Colloid functional sheet of touch panel

Abstract

The invention discloses a touchpad colloidal functional sheet which comprises a colloidal functional sheet and an OC insulating layer, the OC insulating layer is composed of a first OC insulating layer, a second OC insulating layer and a third OC insulating layer, the first OC insulating layer is arranged on the upper surface of the colloidal functional sheet, a copper foil layer is attached to the upper surface of the first OC insulating layer, and the third OC insulating layer is arranged on the upper surface of the second OC insulating layer. The second OC insulating layer is arranged on the upper surface of the copper foil layer, the copper foil wiring layer is attached to the upper surface of the second OC insulating layer, and the third OC insulating layer is arranged on the upper surface of the copper foil wiring layer. The colloidal functional sheet of the touch panel effectively solves the problem of insufficient adhesive force in the traditional printing process, and also obviously enhances the conduction performance of a circuit; meanwhile, the copper foil has a good electromagnetic shielding characteristic and can effectively resist external electromagnetic interference, a more stable signal transmission environment is provided for a touch control system, and the overall performance of a product is greatly improved.

Description

Technical Field

[0001] This invention relates to circuit board processing, and more particularly to a touch panel adhesive functional sheet. Background Technology

[0002] The film sensor in the touchpad is the sensing part of the capacitive screen in the touch display industry. It is made of flexible material and usually has a single-layer or multi-layer structure. It is mainly used for input function after the capacitive display screen and the liquid crystal display screen are assembled into a whole. It has the characteristics of high strength and easy input.

[0003] Traditional touchpad adhesive functional sheets primarily employ a technology involving screen-printed OC insulating layers, Ag circuitry, and ACF bonding. However, this process has significant limitations: Firstly, in existing designs, the spacing between pads is only 0.37mm or 0.2mm, while the printing tolerance for screen printing is as high as ±0.3mm. This leads to frequent screen printing process deviations, severely impacting product yield and performance stability, and hindering efficiency improvements. Secondly, using Ag as a conductive material not only results in high costs but also leaves room for improvement in its conductivity, and its adhesion to the substrate during printing is poor. Furthermore, exposed Ag circuitry is highly susceptible to oxidation by the external environment, leading to blackening and affecting product stability and lifespan. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a touchpad adhesive functional sheet that can improve the performance and reliability of the touchpad adhesive functional sheet.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0006] A touchpad adhesive functional sheet includes an adhesive functional sheet and an OC insulating layer. The OC insulating layer is composed of a first OC insulating layer, a second OC insulating layer, and a third OC insulating layer. The first OC insulating layer is disposed on the upper surface of the adhesive functional sheet, and a copper foil layer is attached to the upper surface of the first OC insulating layer. The second OC insulating layer is disposed on the upper surface of the copper foil layer, and a copper foil trace layer is attached to the upper surface of the second OC insulating layer. The third OC insulating layer is disposed on the upper surface of the copper foil trace layer.

[0007] Furthermore, the first OC insulating layer is screen-printed on the upper surface of the adhesive functional sheet, and the second OC insulating layer is screen-printed on the upper surface of the copper foil layer; windows are formed on the first and second OC insulating layers by laser cutting to create pre-reserved positions for conductive paths; the first OC insulating layer and the copper foil layer, as well as the second OC insulating layer and the copper foil trace layer, are connected through the windows.

[0008] Furthermore, a laser cutter is used to create windows on the copper foil layer according to the wiring path. The window positions on the copper foil layer are the same as the reserved positions on the conductive paths of the first OC insulating layer and the second OC insulating layer.

[0009] Furthermore, the copper foil trace layer includes a varistor electrode pad, an ACF pad, a TX pad, an RX pad, and a CU circuit processed by laser cutting. The CU circuit interconnects the varistor electrode pad, the ACF pad, the TX pad, and the RX pad.

[0010] Furthermore, the thickness of both the varistor electrode pad and the ACF pad is 25 μm.

[0011] Furthermore, the thickness of the first OC insulating layer is 60 μm, the thickness of the copper foil layer is 4-7 μm, the thickness of the second OC insulating layer is 10 μm, the thickness of the copper foil trace layer is 4-7 μm, and the thickness of the third OC insulating layer is 10 μm.

[0012] Compared with the prior art, the advantages of this invention are: this touch panel adhesive functional sheet effectively solves the problem of insufficient adhesion in traditional printing processes and significantly enhances the conductivity of the circuit; at the same time, the copper foil itself has good electromagnetic shielding properties, which can effectively resist external electromagnetic interference, provide a more stable signal transmission environment for the touch system, and greatly improve the overall performance of the product. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of a composite structure of adhesive functional sheets for a touchpad according to the present invention;

[0015] Figure 2 This is a schematic diagram of the planar structure of the first OC insulating layer in a touchpad adhesive functional sheet according to the present invention;

[0016] Figure 3 This is a schematic diagram of the planar structure of the copper foil layer in the adhesive functional sheet of a touch panel according to the present invention;

[0017] Figure 4 This is a schematic diagram of the planar structure of the second OC insulating layer in a touchpad adhesive functional sheet according to the present invention;

[0018] Figure 5This is a schematic diagram of the planar structure of the copper foil trace layer in the adhesive functional sheet of a touch panel according to the present invention.

[0019] In the diagram: 1. Adhesive functional sheet; 2. First OC insulation layer; 3. Copper foil layer; 4. Second OC insulation layer; 5. Copper foil trace layer; 6. Third OC insulation layer; 7. Window. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In the description of the embodiments of the invention, it should be noted that if terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," or "outer" indicate orientation or positional relationships based on the orientation or positional relationships shown in the drawings, or the orientation or positional relationships commonly used when the product is in use, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, the use of terms such as "horizontal" or "vertical" does not imply that the component must be absolutely horizontal or vertical, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure or component must be completely horizontal, but can be slightly tilted.

[0023] In the description of the embodiments of the present invention, "multiple" means at least two.

[0024] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0025] Example

[0026] Please refer to the instruction manual attached. Figure 1 As shown, the instruction manual is attached. Figure 1 The diagram shows a schematic of a touchpad adhesive functional sheet stack according to the present invention. This touchpad adhesive functional sheet includes an adhesive functional sheet 1 and an OC insulating layer. The OC insulating layer is composed of a first OC insulating layer 2, a second OC insulating layer 4, and a third OC insulating layer 6. The thickness of the first OC insulating layer 2 is 60 μm, the thickness of the second OC insulating layer 4 is 10 μm, and the thickness of the third OC insulating layer 6 is 10 μm. The first OC insulating layer 2 is disposed on the upper surface of the adhesive functional sheet 1. Specifically, the first OC insulating layer 2 is screen-printed on the upper surface of the adhesive functional sheet 1. A copper foil layer 3 with a thickness of 4-7 μm is attached to the upper surface of the first OC insulating layer 2. The second OC insulating layer 4 is disposed on the upper surface of the copper foil layer 3. Specifically, the second OC insulating layer 4 is screen-printed on the upper surface of the copper foil layer 3. (See attached specification). Figure 2 and 4 As shown, windows 7 are formed on the first OC insulating layer 2 and the second OC insulating layer 4 by laser cutting to create a reserved position for the conductive path; the laser cutting accuracy is ±0.05mm; a copper foil trace layer 5 is attached to the upper surface of the second OC insulating layer 4, and the thickness of the copper foil trace layer 5 is 4-7μm; the third OC insulating layer 6 is disposed on the upper surface of the copper foil trace layer 5; the use of copper foil lamination to replace the traditional Ag printing process effectively avoids the high procurement cost of precious metal Ag, while introducing high-precision laser cutting technology to accurately control the amount of material used and reduce material loss caused by defects such as printing misalignment and oxidation.

[0027] See the attached instruction manual. Figure 3As shown, the copper foil layer 3 is laser-cut with a precision of ±0.05mm according to the wiring path. The opening position on the copper foil layer 3 is the same as the reserved position of the conduction path on the first OC insulating layer 2 and the second OC insulating layer 4. The first OC insulating layer 2 and the copper foil layer 3, as well as the second OC insulating layer 4 and the copper foil wiring layer 5, are connected through the window 7. The first OC insulating layer 2, the copper foil layer 3, the second OC insulating layer 4, and the copper foil wiring layer 5 can fit tightly together, and the opening positions correspond precisely, forming a stable electrical connection structure. Compared with traditional Ag materials, copper foil has higher conductivity, which can effectively reduce line resistance and enhance the stability and efficiency of signal transmission. At the same time, the excellent electromagnetic shielding properties of copper foil can resist external electromagnetic interference and avoid signal distortion or accidental contact. In addition, the copper foil and the OC insulating layer are tightly bonded after laser opening, reducing the performance degradation problem caused by poor contact.

[0028] See the attached instruction manual. Figure 5 As shown, the copper foil trace layer 5 includes a capacitor electrode pad, an ACF pad, a TX pad, an RX pad, and a CU circuit processed by laser cutting. The thickness of the capacitor electrode pad and the ACF pad is 25μm. The CU circuit interconnects the capacitor electrode pad, the ACF pad, the TX pad, and the RX pad.

[0029] This touchpad adhesive functional sheet improves production quality and product performance from the root through an innovative combination of full-surface insulating printing and laser windowing. The full-surface insulating printing technology provides a more uniform and stable insulation layer coverage, while the laser windowing process with an accuracy of ±0.05mm can accurately locate the circuit conduction area, avoiding defects such as short circuits and open circuits caused by printing errors, effectively reducing defects in the production process. At the same time, the high stability and strong shielding performance of the copper foil further enhance the reliability of signal transmission.

[0030] It effectively solves the problem of insufficient adhesion in traditional printing processes and significantly enhances the conductivity of the circuit. At the same time, the copper foil itself has good electromagnetic shielding properties, which can effectively resist external electromagnetic interference, provide a more stable signal transmission environment for the touch system, greatly improve the overall performance of the product, reduce product performance risks from the root, and provide a reliable guarantee for the stable operation of the touch panel.

[0031] It should be emphasized that the above are merely preferred embodiments of the present invention and are not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A touchpad adhesive functional sheet, comprising an adhesive functional sheet (1) and an OC insulating layer, wherein the OC insulating layer is composed of a first OC insulating layer (2), a second OC insulating layer (4), and a third OC insulating layer (6), characterized in that: The first OC insulating layer (2) is disposed on the upper surface of the adhesive functional sheet (1), and a copper foil layer (3) is attached to the upper surface of the first OC insulating layer (2). The second OC insulating layer (4) is disposed on the upper surface of the copper foil layer (3), and a copper foil trace layer (5) is attached to the upper surface of the second OC insulating layer (4). The third OC insulating layer (6) is disposed on the upper surface of the copper foil trace layer (5).

2. The touchpad adhesive functional sheet according to claim 1, characterized in that: The first OC insulating layer (2) is screen-printed on the upper surface of the adhesive functional sheet (1), and the second OC insulating layer (4) is screen-printed on the upper surface of the copper foil layer (3). Windows (7) are opened on the first OC insulating layer (2) and the second OC insulating layer (4) by laser cutting to form a reserved position for the conductive path. The first OC insulating layer (2) and the copper foil layer (3) and the second OC insulating layer (4) and the copper foil trace layer (5) are connected through the windows (7).

3. The touchpad adhesive functional sheet according to claim 2, characterized in that: The copper foil layer (3) is opened by a laser cutter according to the wiring path. The opening position on the copper foil layer (3) is the same as the reserved position of the conduction path on the first OC insulating layer (2) and the second OC insulating layer (4).

4. The touchpad adhesive functional sheet according to claim 1, characterized in that: The copper foil trace layer (5) includes a varistor pad, an ACF pad, a TX pad, an RX pad, and a CU circuit processed by laser cutting. The CU circuit interconnects the varistor pad, the ACF pad, the TX pad, and the RX pad.

5. The touchpad adhesive functional sheet according to claim 4, characterized in that: The thickness of both the piezoresistive electrode pad and the ACFPad is 25 μm.

6. The touchpad adhesive functional sheet according to claim 1, characterized in that: The thickness of the first OC insulating layer (2) is 60 μm, the thickness of the copper foil layer (3) is 4-7 μm, the thickness of the second OC insulating layer (4) is 10 μm, the thickness of the copper foil trace layer (5) is 4-7 μm, and the thickness of the third OC insulating layer (6) is 10 μm.

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