Mechanical-thermal integrated cabin plate for satellite and satellite comprehensive electronic structure

Abstract

The invention discloses a mechanical-thermal integrated deck for satellites, which comprises a plurality of slots for mounting board cards, and the board cards are fixed in the slots in a wedge-shaped locking manner. The machine-heat integrated cabin plate is applied to a satellite comprehensive electronic structure, compared with a conventional mode that a single machine is installed on a cellular board, the heat transfer process between a single machine bottom plate and the cabin plate and between inner and outer skins of the cabin plate is omitted, heat transfer between all board cards and a heat dissipation surface can be enhanced, and the heat transfer efficiency is improved. In addition, the total weight of the satellite can be reduced, the effective space utilization rate is improved, and the light weight and miniaturization of the whole satellite are achieved.

Description

Technical Field

[0001] This invention relates to the field of aerospace technology, and in particular to an integrated thermal and mechanical compartment for satellites and a satellite integrated electronic structure. Background Technology

[0002] The integrated satellite electronic system is a core component of the satellite platform. Through integrated design, it organically integrates multiple subsystems such as power management, data processing, communication, attitude control, and payload management, enabling unified scheduling of satellite resources, mission coordination, and fault management. Integrated satellite electronic system boards are key components of the system. Common boards include satellite service boards, telemetry and control boards, power boards, and communication boards. These boards are installed within specific modules and connect to other individual units on the satellite via I / O boards.

[0003] Existing satellite integrated electronic systems mostly use 3U chassis. After the various functional boards are installed inside the 3U chassis, they are connected to other individual units via I / O boards. Then, they are installed as a whole (002) onto the satellite module (001). Figure 1 As shown. Figure 2 A schematic diagram of a 3U chassis is shown, as follows: Figure 2 As shown, the 3U chassis includes a top plate 201, a bottom plate 202, and a side plate 203. The inner surface of the top plate 201 has several first slots 211, the direction of which is parallel to the surface of the side plate. The bottom plate 202 includes two side-by-side insert plates, each including several second slots 221, with each second slot 221 corresponding to one of the first slots 211. Functional boards are inserted in two rows, one in front of the other, between the second slots 221 and the first slots 211. After the I / O board is electrically connected to each functional board, it is mounted on the outer surface of the top plate 201.

[0004] It can be seen that the existing satellite integrated electronic system lacks a modular design concept, is not flexible in its compatibility with the whole satellite, and has a heavy single-unit structure. At the same time, the long heat conduction path is not conducive to heat dissipation. Summary of the Invention

[0005] To address some or all of the problems in the prior art, the first aspect of the present invention provides a thermally integrated cabin panel for a satellite, which has a plurality of slots for mounting circuit boards, wherein the circuit boards are fixed in the slots by a wedge locking method.

[0006] Furthermore, the thickness of the integrated mechanical and thermal compartment plate is no greater than XX, and it includes reinforcing ribs.

[0007] Furthermore, the integrated mechanical and thermal compartment includes a perforated structure, which is disposed between two adjacent slots.

[0008] Furthermore, the material of the integrated mechanical and thermal compartment is MB15 magnesium alloy, and its first surface is white and its second surface is black, wherein the second surface refers to the side surface where the slot is provided.

[0009] Based on the aforementioned integrated mechanical and thermal module, a second aspect of the present invention provides a satellite integrated electronic structure, comprising a first support plate, a first integrated mechanical and thermal module, a second support plate, and a second integrated mechanical and thermal module. The first support plate, the first integrated mechanical and thermal module, the second support plate, and the second integrated mechanical and thermal module are connected end to end to form an electronics module. The first integrated mechanical and thermal module and the second integrated mechanical and thermal module are provided with a plurality of boards. The connecting lines of the boards are led out from the -X direction, where the +Y direction refers to the side where the second integrated mechanical and thermal module is located, and the +Z direction is the side where the first support plate is located.

[0010] Furthermore, the boards include: space service boards, telemetry and control boards, communication boards, and energy boards.

[0011] Furthermore, the communication board includes a 6G core network board.

[0012] Furthermore, the energy board is communicatively connected to the lower-level machine via a CAN bus.

[0013] Furthermore, the satellite integrated electronic architecture also includes:

[0014] A backplate is vertically fixed to the integrated mechanical and thermal module and located on the outgoing side of the board. The backplate covers at least the -X side surface of the board on the integrated mechanical and thermal module. The +X side of the backplate includes an I / O plate, which is electrically connected to the board.

[0015] Furthermore, the back plate is fixed to the integrated mechanical and thermal compartment plate by means of a stop or interlocking, and is fixed by screws in two directions.

[0016] Furthermore, the satellite integrated electronic architecture also includes:

[0017] A guide plate is arranged parallel to the integrated mechanical and thermal compartment plate, and one end of the guide plate is fixed to the back plate. The guide plate is provided with a plurality of guide grooves, and the guide grooves are arranged one-to-one with the slots on the integrated mechanical and thermal compartment plate. The two opposite sides of the plate are respectively arranged in the guide grooves and slots.

[0018] Furthermore, the guide plate is fixed to the integrated mechanical and thermal compartment plate and the back plate by means of a stop or interlocking, and is fixed by screws in two directions.

[0019] Furthermore, the guide plate includes a hollow structure.

[0020] A third aspect of the present invention provides a satellite comprising the integrated electronic structure of a satellite as described above.

[0021] This invention provides an integrated thermal and mechanical module compartment panel and a comprehensive electronic structure for satellites. The integrated design enhances heat transfer between the various boards and the heat dissipation surfaces by directly using the ±Y board as the mounting slot for the 3U board. Compared to conventional single-unit mounting on a honeycomb panel, this eliminates the heat transfer process between the single-unit base plate and the compartment panel, as well as the inner and outer skins of the compartment panel, thus improving heat transfer efficiency. Furthermore, the electronic components are directly integrated into the satellite module compartment structure, eliminating the need for some housings, cables, equipment mounting fasteners, and embedded fasteners. This significantly reduces the overall weight of the satellite and greatly improves the effective space utilization, achieving overall satellite lightweighting and miniaturization. The integrated thermal and mechanical module panel is easy to install and test. The boards can be installed via a plug-and-play method through the backplane, allowing the comprehensive electronic structure to flexibly combine boards according to requirements, enabling functional reconfiguration and providing greater scalability. Attached Figure Description

[0022] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the various embodiments of the present invention will be presented with reference to the accompanying drawings. It is to be understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0023] Figure 1 A schematic diagram showing the installation of existing integrated satellite electronic systems in a satellite is provided.

[0024] Figure 2 This diagram shows the structure of an existing 3U chassis.

[0025] Figure 3 This diagram illustrates the structure of an integrated mechanical and thermal compartment according to an embodiment of the present invention.

[0026] Figure 4 A schematic diagram illustrating a locking method for a circuit board according to an embodiment of the present invention is shown;

[0027] Figure 5 This diagram illustrates the structure of a wedge-shaped locking structure according to an embodiment of the present invention.

[0028] Figure 6 This diagram illustrates the structure of a satellite integrated electronic architecture according to an embodiment of the present invention.

[0029] Figure 7 A rear view schematic diagram of a satellite integrated electronic structure according to an embodiment of the present invention is shown; and

[0030] Figure 8This diagram illustrates the installation of a board according to an embodiment of the present invention. Detailed Implementation

[0031] The invention will now be further described with reference to the accompanying drawings and specific embodiments. It should be noted that the components in the drawings may be shown exaggeratedly for illustrative purposes and are not necessarily to scale. In the drawings, the same reference numerals are used for components that are identical or have the same function.

[0032] In this invention, unless otherwise specified, "arranged on," "arranged above," and "arranged on" do not exclude the possibility of an intermediate element between them. Furthermore, "arranged on or above" merely indicates the relative positional relationship between two components, and in certain cases, such as when the product orientation is reversed, it can also be converted to "arranged below or under," and vice versa.

[0033] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0034] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0035] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0036] It should also be noted that, within the scope of this invention, the terms "same," "equal," and "equal to" do not imply that the two values ​​are absolutely equal, but rather allow for a certain reasonable margin of error. In other words, the terms also encompass "substantially the same," "substantially equal," and "substantially equal to." Similarly, in this invention, the directional terms "perpendicular to," "parallel to," etc., also encompass the meanings of "substantially perpendicular to" and "substantially parallel to."

[0037] To reduce the structural weight of the satellite integrated electronic system and enhance heat transfer efficiency, this invention adopts an integrated design. To strengthen heat transfer between each board and the heat dissipation surface, the ±Y board is directly used as the mounting slot for the 3U board. Compared to conventional single-unit mounting on a honeycomb board, this eliminates the heat transfer process between the single-unit base plate and the cabin plate, as well as the inner and outer skins of the cabin plate, thus enhancing heat transfer efficiency. Simultaneously, the 3U board is designed for lightweighting. Heat transfer from components on the PCB board is primarily through thermal conduction. Due to the relatively low thermal conductivity of the PCB motherboard, heat loss mainly occurs from the top, conducted to the central frame boss position via thermally conductive fillers, such as thermally conductive films or other high thermal conductivity materials. Wedge-shaped locking mechanisms are installed on the ribs on both sides of the module for easy module maintenance. When the module is inserted into the mounting plate slot, the wedge-shaped locking mechanisms lock the module in place. Heat exchange is achieved between the closely fitting ribs and the mounting plate and front slot plate. Part of the heat is radiated into the cold space background, and part is radiated into the cabin. Furthermore, since the upper and lower cover plates of traditional satellite integrated electronic structures mainly serve a protective function, they are removed in this embodiment to reduce weight.

[0038] The technical solution of the present invention will be further described below with reference to the accompanying drawings of the embodiments.

[0039] Figure 3 A schematic diagram of the structure of an integrated mechanical and thermal compartment according to an embodiment of the present invention is shown. Figure 3 As shown, a thermally integrated panel has several slots 301 for mounting expansion cards. In one embodiment of the invention, the slots 301 conform to the VPX standard, thus supporting the insertion of standard 3U VPX expansion cards.

[0040] To improve heat dissipation, in one embodiment of the present invention, the integrated mechanical and thermal slab is designed as a thin-walled, and / or perforated structure with reinforcing ribs. Specifically, in one embodiment of the present invention, the thickness of the integrated mechanical and thermal slab is no more than 25 mm and includes reinforcing ribs. In another embodiment of the present invention, the integrated mechanical and thermal slab includes a perforated structure disposed between two adjacent slots. In the embodiments of the present invention, weight reduction measures, such as perforated structures, should not interrupt the heat dissipation path or increase the total thermal resistance to the heat sink, thereby reducing structural mass while maintaining good rigidity, strength, and manufacturability.

[0041] To further improve heat dissipation efficiency, in one embodiment of the present invention, the integrated mechanical and thermal compartment plate is made of a high thermal conductivity material, such as MB15 magnesium alloy, etc., and its first surface is white, for example, sprayed with white paint, and the second surface is black, for example, sprayed with black paint or black anodized, to ensure that the reflectivity is greater than 0.85. The second surface refers to the side surface where the slot is provided.

[0042] In one embodiment of the present invention, the circuit board directly contacts the side wall of the integrated mechanical and thermal interface material for heat conduction, ensuring good thermal connection between the circuit board and the slot 301 while maintaining weight. In another embodiment, thermal grease can be filled at the contact surface between the circuit board and the slot, while simultaneously maximizing the effective heat transfer thickness of the integrated mechanical and thermal interface material wall. In one embodiment, the effective thickness at the thinnest point of the integrated mechanical and thermal interface material wall is 5mm, which simultaneously meets mechanical requirements and heat dissipation needs.

[0043] In one embodiment of the present invention, the board is fixed in the slot by a wedge locking method, such as... Figure 4 As shown, both sides of the board 401 are provided with wedge-shaped locking structures 402, wherein the wedge-shaped locking structure 402 may be, for example, a structure of five sliders. Figure 5 A schematic diagram of a wedge-shaped locking structure according to an embodiment of the present invention is shown, as follows: Figure 5 As shown, the wedge-shaped locking structure adopts a five-slider structure. When locking, tightening the top screw 506 causes the first slider 501, the third slider 503, and the fifth slider 505 to move axially, while the second slider 502 and the fourth slider 504 move radially, pressing the slot tightly and providing a reliable frictional force for fixing the board.

[0044] Based on the aforementioned integrated mechanical and thermal module, a chassis-less integrated satellite electronic structure design can be realized. The integrated satellite electronics consists of three subsystems: satellite operations, energy, and telemetry, tracking, and command (TT&C). It is responsible for overall satellite electronic information processing, energy management, TT&C management, power supply and distribution management, satellite operations management, thermal control management, attitude determination and control algorithms, orbit prediction and control strategies, onboard time synchronization and ground-to-ground time calibration, and providing the necessary support conditions for payload operation, including power supply and distribution management, telemetry, control, and engineering data transmission. In one embodiment of this invention, the integrated satellite electronic structure, based on an open VPX architecture, uses standard 3U VPX boards, uniformly integrated into the VPX standard slots on the integrated mechanical and thermal module, thus realizing a chassis-less integrated satellite electronic structure design.

[0045] Figure 6 This diagram illustrates a structural schematic of a satellite integrated electronic structure according to an embodiment of the present invention. Figure 7 This diagram shows a rear view of a satellite integrated electronic structure according to an embodiment of the present invention. As shown, a satellite integrated electronic structure includes an electronics compartment surrounded by four side panels. The first side panel 611 in the +Y direction and the third side panel 613 in the -Y direction are thermally integrated compartments as described above, while the second side panel 612 in the +Z direction and the fourth side panel 614 in the -Z direction are ordinary compartments. No compartments are provided in the +X and -X directions to reduce the overall structural weight.

[0046] As mentioned above, the integrated mechanical and thermal compartment is provided with several slots, on which a board 602 can be installed. As shown in the figure, the slots are located on the side of the integrated mechanical and thermal compartment facing the inside of the electronics compartment, and the board 602 is located inside the electronics compartment.

[0047] In one embodiment of the present invention, each integrated mechanical and thermal module can be provided with up to 18 board slots. In another embodiment of the present invention, the first side panel 511 is provided with 12 energy boards, and the energy addition slave unit is interconnected with the computer via a CAN bus. The third side panel 613 is provided with satellite service boards, telemetry and control boards, and communication boards, wherein the communication boards are 6G core network boards, and there are a total of 13 satellite service boards, telemetry and control boards, and communication boards. It should be understood that, depending on the satellite model, the types and quantities of boards included in the satellite integrated electronic structure may be different, and their installation positions are not limited to the embodiments described above.

[0048] To facilitate installation, testing, and maintenance, in one embodiment of the present invention, the board's wiring is arranged in a rear-out manner, opposite to the board's insertion and removal direction; that is, the board's connecting wires are led out from the -X direction, pointing towards the interior of the satellite.

[0049] Figure 8 This diagram illustrates the installation of a circuit board according to an embodiment of the present invention. Figure 8 As shown, in one embodiment of the present invention, a backplate 603 is further provided in the outgoing direction of the board. In one embodiment of the present invention, there are two backplates 603, which are respectively vertically fixed to the first side plate and the third side plate. The backplate 603 is located on the outgoing side of the board 602 and at least covers the -X side surface of the board. In one embodiment of the present invention, the +X side of the backplate includes an IO plate, which is electrically connected to the board.

[0050] To facilitate the insertion and removal of the circuit board, in one embodiment of the present invention, a guide plate 604 is also provided. There are two guide plates 604, both parallel to the first side plate 611 and the third side plate 613, with one end fixed to the back plate 603. Each guide plate 604 has several guide grooves, which correspond one-to-one with the slots on the first side plate 611 and the third side plate 613, respectively. The opposite sides of the circuit board 602 are respectively disposed within the guide grooves and slots. Similarly, in one embodiment of the present invention, the circuit board and the guide plate can be fixed using a wedge-shaped locking structure. In one embodiment of the present invention, the width of the guide plate 604 and its length along the Z-axis are not less than 250 mm. In one embodiment of the present invention, the guide plate 604 is designed as a thin-walled structure with reinforcing ribs and / or a hollow structure.

[0051] In one embodiment of the present invention, the connections between the plates, such as between two adjacent side plates, between the back plate and the integrated mechanical and thermal liner, between the guide plate and the integrated mechanical and thermal liner, and between the guide plate and the back plate, can be made using a stop or interlocking connection to enhance the connection strength and vibration resistance between the plates. In another embodiment of the present invention, each plate is designed with screws in at least two directions to connect to adjacent plates, so that the screws are staggered in space to avoid the screws being damaged by simply bearing shear force.

[0052] This invention also provides a satellite comprising the integrated electronic structure described above. The satellite may be, for example, a DRO-L satellite or other microsatellites weighing less than 200 kg. This integrated electronic structure promotes the mass production, modularization, and lightweighting of satellites.

[0053] Although various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limitations. It will be apparent to those skilled in the art that various combinations, modifications, and alterations can be made without departing from the spirit and scope of the invention. Therefore, the breadth and scope of the invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely by the appended claims and their equivalents.

Claims

1. A thermally integrated cabin panel for a satellite, characterized in that, It includes several slots configured to mount plates, wherein the plates are secured within the slots by a wedge locking mechanism.

2. The integrated mechanical and thermal compartment panel as described in claim 1, characterized in that, Its thickness is no more than 25mm and includes reinforcing ribs.

3. The integrated mechanical and thermal compartment panel as described in claim 1, characterized in that, It includes a hollow structure, which is disposed between two adjacent slots.

4. The integrated mechanical and thermal compartment panel as described in claim 1, characterized in that, Its material is MB15 magnesium alloy, and its first surface is white and its second surface is black, where the second surface refers to the side surface where the slot is provided.

5. A satellite integrated electronic architecture, characterized in that, The system includes an electronics compartment surrounded by four side panels, wherein the first side panel in the +Y direction and the third side panel in the -Y direction adopt the integrated mechanical and thermal compartment panel as described in any one of claims 1 to 4, and a plurality of boards are provided on the side of the integrated mechanical and thermal compartment panel facing the interior of the electronics compartment, and the connecting lines of the boards are led out from the -X direction, wherein the -X direction is parallel to the four side panels and points inward.

6. The satellite integrated electronic architecture as described in claim 5, characterized in that, The board includes: Starship board; Measurement and control board; Communication boards, including 6G core network boards; and The energy board connects to the lower-level machine via a CAN bus.

7. The satellite integrated electronic architecture as described in claim 5, characterized in that, Also includes: A backplate is vertically fixed to the integrated mechanical and thermal module and located on the outgoing side of the board. The backplate covers at least the -X side surface of the board on the integrated mechanical and thermal module. An I / O plate is provided on the +X side of the backplate, and the I / O plate is electrically connected to the board.

8. The satellite integrated electronic architecture as described in claim 7, characterized in that, Also includes: A guide plate is arranged parallel to the integrated mechanical and thermal compartment plate, and one end of the guide plate is fixed to the back plate. The guide plate is provided with a plurality of guide grooves, and the guide grooves are arranged one-to-one with the slots on the integrated mechanical and thermal compartment plate. The two opposite sides of the plate are respectively arranged in the guide grooves and slots.

9. The satellite integrated electronic architecture as described in claim 8, characterized in that, The guide plate has a thickness of no more than 25mm and includes reinforcing ribs and / or a hollow structure.

10. The satellite integrated electronic architecture as described in claim 8, characterized in that, The four side plates are connected to each other, the back plate to the integrated mechanical and thermal compartment, the guide plate to the integrated mechanical and thermal compartment, and the guide plate to the back plate by means of a stop or interlocking, and are fixed by screws in two directions.

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