Limiting device, limiting module and assembling method of transistor

Abstract

A limiting device of a transistor, a limiting module and an assembling method thereof, the limiting device comprises a circuit board, a clamping assembly, a radiator and a metal assembly, the clamping assembly is installed on the circuit board, the clamping assembly comprises a first surface, a second surface, at least one opening and at least one concave part, the opening penetrates through the first surface to the second surface, and the concave part is arranged on the first surface and is configured to be provided with a transistor; the metal assembly comprises a body and at least one elastic piece, the body is installed on the second surface of the clamping assembly, the elastic piece extends from the body and extends into the opening in a penetrating mode, and the elastic piece is configured to abut against the transistor and provide pushing force, so that the transistor keeps moving in the direction away from the circuit board to be attached to the radiator.

Description

Technical Field

[0001] This invention relates to a limiting device, a limiting module, and an assembly method thereof, and particularly to a limiting device, a limiting module, and an assembly method thereof for a transistor. Background Technology

[0002] In electrical equipment, the core component is the power conversion semiconductor module. This module is typically fixed in two ways. The first is rigid fixing, such as directly attaching the semiconductor module to the heat sink surface using screws through an insulating plate. However, during operation, the semiconductor module repeatedly expands and contracts due to temperature changes. Using screws, when the semiconductor module expands due to heat, the pressure between the semiconductor module and the screw can easily cause it to crack. When the semiconductor module cools down after stopping operation, its size shrinks, preventing a tight fit between the semiconductor module and the heat sink, thus affecting its heat dissipation performance.

[0003] like Figure 1 As shown, the second fixing method arranges at least one semiconductor component 101 on the edge of a circuit board 102. The circuit board 102 is assembled on a frame 103. The corresponding semiconductor component 101 is pushed down onto a heat sink 105 by at least one limiting member 104 fixed to the frame 103. However, the limiting member 104 only applies pressure to the semiconductor component 101 on one side, which may lead to loosening over time. This cannot ensure the reliability of the assembly of the semiconductor component 101, the circuit board 102, and the heat sink 105, thus reducing the heat exchange efficiency between the semiconductor component 101 and the heat sink 105. Moreover, the placement and number of the semiconductor component 101 are limited by the length of the edge of the circuit board 102, making the circuit design more difficult.

[0004] Therefore, in order to overcome the shortcomings and deficiencies in the prior art, the present invention needs to provide an improved transistor limiting device, limiting module and its assembly method to solve the problems existing in the above-mentioned conventional technology. Summary of the Invention

[0005] The main objective of this invention is to provide a transistor limiting device, a limiting module, and an assembly method thereof. By using the spring of a metal component to continuously apply a pushing force to the transistor, the transistor can be kept in contact with the heat sink, preventing the transistor from becoming loose due to gaps between the transistor and the heat sink, thereby improving the heat exchange efficiency between the transistor and the heat sink.

[0006] To achieve the above-mentioned purpose, the present application provides a transistor limiting module, which comprises a clamping assembly and a metal assembly. The clamping assembly is arranged between a circuit board and a heat sink. The clamping assembly comprises a first surface, a second surface, at least one opening and at least one recess. The opening penetrates the first surface to the second surface. The recess is arranged on the first surface and is configured to accommodate a transistor. The metal assembly comprises a body and at least one spring. The body is arranged on the second surface of the clamping assembly. The spring extends from the body and penetrates into the opening. The spring is arranged to abut against the transistor and provide a pushing force, so that the transistor is maintained to move away from the circuit board and abut against the heat sink.

[0007] In an embodiment of the present application, the clamping assembly comprises a base and an upper cover. The base and the upper cover are arranged on the circuit board. The metal assembly is clamped between the base and the upper cover.

[0008] In an embodiment of the present application, the base has a seat body and two clamping hooks. The clamping hooks are arranged on the seat body and located on the second surface. The clamping hooks are arranged to be clamped on the circuit board.

[0009] In an embodiment of the present application, the upper cover has a cover plate and a tube. The tube is arranged on the cover plate. The tube is arranged to penetrate the circuit board.

[0010] In an embodiment of the present application, the upper cover has two notched portions. The notched portions are arranged on two opposite sides of the cover plate. The tube is located between the notched portions. The notched portions are arranged to be tightly combined with the clamping hooks.

[0011] In an embodiment of the present application, the upper cover has two combined members. The combined members are arranged on two opposite sides of the cover plate. The combined members are arranged to be combined in the clamping holes of the seat body.

[0012] In an embodiment of the present application, the body of the metal assembly is in a strip shape. At least two springs of the metal assembly are arranged on two opposite sides of the body.

[0013] In an embodiment of the present application, the clamping assembly comprises a base and an upper cover. The upper cover is arranged on the circuit board. The metal assembly is clamped between the base and the upper cover.

[0014] In an embodiment of the present application, the body of the metal assembly is in a strip shape. At least two springs of the metal assembly are arranged on two opposite sides of the body.

[0015] In an embodiment of the present application, the clamping assembly comprises a base and an upper cover, the base is configured to be mounted on the circuit board, and the metal component is clamped between the base and the upper cover.

[0016] In an embodiment of the present application, the base has a receiving groove configured to receive the metal component and the upper cover.

[0017] In an embodiment of the present application, the metal component further comprises at least two positioning holes formed on the body, and the positioning holes are misaligned with the elastic sheets.

[0018] In an embodiment of the present application, the body of the metal component has an inner recess and two side walls arranged on two opposite sides of the inner recess, and the elastic sheets respectively extend outwardly from the upper edges of the side walls.

[0019] In an embodiment of the present application, the elastic sheet has a bending portion configured to form a line contact with the surface of the transistor.

[0020] In an embodiment of the present application, the metal component further comprises at least one protrusion formed on a surface of the elastic sheet, and the protrusion is configured to form a point contact with the surface of the transistor.

[0021] In an embodiment of the present application, the protrusion and a contact area of the transistor are limited to overlap with a center line of the surface of the transistor.

[0022] In an embodiment of the present application, the clamping assembly comprises a base, an upper cover, and at least two positioning members, the metal component comprises two through holes formed on the body, the positioning members are arranged on the base, and the positioning members are configured to pass through the through holes, so that the metal component is clamped between the base and the upper cover and can only move up and down.

[0023] In an embodiment of the present application, an extension direction of the elastic sheet is parallel or orthogonal to an extension direction of a pin of the transistor.

[0024] To achieve the above-mentioned purpose, the present application provides a transistor limiting device, which comprises a circuit board, a clamping component, a heat sink and a metal component. The clamping component is installed on the circuit board. The clamping component comprises a first surface, a second surface, at least one opening and at least one recess. The opening penetrates the first surface to the second surface. The recess is arranged on the first surface and is configured to accommodate a transistor. The heat sink is installed on the clamping component and is located between the circuit board and the clamping component. The metal component comprises a body and at least one spring. The body is installed on the second surface of the clamping component. The spring extends from the body and penetrates into the opening. The spring is configured to abut against the transistor and provide a pushing force, so that the transistor is maintained to move away from the circuit board and abut against the heat sink.

[0025] To achieve the above-mentioned purpose, the present application provides a transistor limiting device, which comprises a circuit board, a clamping component, a heat sink and a metal component. The clamping component is installed on the circuit board. The clamping component comprises a first surface, a second surface, at least one opening and at least one recess. The opening penetrates the first surface to the second surface. The recess is arranged on the first surface and is configured to accommodate a transistor. The heat sink is installed on the clamping component and is located between the circuit board and the clamping component. The metal component comprises a body and at least one spring. The body is installed on the second surface of the clamping component. The spring extends from the body and penetrates into the opening. The spring is configured to abut against the transistor and provide a pushing force, so that the transistor is maintained to move away from the circuit board and abut against the heat sink.

[0026] As described above, since the transistor limiting device of the present application can be fixed at any position of the circuit board, the arrangement of the transistor is not limited to the edge of the board body of the circuit board, so that the transistor can be freely arranged according to the circuit requirement, and the flexibility of the circuit design can be greatly improved. In addition, by continuously applying the pushing force to the transistor by the spring, the transistor can be maintained to abut against the heat sink, so that the gap between the transistor and the heat sink is avoided, and the heat exchange efficiency between the transistor and the heat sink is improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a schematic diagram of a known technology of arranging a semiconductor component on a circuit board.

[0028] Figure 2 is a perspective view of a transistor limiting device according to an embodiment of the present application.

[0029] Figure 3 is an exploded view of a transistor limiting device according to an embodiment of the present application.

[0030] Figure 4 is a sectional view of a transistor limiting device according to an embodiment of the present application.

[0031] Figure 5is an exploded view of a limiting device of a transistor according to another embodiment of the present application.

[0032] Figure 6 is a sectional view of a limiting device of a transistor according to another embodiment of the present application.

[0033] Figure 7 is an exploded view of a limiting device of a transistor according to another embodiment of the present application.

[0034] Figure 8 is a sectional view of a limiting device of a transistor according to another embodiment of the present application.

[0035] Figure 9 is a top view of a spring of a metal assembly of a limiting device of a transistor according to another embodiment of the present application.

[0036] Figure 10 is a side view of a spring of a metal assembly of a limiting device of a transistor according to another embodiment of the present application.

[0037] Figure 11 is a flow chart of an assembling method of a limiting device of a transistor according to an embodiment of the present application.

[0038] BRIEF DESCRIPTION OF DRAWINGS

[0039] 101: semiconductor assembly,

[0040] 102: circuit board,

[0041] 103: frame,

[0042] 104: limiting member,

[0043] 105: heat sink,

[0044] 100: transistor,

[0045] 2: circuit board,

[0046] 21: fixing hole,

[0047] 3: sandwich assembly,

[0048] 31: base,

[0049] 311: seat body,

[0050] 312: clamping hook,

[0051] 313: clamping hole,

[0052] 314: accommodating groove,

[0053] 315: clamping tenon,

[0054] 32: upper cover seat,

[0055] 321: cover plate,

[0056] 322: pipe body,

[0057] 323: notch part,

[0058] 324: assembly,

[0059] 33: first surface,

[0060] 34: second surface,

[0061] 35: opening,

[0062] 36: recess,

[0063] 37: positioning member,

[0064] 4: heat sink,

[0065] 41: heat dissipation body,

[0066] 42: heat dissipation fin,

[0067] 43: heat conduction plate,

[0068] 5: metal assembly,

[0069] 51: body,

[0070] 511: inner recess,

[0071] 512: side wall,

[0072] 52: elastic sheet,

[0073] 521: bent part,

[0074] 53: protruding part,

[0075] 54: perforation,

[0076] 55: positioning hole,

[0077] 6: screw,

[0078] L1: center line,

[0079] S201: step,

[0080] S202: step,

[0081] S203: step,

[0082] S204: step. DETAILED DESCRIPTION

[0083] For the above and other purposes, features, and advantages, embodiments of the present application will be described below in detail with reference to the accompanying drawings. Furthermore, the directional terms used in the present application, such as upper, lower, top, bottom, front, back, left, right, inner, outer, side, periphery, center, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, are only used to refer to the directions in the accompanying drawings. Therefore, the directional terms are used to explain and understand the present application, but not to limit the present application.

[0084] Please refer to Figure 2 and Figure 3 , which are a limiting device of a transistor according to an embodiment of the present application, the limiting device includes a circuit board 2, a clamping assembly 3, a heat sink 4, and a metal assembly 5. The detailed structure, assembly relationship, and operation principle of each component will be described in detail below.

[0085] Please refer to Figure 2 , Figure 3 and Figure 4 , the clamping assembly 3 is installed on the circuit board 2. The clamping assembly 3 includes a base 31, an upper cover seat 32, a first surface 33, a second surface 34, at least one opening 35, and at least one recess 36. The base 31 and the upper cover seat 32 are both installed on the circuit board 2, and the metal assembly 5 is clamped between the base 31 and the upper cover seat 32. Figure 3 and Figure 4 , the first surface 33 and the second surface 34 of the clamping assembly 3 are respectively located on the two opposite surfaces of the base 31. The opening 35 penetrates the first surface 33 to the second surface 34, and the recess 36 is provided on the first surface 33 and configured to accommodate a transistor 100.

[0086] In this embodiment, two openings 35 are provided on the base 31, and the first surface 33 is provided with two recesses 36. The openings 35 correspond to the recesses 36, and two transistors 100 are respectively placed in the recesses 36.

[0087] Please refer to Figure 3 and Figure 4 , specifically, the base 31 has a seat body 311 and two clamping hooks 312. The clamping hooks 312 are provided on the seat body 311 and located on the second surface 34. The clamping hooks 312 are configured to be clamped on a fixing hole 21 of the circuit board 2.

[0088] Please refer to Figure 3 and Figure 4As shown, in particular, the upper cover seat 32 has a cover plate 321, a tube body 322, two notch portions 323 and two assembly members 324, the tube body 322 is disposed on the cover plate 321, and the tube body 322 is configured to penetrate the fixing hole 21 of the circuit board 2, the notch portions 323 are respectively disposed on two opposite sides of the cover plate 321, and the tube body 322 is located between the notch portions 323, and the notch portions 323 are configured to be tightly combined on the hooks 312. In addition, the assembly members 324 are respectively disposed on two opposite sides of the cover plate 321, and the assembly members 324 are configured to be combined in the two clamping holes 313 of the seat body 311.

[0089] As shown in Figure 2 and Figure 4 , the heat sink 4 is mounted on the clamping assembly 3, and the clamping assembly 3 is located between the circuit board 2 and the heat sink 4. In this embodiment, the heat sink 4 includes a heat sink body 41 and a plurality of heat sink fins 42 arranged on one surface of the heat sink body 41, and the clamping assembly 3 is attached to the other surface of the heat sink body 41.

[0090] As shown in Figure 3 and Figure 4 , the metal assembly 5 includes a body 51 mounted on the second surface 34 of the clamping assembly 3 and at least one spring sheet 52 extending from the body 51 and penetrating into the opening 35, wherein the spring sheet 52 has a bending portion 521 configured to form a line contact with the surface of the transistor 100. In particular, the spring sheet 52 is configured to abut against the corresponding transistor 100, and the spring sheet 52 provides a pushing force to the transistor 100 through surface contact, so that the transistor 100 is maintained to move away from the circuit board 2 in a direction to fit the heat sink 4. In this embodiment, the metal assembly 5 includes two spring sheets 52 extending outwardly from two opposite sides of the body 51, and the spring sheets 52 respectively penetrate into the openings 35.

[0091] As shown in Figure 3 and Figure 4 , the clamping assembly 3 further includes at least two positioning members 37, and the metal assembly 5 includes two through holes 54 formed in the body 51, the positioning members 37 are disposed on the base 31, and the positioning members 37 are configured to pass through the through holes 54, so that the metal assembly 5 is clamped between the base 31 and the upper cover seat 32 and can only move up and down.

[0092] According to the above structure, when the screw 6 is locked to the circuit board 2, the base 31 and the upper cover base 32, and the transistor 100 and the heat sink 4 are combined on the sandwich assembly 3, the spring sheet 52 of the metal assembly 5 penetrates into the opening 35 to press the transistor 100 downwards to achieve the fixing effect, and the spring sheet 52 provides a pushing force to the transistor 100 through surface contact, so that the transistor 100 is kept moving away from the circuit board 2 to adhere to the heat sink 4.

[0093] As mentioned above, since the transistor limiting device of the present application can be fixed at any position of the circuit board 2, the arrangement of the transistor 100 is not limited to the edge of the circuit board 2, so that the transistor 100 can be freely arranged according to the circuit requirement, and the flexibility of circuit design can be greatly improved. In addition, by continuously applying a pushing force to the transistor 100 by the spring sheet 52, the transistor 100 can be kept adhering to the heat sink 4, avoiding the gap between the transistor 100 and the heat sink 4 to loosen, thereby improving the heat exchange efficiency of the transistor 100 and the heat sink 4.

[0094] Please refer to Figure 5 and Figure 6 , which show a transistor limiting device according to another embodiment of the present application, and the same component names and figure numbers as the above embodiment are generally used, but the difference between the two is that the body 51 of the metal assembly 5 is in a strip shape, and at least two spring sheets 52 of the metal assembly 5 are correspondingly arranged on the two opposite sides of the body 51. In this embodiment, a plurality of spring sheets 52 are arranged on the two opposite sides of the body 51, and the spring sheets 52 on the two opposite sides of the body 51 are correspondingly arranged.

[0095] Please refer to Figure 5 and Figure 6 , the base 31 of the sandwich assembly 3 is arranged to be installed on the circuit board 2 by the tenon 315 arranged on the base body 311, and the metal assembly 5 is sandwiched between the base 31 and the upper cover base 32.

[0096] Please refer to Figure 5 and Figure 6 , specifically, the metal assembly 5 further comprises at least two positioning holes 55, the positioning holes 55 are formed on the body 51, and the positioning holes 55 are misaligned with the spring sheets 52. The positioning holes 55 are arranged for the screw to be locked and fixed on the upper cover base 32 and the circuit board 2.

[0097] Please refer to Figure 5 and Figure 6As shown, in particular, the body 51 of the metal component 5 has an inner recess 511 and two side walls 512 arranged at two opposite sides of the inner recess 511, and the elastic pieces 52 are respectively extended outwardly from the upper edges of the side walls 512.

[0098] Referring back to Figure 5 and Figure 6 As shown, in particular, the base 31 has a receiving groove 314 configured to receive the metal component 5 and the upper cover seat 32, wherein the receiving groove 314, the metal component 5 and the upper cover seat 32 are matched in shape, so that the metal component 5 and the upper cover seat 32 are limited in the receiving groove 314.

[0099] According to the above structure, by arranging a plurality of elastic pieces 52 at two opposite sides of the body 51 of the metal component 5, and pressing the elastic pieces 52 on a plurality of transistors 100, the number of screws 6 locking the body 51 and the circuit board 2 can be reduced, and the opening of the circuit board 2, the cost and the assembly efficiency can be reduced.

[0100] As described above, by arranging a plurality of elastic pieces 52 at two opposite sides of the body 51 to press the corresponding transistors 100, the opening of the circuit board 2, the cost and the assembly efficiency can be reduced. Furthermore, the limiting device can be fixed at any position of the circuit board 2, so that the arrangement of the transistors 100 is not limited to the edge of the circuit board 2, and thus the transistors 100 can be freely arranged according to the circuit requirement, and the flexibility of circuit design can be greatly improved. In addition, by continuously applying a pushing force to the transistor 100 by the elastic piece 52, the transistor 100 can be maintained in contact with the heat sink 4, avoiding the gap between the transistor 100 and the heat sink 4 to be loose, and thus improving the heat exchange efficiency of the transistor 100 and the heat sink 4.

[0101] Please refer to Figure 7 and Figure 8 As shown, in particular, the body 51 of the metal component 5 has an inner recess 511 and two side walls 512 arranged at two opposite sides of the inner recess 511, and the elastic pieces 52 are respectively extended outwardly from the upper edges of the side walls 512.

[0102] Referring back to Figure 7 and Figure 8As shown, the body 51 is provided with a plurality of elastic pieces 52 on two opposite sides of the body 51, and the elastic pieces 52 on the two opposite sides of the body 51 are arranged in a staggered manner, so as to provide the transistors 100 on the two opposite sides of the body 51 arranged in different directions, for example, the transistors arranged in a horizontal or vertical direction. In the embodiment, an extension direction of the elastic piece 52 is parallel or orthogonal to an extension direction of a pin of the transistor 100.

[0103] With reference to Figure 7 and Figure 8 As shown, the upper cover seat 32 of the clamping assembly 3 is configured to be mounted on the circuit board 2, and the base 31 is spaced from the circuit board 2, and the metal assembly 5 is clamped between the base 31 and the upper cover seat 32.

[0104] In the embodiment, the heat sink 4 includes a heat sink body 41, a plurality of heat sink fins 42 arranged on a surface of the heat sink body 41, and a heat conduction plate 43 arranged between the base 31 and the heat sink body 41.

[0105] As shown in Figure 7 , Figure 9 and Figure 10 The metal assembly 5 further includes at least one protruding portion 53 formed on a surface of the corresponding elastic piece 52, and the protruding portion 53 is configured to form a point contact with the surface of the transistor 100. In the embodiment, the protruding portion 53 and a contact area of the transistor 100 are limited to overlap a center line L1 of the surface of the transistor 100.

[0106] According to the above structure, by arranging a plurality of elastic pieces 52 on two opposite sides of the body 51 of the metal assembly 5 in a staggered manner, and pressing the elastic pieces 52 on a plurality of transistors 100, the transistors 100 can be combined on the circuit board 2 in different directions, for example, the extension direction of the elastic piece 52 is parallel or orthogonal to the extension direction of the pin of the transistor 100, thereby improving the degree of freedom of the arrangement of the transistor 100. In addition, the protruding portion 53 is configured to form a point contact with the surface of the transistor 100, and the contact area is limited to overlap the center line L1 of the surface of the transistor 100, thereby reducing the contact area, and there is no need to additionally provide an insulating patch on the surface of the transistor 100.

[0107] As described above, the plurality of elastic pieces 52 are arranged on two opposite sides of the body 51 to press the corresponding transistors 100, thereby improving the freedom of arrangement of the transistors 100. Moreover, the point contact between the protruding portion 53 and the surface of the transistor 100 can eliminate the need for providing an insulating patch on the transistor 100. Furthermore, the limiting device can be fixed at any position on the circuit board 2, so that the arrangement of the transistor 100 is not limited to the edge of the circuit board 2, and the transistor 100 can be arranged freely according to the circuit requirement, thereby greatly improving the flexibility of circuit design. In addition, the elastic piece 52 continuously applies a pushing force to the transistor 100, so that the transistor 100 can be maintained in contact with the heat sink 4, thereby avoiding the generation of a gap between the transistor 100 and the heat sink 4 and the loosening of the transistor 100, and further improving the heat exchange efficiency between the transistor 100 and the heat sink 4.

[0108] Please refer to Figure 11 According to the limiting device for the transistor of the embodiment of the present application, another assembly method for the limiting device for the transistor is provided, which comprises steps S201, S202, S203 and S204. The operation steps and operation principles of each component will be described in detail below.

[0109] Please refer to Figure 3 and Figure 4 , and in combination with Figure 11 In step S201, a metal component 5 is installed on a second surface 34 of a clamping component 3 to combine a limiting module for a transistor, wherein the metal component 5 comprises a body 51 and at least one elastic piece 52, the elastic piece 52 extends from the body 51 and penetrates into an opening 35.

[0110] Please refer to Figure 3 and Figure 4 , and in combination with Figure 11 In step S202, a transistor 100 is arranged in at least one recessed portion 36 of the clamping component 3. In this embodiment, two openings 35 are formed on the base 31, and the first surface 33 is provided with two recessed portions 36, the openings 35 correspond to the recessed portions 36, and two transistors 100 are respectively placed in the recessed portions 36.

[0111] Please refer to Figure 3 and Figure 4 , and in combination with Figure 11 In step S203, the clamping component 3 is installed on the circuit board 2. In this embodiment, the base 31 of the clamping component 3 has a seat body 311 and two clamping hooks 312, the clamping hooks 312 are arranged on the seat body 311, and the clamping hooks 312 are located on the second surface 34, and the clamping hooks 312 are arranged to be clamped on a fixing hole 21 of the circuit board 2.

[0112] Referring to Figure 3 and Figure 4 , and in combination with Figure 11 , in step S204, a heat sink 4 is installed on the sandwich assembly 3 to form a transistor limiting device, wherein the spring sheet 52 abuts against the transistor 100 and provides a pushing force, so that the transistor 100 is maintained to move away from the circuit board 2 and to adhere to the heat sink 4.

[0113] As described above, the transistor limiting device is fixed at any position on the circuit board 2 by the assembling method of the transistor limiting device, so that the arrangement of the transistor 100 is not limited to the edge of the circuit board 2, and the transistor 100 can be freely arranged according to the circuit requirement, and the flexibility of the circuit design can be greatly improved. In addition, the transistor 100 is maintained to adhere to the heat sink 4 by the continuous pushing force provided by the spring sheet 52, so that the gap between the transistor 100 and the heat sink 4 is avoided, and the heat exchange efficiency between the transistor 100 and the heat sink 4 is improved.

[0114] Although the present application has been disclosed with examples, it is not intended to limit the present application, and any person skilled in the art can make various modifications and modifications without departing from the spirit and scope of the present application, and therefore the protection scope of the present application shall be defined by the appended claims.

Claims

1. A limiting module for a transistor, wherein, include: A clamping assembly configured to be mounted between a circuit board and a heat sink, the clamping assembly including a first surface, a second surface, at least one opening, and at least one recess, the opening extending through the first surface to the second surface, the recess disposed on the first surface and configured to accommodate a transistor; and A metal component includes a body and at least one spring clip, the body being mounted on a second surface of the clamping component, and the spring clip extending from the body and through the opening; The spring is configured to abut against the transistor and provide a thrust, causing the transistor to move away from the circuit board and fit against the heat sink.

2. The limiting module for the transistor according to claim 1, wherein, The clamping assembly includes a base and a top cover, both of which are mounted on the circuit board, and the metal component is clamped between the base and the top cover.

3. The limiting module for the transistor according to claim 2, wherein, The base has a body and two hooks, which are disposed on the body and located on the second surface, and are configured to snap onto the circuit board.

4. The limiting module for the transistor according to claim 3, wherein, The upper cover has a cover plate and a tube body disposed on the cover plate and configured to extend through the circuit board.

5. The limiting module for the transistor according to claim 4, wherein, The upper cover has two notches, which are respectively located on two opposite sides of the cover plate, and the tube is located between the two notches. The two notches are configured to fit tightly onto the two hooks.

6. The limiting module for the transistor according to claim 4, wherein, The upper cover has two assemblies, which are respectively disposed on two opposite sides of the cover plate, and the two assemblies are configured to engage in two engagement holes of the base body.

7. The limiting module for the transistor according to claim 1, wherein, The metal component has a long strip-shaped body, and at least two spring clips are staggered on two opposite sides of the body.

8. The limiting module for the transistor according to claim 7, wherein, The clamping assembly includes a base and a top cover, the top cover being configured to be mounted on the circuit board, and the metal component being clamped between the base and the top cover.

9. The limiting module for the transistor according to claim 1, wherein, The metal component has a long strip-shaped body, and at least two spring clips are correspondingly arranged on two opposite sides of the body.

10. The limiting module for the transistor according to claim 9, wherein, The clamping assembly includes a base and a top cover, the base being configured to be mounted on the circuit board, and the metal component being clamped between the base and the top cover.

11. The limiting module for the transistor according to claim 10, wherein, The base has a receiving groove configured to accommodate the metal component and the upper cover.

12. The limiting module for the transistor according to claim 7 or 9, wherein, The metal component also includes at least two positioning holes formed on the body, and at least two positioning holes are misaligned with at least two of the spring pieces.

13. The limiting module for the transistor according to claim 7 or 9, wherein, The body of the metal component has a recess and two sidewalls disposed on two opposite sides of the recess, and at least two spring pieces extend outward from the upper edges of the two sidewalls respectively.

14. The limiting module for the transistor according to claim 1, wherein, The spring has a bend that is configured to form a line contact with the surface of the transistor.

15. The limiting module for the transistor according to claim 1, wherein, The metal component also includes at least one protrusion formed on one surface of the spring, and the protrusion is configured to form a point contact with the surface of the transistor.

16. The limiting module for the transistor according to claim 15, wherein, The protrusion and a contact area of ​​the transistor are confined to a centerline that overlaps with the surface of the transistor.

17. The limiting module for the transistor according to claim 1, wherein, The clamping assembly includes a base, a top cover, and at least two positioning members. The metal assembly includes two through holes formed in the body. The at least two positioning members are disposed on the base and configured to pass through the two through holes respectively, so that the metal assembly can only move up and down when clamped between the base and the top cover.

18. The limiting module for the transistor according to claim 1, wherein, The extension direction of the spring is parallel or orthogonal to the extension direction of the transistor pin.

19. A limiting device for a transistor, wherein, include: A circuit board; A clamping assembly is mounted on the circuit board. The clamping assembly includes a first surface, a second surface, at least one opening, and at least one recess. The opening extends through the first surface to the second surface, and the recess is disposed on the first surface and configured to accommodate a transistor. A heat sink is mounted on the clamping assembly, and the clamping assembly is located between the circuit board and the heat sink; and A metal component includes a body and at least one spring clip, the body being mounted on a second surface of the clamping component, and the spring clip extending from the body and through the opening; The spring is configured to abut against the transistor and provide a thrust, causing the transistor to move away from the circuit board and fit against the heat sink.

20. A method for assembling a transistor limiting device, wherein, include: Step S201: Install a metal component on a second surface of a clamping component, wherein the metal component includes a body and at least one spring tab, the spring tab extending from the body and through an opening; Step S202: Dispose of a transistor in at least one recess of the clamping assembly; Step S203: Install the clamping assembly onto the circuit board; and Step S204: A heat sink is mounted on the clamping assembly, wherein the spring abuts against the transistor and provides a thrust, causing the transistor to maintain movement away from the circuit board and fit against the heat sink.

Images