A PCB board processing system and method

Abstract

This invention provides a PCB board processing system and method, comprising: a loading mechanism, a first processing mechanism, a second processing mechanism, a third processing mechanism, an unloading mechanism, and a transmission mechanism. The first processing mechanism includes a first loading feeder, a first clamping assembly, and an adhesive suction cup; the second processing mechanism includes a second loading feeder, at least two film-peeling grippers, and foam transfer grippers; the third processing mechanism includes a resistor bending assembly and an unloading gripper; and the transmission mechanism includes a second clamping assembly and a third clamping assembly. This invention can complete a complete, high-precision, and high-efficiency PCB board processing flow, achieving efficient connection between the various processing mechanisms and realizing continuous processing. Compared with conventional processing technologies, this application enables fully automated processing with seamless connection between each process, significantly shortening the processing cycle and thus meeting the needs of mass production. Furthermore, it also possesses significant advantages such as strong controllability, strong compatibility, wide applicability, and stable processing quality.

Description

Technical Field

[0001] This invention relates to the field of PCB processing technology, specifically to a PCB board processing system and method. Background Technology

[0002] As a core component of electronic devices, PCB boards undergo complex processing with extremely high precision requirements. The processing includes, but is not limited to, multiple key steps such as loading, applying adhesive, attaching foam, resistor bending, quality inspection, and unloading. These steps not only involve fine treatment of the PCB board surface but also require processing of different sides of the board. This necessitates the successful flipping, precise movement and transfer, and stable positioning of the PCB board during processing.

[0003] However, existing technologies lack dedicated equipment to achieve the aforementioned full-process functionality. The processing primarily relies on general-purpose fixtures and scattered, simple tools. These general-purpose fixtures are not specifically designed for PCB board processing and have numerous limitations: in terms of processing quality, general-purpose equipment results in poor bonding accuracy and inconsistent resistor bending angles, directly impacting subsequent assembly; in terms of production efficiency, transferring boards and readjusting fixtures between processes takes 3-5 times longer for processing a single PCB board compared to automated equipment, making it difficult to meet the demands of mass production; compatibility is a significant weakness, requiring different fixtures for PCB boards of different sizes and thicknesses, and fixture adjustments are time-consuming (over 30 minutes per change), failing to meet the flexible production needs of multi-variety, small-batch PCB board processing, and hindering seamless integration of processes. Therefore, existing general-purpose equipment completely fails to meet the requirements of PCB board processing in terms of quality, process requirements, efficiency, and compatibility. The industry urgently needs an integrated device that combines all processes and is specifically designed for PCB board processing to overcome current processing bottlenecks. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the problem of low processing efficiency and quality of PCB board processing systems in the prior art, and to provide a PCB board processing system and method.

[0005] To solve the above-mentioned technical problems, the present invention provides a PCB board processing system, comprising: a feeding mechanism, a first processing mechanism, a second processing mechanism, a third processing mechanism, and an unloading mechanism arranged sequentially along a first direction. The first processing mechanism includes an adhesive application station, comprising a first feeding feeder, a first clamping assembly, and an adhesive application suction cup. The first clamping assembly moves the PCB board to be processed to the adhesive application station, and the adhesive application suction cup can move between the first feeding feeder and the adhesive application station. The second processing mechanism includes a foam bonding station, comprising a second feeding feeder, at least two film-peeling claws, and at least two foam transfer claws. The film-peeling claws can open and close relative to each other to clamp the adhesive backing film. The cotton transfer gripper can move between the second feeding feeder and the foam bonding station; the third processing mechanism is provided with a resistance bending station, which includes a resistance bending component and a feeding gripper, the resistance bending component can move toward the resistance bending station; the feeding gripper moves between the resistance bending station and the feeding mechanism; the PCB board processing system also includes a transmission mechanism, the PCB board to be processed moves between the first processing mechanism, the second processing mechanism and the third processing mechanism through the transmission mechanism, the transmission mechanism includes at least one second clamping component and at least one third clamping component arranged along the first direction, wherein the third clamping component can rotate around the rotation center line.

[0006] In one embodiment of the present invention, the feeding mechanism includes a feeding plate, a feeding module, and a plurality of first material detectors. The feeding module extends along a first direction, the feeding plate is slidably connected to the feeding module, a fixture holding a PCB board to be processed is placed on the feeding plate, and the plurality of first material detectors are arranged around the feeding module. The unloading mechanism includes an unloading plate, an unloading module, and a plurality of second material detectors. The unloading module extends along a first direction, the unloading plate is slidably connected to the unloading module, a fixture holding a PCB board to be processed is placed on the unloading plate, and the plurality of second material detectors are arranged around the unloading module.

[0007] In one embodiment of the present invention, the first processing mechanism includes a first robotic arm, a fixed processing table, and a pre-folding plate. The first clamping assembly, the adhesive suction cup, and the pre-folding plate are all connected to the moving end of the first robotic arm. The adhesive application station is set on the fixed processing table. The pre-folding plate moves vertically toward the fixed processing table to abut against the thermistor of the PCB board to be processed.

[0008] In one embodiment of the present invention, the second processing mechanism includes a second robotic arm and a pressure holding assembly. The film tearing gripper and the foam transfer gripper are both connected to the moving end of the second robotic arm. The pressure holding assembly is disposed on one side of the second robotic arm and includes a lifting module, a pressing block, and a pressing station. The lifting module extends in a vertical direction, the pressing block is slidably connected to the lifting module, and the pressing block is disposed above the pressing station.

[0009] In one embodiment of the present invention, the third processing mechanism includes a third robotic arm, the resistor bending assembly and the unloading gripper are respectively connected to the moving end of the third robotic arm, wherein the resistor bending assembly includes at least one roller, the roller presses the thermistor of the PCB board to be processed to connect the thermistor to the foam.

[0010] In one embodiment of the present invention, the transmission mechanism includes a horizontal module, a first lifting module, and a transmission frame. The horizontal module extends along a first direction, the first lifting module extends along a vertical direction and is slidably connected to the horizontal module, the transmission frame is slidably connected to the first lifting module, and the second clamping component and the third clamping component are both disposed on the transmission frame and move synchronously with the transmission frame.

[0011] In one embodiment of the present invention, the second clamping assembly includes two fixed opening and closing clamping plates that can be opened and closed relative to each other; the third clamping assembly includes a rotary driver and a rotary opening and closing clamping plate, the rotary driver is disposed on the transmission frame, the rotary opening and closing clamping plate is disposed on the working end of the rotary driver to rotate about the rotation center line, and the rotary opening and closing clamping plate can be opened and closed relative to each other.

[0012] In one embodiment of the present invention, the PCB board processing system further includes a plurality of visual guidance mechanisms, which are respectively configured to correspond to the first processing mechanism, the second processing mechanism and the third processing mechanism. Each visual guidance mechanism includes a frame, a second lifting module and a camera. The second lifting module is connected to the frame and extends in a vertical direction. The camera is slidably connected to the second lifting module and is positioned toward the PCB board to be processed.

[0013] In one embodiment of the present invention, the PCB board processing system further includes a control mechanism, a machine base, and multiple positioning processing tables. The loading mechanism, the first processing mechanism, the second processing mechanism, the third processing mechanism, the transmission mechanism, the unloading mechanism, and the visual guidance mechanism are all connected to the control mechanism and are all disposed on the machine base. The multiple positioning processing tables are respectively disposed corresponding to the first processing mechanism, the second processing mechanism, and the third processing mechanism.

[0014] This invention also provides a PCB board processing method, which uses the above-mentioned PCB board processing system to process PCB boards, comprising: step S1, placing the PCB board to be processed in a carrier, and placing the full carrier in a loading mechanism to load the PCB board to be processed; step S2, moving the PCB board to be processed to the bonding station by a first clamping assembly, and simultaneously supplying adhesive by a first loading feeder, then adsorbing and moving the adhesive to one side of the PCB board to be processed by an adhesive suction cup to obtain a first semi-finished product; step S3, transferring the first semi-finished product to the bonding station by a transfer mechanism. The finished product is moved to the foam bonding station, and foam is supplied through the second feeding feeder. Then, the back film on the adhesive is first peeled off by the film-tearing claw, and then the foam is moved and attached to the adhesive by the foam transfer claw to obtain the second semi-finished product; Step S4: After the second semi-finished product is moved to the resistor bending station by the transmission mechanism, the thermistor on the second semi-finished product is rolled by the third processing mechanism until the thermistor is connected to the foam to obtain the target PCB board; Step S5: The processed PCB board is moved to the unloading mechanism to complete the unloading.

[0015] In one embodiment of the present invention, in step S2, the thermistor on the PCB to be processed is pre-folded using a pre-folding plate before applying the adhesive. Then, the PCB to be processed is flipped so that the side without terminals faces upwards before applying the adhesive. In step S3, the first semi-finished product is pressed together using a pressure-holding component before attaching the foam. In step S4, the pre-folded thermistor is graded and rolled using a resistance bending component until the thermistor is connected to the foam.

[0016] In one embodiment of the present invention, in steps S2 to S4, the movement paths of the colloid, the movement paths of the foam, and the resistance roller pressing paths are planned and guided by a visual guidance mechanism.

[0017] The technical solution of the present invention has the following advantages compared with the prior art:

[0018] The PCB board processing system and method of this invention includes a feeding mechanism for feeding the PCB board to be processed, a first processing mechanism for transferring and applying adhesive to one side of the PCB board, a second processing mechanism for peeling off the adhesive film and applying foam, a third processing mechanism for bending the thermistor on the other side of the PCB board, and finally, an unloading mechanism for unloading the processed PCB board. This completes a high-precision, high-efficiency PCB board processing flow. During this process, a transport mechanism drives the PCB board to move between processing stations and flips it, thereby achieving efficient connection between the processing mechanisms and continuous processing. Compared to current conventional processing technologies, this application achieves fully automated transport and seamless connection between processes, significantly shortening the processing cycle of a single PCB board, thus meeting the needs of mass production. Furthermore, it also boasts significant advantages such as strong controllability, strong compatibility, wide applicability, and stable processing quality. Attached Figure Description

[0019] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0020] Figure 1 This is a three-dimensional structural diagram of a PCB board processing system according to a preferred embodiment of the present invention;

[0021] Figure 2 yes Figure 1 A three-dimensional structural diagram of the PCB board processing system from another perspective;

[0022] Figure 3 yes Figure 1 Top view of the PCB board processing system shown;

[0023] Figure 4 yes Figure 1 A three-dimensional structural diagram of the feeding mechanism in the PCB board processing system shown.

[0024] Figure 5 yes Figure 1 Enlarged structural diagram at point A in the middle;

[0025] Figure 6 yes Figure 1 A three-dimensional structural diagram of the second robotic arm, film-tearing gripper, and foam transfer gripper in the PCB board processing system shown.

[0026] Figure 7 yes Figure 1 A three-dimensional structural diagram of the pressure holding component in the PCB board processing system shown.

[0027] Figure 8 yes Figure 2 Enlarged structural diagram at point B;

[0028] Figure 9 yes Figure 1 A three-dimensional structural diagram of the transmission mechanism in the PCB board processing system shown.

[0029] Figure 10 yes Figure 1 The diagram shows a three-dimensional structural schematic of the visual guidance mechanism in the PCB board processing system.

[0030] Explanation of reference numerals in the accompanying drawings: 100, feeding mechanism; 110, feeding plate; 120, feeding module; 130, first material detector; 200, first processing mechanism; 210, first robotic arm; 220, first clamping assembly; 230, pre-folding plate; 240, adhesive suction cup; 250, fixed processing table; 260, first feeding feeder; 300, second processing mechanism; 310, second robotic arm; 320, film tearing gripper; 330, foam transfer gripper; 340, pressure holding assembly; 341, lifting module; 342, adhesive pressing block; 350, second feeding feeder; 400, third processing mechanism; 410, third robotic arm; 420, resistance bending assembly; 4 21. Roller roller; 430. Unloading gripper; 500. Conveying mechanism; 510. Horizontal module; 520. First lifting module; 530. Conveying frame; 540. Second clamping assembly; 541. Fixed opening and closing clamping plate; 550. Third clamping assembly; 551. Rotary driver; 552. Rotary opening and closing clamping plate; 600. Unloading mechanism; 610. Unloading plate; 620. Unloading module; 630. Second material detector; 700. Vision guidance mechanism; 710. Frame; 720. Second lifting module; 730. Camera; 800. Positioning processing table; 900. Machine base; 1001. Rotation center line; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0032] Example 1:

[0033] See Figures 1 to 3As shown, this embodiment provides a PCB board processing system, which includes: a loading mechanism 100, a first processing mechanism 200, a second processing mechanism 300, a third processing mechanism 400, and an unloading mechanism 600 arranged sequentially along a first direction X. The first processing mechanism 200 includes an adhesive application station, comprising a first loading feeder 260, a first clamping assembly 220, and an adhesive application suction cup 240. The first clamping assembly 220 moves the PCB board to be processed to the adhesive application station, and the adhesive application suction cup 240 can move between the first loading feeder 260 and the adhesive application station. The second processing mechanism 300 includes a foam bonding station, comprising a second loading feeder 350, at least two film-peeling grippers 320, and at least two foam transfer grippers 330. The film-peeling grippers 320 can open and close relative to each other to hold the adhesive backing film, and the foam transfer grippers... 330 can move between the second feeding feeder 350 and the foam bonding station; the third processing mechanism 400 is provided with a resistance bending station, which includes a resistance bending component 420 and a feeding gripper 430. The resistance bending component 420 can move toward the resistance bending station; the feeding gripper 430 can move between the resistance bending station and the feeding mechanism 600; the PCB board processing system also includes a transmission mechanism 500. The PCB board to be processed moves between the first processing mechanism 200, the second processing mechanism 300 and the third processing mechanism 400 through the transmission mechanism 500. The transmission mechanism 500 includes at least one second clamping component 540 and at least one third clamping component 550 arranged along the first direction X, wherein the third clamping component 550 can rotate around the rotation center line 1001.

[0034] The PCB board processing system described in this embodiment loads the PCB board to be processed through a loading mechanism 100, transfers and applies adhesive to one side of the PCB board through a first processing mechanism 200, peels off the adhesive film and applies foam through a second processing mechanism 300, bends the thermistor on the other side of the PCB board through a third processing mechanism 400, and finally unloads the processed PCB board through a unloading mechanism 600. This completes a high-precision, high-efficiency PCB board processing flow. During this process, the transmission mechanism 500 drives the PCB board to move between processing stations and flips it, thereby achieving efficient connection between the processing mechanisms and continuous processing. Compared with current conventional processing technologies, this application achieves fully automated transmission and seamless connection of each process, significantly shortening the processing cycle of a single PCB board, thus meeting the needs of mass production. Furthermore, it also has significant advantages such as strong controllability, strong compatibility, wide applicability, and stable processing quality.

[0035] It should be noted that, for ease of description, this embodiment defines the processing and transmission direction of the PCB board processing system as the first direction X, the width direction of the system as the second direction Y, and the height direction of the system as the third direction Z. The first direction X, the second direction Y, and the third direction Z are set perpendicular to each other in pairs, and the first direction X and the second direction Y are located in the same plane.

[0036] See Figure 4 As shown, in this embodiment, the loading mechanism 100 serves as the starting unit of the processing system, responsible for conveying the PCB board to be processed from the storage area to the initial transmission position of the system, providing a stable supply of board material for subsequent processing steps. Specifically, the loading mechanism 100 includes a loading plate 110, a loading module 120, and a plurality of first material detectors 130. The loading module 120 extends along the first direction X, the loading plate 110 is slidably connected to the loading module 120, the fixture holding the PCB board to be processed is placed on the loading plate 110, and the plurality of first material detectors 130 are arranged around the loading module 120.

[0037] Specifically, the loading plate 110 carries a fixture containing PCB boards to be processed and slides along the first direction X to transport the fixture from its initial position to a position that docks with the transmission mechanism 500, thereby realizing automatic loading of PCB boards. Multiple first material detectors 130 are arranged around the loading module 120 to detect the position and orientation of the fixture and the status of the PCB boards in real time, ensuring the accuracy and stability of the loading process.

[0038] See Figure 5 As shown, the first processing mechanism 200 includes a first robotic arm 210, a fixed processing table 250, and a pre-folding plate 230. The first clamping assembly 220, the adhesive suction cup 240, and the pre-folding plate 230 are all connected to the moving end of the first robotic arm 210. The adhesive application station is located on the fixed processing table 250. The pre-folding plate 230 moves vertically toward the fixed processing table 250 to contact the thermistor of the PCB board to be processed. Specifically, the first robotic arm 210, as the power and motion carrier, adopts a multi-axis linkage design and can move flexibly in three-dimensional space. The fixed processing table 250 serves as the basic platform for the adhesive application station, providing stable support for the PCB board processing. The first clamping assembly 220, the adhesive suction cup 240, and the pre-folding plate 230 are all mounted on the moving end of the robotic arm and move synchronously with the robotic arm, but each has an independent drive system, enabling differentiated movements.

[0039] The core function of the pre-bending plate 230 is to pre-bend the thermistors on the PCB board. Specifically, it can press and hold the thermistors together, causing them to bend at an angle towards the adhesive side of the PCB board, thus providing a basis for the final connection of the thermistors in the subsequent process. During processing, the pre-bending plate 230 moves downward vertically, with its bottom abutting against the leads of the thermistors to apply a preset pressure. After pre-bending, the robotic arm drives the pre-bending plate 230 upward, and the adhesive suction cup 240 and the first feeding feeder 260 work together to attach the adhesive to the PCB board, thus completing the first step of PCB board processing.

[0040] See Figure 6 and Figure 7 As shown, the second processing mechanism 300 in this embodiment includes a second robotic arm 310 and a pressure holding assembly 340. The film tearing gripper 320 and the foam transfer gripper 330 are both connected to the moving end of the second robotic arm 310. The pressure holding assembly 340 is disposed on one side of the second robotic arm 310 and includes a lifting module 341, a pressing block 342 and a pressing station. The lifting module 341 extends vertically, the pressing block 342 is slidably connected to the lifting module 341, and the pressing block 342 is disposed above the pressing station.

[0041] Specifically, the second processing mechanism 300 achieves full automation of the process, including peeling off the adhesive backing film, transferring the foam to the bonding assembly, and maintaining pressure, through a combination design of the second robotic arm 310 and the pressure-holding component 340. The pressure-holding component 340 is independently mounted on one side of the robotic arm, serving as a reinforcement device after foam bonding. It achieves pressure holding by driving the pressure block 342 via the lifting module 341, forming a transfer-pressure-holding relay with the robotic arm. The film-peeling gripper 320 is pneumatically driven to open and close, peeling off the adhesive backing film to facilitate subsequent foam bonding. The foam transfer gripper 330 picks up the foam from the second feeder 350 and precisely transfers it onto the adhesive under the guidance of the robotic arm.

[0042] Furthermore, in the pressure-holding assembly 340, the lifting module 341 can provide a stable vertical driving force for the pressure block 342 and control the lifting stroke of the pressure block 342. The pressure block 342 is preferably made of elastic material, and in this embodiment, it is configured as a silicone pressure block. Since the foam being bonded may have air bubbles or edge lifting due to insufficient pressure, after the pressure block 342 is driven by the lifting module 341 to continuously press with a preset pressure for a preset time, the foam can be completely bonded to the PCB board surface, thereby significantly improving the peel strength.

[0043] See Figure 8As shown, the third processing mechanism 400 includes a third robotic arm 410, with the resistor bending assembly 420 and the unloading gripper 430 respectively connected to the moving end of the third robotic arm 410. The resistor bending assembly 420 includes at least one roller 421, which presses the thermistor of the PCB board to be processed, thereby connecting the thermistor to the foam. Specifically, the third processing mechanism 400 achieves seamless connection between the bending and unloading processes by integrating the resistor bending assembly 420 and the unloading gripper 430 into the same moving end of the robotic arm. The resistor bending assembly 420 uses rollers 421 instead of traditional stamping dies to achieve simultaneous completion of flexible bending and foam bonding. Specifically, in this embodiment, four rollers 421 are configured, arranged in pairs to simultaneously bend two thermistors. Furthermore, two rollers in any set of rollers 421 have a height difference to achieve graded roller pressing of the thermistor, thereby further improving its rolling effect. The rollers 421 roll in the horizontal direction and can simultaneously apply vertical pressure to gradually bend the thermistor leads to a preset angle until the thermistor and foam are tightly bonded.

[0044] See Figure 9 As shown, the transmission mechanism 500 includes a horizontal module 510, a first lifting module 520, and a transmission frame 530. The horizontal module 510 extends along a first direction X, the first lifting module 520 extends vertically and is slidably connected to the horizontal module 510, and the transmission frame 530 is slidably connected to the first lifting module 520. The second clamping component 540 and the third clamping component 550 are both disposed on the transmission frame 530 and move synchronously with the transmission frame 530. The transmission mechanism 500 solves the problem of efficient and accurate transfer of PCB boards between multiple processes through a combination of horizontal-vertical-rotational three-dimensional motion and a dual-clamping component integrated design. Compared with traditional transmission solutions, it has significant improvements in positioning accuracy, transfer speed, space utilization, and compatibility, and is especially suitable for automated PCB production lines with high production cycle requirements, significantly shortening the overall processing cycle of a single board. Specifically, the second clamping assembly 540 includes two fixed opening and closing clamping plates 541 that can be opened and closed relative to each other; the third clamping assembly 550 includes a rotary driver 551 and a rotary opening and closing clamping plate 552. The rotary driver 551 is disposed on the transmission frame 530, and the rotary opening and closing clamping plate 552 is disposed at the working end of the rotary driver 551 to rotate around the rotation center line 1001, and the rotary opening and closing clamping plate can be opened and closed relative to each other.

[0045] The system comprises a horizontal module 510 serving as a basic support, extending along the first direction X. A first lifting module 520 is vertically mounted on the slider of the horizontal module 510 to achieve vertical movement and can move synchronously with the horizontal module 510. A transfer frame 530 is connected to the moving end of the first lifting module 520 and integrates a second clamping component 540 and a third clamping component 550 to grip, transfer, and flip the PCB board. The second clamping component 540 is responsible for horizontally transferring the PCB board between processing mechanisms. The third clamping component 550 adds a rotation drive mechanism to the second clamping component 540. When the PCB board needs to be flipped, the third clamping component 550 grips the PCB board, flips it 180°, and then transfers it to the next workstation. These two components are integrated into the same transfer frame 530 and operate synchronously through a control system, avoiding positioning errors and time losses caused by multi-device collaboration in traditional solutions.

[0046] In this embodiment, the unloading mechanism 600 includes an unloading plate 610, an unloading module 620, and a plurality of second material detectors 630. The unloading module 620 extends along the first direction X. The unloading plate 610 is slidably connected to the unloading module 620. The fixture for holding the processed PCB board is placed on the unloading plate 610. The plurality of second material detectors 630 are arranged around the unloading module 620. The unloading mechanism 600 has the same structural configuration as the loading mechanism 100, and will not be described in detail here.

[0047] See Figure 10 As shown, the PCB board processing system in this embodiment also includes multiple visual guidance mechanisms 700. The multiple visual guidance mechanisms 700 are respectively arranged corresponding to the first processing mechanism 200, the second processing mechanism 300 and the third processing mechanism 400. Each visual guidance mechanism 700 includes a frame 710, a second lifting module 720 and a camera 730. The second lifting module 720 is connected to the frame 710 and extends in the vertical direction. The camera 730 is slidably connected to the second lifting module 720 and is arranged facing the PCB board to be processed.

[0048] Specifically, the vision guidance mechanism 700 achieves high-precision guidance for PCB board processing through three-dimensional spatial positioning. The frame 710 provides stable support for the camera 730, and the second lifting module 720 is vertically mounted on the frame 710 to enable the Z-axis movement of the camera 730. In this embodiment, each processing mechanism corresponds to an independent vision guidance mechanism 700 to ensure the positional correlation between processes. When the PCB board arrives at the processing station via the transmission mechanism 500, the second lifting module 720 drives the camera 730 to descend to the optimal shooting height. The camera 730 then captures surface feature images of the PCB board, and the image data is transmitted to an industrial control computer or PLC. A vision algorithm identifies the positioning points, and the deviation between the actual and theoretical positions is calculated to generate compensation commands. The processing mechanism adjusts its motion path based on the compensation value to ensure the precise execution of operations such as adhesive application, foam application, and resistor bending.

[0049] Furthermore, this embodiment also includes a control mechanism, a machine base 900, and multiple positioning processing tables 800. The loading mechanism 100, the first processing mechanism 200, the second processing mechanism 300, the third processing mechanism 400, the transmission mechanism 500, the unloading mechanism 600, and the visual guidance mechanism 700 are all connected to the control mechanism and are all disposed on the machine base 900. The multiple positioning processing tables are respectively disposed corresponding to the first processing mechanism 200, the second processing mechanism 300, and the third processing mechanism 400. In actual production and processing, operators can adjust the above structure in real time through the control mechanism, thereby improving the flexibility of the equipment. Parameters can also be preset through the control mechanism, thereby improving the automation level of the equipment.

[0050] Example 2:

[0051] This embodiment provides a PCB board processing method, which uses the PCB board processing system described in Embodiment 1 to process the PCB board, and includes:

[0052] Step S1: Place the PCB board to be processed in the carrier and place the full carrier in the loading mechanism 100 so that the PCB board to be processed can be loaded through the loading mechanism 100.

[0053] Step S2: The PCB board to be processed is moved to the bonding station by the first clamping component 220, and the adhesive is supplied by the first feeding feeder 260. Then, the adhesive is adsorbed and moved to one side of the PCB board to be processed by the adhesive suction cup 240 to obtain the first semi-finished product. Specifically, in this embodiment, before applying the adhesive, the thermistor on the PCB board to be processed is pre-folded by the pre-folding plate 230. Then, the PCB board to be processed is flipped so that the side without terminals is facing upwards before the adhesive is applied.

[0054] In step S3, the first semi-finished product is pressed by the pressure-holding component before attaching the foam; in step S4, the pre-folded thermistor is graded and rolled by the resistance bending component 420 until the thermistor is connected to the foam. In step S3, the first semi-finished product is moved to the foam bonding station by the transmission mechanism 500, and foam is supplied by the second feeding feeder 350. Then, the back film on the adhesive is first removed by the film-tearing claw 320, and then the foam is moved and attached to the adhesive by the foam transfer claw 330 to obtain the second semi-finished product.

[0055] Step S4: After the second semi-finished product is moved to the resistor bending station by the transmission mechanism, the thermistor on the second semi-finished product is rolled by the third processing mechanism 400 until the thermistor is connected to the foam to obtain the target PCB board.

[0056] Step S5: Move the processed PCB board to the unloading mechanism 600 to complete the unloading process. Further, in steps S2 to S4 of this embodiment, the visual guidance mechanism 700 plans and guides the movement paths of the colloid, the foam, and the resistive roller pressing path, respectively.

[0057] In summary, the PCB board processing system and method of this invention involves: a loading mechanism 100 loading the PCB board to be processed; a first processing mechanism 200 transferring and applying adhesive to one side of the PCB board; a second processing mechanism 300 peeling the adhesive film and applying foam; a third processing mechanism 400 bending the thermistor on the other side of the PCB board; and finally, an unloading mechanism 600 unloading the processed PCB board. This completes a high-precision, high-efficiency PCB board processing flow. During this process, the transmission mechanism 500 drives the PCB board to move between processing stations and flips it, thereby achieving efficient connection between the processing mechanisms and continuous processing. Compared with conventional processing technologies, this application achieves fully automated transmission and seamless connection of each process, significantly shortening the processing cycle of a single PCB board, thus meeting the needs of mass production. Furthermore, it also has significant advantages such as strong controllability, strong compatibility, wide applicability, and stable processing quality.

[0058] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A PCB board processing system, characterized by: include: The feeding mechanism, the first processing mechanism, the second processing mechanism, the third processing mechanism, and the unloading mechanism are arranged sequentially along the first direction, wherein... The first processing mechanism is equipped with an adhesive application station, which includes a first feeding feeder, a first clamping component and an adhesive application suction cup. The first clamping component moves the PCB board to be processed to the adhesive application station, and the adhesive application suction cup can move between the first feeding feeder and the adhesive application station. The second processing mechanism is provided with a foam bonding station, which includes a second feeding feeder, at least two film-tearing claws and at least two foam transfer claws. The film-tearing claws can open and close relative to each other to hold the adhesive backing film, and the foam transfer claws can move between the second feeding feeder and the foam bonding station. The third processing mechanism is equipped with a resistance bending station, which includes a resistance bending component and a feeding gripper. The resistance bending component can move toward the resistance bending station. The feeding gripper moves between the resistance bending station and the feeding mechanism; The PCB board processing system further includes a transmission mechanism. The PCB board to be processed moves between the first processing mechanism, the second processing mechanism, and the third processing mechanism via the transmission mechanism. The transmission mechanism includes a horizontal module, a first lifting module, a transmission frame, at least one second clamping component and at least one third clamping component arranged along the first direction. The horizontal module extends along the first direction, the first lifting module extends vertically and is slidably connected to the horizontal module, and the transmission frame is slidably connected to the first lifting module. The second clamping component and the third clamping component are both disposed on the transmission frame and move synchronously with the transmission frame. The second clamping component includes two fixed opening and closing clamping plates that can be opened and closed relative to each other. The third clamping component includes a rotary driver and a rotary opening and closing clamping plate. The rotary driver is disposed on the transmission frame, and the rotary opening and closing clamping plate is disposed at the working end of the rotary driver to rotate around the rotation center line. The rotary opening and closing clamping plate can be opened and closed relative to each other.

2. The PCB processing system of claim 1, wherein: The feeding mechanism includes a feeding plate, a feeding module, and multiple first material detectors. The feeding module extends along a first direction, and the feeding plate is slidably connected to the feeding module. A fixture holding the PCB board to be processed is placed on the feeding plate, and multiple first material detectors are arranged around the feeding module. The unloading mechanism includes an unloading plate, an unloading module, and multiple second material detectors. The unloading module extends along a first direction, and the unloading plate is slidably connected to the unloading module. A fixture holding the processed PCB board is placed on the unloading plate, and multiple second material detectors are arranged around the unloading module.

3. The PCB processing system of claim 1, wherein: The first processing mechanism includes a first robotic arm, a fixed processing table, and a pre-folding plate. The first clamping assembly, the adhesive suction cup, and the pre-folding plate are all connected to the moving end of the first robotic arm. The adhesive application station is set on the fixed processing table. The pre-folding plate moves vertically toward the fixed processing table to abut against the thermistor of the PCB board to be processed.

4. The PCB processing system of claim 1, wherein: The second processing mechanism includes a second robotic arm and a pressure holding assembly. The film tearing gripper and the foam transfer gripper are both connected to the moving end of the second robotic arm. The pressure holding assembly is located on one side of the second robotic arm and includes a lifting module, a pressing block, and a pressing station. The lifting module extends vertically, the pressing block is slidably connected to the lifting module, and the pressing block is located above the pressing station.

5. The PCB processing system of claim 1, wherein: The third processing mechanism includes a third robotic arm, the resistor bending assembly and the unloading gripper are respectively connected to the moving end of the third robotic arm, wherein the resistor bending assembly includes at least one roller, the roller presses the thermistor of the PCB board to be processed to connect the thermistor to the foam.

6. The PCB processing system of claim 1, wherein: The PCB board processing system also includes multiple visual guidance mechanisms, which are respectively set to correspond to the first processing mechanism, the second processing mechanism and the third processing mechanism. Each visual guidance mechanism includes a frame, a second lifting module and a camera. The second lifting module is connected to the frame and extends in the vertical direction. The camera is slidably connected to the second lifting module and is set towards the PCB board to be processed.

7. The PCB processing system of claim 6, wherein: The PCB board processing system also includes a control mechanism, a machine base, and multiple positioning processing stations. The loading mechanism, the first processing mechanism, the second processing mechanism, the third processing mechanism, the transmission mechanism, the unloading mechanism, and the visual guidance mechanism are all connected to the control mechanism and are all disposed on the machine base. The multiple positioning processing stations are respectively disposed corresponding to the first processing mechanism, the second processing mechanism, and the third processing mechanism.

8. A PCB board processing method, characterized in that: PCB board processing is performed using the PCB board processing system according to any one of claims 1 to 7, comprising: Step S1: Place the PCB board to be processed in the carrier, and place the full carrier in the loading mechanism so that the PCB board to be processed can be loaded through the loading mechanism. Step S2: The PCB board to be processed is moved to the bonding station by the first clamping component, and the adhesive is supplied by the first feeding feeder. Then, the adhesive is adsorbed by the adhesive suction cup and moved to one side of the PCB board to be processed to obtain the first semi-finished product. Step S3: The first semi-finished product is moved to the foam bonding station by the conveying mechanism, and foam is supplied by the second feeding feeder. Then, the back film on the colloid is first removed by the film tearing claw, and then the foam is moved and attached to the colloid by the foam transfer claw to obtain the second semi-finished product. Step S4: After the second semi-finished product is moved to the resistor bending station by the transmission mechanism, the thermistor on the second semi-finished product is rolled by the third processing mechanism until the thermistor is connected to the foam to obtain the target PCB board. Step S5: Move the processed PCB board to the unloading mechanism to complete the unloading process.

9. The PCB board processing method according to claim 8, characterized in that: In step S2, before applying the adhesive, the thermistor on the PCB to be processed is pre-folded using a pre-folding plate. Then, the PCB to be processed is flipped so that the side without terminals faces upwards before applying the adhesive. In step S3, the first semi-finished product is pressed together using a pressure-holding assembly before attaching the foam. In step S4, the pre-folded thermistor is graded and rolled using a resistor bending assembly until the thermistor is connected to the foam.

10. The PCB board processing method according to claim 8, characterized in that: In steps S2 to S4, the movement paths of the colloid, the foam, and the resistance roller are planned and guided by the visual guidance mechanism.

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