Control device and vehicle with same

Abstract

The invention provides a control device and a vehicle with the control device, and the control device comprises a housing which is internally provided with a containing cavity; the circuit board is arranged in the accommodating cavity, a plurality of welding spots are arranged on the circuit board, the plurality of welding spots form a first welding spot group and a second welding spot group, and the first welding spot group and the second welding spot group are arranged at intervals inside and outside in the direction from the middle of the circuit board to the peripheral edge and cooperatively define a groove extending in the peripheral direction of the circuit board; the conductive part is connected with the shell and located in the containing cavity, at least part of the conductive part is matched in the groove, and the conductive part is connected with the multiple welding spots of the first welding spot set and the second welding spot set, so that the circuit board is grounded through the conductive part and the shell. According to the control device, the conductive part is arranged and abuts against the first welding spot set and the second welding spot set in the conductive groove, the matching position of the conductive part can be rapidly positioned, and therefore the mounting and positioning efficiency of the conductive part and the groove can be improved.

Description

Technical Field

[0001] This invention relates to the field of vehicle manufacturing technology, and in particular to a control device and a vehicle having the same. Background Technology

[0002] In existing control devices, to prevent electromagnetic interference between adjacent control devices, copper sheets are commonly used to connect the solder joints of the circuit board to the housing, thus grounding the circuit board and forming electromagnetic shielding within the housing to prevent mutual interference between adjacent control devices. However, the copper sheets need to have a high-precision plane to ensure electrical connection between the copper sheets and the solder joints of the circuit board, which places high demands on the processing of the copper sheets. At the same time, positioning the copper sheets and solder joints is difficult, making it impossible to guarantee that all solder joints can be connected in one installation, thus failing to improve installation and positioning efficiency. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a control device that can improve installation and positioning efficiency.

[0004] This application also proposes a vehicle having the aforementioned control device.

[0005] According to a first aspect of the present invention, a control device includes: a housing having a receiving cavity therein; a circuit board disposed within the receiving cavity, the circuit board having a plurality of solder joints, the plurality of solder joints forming a first solder joint group and a second solder joint group, the first solder joint group and the second solder joint group being arranged at intervals in the direction from the center of the circuit board toward the periphery, and cooperating to define a groove extending circumferentially along the circuit board; and a conductive element connected to the housing and located within the receiving cavity, at least a portion of the conductive element cooperating within the groove and connected to a plurality of solder joints of the first solder joint group and the second solder joint group, such that the circuit board is grounded through the conductive element and the housing.

[0006] According to the control device of the present invention, a conductive element is provided, which abuts against the first solder joint group and the second solder joint group in the conductive groove. The conductive element will not crush the solder joints on the circuit board, which can avoid the electromagnetic shielding effect being affected by maintenance operations, thereby ensuring that the control device can be maintained normally. At the same time, the groove guides the conductive element, which facilitates the quick positioning of the conductive element's mating position, thereby improving the installation and positioning efficiency of the conductive element and the groove.

[0007] According to some embodiments of the present invention, the plurality of solder joints include first solder joints and second solder joints, the first solder joint group includes a plurality of first solder joints arranged at intervals along the circumference of the circuit board, and the second solder joint group includes a plurality of second solder joints arranged at intervals along the circumference of the circuit board, wherein, in the circumference of the circuit board, at least a portion of the first solder joints and the second solder joints are staggered.

[0008] According to some alternative embodiments of the present invention, a plurality of first solder joints and a plurality of second solder joints are arranged alternately in the circumferential direction of the circuit board.

[0009] According to some alternative embodiments of the present invention, the spacing between the first solder joint and two adjacent second solder joints is unequal in the circumferential direction of the circuit board.

[0010] According to some embodiments of the present invention, at least a portion of the width of the conductive element gradually decreases in the direction from the opening of the groove toward the bottom wall.

[0011] According to some optional embodiments of the present invention, in the thickness direction of the circuit board, the side surface of the conductive element facing the bottom wall of the groove is a first surface, the width of the first surface is smaller than the width of the groove, and the maximum width of the conductive element is greater than the width of the groove.

[0012] According to some alternative embodiments of the invention, in the direction from the bottom wall of the groove toward the opening, the two side surfaces of the conductive element in the width direction extend obliquely toward each other.

[0013] According to some optional embodiments of the present invention, the conductive element has two curved surfaces on both sides in the width direction that convex in opposite directions.

[0014] According to some embodiments of the present invention, the plurality of solder joints of the first solder joint group and the plurality of solder joints of the second solder joint group are arranged in a ring along the circumference of the circuit board, and the first solder joint group is located inside the second solder joint group. The circuit board is provided with electrical components, and the electrical components are located inside the first solder joint group.

[0015] According to some optional embodiments of the present invention, the circuit board is further provided with a connector connected to the circuit board, the connector being arranged outside the second solder joint group.

[0016] According to some embodiments of the present invention, the housing includes a cover plate and a bottom shell, the bottom shell being open on one side in the thickness direction of the circuit board, the cover plate covering the open side of the bottom shell and cooperating with the bottom shell to define the receiving cavity.

[0017] According to some alternative embodiments of the present invention, the conductive element is integrally formed with the bottom shell or the cover plate.

[0018] According to some embodiments of the present invention, the periphery of the opening of the bottom shell is provided with a support edge extending outward from the receiving cavity, the periphery of the circuit board is supported on the support edge, and the conductive element is disposed on the support edge, wherein, in a projection plane perpendicular to the thickness direction of the circuit board, the projections of at least a portion of the solder joints and at least a portion of the conductive element are located within the projection range of the support edge.

[0019] According to some embodiments of the present invention, the cover plate, the circuit board and the bottom shell are fastened together by threaded fasteners.

[0020] A vehicle according to a second aspect of the present invention includes a control device according to a first aspect of the present invention.

[0021] According to the vehicle of the present invention, by providing the control device of the first aspect embodiment described above, a conductive component is provided. The conductive component abuts against the first solder joint group and the second solder joint group in the conductive groove. The conductive component will not crush the solder joints on the circuit board, which can avoid the electromagnetic shielding effect being affected by maintenance operations. This ensures that the control device can be maintained normally. At the same time, the groove guides the conductive component, making it convenient to quickly locate the mating position of the conductive component, thereby improving the installation and positioning efficiency of the conductive component and the groove.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] Figure 1 This is an exploded view of a control device according to an embodiment of the present invention;

[0024] Figure 2 yes Figure 1 A schematic diagram showing the housing and conductive components at one angle;

[0025] Figure 3 yes Figure 2 A schematic diagram of a portion of the structure of the housing and conductive components shown;

[0026] Figure 4 yes Figure 2 A schematic diagram of a portion of the structure of the housing and conductive components shown;

[0027] Figure 5 yes Figure 1 A schematic diagram of the circuit board shown;

[0028] Figure 6 yes Figure 5A magnified view of a section at point A in the middle;

[0029] Figure 7 yes Figure 1 A schematic diagram showing the angle at which the conductive component and solder joint are mated;

[0030] Figure 8 yes Figure 7 A schematic diagram of the conductive component and solder joint mating at another angle;

[0031] Figure 9 yes Figure 7 A schematic diagram of the conductive element shown.

[0032] Figure label:

[0033] 100. Control device;

[0034] 10. Shell; 11. Cover plate; 12. Bottom shell; 121. Supporting edge;

[0035] 20. Circuit board; 21. First solder joint group; 211. First solder joint; 22. Second solder joint group; 221. Second solder joint; 23. Groove; 24. Connector;

[0036] 30. Conductive component; 31. First surface;

[0037] 40. Fasteners. Detailed Implementation

[0038] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0039] The following is a reference appendix. Figure 1-9 A control device 100 according to an embodiment of the present invention is described.

[0040] Reference Figure 1 , Figure 5 , Figure 6 and Figure 7 According to an embodiment of the present invention, the control device 100 includes: a housing 10, a circuit board 20, and a conductive element 30.

[0041] Specifically, the housing 10 has a receiving cavity; the circuit board 20 is disposed in the receiving cavity, and the circuit board 20 has multiple solder points, that is, the circuit board 20 has two, three, four or more solder points, which constitute a first solder point group 21 and a second solder point group 22. In the direction from the center of the circuit board 20 toward the periphery, the first solder point group 21 and the second solder point group 22 are arranged at intervals and cooperate to define a groove 23 extending circumferentially along the circuit board 20; the conductive element 30 is connected to the housing 10 and located in the receiving cavity, and at least a part of the conductive element 30 is fitted in the groove 23, that is, either a part of the conductive element 30 is fitted in the groove 23, or the entire conductive element 30 is fitted in the groove 23, and is connected to multiple solder points of the first solder point group 21 and the second solder point group 22, so that the circuit board 20 is grounded through the conductive element 30 and the housing 10.

[0042] For example, such as Figure 1 , Figure 5 , Figure 6 and Figure 7 As shown, the circuit board 20 has multiple solder joints. A portion of these solder joints form a first solder joint group 21, with the solder joints of the first solder joint group 21 arranged at intervals along the circumference of the circuit board 20 and extending in a ring. A portion of these solder joints form a second solder joint group 22, with the solder joints of the second solder joint group 22 arranged at intervals along the circumference of the circuit board 20 and extending in a ring. In the arrangement direction of the first solder joint group 21 and the second solder joint group 22, a groove 23 is defined between adjacent solder joints of the first solder joint group 21 and the second solder joint group 22, so that the groove 23 is formed as a ring extending circumferentially along the circuit board 20. A conductive element 30 is adapted to the extension shape of the groove 23, and a portion of the conductive element 30 fits within the groove 23, so that the conductive element 30 is electrically connected to both the solder joints of the first solder joint group 21 and the solder joints of the second solder joint group 22. Preferably, both the conductive element 30 and the housing 10 are metal parts, thereby enabling the circuit board 20 to be grounded through the conductive element 30 and the housing 10.

[0043] It should be noted that the control device 100 can be applied to intelligent driving systems, air conditioning systems and battery pack thermal management systems. Since there is electromagnetic interference between adjacent control devices 100, the circuit board 20 needs to be grounded through the housing 10 to form a Faraday cage inside the housing 10, thereby reducing electromagnetic interference between adjacent control devices 100.

[0044] The control device 100 of the present invention is provided with a conductive element 30. The conductive element 30 abuts against the first solder joint group 21 and the second solder joint group 22 in the conductive groove and is electrically connected to the first solder joint group 21 and the second solder joint group 22, thereby enabling the circuit board 20 to be grounded and preventing electromagnetic interference from adjacent control devices 100. At the same time, the conductive element 30 is in abutting contact with the first solder joint group 21 and the second solder joint group 22, and the conductive element 30 will not crush the solder joints on the circuit board 20. Therefore, even if the housing 10 is disassembled and the circuit board 20 is reassembled, the conductive element 30 will not lose contact with the solder joints. This avoids the electromagnetic shielding effect being affected by maintenance operations, thereby ensuring that the control device 100 can be maintained normally and reducing the operating cost of the control device 100.

[0045] Furthermore, compared to the existing technology where copper sheets are placed in contact with solder joints, ensuring that the copper sheet can contact each solder joint requires a high-precision plane, which leads to processing difficulties. However, with the matching form of the conductive element 30 and the groove 23 in this application, the conductive element 30 is easy to process, and the groove 23 is formed by the solder joints of the adjacent first solder joint group 21 and the second solder joint group 22. Therefore, the processing difficulty can be reduced, and the connection stability between the conductive element 30 and the solder joints of the first solder joint group 21 and the second solder joint group 22 can be effectively ensured, thereby ensuring the electromagnetic shielding effect of the control device 100.

[0046] Furthermore, the groove 23 guides the conductive component 30, facilitating quick positioning of the conductive component 30 and thus improving the installation and positioning efficiency of the conductive component 30 and the groove 23.

[0047] According to an embodiment of the present invention, the control device 100 is provided with a conductive element 30. The conductive element 30 abuts against the first solder joint group 21 and the second solder joint group 22 in the conductive groove. The conductive element 30 will not crush the solder joints on the circuit board 20, which can avoid the electromagnetic shielding effect being affected by maintenance operations, thereby ensuring that the control device 100 can be maintained normally. At the same time, the groove 23 guides the conductive element 30, which facilitates the quick positioning of the mating position of the conductive element 30, thereby improving the installation and positioning efficiency of the conductive element 30 and the groove 23.

[0048] According to some embodiments of the present invention, with reference to Figure 5 and Figure 6The multiple solder joints include first solder joints 211 and second solder joints 221. The first solder joint group 21 includes multiple first solder joints 211 arranged at intervals along the circumference of the circuit board 20. That is, the first solder joint group 21 includes two, three, four or more first solder joints 211 arranged at intervals along the circumference of the circuit board 20. The second solder joint group 22 includes multiple second solder joints 221 arranged at intervals along the circumference of the circuit board 20. That is, the second solder joint group 22 includes two, three, four or more second solder joints 221 arranged at intervals along the circumference of the circuit board 20. In the circumference of the circuit board 20, at least some of the first solder joints 211 and the second solder joints 221 are staggered. That is, some of the first solder joints 211 and the second solder joints 221 may be staggered, or all of the first solder joints 211 and all of the second solder joints 221 may be staggered.

[0049] In this way, multiple first solder points 211 form a first solder point group 21, which ensures the electromagnetic shielding effect of the first solder point group 21 on the circuit board 20. Multiple second solder points 221 form a second solder point group 22, which ensures the electromagnetic shielding effect of the second solder point group 22 on the circuit board 20. At the same time, the cooperation of the first solder points 211 and the second solder points 221 can further enhance the electromagnetic shielding effect on the circuit board 20. In addition, the staggered arrangement of the first solder points 211 and the second solder points 221 can facilitate the positioning of the conductive component 30 in the groove 23, and at the same time, prevent the conductive component 30 from sliding out of the groove 23, ensuring the stability of the conductive component 30 in the groove 23, and thus effectively ensuring that the circuit board 20 is stably grounded through the conductive component 30.

[0050] For example, such as Figure 5 and Figure 6 As shown, the first solder joint group 21 includes multiple first solder joints 211, which are arranged in a ring along the circumference of the circuit board 20. The second solder joint group 22 includes multiple second solder joints 221, which are arranged in a ring along the circumference of the circuit board 20. Adjacent first solder joints 211 and second solder joints 221 are arranged at intervals in both the front-back direction and the left-right direction, so that adjacent first solder joints 211 and second solder joints 221 are staggered.

[0051] According to some optional embodiments of the present invention, refer to Figure 5 and Figure 6 In the circumferential direction of the circuit board 20, multiple first solder points 211 and multiple second solder points 221 are arranged alternately. As a result, the density of contact between the conductive component 30 and the solder points can be increased in the circumferential direction of the circuit board 20, thereby effectively ensuring the electromagnetic shielding effect. At the same time, the conductive component 30 can be stably confined within the groove 23, effectively preventing the conductive component 30 from detaching from the groove 23.

[0052] For example, with Figure 6Taking the partial groove 23 shown as an example, the first solder point 211 is arranged on the right side in front of the second solder point 221, and the first solder point 211 and the second solder point 221 define a groove 23 extending in the front-back direction.

[0053] According to some optional embodiments of the present invention, refer to Figure 5 and Figure 6 In the circumferential direction of the circuit board 20, the spacing between the first solder joint 211 and the two adjacent second solder joints 221 is not equal. Therefore, the distance between the first solder joint 211 and the two adjacent second solder joints 221 can be adjusted according to actual needs, thereby ensuring the versatility of the control device 100.

[0054] For example, such as Figure 5 As shown, the distance between the first solder point 211 at position A and the second solder point 221 on the left rear side is less than the distance between the second solder point 221 on the left front side.

[0055] According to some embodiments of the present invention, with reference to Figure 5 , Figure 7 and Figure 8 In the direction from the opening of the groove 23 toward the bottom wall, the width of at least a portion of the conductive element 30 gradually decreases; that is, either a portion of the conductive element 30 gradually decreases in width, or the entire width of the conductive element 30 gradually decreases. This ensures that the conductive element 30 can abut against the first solder joint 211 and the second solder joint 221 within the groove 23, thereby guaranteeing the electromagnetic shielding effect. Furthermore, the conductive element 30 can adapt to grooves 23 of various widths, thus improving its versatility.

[0056] For example, such as 5. Figure 7 and Figure 8 As shown, the overall width of the conductive element 30 gradually decreases from top to bottom.

[0057] According to some optional embodiments of the present invention, refer to Figure 6 , Figure 8 and Figure 9 In the thickness direction of circuit board 20 (e.g.) Figure 8 On the vertical direction shown, the side surface of the conductive element 30 facing the bottom wall of the groove 23 (e.g., in the vertical direction shown) Figure 8 The lower surface shown is the first surface 31. The width of the first surface 31 is less than the width of the groove 23, and the maximum width of the conductive element 30 is greater than the width of the groove 23.

[0058] In this way, limiting the width of the first surface 31 ensures that the end of the conductive element 30 facing the bottom wall of the groove 23 can extend into the groove 23. At the same time, limiting the maximum width of the conductive element 30 ensures that both sides of the conductive element 30 can abut against the first solder joint 211 and the second solder joint 221 on both sides, thereby enabling the circuit board 20 to be grounded through the conductive element 30 and the housing 10.

[0059] For example, such as Figure 6 , Figure 8 and Figure 9 As shown, d1 represents the distance between the first solder joint 211 and the second solder joint 221 in the left-right direction. The lower surface of the conductive component 30 is the first surface 31. d2 represents the width of the first surface 31 in the left-right direction. d2 is less than d1. The upper end of the conductive component 30 is the position where the conductive component 30 has the maximum width. This ensures that the left and right sides of the conductive component 30 can respectively abut against the first solder joint 211 and the second solder joint 221.

[0060] According to some optional embodiments of the present invention, refer to Figure 6 , Figure 8 and Figure 9 In the direction from the bottom wall of the groove 23 toward the opening, the conductive element 30 is in the width direction (e.g. Figure 9 The conductive component 30 shown extends at an angle in the left-right direction, with both sides inclined away from each other. This ensures that the two sides of the conductive component 30 in the width direction can abut against the first solder joint 211 and the second solder joint 221 on both sides, thereby effectively ensuring that the circuit board 20 can be stably grounded and ensuring electromagnetic shielding effect.

[0061] For example, such as Figure 6 , Figure 8 and Figure 9 As shown, in the direction from bottom to top, the left side surface of the conductive element 30 extends to the left at an angle, and the right side surface of the conductive element 30 extends to the right at an angle.

[0062] According to some optional embodiments of the present invention, refer to Figure 6 , Figure 8 and Figure 9 The conductive element 30 is in the width direction (e.g. Figure 9 The conductive component 30 shown has two curved surfaces on its left and right sides (in the left and right direction) that bulge in opposite directions. Therefore, during the contact between the conductive component 30 and the solder joint, the curved surfaces prevent the conductive component 30 from damaging the solder joint, thus protecting it. Therefore, even when repeatedly disassembling and reassembling the housing 10 and the circuit board 20, the conductive component 30 can still maintain normal contact with the solder joint.

[0063] For example, such as Figure 6 , Figure 8 and Figure 9As shown, in the direction from bottom to top, the left surface of the conductive element 30 is formed as an arc surface extending to the left at an angle, and the right surface of the conductive element 30 is formed as an arc surface extending to the right at an angle.

[0064] Furthermore, such as Figure 6 , Figure 8 , Figure 9 As shown, the height of the conductive component 30 in the vertical direction is greater than the height of the solder joint in the vertical direction, thus ensuring that the conductive component 30 can properly abut against the solder joints on both sides of the groove 23.

[0065] According to some embodiments of the present invention, with reference to Figure 1 and 5 Multiple solder joints of the first solder joint group 21 and multiple solder joints of the second solder joint group 22 are arranged in a ring along the circumference of the circuit board 20, and the first solder joint group 21 is located inside the second solder joint group 22. Electrical components (not shown in the figure) are provided on the circuit board 20, and the electrical components are located inside the first solder joint group 21.

[0066] In this way, the first solder joint group 21 and the second solder joint group 22 shield the electrical components on the inside, thereby effectively shielding the electromagnetic signals of the electrical components on the radial inside of the first solder joint group 21 and the second solder joint group 22. Therefore, it can prevent the electromagnetic interference of the control device 100 from affecting the adjacent control device 100. At the same time, the first solder joint group 21 and the second solder joint group 22 work together to prevent the electromagnetic interference of the adjacent control device 100 from affecting the control device 100 of this application.

[0067] For example, such as Figure 1 and Figure 5 As shown, the first solder joint group 21 has multiple first solder joints 211 extending in a ring along the circumference of the circuit board 20, and the second solder joint group 22 has multiple second solder joints 221 extending in a ring along the circumference of the circuit board 20. The first solder joint group 21 is located radially inside the second solder joint group 22, and the electrical components on the circuit board 20 are located radially inside the first solder joint group 21.

[0068] According to some optional embodiments of the present invention, refer to Figure 1 and Figure 5 The circuit board 20 is also provided with a connector 24 connected to the circuit board 20. The connector 24 is arranged outside the second solder joint group 22. This prevents the Faraday cage formed between the conductive component 30 and the solder joint from affecting the connection between the connector 24 and the external structure, thereby ensuring that the circuit board 20 can be electrically connected to the external structure normally, and thus ensuring that the control device 100 can work normally.

[0069] For example, such as Figure 1 and Figure 5As shown, a connector 24 is provided on the front side of the circuit board 20. The connector 24 is located on the radial outer side of the second solder joint group 22. The circuit board 20 is electrically connected to the external structure through the connector 24.

[0070] According to some embodiments of the present invention, with reference to Figure 1 and Figure 5 The housing 10 includes a cover plate 11 and a bottom shell 12, wherein the bottom shell 12 is located in the thickness direction of the circuit board 20 (e.g., ...). Figure 1 On one side of the circuit board 20 shown in the vertical direction (e.g.) Figure 1 The bottom shell 12 shown is open on its lower side, and the cover plate 11 covers the open side of the bottom shell 12 and cooperates with the bottom shell 12 to define the receiving cavity. Thus, the housing 10 is a split part, which not only facilitates the installation of the circuit board 20 with the housing 10, but also facilitates the processing of the housing 10. At the same time, the split cover plate 11 facilitates the maintenance of the circuit board 20, thereby effectively improving the service life of the control device 100.

[0071] For example, such as Figure 1 and Figure 5 As shown, the lower side of the bottom shell 12 is open, and the cover plate 11 is located on the lower side of the bottom shell 12 and covers the open side of the bottom shell 12. The cover plate 11 and the bottom shell 12 cooperate to define the receiving cavity. The circuit board 20 extends in the horizontal direction and is disposed in the receiving cavity.

[0072] According to some optional embodiments of the present invention, refer to Figure 1 , Figure 3 and Figure 4 The conductive element 30 is integrally formed with the bottom shell 12 or the cover plate 11. This ensures the strength of the conductive element 30 and prevents it from being damaged. At the same time, the conductive element 30 directly transmits current to the bottom shell 12 or the cover plate 11, thereby improving the conductivity and ensuring the electromagnetic shielding effect.

[0073] For example, such as Figure 1 , Figure 3 and Figure 4 As shown, the conductive component 30 and the bottom shell 12 are integrally formed, thereby ensuring the strength of the conductive component 30. Preferably, the conductive component 30 and the bottom shell 12 are integrally cast, which can ensure both the structural strength of the conductive component 30 and the processing efficiency.

[0074] According to some optional embodiments of the present invention, refer to Figure 1 and Figure 2 The bottom shell 12 has a support edge 121 extending outward from the receiving cavity around its open periphery. The circuit board 20 is supported on the support edge 121, and the conductive element 30 is disposed on the support edge 121. In the direction perpendicular to the thickness of the circuit board 20 (e.g., ...), Figure 1In the projection plane of the circuit board 20 (vertical direction), at least some of the solder joints and at least some of the conductive parts 30 are located within the projection range of the support edge 121. That is, it is possible that some of the solder joints and some of the conductive parts 30 are located within the projection range of the support edge 121, or it is possible that the overall projection of the solder joints and the overall projection of the conductive parts 30 are both located within the projection range of the support edge 121.

[0075] In this way, the support edge 121 can support the periphery of the circuit board 20, thereby saving the parts for fixing the circuit board 20 and reducing production costs. At the same time, when the bottom shell 12 is engaged with the circuit board 20, the conductive component 30 can directly engage with the groove 23 of the circuit board 20, thereby enabling quick positioning and installation, and thus improving assembly efficiency.

[0076] For example, such as Figure 1 and Figure 2 As shown, the lower periphery of the bottom shell 12 is provided with a support edge 121 extending outward from the receiving cavity. The periphery of the circuit board 20 is supported on the support edge 121. The overall projection of the solder joint and the overall projection of the conductive component 30 are both located within the projection range of the support edge 121. When the shell 10 and the circuit board 20 are engaged, the conductive component 30 can be directly engaged in the groove 23.

[0077] According to some optional embodiments of the present invention, refer to Figure 1 and Figure 2 The cover plate 11, circuit board 20, and bottom shell 12 are fastened together by threaded fasteners 40. This ensures that the circuit board 20 is stably fixed to the cover plate 11 and bottom shell 12, preventing the cover plate 11 from shaking within the cavity and thus protecting the circuit board 20. Furthermore, the fasteners 40 provide a detachable connection, facilitating maintenance of the circuit board 20 and the shell 10.

[0078] For example, such as Figure 1 As shown, the cover plate 11 is located on the lower side of the bottom shell 12, the circuit board 20 is located between the bottom shell 12 and the cover plate 11, and the fastener 40 passes through the cover plate 11, the circuit board 20 and the bottom shell 12 from bottom to top to fix the cover plate 11, the circuit board 20 and the bottom shell 12.

[0079] According to a second aspect embodiment of the vehicle, referring to Figure 1 , Figure 2 and Figure 3 This includes the control device 100 of the first aspect of this embodiment.

[0080] According to an embodiment of the present invention, the vehicle is equipped with a control device 100 as described in the first aspect embodiment, and a conductive element 30 is provided. The conductive element 30 abuts against the first solder joint group 21 and the second solder joint group 22 in the conductive groove. The conductive element 30 will not crush the solder joints on the circuit board 20, which can avoid the electromagnetic shielding effect being affected by maintenance operations. This ensures that the control device 100 can be maintained normally. At the same time, the groove 23 guides the conductive element 30, which facilitates quick positioning of the mating position of the conductive element 30, thereby improving the installation and positioning efficiency of the conductive element 30 and the groove 23.

[0081] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0082] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0083] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0084] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0085] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A control device (100), characterized in that, include: The housing (10) has a receiving cavity inside; A circuit board (20) is disposed in the receiving cavity. The circuit board (20) has multiple solder points, which constitute a first solder point group (21) and a second solder point group (22). In the direction from the center of the circuit board (20) towards the periphery, the first solder point group (21) and the second solder point group (22) are arranged alternately inside and outside, and cooperate to define a groove (23) extending circumferentially along the circuit board (20). A conductive element (30) is connected to the housing (10) and located within the receiving cavity. At least a portion of the conductive element (30) is fitted into the groove (23) and connected to a plurality of the solder joints of the first solder joint group (21) and the second solder joint group (22) so that the circuit board (20) is grounded through the conductive element (30) and the housing (10).

2. The control device (100) according to claim 1, characterized in that, The plurality of solder joints include first solder joints (211) and second solder joints (221), the first solder joint group (21) including a plurality of first solder joints (211) arranged circumferentially on the circuit board (20), and the second solder joint group (22) including a plurality of second solder joints (221) arranged circumferentially on the circuit board (20). In the circumferential direction of the circuit board (20), at least a portion of the first solder joint (211) and the second solder joint (221) are staggered.

3. The control device (100) according to claim 2, characterized in that, On the circumferential direction of the circuit board (20), a plurality of first solder joints (211) and a plurality of second solder joints (221) are arranged alternately.

4. The control device (100) according to claim 3, characterized in that, In the circumferential direction of the circuit board (20), the spacing between the first solder joint (211) and the two adjacent second solder joints (221) is not equal.

5. The control device (100) according to any one of claims 1-4, characterized in that, The width of at least a portion of the conductive element (30) gradually decreases in the direction from the opening of the groove (23) toward the bottom wall.

6. The control device (100) according to claim 5, characterized in that, In the thickness direction of the circuit board (20), the side surface of the conductive element (30) facing the bottom wall of the groove (23) is a first surface (31), the width of the first surface (31) is smaller than the width of the groove (23), and the maximum width of the conductive element (30) is greater than the width of the groove (23).

7. The control device (100) according to claim 6, characterized in that, In the direction from the bottom wall of the groove (23) toward the opening, the conductive element (30) extends at an angle toward each other on both sides in the width direction.

8. The control device (100) according to claim 7, characterized in that, The conductive element (30) has two curved surfaces on its two sides in the width direction that bulge in opposite directions.

9. The control device (100) according to claim 1, characterized in that, The multiple solder joints of the first solder joint group (21) and the multiple solder joints of the second solder joint group (22) are arranged in a ring along the circumference of the circuit board (20), and the first solder joint group (21) is located inside the second solder joint group (22). The circuit board (20) is provided with electrical components, which are located inside the first solder joint group (21).

10. The control device (100) according to claim 9, characterized in that, The circuit board (20) is also provided with a connector (24) connected to the circuit board (20), and the connector (24) is arranged on the outside of the second solder joint group (22).

11. The control device (100) according to claim 1, characterized in that, The housing (10) includes a cover plate (11) and a bottom shell (12), the bottom shell (12) being open on one side in the thickness direction of the circuit board (20), the cover plate (11) covering the open side of the bottom shell (12) and cooperating with the bottom shell (12) to define the receiving cavity.

12. The control device (100) according to claim 11, characterized in that, The conductive element (30) is integrally formed with the bottom shell (12) or the cover plate (11).

13. The control device (100) according to claim 11, characterized in that, The bottom shell (12) has a support edge (121) extending outward from the cavity around its opening. The circuit board (20) is supported on the support edge (121), and the conductive element (30) is disposed on the support edge (121). In the projection plane perpendicular to the thickness direction of the circuit board (20), at least some of the projections of the solder joints and at least some of the projections of the conductive elements (30) are located within the projection range of the support edge (121).

14. The control device (100) according to claim 11, characterized in that, The cover plate (11), the circuit board (20) and the bottom shell (12) are fastened together by threaded fasteners (40).

15. A vehicle, characterized in that, Includes the control device (100) according to any one of claims 1-14.

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