Intelligent factory double-mode switchable chip removal system and chip removal control method

Abstract

The application relates to a double-mode switchable chip removal system and a chip removal control method for a smart factory, and the chip removal system comprises a material conveying mechanism, a crushing treatment mechanism, a double-mode chip removal switching mechanism and a power driving mechanism; the material conveying mechanism is used for receiving and conveying the chips generated in machine tool processing; the crushing treatment mechanism is arranged at the output end of the material conveying mechanism and is used for receiving the chips conveyed by the material conveying mechanism and crushing the chips; the double-mode chip removal switching mechanism is arranged at the output end of the crushing treatment mechanism and is used for receiving the chips crushed by the crushing treatment mechanism and switching the chip removal path; and the power driving mechanism is electrically connected with the material conveying mechanism, the crushing treatment mechanism and the double-mode chip removal switching mechanism and is used for providing power; the application realizes efficient and stable chip removal, and improves the reliability and economy of chip removal treatment in the smart factory.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of smart factories, and in particular to a smart factory dual-mode switchable chip removal system and a chip removal control method. BACKGROUND

[0002] With the increasing development trend of intelligent manufacturing, many manufacturers increase their production capacity and improve processing efficiency by introducing a large number of intelligent equipment, and some advanced factories have installed a whole-plant centralized chip removal + liquid supply system to realize whole-process automation and intelligent production, but at the same time, new pain points are also particularly prominent. At present, the traditional machine tool chip removal mode on the market generally adopts a single machine independent chip removal mode. The specific implementation mode is: a set of chip removal device is configured for each machine tool, and the iron chips generated in the processing process are transported to the chip receiving vehicle by the chain plate conveyor belt. The working process of this mode depends on mechanical transmission, that is, the iron chips are continuously transported by the chain plate conveyor belt, and finally the waste in the chip receiving vehicle is manually handled.

[0003] However, this mode exposes many deficiencies in the application of the centralized chip removal system of the smart lighthouse factory. First, long iron chips generated in the machine tool processing process, such as spiral or winding chips, are easy to be stuck in the gap of the chain plate conveyor belt, causing residual accumulation and further affecting the chip removal efficiency. In addition, once the chain plate conveyor belt, chip removal machine or centralized chip removal system fails, it needs to be stopped for maintenance, which seriously affects the production efficiency and the operating cost of the enterprise.

[0004] At the same time, the traditional chip removal system also has the problem of non-recovery of cooling liquid. The cooling liquid attached to the surface of the iron chips cannot be effectively recovered during the discharge process, not only causing waste of resources, but also possibly causing environmental pollution. At the same time, during the process of manual chip removal and maintenance, or during the processing process, the spilling and splashing of iron chips may cause workers to slip or be scratched, and the lack of emergency handling mechanism when the equipment fails further aggravates the safety risk. The chip receiving vehicle needs to be manually pushed to the designated area for dumping after being filled, and iron chips may spill during the process, not only wasting resources, but also possibly causing environmental pollution.

[0005] Therefore, there is an urgent need for a smart factory dual-mode switchable chip removal system and a chip removal control method. SUMMARY

[0006] (I) Technical problems to be solved

[0007] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present application provides a smart factory dual-mode switchable chip removal system and a chip removal control method, which solves the technical problems of low efficiency, large loss of downtime, waste of resources and safety hazards caused by iron chip jamming, lack of emergency mechanism, non-recovery of cooling liquid and frequent manual intervention in the existing traditional single machine chip removal mode.

[0008] (II) Technical Solution

[0009] To achieve the above object, the main technical scheme adopted by the present application comprises:

[0010] In a first aspect, the present application provides a double-mode switchable chip removal system for intelligent factory, comprising:

[0011] a material conveying mechanism, a crushing treatment mechanism, a double-mode chip removal switching mechanism, and a power driving mechanism;

[0012] The material conveying mechanism is configured to receive and convey the chips generated by machine tool processing. The crushing treatment mechanism is arranged at the output end of the material conveying mechanism and configured to receive the chips conveyed by the material conveying mechanism and crush them. The double-mode chip removal switching mechanism is arranged at the output end of the crushing treatment mechanism and configured to receive the chips crushed by the crushing treatment mechanism and switch the chip removal path. The power driving mechanism is electrically connected to the material conveying mechanism, the crushing treatment mechanism, and the double-mode chip removal switching mechanism and configured to provide power.

[0013] The double-mode chip removal switching mechanism comprises a flow splitting member, a guide member, a positioning member, and a sensor member.

[0014] The flow splitting member is internally provided with a flow splitting passage and at least two outlets respectively connected to the centralized chip removal pipeline and the emergency chip removal pipeline. The guide member is arranged in the flow splitting passage and fixedly connected to the output end of the power driving mechanism. The positioning member is arranged at the connecting position of the guide member. The sensor member is arranged in the flow splitting member.

[0015] Optionally, in some embodiments of the present application, the positioning member comprises two positioning pins and corresponding two positioning holes. The positioning pins are arranged at the rotating shaft end of the guide member, and the positioning holes are arranged in the interior of the flow splitting member. The gap between the positioning pin and the positioning hole is ≤0.1 mm. The positioning pin is inserted into different positioning holes to lock and fix the guide member.

[0016] Optionally, in some embodiments of the present application, the crushing treatment mechanism comprises:

[0017] a crushing cutter assembly, a gap adjusting assembly, a load detecting assembly, and a feeding auxiliary assembly.

[0018] The crushing cutter assembly comprises coarse crushing cutters and fine crushing cutters arranged in sequence along the chip conveying direction and configured to grade and crush the chips. The gap adjusting assembly is mechanically connected to the crushing cutter assembly to adjust the cutter gap. The feeding auxiliary assembly and the load detecting device are arranged at the input end of the crushing treatment mechanism and electrically connected to the power driving mechanism.

[0019] Optionally, in some embodiments of the present application, the rough cutting tool is a tooth-shaped cutter head, and the fine cutting tool is a straight blade cutter, and the rough cutting tool and the fine cutting tool are arranged in parallel and radially staggered.

[0020] Optionally, in some embodiments of the present application, the material conveying mechanism comprises:

[0021] a first conveying assembly, a anti-stagnation cleaning assembly, and a cooling liquid recovery assembly.

[0022] The conveying assembly is in transmission connection with the power driving mechanism to drive the first conveying assembly to operate; the cooling liquid recovery assembly comprises a second conveying assembly, a flow guide channel, a filtering device, a backwashing device, and a liquid storage device.

[0023] The second conveying assembly is fixedly connected with the first conveying assembly to form a conveying loop; an input end of the flow guide channel is connected with the second conveying assembly, and an output end thereof is connected with the liquid storage device; the filtering device and the backwashing device are arranged in the flow guide channel.

[0024] The anti-stagnation cleaning assembly is arranged on both sides of the first conveying assembly and the second conveying assembly to remove the accumulated debris on the surfaces of the first conveying assembly and the second conveying assembly.

[0025] Optionally, in some embodiments of the present application, the debris removal system further comprises:

[0026] a safety protection mechanism.

[0027] The safety protection mechanism comprises a protection shell, an emergency stop device, and a splash-proof device.

[0028] The protection shell is respectively arranged on the material conveying mechanism and the crushing treatment mechanism; the emergency stop device is electrically connected with the power driving mechanism, and the splash-proof device is arranged at a turning position of the centralized debris removal pipeline and the emergency debris removal pipeline.

[0029] In a second aspect, embodiments of the present application provide a double-mode switchable debris removal control method for a smart factory, comprising:

[0030] S1, monitoring a working state of a centralized debris removal pipeline in real time to obtain multi-dimensional time sequence state parameters.

[0031] The multi-dimensional time sequence state parameters comprise a pressure value, a flow value, and a blockage coefficient.

[0032] S2. Based on the multi-dimensional time-series state parameters, the health score of the centralized chip removal pipeline is obtained through a dual-mode switching decision model; the dual-mode switching decision model is a multi-scale attention map neural network algorithm with physical rules embedded.

[0033] S3. Based on the health score and the pre-set switching rules, switch the chip removal pipe.

[0034] Optionally, in some embodiments of this application, S2 includes:

[0035] The multi-dimensional time-series state parameters are input into the dual-mode switching decision model to obtain the health score of the centralized chip removal pipeline. The dual-mode switching decision model includes:

[0036] The physical rule embedding module is used to establish correlation parameters of multi-dimensional time-series state parameters based on debris-fluid two-phase flow theory, and to transform the multi-dimensional time-series state parameters into correlation parameters that conform to physical laws.

[0037] The multi-scale temporal feature extraction module is used to perform temporal feature analysis on the correlation parameters that conform to physical laws. It uses a variable step-size sliding window to extract the temporal features of pressure and flow values, and performs empirical mode decomposition on the blockage coefficient to obtain the proportion of intrinsic mode energy, and outputs a multi-scale temporal feature vector.

[0038] The graph attention network module is used to fuse the pipeline spatial structure with the multi-scale temporal feature vector to model the pipeline, divide the pipeline into inlet, elbow, straight pipe and outlet nodes and construct a topology graph, strengthen the feature weight of fault-sensitive areas through self-attention mechanism, and output the weighted node feature matrix.

[0039] The feature fusion and scoring output module is used to integrate the correlation parameters of the node feature matrix and the physical rule embedding module, perform feature weighted fusion through a gated loop unit, map the results to a health score of 0-100 through an activation function, and output the health score.

[0040] Optionally, in some embodiments of this application, S3 includes:

[0041] When the health score is greater than or equal to 85, maintain the concentrated anti-dumping pathway for anti-dumping.

[0042] When the health score is greater than or equal to 70 points and less than 85 points, maintain the centralized chip removal path and reduce the conveying speed by 20%.

[0043] When the health score is less than 70, switch to emergency chip removal pipeline.

[0044] Optionally, in some embodiments of this application, the method further includes:

[0045] After switching to the emergency chip removal pipeline, steps S1 to S3 are re-executed at fixed time intervals. When the health score of three consecutive time intervals is greater than or equal to 85 points, the system switches to the centralized chip removal path and synchronously restores the conveying speed to the initial value.

[0046] (III) Beneficial Effects

[0047] The beneficial effects of this application are as follows: The dual-mode switchable chip removal system and control method for smart factories proposed in this application, due to the integrated structural design of material conveying, graded crushing, dual-mode switching, and intelligent detection, can achieve efficient chip handling, intelligent switching of chip removal channels, resource recycling and safety protection compared with the prior art, thus achieving the technical effect of improving the reliability, economy and intelligence level of chip removal.

[0048] Furthermore, the dual-mode switchable chip removal system and control method for smart factories in this application, due to the adoption of an intelligent decision-making mechanism with multi-dimensional parameter monitoring and multi-scale feature extraction, coupled with a precisely positioned switching mechanism and graded crushing components, can accurately determine the short-circuit state and achieve smooth switching compared to existing technologies, while improving the chip handling efficiency, thus achieving a stable and controllable chip removal process that meets the production needs of smart factories. Attached Figure Description

[0049] Figure 1 This is a front view of the structure of a smart factory dual-mode switchable chip removal system according to an embodiment of this application;

[0050] Figure 2 This is a structural side view of a smart factory dual-mode switchable chip removal system according to an embodiment of this application;

[0051] Figure 3 This is a flowchart illustrating a dual-mode switchable chip removal control method for a smart factory according to an embodiment of this application.

[0052] [Explanation of Labels in the Attached Image]

[0053] 1: Material conveying mechanism;

[0054] 2: Crushing and processing mechanism;

[0055] 3: Dual-mode chip removal switching mechanism. Detailed Implementation

[0056] To better explain and facilitate understanding of this application, the following detailed description of the application is provided in conjunction with the accompanying drawings and specific embodiments.

[0057] In the large-scale production scenarios of smart factories, machine tool processing often involves the collaborative operation of multiple processes such as turning, milling, planing, and grinding. The resulting metal chips are not only diverse in type and shape, but also often contain a large amount of coolant due to cooling and lubrication requirements. This places far more stringent demands on the continuity, processing efficiency, and adaptability of the chip removal system than in traditional factories. Currently, mainstream chip removal equipment suffers from three major pain points: First, the problem of simplistic path design is prominent. Most systems rely solely on centralized chip removal pipelines for unified collection. However, during peak machine tool operation, the chip emission volume increases sharply, easily forming a "chip congestion zone" in the pipeline. Once a blockage, pressure surge, or pipeline rupture occurs, the entire production line must be suspended for maintenance. A single downtime can result in losses of tens of thousands of yuan, severely restricting production cycle time. Second, there is a lack of chip handling and resource recycling mechanisms. Some equipment does not pre-treat the chips, and large, rolled chips easily become entangled after entering the pipeline. The blockage of conveying components, coupled with the direct discharge of coolant along with debris, not only wastes thousands of yuan worth of coolant resources per ton, but also requires additional environmental treatment costs due to the presence of oil, metal particles, and other pollutants in the coolant, which is inconsistent with the green production concept of smart factories. Thirdly, the status monitoring and intelligent operation and maintenance are insufficient. Traditional systems mostly monitor pipeline status through a single pressure sensor or flow meter, which makes it difficult to detect progressive fault precursors such as debris accumulation and pipeline wear. The fault prediction accuracy is often less than 60%, resulting in delayed path switching and further expanding the scope of fault impact.

[0058] With the upgrading of intelligent manufacturing technology, smart factories have increasingly strong demands for "zero downtime", "high recycling" and "predictability" in the production process. Existing chip removal systems can no longer meet the development requirements of flexible production and efficient operation and maintenance.

[0059] Therefore, the smart factory dual-mode switchable chip removal system and control method proposed in this application adopts an integrated design of "conveying-crushing-switching-control", combined with graded crushing tool assembly, dual-mode chip removal switching mechanism, coolant recovery structure, safety protection mechanism, and intelligent decision-making model embedded with physical rules, to achieve the technical effect of improving the intelligence level, operational reliability and resource utilization economy of the chip removal system.

[0060] To better understand the above technical solutions, exemplary embodiments of this application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application can be understood more clearly and thoroughly, and that the scope of this application can be fully conveyed to those skilled in the art.

[0061] Example 1

[0062] Figure 1This is a front view of a smart factory dual-mode switchable chip removal system according to an embodiment of this application. Figure 2 This is a side view of a smart factory dual-mode switchable chip removal system according to an embodiment of this application, as shown. Figure 1 and Figure 2 As shown, the chip removal system includes:

[0063] Material conveying mechanism 1, crushing and processing mechanism 2, dual-mode chip removal switching mechanism 3, and power drive mechanism;

[0064] Material conveying mechanism 1 is used to receive and convey the chips generated by machine tool processing. Crushing and processing mechanism 2 is set at the output end of material conveying mechanism 1 and is used to receive the chips conveyed by material conveying mechanism 1 and crush them. Dual-mode chip discharge switching mechanism 3 is set at the output end of crushing and processing mechanism 2 and is used to receive the crushed chips from crushing and processing mechanism 2 and switch the chip discharge path. Power drive mechanism is electrically connected to material conveying mechanism 1, crushing and processing mechanism 2 and dual-mode chip discharge switching mechanism 3 and is used to provide power.

[0065] The dual-mode chip removal switching mechanism 3 includes a flow diversion component, a guide component, a positioning component, and a sensor component;

[0066] The diversion component has a diversion channel inside and at least two outlets that connect to the centralized chip removal pipeline and the emergency chip collection pipeline respectively; the guide component is set inside the diversion channel and is fixedly connected to the output end of the power drive mechanism; the positioning component is set at the connection between the guide component and the power drive mechanism; and the sensor component is set inside the diversion component.

[0067] In the specific implementation process, the guiding component is a stainless steel guide baffle, which is driven by a cylinder. Under normal working conditions, the stainless steel guide baffle guides the chips into the centralized chip removal pipe, realizing centralized processing of multiple machine tools in the workshop; when a blockage or malfunction is detected in the centralized chip removal pipe, the baffle deflection mechanism is triggered, causing the chips to be diverted and fall into the machine tool's own stress chip collection cart.

[0068] In addition, the sensor component consists of three sets of sensors with different functions, forming a comprehensive status monitoring network. First, an infrared beam sensor is installed at the input end of the diversion component to detect the flow rate of debris, providing early warning of path load when the flow rate suddenly increases. Second, pressure sensors are installed at the two outlet ends to monitor pressure changes in the corresponding pipelines in real time, providing data support for judging the health status of the path. Third, an angle encoder with an accuracy of 0.1° is installed at the end of the rotating shaft of the guide component, providing real-time feedback on the rotation angle and final position of the guide component, ensuring precise switching actions. Data from all sensors is transmitted to the system controller via a bus, linking with the dual-mode switching decision model to provide real-time basis for path switching.

[0069] In this embodiment, the positioning component includes two positioning pins and two corresponding positioning holes; the positioning pins are located at the end of the rotating shaft of the guide component, the positioning holes are located inside the diversion component, the fitting clearance between the positioning pins and the positioning holes is ≤0.1mm, and the positioning pins are inserted into different positioning holes to lock and fix the guide component.

[0070] Specifically, the positioning pin is a cylindrical structure made of 40Cr alloy steel with a hardened surface, achieving a diameter accuracy of IT6. The positioning hole is located inside the bearing seat end cover of the diverter component, and the clearance between the positioning pin and the positioning pin is strictly controlled to ≤0.1mm to ensure positioning accuracy. When the guide component rotates to the corresponding passage position, the stepper motor triggers the pneumatic extension device of the positioning pin, precisely inserting the positioning pin into the corresponding positioning hole, thus mechanically locking the guide component. This positioning method effectively resists the impact force generated during debris conveying, prevents the guide component from shifting, and ensures stability after passage switching.

[0071] When it is determined that a path switching is required, the power drive mechanism first drives the positioning pin to pull out of the current positioning hole. Then, the stepper motor drives the guide component to rotate to the position corresponding to the emergency chip receiving pipeline. After the angle encoder confirms that the position is accurate, the positioning pin is inserted into the corresponding positioning hole to lock, realizing a fast and smooth switching of the chip removal path and ensuring the continuity of the chip removal process.

[0072] The dual-mode chip removal switching mechanism 3 in this embodiment adopts a stainless steel guide baffle combined with a cylinder-driven execution structure. It combines a high-precision positioning component with "double pins and double holes" with a three-set complementary sensor monitoring network. Under normal working conditions, it can achieve centralized conveying and guidance of chips. In the event of a pipeline failure, it can accurately divert to an emergency chip receiving vehicle through a rapid turning mechanism. Furthermore, through multi-dimensional monitoring of pressure, flow rate, and angle, as well as millimeter-level gap positioning and locking, it can ensure that the switching action is precise and stable, and the locking is firm and impact-resistant. This achieves the technical effect of improving the efficiency of chip removal path switching and ensuring the continuity of chip removal and operational stability.

[0073] Furthermore, the pulverizing and processing mechanism 2 includes:

[0074] Crushing blade assembly, gap adjustment assembly, load detection assembly, and feeding auxiliary assembly;

[0075] The crushing tool assembly includes coarse crushing tools and fine crushing tools arranged sequentially along the crushing conveying direction for classifying and crushing the crushing materials; the gap adjustment component is mechanically connected to the crushing tool assembly to adjust the tool gap; the feeding auxiliary component and the load detection device are located at the input end of the crushing processing mechanism 2 and are electrically connected to the power drive mechanism.

[0076] The coarse crushing tool is a toothed cutter head, and the fine crushing tool is a straight-edged tool. The axes of the coarse crushing tool and the fine crushing tool are parallel and arranged alternately in the radial direction.

[0077] In addition, the gap adjustment component adopts an automatic control structure of "sensor perception + servo drive", which can adjust the blade gap of the fine crushing tool in real time according to the material characteristics of the debris, so as to achieve precise matching of crushing force. Its core components include material recognition structure, servo adjustment structure and gap detection structure.

[0078] Specifically, the material identification structure is linked with the load detection component. The load detection component monitors the torque changes of the coarse crusher when processing chips. Different types of chips (e.g., steel chips with a torque of approximately 80-120 N·m, and aluminum chips with a torque of approximately 30-60 N·m) will form characteristic torque curves. The chip material is automatically identified by comparing the curves with a database. Simultaneously, an infrared spectral sensor at the input end can assist in detecting the surface composition of the chips, thus providing dual verification. The servo adjustment structure consists of a servo motor, a ball screw, and a guide rail. Once the chip material is identified, the motor drives the ball screw to rotate, causing the upper blade assembly of the fine crusher to move up and down along the guide rail, adjusting the cutting edge gap. When processing hard steel chips, the gap is adjusted to 0.5-1 mm to enhance crushing force; when processing softer aluminum and copper chips, the gap is adjusted to 2-3 mm to avoid over-crushing and energy waste. The positioning accuracy of the ball screw can reach 0.01 mm, ensuring the accuracy of the gap adjustment. The gap detection structure uses a laser displacement sensor to monitor the cutting edge spacing of the fine cutting tools in real time, forming a closed-loop control of "identification-adjustment-detection" to prevent gap deviation caused by mechanical wear.

[0079] Furthermore, the load detection component is located at the input end of the crushing and processing mechanism 2, and consists of a torque sensor, a current sensor and a material level sensor to monitor the load status in all aspects during the crushing process and ensure the safe operation of the equipment.

[0080] The feeding auxiliary component is a pressure rod structure installed at the collection port of the crushing and processing mechanism 2. It simulates the action of manually pushing and feeding chips through the reciprocating transmission of a cylinder, forcibly guiding the chips into the crushing area. It is especially suitable for rolled, flocculent, and other chips that are easy to bridge and difficult to transport. Its core components include a drive cylinder, a linkage pressure rod, a guide bracket, and a buffer pad layer.

[0081] In the specific implementation process, after the machine tool debris enters the hopper of the crusher collection port through the material conveying mechanism 1, the material level sensor monitors the debris accumulation height in real time. When the height reaches the set threshold, the pressure bar mechanism is activated: the drive cylinder drives the linkage pressure bar to reciprocate, continuously pushing the debris to the coarse crushing cutter area. The toothed cutter disc quickly crushes the large-sized debris into intermediate particles. At the same time, the load detection component monitors the torque of the coarse crushing cutter and the motor current in real time, and the material identification structure completes the material judgment of the debris based on the torque curve. The gap adjustment component automatically adjusts the gap of the fine crushing cutter according to the material data. After the intermediate particles enter the straight-blade cutter group, they are further crushed into fine particles. When the load detection component detects that the crushing load is too high, it immediately reduces the operating frequency of the pressure bar mechanism and the speed of the coarse crushing cutter to avoid jamming; when the load is too low, it increases the operating frequency to ensure that the debris enters the crushing area at a stable flow rate, forming a complete closed-loop operation of "forced feeding - graded crushing - intelligent control - safety protection", realizing the efficient adaptation and processing of various difficult-to-convey debris.

[0082] In this embodiment, the material conveying mechanism 1 includes:

[0083] The first conveying assembly, the anti-stagnation cleaning assembly, and the coolant recovery assembly;

[0084] The conveying assembly is connected to the power drive mechanism to drive the first conveying assembly to operate; the coolant recovery assembly includes: a second conveying assembly, a flow guide channel, a filter device, a backwashing device, and a liquid storage device;

[0085] The first conveying component adopts a scraper chain conveying structure, which is mainly responsible for receiving the debris generated by the machine tool and conveying it to the crushing and processing unit 2.

[0086] The second conveying component is fixedly connected to the first conveying component to form a conveying circuit; the input end of the guide channel is connected to the second conveying component, and the output end is connected to the liquid storage device; the filter device and the backwashing device are installed in the guide channel.

[0087] The anti-debris cleaning components are located on both sides of the first and second conveying components to remove debris stuck on the surfaces of the first and second conveying components. They remove debris stuck on the surface of the conveying components by mechanical scraping, avoiding cross-contamination and reduced conveying efficiency. They mainly include scraper cleaners.

[0088] Furthermore, the second conveying component adopts a mesh belt structure and is fixedly connected to the lower end of the first conveying component to form a "main conveying - secondary recycling" conveying loop. The guide channel is a sloping channel welded from stainless steel plates with a slope of 10-15° to ensure that the coolant can flow naturally by gravity.

[0089] In the specific implementation process, the filtration device adopts a three-stage filtration system, consisting of a magnetic filter, a paper filter, and a precision filter element.

[0090] In the specific implementation process, the debris generated by the machine tool, carrying coolant, falls into the conveying trough of the first conveying assembly. The scraper chain, driven by the drive sprocket, conveys the mixture forward. Along the way, some of the coolant flows into the second conveying assembly through the gap at the bottom of the trough under the influence of gravity. When the mixture reaches the end of the first conveying assembly, the debris falls into the crushing and processing mechanism 2, while the remaining coolant and fine debris fall into the mesh belt of the second conveying assembly. The coolant passes through the mesh and enters the guide channel, while the fine debris on the mesh belt is sent back to the first conveying assembly for reprocessing.

[0091] Furthermore, the chip removal system of this application also includes:

[0092] Security and protection agencies;

[0093] Safety protection mechanisms include: protective housing, emergency stop device, and splash guard;

[0094] The protective housings are respectively installed on the material conveying mechanism 1 and the crushing and processing mechanism 2; the emergency stop device is electrically connected to the power drive mechanism, and the splash protection device is installed at the junction of the centralized chip discharge pipeline and the emergency chip receiving pipeline.

[0095] The smart factory dual-mode switchable chip removal system of this application adopts a cylinder-driven guide baffle design to create a dual-mode switching mechanism, which can achieve seamless switching between centralized chip removal and emergency chip removal; in addition, combined with the graded crushing tool assembly, dual-mode chip removal switching mechanism 3, coolant recovery structure and safety protection mechanism, it fully ensures operational safety and environmental compliance.

[0096] Example 2

[0097] Figure 3 A dual-mode switchable chip removal control method for a smart factory, as exemplified by one embodiment of this application, includes:

[0098] Step S1: Monitor the working status of the centralized chip removal pipeline in real time and obtain multi-dimensional time-series status parameters;

[0099] Multi-dimensional time-series status parameters include: pressure value, flow rate value, and congestion coefficient;

[0100] Specifically, the pressure value is obtained through pressure sensors at the two outlet ends of the dual-mode chip removal switching mechanism's 3-way component, covering the inlet pressure of the centralized chip removal pipeline and the emergency chip receiving pipeline; the flow rate value is measured by an electromagnetic flowmeter to measure the instantaneous flow rate of the debris-fluid mixture in the centralized chip removal pipeline, and the flow rate calculation is corrected by combining the data from the infrared beam sensor at the input end of the way component; the blockage coefficient is calculated based on the correlation between pressure and flow rate, and the blockage coefficient = (initial pressure × real-time flow rate) / (real-time pressure × initial flow rate).

[0101] Step S2: Based on multi-dimensional time-series state parameters, obtain the health score of the centralized chip removal pipeline through a dual-mode switching decision model; the dual-mode switching decision model is a multi-scale attention map neural network algorithm with physical rules embedded.

[0102] Step S2 includes:

[0103] Multi-dimensional time-series state parameters are input into the dual-mode switching decision model to obtain the health score of the centralized chip removal pipeline. The dual-mode switching decision model includes:

[0104] The physical rule embedding module is used to establish the correlation parameters of multi-dimensional time-series state parameters based on the debris-fluid two-phase flow theory, and to transform the multi-dimensional time-series state parameters into correlation parameters that conform to physical laws.

[0105] The multi-scale time series feature extraction module is used to analyze the time series features of the correlation parameters that conform to physical laws. It uses a variable step-size sliding window to extract the time-domain features of pressure and flow values, and performs empirical mode decomposition on the blockage coefficient to obtain the proportion of intrinsic mode energy, and outputs a multi-scale time series feature vector.

[0106] The graph attention network module is used to fuse pipeline spatial structure with multi-scale temporal feature vectors for modeling. It divides the pipeline into inlet, elbow, straight pipe and outlet nodes and constructs a topology graph. It strengthens the feature weights of fault-sensitive areas through self-attention mechanism and outputs a weighted node feature matrix.

[0107] The feature fusion and scoring output module integrates the correlation parameters of the node feature matrix and the physical rule embedding module. It performs feature weighted fusion through a gated recurrent unit, maps the results to a health score of 0-100 through an activation function, and outputs the health score.

[0108] Step S3: Switch the chip removal pipe according to the health score and the pre-set switching rules.

[0109] Further, step S3 includes:

[0110] When the health score is greater than or equal to 85, maintain the concentrated anti-dumping pathway for anti-dumping.

[0111] When the health score is greater than or equal to 70 points and less than 85 points, maintain the centralized chip removal path and reduce the conveying speed by 20%.

[0112] When the health score is less than 70, switch to emergency chip removal pipeline.

[0113] The smart factory dual-mode switchable chip removal control method in this embodiment also includes:

[0114] After switching to the emergency chip removal pipeline, steps S1 to S3 are re-executed at fixed time intervals. When the health score of three consecutive time intervals is greater than or equal to 85 points, the system switches to the centralized chip removal path and synchronously restores the conveying speed to the initial value.

[0115] The dual-mode switchable chip removal control method in this embodiment of the smart factory adopts the path of "full-dimensional monitoring - physical fusion modeling - hierarchical intelligent control". It accurately predicts potential faults such as pipeline blockage and tool jamming through professional models. The dual-mode switching mechanism is linked by a three-level control strategy to achieve seamless connection and efficient reset of normal, early warning and emergency modes, ensuring continuous and stable chip removal process. It incorporates chip material recognition and dynamic load adaptation logic, and achieves energy saving and efficient resource recovery by accurately adjusting parameters such as tool gap and conveying speed. With multiple safety protection and environmental protection linkage mechanisms, it prevents equipment damage and safety accidents, meets environmental compliance requirements, and can adapt to multiple materials and shapes of chips and diverse production scenarios, comprehensively improving the operating efficiency, reliability and universality of the chip removal system.

[0116] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0117] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0118] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0119] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0120] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A dual-mode switchable chip removal control method for smart factories, characterized in that, The method is executed by a dual-mode switchable chip removal system in a smart factory. The chip removal system includes: a material conveying mechanism (1), a crushing and processing mechanism (2), a dual-mode chip removal switching mechanism (3), and a power drive mechanism. The dual-mode chip removal switching mechanism (3) includes a diversion component, a guiding component, a positioning component, and a sensor component. The method includes: S1. Real-time monitoring of the working status of centralized chip removal pipeline to obtain multi-dimensional time-series status parameters; The multi-dimensional time-series state parameters include: pressure value, flow rate value, and blockage coefficient; S2. Based on the multi-dimensional time-series state parameters, the health score of the centralized chip removal pipeline is obtained through a dual-mode switching decision model; the dual-mode switching decision model is a multi-scale attention map neural network algorithm with physical rules embedded. S2 includes: The multi-dimensional time-series state parameters are input into the dual-mode switching decision model to obtain the health score of the centralized chip removal pipeline. The dual-mode switching decision model includes: The physical rule embedding module is used to establish correlation parameters of multi-dimensional time-series state parameters based on debris-fluid two-phase flow theory, and to transform the multi-dimensional time-series state parameters into correlation parameters that conform to physical laws. The multi-scale temporal feature extraction module is used to perform temporal feature analysis on the correlation parameters that conform to physical laws. It uses a variable step-size sliding window to extract the temporal features of pressure and flow values, and performs empirical mode decomposition on the blockage coefficient to obtain the proportion of intrinsic mode energy, and outputs a multi-scale temporal feature vector. The graph attention network module is used to fuse the pipeline spatial structure with the multi-scale temporal feature vector to model the pipeline, divide the pipeline into inlet, elbow, straight pipe and outlet nodes and construct a topology graph, strengthen the feature weight of fault-sensitive areas through self-attention mechanism, and output the weighted node feature matrix. The feature fusion and scoring output module is used to integrate the correlation parameters of the node feature matrix and the physical rule embedding module, perform feature weighted fusion through a gated loop unit, map the results to a health score of 0-100 through an activation function, and output the health score. S3. Based on the health score and the pre-set switching rules, switch the chip removal pipe.

2. The smart factory dual-mode switchable chip removal control method according to claim 1, characterized in that, S3 includes: When the health score is greater than or equal to 85, maintain the concentrated anti-dumping pathway for anti-dumping. When the health score is greater than or equal to 70 points and less than 85 points, maintain the centralized chip removal path and reduce the conveying speed by 20%. When the health score is less than 70, switch to emergency chip removal pipeline.

3. The smart factory dual-mode switchable chip removal control method according to claim 1, characterized in that, The method further includes: After switching to the emergency chip removal pipeline, steps S1 to S3 are re-executed at fixed time intervals. When the health score of three consecutive time intervals is greater than or equal to 85 points, the system switches to the centralized chip removal path and synchronously restores the conveying speed to the initial value.

4. The smart factory dual-mode switchable chip removal control method according to claim 1, characterized in that, The chip removal system includes: Material conveying mechanism (1), crushing and processing mechanism (2), dual-mode chip removal switching mechanism (3) and power drive mechanism; The material conveying mechanism (1) is used to receive and convey the chips generated by the machine tool processing. The crushing and processing mechanism (2) is set at the output end of the material conveying mechanism (1) and is used to receive the chips conveyed by the material conveying mechanism (1) and crush them. The dual-mode chip removal switching mechanism (3) is set at the output end of the crushing and processing mechanism (2) and is used to receive the chips crushed by the crushing and processing mechanism (2) and switch the chip removal path. The power drive mechanism is electrically connected to the material conveying mechanism (1), the crushing and processing mechanism (2) and the dual-mode chip removal switching mechanism (3) and is used to provide power. The dual-mode chip removal switching mechanism (3) includes a diversion component, a guide component, a positioning component, and a sensor component; The diversion component has a diversion channel inside and at least two outlets that are respectively connected to the centralized chip removal pipeline and the emergency chip collection pipeline; the guide component is disposed in the diversion channel and is fixedly connected to the output end of the power drive mechanism; the positioning component is disposed at the connection part between the guide component and the guide component; the sensor component is disposed inside the diversion component.

5. The smart factory dual-mode switchable chip removal control method according to claim 4, characterized in that, The positioning component includes two positioning pins and two corresponding positioning holes; the positioning pins are located at the end of the rotating shaft of the guide component, the positioning holes are located inside the diverting component, the fitting clearance between the positioning pins and the positioning holes is ≤0.1mm, and the positioning pins are inserted into different positioning holes to lock and fix the guide component.

6. The smart factory dual-mode switchable chip removal control method according to claim 4, characterized in that, The pulverizing and processing mechanism (2) includes: Crushing blade assembly, gap adjustment assembly, load detection assembly, and feeding auxiliary assembly; The crushing tool assembly includes coarse crushing tools and fine crushing tools arranged sequentially along the crushing conveying direction, used for grading and crushing the crushing materials; the gap adjustment component is mechanically connected to the crushing tool assembly to adjust the tool gap; the feeding auxiliary component and the load detection device are located at the input end of the crushing processing mechanism (2) and are electrically connected to the power drive mechanism.

7. The smart factory dual-mode switchable chip removal control method according to claim 6, characterized in that, The coarse crushing tool is a toothed cutter head, and the fine crushing tool is a straight-edged tool. The axes of the coarse crushing tool and the fine crushing tool are parallel and arranged radially in an alternating manner.

8. The smart factory dual-mode switchable chip removal control method according to claim 4, characterized in that, The material conveying mechanism (1) includes: The first conveying assembly, the anti-stagnation cleaning assembly, and the coolant recovery assembly; The conveying assembly is connected to the power drive mechanism to drive the first conveying assembly to operate; the coolant recovery assembly includes: a second conveying assembly, a flow guide channel, a filter device, a backwashing device, and a liquid storage device; The second conveying component is fixedly connected to the first conveying component to form a conveying circuit; the input end of the guide channel is connected to the second conveying component, and the output end is connected to the liquid storage device; the filter device and the backwashing device are disposed in the guide channel; The anti-retention cleaning component is disposed on both sides of the first conveying component and the second conveying component, and is used to remove debris retained on the surface of the first conveying component and the second conveying component.

9. The smart factory dual-mode switchable chip removal control method according to claim 4, characterized in that, The chip removal system also includes: Security and protection agencies; The safety protection mechanism includes: a protective shell, an emergency stop device, and a splash-proof device; The protective housing is respectively covered on the material conveying mechanism (1) and the crushing and processing mechanism (2); the emergency stop device is electrically connected to the power drive mechanism, and the splash protection device is set at the turning point of the centralized chip discharge pipeline and the emergency chip receiving pipeline.

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