint. This delay then numerically aligns with the incorrectly extended minimum curing time, creating a false impression of "effective process adjustment" at the system level, thus masking a self-locking cycle that perpetuates the underlying problem of over-curing. Summary of the Invention

[0004] This invention provides a method for controlling the curing time of integrated circuit packaging, which improves the reliability of the curing process of integrated circuits.

[0005] In a first aspect, to address the aforementioned technical problems, this invention provides a method for controlling the curing time of integrated circuit packaging, comprising: acquiring the real-time energy output of the curing oven during the packaging and curing process of the integrated circuit using a curing oven; the internal temperature of the curing oven being a preset temperature; acquiring an energy output reference for maintaining the preset temperature in a curing oven without product curing; calculating the total energy released by the curing reaction at the current time based on the cumulative result of the difference between the real-time energy output and the energy output reference, and determining the curing energy endpoint when the total energy is greater than or equal to a preset total heat release threshold; the curing energy endpoint being the curing completion time determined based on the energy of the curing reaction; acquiring a curing rate endpoint based on the change in curing rate; the curing rate corresponding to the curing rate endpoint being less than the curing rate threshold; the curing rate endpoint being the curing completion time determined based on the curing rate of the curing reaction; and triggering an abnormal alarm when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and when the time corresponding to the curing rate endpoint is associated with a preset minimum curing time, so as to control the curing time of the packaging and curing process.

[0006] Optionally, when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time, an abnormal alarm is triggered, including: generating different types of diagnostic alarm information based on the time difference between the curing energy endpoint and the curing rate endpoint, and the time difference between the curing rate endpoint and the preset minimum curing time; different types of diagnostic alarm information include: rate sensor contamination or material over-curing, insufficient curing or abnormal heating, and minimum curing time setting too long; based on different types of diagnostic alarm information, an abnormal alarm is triggered.

[0007] Optionally, different types of diagnostic alarm information can be generated, including: when the curing energy endpoint is earlier than the curing rate endpoint, and the difference between the curing rate endpoint and the preset minimum curing time is less than the difference threshold, a diagnostic alarm information indicating contamination of the rate sensor or over-curing of the material is generated; when the curing energy endpoint is later than the curing rate endpoint, a diagnostic alarm information indicating insufficient curing or abnormal heating is generated; when the difference between the curing energy endpoint and the curing rate endpoint is less than the difference threshold, and both the curing energy endpoint and the curing rate endpoint are earlier than the preset minimum curing time, a diagnostic alarm information indicating that the minimum curing time setting is too long is generated.

[0008] Optionally, when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time, an abnormal alarm is triggered, including: obtaining the time required for the total energy released by the curing reaction to reach a preset percentage; dynamically determining the first allowable time difference range between the curing energy endpoint and the curing rate endpoint based on the time required for the total energy released by the curing reaction to reach the preset percentage; dynamically determining the second allowable time difference range between the curing rate endpoint and the preset minimum curing time based on the time required for the total energy released by the curing reaction to reach the preset percentage; and triggering an abnormal alarm when the time difference between the curing energy endpoint and the curing rate endpoint exceeds the first time difference range, and the time difference between the curing rate endpoint and the preset minimum curing time is within the second time difference range.

[0009] Optionally, based on the time required for the total energy released by the curing reaction to reach a preset percentage, the allowable first time difference range between the curing energy endpoint and the curing rate endpoint is dynamically determined, including: acquiring the energy release rate characteristics of the curing reaction in the initial stage; acquiring the energy release duration characteristics of the curing reaction in the later stage; evaluating the dynamic characteristics of the curing process of the current batch based on the time required for the total energy released by the curing reaction to reach a preset percentage, the energy release rate characteristics of the initial stage, and the energy release duration characteristics of the later stage; and determining the allowable first time difference range between the curing energy endpoint and the curing rate endpoint based on the dynamic characteristics of the curing process.

[0010] Optionally, based on the time required for the total energy released by the curing reaction to reach a preset percentage, a second allowable time difference range between the curing rate endpoint and the preset minimum curing time is dynamically determined, including: obtaining the rate of decrease in the energy release rate of the curing reaction in the later stage of curing; obtaining the duration for which the energy release rate of the curing reaction is below the release rate threshold in the later stage of curing; evaluating the completion characteristics of the curing reaction based on the time required for the total energy released by the curing reaction to reach a preset percentage, the rate of decrease in the later stage of curing, and the duration for which the energy release rate is below the release rate threshold in the later stage of curing; and dynamically determining the second allowable time difference range between the curing rate endpoint and the preset minimum curing time based on the completion characteristics of the curing reaction.

[0011] Optionally, based on the curing reaction completion characteristics, the allowable second time difference range between the curing rate endpoint and the preset minimum curing time is dynamically determined, including: based on the curing reaction completion characteristics, initially determining the allowable original time difference range between the curing rate endpoint and the preset minimum curing time; obtaining the temperature fluctuation characteristics of the curing oven in the later stage of the curing reaction; and adjusting the original time difference range according to the temperature fluctuation characteristics to obtain the allowable second time difference range between the curing rate endpoint and the preset minimum curing time.

[0012] Optionally, the real-time energy output of the curing oven can be obtained, including: measuring the input current and input voltage of the curing oven in real time; calculating the real-time power of the curing oven based on the input current and input voltage; and using the real-time power as the real-time energy output of the curing oven.

[0013] Optionally, obtaining the curing rate endpoint based on the curing rate change includes: real-time monitoring of the dielectric properties of the curing material; the curing material is the material used for packaging and curing integrated circuits; identifying a specific time point based on the changing trend of the dielectric properties; the specific time point is the time point indicating the change in the curing rate; and determining the curing rate endpoint based on the specific time point.

[0014] Secondly, the present invention provides an integrated circuit packaging curing time control system for controlling the curing time of integrated circuit packaging, the system comprising:

[0015] The first acquisition module is used to acquire the real-time energy output of the curing oven during the process of packaging and curing integrated circuits in the curing oven; the internal temperature of the curing oven is a preset temperature.

[0016] The second acquisition module is used to acquire the energy output reference of the curing oven in the state of no product curing;

[0017] The energy endpoint determination module is used to calculate the total energy released by the curing reaction at the current time based on the cumulative result of the difference between the real-time energy output and the energy output reference, and to determine the curing energy endpoint if the total energy is greater than or equal to the preset total heat release threshold; the curing energy endpoint is the curing completion time based on the energy judgment of the curing reaction.

[0018] The rate endpoint acquisition module is used to acquire the curing rate endpoint based on the change in curing rate; the curing rate corresponding to the curing rate endpoint is less than the curing rate threshold; the curing rate endpoint is the curing completion time determined based on the curing rate of the curing reaction.

[0019] The alarm triggering module is used to trigger an abnormal alarm when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and when the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time, so as to control the curing time of the encapsulation curing process.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] This application provides an integrated circuit packaging curing time control method and system. By introducing a dual judgment mechanism based on energy endpoint and rate endpoint, and combining it with intelligent anomaly alarm based on minimum curing time, it effectively solves the problems of over-curing, insufficient curing, and misjudgment caused by material characteristics, abnormal heating, or sensor contamination in traditional curing time control. Thus, by introducing dual curing endpoint judgment based on energy and rate, and combining it with anomaly alarm triggering based on minimum curing time, it can effectively identify and avoid over-curing or insufficient curing caused by material characteristics, abnormal heating, or sensor contamination, thereby improving the accuracy and reliability of curing time control and reducing product defects. Attached Figure Description

[0022] Figure 1 This is a schematic flowchart of an integrated circuit packaging curing time control method provided in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of another integrated circuit packaging curing time control method provided in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of an integrated circuit packaging curing time control system provided in an embodiment of the present invention. Detailed Implementation

[0025] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] The following specific embodiments will provide a detailed description and explanation of an integrated circuit packaging curing time control method provided in this application.

[0028] Reference Figure 1 This invention provides a method for controlling the curing time of integrated circuit packaging, comprising the following steps:

[0029] S1, during the process of packaging and curing integrated circuits using a curing oven, obtain the real-time energy output of the curing oven.

[0030] The internal temperature of the curing oven is a preset temperature. Real-time energy output refers to the actual energy or power consumed by the curing oven during the packaging and curing process of integrated circuits.

[0031] As one possible implementation, the system can measure the input current and input voltage of the curing oven in real time, calculate the real-time power of the curing oven based on the product of the input current and input voltage, and use the real-time power as the real-time energy output of the curing oven.

[0032] S2, obtain the energy output reference of the curing oven to maintain the preset temperature when there is no product curing.

[0033] Among them, the "no product curing state" refers to the curing oven curing without any product being cured.

[0034] As one possible implementation, the system can record the average power consumption over a period of time when the curing oven is running unloaded and stable at a preset temperature, and use this average power consumption as a reference for the energy output of the curing oven to maintain the preset temperature when there is no product curing.

[0035] S3. Based on the cumulative result of the difference between the real-time energy output and the energy output reference, calculate the total energy released by the solidification reaction at the current time, and determine the solidification energy endpoint if the total energy is greater than or equal to the preset total heat release threshold.

[0036] Among them, the curing energy endpoint is the curing completion time determined based on the energy of the curing reaction.

[0037] As one possible implementation, the system can calculate and accumulate the difference between the real-time energy output and an energy output reference to obtain the total energy released by the solidification reaction at that time. When this accumulated total energy reaches or exceeds a preset total heat release threshold, the system determines the solidification energy endpoint.

[0038] This provides a curing completion time assessment based on the total heat released by the chemical reaction, which can comprehensively reflect the degree of completion of the curing reaction and avoids excessive reliance on instantaneous rates.

[0039] S4. Obtain the curing rate endpoint based on the curing rate change.

[0040] The curing rate endpoint corresponds to a curing rate less than the curing rate threshold. The curing rate endpoint is the curing completion time determined based on the curing rate of the curing reaction.

[0041] As one possible implementation, the system can calculate the curing rate in real time based on changes in physical parameters. When the curing rate drops below a preset curing rate threshold, the curing rate endpoint is determined.

[0042] For example, a dielectric analysis sensor can be used, with its probe placed inside a curing oven in contact with the integrated circuit packaging material to be cured. This sensor monitors dielectric properties such as the material's dielectric constant or loss factor in real time. A calculation unit receives these parameters and calculates the curing rate based on their rate of change over time. When the calculated curing rate drops below a preset curing rate threshold, for example, a rate of change of 0.01% per minute, the calculation unit records the current time as the curing rate endpoint.

[0043] As another possible implementation, the system can monitor the dielectric properties of the curing material in real time. The curing material is the material used to package and cure integrated circuits. Based on the changing trend of the dielectric properties, a specific time point can be identified, and the curing rate endpoint can be determined based on the specific time point.

[0044] The specific time point refers to the point in time that indicates the change in the curing rate. Specifically, it can be identified by analyzing the first or second derivatives of dielectric property parameters, such as the inflection point or the beginning of the plateau period in the rate of change of the dielectric constant.

[0045] Dielectric properties parameters refer to the electrical properties exhibited by a material under the influence of an electric field. Specifically, they may include dielectric constant, dielectric loss factor, or conductivity, and their purpose is to directly reflect the changes in molecular structure and the degree of cross-linking within the cured material.

[0046] In one example, during the encapsulation and curing process of an integrated circuit, a dielectric sensor is brought into direct or indirect contact with the curing material. This dielectric sensor can be a parallel-plate capacitor or a comb-electrode sensor, with its electrodes capacitively coupled to the curing material. By applying an alternating electric field to the sensor and measuring the current and voltage passing through the curing material in real time, the dielectric constant and dielectric loss factor of the curing material can be calculated. This data on dielectric properties can be continuously acquired and transmitted to a data processing unit. The data processing unit can be a microcontroller or an application-specific integrated circuit (ASIC) running an algorithm. This algorithm can smooth and differentiate the real-time acquired dielectric property data to obtain the rate of change of the dielectric properties over time. For example, the derivative of the dielectric constant with respect to time can be calculated. When the rate of change of the dielectric constant drops below a preset threshold and remains stable for a period of time, the data processing unit can identify this time point as a specific time point indicating a change in the curing rate. For example, a specific time point can be considered reached when the rate of change of the dielectric constant is below 0.001 / second for 10 consecutive seconds. Once this specific time point is identified, the system determines it as the end point of the curing rate and records its timestamp for use by subsequent curing time control logic.

[0047] S5. When there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time, an abnormal alarm is triggered to control the curing time of the encapsulation curing process.

[0048] The preset difference refers to the allowable time deviation range between the curing energy endpoint and the curing rate endpoint. It can be achieved by setting a time window or a percentage deviation, such as ±5 minutes or ±10% time difference. This is mainly to allow fluctuations between the two different judgment methods and avoid misjudgment due to small deviations.

[0049] Among them, the preset association refers to a relationship between the time corresponding to the end of the curing rate and the preset minimum curing time. It can be achieved by the time difference being within a certain range or by satisfying logical conditions, such as the time difference being less than or greater than a certain threshold. Its main purpose is to combine the curing rate judgment result with process safety rules to identify potential process anomalies.

[0050] Triggering an anomaly alarm to control the curing time of the packaging and curing process can refer to operators controlling the curing time of the packaging and curing process based on the anomaly alarm.

[0051] As one possible implementation, the system can generate different types of diagnostic alarm information based on the time difference between the curing energy endpoint and the curing rate endpoint, as well as the time difference between the curing rate endpoint and the preset minimum curing time. Furthermore, based on the different types of diagnostic alarm information, an abnormal alarm can be triggered.

[0052] Different types of diagnostic alarm information include: rate sensor contamination or material over-curing, insufficient curing or abnormal heating, and minimum curing time setting too long.

[0053] In one example, when the curing energy endpoint is earlier than the curing rate endpoint, and the difference between the curing rate endpoint and the preset minimum curing time is less than a difference threshold, the system can generate diagnostic alarm information indicating contamination of the rate sensor or over-curing of the material.

[0054] In another example, when the curing energy endpoint is later than the curing rate endpoint, the system can generate a diagnostic alarm indicating insufficient curing or abnormal heating.

[0055] In another example, when the difference between the curing energy endpoint and the curing rate endpoint is less than the difference threshold, and both the curing energy endpoint and the curing rate endpoint are earlier than the preset minimum curing time, a diagnostic alarm message indicating that the minimum curing time setting is too long is generated.

[0056] For example, when the system detects that the curing energy endpoint is at 100 seconds, the curing rate endpoint is at 120 seconds, and the preset minimum curing time is 125 seconds, if the difference (5 seconds) between the curing rate endpoint of 120 seconds and the preset minimum curing time of 125 seconds is less than a preset difference threshold (e.g., 10 seconds), the system will determine it to be the first type of abnormality, i.e., generate a diagnostic alarm indicating rate sensor contamination or material over-curing. This prompts the operator to check whether the rate sensor is contaminated or to assess whether the current batch of material has a tendency to over-cur.

[0057] In another scenario, if the system detects that the curing energy endpoint is at 150 seconds, while the curing rate endpoint is at 130 seconds (meaning the curing energy endpoint is later than the curing rate endpoint), the system will immediately generate a diagnostic alarm indicating insufficient curing or abnormal heating. This prompts the operator to check whether the curing oven's heating system is functioning properly or whether the material meets the process requirements.

[0058] In another scenario, if the curing energy endpoint is at 90 seconds and the curing rate endpoint is at 92 seconds, and the difference between them (2 seconds) is less than the difference threshold (e.g., 5 seconds), and both the curing energy endpoint (90 seconds) and the curing rate endpoint (92 seconds) are earlier than the preset minimum curing time (e.g., 120 seconds), the system will generate a diagnostic alarm indicating that the minimum curing time setting is too long. This indicates that the curing process has been completed ahead of schedule, and shortening the minimum curing time can be considered to improve production efficiency and reduce energy consumption.

[0059] Understandably, this logical design effectively identifies anomalies that are difficult to detect using traditional methods. For example, if the rate sensor malfunctions due to contamination, causing the curing rate endpoint to be incorrectly delayed, but the actual total heat release of the curing reaction has already met the target, the curing energy endpoint will be earlier than or significantly deviate from the curing rate endpoint, thus triggering an alarm. Similarly, if the minimum curing time is set improperly, leading to over-curing or insufficient curing, this multi-dimensional correlation analysis can also detect the problem in a timely manner. It is precisely because of this dual judgment mechanism of energy and rate, combined with consideration of the minimum curing time, that this solution can effectively break the self-locking loop that traditional control systems may fall into, providing reliable curing time control.

[0060] Because the curing process is affected by a variety of factors, such as material batch differences and equipment condition fluctuations, the relationship between the curing energy endpoint and the curing rate endpoint, as well as their relationship with the preset minimum curing time, is not fixed. If only a fixed time difference range is used to determine whether there is an anomaly, it may lead to misjudgment or omission, thereby affecting the curing quality and efficiency.

[0061] In this regard, such as Figure 2 As shown, this application further proposes a step to trigger an abnormal alarm when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and when the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time. The steps include:

[0062] S101. The time required for the total energy released by the curing reaction to reach a preset percentage.

[0063] The preset percentage refers to the proportion by which the total energy released by the curing reaction reaches its theoretical maximum value or a specific reference value. It can be set using values ​​such as 80%, 90%, or 95%, with the aim of selecting an energy release point that can represent the completion of the main process of the curing reaction.

[0064] As one possible implementation, the system can continuously monitor the real-time energy output of the curing oven during the integrated circuit packaging and curing process, and calculate the total energy released by the curing reaction by combining the energy output in the absence of product curing. When this total energy reaches 90% of the preset value, the system records this moment as the time required for the total energy released by the curing reaction to reach the preset percentage.

[0065] S102. Based on the time required for the total energy released by the curing reaction to reach a preset percentage, dynamically determine the first allowable time difference range between the curing energy endpoint and the curing rate endpoint.

[0066] As one possible implementation, the system can determine the allowable first time difference range between the curing energy endpoint and the curing rate endpoint based on the following steps:

[0067] S1021. Obtain the energy release rate characteristics of the curing reaction in the initial stage and the energy release duration characteristics of the curing reaction in the later stage.

[0068] Among them, the energy release rate characteristic of the curing reaction in the initial stage refers to the rate of change of heat released per unit time at the beginning of the curing reaction.

[0069] Among them, the energy release duration characteristic in the later stage of the curing reaction refers to the length of time the energy release process lasts when the curing reaction is close to completion.

[0070] One possible approach is to calculate the maximum slope or the average slope over a specific time period from the initial exothermic peak region of the DSC curve to obtain the energy release rate characteristics of the curing reaction in the initial stage. Simultaneously, to obtain the energy release duration characteristics of the curing reaction in the later stages, the tail of the exothermic peak in the DSC curve can be observed. After the energy release rate drops to a certain extremely low threshold and persists for a period of time, the time from that threshold point until the energy release completely stops can be recorded.

[0071] For example, during the first 5 minutes after the curing reaction begins, the energy release rate is recorded every 10 seconds, and the average or maximum value of these rates is calculated as a characteristic of the initial stage.

[0072] S1022. Evaluate the dynamic characteristics of the curing process of the current batch based on the time required for the total energy released by the curing reaction to reach a preset percentage, the energy release rate characteristics in the initial stage, and the energy release duration characteristics in the later stage.

[0073] Among them, the dynamic characteristics of the curing process refer to the comprehensive performance of multiple dimensions such as energy release, rate change and time consumption throughout the entire process of the curing reaction from start to finish.

[0074] As one possible implementation, the system can use a pre-trained machine learning model, such as a support vector machine (SVM) or a neural network, to evaluate the dynamic characteristics of the current batch's curing process based on the time required for the total energy released by the curing reaction to reach a preset percentage, the energy release rate characteristics of the initial stage obtained above, and the energy release duration characteristics of the later stage.

[0075] It should be noted that this model can be trained based on a large amount of historical curing data to learn the complex relationship between different combinations of curing parameters and the dynamic characteristics of the actual curing process.

[0076] S1023. Based on the dynamic characteristics of the curing process, determine the first allowable time difference range between the curing energy endpoint and the curing rate endpoint.

[0077] The first time difference range refers to the upper and lower limits of the allowable time difference between the curing energy endpoint and the curing rate endpoint.

[0078] As one possible implementation, the system can display the dynamic characteristics of the curing process, showing that the curing reaction of the current batch starts rapidly and decays steadily in the later stage. The system can correspondingly set the first time difference range to a narrower interval to improve the sensitivity of anomaly detection.

[0079] Conversely, if the dynamic characteristics of the curing process show that the curing reaction starts slowly or there is a tailing phenomenon in the later stage, the first time difference range can be appropriately widened to avoid false alarms.

[0080] Understandably, this dynamic adjustment mechanism makes the setting of the time difference range more flexible and precise, and can adapt to the curing differences under different batches of materials and process conditions.

[0081] S103. Based on the time required for the total energy released by the curing reaction to reach a preset percentage, dynamically determine the allowable second time difference range between the curing rate endpoint and the preset minimum curing time.

[0082] As one possible implementation, the system can determine the allowable second time difference range between the curing energy endpoint and the curing rate endpoint based on the following steps:

[0083] S1031. Obtain the rate of decrease in the energy release rate of the curing reaction during the later stage of curing.

[0084] The rate of decrease in the energy release rate of the curing reaction in the later stages of curing refers to the trend of the rate at which energy is released per unit time as the curing reaction nears completion. This can be specifically calculated by differentiating or fitting the energy release rate curve, with the aim of quantifying the speed at which the curing reaction transitions from active to gradual.

[0085] As one possible approach, the system can obtain the rate of decrease in the energy release rate of the curing reaction in the later stages of curing by numerically differentiating the energy release rate curve or by using a sliding window linear fitting method.

[0086] S1032. Obtain the duration during which the energy release rate of the curing reaction is lower than the release rate threshold in the later stage of curing.

[0087] The duration during which the energy release rate of the curing reaction is below the release rate threshold in the later stages of curing refers to the length of time that the energy release rate of the curing reaction remains below a preset low value. This can be specifically achieved by monitoring the energy release rate and timing it, with the aim of determining whether the curing reaction has been fully completed and reached a stable state.

[0088] As one possible implementation, the system can set a release rate threshold. When the energy release rate is lower than the threshold, a timer is started to continuously monitor the duration for which the energy release rate of the curing reaction is lower than the release rate threshold in the later stage of curing.

[0089] S1033. Evaluate the completion characteristics of the curing reaction based on the time required for the total energy released by the curing reaction to reach a preset percentage, the rate of decrease in the later stage of curing, and the duration of the later stage of curing when the energy is below the release rate threshold.

[0090] The completion characteristics of the curing reaction refer to a comprehensive evaluation of the overall process and final state of the curing reaction. This can be achieved by analyzing and modeling data from multiple dimensions, such as the time required for the total energy released by the curing reaction to reach a preset percentage, the rate of energy reduction in the later stages of curing, and the duration of the later stages of curing when the energy is below the release rate threshold. The aim is to provide a comprehensive indicator to reflect the degree and quality of the curing reaction.

[0091] As one possible implementation, the system could construct a multivariate model, taking these three parameters as input and outputting a comprehensive score or classification result representing the degree of solidification completion. Alternatively, a lookup table could be pre-built, containing solidification completion characteristic levels corresponding to different parameter combinations.

[0092] S1034. Based on the curing reaction completion characteristics, dynamically determine the allowable second time difference range between the curing rate endpoint and the preset minimum curing time.

[0093] The dynamic determination of the allowable second time difference range between the curing rate endpoint and the preset minimum curing time refers to flexibly adjusting the allowable time deviation range between the curing rate endpoint and the preset minimum curing time based on the specific curing reaction characteristics in real time or for each batch. This can be achieved by establishing a mathematical model or lookup table based on the curing reaction completion characteristics. The purpose is to enable the curing time control system to adapt to the curing behavior under different material or process conditions, avoiding misjudgments or unnecessary over-curing caused by a fixed time difference range.

[0094] As one possible implementation, the system can set a small second time difference range based on a preset mapping relationship, provided that the curing reaction completion characteristics are stable and sufficient, to ensure tight control of the curing time. Conversely, if the completion characteristics indicate fluctuations or uncertainties in the curing process, the system can widen the second time difference range based on the preset mapping relationship to provide greater tolerance.

[0095] It should be noted that the mapping relationship includes the mapping relationship between different curing reaction completion characteristics and different second time difference ranges.

[0096] Understandably, this dynamic adjustment can be achieved based on a preset set of rules, adaptive algorithms, or machine learning models, thereby ensuring that the second time difference range can accurately reflect the actual situation of the current solidified batch and avoid misjudgment caused by a fixed time difference range.

[0097] S104. When the time difference between the curing energy endpoint and the curing rate endpoint exceeds the first time difference range, and the time difference between the curing rate endpoint and the preset minimum curing time is within the second time difference range, an abnormal alarm is triggered.

[0098] Among them, the abnormal alarm can be manifested as the warning light on the curing oven control panel flashing and a buzzer sounding. At the same time, specific abnormal information is displayed on the operation interface, such as "The deviation between curing energy and the rate endpoint is too large. Please check the sensor or material batch" or "The correlation between the curing rate endpoint and the minimum curing time is abnormal. Please check the process parameter settings." Relevant data logs are also recorded for subsequent analysis and traceability.

[0099] However, in its implementation, simply considering the characteristics of the curing reaction itself may not be comprehensive enough, as it ignores the influence of the curing oven's own state on the curing process. For example, temperature fluctuations in the curing oven during the later stages of the curing reaction may affect the curing rate, and thus affect the determination of the curing rate endpoint. Therefore, it is necessary to consider the temperature fluctuation characteristics of the curing oven and adjust the original time difference range to improve the accuracy of curing time control.

[0100] In this regard, this application further proposes a step for dynamically determining the allowable second time difference range between the curing rate endpoint and the preset minimum curing time, including:

[0101] S201. Based on the characteristics of the curing reaction completion, the allowable original time difference range between the curing rate endpoint and the preset minimum curing time is initially determined.

[0102] The initial time difference range refers to the allowable time difference between the initially determined curing rate endpoint and the preset minimum curing time, considering only the curing reaction's own completion characteristics. Its purpose is to provide an initial reference based on the chemical reaction characteristics of the material.

[0103] As one possible implementation, the system can utilize a curing characteristic evaluation module that receives data from a differential scanning calorimeter or a dielectric curing monitoring system, analyzes the exothermic curve or dielectric constant change curve of the curing reaction, thereby evaluating the completion characteristics of the curing reaction and outputting an initial time difference range.

[0104] For example, this range could be a baseline value preset based on historical data and material type, and fine-tuned according to the curing characteristics of the current batch.

[0105] S202. Obtain the temperature fluctuation characteristics of the curing oven in the later stage of the curing reaction.

[0106] Among them, the temperature fluctuation characteristics of the curing oven in the later stage of the curing reaction refer to the amplitude and frequency of the internal temperature change over time when the curing reaction is nearing completion. It can be obtained by collecting data using a real-time temperature sensor array and by using statistical analysis methods, such as calculating parameters such as the standard deviation, maximum deviation or fluctuation frequency of the temperature. The purpose is to quantify the potential impact of the curing oven environment on the curing process.

[0107] As one possible implementation, the system can deploy multiple thermocouples or platinum resistance temperature sensors at key locations inside the curing oven. These sensors collect oven temperature data in real time and transmit the data to a temperature monitoring and analysis unit. This analysis unit can perform statistical processing on the collected temperature data, such as calculating the standard deviation of temperature, the maximum temperature deviation, or the root mean square value of the temperature change rate during the later stages of the curing reaction (e.g., a specific time period after the curing rate falls below a threshold), using these statistics as temperature fluctuation characteristics.

[0108] S203. Based on the temperature fluctuation characteristics, the original time difference range is adjusted to obtain the second allowable time difference range between the curing rate endpoint and the preset minimum curing time.

[0109] As one possible implementation, when the temperature fluctuation characteristics show that the standard deviation of the furnace temperature is greater than or equal to the temperature threshold, the adjustment module can increase the upper limit and decrease the lower limit of the original time difference range according to the preset correction factor, so as to expand the allowable fault tolerance space.

[0110] Conversely, if the temperature fluctuation characteristics show that the standard deviation of the furnace temperature is less than the temperature threshold, the adjustment module can tighten the original time difference range, for example, by reducing the upper limit and increasing the lower limit, thereby improving the precision of control.

[0111] In this way, the final output second time difference range can more accurately reflect the actual solidification environment, providing a reliable basis for subsequent abnormal alarm triggering.

[0112] This application further proposes steps for obtaining the curing rate endpoint based on the curing rate change, including:

[0113] S301. Real-time monitoring of the dielectric properties of the cured material.

[0114] Among them, the curing material is the material used to encapsulate and cure integrated circuits.

[0115] Dielectric properties parameters refer to the electrical properties exhibited by a material under the influence of an electric field. Specifically, they may include dielectric constant, dielectric loss factor, or conductivity, and their purpose is to directly reflect the changes in molecular structure and the degree of cross-linking within the cured material.

[0116] As one possible implementation, the system can directly or indirectly contact the dielectric sensor with the cured material during the packaging and curing process of the integrated circuit. This dielectric sensor can be a parallel-plate capacitor or a comb-electrode sensor, with its electrodes capacitively coupled to the cured material. By applying an alternating electric field to the sensor and measuring the current and voltage passing through the cured material in real time, the dielectric constant and dielectric loss factor of the cured material can be calculated, allowing for real-time monitoring of the dielectric properties of the cured material.

[0117] S302. Identify specific time points based on the changing trends of dielectric characteristic parameters.

[0118] Among them, a specific time point refers to a critical moment in the trend of dielectric property parameter changes that can indicate a significant change in the curing reaction rate. Specifically, it can be identified by analyzing the first or second derivative of the dielectric property parameter, such as the inflection point or the beginning of the plateau period of the rate of change of the dielectric constant. The purpose is to accurately capture the key stage of the curing reaction.

[0119] As one possible implementation, the system can smooth and differentiate the dielectric property parameter data collected in real time to obtain the rate of change of the dielectric property parameter over time. When the rate of change drops below a preset threshold and remains stable for a period of time, this time point is identified as a specific time point indicating the change in the curing rate.

[0120] For example, the system can calculate the derivative of the dielectric constant with respect to time. When the rate of change of the dielectric constant drops below a preset threshold and remains stable over a period of time, this time point is identified as a specific time point indicating a change in the curing rate.

[0121] S303. Determine the curing rate endpoint based on a specific time point.

[0122] As one possible implementation, the system can use a specific point in time as the endpoint of the curing rate.

[0123] For example, a specific time point can be defined as when the rate of change of the dielectric constant is below 0.001 / second for 10 consecutive seconds. Once this specific time point is identified, the system determines it as the curing rate endpoint and records its timestamp for use by subsequent curing time control logic. For example, the timestamp of this curing rate endpoint can be compared with the curing energy endpoint to determine if there are any process abnormalities.

[0124] like Figure 3 As shown, this embodiment of the invention also provides an integrated circuit packaging curing time control system. The system includes:

[0125] The first acquisition module is used to acquire the real-time energy output of the curing oven during the process of packaging and curing integrated circuits in the curing oven; the internal temperature of the curing oven is a preset temperature.

[0126] The second acquisition module is used to acquire the energy output reference of the curing oven in the state of no product curing;

[0127] The energy endpoint determination module is used to calculate the total energy released by the curing reaction at the current time based on the cumulative result of the difference between the real-time energy output and the energy output reference, and to determine the curing energy endpoint if the total energy is greater than or equal to the preset total heat release threshold; the curing energy endpoint is the curing completion time based on the energy judgment of the curing reaction.

[0128] The rate endpoint acquisition module is used to acquire the curing rate endpoint based on the change in curing rate; the curing rate corresponding to the curing rate endpoint is less than the curing rate threshold; the curing rate endpoint is the curing completion time determined based on the curing rate of the curing reaction.

[0129] The alarm triggering module is used to trigger an abnormal alarm when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and when the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time, so as to control the curing time of the encapsulation curing process.

[0130] This invention also provides a terminal device. The terminal device includes a processor, a memory, and a computer program stored in the memory and executable on the processor, such as an integrated circuit packaging curing time control program. When the processor executes the computer program, it implements the steps in the various integrated circuit packaging curing time control method embodiments described above. Alternatively, when the processor executes the computer program, it implements the functions of each module / unit in the various system embodiments described above.

[0131] For example, a computer program can be divided into one or more modules / units, one or more of which are stored in memory and executed by a processor to complete the present invention. One or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in a terminal device.

[0132] Terminal devices can be computing devices such as desktop computers, laptops, PDAs, and smart tablets. Terminal devices may include, but are not limited to, processors and memory. Those skilled in the art will understand that the above-described components are merely examples of terminal devices and do not constitute a limitation on the terminal device. The device may include more or fewer components than described above, or a combination of certain components, or different components. For example, a terminal device may also include input / output devices, network access devices, buses, etc.

[0133] The processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor. The processor is the control center of the terminal device, connecting all parts of the terminal device through various interfaces and lines.

[0134] Memory can be used to store computer programs and / or modules. The processor implements various functions of the terminal device by running or executing the computer programs and / or modules stored in the memory, and by accessing data stored in the memory. Memory can mainly include a program storage area and a data storage area. The program storage area can store the operating system, application programs required for at least one function (such as sound playback function, image playback function, etc.), etc.; the data storage area can store data created based on the use of the mobile phone (such as audio data, phonebook, etc.). In addition, memory can include high-speed random access memory, and can also include non-volatile memory, such as hard disk, RAM, plug-in hard disk, SmartMedia Card (SMC), Secure Digital (SD) card, Flash Card, at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0135] If the modules / units integrated into the terminal device are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of the present invention can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or system capable of carrying computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium does not include electrical carrier signals and telecommunication signals.

[0136] It should be noted that the system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Furthermore, in the accompanying drawings of the system embodiments provided by this invention, the connection relationships between modules indicate that they have communication connections, which can be specifically implemented as one or more communication buses or signal lines. Those skilled in the art can understand and implement this without any creative effort.

[0137] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention in detail. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention for those skilled in the art.

Claims

1. A method for controlling the curing time of integrated circuit packaging, characterized in that, include: During the process of packaging and curing integrated circuits using a curing oven, the real-time energy output of the curing oven is obtained; The internal temperature of the curing oven is a preset temperature; Obtain a reference energy output for maintaining the preset temperature in the curing oven when there is no product curing; Based on the cumulative result of the difference between the real-time energy output and the energy output reference, the total energy released by the curing reaction at the current time is calculated, and if the total energy is greater than or equal to the preset total heat release threshold, the curing energy endpoint is determined. The curing energy endpoint is the curing completion time determined based on the energy of the curing reaction; Obtain the curing rate endpoint based on the change in curing rate; The curing rate endpoint corresponds to a curing rate that is less than the curing rate threshold; the curing rate endpoint is the curing completion time determined based on the curing rate of the curing reaction. When there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is preset to be correlated with the preset minimum curing time, an abnormal alarm is triggered to control the curing time of the encapsulation curing process. When there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is correlated with a preset minimum curing time, an abnormal alarm is triggered, including: Based on the time difference between the curing energy endpoint and the curing rate endpoint, and the time difference between the curing rate endpoint and the preset minimum curing time, different types of diagnostic alarm information are generated; the different types of diagnostic alarm information include: rate sensor contamination or material over-curing, insufficient curing or abnormal heating, and minimum curing time set too long; The abnormal alarm is triggered based on the different types of diagnostic alarm information.

2. The integrated circuit packaging curing time control method according to claim 1, characterized in that, The generation of different types of diagnostic alert information includes: When the curing energy endpoint is earlier than the curing rate endpoint, and the difference between the curing rate endpoint and the preset minimum curing time is less than the difference threshold, a diagnostic alarm message indicating contamination of the rate sensor or over-curing of the material is generated. When the curing energy endpoint is later than the curing rate endpoint, a diagnostic alarm message indicating insufficient curing or abnormal heating is generated; When the difference between the curing energy endpoint and the curing rate endpoint is less than the difference threshold, and both the curing energy endpoint and the curing rate endpoint are earlier than the preset minimum curing time, a diagnostic alarm message indicating that the minimum curing time setting is too long is generated.

3. The integrated circuit packaging curing time control method according to claim 1, characterized in that, When there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is correlated with a preset minimum curing time, an abnormal alarm is triggered, including: The time required for the total energy released by the curing reaction to reach a preset percentage; Based on the time required for the total energy released by the curing reaction to reach a preset percentage, the allowable first time difference range between the curing energy endpoint and the curing rate endpoint is dynamically determined; Based on the time required for the total energy released by the curing reaction to reach a preset percentage, a second allowable time difference range between the curing rate endpoint and the preset minimum curing time is dynamically determined. An abnormal alarm is triggered when the time difference between the curing energy endpoint and the curing rate endpoint exceeds the first time difference range, and the time difference between the curing rate endpoint and the preset minimum curing time is within the second time difference range.

4. The integrated circuit packaging curing time control method according to claim 3, characterized in that, The step of dynamically determining the allowable first time difference range between the curing energy endpoint and the curing rate endpoint based on the time required for the total energy released by the curing reaction to reach a preset percentage includes: Obtain the energy release rate characteristics of the curing reaction in the initial stage; Obtain the energy release duration characteristics of the curing reaction in the later stage; The dynamic characteristics of the curing process of the current batch are evaluated based on the time required for the total energy released by the curing reaction to reach a preset percentage, the energy release rate characteristics of the initial stage, and the energy release duration characteristics of the later stage. Based on the dynamic characteristics of the curing process, a first allowable time difference range between the curing energy endpoint and the curing rate endpoint is determined.

5. The method for controlling the curing time of integrated circuit packaging according to claim 3, characterized in that, The step of dynamically determining the allowable second time difference range between the curing rate endpoint and the preset minimum curing time, based on the time required for the total energy released by the curing reaction to reach a preset percentage, includes: The rate at which the energy release rate of the curing reaction decreases in the later stages of curing is obtained; The duration during which the energy release rate of the curing reaction is below the release rate threshold in the later stages of curing is determined. The completion characteristics of the curing reaction are evaluated based on the time required for the total energy released by the curing reaction to reach a preset percentage, the rate of decrease in the later stage of curing, and the duration of the later stage of curing when the energy is below the release rate threshold. Based on the curing reaction completion characteristics, a second allowable time difference range between the curing rate endpoint and the preset minimum curing time is dynamically determined.

6. The integrated circuit packaging curing time control method according to claim 5, characterized in that, The step of dynamically determining the allowable second time difference range between the curing rate endpoint and the preset minimum curing time based on the curing reaction completion characteristics includes: Based on the curing reaction completion characteristics, the allowable original time difference range between the curing rate endpoint and the preset minimum curing time is initially determined; The temperature fluctuation characteristics of the curing oven in the later stage of the curing reaction were obtained; Based on the temperature fluctuation characteristics, the original time difference range is adjusted to obtain a second allowable time difference range between the curing rate endpoint and the preset minimum curing time.

7. The integrated circuit packaging curing time control method according to claim 1, characterized in that, The process of obtaining the real-time energy output of the curing oven includes: The input current and input voltage of the curing oven are measured in real time. The real-time power of the curing oven is calculated based on the input current and the input voltage. The real-time power is used as the real-time energy output of the curing oven.

8. The method for controlling the curing time of integrated circuit packaging according to claim 1, characterized in that, The process of obtaining the curing rate endpoint based on the curing rate change includes: Real-time monitoring of dielectric properties of the cured material; the cured material is a material used for encapsulating and curing integrated circuits. Based on the changing trend of the dielectric property parameters, a specific time point is identified; the specific time point is the time point indicating the change in the curing rate. The curing rate endpoint is determined based on the specific time point.

9. An integrated circuit packaging curing time control system, used for controlling the curing time of integrated circuit packaging, characterized in that, The system includes: The first acquisition module is used to acquire the real-time energy output of the curing oven during the process of packaging and curing integrated circuits in the curing oven; the internal temperature of the curing oven is a preset temperature. The second acquisition module is used to acquire the energy output reference of the curing oven in a state where no product is being cured; The energy endpoint determination module is used to calculate the total energy released by the curing reaction at the current time based on the cumulative result of the difference between the real-time energy output and the energy output reference, and to determine the curing energy endpoint if the total energy is greater than or equal to a preset total heat release threshold; the curing energy endpoint is the curing completion time based on the energy of the curing reaction. The rate endpoint acquisition module is used to acquire the curing rate endpoint based on the change in curing rate; the curing rate endpoint corresponds to a curing rate that is less than a curing rate threshold; the curing rate endpoint is the curing completion time determined based on the curing rate of the curing reaction. An alarm triggering module is used to trigger an abnormal alarm when there is a preset difference between the curing energy endpoint and the curing rate endpoint, and when the time corresponding to the curing rate endpoint is associated with a preset minimum curing time, so as to control the curing time of the encapsulation curing process. When there is a preset difference between the curing energy endpoint and the curing rate endpoint, and the time corresponding to the curing rate endpoint is correlated with a preset minimum curing time, an abnormal alarm is triggered, including: Based on the time difference between the curing energy endpoint and the curing rate endpoint, and the time difference between the curing rate endpoint and the preset minimum curing time, different types of diagnostic alarm information are generated; the different types of diagnostic alarm information include: rate sensor contamination or material over-curing, insufficient curing or abnormal heating, and minimum curing time set too long; The abnormal alarm is triggered based on the different types of diagnostic alarm information.

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