Cyclone Bernoulli finger

Abstract

The invention discloses a cyclone Bernoulli finger, and belongs to the technical field of wafer carrying, the cyclone Bernoulli finger comprises a finger body, the surface of the finger body is provided with a plurality of annular vortex channels, the finger body is also internally provided with an airflow channel, and the airflow channel comprises an air inlet flow channel and an exhaust flow channel which are communicated with the vortex channels in a tangent manner; the air inlet flow channel and the air outlet flow channel respectively form an air inlet hole and an air outlet hole in the surface of the finger body. Through the arrangement of the vortex channels and the airflow channels, airflow only flows in the vortex channels parallel to the surfaces of the fingers in a cyclone shape, negative pressure can be generated in the vortex channels due to the fact that the flow speed of the airflow is high, then the negative pressure suction effect is formed on wafers, and the wafers are adsorbed and carried. Compared with the prior art, the cyclone Bernoulli finger provided by the invention does not need to replace the sucking disc, so that not only can the pollution of adhesive to a wafer be avoided, but also the condition that the finger is damaged due to the replacement of the sucking disc can be avoided.

Description

Technical Field

[0001] This invention relates to the field of wafer handling technology, and in particular to a whirlwind Bernoulli finger. Background Technology

[0002] A wafer refers to a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit component structures can be fabricated on silicon chips to create IC products with specific electrical functions. Semiconductor production and manufacturing have developed into a complete production process. Generally, this involves chip circuit design, wafer fabrication, wafer testing, wafer dicing and grinding, chip packaging, and final chip testing. The process from wafer to chip requires many steps, and each step requires transferring the wafer from one piece of equipment to another. This wafer transfer necessitates specialized handling robots, and fingers are the part of these robots that directly contact the wafer; therefore, fingers play a crucial role in wafer handling.

[0003] Bernoulli fingers are fingers designed for handling thin, extremely precise, and fragile wafers. They are equipped with suction cups that operate based on Bernoulli's principle. When compressed air is applied to the suction cups, a uniform and thin, strong airflow is generated on the working surface of the suction cups. At this time, the gas flow rate on the side of the wafer facing the suction cups is greater than the gas flow rate on the other side. Utilizing the principle that the faster the fluid velocity, the lower the pressure, a pressure difference is generated on both sides of the wafer, thereby adhering the wafer to the fingers.

[0004] However, these finger-mounted Bernoulli suction cups have the problem of needing to be replaced after long-term use. Existing Bernoulli suction cups are either fixed by adhesive or by inserting them into the mold. The adhesive method may contaminate the wafer with adhesive, while the inserting method may cause wear and even damage to the finger. Moreover, the airflow velocity inside the existing Bernoulli fingers is relatively limited, which cannot create a significant air pressure difference between the inside and outside of the Bernoulli fingers, resulting in an unsatisfactory wafer adsorption effect. At the same time, due to the high-speed airflow at the suction cup, there is often a significant airflow overflow phenomenon at the existing Bernoulli fingers, which further weakens the air pressure difference between the inside and outside of the Bernoulli fingers. Summary of the Invention

[0005] In view of the problems that may occur during the replacement of Bernoulli suction cups on fingers in the prior art, the purpose of the present invention is to provide a cyclone Bernoulli finger in order to at least partially solve the above problems.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows: A cyclone Bernoulli finger includes a finger body, the front of which is provided with an annular vortex channel; the two side walls of the vortex channel are provided with inwardly recessed auxiliary air passages, and the airflow converges into the auxiliary air passages on both sides when passing through the vortex channel. The finger body is also provided with an airflow channel that is connected to the vortex channel. External airflow enters the vortex channel from the airflow channel and flows in the vortex channel to form an internal and external air pressure difference to adsorb the wafer. The airflow channel includes an inlet airflow channel and an exhaust airflow channel. A first baffle plate inclined towards the two side walls of the inlet airflow channel is provided at the junction of the inlet airflow channel and the vortex channel to guide the airflow into the auxiliary airflow channels on both side walls of the vortex channel. An airflow guide block is also installed in the vortex channel. The airflow guide block is arranged between the inlet airflow channel and the exhaust flow. The airflow guide block cuts off the vortex channel, causing the airflow to flow from the inlet airflow channel to the exhaust flow channel in the vortex channel. It also includes an anti-slip sheet, the surface of which protrudes from the surface of the finger body. The anti-slip sheet is made of an anti-slip and anti-static material and is used to support the wafer and eliminate static electricity on the wafer.

[0007] In some preferred embodiments, the finger body is flat and is made of high-strength ceramic material by 3D printing. The finger body includes two opposing surfaces and a circumferential side, the two opposing surfaces being defined as the front and back sides, respectively, with the front of the finger body facing the wafer to be transported.

[0008] In some preferred embodiments, the air intake channel and the exhaust channel are both connected tangentially to the vortex channel. The air intake channel forms an air intake hole on the front of the finger body, and the exhaust channel forms an exhaust hole on the circumferential side of the finger body. The angle between the air intake direction of the air intake channel and the exhaust direction of the exhaust channel is configured to be 90° to 210°.

[0009] In some preferred embodiments, a circular groove is provided on the front side of the finger body, and a circular boss is provided concentrically at the bottom of the groove. The vortex channel is formed between the circumferential sidewall of the boss and the circumferential sidewall of the groove.

[0010] In some preferred embodiments, the airflow guide block is generally arc-shaped, with its inner edge diameter matching the inner diameter of the vortex channel, its outer edge diameter matching the outer diameter of the vortex channel, and its thickness matching the thickness of the boss.

[0011] In some preferred embodiments, the anti-slip sheet is disc-shaped, and a coaxial column with a small diameter is integrally formed on one side of the back of the anti-slip sheet. A connecting hole that can pass through the boss is opened on the back of the finger body. The diameter of the column is adapted to the connecting hole. When the anti-slip sheet is arranged on the surface of the boss, the column is inserted into the connecting hole. A metal connecting sleeve is coaxially embedded in the column. A connector is provided on one side of the back of the finger body. The connecting sleeve is provided with an internal thread that cooperates with the connector. The two are threadedly connected.

[0012] In some preferred embodiments, the outer circular sidewall of the boss is provided with a slot for installing an airflow guide block along the axial direction. The root of the airflow guide block has a protrusion on the side facing the center that matches the slot. The anti-slip plate has the same size as the boss and is installed concentrically. The anti-slip plate completely covers the slot and presses the protrusion at the root of the airflow guide block into the slot.

[0013] In some preferred embodiments, the front of the finger body is further provided with multiple arc-shaped steps of different diameters. The arc-shaped steps are used to position the wafer. The multiple arc-shaped steps have the same axis of symmetry and have a diameter equivalent to that of the wafer to be transported.

[0014] In some preferred embodiments, the front of the finger body is provided with a mounting groove, which is located at the center of the arc-shaped step and is symmetrically arranged along the axis of symmetry of the arc-shaped step. A sensor is provided at the intersection of the mounting groove and each arc-shaped step. The detection probe of the sensor is located at the center of the arc-shaped step. When the detection probe of the sensor detects the wafer, the edge of the wafer is completely in contact with the arc-shaped step, and the wafer is in place.

[0015] In some preferred embodiments, at least four vortex channels are provided, and they are symmetrically distributed about the axis of symmetry of the arc-shaped steps.

[0016] By adopting the above technical solution, the beneficial effects of the present invention are as follows: 1. The cyclone Bernoulli finger provided by this invention, through the arrangement of a vortex channel and an airflow channel, allows the airflow to flow in a cyclone shape only within the vortex channel parallel to the finger surface. Due to its high flow velocity, a negative pressure is generated within the vortex channel, thereby creating a negative pressure attraction effect on the wafer and achieving wafer adsorption and transport. Compared with the prior art, the cyclone Bernoulli finger provided by this invention eliminates the need to replace the suction cup, thus avoiding both adhesive contamination of the wafer and damage to the finger caused by replacing the suction cup. 2. This invention, by setting a first baffle plate in the inlet airflow channel and setting inwardly recessed auxiliary airflow channels on both sides of the vortex channel, allows the airflow to flow to both sides when passing through the first baffle plate, which can promote better airflow into the auxiliary airflow channels on both sides of the vortex channel. Since the auxiliary airflow channels are set inwardly, most of the airflow after entering the vortex channel will flow along the auxiliary airflow channels, and a small portion of the airflow will flow in the central part of the vortex channel. The airflow in the central part will form an airflow barrier, reducing the airflow escape from the auxiliary airflow channels. This design can achieve airflow and external communication, ensuring the formation of the Bernoulli mechanism, while also minimizing the reduction of airflow flow in the vortex channel caused by airflow escape, thereby reducing the internal and external pressure difference and avoiding affecting the stable adsorption of the wafer. Attached Figure Description

[0017] Figure 1 This is a front view of a whirlwind Bernoulli finger according to the present invention; Figure 2 This is a cross-sectional view of a cyclone Bernoulli finger according to the present invention; Figure 3 For along Figure 2 Sectional view of line AA in the middle; Figure 4 This is a schematic diagram of the structure at the junction of the vortex channel and the airflow channel of a cyclone Bernoulli finger according to the present invention.

[0018] In the diagram: 1-finger body, 2-vortex channel, 21-groove, 211-first annular air passage, 212-second annular air passage, 22-protrusion, 23-airflow guide block, 24-auxiliary air passage, 25-annular partition plate, 3-airflow channel, 31-inlet air passage, 32-exhaust air passage, 33-inlet port, 34-exhaust port, 35-first baffle plate, 36-second baffle plate, 37-Venturi inlet channel, 38-Venturi exhaust channel, 39-split plate, 4-anti-slip plate, 41-column, 42-connecting sleeve, 43-connector, 5-arc step, 6-sensor. Detailed Implementation

[0019] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the description of the structure of this invention shown in the accompanying drawings. They are only for the convenience of describing this invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] The terms "first" and "second" in this technical solution are merely designations for corresponding structures that are identical or similar, or that perform similar functions. They do not represent an arrangement of the importance of these structures, nor do they imply any ranking, comparison of size, or other meaning.

[0022] Furthermore, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two structures. Those skilled in the art can understand the specific meaning of the above terms in this invention by considering the overall concept of the invention and the specific context of the solution.

[0023] Example 1 A type of whirlwind Bernoulli finger, such as Figure 1-4 As shown, it includes a finger body 1, which is flat and is made of high-strength ceramic material by 3D printing. The finger body 1 includes two opposing surfaces and a circumferential side. The two opposing surfaces are defined as the front and back sides, respectively. When in use, the front side of the finger body 1 faces the wafer to be transported.

[0024] The front of the finger body 1 is provided with an annular vortex channel 2, and the front of the finger body 1 is provided with a circular groove 21. A circular boss 22 is provided concentrically at the bottom of the groove 21. The vortex channel 2 is formed between the circumferential sidewall of the boss 22 and the circumferential sidewall of the groove 21.

[0025] The two side walls of the vortex channel 2 are provided with inwardly recessed auxiliary air passages 24, and the airflow converges into the auxiliary air passages 24 on both sides when passing through the vortex channel 2.

[0026] In order to ensure that the airflow flows stably from the intake channel 31 to the exhaust channel 32 in the vortex channel 2, an airflow guide block 23 is also installed in the vortex channel 2. The airflow guide block 23 is arranged between the connection point formed by the intake channel 31 and the vortex channel 2 and the connection point formed by the exhaust flow 32 and the vortex channel 2. In this way, the vortex channel 2 is cut off by the airflow guide block 23, so that the airflow can flow stably from the intake channel 31 to the exhaust channel 32 in the vortex channel 2, and the interference between the intake airflow and the exhaust airflow is avoided.

[0027] The airflow guide block 23 is generally arc-shaped, with its inner diameter matching the inner diameter of the vortex channel 2, its outer diameter matching the outer diameter of the vortex channel 2, and its thickness matching the thickness of the boss 22.

[0028] Regardless of the direction in which the airflow flows in the vortex channel 2, a negative pressure adsorption effect will be generated during the airflow process. That is, the inlet channel 31, the exhaust channel 32, the inlet hole 33, and the exhaust hole 34 are only used to provide channels for airflow and do not restrict the direction of airflow.

[0029] The finger body 1 is also provided with an airflow channel 3 that is connected to the vortex channel 2. External airflow enters the vortex channel 2 from the airflow channel 3 and flows in the vortex channel 2 to form an internal and external pressure difference to adsorb the wafer. Furthermore, such as Figure 4 As shown, an annular partition plate 25 is provided in the middle of the vortex channel 2, dividing the vortex channel 2 into two equal-width air channels, namely the first annular air channel 211 and the second annular air channel 212. After the airflow enters the vortex channel 2, it enters the first annular air channel 211 and the second annular air channel 212 respectively. The airflow in the first annular air channel 211 and the second annular air channel 212 forms a "parallel" airflow. The advantages of this design are as follows: First, the width of the first annular air channel 211 and the second annular air channel 212 is only half that of the vortex channel 2. According to Bernoulli's principle, when the airflow passes through a narrow channel, the flow velocity increases. Therefore, the setting of the two annular air channels makes the airflow channel narrower, the airflow velocity greater, the static pressure of the airflow lower, and the pressure difference formed between the airflow and the external airflow greater, resulting in greater air pressure, which can provide greater adsorption force for the wafer. Second, the airflow in the two annular air channels can form a "parallel" airflow, which can increase the effective adsorption area and can be applied to larger wafers. Furthermore, the two sides of the annular partition plate 25 are also provided with inwardly recessed auxiliary air passages 24, which can promote the airflow to flow along the auxiliary air passages 24 of the two annular air passages and reduce the escape of airflow within the auxiliary air passages 24.

[0030] The airflow channel 3 includes an inlet channel 31 and an exhaust channel 32. The airflow in the exhaust channel 32 is discharged outward from both sides, effectively creating a central positioning. A first baffle 35, inclined towards the side walls of the inlet channel 31, is provided at the junction of the inlet channel 31 and the vortex channel 2 to guide the airflow into the auxiliary air passages 24 on both side walls of the vortex channel 2. When the airflow passes through the first baffle 35, it flows to both sides (e.g., ...). Figure 4 As shown in the figure (the arrows indicate the airflow direction), this allows the airflow to better enter the auxiliary air passages 24 on both sides of the vortex channel 2. Because the auxiliary air passages 24 are recessed inwards (as shown in the figure), they facilitate better entry of the airflow into the auxiliary air passages 24 on both sides of the vortex channel 2. Figure 4 As shown in the figure (the arrows indicate the airflow direction), most of the airflow after entering the vortex channel 2 will flow along the auxiliary air passage 24, and a small portion of the airflow will flow in the central part of the vortex channel 2. Therefore, the airflow in the central part will form an airflow barrier, reducing the escape of airflow in the auxiliary air passage 24. This design can achieve airflow and external communication, ensuring the formation of the Bernoulli mechanism, while also minimizing the reduction of airflow flow in the vortex channel 2 caused by airflow escape, thereby reducing the internal and external pressure difference and thus avoiding the impact on the stable adsorption of the wafer.

[0031] At the junction of the exhaust channel 32 and the vortex channel 2, a second baffle 36 inclined towards the side walls of the intake channel 31 is provided. Both the first baffle 35 and the second baffle 36 are spindle-shaped. A Venturi intake channel 37 is formed between the first baffle 35 and the side walls of the intake channel 31, and a Venturi exhaust channel 38 is formed between the second baffle 36 and the side walls of the exhaust channel 32. Since the ends of the first baffle 35 and the second baffle 36 are inclined to both sides, airflow can be effectively split, thereby promoting the airflow to flow into the two annular channels. According to the Venturi effect, the design of the Venturi intake channel 37 can actively accelerate the airflow. The intake airflow then enters the vortex channel, while the Venturi exhaust channel 38 is designed to actively accelerate the exhaust airflow, thereby enhancing the suction effect and pulling the airflow in the vortex channel out faster, thus enhancing the overall negative pressure and providing stronger adsorption force for the wafer. At the same time, a flow divider 39 is provided at the junction of the two Venturi intake channels 37 and the two annular air channels. The design of the flow divider 39 can further divide the incoming airflow, so that the airflow can enter the auxiliary air channel 24 in the two annular air channels well. This can promote the airflow to flow better along the auxiliary air channel 24 in the two annular air channels and reduce the escape of the airflow in the auxiliary air channel 24.

[0032] Both the intake channel 31 and the exhaust channel 32 are tangentially connected to the vortex channel 2. The intake channel 31 forms an intake hole 33 on the front of the finger body 1, and the exhaust channel 32 forms an exhaust hole 34 on the circumferential side of the finger body. The angle between the intake direction of the intake channel 31 and the exhaust direction of the exhaust channel 32 is configured to be 90° to 210°. In this embodiment, at the vortex channel 2, the angle between the intake direction of the intake channel 31 and the exhaust direction of the exhaust channel 32 is configured to be 180°, that is, the airflow goes around half a circle in the vortex channel 2 before being exhausted.

[0033] It also includes an anti-slip plate 4, the surface of which protrudes from the surface of the finger body 1. The anti-slip plate 4 is made of an anti-slip and anti-static material, such as anti-static fluororubber or ceramic, and is used to support the wafer and eliminate static electricity on the wafer. The anti-slip plate 4 is set on the boss 22 in each vortex channel 2. When the wafer contacts the handling finger, the anti-slip plate 4 protrudes by 0.1mm, which effectively generates friction on the wafer and prevents the Bernoulli airflow from causing vibration and displacement of the wafer. When the finger is handling the wafer, it can ensure that the Bernoulli finger is consistent in positioning the wafer on each layer, which will bring stability to the next process. In this embodiment, the anti-slip sheet 4 is preferably made of ceramic material, which can effectively prevent the generation of static electricity. At the same time, the static electricity on the wafer can also be released through the ceramic material, so as not to cause static electricity to be introduced into the wafer and cause damage, thereby reducing the wafer yield. Furthermore, the finger body 1 is made of a single piece of fired ceramic. The Ω resistance of the ceramic material is 10 to the power of 6 to 10 to the power of 8, which further avoids the generation of static electricity. At the same time, the static electricity already on the wafer can be released through the finger, which better protects the wafer. The internal gas path is directly fired into shape, which greatly reduces the cost.

[0034] Thanks to the integrated firing technology, the finger body 1 and the anti-slip plate 4 can be fired together, with the total thickness controlled within 2mm. The thinnest part of the entire finger is 1.9mm. In addition, the non-sagging property of ceramic material ensures that wafers in 4-inch, 6-inch, and 8-inch cassettes do not need to be placed in layers. Customers can fill 25 layers of wafers in the cassette (the layer spacing of 4-inch and 6-inch cassettes is 4.76; the layer spacing of 8-inch cassettes is 6.35), which greatly shortens the changeover time and improves handling efficiency.

[0035] Meanwhile, replacing the rubber anti-slip sheet 4 with a ceramic anti-slip sheet 4 achieves high-temperature resistance. When handling wafers with a thickness of 0.15mm or more, it can handle wafers with a temperature of up to 1000 degrees Celsius. Both sides of the finger body 1 are flat, and by increasing the positive pressure of the air intake, the adsorption force is increased. At the same time, since the contact surface between the finger body 1 and the wafer is a flat surface, the contact area is increased, thereby increasing the friction between the wafer and the ceramic, thus ensuring that the wafer will not slide on the finger body 1. Since the wafer thickness is ≥1.5mm, the large adsorption force will not crush the wafer.

[0036] The anti-slip plate 4 is disc-shaped and at least four anti-slip plates 4 are provided. In this embodiment, four anti-slip plates 4 are preferred, spaced 90 degrees apart to reduce the amount of wafer edge sagging. A coaxial columnar body 41 with a small diameter is integrally formed on one side of the back of the anti-slip plate 4. A connecting hole that can penetrate the boss 22 is opened on the back of the finger body 1. The diameter of the columnar body 41 is adapted to the connecting hole. When the anti-slip plate 4 is arranged on the surface of the boss 22, the columnar body 41 is inserted into the connecting hole. The connecting hole is configured as a stepped countersunk hole to prevent the connector 43 from protruding from the back of the finger body 1. A metal connecting sleeve 42 is coaxially embedded in the columnar body 41. A connector 43, such as a screw, is provided on one side of the back of the finger body 1. The connecting sleeve 42 is provided with an internal thread that cooperates with the connector 43. The two are threadedly connected.

[0037] The outer circular sidewall of the boss 22 is provided with a slot for installing the airflow guide block 23 along the axial direction. The root of the airflow guide block 23 has a protrusion that matches the slot on the side facing the center. The anti-slip plate 4 has the same size as the boss 22 and is installed concentrically. The anti-slip plate 4 completely covers the slot and presses the protrusion at the root of the airflow guide block 23 into the slot, thereby achieving the pressing and fixing effect of the airflow guide block 23.

[0038] Example 2 In this embodiment, the front side of the finger body 1 is also provided with multiple arc-shaped steps 5 of different diameters, so that the wafer is positioned at a designated position on the finger body 1 by means of the arc-shaped steps 5. The multiple arc-shaped steps 5 have the same axis of symmetry, and the arc-shaped steps 5 have a diameter equivalent to that of the wafer to be transported.

[0039] The front of the finger body 1 is provided with a mounting groove, which is located at the center of the arc-shaped step 5 and is symmetrically arranged along the axis of symmetry of the arc-shaped step 5. A sensor 6 is provided at the intersection of the mounting groove and each arc-shaped step 5. The detection probe of the sensor 6 is located at the center of the arc-shaped step 5. When the detection probe of the sensor 6 detects the wafer, it is considered that the edge of the wafer is completely in contact with the arc-shaped step 5 and the wafer is in place.

[0040] At least four vortex channels 2 are provided and are symmetrically distributed about the axis of symmetry of the arc-shaped step 5. The airflow directions in two vortex channels 2 that are opposite to each other are set in opposite directions so as to cancel out the torsional torque generated by the airflow and prevent the wafer from rotating.

[0041] Typically, the finger body 1 is not only suitable for handling wafers of a single size. In this case, the arc-shaped steps 5 on the front side of the finger body 1 are provided with two or more steps of different diameters, and these arc-shaped steps 5 have the same axis of symmetry. The mounting groove is provided along the axis of symmetry. A sensor 6 is provided at the intersection of the mounting groove and each arc-shaped step 5, or each detection probe of the sensor 6 is arranged at the intersection of the mounting groove and each arc-shaped step 5.

[0042] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. A whirlwind Bernoulli finger, comprising a finger body (1), characterized in that: The front of the finger body (1) is provided with an annular vortex channel (2); the two side walls of the vortex channel (2) are provided with inwardly recessed auxiliary air passages (24), and the airflow converges to the auxiliary air passages (24) on both sides when passing through the vortex channel (2). The finger body (1) is also provided with an airflow channel (3) that is connected to the vortex channel (2). External airflow enters the vortex channel (2) from the airflow channel (3) and flows in the vortex channel (2) to form an internal and external pressure difference to adsorb the wafer. The airflow channel (3) includes an inlet airflow channel (31) and an exhaust airflow channel (32). A first baffle plate (35) inclined towards the two side walls of the inlet airflow channel (31) is provided at the junction of the inlet airflow channel (31) and the vortex channel (2) to guide the airflow into the auxiliary airflow channel (24) on both side walls of the vortex channel (2). An airflow guide block (23) is also installed in the vortex channel (2). The airflow guide block (23) is arranged between the inlet airflow channel (31) and the exhaust flow (32). The airflow guide block (23) cuts off the vortex channel (2) so that the airflow flows from the inlet airflow channel (31) to the exhaust flow channel (32) in the vortex channel (2). It also includes an anti-slip sheet (4), the surface of which protrudes from the surface of the finger body (1). The anti-slip sheet (4) is made of anti-slip and anti-static material and is used to support the wafer and eliminate static electricity on the wafer.

2. The whirlwind Bernoulli finger according to claim 1, characterized in that: The finger body (1) is flat and is made of high-strength ceramic material by 3D printing. The finger body (1) includes two opposing surfaces and a circumferential side. The two opposing surfaces are defined as the front and back sides, respectively. The front of the finger body (1) faces the wafer to be transported.

3. The whirlwind Bernoulli finger according to claim 1, characterized in that: The air intake channel (31) and the exhaust channel (32) are both connected tangentially to the vortex channel (2). The air intake channel (31) forms an air intake hole (33) on the front of the finger body 1, and the exhaust channel (32) forms an exhaust hole (34) on the circumferential side of the finger body. The angle between the air intake direction of the air intake channel (31) and the exhaust direction of the exhaust channel (32) is configured to be 90° to 210°.

4. The whirlwind Bernoulli finger according to claim 1, characterized in that: The finger body (1) has a circular groove (21) on its front side. A circular boss (22) is concentrically arranged at the bottom of the groove (21). The vortex channel (2) is formed between the circumferential sidewall of the boss (22) and the circumferential sidewall of the groove (21).

5. The whirlwind Bernoulli finger according to claim 1, characterized in that: The airflow guide block (23) is an arc-shaped block with its inner diameter matching the inner diameter of the vortex channel (2), its outer diameter matching the outer diameter of the vortex channel (2), and its thickness matching the thickness of the boss (22).

6. The whirlwind Bernoulli finger according to claim 1, characterized in that: The anti-slip plate (4) is disc-shaped and there are at least four anti-slip plates (4). A coaxial column (41) with a small diameter is integrally formed on one side of the back of the anti-slip plate (4). A connecting hole that can pass through the boss (22) is opened on the back of the finger body (1). The diameter of the column (41) is adapted to the connecting hole. When the anti-slip plate (4) is arranged on the surface of the boss (22), the column (41) is inserted into the connecting hole. A metal connecting sleeve (42) is coaxially embedded in the column (41). A connector (43) is provided on one side of the back of the finger body (1). An internal thread that cooperates with the connector (43) is provided in the connecting sleeve (42). The two are threadedly connected.

7. The whirlwind Bernoulli finger according to claim 1, characterized in that: The outer circular sidewall of the boss (22) is provided with a slot for installing the airflow guide block (23) along the axial direction. The root of the airflow guide block (23) has a protrusion that matches the slot on the side facing the center. The anti-slip plate (4) has the same size as the boss (22) and is installed concentrically. The anti-slip plate (4) completely covers the slot and presses the protrusion at the root of the airflow guide block (23) into the slot.

8. The whirlwind Bernoulli finger according to claim 1, characterized in that: The front of the finger body (1) is also provided with multiple arc-shaped steps (5) of different diameters. The arc-shaped steps (5) are used to position the wafer. The multiple arc-shaped steps (5) have the same axis of symmetry and the arc-shaped steps (5) have a diameter equivalent to that of the wafer to be transported.

9. The whirlwind Bernoulli finger according to claim 1, characterized in that: The finger body (1) has an installation groove on its front side. The installation groove is located at the center of the arc-shaped step (5) and is symmetrically arranged along the axis of symmetry of the arc-shaped step (5). A sensor (6) is provided at the intersection of the installation groove and each arc-shaped step (5). The detection probe of the sensor (6) is located at the center of the arc-shaped step (5). When the detection probe of the sensor (6) detects the wafer, the edge of the wafer is completely in contact with the arc-shaped step (5) and the wafer is in place.

10. The whirlwind Bernoulli finger according to claim 8, characterized in that: The vortex channels (2) are provided at least four and are symmetrically distributed about the axis of symmetry of the arc-shaped steps (5).

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