Connector pin assembly, inter-board connector, inter-board high-speed connector assembly and manufacturing method of inter-board connector

Abstract

The invention provides a connector pin assembly, an inter-board connector, an inter-board high-speed connector assembly and a manufacturing method of the inter-board connector. The above connector pin assembly comprises a pin assembly and an insulating solder mask base. The contact pin assembly comprises a plurality of contact pin single bodies, each contact pin single body comprises a contact part, a connecting part and a welding part which are fixed in sequence, the insulation solder mask base is fixed to the connecting part of each contact pin single body of the contact pin assembly in a sealed mode, and the insulation solder mask base is arranged on the peripheral wall of the connecting part of each contact pin single body of the contact pin assembly in a surrounding mode; a welding block is fixed on the welding part of each pin single body of the pin assembly, and the welding part of each pin single body is used for being welded and electrically connected to a control board of the inter-board connector through the corresponding welding block. The connector pin assembly not only can effectively solve the problem that pseudo soldering is easy to occur between the pin monomers of the inter-board connector and the control board, but also can improve the production efficiency of the inter-board connector.

Description

Technical Field

[0001] This disclosure relates to the technical field of connectors, and in particular to a connector pin assembly, an inter-board connector, an inter-board high-speed connector assembly, and a method for manufacturing an inter-board connector. Background Technology

[0002] To meet the demands of market development, the connection method between board connectors and control boards has changed from the traditional through-hole soldering to fisheye crimping, surface mount soldering, BGA soldering, and other methods. In particular, BGA soldering, with its high density, low profile, high-speed transmission rate, and easy wiring of the control board, has been adopted by many board connectors, such as the existing technology patent CN117317634A.

[0003] However, while achieving the aforementioned advantages, the inter-board connectors also reveal some problems. In particular, during use, cold solder joints are prone to occur between the connector pins and the control board, a problem especially prominent in products with hundreds of pins. After reflow soldering, if individual pins have poor soldering (i.e., during reflow soldering, the molten solder fails to effectively connect the pin's solder joint to the pad, instead rising entirely to the pin's contact area), resulting in an open circuit, the entire product must be reworked. This not only severely impacts the production quality and efficiency of the inter-board connectors but also significantly increases their production costs. Summary of the Invention

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a connector pin assembly, an inter-board connector, an inter-board high-speed connector assembly, and a method for manufacturing an inter-board connector that can not only effectively solve the problem of poor soldering between the pins of the inter-board connector and the control board, but also improve the production efficiency of the inter-board connector.

[0005] The purpose of this disclosure is achieved through the following technical solution: A connector pin assembly for mounting in an inter-board connector, the connector pin assembly including a pin assembly and an insulating solder mask base; The pin assembly includes multiple pin units, each pin unit including a contact portion, a connecting portion, and a soldering portion fixed in sequence. The insulating solder mask base is sealed and fixed to the connecting portion of each pin unit of the pin assembly, such that the multiple pin units of the pin assembly are arranged parallel to each other at intervals. The insulating solder mask base surrounds the outer peripheral wall of the connecting portion of each pin unit of the pin assembly. The soldering portion of each pin unit of the pin assembly is fixed with a soldering block. The soldering portion of each pin unit is used for soldering and electrical connection to the control board of the board-to-board connector through the corresponding soldering block.

[0006] In one embodiment, the insulating solder mask base is injection molded onto the connection portion of each of the individual pins of the pin assembly, and the insulating solder mask base is injection molded and sealed to the connection portion of each of the individual pins of the pin assembly.

[0007] In one embodiment, the connecting portion of each of the pin units is formed with a positioning groove, and the insulating solder mask base is injection molded and sealed to the inner wall of the positioning groove, the positioning groove being used to engage and limit the insulating solder mask base.

[0008] In one embodiment, the pin assembly further includes a plurality of metal connecting pieces, each of which is disposed between the contact portions of two adjacent pin units. The two ends of each metal connecting piece are respectively fixed to the contact portions of the two adjacent pin units. Each metal connecting piece of the pin assembly is used for cutting and removing after the insulating solder mask base is injection molded into the connecting portion of each pin unit of the pin assembly. Each pin unit is arranged parallel to each other through each metal connecting piece.

[0009] In one embodiment, each of the weld blocks is press-fitted to the weld portion of the corresponding pin unit.

[0010] In one embodiment, each pin of the pin assembly has a mounting hole formed in its solder portion, and each of the solder blocks fills and is confined within the corresponding mounting hole.

[0011] In one embodiment, the inner peripheral walls at both ends of the mounting hole are formed with chamfered bevels, which extend obliquely away from the mounting hole.

[0012] An inter-board connector includes a connector base, a control board, and a connector pin assembly as described in any of the above embodiments. The mounting end of the connector base has a mounting surface, and the mounting surface has a plurality of pin limiting holes. Each pin limiting hole is arranged parallel to each other and spaced apart. Each pin limiting hole is used to accommodate and limit the contact portion of the corresponding pin unit. The insulating solder mask base abuts against the mounting surface for limiting. The solder portion of each pin unit of the pin assembly is soldered to and electrically connected to the control board through a corresponding solder block.

[0013] A high-speed inter-board connector assembly includes two inter-board connectors as described in the above embodiments, wherein the two inter-board connectors are a plug connector and a socket connector, and the plug end of the plug connector is inserted into the socket end of the socket connector. The plug connector has multiple first exposed areas at its insertion end. Each of the multiple first exposed areas is connected to a plurality of pin limiting holes of the plug connector. The contact portion of each pin of the plug connector passes through the corresponding pin limiting hole of the plug connector and extends to the corresponding first exposed area, so that the contact portion of each pin of the plug connector is partially exposed to the corresponding first exposed area. The socket connector has multiple second exposed areas at its insertion end. These multiple second exposed areas are connected to multiple pin limiting holes of the socket connector in a one-to-one correspondence. The contact portion of each pin of the socket connector passes through the corresponding pin limiting hole and extends to the corresponding second exposed area, so that the contact portion of each pin of the socket connector is partially exposed in the corresponding second exposed area. The first exposed area and the second exposed area are arranged opposite to each other. The contact portion of each pin of the plug connector abuts against and is electrically connected to the contact portion of each pin of the socket connector.

[0014] A method for manufacturing an inter-board connector, used to manufacture the inter-board connector described in the above embodiments, the method comprising: The insulating solder resist base is sealed and fixed to the connecting part of each pin of the pin assembly, and each pin of the pin assembly is arranged parallel to each other at intervals. Each of the aforementioned welding blocks is fixed to the welding portion of the corresponding insert unit; Insert the contact portion of each pin of the pin assembly into the corresponding pin limiting hole of the board connector until the insulating solder mask base abuts and is limited to the mounting surface of the board connector, so that the contact portion of each pin of the pin assembly is limited to the corresponding pin limiting hole. The solder portion of each pin unit is soldered to the control board via the corresponding solder block.

[0015] Compared with the prior art, this disclosure has at least the following advantages: 1. The aforementioned connector pin assembly includes a pin assembly and an insulating solder mask base. The pin assembly includes multiple pin units, each pin unit comprising a contact portion, a connecting portion, and a soldering portion fixed in sequence. The insulating solder mask base is sealed and fixed to the connecting portion of each pin unit of the pin assembly, such that the multiple pin units of the pin assembly are arranged parallel to each other at intervals. The insulating solder mask base surrounds the outer peripheral wall of the connecting portion of each pin unit of the pin assembly. Each pin unit of the pin assembly has a soldering block fixed to its soldering portion. The soldering portion of each pin unit is used for soldering and electrical connection to the control board of the inter-board connector through the corresponding soldering block. During the reflow soldering process of the inter-board connector, the soldering portion of each pin unit... The solder blocks melt when heated, and the insulating solder mask effectively blocks the molten solder blocks at the corresponding solder joints of each pin unit. This prevents the molten solder blocks from climbing along the length of the pin unit to the contact area, thus avoiding the loss of solder blocks at the corresponding solder joints. This ensures that each pin unit has sufficient solder blocks to reliably solder and electrically connect to the control board, effectively reducing the occurrence of cold solder joints between the pin unit and the control board due to insufficient or missing solder blocks. This significantly reduces the rework rate of inter-board connectors, greatly improving the production quality and efficiency of inter-board connectors, and also significantly reducing the production cost of inter-board connectors.

[0016] 2. Since the insulating solder mask base can also fix multiple pin units side by side, compared with the existing board connectors where each pin unit needs to be installed separately in the board connector during the production process, the connector pin assembly disclosed herein can install multiple pin units at once when installed in the board connector, which greatly reduces the assembly steps of the board connector and further improves the production efficiency of the board connector. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a partial structural schematic diagram of a connector pin assembly according to an embodiment; Figure 2 This is another partial structural diagram of the connector pin assembly; Figure 3 for Figure 2 A partially enlarged schematic diagram of the connector pin assembly shown; Figure 4 for Figure 2 Another partially enlarged schematic diagram of the connector pin assembly shown; Figure 5 This is a schematic diagram of the connector pin assembly. Figure 6 This is a partial structural diagram of the inter-board connector; Figure 7 This is another partial structural diagram of the inter-board connector; Figure 8 This is a structural schematic diagram of an inter-board high-speed connector assembly; Figure 9 for Figure 8 A partially enlarged schematic diagram of the inter-board high-speed connector assembly shown; Figure 10 for Figure 8 Another enlarged schematic diagram of the inter-board high-speed connector assembly shown; Figure 11 for Figure 5 A schematic diagram showing the assembly steps of the connector pin assembly; Figure 12 This is a schematic diagram illustrating the specific steps of the manufacturing process for inter-board connectors.

[0019] Reference numerals: 10, High-speed inter-board connector assembly; 100, Inter-board connector; 110, Connector pin assembly; 111, Pin assembly; 1111, Pin unit; 11111, Contact portion; 111111, Flexible snap-fit ​​flange; 1111111, Guide bevel; 1111112, Abutment limiting surface; 111112, Recessed area; 11112, Connecting portion; 111121, Positioning groove; 11113, Soldering portion; 111131, Mounting hole; 111132, Inverted... 111133, Boss structure; 1112, Welding block; 1113, Metal connector; 112, Insulating solder resist base; 120, Control board; 130, Connector base; 131, Mounting surface; 1311, Guide positioning flange; 132, Pin limiting hole; 140, Plug connector; 141, First exposed area; 142, Plug flange; 1421, Guide key; 150, Socket connector; 151, Second exposed area; 152, Plug groove; 1521, Guide limiting groove. Detailed Implementation

[0020] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments: like Figures 1 to 8 As shown, a connector pin assembly 110 of one embodiment is used for mounting within an inter-board connector 100. The connector pin assembly 110 includes a pin assembly 111 and an insulating solder mask base 112; the pin assembly 111 includes a plurality of pin units 1111, each pin unit 1111 including a contact portion 11111, a connecting portion 11112 and a soldering portion 11113 fixed in sequence, the insulating solder mask base 112 is sealed and fixed to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, such that the plurality of pin units 1111 of the pin assembly 111 are arranged parallel to each other at intervals, and the insulating solder mask base 112 surrounds the outer peripheral wall of the connecting portion 11112 of each pin unit 1111 of the pin assembly 111.

[0024] Each pin assembly 1111 has a soldering portion 11113 fixed with a soldering block 1112. The soldering portion 11113 of each pin assembly 1111 is soldered and electrically connected to the control board 120 of the board connector 100 via the corresponding soldering block 1112. During the reflow soldering operation of the board connector 100, the soldering block 1112 at the soldering portion 11113 of each pin assembly 1111 melts due to heat. The insulating solder resist base 112 can effectively block and limit the molten soldering block 1112 at the soldering portion 11113 of each pin assembly 1111, preventing the molten soldering block 1112 from being blocked along the corresponding soldering portion 11113. The pin unit 1111 ascends along its length to the contact portion 11111 of the insert pin unit 1111, causing the loss of solder blocks 1112 at the corresponding solder portion 11113. This ensures that each insert pin unit 1111's solder portion 11113 has sufficient solder blocks 1112 for secure soldering and electrical connection to the control board 120. This effectively reduces the occurrence of cold solder joints between the insert pin unit 1111's solder portion 11113 and the control board 120 due to insufficient or missing solder blocks 1112, thereby greatly reducing the rework rate of the inter-board connector 100. This not only significantly improves the production quality and efficiency of the inter-board connector 100 but also significantly reduces its production cost.

[0025] like Figures 1 to 8 As shown, the insulating solder mask base 112 can further fix multiple pin units 1111 side by side. Compared with the prior art inter-board connector 100, which requires each pin unit 1111 to be installed separately in the inter-board connector 100 during the production process, the connector pin assembly 110 of this disclosure can install multiple pin units 1111 at one time when installed in the inter-board connector 100, which greatly reduces the assembly steps of the inter-board connector 100 and further improves the production efficiency of the inter-board connector 100.

[0026] The aforementioned connector pin assembly 110 includes a pin assembly 111 and an insulating solder mask base 112. The pin assembly 111 includes multiple pin units 1111, each pin unit 1111 including a contact portion 11111, a connecting portion 11112, and a soldering portion 11113 fixed in sequence. The insulating solder mask base 112 is sealed and fixed to the connecting portion 11112 of each pin unit 1111 in the pin assembly 111, and the multiple pin units 1111 of the pin assembly 111 are parallel to each other. The pins are spaced apart, and the insulating solder mask base 112 surrounds the outer peripheral wall of the connecting portion 11112 of each pin unit 1111 in the pin assembly 111. Each pin unit 1111 in the pin assembly 111 has a solder block 1112 fixed to its soldering portion 11113. The soldering portion 11113 of each pin unit 1111 is soldered and electrically connected to the control board 120 of the board-to-board connector 100 via the corresponding solder block 1112. During the reflow soldering operation of the board-to-board connector 100, each pin unit 1111... The weld block 1112 at the weld portion 11113 of pin 11 melts upon heating, and the insulating solder resist base 112 effectively blocks and confines the molten weld block 1112 at the weld portion 11113 of each pin unit 1111 to the corresponding weld portion 11113. This prevents the weld block 1112 from being lost at the corresponding weld portion 11113 due to the weld block 1112 climbing up along the length of the pin unit 1111 to the contact portion 11111 of the pin unit 1111 after heating, thus ensuring that each The soldering part 11113 of the pin unit 1111 is reliably soldered and electrically connected to the control board 120 with sufficient solder blocks 1112. This effectively reduces the possibility of poor soldering between the soldering part 11113 of the pin unit 1111 and the control board 120 due to insufficient or missing solder blocks 1112. This greatly reduces the rework rate of the board connector 100, which not only greatly improves the production quality and efficiency of the board connector 100, but also greatly reduces the production cost of the board connector 100.

[0027] Furthermore, since the insulating solder mask base 112 can also fix multiple pin units 1111 side by side, compared with the prior art inter-board connector 100 which requires each pin unit 1111 to be installed separately in the inter-board connector 100 during the production process, the connector pin assembly 110 of this disclosure can install multiple pin units 1111 at one time when installed in the inter-board connector 100, which greatly reduces the assembly steps of the inter-board connector 100 and further improves the production efficiency of the inter-board connector 100.

[0028] like Figures 1 to 5As shown, in one embodiment, the insulating solder resist base 112 is injection molded onto the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, and the insulating solder resist base 112 is injection molded and sealed to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111. This not only greatly reduces the assembly difficulty of the insulating solder resist base 112 and the pin assembly 111, but also allows the insulating solder resist base 112 in the molten state to automatically adapt to the shape of the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, so that the insulating solder resist base 112 can be more securely fixed to the pin assembly 111, and at the same time improves the sealing performance between the insulating solder resist base 112 and the connecting portion 11112 of each pin unit 1111 of the pin assembly 111.

[0029] like Figures 1 to 5 As shown, in this embodiment, the pin unit 1111 is a copper pin unit or an aluminum pin unit, so that the pin unit 1111 not only has good structural strength, but also good electrical conductivity.

[0030] like Figures 1 to 5 As shown, in one embodiment, the solder block 1112 is a lead-free solder, which not only reduces environmental pollution but also avoids harm to the human body. In this embodiment, the solder block 1112 is a SAC305 solder block, a tin-copper solder block, and a tin-silver solder block. For example, the mass ratio of Sn, Ag, and Cu in the SAC305 solder block is 96.5:3.0:0.5. Another example is the mass ratio of Sn and Cu in the tin-copper solder block, which is 99.3:0.7. Yet another example is the mass ratio of Sn and Ag in the tin-silver solder block, which is 96.5:3.5.

[0031] like Figures 1 to 5 As shown, in one embodiment, the insulating solder mask base 112 is a high-temperature resistant plastic base. This prevents the insulating solder mask base 112 from melting and being damaged due to high temperatures during reflow soldering of the connector pin assembly 110 (temperature between 200°C and 230°C). The insulating solder mask base 112 effectively confines the molten solder block 1112 within the solder portion 11113 of the pin unit 1111, thereby ensuring that the solder portion 11113 of the pin unit 1111 is reliably soldered and electrically connected to the control board 120. Furthermore, the insulating solder mask base 112 can be a PI (polyimide) base, a PEEK (polyetheretherketone) base, or a PPS (polyphenylene sulfide) base, to provide good high-temperature resistance, structural strength, and insulation performance.

[0032] like Figures 1 to 5As shown, in one embodiment, each pin unit 1111 has a positioning groove 111121 formed in the connecting portion 11112. The insulating solder mask base 112 is injection molded and sealed to the inner wall of the positioning groove 111121. The positioning groove 111121 is used to engage and limit the insulating solder mask base 112. This not only effectively prevents the solder block 1112 in the molten state from flowing out from the gap between the insulating solder mask base 112 and the inner wall of the positioning groove 111121, but also allows the pin unit 1111 to securely limit the insulating solder mask base 112 to the connecting portion 11112 of the pin unit 1111 through the positioning groove 111121. This prevents the insulating solder mask base 112 from shaking or even shifting relative to the pin unit 1111 when subjected to collision or vibration, thereby greatly improving the stability and production quality of the board connector 100.

[0033] like Figures 1 to 5 As shown, in one embodiment, the contact portion 11111, the connecting portion 11112, and the welding portion 11113 are integrally stamped structures to improve the structural compactness of the pin unit 1111.

[0034] like Figures 1 to 5 As shown, in one embodiment, the pin assembly 111 further includes a plurality of metal connecting pieces 1113. Each metal connecting piece 1113 is disposed between the contact portions 11111 of two adjacent pin units 1111. Both ends of each metal connecting piece 1113 are respectively fixed to the contact portions 11111 of two adjacent pin units 1111. Each metal connecting piece 1113 of the pin assembly 111 is used for cutting and removing after the insulating solder mask base 112 is injection molded onto the connecting portion 11112 of each pin unit 1111 of the pin assembly 111. Each pin unit 1111 is arranged parallel to each other through each metal connecting piece 1113. The connecting portion 11111 of each pin unit 1111 of the pin assembly 111 is injection molded onto the insulating solder mask base 112. At step 112, each pin unit 1111 can be fixed to each other and arranged in parallel intervals by the metal connecting material 1113, so as to facilitate the injection molding of the insulating solder mask base 112 and ensure that each pin unit 1111 can be arranged in parallel intervals after the insulating solder mask base 112 is formed. After removing each metal connecting material 1113, each pin unit 1111 can be arranged in parallel intervals by the insulating solder mask base 112. This not only reduces the assembly difficulty of the connector pin assembly 110, but also ensures that each pin unit 1111 is not conductive to each other, avoiding mutual interference between adjacent pin units 1111 when the board connector 100 is transmitting signals, thereby greatly improving the production efficiency and usage stability of the board connector 100.

[0035] like Figures 1 to 5As shown, in one embodiment, each pin unit 1111 and each metal connector 1113 of the pin assembly 111 are integrally stamped structures to improve the structural compactness of the pin assembly 111.

[0036] like Figures 1 to 5 As shown, in one embodiment, each solder block 1112 is crimped and fixed to the solder portion 11113 of the corresponding pin unit 1111. This not only ensures that each solder block 1112 can be reliably fixed to the solder portion 11113 of the corresponding pin unit 1111, but also effectively reduces the installation difficulty between the solder block 1112 and the solder portion 11113 of the pin unit 1111, thereby greatly improving the production efficiency of the board connector 100. Furthermore, each solder block 1112 is pressed onto the solder portion 11113 of the corresponding pin unit 1111 by a cold pressing process. Since the solder block 1112 is a lead-free solder (melting temperature of 200℃-230℃), the solder block 1112 can be pressed onto the solder portion 11113 of the pin unit 1111 at room temperature (20℃-40℃). This not only prevents the solder block 1112 from melting due to heat and falling off from the solder portion 11113 of the pin unit 1111, but also eliminates the need for special tooling fixtures to confine the molten solder block 1112 to the solder portion 11113 of the pin unit 1111 and wait for the solder block 1112 to cool and solidify. This greatly reduces the fixing operation steps and fixing time between the solder block 1112 and the solder portion 11113 of the pin unit 1111, thereby greatly improving the production efficiency of the board connector 100.

[0037] like Figures 1 to 5As shown, in one embodiment, each pin assembly 1111 of the pin assembly 111 has a mounting hole 111131 formed in the solder portion 11113 of each pin unit 1111. Each solder block 1112 fills and is confined in the corresponding mounting hole 111131. Since the solder block 1112 is made of lead-free solder and is relatively soft, when the solder block 1112 is pressed onto the solder portion 11113 of the pin unit 1111, the solder block 1112 can be guided into the mounting hole 111131 through its own deformation capacity and fill the mounting hole 111131. This not only allows the solder block 1112 to... The soldering portion 11113 of the pin unit 1111 is securely located, and the soldering area between the soldering portion 11113 of the pin unit 1111 and the soldering block 1112 is increased. This allows the soldering portion 11113 of the pin unit 1111 to be more securely soldered and fixed to the control board 120, thereby greatly improving the electrical connection stability between the soldering portion 11113 of the pin unit 1111 and the control board 120. This effectively reduces the possibility of poor soldering between the soldering portion 11113 of the pin unit 1111 and the control board 120, thereby improving the stability of the board connector 100 in use and the production quality.

[0038] like Figures 1 to 5 As shown, in one embodiment, the mounting hole 111131 has a polygonal cross-section so that the solder block 1112 can be more securely positioned on the solder portion 11113 of the pin unit 1111, thereby improving the stability of the board connector 100 in use.

[0039] like Figures 1 to 5 As shown, in one embodiment, the inner peripheral walls at both ends of the mounting hole 111131 are formed with chamfered bevels 111132. The chamfered bevels 111132 extend obliquely away from the mounting hole 111131, so that when the welding block 1112 is pressed from one end of the mounting hole 111131 to the welding portion 11113 of the pin unit 1111, the welding block 1112 can fill into the mounting hole 111131 through its own deformation capacity. 111132 can guide and expand the welding block 1112 extending to the other end of the mounting hole 111131, so that the welding block 1112 extending to the outside of the mounting hole 111131 can expand outward and form a limiting structure, thereby enabling the welding block 1112 to be more securely limited in the welding part 11113 of the pin unit 1111, thereby greatly improving the welding quality between the welding part 11113 of the pin unit 1111 and the control board 120.

[0040] like Figures 1 to 5As shown, in one embodiment, the solder portion 11113 of each pin unit 1111 is formed with a boss structure 111133, and the solder block 1112 is pressed and fixed on the boss structure 111133 to increase the pressing area between the solder block 1112 and the solder portion 11113 of the pin unit 1111, so that the solder block 1112 can be more securely fixed on the solder portion 11113 of the pin unit 1111, thereby greatly improving the stability of the board connector 100.

[0041] like Figures 1 to 8 As shown, this disclosure also provides an inter-board connector 100, including a connector base 130, a control board 120, and a connector pin assembly 110 as described in any of the above embodiments. The mounting end of the connector base 130 has a mounting surface 131, and the mounting surface 131 has a plurality of pin limiting holes 132. Each pin limiting hole 132 is arranged parallel to each other and spaced apart. Each pin limiting hole 132 is used to accommodate and limit the contact portion 11111 of the corresponding pin unit 1111. The insulating solder mask base 112 abuts against the mounting surface 131 for limiting. The solder portion 11113 of each pin unit 1111 of the pin assembly 111 is soldered through a corresponding solder block 1112 and electrically connected to the control board 120.

[0042] It is understandable that the existing board-to-board connector 100 generally uses a method of filling with fixing adhesive to securely fix the contact portion 11111 of the pin unit 1111 to the pin limiting hole 132 of the connector base 130. However, due to the narrow gap between the contact portion 11111 of the pin unit 1111 and the pin limiting hole 132, the difficulty of filling with adhesive is greatly increased. At the same time, after filling the gap between the contact portion 11111 of the pin unit 1111 and the pin limiting hole 132 with fixing adhesive, it is necessary to wait for a period of time until the fixing adhesive is completely cured, which greatly increases the manufacturing difficulty of the board-to-board connector 100 and thus reduces the production efficiency of the board-to-board connector 100.

[0043] like Figures 1 to 7As shown, in one embodiment, each pin unit 1111 of the pin assembly 111 has a contact portion 11111 with a protruding elastic snap-fit ​​flange 111111. The inner wall of each pin limiting hole 132 has a snap-fit ​​groove (not shown) opposite to the elastic snap-fit ​​flange 111111. The elastic snap-fit ​​flange 111111 is used to snap and fix with the snap-fit ​​groove, so that after the contact portion 11111 of each pin unit 1111 is inserted into the corresponding pin limiting hole 132, it can be reliably fixed to the connector through the mutual cooperation of the elastic snap-fit ​​flange 1111111 and the snap-fit ​​groove. On the base 130, the elastic snap-fit ​​flange 111111 can also buffer and disperse the extrusion pressure between the contact portion 11111 of the pin unit 1111 and the hole wall of the pin limiting hole 132 through its own elastic properties, so as to avoid damage or even destruction of the contact portion 11111 of the pin unit 1111 and the connector base 130 due to excessive pressure. This not only greatly reduces the manufacturing difficulty of the board connector 100 and improves the production efficiency of the board connector 100, but also greatly improves the production quality and service life of the board connector 100.

[0044] like Figures 1 to 7As shown, in one embodiment, each pin unit 1111's contact portion 11111 also forms a clearance region 111112. An elastic snap-fit ​​flange 111111 is located within the clearance region 111112. The elastic snap-fit ​​flange 111111 extends obliquely along the length of the pin unit 1111, so that the clearance region 111112 can provide sufficient elastic deformation space for the elastic snap-fit ​​flange 111111, greatly improving the stability of the elastic snap-fit ​​flange 111111 in use. The elastic snap-fit ​​flange 111111 is located away from the insulating solder mask base 1. One side of the 12 has a guiding slope 1111111, and the elastic snap-fit ​​flange 111111 has an abutment limiting surface 1111112 on one side adjacent to the insulating solder mask base 112. When the contact portion 11111 of each pin of the pin assembly 111 is inserted into the corresponding pin limiting hole 132 of the board connector 100, the elastic snap-fit ​​flange 111111 of the contact portion 11111 of each pin is able to move to the avoidance area 11 by the guidance of the guiding slope 1111111 and its own elastic deformation capability. Within 1112, to prevent motion interference between the elastic locking flange 111111 and the connector base 130 when the contact portion 11111 of the pin unit 1111 is inserted into the pin limiting hole 132, so as to facilitate the insertion of the contact portion 11111 of the pin unit 1111 into the pin limiting hole 132; and when the contact portion 11111 of each pin unit 1111 is inserted into the preset position of the corresponding pin limiting hole 132, the elastic locking flange 111111 and the locking groove are aligned with each other, so that the elastic locking flange 111111 can pass through the self- The elastic deformation capability of the body is restored to the initial state, so that the elastic snap-fit ​​flange 111111 extends into and snaps into the snap-fit ​​groove. Furthermore, the elastic snap-fit ​​flange 111111 can also reliably limit the contact portion 11111 of the pin unit 1111 within the pin limiting hole 132 by abutting against the limiting surface 1111112, so as to prevent the contact portion 11111 of the pin unit 1111 from disengaging from the pin limiting hole 132. This not only greatly improves the stability of use and production quality of the board connector 100, but also greatly reduces the manufacturing difficulty of the board connector 100.

[0045] It is understandable that during the manufacturing process of the inter-board connector 100, the control board 120 needs to be installed at a preset position on the connector base 130, and the solder portion 11113 of each pin of the pin assembly 111 installed on the connector base 130 needs to be soldered onto the control board 120. However, in the prior art, the inter-board connector 100 is generally aligned manually by visual inspection to place the control board 120 at the preset position on the connector base 130, and then a reflow soldering operation is performed to ensure that the solder portion 11113 of each pin is soldered onto the control board 120. This not only greatly reduces the difficulty and efficiency of alignment between the connector base 130 and the control board 120, but also, during the reflow soldering operation, the control board 120 is prone to shaking or even displacement relative to the connector base 130 due to external factors such as collisions or vibrations, which greatly reduces the production efficiency and quality of the inter-board connector 100.

[0046] like Figures 1 to 7 As shown, in one embodiment, the mounting surface 131 of the connector base 130 is further provided with a guide positioning flange 1311, and the control plate 120 is formed with a positioning hole (not shown) that matches the guide positioning flange 1311. This allows the control plate 120 to be quickly and accurately positioned at a preset position on the connector base 130 through the mutual cooperation between the guide positioning flange 1311 and the positioning hole, greatly reducing the difficulty of assembling and aligning the control plate 120 and the connector base 130. Simultaneously, the control plate 120 can be positioned quickly and accurately through the guide positioning flange 1311. 1. The positioning hole is reliably positioned at the preset position of the connector base 130 to prevent the control board 120 from shaking or even shifting relative to the connector base 130 when the solder part 1111 of each pin of the pin assembly 111 mounted on the connector base 130 is soldered to the control board 120. This not only greatly reduces the soldering difficulty between the connector pin assembly 110 and the control board 120, but also greatly improves the soldering quality between the connector pin assembly 110 and the control board 120.

[0047] like Figures 1 to 7 As shown, in one embodiment, there are two guide positioning flanges 1311. The two guide positioning flanges 1311 are respectively disposed at both ends of the mounting surface 131, and the two guide positioning flanges 1311 are staggered and spaced apart from each other, so that the welding surface of the control board 120 can be set toward the mounting surface 131 of the connector base 130, avoiding the need for rework of the control board 120 due to misalignment, thus greatly reducing the rework rate of the board connector 100 and improving the production efficiency of the board connector 100.

[0048] like Figures 1 to 7As shown, in one embodiment, the connector base 130 is an injection-molded structure. Further, the connector base 130 is a polyamide base, a polybutylene terephthalate base, or a polyphenylene sulfide base, so that the connector base 130 can have better insulation performance and structural strength.

[0049] like Figures 1 to 7 As shown, in another embodiment, the mounting surface 131 also forms a limiting groove (not shown) adapted to the insulating solder mask base 112. The insulating solder mask base 112 is used to engage with the limiting groove when the contact portion 11111 of each pin of the pin assembly 111 is accommodated and limited in the corresponding pin limiting hole 132. This allows the connector pin assembly 110 to be more securely limited in the preset position of the connector base 130 by the insulating solder mask base 112, preventing the pin assembly 111 from sliding or even displacing relative to the connector base 130 when the inter-board connector 100 is affected by external factors such as collision or vibration. At the same time, it can also prevent the contact portion 11111 of the pin of the pin of the pin of the pin of the pin of the pin of the pin limiting hole 132 from being inserted too deeply, causing the elastic locking flange 111111 to detach from the locking groove, thereby greatly improving the stability of the inter-board connector 100.

[0050] like Figures 1 to 10 As shown, this disclosure also provides an inter-board high-speed connector assembly 10, including two inter-board connectors 100 as described in the above embodiments. The two inter-board connectors 100 are a plug connector 140 and a socket connector 150, respectively, with the plug end of the plug connector 140 plugged into the socket end of the socket connector 150.

[0051] The plug connector 140 has a plurality of first exposed areas 141 at its insertion end. The plurality of first exposed areas 141 are connected to the plurality of pin limiting holes 132 of the plug connector 140 in a one-to-one correspondence. The contact portion 11111 of each pin of the plug connector 140 passes through the corresponding pin limiting hole 132 of the plug connector 140 and extends to the corresponding first exposed area 141, so that the contact portion 11111 of each pin of the plug connector 140 is partially exposed in the corresponding first exposed area 141. The socket connector 150 has a plurality of second exposed areas 151 at its socket end. The plurality of second exposed areas 151 are correspondingly provided and connected to the plurality of pin limiting holes 132 of the socket connector 150. The contact portion 11111 of each pin of the socket connector 150 passes through the corresponding pin limiting hole 132 of the socket connector 150 and extends to the corresponding second exposed area 151, so that the contact portion 11111 of each pin of the socket connector 150 is partially exposed in the corresponding second exposed area 151.

[0052] The first exposed area 141 and the second exposed area 151 are arranged opposite to each other. The contact portion 11111 of each pin of the plug connector 140 abuts and is electrically connected to the contact portion 11111 of each pin of the socket connector 150, thereby achieving a stable electrical connection between the plug connector 140 and the socket connector 150. In this embodiment, the plug end of the plug connector 140 is a protruding structure, and the socket end of the socket connector 150 is a recessed structure, so that the plug end of the plug connector 140 can be reliably plugged into and unplugged from the socket end of the socket connector 150.

[0053] like Figures 1 to 10 As shown, in one embodiment, the plug end of the socket connector 150 is formed with a plug groove 152, and the plug end of the plug connector 140 is formed with a plug flange 142 that is adapted to the plug groove 152. The plug flange 142 is used to plug and limit the plug end within the plug groove 152, so that the plug end of the plug connector 140 can be reliably plugged into the plug end of the socket connector 150 through the mutual cooperation of the plug flange 142 and the plug groove 152. This enables the plug connector 140 to achieve a stable electrical connection with the socket connector 150, and avoids the phenomenon of the plug connector 140 and the socket connector 150 separating when the inter-board high-speed connector assembly 10 is affected by external factors such as collision or vibration. This greatly improves the stability of the inter-board high-speed connector assembly 10.

[0054] like Figures 1 to 10 As shown, in one embodiment, guide keys 1421 are protruding on both sides of the insertion flange 142, and guide limiting grooves 1521 are formed on the inner peripheral wall of the insertion groove 152, which are opposite to the guide keys 1421. This allows the insertion flange 142 to be quickly aligned with the preset position of the insertion groove 152 by the guidance of the guide keys 1421, which greatly reduces the difficulty of alignment and insertion between the plug connector 140 and the socket connector 150. At the same time, the insertion flange 142 can also be more securely locked and limited in the insertion groove 152 by the mutual cooperation of the guide keys 1421 and the guide limiting grooves 1521, thereby greatly improving the reliability of the insertion between the plug connector 140 and the socket connector 150, and thus greatly improving the ease of use and stability of the inter-board high-speed connector assembly 10.

[0055] like Figures 11 to 12 As shown, this disclosure also provides a method for manufacturing an inter-board connector, used to manufacture the inter-board connector 100 described in the above embodiments. The method for manufacturing the inter-board connector includes some or all of the following steps: S101, the connecting part 11112 of the insulating solder resist base 112 and each pin unit 1111 of the pin assembly 111 is integrally injection molded, and each pin unit 1111 of the pin assembly 111 is arranged parallel to each other at intervals. In this embodiment, the insulating solder mask base 112 is sealed and fixed to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, and the pin units 1111 of the pin assembly 111 are arranged parallel to each other at intervals. During the reflow soldering operation of the board connector 100, the solder block 1112 at the solder portion 11113 of each pin unit 1111 is melted by heat. The insulating solder mask base 112 can effectively block and limit the molten solder block 1112 at the solder portion 11113 of each pin unit 1111 to the corresponding solder portion 11113, and prevent the molten solder block 1112 from spreading along the length of the pin unit 1111. The phenomenon of solder blocks 1112 being lost at the corresponding solder part 11113 caused by the climbing to the contact part 11111 of the pin unit 1111 ensures that the solder part 11113 of each pin unit 1111 has sufficient solder blocks 1112 to be reliably soldered and electrically connected to the control board 120. This effectively reduces the possibility of cold solder joints caused by insufficient or missing solder blocks 1112 between the solder part 11113 of the pin unit 1111 and the control board 120, thereby greatly reducing the rework rate of the inter-board connector 100. This not only greatly improves the production quality and efficiency of the inter-board connector 100, but also greatly reduces the production cost of the inter-board connector 100.

[0056] S103, fix each welding block 1112 to the welding part 11113 of the corresponding pin unit 1111; In this embodiment, each welding block 1112 is fixed to the welding portion 11113 of the corresponding pin unit 1111, so that the welding portion 11113 of each pin unit 1111 can be welded and fixed by the corresponding welding block 1112 and electrically connected to the control board 120.

[0057] S105, insert the contact portion 11111 of each pin of the pin assembly 111 into the corresponding pin limiting hole 132 of the board connector 100 until the insulating solder mask base 112 abuts against and is limited to the mounting surface 131 of the board connector 100, so that the contact portion 11111 of each pin of the pin assembly 111 is limited to the corresponding pin limiting hole 132. In this embodiment, the contact portion 11111 of each pin of the pin assembly 111 is inserted into the corresponding pin limiting hole 132 of the board connector 100 until the insulating solder mask base 112 abuts against and is limited to the mounting surface 131 of the board connector 100, so that the contact portion 11111 of each pin of the pin assembly 111 is limited to the corresponding pin limiting hole 132, so that each pin of the pin assembly 111 can be installed and fixed on the connector base 130.

[0058] S107, the solder part 11113 of each pin unit 1111 is soldered to the control board 120 through the corresponding solder block 1112.

[0059] In this embodiment, the solder portion 11113 of each pin unit 1111 is soldered and electrically connected to the control board 120 via a corresponding solder block 1112. This ensures that the solder portion 11113 of each pin unit 1111 is securely soldered and fixed to the control board 120 via the solder block 1112, guaranteeing a stable electrical connection between the solder portion 11113 of each pin unit 1111 and the control board 120. This significantly improves the stability and production quality of the inter-board connector 100. Specifically, a reflow soldering process is used to solder and electrically connect the solder portion 11113 of each pin unit 1111 to the control board 120 via the corresponding solder block 1112.

[0060] In this embodiment, firstly, the insulating solder mask base 112 is sealed and fixed to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, such that each pin unit 1111 of the pin assembly 111 is arranged parallel to each other at intervals; secondly, each solder block 1112 is fixed to the solder portion 11113 of the corresponding pin unit 1111; then, the contact portion 11111 of each pin unit 1111 of the pin assembly 111 is inserted into the corresponding pin limiting hole 132 of the board connector 100, until the insulating solder mask base 112 abuts against and is limited to the mounting surface 131 of the board connector 100, such that the contact portion 11111 of each pin unit 1111 of the pin assembly 111 is limited to the corresponding pin limiting hole 132; finally, the solder portion 11113 of each pin unit 1111 is soldered through the corresponding solder block 1112 and electrically connected to the control board 120. During the reflow soldering process of the inter-board connector 100, the solder blocks 1112 at the solder portion 11113 of each pin unit 1111 melt due to heat. The insulating solder mask base 112 effectively blocks and confines the molten solder blocks 1112 at the corresponding solder portion 11113 of each pin unit 1111, preventing the molten solder blocks 1112 from climbing along the length of the pin unit 1111 to the contact portion 11111 of the pin unit 1111, thus preventing the solder blocks 1112 from being lost at the corresponding solder portion 11113. This ensures that each pin unit 1111's solder portion 11113 has sufficient solder blocks 1112 to be reliably soldered and electrically connected to the control board 120, thereby effectively reducing the contact between the solder portion 11113 of the pin unit 1111 and the control board 120. The possibility of incomplete or missing solder blocks 1112 between boards 120 is greatly reduced, thus significantly reducing the rework rate of the board connector 100. This not only greatly improves the production quality and efficiency of the board connector 100, but also significantly reduces the production cost of the board connector 100. Furthermore, the insulating solder mask base 112 can fix multiple pin units 1111 side by side. Compared with the existing board connector 100, which requires production personnel to install each pin unit 1111 individually in the board connector 100 during the production process, the connector pin assembly 110 of this disclosure can install multiple pin units 1111 at once when installed in the board connector 100, which greatly reduces the assembly steps of the board connector 100 and further improves the production efficiency of the board connector 100.

[0061] In one embodiment, the pin assembly 111 further includes a plurality of metal connecting pieces 1113. Each metal connecting piece 1113 is disposed between the contact portions 11111 of two adjacent pin units 1111. Both ends of each metal connecting piece 1113 are respectively fixed to the contact portions 11111 of two adjacent pin units 1111. Each metal connecting piece 1113 of the pin assembly 111 is used for cutting and removing after the insulating solder mask base 112 is injection molded onto the connecting portion 11112 of each pin unit 1111 of the pin assembly 111. Each pin unit 1111 is arranged parallel to each other through each metal connecting piece 1113. The specific step S101 of sealing and fixing the insulating solder mask base 112 to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, and ensuring that each pin unit 1111 of the pin assembly 111 is arranged parallel to each other, includes some or all of the following steps: S1011, the insulating solder mask base 112 is injection molded onto the connecting portion 11112 of each pin individual 1111 of the pin assembly 111, so that the insulating solder mask base 112 is injection molded and sealed to the connecting portion 11112 of each pin individual 1111 of the pin assembly 111. In this embodiment, the insulating solder resist base 112 is injection molded onto the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, so that the insulating solder resist base 112 is injection molded and sealed to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111. This not only greatly reduces the assembly difficulty of the insulating solder resist base 112 and the pin assembly 111, but also allows the insulating solder resist base 112 in the molten state to automatically adapt to the shape of the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, so that the insulating solder resist base 112 can be more securely fixed to the pin assembly 111. At the same time, it can also improve the sealing performance between the insulating solder resist base 112 and the connecting portion 11112 of each pin unit 1111 of the pin assembly 111.

[0062] S1013, each metal piece 1113 of the pin assembly 111 is cut and removed.

[0063] In this embodiment, each metal connecting piece 1113 of the pin assembly 111 is cut off to insulate each pin individual 1111 of the pin assembly 111 from each other, thereby avoiding signal interference between different pin individuals 1111 due to mutual conduction, and thus greatly improving the stability of the board connector 100.

[0064] In one embodiment, each weld block 1112 is press-fitted and fixed to the weld portion 11113 of the corresponding pin unit 1111; each pin unit 1111 of the pin assembly 111 has a mounting hole 111131 formed in its weld portion 11113, and each weld block 1112 fills and is confined within the corresponding mounting hole 111131. The specific step S103 of fixing each weld block 1112 to the weld portion 11113 of the corresponding pin unit 1111 includes some or all of the following steps: S1031, each welding block 1112 is crimped and fixed to the welding part 11113 of the corresponding pin unit 1111, such that each welding block 1112 fills and is confined in the corresponding mounting hole 111131.

[0065] In this embodiment, each solder block 1112 is crimped and fixed to the solder portion 11113 of the corresponding pin unit 1111, and each solder block 1112 fills and is confined in the corresponding mounting hole 111131. This not only ensures that each solder block 1112 can be reliably confined and fixed to the solder portion 11113 of the corresponding pin unit 1111, but also effectively reduces the installation difficulty between the solder block 1112 and the solder portion 11113 of the pin unit 1111, thereby greatly improving the production efficiency of the board connector 100.

[0066] In one embodiment, the specific step S1031 in which each welding block 1112 is crimped and fixed to the welding portion 11113 of the corresponding pin unit 1111, and each welding block 1112 fills and is confined in the corresponding mounting hole 111131, includes some or all of the following steps: S10311, each welding block 1112 is pressed and fixed to the welding part 11113 of the corresponding pin unit 1111 by a cold pressing process, so that each welding block 1112 fills and is confined in the corresponding mounting hole 111131.

[0067] In this embodiment, each solder block 1112 is pressed and fixed to the solder portion 11113 of the corresponding pin unit 1111 by a cold pressing process, so that each solder block 1112 fills and is confined in the corresponding mounting hole 111131. Since the solder block 1112 is lead-free solder (melting temperature of 200℃-230℃), the solder block 1112 can be pressed to the solder portion 11113 of the pin unit 1111 at room temperature (20℃-40℃), which not only avoids soldering The block 1112 melts due to heat, causing it to detach from the solder portion 11113 of the pin unit 1111. At the same time, there is no need for special tooling fixtures to confine the molten solder block 1112 to the solder portion 11113 of the pin unit 1111 and wait for the solder block 1112 to cool and solidify. This greatly reduces the fixing operation steps and fixing time between the solder block 1112 and the solder portion 11113 of the pin unit 1111, thereby greatly improving the production efficiency of the board connector 100.

[0068] In one embodiment, each pin of the pin assembly 111 has a contact portion 11111 with a protruding elastic snap-fit ​​flange 111111, and the inner wall of each pin limiting hole 132 has a snap-fit ​​groove (not shown) opposite to the elastic snap-fit ​​flange 111111. The elastic snap-fit ​​flange 111111 is used to snap and fix with the snap-fit ​​groove. The specific step S105 of inserting the contact portion 11111 of each pin of the pin assembly 111 into the corresponding pin limiting hole 132 of the board connector 100 until the insulating solder mask base 112 abuts against and is limited to the mounting surface 131 of the board connector 100, and so that the contact portion 11111 of each pin of the pin assembly 111 is limited to the corresponding pin limiting hole 132, includes some or all of the following steps: S1051, the contact portion 11111 of each pin unit 1111 of the pin assembly 111 is inserted into the corresponding pin limiting hole 132 of the board connector 100 until the insulating solder mask base 112 abuts against the mounting surface 131 of the board connector 100, so that the elastic snap-fit ​​flange 111111 of the contact portion 11111 of each pin unit 1111 is aligned with the snap-fit ​​groove.

[0069] In this embodiment, the contact portion 11111 of each pin unit 1111 of the pin assembly 111 is inserted into the corresponding pin limiting hole 132 of the board connector 100 until the insulating solder mask base 112 abuts and is limited to the mounting surface 131 of the board connector 100. This ensures that the elastic snap-fit ​​flange 111111 of the contact portion 11111 of each pin unit 1111 is aligned with the snap-fit ​​groove, allowing the elastic snap-fit ​​flange 111111 to recover to its initial state through its own deformation capacity and snap-fit ​​limited to the snap-fit ​​groove. The snap-fit ​​flange 111111 can also buffer and disperse the compressive force between the contact portion 11111 of the pin unit 1111 and the hole wall of the pin limiting hole 132 through its own elastic properties, so as to avoid damage or even destruction of the contact portion 11111 of the pin unit 1111 and the connector base 130 due to excessive pressure. This not only greatly reduces the manufacturing difficulty of the board connector 100 and improves the production efficiency of the board connector 100, but also greatly improves the production quality and service life of the board connector 100.

[0070] In one embodiment, the mounting surface 131 of the connector base 130 is further provided with a guide positioning flange 1311, and the control plate 120 is formed with a positioning hole adapted to the guide positioning flange 1311. The specific step S107 of soldering and electrically connecting the solder portion 11113 of each pin unit 1111 to the control plate 120 via the corresponding solder block 1112 includes some or all of the following steps: S1071, align the positioning hole of the control board 120 with the guide positioning flange 1311 of the connector base 130; In this embodiment, the positioning hole of the control board 120 is aligned with the guide positioning flange 1311 of the connector base 130 so that the control board 120 can be quickly and accurately positioned at the preset position of the connector base 130 through the mutual cooperation of the guide positioning flange 1311 and the positioning hole, which greatly reduces the difficulty of assembling and aligning the control board 120 and the connector base 130.

[0071] S1073, the positioning hole of the control board 120 is passed through the guide positioning flange 1311 so that the control board 120 is pre-positioned at the preset position of the connector base 130. In this embodiment, the positioning hole of the control board 120 is inserted into the guide positioning flange 1311 so that the control board 120 is pre-positioned at a preset position of the connector base 130. The control board 120 can be reliably limited to the preset position of the connector base 130 through the mutual cooperation of the guide positioning flange 1311 and the positioning hole. This avoids the phenomenon of the control board 120 shaking or even displacing relative to the connector base 130 when the welding part 11113 of each pin unit 1111 of the pin assembly 111 installed on the connector base 130 is welded to the control board 120. This not only greatly reduces the welding difficulty between the connector pin assembly 110 and the control board 120, but also greatly improves the welding quality between the connector pin assembly 110 and the control board 120.

[0072] S1075, the solder part 11113 of each pin unit 1111 is soldered to the control board 120 through the corresponding solder block 1112.

[0073] In this embodiment, the solder portion 11113 of each pin unit 1111 is soldered and electrically connected to the control board 120 through the corresponding solder block 1112, so that the solder portion 11113 of each pin unit 1111 can be reliably fixed on the control board 120, and at the same time, it can also ensure that the solder portion 11113 of each pin unit 1111 can be stably electrically connected to the control board 120, thereby greatly improving the stability of the inter-board connector 100.

[0074] Compared with the prior art, this disclosure has at least the following advantages: 1. The aforementioned inter-board connector 100, wherein the connector pin assembly 110 includes a pin assembly 111 and an insulating solder mask base 112; the pin assembly 111 includes a plurality of pin units 1111, each pin unit 1111 including a contact portion 11111, a connecting portion 11112 and a soldering portion 11113 fixed in sequence; the insulating solder mask base 112 is sealed and fixed to the connecting portion 11112 of each pin unit 1111 of the pin assembly 111, and the plurality of pin units 1111 of the pin assembly 111 are parallel to each other. The pins are spaced apart, and the insulating solder mask base 112 surrounds the outer peripheral wall of the connecting portion 11112 of each pin unit 1111 in the pin assembly 111. Each pin unit 1111 in the pin assembly 111 has a solder block 1112 fixed to its soldering portion 11113. The soldering portion 11113 of each pin unit 1111 is soldered and electrically connected to the control board 120 of the board-to-board connector 100 via the corresponding solder block 1112. During the reflow soldering operation of the board-to-board connector 100, each pin unit 1111... The weld block 1112 at the weld portion 11113 of pin 11 melts upon heating, and the insulating solder resist base 112 effectively blocks and confines the molten weld block 1112 at the weld portion 11113 of each pin unit 1111 to the corresponding weld portion 11113. This prevents the weld block 1112 from being lost at the corresponding weld portion 11113 due to the weld block 1112 climbing up along the length of the pin unit 1111 to the contact portion 11111 of the pin unit 1111 after heating, thus ensuring that each The soldering part 11113 of the pin unit 1111 is reliably soldered and electrically connected to the control board 120 with sufficient solder blocks 1112. This effectively reduces the possibility of poor soldering between the soldering part 11113 of the pin unit 1111 and the control board 120 due to insufficient or missing solder blocks 1112. This greatly reduces the rework rate of the board connector 100, which not only greatly improves the production quality and efficiency of the board connector 100, but also greatly reduces the production cost of the board connector 100.

[0075] 2. Since the insulating solder mask base 112 can also fix multiple pin units 1111 side by side, compared with the prior art board connector 100 which requires each pin unit 1111 to be installed separately in the board connector 100 during the production process, the connector pin assembly 110 of this disclosure can install multiple pin units 1111 at one time when installed in the board connector 100, which greatly reduces the assembly steps of the board connector 100 and further improves the production efficiency of the board connector 100.

[0076] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be defined by the appended claims.

Claims

1. A connector pin assembly for mounting within an inter-board connector, characterized in that, The connector pin assembly includes a pin assembly and an insulating solder mask base; The pin assembly includes multiple pin units, each pin unit including a contact portion, a connecting portion, and a soldering portion fixed in sequence. The insulating solder mask base is sealed and fixed to the connecting portion of each pin unit of the pin assembly, such that the multiple pin units of the pin assembly are arranged parallel to each other at intervals. The insulating solder mask base surrounds the outer peripheral wall of the connecting portion of each pin unit of the pin assembly. The soldering portion of each pin unit of the pin assembly is fixed with a soldering block. The soldering portion of each pin unit is used for soldering and electrical connection to the control board of the board-to-board connector through the corresponding soldering block.

2. The connector pin assembly according to claim 1, characterized in that, The insulating solder mask base is injection molded onto the connecting portion of each of the individual pins of the pin assembly, and the insulating solder mask base is injection molded and sealed to the connecting portion of each of the individual pins of the pin assembly.

3. The connector pin assembly according to claim 2, characterized in that, Each of the aforementioned pin units has a positioning groove formed at its connecting portion. The insulating solder mask base is injection molded and sealed to the inner wall of the positioning groove. The positioning groove is used to engage and limit the insulating solder mask base.

4. The connector pin assembly according to claim 2, characterized in that, The pin assembly further includes multiple metal connecting pieces. Each metal connecting piece is disposed between the contact portions of two adjacent pin units. The two ends of each metal connecting piece are respectively fixed to the contact portions of the two adjacent pin units. Each metal connecting piece of the pin assembly is used for cutting and removing after the insulating solder mask base is injection molded into the connecting portion of each pin unit of the pin assembly. Each pin unit is arranged parallel to each other through each metal connecting piece.

5. The connector pin assembly according to claim 1, characterized in that, Each of the aforementioned welding blocks is press-fitted and fixed to the welding portion of the corresponding insert unit.

6. The connector pin assembly according to claim 5, characterized in that, Each pin of the pin assembly has a mounting hole formed in its soldered portion, and each of the soldered blocks fills and is confined within the corresponding mounting hole.

7. The connector pin assembly according to claim 6, characterized in that, The inner peripheral walls at both ends of the mounting hole are formed with chamfered bevels, which extend at an angle away from the mounting hole.

8. An inter-board connector, characterized in that, The connector assembly includes a connector base, a control board, and a connector pin assembly according to any one of claims 1 to 7. The mounting end of the connector base has a mounting surface, and the mounting surface has a plurality of pin limiting holes. Each pin limiting hole is arranged parallel to each other and spaced apart. Each pin limiting hole is used to accommodate and limit the contact portion of the corresponding pin unit. The insulating solder mask base abuts against the mounting surface for limiting. The solder portion of each pin unit of the pin assembly is soldered to the control board through the corresponding solder block.

9. A high-speed inter-board connector assembly, characterized in that, It includes two board-to-board connectors as described in claim 8, wherein the two board-to-board connectors are a plug connector and a socket connector, and the plug end of the plug connector is inserted into the socket end of the socket connector; The plug connector has multiple first exposed areas at its insertion end. Each of the multiple first exposed areas is connected to a plurality of pin limiting holes of the plug connector. The contact portion of each pin of the plug connector passes through the corresponding pin limiting hole of the plug connector and extends to the corresponding first exposed area, so that the contact portion of each pin of the plug connector is partially exposed to the corresponding first exposed area. The socket connector has multiple second exposed areas at its insertion end. These multiple second exposed areas are connected to multiple pin limiting holes of the socket connector in a one-to-one correspondence. The contact portion of each pin of the socket connector passes through the corresponding pin limiting hole and extends to the corresponding second exposed area, so that the contact portion of each pin of the socket connector is partially exposed in the corresponding second exposed area. The first exposed area and the second exposed area are arranged opposite to each other. The contact portion of each pin of the plug connector abuts against and is electrically connected to the contact portion of each pin of the socket connector.

10. A method for manufacturing an inter-board connector, characterized in that, A method for manufacturing the inter-board connector of claim 8, comprising: The insulating solder resist base is sealed and fixed to the connecting part of each pin of the pin assembly, and each pin of the pin assembly is arranged parallel to each other at intervals. Each of the aforementioned welding blocks is fixed to the welding portion of the corresponding insert unit; Insert the contact portion of each pin of the pin assembly into the corresponding pin limiting hole of the board connector until the insulating solder mask base abuts and is limited to the mounting surface of the board connector, so that the contact portion of each pin of the pin assembly is limited to the corresponding pin limiting hole. The solder portion of each pin unit is soldered to the control board via the corresponding solder block.

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