Modular centralized computing unit configured as on-board computing unit for vehicle

Abstract

The present invention relates to a central computing unit (CCU) (105) configured for a vehicle (800), such as an on-board computing unit of an automobile, to centrally control different functions of the vehicle (800), the CCU (105) comprising: a housing structure (605); a plurality of electronic modules (115, 120, 125, 135) housed (600) by the housing structure (605), including a first module (115, 120, 125, 135) and at least one second module (115, 120, 125, 135), the modules individually or collectively defining at least one computing function of the CCU (105); and passive connection means (130) for indirectly connecting the first module (115, 120, 125, 135) with one or more of the second modules (115, 120, 125, 135) to provide one or more gain-free signal paths and / or gain-free power (PWR) connections between the first module (115, 120, 125, 135) and one or more of the second modules (115, 120, 125, 135); wherein each of the modules (115, 120, 125, 135) comprises at least one respective first connector (1110), and the connecting device (130) comprises, for each first connector (1110), a corresponding second connector (920, 925) mating therewith to connect the respective module (115, 120, 125, 135) via (1400) the mating first and second connectors (920, 925). 135) and the connecting device (130) are connected in a detachable power connection and / or a detachable signal connection.

Description

Technical Field

[0001] This invention relates to the field of vehicle electronics (such as, but not limited to, automotive electronics). Specifically, this invention relates to a central computing unit (CCU) configured for an in-vehicle computing system in a vehicle (such as an automobile) to centrally control various functions of the vehicle, and a vehicle comprising such a CCU. Background Technology

[0002] Modern vehicles (such as automobiles (e.g., passenger cars, buses, trucks, recreational vehicles, tractors, etc.)) typically include multiple different electronic components, particularly so-called electronic control units (ECUs). These ECUs are interconnected via one or more communication links or entire networks (such as, for example, well-known bus systems of the CAN or LIN type). Furthermore, Ethernet-based networks are becoming increasingly important in this context. It is important to note that while the abbreviation "ECU" is often used specifically to refer to the engine control unit in automotive technology, it is used in a broader sense here to refer to any electronic controller or control unit used in a vehicle, with the engine control unit being just one possible example.

[0003] Many ECUs are actually embedded systems, comprising hardware (such as a processing platform) and associated software running on that platform. Therefore, such ECUs form embedded systems, and when multiple ECUs are interconnected via a communication network, such a network can be called a distributed embedded system (network). While this “embedded” setup is particularly useful for providing the ability to perform real-time processing and for the optimal adaptation of a given ECU’s software to its corresponding processing platform, it is generally difficult to extend or scale such embedded systems or add new functionality.

[0004] The alternative approach is based on the idea that, instead of using dedicated software running on dedicated hardware to provide a specific function (i.e., the function of a specific ECU), a centralized computing architecture is used, where the desired different functions are provided by multiple different computer programs (especially applications) running on the same CCU, which thus shares computing resources. In particular, as mentioned above, this CCU-based approach offers greater flexibility than traditional decentralized approaches in terms of expanding, scaling, or reducing vehicle functionality.

[0005] Because many different computer programs share computing resources simultaneously, and considering the enormous computing power required for many computational tasks in modern vehicles, such CCUs typically use internal electrical signals in the RF frequency range (usually megahertz or even higher). Therefore, these signals are particularly susceptible to electromagnetic distortion and attenuation, which can adversely affect signal integrity. Summary of the Invention

[0006] The purpose of this invention is to further enhance the flexibility provided by the CCU while maintaining or improving its high operational reliability, particularly regarding the high signal integrity of the RF signals used in communications within the CCU.

[0007] The solution to this problem is provided by the teachings of the independent claims. Various preferred embodiments of this solution are provided by the teachings of the dependent claims.

[0008] The first aspect of this solution relates to a central computing unit (CCU) configured as an in-vehicle computing unit for a vehicle (such as an automobile) to centrally control various functions of the vehicle. The CCU includes: (i) Shell structure; (ii) A plurality of electronic modules at least partially housed by a housing structure, comprising a first module and at least one second module, these modules individually or collectively defining at least one computing function of the CCU (such as data or signal processing capability or data storage capability); and (iii) Passive connection devices (such as circuit boards that do not carry active components) for indirectly connecting a first module to one or more of a second module to provide one or more gainless signal paths and / or gainless power connections between the first module and one or more of the second modules. Such connections may be unidirectional (for transmitting signals and / or power from the first module to the second module, or vice versa) or bidirectional. The connection device may be housed in or attached to a housing structure, or form part of the housing. Specifically, it may be integrally formed with the housing, for example, as its backplate.

[0009] Each of the modules includes at least one corresponding first connector, and the connection device includes a corresponding second connector mating with each first connector to establish a detachable power connection and / or a detachable signal connection between the respective module and the connection device via the mating first and second connectors.

[0010] As used herein, the term “central computing unit” or its abbreviation “CCU” may specifically refer to a computing device configured for use in a vehicle (such as an automobile) as an onboard computing unit to centrally control various functions of the vehicle, wherein the computing device includes (i) a distributed computing system (DCS), (ii) a communication switch and (iii) a power supply system, each as defined below: A “distributed computing system” (DCS) comprises multiple co-located (e.g., within the same housing structure, such as a closed housing or an open housing, such as a rack), autonomous computing entities (CEs), each CE having its own single memory. These CEs are configured to communicate with each other via message passing through one or more communication networks (such as high-speed communication networks, e.g., PCI Express or Ethernet types) to coordinate the distribution of computing tasks to be performed by the DCS as a whole. Specifically, in the case of multiple communication networks, these networks can be coupled to enable message passing between sending CEs and receiving CEs via communication links involving two or more of the multiple networks. For example, a given message can be sent by a sending CE in PCI Express format to a gateway via one or more first communication paths in a PCI Express network, which then converts the message into Ethernet format and forwards the converted message to a receiving CE via one or more second communication paths in an Ethernet network.

[0011] The “communication switch” includes multiple independent (i.e., at least functionally independent) switching architectures, each of which is configured to variably connect a subgroup of CEs of the DCS or each CE to one or more of a plurality of interfaces to exchange information via them with external communication nodes of the vehicle’s CCU (such as network endpoints, e.g., actuators or sensors, or intermediate network nodes, e.g., hubs for connecting multiple other network nodes).

[0012] The “power supply system” includes multiple power supply subsystems for simultaneous operation, each of which is capable of individually and independently powering at least two (preferably all) of the DCS and switching architectures. In this document, “power supply” specifically refers to delivering power (or electricity, i.e., power) to an entity to be powered, and may optionally further include first generating power and / or converting it to a suitable power type or level, for example, through DC / DC, AC / DC, or DC / AC conversion, or conversion of the time-dependent nature of the power signal (signal shaping).

[0013] As used herein, the term "computing entity" (CE) (and its variants) refers to an autonomous computing unit capable of performing computational tasks independently and including at least one of its own processor and at least one of its own associated memory. In particular, each CE may be implemented separately from all other CEs. For example, it may be implemented in one or more circuits, such as in an integrated circuit (e.g., as a system-on-a-chip (SOC), system-in-package (SIP), multi-chip module (MCM), or chiplet) or in a chipset.

[0014] As used herein, the term "distributed computing system" (DCS) (and its variants) specifically refers to a computing system comprising multiple networked computing entities that communicate and coordinate their actions by passing messages to each other, enabling these computing entities to interact with each other to achieve a common goal. In particular, groups of individual CEs of the DCS can be configured to perform parallel task processing, such that the CEs in the group simultaneously execute a set of similar or different computing tasks. For example, each CE can individually execute a true subgroup of a set of computing tasks to be executed by the DCS as a whole, wherein the computing tasks executed by different CEs can be different.

[0015] As used in this article, the term “switching architecture” (and its variants) specifically refers to hardware used to variably connect multiple different nodes (such as nodes in a computer network) of a network to exchange data between them.

[0016] As used herein, the term "communication switch" (and variations thereof) includes at least two switching architectures and is configured to use these switching architectures alternately or simultaneously to variably connect multiple different nodes of a network (such as nodes of a computer network) to exchange data between them. A communication switch may specifically include, but is not limited to, one or more PCI Express (PCIe) switches and / or Compute Fast Link (CXL) as switching architectures.

[0017] As used herein, the term “switching” (and its variations) (included in the terms “switching architecture” and “communication switch”) generally refers to the variable connection of different nodes in a network to exchange data between them, and is not limited to any particular connection technology, such as circuit switching or packet switching, or any particular communication technology or protocol, such as Ethernet, PCIe, etc., unless otherwise expressly indicated herein in the given context.

[0018] Each switching architecture, communication switch, or CE may be arranged individually or together with one or more other components in the CCU as part of a related module (e.g., inside or on). Thus, by removing the related module from the CCU and optionally replacing it with another module that can be attached to the CCU as a replacement for the removed module, one or more of the functions provided by these components can be removed and replaced.

[0019] As used herein, the term "electronic module" specifically refers to a unit (such as a sub-component) that has one or more electronic components and is configured as a module of the CCU. Based on its one or more electronic components, it may define at least one computing function, either alone or together with one or more other electronic modules in the CCU. This computing function may specifically include the CCU's data or signal processing capabilities or data storage capabilities. The module is specifically removable (e.g., detachable) from the CCU as a unit.

[0020] As used herein, the term "passive connection device" specifically refers to a connection device, such as a circuit board (e.g., a printed circuit board (PCB)), that contains only passive components, i.e., components that cannot achieve power gain. For example, and not limitingly, connectors, electrical or optical traces, optical signal splitters and / or combiners are typically passive components, while transistors or integrated circuits (e.g., CPUs or system-on-a-chip (SoCs)) are typically active devices. Passive connection devices may specifically include a plurality of second connectors, specifically for exchanging signals that transmit information, such as electrical or optical signals modulated based on the information to be transmitted.

[0021] As used herein, the term “indirect connection” specifically refers to a connection, such as a signal and / or power connection between two or more different components of a CCU, for example between different modules of a CCU or between a fixed part of a CCU and one or more removable modules, wherein the connection is provided via a passive connection device in such a way that each of the components to be connected has a corresponding signal and / or power connection therebetween to the connection device, and the connection device provides signal and / or power connections between the components to which it is connected, such that the signal or power path for transmitting the signals or power to be exchanged between the components runs at least partially via the connection device.

[0022] As used herein, the term "detachable" specifically refers to the ability to separate the remaining parts of the CCU without force or damage (i.e., non-destructively). Specifically, when two components are connected to each other via a detachable connection, this connection, and therefore the components thereafter, can be separated in a non-destructive manner and without force. This connection can, for example, be releasable without the use of tools, such as by purely manual operation. Alternatively, it can be a threaded connection, etc., which can be released non-destructively using a suitable tool (such as a screwdriver). Specifically, the detachable connection can be achieved through plug-in, push-in, or latching electrical connectors.

[0023] In the specification and claims, terms such as "first," "second," and "third" are used to distinguish similar elements and are not necessarily used to describe a sequence or chronological order. It should be understood that such terms are interchangeable where appropriate, and embodiments of the solution described herein can operate in other sequences besides those described or illustrated herein.

[0024] Unless otherwise required by the context, when the terms “comprising” or “including” or variations thereof, such as “comprising” or “including” or “including”, are used in this specification and claims, they do not exclude other elements or steps and should be interpreted in an open, inclusive sense, that is, as “including but not limited to”.

[0025] When an indefinite or definite article is used to refer to a singular noun, such as “one” or “a kind” or “the,” this includes the plural form of the noun, unless otherwise explicitly stated.

[0026] The phrases “in some embodiments,” “in one embodiment,” or “in an embodiment,” if any, appearing in the specification do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0027] Furthermore, unless explicitly stated otherwise, "or" refers to inclusive or, not exclusive or. For example, condition A or B is satisfied by any of the following: A is true (or exists) and B is false (or does not exist), A is false (or does not exist) and B is true (or exists), and both A and B are true (or exist).

[0028] The use of the terms "configuration" or "arrangement" to perform a specific function (and its corresponding variations), as they may be used herein, should be understood to mean that the relevant device or component is already in a configuration or setting capable of performing that function, or is at least adjustable—i.e., configurable—so that it can perform that function after appropriate adjustments. In this context, configuration can be performed, for example, by setting corresponding parameters of process sequences or hardware (HW) or software (SW) or combined HW / SW switches, to activate or deactivate the function or setting. In particular, the device may have multiple predetermined configurations or operating modes, such that configuration can be performed by selecting one of these configurations or operating modes.

[0029] According to the first aspect, the CCU can provide several advantageous technical effects, particularly including one or more of the following: (i) Easy scalability of computing power (more computing modules containing one or more CEs can be added, or modules can be removed or replaced by other modules, and computing tasks can be optimally distributed among available modules with computing power).

[0030] (ii) High efficiency in performing a variety of different types of computational tasks. For example, one or more modules (or CEs within them) can be specifically adapted to perform certain specific tasks, such as machine learning, image rendering, real-time processing, general-purpose computing, etc., all with options for sequential and parallel processing, so that computational tasks can be selectively executed by multiple appropriately adapted specialized modules / CEs within the CCU. Furthermore, the total amount of computational power allocated by the CCU to a particular computational task can be variably adapted "in operation"; (iii) High flexibility in performing a variety of different and even varying types of computational tasks. In the conventional automotive ECU “world,” each ECU is typically designed to fulfill a small and limited number of specific, fixed, and dedicated functions, implemented by the underlying ECU hardware and proprietary software typically written specifically for that hardware. Both hardware and software are intended to remain virtually unchanged until the vehicle reaches the end of its lifespan—potentially with the exception of minor software updates related to bug fixes or minimal functional expansions. This solution overcomes these limitations and not only allows for the flexible allocation of computational tasks among module / CE groups but also enables the expansion or modification of the computational tasks and thus the functions that the CCU can support. In particular, the software defining such functionality can be easily updated or upgraded (e.g., “over-the-air”, OTA) to allow for such expansion or modification, and even new software can be easily added. Such software-level changes can be performed very frequently, even when needed. Furthermore, by adding, replacing, or removing individual modules, even the underlying computational hardware can be easily adapted to support the changed or new functional groups to be supported.

[0031] (iv) High performance and power efficiency: Due to co-location, the communication links between modules / CEs can be kept short, enabling high-speed communication between them with minimal power loss and high signal quality. Therefore, high performance, power efficiency, and reliability of the CCU as a whole can be achieved.

[0032] (v) High reliability, due to the high degree of flexibility and redundancy in both the allocation of computing tasks to selected modules / CEs and redundant power supplies. Furthermore, the absence of active components (which are typically more prone to failure than passive connections or components alone) enables long lifespan and high reliability of the connected devices.

[0033] (vi) Passive connection devices are particularly well-suited for transmitting RF signals with virtually no or low distortion. In particular, since there are no active components, there is no need to provide active cooling for the connection device to maintain low temperature-dependent distortion, even at high frequencies, and to keep the connection device within its specific operating temperature range.

[0034] Preferred embodiments of the CCU are described below, and these embodiments may be combined with each other in any way unless explicitly excluded or technically impossible.

[0035] In some embodiments, for at least one module, at least one of its first connector and second connector is a press-fit connector type, the connector having one or more pins for establishing the power connection and / or signal connection, and for correspondingly mechanically mounting the at least one connector to a first circuit board of the module or a second circuit board of the connection device, such circuit board including the connector.

[0036] As used herein, the term "press-fit connector (type)" specifically refers to a particular connector type used to establish a press-fit connection. The principle of a press-fit connection is to press the contact terminals (pins) of the connector into a circuit board (or other connection device), such as a printed circuit board (PCB), thereby establishing a mechanical and / or electrical connection between the connector and the circuit board. This circuit board may particularly have narrow holes (e.g., through-holes) with a lateral dimension smaller than the diameter of the press-fit pins, thus achieving a robust mechanical connection. There are two types of press-fit pins: "solid pins" with a solid press-fit area and "flexible pins" with a resilient press-fit area. Press-fit connectors can be particularly used to achieve solderless terminal board connections. In this context, such terminals may specifically be pins of the first or second connector as defined above. Specifically, one or more (e.g., all) of the first and second connectors may be press-fit connectors of the type with one or more flexible pins.

[0037] The press-fit connection of leads relies on the diameter of the press-fit area of ​​the lead being larger than the lateral dimension of the hole in the circuit board into which the lead is introduced under pressure during mounting. This connection offers several advantages, including: (i) the depth to which the press-fit lead is inserted into the circuit board can be kept relatively small, and correspondingly, the parasitic capacitance and / or inductance caused by the (typically spatially narrow) arrangement of multiple leads can be kept at a low level, thereby supporting high signal integrity of the RF signals transmitted by the leads; (ii) high robustness to thermomechanical stresses (e.g., stresses caused by the difference in the coefficients of thermal expansion of different materials in mechanical contact with each other), because press-fit leads, and even flexible press-fit leads, typically exhibit sufficiently high mechanical elasticity. Furthermore, when the lead is pushed into the hole in the circuit board at a high mounting speed, the surface of the lead and the metallization layer in the hole can reach temperatures sufficient to locally soften the surface due to friction, thereby forming a robust connection (“quasi-soldering”) similar to a solder joint, thus further enhancing mechanical robustness.

[0038] In some embodiments, at least one of the first connectors is a press-fit connector type, and further includes iii) at least one additional pin specifically configured solely for mechanically reinforcing the press-fit connection between the first connector and the first circuit board of the first module to which it belongs. Thus, one or more additional pins are used to directly (at least partially) transmit mechanical force between the first connector and the first circuit board of the first module in such a way that mechanical stress is reduced or even completely avoided on one or more (preferably all) of the press-fit connections involving signal or power transmission pins. This may specifically involve (primarily or even only) forces strong enough to cause instantaneous damage or abnormally accelerated wear. In this context, the term "specifically" means that the pin is not configured to transmit signals or power between the first connector and the first circuit board of the first module. Accordingly, it may be made specifically of a non-electrically conductive material, such as a non-electrically conductive polymer.

[0039] The term "electrical conductivity" and its variations should be understood as a physical quantity indicating the intensity of a material's ability to conduct electric current. Therefore, as used herein, the relevant term "electrically conductive" refers to an electrical conductivity (at 25°C) of at least 10. 6 S / m (i.e., at least equal to the conductivity of a metal), while, as used herein, the relevant term "non-electrically conductive" refers to an electrical conductivity (at 25°C) of less than 10. 6 S / m.

[0040] In some embodiments, the connection device includes the second circuit board, and iv) at least one of the second connectors is a press-fit connector type, and further includes at least one additional pin for mechanically reinforcing the press-fit connection between the second connector and the second circuit board of the connection device.

[0041] In both of the above-mentioned solutions (which can be used in combination), the mechanical connection between the corresponding connector and the relevant circuit board can be further strengthened, which can result in greater robustness and lifespan. This is particularly useful considering the challenging use of the CCU as an on-board unit in a vehicle, where high mechanical stresses on such connections are expected due to vehicle motion and related accelerations (e.g., caused by vibration, shock, vehicle acceleration and deceleration).

[0042] The electrical conductivity of the (multiple) additional pins may be particularly lower than that of the press-fit pins of the same connector that transmit signals or power. Specifically, they may be made of electrically insulating (i.e., non-conductive) materials. This material selection is particularly useful for avoiding adverse effects on signal integrity (especially RF signals) transmitted by other pins. Specifically, at least one of the additional pins of the first or second connector may each comprise or be composed of a polymer material. This material may be, in particular, the same as or belong to the same material class as that constituting the housing structure.

[0043] In some embodiments, at least one first connector further includes a first additional mechanical coupling element for further enhancing the mechanical coupling between the first connector and a first circuit board of the module; and / or at least one second connector further includes a second additional mechanical coupling element for further enhancing the mechanical coupling between the second connector and a second circuit board of the connection device. Specifically, in at least some of these embodiments, at least one of the first and second additional coupling elements includes one or more of the following: a frame structure, screws, or other fastening devices. This helps to further strengthen the mechanical connection between the respective connector and the associated circuit board, and thus can particularly further improve the robustness and lifespan of the connection, and therefore the associated module and / or connection device as a whole.

[0044] In some embodiments, one or more of the circuit board of the module (particularly the first circuit board), the substrate material of the circuit board of the connecting device, the first connector, and the second connector comprise a material having one or more of the following properties: (i) a relative static dielectric constant R at a frequency of 10 GHz. r , of which r ≤3.5; (ii) Load loss factor LLF at 10 GHz, wherein LLF ≤0.005, preferably LLF ≤0.0035; (iii) Hydrophobicity. Specifically, for the first connector and / or the second connector, one or more of these characteristics may particularly relate to the housing material of the respective connector(s). Exemplary suitable materials having one or more of these characteristics are available from AGC-Nelco under the trade name “N4000-13 SI” (www.AGC-Nelco.com). All of the above characteristics (individually or in combination) are suitable for supporting or even improving high signal integrity of RF signals. Thus, like all the specific measures having similar effects in the embodiments described herein, each of these measures can help extend the suitable RF frequency range in which the CCU (particularly including its passive connection devices and connectors) can operate effectively.

[0045] In some embodiments, a corresponding first circuit board of at least one first module includes a layered structure comprising a plurality of stacked layers containing at least one electrically conductive shielding layer. On one hand, the shielding layer may shield the module (at least partially) from potential interfering electric fields and / or electromagnetic radiation. On the other hand, it may further support thermal conduction (the electrical conductivity and thermal conductivity of electrically conductive materials (such as metals) are closely related, even approximately proportional, according to the empirical Wiedemann-Franz law). This helps to reduce local thermal gradients and lower thermo-mechanical stresses within the circuit board and, particularly, between the circuit board and the connector mounted thereto. This is especially important for press-fit connectors and for maintaining their high reliability even under harsh conditions (particularly mechanical and / or thermal).

[0046] In some embodiments, the multiple layers comprise: (i) a layer including one or more electrically conductive traces for transmitting electrical signals, each trace being electrically connected to a corresponding first connector of a respective first module; and (ii) two electrically conductive shielding layers, which may be specifically grounded. Within the layered structure, the layer including one or more electrically conductive traces is arranged between two shielding layers. In this way, a high degree of electrical and electromagnetic shielding is achieved, which further supports the achievement of high signal integrity, particularly within the respective first circuit board.

[0047] In some embodiments, at least one of the shielding layers is configured to be electrically connected to a voltage source of the CCU, the voltage source being configured to automatically adjust the potential of the shielding layer (e.g., ground potential or other constant potential) according to a determined amount characterizing interlayer energy loss within the layered structure during CCU operation. An example of such an amount is the insertion loss budget of the PCI Express (PCIe) specification (for PCIe 4, e.g., PCIe 4.0 at a rate of 16 GT / s = 28 dB). In this way, the shielding effect is kept substantially constant, and thus the adverse effects on signal integrity that may result from varying or excessively high interlayer energy loss can be mitigated or even avoided.

[0048] In some embodiments, the plurality of layers include a heat distribution layer for distributing heat across at least a portion of the first circuit board of a respective first module, the heat distribution layer comprising a thermal conductivity k, where k ≥ 50 W / (m·K). Specifically, the heat distribution layer may be thermally coupled to the housing structure of the CCU, which can therefore act as a heat sink. Thus, the heat distribution layer (further) supports the reduction or limitation of local thermal gradients and associated thermo-mechanical stresses.

[0049] In some embodiments, the heat distribution layer is electrically connected to the electrical ground of the CCU and coincides with one of one or more electrically conductive shielding layers, thus reducing the complexity of the layered circuit board and optionally also reducing its thickness. Alternatively, in some other embodiments, the heat distribution layer is attached to one or more of the electrically conductive shielding layers.

[0050] In some embodiments, the layered structure includes one or more vias for electrically connecting different electrically conductive layers within the layered structure. The via extends through the conductive layers of the layered structure without establishing an electrical connection with them. Anti-pads are defined within the conductive layers to provide electrical isolation between the vias and the conductive layers. In this way, the effective capacitance of the vias is kept small, and thus the adverse effects of the vias on signal integrity are mitigated.

[0051] In some embodiments, at least two adjacent traces for transmitting RF signals on a respective first circuit board of at least one first module are arranged such that, at a frequency of 10 GHz, the load loss factor (LLF) of at least one of the adjacent traces satisfies the condition: LLF ≤ 0.005, preferably LLF ≤ 0.0035. This is another measure to support high RF signal integrity, which can therefore help extend the suitable RF frequency range in which the CCU (particularly including its passive connection devices and connectors) can operate effectively.

[0052] In some embodiments, at least one of the first connectors and each of its corresponding mating second connectors are multi-signal connectors, comprising a plurality of electrically isolated conductors for establishing a plurality of individual electrical signal connections between the respective first connector and its corresponding mating second connector when the corresponding connectors are interconnected. In each of the at least one first connector and its corresponding mating second connector, the geometric arrangement of the conductors is designed such that all pairs of conductors for simultaneously transmitting RF signals to and / or from corresponding traces running adjacent to each other are arranged, at least within one or more segments on the respective first or second circuit board, such that (i) their minimum distance from each other is at least nine times the smaller of their respective widths at the location of their minimum distance from each other; and / or (ii) they have shielding pins, such as ground pins or pins maintained at a defined (other) constant voltage, disposed therebetween. In this way, sufficient RF isolation between adjacent RF signal paths is ensured, which in turn supports high RF signal integrity.

[0053] In some embodiments, the CCU further includes a power supply module for powering one or more of a plurality of electronic modules. The connection device includes one or more power traces for delivering power supplied by the power supply to the one or more modules for powering them. Therefore, the connection device can function as a distribution device for signals and power.

[0054] Specifically, in some embodiments, the power supply module is detachably connected to the connection device to establish a releasable power connection between the power supply module and the connection device. This allows the power supply module to be removed and replaced without removing or replacing the connection device. This is particularly useful in scenarios requiring repair or replacement of a defective power supply module or when replacing a power supply module with an updated version or other type of power supply module.

[0055] In some embodiments, two or more of the electronic modules are replaceable modules, each a hardware entity of the CCU, and can be individually inserted into and removed from the housing structure. This supports the advantage that the CCU is not only “centralized” from an abstract computational perspective, but also physically “centralized.” This contrasts with the classical approach of today, where a large number of different controllers (ECUs) are physically distributed throughout the vehicle, each ECU dedicated to performing selected computational tasks relevant only to specific functions of the vehicle. The co-location approach according to these embodiments is particularly useful for the original installation, maintenance, repair, updating, and upgrading of the CCU, as it allows for the spatially integrated and modular provision and access to the CCU’s subsystems, particularly modules. For example, if more computational power than initially available is required to enable further computationally intensive functions recently acquired by the vehicle owner (i.e., after vehicle delivery), one or more related computing modules can be easily replaced by more powerful modules (e.g., modules with more or more advanced CEs). Similarly, due to the centralized and modular approach, malfunctioning modules can be easily replaced. Furthermore, providing a shared housing structure helps reduce weight, minimize connector variations, and enable central software updates (rather than localized updates for each ECU). Additionally, the entire vehicle manufacturing process can be simplified by integrating a pre-configured modular CCU instead of several ECUs located in different parts of the vehicle.

[0056] In some embodiments, the housing structure includes a rack with two or more compartments, each compartment accommodating a corresponding module from the modules. For example, in the case of N=4, i.e., if there are a total of six modules (main module, service module, and N=4 expansion modules), the compartments of the rack can be arranged in two rows and three columns (or vice versa).

[0057] In some embodiments, at least one of the modules has a first circuit board that is mechanically secured to the module housing only at or near a single edge, while allowing for variation in the distance between all other edges and the module housing. Therefore, even if the dimensions of the first circuit board and / or the module housing change over time (e.g., when the circuit board expands with increasing temperature), the first circuit board will not become stuck within the module housing. In this way, widespread mechanical stress and potential bending or damage to the circuit board are avoided.

[0058] Furthermore, specific high-reliability construction measures for the board connector structure and its attachment to the circuit board and module housing allow for a "quasi-suspended" unilateral fixation of the module circuit board within the module housing, preventing the generation of critical mechanical stress gradients while additionally establishing high thermomechanical and mechanical robustness. The solution proposed in this invention is particularly suitable for so-called fail-safe operating systems.

[0059] In some embodiments, the CCU is configured to control at least two, preferably at least three or all, of the following vehicle functions, at least partially, based on one or more software processes running on the CCU: instrument panel, air conditioning, vehicle lighting, windshield wipers or other windshield cleaning functions, vehicle interior lighting, in-vehicle infotainment system, vehicle doors(s), powertrain, navigation, driver assistance, autonomous driving, cabin monitoring, and battery control. In this way, multiple different functions of the vehicle can be controlled by a single central computing unit (CCU) based on a set of computer programs that define and implement a single function.

[0060] In some embodiments, the CCU includes (as discussed in detail above): (i) A distributed computing system (DCS) comprising multiple co-located, autonomous computing entities (CEs), each CE having its own independent memory, wherein each CE has its own single memory, wherein these CEs are all located in a corresponding one of electronic modules and are configured to communicate with each other via message passing through one or more communication networks including connection devices to coordinate the allocation of computing tasks to be performed by the DCS as a whole among them. (ii) A communication switch comprising multiple independent switching architectures, each configured to variably connect a subgroup of CEs of the DCS or each CE to one or more interfaces for exchanging information with external communication nodes of the vehicle's CCU via such interfaces; and (iii) A power supply system comprising a plurality of power supply subsystems for simultaneous operation, each of which is capable of individually and independently powering the DCS and at least two switching architectures in the switching architecture.

[0061] In addition, at least one of the CE, switching architecture and power supply subsystem is arranged as a functional unit of the CCU, either alone or together with other functional units of the CCU, in one of the first or second modules.

[0062] Such embodiments may particularly include or conform to one or more of the CCUs (or specific embodiments thereof) described in PCT / EP2023 / 055182, PCT / EP2023 / 070994, PCT / EP2023 / 059070 and PCT / EP2023 / 058992, the contents of which are incorporated herein by reference in their entirety.

[0063] The second aspect of this solution relates to a vehicle (such as an automobile) that includes the CCU of the first aspect for centralized control of various functions of the vehicle. The features and advantages described with respect to the first aspect of this solution apply accordingly to the vehicle of the second aspect. Attached Figure Description

[0064] Further advantages, features, and applications of this solution are provided in the following detailed description and accompanying drawings, wherein: Figure 1 An embodiment of this solution illustrates a first block diagram, which illustrates selected functional building blocks of an exemplary CCU and related high-level communication structures for communicating within the CCU and with external nodes of the CCU. Figure 2 A more detailed illustration is provided. Figure 1 Some functional building blocks of the CCU; Figure 3 A first view of the second block diagram, illustrated according to an embodiment of this solution, shows... Figure 1 More details on the functional building blocks of the CCU, with a focus on the redundancy settings of power supply and power supply coordination, control coordination and computation coordination within the CCU; Figure 4 The diagram shows Figure 3 The second view of the second block diagram, but now the focus is on anomaly detection in the power supply domain; Figure 5 The diagram illustrates the redundancy concept of multiple instances with each primary CE and / or each associated switching architecture; Figure 6 The illustration shows an exemplary conventional strict hierarchical communication scheme based on the standardized PCI Express (PCIe) communication technology for communication between different nodes in a PCIe network. Figure 7 An exemplary PCIe communication scheme adapted according to an embodiment of this solution is illustrated. Figure 8The diagram illustrates the process of... Figure 7 Three exemplary communication paths implemented using the adapted PCIe communication scheme; Figure 9 A third block diagram is illustrated according to an embodiment of this solution, which shows more details of an exemplary CCU, particularly its communication switch with service modules; Figure 10 An exemplary CCU (e.g., according to an embodiment of this solution) is illustrated. Figure 1 An exemplary housing concept for a CCU; Figure 11 The illustration schematically depicts a computing platform with a vehicle or a CCU for a vehicle. Figure 12 The illustration schematically shows the following: Figure 1 The computing platform for vehicles (especially automobiles); and various suitable locations for placing the CCU within the vehicle; Figure 13 An exemplary embodiment of the housing of the CCU is schematically illustrated, which includes its back panel configured as a passive connection device for interconnecting various electronic modules. Figure 14 The key differences between the conventional architecture of electronic hardware modules (such as graphics cards, power source cards, memory cards, etc.) used for interconnection in a computer and the basic architecture of the CCU according to this solution are illustrated in an abstract manner. Figure 15 A detailed view of the press-fit connection between the first connector of the module and the (first) circuit board is illustrated according to an exemplary embodiment; Figure 16 An exemplary pin arrangement is illustrated, according to which pin groups can be arranged in a multi-pin connector to mitigate adverse effects on RF signal integrity; Figure 17 An exemplary layered structure of a circuit board (such as a first circuit board) is illustrated, wherein a connector is attached to the circuit board via a press-fit connection of its pins to the circuit board. Figure 18 Details of the first circuit board (i.e., the circuit board of the module) are illustrated according to an exemplary embodiment; Figure 19 The diagram illustrates the relationship between... Figure 18 The diagram shows two equivalent circuits related to the arrangement. Figure 20 The diagram illustrates an overview of selected components of the connecting device module and the second connector, which play a role in the transmission of mechanical forces; and Figures 21 to 23 The illustration shows three different variations of the force between the first connector of the minimized module and the first circuit board.

[0065] In the accompanying drawings, in many instances, the same reference numerals are used for the same or corresponding elements of the computing platform described herein. For clarity, the following detailed description is structured into sections introduced by headings in each case. However, these headings should not be construed as limiting the content of the corresponding sections or any of the drawings described therein. Detailed Implementation

[0066] Central Computing Unit (CCU) Figure 1 and Figure 2 A (first) block diagram 100 is shown, illustrating an exemplary computing platform 700 having a central computing unit (CCU) 105 (see [link]). Figure 11 The selected functional building blocks and related high-level communication structures for communicating within the CCU 105 and with external communication nodes of the CCU.

[0067] CCU 105 includes (i) a computer module cluster 110 having a main computing module 115, one or more general-purpose computing modules 120 and one or more special-purpose modules 125, (ii) a service module 135, and (iii) a connection device 130, such as a backplane (which may be particularly a passive backplane), for interconnecting these modules with each other and with the service module 135.

[0068] The interconnection provided by the connection device 130 may specifically include a power connection for exchanging power (such as electrical power P), a data connection for exchanging data D (e.g., Ethernet, PCI, or PCIe), and a control connection for exchanging control information C (e.g., I...). 2 C) An alarm connection for exchanging alarm information A, and a power management connection for exchanging power management information I.

[0069] exist Figure 1 In the example, the external communication nodes of the CCU include a first endpoint cluster 140, which (e.g., via fiber optic communication link O) is optically connected to the CCU 105, and a second endpoint cluster 145, which is connected to the CCU 105 via a wireless communication link W (e.g., Bluetooth, WLAN, ZigBee, or a cellular mobile connection link). A third endpoint cluster 150 (which may specifically be or include methods for interconnecting the CCU 105 to other endpoints 330, 430 (see...) Figures 6 to 9 The area hub can be connected via cable. The fourth endpoint cluster 155 can be connected to the CCU 105 via a separate intermediate wireless transceiver 160.

[0070] Furthermore, two or more endpoints in a cluster can be directly linked to each other via a communication link that does not involve CCU 105, as illustrated by the wireless communication link W between the third endpoint cluster 150 and the fourth endpoint cluster 155. Each endpoint in the 330 is a node within a communication network formed by communication links that directly or indirectly connect the endpoints 330, 430 to CCU 105 or to each other. In particular, endpoints 330, 430 can be or include one or more actuators 715, sensors 720, and intermediate network nodes, such as hubs for connecting multiple other endpoints 330, 430.

[0071] As used herein, the term "endpoint cluster" refers to a group of endpoints 330, 430 that are directly or indirectly connected to the same network node via corresponding communication links, so that they can all exchange information with that common node. Typically, this common node will have some kind of hub function, that is, act as an intermediary node in the communication links between other nodes connected to it.

[0072] CCU 105 further includes (in Figure 1 and Figure 2 (Not shown in the image) Communication switches and power supply systems. These building blocks of the CCU 105 will be referenced below. Figures 2 to 5 Further discussion.

[0073] Now for reference Figure 2 It illustrates in more detail Figure 2 The computing module cluster 110 comprises a main computing module 115, a general-purpose computing module 120, and a special-purpose computing module 125. First, let's consider the main computing module 115, which, within the same module and therefore in a co-location, includes at least a first computing entity (CE) 115a, a separate second computing entity 115b, and optionally one or more other CEs 115c. All these CEs are autonomous and independent of each other, in the sense that they all have comparable, ideally identical computing capabilities and their respective individual memories, such that each of these CEs can be used as a corresponding replacement for another of these CEs.

[0074] In further discussion, for simplicity and without limitation, an exemplary case is considered in which no other CE115c exists in the main computing module 115 besides the first CE 115a and the second CE 115b. Each of the first CE 115a and the second CE 115b can be implemented in a corresponding separate hardware unit, such as a semiconductor chip, for example, a system-on-a-chip (SOC).

[0075] The first CE 115a and the second CE 115b (e.g., via corresponding software (multiple computer programs)) are configured to operate redundantly in such a way that they synchronously execute the same computational tasks so that the CCU 105 can function properly as long as at least one of the CEs 115a and 115b is functioning correctly. Therefore, there is redundancy between the first CE 115a and the second CE 115b not only in terms of redundant hardware but also in terms of the computational tasks they synchronously execute, so that if one of the first CE 115a and the second CE 115b fails (with or without warning), the other corresponding CE can immediately intervene and thus maintain the computational function of the main computing module 115 based on the synchronous execution of the same computational task it is already performing.

[0076] Now, before continuing to explain the remaining building blocks of the main computing module 115, refer to the general-purpose computing module 120. It includes at least one autonomous CE 120a and optionally one or more additional CEs 120b. Each of the autonomous CE 120a and the additional CEs 120b is designed as a general-purpose computing entity, that is, a computing entity designed to perform all kinds of different computing tasks rather than being limited to performing one or more specific types of computing tasks (such as graphics or audio processing or running artificial neural networks or other artificial intelligence algorithms). Each of the autonomous CE 120a and the additional CEs 120b has its own memory and is capable of autonomously executing the computing tasks assigned to it, independent of the other CEs.

[0077] In addition, each general-purpose computing module 120 includes a corresponding individual fault management system (FMS) 120c, which is configured to detect malfunctions occurring within or at least involving the general-purpose computing module 120, such as hardware- and / or software-based errors or defects. The FMS 120c is further configured to communicate any such detected malfunctions to the main computing module 115 via a connection device 130 through alarm information A.

[0078] Turning now to the multiple special-purpose modules 125, in contrast to the multiple general-purpose computing modules 120, the special-purpose modules 125 are specifically designed to perform one or more selected tasks, such as computational or communication tasks, and are generally less suited to or even unable to perform general-purpose computing tasks like the main computing module 115 and the general-purpose computing module 120. For example, one or more of the multiple special-purpose modules 125 may be or include a graphics processing unit (GPU), a module specifically designed to run one or more artificial intelligence algorithms, a neural processing unit (NPU), an in-memory computing unit (IMCU), or a local hub module. Thus, the special-purpose module 125 may specifically include one or more such special CEs 125a and / or one or more communication interfaces 125b for establishing communication links, such as links to endpoints 330, 430, or endpoint cluster 515. Each special CE 125a has its own memory and is capable of autonomously performing the computational tasks assigned to it, independent of other CEs.

[0079] Furthermore, each of the multiple special-purpose modules 125 also includes a corresponding special single fault management system (SFMS) 125c, which is configured to detect malfunctions occurring within or at least involving the corresponding special-purpose module 125, such as hardware- and / or software-based errors or defects. Each SFMS 125c is further configured to communicate any such detected malfunction to the main computing module 115 via alarm information A through connection device 130.

[0080] While the computing module cluster 110 may therefore include one or more general-purpose computing modules 120 and / or one or more special-purpose modules 125, and / or even other modules, in a simplified form it can be implemented without such additional modules, such that only the main module 115 is retained as the computing module. In particular, the computing module cluster 110 or any one or more of its computing modules can be implemented based on a set of interconnected chiplets as its components.

[0081] Returning to the main computing module 115, among all modules, this module—among other roles—is responsible for allocating tasks (including, in particular, computing tasks) to the various modules of the computing module cluster 110. This allocation process thus provides resource coordination functionality 115d for the computing module cluster 110. The first CE 115a and the second CE 115b can therefore be designated as the "master CE," while the other CEs within the general module 120 and the multiple special-purpose modules 125 are at the receiving end of this task allocation process and can therefore be designated as "slave CEs" because they are to execute the tasks assigned to them by the master CEs.

[0082] Task assignments defined by (multiple) master CEs are communicated to slave CEs via message passing through connection device 130, thereby communicating, for example, corresponding control information C and / or data D.

[0083] Specifically, the resource coordination function 115d may include a process in which the main computing module 115 receives periodic reports of the main software operations (including parallel and sequential operations) of all CCU 105 processes (running on the CE group), and the current priority master CE allocates tasks among and to each CE based on these reports (while another master CE synchronously runs the same process, although its associated task allocation will be discarded). Alternatively or additionally, the allocation may depend on the amount of available energy currently available to power the CCU 105.

[0084] While such allocation could even include assigning computational tasks to the primary CE itself, this allocation would treat both primary CEs similarly so that both would execute the self-allocated tasks synchronously, thereby maintaining full redundancy in the operation of both primary CEs.

[0085] In summary, the CE groups for each module (see reference below) Figure 9 and Figure 10 An exemplary embodiment of CCU 105 will be explained in more detail (these modules are co-located) thus forming a distributed computing system (DCS), wherein computing tasks to be executed by the DCS as a whole can be variably assigned to different CEs within the computing module cluster 110, and wherein such assignment is communicated by passing messages between the involved CEs.

[0086] The main computing module 115 further includes a central fault management system (CFMS) 115f, which is configured to receive fault-related anomalies detected within the DCS via alarm information A provided by one or more of the FMS 120c of other modules or even from alarm information A provided by its own single FMS (iFMS) 115g. The CFMS 115f is configured to classify and categorize such alarm information A and initiate countermeasures, such as reassigning computing tasks from the faulty CE or module to another module, or prioritizing tasks when remaining computing power is insufficient, so as to support more important tasks at the expense of less important tasks.

[0087] The main computing module 115 further includes a safety management system (SMS) 115e, which is configured to make decisions on necessary safety measures (i.e., safety status escalation, including real-time scheduling) and activate these necessary safety measures when needed to enable the CCU 105 and / or its assisted controlled vehicle 800 (see [link to documentation]). Figure 12The system enters a safe state. Therefore, the safety management system 115e can rely specifically on alarm information A, which can be obtained from CFMS 115f, as input. CFMS integrates alarm information received from individual FMS 120c and iFMS 115g of each module of CCU 105.

[0088] For example, if alarm message A (or some other information available to SMS 115e) indicates a power shortage in the power supply system of CCU 105, SMS 115e may decide to use all remaining power to guide vehicle 800 to the roadside while shutting off power to all non-essential systems of vehicle 800. These non-essential systems might be related to, for example, air conditioning or entertainment systems, and modules of CCU 105 that are not required for the essential task of safely guiding vehicle 800 to the roadside. These essential tasks might include, for example, turning on warning lights and tasks related to vehicle 800's braking system.

[0089] The central fault management system 115f and resource coordination function (RCOS) 115d are preferably redundantly implemented in multiple instances, such that the failure of one instance can be compensated by another. Specifically, each of the first CE 115a and the second CE 115b may have a different instance of such associated instances, such that each of the first CE 115a and the second CE 115b is autonomous and has its own autonomous CFMS 115f and its own autonomous RCOS 115d.

[0090] The RCOS 115d, SMS 115e, CFMS115f, FMS 120c, and iFMS 115g can be implemented individually or jointly, wholly or partially, as one or more computer programs designed to run synchronously (in individual instances) on each of the main CEs 115a and 115b (i.e., on each of the first CE 115a and the second CE 115b, respectively). Hybrid implementations are also possible, where dedicated hardware is provided in addition to one or more processors for running the software to selectively offload certain tasks, such as offloading to a high-performance dedicated system-on-chip (SoC).

[0091] Figure 3 An embodiment of this solution is illustrated in the diagram. Figure 1 The second block diagram 200 shows more details of the functional building blocks of the CCU 105, with a focus on its redundancy settings.

[0092] As referenced above Figure 1 and Figure 2As already discussed, the computing module cluster 110 includes two or more main CEs within its main computing module 115, which in this example are the first CE 115a and the second CE 115b. Therefore, redundancy is available at the main CE level.

[0093] In addition, the CCU 105 includes a communication switch, which in turn comprises multiple independent switching architectures. Figure 3 In this example, there are two independent and autonomous (primary) switching architectures: a first switching architecture 225a and a second switching architecture 225b, and a third switching architecture 225c for emergency situations. All switching architectures 225a, b, and c are housed within service module 135. Each of the first switching architecture 225a, the second switching architecture 225b, and the third switching architecture 225c includes hardware for variably connecting multiple different nodes (such as nodes in a computer network) to variably exchange data D between them. In this example, the network includes modules of computing module cluster 110 and various endpoints 330, 430, or endpoint cluster 515 thereto as nodes, such as... Figure 1 , Figure 7 , Figure 8 and Figure 9 Any one or more of the following are shown.

[0094] Each of the (primary) switching architectures (i.e., the first switching architecture 225a and the second switching architecture 225b) is signal-connected 730 to an associated primary CE in the primary computing module 115 so that it can selectively switch the flow of information between the respective primary CE (i.e., the first CE 115a or the second CE 115b) and other nodes in the network (such as nodes 120, 125, and 140 to 160). Specifically, the switching architecture can be designed as a PCIe industry standard compliant switch (PCIe switch 325). The same applies to the third switching architecture 225c, although it may have limited connectivity. For example, it may only connect to the subgroups of endpoints 330, 340 and / or only connect to the subgroups from CEs 120a, 120b, 125a, or even not connect to any of these CEs.

[0095] For security purposes, network connections between the switching architecture and other nodes in the network can be protected by one or more first security functions 230a,b on the CE side and / or one or more second security functions 235a,b on the endpoints 330, 340 side, such as authentication, packet inspection, encryption, digital signatures, and / or obfuscation, and may involve offloading to a designated security device. Specifically, the first security functions 230a,b and / or the second security functions 235a,b can be implemented as building blocks of the corresponding associated switching architecture, such as... Figure 3and Figure 4 As shown, authentication and packet detection are provided as protection functions on the architecture endpoints 330 and 340 side in the first security functions 230a and 230b, while one or more second security functions 235a and 235b may be provided on the corresponding CE side of the first switching architecture 225a, the second switching architecture 225b and the third switching architecture 225c in each of the security blocks.

[0096] The main computing module 115, with primary CEs 115a and 115b, and the switching architectures 225a, 225b, and 225c with their associated security functions / blocks, collectively define the computing task coordination domain 205 of the CCU 105, where computing tasks can be variably distributed among the modules of the computing module cluster 110. The CCU 105 can be specifically configured to fully enumerate all nodes in the network during the boot and / or reset processes, such that upon completion of these processes, all nodes possess a defined identity within the network, e.g., an assigned identification code by which they can be unambiguously identified within the network. The enumeration process can be specifically performed under the guidance of the communication switch and / or the main computing module 115.

[0097] To avoid any confusion, at any given point in time, only one of the primary CEs (e.g., by a relevant identifier) ​​is designated as the current priority primary CE. This means that other entities in CCU 105 will only "follow" their commands (such as the assignment of computational tasks) and ignore any commands from any other primary CE. Figure 3 In this context, the first CE is currently designated as the primary CE with the current priority, while the second CE is not.

[0098] This is Figure 3 The diagram uses shading to indicate that the current priority primary CE (i.e., the first CE 115a) and all other building blocks of the second block diagram 200 that are particularly associated with the current priority primary CE are shown with "downward" shading and reference numeral attribute "a" (e.g., "225a"), while the other primary CE (i.e., the second CE 115b) and all other building blocks of the computation task coordination domain 205 that are particularly associated with the other primary CE are shown with "upward" shading and reference numeral attribute "b" (e.g., "225b").

[0099] If a malfunction is detected in the current priority primary CE or its associated switching architecture, then (e.g., via built-in self-test) another primary CE that is functioning normally is identified as the new priority primary CE, and the new priority primary CE takes over the role previously held by the malfunctioning current primary CE. The same applies to the associated switching architecture. For example, if a malfunction is detected in the current priority primary CE (in this example, first CE 115a) and / or its associated first switching architecture 225a, for example due to a hardware defect, then the previously redundant primary CE (i.e., second CE 115b) and its associated second switching architecture 225b are identified as now having priority and taking over the role previously held by first CE 115a and its associated first switching architecture 225a.

[0100] Furthermore, in emergency situations, such as when another switching architecture (i.e., the second switching architecture 225b (now acting as the new priority switching architecture)) is also found to be malfunctioning, the third switching architecture 225c can be identified as now gaining priority and taking over the role of the previously prioritized switching architecture 225a or 225b. If the third switching architecture 225c has limited connectivity, as described above, then when the third switching architecture 225c takes over, all unconnected endpoints 330 and CE will automatically disconnect from the switching function of service module 135. In this way, CCU 105 can focus on emergency tasks without even having to involve resource coordination function 115d.

[0101] Turning to the power supply system for the CCU 105, there are two (or more) redundant, independent power sources, in this example a first main power source 240a and a second main power source 240b. Each power source is capable of independently providing sufficient power (such as electrical power P) to the CCU 105 to support all its functions, at least under normal operating conditions. During normal operation, all these power sources are configured to operate simultaneously to jointly provide a redundant and therefore highly reliable power supply to the CCU 105. Power sources 240a and 240b can be components of the CCU 105 itself, or they can be external to it, for example, as a vehicle 800 battery external to the CCU. Figure 3 As shown.

[0102] In addition, CCU 105 (e.g., in its service module 135) may include other power sources, such as emergency power source 240c. Emergency power source 240c may be specifically designed to be a temporary power source with only a more limited capacity than each of the first main power source 240a and the second main power source 240b, but with sufficient capacity to power at least the third switching architecture 225c (if the third switching architecture is in operation).

[0103] To further support the redundancy concept 201 upon which CCU 105 is based, a single independent power network exists for each primary power source (see [link to relevant documentation]). Figure 3 and Figure 4 The "primary" path and "redundant" path in the CCU 105 are used to distribute power supplied by the corresponding primary power sources among the physical components requiring power in the CCU 105, including but not limited to all CEs and all switching architectures in each computing module. Specifically, each primary power source and its corresponding power network are configured to simultaneously power all switching architectures, thereby achieving full redundancy and maintaining the operation of the CCU 105 even in the event of failure of one switching architecture or one primary power source.

[0104] Current limiters 245a,b can be configured within the power network to ensure that any current flowing in the power lines of the CCU 105 (particularly the power lines in its service module 135) remains below correspondingly defined current thresholds, thereby preventing any current-based damage or malfunction that may occur if the current level rises above these corresponding thresholds. The power network, and optionally the primary power source (if part of the CCU 105), defines the power supply domain 220 of the CCU 105, which provides a high degree of reliability due to its redundant configuration.

[0105] The various hardware components of the CCU 105 may have different voltage requirements for their power supply. Therefore, the power system of the CCU 105 may further include various redundantly provided voltage generation units, each configured to provide the same set of different power supply voltage levels required, and distributed via a backplane to the switching architectures 225a, 225b, 225c. For example, a first voltage level may be 3.3V to power a first group of devices (such as the CCU 105's Ethernet to PCIe bridge), a second voltage level may be 1.8V to power a second group of devices (such as the CCU 105's microcontrollers and NOR flash memory devices), a third voltage level may be 0.8V to power a third group of devices (such as the CCU 105's DRAM memory devices), and so on. In particular, this allows the CCU 105's control coordination domain 210 to control the voltage levels of the entire service module 135 as well as the voltage levels generated within the computer module cluster 110 itself.

[0106] Furthermore, CCU 105 (i.e., its service module 135) includes two or more redundant controllers 260a,b, such as microcontrollers, for controlling selected functions of service module 135. In particular, controllers 260a,b can be configured to use power management information I to control the power supply for communication switches having switching architectures 225a and 225b.

[0107] Specifically, there are one or more first voltage generating units 250a,b and one or more second voltage generating units 255a,b, all of which generate the same set of voltages. Each first voltage generating unit 250a,b provides the full set of voltage levels to an associated one of the first switching architecture 225a and the second switching architecture 225b, while each second voltage generating unit 255a,b provides the same full set of voltage levels to an associated one of the controllers 260a,b. Each controller 260a,b compares the voltage set delivered by its associated first voltage generating unit 250a,b to its associated one in the switching architecture with the set received from the second voltage generating unit 255a,b. Normally, these voltage sets should match. However, if the controller 260a,b determines that the voltage level sets do not match, a problem is detected, and the controller 260a,b can initiate a reaction, such as shutting down one or more components.

[0108] All first voltage generation units 255a and second voltage generation units 255b generate output voltage groups independently based on a load sharing or voting process related to the power supplied simultaneously by the first main power source 240a and the second main power source 240b. For example, power sharing can be applied when it is found that both main power sources should be stable, while voting can be applied when the power supplied by one of the main power sources is unstable.

[0109] Service module 135 includes a monitoring function, which is redundantly implemented in at least two independent instances (e.g., a first hardware component and a second hardware component). This monitoring may specifically include one or more of current monitoring, voltage monitoring, and clock monitoring. Such monitoring may specifically relate to the power output of the first voltage generation units 250a,b and the second voltage generation units 255a,b. The monitoring results are provided to controllers 260a,b, where they are analyzed, and control information (signals) C defining the response to the analysis results and / or, in the event of a detected malfunction, alarm information (signals) A can be issued and communicated to relevant other components of CCU 105, such as CFMS 115f in main computing module 115 and / or other safety functions of CCU 105 (if any). CFMS 115f can thus react accordingly, such as by reassigning current or upcoming computing tasks to CEs unaffected by the detected malfunction.

[0110] The controllers 260a,b, the first voltage generation units 250a,b, the second voltage generation units 255a,b, and the monitoring units 265a,b can therefore be designated as the control coordination domain 210 of the service module 135. In practice, components on the priority path (i.e., those associated with the current priority master CE) and components on the redundant path (i.e., those associated with the current other master CE) are now grouped separately, and for each master CE, a corresponding associated architectural power coordination domain 215 can be defined, including the components of the associated group. Figure 3 In the diagram, only one of these architecture power coordination domains 215 is drawn (dashed box).

[0111] like Figure 4 As shown (the power supply path is not shown here to reduce the complexity of the figures), current limiters 245a,b may be specifically equipped with diagnostic output functionality to generate and output diagnostic data based on the operation of the respective current limiter 245a,b and / or the characteristics of the power it receives or provides. The diagnostic data can then be provided to controllers 260a,b for further analysis and to initiate appropriate responses, such as changing the priority from one primary CE and its associated switching architecture to another primary CE and its associated switching architecture if the diagnostic data indicates a failure or malfunction of one or more components of CCU 105 that may affect the normal operation of the current priority primary CE and / or its associated switching architecture.

[0112] like Figure 5 As shown, Figure 3 and Figure 3 The setup illustrated in the diagram can be further enhanced by adding additional levels of redundancy beyond the basic redundancy provided by the redundancy concept 201 that defines two or more pairs 170a,b (each pair having an associated primary CE and an associated switching architecture), as described above. This further level of redundancy is based on creating such redundancy within the pair 170a,b by redundantly providing the primary CE and / or switching architecture for the pair 170a,b (i.e., in multiple instances) and also by providing configuration switches 270a,b for switching between different configurations of the pair 170a,b for each such pair 170a,b.

[0113] Therefore, if the primary CE and / or the switching architecture providing redundancy within a given pair 170a,b fails, the pair 170a,b as a whole remains operational due to the remaining one or more other primary CEs and / or switching architectures. The concept of priority for basic redundancy between pairs 170a,b discussed above can be similarly applied to further levels of redundancy within a given pair 170a,b. Thus, if a pair 170a,b has multiple redundant instantiations of primary CEs (such as a first instantiation 115a-1 of a first primary CE, a second instantiation 115a-2 of a first primary CE, a first instantiation 115b-1 of a second primary CE, and a second instantiation 115b-2 of a second primary CE), these instantiations can be operated to perform the same computational task simultaneously, with one of the first CE 115a and the second CE 115b designated as the priority primary CE for that pair 170a,b. This also applies to the switching architecture of each pair of 170a,b when there are multiple instantiations of each switching architecture, namely, the first instantiation 225a-1 of the first switching architecture, the second instantiation 225a-2 of the first switching architecture, the first instantiation 225b-1 of the second switching architecture, and the second instantiation 2255b-2 of the second switching architecture.

[0114] As an example, Figure 5 The illustration shows two separate pairs of such pairs 170a,b. Unless such a pair 170a,b consists of a single primary CE (e.g., a first instantiation 115a-1 of the first primary CE) and a single switching architecture (e.g., a first instantiation 225a-1 of the first switching architecture) (“I-shape”), it comprises its own configuration switch 270a,b and either two (or more) associated primary CEs (e.g., two or more instantiations of the first CE 115a or the second CE 115b), or two (or more) associated switching architectures (e.g., two or more instantiations of the switching architecture). The configuration switch 270a,b is operable to variably switch between at least two different possible configurations of the respective pair 170a,b.

[0115] An exemplary shape for each pair of 170a,b is: (i) multiple instantiations of the main CE, such as an instantiation 115a of the first CE and a single switching architecture 225a-1 (or 225b-1) (“Y-shaped”); (ii) a single main CE 115a-1 (or 115b-1) and multiple switching architectures 225a-1 and 225a-2 (or 225b-1 and 225b-2) (“inverted Y-shaped”); and multiple instantiations of the main CE 115a-1 and 115a-2 (or 115b-1 and 115b-2) and multiple instantiations of the switching architecture 225a-1 and 225a-2 (or 225b-1 and 225b-2) (“X-shaped”). Pairs of 170a,b may generally have the same or different shapes at a given point in time. For example, the first pair of 170a may have a Y-shaped shape, while the second pair of 170b may simultaneously have an X-shaped shape. If pairs 170a and 170b have shapes other than I-shapes, they can be configured using their associated configuration switches 270a and 270b, particularly based on the operating state of their components, such as error-free operation or malfunction / failure. For example, if the first pair 170a has an X-shape or an inverted Y-shape, and a failure of the second instantiation 225a-2 of the first switching architecture is detected, the first configuration switch 270a can be (re)configured so that it now connects the (error-free) second instantiation 225a-2 of the first switching architecture to the current priority master CE of the pair 170a and 170b, for example, the first instantiation 115a-1 of the first master CE.

[0116] Now for reference Figure 6 The illustration shows an exemplary conventional classic strict hierarchical communication scheme 300 based on the standardized PCI Express (PCIe) communication technology for communication between different nodes in a PCIe network, specifically including two different computing entities, such as a first central processing unit (CPU) 305 and a second CPU 310.

[0117] The first CPU 305 includes (e.g., for scheduling computing tasks) a first management function 305a, a first processing function 305b for executing the scheduled computing tasks, and a PCIe first PCIe root complex 305c having three first PCIe root ports 315 (315-1, 315-2 and 315-3).

[0118] Similarly, CPU 310 includes a second management function 310a (e.g., for scheduling computing tasks) and a second processing function 310b for executing the scheduled computing tasks, as well as a second PCIe root complex 310c having three second PCIe root ports 320-1, 320-2 and 320-3.

[0119] All communication flows between this CPU (e.g., the first CPU 305) and any endpoint 330 in the PCIe network associated with that CPU should use one or more of its root ports 315 (315-1, 315-2, and 315-3) via the first PCIe root complex 305c. In addition to the PCIe endpoints 430, there may be intermediate hubs in the PCIe network, such as one or more PCIe switches 325.

[0120] Therefore, each of the first CPU 305 and the second CPU 310 has its own communication hierarchy, including its own address space and / or clock domain, for communication between any two nodes in its PCIe network, such that, due to this hierarchy, every communication between two nodes in the same network must necessarily pass through the root complex of the associated CPU.

[0121] Communication between nodes in different communication hierarchies is achieved through an inter-CPU communication link 335 operating between the first CPU 305 and the second CPU 310. Therefore, if a first endpoint 330 in the communication hierarchy of the first CPU 305 needs to communicate with a second endpoint 330 in the communication hierarchy of the second CPU 310, the communication path should operate as follows: - The communication hierarchy from the first endpoint 330 upstream through the first CPU 305. - Through the first composite 305c with the associated first PCIe root port 315 - Through the first management function 305a of the first CPU 305, - Then it further passes through the inter-CPU communication link 335 to the second CPU 310, and - There, it flows downstream via its second management function 310a. - Its second composite 310c and its associated second port 320, - And finally to the second endpoint 330.

[0122] Therefore, because the endpoints 330 of different communication hierarchies are isolated from the CPU of each corresponding other communication hierarchies, this communication is not very efficient and may suffer from particularly high latency.

[0123] and Figure 6 Compared to conventional methods, embodiments of this solution can achieve the following: Figure 7 and Figure 8The example shown is an adapted PCIe communication scheme 400. Similarly, in this exemplary adapted PCIe communication scheme 400, there are two PCIe hierarchical structures, each with its own address space and a corresponding first PCIe single-root complex 405c and a second single-root complex 410c. In the adapted PCIe communication scheme 400, Figure 6 The first CPU 305 is powered by the main CE (e.g., Figure 1 The first CE 115a of B is replaced, and the second CPU 310 is replaced by the CE (e.g., Figure 3 Replaced from CE 120a).

[0124] The first CE 115a (master CE) includes management functions 405a, processing functions 405b, and a first single PCIe root complex 405c with three PCIe root ports 405d (405d-1, 405d-2, and 405d-3). Similarly, the CE 120a includes further management functions 410a, further processing functions 410b, and a second single PCIe root complex 410c with three further PCIe root ports 410d (410d-1, 410d-2, and 410d-3), as well as a resource coordination system block 415d including resource coordination function (RCOS) 115d. All nodes in the adapted PCIe communication scheme 400 share a common clock, i.e., they are in the same clock domain.

[0125] In each communication hierarchy, there are hierarchy-related PCIe switches 415a,b, which have one or more first non-transparent PCIe bridges (NTBs) 420a,b for connection to an associated CE and one or more second non-transparent PCIe bridges (NTBs) 425a,b for direct or indirect connection to one or more PCIe endpoints 430 or another corresponding communication hierarchy (i.e., its root complex). Figure 3 The CPU-to-CPU communication link 335 is now obsolete and can be discarded.

[0126] Now for special reference Figure 8 This illustrates three exemplary communication paths implemented by the adapted PCIe communication scheme 400.

[0127] The first communication path 435 enables communication between the first selected PCIe endpoint 430-1 in the hierarchy of the first CE 115a acting as the master CE and the autonomous CE 120a acting as the slave CE, and the slave CE 120a (specifically, its further processing function 410b). The first communication path 435 runs from the first selected PCIe endpoint 430-1 to the corresponding first PCIe switch 415a in the same hierarchy, and from there via the second NTB 425a to the root port 410d (specifically: 410d-2) of the second PCIe single root complex 410c of another CE (i.e., slave CE 120a), from where it finally runs to the further processing function 410b.

[0128] The second communication path 440 enables communication between the second selected PCIe endpoint 430-2 in the hierarchy from CE 120a and the further processing function 410b from CE 120a. Therefore, the second communication path 440 remains within the same hierarchy from the second selected PCIe endpoint 430-2 to the corresponding second PCIe switch 415b to the further PCIe root port 410d (specifically: root port 410d-1), and from there through the further PCIe root port 410d (specifically: root port 410d-2) to its further processing function 410b (i.e., the processing function from CE 120a), like... Figure 6 The situation is the same as usual.

[0129] The third communication path 445 enables communication between the second selected PCIe endpoint 430-2 in the hierarchy of CE 120a and another selected PCIe endpoint 430 in the hierarchy of the main CE 115a. The third communication path 445 runs from the second selected PCIe endpoint 430-2 to the corresponding second PCIe switch 415b in the same hierarchy, to a further PCIe root port 410d (specifically: root port 410d-1) of the second PCIe single root complex 410c of CE 120a, and there to a further PCIe root port 410d (specifically: root port 410d-2), from where it reaches the corresponding first PCIe switch 415a via NTB 425a, from where it finally proceeds to the processing function 405b.

[0130] All these communication paths, especially the first and third paths that interconnect different hierarchical structures, can be managed by the management function 405a of the main CE 115a. Therefore, the adapted communication scheme 400 uses NTB to achieve “direct” point-to-point communication between distributed locations (included in different hierarchical structures) within the same clock domain, while the communication paths are centrally managed, and in particular configured.

[0131] Figure 9 A third block diagram 500 illustrating an exemplary CCU 105, and in particular its communication switch having a service module 135, is shown according to an embodiment of this solution. The CCU 105 has a computing module cluster 110, which includes a main computing module 115, three general-purpose computing modules 120, and a single special-purpose module 125, each of which is described above. Figure 1 and Figure 2 The corresponding type mentioned above.

[0132] Each module in the compute module cluster 110 is linked to two hierarchically related PCIe switches 415a,b. Each of these hierarchically related PCIe switches 415a,b is equipped with multiple first NTBs 420a,b on the CE side and multiple second NTBs 425a,b on the PCIe endpoint 430 side. Therefore, the setup is similar to... Figure 7 The / 8 setting, although optionally with a different number of NTBs.

[0133] Furthermore, the CCU 105 of the third block diagram 500 includes a corresponding conversion bridge 505 for one or more (particularly all) endpoint-side second NTB 425a,b, for converting between different communication technologies used in the relevant communication paths running through the corresponding NTB. For example, such a conversion bridge 505 can be configured to perform a conversion from Ethernet communication technology to PCIe technology. Specifically, in Figure 9 In the example, the conversion bridge 505 is configured to perform a conversion from Ethernet communication technology on the endpoint side to PCIe technology on the CE side of the NTB.

[0134] Therefore, PCIe technology is used for communication between modules in the computing module cluster 110, as well as with the corresponding first PCIe switch 415a and the corresponding second PCIe switch 415b, and towards the conversion bridge 505, while Ethernet technology is used for communication between the conversion bridge 505 and the PCIe endpoints 430. The latter can be spatially arranged or through some other common attributes (e.g., shared functionality, address space, or clock) within the endpoint cluster 515 of the PCIe endpoints 430. An Ethernet switch 510 can be arranged between the bridge 505 and the endpoint cluster 515 to variably connect selected individual PCIe endpoints 430 to selected conversion bridges 505. The hierarchical group of PCIe switches 415a,b and conversion bridges 505 can be implemented specifically within a single SoC or via a chiplet solution, wherein the hierarchical group of PCIe switches 415a,b and conversion bridges 505 is distributed across multiple chiplets, each chiplet carrying one or more of these components.

[0135] Therefore, each module of the compute module cluster 110 is connected to each of the two switching architectures, each of which includes a corresponding hierarchical PCIe switch 415a,b, various NTBs 420a / 425a or 420b / 425b, and several conversion bridges 505. In this way, the desired redundancy is achieved, where each PCIe endpoint 430 can be reached from any module of the compute module cluster 110 via each of the communication architectures (and vice versa).

[0136] Figure 10 An exemplary computing system (e.g., according to an embodiment of this solution) is illustrated. Figure 1 An exemplary housing 600 for the CCU 105. Housing 600 includes a rack-type housing structure 605 having multiple compartments, each compartment for receiving, preferably in a replaceable manner, modules of the CCU 105, such as computing modules of computing module cluster 110 or service modules 135. In this example, six compartments (slots) are arranged in the architecture and collectively (co-located, particularly adjacently) accommodate the main computing module 115, two general-purpose computing modules 120, two special-purpose modules 125, and service module 135.

[0137] While the first end of the housing structure 605 includes a corresponding opening for inserting or removing modules for each compartment, the opposite end of the housing structure 605 includes a passive connection device 130 configured to provide a connection for exchanging one or more power P, data D, control information C, alarm information A, or power management information I between different modules.

[0138] The passive connection device 130 may in particular have a substantially planar shape and may therefore be referred to as a “backplane”. It does not include any active components, such as transistors, ICs, etc., and is strictly limited to carrying passive components, such as conductive traces, connectors, resistors, capacitors, etc. (hence it is a “passive” connection device). Between the connection device 130 and the opposite rear of the module, each module has one or more connectors 610 to provide the aforementioned connections. In particular, the connectors 610 may be designed as detachable connectors 610, such that modules can be inserted and connected by (i) pushing them into their respective compartments until one or more associated connectors 610 are engaged, and (ii) removed and disconnected by pulling them out of the compartments and thus detaching the connection. Each of the connectors 610 includes a first connector located on the associated module and a second connector located on the connection device, the first connector engaging with the second connector when the module is properly inserted into its associated compartment to form at least one of a signal connection and a power connection.

[0139] Computing platform Now for reference Figure 11 Vehicle 800 or computing platform 700 for vehicle 800 (see Figure 3 , Figure 4 An exemplary embodiment of the device includes a central computing unit (CCU) 105 having a modular design, wherein multiple different modules 105a to 105f are combined within a common housing 600, such as a rack-type common housing, to jointly define the computing device. Modules 105a to 105f may particularly overlap with the modules 115, 120(2x), 125a, 125b and 135 described above (see [link to documentation]). Figure 10 The housing 600 and optionally other sections of the CCU 105 form its fixed portion. Conversely, at least one, preferably several, of modules 105a to 105f are releasably and replaceably connected to the housing 600, allowing them to be easily removed via releasable mechanical, electrical, and / or optical connectors 610. This enables hardware-based reconfiguration, repair, or enhancement of the CCU 105 by adding, removing, or replacing one or more modules with respect to the fixed portion. Specifically, one of the modules (e.g., module 105b) may be a power supply module for supplying energy to at least one, preferably all, of the other modules 105a and 105c to 105f. Power supply module 105b may be specifically part of the fixed portion of the CCU 105, but it is also contemplated to be releasably and replaceably connected to the housing 600, allowing it to be easily removed, replaced, etc.

[0140] As used herein, the term "computing platform" 700 may specifically refer to the environment in which a piece of software is executed. It can be hardware or an operating system (OS), even a web browser and its associated application programming interface (API), or other low-level software, as long as the program code is executed using it. The computing platform 700 may have different levels of abstraction, including computer architecture, OS, or runtime libraries. Therefore, a computing platform is the stage on which computer programs can run. It may specifically include or be based on multiple computers or processors.

[0141] The CCU 105 is designed to serve as the central computing entity of the computing platform 700 and is configured to provide on-demand computing to various other functional units of the vehicle 800 based on the CCU 105's flexible, software-defined resource and process management and / or control functions. Specifically, the CCU 105 may be designed to communicate with these other functional units via one or more, preferably standardized, high-speed communication links 725 (such as one or more high-speed bus systems or several individual communication links, such as Ethernet links, for example, for data rates of 10 Mbit / s or higher). These high-speed communication links 725 may be particularly used for communicating one or more of the following: data D, control information C, alarm information A, and power management information I, as described above, for example with... Figure 1 , Figure 2 , Figure 3 and / or Figure 4 Related.

[0142] In addition, the CCU 105 may include a multi-core operating system, which includes a main core and multiple other cores, wherein the main core is configured to control at least two of the multiple other cores simultaneously, and these cores run concurrently.

[0143] Another module in the module (e.g., module 105a (which, as described above, may specifically overlap with the main computing module 115)) may include a general-purpose computing device, such as one or more general-purpose microprocessors. In particular, module 105a may serve as the main computing resource (e.g., the main control unit) of CCU 105 and is configured to distribute computing needs among multiple computing resources of CCU 105 (including computing resources of other modules in the module of CCU 105).

[0144] For example, module 105c (which, as described above, may specifically overlap with special-purpose computing module 125) may include dedicated computing devices, such as a graphics processing unit (GPU) and / or a dedicated processor for running artificial intelligence-based algorithms (e.g., algorithms that implement one or more artificial neural networks). Furthermore, modules 105d, 105e, and 105f may include other general-purpose or dedicated computing resources / devices and / or memory.

[0145] For example, module 105d may include a security controller for protecting data and / or programs within CCU 105 and restricting access to them (as described above, module 105d may specifically include one or more of first security functions 230a,b and / or second security functions 235a,b). Module 105e may include one or more interface controllers or communication devices for connecting CCU 105 to one or more communication links with other devices outside CCU 105, such as actuators 715, sensors 720, or cluster hubs 710 (hubs), for aggregating / routing or separating signals from / to several actuators 715 and / or sensors 720 to form a cluster centered on the hub (e.g., one or more of the endpoint clusters 515, 140, 145, 150, and 160 described above), each cluster including several actuators 715 and / or sensors 720.

[0146] When using this cluster / hub concept, it can be implemented specifically based on a tree topology, where various actuators 715 and / or sensors 720 are connected to one or more cluster hubs 710 or multiple cascaded cluster hubs 710 to the CCU 105, for example, to its module 105e, via associated signal connections 730. The cluster hub 710 (which may be referred to, for example, as a “zone electrical controller” 260a,b (ZeC)) can specifically have the function of aggregating signals from different sources (such as actuators 715 and / or sensors 720), and can thus also be configured to act as a gateway between different communication protocols (such as CCN, LIN, and Ethernet). Therefore, significant wiring can be saved, and a central computing mechanism can be used to provide processing capabilities for handling signals from / to the actuators 715 and / or sensors 720, particularly for controlling one or more functions of the vehicle 800 based on these signals. However, a hubless or hybrid topology is also possible, in which some or all of the actuators 715 and / or sensors 720 are directly connected to the CCU 105 without any intermediate cluster hubs 710.

[0147] The computing platform 700 can be designed as a multi-layer computing platform and therefore includes multiple computing layers, such as (i) a first computing layer 740 for processing basic mobility functions of the vehicle 800 (e.g., a car) such as acceleration, deceleration, and steering; (ii) a second computing layer, as described herein, for processing various other (e.g., digital) functions of the vehicle 800 such as driver assistance, infotainment, or (other) comfort-related functions such as air conditioning; and (iii) a third computing layer 750 for processing functions of the vehicle 800 related to high automation or even autonomous driving, such as processing signals from relevant sensors 720 to detect objects or road markings in the environment of the vehicle 800. The second computing layer can be specifically designed according to… Figure 11Design (but excluding the first computing layer 740, the third computing layer 750, and the related interfaces to the second computing layer, as described below).

[0148] In a multi-computing-layer embodiment of the computing platform 700, one of the modules 105a-f of the CCU 105 may further include or be configured to link to (i) a first interface unit 735 for connecting the second computing layer to the first computing layer 740 and (ii) a second interface unit 745 for connecting the second computing layer to the third computing layer 750 and exchanging information with it in a controlled manner (e.g., according to one or more defined protocols).

[0149] Module 105f may, for example, include a communication interface 125b for implementing interface functions to the third computing layer 750. In fact, module 105f itself may also include one or more computing units of the third computing layer 750, such that the second computing layer and the third computing layer 750, although defined as separate computing layers with a single function and structure, are then physically integrated in the same physical device, i.e., in the housing 600 of CCU 105, and even at least partially within the same module of CCU 105.

[0150] Further details of the multi-computing-layer embodiment of the computing platform 700 are described in PCT / EP2023 / 055182, which is incorporated herein by reference in its entirety.

[0151] vehicle Figure 12 The diagram illustrates the basis including CCU 105. Figure 11 An exemplary vehicle 800, particularly an automobile, is illustrated with an exemplary computing platform 700. The CCU 105 is configured to centrally control various functions of the vehicle 800 (not shown). To reduce complexity, only some elements of the computing platform 700 (particularly its second computing layer) are shown, while other elements are not explicitly shown. This includes, in particular, all actuators 715 and sensors 720, and in multi-computing-layer embodiments, all elements of the first computing layer 740 and the third computing layer 750, as well as all elements of the first interface unit 735 and the second interface unit 745.

[0152] Figure 12 (a) Several cluster hubs 710 of the second computing layer are also shown, along with associated high-speed communication links 725 from the cluster hubs 710 to the CCU 105. Each of these hubs 710 can be connected to multiple actuators 715 and / or sensors 720, such as Figure 11 As shown in more detail below.

[0153] While in principle the CCU 105 can be located anywhere within the vehicle 800, there are certain preferred locations, particularly given safety requirements and the need to make it easily accessible to facilitate the easy removal and replacement of modules 105a to 105f into the housing 600 of the CCU 105.

[0154] Figure 12 (b) shows another simplified view of vehicle 800, in which three distinct exemplary locations within vehicle 800 (i.e., first location 805, second location 810, and third location 815) are identified, which are particularly suitable for placing CCU 105 within vehicle 800. First location 805 and third location 815 are arranged on or near the (virtual) centerline of vehicle 800, which extends midway along the main extensional dimension (y-dimension) of the vehicle between the two sides of vehicle 800. First location 805 is located between the two front seats, for example, in the center console of vehicle 800, while third location 815 is located below the rear seats or seat benches of the second or third row. These central locations (at least in the x and y dimensions) are particularly advantageous in terms of safety and protection against damage or destruction in the event of an accident. They are also easily accessible for maintenance, repair, or replacement purposes, particularly when one or more of modules 105a to 105f need to be removed from CCU 105 (particularly from its housing 600).

[0155] The second position 810 is also highly accessible and well protected against collisions from virtually any direction. This second position 810 is also particularly well-suited for establishing wireless communication links W with communication nodes outside the vehicle 800 (such as communication nodes of traffic infrastructure or other vehicles, for example, for vehicle-to-vehicle communication), because its proximity to the windshield generally reduces its exposure to the electromagnetic shielding of the vehicle 800 itself.

[0156] Therefore, CCU 105 can be specifically located in or near the glove box, or in the central control console of vehicle 800, that is, in or near the center of the passenger compartment of vehicle 800, so that CCU 105 is well protected against external mechanical impacts, for example, in the event of an accident involving vehicle 800, and is easily accessible.

[0157] Passive connection device and its connection to the CCU module Figure 13 An exemplary embodiment 900 of the housing 600 of the CCU 105 is illustrated, which includes a backplane configured as a passive connection device 130 for interconnecting various electronic modules 115, 120, 125, 135 of the CCU 105. Figure 13 Can be specifically regarded as Figure 10 A more detailed illustration of the housing 600 according to its possible embodiments is shown.

[0158] In this exemplary embodiment, the housing 600 includes a structure 605 in the form of a rack 905 having a plurality of compartments 905a (six compartments 905a arranged in a 2-row × 3-compartment matrix in this example), each compartment 905a for accommodating a corresponding one of modules 115, 120, 125, 135. For illustration, one module 115, 120, 125, 135 is shown inserted into the lower center compartment 905a of the bottom row, while the top row of the rack 905 is not shown to allow for a clearer view of the connecting device 130 (backplate). Each module 115, 120, 125, 135 has a substantially cuboid profile, and each compartment 905a is configured to receive a module 115, 120, 125, 135 of this shape. Each compartment 905a may include a spring mechanism or the like to act on modules 115, 120, 125, 135 inserted into the compartment 905a, thereby pressing heat transfer elements 910 (such as hot foil) against a corresponding surface of the frame 905 (such as a cooling plate surface not shown). Additionally or alternatively (as shown), openings 950 may be present in one or more walls of the compartment 905a through which elements such as springs (not shown) extend into the compartment 905a, these elements being configured to apply such pressure to the modules 115, 120, 125, 135.

[0159] One or more of modules 115, 120, 125, 135 may have a heat transfer element 910 (such as a foil with high thermal conductivity) on one or more of its surfaces (particularly the top or bottom surface), which is configured to contact a well-conducting surface of the frame 905 or a heat dissipation element (e.g., a cooling plate, not shown) disposed thereon. In this way, the heat generated within modules 115, 120, 125, 135 during their operation can be efficiently dissipated, thereby maintaining their temperature within a permissible specific operating temperature range.

[0160] The connecting device 130 is fastened to the housing structure 605, for example, by a first retaining screw 940. Specifically, the connecting device 130 may have a substantially plate-like base that carries several circuit boards (second circuit boards 915), such as one for each compartment 905a (as illustrated), on its surface facing modules 115, 120, 125, 135. The second circuit boards 915 are attached to the surface of the base. This attachment may be achieved, in particular, by a second retaining screw 935, which may extend through a hole 1125 or its fastening lug 935a in the corresponding second circuit board 915, as illustrated exemplary for the upper left corner second circuit board 915. Furthermore, one or more guiding devices, such as guide posts 930, may be arranged on the backplate (e.g., on its second circuit boards 915). The guide device of each compartment 905a is configured to interact with modules 115, 120, 125, 135 (e.g., through corresponding holes 1125 on the back of the latter) when modules 115, 120, 125, 135 are pushed into the respective compartment 905a, thereby guiding modules 115, 120, 125, 135 to the correct position during their movement, wherein one or more first connectors 1110 of modules 115, 120, 125, 135 are correctly connected to corresponding mating second connectors(s) 920, 925 on the connecting device 130. A third retaining screw 945 may be provided to secure the inserted modules 115, 120, 125, 135 in their associated compartment 905a in a strong but removable manner. Additionally or alternatively, other fastening devices may be provided, such as a manually releasable push-lock connection between the first connector 920 and the second connector 925.

[0161] Now, additional references Figure 15 Each second circuit board 915 includes one or more second connectors 920, 925 (such as power connector 920 and / or signal connector 925), each for mating with a corresponding first connector 1110 on the back of the modules 115, 120, 125, 135 to be inserted into the adjacent compartment 905a (see...). Figure 15 At least one corresponding connection is established. One or more second connectors 920, 925 (preferably all) are attached to the corresponding second circuit board 915 via a press-fit connection 1100 involving one or more pins 1115 of connector 610 to the second circuit board 915. Specifically, the second circuit board 915 may have holes 1125 (such as through holes 1125) such that each pin 1115 extends into the corresponding hole 1125 to establish the press-fit connection 1100, as will be explained in further detail below. This connection is particularly suitable for withstanding the harsh use in automotive applications (i.e., in vehicle 800), where vibrations, shocks, and thermomechanical stresses (depending on current operating conditions) acting individually or collectively at the connection need to remain intact.

[0162] To maximize the advantages of the press-fit connection 1100 in terms of signal quality (especially signal integrity), it is preferable to keep parasitic capacitance low, and therefore, on the one hand, relatively short pins are preferred in most instances. On the other hand, given the aforementioned mechanical and thermomechanical challenges, longer pins may be preferred. A solution that balances these aspects is to add one or more additional mechanical connections to enhance the overall mechanical and thermomechanical robustness of the press-fit arrangement. For example, one or more additional pins 1130 can be provided for this purpose, wherein these additional pins can be used particularly purely mechanically (i.e., connected to the associated first or second circuit board without transmitting signals). Specifically, these one or more additional pins can be arranged on the connector or circuit board, and preferably close to one or more signal transmission pins. In this way, the press-fit connections of (multiple) signal transmission pins can be protected to the maximum extent from mechanical or thermomechanical stress by decoupling the press-fit area from stress. The press-fit pins themselves can have elastic properties large enough to promote stress relaxation, especially under thermomechanical stress.

[0163] In addition, the following text will also refer to Figure 21 , Figure 22 and Figure 23 Several means for this decoupling are further discussed to ensure the high mechanical and thermomechanical robustness of the press-fit connection.

[0164] Figure 14 The key differences between the conventional architecture of interconnected electronic hardware modules 1015 (such as graphics cards, power PWR supply cards, memory cards, etc.) in a computer (such as a personal computer) and the basic architecture of the CCU 105 according to this solution are illustrated in a more abstract way.

[0165] exist Figure 14In the conventional architecture 1000 shown in (a), multiple hardware modules 1015 are connected to a motherboard 1005 via dedicated connectors 1400 and 1010, respectively. This motherboard typically comprises many different active electronic components (e.g., integrated circuits, such as processor ICs, interface ICs, etc.) and passive components (e.g., capacitors, switches, and resistors mounted thereon) to form electronic circuits. Therefore, the topology of this architecture is essentially a star topology, centered on the motherboard 1005, and all hardware modules 1015 communicate directly with the motherboard or via the 1400 motherboard only through corresponding communication paths 1020, not directly with each other. Therefore, there are no direct, purely passive communication paths 1020 between different hardware modules 1015, i.e., no gain-free communication paths 1020. On the one hand, although individual hardware modules 1015 can be replaced, if the motherboard is defective or its components are obsolete / beyond their lifespan, the entire expensive and complex motherboard must be replaced, and potentially one or more hardware modules 1015 may also need to be replaced, making such an architecture relatively inflexible. On the other hand, because the communication path 1020 only needs to include a single connector 610 and can be kept short, it can more easily meet challenging RF requirements.

[0166] In contrast, the architecture of the CCU 105 according to this solution precisely achieves a direct, purely passive communication path 1020 between modules 115, 120, 125, and 135 of the CCU 105 via a 1400 communication device. Therefore, high flexibility is possible, as purely passive communication devices are generally less prone to failure and typically have a longer lifespan than active motherboards. Furthermore, individual modules 115, 120, 125, and 135 can be added, removed, or replaced individually, whether for repair, functional expansion, or other upgrades. Although this requires adding another connector 610 to the inter-module communication path 1020, the high degree of flexibility achievable is highly beneficial, especially considering future automotive applications. In conventional automobiles, the hardware is essentially "frozen" after the vehicle's design and configuration are finalized before production. The novel approach of the CCU 105 based on this solution allows for simple post-production modifications to the computing hardware (CCU 105) of a vehicle 800 (such as an automobile), even after they have been sold and are being used by users, even several years after their sale.

[0167] Figure 15A detailed view of a press-fit connection 1100 between a first connector 1110 and a (first) circuit board of modules 115, 120, 125, 135 is illustrated according to an embodiment. The first connector 1110 includes a plurality of electrically conductive pins 1115 within a plastic housing for connecting modules 115, 120, 125, 135 to second connectors 920, 925 on a connection device 130. Specifically, the first connector 1110 may include mating power connectors 1112 and signal connectors 1111 mirrored with the second connectors 920, 925. The pins 1115 are arranged in a substantially parallel manner, and a first end 1115a of each pin 1115 is inserted into a corresponding associated hole 1125 (specifically a through-hole) in the first circuit board 1105. The inner wall of the hole 1125 may be covered with an electrically conductive wall layer 1120 of a material connected to one or more electrically conductive traces 1305 located on or in the first circuit board 1105 for transmitting signals and / or power PWR.

[0168] During the manufacture of modules 115, 120, 125, 135, when the first end 1115a of pin 1115 is pressed (hence “press-fitted”) into an associated hole 1125 in the first circuit board 1105, a strong frictional connection is established between the first end 1115a and the peripheral wall of the hole 1125. Due to the high mechanical strength achievable with the press-fit connection 1100, the axial dimension d1 of the first end 1115a can be significantly smaller than the remaining depth d2 of the hole 1125. Furthermore, the first circuit board 1105 may be equipped with one or more flexible distance elements 1135, which may be specifically configured to define an average distance between the first circuit board 1105 and the inner wall of the module housing 1140 of the associated module. For example, the distance element 1135 may comprise or be entirely made of rubber or other elastic materials, preferably electrically insulating materials.

[0169] Figure 16An exemplary pin arrangement scheme 1200 is illustrated, according to which a group of pins 1115 in a multi-pin connector 610 can be arranged to mitigate adverse effects on the integrity of RF signals within the connector 610. This pin arrangement scheme 1200 is used for a first connector 1110 and its corresponding mating second connectors 920, 925. According to the pin arrangement scheme 1200, a first subgroup of pins 1115 is signal pins 1205, and a second subgroup of pins 1115 is ground pins 1210, i.e., pins 1115 connected to a constant potential (voltage), which could be the ground or common ground potential of the CCU 105 or even the vehicle 800 as a whole. However, the potential of the signal pins 1205 may vary significantly, as defined by the modulation schemes 115, 120, 125, 135 used to transmit the signals on these pins 1115. Pin arrangement 1200 has a matrix arrangement of pins 1115 (as shown in the projection on the circuit board to which connector 610 is mounted), wherein signal pins 1205 and ground pins 1210 alternate in the rows and columns of the matrix, such that no two signal pins 1205 are directly adjacent in any row or column. In this way, potential signal coupling between different pins 1115 is reduced, and thus high signal integrity is maintained. This is particularly important when the space density of pins 1115 in the pin arrangement is high (such as in connector 610 with a high number of pins 1115, e.g., 20 or more pins 1115).

[0170] Figure 17 An exemplary layered structure 1300 of a circuit board (such as a first circuit board 1105) is illustrated, to which a connector 610 is attached via a press-fit connection 1100 of its pins 1115. The layered structure 1300 includes multiple stacked layers comprising multiple layers with conductive traces 1305. For example, such a layered structure 1300 may include one or more of the following: a layer LSS for transmitting low-speed signals, a layer HSS for transmitting high-speed signals, or a layer for distributing power (PWR). In this document, the term "speed" refers to the frequency or wavelength of the signal, not the propagation speed. Therefore, although both high-speed and low-speed signals can be RF signals, high-speed signals are transmitted over a significantly higher frequency range than low-speed signals.

[0171] In addition, the layered structure 1300 includes multiple electrically conductive shielding layers GND, which can be specifically electrically connected to the ground potential. Due to their high conductivity, the shielding layers GND can further serve as a heat distribution layer HDL within the layered structure 1300.

[0172] Within the layered structure 1300, the vertical region extending from the (top) surface is the most critical area for potential signal distortion, where the press-fit connection 1100 is established by pressing the first end 1115a of the pin 1115 into the layered structure 1300, its depth at least approximately corresponding to the axial dimension d1 of the first end 1115a. This is because this region is adjacent to the first end 1115a of the pin 1115 and is therefore most susceptible to electric or electromagnetic fields originating from the pin 1115 (especially its first end 1115a). Since high-speed signals are generally more susceptible to electromagnetic interference than low-speed signals, in Figure 17 In this process, the HSS layer used for transmitting high-speed signals is arranged away from the top surface (critical working area), that is, only arranged in the layer corresponding to the remaining depth d2 in the vertical position within the portion having layer structure 1300.

[0173] Adjacent layers HSS used for transmitting high-speed signals are also separated from each other by a shielding layer GND between them to mitigate interlayer interference. They are even double-shielded from each surface layer of the layered structure 1300 by a ground layer and a power layer PWR. The high-speed traces 1305 for TX and RX in each layer are laid out as symmetrically as possible—which also reduces signal coupling.

[0174] Now for reference Figure 18 The illustration shows details of a circuit board for a first circuit board 1105 (i.e., modules 115, 120, 125, 135) according to an exemplary embodiment. The first circuit board 1105 may specifically include a layered structure 1300 (such as...). Figure 17 The first circuit board 1105 (as shown in the layered structure) has multiple stacked wiring levels with corresponding isolation layers between adjacent wiring levels. Specifically, the first circuit board 1105 may be a multilayer PCB. In each wiring level, one or more conductive traces 1305 may exist for transmitting signals and / or power PWR. To establish vertical electrical conductive connections between different wiring levels at selected locations, the first circuit board 1105 may include one or more vias 1400. Such vias 1400 may specifically include at least partially hollow structures 1310 that utilize outer walls to cover the inner walls of vertical holes 1125 passing through the first circuit board 1105. Figure 15As shown, via 1400 may be specifically formed in hole 1125 designed to accommodate press-fit connector 1100. Here, hollow structure 1310 itself may constitute wall layer 1120, which is typically a metallized layer deposited on the inner wall of hole 1125. Hollow structure 1310 may particularly have the shape of a hollow cylinder (“barrel”), and is therefore preferably formed in cylindrical hole 1125. Thus, when press-fit connection 1100 is achieved at via 1400 by pressing the pins 1115 of first connector 1110 into hole 1125, the power supplied through pins 1115 can be distributed vertically through first circuit board 1105 to conductive layer 1315 of the connection, and horizontally along traces 1305 of the connection within or on this layer.

[0175] When via 1400 passes through a conductive layer 1315 (such as a reference or shielding layer GND or a thermal distribution layer HDL) that should not be connected to via 1400, a so-called anti-pad 1320 can be provided, which is a non-conductive gap between via 1400 and conductive layer 1315. This is yet another measure applicable to protecting high signal integrity, specifically for signals passing through via 1400.

[0176] Turn now Figure 18 On the left, a portion of a top view of the first circuit board 1105 (and its multiple layers) is shown. Several vias 1400 are arranged in a matrix at defined mutual distances x1-x4. This matrix arrangement (shown only partially) corresponds to the pin arrangement scheme 1200 of the first connector 1110, as... Figure 16 As shown. As previously described, according to pin arrangement scheme 1200, adjacent signal pins 1205 are electromagnetically shielded from each other (at least partially) by placing corresponding ground pins 1210 between each pair of signal pins 1205. Therefore, this electrical mode (signal-ground-signal, etc.) is also established within the matrix arrangement of vias 1400, such that each pair of vias 1400 transmitting signal or power PWR is separated by one or more vias 1400 carrying the potential (e.g., common ground potential) of the ground pins 1210. Therefore, laterally adjacent traces 1305 for transmitting signals can be easily shielded from each other by traces 1305 carrying ground potential. Thus, signal integrity is protected in all spatial dimensions: vertically through the layered structure 1300 ( Figure 17 This is achieved through a pin arrangement pattern of 1115 and a corresponding pattern of via 1400 electrically connected to it and trace 1305 (on / in the same layer).

[0177] Figure 19 It shows the relationship with Figure 18 The diagram shows two equivalent circuits related to the arrangement. Specifically, Figure 19 (a) is Figure 18The first equivalent circuit diagram 1500 of via 1400 is shown. Via 1400 is formed by via inductance L. via and via capacitor C via (Divided into two parts) This via 1400 connects to selected traces 1305, each of which has a corresponding trace impedance Z. trace . Figure 19 (b) shows the trace impedance Z trace The second equivalent circuit diagram is shown in Figure 1600. Therefore, the trace impedance Z... trace Can be determined by the trace inductance L' trace Trace resistance R' trace , trace capacitor C' trace and the conductivity G' of the dielectric between trace 1305 and ground trace This indicates that all these values ​​are defined in terms of the unit length of trace 1305, and therefore are indicated by an apostrophe (') in the associated reference numerals.

[0178] Through-hole inductor L via 1400 via conductivity and trace impedance Z trace The value can be as follows Figure 19 (a) and Figure 19 (b) is determined based on the following parameters: D1 = pad diameter, D2 = anti-pad 1320 diameter, l = via length, d = barrel diameter.

[0179] To achieve a high level of signal integrity even for high-speed (i.e., high-frequency) signals (such as high-speed signals used for PCIe signal connections according to fourth-generation and newer generation PCIe interconnect technologies), it is desirable to optimize the signal path used to transmit such signals as reasonably as possible, especially continuously along its entire length. Several factors can significantly affect signal integrity, including (i) signal coupling between adjacent traces 1305, (ii) losses along trace 1305 (especially those caused by resistance), (iii) dielectric loss (tanδ), and (iv) impedance mismatch. Therefore, considering one or more (ideally all) of these factors will help enhance signal integrity.

[0180] Specifically, firstly, special consideration should be given to factor (i), namely, the signal coupling between adjacent traces 1305, and the aforementioned alternating arrangement of the signal transmission trace 1305 and the ground trace 1305 in the signal transmission layer and the shielding layer GND (vertical direction as shown). Figure 17 As shown, and in the horizontal direction as Figure 18 (As shown) It is highly suitable for alleviating this first factor.

[0181] Now, we turn our attention to factor (ii), namely, the loss along trace 1305. Keeping the length of trace 1305 as short as reasonably possible and / or limiting the placement of signal vias to the location of the first connector 1110 are useful measures. Figure 19 As shown in the first equivalent circuit in (a), via 1400 can significantly impact signal integrity; therefore, reducing the pad area, increasing the area of ​​anti-pad 1320, and lowering the dielectric constant all contribute to reducing signal loss. The length of via 1400 is a trade-off resulting from the number of layers within the layered structure 1300. Specifically, increasing the layer thickness generally reduces cross-coupling but increases dielectric loss.

[0182] Now we turn to factor (iii), namely dielectric energy loss, trace capacitance C' trace Values ​​can be crucial. Figure 19 (b) The diagram shows the trace capacitance C'. trace The meaning of this, and thus also reveals why low dielectric constant materials (e.g., ε) are used. r Approximately 3.35, tanδ @ 10GHz ≤ 0.008) — compared to standard PCB material FR-4 (ε r (Approximately 3.8-4.7, tanδ approximately 0.023) may be more highly recommended, especially for the very high RF frequency range of 2 GHz or above.

[0183] Figure 20 An overview of selected components 1700 of modules 115, 120, 125, 135 and second connectors 920, 925 of the connecting device 130 is shown. These components play a role in the transmission of mechanical force F when the first connector 1110 and the second connectors 920, 925 are connected or disconnected, and when modules 115, 120, 125, 135 are respectively inserted into or removed from compartments 905a of the housing structure 605. The first connector 1110 is mounted to a first circuit board 1105 of modules 115, 120, 125, 135, which in turn is mounted to or within the module housing 1140.

[0184] The second connectors 920 and 925 may specifically include a power connector 920 and a signal connector 925, and the first connector 1110 may similarly include corresponding mating power connectors 1112 and mating signal connectors 1111. In each case, Figure 19 The dashed line in the diagram indicates the boundary between the power connector 610 used for the power PWR and the connector used for the signal.

[0185] When modules 115, 120, 125, 135 are inserted into their associated compartments 905a within housing structure 605 to establish a connection, mechanical force F is transmitted from the second connectors 920, 925 to the first connector 1110, further to the first circuit board 1105, and from there to the module housing 1140. Similarly, when the connection is subsequently disconnected, mechanical force F occurs along the same chain in reverse order and direction.

[0186] Therefore, in order to achieve the goal of high robustness and long lifespan of the CCU 105 and its components, it is crucial to minimize these forces and keep them below an acceptable threshold. Specifically, the focus is on keeping the mechanical stress on the press-fit connection 1100 between the connector 610 and its corresponding associated circuit board, as well as the stress on the circuit board itself, below this threshold.

[0187] Several measures can be used to achieve this goal, including methods to transmit this force directly from the first connector 1110 to the module housing 1140, while avoiding or minimizing the transmission of this force from the first connector 1110 to the first circuit board 1105. The same applies to the relationship between the second connectors 920, 925 and the second circuit board 915 and the connection device 130 housing 600 (if present) or rack 905. This will be discussed further below. Figures 21 to 23 Explain various variations 1800, 1900, and 2000 used to implement this method. Furthermore, by avoiding a direct mechanical connection between the first circuit board 1105 and the module housing 1140, and by placing the first circuit board on an elastic material within the module housing 1140, such as rubber (e.g., a rubber pad or buffer), this material acts as an intermediary layer and damping device between the first circuit board 1105 and the module housing 1140 (other intermediary elements may also be present).

[0188] Now for reference Figure 21 The first variant 1800 includes a direct attachment of the first connector 1110 to the module housing 1140. For example, this attachment may include a bolted connection or a clamping connection. Figure 21In a specific example, the first connector 1110 has an extended, integral housing structure 605 with flanges 1805 at each side end along its main extension direction. Each flange 1805 has a flange hole 1810 for establishing a bolted connection to a module housing 1140, which has a corresponding housing hole 1815 to allow the bolted connection, wherein each bolt extends through the associated flange hole 1810 and the mating housing hole 1815. In this way, any mechanical force F acting on the connector 610 can be directly transmitted to the module housing 1140 and vice versa, without adversely affecting the connection (particularly the press-fit connection 1100) between the first connector 1110 and the first circuit board 1105. Therefore, the transmission of force does not involve the first circuit board 1105 at least substantially, providing effective protection against potential deformation. Specifically, this thus eliminates the need for any additional mechanical fastening connections between the first circuit board 1105 and the module housing 1140. This is particularly advantageous in enhancing the module’s robustness against thermomechanical stresses or other mechanical stresses that could otherwise occur in some instances if the first circuit board 1105 is fixed to the module housing at several different locations, causing tension, for example, due to bending caused by temperature changes.

[0189] Now for reference Figure 22 The second variant 1900 includes an indirect attachment of the first connector 1110 to the module housing 1140. Specifically, the first circuit board 1105 includes one or more first mechanical coupling elements 1905 (e.g., "L"-shaped brackets) mounted on the first circuit board 1105 (e.g., at its edges). The first connector 1110 includes a mating first additional mechanical coupling element for each bracket, such as an internal thread 1910 in the first connector 1110. Screws are provided for interacting with the internal thread 1910 to secure the first connector 1110 to the bracket and the module housing 1140, thereby achieving a strong mechanical connection.

[0190] The first circuit board 1105 is then mounted to the module housing 1140 via a bracket using screws or bolts (e.g., using housing holes 1815 and corresponding bracket holes 1125). In this way, a transmission chain exists to transfer any mechanical force F acting on the first connector 1110 or the module housing 1140 to each other, while protecting the connection between the first connector 1110 and the first circuit board 1105 (especially the press-fit connection 1100) from the otherwise adverse effects (i.e., mechanical stress) caused by such force.

[0191] The transmission chain includes: transmitting the force acting on the first connector 1110 to the bracket, from the bracket to the first circuit board 1105, and from the first circuit board 1105 to the module housing 1140. The connection between the first connector 1110 and the bracket establishes at least a partial bypass for the force around the press-fit connection 1100, which alleviates mechanical stress on the press-fit connection 1100. Furthermore, one or more (preferably all) electrical pins 1115 in the first connector 1110 relating to the connection to the first circuit board 1105 can be implemented as flexible pins 1115, thereby further reducing mechanical stress on the press-fit connection 1100 relating to these pins 1115. Additionally, the connection between the bracket and the module housing 1140 may optionally include additional fastening devices, such as bolts, screws, or other fasteners (not shown). If the connection between the bracket and the first connector 1110 is designed such that they resist rotation of the first connector 1110 relative to the first circuit board 1105 (e.g., in… Figure 20 In the case shown, where the notch on the first connector 1110 and the mating bracket on the first circuit board 1105 are in this condition, the orientation of the first connector 1110 relative to the first circuit board 1105 is essentially maintained even under strong vibration.

[0192] Finally, refer to Figure 23 The third variant 2000 includes a further indirect attachment of the first connector 1110 to the module housing 1140. Specifically, the first connector 1110 is directly attached to the first circuit board 1105 via fasteners (such as bolts or screws). Additionally, one or more additional pins 2005 may be present, designed to mate with cavities or vias 2010 in the first circuit board 1105 to mechanically reinforce the press-fit connection 1100 between the first connector 1110 and the first circuit board 1105. In this way, at least a majority of the force can bypass the press-fit connection 1100 and instead be transmitted directly to the first circuit board 1105 via the fasteners and (if present) the additional pins 2005, and from there to the first modules 115, 120, 125, 135. Furthermore, two or all of the above three variants may be combined. One or more additional pins 2005 may specifically coincide with one or more corresponding pins 1130, as referenced above. Figure 15 The discussion.

[0193] In general, the CCU 105 according to this solution includes a passive connection device 130, which means that there are no active signal improvement devices (such as signal retimers, amplifiers, etc.) on the connection device 130. To achieve high signal integrity under a wide range of operating conditions, especially at RF signal frequencies, this paper proposes various measures and components to protect or enhance signal integrity. These measures and / or components can be used individually or in combination of two or more of them.

[0194] While at least one exemplary embodiment of the present solution has been described above, it should be noted that numerous variations exist. Furthermore, it should be understood that the exemplary embodiments described are merely non-limiting examples of how the present solution can be implemented and are not intended to limit the scope, application, or configuration of the apparatus and methods described herein. Rather, the foregoing description will provide those skilled in the art with constructive options for implementing at least one exemplary embodiment of the present solution, wherein it should be understood that various changes may be made to the functionality and arrangement of elements of the exemplary embodiments without departing from the subject matter defined by the appended claims.

[0195] List of reference numerals 100 First block diagram 105 CCU Exemplary modules of CCU 105a-f 110 Computer Module Cluster 115 Main Computing Module 115a First Computational Entity (CE) 115a-1 First instance of the first primary CE 115a-2 Second instance of the first master CE 115b Second Computational Entity 115b-1 First instance of the second main CE 115b-2 Second instance of the second main CE 115c Other CE 115d Resource Coordination Function 115e Safety Management System 115f Central Fault Management System 115g of its own single FMS, iFMS 120 General-purpose computing module 120a Independent CE 120b with CE marking 120c Single Fault Management System 125 Special Module 125a Special CE 125b communication interface 125c Special Single Fault Management System 130 Connecting device 135 Service Module 140 First Endpoint Cluster 145 Second Endpoint Cluster 150 Third-Endpoint Cluster 155 Fourth Endpoint Cluster 160 intermediate wireless transceiver 170 First pair 170a,b 170b Second pair 200 Second Frame Diagram 201 Redundancy Concept 205 Computational Task Coordination Domain 210 Control and Coordination Domain 215 Architecture Power Coordination Domain 220 power supply domain 225a First Switching Architecture 225a-1 First Instance of the First Switching Architecture 225a-2 Second instance of the first switching architecture 225b Second Switching Architecture 225b-1 First Instance of the Second Switching Architecture 225b-2 Second instance of the second switching architecture 225c Third Switching Architecture 230a,b First safety function 235a,b Second safety function 240a First Main Power Source 240b Second Main Power Source 240c Emergency Power Source 245a,b Current limiters 250a,b First Voltage Generation Unit 255a,b Second Voltage Generation Unit 260a,b controller 265a,b Monitoring Unit 270a First Configuration Switch 270a,b Configuration Switch 300-layer PCIe communication scheme 305 First Central Processing Unit (CPU) 305a First Management Function 305b First Processing Function 305c First PCIe Root Complex 310 Second CPU 310a Second Management Function 310b Second Processing Function 310c Second PCIe Root Complex 315 First PCIe Root Port 320 Second PCIe Root Port 325 PCIe Switch 330 endpoint 335 CPU Inter-CPU Communication Link 400-compatible PCIe communication solution 405a Management Functions 405b processing functions 405c First PCIe Single-Pipe Complex 405d PCIe root port 410a Further management functions 410b Further processing capabilities 410c Second PCIe Single-Pipe Complex 410d Further root port 415a corresponds to the first PCIe switch 415a,b hierarchical PCIe switches 415b corresponds to the second PCIe switch 415d Resource Coordination System Block 420a,b First Non-Transparent PCIe Bridge (NTB) 425a,b Second Non-Transparent PCIe Bridge (NTB) 430 PCIe endpoints 430-1 First Selected PCIe Endpoint 430-2 Second Selected PCIe Endpoint 435 First Communication Path 440 Second Communication Path 445 Third Communication Path 500 Third Box Diagram 505 Transfer Bridge 510 Ethernet Switch 515 Endpoint Cluster 600 housing 605 Shell Structure 610 connector 700 Computing Platform 710 Cluster Hub 715 Actuator 720 sensor 725 High-speed communication link 730 signal connection 735 First Interface Unit 740 First Computational Layer 745 Second Structural Unit 750 Third Computational Layer 800 vehicles 805 First Position 810 Second position 815 Third position 900 Housing Example 905 rack 905a compartment 910 Heat transfer element 915 Second Circuit Board 920 Power Connector 921 Second Connector 925 signal connector 930 guide column 935 Second fixing screw 935a Fastening Lug 940 First fixing screw 945 Third fixing screw 950 opening 1000 Standard Hierarchical Structure 1005 motherboard 1010 Dedicated Connector 1015 Hardware Module 1020 Communication Path 1100 Press-fit Connector 1105 First Circuit Board 1110 First Connector 1111 Matching Signal Connector 1112 Matching Power Connector 1115 pin 1115a First End 1120 wall layer 1125 holes 1130 Additional Pins 1135 Distance element 1140 Module Housing 1200 Pin Layout Scheme 1205 signal pin 1210 Ground Pin 1300 layered structure 1305 wiring 1310 Hollow Structure 1315 Conductive Layer 1320 solder pad 1400 via 1500 First Equivalent Circuit Diagram 1600 Second Equivalent Circuit Diagram Overview of 1700 Selected Components 1800 First Variation 1805 flange 1810 Flange Hole 1815 Casing Hole 1900 Second variant 1905 First Mechanical Coupling Element 1910 First Additional Mechanical Coupling Element 2000 Third Variation 2005 Additional Pins 2010 plate holes C' trace trace capacitors C via Through-hole capacitor d1 Axial dimension d2 Remaining depth F Mechanical force G' trace conductivity of dielectric GND shielding layer HDL thermal distribution layer HSS is a layer used for transmitting high-speed signals. L' trace wiring inductor LSS is a layer used for transmitting low-speed signals. L via Through-hole inductor PWR power R' trace trace resistance Distance between x1 and x4 Z trace Trace impedance.

Claims

1. A central computing unit (CCU) (105) configured for use in a vehicle (800), such as an automobile, to centrally control various functions of the vehicle (800), the CCU (105) comprising: Shell structure (605); A plurality of electronic modules (115, 120, 125, 135) are housed (600) by the housing structure (605), comprising a first module (115, 120, 125, 135) and at least one second module (115, 120, 125, 135), the modules individually or collectively defining at least one computing function of the CCU (105); and A passive connection device (130) is used to indirectly connect one or more of the first module (115, 120, 125, 135) and the second module (115, 120, 125, 135) to provide one or more gainless signal paths and / or gainless power (PWR) connections between the first module (115, 120, 125, 135) and the second module (115, 120, 125, 135); Each of the modules (115, 120, 125, 135) includes at least one corresponding first connector (1110), and the connection device (130) includes a corresponding second connector (920, 925) mating with each first connector (1110) to establish a detachable power connection and / or a detachable signal connection between the respective module (115, 120, 125, 135) and the connection device (130) via the mating first and second connectors (920, 925) (1400).

2. The CCU (105) according to claim 1, wherein for at least one module (115, 120, 125, 135), at least one of its first connector (1110) and second connector (920, 925) is a press-fit connector (1100) type, the connector having one or more pins (1115) for establishing the power connection and / or signal connection, and for correspondingly mechanically mounting the at least one connector (610) to a first circuit board (1105) of the module (115, 120, 125, 135) or a second circuit board (915) of the connection device (130), such circuit board including the connector (610).

3. The CCU (105) according to claim 2, wherein at least one of the first connectors (1110) is a press-fit connector (1100) type, and further includes at least one additional pin (2005) for mechanically reinforcing the press-fit connection (1100) between the first connector (1110) and the first circuit board (1105) of the first module (115, 120, 125, 135) to which it belongs.

4. The CCU (105) according to claim 2 or 3, wherein: The connecting device (130) includes the second circuit board (915); and At least one of the second connectors (920, 925) is a press-fit connector (1100) type, and further includes at least one additional pin (2005) for mechanically reinforcing the press-fit connection (1100) between the second connector (920, 925) and the second circuit board (915) of the connection device (130).

5. The CCU (105) according to claim 3 or 4, wherein the additional pins (2005) of at least one first connector or second connector (920, 925) are respectively composed of or made of polymer material.

6. The CCU (105) according to any one of claims 2 to 5, wherein: At least one first connector (1110) further includes a first additional mechanical coupling element (1910) for further enhancing the mechanical coupling between the first connector (1110) and the first circuit board (1105) of the module (115, 120, 125, 135); and / or At least one second connector (920, 925) further includes a second additional mechanical coupling element for further enhancing the mechanical coupling between the second connector (920, 925) and the second circuit board (915) of the connection device (130).

7. The CCU (105) according to claim 6, wherein at least one of the first additional mechanical coupling element and the second additional mechanical coupling element comprises one or more of the following: a frame structure, screws or other fasteners.

8. The CCU (105) according to any one of the preceding claims, wherein one or more of the circuit board of the module (115, 120, 125, 135), the substrate material of the circuit board of the connecting device (130), the first connector (1110), and the second connector (920, 925) comprise a material having one or more of the following properties: - At a frequency of 10 GHz, the relative static permittivity R r , of which r ≤3.5; - At a frequency of 10 GHz, the load loss factor LLF, where LLF≤0.005, preferably LLF≤0.0035; - Hydrophobic.

9. The CCU (105) according to any one of claims 2 to 8, wherein the corresponding first circuit board (1105) of at least one first module (115, 120, 125, 135) includes a layered structure (1300) comprising a plurality of stacked layers, which includes at least one electrically conductive shielding layer (GND).

10. The CCU (105) according to claim 9, wherein the plurality of layers comprises: A signal layer, comprising one or more electrically conductive traces (1305) for transmitting electrical signals, each trace (1305) being electrically connected to a corresponding first connector (1110) of a corresponding first module (115, 120, 125, 135); and Two electrically conductive shielding layers (GND); Within the layered structure (1300), a layer including one or more electrically conductive traces (1305) is arranged between two shielding layers (GND).

11. The CCU (105) according to claim 9 or 10, wherein at least one of the shielding layers (GND) is configured to be electrically connected to a voltage source of the CCU (105), the voltage source being configured to automatically adjust the potential of the shielding layer (GND) according to a determined amount characterizing interlayer energy loss within the layered structure (1300) during operation of the CCU (105).

12. The CCU (105) according to any one of claims 9 to 11, wherein the plurality of layers includes a heat distribution layer (HDL) for distributing heat across at least a portion of the first circuit board (1105) of the respective first modules (115, 120, 125, 135), the heat distribution layer (HDL) including a thermal conductivity k, wherein k ≥ 50 W / (m·K).

13. The CCU (105) according to claim 12, wherein the heat distribution layer (HDL) is electrically connected to the electrical ground of the CCU (105) and coincides with one of the electrical conductive shielding layers (GND).

14. The CCU (105) according to any one of claims 9 to 13, wherein: The layered structure includes one or more vias for electrically connecting different electrically conductive layers within the layered structure; The via extends through the conductive layer of the layered structure without establishing an electrical connection with it; and An anti-solder pad is defined within the conductive layer to provide electrical isolation between the via and the conductive layer.

15. The CCU (105) according to any one of claims 2 to 13, wherein at least two adjacent traces (1305) for transmitting RF signals on a respective first circuit board (1105) of at least one first module (115, 120, 125, 135) are arranged such that, at a frequency of 10 GHz, the load loss factor LLF of at least one of the adjacent traces (1305) satisfies the condition: LLF ≤ 0.005, preferably LLF ≤ 0.0035.

16. The CCU (105) according to any one of the preceding claims, wherein: At least one of the first connectors (1110) and each of its corresponding mating second connectors (920, 925) is a multi-signal connector (610), comprising a plurality of electrically isolated electrical conductors for establishing a plurality of individual electrical signal connections between the corresponding first connector (1110) and its corresponding mating second connector (920, 925) when the corresponding connectors are interconnected; and In each of the at least one first connector (1110) and its corresponding mating second connector (920, 925), the geometric arrangement of the electrical conductors is designed such that all pairs of electrical conductors for simultaneously transmitting RF signals to and / or from corresponding traces running adjacent to each other are arranged in one or more segments on the respective first or second circuit board in such a way that: The minimum distance between them is at least nine times the smaller value of their respective widths at the position of their minimum distance from each other, and / or It has shielding pins arranged therebetween.

17. The CCU (105) according to any one of the preceding claims, further comprising a power supply module (105b) for powering (PWR) one or more of a plurality of electronic modules (115, 120, 125, 135); The connection device (130) includes one or more power (PWR) traces (1305) for transmitting power (PWR) supplied by the power (PWR) supply to one or more modules (115, 120, 125, 135) for powering them (PWR).

18. The CCU (105) according to claim 16, wherein the power supply module (105b) is detachably connected to the connection device (130) to establish a releasable power (PWR) connection between the power supply module (105b) and the connection device (130).

19. The CCU (105) according to any of the preceding claims, wherein two or more of the electronic modules (115, 120, 125, 135) are replaceable modules (115, 120, 125, 135), each module being a hardware entity of the CCU (105) and individually insertable into and removed from the housing structure (605).

20. The CCU (105) according to any one of the preceding claims, wherein the CCU (105) is configured to control at least two of the following functions of the vehicle (800) at least partially based on one or more software processes running on the CCU (105): - Dashboard; - air conditioner; - Vehicle (800) lighting; - Windshield wipers or other windshield cleaning functions; - Vehicle interior lighting; - In-vehicle infotainment system; - Vehicle (800) doors; - Powertrain; - Navigation; - Driver assistance; - Autonomous driving; - Cockpit monitoring; - Battery control.

21. The CCU (105) according to any one of the preceding claims, wherein, The CCU(105) includes: A distributed computing system (DCS) comprising multiple co-located, autonomous computing entities (CEs) (115a, 120a-b, 125a), each of which has its own single memory, wherein each of the CEs (115a, 120a-b, 125a) is disposed within a corresponding one of the electronic modules and is configured to communicate with each other via message passing through one or more communication networks including the connection device (130) to coordinate the allocation of computing tasks to be performed by the DCS as a whole among them; A communication switch comprising multiple independent switching architectures (225a, 225b), each switching architecture being configured to variably connect a subgroup of CEs (115a, 120a-b, 125a) of the DCS or each CE to one or more of a plurality of interfaces for exchanging information with external communication nodes (140, ..., 155) of the CCU of the vehicle (800) via such interfaces; and A power (PWR) supply system comprising a plurality of power (PWR) supply subsystems for simultaneous operation, each power supply subsystem being capable of individually and independently supplying power (PWR) to at least two of the DCS and the switching architectures (225a, 225b). At least one of the CEs (115a, 120a-b, 125a), the switching architecture (225a, 225b), and the power (PWR) supply subsystem is arranged as a functional unit of the CCU (105), either alone or together with other functional units of the CCU (105), in one of the first modules (115, 120, 125, 135) or the second module (115, 120, 125, 135).

22. A vehicle (1200), such as an automobile, comprising a CCU (105) according to any one of the preceding claims for centralized control of various functions of the vehicle (800).

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