Measurement-while-drilling circuit board protection device and protection method

Abstract

The invention provides a measurement-while-drilling circuit board protection device and method.The device comprises a first supporting plate and a second supporting plate, the first supporting plate and the second supporting plate are used for being arranged on the two sides of a to-be-protected circuit board respectively, the first supporting plate and the second supporting plate are connected through a connecting piece, and the first supporting plate and the second supporting plate are arranged in a spaced mode; a potting space is formed between the first supporting plate and the second supporting plate, the potting space is filled with potting colloid, and the potting colloid wraps the outer side of the circuit board. The first supporting plate and the second supporting plate are used for supporting the two faces of the circuit board respectively, deformation of the circuit board is limited, and the resistance of the circuit board to pressure impact is higher; the circuit board, the first supporting plate and the second supporting plate are connected through the pouring sealant, so that heat on the circuit board can be better transmitted to the first supporting plate and the second supporting plate through the pouring sealant, and heat dissipation of the circuit board is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of measurement-while-drilling technology, and in particular to a measurement-while-drilling circuit board protection device and a protection method. BACKGROUND

[0002] A measurement-while-drilling device is used to measure and monitor various parameters in real time during drilling operations, such as well depth, hole inclination angle, azimuth angle, formation resistivity, formation density, and formation thermal conductivity. The measurement-while-drilling device is usually composed of multiple sensors and measuring equipment, which are installed on a drill pipe or a measuring tool to obtain various parameters during drilling.

[0003] During measurement-while-drilling, vibrations are generated during drilling operations, especially when the rotating drill pipe and drill bit drill into the formation. These vibrations are transmitted to the measurement-while-drilling device, causing a large impact on the circuit board inside the measurement-while-drilling device. On the other hand, as the drilling depth increases, the downhole temperature rises, and temperature changes can cause the circuit board material to expand or contract, thereby causing stress on the circuit board and components on the circuit board, which can easily lead to circuit board damage or abnormal function.

[0004] To protect the measurement-while-drilling circuit board, the prior art usually uses a whole circuit board sealing glue, and then uses a high-temperature adhesive tape to wrap and fix to isolate the temperature influence of the external environment on the circuit board.

[0005] However, during actual field measurement, when the drill bit drills into the formation, there is often a pressure difference between the formation fluid (such as groundwater or oil and gas) in the pores or cracks of the formation and the drilling fluid in the well. As the drill bit continues to drill deeper, the pressure difference changes, causing a pressure impact on the measurement-while-drilling circuit board, so that the circuit board is subjected to at least the following impacts: impact from vibrations during drilling, stress impact from temperature changes, and impact from pressure difference changes. The high-temperature adhesive tape wrapping and sealing glue fixing isolation method cannot provide sufficient impact protection, affecting the reliability of the hardware system of the measurement-while-drilling instrument. SUMMARY

[0006] Therefore, it is necessary to provide a measurement-while-drilling circuit board protection device and a protection method to solve the above technical problems.

[0007] In a first aspect, the present application provides a measurement-while-drilling circuit board protection device.

[0008] The application discloses a kind of measurement while drilling circuit board protection devices, comprising: first support plate and second support plate, the first support plate and the second support plate are used to be arranged in the two sides of the circuit board to be protected respectively, the first support plate and the second support plate are connected by connecting piece, the first support plate and the second support plate are spaced apart, and the first support plate and the second support plate form filling space between spacing, and the filling space is filled with potting glue, and the potting glue is coated on the outside of the circuit board.

[0009] The beneficial effects of the present scheme are: by supporting the opposite two surfaces of the circuit board with the first support plate and the second support plate, the deformation of the circuit board is limited, and the resistance of the circuit board to pressure impact is stronger; by using the spacing space between the first support plate and the second support plate as a filling space, the operation of injecting glue with a filling mold can be omitted, and demolding is not required, thereby improving the glue sealing efficiency. At the same time, the circuit board and the first support plate and the second support plate are connected by the potting glue, so that the heat on the circuit board can be better transmitted to the first support plate and the second support plate through the potting glue, thereby increasing the heat dissipation area of the circuit board and helping to reduce the influence of self-heating of the circuit board. In summary, the present scheme sets the first support plate and the second support plate on the opposite two surfaces of the circuit board, and fills the potting glue between the first support plate and the second support plate, thereby reducing the deformation of the circuit board, providing better isolation and stronger impact protection for the circuit board, and helping to improve the glue sealing efficiency and heat dissipation of the circuit board.

[0010] Preferably, the connecting piece includes a plurality of screws, a plurality of first through holes are formed in the first support plate, a plurality of first screw holes are formed in the second support plate, each first through hole is aligned with a first screw hole, each screw passes through a first through hole and a first screw hole, and is screwed with the side wall of the first screw hole.

[0011] The beneficial effects of the present scheme are: by screwing the first support plate and the second support plate together, the first support plate and the second support plate form a whole support structure, and support each other, thereby providing more stable impact protection for the circuit board. At the same time, the screw fixing method is simple and convenient, has good fixing effect, and is convenient for subsequent disassembly and maintenance of the structure.

[0012] Preferably, the connecting piece includes a plurality of bolts and nuts, a plurality of first through holes are formed in the first support plate, a plurality of second through holes are formed in the second support plate, each first through hole is aligned with a second through hole, each screw passes through a first through hole and a second through hole, and is screwed with a nut.

[0013] The beneficial effects of the scheme are: the scheme is another method for screwing and fixing the first support plate and the second support plate, the first support plate and the second support plate are fixed together through the cooperation of the screw and the nut, so that the first support plate and the second support plate form an integral support structure, support each other, and provide more stable impact protection for the circuit board. In addition, the processing method of this way is simple, the screws and nuts used are easy to purchase, and the protection device is easy to disassemble, maintain and maintain.

[0014] Preferably, one side of the first support plate facing the second support plate is provided with a plurality of first accommodating grooves.

[0015] The beneficial effects of the scheme are: the accommodating grooves are used to accommodate the components on the circuit board, and play a role in avoiding. In actual use, the components on the circuit board are usually divided according to functional areas and are pasted, a plurality of accommodating grooves are opened in the first support plate to accommodate the components in different functional areas, which can better protect the components.

[0016] Preferably, one side of the second support plate facing the first support plate is provided with a plurality of second accommodating grooves.

[0017] The beneficial effects of the scheme are: the accommodating grooves are used to accommodate the components on the circuit board, and play a role in avoiding. In actual use, the components on the circuit board are usually divided according to functional areas and are pasted, a plurality of accommodating grooves are opened in the second support plate to accommodate the components in different functional areas, which can better protect the components.

[0018] Preferably, the first support plate comprises a first plate body and a first reinforcing rib protruding on the first plate body.

[0019] The beneficial effects of the scheme are: the first reinforcing rib is used to increase the strength of the first plate body, so that the first support plate is less likely to deform and damage under the action of various impact forces, and provides better impact protection for the circuit board.

[0020] Preferably, the second support plate comprises a second plate body and a second reinforcing rib protruding on the second plate body.

[0021] The beneficial effects of the scheme are: the second reinforcing rib is used to increase the strength of the second plate body, so that the second support plate is less likely to deform and damage under the action of various impact forces, and provides better impact protection for the circuit board.

[0022] In a second aspect, the application provides a method for protecting a measurement-while-drilling circuit board.

[0023] A method for protecting a measurement-while-drilling circuit board comprises:

[0024] providing a first support plate and a second support plate;

[0025] Placing the first support plate and the second support plate respectively parallel on both sides of the circuit board to be protected, so that the first support plate and the second support plate are spaced apart, and an inner side forms a potting space;

[0026] Fixing the first support plate and the second support plate by the connecting piece;

[0027] Pouring potting glue into the potting space;

[0028] Curing the potting glue to obtain a potting glue body wrapped on the outer side of the circuit board.

[0029] The beneficial effects of the present scheme are: by supporting the opposite two sides of the circuit board with the first support plate and the second support plate, the deformation amount of the circuit board is limited, and the resistance of the circuit board to pressure impact is stronger; by using the space between the first support plate and the second support plate as a potting space, the operation of injecting glue with a potting mold can be omitted, and demolding is not needed, improving the glue sealing efficiency. At the same time, the circuit board, the first support plate and the second support plate are connected by the potting glue, so that the heat on the circuit board can be better transmitted to the first support plate and the second support plate through the potting glue, and then diffused to the external environment, which helps to reduce the influence of the heat generated by the circuit board itself. In summary, the present scheme sets the first support plate and the second support plate on the opposite two sides of the circuit board, and pours glue between the first support plate and the second support plate, which reduces the deformation of the circuit board, provides better isolation and stronger impact protection for the circuit board, and helps to improve the glue sealing efficiency and heat dissipation of the circuit board.

[0030] Preferably, the first support plate and the second support plate have a deformation amount less than 3% within a preset temperature range, wherein the preset temperature range is 0 to 200°.

[0031] The beneficial effects of the present scheme are: the preset temperature range is usually consistent with the working temperature of the drilling device, and the structure with a deformation amount less than 3% can ensure that the first support plate and the second support plate maintain a stable form and do not deform excessively, thereby providing good protection for the circuit board.

[0032] Preferably, the step of curing the potting glue to obtain a potting glue body wrapped on the outer side of the circuit board comprises:

[0033] Using a heat aging device to cure the potting glue to obtain a potting glue body wrapped on the outer side of the circuit board.

[0034] The beneficial effects of the scheme are: the heat aging equipment can provide suitable temperature and humidity conditions, which can accelerate the curing process of the potting adhesive, and the curing of the heat aging equipment can help improve the physical and chemical properties of the potting adhesive, so that the cured potting adhesive generally has better heat resistance, adhesion, and good electrical insulation performance, thereby providing better heat insulation and protection effects for the circuit board.

[0035] In summary, the scheme includes at least the following beneficial effects:

[0036] By supporting the opposite two surfaces of the circuit board through the first support plate and the second support plate, the deformation amount of the circuit board is limited, and the resistance of the circuit board to pressure impact is stronger; by using the spacing space between the first support plate and the second support plate as a potting space, the operation of injecting adhesive by using a potting mold can be omitted, and demolding is not required, thereby improving the efficiency of adhesive sealing. At the same time, the circuit board, the first support plate and the second support plate are connected by the potting adhesive, so that the heat on the circuit board can be better transmitted to the first support plate and the second support plate through the potting adhesive, thereby increasing the heat dissipation area of the circuit board and helping to reduce the influence of the heat generated by the circuit board itself. In summary, the scheme sets the first support plate and the second support plate on the opposite two surfaces of the circuit board, and fills the potting adhesive between the first support plate and the second support plate, thereby reducing the deformation of the circuit board, providing better isolation and stronger impact protection for the circuit board, and helping to improve the efficiency of adhesive sealing and heat dissipation of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall structure of the MWD circuit board protection device in one embodiment;

[0038] Figure 2 It is an exploded view schematic diagram of the MWD circuit board protection device in one embodiment;

[0039] Figure 3 It is a schematic diagram of the implementation flow of the MWD circuit board protection method in one embodiment.

[0040] BRIEF DESCRIPTION OF DRAWINGS: 100, first support plate; 101, first accommodating groove; 200, second support plate; 201, second accommodating groove; 300, connecting piece; 310, screw; 320, first through hole; 330, first screw hole; 400, potting space. DETAILED DESCRIPTION

[0041] The MWD device is used for real-time measurement and monitoring of various parameters during drilling operations, such as well depth, well inclination angle, azimuth angle, formation resistivity, formation density, and formation thermal conductivity. The MWD device is usually composed of multiple sensors and measurement equipment, which are installed on the drill pipe or measurement tool to obtain various parameters during drilling.

[0042] In the process of measurement while drilling, drilling operation will produce vibration, especially when the rotating drill pipe and drill bit drill into the formation, these vibrations will be transmitted to the measurement while drilling device, causing a greater impact on the circuit board inside the measurement while drilling device. On the other hand, when the drilling depth increases, the downhole temperature will rise, and the temperature change can cause the circuit board material to expand or shrink, thereby causing stress to the circuit board and components on the circuit board, which can easily lead to circuit board damage or abnormal function.

[0043] To protect the measurement while drilling circuit board, the prior art usually uses a whole circuit board to seal glue, and then uses high-temperature adhesive tape to wrap and fix to isolate the temperature influence of the external temperature on the circuit board.

[0044] However, in actual field measurement, when the drill bit drills into the formation, there is often a pressure difference between the formation fluid (such as groundwater or oil and gas) in the pores or cracks of the formation and the drilling fluid in the well. As the drill bit continues to penetrate, the pressure difference will change, causing a pressure impact on the measurement while drilling circuit board, so that the circuit board is subjected to at least the following impacts: impact from vibration during drilling, stress impact from temperature change, and impact from pressure difference change. The fixed isolation method of wrapping with high-temperature adhesive tape and sealing with glue is difficult to provide sufficient impact protection, affecting the reliability of the hardware system of the measurement while drilling instrument.

[0045] To solve the problem that the fixed isolation method of wrapping with high-temperature adhesive tape and sealing with glue in the prior art is difficult to provide sufficient impact protection for the measurement while drilling circuit board, affecting the reliability of the hardware system of the measurement while drilling instrument, the present application provides a measurement while drilling circuit board protection device and protection method.

[0046] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0047] Embodiment one

[0048] A measurement while drilling circuit board protection device, referring to the accompanying Figure 1 and the accompanying Figure 2 , comprising: a first support plate 100 and a second support plate 200, the first support plate 100 and the second support plate 200 are used to be arranged on both sides of the circuit board to be protected, the first support plate 100 and the second support plate 200 are connected by a connecting piece 300, the first support plate 100 and the second support plate 200 are arranged with a spacing between them, a filling space 400 is formed between the first support plate 100 and the second support plate 200, a filling glue body (not shown in the figure) is arranged in the filling space 400, and the filling glue body is wrapped on the outside of the circuit board.

[0049] Refer to the drawings Figure 2 Specifically, in the embodiment, the first support plate 100 and the second support plate 200 are fixed to the front and back of the circuit board to be protected by the same connecting piece 300, so that the impact force on the first support plate 100 and the second support plate 200 can be transmitted to each other through the connecting piece 300, thereby playing a stress dispersion effect and strengthening the deformation resistance of the first support plate 100 and the second support plate 200.

[0050] The first support plate can be integrally formed with a avoiding groove for avoiding the front components of the circuit board, and the second support plate can be integrally formed with a avoiding cavity for avoiding the back components of the circuit board, and the space between the avoiding groove and the avoiding cavity is the filling space.

[0051] The fixing mode of the circuit board in the filling space can be that one side of the second support plate facing the circuit board is provided with a mounting groove, the mounting groove is communicated with the avoiding cavity and is used for accommodating the circuit board, and when the first support plate and the second support plate are fixedly connected through the connecting piece, the circuit board is fixed in the filling space.

[0052] In the prior art, the measurement-while-drilling instrument is usually hollow and rod-shaped, and after the circuit board is completed, it is closed in a narrow instrument, which is easy to cause poor heat dissipation effect of the circuit board.

[0053] The scheme can fix the first support plate 100 and the second support plate 200 on the front and back of the circuit board, fix the second support plate 200 on the skeleton of the measurement-while-drilling instrument, and expose the first support plate 100 at least partially from the skeleton when fixing the circuit board, so that the heat generated by the circuit board can be transmitted to the first support plate 100 and the second support plate 200 through the filling glue, and then dissipated to the external environment, which is helpful for heat dissipation of the circuit board and makes the performance of the measurement-while-drilling instrument more stable. In addition, due to the softness of the filling glue, external impact force can be effectively absorbed, which not only effectively protects the circuit board, but also provides effective buffering for the circuit board.

[0054] Refer to the drawings Figure 2 In one embodiment, the connecting piece 300 includes a plurality of screws 310, the first support plate 100 is provided with a plurality of first through holes 320, and the second support plate 200 is provided with a plurality of first screw holes 330. Each first through hole 320 is aligned with a first screw hole 330, each screw 310 passes through a first through hole 320 and a first screw hole 330, and is screwed with the side wall of the first screw hole 330.

[0055] The first through holes 320 can be arranged at the edges of the first support plate 100, and the first screw holes 330 can be arranged at the edges of the second support plate 200, so as to reliably connect the first support plate 100 and the second support plate 200. The circuit board is provided with a plurality of through holes communicating with the first through holes 320 and the first screw holes 330, and the screws 310 are screwed with the first screw holes 330 after penetrating through the first through holes 320 and the through holes.

[0056] In other possible embodiments, the first support plate can be provided with a plurality of first screw holes, and the second support plate can be provided with a plurality of first through holes. Each screw can penetrate through a first through hole and be screwed with a side wall of a first screw hole.

[0057] The first support plate and the second support plate are fixed together by the screws, so that the first support plate and the second support plate form an integral support structure and support each other to provide more stable impact protection for the circuit board. Meanwhile, the screw fixing method is simple and convenient, has good fixing effect, and is convenient for subsequent disassembly, assembly and maintenance.

[0058] In another embodiment, the connecting member includes a plurality of bolts and nuts, the first support plate is provided with a plurality of first through holes, the second support plate is provided with a plurality of second through holes, each first through hole is aligned with a second through hole, and each screw penetrates through a first through hole and a second through hole and is screwed with a nut.

[0059] The first support plate and the second support plate are connected by the nuts and the screws, which saves the process of opening screw holes on the first support plate or the second support plate, so that the protection device is easier to manufacture.

[0060] In other possible embodiments, the first support plate 100 and the second support plate 200 can also be fixed together by buckling or riveting, which is not limited here.

[0061] Referring to the accompanying drawings Figure 2 In one embodiment, the first support plate 100 is provided with a plurality of first accommodating grooves 101 on the side facing the second support plate 200.

[0062] The first accommodating grooves 101 are used to accommodate the components on the front side of the circuit board. In actual use, the components on the circuit board are usually divided by function area and are pasted. The first support plate 100 is provided with a plurality of first accommodating grooves 101 to accommodate the components in different functional areas, which can better isolate the components, such as isolating high-heat components from ordinary components, reducing heat transfer between components, and short circuit.

[0063] The first accommodating grooves 101 can be formed through two opposite surfaces of the first support plate 100, so as to facilitate pouring of the circuit board with the encapsulation glue, and also help heat dissipation.

[0064] Specifically, the first support plate 100 is formed with at least two first accommodating grooves 101, the shape of the first accommodating grooves 101 is matched with the distribution shape of the components in the functional area of the circuit board, one side of the first support plate 100 facing the circuit board is completely attached to the circuit board, and the first accommodating grooves 101 are poured with the encapsulation glue.

[0065] Through the through grooving and the completely attached mode, the support effect of the first support plate 100 on the circuit board is better, and the circuit board is less likely to be deformed when high-intensity impact force is encountered.

[0066] Referring to the accompanying drawings Figure 2 In one embodiment, the second support plate 200 is provided with a plurality of second accommodating grooves 201 on the side facing the first support plate 100.

[0067] The second accommodating grooves 201 are used for accommodating the components on the back of the circuit board, and the second accommodating grooves 201 have similar effects to the first accommodating grooves 101, and details are not repeated here.

[0068] By attaching the first support plate 100 and the second support plate 200 to the surface of the circuit board, the circuit board can be provided with more anti-deformation protection.

[0069] In one embodiment, the first support plate includes a first plate body and a first reinforcing rib protruding on the first plate body.

[0070] The first reinforcing rib can be protruding on the first plate body in a longitudinal and transverse interlaced state, or can be parallel to the first plate body, and details are not limited here. By providing the first reinforcing rib, the strength of the first plate body is further improved, so as to improve the anti-deformation ability.

[0071] In one embodiment, the second support plate includes a second plate body and a second reinforcing rib protruding on the second plate body.

[0072] The second reinforcing rib has similar effects and setting modes to the first reinforcing rib, and details are not repeated here.

[0073] The implementation principle of the embodiment is that the first support plate 100 and the second support plate 200 support the opposite two surfaces of the circuit board respectively, limit the deformation amount of the circuit board, and make the circuit board more resistant to pressure impact; the interval space between the first support plate 100 and the second support plate 200 is used as the pouring space 400, so that the operation of injecting glue by using a pouring mold can be omitted, and demolding is not needed, thereby improving the glue sealing efficiency. At the same time, the pouring glue is used to connect the circuit board and the first support plate 100 and the second support plate 200, so that the heat on the circuit board can be better transmitted to the first support plate 100 and the second support plate 200 through the pouring glue, and then diffused to the external environment, which helps to reduce the influence of the heat generated by the circuit board itself. In summary, by arranging the first support plate 100 and the second support plate 200 on the opposite two surfaces of the circuit board, and pouring glue between the first support plate 100 and the second support plate 200, the deformation of the circuit board is reduced, better isolation and stronger impact protection are provided for the circuit board, and the glue sealing efficiency and heat dissipation of the circuit board are improved.

[0074] Embodiment two

[0075] In the embodiment, as shown in Figure 3 a measurement-while-drilling circuit board protection method is provided, including steps 210 to 250:

[0076] Step 210, providing a first support plate and a second support plate;

[0077] The support plate is used to provide impact protection for the circuit board, so it needs to have strong anti-deformation characteristics. In actual use, the working temperature range of the measurement-while-drilling instrument is usually 0 to 200°, so the first support plate and the second support plate need to have good anti-deformation characteristics in this temperature range, and the deformation amount is less than 3%, so as to provide impact protection for the circuit board as much as possible.

[0078] Within 0-200 degrees, the plate material with a deformation amount less than 3% usually includes aluminum alloy plate material, stainless steel plate material and carbon fiber plate material. For example, the carbon fiber plate material can be used to process the first support plate and the second support plate, so as to meet the deformation requirement in the preset temperature range.

[0079] Step 220, placing the first support plate and the second support plate parallel on the two sides of the circuit board to be protected, so that the first support plate and the second support plate are spaced apart, and an inner side forms a pouring space;

[0080] In the embodiment, the first pouring space can be formed between the first support plate and the circuit board, and the second pouring space can be formed between the second support plate and the circuit board. The first pouring space and the second pouring space can be independent of each other, or can be in communication with each other.

[0081] The potting space is used for pouring potting glue on the protected circuit board. The potting glue can effectively seal the electronic components and circuits on the circuit board, prevent external substances such as moisture, dust, and oil from entering, and thus improve the waterproof and dustproof performance and vibration resistance of the product.

[0082] In addition, the potting glue of some models also has good heat conduction performance, which can help the electronic components to dissipate heat better and prevent the temperature of the components from being too high during operation to affect their performance and service life. This type of potting glue usually contains heat-conducting fillers such as metal powder or ceramic powder, materials such as aluminum oxide and boron nitride to improve the overall heat conduction performance.

[0083] The potting glue can be used as a medium to connect the surface of the circuit board to the first support plate and the second support plate. By using potting glue with good heat conduction performance, it helps to transfer the heat on the circuit board to the first support plate and the second support plate, and finally dissipate to the outside environment through the first support plate and the second support plate. Thus, the first support plate and the second support plate not only provide deformation resistance protection, but also increase the heat dissipation area of the circuit board, further ensuring the stability and reliability of the circuit board performance.

[0084] Step 230, fixing the first support plate and the second support plate through the connecting piece;

[0085] The connecting piece can be connected and fixed by screws, metal buckles, or rivets. The fixing method is similar to the method described in Embodiment 1 above, and is not repeated here to avoid repetition.

[0086] Step 240, pouring potting glue into the potting space;

[0087] When pouring the potting glue, an injection hole can be formed through the surface of the first support plate and / or the second support plate, the injection hole being in communication with the potting space, and the potting glue being injected from the injection hole.

[0088] For example, when the first potting space is formed between the first support plate and the circuit board, and the second potting space is formed between the second support plate and the circuit board, and the first potting space and the second potting space are not in communication with each other, a plurality of injection holes can be formed on the surface of the first support plate and the second support plate. When injecting the glue, the glue can be injected into the injection hole on the first support plate first, and after the potting glue solidifies or the glue does not leak out, the protection device can be turned over to inject the glue into the injection hole on the second support plate.

[0089] When the first potting space and the second potting space are in communication, a plurality of injection holes can be formed on the first support plate, and the glue can be injected into the injection hole until the glue completely covers the circuit board.

[0090] Step 250, solidifying the potting glue to obtain a potting glue body wrapped on the outer side of the circuit board.

[0091] The potting method of the potting adhesive can be curing by using a heat aging device. The heat aging device can provide suitable temperature and humidity conditions, which can accelerate the curing process of the potting adhesive, and the curing by the heat aging device can help to improve the physical and chemical properties of the potting adhesive, so that the cured potting adhesive generally has better heat resistance, adhesion, and good electrical insulation performance, thereby providing better heat insulation and protection for the circuit board.

[0092] The implementation principle and beneficial effects of the method are similar to those of the protection device in Embodiment 1 described above. To avoid repetition, details are not described here.

[0093] It should be understood that, although each step in the flowchart in the drawings is displayed in sequence according to the direction of the arrow, these steps are not necessarily executed in sequence according to the direction of the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other sequences. Moreover, Figure 3 At least part of the steps in the above embodiments can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of the sub-steps or stages is not necessarily sequential, but can be executed in rotation or alternation with other steps or at least part of the sub-steps or stages of other steps.

[0094] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0095] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A protection device for a measurement-while-drilling circuit board, characterized in that, include: A first support plate and a second support plate are respectively disposed on both sides of the circuit board to be protected. The first support plate and the second support plate are connected by a connector and are spaced apart. A potting space is formed between the first support plate and the second support plate, and the potting space is filled with potting colloid, which covers the outside of the circuit board.

2. The protection device for a measurement-while-drilling circuit board according to claim 1, characterized in that, The connector includes a plurality of screws. The first support plate has a plurality of first through holes, and the second support plate has a plurality of first screw holes. Each first through hole is aligned with a first screw hole. Each screw passes through a first through hole and a first screw hole and is screwed to the side wall of the first screw hole.

3. The measurement-while-drilling circuit board protection device according to claim 2, characterized in that, The connector includes multiple bolts and nuts. The first support plate has multiple first through holes, and the second support plate has multiple second through holes. Each first through hole is aligned with a second through hole. Each screw passes through a first through hole and a second through hole and is screwed into a nut.

4. The protection device for a measurement-while-drilling circuit board according to claim 1, characterized in that, The side of the first support plate facing the second support plate is provided with a plurality of first receiving grooves.

5. The protection device for a measurement-while-drilling circuit board according to claim 1, characterized in that, The second support plate has a plurality of second receiving grooves on the side facing the first support plate.

6. The protection device for a measurement-while-drilling circuit board according to claim 1, characterized in that, The first support plate includes a first plate body and a first reinforcing rib protruding from the first plate body.

7. The protection device for a measurement-while-drilling circuit board according to claim 1, characterized in that, The second support plate includes a second plate body and a second reinforcing rib protruding from the second plate body.

8. A method for protecting a measurement-while-drilling circuit board, characterized in that, include: Provide a first support plate and a second support plate; The first support plate and the second support plate are placed parallel to each other on both sides of the circuit board to be protected, so that there is a gap between the first support plate and the second support plate, and a potting space is formed on the inside. The first support plate and the second support plate are fixed by connectors; Inject potting compound into the potting space; The potting compound is cured to obtain a potting compound covering the outside of the circuit board.

9. The method for protecting the measurement-while-drilling circuit board according to claim 8, characterized in that, A first support plate and a second support plate are provided, wherein the deformation is less than 3% within a preset temperature range, wherein the preset temperature range is 0 to 200°.

10. The method for protecting the measurement-while-drilling circuit board according to claim 8, characterized in that, The step of curing the potting compound to obtain a potting compound covering the outside of the circuit board includes: The potting compound is cured using a thermal aging device to obtain a potting compound that covers the outside of the circuit board.

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